TW202022548A - Dual airflow heat dissipation system including a main body, at least one turbo fan and at least one air intake fan - Google Patents

Abstract

The present invention relates to a dual airflow heat dissipation system, which includes a main body, at least one turbine fan and at least one air intake fan. The turbine fan is arranged on the main body. The main body surrounds the turbine fan and is provided with a plurality of chassis communicating with the turbine fan but not communicating with each other, and a wind guide chamber. The air intake fan is provided in the wind guide chamber to introduce the cold air outside the main body into the wind guide chamber. Then the turbine fan distributes the cold air in the wind guide chamber into each chassis to dissipate heat from the electronic components provided in each chassis.

Description

Dual airflow cooling system

The present invention relates to a heat dissipation system, in particular to a dual airflow heat dissipation system that simultaneously performs heat dissipation actions on multiple areas or components that need heat dissipation with a minimum number of fans.

In recent years, due to the continuous innovation of computer technology, how to improve the speed and efficiency of the computer is a very important topic. However, with the increase in the speed and efficiency of the computer and the increase in functions, the electronic components inside the computer such as: read only Compact Disc Read-Only Memory (CD-ROM), Hard Disk Drive (HDD), Motherboard (Motherboard, Mainboard, Mobo) and PC Power Supply Unit (PSU).. etc. The heat generated during operation is also constantly rising. Therefore, in order to prevent the heat generated by these electronic components from circulating inside the computer host, causing the electronic components to overheat and cause temporary or permanent damage, how to provide effective heat dissipation methods Becomes very important.

The general heat dissipation methods on the market are nothing more than air-cooling (air-cooling) and water-cooling. The so-called air-cooling method is to install a cooling fan on the computer host, and blow the external cold air into the host through the cooling fan. The hot air is exhausted to maintain the internal temperature of the main body. However, as the operating speed and efficiency of the computer increase, the speed and heat generation at which electronic components generate heat also increases, which necessitates the replacement of higher-power cooling fans or Install more cooling fans to cope with the rising temperature inside the computer host. However, due to the cooling fan itself Heat energy is also generated during operation, so the method of using a higher-power cooling fan or installing more cooling fans is also increasing the heat source inside the computer host.

Moreover, because the electronic components are installed in the computer host at the same time, the heat generated by the electronic components will be conducted to each other, which will cause the internal temperature of the host to continue to rise, which will affect the heat dissipation effect. Therefore, such as the Republic of China No. M300415, M552123 Patent No. or M541034, both try to divide the inside of the computer host into several spaces to prevent the heat between the various electronic components from being conducted in the host body and increasing the difficulty of heat dissipation. However, this method can prevent the generation of various electronic components The heat conducts each other, but at least one set of cooling fans must be installed for each space. This not only increases the power consumption of the computer, but also increases the heat source in the mainframe and reduces the available space inside the mainframe.

The water-cooled heat dissipation system takes away the heat energy of various electronic components through the circulation of coolant. Its cooling efficiency is better than air cooling, and the sound during operation is also lower. However, water-cooled systems are not only costly and difficult to maintain, And if there is a problem of coolant leakage due to poor installation or use, it is very easy to cause failure or even damage to the internal electronic components of the computer host.

In order to solve the various deficiencies of the aforementioned conventional technologies, one of the objectives of the present invention is to provide a dual airflow heat dissipation system that divides the inside of the computer host into a plurality of areas and performs heat dissipation for each area.

In order to solve the various deficiencies of the aforementioned conventional technologies, another object of the present invention is to provide a method that can effectively prevent the heat generated by various components in the main body from circulating in the main body, and then Dual airflow cooling system that affects cooling efficiency.

In order to solve the various deficiencies of the aforementioned conventional technology, another object of the present invention is to provide a dual airflow heat dissipation system that achieves the best heat dissipation effect with a minimum number of heat dissipation fans.

In order to achieve the above objective, the dual airflow heat dissipation system provided by the present invention is mainly provided with a turbo fan in the main body of the computer, and the main body is separated with the turbo fan as the axis to separate a plurality of mutually disconnected The case and at least one air guiding chamber, and each case and air guiding chamber are connected with a turbo fan. At the same time, an air intake fan is arranged in the air guiding room to suck cold air outside the main body into the air guiding room through the air inlet fan , And disperse and blow the cold air sucked into the air duct into each case through a turbo fan, so as to achieve the purpose of dissipating the internal components of each case.

Among them, each chassis and air duct are independent bodies.

Among them, each case and the air duct are formed by partitioning the internal space of the main body.

Wherein, at least one air inlet hole is opened on the outer shell of the air guiding chamber, so that the air inlet fan can suck cold air into the air guiding chamber through the air inlet hole.

Wherein, at least one heat dissipation hole is opened at the diagonal position of the turbo fan in each case shell.

1‧‧‧Main body

11‧‧‧Chassis

111‧‧‧Heat vent

12‧‧‧Air duct

121‧‧‧Air inlet

2‧‧‧Turbo fan

3‧‧‧Intake fan

4‧‧‧Support frame

41‧‧‧Ventilation hole

5‧‧‧Partition

Figure 1 is a perspective view of the dual-airflow heat dissipation system of the present invention; Figure 2 is a perspective view of another embodiment of the dual-airflow heat dissipation system of the present invention; and Figure 3 is a schematic diagram of the side action of the dual airflow heat dissipation system of the present invention.

Specific embodiments are described below to illustrate the implementation of the present invention, but they are not used to limit the scope of the present invention.

The dual airflow heat dissipation system provided by the present invention is mainly installed on a host body, which includes but is not limited to a general computer host. However, this embodiment is to enable people to understand the technical features of the present invention more clearly. Therefore, the computer host is taken as an example for description as follows: Please refer to Figs. 1 to 3, the dual airflow cooling system provided in this embodiment mainly includes a computer host main body 1, a turbo fan 2 and an air intake fan 3. Wherein, the intake fan 3 can be a high-speed DC fan or a general cooling fan.

The turbo fan 2 is installed on the main body 1, and the main body 1 has at least one air duct 12 and a plurality of cases 11 distributed around the periphery of the turbo fan 2, and each case 11 is installed inside There is at least one electronic component of the computer host (for example: power supply, motherboard or hard disk... etc.), and the shell of each case 11 is provided with at least one heat dissipation hole 111. The best location for the heat dissipation hole 111 is the case The housing of 11 is at a diagonal position relative to the turbofan 2, and the intake fan 3 is arranged in the air guiding chamber 12, and the casing of the air guiding chamber 12 is provided with at least one inlet corresponding to the position of the intake fan 3.气孔121。 Air hole 121.

When the dual airflow heat dissipation system of this embodiment is used, the air intake fan 3 is used to draw the cold air outside the main body 1 into the air guiding chamber 12 through the air inlet 121, and then the turbo fan 2 is used to draw the air in the air guiding chamber 12 The cold air is blown into each chassis 11, so that the cold air exchanges heat with the electronic components running in each chassis 11, so as to reduce the temperature of the electronic components running in each chassis 11, and act as a turbo type When the fan 2 continuously blows the cold air sucked into the air duct 12 by the intake fan 3 into each chassis 11, it will blow the heated air out of the chassis 11 through the heat dissipation holes 111 while exchanging heat with the electronic components. 1 outside, to avoid the hot air circulating in the chassis 11 causing the temperature to continue to rise.

As described in the above embodiments, compared with the prior art in which only one or more cooling fans are used to simultaneously dissipate multiple electronic components in operation, the present invention disperses the various electronic components in the main body 1 In each chassis 11 that are not connected to each other, an intake fan 3 is used to suck cold air into the air guide chamber 12, and then the cool air is dispersed and blown into each chassis 11 through a turbo fan 2 to dissipate heat of various electronic components. This way of separating each electronic component for separate heat dissipation can effectively prevent the heat generated by each electronic component from conducting each other, thereby increasing the heat dissipation effect.

In addition, compared with the prior art, the present invention has a structure in which a cooling fan is separately arranged for different electronic components to dissipate heat. The dual airflow cooling system provided by the present invention only uses an intake fan 3 and a turbo fan 2 to dissipate heat. The best heat dissipation effect can effectively avoid excessive power consumption, and since the heat dissipation fan itself also generates heat when it is running, the dual airflow heat dissipation system provided by the present invention can also prevent excessive heat dissipation fans from being installed in order to increase the heat dissipation effect. The problem of the heat source in the main body 1.

In addition, in the dual airflow heat dissipation system provided by the present invention, the main body 1 can also be raised by the support frame 4 outside the main body 1, so as to prevent the chassis 11 at the bottom of the main body 1 from touching the ground compared to other chassis 11 It is difficult to dissipate heat, and if the position of the support frame 4 blocks the air intake hole 121 of the air guide chamber 12, the support frame 4 can also be provided with a ventilation hole 41 corresponding to the position of the air intake hole 121, so that the intake fan 3 can The cold air outside the main body 1 is smoothly sucked into the air guiding chamber 12.

In addition, the dual airflow heat dissipation system provided by the present invention can also utilize multiple partitions. The board 5 divides the inside of the main body 1 into a plurality of spaces as the chassis 11, and sets the turbofan 2 in the center of these spaces, and then uses one of the spaces as the air guide chamber 12, and enters The air fan 3 is arranged in the air guide chamber 12. Therefore, the dual airflow heat dissipation system provided by the present invention does not need to create a main body 1 with separate chassis 11 in the embodiment shown in Figs. In the way of 5, separate the inside of the general computer host into several independent spaces.

The above detailed description is specific to the feasible embodiments of the present invention. Therefore, it is not intended to limit the patent scope of the present invention. Any equivalent implementation or modification that does not deviate from the technical spirit of the present invention should be included in the patent in this case. In the scope, and this case is not only innovative in terms of technical ideas, but also has multiple functions that are not available in the traditional structure. It has fully met the statutory patent requirements for novelty and progress. An application is filed in accordance with the law. Please approve this invention. A patent application is a way to encourage invention and to feel good.

1‧‧‧Main body

11‧‧‧Chassis

111‧‧‧Heat vent

12‧‧‧Air duct

2‧‧‧Turbo fan

4‧‧‧Support frame

41‧‧‧Ventilation hole

Claims (7)

A dual airflow heat dissipation system, which mainly includes: a main body, the main body including a plurality of chassis, at least one air guide chamber and a turbo fan, the chassis and the air guide chamber are arranged around the periphery of the turbo fan, The chassis and the air guiding chamber are all connected with the turbo fan; at least one air intake fan is arranged in the air guiding chamber for blowing cold air outside the main body into the air guiding chamber, In order to allow the turbo fan to disperse and blow the cold air blown into the air duct into the cases. The dual airflow heat dissipation system according to claim 1, wherein the cabinets and the cabinets are not connected to each other, and the air duct and the cabinets are not connected to each other. The dual airflow heat dissipation system according to claim 1, wherein the enclosure shells of the enclosures are provided with at least one heat dissipation hole. The dual airflow heat dissipation system according to claim 1, wherein the heat dissipation hole is opened in the chassis shell of the chassis at a diagonal position of the turbo fan. The dual airflow heat dissipation system according to claim 1, wherein the air duct housing is provided with at least one air inlet hole. The dual-air cooling system according to claim 1, wherein the intake fan is a high-speed direct-blowing fan. The dual-air fan thermal fan according to claim 5, wherein the main body further includes at least one supporting frame for raising the main body, and the supporting frame is provided with ventilation holes at positions corresponding to the air intake holes of the air guiding chamber .

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