TW202009602A - Fine metal mask and method for making the same - Google Patents

Abstract

A fine metal mask has a central pattern portion and a reinforcement frame. The central pattern portion has a mask pattern. The reinforcement frame is connected with a peripheral edge of the central pattern portion. The reinforcement frame is thicker than the central pattern portion. The fine metal mask is made by electroforming process. A method of making the fine metal mask has the steps of: sputtering a metal layer on a glass substrate; electroforming the central pattern portion and the reinforcement frame on the metal layer; removing the metal layer and the glass substrate, so as to obtaining the fine metal mask. The fine metal mask is not easily to be deflected, has long lifetime, and is beneficial to enhance the yield of OLED.

Description

Fine metal mask and its manufacturing method

The invention relates to a fine metal mask and its manufacturing method.

Organic Light-Emitting Diode (OLED) is widely used in e-books, mobile phones, displays and other products due to its advantages of self-luminescence, wide viewing angle, power saving, high efficiency, response time, and thinness and lightness. in. The OLED includes a glass substrate, an organic light-emitting material layer and an electrode layer. The organic light-emitting material layer is arranged on the glass substrate, and the electrode layer is arranged on the organic light-emitting material layer. Among them, the organic light-emitting material layer is formed on the glass substrate by evaporation, and the mask pattern of the fine metal mask used during evaporation not only determines the placement of the organic light-emitting material layer on the glass substrate, but also determines The size and fineness of the organic light-emitting material layer affect the pixel height of the OLED display.

In order to improve the pixels of the OLED display, the conventional technology uses a fine metal mask (FMM) to form an organic light-emitting material layer in the evaporation process. The manufacturing methods of the fine metal mask of the conventional technology are divided into an etching method and an electroforming method. Due to the shortcomings of the etching method, such as over-etching and passivation of the mask pattern, compared with the etching method, the position of the mask pattern of the fine metal mask made by electroforming can be more accurate and the aperture accuracy can reach several microns (μm ).

However, the thickness of the fine metal mask made by electroforming is relatively thin, and the overall structural strength is weak, and it is easy to deflect due to external forces, resulting in the mask pattern cannot be accurately aligned with the intended position of the organic light-emitting material layer in use. Problems, which in turn affect the service life of fine metal masks and the yield of OLED displays.

The invention provides a fine metal mask, which is not easy to deflect due to external force, has a long service life and can improve the yield of the OLED display.

The invention also provides a method for manufacturing a fine metal mask. The manufactured fine metal mask is not easy to be flexed by external force, has a long service life and can improve the yield of the OLED display.

To achieve one or more of the above objectives, the fine metal mask provided by the present invention includes a central pattern portion and a reinforced outer frame. The central pattern part has a mask pattern. The reinforced outer frame is connected to the outer edge of the central pattern portion. The thickness of the reinforced outer frame is greater than the thickness of the central pattern portion, and the fine metal mask is made by an electroforming process.

In an embodiment of the present invention, the central pattern portion further includes a first central portion of the first electroformed layer, a mask pattern is formed on the first central portion, and the reinforced outer frame further includes the first electroformed layer The first peripheral part and the second electroformed layer, the first peripheral part is adjacent to the first central part, the second electroformed layer is stacked on the first peripheral part, the second electroformed layer and the first central part A through hole is formed between the two, and the through hole communicates with the mask pattern.

In an embodiment of the invention, the above-mentioned reinforced outer frame further includes a third electroformed layer, the second electroformed layer further includes a second central portion and a second peripheral portion, the second peripheral portion is adjacent to the second central portion, The third electroformed laminate is provided on the second peripheral portion, and a through hole is formed between the third electroformed layer and the second central portion, and the through hole communicates with the through hole.

In an embodiment of the present invention, the material of the above-mentioned fine metal mask is selected from the group consisting of iron, cobalt, nickel, and alloys of at least two of the above.

In order to achieve one or more of the above objectives, the method for manufacturing a fine metal mask provided by the present invention includes: sputtering to form a metal layer on a glass substrate; and electroforming to form a central pattern portion and strengthening the outer frame on the metal layer, And remove the metal layer and the glass substrate to obtain a fine metal mask. The reinforced outer frame is connected to the outer edge of the central pattern portion, the central pattern portion has a mask pattern, the thickness of the reinforced outer frame is greater than the thickness of the central pattern portion, and the fine metal mask includes the central pattern portion and the reinforced outer frame.

In an embodiment of the present invention, the above-mentioned electroforming forms a central pattern portion and reinforces the outer frame on the metal layer, and the step of removing the metal layer and the glass substrate to obtain a fine metal mask further includes: on the metal layer Forming a first patterned photoresist layer, the first patterned photoresist layer exposes the first predetermined electroformed surface of the metal layer; the first electroformed layer is electroformed on the first predetermined electroformed surface, the first electroformed layer Having a first central portion and a first peripheral portion adjacent to the first central portion, the first central portion is connected to the first patterned photoresist layer, the first peripheral portion has a second predetermined electroformed surface; Forming a second patterned photoresist layer on the central portion and the first patterned photoresist layer, wherein the second patterned photoresist layer exposes the second predetermined electroformed surface; Two electroformed layers; and, removing the first patterned photoresist layer, the second patterned photoresist layer, the metal layer and the glass substrate to obtain a fine metal mask. After removing the first patterned photoresist layer, a mask pattern is formed on the first central portion, and after removing the second patterned photoresist layer, a through hole is formed between the second electroformed layer and the first central portion, The through hole communicates with the mask pattern, the central pattern portion further includes the first central portion of the first electroformed layer, and the reinforced outer frame further includes the first peripheral portion of the first electroformed layer and the second electroformed layer.

In an embodiment of the present invention, the above steps of removing the first patterned photoresist layer, the second patterned photoresist layer, the metal layer and the glass substrate to obtain a fine metal mask further include: A patterned photoresist layer and a second patterned photoresist layer are removed and the first protective film is covered on the second electroformed layer and the first electroformed layer is adjacent to one side of the second electroformed layer; and the metal layer And the glass substrate is removed and the second protective film is covered on the side of the first electroformed layer away from the second electroformed layer to obtain a fine metal mask between the first protective film and the second protective film.

In an embodiment of the invention, the above-mentioned second electroformed layer further has a second central portion and a second peripheral portion adjacent to the second central portion. The second central portion is connected to the second patterned photoresist layer. The second peripheral portion has a third predetermined electroformed surface. The step of electroforming to form the central pattern part and strengthen the outer frame on the metal layer, and remove the metal layer and the glass substrate to obtain a fine metal mask. The step further includes: forming on the second central part and the second patterned photoresist layer A third patterned photoresist layer, wherein the third patterned photoresist layer exposes a third predetermined electroformed surface; and, electroforming on the third predetermined electroformed surface to form a third electroformed layer. The steps of removing the first patterned photoresist layer, the second patterned photoresist layer, the metal layer and the glass substrate to obtain a fine metal mask further include: the first patterned photoresist layer and the second patterned photoresist The layer, the third patterned photoresist layer, the metal layer and the glass substrate are removed to obtain a fine metal mask. After the third patterned photoresist layer is removed, a through hole is formed between the third electroformed layer and the second central portion, the through hole communicates with the through hole, and the reinforced outer frame further includes the third electroformed layer.

In an embodiment of the present invention, the first patterned photoresist layer, the second patterned photoresist layer, the third patterned photoresist layer, the metal layer and the glass substrate are removed to obtain a fine metal mask The step further includes: removing the first patterned photoresist layer, the second patterned photoresist layer and the third patterned photoresist layer and covering the first protective film on the third electroformed layer and the second electroformed layer The layer and the first electroformed layer are adjacent to one side of the second electroformed layer; and, the metal layer and the glass substrate are removed and the second protective film is covered on the first electroformed layer away from the second electroformed layer and the third One side of the electroformed layer to obtain a fine metal mask between the first protective film and the second protective film.

In the manufacturing method of the fine metal mask and the fine metal mask of the present invention, since the reinforced outer frame is connected to the outer edge of the central pattern portion, and the thickness of the reinforced outer frame is greater than the thickness of the central pattern layer, the central pattern portion can be used or During transportation, it is kept flat and not easily flexed. The mask pattern can be accurately aligned with the predetermined setting position of the organic light-emitting material layer after multiple uses. Therefore, the use of the fine metal mask of the present invention is long-lived and beneficial to improve the yield of OLED displays.

To make the above and other objects, features, and advantages of the present invention more comprehensible, embodiments are described below in conjunction with the accompanying drawings, which are described in detail below.

FIG. 1 is a schematic diagram of a fine metal mask according to an embodiment of the invention. Referring to FIG. 1, the fine metal mask 100 of this embodiment includes a central pattern portion 110 and a reinforced outer frame 120. The central pattern portion 110 has a mask pattern 111. The reinforced outer frame 120 is connected to the outer edge of the central pattern portion 110, and The thickness T1 of the reinforced outer frame 120 is greater than the thickness T2 of the central pattern portion 110, and the fine metal mask 100 is made by electroforming technology.

The aforementioned central pattern portion 110 may further include the first central portion 210 of the first electroformed layer 200, the mask pattern 111 is formed on the first central portion 210, and the reinforced outer frame 120 may further include the first electroformed layer 200. The first peripheral portion 220 and the second electroformed layer 300, the first peripheral portion 220 is adjacent to the first central portion 210, the second electroformed layer 300 is stacked on the first peripheral portion 220, and the second electroformed layer A through hole 310 is formed between 300 and the first central portion 210, and the through hole 310 communicates with the mask pattern 111. In this embodiment, the total thickness of the first peripheral portion 220 and the second electroformed layer 300 may be the thickness T1 of the reinforced outer frame 120, and the thickness of the first central portion 210 may be the thickness T2 of the central pattern portion 110. In addition, the aperture D1 of the mask pattern 111 may be smaller than the aperture D2 of the through hole 310. For example, the aperture D1 of the mask pattern 111 may be 25 μm, for example, and the aperture D2 of the through hole 310 may be 80 μm, for example. This is limited.

In the fine metal mask 100 of this embodiment, the mask pattern 111 of the central pattern portion 110 can be used to fabricate the organic light emitting material layer of the OLED. Since the reinforced outer frame 120 is connected to the outer edge of the central pattern portion 110, The thickness is greater than the thickness of the central pattern layer, so the overall structural strength of the fine metal mask 100 can be improved, and the central pattern portion 110 can be prevented from flexing due to external forces during use or transportation, so that the central pattern portion 110 can be kept flat and the mask The pattern 111 can be accurately aligned with a predetermined setting position of the organic light-emitting material layer after multiple uses. Therefore, the fine metal mask 100 of this embodiment not only has a long service life but also helps to improve the yield of the OLED display. In addition, the fine metal mask 100 of this embodiment is made by electroforming, so the position of the mask pattern 111 is accurate and the aperture accuracy can reach several microns, and there is no problem of sewage treatment and etching solution management like etching .

2 is a flowchart of a method for manufacturing a fine metal mask according to an embodiment of the invention. Please refer to FIG. 2, the manufacturing method of the fine metal mask of this embodiment includes: step S100: forming a metal layer on a glass substrate by sputtering; and step S200: forming a central pattern portion and strengthening the outer frame on the metal layer by electroforming, and Remove the metal layer and the glass substrate to obtain a fine metal mask. The manufacturing method of the fine metal mask of this embodiment can produce the fine metal mask 100 shown in FIG. 1.

FIG. 3 is a flowchart of step S200 of the manufacturing method of the fine metal mask of FIG. 2. 2 and 3, step S200 may further include: step S210: forming a first patterned photoresist layer on the metal layer; step S220: forming the first electroformed layer on the first predetermined electroformed surface of the metal layer by electroforming Step S230: forming a second patterned photoresist layer on the first central portion of the first electroformed layer and the first patterned photoresist layer; step S240: electroforming the second electroformed layer on the first electroforming On the second predetermined electroformed surface of the layer; and step S250: removing the first patterned photoresist layer, the second patterned photoresist layer, the metal layer and the glass substrate to obtain a fine metal mask.

FIG. 4A is a schematic diagram corresponding to step S100 in FIG. 2. 2 and 4A, in step S100, the metal layer 500 is formed on the glass substrate 510 by sputtering. The material of the metal layer 500 may be, but not limited to, conductive metals such as copper, platinum, gold and silver, glass, etc. The material of the substrate 510 may be, for example, but not limited to tin oxyfluoride, indium tin oxide, or silicon. The metal layer 500 may be formed on the glass substrate 510 by sputtering methods such as direct current sputtering, radio frequency sputtering, or triode sputtering. The present invention does not limit the sputtering method.

FIG. 4B is a schematic diagram corresponding to step S210 in FIG. 3. 3 and 4B, in step S210, the first patterned photoresist layer 600 is formed on the metal layer 500, and the first patterned photoresist layer 600 exposes the first predetermined electroformed surface 501 of the metal layer 500; In this embodiment, the first patterned photoresist layer 600 is a dry film photoresist, but not limited thereto; in other embodiments, the first patterned photoresist layer 600 may also be a wet film photoresist. In addition, in this embodiment, the first patterned photoresist layer 600 is a positive photoresist, but it is not limited thereto. In other embodiments, the first patterned photoresist layer 600 may also be a negative photoresist.

FIG. 4C is a schematic diagram corresponding to step S220 in FIG. 3. 3 and 4C, in step S220, the first electroformed layer 200 is formed on the first predetermined electroformed surface 501 by electroforming. The first electroformed layer 200 has a first central portion 210 and is adjacent to the first A first peripheral portion 220 of a central portion 210 is connected to the first patterned photoresist layer 600. The first peripheral portion 220 has a second predetermined electroformed surface 221. The material of the first electroformed layer 200 may be, for example, iron, cobalt, nickel, or an alloy of at least two of the above. In addition, the thickness T2 of the first electroformed layer 200 may be, for example, 3 μm to 5 μm, and further, for example, 4 μm, but it is not limited thereto.

FIG. 4D is a schematic diagram corresponding to step S230 in FIG. 3. 3 and 4D, in step S230, the second patterned photoresist layer 610 is formed on the first central portion 210 of the first electroformed layer 200 and the first patterned photoresist layer 600. The second patterned photoresist layer 610 exposes the second predetermined electroformed surface 221. In this embodiment, the second patterned photoresist layer 610 is a dry film photoresist, but not limited thereto; in other embodiments, the second patterned photoresist layer 610 may also be a wet film photoresist. In addition, in this embodiment, the second patterned photoresist layer 610 is a positive photoresist, but it is not limited thereto. In other embodiments, the second patterned photoresist layer 610 may also be a negative photoresist.

FIG. 4E is a schematic diagram corresponding to step S240 in FIG. 3. 3 and 4E, in step S240, the second electroformed layer 300 is formed on the second predetermined electroformed surface 221 of the first electroformed layer 200 by electroforming. The material of the second electroformed layer 300 may be, for example, iron, cobalt, nickel, or an alloy of at least two of the above. In addition, the total thickness T1 of the second electroformed layer 300 and the first peripheral portion 220 may be, for example, 50 μm to 100 μm, and further, for example, 75 μm, but not limited thereto. The thickness T2 of the first electroforming layer 200 can be equal to the thickness of the first peripheral portion 220.

FIG. 4F is a schematic diagram corresponding to step S250 in FIG. 3. Referring to FIGS. 1, 3, 4E, and 4F, in step S250, after removing the first patterned photoresist layer 600, the second patterned photoresist layer 610, the metal layer 500, and the glass substrate 510, a fine metal is obtained Mask 100. After the first patterned photoresist layer 600 is removed, a mask pattern 111 is formed on the first central portion 210. After the second patterned photoresist layer 610 is removed, a through hole 310 can be formed in the second electroformed layer 300 and the first Between the central portions 210, the through holes 310 communicate with the mask pattern 111, and the fine metal mask 100 can include the first electroformed layer 200, the second electroformed layer 300, the through holes 310, and the mask pattern 111; further, The central pattern portion 110 may further include a first central portion 210, and the reinforced outer frame 120 may further include a first peripheral portion 220 and a second electroformed layer 300. The second electroformed layer 300 is stacked on the first peripheral portion 220 on. In addition, the mask pattern 111 may be a regular shape such as a rectangle, a diamond, a circle, and a polygon, but may also be an irregular shape. The present invention does not limit the shape and aperture of the mask pattern 111.

In addition, in the manufacturing method of the fine metal mask of this embodiment, the first patterned photoresist layer 600 can be obtained by exposing the photoresist and developing the exposed photoresist using, for example, lithography technology; similarly, the second pattern The photoresist layer 610 can also be obtained by lithography, but the invention is not limited thereto.

FIG. 5 is a flowchart of step S250 of the method for manufacturing a fine metal mask according to an embodiment of the invention. Please refer to FIG. 5. Step S250 may further include: Step S251: removing the first patterned photoresist layer and the second patterned photoresist layer and covering the first protective film adjacent to the second electroformed layer and the first electroformed layer On one side of the second electroformed layer; and step S252: removing the metal layer and the glass substrate and covering the second protective film on the side of the first electroformed layer away from the second electroformed layer to obtain a fine metal mask Between the first protective film and the second protective film.

6A and 6B are schematic diagrams corresponding to steps S251 and S252 in FIG. 5. Referring to FIGS. 4E, 5, 6A and 6B, in step S251, the first patterned photoresist layer 600 and the second patterned photoresist layer 610 are removed to form a through hole 310 and a mask pattern 111, and then the A protective film 700 covers the first protective film 700 on one side of the second electroformed layer 300 and the first electroformed layer 200 adjacent to the second electroformed layer 300, and can close the end of the through hole 310 away from the mask pattern 111; In step S252, after removing the metal layer 500 and the glass substrate 510, the second protective film 710 is covered on the side of the first electroformed layer 200 away from the second electroformed layer 300 to close the mask pattern 111 away from the through hole One end of 310 to obtain the fine metal mask 100 between the first protective film 700 and the second protective film 710. In addition, the first protective film 700 and the second protective film 710 may be, for example, photo-curable release films, but not limited thereto.

In the manufacturing method of the fine metal mask of this embodiment, by covering the first protective film 700 and the second protective film 710 on the fine metal mask 100, the advantage of protecting the fine metal mask 100 from dust or abrasion can be achieved .

7 is a schematic diagram of a fine metal mask according to an embodiment of the invention. Referring to FIG. 7, in the fine metal mask 100 of this embodiment, the reinforced outer frame 120 may further include a third electroformed layer 400, and the second electroformed layer 300 may further include a second central portion 320 and a second peripheral portion 330 , The second peripheral portion 330 is adjacent to the second central portion 320, the third electroformed layer 400 is stacked on the second peripheral portion 330, and a through hole 410 is formed between the third electroformed layer 400 and the second central portion 320 The hole 410 communicates with the through hole 310. In this embodiment, the thickness T1 of the reinforced outer frame 120 is the total thickness of the third electroformed layer 400, the second peripheral portion 330 and the first peripheral portion 220. In addition, the diameter D2 of the through hole 310 is smaller than the diameter D3 of the through hole 410.

8 is a flowchart of step S200 of the method for manufacturing a fine metal mask according to an embodiment of the invention. Please refer to FIG. 8, in the manufacturing method of the fine metal mask of this embodiment, step S200 may further include between step S240 and step S250: step S260: forming a third patterned photoresist layer on the second electroformed layer and the second Two patterned photoresist layers; and Step S270: Electroforming to form a third electroforming layer on the third predetermined electroforming surface of the second peripheral portion of the second electroforming layer. The manufacturing method of the fine metal mask of this embodiment can produce the fine metal mask 100 shown in FIG. 6.

FIG. 9A is a schematic diagram corresponding to step S240 in FIG. 8. 8 and 9A, in step S240, the second electroformed layer 300 may further have a second central portion 320 and a second peripheral portion 330 adjacent to the second central portion 320, the second central portion 320 and the second pattern The photoresist layer 610 is connected, and the second peripheral portion 330 has a third predetermined electroformed surface 331. In addition, the thickness of the first electroformed layer 200 (that is, the thickness T2 of the first electroformed layer 200) may be, for example, 3 μm to 5 μm, and further, for example, 5 μm, but not limited thereto. The total thickness T3 of the second electroformed layer 300 and the first peripheral portion 220 may be, for example, 20 μm to 100 μm, and further, for example, 30 μm, but not limited thereto.

FIG. 9B is a schematic diagram corresponding to step S260 in FIG. 8. 8 and 9B, in step S260, the third patterned photoresist layer 620 is formed on the second central portion 320 of the second electroformed layer 300 and the second patterned photoresist layer 610. The third patterned photoresist layer 620 exposes the third predetermined electroformed surface 331. In this embodiment, the third patterned photoresist layer 620 is a dry film photoresist, but not limited thereto; in other embodiments, the third patterned photoresist layer 620 may also be a wet film photoresist. In addition, in this embodiment, the third patterned photoresist layer 620 is a positive photoresist, but not limited thereto. In other embodiments, the third patterned photoresist layer 620 may also be a negative photoresist.

9C is a schematic diagram corresponding to step S270 in FIG. 8. 8 and 9C, in step S270, the third electroformed layer 400 is formed on the third predetermined electroformed surface 331 of the second electroformed layer 300 by electroforming. The material of the third electroformed layer 400 may be, for example, iron, cobalt, nickel, or an alloy of at least two of the above. In addition, the total thickness of the third electroformed layer 400, the second peripheral portion 330, and the first peripheral portion 220 (that is, the thickness T1 of the reinforced outer frame 120) may be, for example, 50 μm to 100 μm, but not limited thereto.

FIG. 9D is a schematic diagram corresponding to step S250 in FIG. 8. Referring to FIGS. 7, 8, 9C, and 9D, in step S250, the first patterned photoresist layer 600, the second patterned photoresist layer 610, the third patterned photoresist layer 620, the metal layer 500, and the glass substrate After 510 is removed, the fine metal mask 100 can be obtained. After the third patterned photoresist layer 620 is removed, a through hole 410 may be formed between the third electroformed layer 400 and the second central portion 320, the through hole 410 communicates with the through hole 310, and the reinforced outer frame 120 may further include a third Electroforming layer 400.

In addition, in the manufacturing method of the fine metal mask of this embodiment, the first patterned photoresist layer 600 can be obtained by exposing the photoresist and developing the exposed photoresist using, for example, lithography technology; similarly, the second The patterned photoresist layer 610 and the third patterned photoresist layer 620 can also be obtained by lithography, but the invention is not limited thereto.

In the manufacturing method of the fine metal mask 100 of this embodiment, the first electroformed layer 200 with a relatively thin thickness is formed first, and then the second electroformed layer 300 and the third electroformed with a relatively thick thickness are formed by thickening The layer 400 obtains the reinforced outer frame 120. Among them, since the mask pattern 111 is formed on the first central portion 210 of the first electroforming layer 200 which is formed earlier and has a relatively thin thickness, the position, shape and aperture of the mask pattern 111 can be accurately controlled, then Help to improve the yield of OLED displays.

10 is a flowchart of step S250 of the method for manufacturing a fine metal mask according to an embodiment of the invention. Referring to FIG. 10, step S250 may further include: step S251a: removing the first patterned photoresist layer, the second patterned photoresist layer, and the third patterned photoresist layer, and covering the first protective film on the third The electroformed layer, the second electroformed layer and the first electroformed layer are adjacent to one side of the second electroformed layer; and step S252a: removing the metal layer and the glass substrate and covering the second protective film away from the first electroformed layer On one side of the second electroformed layer and the third electroformed layer, a fine metal mask is obtained between the first protective film and the second protective film.

11A and 11B are schematic diagrams corresponding to steps S251a and S252a in FIG. 10. 9C, 10, 11A, and 11B, in step S250, the first patterned photoresist layer 600, the second patterned photoresist layer 610, and the third patterned photoresist layer 620 are removed to form a through hole 410, the through hole 310 and the mask pattern 111, and then cover the first protective film 700 on the third electroformed layer 400, the second electroformed layer 300 and the first electroformed layer 200 adjacent to one of the second electroformed layer 300 The side can close the through hole 410 away from the end of the mask pattern 111 and the through hole 310; in step S252, after removing the metal layer 500 and the glass substrate 510, the second protective film 710 is covered on the first electroforming layer 200 One side away from the second electroforming layer 300 and the third electroforming layer 400 can close the end of the mask pattern 111 away from the through hole 310, thereby obtaining the fine metal mask 100 on the first protective film 700 and the second protective film Between 710. In addition, the first protective film 700 and the second protective film 710 may be, for example, photocurable release films, but not limited thereto.

In the manufacturing method of the fine metal mask of this embodiment, by covering the first protective film 700 and the second protective film 710 on the fine metal mask 100, the advantage of protecting the fine metal mask 100 from dust or abrasion can be achieved.

In summary, in the manufacturing method of the fine metal mask and the fine metal mask of the embodiment of the present invention, since the reinforced outer frame is connected to the outer edge of the central pattern portion, and the thickness of the reinforced outer frame is greater than the thickness of the central pattern layer, The central pattern portion can be kept flat and not easily flexed during use or transportation. The mask pattern can be accurately aligned with the predetermined placement position of the organic light-emitting material layer after multiple uses, thereby improving the yield of the OLED display. And the fine metal mask is made by electroforming, so the position of the mask pattern is accurate and the aperture accuracy can reach several microns, and there is no problem of sewage treatment and etching solution management like the etching method.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined in the appended patent application. In addition, the terms "first" and "second" mentioned in this specification or the scope of patent application are only used to name the element or distinguish different embodiments or ranges, not to limit the number of elements. Upper or lower limit.

100‧‧‧Fine metal mask 110‧‧‧ Central pattern part 111‧‧‧ Mask pattern 120‧‧‧Strengthened outer frame 200‧‧‧First electroformed layer 210‧‧‧‧First central part 220‧‧‧ First peripheral part 221‧‧‧Second scheduled electroformed surface 300‧‧‧Second electroformed layer 310‧‧‧Through hole 320‧‧‧Second central part 330‧‧‧Second peripheral part 331‧‧‧ Third scheduled electroformed surface 400‧‧‧ Third electroformed layer 410‧‧‧Through hole 500‧‧‧Metal layer 501‧‧‧First scheduled electroformed surface 510‧‧‧Glass substrate 600‧‧‧ First pattern Photoresist layer 610‧‧‧Second patterned photoresist layer 620‧‧‧ Third patterned photoresist layer 700‧‧‧First protective film 710‧‧‧Second protective film T1, T2, T3‧‧‧‧ Thickness D1, D2, D3 ‧‧‧ Aperture S100, S200, S210, S220, S230, S240, S250, S251, S251a, S252, S252a, S260, S270

1 is a schematic diagram of a fine metal mask according to an embodiment of the invention; FIG. 2 is a flowchart of a method for manufacturing a fine metal mask according to an embodiment of the invention; FIG. 3 is a step S200 of a method for manufacturing a fine metal mask in FIG. 2 4A is a schematic diagram corresponding to step S100 in FIG. 2; FIG. 4B is a schematic diagram corresponding to step S210 in FIG. 3; FIG. 4C is a schematic diagram corresponding to step S220 in FIG. 3; FIG. 4D is a diagram corresponding to FIG. 3 4E is a schematic diagram corresponding to step S240 in FIG. 3; FIG. 4F is a schematic diagram corresponding to step S250 in FIG. 3; FIG. 5 is a step S250 of a method for manufacturing a fine metal mask according to an embodiment of the present invention 6A is a schematic diagram corresponding to step S251 in FIG. 5; FIG. 6B is a schematic diagram corresponding to step S252 in FIG. 5; FIG. 7 is a schematic diagram of a fine metal mask according to an embodiment of the present invention; FIG. 8 is FIG. 9A is a schematic diagram corresponding to step S240 in FIG. 8; FIG. 9B is a schematic diagram corresponding to step S260 in FIG. 8; FIG. 9C is a corresponding diagram 8 is a schematic diagram of step S270 in FIG. 8; FIG. 9D is a schematic diagram corresponding to step S250 in FIG. 8; FIG. 10 is a flowchart of step S250 of a method for manufacturing a fine metal mask according to an embodiment of the present invention; FIG. 11A is a diagram corresponding to FIG. A schematic diagram of step S251a; and FIG. 11B is a schematic diagram corresponding to step S252a in FIG.

100‧‧‧Fine metal mask

110‧‧‧Central Design Department

111‧‧‧Mask pattern

120‧‧‧Strengthen the frame

200‧‧‧The first electroforming layer

210‧‧‧First Central Department

220‧‧‧First Perimeter

300‧‧‧Second electroforming layer

310‧‧‧Through hole

T1, T2‧‧‧thickness

D1, D2‧‧‧Aperture

Claims (10)

A fine metal mask, including: a central pattern portion with a mask pattern; and a reinforced outer frame connected to an outer edge of the central pattern portion; wherein the thickness of the reinforced outer frame is greater than that of the central pattern portion Thickness, and the fine metal mask is made by electroforming process. The fine metal mask of claim 1, wherein the central pattern portion further includes a first central portion of a first electroformed layer, the mask pattern is formed on the first central portion, and the reinforced outer The frame further includes a first peripheral portion of the first electroformed layer and a second electroformed layer, the first peripheral portion is adjacent to the first central portion, and the second electroformed layer is stacked on the first circumference On the edge portion, a through hole is formed between the second electroformed layer and the first central portion, and the through hole communicates with the mask pattern. The fine metal mask according to claim 2, wherein the reinforced outer frame further includes a third electroformed layer, and the second electroformed layer further includes a second central portion and a second peripheral portion, the second The peripheral portion is adjacent to the second central portion. The third electroformed layer is stacked on the second peripheral portion. A through hole is formed between the third electroformed layer and the second central portion. The through hole communicates with the through hole hole. The fine metal mask of claim 1, wherein the material of the fine metal mask is selected from the group consisting of iron, cobalt, nickel, and alloys of at least two of the above. A method for manufacturing a fine metal mask includes: forming a metal layer on a glass substrate by sputtering; and forming a central pattern portion and a strengthened outer frame on the metal layer by electroforming, and removing the metal layer and the glass A substrate to obtain the fine metal mask; wherein the reinforced outer frame is connected to an outer edge of the central pattern portion, the central pattern portion has a mask pattern, and the thickness of the reinforced outer frame is greater than the thickness of the central pattern portion And the fine metal mask includes the central pattern portion and the reinforced outer frame. The method for manufacturing a fine metal mask according to claim 5, wherein the electroforming forms the central pattern portion and the reinforced outer frame on the metal layer, and removes the metal layer and the glass substrate to obtain the fine The step of the metal mask further includes: forming a first patterned photoresist layer on the metal layer, wherein the first patterned photoresist layer exposes a first predetermined electroformed surface of the metal layer; electroforming Forming a first electroforming layer on the first predetermined electroforming surface, wherein the first electroforming layer has a first central portion and a first peripheral portion adjacent to the first central portion, the first central Connected to the first patterned photoresist layer, the first peripheral portion has a second predetermined electroformed surface; forming a second patterned photoresist layer on the first central portion and the first patterned photoresist On the layer, wherein the second patterned photoresist layer exposes the second predetermined electroformed surface; electroforming forms a second electroformed layer on the second predetermined electroformed surface; and removing the first patterned A photoresist layer, the second patterned photoresist layer, the metal layer and the glass substrate to obtain the fine metal mask; wherein, after the first patterned photoresist layer is removed, the mask pattern is formed on the first On a central portion, after the second patterned photoresist layer is removed, a through hole is formed between the second electroformed layer and the first central portion, the through hole communicates with the mask pattern, and the central pattern portion further includes The first central portion of the first electroformed layer, and the reinforced outer frame further includes the first peripheral portion of the first electroformed layer and the second electroformed layer. The method for manufacturing a fine metal mask according to claim 6, wherein the second electroformed layer further has a second central portion and a second peripheral portion adjacent to the second central portion, the second central portion and the first Two patterned photoresist layers are connected, the second peripheral portion has a third predetermined electroformed surface; the electroforming forms the central pattern portion and the strengthened outer frame on the metal layer, and removes the metal layer and the The step of obtaining the fine metal mask on the glass substrate further includes: forming a third patterned photoresist layer exposing the third predetermined electroformed surface on the second central portion and the second patterned photoresist layer Above, wherein the third patterned photoresist layer; and, electroforming to form a third electroformed layer on the third predetermined electroformed surface; and said removing the first patterned photoresist layer, the first The step of obtaining the fine metal mask by two patterned photoresist layers, the metal layer and the glass substrate, further comprising: removing the first patterned photoresist layer, the second patterned photoresist layer, the first Three patterned photoresist layers, the metal layer and the glass substrate to obtain the fine metal mask, wherein after the third patterned photoresist layer is removed, a through hole is formed in the third electroformed layer and the first Between the two central portions, the through hole communicates with the through hole, and the reinforced outer frame further includes the third electroformed layer. The method for manufacturing a fine metal mask according to claim 6, wherein the first patterned photoresist layer, the second patterned photoresist layer, the metal layer and the glass substrate are removed to obtain the fine The step of the metal mask further includes: removing the first patterned photoresist layer, the second patterned photoresist layer and covering a first protective film adjacent to the second electroformed layer and the first electroformed layer On one side of the second electroformed layer; and removing the metal layer and the glass substrate and covering a second protective film on the side of the first electroformed layer away from the second electroformed layer to obtain the fine The metal is shielded between the first protective film and the second protective film. The method for manufacturing a fine metal mask according to claim 7, wherein the first patterned photoresist layer, the second patterned photoresist layer, the third patterned photoresist layer, and the metal layer are removed And the glass substrate to obtain the fine metal mask, further comprising: removing the first patterned photoresist layer, the second patterned photoresist layer and the third patterned photoresist layer and covering a first A protective film on the third electroformed layer, the second electroformed layer and the first electroformed layer adjacent to one side of the second electroformed layer; and removing the metal layer and the glass substrate and covering a first Two protective films are located on one side of the first electroformed layer away from the second electroformed layer and the third electroformed layer to obtain the fine metal mask between the first protective film and the second protective film. The method for manufacturing a fine metal mask according to claim 7, wherein the material of the fine metal mask is selected from the group consisting of iron, cobalt, nickel and alloys of at least two of the above.

Images