TW200711559A - Passive heat-dissipating fan system and electronic system contaning the same - Google Patents

Passive heat-dissipating fan system and electronic system contaning the same

Info

Publication number
TW200711559A
TW200711559A TW094130973A TW94130973A TW200711559A TW 200711559 A TW200711559 A TW 200711559A TW 094130973 A TW094130973 A TW 094130973A TW 94130973 A TW94130973 A TW 94130973A TW 200711559 A TW200711559 A TW 200711559A
Authority
TW
Taiwan
Prior art keywords
airflow
hot
cold
cooling member
electronic system
Prior art date
Application number
TW094130973A
Other languages
Chinese (zh)
Other versions
TWI298239B (en
Inventor
Shun-Chen Chang
Chia-Ming Hsu
Wen-Shi Huang
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW094130973A priority Critical patent/TWI298239B/en
Priority to US11/370,911 priority patent/US20070056293A1/en
Priority to DE102006012718A priority patent/DE102006012718A1/en
Priority to JP2006207591A priority patent/JP2007081376A/en
Publication of TW200711559A publication Critical patent/TW200711559A/en
Application granted granted Critical
Publication of TWI298239B publication Critical patent/TWI298239B/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B47/00—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass
    • F25B47/006—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass for preventing frost
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A passive heat-dissipating fan system set in an electronic system includes an airflow-providing device, an airflow-guiding device, a cooling member with one cold end and one hot end disposed in the airflow-guiding device, at least one cold-end passive assembly, and at least one hot-end passive assembly. High pressure airflow generated by the airflow-providing device is distributed into the airflow-guiding device and divided into tow parts. One part of the airflow flows over the hot end of the cooling member and takes the heat of the cooling member out of the electronic system through the hot-end passive assembly. The other part of the airflow flows over the cold end of the cooling member and into the cold-end passive assembly, which can dissipate the heat generated by an electronic element without producing dew.
TW094130973A 2005-09-09 2005-09-09 Passive heat-dissipating fan system and electronic system containing the same TWI298239B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW094130973A TWI298239B (en) 2005-09-09 2005-09-09 Passive heat-dissipating fan system and electronic system containing the same
US11/370,911 US20070056293A1 (en) 2005-09-09 2006-03-09 Passive heat-dissipating fan system and electronic system containing the same
DE102006012718A DE102006012718A1 (en) 2005-09-09 2006-03-17 Passive heat-dissipating fan system and electronic system equipped with it
JP2006207591A JP2007081376A (en) 2005-09-09 2006-07-31 Passive heat dissipating fan system and electronic system provided with the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094130973A TWI298239B (en) 2005-09-09 2005-09-09 Passive heat-dissipating fan system and electronic system containing the same

Publications (2)

Publication Number Publication Date
TW200711559A true TW200711559A (en) 2007-03-16
TWI298239B TWI298239B (en) 2008-06-21

Family

ID=37832742

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130973A TWI298239B (en) 2005-09-09 2005-09-09 Passive heat-dissipating fan system and electronic system containing the same

Country Status (4)

Country Link
US (1) US20070056293A1 (en)
JP (1) JP2007081376A (en)
DE (1) DE102006012718A1 (en)
TW (1) TWI298239B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105258382A (en) * 2015-09-29 2016-01-20 青岛海尔特种电冰箱有限公司 Heat exchange device and semiconductor refrigerator provided with same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008085172A1 (en) * 2007-01-11 2008-07-17 Otis Elevator Company Thermoelectric temperature control with convective air flow for cooling elevator components
US8037693B2 (en) * 2008-05-13 2011-10-18 Ge Intelligent Platforms, Inc. Method, apparatus, and system for cooling an object
CN110139530B (en) * 2018-02-02 2020-09-15 台达电子工业股份有限公司 Liquid cooling device with liquid-gas isolation mechanism
CN109002103B (en) * 2018-08-17 2020-12-01 包建伟 Server machine case with heat dissipation function
CN110854715B (en) * 2019-11-08 2021-09-21 湖南国开电气有限公司 Combined power distribution cabinet
CN110822581B (en) * 2019-11-18 2021-07-09 上海三菱电机·上菱空调机电器有限公司 Intelligent air conditioning system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19507977A1 (en) * 1995-03-07 1996-09-12 Schatz Thermo Gastech Gmbh Method and arrangement for reducing the exhaust gas emissions of internal combustion engines with exhaust gas catalysts
US6215249B1 (en) * 1999-11-16 2001-04-10 Jong-Cherng Wu Fluorescent lamp assembly
US6705089B2 (en) * 2002-04-04 2004-03-16 International Business Machines Corporation Two stage cooling system employing thermoelectric modules
TW588144B (en) * 2002-11-21 2004-05-21 Delta Electronics Inc Blower with a plurality of impellers
US6940195B2 (en) * 2003-05-12 2005-09-06 Delta Electronics, Inc. Fastening structure for securing stator of motor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105258382A (en) * 2015-09-29 2016-01-20 青岛海尔特种电冰箱有限公司 Heat exchange device and semiconductor refrigerator provided with same

Also Published As

Publication number Publication date
JP2007081376A (en) 2007-03-29
DE102006012718A1 (en) 2007-03-29
TWI298239B (en) 2008-06-21
US20070056293A1 (en) 2007-03-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees