MY197078A - An apparatus for infrared inspection of an electronic component and method thereof - Google Patents

An apparatus for infrared inspection of an electronic component and method thereof

Info

Publication number
MY197078A
MY197078A MYPI2018703073A MYPI2018703073A MY197078A MY 197078 A MY197078 A MY 197078A MY PI2018703073 A MYPI2018703073 A MY PI2018703073A MY PI2018703073 A MYPI2018703073 A MY PI2018703073A MY 197078 A MY197078 A MY 197078A
Authority
MY
Malaysia
Prior art keywords
electronic component
imaging unit
infrared imaging
infrared inspection
infrared
Prior art date
Application number
MYPI2018703073A
Inventor
Kuang Eng Oh
Original Assignee
Mi Equipment M Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mi Equipment M Sdn Bhd filed Critical Mi Equipment M Sdn Bhd
Priority to MYPI2018703073A priority Critical patent/MY197078A/en
Priority to PH12019000264A priority patent/PH12019000264A1/en
Priority to TW108126732A priority patent/TW202009476A/en
Priority to TW109206913U priority patent/TWM599909U/en
Priority to KR1020190100219A priority patent/KR102246219B1/en
Publication of MY197078A publication Critical patent/MY197078A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8812—Diffuse illumination, e.g. "sky"
    • G01N2021/8816—Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/50—Detectors
    • G01N2223/509—Detectors infrared

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

An apparatus for infrared inspection of an electronic component (1), comprising of at least one first infrared imaging unit (101) is capable of capturing first surface of said electronic component (103) wherein said first surface is top surface of said electronic component (103); said first infrared imaging unit (101) is applying direct front lighting (107), direct back lighting (109) or combination thereof; said apparatus further comprises of at least one second infrared imaging unit (105) wherein said second infrared imaging unit (105) is capable of capturing second surface of said electronic component (103) wherein said second surface is substantially perpendicular to the first surface of said electronic component (103); said second infrared imaging unit (105) is applying direct front lighting (107), direct back lighting (109) or combination thereof.
MYPI2018703073A 2018-08-30 2018-08-30 An apparatus for infrared inspection of an electronic component and method thereof MY197078A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
MYPI2018703073A MY197078A (en) 2018-08-30 2018-08-30 An apparatus for infrared inspection of an electronic component and method thereof
PH12019000264A PH12019000264A1 (en) 2018-08-30 2019-07-26 An apparatus for infrared inspection of an electronic component and method thereof
TW108126732A TW202009476A (en) 2018-08-30 2019-07-29 An apparatus for infrared inspection of an electronic component and method thereof
TW109206913U TWM599909U (en) 2018-08-30 2019-07-29 An apparatus for infrared inspection of an electronic component
KR1020190100219A KR102246219B1 (en) 2018-08-30 2019-08-16 An apparatus for infrared inspection of an electronic component and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2018703073A MY197078A (en) 2018-08-30 2018-08-30 An apparatus for infrared inspection of an electronic component and method thereof

Publications (1)

Publication Number Publication Date
MY197078A true MY197078A (en) 2023-05-24

Family

ID=69738688

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018703073A MY197078A (en) 2018-08-30 2018-08-30 An apparatus for infrared inspection of an electronic component and method thereof

Country Status (4)

Country Link
KR (1) KR102246219B1 (en)
MY (1) MY197078A (en)
PH (1) PH12019000264A1 (en)
TW (2) TWM599909U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI797689B (en) * 2021-05-24 2023-04-01 馬來西亞商正齊科技有限公司 Apparatus and method for performing internal defects inspection of an electronic component

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101001113B1 (en) * 2008-11-12 2010-12-14 주식회사 코로 Apparatus for Detecting Wafer Crack and Method for Detecting Wafer Defect
JP5594254B2 (en) * 2011-08-09 2014-09-24 三菱電機株式会社 Silicon substrate inspection apparatus and inspection method
CN104160366A (en) * 2011-11-28 2014-11-19 康宁股份有限公司 Robust optical touch-screen systems and methods using a planar transparent sheet
KR101341620B1 (en) 2012-06-14 2013-12-13 전자부품연구원 System and method for measuring three dimensional shape
DE102013108308A1 (en) * 2013-08-01 2015-02-19 Schott Ag Method and device for detecting tape rolls made of brittle-hard or brittle-breaking, at least partially transparent material, and their use

Also Published As

Publication number Publication date
PH12019000264A1 (en) 2020-03-09
TWM599909U (en) 2020-08-11
TW202009476A (en) 2020-03-01
KR102246219B1 (en) 2021-04-29
KR20200026708A (en) 2020-03-11

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