WO2020077484A1 - Touch structure and touch device - Google Patents

Touch structure and touch device Download PDF

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Publication number
WO2020077484A1
WO2020077484A1 PCT/CN2018/110195 CN2018110195W WO2020077484A1 WO 2020077484 A1 WO2020077484 A1 WO 2020077484A1 CN 2018110195 W CN2018110195 W CN 2018110195W WO 2020077484 A1 WO2020077484 A1 WO 2020077484A1
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WO
WIPO (PCT)
Prior art keywords
touch
flexible substrate
structure according
control structure
connection
Prior art date
Application number
PCT/CN2018/110195
Other languages
French (fr)
Chinese (zh)
Inventor
朱林
李贺
胡康军
张瑶
雷晓华
何传熙
陈靖
Original Assignee
深圳柔显系统技术有限公司
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳柔显系统技术有限公司, 深圳市柔宇科技有限公司 filed Critical 深圳柔显系统技术有限公司
Priority to PCT/CN2018/110195 priority Critical patent/WO2020077484A1/en
Priority to CN201880003058.8A priority patent/CN109643196A/en
Priority to CN201920185064.1U priority patent/CN209560511U/en
Publication of WO2020077484A1 publication Critical patent/WO2020077484A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display

Definitions

  • the invention relates to the field of touch technology, in particular to a touch structure and a touch device.
  • ITO Indium-Tin Oxide
  • embodiments of the present invention disclose a touch structure and a touch device that are not easily broken after stretching.
  • a touch control structure includes a flexible substrate and a touch function layer disposed on the flexible substrate, the touch function layer is made of an elastic conductive material.
  • a touch control device includes the touch control structure as described above.
  • the touch conductive layer is formed on the flexible substrate by the elastic conductive material, which can improve the flexibility and stretch resistance of the touch functional layer and reduce the touch function The possibility of the layer breaking due to stretching.
  • the laminated structure of the touch structure is simple, which is conducive to the development of thin and light touch devices.
  • FIG. 1 is a schematic structural diagram of a touch structure provided by an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a first buffer portion of the touch structure shown in FIG. 1 connected to a trace.
  • FIG. 3 is a schematic diagram of the first buffer portion of the connection trace in an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of a partial area of the touch structure shown in FIG. 1.
  • FIG. 5 is an exploded schematic diagram of a touch structure in an embodiment of the invention.
  • FIG. 6 is a schematic structural diagram of a touch device provided by an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a partial area of a touch device provided by an embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of a touch structure 10 according to an embodiment of the present invention.
  • the touch control structure 10 includes a flexible substrate 11 and a touch function layer 12 disposed on the flexible substrate 11.
  • the touch function layer 12 is made of an elastic conductive material.
  • the flexible base material 11 is made of thermoplastic polyurethane elastomers (TPU). It can be understood that the flexible substrate 11 can also be made of other flexible materials, so that the flexible substrate 11 can be bent and stretched, such as carbon-based rubber (such as latex, butadiene rubber, ethylene propylene rubber, nitrile rubber, etc.) , Silicone rubber, silicone resin (such as polydimethylsiloxane (PDMS)), SEBS (hydrogenated styrene-butadiene copolymer), EcoFlex (butylene adipate-terephthalic acid At least one of butylene glycol ester copolymer) and elastic hydrogel.
  • TPU thermoplastic polyurethane elastomers
  • the elastic conductive material is a composite material of resin and conductive components.
  • the elastic conductive material is a stretchable conductive mixed system, wherein the resin is a continuous phase and is stretchable, that is, the resin has elasticity, and the conductive component is a dispersed phase, capable of conducting electricity.
  • the touch function layer 12 made of the elastic conductive material can be bent and stretched.
  • the conductive components include silver particles, copper particles, silver wires, copper wires, carbon powder, graphene, carbon nanotubes, PEDOT (polymer of EDOT (3,4-ethylenedioxythiophene monomer)), liquid metal, At least one of ionic liquids.
  • the resin and conductive components can be uniformly and stably mixed, and the solid content can meet the impedance requirements of the printed circuit, so that the elastic conductive material can form the touch-control layer 12 with excellent conductivity.
  • the elastic conductive material may be a composite material of rubber and conductive components.
  • the elastic conductive material may also be a composite material of elastic plastic and conductive components.
  • the conductive component and the resin are taken, and then an appropriate amount of solvent is added and mixed to form the elastic conductive material.
  • the volume ratio of the resin and the conductive component is (1/8) to (1/3 ),
  • the elastic conductive material is printed on the surface of the flexible substrate 11 by means of screen printing, transfer, embossing, inkjet printing, 3D printing, sputtering and the like. It can be understood that the ratio of the resin and the conductive component is not limited, and the elastic conductive material made by mixing the resin and the conductive component can be stretchable and conductive.
  • the mixing system may be heat-treated, and at the same time, a ball mill or a planetary mixer may be used to disperse the system to make the system mixing more uniform, and an elastic conductive material with good performance may be obtained.
  • the touch function layer 12 By forming the touch function layer 12 on the flexible substrate 11 through the elastic conductive material, the flexibility and stretch resistance of the touch function layer 12 can be improved, and the possibility of the touch function layer 12 breaking can be reduced.
  • the laminated structure of the touch structure 10 is simple, which is conducive to the development of light and thin touch devices with the touch structure 10.
  • the touch structure 10 further includes a circuit board 14, a touch sensing circuit 15 and a plurality of connecting traces 16.
  • the touch sensing circuit 15 includes at least a touch chip.
  • the touch sensing circuit 15 and its peripheral circuits are integrated on the circuit board 14.
  • the circuit board 14 is a printed circuit board, and the touch sensing circuit 15 is packaged on the circuit board 14 by way of chip on board (COB). Since the touch sensing circuit 15 is packaged on the circuit board 14 instead of the flexible substrate 11, the flexible substrate 11 can be prevented from being affected by the temperature and pressure during the packaging process, thereby protecting the flexible substrate 11 from damage.
  • COB chip on board
  • the existing FPC flexible circuit board
  • the flexible substrate 11 is a stretchable material
  • the existing FPC is not used as the medium connecting the flexible substrate 11 and the circuit board 14, or the FPC is used as the bonding area of the chip, but the flexible substrate 11 is directly connected to the circuit board 14.
  • the touch function layer 12 is electrically connected to the touch sensing circuit 15 through the connection trace 16.
  • the flexible substrate 11 further includes a main body 113 and an extension 115 integrally formed by one end of the main body 113.
  • the main body 113 includes a functional area 1131 and a connection area 1133 disposed around the functional area 1131.
  • the extension 115 is provided adjacent to the circuit board 14. In this embodiment, the body 113 and the extension 115 are formed integrally.
  • the touch function layer 12 is graphically arranged in the function area 1131 of the main body 113 for sensing the touch position.
  • the touch function layer 12 includes a plurality of touch units 121 arranged in an array.
  • the touch unit 121 has a substantially strip-shaped structure to improve the tensile resistance of the touch unit 121.
  • connection traces 16 are arranged on the flexible substrate 11 at intervals.
  • each connection trace 16 is electrically connected between a touch unit 121 and the touch sensing circuit 15.
  • connection trace 16 is electrically connected between the touch sensing circuit 15 and the touch unit 121, so as to realize the electrical connection between the touch unit 121 and the touch sensing circuit 15.
  • the connection trace 16 includes a first buffer portion 161 formed in the connection area 1133 and a second buffer portion 163 formed in the extension portion 115.
  • One end of the first buffer portion 161 is electrically connected to the corresponding touch unit 121, and the other end of the first buffer portion 161 extends toward the extension portion 115 to form a second buffer portion 163.
  • the structure of the first buffering portion 161 is a curved structure bent in the connection area 1133 to buffer the stress generated when the touch structure 10 is stretched, reducing the possibility of the connection trace 16 being broken and the possibility of sudden resistance change Sex.
  • the structure of the first buffer portion 161 is a wavy line structure.
  • FIG. 1 the structure of the first buffer portion 161 is a wavy line structure.
  • the structure of the first buffer portion 161 is a broken line structure.
  • the structure of the first buffer portion 161 is a trigonometric curve structure. It can be understood that in an embodiment, the structure of the first buffer portion 161 may include a polyline structure, a wavy line structure, and a trigonometric function curve structure, that is, the structure of the first buffer portion 161 may include a polyline structure, a wavy line structure, and a trigonometric function curve At least one of the structures.
  • FIG. 4 is a schematic cross-sectional view of a partial area of the touch structure 10 provided by this embodiment.
  • the extending portion 115 is substantially wavy, folded, or pleated in a curved shape, so that there is a certain elastic deformation space along the extending direction of the extending portion 115.
  • the extending portion 115 includes a plurality of protrusions 1151, and a gap is formed between adjacent protrusions 1151 to buffer the stress generated when the touch structure 10 is stretched.
  • the second buffer portion 163 is a curved structure, which is used to buffer the stress generated when the touch structure 10 is stretched, so as to reduce the possibility of the connection trace 16 being broken and the possibility of sudden resistance change.
  • the structure of the second buffer portion 163 is at least one of a polyline structure, a wavy line structure, and a trigonometric curve structure.
  • the curved structure of the second buffer portion 163 may be closely attached to the curved surface of the extending portion 115 to form a curved structure consistent with the curved surface of the extending portion 115, that is, the bending of the extending portion 115 from the cross section of FIG.
  • the bending width and angle of the curved structure of the surface and the second buffer portion 163 are the same, and both are curved in the vertical direction.
  • the curved structure of the second buffer portion 163 may be formed on the surface of the extending portion 115 to be curved along the left and right sides or the front and rear sides of the extending portion 115, or include both of the above-mentioned curved structures.
  • connection trace 16 is bent in a region near the outer contour of the flexible substrate 11.
  • the connecting trace 16 is oscillated and bent.
  • the oscillating bending forms a plurality of alternately distributed peaks and troughs of the connecting trace 16.
  • the connecting trace 16 forms a plurality of alternating peaks and troughs.
  • the connection trace 16 is also bent in an area away from the outer contour of the flexible substrate 11.
  • the touch control structure 10 further includes an electrical connector 17.
  • the electrical connector 17 is disposed on the circuit board 14 and electrically connected to the touch sensing circuit 15.
  • An end of the second buffer portion 163 away from the touch function layer 12 forms a pin 1631.
  • the plug end 1631 is plugged on the electrical connector 17, so as to realize the electrical connection between the touch sensing circuit 15 and the touch function layer 12.
  • the electrical connector 17 includes a connection end (not shown) provided corresponding to the plug end 1631. Since the touch structure 10 is connected to the electrical connector 17 through the plug end 1631 of the connection trace 16, the connection trace 16 of the touch structure 10 can realize the touch sensing circuit 15 and the touch without binding The electrical connection between the functional layers 12 simplifies the assembly process of the touch structure 10, and at the same time prevents the flexible substrate 11 from being damaged due to high temperature during binding, improving the product yield.
  • the impact of the circuit board 14 when the touch structure 10 is stretched can be buffered, the possibility of the circuit board 14 being damaged is reduced, and the plug-in end 1631 can also be reduced The possibility of the control structure 10 being disengaged from the electrical connector 17 when being stretched, thereby ensuring the performance of the touch structure 10.
  • the bent extension 115 can buffer the tensile force of the touch structure 10 on the plug end 1631 when being stretched to avoid the tensile force received by the plug end 1631 Too large and damaged.
  • the number of the connection ends corresponds to the number of the plug ends 1631, and the distance between the connection ends is set according to the number of channels and the connection traces 16.
  • the height of the connection end is confirmed according to the thickness of the stacked structure.
  • the electrical connection between the insertion end 1631 and the insertion end of the connection end can be selected as the upper connection type or the lower connection type.
  • the locking method between the plug-in end 1631 and the connection end can be selected from the plug-in type or the flip-up type.
  • connection method of the touch sensing circuit 15 and the circuit board 14 is not limited.
  • the circuit board 14 may be a flexible circuit board, and the touch sensing circuit 15 is provided by a chip on film (Chip On Flex, COF) method.
  • the second buffer portion 163 on the flexible substrate 11 is bonded to the circuit board 14 by binding to realize the electrical connection between the touch sensing circuit 15 and the touch function layer 12. Since the second buffer portion 163 and the touch sensing circuit 15 are bound and joined on the circuit board 14, the flexible substrate 11 is prevented from being affected by high temperature and pressure during the binding process, thereby protecting the flexible substrate 11 from damage.
  • the touch control structure 10 further includes a reinforcement layer 18.
  • the reinforcing layer 18 is disposed on the side of the flexible substrate 11 away from the touch function layer 12 and on the opposite sides to the second buffer portion 163.
  • the reinforcement layer 18 is located on the extension 115 and is adjacent to the circuit board 14.
  • the reinforcing layer 18 can provide support for the flexible substrate 11, enhance the strength of the flexible substrate 11, and facilitate the insertion of the plug end 1631 on the electrical connector 17. It can be understood that the reinforcement layer 18 may be provided only in a part of the area where the extension 115 is adjacent to the circuit board 14, and the reinforcement layer 18 may also cover the entire area of the extension 115.
  • the reinforcing layer 18 is made of polypropylene (PP).
  • the material of the reinforcement layer 18 may be other materials.
  • the material of the reinforcement layer 18 includes PP, polyvinyl chloride (Polyvinyl chloride, PVC), polyimide (Polyimide, PI), At least one of polyphenylene sulfide (Phenylene Sulphide, PPS), epoxy resin board, phenolic resin board, resin fiber board, steel sheet, ceramic sheet, quartz sheet.
  • the touch structure 10 further includes a flexible encapsulation layer 19 disposed on the side of the touch function layer 12 away from the flexible substrate 11 for encapsulating and protecting the touch function layer 12 .
  • the touch function layer 12 is located between the flexible encapsulation layer 19 and the flexible substrate 11.
  • the flexible encapsulation layer 19 is made of stretchable resin or stretchable film material. When the flexible encapsulation layer 19 is made of a stretchable resin, it can be prepared on the flexible substrate 11 by coating, spraying, chemical deposition, etc. and cover the touch function layer 12.
  • the flexible encapsulation layer 19 When the flexible encapsulation layer 19 is made of a stretchable film material, the flexible encapsulation layer 19 can be prepared on the flexible substrate 11 and cover the touch function layer 12 by means of hot pressing, blow molding, injection molding, or the like.
  • the material of the flexible encapsulation layer 19 includes at least one of polyurethane elastic resin and TPU adhesive film.
  • the tensile modulus of elasticity of the flexible substrate 11, the touch function layer 12 and the flexible encapsulation layer 19 are of the same order, and the mechanical properties are matched to avoid the stretching process of the touch structure 10 Phenomenon such as delamination and peeling are easy to occur, resulting in the failure of the touch structure 10.
  • the present invention also provides a touch device 100 including the touch structure 10, the adhesive layer 70 and the flexible member 80 as described above.
  • the flexible member 80 and the touch control structure 10 are bonded together by an adhesive layer 70.
  • the adhesive layer 70 is optical glue.
  • the adhesive layer 70 may be other adhesive layers, for example, the adhesive layer 70 may be at least one of hot melt adhesive, double-sided adhesive, optical adhesive, and liquid adhesive; the touch structure 10 and the flexible member 80
  • the bonding method may be hot-melt adhesive hot-press bonding, double-sided adhesive, optical adhesive bonding, and liquid adhesive bonding.
  • the extension 115 and the adhesive layer 70 are bonded to the flexible member 80 at the top 1155 of the protrusion 1151 and the flexible member 80 through the adhesive layer 70.
  • the tip 1155 of the protrusion 1151 on the side of the extension 115 adjacent to the flexible member 80 is bonded to the flexible member 80, and the other parts are separated from the flexible member 80 so that the extension 115 is in a folded state with the flexible member 80 It is fixed and adhered together to prevent the plug end or the circuit board 14 from being pulled by the extension 115 when the touch device 100 is stretched.
  • the position of the adhesive layer 70 corresponding to the extension 115 may also be a discrete distribution (non-continuous distribution). Please refer to FIG.
  • the adhesive layer 70 is only provided at the position of the protrusion 1151 corresponding to the extension 115. There is no distribution between the positions 1151, and the adhesive layer 70 is broken between two adjacent protrusions 1151. The discretely distributed adhesive layer 70 further helps to improve the tensile resistance of the adhesive layer 70.
  • the extension 115 can be folded along the stretching direction 700.
  • the materials of the flexible member 80, the adhesive layer 70, and the layers of the touch structure 10 have the same order of tensile modulus of elasticity, so that the mechanical properties of the layers can be matched to avoid the touch device During the stretching process of 100, delamination, peeling and other phenomena are prone to occur, resulting in the failure of the touch device 100.
  • the flexible member 80 is made of an elastic textile material, and the touch device 100 is a wearable device, such as clothes. In other embodiments, the flexible member 80 may also be other materials, such as leather and other materials with certain flexibility.
  • the touch conductive layer 12 is formed on the flexible substrate 11 by the elastic conductive material, which can improve the flexibility and stretch resistance of the touch functional layer 12 To reduce the possibility of the touch function layer 12 breaking due to bending and stretching.
  • the laminated structure of the touch structure 10 is simple, which is conducive to the development of the thin and thin touch device 100.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)
  • Push-Button Switches (AREA)

Abstract

A touch structure (10), comprising a flexible substrate (11) and a touch functional layer (12) provided on the flexible substrate (11), the touch functional layer (12) being made of an elastic conductive material. Formation of the touch functional layer (12) on the flexible substrate (11) by means of the elastic conductive material improves the flexibility and stretching resistance capability of the touch functional layer (12), and reduces the possibility that the touch functional layer (12) breaks due to bending and stretching. Further provided is a touch device (100).

Description

触控结构及触控装置Touch structure and touch device 技术领域Technical field
本发明涉及触控技术领域,尤其涉及一种触控结构及触控装置。The invention relates to the field of touch technology, in particular to a touch structure and a touch device.
背景技术Background technique
现有的电子装置通常设触控结构以提供触控输入功能。触控结构中的触控电极通常由氧化铟锡(Indium-Tin Oxide,ITO)材料制成。由于氧化铟锡材料的机械硬度高,在拉伸电极之后容易发生断裂,影响使用。Existing electronic devices usually have a touch structure to provide a touch input function. The touch electrodes in the touch structure are usually made of Indium-Tin Oxide (ITO) material. Due to the high mechanical hardness of indium tin oxide material, it is easy to break after stretching the electrode, which affects the use.
发明内容Summary of the invention
为解决上述问题,本发明实施例公开一种拉伸后不容易断裂的触控结构及触控装置。In order to solve the above problems, embodiments of the present invention disclose a touch structure and a touch device that are not easily broken after stretching.
一种触控结构,包括柔性基材及设置于所述柔性基材上的触控功能层,所述触控功能层由弹性导电材料制成。A touch control structure includes a flexible substrate and a touch function layer disposed on the flexible substrate, the touch function layer is made of an elastic conductive material.
一种触控装置,包括如上所述的触控结构。A touch control device includes the touch control structure as described above.
本发明提供的触控结构及触控装置,通过所述弹性导电材料在所述柔性基材上形成触控功能层,能够提高触控功能层的柔韧性能及耐拉伸能力,减少触控功能层因拉伸断裂的可能性。另外,触控结构的叠层结构简单,有利于触控装置的轻薄化发展。In the touch structure and touch device provided by the present invention, the touch conductive layer is formed on the flexible substrate by the elastic conductive material, which can improve the flexibility and stretch resistance of the touch functional layer and reduce the touch function The possibility of the layer breaking due to stretching. In addition, the laminated structure of the touch structure is simple, which is conducive to the development of thin and light touch devices.
附图说明BRIEF DESCRIPTION
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly explain the technical solutions in the embodiments of the present invention, the drawings required in the embodiments will be briefly described below. Obviously, the drawings in the following description are only some embodiments of the present invention. Those of ordinary skill in the art can obtain other drawings based on these drawings without creative work.
图1为本发明一实施方式提供的一种触控结构的结构示意图。FIG. 1 is a schematic structural diagram of a touch structure provided by an embodiment of the present invention.
图2为图1所示的触控结构的连接走线的第一缓冲部的示意图。FIG. 2 is a schematic diagram of a first buffer portion of the touch structure shown in FIG. 1 connected to a trace.
图3为本发明一实施方式中的连接走线的第一缓冲部的示意图。FIG. 3 is a schematic diagram of the first buffer portion of the connection trace in an embodiment of the present invention.
图4为图1所示的触控结构的部分区域的剖面示意图。4 is a schematic cross-sectional view of a partial area of the touch structure shown in FIG. 1.
图5为本发明一实施方式中的触控结构的分解示意图。FIG. 5 is an exploded schematic diagram of a touch structure in an embodiment of the invention.
图6为本发明一实施方式提供的触控装置的结构示意图。6 is a schematic structural diagram of a touch device provided by an embodiment of the present invention.
图7为本发明一实施方式提供的触控装置的部分区域示意图。7 is a schematic diagram of a partial area of a touch device provided by an embodiment of the present invention.
具体实施方式detailed description
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.
请参阅图1,图1为本发明一实施例提供的一种触控结构10的结构示意图。触控结构10包括柔性基材11及设置于柔性基材11上的触控功能层12,触控功能层12由弹性导电材料制成。Please refer to FIG. 1, which is a schematic structural diagram of a touch structure 10 according to an embodiment of the present invention. The touch control structure 10 includes a flexible substrate 11 and a touch function layer 12 disposed on the flexible substrate 11. The touch function layer 12 is made of an elastic conductive material.
本实施方式中,柔性基材11的制成材料为热塑性聚氨酯弹性体橡胶(Thermoplastic polyurethanes,TPU)。可以理解,柔性基材11还可以由其他柔性材料制成,使得柔性基材11可弯折、可拉伸,例如碳基橡胶(如乳胶、顺丁橡胶、乙丙橡胶、丁腈橡胶等)、硅橡胶、有机硅树脂(如聚二甲基硅氧烷(polydimethylsiloxane,PDMS))、SEBS(氢化苯乙烯-丁二烯共聚物)、EcoFlex(己二酸丁二醇酯-对苯二甲酸丁二醇酯共聚物)、弹性水凝胶中的至少一种。所述弹性导电材料为树脂与导电成分的复合材料。所述弹性导电材料为可拉伸导电混合体系,其中,所述树脂为连续相,可拉伸,即所述树脂具弹性,而导电成分为分散相,能够进行导电。所述弹性导电材料制成的触控功能层12可弯折、可拉伸。所述导电成分包括银颗粒、铜颗粒、银线、铜线、碳粉、石墨烯、碳纳米管、PEDOT(EDOT(3,4-乙烯二氧噻吩单体)的聚合物)、液态金属、离子液体中的至少一种。树脂与导电成分(如导电颗粒)可均匀、稳定地混合,并且固含量能达到印刷电路的阻抗要求,使得弹性导电材料可形成导电性优良的触控功能层12。在一些实施方式中,所述弹性导电材料可以为橡 胶与导电成分的复合材料。在一些实施方式中,所述弹性导电材料也可以为弹性塑料与导电成分的复合材料。In this embodiment, the flexible base material 11 is made of thermoplastic polyurethane elastomers (TPU). It can be understood that the flexible substrate 11 can also be made of other flexible materials, so that the flexible substrate 11 can be bent and stretched, such as carbon-based rubber (such as latex, butadiene rubber, ethylene propylene rubber, nitrile rubber, etc.) , Silicone rubber, silicone resin (such as polydimethylsiloxane (PDMS)), SEBS (hydrogenated styrene-butadiene copolymer), EcoFlex (butylene adipate-terephthalic acid At least one of butylene glycol ester copolymer) and elastic hydrogel. The elastic conductive material is a composite material of resin and conductive components. The elastic conductive material is a stretchable conductive mixed system, wherein the resin is a continuous phase and is stretchable, that is, the resin has elasticity, and the conductive component is a dispersed phase, capable of conducting electricity. The touch function layer 12 made of the elastic conductive material can be bent and stretched. The conductive components include silver particles, copper particles, silver wires, copper wires, carbon powder, graphene, carbon nanotubes, PEDOT (polymer of EDOT (3,4-ethylenedioxythiophene monomer)), liquid metal, At least one of ionic liquids. The resin and conductive components (such as conductive particles) can be uniformly and stably mixed, and the solid content can meet the impedance requirements of the printed circuit, so that the elastic conductive material can form the touch-control layer 12 with excellent conductivity. In some embodiments, the elastic conductive material may be a composite material of rubber and conductive components. In some embodiments, the elastic conductive material may also be a composite material of elastic plastic and conductive components.
本实施方式中,取导电成分与树脂,然后加入适量溶剂进行混合搅拌形成所述弹性导电材料,所述树脂与所述导电成分的体积配比比例范围为(1/8)~(1/3),将所述弹性导电材料通过丝印、转印、压印、喷墨打印、3D打印、溅射等方式印刷于柔性基材11的表面上。可以理解,不限定所述树脂与所述导电成分的配比比例,所述树脂与所述导电成分混合制成的弹性导电材料能够可拉伸及导电即可。优选的,所述导电成分与树脂进行混合时可对混合体系进行加热处理,同时使用球磨机或行星搅拌机对体系进行分散,使体系混合更加均匀,能够得到性能良好的弹性导电材料。In this embodiment, the conductive component and the resin are taken, and then an appropriate amount of solvent is added and mixed to form the elastic conductive material. The volume ratio of the resin and the conductive component is (1/8) to (1/3 ), The elastic conductive material is printed on the surface of the flexible substrate 11 by means of screen printing, transfer, embossing, inkjet printing, 3D printing, sputtering and the like. It can be understood that the ratio of the resin and the conductive component is not limited, and the elastic conductive material made by mixing the resin and the conductive component can be stretchable and conductive. Preferably, when the conductive component and the resin are mixed, the mixing system may be heat-treated, and at the same time, a ball mill or a planetary mixer may be used to disperse the system to make the system mixing more uniform, and an elastic conductive material with good performance may be obtained.
通过所述弹性导电材料在柔性基材11上形成触控功能层12,能够提高触控功能层12的柔韧性能及耐拉伸能力,减少触控功能层12断裂的可能性。另外,触控结构10的叠层结构简单,有利于具触控结构10的触控装置的轻薄化发展。By forming the touch function layer 12 on the flexible substrate 11 through the elastic conductive material, the flexibility and stretch resistance of the touch function layer 12 can be improved, and the possibility of the touch function layer 12 breaking can be reduced. In addition, the laminated structure of the touch structure 10 is simple, which is conducive to the development of light and thin touch devices with the touch structure 10.
具体的,触控结构10还包括电路板14、触控感测电路15及多个连接走线16。触控感测电路15至少包括触控芯片。触控感测电路15及其外围电路集成于电路板14上。本实施方式中,电路板14为印刷电路板,触控感测电路15通过板上芯片封装(Chips on Board,COB)的方式封装于电路板14上。由于将触控感测电路15封装在电路板14上而非在柔性基材11上,可以避免柔性基材11受到封装过程中的温度及压力的影响,进而保护柔性基材11不受到损坏。并且,由于现有的FPC(柔性电路板)为非可拉伸材料,而柔性基材11为可拉伸材料,如直接采用现有的FPC绑定(bonding)于柔性基材上将由于二者的拉伸特性不一致而容易发生损坏的情况。因此,本实施例也没有采用现有的FPC作为连接柔性基材11与电路板14的介质,或者是将FPC作为芯片的绑定区域,而是直接将柔性基材11与电路板14连接。Specifically, the touch structure 10 further includes a circuit board 14, a touch sensing circuit 15 and a plurality of connecting traces 16. The touch sensing circuit 15 includes at least a touch chip. The touch sensing circuit 15 and its peripheral circuits are integrated on the circuit board 14. In this embodiment, the circuit board 14 is a printed circuit board, and the touch sensing circuit 15 is packaged on the circuit board 14 by way of chip on board (COB). Since the touch sensing circuit 15 is packaged on the circuit board 14 instead of the flexible substrate 11, the flexible substrate 11 can be prevented from being affected by the temperature and pressure during the packaging process, thereby protecting the flexible substrate 11 from damage. Moreover, since the existing FPC (flexible circuit board) is a non-stretchable material, and the flexible substrate 11 is a stretchable material, if the existing FPC is directly bonded to the flexible substrate, it will be due to the two The tensile properties of the person are inconsistent and damage may occur easily. Therefore, in this embodiment, the existing FPC is not used as the medium connecting the flexible substrate 11 and the circuit board 14, or the FPC is used as the bonding area of the chip, but the flexible substrate 11 is directly connected to the circuit board 14.
触控功能层12通过连接走线16与触控感测电路15电性连接。The touch function layer 12 is electrically connected to the touch sensing circuit 15 through the connection trace 16.
柔性基材11还包括主体113及由主体113一端一体延伸形成的延伸部115。主体113包括功能区1131及绕功能区1131设置的连接区1133。延伸部115与电路板14相邻设置。本实施方式中,主体113与延伸部115一体形成。The flexible substrate 11 further includes a main body 113 and an extension 115 integrally formed by one end of the main body 113. The main body 113 includes a functional area 1131 and a connection area 1133 disposed around the functional area 1131. The extension 115 is provided adjacent to the circuit board 14. In this embodiment, the body 113 and the extension 115 are formed integrally.
触控功能层12图形化设置于主体113的功能区1131,用于感应触摸位置。触控功能层12包括多个呈阵列设置的触控单元121。触控单元121大致呈带状结构,以提高触控单元121的耐拉伸能力。The touch function layer 12 is graphically arranged in the function area 1131 of the main body 113 for sensing the touch position. The touch function layer 12 includes a plurality of touch units 121 arranged in an array. The touch unit 121 has a substantially strip-shaped structure to improve the tensile resistance of the touch unit 121.
多个连接走线16间隔设置于柔性基材11上。本实施方式中,每个连接走线16电性连接于一触控单元121与触控感测电路15之间。A plurality of connection traces 16 are arranged on the flexible substrate 11 at intervals. In this embodiment, each connection trace 16 is electrically connected between a touch unit 121 and the touch sensing circuit 15.
连接走线16电性连接于触控感测电路15及触控单元121之间,从而实现触控单元121与触控感测电路15的电性连接。The connection trace 16 is electrically connected between the touch sensing circuit 15 and the touch unit 121, so as to realize the electrical connection between the touch unit 121 and the touch sensing circuit 15.
连接走线16包括形成于连接区1133的第一缓冲部161及形成于延伸部115的第二缓冲部163。第一缓冲部161一端与对应的触控单元121电性连接,第一缓冲部161的另一端向延伸部115延伸形成第二缓冲部163。第一缓冲部161的结构为弯曲设置于连接区1133的弯曲结构,用于缓冲触控结构10拉伸时产生的应力,降低连接走线16被拉断的可能性以及出现阻值突变的可能性。例如,在一实施方式中,请参阅图2,第一缓冲部161的结构为波浪线结构。又例如,在一实施方式中,请参阅图3,第一缓冲部161的结构为折线结构。在一实施方式中,第一缓冲部161的结构为三角函数曲线结构。可以理解,在一实施方式中,第一缓冲部161的结构可以包括折线结构、波浪线结构、三角函数曲线结构,即第一缓冲部161的结构可以包括折线结构、波浪线结构、三角函数曲线结构中的至少一种。The connection trace 16 includes a first buffer portion 161 formed in the connection area 1133 and a second buffer portion 163 formed in the extension portion 115. One end of the first buffer portion 161 is electrically connected to the corresponding touch unit 121, and the other end of the first buffer portion 161 extends toward the extension portion 115 to form a second buffer portion 163. The structure of the first buffering portion 161 is a curved structure bent in the connection area 1133 to buffer the stress generated when the touch structure 10 is stretched, reducing the possibility of the connection trace 16 being broken and the possibility of sudden resistance change Sex. For example, in one embodiment, please refer to FIG. 2, the structure of the first buffer portion 161 is a wavy line structure. For another example, in an embodiment, please refer to FIG. 3, the structure of the first buffer portion 161 is a broken line structure. In one embodiment, the structure of the first buffer portion 161 is a trigonometric curve structure. It can be understood that in an embodiment, the structure of the first buffer portion 161 may include a polyline structure, a wavy line structure, and a trigonometric function curve structure, that is, the structure of the first buffer portion 161 may include a polyline structure, a wavy line structure, and a trigonometric function curve At least one of the structures.
第二缓冲部163远离触控单元121的一端与触控感测电路15电性连接。请结合参阅图4,图4为本实施方式提供的触控结构10的部分区域的剖面示意图。延伸部115大致呈波浪形、折叠形或褶皱形的弯曲状,使得沿延伸部115的延伸方向具有一定的弹性形变空间。延伸部115包括多个凸起1151,相邻的凸起1151之间形成间隙,用于缓冲触控结构10拉伸时产生的应力。第二缓冲部163为弯曲结构,用于缓冲触控结构10拉伸时产生的应力,降低连接走线16被拉断的可能性以及出现阻值突变的可能性。例如,第二缓冲部163的结构为折线结构、波浪线结构、三角函数曲线结构中的至少一种。进一步地,第二缓冲部163的弯曲结构可以是紧贴在延伸部115的弯曲的表面上而形成与延伸部115弯曲表面一致的弯曲结构,即从图4的截面来看延伸部115的弯曲表面与第二缓冲部163的弯曲结构弯曲幅度及角度均相同,且均是沿上下方向 弯曲。当然,第二缓冲部163的弯曲结构也可以是形成在延伸部115表面沿着延伸部115左右两侧或前后两侧弯曲,或者同时包含上述两种弯曲结构。The end of the second buffer portion 163 away from the touch unit 121 is electrically connected to the touch sensing circuit 15. Please refer to FIG. 4, which is a schematic cross-sectional view of a partial area of the touch structure 10 provided by this embodiment. The extending portion 115 is substantially wavy, folded, or pleated in a curved shape, so that there is a certain elastic deformation space along the extending direction of the extending portion 115. The extending portion 115 includes a plurality of protrusions 1151, and a gap is formed between adjacent protrusions 1151 to buffer the stress generated when the touch structure 10 is stretched. The second buffer portion 163 is a curved structure, which is used to buffer the stress generated when the touch structure 10 is stretched, so as to reduce the possibility of the connection trace 16 being broken and the possibility of sudden resistance change. For example, the structure of the second buffer portion 163 is at least one of a polyline structure, a wavy line structure, and a trigonometric curve structure. Further, the curved structure of the second buffer portion 163 may be closely attached to the curved surface of the extending portion 115 to form a curved structure consistent with the curved surface of the extending portion 115, that is, the bending of the extending portion 115 from the cross section of FIG. 4 The bending width and angle of the curved structure of the surface and the second buffer portion 163 are the same, and both are curved in the vertical direction. Of course, the curved structure of the second buffer portion 163 may be formed on the surface of the extending portion 115 to be curved along the left and right sides or the front and rear sides of the extending portion 115, or include both of the above-mentioned curved structures.
在一实施例中,所述连接走线16在靠近所述柔性基材11的外轮廓的区域弯曲设置。所述连接走线16为振荡弯曲。所述振荡弯曲为所述连接走线16形成多个交替分布的波峰及波谷。沿着朝向所述柔性基材11的外轮廓的方向,所述连接走线16形成多个交替分布的波峰及波谷。所述连接走线16在远离所述柔性基材11的外轮廓的区域也弯曲设置。In an embodiment, the connection trace 16 is bent in a region near the outer contour of the flexible substrate 11. The connecting trace 16 is oscillated and bent. The oscillating bending forms a plurality of alternately distributed peaks and troughs of the connecting trace 16. Along the direction toward the outer contour of the flexible substrate 11, the connecting trace 16 forms a plurality of alternating peaks and troughs. The connection trace 16 is also bent in an area away from the outer contour of the flexible substrate 11.
触控结构10还包括电连接器17。电连接器17设置于电路板14上并与触控感测电路15电性连接。第二缓冲部163远离触控功能层12的一端形成插接端(PIN)1631。插接端1631插接于电连接器17上,从而实现触控感测电路15与触控功能层12之间的电性连接。The touch control structure 10 further includes an electrical connector 17. The electrical connector 17 is disposed on the circuit board 14 and electrically connected to the touch sensing circuit 15. An end of the second buffer portion 163 away from the touch function layer 12 forms a pin 1631. The plug end 1631 is plugged on the electrical connector 17, so as to realize the electrical connection between the touch sensing circuit 15 and the touch function layer 12.
电连接器17包括对应插接端1631设置的连接端(图未示)。由于触控结构10通过连接走线16的插接端1631插接于电连接器17上,使得触控结构10的连接走线16无需通过绑定即可实现触控感测电路15与触控功能层12之间的电性连接,简化了触控结构10的组装制程,同时避免柔性基材11在绑定中因高温被损坏,提高了产品良率。此外,由于延伸部115的凸起1151之间形成间隙,能够缓冲触控结构10拉伸时电路板14受到的冲击,降低电路板14被损坏的可能性,亦能减少插接端1631因触控结构10在拉伸时而脱离电连接器17的可能性,从而确保触控结构10的性能。换句话说,由于插接端1631不能承受拉伸作用,弯曲的延伸部115能够缓冲触控结构10在拉伸时对插接端1631的拉伸力,避免插接端1631受到的拉伸力过大而损坏的情况。The electrical connector 17 includes a connection end (not shown) provided corresponding to the plug end 1631. Since the touch structure 10 is connected to the electrical connector 17 through the plug end 1631 of the connection trace 16, the connection trace 16 of the touch structure 10 can realize the touch sensing circuit 15 and the touch without binding The electrical connection between the functional layers 12 simplifies the assembly process of the touch structure 10, and at the same time prevents the flexible substrate 11 from being damaged due to high temperature during binding, improving the product yield. In addition, due to the gap formed between the protrusions 1151 of the extending portion 115, the impact of the circuit board 14 when the touch structure 10 is stretched can be buffered, the possibility of the circuit board 14 being damaged is reduced, and the plug-in end 1631 can also be reduced The possibility of the control structure 10 being disengaged from the electrical connector 17 when being stretched, thereby ensuring the performance of the touch structure 10. In other words, since the plug end 1631 cannot withstand the stretching action, the bent extension 115 can buffer the tensile force of the touch structure 10 on the plug end 1631 when being stretched to avoid the tensile force received by the plug end 1631 Too large and damaged.
本实施方式中,所述连接端的数量对应插接端1631的数量,所述连接端之间的间距根据通道数量和连接走线16进行设置。所述连接端设置的高度根据叠构厚度确认,插接端1631与所述连接端的插接处的接电可选择上接式或下接式。插接端1631与所述连接端之间的锁扣方式可选择直插式或掀盖式。In this embodiment, the number of the connection ends corresponds to the number of the plug ends 1631, and the distance between the connection ends is set according to the number of channels and the connection traces 16. The height of the connection end is confirmed according to the thickness of the stacked structure. The electrical connection between the insertion end 1631 and the insertion end of the connection end can be selected as the upper connection type or the lower connection type. The locking method between the plug-in end 1631 and the connection end can be selected from the plug-in type or the flip-up type.
可以理解,对触控感测电路15与电路板14的连接方式不作限定,例如,电路板14可为柔性电路板,触控感测电路15通过覆晶薄膜(Chip On Flex,COF)方式设于电路板14上,柔性基材11上的第二缓冲部163通过绑定的方式与电路板14接合于一起,实现触控感测电路15与触控功能层12的电性连接。由 于第二缓冲部163与触控感测电路15在电路板14上绑定接合,避免柔性基材11在绑定过程中受到高温及压力的影响,进而保护柔性基材11不受到损坏。It can be understood that the connection method of the touch sensing circuit 15 and the circuit board 14 is not limited. For example, the circuit board 14 may be a flexible circuit board, and the touch sensing circuit 15 is provided by a chip on film (Chip On Flex, COF) method. On the circuit board 14, the second buffer portion 163 on the flexible substrate 11 is bonded to the circuit board 14 by binding to realize the electrical connection between the touch sensing circuit 15 and the touch function layer 12. Since the second buffer portion 163 and the touch sensing circuit 15 are bound and joined on the circuit board 14, the flexible substrate 11 is prevented from being affected by high temperature and pressure during the binding process, thereby protecting the flexible substrate 11 from damage.
触控结构10还包括加强层18。加强层18设于柔性基材11远离触控功能层12的一侧,并与第二缓冲部163位于相反的两侧。加强层18位于延伸部115上并与电路板14相邻设置。加强层18能够提供柔性基材11支撑,增强柔性基材11的强度,方便插接端1631插接于电连接器17上。可以理解,加强层18可以仅设置于延伸部115与电路板14相邻的部分区域,加强层18亦可以覆盖延伸部115的整个区域。本实施方式中,加强层18的制成材料为聚丙烯(polypropylene,PP)。在其他实施方式中,加强层18的制成材料可以为其他材料,例如,加强层18的制成材料包括PP、聚氯乙烯(Polyvinyl chloride,PVC)、聚酰亚胺(Polyimide,PI)、聚苯硫醚(Phenylene sulfide,PPS)、环氧树脂板、酚醛树脂板、树脂纤维板、钢片、陶瓷片、石英片中的至少一种。The touch control structure 10 further includes a reinforcement layer 18. The reinforcing layer 18 is disposed on the side of the flexible substrate 11 away from the touch function layer 12 and on the opposite sides to the second buffer portion 163. The reinforcement layer 18 is located on the extension 115 and is adjacent to the circuit board 14. The reinforcing layer 18 can provide support for the flexible substrate 11, enhance the strength of the flexible substrate 11, and facilitate the insertion of the plug end 1631 on the electrical connector 17. It can be understood that the reinforcement layer 18 may be provided only in a part of the area where the extension 115 is adjacent to the circuit board 14, and the reinforcement layer 18 may also cover the entire area of the extension 115. In this embodiment, the reinforcing layer 18 is made of polypropylene (PP). In other embodiments, the material of the reinforcement layer 18 may be other materials. For example, the material of the reinforcement layer 18 includes PP, polyvinyl chloride (Polyvinyl chloride, PVC), polyimide (Polyimide, PI), At least one of polyphenylene sulfide (Phenylene Sulphide, PPS), epoxy resin board, phenolic resin board, resin fiber board, steel sheet, ceramic sheet, quartz sheet.
请参阅图5,在一实施方式中,触控结构10还包括设于所述触控功能层12远离柔性基材11一侧的柔性封装层19,用于对触控功能层12进行封装保护。触控功能层12位于柔性封装层19与柔性基材11之间。柔性封装层19由可拉伸树脂或可拉伸膜材制成。柔性封装层19由可拉伸树脂制成时,可通过涂布、喷涂、化学沉积等方式制备于柔性基材11上并覆盖触控功能层12。柔性封装层19由可拉伸膜材制成时,柔性封装层19可通过热压、吹压、注塑等方式制备于柔性基材11上并覆盖触控功能层12。柔性封装层19的制成材料包括聚氨酯弹性树脂、TPU胶膜中的至少一种。Please refer to FIG. 5. In one embodiment, the touch structure 10 further includes a flexible encapsulation layer 19 disposed on the side of the touch function layer 12 away from the flexible substrate 11 for encapsulating and protecting the touch function layer 12 . The touch function layer 12 is located between the flexible encapsulation layer 19 and the flexible substrate 11. The flexible encapsulation layer 19 is made of stretchable resin or stretchable film material. When the flexible encapsulation layer 19 is made of a stretchable resin, it can be prepared on the flexible substrate 11 by coating, spraying, chemical deposition, etc. and cover the touch function layer 12. When the flexible encapsulation layer 19 is made of a stretchable film material, the flexible encapsulation layer 19 can be prepared on the flexible substrate 11 and cover the touch function layer 12 by means of hot pressing, blow molding, injection molding, or the like. The material of the flexible encapsulation layer 19 includes at least one of polyurethane elastic resin and TPU adhesive film.
本实施方式中,柔性基材11、触控功能层12及柔性封装层19的拉伸弹性模量的数量级相同,实现力学性能上具有匹配性,以避免在触控结构10的拉伸过程中容易出现脱层、剥离等现象,导致触控结构10失效。In this embodiment, the tensile modulus of elasticity of the flexible substrate 11, the touch function layer 12 and the flexible encapsulation layer 19 are of the same order, and the mechanical properties are matched to avoid the stretching process of the touch structure 10 Phenomenon such as delamination and peeling are easy to occur, resulting in the failure of the touch structure 10.
请参阅图6,本发明还提供一种触控装置100,包括如上所述的触控结构10、粘合层70及柔性件80。柔性件80与触控结构10通过粘合层70粘接于一起。本实施方式中,粘合层70为光学胶。其他实施方式中,粘合层70可以为其他胶层,例如粘合层70可以为热熔胶、双面胶、光学胶、液体胶中的至少一种;触控结构10与柔性件80的贴合方法可以是热熔胶热压贴合、双面胶、光学胶粘合、液体胶粘合。Referring to FIG. 6, the present invention also provides a touch device 100 including the touch structure 10, the adhesive layer 70 and the flexible member 80 as described above. The flexible member 80 and the touch control structure 10 are bonded together by an adhesive layer 70. In this embodiment, the adhesive layer 70 is optical glue. In other embodiments, the adhesive layer 70 may be other adhesive layers, for example, the adhesive layer 70 may be at least one of hot melt adhesive, double-sided adhesive, optical adhesive, and liquid adhesive; the touch structure 10 and the flexible member 80 The bonding method may be hot-melt adhesive hot-press bonding, double-sided adhesive, optical adhesive bonding, and liquid adhesive bonding.
延伸部115与粘合层70在凸起1151的顶端1155与柔性件80通过粘合层70粘合于一起。换句话说,延伸部115与柔性件80相邻一侧的凸起1151的顶端1155与柔性件80粘接,其他部分则与柔性件80隔开,使得延伸部115以折叠状态与柔性件80固定粘合于一起,避免插接端或电路板14在触控装置100拉伸时被延伸部115拉扯。进一步地,粘合层70在对应延伸部115的位置也可为离散型分布(非连续分布),请参阅图7,即粘合层70仅设在对应延伸部115的凸起1151位置,凸起1151之间的位置则未有分布,粘合层70在相邻二凸起1151之间断开。此种离散型分布的粘合层70更有助于提升粘合层70的抗拉伸性能。延伸部115可沿拉伸方向700进行折叠。The extension 115 and the adhesive layer 70 are bonded to the flexible member 80 at the top 1155 of the protrusion 1151 and the flexible member 80 through the adhesive layer 70. In other words, the tip 1155 of the protrusion 1151 on the side of the extension 115 adjacent to the flexible member 80 is bonded to the flexible member 80, and the other parts are separated from the flexible member 80 so that the extension 115 is in a folded state with the flexible member 80 It is fixed and adhered together to prevent the plug end or the circuit board 14 from being pulled by the extension 115 when the touch device 100 is stretched. Further, the position of the adhesive layer 70 corresponding to the extension 115 may also be a discrete distribution (non-continuous distribution). Please refer to FIG. 7, that is, the adhesive layer 70 is only provided at the position of the protrusion 1151 corresponding to the extension 115. There is no distribution between the positions 1151, and the adhesive layer 70 is broken between two adjacent protrusions 1151. The discretely distributed adhesive layer 70 further helps to improve the tensile resistance of the adhesive layer 70. The extension 115 can be folded along the stretching direction 700.
本实施方式中,柔性件80、粘合层70及触控结构10的各层制成材料的拉伸弹性模量的数量级相同,使各层在力学性能上能够匹配,以避免在触控装置100的拉伸过程中容易出现脱层、剥离等现象,导致触控装置100失效。柔性件80由弹性纺织材料制成,所述触控装置100为可穿戴设备,例如衣服。其他实施方式中,柔性件80还可以为其他材料,例如皮革等具一定柔韧性的材料。In this embodiment, the materials of the flexible member 80, the adhesive layer 70, and the layers of the touch structure 10 have the same order of tensile modulus of elasticity, so that the mechanical properties of the layers can be matched to avoid the touch device During the stretching process of 100, delamination, peeling and other phenomena are prone to occur, resulting in the failure of the touch device 100. The flexible member 80 is made of an elastic textile material, and the touch device 100 is a wearable device, such as clothes. In other embodiments, the flexible member 80 may also be other materials, such as leather and other materials with certain flexibility.
本发明提供的触控结构10及触控装置100,通过所述弹性导电材料在所述柔性基材11上形成触控功能层12,能够提高触控功能层12的柔韧性能及耐拉伸能力,减少触控功能层12因弯折拉伸而断裂的可能性。另外,触控结构10的叠层结构简单,有利于触控装置100的轻薄化发展。In the touch structure 10 and the touch device 100 provided by the present invention, the touch conductive layer 12 is formed on the flexible substrate 11 by the elastic conductive material, which can improve the flexibility and stretch resistance of the touch functional layer 12 To reduce the possibility of the touch function layer 12 breaking due to bending and stretching. In addition, the laminated structure of the touch structure 10 is simple, which is conducive to the development of the thin and thin touch device 100.
以上所述是本发明的优选实施例,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明的保护范围。The above is a preferred embodiment of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principles of the present invention, several improvements and retouches can be made. These improvements and retouches are also regarded as This is the protection scope of the present invention.

Claims (26)

  1. 一种触控结构,其特征在于,所述触控结构包括柔性基材及设置于所述柔性基材上的触控功能层,所述触控功能层由弹性导电材料制成。A touch control structure, characterized in that the touch control structure includes a flexible substrate and a touch function layer disposed on the flexible substrate, the touch function layer is made of an elastic conductive material.
  2. 如权利要求1所述的触控结构,其特征在于,所述弹性导电材料为树脂与导电成分的复合材料,或者橡胶与导电成分的复合材料,或者弹性塑料与导电成分的复合材料。The touch control structure according to claim 1, wherein the elastic conductive material is a composite material of resin and conductive components, or a composite material of rubber and conductive components, or a composite material of elastic plastic and conductive components.
  3. 如权利要求2所述的触控结构,其特征在于,所述导电成分包括银颗粒、铜颗粒、银线、碳粉、石墨烯、碳纳米管、3,4-乙烯二氧噻吩单体的聚合物、液态金属、离子液体中的至少一种。The touch control structure according to claim 2, wherein the conductive component comprises silver particles, copper particles, silver wires, carbon powder, graphene, carbon nanotubes, 3,4-ethylenedioxythiophene monomer At least one of polymer, liquid metal, and ionic liquid.
  4. 如权利要求1所述的触控结构,其特征在于,所述触控结构还包括电路板及设置于所述电路板上的触控感测电路,所述触控感测电路与所述触控功能层电性连接。The touch structure according to claim 1, wherein the touch structure further comprises a circuit board and a touch sensing circuit provided on the circuit board, the touch sensing circuit and the touch The control function layer is electrically connected.
  5. 如权利要求4所述的触控结构,其特征在于,所述触控功能层包括多个触控单元,所述触控结构还包括多个设于所述柔性基材上的连接走线,所述连接走线电性连接于对应的触控单元与所述触控感测电路之间。The touch structure according to claim 4, wherein the touch function layer comprises a plurality of touch units, and the touch structure further comprises a plurality of connection traces provided on the flexible substrate, The connecting trace is electrically connected between the corresponding touch unit and the touch sensing circuit.
  6. 如权利要求5所述的触控结构,其特征在于,所述柔性基材包括主体及由所述主体一端延伸形成的延伸部,所述多个触控单元设置于所述主体,所述连接走线的一端与对应的所述触控单元电性连接,所述连接走线的另一端从所述主体延伸至所述延伸部并与所述触控感测电路电性连接。The touch control structure according to claim 5, wherein the flexible substrate includes a main body and an extension portion formed by one end of the main body, the plurality of touch units are disposed on the main body, and the connection One end of the wiring is electrically connected to the corresponding touch unit, and the other end of the connection wiring extends from the main body to the extension portion and is electrically connected to the touch sensing circuit.
  7. 如权利要求6所述的触控结构,其特征在于,所述主体与所述延伸部一体形成。The touch control structure according to claim 6, wherein the main body and the extending portion are integrally formed.
  8. 如权利要求6所述的触控结构,其特征在于,所述主体包括功能区及邻近所述功能区边缘设置的连接区,所述多个触控单元设置于所述功能区,所述连接走线的另一端从所述连接区延伸至所述延伸部。The touch structure according to claim 6, wherein the main body includes a functional area and a connection area disposed adjacent to an edge of the functional area, the plurality of touch units are disposed in the functional area, and the connection The other end of the trace extends from the connection area to the extension.
  9. 如权利要求8所述的触控结构,其特征在于,所述连接走线于所述连接区弯曲设置而形成第一缓冲部。The touch control structure according to claim 8, wherein the connection trace is bent at the connection area to form a first buffer portion.
  10. 如权利要求8所述的触控结构,其特征在于,所述连接走线于所述延伸部弯曲设置而形成第二缓冲部。The touch control structure according to claim 8, wherein the connection trace is bent at the extending portion to form a second buffer portion.
  11. 如权利要求5所述的触控结构,其特征在于,所述触控结构还包括电连接器,所述电连接器设于所述电路板上,所述触控感测电路与所述电连接器电性相接,所述连接走线远离所述触控单元的一端为插接端,所述插接端插接于所述电连接器上使得所述触控感测电路通过电连接器电性连接。The touch control structure according to claim 5, wherein the touch control structure further comprises an electrical connector, the electrical connector is provided on the circuit board, the touch sensing circuit and the electrical The connectors are electrically connected, and the end of the connection trace away from the touch unit is a plug-in end, and the plug-in end is plugged into the electrical connector so that the touch sensing circuit is electrically connected The device is electrically connected.
  12. 如权利要求11所述的触控结构,其特征在于,所述触控结构还包括加强层,所述加强层设于所述柔性基材远离所述触控功能层的一侧。The touch structure of claim 11, wherein the touch structure further comprises a reinforcement layer, the reinforcement layer is disposed on a side of the flexible substrate away from the touch function layer.
  13. 如权利要求5所述的触控结构,其特征在于,所述连接走线在靠近所述柔性基材的外轮廓的区域弯曲设置。The touch control structure according to claim 5, wherein the connection trace is bent in a region close to the outer contour of the flexible substrate.
  14. 如权利要求13所述的触控结构,其特征在于,所述连接走线为振荡弯曲。The touch control structure according to claim 13, wherein the connection trace is an oscillating bend.
  15. 如权利要求13所述的触控结构,其特征在于,沿着朝向所述柔性基材的外轮廓的方向,所述连接走线形成多个交替分布的波峰及波谷。The touch control structure according to claim 13, wherein the connecting traces form a plurality of alternately distributed peaks and troughs along a direction toward the outer contour of the flexible substrate.
  16. 如权利要求13所述的触控结构,其特征在于,所述连接走线在远离所述柔性基材的外轮廓的区域也弯曲设置。The touch control structure according to claim 13, wherein the connection trace is also bent in an area away from the outer contour of the flexible substrate.
  17. 如权利要求1所述的触控结构,其特征在于,所述柔性基材的制成材料包括热塑性聚氨酯弹性体橡胶、碳基橡胶、硅橡胶、有机硅树脂、大分子水凝胶中的至少一种。The touch control structure according to claim 1, wherein the material of the flexible substrate comprises at least one of thermoplastic polyurethane elastomer rubber, carbon-based rubber, silicone rubber, silicone resin, macromolecular hydrogel One kind.
  18. 如权利要求1所述的触控结构,其特征在于,所述柔性基材与所述弹性导电材料的拉伸弹性模量的数量级相同。The touch control structure according to claim 1, wherein the flexible substrate and the elastic conductive material have the same order of tensile modulus of elasticity.
  19. 如权利要求1所述的触控结构,其特征在于,所述触控结构还包括设于所述触控功能层远离所述柔性基材一侧的柔性封装层。The touch structure as claimed in claim 1, wherein the touch structure further comprises a flexible encapsulation layer disposed on a side of the touch function layer away from the flexible substrate.
  20. 如权利要求19所述的触控结构,其特征在于,所述柔性封装层的制成材料包括聚氨酯弹性树脂、热塑性聚氨酯弹性体橡胶胶膜中的至少一种。The touch control structure of claim 19, wherein the material of the flexible encapsulation layer comprises at least one of polyurethane elastic resin and thermoplastic polyurethane elastomer rubber film.
  21. 一种触控装置,其特征在于,所述触控装置包括如权利要求1-20项任意一项所述的触控结构。A touch device, characterized in that the touch device comprises the touch structure according to any one of claims 1-20.
  22. 如权利要求21所述的触控装置,其特征在于,所述触控装置还包括柔性件,所述柔性件与所述触控结构通过粘合层粘接。The touch device according to claim 21, wherein the touch device further comprises a flexible member, and the flexible member and the touch structure are adhered by an adhesive layer.
  23. 如权利要求22所述的触控装置,其特征在于,所述柔性基材包括主体及由所述主体一端延伸形成的延伸部,所述触控功能层设置于所述主体上,所述延伸部包括多个凸起,相邻的凸起之间形成间隙,所述延伸部与所述柔性件相邻一侧的凸起顶端通过粘合层与所述柔性件粘接。The touch device as claimed in claim 22, wherein the flexible substrate includes a main body and an extension portion extending from one end of the main body, the touch function layer is disposed on the main body, the extension The portion includes a plurality of protrusions, a gap is formed between adjacent protrusions, and the top end of the protrusion on the side of the extension portion adjacent to the flexible member is bonded to the flexible member through an adhesive layer.
  24. 如权利要求23所述的触控装置,其特征在于,所述粘合层为非连续分布,所述粘合层在相邻二凸起之间断开。The touch device according to claim 23, wherein the adhesive layer is distributed discontinuously, and the adhesive layer is broken between two adjacent protrusions.
  25. 如权利要求22所述的触控装置,其特征在于,所述柔性件、所述粘合 层、所述柔性基材、所述弹性导电材料的拉伸弹性模量的数量级相同。The touch device of claim 22, wherein the flexible member, the adhesive layer, the flexible substrate, and the elastic conductive material have the same order of tensile modulus of elasticity.
  26. 如权利要求22所述的触控装置,其特征在于,所述柔性件由弹性纺织材料制成,所述触控装置为可穿戴设备。The touch device according to claim 22, wherein the flexible member is made of an elastic textile material, and the touch device is a wearable device.
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