TW202021509A - Computer cockpit with food thermal insulation rack - Google Patents

Abstract

A computer cockpit includes a cockpit body, a computer host, a heat pipe and a thermal insulation rack. The computer host is disposed to the cockpit body, and the computer host includes a heat source. The heat pipe is connected to the heat source. The thermal insulation rack is disposed to the cockpit body and is connected to the heat pipe. The heat from the heat source is adapted to be conducted to the thermal insulation rack by the heat pipe to maintain the thermal insulation rack at a particular temperature.

Description

Computer cockpit with food insulation rack

The present invention relates to a computer cockpit, and more particularly to a computer cockpit with a food insulation rack.

With the rise of the e-sports industry, more and more products have emerged. In order to provide users with a more comfortable environment, vendors have developed products such as computer cockpits. The computer cockpit provides users with higher comfort and can meet the needs of users sitting in the computer cockpit for a long time, and the computer cockpit is equipped with a computer host of higher specifications, which can provide users with higher enjoyment. However, in the existing computer cockpit, the heat generated by the computer mainframe is meaninglessly radiated to the outside. In other words, the heat generated by the computer mainframe lacks good applications.

The invention provides a computer cockpit, which can use the heat generated by the computer host as the heat source of the food insulation rack, and is helpful for efficiently using the heat generated by the computer host.

A computer cockpit of the present invention includes a cabin body, a computer host, a heat conduction pipe and a heat preservation frame. The computer host is arranged in the cockpit, and the computer host includes a heat source. The heat pipe is connected to the heat source. The heat preservation frame is arranged on the cabin body and connected to the heat pipe. The heat emitted by the heat source is suitable for being conducted to the heat preservation frame through the heat pipe so as to maintain the heat preservation frame at a temperature.

In an embodiment of the present invention, the above-mentioned thermal insulation rack includes a box body and a heating module. The box body is fixed to the cockpit body. The heating module is arranged under the box body and on the heat conduction path of the heat pipe.

In an embodiment of the present invention, the aforementioned heat pipe includes a heating section. The heating section is arranged in the heating module, and the heat conducted by the heating section is suitable for being conducted to the box body through the heating module, so that the box body is maintained at this temperature.

In an embodiment of the present invention, the above-mentioned heating module includes a heating element and a heat insulating element. The heating element is arranged below the box body. The heat insulation element is arranged below the heating element, and the heating section is located between the heating element and the heat insulation element.

In an embodiment of the present invention, the above-mentioned heating element is suitable for conducting the heat of the heating section into the box, and the heat insulating element is suitable for isolating the heat of the heating section and the heating element from the box.

In an embodiment of the present invention, the aforementioned box has at least one opening, and at least one object to be heated is adapted to pass through the at least one opening and then be placed in the box.

In an embodiment of the present invention, the above-mentioned thermal insulation rack includes a fixing member connected to the box body, and the thermal insulation rack is fixed to the cockpit body through the fixing member.

In an embodiment of the present invention, the above-mentioned computer cockpit further includes a cooling system connected to the main computer, and the thermal insulation rack is located on the heat conduction path of the cooling system.

In an embodiment of the present invention, the aforementioned cooling system includes a heat dissipation element, the heat pipe and a return pipe. The heat dissipation element is arranged on the cockpit body. The heat pipe is connected between the computer host and the heat dissipation element. The return pipe is connected between the heat dissipation element and the computer host. The heat emitted by the heat source is suitable for being conducted to the heat dissipation element through the heat pipe, and the heat dissipation element is suitable for cooling the heat conducted by the heat pipe and further conducts it back to the heat source through the return pipe.

In an embodiment of the present invention, the aforementioned heat pipe includes a water-cooled heat pipe, and the return pipe includes a water-cooled return pipe.

Based on the foregoing, in the computer cockpit of the present invention, the heat emitted by the heat source is suitable for being conducted to the heat preservation frame through the heat pipe, so that the heat preservation frame maintains a temperature. Accordingly, the computer cockpit of the present invention can use the heat generated by the computer host as the heat source of the food insulation rack, which helps to efficiently utilize the heat generated by the computer host.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below and described in detail in conjunction with the accompanying drawings.

Fig. 1 is a schematic diagram of a computer cockpit according to an embodiment of the present invention. FIG. 1 schematically shows a computer host 120, a heat source 122, a cooling system 130, a heat dissipation element 132, a heat conduction pipe 134, a return pipe 136, and a heat preservation frame 140 in dotted lines. Please refer to FIG. 1, the computer cockpit 100 of this embodiment includes a cockpit body 110, a computer mainframe 120, a heat pipe 134 and a thermal insulation frame 140. The main computer 120 is disposed in the cockpit 110, and the main computer 120 includes a heat source 122. The heat pipe 134 is connected to the heat source 122. The heat preservation frame 140 is disposed on the cabin body 110 and connected to the heat pipe 134. Accordingly, the heat generated by the heat source 122 is transferred to the heat preservation frame 140 through the heat pipe 134, so that the heat preservation frame 140 is maintained at a temperature. Therefore, the computer cockpit 100 of this embodiment can use the heat generated by the computer host 120 as the heat source of the thermal insulation rack 140, which helps to efficiently utilize the heat generated by the computer host 120.

Fig. 2 is a three-dimensional schematic diagram of the thermal insulation rack of Fig. 1. Fig. 3 is an exploded schematic diagram of the thermal insulation rack of Fig. 2. Fig. 4 is a schematic diagram of the thermal insulation rack of Fig. 2 equipped with fixing parts. Please refer to FIG. 1, FIG. 3 and FIG. 4, the heat preservation frame 140 includes a box body 142, a heating module 144 and a fixing member 146. The fixing member 146 is connected to the box body 142, and the heat preservation frame 140 is further fixed to the computer cockpit 110 through the fixing member 146. The heating module 144 is disposed under the box body 142, and the heating module 144 is located on the heat conduction path of the heat pipe 134.

Please refer to FIG. 1, FIG. 2 and FIG. 3. The heating module 144 of this embodiment includes a heating element 144a and an insulating element 144b. The heating element 144a is arranged below the box body 142. The heat insulation element 144b is arranged below the heating element 144a. A heating section 134a of the heat pipe 134 is disposed between the heating element 144a and the heat insulating element 144b of the heating module 144. Accordingly, the heat conducted by the heat pipe 134 can be conducted to the heating element 144a of the heating module 144, and the heat of the heating element 144a can be conducted to the box body 142, so that the box body 142 can be maintained at this temperature. In addition, the heat insulation element 144b can isolate the heat of the heating element 144a and the heat of the heating section 134a of the heat pipe 134 in the box body 142, so that the heat preservation rack 140 of the present invention can have a better heat preservation effect.

In this embodiment, the box body 142 of the thermal insulation rack 140 has at least one opening (for example, an opening 142a and an opening 142b), and at least one object to be heated (for example, an object to be heated B1 and an object to be heated B2) can pass through the opening 142a, 142b is further placed in the box body 142. The object B1 to be heated is, for example, food, and the object B2 to be heated is, for example, a drink. Preferably, after passing through the openings 142a and 142b, the object B1 and the object B2 to be heated can be directly carried and contacted with the heating element 144a of the heating module 144 to obtain a better heating and heat preservation effect.

Fig. 5 is a schematic diagram of the cooling system of Fig. 1. Please refer to FIG. 1, FIG. 2, and FIG. 5, the computer cockpit 100 of this embodiment further includes a cooling system 130. The cooling system 130 includes a heat dissipation element 132, the aforementioned heat pipe 134 and a return pipe 136. The heat pipe 134 includes a water-cooled heat pipe, and the return pipe 136 includes a water-cooled return pipe. The insulation rack 140 is located on the heat conduction path of the heat pipe 134 of the cooling system 130. The heat dissipation element 132 includes a cold row 132a (or condenser) and a fan 132b. The heat dissipation element 132 is disposed on the cabin body 110. The heat pipe 134 is connected between the computer host 120 and the heat dissipation element 132. The return pipe 136 is connected between the heat dissipation element 132 and the computer host 120. The heat generated by the heat source 122 can be conducted to the cold row 132 a of the heat dissipation element 132 through the heat pipe 134. The fan 132b can draw the outside air A to the cold row 132a, thereby cooling the liquid in the cold row 132a. Then, the cooled liquid can be transported back to the heat source 122 through the return pipe 136 to cool the heat source 122.

To sum up, in the computer cockpit of the present invention, the heat generated by the heat source is conducted to the heat preservation frame through the heat conducting pipe, so that the heat preservation frame maintains a temperature. Therefore, the computer cockpit of the present invention can use the heat generated by the computer host as the heat source of the thermal insulation rack, which helps to efficiently utilize the heat generated by the computer host.

Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

100: computer cockpit 110: cockpit cabin 120: computer host 122: heat source 130: cooling system 132: heat dissipation element 132a: cold exhaust 132b: fan 134: heat pipe 134a: heating section 136: return pipe 140: insulation rack 142: box Body 142a, 142b: opening 144: heating module 144a: heating element 144b: heat insulation element 146: fixing part A: air B1, B2: object to be heated

Fig. 1 is a schematic diagram of a computer cockpit according to an embodiment of the present invention. Fig. 2 is a three-dimensional schematic diagram of the thermal insulation rack of Fig. 1. Fig. 3 is an exploded schematic diagram of the thermal insulation rack of Fig. 2. Fig. 4 is a schematic diagram of the thermal insulation rack of Fig. 2 equipped with fixing parts. Fig. 5 is a schematic diagram of the cooling system of Fig. 1.

100: computer cockpit

110: Cockpit

120: computer host

122: heat source

130: cooling system

132: heat dissipation element

134: heat pipe

136: Return pipe

140: Insulation rack

Claims (10)

A computer cockpit includes: a cockpit body; a computer host arranged in the cockpit cabin body, and the computer host includes a heat source; a heat conduction pipe connected to the heat source; and a thermal insulation rack arranged on the cockpit cabin body , And connected to the heat-conducting pipe, wherein the heat emitted by the heat source is suitable for being transferred to the heat-preserving frame through the heat-conducting pipe, so that the heat-preserving frame maintains a temperature. The computer cockpit described in item 1 of the scope of patent application, wherein the thermal insulation rack includes: a box body fixed to the cockpit cabin body; and a heating module arranged below the box body and located at the heat pipe Heat conduction path. The computer cockpit described in item 2 of the scope of patent application, wherein the heat pipe includes a heating section disposed in the heating module, and the heat conducted by the heating section is suitable for being conducted to the box body through the heating module , So that the box is maintained at this temperature. For the computer cockpit described in item 3 of the scope of patent application, the heating module includes: a heating element arranged under the box; and a heat insulating element arranged under the heating element, and the heating section Located between the heating element and the heat insulation element. For the computer cockpit described in item 4 of the scope of patent application, wherein the heating element is suitable for conducting the heat of the heating section into the box body, and the heat insulation element is suitable for isolating the heat of the heating section and the heating element from the Inside the box. The computer cockpit described in item 2 of the scope of patent application, wherein the box body has at least one opening, and at least one object to be heated is adapted to pass through the at least one opening and be placed in the box body. For the computer cockpit described in item 2 of the scope of patent application, the thermal insulation frame includes: a fixing member connected to the box body, and the thermal insulation frame is fixed to the cockpit cabin body through the fixing member. The computer cockpit described in item 1 of the scope of the patent application further includes: a cooling system connected to the computer host, and the thermal insulation rack is located on the heat conduction path of the cooling system. For the computer cockpit described in item 8 of the scope of patent application, the cooling system includes: a heat dissipation element disposed in the cockpit body; the heat pipe connected between the computer host and the heat dissipation element; and a return pipe , Connected between the heat dissipation element and the computer host, wherein the heat emitted by the heat source is suitable for being conducted to the heat dissipation element by the heat pipe, and the heat dissipation element is suitable for further cooling the heat conducted by the heat pipe Conduction back to the heat source through the return pipe. In the computer cockpit described in item 9 of the scope of patent application, the heat pipe includes a water-cooled heat pipe, and the return pipe includes a water-cooled return pipe.

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