CN110941316A - Liquid cooling server and liquid cooling plate thereof, circuit board and mounting assembly of liquid cooling plate - Google Patents
Liquid cooling server and liquid cooling plate thereof, circuit board and mounting assembly of liquid cooling plate Download PDFInfo
- Publication number
- CN110941316A CN110941316A CN201911243575.5A CN201911243575A CN110941316A CN 110941316 A CN110941316 A CN 110941316A CN 201911243575 A CN201911243575 A CN 201911243575A CN 110941316 A CN110941316 A CN 110941316A
- Authority
- CN
- China
- Prior art keywords
- liquid
- liquid cooling
- cooling plate
- plate
- cooled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a liquid cooling server and a liquid cooling plate thereof, a circuit board and a mounting assembly of the liquid cooling plate, wherein the liquid cooling plate comprises: the liquid cooling plate main body is integrally formed by extrusion, a plurality of circulation holes which are arranged in parallel and penetrate through two end parts of the liquid cooling plate main body are arranged in the liquid cooling plate main body, the circulation holes are arranged in a spaced mode through spacing ribs, the end parts of part of the spacing ribs are provided with notches, at least one side of the liquid cooling plate is provided with a plurality of protruding parts, and the protruding parts are suitable for being attached to force calculating chips; the two end covers are respectively connected with the liquid cooling plate at two ends of the liquid cooling plate main body, the gaps of the spacing ribs are spaced from the end covers to form liquid passing channels, the circulation holes are connected end to end through the liquid passing channels to form cooling flow paths, and the end covers are provided with liquid inlets and liquid outlets. The liquid cooling plate is simple in structure and low in production cost by applying the metal profile extrusion process and the brazing process to the liquid cooling plate. The arrangement of the protruding part can enable the force calculating chip to be tightly attached to the liquid cooling plate, and the temperature uniformity of the liquid cooling plate is improved.
Description
Technical Field
The invention relates to the technical field of server cooling, in particular to a liquid cooling server and a liquid cooling plate thereof, a circuit board and a mounting assembly of the liquid cooling plate.
Background
With the rapid development of electronic information technology, the application of servers is more and more extensive. The large amount of energy consumption causes heat dissipation problems of the server to become particularly important.
In the related art, the server may use a liquid cooling plate having a heat dissipation function to dissipate heat. The liquid cooling plate of the traditional liquid cooling server is generally provided with an upper liquid cooling plate and a lower liquid cooling plate, and various processing procedures such as stamping, brazing, shaping, CNC (computer numerical control processing), riveting, shaping matching and the like are generally needed during production, so that the structural processing process of the liquid cooling plate is complex, the requirement on a mounting plane is high, and errors are easily generated in the manufacturing process. Complicated processing technology can lead to the installation back circuit board and the surface of liquid cooling board can not be fine laminating to can cause the chip heat dissipation bad, influence the heat dissipation temperature uniformity index of liquid cooling board.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a liquid cooling plate of a liquid cooling server, which is used for solving the problems that the structure processing technology of the liquid cooling plate of the traditional liquid cooling server is complex, the error is easy to cause, the production cost is high, and the heat dissipation performance is poor.
The invention also provides a circuit board with the liquid cooling plate and a mounting assembly of the liquid cooling plate.
The invention also provides a liquid cooling server with the mounting assembly of the circuit board and the liquid cooling plate.
According to a first aspect of the embodiments of the present invention, a liquid cooling plate of a liquid cooling server includes: the liquid cooling plate main body is integrally formed by extrusion, a plurality of circulation holes which are arranged in parallel and penetrate through two end parts of the liquid cooling plate main body are formed in the liquid cooling plate main body, the circulation holes are arranged in a spaced mode through spacing ribs, gaps are formed in the end parts of part of the spacing ribs, a plurality of protruding parts are arranged on at least one side of the liquid cooling plate, and the protruding parts are suitable for being connected with a force computing chip; the two end covers are respectively arranged at the two ends of the liquid cooling plate main body and connected with the liquid cooling plate through first fasteners, the gaps of the spacing ribs are spaced from the end covers and form liquid passing channels, the circulation holes are connected end to end through the liquid passing channels to form cooling flow paths, and the end covers are provided with liquid inlets and liquid outlets communicated with the cooling flow paths.
Therefore, according to the liquid cooling plate of the liquid cooling server provided by the embodiment of the invention, the aluminum profile extrusion process and the brazing process are applied to the liquid cooling plate, so that the liquid cooling plate can be directly formed, the liquid cooling plate is simple in structure, the processing procedures are few, and the production cost is low. The elastic pressing screw is arranged, so that the force calculation chip is tightly attached to the liquid cooling plate, and the temperature uniformity of the liquid cooling plate can be improved.
According to some embodiments of the invention, the liquid-cooled panel body includes a flat-shaped casing, the spacer ribs being connected within the casing to divide the casing into the plurality of flow holes, one end of each spacer rib being recessed with respect to an end of the casing to form the gap.
According to some embodiments of the invention, the gaps of two adjacent spacing ribs are arranged oppositely, one end of each spacing rib is formed with a gap, and the other end of each spacing rib abuts against the corresponding end cover.
According to some embodiments of the invention, at least one end of the spacer rib abutting the end cap has a first threaded hole, and a first fastener passes through the end cap to fit into the first threaded hole; and/or both ends of the end cover in the length direction are provided with positioning notches, the end part of the shell is provided with a positioning hole opposite to the positioning notches, and the end cover and the shell are positioned by a positioning pin penetrating through the positioning notches and the positioning hole; and/or the opposite edges of the liquid cooling plate in the width direction are provided with extension plates, and the extension plates are provided with positioning columns vertical to the central axis of the circulation hole; and/or the end cover is welded with the end part of the shell and the end part of the spacing rib.
According to some embodiments of the present invention, the liquid inlet and the liquid outlet are located at the same end of the liquid cooling plate main body, one of the end caps is connected to an end of the liquid cooling plate main body and closes a through hole at the end except the liquid inlet and the liquid outlet, and the water inlet joint and the water outlet joint are correspondingly inserted into the liquid inlet and the liquid outlet at two sides of the end cap.
According to some embodiments of the present invention, the liquid-cooled plate main body is a flat plate, the housing of the liquid-cooled plate main body includes a plurality of protrusions arranged side by side and recesses arranged between adjacent protrusions, the spacer rib is connected between the recesses arranged opposite to each other, and the spacer rib and inner walls of the protrusions facing each other define the circulation hole.
According to some embodiments of the invention, the liquid cooling plate main body has a second threaded hole passing through the boss and the spacing rib in sequence, the second threaded hole is a blind hole, and a plurality of the second threaded holes are open towards the same side.
According to some embodiments of the invention, the liquid-cooled plate body is brazed to the end cap, the liquid-cooled plate body is formed by metal extrusion and the second threaded hole has a hardened surface formed after heat treatment.
The mounting assembly of the circuit board and the liquid cooling plate comprises a main body plate, a plurality of force calculating chips, a plurality of liquid cooling units and a plurality of liquid cooling units, wherein the force calculating chips are distributed in a plurality of rows and a plurality of columns on one side of the main body plate; and the liquid cooling plate and the main body plate are stacked and arranged, the power calculating chip is attached to the boss of the liquid cooling plate, and the main body plate is detachably connected with the liquid cooling plate through a second fastener.
According to some embodiments of the invention, the second fastening member is a spring screw, the spring screw includes a fastening screw and a spring, the spring is sleeved on the fastening screw and is stopped between a head of the screw and the main body plate, and the fastening screw penetrates through the main body plate to be matched with the liquid cooling plate.
The liquid cooling server according to the third aspect embodiment of the present invention comprises the mounting assembly of the circuit board and the liquid cooling plate according to the second aspect embodiment of the present invention.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic view of a circuit board and liquid cooled board mounting assembly according to an embodiment of the invention;
FIG. 2 is a cross-sectional view of a liquid-cooled panel according to an embodiment of the invention;
FIG. 3 is a cross-sectional view A-A according to FIG. 2;
FIG. 4 is an enlarged view of B from FIG. 3;
FIG. 5 is a schematic view of a liquid-cooled panel according to an embodiment of the invention;
fig. 6 is a schematic view of the back of a mounting assembly of a circuit board and a liquid-cooled board according to an embodiment of the invention.
Reference numerals:
a liquid-cooled panel 100; a circuit board and liquid cooling board mounting assembly 200;
a liquid-cooled panel main body 10; a flow-through hole 11; a spacer rib 12; a notch 121; a first threaded hole 122; a second threaded hole 123; a housing 13; positioning holes 131; the boss portion 132; a recessed portion 133;
an end cap 20; a first fastener 21; a liquid passing channel 22; a liquid inlet 23; a liquid outlet 24;
positioning the notch 25;
an extension plate 30; a positioning post 31;
a through hole 40; a second fastener 60; a fastening screw 61; a spring 62;
a wiring board assembly 210; a main board body 211; a computational power chip 212;
a power supply interface 213; a data interface 214.
Detailed Description
Embodiments of the present invention will be described in detail below, the embodiments described with reference to the drawings being illustrative, and the embodiments of the present invention will be described in detail below.
A liquid-cooled plate 100 of a liquid-cooled server according to an embodiment of the first aspect of the present invention is described below with reference to fig. 1 to 6.
As shown in fig. 1 to 6, a liquid-cooling plate 100 of a liquid-cooling server according to an embodiment of the present invention includes a liquid-cooling plate main body 10 and an end cap 20.
Specifically, referring to fig. 1 to 3, the liquid cooling plate main body 10 is integrally formed by extrusion, a plurality of flow holes 11 are formed in the liquid cooling plate main body 10 in parallel and penetrate through two end portions of the liquid cooling plate main body 10, the plurality of flow holes 11 are spaced apart by the spacer 12, a part of the spacer 12 has a notch 121 at an end portion thereof, at least one side of the liquid cooling plate 100 has a plurality of protrusions 132, and the protrusions 132 are adapted to abut against the force calculating chip 212. The two end covers 20 are respectively connected with the liquid cooling plate 100 at two ends of the liquid cooling plate main body 10 and connected through a first fastener 21, the notches 121 of the spacing ribs 12 are spaced apart from the end covers 20 to form a liquid passing channel 22, the circulation holes 11 are connected end to end through the liquid passing channel 22 to form a cooling flow path, and the end covers 20 are provided with a liquid inlet 23 and a liquid outlet 24 which are communicated with the cooling flow path.
The liquid cooling plate 100 is composed of a liquid cooling plate main body 10, a front end cover 20 and a rear end cover 20, the section bar of the liquid cooling plate 100 can be integrally formed in an extrusion mode, and is machined through CNC (computer numerical control) after being cut to the required size requirement, and a liquid passing channel 22 and a plurality of connecting holes are machined in the liquid cooling plate main body 10. One side (for example, the lower end of fig. 3) of the liquid cooling plate 100 is provided with a plurality of protruding portions 132, a plurality of power computing chips 212 are correspondingly attached to the plurality of protruding portions 132, the power computing chips 212 and the liquid cooling plate 100 can be connected through fasteners such as elastic compression screws, so that the power computing chips 212 are closely attached to the protruding portions 132 and are in seamless contact with the protruding portions 132, the partition ribs 12 and the inner walls of the protruding portions 132 jointly define the circulation holes 11, heat generated by the power computing chips 212 can be conducted into cooling liquid in the circulation holes 11 through the protruding portions 132, and the cooling liquid circulates to cool the power computing chips 212, thereby improving the heat dissipation performance of the power computing chips 212 by the liquid cooling plate 100.
Referring to fig. 1, two end caps 20 are respectively disposed at the front and rear ends of the liquid cooling plate body 10, and after the two end caps 20 are pre-positioned, they are locked by a first fastener 21 such as a screw, and the end caps 20 are locked and then placed into a brazing furnace for brazing, so that the graphite jig can be used as a substitute for a conventional graphite jig and then welded for brazing, thereby simplifying the manufacturing process. Referring to fig. 2, the flow passage 22 may be a serpentine passage having a plurality of loops. A plurality of secondary cooling liquid can flow in from the liquid inlet 23 and flow out from the liquid outlet 24 through the liquid passage 22, so that the purpose of heat dissipation can be effectively achieved.
Of course, the end cap 20 of the present invention may be processed by various methods such as laser welding, high-strength bonding, friction stir welding, etc. besides the brazing method, and all of them fall within the protection scope of the present invention.
Alternatively, after the liquid cooling plate 100 profile is extruded, the screw threads can be directly tapped through the structural holes on the two sides to connect the water inlet joint and the water outlet joint, so that the liquid inlet 23 and the liquid outlet 24 are formed, and the liquid cooling plate 100 is simple and reliable in structure.
The traditional liquid cooling plate generally needs various processing procedures such as stamping, brazing, shaping, CNC (computer numerical control processing), riveting, shaping and the like during production, and the liquid cooling plate has more processing procedures and more complex process, so that the cost of a die and production is higher, and the requirement on the whole production process is higher. Compared with the traditional processing mode of the liquid cooling plate 100, the liquid cooling plate main body 10 disclosed by the invention can be integrally formed by a metal profile extrusion process, and can be processed without a graphite jig required by the traditional liquid cooling plate. The liquid passing channel 22 of the liquid cooling plate 100 can be directly formed, the forming is simple, large-area welding is not needed, the liquid passing channel 22 has no leakage hidden trouble, the liquid cooling plate main body 10 arranged in the way is reliable in structure and simple in process, only simple processing procedures such as extrusion forming and CNC (computer numerical control) can be used, and conventional extrusion materials with good manufacturability, such as aluminum or aluminum alloy materials, can be adopted for production. And the liquid cooling plate main body 10 is provided with a plurality of protruding parts 132, so that the computing power chip 212 can be ensured to be in seamless contact with the protruding parts 132, and the heat dissipation performance of the liquid cooling plate 100 to the computing power chip 212 is improved.
Further, the cost of a mould and a tool (comprising a set of stamping mould and a set of riveting mould) of ten thousand yuan is probably required to be invested in the traditional liquid cooling plate structure, and the cost of an extruded section mould of about ten thousand yuan is only required to be invested in the invention. Two end covers 20 are pre-fixed on the liquid cooling plate main body 10 through fasteners such as screws, and the subsequent processing mode of the liquid cooling plate 100 such as welding is small in area, so that the liquid cooling plate can be processed without a graphite jig required by the traditional liquid cooling plate, and the cost of the jig can be effectively saved. Moreover, the brazing jig required by the traditional liquid cooling plate can be used for a nitrogen protection continuous brazing furnace, the cost of the brazing jig is about one thousand yuan per set, four hundred sets of jigs are probably required for continuous welding production, the cost of the input jig needs forty thousand yuan, and the traditional liquid cooling plate is higher in processing. It should be noted that the price is referred to the price quoted by the supplier.
According to some embodiments of the present invention, referring to fig. 2, the liquid-cooled plate main body 10 includes a flat-shaped housing 13, and spacer ribs 12 are attached inside the housing 13 to partition the housing 13 into a plurality of flow holes 11, and one end of each spacer rib 12 is recessed with respect to an end of the housing 13 to form a notch 121. The cooling liquid can flow through the plurality of flow holes 11 and the notches 121 for the purpose of heat dissipation.
Specifically, the notches 121 of two adjacent spacing ribs 12 are oppositely arranged, one end of each spacing rib 12 is formed with the notch 121, and the other end abuts against the corresponding end cover 20. The spaced ribs 12 and the housing 13 and the end cap 20 are configured to cooperate to define a serpentine flow channel 22, thereby ensuring heat dissipation performance of the liquid-cooled panel 100.
According to some embodiments of the present invention, at least one end of the spacer rib 12 abutting the end cap 20 has a first threaded hole 122, and the first fastener 21 passes through the end cap 20 to fit into the first threaded hole 122. For example, referring to fig. 2, four first threaded holes 122 may be provided, respectively provided at the front and rear ends of the four spacing ribs 12, and a first fastening member 21, such as a fixing screw, may pass through the end cover 20 and the first threaded hole 122 to fix the end cover 20 to the liquid-cooling plate body 10.
In some embodiments of the present invention, both ends in the length direction (referring to fig. 1, the length direction is the front-rear direction) of the end cap 20 have positioning cutouts 25, the end portion of the outer case 13 has positioning holes 131 opposite to the positioning cutouts 25, and the end cap 20 and the outer case 13 are positioned by positioning pins passing through the positioning cutouts 25 and the positioning holes 131. The two end caps 20 may be pre-positioned by pins with the locating holes 131 and the locating cutouts 25.
According to some embodiments of the present invention, the liquid cooling plate 100 is formed with an extension plate 30 at the edge opposite to the width direction (the width direction is the left-right direction in conjunction with fig. 2), and the extension plate 30 is provided with a positioning column 31 perpendicular to the central axis of the circulation hole 11. The positioning column 31 can complete the initial installation and positioning of the liquid cooling plate 100 and the circuit board assembly 210. As shown in fig. 2, four extension plates 30 may be provided, wherein two extension plates are oppositely disposed on the left and right ends of the liquid-cooled plate 100 to extend outward in the left-right direction. The other two extension plates 30 are oppositely arranged on the edges of the left end and the right end of the liquid cooling plate 100 far away from the liquid inlet 23 and the liquid outlet 24 and extend outwards along the left-right direction so as to be provided with positioning holes 131.
Specifically, the positioning column 31 may be provided with two, one of them extension board 30 that can set up at the left end of liquid cooling plate 100, the other one may set up on the extension board 30 of liquid cooling plate 100 right-hand member to two extension boards 30 that are equipped with positioning column 31 do not correspond each other in the left-right direction, can make positioning column 31's span great, thereby can guarantee liquid cooling plate 100's overall structure stable.
Optionally, the end cap 20 is welded to the end of the housing 13 and the end of the spacer 12. Can be earlier with two end covers 20 carry out prepositioning, rethread first fastener 21 with end cover 20 locking on liquid cold plate main part 10, can weld the tip of end cover 20 and shell 13, interval muscle 12, can omit the step of fixing from traditional graphite tool during the welding to the manufacturing procedure of liquid cold plate 100 can be simplified.
Specifically, as shown in fig. 1-2, the liquid inlet 23 and the liquid outlet 24 are located at the same end of the liquid cooling plate main body 10, one of the end caps 20 is connected to the end of the liquid cooling plate main body 10, and closes the through hole 40 of the end except for the liquid inlet 23 and the liquid outlet 24, and the water inlet joint and the water outlet joint are correspondingly inserted into the liquid inlet 23 and the liquid outlet 24 at two sides of the end cap 20. Referring to fig. 1 and 2, the liquid outlet 24 and the liquid inlet 23 are located at the front end of the liquid-cooled plate body 10. The water inlet joint and the water outlet joint are correspondingly inserted in the liquid inlet 23 and the liquid outlet 24 respectively. At least one sealing ring is respectively sleeved on the water inlet joint and the water outlet joint, and the sealing rings can improve the sealing performance of the liquid cooling plate 100.
Further, as shown in fig. 3 and 4, the liquid-cooled plate main body 10 is a flat plate, the housing 13 of the liquid-cooled plate main body 10 includes a plurality of protrusions 132 arranged side by side and recesses 133 arranged between the adjacent protrusions 132, the spacing ribs 12 are connected between the recesses 133 arranged oppositely, and the spacing ribs 12 and the inner walls of the protrusions 132 opposite to each other define the circulation holes 11 together.
According to some alternative embodiments of the present invention, as shown in fig. 2 to 4, the liquid-cooled plate main body 10 has the second threaded hole 123 sequentially passing through the recessed portion 133 and the spacer 12, the second threaded hole 123 is a blind hole, and the plurality of second threaded holes 123 are open toward the same side. Referring to fig. 2, the number of the second threaded holes 123 is multiple, at least one second threaded hole 123 is provided on each spacer 12, the projections of the second threaded holes 123 on adjacent spacers 12 in the left-right direction do not overlap, and the projections of the second threaded holes 123 on the spacers 12 at the same direction end of each gap 121 in the left-right direction overlap correspondingly. The liquid cooling plate main body 10 thus arranged is structurally stable and reliable.
Optionally, the liquid-cooled plate body 10 is brazed with the end cap 20, the liquid-cooled plate body 10 is formed by metal extrusion, and the second threaded hole 123 has a hardened surface formed after heat treatment. The two end covers 20 can be fixed with the liquid cooling plate main body 10 and then placed in a brazing furnace for brazing, so that the step of welding after the traditional graphite jig is clamped can be omitted, and the processing technology can be simplified. The heat treatment process is simple, and the strength of the second screw hole 123 can be strengthened, thereby improving the structural stability of the liquid-cooled panel 100. For example, the liquid-cooled plate body 10 may be formed by aluminum alloy or aluminum extrusion
The mounting assembly 200 for a circuit board and a liquid-cooled plate according to the second embodiment of the present invention comprises a circuit board assembly 210 and a liquid-cooled plate 100. The circuit board assembly 210 includes a main board body 211 and a power calculating chip 212, and the main board body 211 may be a PCB or an aluminum substrate. The liquid cooling plate 100 and the main body plate 211 are stacked, the power calculating chip 212 abuts against the boss 132 of the liquid cooling plate 100, and the main body plate 211 is detachably connected with the liquid cooling plate 100 through the second fastening member 60. As shown in fig. 1, 3 and 4, the body plate 211 can be fixed on the liquid cold plate body 10 by the second fastening member 60, so that the computing power chip 212 and the liquid passing channel 22 can be attached seamlessly, and the heat dissipation effect on the computing power chip 212 can be ensured.
Specifically, as shown in fig. 3 to 6, the second fastening member 60 is a spring screw, the spring screw includes a fastening screw 61 and a spring 62, the spring 62 is sleeved on the fastening screw 61 and is abutted between the head of the screw and the main body plate 211, and the fastening screw 61 penetrates through the main body plate 211 to be matched with the liquid cooling plate 100. Referring to fig. 3 and 4, a plurality of biasing screws are disposed to be horizontally opposite to the concave portions 133, and a plurality of force calculating chips 212 are disposed to be horizontally opposite to the convex portions 132. The elastic pressing screw has an elastic pressing fixing mode, so that the circuit board assembly 210 and the liquid cooling plate main body 10 can be connected in an elastic pressing fixing mode, the computing chip 212 arranged on the circuit board assembly 210 can be guaranteed to be elastically pressed and attached to the outer surface of the liquid channel 22, pressing force is horizontal and controllable, and the temperature uniformity of heat dissipation of the computing chip 212 during working can be guaranteed. When the circuit board and liquid cooling board mounting assembly 200 is assembled, positioning is performed through the positioning column 31, and then the pressing screw penetrates through the main body board 211 and is connected to the second threaded hole 123 which is prefabricated on the liquid cooling board 100. Therefore, after the elastic screw is connected to the mounting assembly 200 of the circuit board and the liquid cooling plate, the spring 62 on the elastic screw is compressed, so as to generate pressure on the circuit board, so that the main body plate and the liquid cooling plate 100 can be tightly attached, and certainly, the protruding part 132 of the liquid cooling plate 100 and the force calculating chip 212 can be connected by using heat-conducting silicone grease, so that the force calculating chip 212 can be further ensured to be in seamless contact with the liquid passing channel 22, and further, the heat dissipation performance of the liquid cooling plate 100 on the force calculating chip 212 can be further improved.
The liquid cooling server according to the third aspect of the present invention comprises the mounting assembly 200 of the circuit board and the liquid cooling board according to the second aspect of the present invention. The mounting assembly 200 of the circuit board and the liquid cooling plate is provided with a data interface 214, a power interface 213 and other components to ensure the normal operation of the liquid cooling server.
For example, the liquid-cooled server may be a water-cooled server suitable for application to a virtual currency miner.
In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "radial", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In the description of the present invention, "a plurality" means two or more.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. A liquid cooling plate of a liquid cooling server, comprising:
the liquid cooling plate main body is integrally formed by extrusion, a plurality of circulation holes which are arranged in parallel and run through two end parts of the liquid cooling plate main body are arranged in the liquid cooling plate main body, the circulation holes are arranged in a spaced mode through spacing ribs, the end parts of a part of the spacing ribs are provided with notches, at least one side of the liquid cooling plate is provided with a plurality of protruding parts, and the protruding parts are suitable for being attached to a force calculating chip;
the two end covers are respectively arranged at the two ends of the liquid cooling plate main body and connected with the liquid cooling plate through first fasteners, the gaps of the spacing ribs are spaced from the end covers and form liquid passing channels, the circulation holes are connected end to end through the liquid passing channels to form cooling flow paths, and the end covers are provided with liquid inlets and liquid outlets communicated with the cooling flow paths.
2. The liquid cooled plate of claim 1, wherein the plate body includes a flat housing, the spacer ribs being connected within the housing to separate the housing into the plurality of flow holes, one end of each spacer rib being recessed relative to an end of the housing to form the gap.
3. The liquid cooled plate of claim 2, wherein the gaps of two adjacent spacers are oppositely disposed, and each spacer has a gap formed at one end and the other end abutting against the corresponding end cap.
4. The liquid cold plate of claim 2, wherein at least one end of the spacer rib abutting the end cap has a first threaded hole, and a first fastener passes through the end cap to mate with the first threaded hole; and/or
The end cover and the shell are positioned by a positioning pin penetrating through the positioning opening and the positioning hole; and/or
The opposite edges of the liquid cooling plate in the width direction are provided with extension plates, and the extension plates are provided with positioning columns vertical to the central axis of the circulation hole; and/or
The end cover is welded with the end part of the shell and the end part of the spacing rib.
5. The liquid-cooled plate of any one of claims 1-4, wherein the liquid inlet and the liquid outlet are located at the same end of the liquid-cooled plate body, one of the end caps is connected to the end of the liquid-cooled plate body and closes the through hole except the liquid inlet and the liquid outlet at the end, and the water inlet connector and the water outlet connector are correspondingly inserted into the liquid inlet and the liquid outlet at two sides of the end cap.
6. The liquid-cooled plate of any one of claims 1 to 4, wherein the liquid-cooled plate body is a flat plate, the housing of the liquid-cooled plate body includes a plurality of the protrusions arranged side by side and recesses arranged between adjacent protrusions, the spacer ribs are connected between the recesses arranged oppositely, and the spacer ribs and inner walls of the protrusions facing each other define the flow holes together.
7. The liquid cooling plate of claim 6, wherein the liquid cooling plate body has a second threaded hole that sequentially passes through the recess and the spacer rib, the second threaded hole being a blind hole, and a plurality of the second threaded holes being open toward the same side.
8. The liquid-cooled plate of claim 7, wherein the liquid-cooled plate body is brazed to the end cap, the liquid-cooled plate body is formed by extrusion of a metal and the second threaded bore has a hardened surface formed after heat treatment.
9. A circuit board and liquid cooling board's installation component, its characterized in that includes:
the circuit board assembly comprises a main board body and a plurality of force calculation chips which are connected to one side of the main board body and distributed in a plurality of rows and a plurality of columns; and
the liquid cooled plate of any of claims 1-8, wherein the liquid cooled plate is stacked with the body plate and the force calculating chip abuts the boss of the liquid cooled plate, and the body plate is removably connected to the liquid cooled plate via a second fastener.
10. The circuit board and liquid cooling plate mounting assembly of claim 9, wherein the second fastener is a compression screw, the compression screw includes a fastening screw and a spring, the spring is sleeved on the fastening screw and abuts between a head of the screw and the main plate, and the fastening screw passes through the main plate to be matched with the liquid cooling plate.
11. A liquid cooled server comprising a mounting assembly of a circuit board according to any one of claims 9 to 10 and a liquid cooled board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911243575.5A CN110941316A (en) | 2019-12-06 | 2019-12-06 | Liquid cooling server and liquid cooling plate thereof, circuit board and mounting assembly of liquid cooling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911243575.5A CN110941316A (en) | 2019-12-06 | 2019-12-06 | Liquid cooling server and liquid cooling plate thereof, circuit board and mounting assembly of liquid cooling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110941316A true CN110941316A (en) | 2020-03-31 |
Family
ID=69909092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911243575.5A Pending CN110941316A (en) | 2019-12-06 | 2019-12-06 | Liquid cooling server and liquid cooling plate thereof, circuit board and mounting assembly of liquid cooling plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110941316A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111799239A (en) * | 2020-07-13 | 2020-10-20 | 深圳比特微电子科技有限公司 | Liquid cooling device and electronic equipment |
| CN111813194A (en) * | 2020-08-26 | 2020-10-23 | 深圳杰微芯片科技有限公司 | Liquid-cooled heat dissipation server |
| WO2021227846A1 (en) * | 2020-05-12 | 2021-11-18 | 深圳比特微电子科技有限公司 | Liquid cooling plate suitable for liquid-cooling heat dissipation of electronic device, and heat dissipation unit |
| CN114637382A (en) * | 2022-04-06 | 2022-06-17 | 东莞市东一思创电子有限公司 | Aluminum alloy liquid cooling radiator of ultra-high-power GPU server |
| CN114954288A (en) * | 2022-05-30 | 2022-08-30 | 禾多科技（北京）有限公司 | Central domain controller and vehicle |
-
2019
- 2019-12-06 CN CN201911243575.5A patent/CN110941316A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021227846A1 (en) * | 2020-05-12 | 2021-11-18 | 深圳比特微电子科技有限公司 | Liquid cooling plate suitable for liquid-cooling heat dissipation of electronic device, and heat dissipation unit |
| US20230086448A1 (en) * | 2020-05-12 | 2023-03-23 | Shenzhen Microbt Electronics Technology Co., Ltd. | Liquid cooling plate suitable for liquid cooling heat dissipation of electronic device, and heat dissipation unit |
| CN111799239A (en) * | 2020-07-13 | 2020-10-20 | 深圳比特微电子科技有限公司 | Liquid cooling device and electronic equipment |
| CN111813194A (en) * | 2020-08-26 | 2020-10-23 | 深圳杰微芯片科技有限公司 | Liquid-cooled heat dissipation server |
| CN114637382A (en) * | 2022-04-06 | 2022-06-17 | 东莞市东一思创电子有限公司 | Aluminum alloy liquid cooling radiator of ultra-high-power GPU server |
| CN114954288A (en) * | 2022-05-30 | 2022-08-30 | 禾多科技（北京）有限公司 | Central domain controller and vehicle |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110941316A (en) | Liquid cooling server and liquid cooling plate thereof, circuit board and mounting assembly of liquid cooling plate | |
| CN215935363U (en) | Liquid cooling head | |
| JP7118186B2 (en) | Heat dissipation device | |
| JP2005505927A (en) | Heat collector with mounting plate | |
| TWM505164U (en) | Single-board computer locking structure performing heat dissipation by thermal conduction | |
| CN213694681U (en) | Heat radiation module | |
| US6680849B2 (en) | Extruded heatsink and EMC enclosure | |
| US10873245B2 (en) | Cold plate for a linear motor | |
| CN106455456A (en) | Copper-aluminum compound water-cooling plate and processing and manufacturing method thereof as well as water-cooling heat dissipation method | |
| CN112752488B (en) | Phase change heat pipe and liquid cooling combined radiating case | |
| CN217485929U (en) | Composite base of laser pumping source | |
| JPH0738025A (en) | Cooling structure | |
| CN211454505U (en) | Liquid cooling server and liquid cooling plate thereof, circuit board and mounting assembly of liquid cooling plate | |
| CN113346161A (en) | Liquid-cooled panel and method for manufacturing same | |
| CN212393136U (en) | Power adapter with radiating fins | |
| CN218769764U (en) | Liquid cooling assembly and energy storage device | |
| EP3709776A1 (en) | Circuit board heat dissipation assembly | |
| JP2007019365A (en) | Micro heat sink and jacket using the same | |
| CN210042719U (en) | Heat conduction mechanism and circuit assembly | |
| TWM608496U (en) | Combined water cooling unit buckle structure | |
| CN220253314U (en) | Battery pack and energy storage system | |
| TWI709017B (en) | Securing structure for water-cooling head | |
| CN210406041U (en) | Radiator and electronic equipment | |
| WO2023162413A1 (en) | Cooler, method for manufacturing cooler, semiconductor device, and method for manufacturing semiconductor device | |
| EP4188043A1 (en) | Method for assembling a liquid cooling assembly of a family of liquid cooling assemblies |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |