TW202019569A - 基板處理方法及基板處理裝置 - Google Patents

基板處理方法及基板處理裝置 Download PDF

Info

Publication number
TW202019569A
TW202019569A TW108118197A TW108118197A TW202019569A TW 202019569 A TW202019569 A TW 202019569A TW 108118197 A TW108118197 A TW 108118197A TW 108118197 A TW108118197 A TW 108118197A TW 202019569 A TW202019569 A TW 202019569A
Authority
TW
Taiwan
Prior art keywords
substrate
liquid
processing
component
film
Prior art date
Application number
TW108118197A
Other languages
English (en)
Chinese (zh)
Inventor
吉田幸史
奥谷学
安田周一
金松泰範
上田大
張松
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202019569A publication Critical patent/TW202019569A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW108118197A 2018-05-31 2019-05-27 基板處理方法及基板處理裝置 TW202019569A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-105631 2018-05-31
JP2018105631A JP7144975B2 (ja) 2018-05-31 2018-05-31 基板処理方法および基板処理装置

Publications (1)

Publication Number Publication Date
TW202019569A true TW202019569A (zh) 2020-06-01

Family

ID=68697480

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108118197A TW202019569A (zh) 2018-05-31 2019-05-27 基板處理方法及基板處理裝置

Country Status (3)

Country Link
JP (1) JP7144975B2 (ja)
TW (1) TW202019569A (ja)
WO (1) WO2019230404A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7469073B2 (ja) * 2020-02-28 2024-04-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11101970A (ja) * 1997-09-29 1999-04-13 Advanced Display Inc 基板洗浄方法
JP5977727B2 (ja) * 2013-11-13 2016-08-24 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体
JP6371253B2 (ja) * 2014-07-31 2018-08-08 東京エレクトロン株式会社 基板洗浄システム、基板洗浄方法および記憶媒体

Also Published As

Publication number Publication date
WO2019230404A1 (ja) 2019-12-05
JP7144975B2 (ja) 2022-09-30
JP2019212697A (ja) 2019-12-12

Similar Documents

Publication Publication Date Title
US20220277968A1 (en) Substrate cleaning method, substrate cleaning system, and memory medium
TWI552220B (zh) Substrate cleaning system, substrate cleaning method and memory media
KR101940603B1 (ko) 기판 처리 방법, 기판 처리 장치 및 기억 매체
TWI696218B (zh) 基板處理方法及基板處理裝置
TWI747792B (zh) 基板處理方法及基板處理裝置
TWI700133B (zh) 基板洗淨方法、基板洗淨系統及記憶媒體
TWI760091B (zh) 基板處理方法及基板處理裝置
KR20150055591A (ko) 기판 세정 방법, 기판 세정 시스템 및 기억 매체
TW201913726A (zh) 基板處理方法以及基板處理裝置
TWI744917B (zh) 基板處理方法及基板處理裝置
JP2015062259A (ja) 基板洗浄システム
TW201919783A (zh) 基板處理系統、基板清洗方法及記錄媒體
TWI785316B (zh) 基板處理方法及基板處理裝置
JP2021073739A (ja) 基板洗浄方法
TW202019569A (zh) 基板處理方法及基板處理裝置
TWI631601B (zh) 基板處理方法及基板處理裝置
TW201820406A (zh) 基板處理方法及基板處理裝置
WO2023089939A1 (ja) 基板処理方法