TW202016519A - Air flow heat conduction measurement system - Google Patents
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本發明係關於一種量測系統,尤指一種氣體對流熱傳導量測系統。The invention relates to a measurement system, in particular to a gas convection heat conduction measurement system.
熱式流量感測器主要是由加熱元件(heater)及溫度感測元件(temperature sensor)所組成之感測器,其中,熱式流量感測器用於量測時,需要透過加熱元件藉由外部之驅動電流對溫度感測元件進行加熱,而流體之流動會帶走溫度感測元件的熱量,造成溫度感測元件溫度的改變或加熱功率的變化,而可測量流體的流速或流量之感測器。The thermal 流量 sensor is mainly composed of a heating element (heater) and a temperature 度 temperature sensing element (temperature sensor). Among them, when the thermal flow sensor is used for measurement, it needs to pass through the heating element through the external The driving current heats the temperature sensing element, and the movement of the body will take away the heat of the temperature sensing element, causing a change in the temperature of the temperature sensing element or a change in the heating power, which can measure the speed of the body or the speed of the body. Device.
然而,於熱式流量感測器量測流體時,需要透過加熱元件長時間對溫度感測元件加熱,由於溫度感測元件需要長時間被加熱使用,便會使得溫度感測元件產生老化、電阻飄移等情形,而影響量測精準度,所以熱式流量感測器需要定時定期之校正參數,以確保量測精準度,但是即便時常性之校正參數,仍存在溫度感測元件隨著使用而逐漸老化之問題,因此,依然無法增加熱式流量感測器之使用壽命。However, when the thermal flow sensor measures the fluid, the temperature sensing element needs to be heated through the heating element for a long time. Since the temperature sensing element needs to be heated for a long time, the temperature sensing element will cause aging and resistance Drift and other conditions affect the measurement accuracy, so thermal flow sensors need regular calibration parameters to ensure measurement accuracy, but even with frequent calibration parameters, there are still temperature sensing elements with the use of The problem of gradual aging, therefore, it is still impossible to increase the service life of the thermal flow sensor.
為解決上述課題,本發明提供一種氣體對流熱傳導量測系統,透過狀態切換模組控制熱電元件進行加熱或偵測狀態,熱電元件,藉以降低額外設置加熱器之成本、確保偵測之精準度、縮小晶片面積及提高製造良率。In order to solve the above-mentioned problems, the present invention provides a gas convection heat conduction measurement system, which controls the thermoelectric element to heat or detect the state through the state switching module. The thermoelectric element can reduce the cost of additional heaters, ensure the accuracy of detection, Reduce wafer area and increase manufacturing yield.
本發明之一項實施例提供一種氣體對流熱傳導量測系統,其包含:一微機電感測模組,其具有一基板及設於基板之一熱電元件;一狀態切換模組,其耦接於熱電元件;以及一中央處理模組,其與熱電元件及狀態切換模組耦接,中央處理模組輸出一操控訊號至狀態切換模組,狀態切換模組根據操控訊號控制熱電元件為一加熱狀態或一偵測狀態,於加熱狀態時,對熱電元件進行加熱;於偵測狀態時,熱電元件進行氣體熱傳導之偵測,以產生一溫度變化訊號,中央處理模組接收溫度變化訊號。An embodiment of the present invention provides a gas convection heat conduction measurement system, which includes: a microcomputer inductive measurement module having a substrate and a thermoelectric element disposed on the substrate; a state switching module coupled to Thermoelectric element; and a central processing module, which is coupled to the thermoelectric element and the state switching module, the central processing module outputs a control signal to the state switching module, and the state switching module controls the thermoelectric element to a heating state according to the control signal Or a detection state, in the heating state, the thermoelectric element is heated; in the detection state, the thermoelectric element detects gas heat conduction to generate a temperature change signal, and the central processing module receives the temperature change signal.
於其中一項實施例中,本發明更具有一放大器,其耦接於熱電元件與資料擷取單元間,放大器用以放大溫度變化訊號。In one of the embodiments, the present invention further has an amplifier coupled between the thermoelectric element and the data acquisition unit. The amplifier is used to amplify the temperature change signal.
於其中一項實施例中,放大器具有一正相連接端及一負相連接端,熱電元件具有一第一端以及一第二端,正相連接端耦接於第二端,負相連接端耦接於狀態切換模組,第一端耦接於一參考電源端。In one embodiment, the amplifier has a positive terminal and a negative terminal, the thermoelectric element has a first terminal and a second terminal, the positive terminal is coupled to the second terminal, and the negative terminal It is coupled to the state switching module, and the first terminal is coupled to a reference power terminal.
於其中一項實施例中,狀態切換模組更具有一延遲狀態,延遲狀態處於偵測狀態之後。In one of the embodiments, the state switching module further has a delay state, and the delay state is after the detection state.
藉由上述,本發明透過狀態切換模組控制熱電元件進行加熱或偵測狀態,藉由以短時間加熱方式再進行偵測;藉此,以確保偵測之精準度。Through the above, the present invention controls the thermoelectric element to heat or detect the state through the state switching module, and then performs the detection by heating in a short time; thereby, ensuring the accuracy of detection.
再者,本發明無須額外設置加熱器,僅需透過狀態切換模組控制熱電元件進行加熱或偵測狀態;藉此,能夠有效降低系統成本,而且能夠縮小晶片面積及提高製造良率。Furthermore, the present invention does not require additional heaters, and only needs to control the thermoelectric elements through the state switching module to heat or detect the state; thereby, the system cost can be effectively reduced, and the chip area can be reduced and the manufacturing yield can be improved.
另外,本發明之放大器能夠作為訊號放大處理,以及控制熱電元件狀態之雙重功效。In addition, the amplifier of the present invention can be used for signal amplification and dual functions of controlling the status of thermoelectric elements.
此外,本發明控制熱電元件於偵側狀態後先處於延遲狀態,用以避免熱電元件在不穩定狀態下,接續後續加熱狀態,令熱電元件產生不穩定之溫度變化訊號;藉此,能夠避免熱電元件輸出雜訊,影響接續之偵測精準度,進而提升本發明偵測之訊號雜訊比。In addition, the invention controls the thermoelectric element to be in a delayed state after detecting the side state, so as to prevent the thermoelectric element from being in an unstable state and continuing the subsequent heating state, so that the thermoelectric element generates an unstable temperature change signal; thereby, the thermoelectric element can be avoided The component outputs noise, which affects the detection accuracy of the connection, thereby improving the signal-to-noise ratio detected by the present invention.
為便於說明本發明於上述發明內容一欄中所表示的中心思想,茲以具體實施例表達。實施例中各種不同物件係按適於說明之比例、尺寸、變形量或位移量而描繪,而非按實際元件的比例予以繪製,合先敘明。In order to facilitate the description of the central idea of the present invention in the column of the above summary of the invention, it is expressed in a specific embodiment. In the embodiments, various objects are drawn according to the proportion, size, deformation or displacement suitable for description, rather than drawn according to the proportion of actual elements, which will be described first.
請參閱圖1至圖10所示,本發明提供一種氣體對流熱傳導量測系統100,其包含:Please refer to FIG. 1 to FIG. 10, the present invention provides a gas convection heat
一微機電感測模組10,其具有一基板11及設於基板11一側面上之一熱電元件12,熱電元件12具有一第一端121以及一第二端122,第一端121耦接於一參考電源端1,其中,參考電源端1係用以提供電壓訊號至熱電元件12,而參考電源端1提供之電壓訊號大於0伏特;於本發明實施例中,基板11係矽(silicon);熱電元件12係熱電堆(thermopile);參考電源端1提供3.3伏特。A microcomputer
熱電元件12具有複數熱電單元123,各熱電單元123概呈扇形狀,其中,各熱電單元123具有相反設置之一第一面123a與一第二面123b以及相反設置之一第一側123c及一第二側123d,各熱電單元123之第一面123a朝向基板11,如圖3所示。The
再者,微機電感測模組10更具有一絕緣構件13,絕緣構件13設於基板11上,並使熱電元件12藉由絕緣構件13與基板11隔離;更進一步說明,絕緣構件13包覆各熱電單元123之第一面123a、第二面123b、第一側123c及第二側123d,其中,相鄰兩熱電單元123間具有一蝕刻孔131,如圖1所示。絕緣構件13對應各熱電單元123之第一側123c穿設有複數穿孔132,各穿孔132能夠提供氣體進入,提高氣體交換率並提高感測的靈敏度;於本發明實施例中,絕緣構件13係二氧化矽(SiO2
)。Furthermore, the microcomputer inductance measuring
一狀態切換模組20,其耦接於熱電元件12,其中,如圖9所示,狀態切換模組20能夠直接與熱電元件12電連接;或是如圖10所示,狀態切換模組20與熱電元件12間電連接電子元件,例如:狀態切換模組20與熱電元件12間電連接電阻與電容,詳細架構於後續說明。A
一中央處理模組30,其與熱電元件12及狀態切換模組20耦接,中央處理模組30具有一資料擷取單元31,其中,中央處理模組30能夠輸出一操控訊號至狀態切換模組20,狀態切換模組20根據操控訊號控制熱電元件12為一加熱狀態或一偵測狀態;熱電元件12於加熱狀態時,對熱電元件12進行加熱;熱電元件12於偵測狀態時,熱電元件12進行氣體熱傳導之偵測,以產生一溫度變化訊號,資料擷取單元31接收處理溫度變化訊號,以產生一溫度變化資訊於;本發明實施例中,操控訊號為電壓訊號;溫度變化訊號為類比電壓訊號。A
中央處理模組30更具有一時間控制單元32,時間控制單元32設有一加熱時間Th、一穩態時間Ts及一讀取時間Tm,操控訊號根據加熱時間Th決定熱電元件12呈加熱狀態之時段長度;操控訊號根據穩態時間Ts與讀取時間Tm決定熱電元件12呈偵測狀態之時段長度;於本發明實施例中,加熱時間Th之時段長度大於穩態時間Ts之時段長度,穩態時間Ts之時段長度小於讀取時間Tm之時段長度,讀取時間Tm之時段長度大於加熱時間Th之時段長度,如圖5及圖7所示;而穩態時間Ts之目的在於避免由加熱狀態轉換成偵測狀態時,訊號震盪不穩定所造成之影響。The
再者,狀態切換模組20更具有一延遲狀態,延遲狀態處於偵測狀態之後,而時間控制單元32更具有一延遲時間To,延遲時間To對應於延遲狀態,延遲時間To晚於讀取時間Tm,其中,操控訊號根據延遲時間To決定熱電元件12呈延遲狀態之時段長度,於本發明實施例中,延遲時間To之時段長度大於穩態時間Ts之時段長度,延遲時間To之時段長度小於讀取時間Tm之時段長度,延遲時間To之時段長度小於加熱時間Th之時段長度;如圖6及圖8所示。需說明的是,延遲時間To的設置,讓熱電元件12繼續散逸熱量,藉以避免熱電元件12輸出雜訊,影響接續之偵測精準度的問題。Furthermore, the
一放大器40,其耦接於熱電元件12與中央處理模組30之資料擷取單元31間,放大器40用以放大溫度變化訊號,或是用以搭配中央處理模組30及狀態切換模組20控制熱電元件12之狀態,其中,放大器40具有一輸入端41及一輸出端42。An
請參閱圖7至圖9所示,熱電元件12之第一端121耦接於參考電源端1,熱電元件12之第二端122與狀態切換模組20耦接,放大器40之輸入端41與熱電元件12耦接,放大器40之輸出端42與中央處理模組30間耦接濾波器2及類比數位轉換器3;於本發明實施例中,濾波器2係低通濾波器(RC Filter)。Please refer to FIG. 7 to FIG. 9, the
當中央處理模組30給予狀態切換模組20的操控訊號之數位電壓為0時,熱電元件12之第一端121與第二端122分別接收不同電壓,而電壓差會使熱電元件12呈加熱狀態,其中,操控訊號會根據時間控制單元32所設定加熱時間Th決定熱電元件12呈加熱狀態之時段長度。When the digital voltage of the control signal given to the
當中央處理模組30給予狀態切換模組20的操控訊號之數位電壓為1時,而熱電元件12之第一端121與第二端122間沒有產生電壓差,而會使熱電元件12呈偵測狀態,於偵測狀態時中央處理模組30之操控訊號,會根據時間控制單元32所設定之穩態時間Ts與讀取時間Tm決定熱電元件12呈偵測狀態之時段長度。When the digital voltage of the control signal given to the
接著,操控訊號會對應於讀取時間Tm,而所產生之溫度變化訊號會輸入至放大器40,透過放大器40進行放大處理,再將放大後之溫度變化訊號由放大器40之輸出端42傳送至濾波器2,由濾波器2將溫度變化訊號進行雜訊過濾,並經由類比數位轉換器3處理進入中央處理模組30,由中央處理模組30之資料擷取單元31處理分析產生溫度變化資訊。Then, the control signal will correspond to the reading time Tm, and the generated temperature change signal will be input to the
請參閱圖10係本發明電路實施例示意圖,放大器40之輸入端41分別具有一正相連接端411及一負相連接端412,正相連接端411耦接於熱電元件12之第二端122,負相連接端412耦接於狀態切換模組20,熱電元件12之第一端121耦接於參考電源端1。10 is a schematic diagram of an embodiment of the circuit of the present invention. The
當中央處理模組30給予狀態切換模組20的操控訊號之數位電壓為0時,熱電元件12之第一端121與第二端122分別接收不同電壓,而放大器40不會產生虛短路,且藉由電壓差使熱電元件12呈加熱狀態。When the digital voltage of the control signal given by the
當中央處理模組30給予狀態切換模組20的操控訊號之數位電壓為1時,而熱電元件12之第一端121與第二端122間沒有產生電壓差,而放大器40會產生虛短路,會使熱電元件12呈偵測狀態,放大器40能夠接收熱電元件12所產生之溫度變化訊號,且透過放大器40進行放大處理,以及濾波器2將溫度變化訊號進行雜訊過濾,並經由類比數位轉換器3處理進入中央處理模組30,由中央處理模組30之資料擷取單元31處理分析產生溫度變化資訊。When the digital voltage of the control signal given by the
需特別說明的是,本發明於資料擷取單元31處理分析產生溫度變化資訊後,中央處理模組30之操控訊號能夠直接控制熱電元件12回至加熱狀態,如圖5及圖7所示;或是於資料擷取單元31處理分析產生溫度變化資訊後,中央處理模組30之操控訊號先控制熱電元件12處於延遲狀態,經過延遲狀態令熱電元件12呈穩定狀態後,再控制熱電元件12至加熱狀態,如圖6及圖8所示。It should be particularly noted that in the present invention, after the
綜合上述,本發明具有以下功效:In summary, the present invention has the following effects:
一、本發明氣體對流熱傳導量測系統100透過狀態切換模組20控制熱電元件12進行加熱或偵測狀態,藉由以短時間加熱方式再進行偵測;藉此,以確保偵測之精準度。1. The gas convection heat
二、本發明氣體對流熱傳導量測系統100無須額外設置加熱器,僅需透過狀態切換模組20控制熱電元件12進行加熱或偵測狀態;藉此,能夠有效降本發明低系統成本,而且能夠縮小晶片面積及提高製造良率。2. The gas convective heat
三、本發明之放大器40能夠作為訊號放大處理,以及控制熱電元件12狀態之雙重功效。3. The
四、本發明氣體對流熱傳導量測系統100能夠控制熱電元件12於偵側狀態後先處於延遲狀態;藉此,能夠避免熱電元件12於不穩定狀態下接續加熱狀態,因而影響偵測精準度,進而提升本發明偵測之訊號雜訊比。4. The gas convection heat
以上所舉實施例僅用以說明本發明而已,非用以限制本發明之範圍。舉凡不違本發明精神所從事的種種修改或變化,俱屬本發明意欲保護之範疇。The above-mentioned embodiments are only used to illustrate the present invention, not to limit the scope of the present invention. Any modifications or changes that do not violate the spirit of the present invention are within the scope of the invention to be protected.
1:參考電源端
131:蝕刻孔
2:濾波器
132:穿孔
3:類比數位轉換器
20:狀態切換模組
100:氣體對流熱傳導量測系統
30:中央處理模組
10:微機電感測模組
31:資料擷取單元
11:基板
32:時間控制單元
12:熱電元件
40:放大器
121:第一端
41:輸入端
122:第二端
411:正相連接端
123:熱電單元
412:負相連接端
123a:第一面
42:輸出端
123b:第二面
Th:加熱時間
123c:第一側
Ts:穩態時間
123d:第二側
Tm:讀取時間
13:絕緣構件
To:延遲時間
1: Reference power terminal
131: Etching hole
2: filter
132: Piercing
3: Analog to digital converter
20: State switching module
100: Gas convection heat conduction measurement system
30: central processing module
10: Microcomputer inductive measurement module
31: Data extraction unit
11: substrate
32: Time control unit
12: Thermoelectric element
40: amplifier
121: The first end
41: input
122: second end
411: Normal phase connection
123: Thermoelectric unit
412:
圖1係本發明外觀立體示意圖。 圖2係圖1俯視圖。 圖3係本發明剖面示意圖。 圖4係本發明系統架構圖。 圖5係本發明時間控制單元控制流程示意圖(一)。 圖6係本發明時間控制單元控制流程示意圖(二)。 圖7係本發明操控訊號之數位與類比電壓變化示意圖(一)。 圖8係本發明操控訊號之數位與類比電壓變化示意圖(二)。 圖9係本發明電路架構示意圖。 圖10係本發明電路實施例示意圖。FIG. 1 is a schematic perspective view of the present invention. Fig. 2 is a top view of Fig. 1. 3 is a schematic cross-sectional view of the present invention. 4 is a system architecture diagram of the present invention. 5 is a schematic diagram (1) of the control flow of the time control unit of the present invention. 6 is a schematic diagram (2) of the control flow of the time control unit of the present invention. 7 is a schematic diagram of the digital and analog voltage changes of the control signal of the present invention (1). 8 is a schematic diagram (2) of the digital and analog voltage changes of the control signal of the present invention. 9 is a schematic diagram of the circuit architecture of the present invention. 10 is a schematic diagram of an embodiment of the circuit of the present invention.
1:參考電源端 1: Reference power terminal
2:濾波器 2: filter
3:類比數位轉換器 3: Analog to digital converter
12:熱電元件 12: Thermoelectric element
121:第一端 121: The first end
122:第二端 122: second end
20:狀態切換模組 20: State switching module
30:中央處理模組 30: central processing module
40:放大器 40: amplifier
41:輸入端 41: input
42:輸出端 42: output
Claims (11)
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