TW202013118A - Securing structure for water-cooling head - Google Patents
Securing structure for water-cooling head Download PDFInfo
- Publication number
- TW202013118A TW202013118A TW107132790A TW107132790A TW202013118A TW 202013118 A TW202013118 A TW 202013118A TW 107132790 A TW107132790 A TW 107132790A TW 107132790 A TW107132790 A TW 107132790A TW 202013118 A TW202013118 A TW 202013118A
- Authority
- TW
- Taiwan
- Prior art keywords
- water
- buckle
- item
- patent application
- application scope
- Prior art date
Links
Images
Abstract
Description
本發明有關於一種水冷頭扣具結構,尤指一種降低成本及提升生產效率的水冷頭扣具結構。The invention relates to a water-cooled head buckle structure, in particular to a water-cooled head buckle structure that reduces costs and improves production efficiency.
隨著科技的進步,電子產品(如電腦、伺服器或通訊機箱)的運作頻率越來越快,使得在運作時所產生之熱能也隨之增高,相對的散熱需求也提高,其中以伺服器來說,因伺服器針對大數據及雲端計算處理,使得現有的風冷已經無法負擔目前電子產品的如中央處理器(CPU)、顯示卡晶片(GPU)、南北橋晶片或ASIC晶片的散熱需求,故業者便開發一水冷板來滿足上數的散熱需求。 現有一般水冷板(Cold Plate)的結構設計,通常是由一銅材質構成的底板與一銅材質構成的的上蓋板所構成,且該上蓋板蓋合在該底板上,該上蓋板與底板的一側上有相對應的複數鎖孔,透過複數螺絲件依序穿設該上蓋板的該等鎖孔及下蓋的該等鎖孔至對應的一主機板上具有的鎖孔內螺鎖固定,令該水冷板鎖固在該主機板的一發熱元件(如中央處理器(CPU)、顯示卡晶片(GPU)或ASIC晶片)上,以對該發熱元件進行水冷散熱。 而現有水冷板的上蓋板本身的該等鎖固孔及下蓋板本身的該等鎖固孔的鎖固孔位置是根據該主機板的發熱元件的規格型號及廠牌的需求來設計,因為不同規格型號的發熱元件(如中央處理器、顯示卡晶片(GPU)、南北橋晶片或ASIC晶片)就需要不同鎖固孔位置的水冷板,例如同廠牌不同規格型號的中央處理器(如INTEL I3-CPU或INTEL I7-CPU)就需要對應設計一款不同鎖固孔位置的水冷板(如對應INTEL I3-CPU的水冷板設計4個鎖固孔開設在水冷板的四隅處或對應INTEL I5-CPU的水冷板設計6個鎖固孔開設在水冷板的上、下周邊處),或是不同廠牌的中央處理器(如INTEL I7-CPU或AMD Ryzen 7-CPU)也需要對應設計另一款不同鎖固孔位置的水冷板(如對應INTEL I7-CPU的水冷板設計5個鎖固孔開設在水冷板的邊角處或對應AMD Ryzen 7-CPU的水冷板設計8個鎖固孔開設在水冷板的左、右周邊處),以致於導致水冷板的通用性差,令生產工廠需要針對每一款水冷板設計其對應主機板及發熱元件的模具,造成需單獨製作、設計研發成本高及製作成本高,且還無法達到大量生產、無法統一及管控風險高等諸多問題。 此外,現有水冷板的上蓋板及底板兩者是各別單獨以電腦數值控制機具(CNC)加工所製造出,並利用硬焊將該上蓋板與底板連接一起,但因上蓋板與底板兩者皆是相同的銅材質所構成,且兩者其上必需額外預留與主機板相鎖固的鎖固孔位置,使得該上蓋板與底板整體在製造上需向外延長多出位置來開設鎖固孔,導致水冷板整體大且重量過重,進而成本也相對提升。With the advancement of technology, the operating frequency of electronic products (such as computers, servers or communication chassis) is getting faster and faster, so that the heat energy generated during operation is also increased, and the relative heat dissipation requirements are also increased. Generally speaking, due to the server's processing of big data and cloud computing, the existing air cooling can no longer afford the heat dissipation requirements of current electronic products such as central processing unit (CPU), graphics card chip (GPU), north-south bridge chip or ASIC chip Therefore, the industry has developed a water cooling plate to meet the above heat dissipation requirements. The structure design of the existing general cold plate is usually composed of a bottom plate made of copper material and an upper cover plate made of copper material, and the upper cover plate is closed on the bottom plate and the upper cover plate There are a plurality of lock holes corresponding to one side of the bottom plate, and the lock holes of the upper cover plate and the lock holes of the lower cover are sequentially threaded through the plurality of screw pieces to the corresponding lock holes on a main board The internal screw lock is fixed, so that the water cooling plate is fixed on a heating element (such as a central processing unit (CPU), a graphics card chip (GPU) or an ASIC chip) of the main board, so as to perform water cooling on the heating element. The positions of the locking holes of the upper cover plate of the existing water cooling plate and the locking holes of the lower cover plate are designed according to the specifications of the heating element of the motherboard and the requirements of the brand, Because different specifications and types of heating elements (such as central processing unit, graphics card chip (GPU), north-south bridge chip or ASIC chip) require water-cooled plates with different locking hole positions, such as different specifications and types of central processors of the same brand ( For example, INTEL I3-CPU or INTEL I7-CPU, you need to design a water cooling plate with a different locking hole position (for example, the water cooling plate corresponding to INTEL I3-CPU is designed with 4 locking holes opened at the four corners of the water cooling plate or corresponding The water cooling plate of INTEL I5-CPU is designed with 6 locking holes opened at the upper and lower periphery of the water cooling plate), or central processors of different brands (such as INTEL I7-CPU or AMD Ryzen 7-CPU) also need to correspond Design another water-cooled plate with different locking holes (such as the water-cooled plate corresponding to the INTEL I7-
本發明之一目的在提供一種具有達到節省成本的水冷頭扣具結構。 本發明之另一目的在提供一種透過模組化的水冷頭結合一扣具的結構設計,可達到大量生產、增加製程穩定、降低研發成本、降低管控風險及減少重量的水冷頭扣具結構。 本發明之另一目的在提供一種透過一以金屬材質鍛造加工(如熱鍛加工)方式形成的上部與一以金屬材質切銷加工(如CNC加工)方式形成的下部利用焊接方式結合構成水冷頭的結構設計,使得可有效省去上部用CNC加工方式形成,藉以達到節省該上部在製程上的時間的水冷頭扣具結構。 為達上述目的,本發明係在提供一種水冷頭扣具結構,應用裝設於一水冷頭,且與該水冷頭貼設在具有一發熱元件的一主機板相接設,該水冷頭扣具包括一扣具,該扣具具有一中空的開孔及複數貫孔,該開孔及該等貫孔分別貫穿在該扣具上,該等貫孔沿該扣具的一周側設置,用以供該主機板上具有的複數固定件穿設固定,該扣具的開孔套設在該水冷頭上,令該水冷頭承連接該扣具;透過本發明此水冷頭扣具結構設計,使得可根據主機板上的發熱元件的廠牌及規格型號設計調整符合發熱元件的貫孔位置,且還有效達到節省研發成本、降低生產成本及減少水冷頭扣具結構整體重量。One object of the present invention is to provide a water-cooled head fastener structure that achieves cost savings. Another object of the present invention is to provide a water-cooled head buckle structure that can achieve mass production, increase process stability, reduce research and development costs, reduce management and control risks, and reduce weight through a modular water-cooled head combined with a buckle structure design. Another object of the present invention is to provide a water cooling head formed by combining an upper part formed by a metal material forging process (such as hot forging) and a lower part formed by a metal material cutting process (such as CNC processing) by welding The design of the structure makes it possible to effectively save the upper part formed by CNC machining, so as to achieve the water-cooled head fastener structure that saves the time of the upper part in the manufacturing process. In order to achieve the above object, the present invention is to provide a water-cooled head buckle structure, which should be installed on a water-cooled head and attached to the water-cooled head on a motherboard with a heating element. The water-cooled head buckle It includes a buckle with a hollow opening and a plurality of through holes, the opening and the through holes penetrate through the buckle respectively, the through holes are provided along the circumference of the buckle for The plurality of fixing pieces provided on the main board are threaded and fixed, and the opening of the buckle is sleeved on the water cooling head, so that the water cooling head is connected to the buckle; through the structure design of the water cooling head buckle of the present invention, According to the design and model of the heating element on the motherboard, the position of the through hole conforming to the heating element is adjusted, and it also effectively saves research and development costs, reduces production costs and reduces the overall weight of the water-cooled head fastener structure.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 本發明係一種水冷頭扣具結構,請參考第1A圖為本發明之第一實施例之立體分解示意圖;第1B圖為本發明之第一實施例之另一視角立體分解示意圖;第2A圖為本發明之第一實施例之立體組合示意圖;第2B圖為本發明之第一實施例之立體組合局部剖面示意圖;第3A圖為本發明之第一實施例之實施態樣分解示意圖;第3B圖為本發明之第一實施例之實施態樣組合示意圖。該水冷頭扣具結構應用裝設於一水冷頭2,用以接設該水冷頭2後再貼設在一具發熱元件主機板上,其中該主機板5設有一固定板51及複數固定件52,該等固定件52設於該固定板51的一側上,且該等固定件52具有複數螺合柱521及複數定位柱522,該水冷頭2包含一上部214、一下部215、一進口211、一出口212及一容水空間216,其中該進口211與出口212分別開設在該上部214上,該進口211與出口212分別連通該容水空間216,並該上部214為金屬材質(如銅、鐵、鋁、不銹鋼、鈦或其合金材質)以鍛造(如熱鍛)加工方式所製成,該上部214係蓋合在該下部215的一側上,於本實施例的上部214與下部215的連接方式係以焊接方式連接為一體構成前述水冷頭2,但並不引以為限。並該上部214設有一頂端部2141及一從該頂端部2141的外周緣向下延伸的側端部2142,該進口211與出口212分別貫穿開設在該上部214的頂端部2141上,該上部214的側端部2142與頂端部2141及下部215共同界定前述容水空間216,一工作液體(如純水)通過該進口211流入該容水空間216。 該側端部2142設有一結合區2143,該結合區2143位於該側端部2142鄰近其底端的一位置,所述下部215為金屬材質(如銅、鐵、鋁、不銹鋼、鈦或其合金材質)係以切銷加工(如電腦數值控制機具,CNC加工)方式所製成,且該下部215與上部214為相同金屬材質,於本實施例的下部215與上部214為銅材質說明。並該下部215設有複數散熱鰭片2151及一凹槽2153,該等散熱鰭片2151排列設置在該容水空間216內的下部215的一側上,該凹槽2153凹設形成在該下部215的一側上,且圍繞在對應該等散熱鰭片2151外,該凹槽2153與面對該側端部2142的底端相連接。 而本發明之水冷頭扣具結構包括一扣具3,該扣具3為金屬材質例如鋁、鐵、不銹鋼、商業純鈦、鈦或其合金材質或塑膠或金屬與塑膠之組成物,而於本實施例的扣具3表示為鋁材質,且外形呈一呈長方形狀說明,於具體實施時,該扣具3也可設計選擇其他材質及其他形狀(如正方形狀或菱形狀)。並該扣具3係以機械加工(如CNC加工)、壓鑄加工、沖壓加工或鍛造加工方式所製成,該扣具3係與對應該水冷頭2的上部214相連接,該扣具3具有一容設空間33、一中空的開孔31及複數貫孔32,該開孔31及該等貫孔32係不連通該容水空間216,該開孔31及該等貫孔32分別貫穿在該扣具3上,並於本實施例表示該開孔31的寬度大於該水冷頭2的上部214的寬度且小於該水冷頭2的下部215的寬度。而該等貫孔32係沿該扣具3的一周側設置,用以供該主機板5上的複數固定件52穿設固定,於本實施例表示該等貫孔32為6個貫孔32,其中4個貫孔32用以供該主機板5的固定板51上的該等螺合柱521(如4隻螺合柱521)穿設固定,令該等螺合柱521與對應的複數螺鎖件8(如4顆螺絲)相螺合,其餘2個貫孔32用以供該主機板5的固定板51上的該等定位柱522(如2隻定位柱522)穿設定位且固定,令該水冷頭2的下部215可穩固貼設在該主機板5的發熱元件6(如中央處理器(CPU)、顯示卡晶片(GPU)或ASIC晶片)上,以對該發熱元件6進行水冷循環散熱。 並於本實施例的扣具3是對應該發熱元件6為如英特爾(INTEL)廠牌的中央處理器(如CPU- I3),並搭配符合前述發熱元件6(如CPU- I3)的主機板5說明,但並不侷限於此。而該扣具3上開設的該等貫孔32的孔位置、形狀及數量可以事先根據該發熱元件6的廠牌及規格型號的需求設計,調整開設在該扣具3上的貫孔位置及貫孔的大小、形狀及數量,且搭配符合對應要鎖固該主機板5的固定板51上的螺合柱521及定位柱522的位置、形狀與數量。 再者,該扣具3的開孔31套設在該水冷頭2上,令水冷頭2承接(如套接)該扣具3,且前述側端部2142的結合區2143容設在該開孔31內,該側端部2142的結合區2143的外側與相鄰該開孔31的扣具3的一側相連接,而該側端部2142相鄰該頂端部的部分及頂端部2141則位於該開孔31的正上方且裸露在外。並於本實施例表示該上部214的側端部2142與扣具3的連接方式係以焊接方式(如錫焊接)連接,但並不侷限於此,於具體實施時,也可選用嵌接方式、螺接方式或黏接或卡接方式連接。該容設空間33凹設形成在該扣具3的另一側上,且連通該開孔31,並該下部215容設於對應該容設空間33內,該下部215的另一側平齊相鄰該扣具3的另一側。 在一替代實施例,改設計將該扣具3的容設空間33的寬度等於該上部214的頂端部214外周緣的寬度,且該上部214的頂端部214外周緣容納在該容設空間33內,並該扣具3與上部214以抵壓連接方式相接,例如藉由該扣具3與固定板52的該等固定件52相接固定時產生的一接合力,令該扣具3會產生一向下壓力對該上部214進行抵壓而連接,進而讓該水冷頭2可更緊貼穩固在發熱元件6上。 所以透過鍛造加工方式形成的上部214與切銷(如CNC)加工方式形成的下部215焊接結合為一體構成模組化的水冷頭2與可根據廠牌及規格型號製出的扣具3結合的設計,除了模組化的水冷頭2可適用各廠牌及多款不同規格型號的發熱元件6,藉以達到共用性高、節省管理成本、降低管控風險、增加生產穩定及提高生產效率,且還有效達到大量生產及降低成本的效果外, 並在製造及研發上只需針對不同發熱元件6的鎖固方式及廠牌及規格型號來對應設計該扣具3的外觀形狀及其上貫孔32位置,以有效達到縮短開發時間及降低研發成本的效果。 此外,由於本發明的模組化的水冷頭2本身並沒有提供與主機板5相鎖固的功能,相對的模組化的水冷頭2本身也不需要預留多餘與主機板5相鎖的鎖孔位置,讓該模組化的水冷頭2整體上可達到減輕整體重量及降低成本,並前述模組化的水冷頭2的上部214利用鍛造加工(如熱鍛加工)方式形成,使得可有效解決切銷加工(如CNC加工)在製程過程繁瑣複雜及製程時間過長的問題,進而有效達到降低成本。 另外,該上部214的進口211對接一貫穿過該開孔31的第一連接件25的一端,該出口212對接一貫穿過該開孔31的第二連接件26的一端,該第一、二連接件25、26的另一端則裸露在開孔31的上方外,並該第一、二連接件25、26的另一端分別用以供對應的一水管7相接設,且該第一、二連接件25、26內分別具有一第一連通孔251及一第二連通孔261,該第一、二連通孔251、261分別透過該進口211及出口212連通該容水空間216,並該第一、二連接件25、26分別連接一水冷散熱裝置(包含散熱水排及泵浦,圖中未示)的二水管7,令於該容水空間216內的該等散熱鰭片2151將接收到該發熱元件6的熱量與工作液體進行熱交換散熱後,使帶有熱量的工作液體由該出口212通過該第二連通孔261及連接的一水管7而流入到泵浦內,接著再由泵浦驅動而流動到散熱水排內進行散熱,然後經冷卻後的工作液體則經由連接的另一水管7內通過該第二連通孔261及進口211至該容水空間216內,一直不斷水循環散熱,來達到水冷散熱的效果。 因此,透過本發明此水冷頭扣具結構的設計,使得有效達到節省成本、減輕重量及大量生產,且還有效達到提升生產效率。 請參考第4A圖為本發明之第二實施例之立體分解示意圖;第4B圖為本發明之第二實施例之立體組合示意圖。該本實施例的水冷頭扣具結構的結構及連結關係及功效大致與前述第一實施例的水冷頭扣具結構的結構及連結關係及功效相同,故在此不重新贅述,本實施例主要是將前述第一實施例的上部214的側端部2142與扣具3以焊接方式結合,改設計該下部215的一側與面對該扣具3連接,亦即本實施例表示前述下部215與該扣具3的連接方式係以螺接方式結合,但並不侷限於此,於具體實施時,也可選擇為焊接方式或嵌接方式或卡接或黏接方式連接。並該下部215設有複數通孔2154,該等通孔2154貫穿在該下部215的角落處(如下部215的四個角落處)上,該等通孔2154用以供複數結合件4(如螺絲件)穿設固定。並該扣具3設有複數凸部34,該等凸部34設於對應該等通孔2154的該扣具3的一側上,於本實施例表示該等凸部34位於相鄰該開孔31的扣具3之一側上,且該等凸部34內具有一連接孔341,該等連接孔341用以供該等結合件4(如螺絲件)穿設固定至對應該等通孔2154內,令該扣具3的另一側與對應該下部215的一側相緊密接合。 在一替代實施例,該扣具3與下部215的連接方式為抵壓連接方式,例如藉由該扣具3與固定板52的該等固定件52相接固定時產生的一接合力,令該扣具3會產生一向下壓力對該下部215進行抵壓而連接,進而讓該水冷頭2可更緊貼穩固在發熱元件6上。 請參考第5圖為本發明之第三實施例之立體分解示意圖;第5A圖為本發明之第三實施例之立體組合示意圖;第5B圖為本發明之第三實施例之立體組合局部剖面示意圖;第6A圖為本發明之第三實施例之實施態樣分解示意圖;第6B圖為本發明之第三實施例之實施態樣組合示意圖。該本實施例的水冷頭扣具結構的結構及連結關係及功效大致與前述第二實施例的水冷頭扣具結構的結構及連結關係及功效相同,故在此不重新贅述,本實施例主要是將前述第二實施例的扣具3及其上貫孔32的孔位置、數量與形狀是對應發熱元件6為如英特爾(INTEL)廠牌第三代中央處理器(如簡稱為CPU- I3),並搭配符合該主機板5及其上螺合柱521及定位柱 522,改設計為該扣具3及其上貫孔32的孔位置、數量與形狀是對應發熱元件6為如INTEL廠牌第九代中央處理器(如簡稱為CPU- I9) ,並搭配符合該主機板5及其上定位柱522與未設有螺合柱521;亦即參考第6A、6B圖,本實施例表示該扣具3的該等貫孔32為4個貫孔32,所述 4個貫孔32用以供該主機板5的固定板51上的該等定位柱522(如4隻定位柱522)穿設定位且固定,且該主機板5的固定板51上未設有前述螺合柱521。另外,前述主機板5具有複數延伸部53,該等延伸部53設於該固定板51的兩相對側邊,該等延伸部53用以輔助夾持固定該扣具3,以穩固該扣具3,間接固定該水冷頭2穩定貼設在該發熱元件6上。 如下舉一實際實施說明: 當該主機板5上的發熱元件6為如INTEL廠牌第九代中央處理器(如簡稱為CPU- I9)時,此時使用者(或業者)直接將原先模組化的水冷頭2上鎖固有對應如AMD廠牌中央處理器的扣具3其上該等結合件4螺鬆拆卸下來,接著便將模組化的水冷頭2直接替換上另一個扣具3及其上貫孔32是對應如INTEL廠牌第九代中央處理器(如簡稱為CPU- I9),並透過該等結合件4穿設該等連接孔341螺鎖至該下部215的該等通孔2154內,令對應INTEL廠牌的扣具3與模組化的水冷頭2連接後,然後該扣具3的4個貫孔32直接套入至對應該主機板5上的該等定位柱522(如4隻定位柱522)上定位固定,同時該固定板51的該等延伸部53會夾持固定該扣具3的側邊,使該水冷頭2的下部215貼設在該發熱元件6上進行水冷循環散熱。 在一實施例,該扣具3具有複數散熱鰭片(圖中未示),該等散熱鰭片設於該扣具3的一側上,該等散熱鰭片用以將該扣具3上接收到該水冷頭2傳來的熱量迅速向外輻射散熱,藉以達到提升散熱效率。 所以透過本發明前述模組化的水冷頭2與扣具3相鎖固結合的設計,使模組化的水冷頭2可依據發熱元件6的廠牌及規格型號或散熱特性及能力套用不同款的扣具3(如對應不同廠牌、規格型號中央處理器的扣具3或具有散熱鰭片2151的扣具3),讓模組化的水冷頭2可達到共用性高,以有效達到降低成本及大量生產的效果,且還可達到扣具3與模組化的水冷頭2組裝拆換便利佳。The above objects, structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. The present invention is a water-cooled head fastener structure. Please refer to FIG. 1A for a perspective exploded schematic view of the first embodiment of the present invention; FIG. 1B is a perspective exploded schematic view for another perspective of the first embodiment of the present invention; FIG. 2A It is a three-dimensional schematic diagram of the first embodiment of the present invention; FIG. 2B is a partial cross-sectional schematic diagram of the three-dimensional assembly of the first embodiment of the present invention; FIG. 3A is an exploded schematic diagram of an implementation form of the first embodiment of the present invention; FIG. 3B is a schematic diagram of the implementation of the first embodiment of the present invention. The water-cooled head buckle structure should be installed on a water-cooled
2:水冷頭 211:進口 212:出口 214:上部 2141:頂端部 2142:側端部 2143:結合區 215:下部 2151:散熱鰭片 2153:凹槽 2154:通孔 216:容水空間 25:第一連接件 251:第一連通孔 26:第二連接件 261:第二連通孔 3:扣具 31:開孔 32:貫孔 33:容設空間 34:凸部 341:連接孔 4:結合件 5:主機板 51:固定板 52:固定件 521:螺合柱 522:定位柱 53:延伸部 6:發熱元件 7:水管 8:螺鎖件 2: water head 211: Import 212: Export 214: upper part 2141: The top part 2142: Side end 2143: Bonding zone 215: Lower part 2151: cooling fins 2153: Groove 2154: through hole 216: water-holding space 25: First connector 251: first communication hole 26: Second connector 261: Second communication hole 3: Buckle 31: opening 32: through hole 33: accommodation space 34: convex part 341: connection hole 4: Combined parts 5: motherboard 51: fixed plate 52: fixing 521: Bolt 522: Positioning column 53: Extension 6: heating element 7: Water pipe 8: screw lock
第1A圖為本發明之第一實施例之立體分解示意圖。 第1B圖為本發明之第一實施例之另一視角立體分解示意圖。 第2A圖為本發明之第一實施例之立體組合示意圖。 第2B圖為本發明之第一實施例之立體組合局部剖面示意圖。 第3A圖為本發明之第一實施例之實施態樣分解示意圖。 第3B圖為本發明之第一實施例之實施態樣組合示意圖。 第4A圖為本發明之第二實施例之立體分解示意圖。 第4B圖為本發明之第二實施例之立體組合示意圖。 第5圖為本發明之第三實施例之立體分解示意圖。 第5A圖為本發明之第三實施例之立體組合示意圖。 第5B圖為本發明之第三實施例之立體組合局部剖面示意圖。 第6A圖為本發明之第三實施例之實施態樣分解示意圖。 第6B圖為本發明之第三實施例之實施態樣組合示意圖。FIG. 1A is a three-dimensional exploded view of the first embodiment of the invention. FIG. 1B is a three-dimensional exploded schematic view of the first embodiment of the present invention. FIG. 2A is a three-dimensional schematic diagram of the first embodiment of the invention. FIG. 2B is a schematic partial cross-sectional view of the three-dimensional assembly of the first embodiment of the present invention. FIG. 3A is an exploded schematic view of the implementation form of the first embodiment of the present invention. FIG. 3B is a schematic diagram of the implementation of the first embodiment of the present invention. FIG. 4A is a three-dimensional exploded view of the second embodiment of the invention. FIG. 4B is a three-dimensional schematic diagram of the second embodiment of the invention. FIG. 5 is a three-dimensional exploded view of the third embodiment of the invention. FIG. 5A is a three-dimensional schematic diagram of a third embodiment of the invention. FIG. 5B is a partial cross-sectional schematic diagram of a three-dimensional combination of a third embodiment of the present invention. FIG. 6A is an exploded schematic diagram of an implementation form of a third embodiment of the invention. FIG. 6B is a schematic diagram of the implementation of the third embodiment of the present invention.
2:水冷頭 2: water head
25:第一連接件 25: First connector
26:第二連接件 26: Second connector
3:扣具 3: Buckle
32:貫孔 32: through hole
5:主機板 5: motherboard
51:固定板 51: fixed plate
52:固定件 52: fixing
521:螺合柱 521: Bolt
522:定位柱 522: Positioning column
6:發熱元件 6: heating element
7:水管 7: Water pipe
8:螺鎖件 8: screw lock
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107132790A TWI709017B (en) | 2018-09-18 | 2018-09-18 | Securing structure for water-cooling head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107132790A TWI709017B (en) | 2018-09-18 | 2018-09-18 | Securing structure for water-cooling head |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202013118A true TW202013118A (en) | 2020-04-01 |
TWI709017B TWI709017B (en) | 2020-11-01 |
Family
ID=71130546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107132790A TWI709017B (en) | 2018-09-18 | 2018-09-18 | Securing structure for water-cooling head |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI709017B (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW577579U (en) * | 2002-04-26 | 2004-02-21 | Wayvet Taiwan Corp | A liquid CPU cooler for computers |
TW573926U (en) * | 2003-06-11 | 2004-01-21 | Hon Hai Prec Ind Co Ltd | Fixing frame for heat sink |
TWM267813U (en) * | 2004-07-20 | 2005-06-11 | Neng-Chau Jang | Fastener for versatile heat sink |
TWM439107U (en) * | 2012-05-16 | 2012-10-11 | Enermax Technology Corp | External type gas-liquid composite cooling system |
TW201826470A (en) * | 2017-01-13 | 2018-07-16 | 雙鴻科技股份有限公司 | Cold plate |
CN207457954U (en) * | 2017-10-24 | 2018-06-05 | 于琰 | A kind of visual water-cooling head |
-
2018
- 2018-09-18 TW TW107132790A patent/TWI709017B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI709017B (en) | 2020-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI400032B (en) | Heat dissipation module and supporting element thereof | |
TWI784364B (en) | Heat dissipation module | |
US10809776B2 (en) | Water block mounting holder with reinforced structure | |
TWM512124U (en) | Butt type water cooling device | |
GB2601357A (en) | Modular thermal heat sink device | |
CN116324671A (en) | Cooling device for cooling components of a circuit board | |
US10378836B2 (en) | Water-cooling radiator assembly | |
CN110941316A (en) | Liquid cooling server and liquid cooling plate thereof, circuit board and mounting assembly of liquid cooling plate | |
CN109244052A (en) | Water-cooling head buckle structure | |
TWM540463U (en) | Lightweight liquid cooling plate set and heat dissipation system featuring plastic frame body | |
TW202013118A (en) | Securing structure for water-cooling head | |
CN108109976B (en) | Light liquid cooling plate set with plastic frame and heat dissipation system | |
US20230156962A1 (en) | Hybrid heat sink | |
TWM588235U (en) | Reinforcement structure of heat conduction member | |
JP5558536B2 (en) | Heat dissipation device | |
WO2022068908A1 (en) | Radiator and electronic device | |
TWI751742B (en) | Knockdown water-cooling unit latch device structure | |
TWM571514U (en) | Water-cooled head buckle structure | |
TWM560169U (en) | Mezzanine-type heat sink structure with turbulent flow unit | |
CN210119749U (en) | Heat dissipation device and notebook computer | |
CN208753305U (en) | Water-cooling head buckle structure | |
TWM610072U (en) | Water cooling apparatus | |
TWI756868B (en) | Knockdown water-cooling module latch device structure | |
TWI589834B (en) | Water cooling device with detachably assembled modularized units | |
CN217404811U (en) | Liquid cooling heat radiation structure of display card |