TW202007975A - Radio-frequency probe card device and space transformer thereof - Google Patents

Abstract

The present disclosure discloses a radio-frequency (RF) probe card device and a space transformer thereof. The space transformer includes a main plate and an extending plate, and the main plate includes a plurality of insulating layers and a plurality of conductive layers disposed on the insulating layers. The main plate has a first surface, a second surface, and a lateral surrounding surface arranged between the first surface and the second surface. The extending plate includes an elongated isolation layer and an elongated transmission layer formed on the isolation layer. The isolation layer integrally extends from one of the insulating layers, and protrudes out of the lateral surrounding surface. The transmission layer integrally extends from one of the insulating layers that is arranged adjacent to the isolation layer, and the transmission layer protrudes out of the lateral surrounding surface. The extending plate is a bendable structure, and a free end of the transmission layer is configured to electrically couple to a testing apparatus.

Description

Radio frequency probe card device and its pitch conversion board

The invention relates to a probe card, in particular to a radio frequency probe card device and a pitch conversion board.

The existing probe card includes a plunger, a flexible circuit board partially disposed on the end surface of the plunger, and a plurality of detection bumps fixed on the flexible circuit board. Wherein, each of the detection bumps has no elasticity. The detection bumps are used to abut and electrically couple to an object to be tested, and transmit corresponding signals through the flexible circuit board.

However, due to the high dissipation factor (DF) of the flexible circuit board, the flexible circuit board is prone to large losses during signal transmission, and the water absorption rate of the material is also high. The pitch application is relatively easy to risk leakage, so the existing probe card structure is not suitable for the transmission of radio frequency signals.

Therefore, the inventor believes that the above-mentioned defects can be improved, and Naite devotes himself to research and cooperates with the application of scientific principles, and finally proposes a reasonable design and effectively improves the above-mentioned defects of the present invention.

An embodiment of the present invention is to provide a radio frequency probe card device and a pitch conversion board thereof, which can effectively improve defects that may be caused by the existing probe card.

An embodiment of the present invention discloses a radio frequency probe card device, including: a pitch conversion board, including: a main board body, including a plurality of insulating layers and a plurality of conductive layers respectively disposed in the plurality of insulating layers, and The main board body includes a first board surface and a second board surface on opposite sides, and a ring side edge between the first board surface and the second board surface; and an extension board body, including There are: an isolation layer that is elongated and formed from one of the plurality of insulating layers that extends integrally out of the side edge of the ring; and a transmission layer that is elongated and attached to the An isolation layer, and the transmission layer is formed by integrally extending from the side edge of the ring from the conductive layer adjacent to the isolation layer; wherein, the extension plate body is a bendable structure, and the transmission A free end of the layer is used to be electrically coupled to a testing machine; and a circuit board and a probe base are respectively connected to the first board surface and the second board surface of the pitch conversion board, and One end of the probe base away from the circuit board is used to detachably abut an object to be measured.

An embodiment of the present invention also discloses a pitch conversion board for an RF probe card device, which includes: a main board body including a plurality of insulating layers and a plurality of conductive layers provided on the plurality of insulating layers, and the main board body includes There are a first plate surface and a second plate surface located on opposite sides, and a ring side edge between the first plate surface and the second plate surface; and an extended plate body, including: an isolation A layer formed in a strip shape and extending integrally from one of the plurality of insulating layers out of the ring side edge; and a transmission layer in a strip shape and attached to the isolation layer, and The transmission layer is formed by integrally extending from the side edge of the ring from the conductive layer adjacent to the isolation layer; wherein, the extension plate body is a bendable structure, and a free of the transmission layer The terminal is used to be electrically coupled to a testing machine.

In summary, the RF probe card device and the pitch conversion board disclosed in the embodiments of the present invention are formed by using the extension plate body to extend at least partially from the main board body, and the transmission layer of the extension plate body is electrically coupled In one of the conductive layers, the distance conversion board can directly transmit part of the signal to the test machine through the transmission layer without passing through the circuit board, so that the transmission process of the part of the signal is less lost, and the RF probe card device Test results are less susceptible to distortion.

In order to understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, not to make any protection to the scope of the present invention. limit.

1000‧‧‧RF probe card device

100‧‧‧Pitch conversion board

1‧‧‧Main body

1a‧‧‧The first structural layer

1b‧‧‧Second structural layer

11‧‧‧ First board

12‧‧‧Second board

13‧‧‧ring side edge

14‧‧‧Insulation

15‧‧‧conductive layer

151‧‧‧Contact

2‧‧‧Extended plate

21‧‧‧Bending plate

211‧‧‧Buried end

212‧‧‧Bent end

22‧‧‧Isolation layer

23‧‧‧Transport layer

231‧‧‧ Transmission line

24‧‧‧Protective layer

3‧‧‧Tune electronic components

4‧‧‧coaxial connector

200‧‧‧ circuit board

300‧‧‧Probe

301‧‧‧Positioning seat

302‧‧‧ conductive probe

H‧‧‧ Height direction

D1, D2‧‧‧Distance

FIG. 1 is a schematic diagram of a radio frequency probe card device of the present invention.

FIG. 2 is a schematic diagram of the RF probe card device of FIG. 1 after bending the extension plate body.

3 is a schematic diagram of another aspect of the radio frequency probe card device of the present invention.

4 is a partial perspective view of an extension plate of the RF probe card device of the present invention.

Please refer to FIG. 1 to FIG. 4, which are the embodiments of the present invention. It should be noted that this embodiment corresponds to the relevant quantities and appearances mentioned in the drawings, and is only used to specifically illustrate the embodiments of the present invention. In order to understand the content of the present invention, it is not used to limit the protection scope of the present invention.

As shown in FIGS. 1 and 2, this embodiment discloses a radio frequency probe card device 1000 that can be used to test an object to be tested (not shown in the figure, such as a semiconductor wafer). It should be noted that, in order to facilitate understanding of this embodiment, the drawing is illustrated by a partial cross-sectional schematic diagram of the RF probe card device 1000 described above.

The RF probe card device 1000 includes a pitch conversion board 100, a circuit board 200, and a probe base 300, and the circuit board 200 and the probe base 300 are respectively disposed on opposite sides of the pitch conversion board 100 (eg: (Bottom side and top side of the pitch conversion board 100 in FIG. 1). The structures of the circuit board 200 and the probe base 300 are only shown in a schematic manner in the drawings of this embodiment, and their specific structures can be adjusted and changed according to design requirements, and the present invention is not limited thereto.

Furthermore, although the RF probe card device 1000 of this embodiment is described by using the pitch conversion board 100 in combination with the circuit board 200 and the probe base 300, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the pitch conversion board 100 can also be used alone (for example, sold) or used with other components. The structure of the pitch conversion plate 100 of this embodiment will be described below, and then the connection relationship between the pitch conversion plate 100 and other components will be described.

The pitch conversion board 100 includes a main board body 1, an extension board body 2 connected to the side edge of the main board body 1, a tuning electronic component 3 mounted on the extension board body 2, and a coaxial connector 4. Wherein, at least a part of the extension board body 2 is integrally formed by the main board body 1, and the main board body 1 and the extension board body 2 may be a single-piece member manufactured simultaneously and cannot be disassembled; that is, In this embodiment, it is preferable to exclude the extended plate body 2 from being manufactured and then installed on the main board body 1, but the invention is not limited thereto.

Furthermore, the coaxial connector 4 is assembled at an end portion of the extension plate body 2 away from the main board body 1, and the coaxial connector 4 is used to be detachably mounted on a testing machine (not shown), but The invention is not limited to this. For example, in other embodiments not shown in the present invention, the pitch conversion board 100 may omit the above-mentioned coaxial connector 4 or replace the coaxial connector 4 with other components. According to this, since the end portion of the extension plate body 2 is directly connected to the testing machine with the coaxial connector 4, the problem of signal distortion or attenuation caused by the loss of the signal on the plate is effectively avoided, thereby ensuring the signal transmission Completeness.

The main board body 1 includes a first board surface 11 and a second board surface 12 on opposite sides, and a ring-shaped side edge 13 between the first board surface 11 and the second board surface 12. Wherein, in this embodiment, the main board body 1 is made of a multi-layer ceramic (MLC) or a multi-layer organic carrier (MLO) layer or a thin film manufacturing process (eg, by lamination or Coating, etc.), but the invention is not limited thereto. From another perspective, the main board body 1 includes a first structural layer 1a (e.g. MLC or MLO) and a second structural layer 1b on the first structural layer 1a. Wherein, the second structure layer 1b includes a plurality of insulating layers 14 and a plurality of conductive layers 15 disposed in the plurality of insulating layers 14 respectively, and the plurality of insulating layers 14 are along a height in this embodiment The direction H is sequentially stacked, and the plurality of conductive layers 15 can be electrically coupled to each other. Furthermore, in this embodiment, the insulating layer 14 and the corresponding conductive layer 15 located at the top of the main board body 1 define the first board surface 11 of the main board body 1, and the first structural layer 1 a is the most The lower surface defines the second board surface 12 of the main board body 1.

In more detail, each conductive layer 15 includes a plurality of contacts 151 arranged at intervals, and at least a part of each of the contacts 151 is buried in the corresponding conductive layer 15 at least partially. Among the plurality of contacts 151 in the insulating layer 14 at the uppermost of the second structural layer 1b, at least one of the contacts 151 is connected to the adjacent contacts 151 in the other insulating layers 14 in order along the height direction H. Until it is connected to the corresponding contact 151 in the insulating layer 14 at the bottom of the second structural layer 1b, and then cooperates with the first structural layer 1a to form a signal transmission path, so that the pitch conversion board 100 can be in the height direction H Signaling.

It should be noted that the signal transmission path is substantially along the height direction H, but it is not limited to being parallel to the height direction H. In this embodiment, in the two insulating layers 14 and their corresponding two conductive layers 15 stacked on top of each other (such as: the upper two insulating layers 14 and their corresponding two conductive layers 15 in FIG. 1 or FIG. 2 ), the distance D1 between the two adjacent contacts 151 in the conductive layer 15 below may be greater than the distance D2 between the two adjacent contacts 151 in the conductive layer 15 above, thereby forming a fan A fan-out design structure makes the pitch conversion board 100 suitable for testing different types of DUTs (such as peripheral integrated circuits or array integrated circuits).

The circuit board 200 and the probe base 300 are respectively (structured and electrically) connected to the first board surface 11 and the second board surface 12 of the above-mentioned distance conversion board 100, and are far away from the probe of the circuit board 200 One end of the base 300 is used to detachably abut the object to be tested (eg, semiconductor wafer). The probe base 300 includes a positioning base 301 and a plurality of conductive probes 302 disposed on the positioning base 301, and the conductive probes 302 far from the circuit board 200 are used to detachably abut against Analyte. It should be noted that the specific structures of the circuit board 200 and the probe base 300 can be adjusted and changed according to design requirements, and are not limited to the drawings in this embodiment.

The extension plate body 2 is a bendable structure, and the extension plate body 2 includes a bendable plate 21 partially embedded in the main board body 1 (eg, the second structural layer 1b), and is elongated Moreover, an isolation layer 22 provided on the bendable plate 21, a transmission layer 23 in the form of a long strip attached to the isolation layer 22, and a protective layer 24 (e.g., solder mask) covering the transmission layer 23 ). In this embodiment, the isolation layer 22 and the transmission layer 23 are located between the protective layer 24 and the bendable plate 21.

However, the structure and arrangement order of the layers of the extension board 2 can also be adjusted according to design requirements, and is not limited to those shown in FIGS. 1 and 2. For example, the protective layer 24 and the bendable plate 21 of the extension plate body 2 can also be selectively implemented according to actual needs (eg, FIG. 3 ).

The bendable plate 21 includes a buried end portion 211 embedded in the main board body 1 (eg, the second structural layer 1b) and the ring side edge 13 extending from the buried end portion 211的一弯折端部212. In this embodiment, the bendable plate 21 is a single plate, and the buried end 211 of the bendable plate 21 is buried in the process of manufacturing the main board body 1 (eg, the second structural layer 1b) Between two insulating layers 14 stacked on top of each other; that is to say, the flexible sheet 21 of the present invention preferably excludes the state of being embedded in the main board body 1 (eg, the second structural layer 1b), However, the invention is not limited to this. In addition, the material selection of the bendable plate 21 mainly considers its dissipation factor (DF), and the dispersion factor of the bendable plate 21 is observed to be 10 GHz in this embodiment, between 0.01~0.0021 (preferably, the smaller the better); that is, in the case of a signal of 10 GHz, the dissipation factor of the bendable plate 21 is between 0.01~0.0021 (preferably the smaller the better).

The isolation layer 22 is formed by integrally extending from one of the plurality of insulation layers 14 above the ring side edge 13 of the main board body 1. Further, the isolation layer 22 of this embodiment is manufactured by simultaneously extending on the bent end 212 of the bendable plate 21 during the process of manufacturing the corresponding insulation layer 14 to make the insulation layer 14 The isolation layer 22 has an integrated single-layer structure. In addition, the choice of material of the isolation layer 22 is mainly to consider its dissipation factor, and the dissipation factor of the isolation layer 22 is not greater than 0.003 in this embodiment, and is preferably 0.0021, but the invention is not limited Here.

The transmission layer 23 is formed by integrally extending from the ring side edge 13 of the main body 1 from the conductive layer 15 adjacent to the isolation layer 22. Further, in the process of forming the corresponding conductive layer 15, the transmission layer 23 of this embodiment extends synchronously from one of the contacts 151 (eg, the contact 151 adjacent to the ring side edge 13) on the isolation layer 22 is made so that the contact 151 and the transmission layer 23 have an integrated single-layer structure. In other words, the isolation layer 22 and the transmission layer 23 of this embodiment are formed on the bent end 212 of the bendable plate 21.

As mentioned above, a free end of the above-mentioned transmission layer 23 (for example: the end of the transmission layer 23 away from the main board body 1) can be used to be electrically coupled to the testing machine; that is, the free end of the transmission layer 23 in this embodiment It can be electrically coupled to the testing machine by being installed on the coaxial connector 4.

Furthermore, as shown in FIG. 4, in this embodiment, the transmission layer 23 preferably includes a plurality of transmission lines 231 arranged at intervals and in parallel, and the plurality of transmission lines 231 are collectively configured as a coplanar waveguide ( Coplanar Waveguide (CPWG) structure. According to this, the extension plate body 2 can be controlled by the characteristic impedance of the plurality of transmission lines 231 (eg, adjusting the thickness, width, or spacing of the plurality of transmission lines 231), so that the transmission layer 23 does not have any Impedance discontinuities, which effectively avoids signal reflection problems.

In more detail, as shown in FIGS. 1 and 2, the isolation layer 22 and the transmission layer 23 are respectively composed of the insulating layer 14 and the conductive layer 15 corresponding to the first board surface 11 (such as: The upper insulating layer 14 and the conductive layer 15) are integrally formed, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the isolation layer 22 and the transmission layer 23 may also be composed of any insulating layer 14 located between the first board surface 11 and the second board surface 12 and The corresponding conductive layer 15 extends integrally.

Furthermore, in this embodiment, the tuning electronic component 3 is partially mounted on the conductive layer 15 (such as the uppermost conductive layer 15 in FIG. 2) corresponding to the first board surface 11 through the protective layer 24. , So that the tuned electronic component 3 is electrically coupled to the transmission layer 23 of the extension plate 2 and an adjacent contact 151 (eg, the outer contact 151 of the uppermost conductive layer 15 in FIG. 2 ), but this The mounting method of the inventive tuning electronic component 3 is not limited to this.

Further, the transmission layer 23 is electrically coupled to one of the contacts 151 (eg, the outer contact 151 of the uppermost conductive layer 15 in FIG. 1) of the motherboard 1 (eg, the second structural layer 1b) And used to transmit a radio frequency signal to the testing machine. Other types of signals (such as power signals or ground signals) can be formed by the contacts 151 of the plurality of conductive layers 15 of the main body 1 (such as the first structure layer 1a and the second structure 1b. Signal transmission path) and the circuit board 200 to be transmitted to the testing machine.

According to this, the pitch conversion board 100 can transmit the radio frequency signal (or high frequency signal) with the extension board body 2 and transmit other types of signals with the main board body 1 to achieve the signal shunt effect. Furthermore, since the radio frequency signal is directly transmitted to the testing machine through the extension board 2 and thus does not need to pass through the circuit board 200, the transmission process of the above radio frequency signal is less lost, making the radio frequency probe The test result of the card device 1000 is less likely to be distorted.

[Technical Effects of Embodiments of the Invention]

In summary, the RF probe card device 1000 and the pitch conversion board 100 disclosed in the embodiments of the present invention are formed by extending the body 2 at least partially from the main body 1 (eg, the second structural layer 1b) , And the transmission layer 23 of the extension board 2 is electrically coupled to one of the conductive layers 15, so that the distance conversion board 100 can directly transmit some signals (such as radio frequency signals) to the testing machine through the transmission layer 23, and There is no need to pass through the circuit board 200, so that part of the signal transmission process has less loss, and the test result of the RF probe card device 1000 is less likely to be distorted.

Furthermore, in the distance conversion board 100 disclosed in the embodiment of the present invention, the material selection of the isolation layer 22 (and the bendable plate 21) is based on the loss factor (eg, not more than 0.003, and the transmission layer 23 can pass multiple The transmission lines 231 are collectively configured as a coplanar waveguide structure, so that the characteristic impedances of the plurality of transmission lines 231 can be adjusted and controlled, so that there is no impedance discontinuity in the transmission layer 23, and the signal reflection problem is effectively avoided .

The above are only the preferred and feasible embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any changes and modifications made within the scope of the patent of the present invention shall fall within the scope of protection of the claims of the present invention.

1000‧‧‧RF probe card device

100‧‧‧Pitch conversion board

1‧‧‧Main body

1a‧‧‧The first structural layer

1b‧‧‧Second structural layer

11‧‧‧ First board

12‧‧‧Second board

13‧‧‧ring side edge

14‧‧‧Insulation

15‧‧‧conductive layer

151‧‧‧Contact

2‧‧‧Extended plate

21‧‧‧Bending plate

211‧‧‧Buried end

212‧‧‧Bent end

22‧‧‧Isolation layer

23‧‧‧Transport layer

24‧‧‧Protective layer

3‧‧‧Tune electronic components

4‧‧‧coaxial connector

200‧‧‧ circuit board

300‧‧‧Probe

301‧‧‧Positioning seat

302‧‧‧ conductive probe

H‧‧‧ Height direction

D1, D2‧‧‧Distance

Claims (10)

An RF probe card device includes: a pitch conversion board, including: a main board body, including a plurality of insulating layers and a plurality of conductive layers respectively disposed in the plurality of insulating layers, and the main board body includes A first plate surface and a second plate surface located on opposite sides, and a ring side edge between the first plate surface and the second plate surface; and an extended plate body, including: an isolation layer , Formed in a strip shape and extending integrally from one of the plurality of insulating layers out of the side edges of the ring; and a transmission layer in a strip shape and attached to the isolation layer, and The transmission layer is formed by integrally extending from the side edge of the ring from the conductive layer adjacent to the isolation layer; wherein, the extension plate body is a bendable structure, and a free end of the transmission layer For electrically coupling to a testing machine; and a circuit board and a probe base, respectively connected to the first board surface and the second board surface of the pitch conversion board, and away from the circuit board One end of the probe base is used to detachably abut an object to be measured. The RF probe card device according to claim 1, wherein the isolation layer and the transmission layer are respectively formed by integrally extending the insulating layer and the conductive layer at positions corresponding to the first board surface . The RF probe card device according to claim 2, wherein the conductive layer whose position corresponds to the first board surface includes a plurality of contacts, the RF probe card device includes a tuning electronic component, and The tuning electronic component is electrically coupled to the transmission layer and an adjacent one of the contacts. The radio frequency probe card device according to claim 1, wherein the extension plate body includes a bendable plate material, and the bendable plate material includes a buried end portion embedded in the main board body and A bent end portion of the ring side edge extends from the buried end portion, and the isolation layer and the transmission layer are formed on the bent end portion of the bendable plate material. The RF probe card device according to claim 4, wherein the extension plate body includes a protective layer covering the transmission layer, and the isolation layer and the transmission layer are located on the protective layer and the It can be bent between plates. The RF probe card device according to claim 5, wherein the pitch conversion board includes a coaxial connector, and an end portion of the extension plate body away from the main board body is fitted to the coaxial connector, and the The coaxial connector is used to be detachably installed on the testing machine. The RF probe card device according to claim 1, wherein the conductive layer whose position corresponds to the first board includes a plurality of contacts, and the transmission layer is electrically coupled to the plurality of contacts One of the contacts of the point is used to transmit a radio frequency signal to the testing machine. The RF probe card device according to claim 1, wherein a dissipation factor (DF) of the isolation layer is not greater than 0.003; the transmission layer includes a plurality of transmission lines arranged in parallel and spaced apart, and more The transmission lines are collectively configured as a Coplanar Waveguide (CPWG) structure. A pitch conversion board for a radio frequency probe card device includes a main board body including a plurality of insulating layers and a plurality of conductive layers provided on the plurality of insulating layers, and the main board body includes a A first plate surface and a second plate surface, and a ring side edge located between the first plate surface and the second plate surface; and an extended plate body, including: an isolation layer in the shape of a long strip And from one of the plurality of insulation layers, the insulation layer integrally extends out of the ring side edge; and a transmission layer, which is elongated and attached to the isolation layer, and the transmission layer is The conductive layer adjacent to the isolation layer is integrally formed to extend out from the side edge of the ring; wherein, the extending plate body is a bendable structure, and a free end of the transmission layer is used for electrical coupling On a test machine. The pitch conversion board of the RF probe card device according to claim 9, wherein the conductive layer whose position corresponds to the first board surface includes a plurality of contacts, and the transmission layer is electrically coupled to more than one One of the contacts is used to transmit an RF signal to the testing machine; the dispersion factor of the isolation layer is not greater than 0.003.

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