TW202018835A - Semiconductor apparatus and detection method thereof - Google Patents

Abstract

A semiconductor apparatus includes a first automated optical inspection (AOI) system and a second AOI. A first image-capturing module of the first AOI takes an image of an object to be tested to produce a first image information. The first image processing module implements an image processing according to the first image information to produce a first image processing information. The first analyzing module implements an analysis according to the first image processing information to produce a first analysis information. The display module displays an analysis image according to the first analysis information. A second image-capturing module of the second AOI takes an image of the analysis image to produce a second image information. The second image processing module implements an image processing to the second image information.

Description

Semiconductor equipment and its detection method

The invention relates to a semiconductor device and a detection method thereof, in particular to a semiconductor device with an automatic optical detection system and a detection method thereof.

Automated optical inspection (AOI) system is a high-speed, high-precision optical image inspection system that replaces natural light with light-emitting diodes (LEDs), optical lenses, and charge-coupled components device, CCD) instead of the human eye, using optical instruments to obtain the surface state of the finished product, and then using computer image processing technology to detect defects such as foreign objects or component abnormalities, as an improvement to the shortcomings of traditionally using optical instruments for human inspection. Generally speaking, AOI system includes lighting system, imaging system, electromechanical control system and image processing and object classification. Among them, the lighting system is about the choice of light source; the imaging system includes the lens, CCD, image capture card, etc.; the electromechanical control system controls the lighting system, the imaging system, the positioning platform, etc.; the image processing and object classification system performs the image Pre-processing, 3D reconstruction, graphic recognition, defect classification, defect verification.

Through the normal operation of the AOI system described above, the automated inspection can be completed efficiently and quickly. However, the ever-changing science and technology make the size of the object to be measured smaller and smaller, and the structure is more precise. The inspection lens of the old AOI equipment is not capable of the precise work at this stage, which may cause the machine to fail to perform normal inspection and operation. Or it may cause an increase in the error rate during the inspection process, which greatly increases the defect rate of the production line. Therefore, it is necessary to upgrade the hardware equipment to improve the situation encountered at this stage, including the need for higher specifications of the imaging system, and other corresponding hardware equipment, such as replacement of higher resolution optical inspection lens, More precise image capture and replacement of higher specification processors and memory can assist in more accurate classification and judgment. However, the entire set of semiconductor equipment is composed of multiple different modules. AOI is only one of the semiconductor equipment. If it is only because AOI is not capable of image recognition, the entire set of semiconductor equipment must be replaced. It is not economically beneficial; in addition, if you want to replace the AOI module in the entire semiconductor device, you must still consider the coordination of the communication of the entire semiconductor machine, and abrupt replacement of a module still needs one And corresponding to the modification of all the hardware and software in its machine, it can be said that the whole body is moved in one stroke, which undoubtedly caused great trouble.

Therefore, how to provide a semiconductor device that can upgrade the AOI function with an innovative design without significantly changing the original AOI system, thereby improving the detection accuracy and accuracy, and thus improving the use efficiency and competitiveness of the semiconductor device is currently the current One of the important topics.

In view of the above-mentioned problems, one object of the present invention is to provide a semiconductor device that can upgrade the AOI function with an innovative design without significantly changing the original AOI system, thereby improving the detection accuracy and accuracy, thereby enhancing the use of semiconductor devices Efficiency and competitiveness.

To achieve the above object, a semiconductor device of the present invention includes a first automatic optical inspection system and a second automatic optical inspection system. The first automatic optical detection system has a first camera module, a first image processing module, a first analysis module and a display module. The first camera module captures an object to be tested to generate first camera information. The first image processing module performs image processing based on the first camera information to generate first image processing information. The first analysis module The first analysis information is generated based on the first image processing information, and the display module displays an analysis screen based on the first analysis information. The second automatic optical detection system has a second camera module and a second image processing module. The second camera module images the analysis screen to generate second camera information, and the second image processing module performs image processing on the second camera information.

In order to achieve the above object, the present invention provides a detection method for semiconductor equipment, wherein the semiconductor equipment includes a first automatic optical inspection system and a second automatic optical inspection system, and the first automatic optical inspection system has a first camera module , A first image processing module, a first analysis module and a display module. The second automatic optical detection system has a second camera module and a second image processing module. The detection method includes: generating a first camera information by imaging a test object with the first camera module; generating a first image processing information by the first image processing module performing image processing according to the first camera information ; The first analysis module analyzes the first image processing information to generate a first analysis information; The display module displays an analysis screen according to the first analysis information; The second camera module analyzes the analysis screen The camera generates a second camera information; and the second camera module performs image processing on the second camera information.

In one embodiment, the resolution of the first camera module is higher than that of the second camera module.

In one embodiment, the specification of the first image processing module is higher than that of the second image processing module.

In one embodiment, the second automatic optical inspection system further includes a second analysis module. The second image processing module performs image processing on the second camera information to generate second image processing information, and the second analysis module analyzes the second image processing information to generate control information.

In one embodiment, the semiconductor device further includes an actuation system, which performs an action on the object to be measured according to the control information.

In an embodiment, the second automatic optical detection system further includes a second analysis module, and the detection method further includes: performing image processing on the second camera information by the second image processing module to generate a second image processing information ; And the second analysis module analyzes the second image processing information to generate a control information.

In one embodiment, the semiconductor device further includes an actuation system, and the detection method further includes: performing an action on the object to be measured according to the control information by the actuation system.

As described above, according to the semiconductor device and the detection method of the semiconductor device of the present invention, in addition to the original second automatic optical detection system, the semiconductor device is provided with another first automatic optical detection system, which can perform High-standard detection, and the detection result is presented by the analysis screen displayed by one of the display modules, and then the analysis screen is captured by the camera module of the second automatic optical detection system, and by the second The image processing module of the moving optical detection system performs image processing on the acquired camera information. In this way, although the semiconductor device is further provided with the first automatic optical inspection system, this arrangement can be seamlessly connected with the original semiconductor device. Therefore, with the above configuration, the present invention can have the following benefits:

Install a new AOI system on the original semiconductor device to couple with the old AOI module. The new AOI module can include high-resolution cameras and high-standard image processing systems to solve the original low-resolution optical inspection The camera has no way to detect the problem of precision objects.

Without destroying the integrity of the original semiconductor equipment, add a new AOI system to the existing semiconductor equipment to solve the problems encountered by replacing the old AOI system on the semiconductor equipment, including the need to adjust the process settings on the existing semiconductor equipment , Need to replace the machine design and manufacture of the new AOI system, system integration technology, image pre-processing, image post-processing, testing application settings, and need to replace the hardware equipment of the old AOI system on the production line.

To reduce the necessary cost when upgrading the system, the original replacement of the new AOI system requires the removal of the equipment of the old AOI system, and the change of the software system settings on the original semiconductor equipment and other equipment connected to the AOI system.

Therefore, the technology of the present invention is to install a new AOI system on the original semiconductor device. It does not change the setting and arrangement of any hardware or software on the original semiconductor device. It is just a new (higher specification AOI system with the existing Semiconductor devices), compared to the changes required to replace the entire AOI system, it can also reduce the risk of compatibility errors in semiconductor devices after the upgraded system.

The semiconductor device of the present invention has an automatic optical inspection (AOI) system. In one embodiment, the automatic optical inspection system may include four main parts, namely, optical illumination, mechanism and drive, electronic control system, and vision software. Among them, the optical lighting system includes a CCD camera, optical lens group, and light source lighting equipment; the mechanism and drive system include a robot arm, robot interface, and robot drive; and the electronic control system includes a programmable logic controller (PLC) and control Host; visual soft system includes algorithms, communication equipment, image processing software. Through the division and cooperation of the above four parts, the function of automatic optical detection can be completed.

An AOI system according to an embodiment of the present invention uses optical instruments to obtain the surface state of the finished product, and then uses computer image processing technology to detect defects such as foreign objects or abnormal patterns. This is a non-contact inspection, so semi-finished products can be inspected in intermediate projects. It belongs to a high-precision optical image detection system, which includes measurement lens, optical illumination, positioning measurement, electronic circuit test, image processing and automation.

FIG. 1 is a block diagram of a semiconductor device 1 according to an embodiment of the invention. The invention does not limit the application scope of the semiconductor device 1, such as aviation, biomedicine, industrial production quality detection, fingerprint comparison, robot control, multimedia technology; or industrial automated liquid crystal display device (LCD), thin film transistor (TFT) ), optical inspection equipment in the industrial process of the circuit board (PCB), and in the IC and general electronics industry, machine tools/automation machinery, motor/electronic industry, metal and steel industry, food processing/packaging industry, textile and leather industry, automotive industry , Building materials, security/surveillance and other automatic optics combined with image processing system.

As shown in FIG. 1, the semiconductor device 1 of this embodiment includes a first automatic optical inspection system 11 and a second automatic optical inspection system 12. Among them, the first automatic optical inspection system 11 can detect an object O, and has a first camera module 111, a first image processing module 112, a first analysis module 113 and a display module Group 114.

The first camera module 111 captures the object O to generate first camera information I11. In this embodiment, the first camera module 111 may include a charge-coupled device camera, an optical lens group, and a light source lighting group. Among them, the light source lighting group has a light source to provide illumination, the light source can be a light emitting diode element; the optical lens group is used to focus to obtain a clear image picture, and the light provided by the light source lighting group is through the object to be measured and the optical The lens group reaches the charge-coupled element camera to form an image, and generates first camera information I11. The object to be measured O is, for example, a precise circuit board or an electronic component. In this embodiment, the resolution of the first camera module 111 belongs to high specifications, for example, thousands * thousands of pixels.

The first image processing module 112 performs image processing according to the first camera information I11 to generate a first image processing information I12. The first image processing module 112 can be formed by software, hardware, firmware, or a combination thereof. The first image processing module 112 includes, for example, algorithms or image processing software. The first image processing module 112 performs image processing on the first camera information I11 to generate the first image processing information I12, and the resolution of the first image processing module 112 belongs to high resolution, and the so-called resolution refers to The smallest size that can distinguish the details of objects in image processing. The higher the resolution, the better the image quality. The optical image can be converted into an electronic signal through a charge-coupled device, and then image processing technology is used to separate the object O from the background, and unnecessary noise is filtered out, for example, the surface of the object O is detected by edge detection technology Features are measured.

Next, the first analysis module 113 performs analysis based on the first image processing information I12 to generate a first analysis information I13. The first analysis module 113 can analyze different targets, for example, yield analysis or pattern analysis. Here, the first analysis module 113 belongs to the object classification software, and judges whether the object to be tested O is defective or not, that is, the first analysis information I13 includes the identification information of whether the defect is or not.

Then, the display module 114 displays an analysis screen based on the first analysis information I13. This embodiment does not limit the format of the analysis screen, for example, it simply outputs O or X. In other words, all the judgment processes on whether the object O is flawed or not are completed in the first automatic optical inspection system 11, and the output image at this time is only an image input that allows the second automatic optical inspection system to work normally. Therefore, the presentation mode of the image may have any form, which can make the second automatic optical detection system clearly determine the priority.

In this embodiment, the first automatic optical detection system may further include a first calculation module 115, which is coupled to the first image processing module 112 and the first analysis module 113. The first computing module 115 may include a central processing unit and a memory. Since the capability of the first computing module 115 needs to match the first image processing module 112, it is a central processing unit with high specification and high speed computing capability.

The second automatic optical inspection system 12 has a second camera module 121 and a second image processing module 122. The second camera module 121 images the analysis screen to generate a second camera information I21, and the second image processing module 122 performs image processing on the second camera information I21. Here, the second automatic optical inspection system 12 belongs to the original system of the semiconductor device 1, so the specifications are lower than the first automatic optical inspection system 11, for example, the resolution of the first camera module 111 is higher than that of the second camera module 121 The specification of the first image processing module 112 is higher than that of the second image processing module 122. Similarly, in order to allow the second camera module 121 to perform appropriate imaging, the analysis screen displayed by the display module 114 of the first automatic optical inspection system 11 is a low-spec or low-resolution image, that is, the analysis screen analysis The degree system corresponds to the second camera module 121.

Next, the second image processing module 122 performs image processing on the second camera information I21 to generate a second image processing information I22. The second automatic optical inspection system further includes a second analysis module 123. The second analysis module 123 analyzes the second image processing information I22 to generate a control information I23. The second analysis module 123 here also uses the software of object classification as an example for description. Since the input of the second automatic optical detection system 12 has changed, the original classification principle only needs to be modified slightly. In this embodiment, the second analysis module 123 performs relatively simple and simple judgment.

In conclusion, in this embodiment, because only a new AOI system is added, its complexity is much simpler than replacing the old AOI system, and the procedure does not affect the flow of the original production line. The old AOI system still handles its The original inspection operation strengthened the resolution of the optical photography inspection equipment in the new AOI system, improved the performance of the production line to process the object to be tested, and completed the equipment upgrade under the seamless connection state.

In this embodiment, the second automatic optical inspection system 12 further includes a second calculation module 124 which is coupled to the second image processing module 122 and the second analysis module 123. The second computing module 124 may include a central processing unit and a memory. Since the second computing module 124 is only a simple task, it is a low-spec central processing unit and memory, that is, the specification of the first computing module 115 is higher than that of the second computing module 124.

The semiconductor device 1 may further include an actuation system 13 that performs an action on the object O based on the control information I23. In this embodiment, the actuating system 13 includes a robot arm, which classifies the object O to be clamped according to the movement.

2 is a flowchart of a method for detecting a semiconductor device according to an embodiment of the present invention. The semiconductor device of this embodiment is the semiconductor device 1 of the above embodiment. As shown in FIG. 2, the detection method of the semiconductor device 1 includes: generating a first imaging information I11 by imaging an object O by the first camera module 111 (step S01 ); by the first image processing module The group 112 performs image processing based on the first camera information I11 to generate a first image processing information I12 (step S02); the first analysis module 113 performs analysis based on the first image processing information I12 to generate a first analysis information I13 (Step S03); display an analysis screen based on the first analysis information I13 by the display module 114 (step S04); generate a second camera information I21 by shooting the analysis screen by the second camera module 121 (step S05) ); and the second image processing module 122 performs image processing on the second camera information I21 (step S06). Since the detection methods of this embodiment are all described in detail in the above embodiments, they will not be repeated here.

In summary, according to the semiconductor device and the semiconductor device detection method of the present invention, in addition to the original second automatic optical detection system, the semiconductor device is further provided with a first automatic optical detection system, which can perform Specification detection, and the detection result is presented by the analysis screen displayed by one of the display modules, and then the analysis screen is captured by the camera module of the second automatic optical detection system, and the second The image processing module of the optical detection system performs image processing on the acquired camera information. In this way, although the semiconductor device is further provided with the first automatic optical inspection system, this arrangement can be seamlessly connected with the original semiconductor device. Therefore, with the above configuration, the present invention can have the following benefits:

Install a new AOI system on the original semiconductor device to couple with the old AOI module. The new AOI module can include high-resolution cameras and high-standard image processing systems to solve the original low-resolution optical inspection The camera has no way to detect the problem of precision objects.

Without destroying the integrity of the original semiconductor equipment, add a new AOI system to the existing semiconductor equipment to solve the problems encountered by replacing the old AOI system on the semiconductor equipment, including the need to adjust the process settings on the existing semiconductor equipment , Need to replace the machine design and manufacture of the new AOI system, system integration technology, image pre-processing, image post-processing, testing application settings, and need to replace the hardware equipment of the old AOI system on the production line.

To reduce the necessary cost when upgrading the system, the original replacement of the new AOI system requires the removal of the equipment of the old AOI system, and the change of the software system settings on the original semiconductor equipment and other equipment connected to the AOI system.

Therefore, the technology of the present invention is to install a new AOI system on the original semiconductor device. It does not change the setting and arrangement of any hardware or software on the original semiconductor device. It is just a new (higher specification AOI system with the existing Semiconductor devices), compared to the changes required to replace the entire AOI system, it can also reduce the risk of compatibility errors in semiconductor devices after the upgraded system.

The above is only exemplary, and not restrictive. Any equivalent modifications or changes made without departing from the spirit and scope of the present invention shall be included in the scope of the attached patent application.

1: Semiconductor equipment 11: First automatic optical inspection system 111: First camera module 112: First image processing module 113: First analysis module 114: Display module 115: First calculation module 12: Second Automatic optical detection system 121: second camera module 122: second image processing module 123: second analysis module 124: second calculation module 13: actuation system I11: first camera information I12: first image processing Information I13: First analysis information I21: Second camera information I22: Second image processing information I23: Control information O: Test object S01～S06: Steps of detection method

FIG. 1 is a block diagram of a semiconductor device according to an embodiment of the invention. FIG. 2 is a flowchart of a semiconductor device detection method according to an embodiment of the invention.

1: Semiconductor equipment

11: The first automatic optical inspection system

111: the first camera module

112: The first image processing module

113: The first analysis module

114: display module

115: The first computing module

12: Second automatic optical inspection system

121: Second camera module

122: Second image processing module

123: Second analysis module

124: second computing module

13: Actuation system

I11: First camera information

I12: First image processing information

I13: First analysis information

I21: Second camera information

I22: Second image processing information

I23: Control information

O: test object

Claims (10)

A semiconductor device, including: a first automatic optical inspection system, having a first camera module, a first image processing module, a first analysis module and a display module, the first camera module is The first image processing information is generated by imaging an object to be measured, the first image processing module performs image processing according to the first imaging information to generate a first image processing information, and the first analysis module is based on the The first image processing information is analyzed to generate a first analysis information, the display module displays an analysis screen based on the first analysis information; and a second automatic optical inspection system, which has a second camera module and a A second image processing module, the second camera module captures the analysis screen to generate second camera information, and the second image processing module performs image processing on the second camera information. The semiconductor device as described in item 1 of the patent application scope, wherein the resolution of the first camera module is higher than that of the second camera module. The semiconductor device as described in item 1 of the patent application scope, wherein the specification of the first image processing module is higher than that of the second image processing module. The semiconductor device as described in item 1 of the patent application scope, wherein the second automatic optical inspection system further includes: a second analysis module, wherein the second image processing module performs image processing on the second camera information A second image processing information is generated, and the second analysis module analyzes the second image processing information to generate a control information. The semiconductor device described in item 4 of the patent application scope further includes: an actuation system, which performs an action on the object to be tested based on the control information. An inspection method for semiconductor equipment, wherein the semiconductor equipment includes a first automatic optical inspection system and a second automatic optical inspection system, the first automatic optical inspection system has a first camera module and a first image processing module Group, a first analysis module and a display module, the second automatic optical detection system has a second camera module and a second image processing module, the detection method includes: by the first camera module The group takes a picture of the object to be tested to generate a first camera information; the first image processing module performs image processing according to the first camera information to generate a first image processing information; the first analysis module The group analyzes the first image processing information to generate a first analysis information; the display module displays an analysis screen based on the first analysis information; the second camera module captures the analysis screen Generating a second camera information; and performing image processing on the second camera information by the second image processing module. The detection method as described in item 6 of the patent application scope, wherein the resolution of the first camera module is higher than that of the second camera module. The detection method as described in item 6 of the patent application scope, wherein the specification of the first image processing module is higher than that of the second image processing module. The detection method as described in item 6 of the patent application scope, wherein the second automatic optical detection system further includes a second analysis module, and the detection method further includes: the second camera The information is image processed to generate second image processing information; and the second analysis module analyzes the second image processing information to generate control information. The detection method as described in item 9 of the patent application scope, wherein the semiconductor device further includes an actuation system, the detection method further includes: an action is performed on the object to be tested by the actuation system based on the control information.

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