JP2001024240A - Temperature regulating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a thermal resistance between a thermoelectric module and a heat exchanger extremely small and to enhance the performance of the thermoelectric module by installing the heat exchanger at least on a thermoelectric plate, on one side, in the thermoelectric module in such a way that the thermoelectric plate comes directly into contact with a fluid housed at the inside of the heat exchanger. SOLUTION: A temperature regulating apparatus 10 comprises a mounting plate 10, a water-cooled plate 20 and many thermoelectric modules 30 which are interposed and mounted between them. When the respective thermoelectric modules 30 are electrified, a substrate W which is placed on the mounting plate 10s is heated/cooled, the distribution of the temperature of the mounting plate 10 composed of a platelike heat pipe becomes uniform, and the substrate W is heated/cooled by keeping the uniform distribution of the temperature. At this time, a thermoelectric plate 33 on the upper side of the thermoelectric modules 30 come directly into contact with a working medium 10L housed at the inside of the mounting plate 10, and a thermal resistance between the thermoelectric modules 30 and the mounting plate 10 can be made extremely small.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature controller comprising a thermoelectric module and a heat exchanger for exchanging heat with a fluid contained therein.

[0002]

2. Description of the Related Art Semiconductor wafer manufacturing processes include a baking process for heating a substrate (semiconductor wafer) and a cooling process for cooling a heated substrate to a room temperature level. Is a temperature adjusting plate (temperature adjusting device) as shown in FIG.
A.

The temperature adjustment plate A has thermoelectric modules M, M... Installed between a mounting plate B composed of a plate-like heat pipe and a water cooling plate C as a heat exchanger. By energizing M, the substrate W mounted on the mounting plate B is heated / cooled.

[0004] Here, the plate-shaped heat pipe constituting the mounting plate B contains a working medium B1 such as chlorofluorocarbon or the like as is well known.
Extremely efficient heat transfer is made possible by condensation.

[0005] The water-cooled plate C allows efficient heat radiation by flowing a cooling medium Cl such as water therein.

According to the temperature adjusting plate A having the above-described structure, when power is supplied to each of the thermoelectric modules M, the temperature distribution of the mounting plate B composed of plate-shaped heat pipes becomes uniform, so that the substrate W has a uniform temperature distribution. It will be heated / cooled while maintaining.

[0007]

By the way, each thermoelectric module M in the conventional temperature adjusting plate A described above.
Is interposed between the mounting plate B and the water cooling plate C, and the thermoelectric module M is in contact with the casing of the mounting plate B and the casing of the water cooling plate C.

For this reason, when the thermoelectric module M is energized, the contact thermal resistance between the thermoelectric module M and the mounting plate B and the water-cooled plate C becomes large, so that the thermoelectric module cannot exhibit its performance sufficiently. There has been an inconvenience that the performance as a temperature adjustment plate is lowered.

The present invention has been made in view of the above circumstances, and has as its object to provide a temperature control device capable of achieving improved performance.

[0010]

The temperature control apparatus according to the present invention is a temperature control apparatus comprising a thermoelectric module and a heat exchanger for exchanging heat with a fluid contained therein. Wherein the heat exchanger is provided on at least one of the heat transfer plates of the thermoelectric module in such a manner that the heat transfer plate is in direct contact with the fluid contained in the heat exchanger. And According to the above configuration, the heat transfer plate in the thermoelectric module comes into direct contact with the fluid contained in the heat exchanger, so that the thermal resistance between the thermoelectric module and the heat exchanger becomes extremely small. It is possible to obtain a temperature control device with improved performance.

[0011] The temperature control device according to the invention of claim 2 is:
In the temperature control device of the first aspect, the heat exchanger is a heat pipe containing a working medium of a fluid therein. According to the above configuration, the heat transfer plate in the thermoelectric module is in direct contact with the working medium of the fluid housed inside the heat pipe, so that the thermal resistance between the thermoelectric module and the heat pipe becomes extremely small, As a result, it is possible to obtain a temperature adjustment device with improved performance.

[0012] The temperature control device according to the invention of claim 3 is:
The temperature control device according to claim 1, wherein the heat exchanger is a water-cooled plate containing a cooling medium for fluid therein. According to the above configuration, the heat transfer plate in the thermoelectric module is in direct contact with the cooling medium of the fluid housed inside the water cooling plate, so that the thermal resistance between the thermoelectric module and the water cooling plate is extremely small, As a result, it is possible to obtain a temperature adjustment device with improved performance.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings showing embodiments. As shown in FIGS. 1 and 2, a temperature adjusting plate (temperature adjusting device) 1 according to the present invention.
Comprises a mounting plate 10 on which a substrate (semiconductor wafer) W is mounted, and a water-cooling plate 20 as a heat exchanger.
0 thermoelectric modules 30, 3
0 ... are provided.

The mounting plate 10 and the water-cooled plate 20 are connected to each other via a large number of bolts 40, 40,.
0 and the water cooling plate 20 between the thermoelectric modules 30 and 3
0... Are integrally formed.

Each of the thermoelectric modules 30, 30,...
In order to cool the mounting plate 10 uniformly, the mounting plate 10 is arranged in a scattered manner over the entire area of the mounting plate 10. Also,
The bolts 40 are also arranged in such a manner as to connect the mounting plate 10 and the water-cooled plate 20 with each other.

The mounting plate 10 is constituted by a plate-shaped heat pipe as a heat exchanger, and the mounting plate 10 has a hollow disk-shaped housing 1.
It is configured such that a working medium 10L of a fluid such as liquid Freon is housed inside 0h.

Openings 10o, 10o,... Are formed in the housing 10h of the mounting plate 10 at positions corresponding to the individual thermoelectric modules 30, 30,.

The plate-shaped heat pipe constituting the mounting plate 10 has a wick for distributing the working medium 10L throughout the inside thereof,
Various plate-shaped heat pipes, such as those having a chiller for reinforcement, can be employed.

On the other hand, a water-cooled plate 20 as a heat exchanger
Has a hollow housing 20h having a disk shape corresponding to the mounting plate 10, and inside the housing 20h, a flow path 20a through which a cooling medium 20L such as water flows.
And hubs 20b, 20b,. In FIG. 2, reference numeral 20i denotes a cooling medium inlet, and reference numeral 20o denotes a cooling medium outlet.

As shown in FIG. 3, the thermoelectric module 30 has p-type thermoelectric elements 31p and n-type thermoelectric elements 31n alternately arranged, and the adjacent p-type thermoelectric elements 31p and n-type thermoelectric elements 31n are connected to each other. One end and the other end are connected by one terminal 32u and the other terminal 32l, respectively. The one terminal 32u, 32u... And the other terminal 32l, 32l. The heat transfer plate 33 and the lower heat transfer plate 34 are attached via an insulating polyimide adhesive G, respectively.

As the thermoelectric module 30, the heat transfer plates 33 and 34 made of an aluminum material whose surface is subjected to an insulation coating treatment, or the heat transfer plates 33 and 34 made of a ceramic material such as alumina having an insulating property are used. It is possible.

The upper heat transfer plate 33 of the thermoelectric module 30 faces the opening 10o formed in the housing 10h of the mounting plate 10, and is placed on the upper side via a sealing material 50 installed around the opening 10o. Writing plate 1
0 housing 10h.

With this configuration, the working medium 10L accommodated in the mounting plate 10 does not leak from the housing 10h due to the action of the sealing member 50, and the upper side of the thermoelectric module 30 through the opening 10o of the housing 10h. Is in direct contact with the heat transfer plate 33.

On the other hand, the lower heat transfer plate 34 in the thermoelectric module 30 is in pressure contact with the housing 20h of the water-cooled plate 20 fastened to the mounting plate 10 by bolts 40, 40.

According to the temperature adjustment plate 1 having the above-described configuration, by supplying electricity to each of the thermoelectric modules 30, 30,.
The substrate W mounted on the mounting plate 10 is heated / cooled, and at this time, the temperature distribution of the mounting plate 10 including the plate-shaped heat pipe becomes uniform, so that the substrate W is heated while maintaining a uniform temperature distribution. / Cooling.

Here, in the temperature control plate 1 having the above-described configuration, the upper heat transfer plate 3 in the thermoelectric module 30 is used.
3 is a working medium 10 housed inside the mounting plate 10
By making direct contact with L, the thermal resistance between the thermoelectric module 30 and the mounting plate 10 becomes extremely small, so that it is possible to obtain the temperature adjustment plate 1 with improved performance.

In consideration of the reduction in thermal resistance between the mounting plate 10 and the thermoelectric module 30, for example, a so-called skeleton type thermoelectric module in which the heat transfer plates 33 and 34 are removed from the thermoelectric module 30 is employed. It is also conceivable that the terminals of the thermoelectric module are configured to be brought into direct contact with the working medium via openings formed in the mounting plate.

However, the skeleton type thermoelectric module is not only extremely difficult to handle, but also because a single thermoelectric module has a large number of terminals, the number of terminals is limited in the mounting position of the thermoelectric module on the mounting plate. A large number of corresponding small openings must be formed, and the mounting plate as a whole requires, for example, hundreds of openings.

For this reason, not only is the production of the mounting plate extremely complicated, but also a large number of seal portions between the mounting plate and the thermoelectric module must be provided, and the operation from the inside of the mounting plate must be performed. The medium is likely to leak.

Further, in the above-described configuration, since the terminals of the thermoelectric module come into direct contact with the working medium in the mounting plate, only a working medium having an insulating property can be used. Will have a narrow selection range.

On the other hand, the temperature adjustment plate 1 according to the present invention uses a thermoelectric module in which a large number of thermoelectric elements and terminals are sandwiched by heat transfer plates as described above, and the mounting plate is provided with each thermoelectric module. Since the opening facing the heat transfer plate is formed, the number of openings formed in the mounting plate is sufficient for the number of thermoelectric modules to be installed, thereby facilitating the manufacturing of the mounting plate.

Further, since the number of seal portions between the mounting plate and the thermoelectric module is small, it is possible to prevent the working medium from leaking from the inside of the mounting plate as much as possible. Since the terminals do not directly contact the working medium in the mounting plate, the selection range of the working medium to be used is very wide.

A temperature adjusting plate (temperature adjusting device) 1 'shown in FIG.
0h 'have openings 20c', 20c '...
Lower heat transfer plate 34 'in thermoelectric module 30'
Is pressed against the housing 20h 'of the water-cooled plate 20' via a sealing member 50 'provided facing the opening 20c' and surrounding the opening 20c '.

With this configuration, the cooling medium 20L 'such as water contained in the water cooling plate 20' does not leak from the housing 20h 'by the function of the sealing member 50', and passes through the opening 20o 'of the housing 20h'. , Is in direct contact with the heat transfer plate 34 'below the thermoelectric module 30'.

The configuration of the temperature adjusting plate 1 'shown in FIG. 4 is that the openings 20c', 20c '... Are formed in the housing 20h' of the water cooling plate 20 ', and the sealing members 50', 50 '. Since there is basically no difference from the temperature adjustment plate 1 described above except for the point that the temperature adjustment plate 1 is mounted, elements having the same functions as the elements of the temperature adjustment plate 1 are denoted by the same reference numerals as those in FIG. A detailed description is omitted by adding a '(dash).

According to the temperature adjusting plate 1 'having the above structure, the heat transfer plate 33' on the upper side of the thermoelectric module 30 'is
Through the opening 10o 'of the mounting plate 10', the working medium 1
0L 'and the thermoelectric module 3
The heat transfer plate 34 'on the lower side of 0' comes into direct contact with the cooling medium 20L 'via the opening 20c' of the water cooling plate 20 '.

Thus, the thermal resistance between the mounting plate 10 'and the thermoelectric module 30' and the thermoelectric module 3 '
The thermal resistance between the 0 'and the water-cooled plate 20' is both extremely small, so that it is possible to obtain the temperature control plate 1 'with improved performance.

The temperature adjusting plate 1 shown in FIGS. 1 to 3 and the temperature adjusting plate 1 'shown in FIG.
Both have a plate-shaped heat pipe as a heat exchanger on one side of the thermoelectric module, and a water-cooled plate also as a heat exchanger on the other side, but a plate-shaped heat pipe on both one side and the other side of the thermoelectric module, or It is also possible to provide a water cooling plate.

The temperature adjusting plate (temperature adjusting device) 100 shown in FIGS. 5 and 6 includes a mounting plate 110 for mounting a substrate (semiconductor wafer) W and a water cooling plate 120 as a heat exchanger. And a plurality of thermoelectric modules 130, 130,... Interposed between the mounting plate 110 and the water cooling plate 120.

Mounting plate 110 and water cooling plate 120
Are connected to each other via a number of bolts 140, 140. The temperature adjustment plate 100 is integrated with the mounting plate 110 and the water cooling plate 120 with the thermoelectric modules 130, 130. Is configured.

Each of the thermoelectric modules 130, 130,...
Are arranged so as to be uniformly distributed over the entire area of the mounting plate 110 in order to cool the mounting plate 110 evenly. Are also arranged in such a manner that the mounting plate 110 and the water cooling plate 120 are connected to each other.

The mounting plate 110 has a disk shape and is made of an aluminum material having good heat conductivity. The mounting plate 110 can be made of a material other than the aluminum material, for example, a metal-ceramic composite material in which ceramic is impregnated with aluminum.

On the other hand, a water-cooled plate 120 as a heat exchanger
Has a hollow housing 120h having a disk shape corresponding to the mounting plate 110.
h, a flow channel 120 a through which a cooling medium 120 L such as water flows, and a hub 120 through which each bolt 140 passes.
b, 120b... are provided.

Further, the individual thermoelectric modules 130, 13 are provided in the housing 120h of the water cooling plate 120.
0, a lower heat transfer plate 134 described later
Openings 120c, 120 into which the projections 134A fit.
are formed through. In FIG. 6, reference numeral 120i denotes a cooling medium inlet, and reference numeral 120o denotes a cooling medium outlet.

As shown in FIG. 7, the thermoelectric module 130 includes a p-type thermoelectric element 131p and an n-type thermoelectric element 131p.
n are alternately arranged, and one end and the other end of the adjacent p-type thermoelectric element 131p and n-type thermoelectric element 131n are
One terminal 132u and the other terminal 132l
And these one-side terminals 132u, 1
32u ... and the other terminals 132l, 132l ...
The upper heat transfer plate 133 and the lower heat transfer plate 134 made of an aluminum material are attached via an insulating polyimide adhesive G, respectively.

The lower heat transfer plate 134 has a convex portion 134A bulging downward at the center thereof.
As shown in FIG. 6, the convex portion 1 on the lower heat transfer plate 134
34A fits into an opening 120c formed in the housing 120h of the water cooling plate 120, and
A top surface 134a is the inner surface 1 of the housing 120h.
20f are formed so as to be flush with each other.

As the thermoelectric module 30, the heat transfer plates 33 and 34 made of an aluminum material whose surface is subjected to insulation coating treatment, or the heat transfer plates 33 and 34 made of a ceramic material such as alumina having an insulating property are used. It is possible.

The upper heat transfer plate 133 of the thermoelectric module 130 is in pressure contact with the mounting plate 110 fastened to the water cooling plate 120 by bolts 140, 140.

On the other hand, the lower heat transfer plate 134 of the thermoelectric module 130 has a projection 134A fitted into the opening 120c of the housing 120h of the water cooling plate 120, and the top surface 134a of the projection 134A is connected to the housing 1h.
The water cooling plate 120 is brought into contact with the housing 120h of the water cooling plate 120 via a sealing member 150 provided so as to surround the opening 120c.

With this configuration, the cooling medium 120L such as water contained in the water cooling plate 120 is
By the action of 0, without leaking from the housing 120h, it is in direct contact with the heat transfer plate 134 below the thermoelectric module 130 through the opening 120c of the housing 120h.

According to the temperature adjusting plate 100 having the above-described configuration, the substrate W mounted on the mounting plate 110 is heated / cooled by energizing the thermoelectric modules 130, 130,.

Here, in the temperature control plate 100 having the above-described configuration, the lower heat transfer plate 134 of the thermoelectric module 130 is brought into direct contact with the cooling medium 120L housed inside the water cooling plate 120, so that the thermoelectric module The thermal resistance between 130 and the water-cooled plate 120 becomes extremely small, so that it is possible to obtain the temperature adjustment plate 100 with improved performance.

Further, the temperature adjusting plate 1 having the above-described structure is used.
00, the top surface 134a of the projection 134A of the heat transfer plate 134 of the thermoelectric module 130 is
Is flush with the inner surface 120f of the housing 120h, so that the cooling medium 120L such as water flows very smoothly inside the housing 120h, thereby improving the cooling efficiency of the water cooling plate 120.

The above-mentioned temperature adjustment plate 100
Is provided with a water cooling plate 120 as a heat exchanger below the thermoelectric module 130.
It is also possible to provide a plate-shaped heat pipe as a heat exchanger instead of 20.

Further, as described above, the structure capable of smoothly flowing the fluid in the housing is effectively applied to the temperature adjusting plate 1 shown in FIGS. 1 to 3 and the temperature adjusting plate 1 'shown in FIG. It goes without saying that it can be adopted.

The temperature adjusting apparatus 200 shown in FIG. 8 is for heating / cooling a substrate in a semiconductor wafer manufacturing process, and includes a block-shaped mounting stage 210 for mounting a substrate (semiconductor wafer) W. ing.

The mounting stage 210 is constituted by a block-shaped heat pipe as a heat exchanger, and a working medium (not shown) of a fluid such as liquid Freon is provided inside a hollow rectangular parallelepiped housing 210h. Is housed.

The housing 210h of the mounting stage 210
Include side plates 210s, 210s... And a low plate 210b.
The water cooling plate 220 and the thermoelectric module 23
0 is attached.

Here, the configurations of the water cooling plate 220 and the thermoelectric module 230 are basically the same as the water cooling plate 20 and the thermoelectric module 30 of the temperature adjusting plate (temperature adjusting device) 1 shown in FIGS. Description is omitted.

Each water cooling plate 220 has a plurality of bolts 2
The thermoelectric modules 230 are mounted on the mounting stage 210 by the reference numeral 40. The thermoelectric modules 230 are mounted between the mounting stage 210 and the water-cooled plate 220.

On the other hand, the housing 2 of the mounting stage 210
In 10h, openings 210o, 210o,... Are formed at positions corresponding to the thermoelectric modules 230, 230,.

Each of the thermoelectric modules 230, 230...
The housing 21 of the mounting stage 210 is provided with a heat transfer plate (not shown) facing the opening 210o and a sealing material 250 provided so as to surround the opening 210o.
0h.

According to temperature control device 200 having the above-described configuration, one heat transfer plate (not shown) in each thermoelectric module 230 is directly connected to the working medium (not shown) housed inside mounting stage 210. , The thermal resistance between the thermoelectric module 230 and the mounting stage 210 becomes extremely small, so that it is possible to obtain the temperature adjustment device 200 with improved performance.

A temperature adjusting device 200 'shown in FIG. 9 is intended to prevent thermal deformation of optical components in various optical devices, and is a block-shaped support stage for supporting a mirror (optical component). 210 '.

The support stage 210 'is constituted by a block-shaped heat pipe as a heat exchanger.
A working medium (not shown) of a fluid such as liquid Freon is housed inside a housing 210h 'having a hollow rectangular parallelepiped shape.

An opening 210o 'is formed in the upper plate 210t' of the housing 210h '.
On the upper surface of the mirror 26, a mirror 26 is provided so as to cover the opening 210o '.
0 'is fixedly installed.

The mirror 260 'is connected to the clamper 27.
It is fixed to the upper plate 210t 'by 0' and 270 ', and is pressed against the housing 210h' of the support stage 210 'via a seal member 250' provided around the opening 210o '.

The temperature control device 200 'is basically the same as the temperature control device 200 described above except for the configuration of the mirror 260'. The detailed description of the constituent elements will be omitted by adding '(dash) to the same reference numerals as those in FIG.

According to the temperature control device 200 'having the above-described configuration, one of the heat transfer plates (not shown) in each thermoelectric module 230' is connected to the working medium (not shown) housed inside the support stage 210 '. ), The thermal resistance between the thermoelectric module 230 ′ and the support stage 210 ′ becomes extremely small, so that an improvement in performance can be achieved, and the mirror 260 ′ is connected to the support stage 210 ′. The direct contact with the working medium (not shown) accommodated therein enables efficient temperature control of the mirror 260 ′.

The above-mentioned temperature control device 200 '
It goes without saying that the present invention can be effectively applied to prevent thermal deformation of not only the mirror 260 'shown in the embodiment but also various optical components.

A temperature adjusting device 300 shown in FIG. 10 is a constant temperature device for holding a controlled object such as a non-linear crystal in a constant temperature state, and is a block-shaped casing for accommodating an optical fiber (controlled object) H. 310 is provided.

The casing 310 is constituted by a block-shaped heat pipe as a heat exchanger, and a working medium (not shown) of a fluid such as liquid Freon is accommodated in a housing 310h having a hollow rectangular parallelepiped shape. ing.

A plurality of water cooling plates 320 and a plurality of thermoelectric modules 330 are attached to the peripheral plates 310 s, 310 s... On the housing 310 h of the casing 310.

Here, the configurations of the water cooling plate 320 and the thermoelectric module 330 are basically the same as the water cooling plate 20 and the thermoelectric module 30 of the temperature adjusting plate (temperature adjusting device) 1 shown in FIGS. Description is omitted.

Each water cooling plate 320 has a plurality of bolts 3
40 attached to the casing 310,
Each thermoelectric module 330 is assembled so as to be sandwiched between the casing 310 and the water cooling plate 320.

On the other hand, the housing 31 of the casing 310
At 0h, openings 310o, 310o,... Are formed at positions corresponding to the respective thermoelectric modules 330, 330,.

Each of the thermoelectric modules 330, 330...
The housing 310 of the casing 310 has one heat transfer plate (not shown) facing the opening 310o and a sealing material 350 provided so as to surround the opening 310o.
h.

The casing 310 has an optical fiber H to be controlled, and an end plate 3 of the housing 310h.
10e, 310e, and is housed.
The gap between the optical fiber 0e and the optical fiber H is sealed by a sealing material 370 fixed to the end plate 310e by a clamper 360.

According to the temperature control device 300 having the above-described configuration, one of the heat transfer plates (not shown) in each thermoelectric module 330 is directly connected to the working medium (not shown) housed inside the casing 310. Due to the contact, the thermal resistance between the thermoelectric module 330 and the casing 310 becomes extremely small, so that the performance can be improved, and the optical fiber H to be controlled is housed inside the casing 310. Working medium (not shown)
By making direct contact with the optical fiber H, efficient temperature control of the optical fiber H can be performed.

It is needless to say that the above-mentioned temperature adjusting device 300 can be effectively applied to hold not only the optical fiber H shown in the embodiment but also various controlled objects in a constant temperature state.

A temperature adjusting device 400 shown in FIG. 11 is intended for cooling electronic components in various electronic devices, and includes a block-shaped mounting body 410 on which a power transistor (electronic component) is mounted. .

The mounting body 410 is constituted by a block-shaped heat pipe as a heat exchanger, and a working medium (not shown) of a fluid such as liquid Freon is housed in a housing 410h having a hollow rectangular parallelepiped shape. Have been.

A water cooling plate 420 and a thermoelectric module 430 are attached to one side plate 410 t of the housing 410 h of the mounting body 410, and the other side plate 41
A power transistor 460 as an electronic component is attached to 0b.

Here, the configurations of the water cooling plate 420 and the thermoelectric module 430 are basically the same as the water cooling plate 20 and the thermoelectric module 30 of the temperature adjusting plate (temperature adjusting device) 1 shown in FIGS. Description is omitted.

The water cooling plate 420 has a plurality of bolts 44
The thermoelectric module 430 is assembled so as to be sandwiched between the mounting body 410 and the water cooling plate 420.

The housing 410h of the mounting body 410
Has openings 41 at positions corresponding to thermoelectric modules 430.
0o is formed, and the thermoelectric module 430 causes one of the heat transfer plates (not shown) to face the opening 410o, and
It is pressed into contact with the housing 410h of the mounting body 410 via a sealing material 450 provided around o.

On the other hand, the power transistor 460 is assembled to the mounting body 410 by a plurality of bolts 470, and a part of the opening 41 is formed in the housing 410h.
0o and a housing 41 of the mounting body 410 via a sealing material 450 installed around the opening 410o.
0h.

According to temperature control device 400 having the above-described configuration, one of the heat transfer plates (not shown) of thermoelectric module 430 is directly connected to the working medium (not shown) housed in mounting body 410. By the contact, the thermal resistance between the thermoelectric module 430 and the mounting body 410 becomes extremely small, so that the performance can be improved, and the working medium (the power transistor 460 accommodated inside the mounting body 410) (Not shown), efficient cooling of the power transistor 460 can be performed.

It goes without saying that the above-described temperature adjusting device 400 can be effectively applied not only to the power transistor 460 shown in the embodiment but also to cooling various electronic components.

The temperature control device 500 shown in FIG. 12 is for cooling the inside of the refrigerator, and the cabinet G of the refrigerator F includes a storage Ga and a cooling jacket 5.
10 is provided.

The cooling jacket 510 is constituted by a block-shaped heat pipe as a heat exchanger.
A fluid working medium (not shown) such as liquid Freon is housed inside.

A cooling fin 520 and a thermoelectric module 530 are attached to one side plate 510t (partition wall with the storage case Ga) of the cooling jacket 510 so as to face the inside of the storage case Ga. A large cooling fin 560 exposed to the outside is attached by a plurality of bolts 570, 570.

Here, the configuration of the thermoelectric module 530 is as follows.
Temperature adjustment plate (temperature adjustment device) 1 shown in FIGS.
Since it is basically the same as the thermoelectric module 30 described above, detailed description is omitted.

The cooling fins 520 include a plurality of bolts 540
By the cooling jacket 510,
The thermoelectric module 530 is assembled so as to be sandwiched between the cooling jacket 510 and the cooling fins 520.

An opening 510o is formed in one side plate 510t of the cooling jacket 510 at a position corresponding to the thermoelectric module 530.
Has one heat transfer plate (not shown) facing the opening 510o,
Further, it is pressed against the side plate 510t of the cooling jacket 510 via a sealing material 550 provided so as to surround the opening 510o.

In the refrigerator F having the above-described structure, the temperature of the cooling fins 520 is lowered by energizing the thermoelectric module 530, and the air in the storage Ga is applied to the cooling fins 520 by the fan f to lower the temperature in the refrigerator. Let me.

On the other hand, heat released from thermoelectric module 530 to cooling jacket 510 is
The cooling jacket 510 is transported while diffusing inside the
Is efficiently discharged from the large-sized cooling fins 560 provided at the bottom.

Here, the temperature control device 50 having the above-described configuration is used.
According to FIG. 0, one of the heat transfer plates (not shown) in the thermoelectric module 530 comes into direct contact with the working medium (not shown) accommodated inside the cooling jacket 510, and thus the thermoelectric module 530 and the cooling medium are cooled. The thermal resistance between the jacket 510 and the jacket 510 becomes extremely small, and an improvement in performance can be achieved.

[Brief description of the drawings]

FIG. 1 is an overall plan view showing a temperature adjusting device according to the present invention.

FIG. 2 shows a temperature control device according to the present invention.
I-II line sectional view.

FIGS. 3A and 3B are conceptual diagrams showing a thermoelectric module of a temperature control device according to the present invention.

FIG. 4 is a sectional side view showing a temperature adjusting device according to the present invention.

FIG. 5 is an overall plan view showing a temperature adjusting device according to the present invention.

FIG. 6 is a diagram illustrating a temperature control device according to the present invention;
I-VI sectional view.

7 (a) and (b) are a side view and a bottom view showing a thermoelectric module in the temperature adjusting device shown in FIG.

FIG. 8 is a sectional view showing a temperature adjusting device according to the present invention.

FIG. 9 is a sectional view showing a temperature adjusting device according to the present invention.

FIG. 10 is a sectional view showing a temperature adjusting device according to the present invention.

FIG. 11 is a sectional view showing a temperature adjusting device according to the present invention.

FIG. 12 is a sectional view showing a temperature adjusting device according to the present invention.

13A and 13B are a conceptual overall plan view and a side sectional view showing a conventional temperature control device.

[Explanation of symbols]

 1, 1 ': temperature adjusting plate (temperature adjusting device) 10, 10': mounting plate (heat exchanger) 20, 20 ': water cooling plate (heat exchanger) 30, 30': thermoelectric module 33, 34, 33 34, heat transfer plate 100 temperature control plate (temperature control device) 110 mounting plate 120 water cooling plate (heat exchanger) 130 thermoelectric module 133, 134 heat transfer plate 200, 200 'temperature control Devices 210, 210 ': Mounting stage (heat exchanger) 220, 220': Water-cooled plate (heat exchanger) 230, 230 ': Thermoelectric module 300: Temperature controller 310: Casing (heat exchanger) 320: Water-cooled plate (Heat exchanger) 330: Thermoelectric module 400: Temperature controller 410: Mounting body (Heat exchanger) 420: Water cooling plate (Heat exchanger) 430: Thermoelectric module 500: Temperature control 510 ... cooling jacket (the heat exchanger) 530 ... thermoelectric module

Claims (3)

[Claims] 1. A temperature control device comprising: a thermoelectric module; and a heat exchanger that performs heat exchange with a fluid contained therein, wherein at least one of the heat transfer plates in the thermoelectric module includes the heat transfer module. A temperature control device comprising the heat exchanger installed such that the plate is in direct contact with a fluid contained in the heat exchanger. 2. The temperature control device according to claim 1, wherein the heat exchanger is a heat pipe containing a fluid working medium therein. 3. The temperature control device according to claim 1, wherein the heat exchanger is a water-cooled plate containing a fluid cooling medium therein.