TW202009476A - 一種用於對電子元件進行紅外線檢查的裝置及方法 - Google Patents

一種用於對電子元件進行紅外線檢查的裝置及方法 Download PDF

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Publication number
TW202009476A
TW202009476A TW108126732A TW108126732A TW202009476A TW 202009476 A TW202009476 A TW 202009476A TW 108126732 A TW108126732 A TW 108126732A TW 108126732 A TW108126732 A TW 108126732A TW 202009476 A TW202009476 A TW 202009476A
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TW
Taiwan
Prior art keywords
imaging unit
electronic component
infrared
infrared imaging
inspection
Prior art date
Application number
TW108126732A
Other languages
English (en)
Chinese (zh)
Inventor
光榮 胡
Original Assignee
馬來西亞商正齊科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 馬來西亞商正齊科技有限公司 filed Critical 馬來西亞商正齊科技有限公司
Publication of TW202009476A publication Critical patent/TW202009476A/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8812—Diffuse illumination, e.g. "sky"
    • G01N2021/8816—Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/50—Detectors
    • G01N2223/509—Detectors infrared
TW108126732A 2018-08-30 2019-07-29 一種用於對電子元件進行紅外線檢查的裝置及方法 TW202009476A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI2018703073A MY197078A (en) 2018-08-30 2018-08-30 An apparatus for infrared inspection of an electronic component and method thereof
MYPI2018703073 2018-08-30

Publications (1)

Publication Number Publication Date
TW202009476A true TW202009476A (zh) 2020-03-01

Family

ID=69738688

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109206913U TWM599909U (zh) 2018-08-30 2019-07-29 一種用於對電子元件進行紅外線檢查的裝置
TW108126732A TW202009476A (zh) 2018-08-30 2019-07-29 一種用於對電子元件進行紅外線檢查的裝置及方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109206913U TWM599909U (zh) 2018-08-30 2019-07-29 一種用於對電子元件進行紅外線檢查的裝置

Country Status (4)

Country Link
KR (1) KR102246219B1 (ko)
MY (1) MY197078A (ko)
PH (1) PH12019000264A1 (ko)
TW (2) TWM599909U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI797689B (zh) * 2021-05-24 2023-04-01 馬來西亞商正齊科技有限公司 檢查電子元件內部缺陷的裝置及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101001113B1 (ko) * 2008-11-12 2010-12-14 주식회사 코로 웨이퍼 결함의 검사장치 및 검사방법
JP5594254B2 (ja) * 2011-08-09 2014-09-24 三菱電機株式会社 シリコン基板の検査装置、および検査方法
CN104160366A (zh) * 2011-11-28 2014-11-19 康宁股份有限公司 使用平面透明薄板的稳固的光学触摸屏系统和方法
KR101341620B1 (ko) 2012-06-14 2013-12-13 전자부품연구원 3차원 형상 측정 시스템 및 방법
DE102013108308A1 (de) * 2013-08-01 2015-02-19 Schott Ag Verfahren und Vorrichtung zur Detektion in Bandrollen aus sprödhartem oder sprödbrechendem, zumindest teiltransparentem Material, sowie deren Verwendung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI797689B (zh) * 2021-05-24 2023-04-01 馬來西亞商正齊科技有限公司 檢查電子元件內部缺陷的裝置及方法

Also Published As

Publication number Publication date
MY197078A (en) 2023-05-24
TWM599909U (zh) 2020-08-11
KR20200026708A (ko) 2020-03-11
PH12019000264A1 (en) 2020-03-09
KR102246219B1 (ko) 2021-04-29

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