JP2020088396A - Receiving carrier to be equipped, with carrier-receiving device comprising body and adapter element - Google Patents

Abstract

To provide a carrier-receiving device for receiving a carrier to be equipped with chips not housed in a housing.SOLUTION: A carrier-receiving device 130 has: a body 140; a pneumatic system 444 formed in the body; an adapter element 150 with a first side 451 and an opposite second side 452, where the first side is detachably attached to a surface of the body, and the second side is designed such that a carrier 190 to be equipped can be placed; and a pneumatic connection structure 454 which is formed in the adapter element and extends through the adapter element from the first side to the second side. The pneumatic system and the pneumatic connection structure apply a negative pressure to a surface of the carrier.SELECTED DRAWING: Figure 4

Description

The present invention relates generally to the technical field of electronic component manufacturing. The invention relates in particular to a carrier receiving device for receiving a carrier on which a chip not housed in a housing is to be mounted. Furthermore, the invention relates to a system, a mounting machine having the carrier receiving device, and a method for mounting a chip, which is not housed in a housing, on a carrier, especially within the manufacturing of electronic components, The electronic components each have at least one chip packaged in a housing and suitable electrical connection contacts, with which the packaged chips are electrically contacted. obtain.

When manufacturing an electronic component housed in a housing, a (semiconductor) chip not housed in the housing, a so-called "bare chip", is mounted on the carrier. Within the so-called "Built-In Wafer Level Package" (eWLP) process therefor one or more chips per package are mounted, active side down, on a bonding film lying on a carrier. .. Subsequently, a large number of mounted chips are potted with a compound of plastic, which compound later becomes the housing. The whole potting is then dried under high pressure and subsequently separated from the carrier or the bonding film. In a subsequent process step, the chips are contacted, electrically connected if necessary, and solder balls used as electrical connection contacts are placed. Finally, the entire further processed potting is milled into individual parts or otherwise separated.

Expressed simply, an eWLP is a type of housing for integrated circuits in which electrical connection contacts are formed on a wafer that is artificially manufactured from chips and potting compounds. Therefore, all necessary processing steps are performed to form the housing on the artificial wafer. This allows the production of extremely small and flat housings with excellent electrical and thermal properties, especially at low manufacturing costs, as opposed to classical housing techniques where so-called "wire bonding" is used. .. With this technique, the component may be manufactured, for example, as a ball grid array (BGA).

A further integration approach known in microelectronics is the production of so-called system-in-package (SiP) modules. In the SiP process, passive and active components and further components are manufactured from a plurality of (semiconductor) chips, which are mounted on a carrier by a mounting process, which carrier is, for example, an epoxy printed circuit board. It can be a material, a bonding film or a metal film. The mounted chips are integrated into a housing, often referred to as an IC package, using known construction and connection techniques. The required electrical connection between the chips can be realized, for example, by means of bonding wires, and other connection principles are also possible, for example conductive thin films on the side edges of the chips or the feedthroughs. Handling of chips not yet housed in the housing during the manufacture of the eWLP process or SIP modules is typically done using a (modified) mounting machine compared to known surface mounting techniques. Such a mounting machine has a mounting head, and a chip is mounted on each carrier at a predetermined mounting position by using the mounting head. In that case, the demand for the accuracy of the mounting position is particularly high. At present, positional accuracy or mounting accuracy of 15 μm/3σ or higher is required for both the eWLP process and the manufacture of SIP modules. σ (sigma) is a standard deviation regarding the mounting position. As electronic components become smaller, it is expected that higher precision will be demanded in the future.

Such high-precision mounting requires, on the one hand, a high temperature stability of the components involved in the mounting, and on the other hand, the low thermal expansion of the carrier receiving device in which the carrier to be mounted is fixed by vacuum or negative pressure. Need. Thus, for example, from US Pat. No. 6,096,839, (i) the carrier receiving device is kept at a temperature as constant as possible using a temperature control device, and (ii) consists of about 64% iron and 36% nickel, It is known to manufacture from Invar alloys which have a very low coefficient of thermal expansion. Furthermore, it is known, for example, from the above-mentioned patent document 1 and also from patent document 2 to mark a carrier receiving device. From the measurement of the markings, the distortion of the portal system caused by the thermal expansion, which is moved with the mounting head of the mounting machine, can be determined. With accurate knowledge of the portal distortion, the portal distortion can be at least substantially eliminated by actuating to properly compensate the portal motor. Furthermore, the so-called mounting machine mapping data can be modified so that the mounting position accommodates the thermal expansion of the carrier. Therefore, in order to improve the mounting accuracy to 10 μm/3σ or more, it is necessary to use the same material (material having the same thermal expansion coefficient) as that used for the carrier receiving device for the carrier. However, the use of Invar is very expensive due to the high cost of such materials.

The use of different materials for the carrier receiving device and carrier may alleviate the above cost problems, but it is not possible to obtain the desired mounting accuracy of 10 μm/3σ or higher.

German Patent Invention No. 102015101759 German Patent Invention No. 102115112518

An object of the present invention is to improve the accuracy when mounting a chip not stored in a housing on a carrier with a simple device at low cost.

This problem is solved by the subject matter of the independent claims. Advantageous embodiments of the invention are described in the dependent claims.

According to a first aspect of the invention, a carrier receiving device is described for receiving a carrier on which a chip not housed in a housing is to be mounted. The carrier receiving device has (a) a body, (b) a pneumatic system configured within the body, (c) a first surface and a second surface opposite the first surface. An adapter element having a surface, the first surface being removably attached to the surface of the body, and the second surface such that the carrier to be mounted can be installed (in a plane) on the adapter element. And (d) a pneumatic connection structure that is configured within the adapter element and that extends through the adapter element from the first surface to the second surface. The pneumatic connection structure and the pneumatic connection structure are pneumatic connection structures configured to apply a negative pressure to the (lower) surface of the carrier.

The carrier receiving device differs from conventional (integral or one-piece) carrier receiving devices (without adapter plates) in that the carrier receiving device has various types of functionality and/or flexibility. Recognizing in terms of "suitability" for a carrier, it can be expanded in an easy and effective way by a (at least) two-piece or carrier-receptor device configured to consist of two parts with a body and an adapter element. Is based on. That is, different adapter elements can be provided for different types of carriers, each first surface being the same for all adapter elements and adapted to match the surface of the body. The second surface of the adapter element can be adapted to be compatible with at least one of a plurality of different types of carriers, so that this one type of carrier can be reliably received.

Expressed simply, it is also possible to use a carrier with a different material than the body, and thus a different coefficient of thermal expansion, by means of the replaceable adapter element. That is, for high mounting accuracy, it is only necessary that the adapter element and the carrier consist of or have a material with at least approximately the same coefficient of thermal expansion. Thereby, it is also possible to use cheaper materials than the material of the body for the manufacture of the carrier. In particular, it is possible to use carrier materials having a higher coefficient of thermal expansion.

A carrier material that is (obviously) different compared to the material of the body, in particular with a higher coefficient of thermal expansion, is for example also for a particular manufacturing method of parts, which necessarily requires a particular carrier material (due to the process). May be necessary. Due to the interchangeable adapter element described above, the flexibility of the carrier receiving device described above is comparable to that of a conventional carrier receiving device for processing or manufacturing various (housing-stored) parts manufactured in different manufacturing processes. It can be expanded in comparison.

Preferably, the material of the adapter element is a material having a coefficient of thermal expansion of at least about the same as the material of the carrier. In particular, the same material is preferably used for the adapter element and the carrier.

In the present application, the term “carrier” can be understood in principle to be a mountable medium that can be arranged (on its underside) on an adapter element. The carrier can also be a (monolithic) substrate on which the chip is mounted, eg a printed circuit board, depending on the respective use case. The carrier may be a carrier composed of a plurality of pieces. The carrier can have, for example, a frame structure having a relatively high mechanical rigidity, the frame structure is covered with a (adhesive) carrier film, and on the carrier film, The chips can be placed in a known manner for further processing. Such further processing may include, inter alia, the production of so-called artificial wafers, which can be used in a known manner for the production of electrical components housed in housings.

In the present application, the concept of "body" is (i) a spatial physical structure that can be placed in and/or part of the mounting machine, and (ii) an adapter element can be attached and detached. Can be understood to be a spatial physical structure having a surface (spatially) shaped for installation in the.

In the present application, the concept of an "adapter element" is (i) a spatial physical structure whose first surface is mountable (in a plane) on the (upper) surface of the body, and (ii) On the second side it can be understood that the carrier to be mounted is a spatial physical structure that can be installed (in a plane). The adapter element may consist of multiple pieces or, preferably, be of one-piece construction.

The term "pneumatic system" can be understood to be any conduit system mounted in or configured on or on the body. On the inlet side, the pneumatic system can have a pneumatic interface to which a vacuum generating unit or a suction pump can be connected. On the outlet side, the pneumatic system has a suitable outlet opening so that the negative pressure created in the pneumatic system is "transmittable" to the pneumatic connection structure.

The concept of "pneumatic connection structure" is likewise any conduit system that transfers the negative pressure received from the pneumatic system on the inlet side to the underside of the carrier located on the second side of the adapter element. Can be understood. The pneumatic connection structure can be realized in a particularly simple embodiment by suitable passage openings, for example via holes.

According to an embodiment of the present invention, the body comprises a first material having a first coefficient of thermal expansion and the adapter element comprises a second material having a second coefficient of thermal expansion. .. At that time, the second coefficient of thermal expansion is larger than the first coefficient of thermal expansion. This is because the carrier receiving device can also reliably receive or hold a carrier for high-precision mounting, and the carrier has a coefficient of thermal expansion different from that of the first material of the main body. It has the advantage of having the material or being manufactured from the carrier material. As mentioned above, this may increase the flexibility of the carrier receiving device with respect to various types of carriers.

According to a further embodiment of the invention, the first material is Invar, in particular Super Invar.

The use of Invar as the material has the advantage that the temperature variations of the carrier receiving device have a relatively small effect on the mounting accuracy. Such temperature changes can be caused, for example, by waste heat of the components of the mounting machine on which the carrier receiving device is mounted and/or by changes in ambient temperature.

As mentioned above, the Invar material may be an alloy of about 64% iron and 36% nickel. So-called Super Invar can be a Ni-Co-Fe alloy consisting of 31% nickel, 5% cobalt, the balance iron.

According to a further embodiment of the invention, the adapter element comprises a plate or is realized with a plate on which the pneumatic connection structure is constructed. This has the advantage that the adapter element can be manufactured easily. This applies in particular to the embodiment in which the plate is a plane-parallel plate.

According to a further embodiment of the invention, the surface of the body has a rectangular shape. Alternatively or in combination, at least the second side of the adapter element has a circular shape adapted to the shape of the carrier.

The adapter element may consist of two pieces, a (formally) rectangular plate and a circular disc on or arranged on the plate. In operation, the lower surface of the rectangular plate is in contact with the body. A carrier is placed on the upper surface of the circular disk. The thickness of the circular disc is adjustable to give the desired height of the circular bearing surface for the carrier. This height is preferably attached to the top surface of a rectangular plate and may match the height of special marks used for the calibration process described below.

The use of a relatively simple geometry for the body and/or the adapter element has the advantage that the body or the adapter element can be manufactured easily and with high precision.

According to a further embodiment of the invention, the carrier receiving device further comprises a plurality of fastening elements, in particular screws, by means of which the adapter element is removably fastened to the body.

Each fixing element may be arranged evenly or unevenly distributed on the surface of the body, with a fixed connection of the adapter element to the body and, in some cases, an overdetermination. ) Can be used for connection.

If screws are used as fastening elements, it is clear that both the body and the adapter element must have suitable openings in the positions spatially assigned to one another, each of which has at least one opening. , Female threads are provided.

According to a further embodiment of the invention, the carrier receiving device further comprises three supporting elements, which are arranged or arranged between the body and the adapter element, in particular the supporting element. Are each realized as a pad-type support element. This has the advantage that the adapter element can be easily (manually) installed in and removed from the body. By avoiding a fixed connection in the plane, it is possible to prevent twisting and/or straining, in particular of the adapter element, during temperature changes (as a result of different coefficients of thermal expansion). According to a further embodiment of the invention, the three support elements are arranged to ensure that the adapter element rests against the body in a stationary state.

Reliable support at rest does not result in spatial distortion of the adapter element during temperature changes due to different coefficients of thermal expansion of the body and adapter element, as compared to overdetermined support at rest It has the advantage of This ensures a particularly precise positioning of the carrier element in the mounting machine on which the chip (not housed in the housing) is to be mounted, which is an important prerequisite for high mounting accuracy. ..

Exact support in the static state can be achieved, for example, by means of three spherical pads, which can be constructed as follows:
(1) First spherical pad: On the (lower) first surface of the adapter element there is a (conical) bore, eg a 90° countersink. On the (upper) surface of the body, there is a portion of a first sphere that engages a (conical) bore, thereby "pulling" the bore. Has been hung." The adapter element, with this first spherical pad (alone), can be further rotated and tilted around the spherical pad.
(2) Second spherical pad: There is a V-shaped groove on or in the first surface below the adapter element, and the longitudinal axis of the groove indicates the first spherical pad. ing. A portion of the second sphere on the body engages the (V-shaped) groove. The combination of the first spherical pad and the second spherical pad allows the adapter element to move between the (first) supporting position of the first spherical pad and the (second) supporting position of the second spherical pad. It is possible to tilt slightly around the axis which is determined by the shortest connection of
(3) Third spherical pad: The upper point of the portion of the third spherical body formed on the body is in contact with the flat first surface of the adapter element. Thereby, the adapter element is securely supported in the stationary state on the main body.

It is pointed out that the adapter element may still come off the (partial) sphere of the three support elements in the state of being securely supported in the rest state. This can be prevented, for example, by the adapter element being retained on the body either magnetically or by a central threaded connection through the (partial) sphere of the first spherical pad.

It is further pointed out that each of the above-mentioned spherical pads is provided by a corresponding (partial) sphere being attached to or formed on the adapter element and by a corresponding counterpart, ie (conical shape). It is also feasible to have a bore, a groove, a V-shaped groove or a flat surface attached to or formed in the body.

According to a further embodiment of the invention, the adapter element has at least two first markings, said markings being optically recognizable, in particular a space provided for receiving a carrier. Attached to or formed on the adapter element outside the region. Presently, preferably four such first markings are provided.

With at least one first marking, the position of the mounted chip with respect to that marking can be determined with high accuracy by means of suitable optical measurements. Thereby, in the coordinate system of the carrier, the mounting position of the corresponding chip is known very accurately. This recognition can be used for further processing of the carrier on which the chip is at least partially mounted. Furthermore, in recognizing an undesired deviation of the mounting position of the chip in the coordinate system of the carrier, this information can be transferred to the control part of the portal system which moves or positions the mounting head. This information can then be used to operate the portal system in the subsequent mounting of further chips, so that deviations in the mounting position are avoided as far as possible later.

According to a further embodiment of the invention, the body has at least two second markings, said markings being optically recognizable, in particular a space provided for the reception of the adapter element. Attached to or formed on the body outside the region.

With at least one second marking, the position of the mounted chip with respect to the marking can be determined with high accuracy by means of suitable optical measurements. Thereby, the mounting position of the corresponding chip is known very accurately in the coordinate system of the main body. As mentioned above, as long as the main body is made of an expensive material having a low coefficient of thermal expansion, the coordinate system of the main body can be regarded as the coordinate system of the entire mounting machine in a very approximate manner.

As long as the position of the second marking inside the mounting machine is known exactly, the actual position of the mounted chip inside the coordinate system of the mounting machine can be accurately detected. In addition, as long as the position of the carrier to be mounted within the relevant coordinate system of the mounting machine (directly or indirectly on the position of the adapter element) is known, inside the carrier coordinate system. The actual position of the mounted chip in can also be detected with high accuracy.

When such a position measurement detects a desirable one between the actual mounting position and the predetermined mounting position, such a shift causes a movement of the mounting head in a subsequent mounting process. With proper control, it can be at least nearly compensated.

The exact position of the optically recognizable second marking can be measured using a high precision optical measuring machine before mounting the body on the mounting machine. In this way, the above-mentioned optical measurement of the mounting position can be carried out with particularly high accuracy.

The spatial arrangement of both second markings outside the area provided for receiving the adapter element during the operation of the mounting machine is such that the marking (position of the marking does not, unless the carrier projects laterally from the adapter element). ) Has the advantage that it can also be measured during the mounting of the carrier. Therefore, even during the mounting process, which can last for several hours depending on the number of chips to be mounted, it is possible to accurately pinpoint the mounting position and ensure high mounting accuracy continuously over a long period. Is.

According to a further aspect of the invention, a system is described for receiving a variety of carriers on which chips not housed in a housing are to be mounted. The system comprises (a) a carrier receiving device of the type described above, (b) a further first side and a further second side opposite the further first side. A further adapter element having: the further first surface releasably attachable to the surface of the body, the further second surface comprising a carrier to be further mounted ( An adapter element configured to be able to contact the further adapter element in a plane), (c) configured in the further adapter element, passing through the further adapter element and further from the first surface. A further pneumatic connection structure extending to the second surface. The further pneumatic system and the pneumatic connecting structure are arranged such that a negative pressure can be applied to the (lower) surface of the further carrier.

The system is based on the realization that the various adapter plates assigned to each type of carrier can be supplied as a basic element. The components, the carrier and the adapter plate, which are assigned to one another, are preferably made of the same material or have at least the same or a similar coefficient of thermal expansion. Generally expressed, different adapter elements (of any number) with different coefficients of thermal expansion can be provided in the system, whereby carriers of different types having different coefficients of thermal expansion can be provided. Can be accepted reliably and with high accuracy.

Expressed simply, for each carrier type it is possible to mount the chip on different carrier types using a mounting machine with a (fixed) mounted body by using the appropriate adapter element. Is. That is, for each carrier type, it is not necessary to use a suitable one-piece carrier receiving device, which would have to be completely replaced with another one-piece carrier receiving device when changing the type of carrier to be implemented. .. By using a multi-piece carrier receiving device according to the invention, this is dispensed with. This is because only the appropriate adapter element needs to be supplied. Since the adapter element is clearly cheaper compared to the (integrated) carrier receiving device, the system with at least two adapter elements can significantly reduce costs. In addition, the adapter element is obviously easier to replace compared to the (integrated) carrier receiving device, so that the system requires replacement when changing the type of carrier to be implemented. The time can be significantly reduced.

According to a further aspect of the invention, described is a mounting machine for mounting a chip, which is not housed in a housing, on a carrier, in particular in a housing having a hardened potting compound, A mounting machine for manufacturing electronic components each having at least one chip. The mounting machine has (a) a supply device for supplying a wafer having a large number of chips, (b) a carrier receiving device of the type described above, and (c) a chip for receiving the supplied wafers. , A mounting head for arranging the received chip at a predetermined mounting position on the carrier.

The mounting machine can easily achieve an optimum receiving for each carrier type by means of a two-piece carrier receiving device having a body and an adapter plate adaptable to the type of carrier to be individually mounted. It is based on the recognition that Such an optimal, precise position and the reception of as little mechanical stress as possible is an important prerequisite for achieving a very high mounting accuracy, especially with respect to temperature changes which cannot be completely avoided.

According to a further aspect of the invention, described is a method for mounting a chip not housed in a housing onto a carrier using a mounting machine, in particular a mounting machine of the type described above. The method comprises the steps of (a) supplying a wafer having a large number of chips with a supply device, and (b) using a carrier receiving device of the type described above to obtain a carrier to be mounted. Receiving step, (c) using a negative pressure exerted on the (lower) surface of the carrier by the pneumatic system in the body and the pneumatic connection structure in the adapter element, the carrier to be mounted Fixing the chip to the receiving device, (d) receiving the supplied chip from the supplying device using the mounting head, (e) transporting the received chip to the mounting region, (f) transporting the chip, Mounting at a predetermined mounting position on the carrier. The method is also based on the recognition that the optimum receiving for each carrier type can be easily achieved by using the above-mentioned carrier receiving device with an adapter plate that is individually adaptable to the type of carrier to be implemented. ing. This is particularly useful for temperature changes that cannot be completely avoided during the mounting of the chip on the carrier.

It is pointed out that the embodiments of the present invention have been described with respect to various objects of the present invention. In particular, some embodiments of the invention having a device claim and another embodiment of the invention having a method claim are described. However, in reading this application, unless otherwise expressly stated by a person skilled in the art, in addition to combinations of features belonging to one type of subject of the invention, features belonging to different types of the subject of the invention It will be immediately apparent that any combination is possible.

Further advantages and features of the invention will be apparent from the following exemplary description of preferred embodiments.

FIG. 3 is a diagram showing a mounting machine having (i) a two-piece carrier receiving device having a main body and an adapter element, (ii) two wafer supply devices, and (iii) two mounting heads according to an embodiment of the present invention. is there. It is the figure which expanded and showed a part of mounting machine which concerns on FIG. FIG. 3 is a top view of a two-piece carrier receiving device having a pneumatically connected vacuum generating unit and a temperature control device. FIG. 3 shows in cross section a two-piece carrier receiving device, in which the adapter element is its pneumatic connection structure and is screwed to the body with the pneumatic system. FIG. 8 shows a further embodiment of a two-piece carrier receiving device in cross section in which the adapter element is resting and securely mounted on the body through the three support elements.

In the following detailed description, features or components of various embodiments that are the same as, or at least functionally the same as, corresponding features or components of another embodiment, have the same reference signs, or It is pointed out that reference signs are used which are correspondingly or at least functionally identical to the reference signs of the same features or components in the last two digits. In order to avoid unnecessary repetition, features or components already mentioned with the above embodiments are not mentioned in detail below.

FIG. 1 shows a mounting machine 100 according to an embodiment of the present invention. The mounting machine 100 has a chassis 112, to which two planar positioning systems for moving the mounting heads 120 and 121, respectively, are attached, whereby the mounting head is placed on the projection plane. It can move in a plane parallel to the plane. Both planar positioning systems have as a first and commonly used part a carrier rail 114 fixed to the chassis. On the carrier rail 114, as a second (non-common) part, two laterally located carrier arms 116 are mounted, which carrier arms are movable along the y-direction. In that case, one carrier arm 116 is arranged in one positioning system and one carrier arm 116 is arranged in the other positioning system. Both positioning systems further each have a movable carrier plate 118, which is attached to a respective carrier arm 116 and is movable along the x-direction. A mounting head 120 or 121 is attached to both carrier plates 118 by means of a solid screw connection.

The mounting machine 100 further includes a wafer supply device 160, which is two wafer supply devices, and a further wafer supply device 161. In another, not shown embodiment, at least one wafer feeder can be replaced by another type of feeder (eg belt feeder or magazine feeder). Wafers 180 are brought into the supply area of the mounting machine 100 from a wafer storage container (not shown in FIG. 1) by each of the two wafer supply devices 160 and 161, and the mounting heads 120, With 121, each chip can be received. Preferably, the mounting heads 120, 121 are so-called manifold type mounting heads, each having a plurality of suction pipettes, shown as small circles in FIG. Each tip can be temporarily received by a suction pipette. According to the embodiment shown in this figure, the aspirating pipettes are individually movable along the z-direction, which is perpendicular to the plane of projection and thus both y-direction and x-direction. Even vertically oriented. Alternatively, it is also possible to use a mounting head with another topology, for example a so-called Collect & Place Revolver Koepfe.

The chips received by each mounting head 120, 121 are then carried to the mounting area by the appropriate actuation of the corresponding planar positioning system, where the chips are on the carrier 190 to be mounted. , Are arranged at predetermined mounting positions.

The mounting machine 100 provided with both mounting heads 120, 121 and both feeding devices 160, 161 is advantageously arranged in such a way that both mounting heads 120, 121 are arranged with their respective chips alternately. It is operable in an operating mode which receives from the supply device 160, 161, and rests on the carrier 190 to be mounted. Thereby, the mounting performance can be significantly improved. In this context, the term "mounting performance" is understood to be the number of chips that can be received by both mounting heads 120, 121 and mounted on the carrier 190 within a given time unit, such as, for example, one hour. It should be.

The mounting machine 100 further comprises a carrier receiving device 130. The carrier receiving device 130 comprises (at least) two parts or parts: a body 140 and an adapter element 150. According to the embodiment shown in the figure, the body 140 is made of Invar (about 64% iron, 36% nickel) or Super Invar (about 31% nickel, 5% cobalt, balance iron). Being formed, the body thereby has only a very low thermal expansion during temperature fluctuations that may occur during operation of the mounting machine. Primarily, the adapter element with the outer shape of the plate is made of another material. The material is the same as, or at least has, about the same coefficient of thermal expansion as the material forming the carrier 190 to be mounted. According to the embodiment shown in the figure, the carrier 190 has a frame structure with a relatively high mechanical rigidity, which frame structure is formed exactly from the material forming the adapter element 150. There is. The structure of the carrier 190 is described below with reference to FIG.

During the mounting process, the carrier 190 is held or fixed in a fixed spatial position in the mounting machine 100 coordinate system. It is pointed out in this connection that, unlike the mounting of the electronic components housed in the housing on the printed circuit board, the mounting of the chips not stored in the housing on the carrier 190 typically takes a significantly longer time. Target. This is because the carrier 190 is generally mounted with a much larger number of chips than the number of electronic components stored in the housing, which are to be mounted on the printed circuit board. For this reason, the positioning and fixing of the carrier 190 to be mounted on the carrier receiving device 130 is extremely demanding. That is, for that purpose, it must be ensured that neither the position of the entire carrier 190 nor the position of each sub-region of the carrier 190 changes during the entire mounting time of, for example, 2 hours. The same applies to the travel path of the corresponding planar positioning system.

In order to obtain a high mounting accuracy and to ensure a high mounting accuracy over a relatively long time, the carrier receiving device is configured or fitted with a plurality of markings. The marking can be detected by a camera, not shown, and the exact position of the marking can be determined by the corresponding image interpretation of the detected image. From the exact location of the detected markings, the portal system can be calibrated or iteratively recalibrated during a relatively long mounting process. Preferably, such a camera is attached to the mounting head, either directly or indirectly, as shown in FIG.

According to the embodiment shown in the figure, a total of four first markings 148 are present on the adapter element 150, next to the carrier 190. On the (upper) surface 142 of the body 140, there are a total of four second markings 158 on the outside of the adapter element 150 and therefore visible from above.

FIG. 2 is an enlarged view showing a part of the mounting machine 100 according to FIG. A wafer storage container 265 is arranged in the wafer supply device 160, and a large number of wafers each having a large number of chips (not shown) that are not stored in a housing are stacked in the wafer storage container 265. ing. The wafers 180 are taken out from the wafer storage container 265 by using the wafer supply device 160, and after mounting the corresponding chips, the wafers 180 at least partially having the chips removed are returned to the wafer storage container 265 again. Can be done.

Due to the approximate positioning or centering of the carrier 190 on the carrier receiving device 130, or more precisely on the adapter element 150, using a carrier transporting device, not shown, the outer region of the carrier 190 is Two opposing optical structures 296 are constructed. According to the embodiment shown in the figure, each of both optical structures is realized by a simple bore 296.

It is pointed out that the carrier 190 used is a conventional carrier, which in a known manner has a carrier plate 292, preferably made of metal, and a bonding film 294 affixed to the carrier plate 292. On the bonding film 294, the chip indicated by reference numeral 282 in FIG. 2 is arranged. The mounting of the tip 282 is carried out in a known manner through proper positioning of the mounting head 120 and the tip holding device 222, which is configured as a suction pipette, along the z-direction perpendicular to the (xy) projection plane. It is done through

The previously described centering of the carrier 190 on the adapter element 150 is based on an optical measurement of the position of the structure 296. According to the embodiment shown in the figure, a camera 270 is used for this, which is mounted in a convenient manner on the movable mounting head 120 and is therefore shown in FIG. It can be placed above the structure 296 to be measured in any suitable manner through the proper operation of a non-planar positioning system. During this measurement, as long as the position of the camera 270 within the mounting machine 100 or the coordinate system of the planar positioning system is known exactly, the mounting machine 100 through proper image evaluation of the images detected by the camera 270. The coordinates of the carrier 190 within the coordinate system can be determined.

Alternatively or in combination, the markings 148 and 158 described above can be used to optically determine the relative position of the carrier 190 with respect to the markings 148 and 158. To do so, it is only necessary to use the camera 270 to detect the optically recognizable structure 296 and the at least two markings 148, 158.

It is pointed out that the number of markings used is not limited to the total of eight markings 148, 158 shown in FIG. Generally applicable, the greater the number of markings, the more accurate each optical measurement may be.

At least one of the markings 148, 158 can also be measured with the chip 282 already mounted. In this way, the exact current location of the chip 282 in question can be measured, as is the case with automatic optical inspection (AOI) of known implementations. Deviations from the target position, which may be present, can be taken into account in the subsequent mounting of further chips and compensated by the proper operation of the planar positioning system.

It is pointed out that the markings 148, 158 have a very precise internal structure, the position of which on the body 140 or on the adapter element 150 is known with very high precision. To that end, the body 140 and/or the adapter element 150, together with the corresponding markings 148 or 158, are preferably measured with a high-precision optical measuring machine before being mounted on the mounting machine 100. Thereby, the position data of the coordinates of the markings 148, 158 is known accurately, and the position data can be used for highly accurate measurement of the position of the mounted chip 282.

It is further pointed out that the adapter element 150 can be supplied in a number of different formats or sizes. Thereby, the mounting machine 100 can be easily adapted for operation with different carrier formats. Moreover, since the adapter elements 150 with different coefficients of thermal expansion can be provided, the mounting machine 100 can also be easily adapted for operation with different carriers, where the different carriers have different thermal properties. It has a material with a coefficient of expansion.

FIG. 3 shows a two-piece carrier receiving device 130 in a top view. The carrier 190 is removably fixed to the adapter element 150 using negative pressure. In the top view of FIG. 3, the corresponding pneumatic conduits formed in the adapter element 150 and in the body 140 are not visible. Shown schematically in FIG. 3 is a vacuum generating unit 375, which pneumatically through vacuum conduit 376 to a pneumatic system 444 of body 140, not shown in FIG. It is connected.

Furthermore, FIG. 3 likewise schematically shows a temperature adjusting device 372, which is thermally connected to the main body 140. In operation, the temperature adjuster 372 operated in a suitable manner functions to keep the body 140 at least at a substantially constant temperature. As long as the adapter element 150 is made of a highly thermally conductive material, in particular a metal, if there is a good thermal coupling between the adapter element 150 and the body 140, then the adapter element 150 will also The carrier 190 mounted on the can also be maintained at at least a substantially constant temperature.

FIG. 4 shows a (at least) two-piece carrier receiving device 130 in cross section. Within the body 140, a pneumatic system 444 consisting of multiple conduits is constructed. On the inlet side, the pneumatic system 444 is pneumatically connected to the vacuum conduit 376 already shown in FIG. That is, during operation of the vacuum generating unit 375, a negative pressure is created in the pneumatic system 444, and the negative pressure is transmitted to the pneumatic connection structure formed in the adapter element 150. The pneumatic connection structure 454 also has a plurality of conduits which, when the adapter element 150 is accurately positioned on the body 140, provide an outlet opening for the pneumatic system 444 on the upper surface of the body 140. Corresponding to the position and size of. Using the pneumatic connection structure 454, the negative pressure applied to the lower second surface 452 of the adapter element 150 is transferred to the opening of the upper first surface 451 of the adapter element 150. The opening of the pneumatic connection structure 454 in the upper first surface 451 of the adapter element 150 is at least almost completely closed by the carrier 190 to be mounted, whereby the pneumatic system 444 and the pneumatic connection. The negative pressure on the structure 454 leads to a vacuum fixing of the carrier 190 on the first surface 451 of the adapter element 150.

It is pointed out that the spatial arrangement of the pneumatic system 444 and/or the pneumatic connection structure 454 is shown only schematically or by way of example in FIG. Completely different shapes can be used depending on the particular use case. For example, the upper first surface of the adapter element 150 may be formed with an annular groove capable of applying a negative pressure.

According to the embodiment shown in FIG. 4, the adapter element 150 is detachably fixed to the body 140 by means of a plurality of schematically illustrated screws 456 and corresponding internal threads. The screw 456 serves for a mechanically secure connection of the adapter element 150 to the body 140. Upon replacement of the adapter element 150, all screws 456 need to be loosened and screws 456 must be retightened after installing another adapter element.

FIG. 5 shows a further embodiment of a (at least) two-piece carrier receiving device 530 in cross section. The carrier receiving device 530 differs from the carrier receiving device 130 shown in FIG. 4 simply by using a hemispherical support element 557 on which the adapter element 150 is mounted, instead of the screw 456. The gap between the lower second surface 452 of the adapter element 150 and the upper surface of the body 140 is shown enlarged in FIG. 5 for reasons of readability. That is, the gap is practically small to the extent that only a small amount of air can enter the pneumatic system 444 from the outside through the gap. This small amount of air is "pumped off" by the vacuum generation unit 375.

According to the illustrated embodiment, the support element 557 or the spatial depression in the lower second surface 452 of the adapter element 150, not shown, is secured by the body 140 of the adapter element 150 in a stationary state. It is configured to provide support. The possibilities for achieving a reliable support at rest with three spherical pads have already been described in detail here and should not be repeated here.

It should be noted that the concept of “having” does not exclude another element, and the concept of “one” does not exclude a plurality. It is also possible to combine the elements described in connection with different embodiments. Again, it should be noted that reference signs in the claims shall not be construed as limiting the scope of protection of the claims.

100 mounting machine 112 chassis 114 first part/fixed carrier rail 116 second part/movable lateral carrier arm 118 third part/movable carrier plate 120 mounting head 121 further mounting head 130 Carrier receiving device 140 Main body 142 Surface 148 Second marking 150 Adapter element 158 First marking 160 Wafer supplying device 161 Further wafer supplying device 180 Wafer 190 Carrier 222 Chip holding device/suction pipette 265 Wafer storage container 270 Camera 282 Chip ( Implemented)
292 Carrier plate 294 Bonding film 296 Optically recognizable structure/bore 372 Temperature controller 375 Vacuum generation unit/suction pump 376 Vacuum conduit 444 Pneumatic system 451 First side 452 Second side 454 Pneumatic connection Structure 456 Fixing element/screw 530 Carrier receiving device 557 Support element

Claims (13)

A carrier receiving device (130) for receiving a carrier (190) on which a chip (282) not housed is mounted, comprising:
The body (140),
A pneumatic system (444) configured within the body (140);
An adapter element (150) having a first surface (451) and a second surface (452) opposite to the first surface (451), wherein the first surface (451) is the The second surface (452) is configured such that the carrier (190) removably attached to and mounted on the surface (142) of the body (140) can be installed on the adapter element (150). The adapter element (150),
A pneumatic connection structure configured within the adapter element (150) and extending through the adapter element (150) from the first surface (451) to the second surface (452). (454), wherein the pneumatic system (444) and the pneumatic connection structure (454) are configured to apply a negative pressure to the surface of the carrier (190). A pressure connection structure (454),
A carrier receiving device (130) having a. The body (140) has a first material with a first coefficient of thermal expansion and the adapter element (150) has a second material with a second coefficient of thermal expansion; The carrier receiving device (130) of claim 1, wherein the coefficient of thermal expansion of is greater than the first coefficient of thermal expansion. The carrier receiving device (130) according to claim 2, wherein the first material is Invar, in particular Super Invar. 4. A carrier receiving device (130) according to any one of claims 1 to 3, wherein the adapter element is a plate (150), in which the pneumatic connection structure (454) is configured. The surface (142) of the body (140) has a rectangular shape and/or at least the second surface (452) of the adapter element (150) has a circular shape. A carrier receiving device (130) according to any one of the preceding items. 6. A plurality of fastening elements (456), in particular screws (456), which are further used to detachably fix the adapter element (150) to the body (140). A carrier receiving device (130) according to any one of the preceding items. It further comprises three support elements (557), said support elements being arranged or configured between said body (140) and said adapter element (150), in particular said support elements (557) each being a pad-type support element. Carrier carrier device (530) according to any one of claims 1 to 5, realized as The carrier receiving device (530) of claim 7, wherein the three support elements (557) are configured to ensure that the adapter element (150) rests against the body (140). .. The adapter element (150) has at least two first markings (158), said first markings being optically recognizable and in particular provided for the reception of said carrier (190). 9. A carrier receiving device (130) according to any one of the preceding claims, which is attached to or formed on the adapter element (150) outside the spatial region. The body (140) has at least two second markings (148), the second markings being optically recognizable and specifically provided for the reception of the adapter element (150). 10. The carrier receiving device (130) according to any one of claims 1 to 9, which is attached to or formed on the body (140) outside the spatial region. A system for receiving a carrier (190) on which a chip (282) not contained in a housing is mounted,
A carrier receiving device (130) according to any one of claims 1 to 10,
A further adapter element having a further first surface and a further second surface opposite the further first surface, the further first surface being detachable from the surface of the body. A further adapter element, which is operably attachable, the further second surface being configured so that the further carrier to be mounted can contact the further adapter element;
A further pneumatic connection structure configured in the further adapter element and extending through the further adapter element from the further first surface to the further second surface. An additional pneumatic connection structure, wherein the additional pneumatic system and the pneumatic connection structure are configured such that negative pressure can be applied to the (lower) surface of the additional carrier;
System that has. Mounting for mounting a chip (282) not housed in a housing on a carrier (190), in particular for manufacturing an electronic component having at least one chip each present in a housing having a particularly hardened potting compound A machine (100),
A supply device (160) for supplying a wafer (180) having a plurality of chips (282),
A carrier receiving device (130) according to any one of claims 1 to 10 for receiving the carrier (190) to be mounted,
A mounting head (120) for receiving a chip (282) from the supplied wafer (180) and arranging the received chip (282) at a predetermined mounting position on the carrier (190);
Mounting machine (100) having. A method for mounting a chip (282) not housed in a housing onto a carrier (190) using a mounting machine (100), in particular a mounting machine (100) according to claim 12.
Supplying a wafer (180) having a large number of chips (282) using a supply device (160);
Receiving a carrier to be mounted using a carrier receiving device (130) according to any one of claims 1 to 10.
Implemented using the low pressure applied to the surface of the carrier (190) by the pneumatic system (444) in the body (140) and the pneumatic connection structure (454) in the adapter element (150). Securing the carrier (190) to the carrier receiving device (130);
Receiving a dispensed chip (282) from the dispenser (160) using a mounting head (120);
Transporting the received chip (282) to the mounting area,
Placing the transported chip (282) in a predetermined mounting position on the carrier (190);
A method having.

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