TW200711559A - Passive heat-dissipating fan system and electronic system contaning the same - Google Patents
Passive heat-dissipating fan system and electronic system contaning the sameInfo
- Publication number
- TW200711559A TW200711559A TW094130973A TW94130973A TW200711559A TW 200711559 A TW200711559 A TW 200711559A TW 094130973 A TW094130973 A TW 094130973A TW 94130973 A TW94130973 A TW 94130973A TW 200711559 A TW200711559 A TW 200711559A
- Authority
- TW
- Taiwan
- Prior art keywords
- airflow
- hot
- cold
- cooling member
- electronic system
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B47/00—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass
- F25B47/006—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass for preventing frost
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A passive heat-dissipating fan system set in an electronic system includes an airflow-providing device, an airflow-guiding device, a cooling member with one cold end and one hot end disposed in the airflow-guiding device, at least one cold-end passive assembly, and at least one hot-end passive assembly. High pressure airflow generated by the airflow-providing device is distributed into the airflow-guiding device and divided into tow parts. One part of the airflow flows over the hot end of the cooling member and takes the heat of the cooling member out of the electronic system through the hot-end passive assembly. The other part of the airflow flows over the cold end of the cooling member and into the cold-end passive assembly, which can dissipate the heat generated by an electronic element without producing dew.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094130973A TWI298239B (en) | 2005-09-09 | 2005-09-09 | Passive heat-dissipating fan system and electronic system containing the same |
US11/370,911 US20070056293A1 (en) | 2005-09-09 | 2006-03-09 | Passive heat-dissipating fan system and electronic system containing the same |
DE102006012718A DE102006012718A1 (en) | 2005-09-09 | 2006-03-17 | Passive heat-dissipating fan system and electronic system equipped with it |
JP2006207591A JP2007081376A (en) | 2005-09-09 | 2006-07-31 | Passive heat dissipating fan system and electronic system provided with the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094130973A TWI298239B (en) | 2005-09-09 | 2005-09-09 | Passive heat-dissipating fan system and electronic system containing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200711559A true TW200711559A (en) | 2007-03-16 |
TWI298239B TWI298239B (en) | 2008-06-21 |
Family
ID=37832742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094130973A TWI298239B (en) | 2005-09-09 | 2005-09-09 | Passive heat-dissipating fan system and electronic system containing the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070056293A1 (en) |
JP (1) | JP2007081376A (en) |
DE (1) | DE102006012718A1 (en) |
TW (1) | TWI298239B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105258382A (en) * | 2015-09-29 | 2016-01-20 | 青岛海尔特种电冰箱有限公司 | Heat exchange device and semiconductor refrigerator provided with same |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008085172A1 (en) * | 2007-01-11 | 2008-07-17 | Otis Elevator Company | Thermoelectric temperature control with convective air flow for cooling elevator components |
US8037693B2 (en) * | 2008-05-13 | 2011-10-18 | Ge Intelligent Platforms, Inc. | Method, apparatus, and system for cooling an object |
CN110139530B (en) * | 2018-02-02 | 2020-09-15 | 台达电子工业股份有限公司 | Liquid cooling device with liquid-gas isolation mechanism |
CN109002103B (en) * | 2018-08-17 | 2020-12-01 | 包建伟 | Server machine case with heat dissipation function |
CN110854715B (en) * | 2019-11-08 | 2021-09-21 | 湖南国开电气有限公司 | Combined power distribution cabinet |
CN110822581B (en) * | 2019-11-18 | 2021-07-09 | 上海三菱电机·上菱空调机电器有限公司 | Intelligent air conditioning system |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19507977A1 (en) * | 1995-03-07 | 1996-09-12 | Schatz Thermo Gastech Gmbh | Method and arrangement for reducing the exhaust gas emissions of internal combustion engines with exhaust gas catalysts |
US6215249B1 (en) * | 1999-11-16 | 2001-04-10 | Jong-Cherng Wu | Fluorescent lamp assembly |
US6705089B2 (en) * | 2002-04-04 | 2004-03-16 | International Business Machines Corporation | Two stage cooling system employing thermoelectric modules |
TW588144B (en) * | 2002-11-21 | 2004-05-21 | Delta Electronics Inc | Blower with a plurality of impellers |
US6940195B2 (en) * | 2003-05-12 | 2005-09-06 | Delta Electronics, Inc. | Fastening structure for securing stator of motor |
-
2005
- 2005-09-09 TW TW094130973A patent/TWI298239B/en not_active IP Right Cessation
-
2006
- 2006-03-09 US US11/370,911 patent/US20070056293A1/en not_active Abandoned
- 2006-03-17 DE DE102006012718A patent/DE102006012718A1/en not_active Withdrawn
- 2006-07-31 JP JP2006207591A patent/JP2007081376A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105258382A (en) * | 2015-09-29 | 2016-01-20 | 青岛海尔特种电冰箱有限公司 | Heat exchange device and semiconductor refrigerator provided with same |
Also Published As
Publication number | Publication date |
---|---|
JP2007081376A (en) | 2007-03-29 |
DE102006012718A1 (en) | 2007-03-29 |
TWI298239B (en) | 2008-06-21 |
US20070056293A1 (en) | 2007-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |