TW202022229A - Micro electrical-mechanical pump module - Google Patents

Abstract

A micro electrical-mechanical pump module is disclosed and comprises a microprocessor and a micro electrical-mechanical chip. The microprocessor sends a control signal. The micro electrical-mechanical chip electrically connects to the microprocessor and comprises a chip main body, plural micro electrical-mechanical pumps plural connecting electrodes and at least one common electrode. The chip main body is a rectangular structure and comprises a longer side. The plural micro electrical-mechanical pumps are disposed on the chip main body and each of them comprises a first electrode and a second electrode. The plural connecting electrodes are disposed on the chip main body, located nearby the longer side, and respectively electrically connect to the first electrodes of the plural micro electrical-mechanical pumps. The at least one common electrode is disposed on the chip main body, located nearby the longer side, and electrically connected to the second electrodes of the plural micro electrical-mechanical pumps. The microprocessor electrically connects to the plural connecting electrodes and the at least one common electrode, so as to transmit the control signal to the plural micro electrical-mechanical pumps.

Description

MEMS Pump Module

This case is about a MEMS pump module, especially a MEMS pump module that uses the arrangement of common electrodes to reduce the contacts of the microprocessor, thereby simplifying the contacts and wiring of the MEMS pump.

With the rapid development of science and technology, the applications of fluid delivery devices are becoming more and more diversified. For example, industrial applications, biomedical applications, medical care, electronic heat dissipation, etc., and even the recent popular wearable devices can be seen in its shadow and tradition. The pump has gradually become a trend toward miniaturization of the device, but the traditional pump is difficult to reduce the size to the millimeter level, so the current micro fluid delivery device can only use the piezoelectric pump structure as a micro fluid delivery device.

Although the MEMS pump can miniaturize the pump volume to the micron level, the micron-level MEMS pump will limit the fluid transmission due to the too small volume, so multiple MEMS pumps are required for use. Please refer to As shown in Figure 1, the current MEMS pump modules are individually controlled by a high-end microprocessor 1, but the high-end microprocessor 1 itself is expensive, and each MEMS pump 2 requires two microprocessors The connection of pin 11 of the device increases the cost of the high-end microprocessor 1, resulting in the high cost of the MEMS pump module, which is difficult to popularize. Therefore, how to reduce the cost of the drive end of the MEMS pump module is the first to overcome at present Difficulties.

The main purpose of this case is to provide a MEMS pump module that reduces the contacts of the microprocessor through the common electrode, reduces the contacts and wiring of the MEMS pump module, and further simplifies the MEMS pump module.

In order to achieve the above purpose, the broader implementation aspect of this case is to provide a MEMS pump module, which includes: a microprocessor that sends out a control signal; a MEMS chip that is electrically connected to the microprocessor, and the MEMS chip includes ：A chip body is a rectangular shape with a long side; a plurality of microelectromechanical pumps are arranged on the chip body, and respectively have a first electrode and a second electrode; a plurality of connecting electrodes are arranged on the chip The main body is adjacent to the long side, and the connection electrodes are respectively electrically connected to the first electrodes of the MEMS pumps; and at least one common electrode is disposed on the chip body and adjacent to the long side, and the at least one common electrode is electrically connected to the MEMS pumps The second electrode; wherein the microprocessor is electrically connected to the connecting electrodes and the at least one common electrode to transmit the control signal to the MEMS pumps.

Some typical embodiments embodying the features and advantages of this case will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different forms, and it does not deviate from the scope of this case, and the descriptions and illustrations therein are essentially used for explanation, not for limiting this case.

Please refer to Figure 2. Figure 2 is a schematic diagram of the MEMS pump module in this case. The micro piezoelectric pump module 100 includes: a microprocessor 3, a microelectromechanical chip 4, the microelectromechanical chip 4 is electrically connected to the microprocessor 3, and the microelectromechanical chip 4 includes a chip body 41, a plurality of microelectromechanical pumps 42, At least one common electrode 43 and a plurality of connecting electrodes 44. The chip body 41 has a rectangular shape with a long side 41a and a short side 41b. The microelectromechanical pumps 42 are arranged on the chip body 41, and each microelectromechanical pump 42 has A first electrode 42a and a second electrode 42b, and at least one common electrode 43 is also disposed on the chip body 41 and adjacent to the long side 41a, and is electrically connected to the second electrodes 42b of all the microelectromechanical pumps 42, the connecting electrodes 44 are disposed on The chip body 41 is adjacent to the long side 41a. The connecting electrodes 44 are respectively electrically connected to the first electrodes 42a of the MEMS pumps 42, wherein all the connecting electrodes 44 and at least one common electrode 43 on the chip body 41 are respectively electrically connected to the micro The processor 3 receives the control signal sent by the microprocessor 3. In addition, Figure 2 is also a schematic diagram of the first embodiment of the present invention. At least the number of common electrodes 43 includes a first common electrode 43a. The number of electrodes 43 is one, and the second electrodes 42b of all the MEMS pumps 42 are electrically connected to the first common electrode 43a.

Please refer to Figure 3. Figure 3 is a schematic diagram of the second embodiment of the MEMS chip of the MEMS pump module in this case. At least one common electrode 43 includes a first common electrode 43a and a second common electrode 43b. The plurality of MEMS pumps 42 are divided into a first MEMS pump group 421 and a second MEMS pump group 422 according to their positions. The MEMS pump 42 located in the first MEMS pump group 421 has its second electrode 42b are electrically connected to the first common electrode 43a, and the second electrode 42b of the MEMS pump 42 in the second MEMS pump group 422 is electrically connected to the second common electrode 43b, so as to achieve the effect of zone control. The number of common electrodes 43 in the embodiment is two.

Please refer to Figure 4. Figure 4 is a schematic diagram of the third embodiment of the MEMS chip of the MEMS pump module in this case. The third embodiment is the same as the second embodiment. There are two common electrodes 43, so the common electrode 43 has a first common electrode 43a and a second common electrode 43b. The first common electrode 43a and the second common electrode 43b are separately arranged on both sides of the wafer body 41, and the first common electrode 43a and the second common electrode 43b are electrically connected. In addition, the second electrodes 42b of the aforementioned plurality of MEMS pumps 42 are simultaneously electrically connected to the first common electrode 43a and the second common electrode 43b on both sides. The third embodiment can reduce the second electrode 42b of the MEMS pump 42 and the common electrode. The impedance between the electrodes 43 reduces the power loss of the second electrode 42b farther from the common electrode 43.

Please refer to Figure 5. Figure 5 is a schematic diagram of the fourth embodiment of the MEMS chip of the MEMS pump module in this case. At least one common electrode 43 includes a first common electrode 43a, a second common electrode 43b, and a third A common electrode 43c and a fourth common electrode 43d. The first common electrode 43a and the third common electrode 43c are spaced apart on one side of the wafer body 41, and the second common electrode 43b and the fourth common electrode 43d are spaced apart on the wafer body 41. On the other hand, in this embodiment, the aforementioned plurality of MEMS pumps 42 are divided into a first MEMS pump group 421, a second MEMS pump group 422, and a third MEMS pump group 423 according to location areas. And a fourth microelectromechanical pump group 424. The first microelectromechanical pump group 421 is composed of microelectromechanical pumps 42 adjacent to the first common electrode 43a, and the first common electrode 43a is provided in the first microelectromechanical pump group 421 The second electrodes 42b of all the microelectromechanical pumps 42 are electrically connected; the second microelectromechanical pump group 422 is composed of microelectromechanical pumps 42 adjacent to the second common electrode 43b, and the second common electrode 43b is provided in the second microelectromechanical pump group The second electrodes 42b of all the microelectromechanical pumps 42 in 422 are electrically connected; the third microelectromechanical pump group 423 is composed of microelectromechanical pumps 42 adjacent to the third common electrode 43c, and the third common electrode 43c is provided in the third microelectromechanical pump. The second electrodes 42b of all the microelectromechanical pumps 42 in the pump group 423 are electrically connected; the fourth microelectromechanical pump group 424 is composed of the microelectromechanical pumps 42 adjacent to the fourth common electrode 43d, and the fourth common electrode 43d is provided in the fourth common electrode 43d. The second electrodes 42b of all the microelectromechanical pumps 42 in the four microelectromechanical pump group 424 are electrically connected to achieve the effect of zone control.

Please refer to Figure 6. Figure 6 is a schematic diagram of the fifth embodiment of the MEMS chip of the MEMS pump module in this case. This embodiment has the same first common electrode 43a and second common electrode as in the fourth embodiment. 43b, the third common electrode 43c, and the fourth common electrode 43d, and their positions are also the same. The difference is that the first common electrode 43a is electrically connected to the second common electrode 43b in this embodiment, and the third common electrode 43c is electrically connected to the fourth common electrode. Common electrode 43d, and the aforementioned plurality of MEMS pumps 42 are divided into a first MEMS pump group 421 and a second MEMS pump group 422. The first MEMS pump group 421 is adjacent to the first common electrode 43a or The MEMS pumps 42 adjacent to the second common electrode 43b are formed, and the second MEMS pump group 422 is formed by the MEMS pumps 42 adjacent to the third common electrode 43c or the fourth common electrode 43d, thereby achieving zone control. It also reduces the distance between the common electrode 43 and the second electrode 42b and reduces the loss of power transmission.

Please refer to Figure 7. Figure 7 is a schematic diagram of the sixth embodiment of the MEMS chip of the MEMS pump module in this case. This embodiment and the fourth embodiment have the same first common electrode 43a and second common electrode. The electrode 43b, the third common electrode 43c, and the fourth common electrode 43d are arranged at the same position. The difference is that in this embodiment, the first common electrode 43a, the second common electrode 43b, the third common electrode 43c and the fourth The common electrodes 43d are all electrically connected to each other, so that the second electrodes 42b of the aforementioned plural MEMS pumps 42 can be electrically connected to the common electrodes 43 that are closer to them, such as the second electrodes of the MEMS pumps 42 adjacent to the first common electrode 43a. The electrode 42b is electrically connected to the first common electrode 43a, and the second electrode 42b of the microelectromechanical pump 42 adjacent to the second common electrode 43b is electrically connected to the second common electrode 43b, and so on, the common electrode 43 supplies the microelectrodes at similar positions. The electromechanical pump 42 can reduce the power loss of each microelectromechanical pump 42 in transmission.

Please refer to Fig. 8A and Fig. 8B at the same time. Fig. 8A is a schematic diagram of the electrical connection of the micro-electromechanical pump of the present invention, and Fig. 8B is a schematic diagram of the first embodiment of the control signal output by the microprocessor of the present invention; There is a piezoelectric element 42c. The first electrode 42a and the second electrode 42b transfer voltage to the piezoelectric element 42c, and the piezoelectric element 42c is deformed due to the piezoelectric effect, thereby changing the internal pressure of the microelectromechanical pump 42 for transport For fluid, the first electrode 42a of the MEMS pump 42 is electrically connected to the microprocessor 3 through the connecting electrode 44 (as shown in the second figure), and the second electrode 42b is electrically connected to the microprocessor 3 through the common electrode 43 (as the second As shown in the figure), the control signal output by the microprocessor 3 includes a certain voltage and a variable voltage. In this embodiment, the variable voltage can be a voltage switched between a first voltage and a second voltage. And the voltage value of the constant voltage is between the voltage value of the first voltage and the voltage value of the second voltage, and the voltage value of the constant voltage can also be the middle value of the voltage value of the first voltage and the voltage value of the second voltage ±10%, for example, when the first voltage is 1.5V and the second voltage is -1.5V, the constant voltage is 0V, the first voltage is 3V, and the second voltage is 0V, the constant voltage is 1.5V, so The second electrode 42b of the MEMS pump 42 receives a fixed voltage, and the first electrode 42a receives continuously changing first and second voltages, so that the piezoelectric element 42c will be continuously changed due to the continuous change between the first electrode 42a and the second electrode 42b. The voltage difference produces deformation, which is used to transfer fluid. In addition, please continue to refer to Figures 8C and 8D. Figure 8C is a schematic diagram of the second embodiment of the control signal output by the microprocessor of the present invention, and Figure 8D is a schematic diagram of the third embodiment of the control signal output by the microprocessor of the present project. The voltage can also be a voltage that continuously changes between the first voltage and the second voltage. In addition to the square wave of the first embodiment, the control signal can also use a triangular wave (Figure 8C) and a sine wave (Figure 8D).

To sum up, this project provides a MEMS pump module, which allows the microprocessor to transfer a constant voltage to the second electrode of the MEMS pump through the common electrode, and then transfer the variable voltage to the first electrode of the MEMS pump. Changing the voltage on the first electrode can change the voltage difference between the first electrode and the second electrode, and successfully drive the piezoelectric element of the MEMS pump to make it actuate to transfer fluid. The arrangement of the common electrode can greatly reduce micro The pins of the processor can effectively control multiple MEMS pumps while reducing the cost of the microprocessor.

This case can be modified in many ways by those who are familiar with this technology, but it is not deviated from the protection of the scope of the patent application.

100: MEMS pump module 1: high-end microprocessor 11: microprocessor pin 2: MEMS pump 3: microprocessor 4: MEMS chip 41: chip body 41a: long side 41b: short side 42: micro Electromechanical pump 42a: first electrode 42b: second electrode 42c: piezoelectric element 421: first MEMS pump group 422: second MEMS pump group 423: third MEMS pump group 424: fourth MEMS Pump group 43: common electrode 43a: first common electrode 43b: second common electrode 43c: third common electrode 43d: fourth common electrode 44: connecting electrode

Fig. 1 is a schematic diagram of a MEMS pump module in the prior art. Figure 2 is a schematic diagram of the MEMS pump module of this case. Figure 3 is a schematic diagram of the second embodiment of the MEMS chip of the MEMS pump module in this case. Figure 4 is a schematic diagram of the third embodiment of the MEMS chip of the MEMS pump module of the present invention. Figure 5 is a schematic diagram of the fourth embodiment of the MEMS chip of the MEMS pump module in this case. Figure 6 is a schematic diagram of the fifth embodiment of the MEMS chip of the MEMS pump module of the present invention. Figure 7 is a schematic diagram of the sixth embodiment of the MEMS chip of the MEMS pump module of the present invention. Figure 8A is a schematic diagram of the electrical connection of the MEMS pump in this case. Figure 8B is a schematic diagram of the first embodiment of the control signal output by the microprocessor of the present invention. Figure 8C is a schematic diagram of the second embodiment of the control signal output by the microprocessor of the present invention. Figure 8D is a schematic diagram of the third embodiment of the control signal output by the microprocessor of the present invention.

100: MEMS pump module

3: Microprocessor

4: MEMS chip

41: chip body

41a: Long side

41b: short side

42: MEMS pump

42a: first electrode

42b: second electrode

43: common electrode

43a: first common electrode

44: Connect electrode

Claims (10)

A micro-electro-mechanical pump module includes: a microprocessor that sends out a control signal; a micro-electro-mechanical chip that is electrically connected to the microprocessor, and the micro-electro-mechanical chip includes: a chip body, which has a rectangular shape and has a long A plurality of microelectromechanical pumps are arranged on the chip body, and each has a first electrode and a second electrode; A plurality of connection electrodes are arranged on the chip body and adjacent to the long side, and the connection electrodes are respectively electrically connected The first electrodes of the MEMS pumps; and at least one common electrode disposed on the chip body and adjacent to the long side, and the at least one common electrode is electrically connected to the second electrodes of the MEMS pumps; wherein the microprocessor is electrically connected to The connecting electrodes and the at least one common electrode are connected to transmit the control signal to the MEMS pumps. According to the MEMS pump module described in claim 1, wherein the at least one common electrode includes a first common electrode. For the MEMS pump module described in item 2 of the scope of patent application, the second electrodes of the MEMS pumps are electrically connected to the first common electrode. According to the MEMS pump module described in item 2 of the scope of patent application, the at least one common electrode further includes a second common electrode. For example, the MEMS pump module described in item 4 of the scope of patent application, wherein the MEMS pumps can be divided into a first MEMS pump group and a second MEMS pump group. The first MEMS pump group The second electrodes are electrically connected to the first common electrode, and the second electrodes of the second MEMS pump group are electrically connected to the second common electrode. The MEMS pump module described in item 4 of the scope of patent application, wherein the second electrodes of the MEMS pumps are electrically connected to the first common electrode and the second common electrode. According to the MEMS pump module described in claim 4, the at least one common electrode further includes a third common electrode and a fourth common electrode. Such as the MEMS pump module described in item 7 of the scope of patent application, wherein the MEMS pumps can be divided into a first MEMS pump group, a second MEMS pump group, and a third MEMS pump group And a fourth microelectromechanical pump group, the second electrodes of the first microelectromechanical pump group are electrically connected to the first common electrode, and the second electrodes of the second microelectromechanical pump group are electrically connected to the first common electrode Two common electrodes, the second electrodes of the third MEMS pump group are electrically connected to the third common electrode, and the second electrodes of the fourth MEMS pump group are electrically connected to the fourth common electrode. For example, the MEMS pump module described in item 7 of the scope of patent application, wherein the MEMS pumps can be divided into a first MEMS pump group and a second MEMS pump group. The first MEMS pump group The second electrodes are electrically connected to the first common electrode and the second common electrode, and the second electrodes of the second MEMS pump group are electrically connected to the third common electrode and the fourth common electrode. For example, the MEMS pump module described in item 7 of the scope of patent application, wherein the second electrodes of the MEMS pumps are electrically connected to the first common electrode, the second common electrode, the third common electrode and the fourth common electrode. electrode.

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