JP2017129507A - Temperature controller and temperature-testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure test precision by uniformizing temperature distribution in the entire testing device.SOLUTION: A temperature-testing device for performing an operation test of an electronic component under a predetermined temperature environment includes: a flat cooling/heating plate part 2 in which one surface is brought into contact with an electronic component subjected to a temperature test; a heat circulation space part 6 demarcated so as to surround the other surface of the cooling/heating plate part 2; a temperature-varying part 3 that is installed so as to be isolated from a surface in which the cooling/heating plate part 2 of the heat circulation space part 6 is formed, and is installed while facing the heat circulation space part 6, and heats or cools the heat circulation space part 6; an air flow stabilizing plate 5 for forming an air circulation path within the heat circulation space part 6; and an inner circulation fan 4 provided in the middle of the circulation path to circulate air along the circulation path.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a temperature controller provided with a heating / cooling means, a temperature characteristic test for performing an operation test of electronic components such as a temperature sensor and a semiconductor element in a predetermined temperature environment, and a chemical using the temperature controller.・ Chemical products and food temperature environment tests relate to temperature test equipment.

  In general, as one of various tests performed on electronic components such as semiconductor elements, chemicals and chemical products, there are a temperature characteristic test and a temperature environment test performed under a predetermined temperature environment. In these temperature tests, measurement of quality characteristic items is performed while operating an electronic component in a temperature environment higher or lower than normal temperature, and a dedicated temperature test apparatus is used for such a test.

  As an example of this temperature test apparatus, there is one provided with a temperature control apparatus that performs heating using the Peltier effect of an electronic thermoelectric element (see, for example, Patent Document 1). In the temperature control device shown in Patent Document 1, a soaking block made of a good heat conductive material is in close contact with the lower surface of a temperature variable portion made of a Peltier element, and the Peltier element releases heat to the soaking block or By changing the temperature of the soaking block through absorption and pressing the soaking block against the electronic component to be tested, the device under test can be brought into a predetermined temperature environment.

  According to such a temperature control device shown in Patent Document 1, the electronic component to be tested is changed to a predetermined temperature by heating / cooling by contact heat transfer, and the test is performed in a temperature environment higher or lower than normal temperature. By doing so, there is an advantage that the time required for the test can be shortened by accelerating the deterioration of quality over time.

JP 2003-258324 A

  However, in the temperature control device shown in the above-mentioned patent document, the Peltier element is brought into contact with the heating block, the heating block is heated and cooled by conduction, and the electronic component to be tested is heated through the heated heating block. Because of this system, the temperature of the part near the Peltier element is high, and the temperature at the part far from the Peltier element is low. There is a problem that it is difficult to ensure test accuracy for electronic components that are difficult to test and that need to control the test temperature with high accuracy.

  Therefore, the present invention has been made in view of such a problem, and provides a temperature controller capable of making temperature distribution uniform throughout the test apparatus and ensuring test accuracy, and a temperature test apparatus including the same. That is the purpose.

  In order to achieve the above object, a temperature controller according to the present invention surrounds a flat conductor plate whose one surface is in contact with an electronic component to be subjected to a temperature test and the other surface of the conductor plate. The thermal circulation space portion defined by the thermal circulation space portion and a surface of the thermal circulation space portion that is separated from the surface on which the conductor plate is formed, and is disposed so as to face the thermal circulation space portion. A temperature control unit that heats or cools the unit, a path forming member that forms a circulation path of air in the thermal circulation space part, and provided in the middle of the circulation path, for circulating air along the circulation path And an air blowing means. The temperature controller can be applied to a temperature test apparatus that performs an operation test of an electronic component under a predetermined temperature environment.

  According to the present invention as described above, the conductor plate on which electronic parts, chemicals, chemical products and the like to be subjected to the temperature test are placed and the temperature control unit such as a Peltier element to be heated or cooled are installed separately. In addition, since the air in the heat circulation space is circulated by the air blowing means, the temperature distribution on the surface of the conductor plate can be prevented from being uneven.

  In the above invention, an internal heat exchanging member having an internal heat radiation fin is thermally coupled to a surface of the temperature control unit directed inward of the thermal circulation space, and the blowing unit is connected to the internal heat radiation fin. The path forming member is disposed adjacent to the inner heat dissipating fin, and is installed on a plane parallel to the conductor plate so as to separate the air blowing direction front and the air blowing rear of the internal heat dissipating fin. It is preferable that

  In this case, the path forming members are arranged around the internal heat radiation fins, and the inside of the heat circulation space is separated into a region on the conductor plate side and a region on the temperature control unit side. Air can be circulated between the areas separated on the front and back sides, air heated and cooled by the temperature control unit can be efficiently blown onto the conductor plate, and the conductor plate is uniformly heated and cooled while improving thermal efficiency. be able to.

  In the above invention, the temperature control unit may facilitate temperature control while reducing power consumption by using, for example, a thermoelectric conversion device in which an electronic thermoelectric element such as a Peltier element is provided on a flat plate. it can.

  In the above invention, the temperature control unit is disposed so as to separate the inside and outside of the thermal circulation space part in the communication part communicating with the inside and outside of the thermal circulation space part, and outward of the thermal circulation space part of the temperature control part. An external heat exchange member having an external heat dissipating fin is thermally coupled to the directed surface, and external air blowing means for blowing air to the external heat exchange member is provided outside the thermal circulation space. It is preferable.

  In this case, the cool air or hot air generated for heating / cooling in the heat circulation space is discharged outside the heat circulation space, and the heat is removed by the external air blowing means, so that the heat in the heat circulation space is removed. Can be prevented, and the thermal efficiency can be further increased.

  As described above, according to the present invention, in a temperature test apparatus that performs an operation test of an electronic component such as a semiconductor element under a predetermined temperature environment, heat generated by a temperature control unit such as a Peltier element is transmitted by a blowing unit. Since it is circulated by convection with air in the thermal circulation space, it is possible to avoid uneven temperature distribution on the surface of the conductor plate, uniform temperature distribution throughout the test equipment, and ensure test accuracy can do.

It is a perspective view which shows the external appearance of the temperature test apparatus which concerns on embodiment. It is a top view which shows the place which removed the conductor board of the temperature test apparatus upper surface which concerns on embodiment. It is sectional drawing which shows the temperature test apparatus which concerns on embodiment from a side surface, and shows the AA cross section of FIG. It is a block diagram which shows the module of the control system of the temperature test apparatus which concerns on embodiment. It is sectional drawing which shows operation | movement of the temperature test apparatus which concerns on embodiment from a side surface.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, a case where the temperature controller of the present invention is applied to a temperature test apparatus that performs an operation test of an electronic component under a predetermined temperature environment will be described as an example. FIG. 1 is a perspective view showing an appearance of a temperature test apparatus 1 according to the present embodiment, FIG. 2 is a top view showing a state where a cooling / heating plate portion 2 on the upper surface of the temperature test apparatus 1 is removed, and FIG. 1 is a cross-sectional view showing a temperature test apparatus 1 from the side.

(Device configuration)
As shown in FIG. 1, a temperature test apparatus 1 is a temperature test apparatus that performs an operation test of an electronic component such as a semiconductor element in a predetermined temperature environment, and places the electronic component on the cooling plate portion 2 on the upper surface. By heating or cooling the surface of the cold plate portion 2, the quality characteristic item is measured while operating the electronic component in a temperature environment higher or lower than normal temperature. In the present embodiment, heating or cooling is performed using the Peltier effect of the electronic thermoelectric element, and the temperature of the surface of the cold plate 2 is increased or decreased through the release or absorption of heat to the cold plate 2 by the Peltier element. The target electronic component is set to a predetermined temperature environment.

  Specifically, as shown in FIG. 1, the temperature test apparatus 1 includes a box-shaped main body 10, a cooling / heating plate portion 2 provided on the upper surface of the main body 10 on which electronic components are placed, and a display unit that displays the state of the temperature test apparatus 1. 10a and an operation unit 10b for operating the present apparatus. Further, an exhaust port 10 c for releasing internal heat is provided on the side surface of the main body 10.

  As shown in FIG. 3, the temperature test apparatus 1 is a box having a hollow inside, and the partition plate 62 defines two spaces, a thermal circulation space 6 and a waste heat space 7. ing. The thermal circulation space portion 6 is formed on the upper side of the main body 10 and has a container shape with an open top surface, and the cooling plate portion 2 is fitted into the top surface opening so that the top surface opening is closed and sealed. It has become. The waste heat space 7 is formed on the lower side of the main body 10 and communicates with the outside air through the exhaust port 10c.

  The cooling / heating plate portion 2 is a flat conductor plate in which an electronic component to be subjected to a temperature test is installed on the upper surface, and the electronic component is in contact with this surface, and the thermal circulation space portion 6 is the cooling / heating plate portion 2. It is defined so as to surround the lower surface side. The cooling / heating plate portion 2 is made of, for example, a metal such as stainless steel, and has the same shape as the opening on the upper surface of the main body 10, and has a square shape in the present embodiment.

  As a means for heating and cooling the cooling plate portion 2 by circulating heat in such a heat circulation space portion 6, the temperature variable portion 3, the internal circulation fan 4, the rectifying plate 5, the external heat dissipation fan 8, And a control unit 9.

  The temperature variable unit 3 is disposed apart from the surface of the thermal circulation space where the conductor plate is formed, and is disposed facing the thermal circulation space to heat or cool the thermal circulation space. Specifically, the temperature variable unit 3 is a thermoelectric conversion device in which an electronic thermoelectric element such as a Peltier element is provided on a flat plate. In addition, an internal heat sink portion 31 including internal heat radiation fins 31a is thermally coupled to a surface (upper surface) of the temperature variable portion 3 directed inward in the thermal circulation space portion 6.

  The temperature variable portion 3 is arranged so as to separate the inside and outside of the heat circulating space portion 6 in the communicating portion 62a that communicates with the inside and outside of the heat circulating space portion 6, and toward the outside of the heat circulating space portion 6 of the temperature variable portion 3. An external heat sink portion 32 having external heat radiation fins 32a is thermally coupled to the formed surface.

  The internal circulation fan 4 is a blowing means that is provided in the middle of the circulation path formed by the current plate 5 and circulates air along the circulation path. The internal circulation fan 4 is disposed adjacent to the internal heat radiation fin 31a.

  The rectifying plate 5 is a plate-like circulation path forming member that forms an air circulation path in the thermal circulation space portion 6. In this embodiment, the current plate 5 is a square shape that is slightly smaller than the bottom area of the thermal circulation space portion 6. The plate member is installed on a plane parallel to the cooling / heating plate portion 2. In this embodiment, the current plate 5 is formed of a heat insulating material such as polystyrene foam, and a communication hole 5a communicating with the front and back is formed at the center. By assembling the internal circulation fan 4 in the communication hole 5a, the rectifying plate 5 is arranged around the internal circulation fan 4. The rectifying plate 5 causes the internal circulation fan 4 to flow forward and backward in the blowing direction. And are separated.

  The external heat radiating fan 8 is an external heat radiating fan 8 for sending air to the external heat sink portion 32 outside the thermal circulation space portion 6, and cools and hot air generated for heating and cooling in the thermal circulation space portion is heated. The heat is discharged out of the circulation space 6, and the heat is exhausted from the exhaust port 10 c to the outside of the apparatus by the external heat radiating fan 8.

  The control unit 9 is a control device including a CPU, an electronic circuit, and a storage device such as a memory for performing various arithmetic processes necessary for controlling each unit such as the internal circulation fan 4, the external heat dissipation fan 8, and the temperature variable unit 3. It is. The control unit 9 is connected to the temperature sensor 91 of the cooling / heating plate unit 2 and other sensors. In addition to the operation unit 10b to which an operation signal is input by the user, setting information and a measurement result by the temperature sensor 91 are displayed. A display unit 10a such as a display for display is connected.

  Specifically, as shown in FIG. 4, the control unit 9 includes a setting management unit 9a, a drive control unit 9b, and a measurement unit 9c as functional modules for drive control. The “module” refers to a functional unit that is configured by hardware such as an apparatus or a device, software or firmware having the function, or a combination thereof, and achieves a predetermined operation.

  The setting management unit 9a is a module that stores and manages various setting data. The setting management unit 9a stores each setting data in a storage device such as a memory, and reads or updates the setting data in response to a user operation or a request from another module. To do. The measuring unit 9c is a module that inputs a detection result by the temperature sensor 91 and a time measurement result by a built-in clock function to the drive control unit.

  The drive control unit 9b drives each unit such as the internal circulation fan 4, the external heat dissipation fan 8, and the temperature variable unit 3 according to various conditions based on the setting data in the setting management unit 9a and the measurement result by the measurement unit 9c. This is a module for transmitting the control signal. For example, when the setting data in the setting management unit 9a includes time information / timer information related to the driving time, the driving control unit 9b measures the time information measured by the measuring unit 9c according to the time setting. Based on the above, the operation of each part is controlled.

(Operation and effects of the device)
The temperature test apparatus 1 according to the present embodiment having the above configuration operates as follows. FIG. 5 is a cross-sectional view showing the operation of the temperature test apparatus according to the embodiment.

  First, an electronic component to be subjected to a temperature test is placed on the cooling / heating plate unit 2, a target temperature is set by the operation unit 10b and the display unit 10a, and cooling / heating is started. Thereby, the drive control unit 9b applies a necessary voltage to the Peltier element of the temperature variable unit 3, and the internal circulation fan 4 and the external heat dissipation fan 8 are rotationally driven.

  The upper surface of the temperature variable portion 3 is heated and cooled to raise and lower the temperature of the conductor plate, and the heat is dissipated from the internal heat radiation fins 31a. The air is sucked and blown out to the lower lower region 6 c through the internal circulation fan 4. Due to the flow of air to the lower region 6c, hot air or cold air from the internal heat radiation fin 31a is sent to the upper region 6b at the upper portion from the gap 6a formed at the peripheral portion of the thermal circulation space 6 through the lower region 6c. It is. The cold plate portion 2 is uniformly heated and cooled by the hot air or cold air sent to the upper region 6b. In addition to this, in the present embodiment, outside the heat circulation space portion 6, cold air or hot air generated in the heat circulation space portion 6 by the external heat radiation fan 8 is transferred to the outside of the heat circulation space portion 6 through the external heat radiation fins 32 a. And the heat is removed through the exhaust port 10c by the external heat radiating fan 8, so that the heat in the thermal circulation space 6 is prevented from being accumulated.

  According to the present embodiment, the cold plate unit 2 on which the electronic components to be subjected to the temperature test are placed and the temperature variable unit 3 to be heated or cooled are installed separately, and the two are not in direct contact with each other. In addition, since the air in the thermal circulation space 6 is circulated by the internal circulation fan 4, it is possible to avoid occurrence of uneven temperature distribution on the surface of the cooling / heating plate portion 2. In particular, in this embodiment, since the thermoelectric conversion device in which an electronic thermoelectric element such as a Peltier element is provided on a flat plate is used as the temperature variable unit 3, temperature control is facilitated while reducing power consumption. be able to.

  Further, in the present embodiment, the rectifying plate 5 is disposed around the internal heat radiation fin 31a, and the heat circulation space 6 is divided into an upper region 6b on the cold plate portion 2 side and a lower region 6c on the temperature variable portion 3 side. The air can be circulated between the areas separated on the front and back of the current plate 5 by the internal circulation fan 4, and the air heated and cooled by the temperature variable portion 3 is efficiently blown onto the cold plate portion 2. It is possible to heat and cool the cold plate portion 2 evenly while increasing the thermal efficiency.

  Further, in the present embodiment, an external heat radiating fan 8 for blowing air to the external heat sink portion 32 is provided outside the thermal circulation space portion 6, so that heating and cooling are performed in the thermal circulation space portion 6. The generated cold air or hot air is discharged out of the heat circulation space 6, and the heat is removed by the external heat radiating fan 8, so that the heat in the heat circulation space 6 is prevented from being stored and the heat efficiency is further improved. Can be increased.

  As described above, according to the embodiment, in the temperature test apparatus that performs an operation test of an electronic component such as a semiconductor element under a predetermined temperature environment, the heat generated by the temperature control unit such as a Peltier element Therefore, it is possible to avoid uneven temperature distribution on the surface of the conductor plate, to make the temperature distribution uniform throughout the test equipment, and to improve test accuracy. Can be secured.

(Example of change)
The above description of the embodiment is an example of the present invention. For this reason, the present invention is not limited to the above-described embodiment, and various modifications can be made according to the design and the like as long as they do not depart from the technical idea of the present invention. For example, in the embodiment described above, the circulation path is circulated from the lower region 6c to the upper region 6b via the gap 6a formed at the periphery of the rectifying plate 5, but the heat of the temperature variable unit 3 is cooled. Various forms can be adopted as long as the path can be transmitted uniformly to the plate portion 2.

  In the above-described embodiment, a method of heating and cooling the heat circulation space 6 and the waste heat space 7 by circulating air is employed. However, for example, a water-cooling method of circulating a fluid such as water may be used.

DESCRIPTION OF SYMBOLS 1 ... Temperature test apparatus 2 ... Cooling plate part 3 ... Temperature variable part 4 ... Internal circulation fan 5 ... Rectification plate 5a ... Communication hole 6 ... Thermal circulation space part 6a ... Gap 6b ... Upper area | region 6c ... Lower area | region 7 ... Waste heat space Unit 8 ... External heat dissipation fan 9 ... Control unit 9a ... Setting management unit 9b ... Driving control unit 9c ... Measurement unit 10 ... Main body 10a ... Display unit 10b ... Operation unit 10c ... Exhaust port 31 ... Internal heat sink 31a ... Internal heat dissipation fin 32 ... External heat sink part 32a ... External heat radiation fin 62 ... Partition plate 62a ... Communication part 91 ... Temperature sensor

Claims (5)

A flat conductor plate whose one surface is in contact with an electronic component to be subjected to a temperature test;
A thermal circulation space defined to surround the other surface of the conductor plate;
A temperature variable unit that is disposed away from the surface on which the conductive plate of the thermal circulation space is formed, and is arranged facing the thermal circulation space to heat or cool the thermal circulation space,
A path forming member for forming an air circulation path in the thermal circulation space,
A temperature controller comprising a blowing means provided in the middle of the circulation path for circulating air along the circulation path. An internal heat exchange member provided with an internal heat radiation fin is thermally coupled to the surface of the temperature variable portion directed toward the inside of the thermal circulation space,
The air blowing means is disposed adjacent to the internal radiation fin,
The path forming member is disposed around the internal heat radiating fins, and is disposed on a plane parallel to the conductor plate so as to separate the air blowing direction front and the air blowing direction rear of the internal heat radiating fins. The temperature controller according to claim 1.   The temperature controller according to claim 1, wherein the temperature variable unit includes a thermoelectric conversion device in which an electronic thermoelectric element is provided in a flat plate shape. The temperature variable part is arranged so as to separate the inside and outside of the thermal circulation space part in a communication part that communicates with the inside and outside of the thermal circulation space part,
An external heat exchange member provided with external heat radiation fins is thermally coupled to the surface of the temperature variable portion directed outward from the thermal circulation space,
The temperature controller according to any one of claims 1 to 3, wherein an external blower for blowing air to the external heat exchange member is provided outside the thermal circulation space.   A temperature test apparatus comprising the temperature controller according to claim 1 and having a function of performing an operation test of an electronic component under a predetermined temperature environment.