TW202013259A - Electronic component mounting device and method for manufacturing electronic component mounted body - Google Patents

Abstract

The present invention addresses the problem of providing an electronic component mounting device with which an electronic component mounted body, in which an electronic component and a circuit are accurately positioned, can be manufactured easily and reliably. The present invention is a mounting device for an electronic component, in which the electronic component is attached to a first band-shaped member on which a plurality of circuits are formed, said mounting device comprising: a first transport mechanism for transporting a first band-shaped member; a second transport mechanism for transporting a second band-shaped member; a transfer member for transferring a plurality of the electronic components to the second band-shaped member, with intervals therebetween in accordance with the position of the plurality of circuits; and an attachment mechanism for attaching to each other the first band-shaped member and the second band-shaped member to which the plurality of electronic components have been transferred. The transfer mechanism is capable of transferring the electronic components while changing the interval between the electronic components. Preferably, the mounting device is further equipped with a supply mechanism for supplying an adhesive material to the surface of at least one member which is to be attached to the surface of the other, that is, the first band-shaped member or the second band-shaped member, before the members are attached to each other.

Description

Electronic component mounting device and manufacturing method of electronic component mounting body

The invention relates to an electronic component mounting device and a method of manufacturing an electronic component mounting body.

As an apparatus for manufacturing an RFID tag as an example of an electronic component mounted body, the content described in Japanese Patent Laid-Open No. 2012-74570 is known. In the RFID tag, an IC chip is mounted on a sheet-like member formed with an antenna circuit. In the device described in the above publication, the adhesive is applied to the band-shaped member on which the antenna circuit is formed at predetermined intervals, and the IC wafer held by the suction nozzle of the synchronizing roller is sequentially delivered to the band-shaped member. An IC wafer is mounted on the belt-shaped member, and an RFID tag is manufactured. After that, the RFID tag is manufactured by cutting the band-shaped member into a predetermined tag-like size.

Patent Document 1: Japanese Patent Laid-Open No. 2012-74570

As described above, in the state where only the IC wafer is mounted, there is a possibility that the IC wafer may be damaged. Therefore, the antenna circuit is usually mounted on the mounting side of the IC wafer of the RFID tag via an adhesive, and the cover film is laminated so as to cover the IC wafer. However, since the cover film needs to be laminated in this way, cost reduction cannot be achieved.

In view of this, it is considered that an IC wafer is placed in advance at predetermined intervals (the same interval as the interval at which the antenna circuit is formed) on the band-shaped member as a cover film, and the band-shaped member on which the IC wafer is mounted is bonded to the formed The band-shaped member of the antenna circuit described above manufactures an RFID tag. However, in this case, it is possible to manufacture an RFID tag in which the IC chip and the antenna circuit cannot be electrically connected. In other words, when the IC chip and the antenna circuit are not positioned correctly, the IC chip and the antenna circuit may not be electrically connected. For example, due to deformations such as slight expansion and contraction of the band-shaped member due to humidity and temperature, the interval between the antenna circuits may not necessarily be fixed. Thus, when a plurality of antenna circuits are not accurately formed at predetermined intervals, there are manufacturing methods Inadequate electrical connection RFID.

The present invention has been completed in view of such inconveniences, and an object of the present invention is to provide an electronic component mounting device and a method of manufacturing an electronic component mounting body that can easily and reliably manufacture electronic component mounting bodies in which electronic components and circuits are accurately positioned .

An invention completed to solve the above-mentioned problems provides an electronic component mounting device that mounts an electronic component on a first strip-shaped member formed with a plurality of circuits, characterized in that: The electronic component mounting device includes: A first conveying mechanism to convey the first belt-shaped member; The second conveying mechanism conveys the second belt-shaped member; A transfer mechanism that transfers the plurality of electronic components to the second strip-shaped member at intervals according to the positions of the plurality of circuits; and A bonding mechanism for bonding the first band-shaped member to the second band-shaped member on which a plurality of the electronic components are transferred, The transfer mechanism is provided so as to change the interval between the electronic components and transfer.

In the electronic component mounting device, the first belt-shaped member is transported by the first transport mechanism, and the plurality of electronic components are transferred to the second belt-shaped member at intervals according to the positions of the plurality of circuits by the transfer mechanism. The bonding mechanism bonds the first band-shaped member and the second band-shaped member, whereby the electronic component mounted body can be manufactured. In addition, here, the circuit includes all circuits such as an antenna circuit, an electronic circuit, and an electric circuit. Furthermore, the circuit includes not only the circuit completed to function as a circuit, but also a part of the circuit. In addition, the formation of a circuit on the first strip-shaped member refers to a state in which a circuit exists on the first strip-shaped member when the circuit is printed on the first strip-shaped member, a circuit board, or the like is mounted.

It is preferable that the electronic component mounting apparatus further includes a supply mechanism that transfers the electronic components to the first and second strip-shaped members after the electronic components are transferred by the transfer mechanism and before bonding. At least one of the surfaces bonded to the other is supplied with the coating material. Thereby, the coating material can be supplied to the surface bonded to the other of at least one of the first belt-shaped member and the second belt-shaped member by the supply mechanism, and the first belt-shaped member and the second belt-shaped can be separated by the bonding mechanism The members are bonded together with the coating material in between.

It is preferable that a plurality of antenna circuits are formed at intervals on the surface of the first strip-shaped member that is in contact with the second strip-shaped member, and the transfer mechanism is provided between the first strip-shaped member and the first When the two strip-shaped members are bonded, the electronic component is transferred so that the electronic component is located at a predetermined position of the antenna circuit. Thereby, the electronic component mounted body in which the electronic component is located at a predetermined position with respect to the antenna circuit can be easily and reliably manufactured.

It is preferable that the coating material supplied by the supply mechanism is a material that is cured by electron rays, and the electronic component mounting device further includes an irradiation mechanism that irradiates electron rays before bonding. Thereby, electron beam irradiation curing type adhesive is used as the coating material supplied by the supply mechanism to the bonding surface (the surface bonded to the other of at least one of the first band-shaped member and the second band-shaped member). In the case of an agent, curing of the coating material supplied to the bonding surface can be started.

It is preferable that the electronic component mounting device further includes a first imaging mechanism that photographs the first band-shaped member, and the transfer mechanism is based on the photographing result of the first imaging mechanism in the second The electronic component is placed on the band-shaped member. Thereby, the first strip-shaped member formed with a plurality of circuits is photographed by the first imaging mechanism, and the transfer mechanism can change the interval between the electronic components transferred to the second strip-shaped member. After the first imaging mechanism recognizes the position of the circuit in the first strip-shaped member, the transfer mechanism transfers the electronic component to the position of the second strip-shaped member corresponding to the position of the circuit of the first strip-shaped member. Therefore, the electronic component mounting device can stick the first strip-shaped member and the second strip-shaped member in a state where the plurality of circuits of the first strip-shaped member and the plurality of electronic components of the second strip-shaped member are correctly positioned In combination, an electronic component mounted body in which electronic components and circuits are correctly positioned can be manufactured more easily and reliably.

Preferably in the electronic component mounting device, the transfer mechanism includes a holding unit that holds the electronic component, and the electronic component mounting device further includes a second imaging mechanism that photographs the holding unit For the held electronic component, the transfer mechanism transfers the electronic component to the second band-shaped member based on the photographing result of the first imaging mechanism and the photographing result of the second imaging mechanism. This allows the transfer mechanism to transfer the electronic component held by the holding unit to the second band-shaped member after recognizing the state of the electronic component held by the holding unit by the first imaging mechanism and the second imaging mechanism Correct location.

Preferably, the electronic component mounting device further includes a third imaging mechanism that photographs the electronic component transferred to the second band-shaped member by the transfer mechanism, and the transfer mechanism considers The photographing result of the third imaging mechanism transfers the electronic component to the second strip-shaped member. Thus, it can be recognized by the third imaging mechanism whether the electronic component is transferred to the correct position of the second band-shaped member by the transfer mechanism. Therefore, in the case where the transfer position of the electronic component on the second band-shaped member is adjusted based on the data obtained by the third imaging mechanism, the transfer position can be adjusted using the data obtained by the third imaging mechanism On the basis of the correction of the data, the transfer position of the subsequent electronic components is set to a more correct position.

Another invention completed to solve the above-mentioned problems provides a method of manufacturing an electronic component mounted body, which includes an electronic component mounting process using the electronic component mounting device configured as described above. According to this method of manufacturing an electronic component mounted body, the first band-shaped member and the second band-shaped member can be positioned in a state where the plurality of circuits of the first band-shaped member and the plurality of electronic components of the second band-shaped member are correctly positioned By bonding the components, an electronic component mounted body in which electronic components and circuits are accurately positioned can be easily and reliably manufactured.

Another invention completed to solve the above-mentioned problems provides a method of manufacturing an electronic component mounted body having an electronic component mounting step of mounting an electronic component on a first strip-shaped member formed with a plurality of circuits, In the installation process, Conveying the first belt-shaped member by the first conveying mechanism, The second belt-shaped member is conveyed by the second conveying mechanism, By providing a transfer mechanism capable of changing the interval between the electronic components, a plurality of the electronic components are transferred to the second band-shaped member at intervals, The first band-shaped member is bonded to the second band-shaped member on which the plurality of electronic components are transferred by the bonding mechanism.

According to this method of manufacturing an electronic component mounted body, the first band-shaped member and the second band-shaped member can be positioned in a state where the plurality of circuits of the first band-shaped member and the plurality of electronic components of the second band-shaped member are correctly positioned By bonding the components, an electronic component mounted body in which electronic components and circuits are accurately positioned can be easily and reliably manufactured.

Another invention completed to solve the above-mentioned problems provides a method for manufacturing an electronic component mounted body, The first belt-shaped member formed by arranging a plurality of circuits is conveyed by the first conveying mechanism, Detecting the position of the circuit of the first band-shaped member by the first imaging mechanism, The second belt-shaped member is conveyed by the second conveying mechanism, Based on the detection result of the first imaging mechanism, the electronic component is fixed at a position corresponding to the circuit of the first strip-shaped member in the second strip-shaped member.

According to this method of manufacturing an electronic component mounted body, the first band-shaped member and the second band-shaped member can be positioned in a state where the plurality of circuits of the first band-shaped member and the plurality of electronic components of the second band-shaped member are correctly positioned By bonding the components, an electronic component mounted body in which electronic components and circuits are accurately positioned can be easily and reliably manufactured.

As described above, according to the electronic component mounting device and the manufacturing method of the electronic component mounting body of the present invention, the electronic component mounting body in which the electronic components and the circuits are correctly positioned can be easily and reliably manufactured.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings, but the present invention is not limited to the structure of the following embodiments.

(Mounting device for electronic components)

The electronic component mounting device M of FIG. 1 is a device used in the electronic component mounting process of the manufacturing method of the electronic component mounted body. In addition, in FIG. 1, for easy understanding, the antenna circuit 64 is expressed to have a thickness. Actually, since the first strip-shaped member S1 is formed by printing or the like, the antenna circuit 64 is extremely thin.

In the present embodiment, an RFID tag will be described as an example of the electronic component mounted body. However, in the present invention, the electronic component mounted body is not limited to this. In addition, as the electronic component, the IC wafer itself may be used. However, in this embodiment, as an electronic component, a strap including an IC wafer and a terminal will be described as an example.

As shown in FIG. 2, the tape 50 is, for example, an electronic component in which an IC wafer 51 is mounted on the surface of a 200 μm-thick sheet-shaped wafer holding base 53 composed of PSF (polystyrene). A conductive pad (not shown) electrically connected to an electrode pad (not shown) of the IC wafer 51 and a strip extending from the conductive pad are formed on the surface of the wafer holding base 53侧terminal52. In addition, the conductive pad and the strip-side terminal 52 of this embodiment are formed by a printing pattern based on conductive ink.

In addition, as the material of the wafer holding base 53, instead of the PSF of the present embodiment, resin film such as PC (polycarbonate), paper such as processed paper, or the like may be used. In addition, in order to protect the electrical connection portion of the conductive pad and the electrode pad, an underfill material, potting material, or the like may also be used. In addition, as a method of forming the strip-side terminal 52 and the like, instead of the method of printing the conductive ink of the present embodiment, copper etching, dispensing, metal foil bonding, direct vapor deposition of metal, metal vapor deposition film transfer, conductive Methods such as the formation of a sexual polymer layer.

In addition, in the present embodiment, as shown in FIG. 2, the RFID tag R includes a strip 50 and an antenna circuit sheet 60 to which the strip 50 is attached. The antenna circuit sheet 60 is, for example, 100 μm thick made of PET. The surface of the thermoplastic base substrate 61 is provided with a sheet-shaped electronic substrate of the antenna circuit 64. The antenna circuit 64 is a printed pattern based on conductive ink that is formed in an incomplete ring that is interrupted at one place. At both end portions forming the above-mentioned one intermittent portion, a base-side terminal 62 electrically connected to the strip-side terminal 52 is formed.

In addition, as with the strip-side terminal 52, instead of the antenna circuit 64 made of conductive ink, copper etching foil, distribution, metal foil adhesion, direct metal deposition of metal, metal vapor deposition film transfer, conductive polymer can be used The antenna circuit 64 formed by a method such as layer formation. In addition, as the material of the base substrate 61, in addition to the PET of the present embodiment, resin films such as PET-G, PC, PP (polypropylene), nylon, and paper such as processed paper can be used. Furthermore, as the ink material of the conductive ink, silver, graphite, silver chloride, copper, nickel, or the like can be used.

The mounting device M is a device for mounting the strap 50 on the first strip-shaped member S1. The first belt-shaped member S1 is composed of a long sheet member, and is provided in a continuous sheet shape connected to the base substrate 61. As shown in FIG. 3, a plurality of antenna circuits 64 are formed at predetermined intervals on the first strip-shaped member S1. Specifically, a plurality of antenna circuits 64 are sequentially formed in the first strip-shaped member S1 along the longitudinal direction (conveying direction) of the first strip-shaped member S1. After the plurality of strips 50 are mounted on the first band-shaped member S1 by the mounting device M, the first band-shaped member S1 is cut between the antenna circuits 64, thereby cutting out the RFID tag R.

(the whole frame)

As shown in FIG. 1, the mounting device M includes a first transport mechanism 2, a first imaging mechanism 3, a second transport mechanism 4, a transfer mechanism 1, and a bonding mechanism 5. The first transport mechanism 2 is a mechanism that transports the first belt-shaped member S1. The first imaging mechanism 3 is a mechanism for imaging the first band-shaped member S1. The second transport mechanism 4 is a mechanism that transports the second belt-shaped member S2. The transfer mechanism 1 is a mechanism that transfers a plurality of strips 50 to the second strip-shaped member S2 at intervals. The bonding mechanism 5 is a mechanism for bonding the first band-shaped member S1 imaged by the first imaging mechanism 3 and the second band-shaped member S2 on which a plurality of electronic components are transferred. The transfer mechanism 1 has a holding unit (end effector 13) that holds the transferred tape 50, and is provided so that the tape 50 can be transferred by changing the interval between the tapes 50. That is, the transfer mechanism 1 can move each holding unit independently, and can freely adjust the interval between the straps 50. The detailed structure of the transfer mechanism 1 will be described later.

The mounting device M further includes: a second imaging mechanism 6 that photographs the strip 50 of the transfer mechanism 1; a third imaging mechanism 7 that photographs the strip 50 transferred to the second strip-shaped member S2; The supply mechanism 8 for the adhesive material (coating material) of the strip-shaped member S1 and the second strip-shaped member S2; and the irradiation mechanism 9 for irradiating the adhesive material. Furthermore, the mounting device M further includes a control mechanism (not shown) that receives data from the above-mentioned various mechanisms and controls the operations of the various mechanisms.

(First delivery mechanism)

The first conveying mechanism 2 continuously conveys the first belt-shaped member S1 toward the bonding mechanism 5. The first conveying mechanism 2 has a substantially cylindrical rotating roller 2a. The first conveying mechanism 2 conveys the first strip-shaped member S1 such that the surface of the first strip-shaped member S1 on which the antenna circuit 64 is formed faces the second strip-shaped member S2 in the bonding mechanism 5.

(Second conveying mechanism)

The second conveying mechanism 4 continuously conveys the second belt-shaped member S2 toward the bonding mechanism 5. The second conveying mechanism 4 has a substantially cylindrical rotating roller 4a. As the material of the second belt-shaped member S2, the same material as the first belt-shaped member S1 can be used, and papers such as resin films such as PET, PET-G, PC, PP (polypropylene), nylon, and processing paper can be used. Wait. On the rotating roller 4a of the second conveyance mechanism 4, the tape 50 is transferred from the transfer mechanism 1 onto the second belt-shaped member S2. In addition, the second tape-shaped member S2 forms an adhesive layer on the surface before the tape 50 is transferred from the transfer mechanism 1.

(Fitting organization)

The bonding mechanism 5 bonds the first belt-shaped member S1 and the second belt-shaped member S2 sent out by the first transport mechanism 2 and the second transport mechanism 4. The bonding mechanism 5 has a pair of rotating rollers 5a that sandwich the first belt-shaped member S1 and the second belt-shaped member S2. Since the adhesive layer is formed on the surface of the second belt-shaped member S2 as described above, the first belt-shaped member S1 and the second belt-shaped member S2 are bonded together. Immediately before the position where the first belt-shaped member S1 and the second belt-shaped member S2 are bonded, the transportation direction of the first belt-shaped member S1 and the transportation direction of the second belt-shaped member S2 are different directions.

(First camera organization)

The first imaging mechanism 3 has a first camera 3 a that photographs the first belt-shaped member S1 transported by the first transport mechanism 2 on the upstream side of the first transport mechanism 2 from the bonding mechanism 5. The first camera 3a is arranged on the side of the first strip-shaped member S1 where the antenna circuit is formed, and images the antenna circuit 64 of the first strip-shaped member S1.

(Second camera organization)

The second imaging mechanism 6 photographs the strap 50 held by the holding unit of the transfer mechanism 1. The second imaging mechanism 6 has a second camera 6 a arranged on the upstream side of the transfer mechanism 1 relative to the transfer location in order to capture the tape 50 before the transfer to the second band-shaped member S2 by the transfer mechanism 1.

(Third Camera Organization)

The third imaging mechanism 7 is on the upstream side of the second conveyance mechanism 4 from the bonding mechanism 5 and downstream from the transfer site, and has a third image of the second belt-shaped member S2 conveyed by the second conveyance mechanism 4 Camera 7a. This third camera 7a is arranged on the surface side where the strip 50 is transferred by the transfer mechanism 1 of the second strip-shaped member S2 to the second strip-shaped member S2, and photographs the strip 50 on the second strip-shaped member S2.

(Supply institution)

The supply mechanism 8 supplies an adhesive material to at least one surface of the first band-shaped member S1 and the second band-shaped member S2 bonded to the other before bonding. In this embodiment, the supply mechanism 8 supplies the adhesive to the tape 50 on the second belt-shaped member S2. The supply mechanism 8 is disposed on the downstream side of the second belt-shaped member S2 and the upstream side of the third imaging mechanism 7 from the transfer site of the transfer mechanism 1 to the transfer side of the strip 50 of the second belt-shaped member S2 Supply adhesive materials. As the adhesive material, various materials can be used. In the present embodiment, an electron beam irradiating adhesive is used, and specifically, an ultraviolet curing adhesive is used. In addition, in the present embodiment, the electron beam irradiation adhesive uses a delayed curing type material that starts curing by irradiation with electron beams.

(Irradiation mechanism)

The irradiation mechanism 9 irradiates the adhesive material supplied by the supply mechanism 8 with electron beams before bonding. In this embodiment, the irradiation mechanism 9 irradiates ultraviolet rays. The irradiation mechanism 9 has a light source that irradiates the adhesive material with ultraviolet rays on the upstream side of the second conveyance mechanism 4 from the bonding mechanism 5.

(Transfer agency)

The transfer mechanism 1 intermittently transfers the strip 50 sequentially to the second belt-shaped member S2 transported by the second transport mechanism 4 on the upstream side of the bonding mechanism 5. The transfer mechanism 1 is disposed on the surface side of the bonding mechanism 5 facing the first belt-shaped member S1 with respect to the second belt-shaped member S2 transported by the second transport mechanism 4, and faces the second belt-shaped member S2的的贴面面移带带条50。 The bonding surface of the transfer strip 50. As described above, the transfer mechanism 1 is provided so that the strip 50 can be transferred to an appropriate position of the second strip-shaped member S2 by changing the interval between the strips 50. The transfer mechanism 1 appropriately changes the interval between the strips 50 based on the imaging data of the first imaging mechanism 3 and transfers a plurality of strips 50 to the second strip-shaped member S2. The transfer mechanism 1 conveys the tape 50 at a speed different from the conveyance speed of the antenna circuit 64 of the first conveyance mechanism 2 and the conveyance speed of the tape 50 of the second conveyance mechanism 4. The transfer mechanism 1 can transport the tape 50 at a slower speed than the transport speed of the antenna circuit 64 of the first transport mechanism 2 and the transport speed of the tape 50 of the second transport mechanism 4. The transfer mechanism 1 can also transport the belt 50 at a speed faster than the transportation speed of the antenna circuit 64 of the first transportation mechanism 2 and the transportation speed of the belt 50 of the second transportation mechanism 4. In addition, the distance between the belts 50 placed on the second belt-shaped member S2 by the transfer mechanism 1 is larger than the distance between the belts 50 on which the strip sheets of the belts 50 supplied to the transfer mechanism 1 are arranged.

The specific structure of the transfer mechanism 1 is not particularly limited, and for example, the mechanisms shown in FIGS. 4 to 7 can be used. The transfer mechanism 1 shown in FIGS. 4 to 7 includes: three end effectors 13 that can maintain a sequence on the same circumference and can rotate independently of each other; a support shaft 100 as a structural member; The outer ring 142 and the three bearings 14 fixed to the inner ring 141 on the support shaft 100 side; and the driving portion 17 that rotationally drives the outer ring 142 by the rotational driving force of the rotary motor 170 connected via the rotation transmission member 171. In addition, in the present embodiment, the two delivery units 10 are arranged to be coaxially opposed (see FIG. 7 ), and the six end effectors 13 rotate on substantially the same circumference (see FIG. 6 ).

As shown in FIGS. 4 and 5, the support shaft 100 is a structural member that is fixedly supported on the frame (not shown) of the delivery unit 10 along the rotation axis CL. The support shaft 100 is a shaft body having a hollow structure with a substantially cylindrical cross section. The support shaft 100 has a through-hole (not shown) on the end surface on the rear end side supported by the housing. A suction port of a vacuum pump (not shown) is connected to the through hole communicating with the hollow portion. The hollow part is maintained at a negative pressure by the action of a vacuum pump.

With respect to the support shaft 100, a substantially disc-shaped support plate 16 is externally fixed at three locations along the axial direction of the rotary shaft CL at substantially equal intervals. The rotating ring 15 holding the end effector 13 is rotatably supported on the outer peripheral side of the support plate 16 via a bearing 14. The rotating ring 15 has a shape in which an approximately disc-shaped gear portion 152 provided with gear teeth on the inner circumferential surface and a substantially cylindrical bearing fitting portion 151 of the interpolated bearing 14 are combined in the axial direction. The gear portion 152 and the bearing fitting portion 151 have substantially the same outer diameter. On the other hand, the inner diameter of the gear portion 152 is smaller than the inner diameter of the bearing fitting portion 151. In addition, FIG. 5 is a diagram schematically showing the structure of the rotating ring 15, the support plate 16, the rotation transmitting member 171 and the like in a perspective view. In the same figure, the illustration of the end effector 13 and the support shaft 100 and the like is omitted, and the bearing 14 and the support plate 16 are not separately shown as a single body.

As shown in FIGS. 4 to 7, the end effector 13 is a bar-shaped member that rotates while holding the strap 50. The end effector 13 is fixed to the outer circumferential side of the rotating ring 15 so as to be substantially parallel to the rotary axis CL. The end effector 13 receives the belt 50 from the conveyor and transfers it to the anvil roll side while it is rotating. The end effector 13 arranges the tape 50 on the surface of the second tape-shaped member S2 in the bonding mechanism 5 such that the tape-side terminal 52 faces the base-side terminal 62. Furthermore, the front end side of the end effector 13 is rotatably supported by the bearing 18 supported by the support shaft 100.

As shown in FIGS. 4 to 7, a holding surface 130 (holding unit) for sucking and holding the strap 50 is provided at the front end of the end effector 13. The holding surface 130 is provided with a hole 131 communicating with the hollow portion of the support shaft 100 for air pressure control. The hole 131 communicates with the hollow portion of the support shaft 100 via a pressure path (not shown) provided through the end effector 13, the bearing 14, and the support plate 16. In addition, the bearing 14 is formed with a communication hole for opening the pressure path to the atmosphere when the end effector 13 is located in a predetermined turning section. The pressure of the holding surface 130 is controlled to atmospheric pressure (positive pressure) or negative pressure depending on whether the pressure path is open to the atmosphere. The end effector 13 can suction the tape 50 when the holding surface 130 is set to negative pressure, and can release the held tape when the holding surface 130 is set to atmospheric pressure (positive pressure) Article 50 adsorption.

As shown in FIGS. 4 and 5, the drive unit 17 includes a rotation transmission member 171 for rotating the outer ring 142 of the bearing 14 and a rotation motor (general servo control system prime mover) 170 for rotationally driving the rotation transmission member 171. A gear 173 that meshes with the gear portion 152 of the rotating ring 15 is externally fixed to the end of the rotation transmission member 171. In the transfer unit 10, the rotation of the rotation motor 170 is transmitted via the rotation transmission member 171, the rotation ring 15 and the outer ring 142 rotate, and the end effector 13 rotates as the rotation ring 15 rotates. In the transfer unit 10, the rotary ring 15 to which each end effector 13 is fixed is individually driven to rotate by each of the rotation motors 170, and therefore, the turning operation of the end effector 13 can be independently controlled.

For the support plate 16A at the end of the rear end side of the end effector 13 among the support plates 16, as shown in FIGS. 4 and 5, the bearing 161 that supports the rotation transmission member 171 and the other two rotation transmission shafts The through holes 160 through which the member 171 passes are arranged at intervals of 120 degrees in the circumferential direction. For the support plate 16B disposed in the middle in the axial direction, a bearing 161 that pivotally supports the rotation transmission member 171 and a through hole 160 for penetrating the other rotation transmission member 171 are arranged at 180-degree intervals in the circumferential direction. With respect to the support plate 16C at the end of the front end side of the end effector 13, only the bearing 161 that axially supports the rotation transmission member 171 is arranged, and no through-hole through which the other rotation transmission member 171 passes is formed. In addition, a bearing 14C at one end in the axial direction is inserted outside the support plate 16C, a bearing 14B disposed in the middle in the axial direction is inserted outside the support plate 16B, and the other axial direction is inserted at the support plate 16A Bearing 14A at the end.

According to the through-hole 160 perforated in the support plate 16, as shown in FIGS. 4 and 5, the rotation transmission member 171 can be penetrated and arranged on the inner peripheral side of the bearing 14 that is externally inserted into the support plate 16. Specifically, the rotation transmission member 171 corresponding to the bearing 14B of the bearing 14A that is not the end on the rear end side penetrates the inner peripheral side of the bearing 14A on the rear end side of the corresponding bearing 14B. In addition, the rotation transmission member 171 corresponding to the bearing 14C penetrates the inner circumferential sides of the bearing 14A and the bearing 14B located on the rear end side of the corresponding bearing 14C. On the other hand, with respect to the bearing 14A at the end on the rear end side, the corresponding rotation transmission member 171 does not penetrate the inner circumferential side of the other bearings 14B and 14C.

In this way, in the transfer unit 10 of the present embodiment adopting the structure in which the rotation transmission member 171 penetrates the inner peripheral side of the bearing 14, the shaft of the three bearings 14A to 14C (support plates 16A to 16C) arranged in line can be arranged To the outside, the rotary motor 170 corresponding to each end effector 13 is centrally arranged. Since it is not necessary to arrange the rotary motor 170 in the gap between the adjacent bearings 14 in the axial direction, the bearings 14 can be arranged close to each other in the axial direction. If the bearing 14 is brought close to the axial direction, the difference in the distance G (FIG. 4) from the bearing 14 to the holding surface 130 of the end effector 13 can be suppressed. If the difference in the distance G is suppressed, the support rigidity of each end effector 13 can be uniformly approached, and the difference in controllability can be suppressed. In addition, in the transfer device 1 of the present embodiment, as shown in FIG. 7, the transfer unit 10 configured as described above is coaxially arranged to face each other. Therefore, in the transfer device 1 of the present embodiment, three rotary motors 170 are arranged on both outer sides in the axial direction with respect to all six bearings 14 (support plates 16).

Furthermore, the transfer mechanism 1 of the present embodiment performs transfer while correcting the transfer position of the strip 50 of the second strip-shaped member S2 based on the imaging data of the first imaging mechanism 3. The transfer mechanism 1 transfers while correcting the transfer position of the strip 50 of the second strip-shaped member S2 based on the imaging data of the second imaging mechanism 6. The transfer mechanism 1 transfers while correcting the second strip-shaped member S2 at the transfer position of the tape 50 based on the imaging data of the third imaging mechanism 7. For this reason, the above-mentioned control mechanism controls the turning movement of each end effector 13 so as to coincide with the corrected transfer position.

(Manufacturing method of RFID tag)

Next, a method of manufacturing an electronic component mounted body according to an embodiment of the present invention will be described.

The manufacturing method of this embodiment has a step of mounting an electronic component (tape 50) using the mounting device M configured as described above. In addition, this manufacturing method has a step of cutting the first tape-shaped member S1 between the antenna circuits 64 to cut out the RFID tag R after the mounting step.

In the above mounting process, the first belt-shaped member S1 is transported by the first transport mechanism 2, the first belt-shaped member S1 is imaged by the first imaging mechanism 3, and the second belt-shaped member S2 is transported by the second transport mechanism 4 and passes Transfer mechanism 1 provided so that the interval of the strips 50 can be changed 1. The plurality of strips 50 are transferred to an appropriate position on the second strip-shaped member S2, and then the first imaging mechanism 3 is photographed by the bonding mechanism 5 The first strip-shaped member S1 after the lamination is bonded to the second strip-shaped member S2 on which the plurality of straps 50 are transferred.

The transfer mechanism 1 transfers the strip 50 to the position corresponding to the position of the antenna circuit 64 based on the data obtained by the first imaging mechanism 3 on the position of the antenna circuit 64 in the first strip-shaped member S1. The position of the second band-shaped member S2.

In the above mounting process, the second imaging mechanism 6 images the strap 50 held by the holding unit of the transfer mechanism 1. The transfer mechanism 1 transfers the strip 50 to the second strip-shaped member S2 based on the information obtained by the second camera mechanism 6 regarding the position of the strip 50 in the holding unit of the transfer mechanism 1 position. Specifically, when the tape 50 is held in the holding unit in a state where a positional deviation occurs, the transfer mechanism 1 transfers the tape 50 to the second belt-shaped member with the positional deviation corrected S2.

In the above mounting process, the strip 50 transferred to the second strip-shaped member S2 by the transfer mechanism 1 is imaged by the third imaging mechanism 7. The transfer mechanism 1 confirms whether the mounting state is correct based on the data related to the position of the tape 50 obtained by the third imaging mechanism 7. It is assumed that when a position shift occurs in the mounting state, the transfer mechanism 1 corrects the position shift and determines the transfer position of the next strip 50. Therefore, the tape 50 is conveyed at two different speeds from the position where the continuous tape is delivered to the transfer device 1 to the bonding position. That is, the transfer speed of the transfer device 1 is different from the transfer speed of the second transfer mechanism 4.

In the above-mentioned mounting step, before bonding, an adhesive material is supplied to the bonding surface of the second band-shaped member S2 by the supply mechanism 8, and the adhesive material is irradiated with electron beams by the irradiation mechanism 9.

(advantage)

In the mounting device M configured as described above, the first strip-shaped member S1 formed with the plurality of antenna circuits 64 is photographed by the first imaging mechanism 3, and the transfer mechanism 1 is provided so as to be able to change to the second strip-shaped member S2. The distance between the loaded strips 50, therefore, the transfer mechanism 1 can transfer the strip 50 to the same position as the first imaging mechanism 3 recognizes the position of the antenna circuit 64 in the first strip-shaped member S1. The position of the antenna circuit 64 of the first band-shaped member S1 corresponds to the position of the second band-shaped member S2. Therefore, the mounting device M can position the first strip-shaped member S1 and the second strip in a state where the plurality of antenna circuits 64 of the first strip-shaped member S1 and the plurality of strips 50 of the second strip-shaped member S2 are correctly positioned. The shape member S2 is bonded, and the RFID tag R in which the strip 50 and the antenna circuit 64 are correctly positioned can be easily and reliably manufactured.

In addition, the transfer mechanism 1 can correctly transfer the strip 50 to the second strip-shaped member S2 after the second imaging mechanism 6 recognizes the state of the strip 50 held by the holding unit of the transfer mechanism 1 position. Furthermore, since the third imaging mechanism 7 can recognize whether the tape 50 is transferred by the transfer mechanism 1 to the correct position of the second strip-shaped member S2, the tape can be adjusted based on the data obtained by the third imaging mechanism 7 The transfer position of 50 to the second band-shaped member S2 is set to a more accurate position.

Suppose that in a structure where the strip 50 is directly fixed to the antenna circuit 64 of the first strip-shaped member S1 and the second strip-shaped member S2 is bonded to the first strip-shaped member S1, the adhesive member Before the bonding, the tape 50 is fixed to the extent that there is no positional deviation. Therefore, the adhesion performance needs to be prioritized as compared with the case where it is considered good from the viewpoint of conductivity and the like. Furthermore, in the case of selecting paper or the like as the material of the first belt-shaped member S1, it is difficult to sufficiently heat, and compared with the performance of RFID, it is necessary to select an adhesive material focusing on the ability to exhibit adhesive performance even without heating .

As in the structure described in Japanese Patent Laid-Open Publication No. 2012-74570, in the case of a structure in which the tape is directly fixed to the antenna circuit of the band-like member by using a roller that is mounted while adsorbing the tape on the surface, the mounting is performed directly. The structure of the tape is large, so it is difficult to arrange the structure for supplying the adhesive near the installation position. Therefore, the installation position of the tape 50 is far from the adhesive supply position, and there may be a case where it is dried after the adhesive is supplied and before the tape 50 is installed. One of the problems that can be solved by the electronic component mounting device of this embodiment is that the supply position of the adhesive can be arranged near the bonding position. In the electronic component mounting device of the present embodiment, a structure is adopted in which the second strip-shaped member S2 and the first strip-shaped member S1 are bonded after the strap 50 is mounted on the second strip-shaped member S2. With this structure, it is possible to use an adhesive that is difficult to dry and easy to dry until the tape 50 is attached after the adhesive is supplied.

As in the structure described in Japanese Patent Laid-Open No. 2012-74570, in the structure of an antenna circuit that directly fixes the strip to the strip-shaped member by using a roller that is mounted while attracting the strip on the surface, the tight Just before the installation position of the tape, the roller applies positive pressure to the tape to transfer the tape to the antenna circuit. However, there are cases where the installation accuracy is low due to the transfer of the tape by positive pressure. One of the problems that can be solved by the electronic component mounting device of the present embodiment is to provide a structure for mounting an object such as a tape to a predetermined position such as an antenna circuit with high accuracy. In the electronic component mounting device of the present embodiment, after mounting the strip 50 to the second strip-shaped member S2, the strip 50 is mounted to the antenna circuit 64 of the first strip-shaped member S1, and therefore, it is possible to achieve high accuracy Install strap 50.

In the above-mentioned embodiment, since the first strip-shaped member S1 and the second strip-shaped member S2 are bonded after the strip 50 is fixed to the second strip-shaped member S2, there is no need to fix the strip 50 to the first strip状member S1. Therefore, even when an adhesive material is used, the material can be selected with attention to the performance of RFID such as conductivity. In addition, for example, in the case of an RFID tag that performs communication by electromagnetic coupling, it is not necessary to use an adhesive material, so the supply mechanism 8 is also unnecessary, and the structure can be simplified.

In the above-described mounting device M, the supply mechanism 8 is arranged on the downstream side of the second belt-shaped member S2 from the transfer site of the transfer mechanism 1 and on the upstream side of the third imaging mechanism 7. Therefore, the adhesive material can be supplied and applied immediately before bonding, so that the adhesive material can be prevented from drying before bonding.

(Other embodiments)

The present invention is not limited to the configuration of the above-described embodiment, and design changes can be appropriately made within the scope intended by the present invention.

That is, in the above embodiment, the RFID tag is taken as an example of the electronic component mounting body, and the tape is taken as an example as the electronic component, but the present invention is not limited to this. For example, the IC chip itself may be used as an electronic component. When the IC chip is mounted on a circuit, a tighter positional relationship is required than when the tape of the above embodiment is mounted. Therefore, the mounting device of the present invention The effect is more significant. In addition, an example in which an antenna circuit is used as a circuit is shown, but it is not limited to this, and may be other circuits such as an electronic circuit, an electric circuit, and the like. Furthermore, the circuit may not be completed until it functions as a circuit, but may be a part of the circuit.

In the above-mentioned embodiment, the structure in which the circuit is formed on the first strip-shaped member and the strip is placed on the second strip-shaped member has been described. However, the present invention is not limited to this. A structure in which the first belt-shaped member of the electronic component is bonded to the second belt-shaped member holding the electronic component on the surface to overlap the two electronic components. Alternatively, the first strip-shaped member may hold the electronic device and the substrate, the second strip-shaped member may hold the electronic component to be mounted on the electronic device and the substrate, and the first strip-shaped member may be attached to the second strip-shaped member. A structure in which electronic components are mounted on an electronic device and a substrate.

In addition, even when a tape is used as described above, the connection between the strip-side terminal of the tape and the circuit of the first tape-shaped member is not limited to direct electrical connection, and may be, for example, electromagnetic induction or electrostatic coupling. connection. In the case of the electromagnetic induction method and the electrostatic coupling method, the supply mechanism 8 does not necessarily need to supply the adhesive material, but may supply the conductive material according to the structure of the RFID tag or the inlay.

Furthermore, in the mounting device of the present invention, the bonding device may have a structure having a unit for caulking the strip-side terminal of the strip and the circuit of the first strip-shaped member, and the terminal and the circuit are electrically connected by the unit.

In the above-described embodiment, the transfer mechanism 1 is used to transfer the strip 50 to the second strip-shaped member S2, but the present invention is not limited to this, as long as it can match the antenna circuit 64 of the first strip-shaped member S1 The tape strip 50 may be transferred to the ground, and a so-called pick-and-place structure may be used.

In the above embodiment, the RFID tag having the strip 50 including the IC chip and the electrode and the antenna circuit 64 has been described as an example, but the present invention is not limited to this, and a gain antenna and a loop antenna may be used. An RFID tag, an RFID tag using a strip including a resonance circuit.

In the above-described embodiment, the tape 50 supplied to the transfer mechanism 1 is attached to the tape-shaped member in a separated state and is conveyed, but the present invention is not limited to this, and the tape 50 may be used to continuously The belt-like state is conveyed, and it is cut into the structure of each belt immediately before.

In the above-described embodiment, the supply mechanism 8 is configured to supply the adhesive material to the second strip-shaped member S2, but the present invention is not limited to this, and a configuration may be adopted in which the adhesive material is supplied to the first strip-shaped member S1 .

Furthermore, in the present invention, it is not necessary to provide a supply mechanism for supplying an adhesive material that joins the first belt-shaped member and the second belt-shaped member as in the above-described embodiment. In addition, even when a supply mechanism is provided, various materials can be used as the adhesive material, and for example, an anisotropic adhesive can be used. Furthermore, even when a supply mechanism is provided, the position of the supply mechanism is not limited to the position described in the above embodiment, and the adhesive material may be supplied before the transfer mechanism 1 is transferred, or may be disposed in the bonding mechanism 5 Near. When it is arrange|positioned in the vicinity of the bonding mechanism 5, since bonding is performed immediately after supplying an adhesive material, bonding can be performed before drying of an adhesive material.

As described above, the present invention can easily and reliably manufacture an electronic component mounted body in which electronic components and circuits are correctly positioned, and therefore, for example, can be suitably used for manufacturing RFID tags.

CL: rotary axis G: distance M: Installation device S1: The first band-shaped member S2: The second band-shaped member R: RFID tag (electronic component mounting body) 1: Transfer agency 2: The first conveying mechanism 2a: rotating roller 3: The first camera 3a: the first camera 4: Second conveying mechanism 4a: rotating roller 5: Fitting organization 5a: Rotating roller 6: Second camera mechanism 6a: Second camera 7: Third camera organization 7a: third camera 8: Supply organization 9: Irradiation mechanism 10: Handover unit 13: End effector 14, 14A, 14B, 14C: Bearing 15: Rotating ring 16, 16A, 16B, 16C: support plate 17: Drive Department 18: Bearing 50: Strip (electronic components) 51: IC chip 52: Strip side terminal 53: Wafer holding substrate 60: Sheet for antenna circuit 61: Base substrate 62: Base side terminal 64: Antenna circuit (circuit) 100: support shaft 130: holding surface (holding unit) 131: Hole 141: inner circle 142: Outer ring 151: Bearing fitting 152: Gear Department 160: through hole 161: Bearing 170: Rotating motor 171: Rotation transmission member 173: Gear

FIG. 1 is a schematic explanatory diagram for explaining the structure of an electronic component mounting device according to an embodiment of the present invention. FIG. 2 is a schematic explanatory diagram of an RFID tag. FIG. 3 is a schematic explanatory diagram of the first band-shaped member. 4 is a schematic explanatory view showing a cross-sectional structure of a transfer mechanism of the mounting device of FIG. 1. 5 is a schematic perspective view showing a partial structure of a transfer mechanism of the mounting device of FIG. 1. 6 is an explanatory view showing an end effector that surrounds the same circumference of the transfer mechanism of the mounting device of FIG. 1. 7 is a schematic cross-sectional explanatory view of two delivery units arranged coaxially and opposed to each other in the transfer mechanism of the mounting apparatus of FIG. 1.

M: Installation device

S1: The first band-shaped member

S2: The second band-shaped member

1: Transfer agency

2: The first conveying mechanism

2a: rotating roller

3: The first camera

3a: the first camera

4: Second conveying mechanism

4a: rotating roller

5: Fitting mechanism

5a: Rotating roller

6: Second camera mechanism

6a: Second camera

7: Third camera organization

7a: third camera

8: Supply organization

9: Irradiation mechanism

13: End effector

50: Strip (electronic components)

51: IC chip

64: Antenna circuit (circuit)

130: holding surface (holding unit)

Claims (10)

An electronic component mounting device that mounts an electronic component on a first belt-shaped member formed with a plurality of circuits is characterized in that the electronic component mounting device includes a first conveying mechanism that conveys the first belt-shaped member A second conveying mechanism that conveys the second strip-shaped member; a transfer mechanism that transfers a plurality of the electronic components to the second strip-shaped member at intervals according to the positions of the plurality of circuits; and paste A coupling mechanism for bonding the first belt-shaped member to a second belt-shaped member on which a plurality of the electronic components are transferred, and the transfer mechanism is provided to be able to change the interval between the electronic components for transfer . The electronic component mounting device according to claim 1, characterized in that the electronic component mounting device further includes a supply mechanism after the electronic component is transferred by the transfer mechanism and before bonding , Supplying the coating material to the surface bonded to the other of at least one of the first belt-shaped member and the second belt-shaped member. The electronic component mounting device according to claim 1 or 2, wherein a plurality of surfaces of the first strip-shaped member on the side where the second strip-shaped member is bonded are formed at intervals. An antenna circuit, and the transfer mechanism transfers the electronic component so that the electronic component is located at a predetermined position of the antenna circuit when the first strip-shaped member and the second strip-shaped member are bonded. The electronic component mounting device according to claim 2, wherein the coating material supplied by the supply mechanism is a material that is cured by electron beams, and the electronic component mounting device further includes an irradiation mechanism, the irradiation mechanism Electron beam irradiation before bonding. The electronic component mounting apparatus according to any one of claims 1 to 4, wherein the electronic component mounting apparatus further includes a first imaging mechanism that photographs the first band-shaped member , The transfer mechanism mounts the electronic component on the second strip-shaped member based on the photographing result of the first imaging mechanism. The electronic component mounting device according to claim 5, wherein the transfer mechanism has a holding unit that holds the electronic component, and the electronic component mounting device further includes a second imaging mechanism, the second imaging A mechanism photographs the electronic component held by the holding unit, and the transfer mechanism transfers the electronic component to the second tape based on the photographing result of the first camera mechanism and the photographing result of the second camera mechanism Shaped member. The electronic component mounting device according to claim 6, wherein the electronic component mounting device further includes a third imaging mechanism that captures images transferred by the transfer mechanism to the second For the electronic component on the band-shaped member, the transfer mechanism takes the imaging result of the third imaging mechanism into consideration and transfers the electronic component to the second band-shaped member. A method of manufacturing an electronic component mounted body, characterized by comprising an electronic component mounting process using the electronic component mounting device according to any one of claims 1 to 7. A method of manufacturing an electronic component mounted body, comprising an electronic component mounting step of mounting an electronic component on a first belt-shaped member formed with a plurality of circuits, characterized in that in the mounting step, the electronic component is transported by a first transport mechanism The first belt-shaped member transports the second belt-shaped member through the second transport mechanism, and a plurality of electronic components are transferred at intervals by a transfer mechanism provided to change the interval between the electronic components To the second band-shaped member, the first band-shaped member is bonded to the second band-shaped member on which the plurality of electronic components are transferred by the bonding mechanism. A method of manufacturing an electronic component mounted body, characterized in that a first belt-shaped member in which a plurality of circuits are arranged is transported by a first transport mechanism, and the position of the circuit of the first belt-shaped member is detected by a first imaging mechanism, The second belt-shaped member is transported by the second transport mechanism, and based on the detection result of the first imaging mechanism, the electronic component is fixed at a position corresponding to the circuit of the first belt-shaped member in the second belt-shaped member .

Images