TW202021879A - Tape cover structure for preventing sticking components and die adhesion issues and greatly enhancing light transmittance - Google Patents

Abstract

A tape cover structure comprises a substrate and an adhesive layer. The substrate has an upper surface and a lower surface. The left and right sides of the lower surface are respectively formed with at least one notch. The adhesive layer is correspondingly disposed on the left and right sides of the lower surface, and is correspondingly disposed on the outer side of the notch. By the structural design of the invention, miniature electronic components may be prevented from direct contact with the adhesive layer causing sticky components and die adhesion, and capable of greatly enhancing light transmittance.

Description

Cover tape structure

The present invention relates to a cover tape structure, in particular to a cover tape structure that can avoid the problems of adhesives, crystals, etc. caused by direct contact with the adhesive layer of tiny electronic components, and greatly increase the light transmittance.

In recent years, with the demand for thinner and lighter designs of display devices and the improvement of advanced integrated circuit (IC) packaging processes, the development of sub-millimeter light-emitting diodes (Mini LEDs) and their packaging gels after integrating light-emitting elements The development and development of the latest miniaturization technology and Bare Die packaging technology, as well as the packaging technology of various active and passive electronic components, have become one of the main core technologies in the relevant industry. However, in response to the development of mini LED components, bare crystal components, and active and passive electronic components, it is necessary to design a thermoplastic resin carrier tape for storing the Mini LED components or bare crystal components or electronic components according to the shape of the components. , Its size also tends to be shallow, and after storing the component, the cover tape is covered on the carrier tape as the covering material, and the two sides of the cover tape can be continuous along the length direction by a heated sealing knife or pressing wheel Sealing to form a package containing the component. Please refer to Figure 1. The structure of the conventional cover tape 1 is composed of three layers. The structure of the cover tape 1 is a base film layer 10 (Polyester Film, PET) and a polyolefin film layer 11 (Polyolefin Film). , PO) and a heat-sensitive adhesive layer 12 (Heat Activity Adhesive, HAA), and the structure of the cover tape 1 is made by layer-by-layer coating or extruder coating. However, in the process often due to chemical failure, equipment abnormality or human operation negligence and other reasons, poor bonding between layers, which leads to the danger and possibility of delamination and delamination. In addition, because the traditional three-layer structure of the cover tape 1 has problems of delamination and delamination, and it may be repelled or mismatched by the performance of the heat-sensitive adhesive layer 12 of the cover tape 1 and the matched carrier tape, As a result, the electronic components contained in the carrier tape directly contact the heat-sensitive adhesive layer to cause problems such as adhesives and crystal sticking during the tearing process of the cover tape 1. Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the inventor of this case and the related manufacturers engaged in this industry urgently want to study and improve.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a cover tape structure that avoids the sticky material and crystal sticking problems caused by the direct contact of the tiny electronic components with the adhesive layer. The secondary objective of the present invention is to provide a cover tape structure that greatly increases light transmittance. The secondary purpose of the present invention is to provide a cover tape structure that greatly increases the convenience and accuracy of detection. To achieve the above objective, the present invention provides a cover tape structure, which includes a substrate and an adhesive layer. The substrate has an upper surface and a lower surface. The left and right sides of the lower surface are formed with at least one groove. The layer is correspondingly arranged on the left and right sides of the lower surface, and the adhesive layer is correspondingly arranged on the outer side of the groove. Through the design of this structure of the present invention, since the cover tape structure is only a two-layer structure, the risk of delamination and delamination caused by the conventional cover tape structure requiring a three-layer structure can be avoided. In addition, when the When the cover tape structure is correspondingly attached to a carrier tape, since the adhesive layer is correspondingly disposed on the left and right sides of the bottom surface of the substrate and at positions opposite to the outer side of the groove, it can not only avoid the inside of the carrier tape The contained tiny electronic components directly contact the adhesive layer, causing problems such as sticky material and crystal sticking, and through the structural design of the substrate relative to the inner side of the groove where the adhesive layer is not provided, the light transmittance can be greatly increased. Improve the convenience and accuracy of testing.

The above objects, structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. The above objects, structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. Please refer to Figures 2 and 3, which are perspective views of the first embodiment of the cover tape structure of the present invention. As shown in the figure, a cover tape structure 2 includes a substrate 20 and an adhesive layer 21. It should be noted that The material of the substrate 20 is selected to be PET (Polyethylene terephthalate) or CPP (cast polypropylene) or BOPP (Biaxially Oriented Polypropylene) or PA (Polyamide) or PU (Polyurethane) or PE (polyethylene) or CPE (Chlorinated Polyethylene). It is an optimal embodiment that the substrate 20 is composed of any one, and the substrate 20 has a width of 4 mm to 92 mm and a thickness of 10 u to 100 u in this embodiment, but it is not limited to it, and is described first; The substrate 20 has an upper surface 201 and a lower surface 202. At least one notch 203 is formed on the left and right sides of the lower surface 202. In this embodiment, the depth of the notch 203 is between 8u and 80u. A preferred embodiment, but not limited to it, and the depth of the groove 203 is such that the peeling force value of the adhesive layer 21 at the groove 203 is between 10 g and 80 g; the adhesive layer 21 is Correspondingly arranged on the left and right sides of the lower surface 202, and the adhesive layer 21 is correspondingly arranged on the outer side of the groove 203, and the adhesive layer 21 is made of hot melt adhesive (Hot Melting Contact Adhesive), Moreover, the width of the adhesive layer 21 is between 0.5mm and 25mm, and the thickness is between 5u and 50u. It is an optimal implementation mode, but it is not to be regarded as a limitation, it shall be described first; in addition, it should be noted that this The cover tape structure 2 of the invention further has a carrier tape 3 formed on both sides of the carrier tape 3 with an attaching portion 30. The adhesive layer 21 is correspondingly attached to the attaching portion 30. The material of the carrier tape 3 is Choose from cardboard or synthetic cardboard, multi-layer laminated paper or chip paper, or PS (Polystyrene), PC (Polycarbonate), PP (Polypropylene), PET (Polyethylene terephthalate), or ABS (Acrylonitrile Butadiene Styrene). Therefore, During work, when the substrate 20 of the cover tape structure 2 on the carrier tape 3 is torn apart, it will be torn apart along the position of the notch 203, so it can be applied to various carrier tape 3 materials and provide stable The peeling force (as mentioned above, the peeling force value is between 10g and 80g), so as to avoid the vibration problem caused by the small electronic components 4 in the carrier tape 3 when peeling off. Please also refer to Figure 3 again. Through the design of this structure of the present invention, since the cover tape structure 2 is only a two-layer structure (the substrate 20 and the adhesive layer 21), the conventional cover tape structure can be eliminated. There is a risk of delamination and delamination caused by the three-layer structure. In addition, when the cover tape structure 2 is correspondingly attached to the carrier tape 3, since the adhesive layer 21 is correspondingly disposed on the substrate The left and right sides of the lower surface 202 of the lower surface 20 and the position on the outer side of the groove 203 are opposite. Therefore, it can not only prevent the tiny electronic components 4 contained in the carrier tape 3 from directly contacting the adhesive layer 21, which may cause sticky material and crystal sticking. In addition, through the structural design of the substrate 20 that is not provided with the adhesive layer 21 on the inner side of the groove 203, the light transmittance can be greatly increased, thereby improving the convenience and accuracy of detection. Please refer to Figure 4, which is a three-dimensional assembly view of the second embodiment of the cover tape structure of the present invention. The part of the cover tape structure and the corresponding relationship between the elements are the same as the aforementioned cover tape structure, so here Without repeating it, the main difference between the cover tape structure and the aforementioned cover tape structure 2 is that the cover tape structure 2 further has an antistatic layer 22. The antistatic layer 22 has an upper side 220 and a lower side 221. The lower surface 202 is attached to each other, and the adhesive layer 21 is correspondingly provided on the left and right sides of the lower side 221. In other words, the cover tape structure 2 of this embodiment is provided between the substrate 20 and the adhesive layer 21 The antistatic layer 22 is used to neutralize or eliminate the ionicity of the charge, so as to avoid static electricity from destroying the tiny electronic components 4, generating sparks and causing danger and dust pollution. As mentioned above, the present invention has the following advantages compared with the prior art: 1. Avoid the problems of adhesion and crystal sticking caused by small electronic components directly contacting the adhesive layer; 2. Significantly increase the light transmittance; 3. Significantly increase the convenience of detection and Detection accuracy. The present invention has been described in detail above, but what is described above is only a preferred embodiment of the present invention, and should not limit the scope of implementation of the present invention. That is, all changes and modifications made within the scope of the application of the present invention shall still fall within the scope of the patent of the present invention.

1: Cover tape 10: Substrate film layer 11: Polyolefin bonding layer 12: Heat-sensitive adhesive layer 2: Cover tape structure 20: Substrate 201: upper surface 202: lower surface 203: Notch 21: Adhesive layer 22: Antistatic layer 220: upper side 221: Underside 3: carrier tape 30: attaching part 4: electronic components

Figure 1 is a cross-sectional view of the conventional cover tape structure; Figure 2 is a cross-sectional view of the first embodiment of the cover tape structure of the present invention; Figure 3 is a schematic diagram of the first embodiment of the cover tape structure of the present invention; Figure 4 is a cross-sectional view of the second embodiment of the cover tape structure of the present invention.

2: Cover tape structure

20: Substrate

201: upper surface

202: lower surface

203: Notch

21: Adhesive layer

Claims (10)

A cover tape structure includes: a substrate having an upper surface and a lower surface, the left and right sides of the lower surface are each formed with at least one groove; and an adhesive layer, which is correspondingly provided on the left and right sides of the lower surface And the adhesive layer is correspondingly arranged on the outer side of the groove. According to claim 1, the cover tape structure further has an antistatic layer, the antistatic layer has an upper side and a lower side, the upper side is attached to the lower surface, and the adhesive layer is correspondingly provided on the The left and right sides of the lower side. The cover tape structure according to claim 1, wherein the material of the substrate is selected to be PET (Polyethylene terephthalate) or CPP (cast polypropylene) or BOPP (Biaxially Oriented Polypropylene) or PA (Polyamide) or PU (Polyurethane) or It is composed of either PE (polyethylene) or CPE (Chlorinated Polyethylene). The cover tape structure according to claim 1, wherein the width of the substrate is between 4mm and 92mm, and the thickness of the substrate is between 10u and 100u. The cover tape structure according to claim 1, wherein the adhesive layer is composed of hot melt adhesive (Hot Melting Contact Adhesive). The cover tape structure according to claim 1, wherein the width of the adhesive layer disposed on the outside of the groove is between 0.5mm and 25mm, and the thickness is between 5u and 50u. The cover tape structure according to claim 1, wherein the depth of the grooves is between 8u and 80u. The cover tape structure according to claim 1, wherein the peeling force value of the adhesive layer at the groove is between 10 g and 80 g. The cover tape structure according to claim 1, wherein there is a carrier tape, an attachment part is formed on both sides of the carrier tape, and the adhesive layer is correspondingly attached to the attachment part. The cover tape structure according to claim 9, wherein the material of the carrier tape is selected from cardboard or synthetic cardboard, multilayer laminated paper or wafer paper, or PS (Polystyrene) or PC (Polycarbonate) or PP (Polypropylene) or PET (Polyethylene terephthalate) or ABS (Acrylonitrile Butadiene Styrene).

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