TW202021879A - Tape cover structure for preventing sticking components and die adhesion issues and greatly enhancing light transmittance - Google Patents
Tape cover structure for preventing sticking components and die adhesion issues and greatly enhancing light transmittance Download PDFInfo
- Publication number
- TW202021879A TW202021879A TW107146995A TW107146995A TW202021879A TW 202021879 A TW202021879 A TW 202021879A TW 107146995 A TW107146995 A TW 107146995A TW 107146995 A TW107146995 A TW 107146995A TW 202021879 A TW202021879 A TW 202021879A
- Authority
- TW
- Taiwan
- Prior art keywords
- cover tape
- adhesive layer
- tape structure
- structure according
- substrate
- Prior art date
Links
Images
Landscapes
- Packaging Frangible Articles (AREA)
- Packages (AREA)
Abstract
Description
本發明是有關於一種蓋帶結構,尤指一種可避免微小電子元件直接接觸黏著層造成黏料、沾晶等問題並大幅增加透光率之蓋帶結構。The present invention relates to a cover tape structure, in particular to a cover tape structure that can avoid the problems of adhesives, crystals, etc. caused by direct contact with the adhesive layer of tiny electronic components, and greatly increase the light transmittance.
近年,隨著顯示裝置對更加輕薄設計之需求與先進積體電路(IC)封裝製程之提升,使得整併各發光元件後開發而生之次毫米發光二極體(Mini LED)及其封裝膠體的微小化技術之開發、發展和裸晶(Bare Die)封裝技術,以及各項主被動電子元器件之封裝技術,已成為目前相關業界的主要核心技術之一。 但因應Mini LED元件、裸晶元件及主被動電子元器件輕薄化的發展,必須依據該Mini LED元件或裸晶元件或電子元器件之形狀而設計出用於收納該元件之熱塑性樹脂製載體帶,其尺寸亦趨於淺薄,而在收納該元件後,載體帶上方披覆之做為覆蓋材料的蓋帶,可藉由加熱的密封刀或壓輪而將蓋帶兩側沿著長度方向連續封合,形成收納該元件之包裝物。 請參閱第1圖,習知蓋帶1結構係由三層結構所組合構成,該蓋帶1結構分別為一基材膜層10(Polyester Film,PET)、一聚烯烴結合層11(Polyolefin Film,PO)及一熱敏性黏著膠層12(Heat Activity Adhesive,HAA)所疊合而成,而於該蓋帶1結構製造過程係為逐層塗布或使用淋模機(Extruder)塗塑複合而成,然而,於過程中常因化學藥劑失效、設備異常或人為操作疏失等原因而造成層與層之間接合不良,而導致分層、脫層的危險性及可能性。 此外,由於傳統三層式結構的蓋帶1結構因具分層、脫層的問題,並且有可能因蓋帶1的熱敏性黏著膠層12之性能與搭配的載體帶相排斥或不匹配,而使得於蓋帶1撕除過程中易造成容設於該載體帶內的電子元件直接接觸熱敏性黏著膠層所產生黏料、沾晶等問題。 是以,要如何解決上述習用之問題與缺失,即為本案之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。In recent years, with the demand for thinner and lighter designs of display devices and the improvement of advanced integrated circuit (IC) packaging processes, the development of sub-millimeter light-emitting diodes (Mini LEDs) and their packaging gels after integrating light-emitting elements The development and development of the latest miniaturization technology and Bare Die packaging technology, as well as the packaging technology of various active and passive electronic components, have become one of the main core technologies in the relevant industry. However, in response to the development of mini LED components, bare crystal components, and active and passive electronic components, it is necessary to design a thermoplastic resin carrier tape for storing the Mini LED components or bare crystal components or electronic components according to the shape of the components. , Its size also tends to be shallow, and after storing the component, the cover tape is covered on the carrier tape as the covering material, and the two sides of the cover tape can be continuous along the length direction by a heated sealing knife or pressing wheel Sealing to form a package containing the component. Please refer to Figure 1. The structure of the
爰此,為有效解決上述之問題,本發明之主要目的在於提供一種避免微小電子元件直接接觸黏著層造成黏料及沾晶問題之蓋帶結構。 本發明之次要目的,在於提供一種大幅增加透光率之蓋帶結構。 本發明之次要目的,在於提供一種大幅增加檢測便利性及檢測準確性之蓋帶結構。 為達上述目的,本發明係提供一種蓋帶結構,係包括一基材及一黏著層,該基材具有一上表面及一下表面,該下表面之左右兩側各形成至少一刻槽,該黏著層對應設置於所述下表面之左右兩側,並該黏著層對應設置於所述刻槽之外側。 透過本發明此結構的設計,由於所述蓋帶結構僅為兩層之構造,可免除習知蓋帶結構需有三層結構所造成的易有脫層及分層的危險性,此外,當該蓋帶結構對應貼設於一載體帶上時,由於所述黏著層係對應設置於該基材之下表面的左右兩側並且相對刻槽之外側位置處,因此,不僅可避免該載體帶內所容置的微小電子元件直接接觸該黏著層而造成黏料、沾晶等問題,並且透過該基材相對該刻槽的內側未設置所述黏著層之結構設計,可大幅增加透光率進而提升檢測便利性及準確性之效果。Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a cover tape structure that avoids the sticky material and crystal sticking problems caused by the direct contact of the tiny electronic components with the adhesive layer. The secondary objective of the present invention is to provide a cover tape structure that greatly increases light transmittance. The secondary purpose of the present invention is to provide a cover tape structure that greatly increases the convenience and accuracy of detection. To achieve the above objective, the present invention provides a cover tape structure, which includes a substrate and an adhesive layer. The substrate has an upper surface and a lower surface. The left and right sides of the lower surface are formed with at least one groove. The layer is correspondingly arranged on the left and right sides of the lower surface, and the adhesive layer is correspondingly arranged on the outer side of the groove. Through the design of this structure of the present invention, since the cover tape structure is only a two-layer structure, the risk of delamination and delamination caused by the conventional cover tape structure requiring a three-layer structure can be avoided. In addition, when the When the cover tape structure is correspondingly attached to a carrier tape, since the adhesive layer is correspondingly disposed on the left and right sides of the bottom surface of the substrate and at positions opposite to the outer side of the groove, it can not only avoid the inside of the carrier tape The contained tiny electronic components directly contact the adhesive layer, causing problems such as sticky material and crystal sticking, and through the structural design of the substrate relative to the inner side of the groove where the adhesive layer is not provided, the light transmittance can be greatly increased. Improve the convenience and accuracy of testing.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 請參閱第2、3圖,係為本發明蓋帶結構之第一實施例之立體圖,如圖所示,一種蓋帶結構2,係包括一基材20及一黏著層21,須說明的是,該基材20之材質係選擇為PET(Polyethylene terephthalate)或CPP(cast polypropylene)或BOPP(Biaxially Oriented Polypropylene)或PA(Polyamide)或PU(Polyurethane)或PE(polyethylene)或CPE(Chlorinated Polyethylene)其中任意一種所構成,並且該基材20於本實施例中其寬度介於4mm~92mm、厚度介於10u~100u為一最佳實施態樣,但並不引以為限,合先敘明; 所述基材20具有一上表面201及一下表面202,於該下表面202之左右兩側各形成至少一刻槽203,於本實施例中,該刻槽203之深度係介於8u~80u為一最佳實施態樣,但並不引以為限,且該刻槽203的深度使其位於刻槽203處的黏著層21之剝離力值係介於10g~80g; 所述黏著層21係對應設置於所述下表面202之左右兩側,並該黏著層21對應設置於所述刻槽203之外側,所述黏著層21係由熱熔型接合膠(Hot Melting Contact Adhesive)所構成,並且該黏著層21寬度係介於0.5mm~25mm、厚度則介於5u~50u為一最佳實施態樣,但並不引以為限,合先敘明; 另外,須說明的是,本發明蓋帶結構2更具有一載體帶3,該載體帶3兩側形成一貼附部30,所述黏著層21係對應貼設於該貼附部30處,所述載體帶3之材質係選擇為紙板或合成紙板或多層疊合紙或晶片紙或PS(Polystyrene)或PC(Polycarbonate)或PP(Polypropylene)或PET(Polyethylene terephthalate)或ABS(Acrylonitrile Butadiene Styrene)其中任意一種所構成,因此,於工作時,當撕開該載體帶3上的蓋帶結構2之基材20時會沿著所述刻槽203位置處撕開分離,故可適用於各種載體帶3的材質並且提供穩定的剝離力(如前所述,剝離力值係介於10g~80g),進以避免載體帶3內的微小電子元件4於剝離時所產生的震動問題。 再請一併參閱第3圖,透過本發明此結構的設計,由於所述蓋帶結構2僅為兩層(所述基材20及黏著層21)之構造,可免除習知蓋帶結構需有三層結構所造成的易有脫層及分層的危險性,此外,當該蓋帶結構2對應貼設在所述載體帶3上時,由於所述黏著層21係對應設置於該基材20之下表面202的左右兩側並且相對刻槽203之外側位置處,因此,不僅可避免該載體帶3內所容置的微小電子元件4直接接觸該黏著層21而造成黏料、沾晶等問題,並且透過該基材20相對該刻槽203的內側未設置所述黏著層21之結構設計,可大幅增加透光率進而提升檢測便利性及準確性之效果。 請參閱第4圖,係為本發明蓋帶結構第二實施例之立體組合圖,所述之蓋帶結構部份元件及元件間之相對應之關係與前述之蓋帶結構相同,故在此不再贅述,惟本蓋帶結構與前述最主要之差異為,該蓋帶結構2更具有一抗靜電層22,該抗靜電層22具有一上側220及一下側221,該上側220與所述下表面202相貼設,所述黏著層21係對應設置於該下側221之左右兩側,換言之,本實施例之蓋帶結構2係於所述基材20及黏著層21之間設置有所述抗靜電層22,該抗靜電層22係用以中和或消除電荷離子性,以避免靜電破壞微小電子元件4、產生火花而造成危險、灰塵汙染。 以上所述,本發明相較於習知具有下列優點: 1.避免微小電子元件直接接觸黏著層造成黏料、沾晶等問題; 2.大幅增加透光率; 3.大幅增加檢測便利性及檢測準確性。 以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍。The above objects, structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. The above objects, structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. Please refer to Figures 2 and 3, which are perspective views of the first embodiment of the cover tape structure of the present invention. As shown in the figure, a
1:蓋帶 10:基材膜層 11:聚烯烴結合層 12:熱敏性黏著膠層 2:蓋帶結構 20:基材 201:上表面 202:下表面 203:刻槽 21:黏著層 22:抗靜電層 220:上側 221:下側 3:載體帶 30:貼附部 4:電子元件 1: Cover tape 10: Substrate film layer 11: Polyolefin bonding layer 12: Heat-sensitive adhesive layer 2: Cover tape structure 20: Substrate 201: upper surface 202: lower surface 203: Notch 21: Adhesive layer 22: Antistatic layer 220: upper side 221: Underside 3: carrier tape 30: attaching part 4: electronic components
第1圖係為習知蓋帶結構之剖視圖; 第2圖係為本發明蓋帶結構之第一實施例之剖視圖; 第3圖係為本發明蓋帶結構之第一實施例之實施示意圖; 第4圖係為本發明蓋帶結構之第二實施例之剖視圖。Figure 1 is a cross-sectional view of the conventional cover tape structure; Figure 2 is a cross-sectional view of the first embodiment of the cover tape structure of the present invention; Figure 3 is a schematic diagram of the first embodiment of the cover tape structure of the present invention; Figure 4 is a cross-sectional view of the second embodiment of the cover tape structure of the present invention.
2:蓋帶結構 2: Cover tape structure
20:基材 20: Substrate
201:上表面 201: upper surface
202:下表面 202: lower surface
203:刻槽 203: Notch
21:黏著層 21: Adhesive layer
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201822035437.5U CN209276427U (en) | 2018-12-05 | 2018-12-05 | A kind of upper sealed adhesive tape of two sides compartment gluing |
CN201822035437.5 | 2018-12-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202021879A true TW202021879A (en) | 2020-06-16 |
Family
ID=67609992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107146995A TW202021879A (en) | 2018-12-05 | 2018-12-25 | Tape cover structure for preventing sticking components and die adhesion issues and greatly enhancing light transmittance |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN209276427U (en) |
TW (1) | TW202021879A (en) |
-
2018
- 2018-12-05 CN CN201822035437.5U patent/CN209276427U/en active Active
- 2018-12-25 TW TW107146995A patent/TW202021879A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN209276427U (en) | 2019-08-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6027802A (en) | Cover tape for packaging | |
CN105377713A (en) | Cover tape for packaging electronic components | |
TW201822335A (en) | Double-sided adhesive sheet and production method for semiconductor device | |
TWM444273U (en) | Back adhesive and print circuit board with same | |
TW202021879A (en) | Tape cover structure for preventing sticking components and die adhesion issues and greatly enhancing light transmittance | |
KR101145344B1 (en) | Cover tape for the electric part conveyance | |
JPH0618935Y2 (en) | Cover tape for chip-type electronic component packaging | |
JP2017081113A (en) | Laminate for packaging bag and manufacturing method therefor, packaging bag and manufacturing method therefor | |
TWI789533B (en) | Carrier tape system, method of forming carrier system and method for supplying semiconductor devices to apparatus | |
KR20080083293A (en) | A component casing comprising a micro circuit | |
JP2016104641A (en) | Cover tape, electronic component packaging material, and electronic component packaging body | |
KR20210106420A (en) | Cover film and electronic component package using same | |
JP4444814B2 (en) | Cover tape and electronic component packaging | |
TWI675752B (en) | Highly isolated electronic packaging cover tape | |
JPH0635964Y2 (en) | Cover tape for chip-type electronic component packaging | |
JP2511761Y2 (en) | Cover tape for chip type electronic parts packaging | |
JPH01303781A (en) | Flexible printed board with connection section of electronic component reinforced, and manufacture thereof | |
WO2023023983A1 (en) | Carrier tape and carrier tape assembly | |
TWI841722B (en) | Covering tape for packing elecronic component and package | |
JP2020045130A (en) | Electronic component packaging cover tape and package | |
CN112492777B (en) | Circuit board and manufacturing method thereof | |
TWM451782U (en) | Covering structure for use in printed circuit board | |
TWI656816B (en) | Electronic cardand fabricating method thereof | |
JPH0936182A (en) | Semiconductor element carrier tape | |
JP2017030851A (en) | Carrier tape, tape-like package, and manufacturing method of carrier tape |