TW202016612A - Touch structure and touch device - Google Patents

Touch structure and touch device Download PDF

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TW202016612A
TW202016612A TW107136113A TW107136113A TW202016612A TW 202016612 A TW202016612 A TW 202016612A TW 107136113 A TW107136113 A TW 107136113A TW 107136113 A TW107136113 A TW 107136113A TW 202016612 A TW202016612 A TW 202016612A
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Taiwan
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touch
patent application
item
flexible substrate
application range
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TW107136113A
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Chinese (zh)
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朱林
李賀
胡康軍
張瑤
雷曉華
何傳熙
陳靖
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大陸商深圳柔顯系統技術有限公司
大陸商深圳市柔宇科技有限公司
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Priority to TW107136113A priority Critical patent/TW202016612A/en
Publication of TW202016612A publication Critical patent/TW202016612A/en

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Abstract

The present invention provides a touch structure which includes a flexible substrate and a touch function layer disposed on the flexible substrate. The touch function layer is made of an elastic conductive material. In the touch structure and touch device provided by the present invention, the elastic conductive material is used to form a touch function layer on the flexible substrate, which can improve the flexibility and stretch resistance of the touch function layer, and reduce the possibility of breaking of the touch functional layer due to stretching.

Description

觸控結構及觸控裝置Touch structure and touch device

本發明涉及觸控技術領域,尤其涉及一種觸控結構及觸控裝置。The invention relates to the field of touch technology, in particular to a touch structure and a touch device.

現有的電子裝置通常設觸控結構以提供觸控輸入功能。觸控結構中的觸控電極通常由氧化銦錫(Indium-Tin Oxide,ITO)材料製成。由於氧化銦錫材料的機械硬度高,在拉伸電極之後容易發生斷裂,影響使用。。Existing electronic devices usually have a touch structure to provide a touch input function. The touch electrodes in the touch structure are usually made of Indium-Tin Oxide (ITO) material. Due to the high mechanical hardness of indium tin oxide material, it is easy to break after stretching the electrode, which affects the use. .

為解決上述問題,本發明實施例公開一種拉伸後不容易斷裂的觸控結構及觸控裝置。In order to solve the above problems, embodiments of the present invention disclose a touch structure and a touch device that are not easily broken after stretching.

一種觸控結構,包括柔性基材及設置於所述柔性基材上的觸控功能層,所述觸控功能層由彈性導電材料製成。A touch control structure includes a flexible substrate and a touch function layer disposed on the flexible substrate, the touch function layer is made of an elastic conductive material.

一種觸控裝置,包括如上所述的觸控結構。A touch control device includes the touch control structure as described above.

本發明提供的觸控結構及觸控裝置,藉由所述彈性導電材料在所述柔性基材上形成觸控功能層,能夠提高觸控功能層的柔韌性能及耐拉伸能力,減少觸控功能層因拉伸斷裂的可能性。另,觸控結構的疊層結構簡單,有利於觸控裝置的輕薄化發展。In the touch structure and touch device provided by the present invention, the flexible conductive material is used to form a touch function layer on the flexible substrate, which can improve the flexibility and stretch resistance of the touch function layer and reduce touch The possibility of the functional layer breaking due to stretching. In addition, the laminated structure of the touch structure is simple, which is conducive to the development of thin and light touch devices.

下面將結合本發明實施例中的附圖,對本發明實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅僅是本發明一部分實施例,而不是全部的實施例。基於本發明中的實施例,本領域普通技術人員在沒有做出進步性勞動前提下所獲得的所有其他實施例,均屬於本發明保護的範圍。The technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without making progressive labor fall within the protection scope of the present invention.

請參閱圖1,圖1為本發明一實施例提供的一種觸控結構10的結構示意圖。觸控結構10包括柔性基材11及設置於柔性基材11上的觸控功能層12,觸控功能層12由彈性導電材料製成。Please refer to FIG. 1, which is a schematic structural diagram of a touch structure 10 according to an embodiment of the present invention. The touch control structure 10 includes a flexible substrate 11 and a touch function layer 12 disposed on the flexible substrate 11. The touch function layer 12 is made of an elastic conductive material.

本實施方式中,柔性基材11的製成材料為熱塑性聚氨酯彈性體橡膠(Thermoplastic polyurethanes,TPU)。可以理解,柔性基材11還可以由其他柔性材料製成,使得柔性基材11可彎折、可拉伸,例如碳基橡膠(如乳膠、順丁橡膠、乙丙橡膠、丁腈橡膠等)、矽橡膠、有機矽樹脂(如聚二甲基矽氧烷(polydimethylsiloxane,PDMS))、SEBS(氫化苯乙烯-丁二烯共聚物)、EcoFlex(己二酸丁二醇酯-對苯二甲酸丁二醇酯共聚物)、彈性水凝膠中的至少一種。所述彈性導電材料為樹脂與導電成分的複合材料。所述彈性導電材料為可拉伸導電混合體系,其中,所述樹脂為連續相,可拉伸,即所述樹脂具彈性,而導電成分為分散相,能夠進行導電。所述彈性導電材料製成的觸控功能層12可彎折、可拉伸。所述導電成分包括銀顆粒、銅顆粒、銀線、銅線、碳粉、石墨烯、碳納米管、PEDOT(EDOT(3,4-乙烯二氧噻吩單體)的聚合物)、液態金屬、離子液體中的至少一種。樹脂與導電成分(如導電顆粒)可均勻、穩定地混合,並且固含量能達到印刷電路的阻抗要求,使得彈性導電材料可形成導電性優良的觸控功能層12。在一些實施方式中,所述彈性導電材料可以為橡膠與導電成分的複合材料。在一些實施方式中,所述彈性導電材料亦可以為彈性塑膠與導電成分的複合材料。In the present embodiment, the flexible base material 11 is made of thermoplastic polyurethane elastomer (TPU). It can be understood that the flexible substrate 11 can also be made of other flexible materials, so that the flexible substrate 11 can be bent and stretched, such as carbon-based rubber (such as latex, butadiene rubber, ethylene propylene rubber, nitrile rubber, etc.) , Silicone rubber, silicone resin (such as polydimethylsiloxane (PDMS)), SEBS (hydrogenated styrene-butadiene copolymer), EcoFlex (butylene adipate-terephthalic acid Butylene glycol ester copolymer), elastic hydrogel at least one. The elastic conductive material is a composite material of resin and conductive components. The elastic conductive material is a stretchable conductive mixed system, wherein the resin is a continuous phase and is stretchable, that is, the resin is elastic, and the conductive component is a dispersed phase, capable of conducting electricity. The touch function layer 12 made of the elastic conductive material can be bent and stretched. The conductive component includes silver particles, copper particles, silver wires, copper wires, carbon powder, graphene, carbon nanotubes, PEDOT (polymer of EDOT (3,4-ethylenedioxythiophene monomer)), liquid metal, At least one of ionic liquids. The resin and conductive components (such as conductive particles) can be mixed uniformly and stably, and the solid content can meet the impedance requirements of the printed circuit, so that the elastic conductive material can form the touch function layer 12 with excellent conductivity. In some embodiments, the elastic conductive material may be a composite material of rubber and conductive components. In some embodiments, the elastic conductive material may also be a composite material of elastic plastic and conductive components.

本實施方式中,取導電成分與樹脂,然後加入適量溶劑進行混合攪拌形成所述彈性導電材料,所述樹脂與所述導電成分的體積配比比例範圍為(1/8)~(1/3),將所述彈性導電材料藉由絲印、轉印、壓印、噴墨列印、3D列印、濺射等方式印刷於柔性基材11的表面上。可以理解,不限定所述樹脂與所述導電成分的配比比例,所述樹脂與所述導電成分混合製成的彈性導電材料能夠可拉伸及導電即可。優選的,所述導電成分與樹脂進行混合時可對混合體系進行加熱處理,同時使用球磨機或行星攪拌機對體系進行分散,使體系混合更加均勻,能夠得到性能良好的彈性導電材料。In this embodiment, the conductive component and the resin are taken, and then an appropriate amount of solvent is added and mixed to form the elastic conductive material. The volume ratio of the resin and the conductive component is (1/8) to (1/3 ), the elastic conductive material is printed on the surface of the flexible substrate 11 by means of screen printing, transfer, embossing, inkjet printing, 3D printing, sputtering and the like. It can be understood that the ratio of the resin and the conductive component is not limited, and the elastic conductive material made by mixing the resin and the conductive component can be stretchable and conductive. Preferably, when the conductive component and the resin are mixed, the mixed system may be heat-treated, and at the same time, a ball mill or a planetary mixer may be used to disperse the system, so that the system is mixed more uniformly, and an elastic conductive material with good performance can be obtained.

藉由所述彈性導電材料在柔性基材11上形成觸控功能層12,能夠提高觸控功能層12的柔韌性能及耐拉伸能力,減少觸控功能層12斷裂的可能性。另,觸控結構10的疊層結構簡單,有利於具觸控結構10的觸控裝置的輕薄化發展。By forming the touch function layer 12 on the flexible substrate 11 by the elastic conductive material, the flexibility and stretch resistance of the touch function layer 12 can be improved, and the possibility of the touch function layer 12 breaking can be reduced. In addition, the laminated structure of the touch structure 10 is simple, which is conducive to the development of light and thin touch devices with the touch structure 10.

具體的,觸控結構10還包括電路板14、觸控感測電路15及複數連接走線16。觸控感測電路15至少包括觸控晶片。觸控感測電路15及其週邊電路集成於電路板14上。本實施方式中,電路板14為印刷電路板,觸控感測電路15藉由板上晶片封裝(Chips on Board,COB)的方式封裝於電路板14上。由於將觸控感測電路15封裝在電路板14上而非在柔性基材11上,可以避免柔性基材11受到封裝過程中的溫度及壓力的影響,進而保護柔性基材11不受到損壞。並且,由於現有的FPC(柔性電路板)為非可拉伸材料,而柔性基材11為可拉伸材料,如直接採用現有的FPC綁定(bonding)於柔性基材上將由於二者的拉伸特性不一致而容易發生損壞的情況。故,本實施例亦沒有採用現有的FPC作為連接柔性基材11與電路板14的介質,或者是將FPC作為晶片的綁定區域,而是直接將柔性基材11與電路板14連接。Specifically, the touch structure 10 further includes a circuit board 14, a touch sensing circuit 15 and a plurality of connection traces 16. The touch sensing circuit 15 includes at least a touch chip. The touch sensing circuit 15 and its peripheral circuits are integrated on the circuit board 14. In this embodiment, the circuit board 14 is a printed circuit board, and the touch sensing circuit 15 is packaged on the circuit board 14 by means of chip on board (COB). Since the touch sensing circuit 15 is packaged on the circuit board 14 instead of the flexible substrate 11, the flexible substrate 11 can be prevented from being affected by the temperature and pressure during the packaging process, thereby protecting the flexible substrate 11 from damage. Moreover, since the existing FPC (flexible circuit board) is a non-stretchable material, and the flexible substrate 11 is a stretchable material, if the existing FPC is directly bonded to the flexible substrate, it will be due to the two The tensile properties are inconsistent and easily damaged. Therefore, in this embodiment, the existing FPC is not used as a medium for connecting the flexible substrate 11 and the circuit board 14, or the FPC is used as the bonding area of the wafer, but the flexible substrate 11 and the circuit board 14 are directly connected.

觸控功能層12藉由連接走線16與觸控感測電路15電性連接。The touch function layer 12 is electrically connected to the touch sensing circuit 15 through the connection trace 16.

柔性基材11還包括主體113及由主體113一端一體延伸形成的延伸部115。主體113包括功能區1131及繞功能區1131設置的連接區1133。延伸部115與電路板14相鄰設置。本實施方式中,主體113與延伸部115一體形成。The flexible substrate 11 further includes a main body 113 and an extension 115 integrally formed by one end of the main body 113. The main body 113 includes a functional area 1131 and a connection area 1133 disposed around the functional area 1131. The extension 115 is provided adjacent to the circuit board 14. In this embodiment, the body 113 and the extension 115 are formed integrally.

觸控功能層12圖形化設置於主體113的功能區1131,用於感應觸摸位置。觸控功能層12包括複數呈陣列設置的觸控單元121。觸控單元121大致呈帶狀結構,以提高觸控單元121的耐拉伸能力。The touch function layer 12 is graphically arranged in the function area 1131 of the main body 113 for sensing the touch position. The touch function layer 12 includes a plurality of touch units 121 arranged in an array. The touch unit 121 has a substantially strip-shaped structure to improve the tensile resistance of the touch unit 121.

複數連接走線16間隔設置於柔性基材11上。本實施方式中,每個連接走線16電性連接於一觸控單元121與觸控感測電路15之間。A plurality of connection traces 16 are arranged on the flexible substrate 11 at intervals. In this embodiment, each connection trace 16 is electrically connected between a touch unit 121 and the touch sensing circuit 15.

連接走線16電性連接於觸控感測電路15及觸控單元121之間,從而實現觸控單元121與觸控感測電路15的電性連接。The connection trace 16 is electrically connected between the touch sensing circuit 15 and the touch unit 121, so as to realize the electrical connection between the touch unit 121 and the touch sensing circuit 15.

連接走線16包括形成于連接區1133的第一緩衝部161及形成於延伸部115的第二緩衝部163。第一緩衝部161一端與對應的觸控單元121電性連接,第一緩衝部161的另一端向延伸部115延伸形成第二緩衝部163。第一緩衝部161的結構為彎曲設置于連接區1133的彎曲結構,用於緩衝觸控結構10拉伸時產生的應力,降低連接走線16被拉斷的可能性以及出現阻值突變的可能性。例如,在一實施方式中,請參閱圖2,第一緩衝部161的結構為波浪線結構。又例如,在一實施方式中,請參閱圖3,第一緩衝部161的結構為折線結構。在一實施方式中,第一緩衝部161的結構為三角函數曲線結構。可以理解,在一實施方式中,第一緩衝部161的結構可以包括折線結構、波浪線結構、三角函數曲線結構,即第一緩衝部161的結構可以包括折線結構、波浪線結構、三角函數曲線結構中的至少一種。The connection trace 16 includes a first buffer portion 161 formed in the connection area 1133 and a second buffer portion 163 formed in the extension portion 115. One end of the first buffer portion 161 is electrically connected to the corresponding touch unit 121, and the other end of the first buffer portion 161 extends toward the extension portion 115 to form a second buffer portion 163. The structure of the first buffering portion 161 is a curved structure bent in the connection area 1133 to buffer the stress generated when the touch structure 10 is stretched, reducing the possibility of the connection trace 16 being broken and the possibility of sudden resistance change Sex. For example, in one embodiment, please refer to FIG. 2, the structure of the first buffer portion 161 is a wavy line structure. For another example, in an embodiment, please refer to FIG. 3, the structure of the first buffer portion 161 is a broken line structure. In one embodiment, the structure of the first buffer 161 is a trigonometric curve structure. It can be understood that in an embodiment, the structure of the first buffer portion 161 may include a polyline structure, a wavy line structure, and a trigonometric function curve structure, that is, the structure of the first buffer portion 161 may include a polyline structure, a wavy line structure, and a trigonometric function curve At least one of the structures.

第二緩衝部163遠離觸控單元121的一端與觸控感測電路15電性連接。請結合參閱圖4,圖4為本實施方式提供的觸控結構10的部分區域的剖面示意圖。延伸部115大致呈波浪形、折疊形或褶皺形的彎曲狀,使得沿延伸部115的延伸方向具有一定的彈性形變空間。延伸部115包括複數凸起1151,相鄰的凸起1151之間形成間隙,用於緩衝觸控結構10拉伸時產生的應力。第二緩衝部163為彎曲結構,用於緩衝觸控結構10拉伸時產生的應力,降低連接走線16被拉斷的可能性以及出現阻值突變的可能性。例如,第二緩衝部163的結構為折線結構、波浪線結構、三角函數曲線結構中的至少一種。進一步地,第二緩衝部163的彎曲結構可以是緊貼在延伸部115的彎曲的表面上而形成與延伸部115彎曲表面一致的彎曲結構,即從圖4的截面來看延伸部115的彎曲表面與第二緩衝部163的彎曲結構彎曲幅度及角度均相同,且均是沿上下方向彎曲。當然,第二緩衝部163的彎曲結構亦可以是形成在延伸部115表面沿著延伸部115左右兩側或前後兩側彎曲,或者同時包含上述兩種彎曲結構。The end of the second buffer portion 163 away from the touch unit 121 is electrically connected to the touch sensing circuit 15. Please refer to FIG. 4. FIG. 4 is a schematic cross-sectional view of a partial area of the touch structure 10 provided by the embodiment. The extending portion 115 is substantially wavy, folded, or folded in a curved shape, so that there is a certain elastic deformation space along the extending direction of the extending portion 115. The extending portion 115 includes a plurality of protrusions 1151, and a gap is formed between adjacent protrusions 1151 to buffer the stress generated when the touch structure 10 is stretched. The second buffer portion 163 is a curved structure, which is used to buffer the stress generated when the touch structure 10 is stretched, so as to reduce the possibility of the connecting trace 16 being broken and the possibility of sudden resistance change. For example, the structure of the second buffer portion 163 is at least one of a polyline structure, a wavy line structure, and a trigonometric curve structure. Further, the curved structure of the second buffer portion 163 may be close to the curved surface of the extending portion 115 to form a curved structure consistent with the curved surface of the extending portion 115, that is, the bending of the extending portion 115 from the cross section of FIG. 4 The bending width and angle of the curved structure of the surface and the second buffer portion 163 are the same, and both are curved in the vertical direction. Of course, the curved structure of the second buffer portion 163 may also be formed on the surface of the extending portion 115 to be curved along the left and right sides or the front and rear sides of the extending portion 115, or include both of the above-mentioned curved structures.

在一實施例中,所述連接走線16在靠近所述柔性基材11的外輪廓的區域彎曲設置。所述連接走線16為振盪彎曲。所述振盪彎曲為所述連接走線16形成複數交替分佈的波峰及波谷。沿著朝向所述柔性基材11的外輪廓的方向,所述連接走線16形成複數交替分佈的波峰及波谷。所述連接走線16在遠離所述柔性基材11的外輪廓的區域亦彎曲設置。In an embodiment, the connection trace 16 is bent at a region near the outer contour of the flexible substrate 11. The connection trace 16 is oscillated and bent. The oscillating bending is that the connecting trace 16 forms a plurality of alternating peaks and troughs. Along the direction toward the outer contour of the flexible substrate 11, the connecting traces 16 form a plurality of alternating peaks and troughs. The connection trace 16 is also bent in an area away from the outer contour of the flexible substrate 11.

觸控結構10還包括電連接器17。電連接器17設置於電路板14上並與觸控感測電路15電性連接。第二緩衝部163遠離觸控功能層12的一端形成插接端(PIN)1631。插接端1631插接於電連接器17上,從而實現觸控感測電路15與觸控功能層12之間的電性連接。The touch control structure 10 further includes an electrical connector 17. The electrical connector 17 is disposed on the circuit board 14 and electrically connected to the touch sensing circuit 15. An end of the second buffer portion 163 away from the touch function layer 12 forms a pin 1631. The plug end 1631 is plugged on the electrical connector 17, so as to realize the electrical connection between the touch sensing circuit 15 and the touch function layer 12.

電連接器17包括對應插接端1631設置的連接端(圖未示)。由於觸控結構10藉由連接走線16的插接端1631插接於電連接器17上,使得觸控結構10的連接走線16無需藉由綁定即可實現觸控感測電路15與觸控功能層12之間的電性連接,簡化了觸控結構10的組裝制程,同時避免柔性基材11在綁定中因高溫被損壞,提高了產品良率。此外,由於延伸部115的凸起1151之間形成間隙,能夠緩衝觸控結構10拉伸時電路板14受到的衝擊,降低電路板14被損壞的可能性,亦能減少插接端1631因觸控結構10在拉伸時而脫離電連接器17的可能性,從而確保觸控結構10的性能。換句話說,由於插接端1631不能承受拉伸作用,彎曲的延伸部115能夠緩衝觸控結構10在拉伸時對插接端1631的拉伸力,避免插接端1631受到的拉伸力過大而損壞的情況。The electrical connector 17 includes a connection end (not shown) provided corresponding to the plug end 1631. Since the touch structure 10 is connected to the electrical connector 17 through the plug end 1631 of the connection trace 16, the connection trace 16 of the touch structure 10 can realize the touch sensing circuit 15 and the connection without binding The electrical connection between the touch function layers 12 simplifies the assembly process of the touch structure 10, and at the same time prevents the flexible substrate 11 from being damaged due to high temperature during binding, which improves the product yield. In addition, due to the gap formed between the protrusions 1151 of the extending portion 115, the impact of the circuit board 14 when the touch structure 10 is stretched can be buffered, the possibility of the circuit board 14 being damaged is reduced, and the plug-in end 1631 can also be reduced The possibility of the control structure 10 being disengaged from the electrical connector 17 when stretched, thereby ensuring the performance of the touch structure 10. In other words, since the plug end 1631 cannot withstand the stretching action, the curved extension 115 can buffer the tensile force of the touch structure 10 on the plug end 1631 when being stretched to avoid the tensile force received by the plug end 1631 Too large and damaged.

本實施方式中,所述連接端的數量對應插接端1631的數量,所述連接端之間的間距根據通道數量和連接走線16進行設置。所述連接端設置的高度根據疊構厚度確認,插接端1631與所述連接端的插接處的接電可選擇上接式或下接式。插接端1631與所述連接端之間的鎖扣方式可選擇直插式或掀蓋式。In this embodiment, the number of the connection ends corresponds to the number of the plug ends 1631, and the distance between the connection ends is set according to the number of channels and the connection traces 16. The height of the connection end is confirmed according to the thickness of the stacked structure, and the electrical connection between the insertion end 1631 and the connection end can be selected as the upper connection type or the lower connection type. The locking method between the plug-in end 1631 and the connection end can be a direct plug-in type or a flip-up type.

可以理解,對觸控感測電路15與電路板14的連接方式不作限定,例如,電路板14可為柔性電路板,觸控感測電路15藉由覆晶薄膜(Chip On Flex, COF)方式設於電路板14上,柔性基材11上的第二緩衝部163藉由綁定的方式與電路板14接合於一起,實現觸控感測電路15與觸控功能層12的電性連接。由於第二緩衝部163與觸控感測電路15在電路板14上綁定接合,避免柔性基材11在綁定過程中受到高溫及壓力的影響,進而保護柔性基材11不受到損壞。It can be understood that the connection method of the touch sensing circuit 15 and the circuit board 14 is not limited, for example, the circuit board 14 may be a flexible circuit board, and the touch sensing circuit 15 is implemented by a chip on flex (COF) method On the circuit board 14, the second buffer portion 163 on the flexible substrate 11 is bonded to the circuit board 14 by binding to realize the electrical connection between the touch sensing circuit 15 and the touch function layer 12. Since the second buffer portion 163 and the touch sensing circuit 15 are bound and joined on the circuit board 14, the flexible substrate 11 is prevented from being affected by high temperature and pressure during the binding process, thereby protecting the flexible substrate 11 from damage.

觸控結構10還包括加強層18。加強層18設於柔性基材11遠離觸控功能層12的一側,並與第二緩衝部163位於相反的兩側。加強層18位於延伸部115上並與電路板14相鄰設置。加強層18能夠提供柔性基材11支撐,增強柔性基材11的強度,方便插接端1631插接於電連接器17上。可以理解,加強層18可以僅設置於延伸部115與電路板14相鄰的部分區域,加強層18亦可以覆蓋延伸部115的整個區域。本實施方式中,加強層18的製成材料為聚丙烯(polypropylene,PP)。在其他實施方式中,加強層18的製成材料可以為其他材料,例如,加強層18的製成材料包括PP、聚氯乙烯(Polyvinyl chloride, PVC)、聚醯亞胺(Polyimide, PI)、聚苯硫醚(Phenylene sulfide, PPS)、環氧樹脂板、酚醛樹脂板、樹脂纖維板、鋼片、陶瓷片、石英片中的至少一種。The touch control structure 10 further includes a reinforcement layer 18. The reinforcing layer 18 is disposed on the side of the flexible substrate 11 away from the touch function layer 12 and on the opposite sides to the second buffer portion 163. The reinforcement layer 18 is located on the extension 115 and is adjacent to the circuit board 14. The reinforcing layer 18 can provide support for the flexible substrate 11, enhance the strength of the flexible substrate 11, and facilitate the insertion of the plug end 1631 on the electrical connector 17. It can be understood that the reinforcement layer 18 may be provided only in a part of the area where the extension 115 is adjacent to the circuit board 14, and the reinforcement layer 18 may also cover the entire area of the extension 115. In this embodiment, the reinforcing layer 18 is made of polypropylene (PP). In other embodiments, the material of the reinforcement layer 18 may be other materials. For example, the material of the reinforcement layer 18 includes PP, Polyvinyl chloride (PVC), Polyimide (PI), At least one of polyphenylene sulfide (Phenylene sulfide, PPS), epoxy resin board, phenolic resin board, resin fiber board, steel sheet, ceramic sheet, quartz sheet.

請參閱圖5,在一實施方式中,觸控結構10還包括設於所述觸控功能層12遠離柔性基材11一側的柔性封裝層19,用於對觸控功能層12進行封裝保護。觸控功能層12位於柔性封裝層19與柔性基材11之間。柔性封裝層19由可拉伸樹脂或可拉伸膜材製成。柔性封裝層19由可拉伸樹脂製成時,可藉由塗布、噴塗、化學沉積等方式製備於柔性基材11上並覆蓋觸控功能層12。柔性封裝層19由可拉伸膜材製成時,柔性封裝層19可藉由熱壓、吹壓、注塑等方式製備於柔性基材11上並覆蓋觸控功能層12。柔性封裝層19的製成材料包括聚氨酯彈性樹脂、TPU膠膜中的至少一種。Please refer to FIG. 5. In one embodiment, the touch structure 10 further includes a flexible encapsulation layer 19 disposed on the side of the touch function layer 12 away from the flexible substrate 11 for encapsulating and protecting the touch function layer 12 . The touch function layer 12 is located between the flexible encapsulation layer 19 and the flexible substrate 11. The flexible encapsulating layer 19 is made of stretchable resin or stretchable film material. When the flexible encapsulation layer 19 is made of a stretchable resin, it can be prepared on the flexible substrate 11 by coating, spraying, chemical deposition, etc. to cover the touch function layer 12. When the flexible encapsulation layer 19 is made of a stretchable film material, the flexible encapsulation layer 19 can be prepared on the flexible substrate 11 and cover the touch function layer 12 by means of hot pressing, blow molding, injection molding, or the like. The material of the flexible encapsulation layer 19 includes at least one of polyurethane elastic resin and TPU adhesive film.

本實施方式中,柔性基材11、觸控功能層12及柔性封裝層19的拉伸彈性模量的數量級相同,實現力學性能上具有匹配性,以避免在觸控結構10的拉伸過程中容易出現脫層、剝離等現象,導致觸控結構10失效。In this embodiment, the tensile modulus of elasticity of the flexible substrate 11, the touch function layer 12 and the flexible encapsulation layer 19 are of the same order, and the mechanical properties are matched to avoid the stretching process of the touch structure 10 Phenomenon such as delamination and peeling are easy to occur, resulting in the failure of the touch structure 10.

請參閱圖6,本發明還提供一種觸控裝置100,包括如上所述的觸控結構10、粘合層70及柔性件80。柔性件80與觸控結構10藉由粘合層70粘接於一起。本實施方式中,粘合層70為光學膠。其他實施方式中,粘合層70可以為其他膠層,例如粘合層70可以為熱熔膠、雙面膠、光學膠、液體膠中的至少一種;觸控結構10與柔性件80的貼合方法可以是熱熔膠熱壓貼合、雙面膠、光學膠粘合、液體膠粘合。Referring to FIG. 6, the present invention also provides a touch device 100 including the touch structure 10, the adhesive layer 70 and the flexible member 80 as described above. The flexible member 80 and the touch structure 10 are bonded together by an adhesive layer 70. In this embodiment, the adhesive layer 70 is optical glue. In other embodiments, the adhesive layer 70 may be another adhesive layer, for example, the adhesive layer 70 may be at least one of hot-melt adhesive, double-sided adhesive, optical adhesive, and liquid adhesive; the sticking of the touch control structure 10 and the flexible member 80 The bonding method may be hot-melt adhesive hot-press bonding, double-sided adhesive, optical adhesive bonding, liquid adhesive bonding.

延伸部115與粘合層70在凸起1151的頂端1155與柔性件80藉由粘合層70粘合於一起。換句話說,延伸部115與柔性件80相鄰一側的凸起1151的頂端1155與柔性件80粘接,其他部分則與柔性件80隔開,使得延伸部115以折疊狀態與柔性件80固定粘合於一起,避免插接端或電路板14在觸控裝置100拉伸時被延伸部115拉扯。進一步地,粘合層70在對應延伸部115的位置亦可為離散型分佈(非連續分佈),請參閱圖7,即粘合層70僅設在對應延伸部115的凸起1151位置,凸起1151之間的位置則未有分佈,粘合層70在相鄰二凸起1151之間斷開。此種離散型分佈的粘合層70更有助於提升粘合層70的抗拉伸性能。延伸部115可沿拉伸方向700進行折疊。The extending portion 115 and the adhesive layer 70 are bonded to the flexible member 80 at the top 1155 of the protrusion 1151 by the adhesive layer 70. In other words, the tip 1155 of the protrusion 1151 on the side of the extension 115 adjacent to the flexible member 80 is bonded to the flexible member 80, and the other parts are separated from the flexible member 80, so that the extension 115 is in a folded state with the flexible member 80 It is fixed and adhered together to prevent the plug end or the circuit board 14 from being pulled by the extension 115 when the touch device 100 is stretched. Further, the position of the adhesive layer 70 corresponding to the extension 115 may also be a discrete distribution (non-continuous distribution). Please refer to FIG. 7, that is, the adhesive layer 70 is only provided at the position of the protrusion 1151 corresponding to the extension 115. There is no distribution between the positions 1151, and the adhesive layer 70 is broken between two adjacent protrusions 1151. The discretely distributed adhesive layer 70 further helps to improve the tensile resistance of the adhesive layer 70. The extension 115 can be folded along the stretching direction 700.

本實施方式中,柔性件80、粘合層70及觸控結構10的各層製成材料的拉伸彈性模量的數量級相同,使各層在力學性能上能夠匹配,以避免在觸控裝置100的拉伸過程中容易出現脫層、剝離等現象,導致觸控裝置100失效。柔性件80由彈性紡織材料製成,所述觸控裝置100為可穿戴設備,例如衣服。其他實施方式中,柔性件80還可以為其他材料,例如皮革等具一定柔韌性的材料。In this embodiment, the materials of the flexible member 80, the adhesive layer 70, and the layers of the touch structure 10 have the same magnitude of tensile modulus of elasticity, so that the mechanical properties of the layers can be matched to avoid Phenomenon such as delamination and peeling easily occur during the stretching process, resulting in the failure of the touch device 100. The flexible member 80 is made of an elastic textile material, and the touch device 100 is a wearable device, such as clothes. In other embodiments, the flexible member 80 may also be other materials, such as leather and other materials with certain flexibility.

本發明提供的觸控結構10及觸控裝置100,藉由所述彈性導電材料在所述柔性基材11上形成觸控功能層12,能夠提高觸控功能層12的柔韌性能及耐拉伸能力,減少觸控功能層12因彎折拉伸而斷裂的可能性。另,觸控結構10的疊層結構簡單,有利於觸控裝置100的輕薄化發展。In the touch structure 10 and the touch device 100 provided by the present invention, the touch conductive layer 12 is formed on the flexible substrate 11 by the elastic conductive material, which can improve the flexibility and stretch resistance of the touch functional layer 12 Ability to reduce the possibility of the touch function layer 12 breaking due to bending and stretching. In addition, the laminated structure of the touch structure 10 is simple, which is conducive to the development of the thin and thin touch device 100.

最後應說明的是:以上實施例僅用以說明本發明的技術方案,而非對其限制;儘管參照前述實施例對本發明進行了詳細的說明,本領域的普通技術人員應當理解:本發明的保護範圍並不局限於此,任何熟悉本技術領域的技術人員在本發明揭露的技術範圍內,可輕易想到的變化或替換,均應涵蓋在本發明的保護範圍之內。故,本發明的保護範圍應以權利要求的保護範圍為准。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: The scope of protection is not limited to this, and any change or replacement that can be easily imagined by those skilled in the art within the technical scope disclosed by the present invention should be included in the scope of protection of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

10:觸控結構11:柔性基材113:主體1131:功能區1133:連接區115:延伸部1151:凸起1155:頂端12:觸控功能層121:觸控單元14:電路板15:觸控感測電路16:連接走線161:第一緩衝部163:第二緩衝部1631:插接端17:電連接器18:加強層19:柔性封裝層100:觸控裝置70:粘合層80:柔性件700:拉伸方向10: Touch structure 11: Flexible substrate 113: Main body 1131: Function area 1133: Connection area 115: Extension 1151: Protrusion 1155: Top 12: Touch function layer 121: Touch unit 14: Circuit board 15: Touch Control sensing circuit 16: connection trace 161: first buffer section 163: second buffer section 1631: plug end 17: electrical connector 18: reinforcement layer 19: flexible encapsulation layer 100: touch device 70: adhesive layer 80: flexible part 700: stretching direction

為了更清楚地說明本發明實施例或習知技術中的技術方案,下面將對實施例中所需要使用的附圖作簡單地介紹,顯而易見地,下面描述中的附圖僅僅是本發明的一些實施例,對於本領域普通技術人員來講,在不付出進步性勞動的前提下,還可以根據該等附圖獲得其他的附圖。In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are only some of the invention For the embodiment, for those of ordinary skill in the art, without paying progressive work, other drawings may be obtained based on these drawings.

圖1為本發明一實施方式提供的一種觸控結構的結構示意圖。FIG. 1 is a schematic structural diagram of a touch structure provided by an embodiment of the present invention.

圖2為圖1所示的觸控結構的連接走線的第一緩衝部的示意圖。FIG. 2 is a schematic diagram of the first buffer portion of the touch structure shown in FIG.

圖3為本發明一實施方式中的連接走線的第一緩衝部的示意圖。FIG. 3 is a schematic diagram of the first buffer portion of the connection trace in an embodiment of the present invention.

圖4為圖1所示的觸控結構的部分區域的剖面示意圖。4 is a schematic cross-sectional view of a partial area of the touch structure shown in FIG. 1.

圖5為本發明一實施方式中的觸控結構的分解示意圖。FIG. 5 is an exploded schematic diagram of a touch structure in an embodiment of the invention.

圖6為本發明一實施方式提供的觸控裝置的結構示意圖。6 is a schematic structural diagram of a touch device provided by an embodiment of the present invention.

圖7為本發明一實施方式提供的觸控裝置的部分區域示意圖。7 is a schematic diagram of a partial area of a touch device provided by an embodiment of the present invention.

10:觸控結構 10: Touch structure

11:柔性基材 11: Flexible substrate

113:主體 113: Subject

1131:功能區 1131: Ribbon

1133:連接區 1133: Connection area

115:延伸部 115: Extension

12:觸控功能層 12: Touch function layer

121:觸控單元 121: Touch unit

14:電路板 14: Circuit board

15:觸控感測電路 15: Touch sensing circuit

16:連接走線 16: Connect the wiring

161:第一緩衝部 161: First buffer

163:第二緩衝部 163: Second buffer

17:電連接器 17: Electrical connector

Claims (26)

一種觸控結構,其中,所述觸控結構包括柔性基材及設置於所述柔性基材上的觸控功能層,所述觸控功能層由彈性導電材料製成。A touch control structure, wherein the touch control structure includes a flexible substrate and a touch function layer disposed on the flexible substrate, the touch function layer is made of an elastic conductive material. 如申請專利範圍第1項所述的觸控結構,其中,所述彈性導電材料為樹脂與導電成分的複合材料,或者橡膠與導電成分的複合材料,或者彈性塑膠與導電成分的複合材料。The touch structure as described in item 1 of the patent application range, wherein the elastic conductive material is a composite material of resin and conductive components, or a composite material of rubber and conductive components, or a composite material of elastic plastic and conductive components. 如申請專利範圍第2項所述的觸控結構,其中,所述導電成分包括銀顆粒、銅顆粒、銀線、碳粉、石墨烯、碳納米管、3,4-乙烯二氧噻吩單體的聚合物、液態金屬、離子液體中的至少一種。The touch structure as described in item 2 of the patent application range, wherein the conductive component includes silver particles, copper particles, silver wires, carbon powder, graphene, carbon nanotubes, 3,4-ethylenedioxythiophene monomer At least one of polymers, liquid metals, and ionic liquids. 如申請專利範圍第1項所述的觸控結構,其中,所述觸控結構還包括電路板及設置於所述電路板上的觸控感測電路,所述觸控感測電路與所述觸控功能層電性連接。The touch structure according to item 1 of the patent application scope, wherein the touch structure further includes a circuit board and a touch sensing circuit provided on the circuit board, the touch sensing circuit and the The touch function layer is electrically connected. 如申請專利範圍第4項所述的觸控結構,其中,所述觸控功能層包括複數觸控單元,所述觸控結構還包括複數設於所述柔性基材上的連接走線,所述連接走線電性連接於對應的觸控單元與所述觸控感測電路之間。The touch structure as described in item 4 of the patent application range, wherein the touch function layer includes a plurality of touch units, and the touch structure further includes a plurality of connection traces provided on the flexible substrate. The connection trace is electrically connected between the corresponding touch unit and the touch sensing circuit. 如申請專利範圍第5項所述的觸控結構,其中,所述柔性基材包括主體及由所述主體一端延伸形成的延伸部,所述複數觸控單元設置於所述主體,所述連接走線的一端與對應的所述觸控單元電性連接,所述連接走線的另一端從所述主體延伸至所述延伸部並與所述觸控感測電路電性連接。The touch structure according to item 5 of the patent application scope, wherein the flexible substrate includes a main body and an extension portion formed by one end of the main body, the plurality of touch units are disposed on the main body, and the connection One end of the wiring is electrically connected to the corresponding touch unit, and the other end of the connection wiring extends from the main body to the extension portion and is electrically connected to the touch sensing circuit. 如申請專利範圍第6項所述的觸控結構,其中,所述主體與所述延伸部一體形成。The touch structure as described in item 6 of the patent application range, wherein the main body is formed integrally with the extension portion. 如申請專利範圍第6項所述的觸控結構,其中,所述主體包括功能區及鄰近所述功能區邊緣設置的連接區,所述複數觸控單元設置於所述功能區,所述連接走線的另一端從所述連接區延伸至所述延伸部。The touch structure according to item 6 of the patent application scope, wherein the main body includes a functional area and a connection area provided adjacent to an edge of the functional area, and the plurality of touch units are provided in the functional area, the connection The other end of the trace extends from the connection area to the extension. 如申請專利範圍第8項所述的觸控結構,其中,所述連接走線於所述連接區彎曲設置而形成第一緩衝部。The touch structure as recited in item 8 of the patent application range, wherein the connection trace is bent at the connection area to form a first buffer portion. 如申請專利範圍第8項所述的觸控結構,其中,所述連接走線於所述延伸部彎曲設置而形成第二緩衝部。The touch control structure as recited in item 8 of the patent application range, wherein the connection trace is bent at the extending portion to form a second buffer portion. 如申請專利範圍第5項所述的觸控結構,其中,所述觸控結構還包括電連接器,所述電連接器設於所述電路板上,所述觸控感測電路與所述電連接器電性相接,所述連接走線遠離所述觸控單元的一端為插接端,所述插接端插接於所述電連接器上使得所述觸控感測電路通過電連接器電性連接。The touch structure as described in item 5 of the patent application scope, wherein the touch structure further includes an electrical connector, the electrical connector is provided on the circuit board, the touch sensing circuit and the The electrical connectors are electrically connected, and the end of the connection trace away from the touch unit is a plug end, and the plug end is plugged on the electrical connector so that the touch sensing circuit passes electricity The connector is electrically connected. 如申請專利範圍第11項所述的觸控結構,其中,所述觸控結構還包括加強層,所述加強層設於所述柔性基材遠離所述觸控功能層的一側。The touch structure as recited in item 11 of the patent application range, wherein the touch structure further includes a reinforcement layer disposed on a side of the flexible substrate away from the touch function layer. 如申請專利範圍第5項所述的觸控結構,其中,所述連接走線在靠近所述柔性基材的外輪廓的區域彎曲設置。The touch control structure as described in item 5 of the patent application range, wherein the connection trace is bent in a region close to the outer contour of the flexible substrate. 如申請專利範圍第13項所述的觸控結構,其中,所述連接走線為振盪彎曲。The touch structure as recited in item 13 of the patent application range, wherein the connection trace is an oscillating bend. 如申請專利範圍第13項所述的觸控結構,其中,沿著朝向所述柔性基材的外輪廓的方向,所述連接走線形成複數交替分佈的波峰及波谷。The touch structure as described in item 13 of the patent application range, wherein the connecting traces form a plurality of alternating peaks and troughs along a direction toward the outer contour of the flexible substrate. 如申請專利範圍第13項所述的觸控結構,其中,所述連接走線在遠離所述柔性基材的外輪廓的區域亦彎曲設置。The touch structure as recited in item 13 of the patent application range, wherein the connection trace is also bent in an area away from the outer contour of the flexible substrate. 如申請專利範圍第1項所述的觸控結構,其中,所述柔性基材的製成材料包括熱塑性聚氨酯彈性體橡膠、碳基橡膠、矽橡膠、有機矽樹脂、大分子水凝膠中的至少一種。The touch structure as described in item 1 of the patent application range, wherein the flexible substrate is made of thermoplastic polyurethane elastomer rubber, carbon-based rubber, silicone rubber, silicone resin, macromolecular hydrogel At least one. 如申請專利範圍第1項所述的觸控結構,其中,所述柔性基材與所述彈性導電材料的拉伸彈性模量的數量級相同。The touch structure as described in item 1 of the patent application range, wherein the flexible substrate and the elastic conductive material have the same order of tensile modulus of elasticity. 如申請專利範圍第1項所述的觸控結構,其中,所述觸控結構還包括設於所述觸控功能層遠離所述柔性基材一側的柔性封裝層。The touch structure as recited in item 1 of the patent application range, wherein the touch structure further includes a flexible encapsulation layer disposed on a side of the touch function layer away from the flexible substrate. 如申請專利範圍第19項所述的觸控結構,其中,所述柔性封裝層的製成材料包括聚氨酯彈性樹脂、熱塑性聚氨酯彈性體橡膠膠膜中的至少一種。The touch control structure as described in Item 19 of the patent application range, wherein the material of the flexible encapsulation layer includes at least one of polyurethane elastic resin and thermoplastic polyurethane elastomer rubber film. 一種觸控裝置,其中,所述觸控裝置包括如申請專利範圍第1-20項任意一項所述的觸控結構。A touch control device, wherein the touch control device includes the touch control structure according to any one of items 1-20 of the patent application. 如申請專利範圍第21項所述的觸控裝置,其中,所述觸控裝置還包括柔性件,所述柔性件與所述觸控結構通過粘合層粘接。The touch device of claim 21, wherein the touch device further includes a flexible member, and the flexible member and the touch structure are adhered by an adhesive layer. 如申請專利範圍第22項所述的觸控裝置,其中,所述柔性基材包括主體及由所述主體一端延伸形成的延伸部,所述觸控功能層設置於所述主體上,所述延伸部包括複數凸起,相鄰的凸起之間形成間隙,所述延伸部與所述柔性件相鄰一側的凸起頂端通過粘合層與所述柔性件粘接。The touch device according to item 22 of the patent application scope, wherein the flexible substrate includes a main body and an extension portion extending from one end of the main body, the touch function layer is provided on the main body, the The extension portion includes a plurality of protrusions, a gap is formed between adjacent protrusions, and the top ends of the protrusions on the side of the extension portion adjacent to the flexible member are bonded to the flexible member through an adhesive layer. 如申請專利範圍第23項所述的觸控裝置,其中,所述粘合層為非連續分佈,所述粘合層在相鄰二凸起之間斷開。The touch device as described in item 23 of the patent application range, wherein the adhesive layer is distributed discontinuously, and the adhesive layer is broken between two adjacent protrusions. 如申請專利範圍第22項所述的觸控裝置,其中,所述柔性件、所述粘合層、所述柔性基材、所述彈性導電材料的拉伸彈性模量的數量級相同。The touch device as described in item 22 of the patent application range, wherein the flexible member, the adhesive layer, the flexible substrate, and the elastic conductive material have the same order of tensile modulus of elasticity. 如申請專利範圍第22項所述的觸控裝置,其中,所述柔性件由彈性紡織材料製成,所述觸控裝置為可穿戴設備。The touch device as described in item 22 of the patent application range, wherein the flexible member is made of an elastic textile material, and the touch device is a wearable device.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113078274A (en) * 2021-03-22 2021-07-06 江苏集萃有机光电技术研究所有限公司 OLED device, preparation method and OLED display device
TWI788776B (en) * 2021-02-02 2023-01-01 大陸商業成科技(成都)有限公司 Touch device and manufacture method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI788776B (en) * 2021-02-02 2023-01-01 大陸商業成科技(成都)有限公司 Touch device and manufacture method thereof
CN113078274A (en) * 2021-03-22 2021-07-06 江苏集萃有机光电技术研究所有限公司 OLED device, preparation method and OLED display device
CN113078274B (en) * 2021-03-22 2022-06-17 江苏集萃有机光电技术研究所有限公司 OLED device, preparation method and OLED display device

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