US20100231320A1 - Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system - Google Patents
Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system Download PDFInfo
- Publication number
- US20100231320A1 US20100231320A1 US12/720,237 US72023710A US2010231320A1 US 20100231320 A1 US20100231320 A1 US 20100231320A1 US 72023710 A US72023710 A US 72023710A US 2010231320 A1 US2010231320 A1 US 2010231320A1
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- Prior art keywords
- semiconductor device
- transmission line
- electrical signal
- transmission
- circuit element
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Abstract
Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.
Description
- 1. Field of the Invention
- The present invention relates to a semiconductor device, a transmission system, a method for manufacturing a semiconductor device, and a method for manufacturing a transmission system that allow high-speed data transmission by use of an electrical signal having a millimeter-wave frequency.
- 2. Description of the Related Art
- In recent years, demands for high-speed data transmission for transmitting large-volume data such as moving image data at high speed are increasing. For such high-speed data transmission, there is a method of using an electrical signal having a millimeter-wave frequency as one of high-frequency signals.
- For example, an oscillating circuit in which a resonant electrode is formed in a resonator is disclosed in PCT Patent Publication No. WO2006/33204 (FIG. 1 and FIG. 8, hereinafter Patent Document 1). In this oscillating circuit, the resonant electrode is formed in the resonator and the resonator and a transmission line provided on a circuit board are connected to each other by a bonding wire. By this resonator, a resonant frequency in the range of 22 GHz to 26 GHz can be achieved.
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FIG. 23 is a perspective view showing a configuration example of asemiconductor device 100 of a related art.FIG. 24 is a plan view showing a configuration example of a major part of thesemiconductor device 100, andFIG. 25 is a front view thereof. As shown inFIGS. 23 to 25 , thesemiconductor device 100 includes acircuit board 10 serving as a semiconductor circuit element that processes an electrical signal having a millimeter-wave frequency, and an interposer substrate (hereinafter, referred to as the substrate 17) having atransmission line 14 that transmits the electrical signal processed by thecircuit board 10. - The
circuit board 10 has aterminal unit 11 composed of asignal transmission terminal 11 a andgrounding terminals 11 b. Thesubstrate 17 has aterminal unit 13 composed of asignal transmission terminal 13 a andgrounding terminals 13 b. Thesignal transmission terminal 11 a is connected to thesignal transmission terminal 13 a via awire 12 a included in awire unit 12. Thegrounding terminals 11 b are connected to thegrounding terminals 13 b viawires 12 b included in thewire unit 12. - The
substrate 17 has a first dielectric layer (hereinafter, referred to as thedielectric layer 17 a), agrounding layer 17 b, and a second dielectric layer (hereinafter, referred to as thedielectric layer 17 c). Thegrounding layer 17 b is formed of copper or aluminum and has a function for grounding.Vias 19 having electrical conductivity are provided in thedielectric layer 17 a at the positions on which thegrounding terminals 13 b are provided. Thesemiconductor device 100 is grounded by electrical connection between thegrounding terminals 13 b and thegrounding layer 17 b through thevias 19. Thedielectric layer 17 a has a predetermined dielectric constant. Thedielectric layer 17 a, thetransmission line 14, and thegrounding layer 17 b form a micro-strip line. Thedielectric layer 17 c has a function to support thedielectric layer 17 a and thegrounding layer 17 b. - The
transmission line 14 is connected to thesignal transmission terminal 13 a, and thistransmission line 14 transmits a millimeter-wave electrical signal in a predetermined direction (inFIGS. 24 and 25 , in the right direction). Anantenna part 16 is connected to thetransmission line 14, and theantenna part 16 converts the millimeter-wave electrical signal to an electromagnetic wave signal. Thesemiconductor device 100 is sealed by a sealingresin 18 in such a way that an upper part of thesubstrate 17 is covered. - The millimeter-wave electrical signal resulting from signal processing by the
circuit board 10 is transmitted by thetransmission line 14 on thesubstrate 17 via thewire 12 a. The transmitted millimeter-wave electrical signal is changed to the electromagnetic wave signal by theantenna part 16, and the electromagnetic wave signal passes through thesealing resin 18 to be output to the external. - A simulation result relating to the millimeter-wave signal transmission by the
semiconductor device 100 will be described below.FIG. 26 is a graph showing a characteristic example of thesemiconductor device 100, obtained by the simulation. As shown inFIG. 26 , this simulation result is represented by plotting the frequency (GHz) of the millimeter-wave electrical signal on the abscissa and plotting the S-parameter magnitude (dB) on the ordinate, and is obtained by calculation with use of thesemiconductor device 100 shown inFIGS. 23 to 25 based on parameters shown in Table 1. The S-parameter magnitudes refer to the parameter magnitudes representing the transfer and reflection of the millimeter-wave electrical signal. The full lines inFIG. 26 indicate transfer characteristics S12 and S21, and the dashed lines indicate reflection characteristics S11 and S22. -
TABLE 1 Thickness A1 of transmission line 1418 μm Width A2 of transmission line 14130 μm Length A3 of transmission line 142 mm Thickness A5 of dielectric layer 17a70 μm Relative dielectric constant of dielectric layer 17a4.7 Dissipation factor of dielectric layer 17a0.02 Relative dielectric constant of sealing resin 184.2 Dissipation factor of sealing resin 180.02 Length of wire 12a635 μm Length of wire 12b711 μm - As shown in Table 1, in this simulation, the width A2 and the length A3 of the
transmission line 14, shown inFIG. 24 , are set to 130 μm and 2 mm, respectively. Referring toFIG. 25 , the thickness A1 of thetransmission line 14 is set to 18 μm, and the thickness A5 of thedielectric layer 17 a in thesubstrate 17 is set to 70 μm. Furthermore, the relative dielectric constant and the dissipation factor of thedielectric layer 17 a are set to 4.7 and 0.02, respectively. The relative dielectric constant and the dissipation factor of the sealingresin 18 are set to 4.2 and 0.02, respectively. The lengths of thewire 12 a and thewire 12 b are set to 635 μm and 711 μm, respectively. - According to this simulation result, the S-parameter magnitudes of the transfer characteristics S12 and S21 are lower than those of the reflection characteristics S11 and S22 over the frequency range of the millimeter-wave electrical signal from 40 GHz to 80 GHz. This indicates that the data transmission is difficult when the frequency of the millimeter-wave electrical signal is in the frequency band from 40 GHz to 80 GHz.
- By the technique of
Patent Document 1, a resonant frequency in the range of 22 GHz to 26 GHz can be obtained by the resonator. However, a resonant frequency beyond this range can not be obtained. Furthermore, for thesemiconductor device 100 of the related art, data transmission is difficult in the frequency band from 40 GHz to 80 GHz. - There is a desire for the present invention to allow enhancement in the transmission characteristic of an electrical signal having a frequency in a frequency band over 40 GHz, and provide a semiconductor device, a transmission system, a method for manufacturing a semiconductor device, and a method for manufacturing a transmission system that allow high-speed data transmission involving little signal deterioration.
- According to an embodiment of the present invention, there is provided a semiconductor device including a semiconductor circuit element configured to process an electrical signal having a predetermined frequency, and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. In the semiconductor device, an impedance matching pattern having a symmetric shape with respect to the direction of the transmission line is provided in the transmission line.
- In the semiconductor device according to the embodiment of the present invention, the semiconductor circuit element processes the electrical signal having the predetermined frequency. The transmission line is connected to the semiconductor circuit element via the wire and transmits the electrical signal. On the premise of this configuration, the impedance matching pattern having a symmetric shape with respect to the direction of the transmission line is provided in the transmission line. Due to this feature, impedance matching of the transmission line is achieved by the impedance matching pattern, which makes it possible to reduce reflection of the electrical signal that is transmitted through this transmission line and has the predetermined frequency.
- According to another embodiment of the present invention, there is provided a transmission system including a first semiconductor device configured to include a first semiconductor circuit element that processes an electrical signal having a predetermined frequency, a first transmission line that is connected to the first semiconductor circuit element via a wire and transmits the electrical signal, and a first antenna part that converts the electrical signal transmitted from the first transmission line to an electromagnetic wave signal and sends the electromagnetic wave signal. The transmission system further includes a second semiconductor device configured to include a second antenna part that receives the electromagnetic wave signal sent from the first antenna part and converts the electromagnetic wave signal to an electrical signal having the predetermined frequency, a second transmission line that transmits the electrical signal arising from conversion by the second antenna part, and a second semiconductor circuit element that is connected to the second transmission line via a wire and processes the electrical signal transmitted by the second transmission line. In the semiconductor device, impedance matching patterns having symmetric shapes with respect to the directions of the first and second transmission lines are provided in the first and second transmission lines.
- According to further another embodiment of the present invention, there is provided a method for manufacturing a semiconductor device. The method includes the steps of forming a semiconductor circuit element that processes an electrical signal having a predetermined frequency, forming, on a substrate, a transmission line that transmits the electrical signal and an impedance matching pattern having a symmetric shape with respect to the direction of the transmission line, setting the semiconductor circuit element on the substrate, and connecting the transmission line to the semiconductor circuit element via a wire.
- According to further another embodiment of the present invention, there is provided a method for manufacturing a transmission system. The method includes the steps of fabricating a first semiconductor device, fabricating a second semiconductor device, and connecting the first semiconductor device to the second semiconductor device. The step of fabricating a first semiconductor device includes the sub-steps of forming a first semiconductor circuit element that processes an electrical signal having a predetermined frequency, forming, on a first substrate, a first transmission line that transmits the electrical signal and an impedance matching pattern having a symmetric shape with respect to the direction of the first transmission line, setting the first semiconductor circuit element on the first substrate, and connecting the first transmission line to the first semiconductor circuit element via a wire. The step of fabricating a second semiconductor device includes the sub-steps of forming a second semiconductor circuit element that processes an electrical signal having a predetermined frequency, forming, on a second substrate, a second transmission line that transmits the electrical signal and an impedance matching pattern having a symmetric shape with respect to the direction of the second transmission line, setting the second semiconductor circuit element on the second substrate, and connecting the second transmission line to the second semiconductor circuit element via a wire.
- In the semiconductor device according to the embodiment of the present invention, impedance matching of the transmission line is achieved by the impedance matching pattern. Due to this feature, reflection of the electrical signal that is transmitted through this transmission line and has the predetermined frequency can be reduced, and thus the transmission characteristic of the electrical signal can be enhanced. This can provide a semiconductor device capable of high-speed data transmission involving little signal deterioration.
- The transmission system according to the embodiment of the present invention includes the above-described semiconductor device. This can provide a transmission system capable of high-speed data transmission involving little signal deterioration.
- In the method for manufacturing a semiconductor device and the method for manufacturing a transmission system according to the embodiments of the present invention, the transmission line that transmits the signal having the predetermined frequency and the impedance matching pattern having a symmetric shape with respect to the direction of this transmission line are formed on the same substrate. Therefore, the step of forming the impedance matching pattern can be carried out simultaneously with the step of forming the transmission line, and thus cost reduction can be achieved.
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FIG. 1 is a perspective view showing a configuration example of a semiconductor device according to a first embodiment of the present invention; -
FIG. 2 is a plan view showing a configuration example of a major part of the semiconductor device; -
FIG. 3 is a side view showing the configuration example of the major part of the semiconductor device; -
FIG. 4 is a graph showing a characteristic example of the semiconductor device, obtained by simulation; -
FIG. 5 is a graph showing a characteristic example of the semiconductor device including characteristic difference dependent on distance, obtained by simulation; -
FIG. 6 is a graph showing a characteristic example of the semiconductor device including characteristic difference dependent on the relative dielectric constant of a sealing resin, obtained by simulation; -
FIG. 7 is an exploded perspective view showing a manufacturing example of the semiconductor device; -
FIG. 8 is an exploded perspective view showing the manufacturing example of the semiconductor device; -
FIG. 9 is an exploded perspective view showing the manufacturing example of the semiconductor device; -
FIG. 10 is a plan view showing a configuration example of a major part of a semiconductor device according to a second embodiment of the present invention; -
FIG. 11 is a side view showing the configuration example of the major part of the semiconductor device; -
FIG. 12 is a graph showing a characteristic example of the semiconductor device, obtained by simulation; -
FIG. 13 is a plan view showing a configuration example of a major part of a semiconductor device according to a third embodiment of the present invention; -
FIG. 14 is a front view showing the configuration example of the major part of the semiconductor device; -
FIG. 15 is a graph showing a characteristic example of the semiconductor device, obtained by simulation; -
FIG. 16 is a perspective view showing a configuration example of a semiconductor device according to a fourth embodiment of the present invention; -
FIG. 17 is a side view showing a configuration example of a transmission system according to a fifth embodiment of the present invention; -
FIG. 18 is a plan view showing the configuration example of the transmission system, parallel to the section along line A-A inFIG. 17 ; -
FIG. 19 is a side view showing a configuration example of a transmission system according to a sixth embodiment of the present invention; -
FIG. 20 is an exploded perspective view showing an assembly example of the transmission system; -
FIG. 21 is an exploded perspective view showing the assembly example of the transmission system; -
FIG. 22 is an exploded perspective view showing the assembly example of the transmission system; -
FIG. 23 is a perspective view showing a configuration example of a semiconductor device of a related art; -
FIG. 24 is a plan view showing a configuration example of a major part of the semiconductor device; -
FIG. 25 is a side view showing the configuration example of the major part of the semiconductor device; and -
FIG. 26 is a graph showing a characteristic example of the semiconductor device, obtained by simulation. - Modes (hereinafter, referred to as embodiments) for carrying out the present invention will be described below. The description will be made in the following order.
- 1. First Embodiment (semiconductor device 1: configuration example, characteristic example, and manufacturing example)
2. Second Embodiment (semiconductor device 2: configuration example and characteristic example)
3. Third Embodiment (semiconductor device 3: configuration example and characteristic example)
4. Fourth Embodiment (semiconductor device 4: configuration example)
5. Fifth Embodiment (transmission system 5: configuration example)
6. Sixth Embodiment (transmission system 6: configuration example and assembly example) - As shown in
FIGS. 1 to 3 , asemiconductor device 1 according to the present embodiment includes acircuit board 10 serving as a semiconductor circuit element that processes an electrical signal having a predetermined frequency, e.g. a frequency in the millimeter-wave band, and atransmission line 14 that is connected to thecircuit board 10 via awire unit 12 and transmits the electrical signal. In thetransmission line 14, aresonant pattern 15 serving as an impedance matching pattern having a symmetric shape with respect to the direction of this transmission line is provided. Thesemiconductor device 1 further includes asubstrate 17 on which thetransmission line 14 and theresonant pattern 15 are formed. - The
circuit board 10 has aterminal unit 11 composed of asignal transmission terminal 11 a andgrounding terminals 11 b. Thesubstrate 17 has aterminal unit 13 composed of asignal transmission terminal 13 a andgrounding terminals 13 b serving as grounding electrodes. Thesignal transmission terminal 11 a is connected to thesignal transmission terminal 13 a via awire 12 a included in thewire unit 12. Thegrounding terminals 11 b are connected to thegrounding terminals 13 b viawires 12 b included in thewire unit 12. Thegrounding terminals 13 b are provided symmetrically with respect to the direction of thetransmission line 14. This feature can stabilize the electrical signal transmitted through thetransmission line 14. - The
substrate 17 has adielectric layer 17 a, agrounding layer 17 b, and adielectric layer 17 c. Thegrounding layer 17 b is formed of copper or aluminum and has a function for grounding.Vias 19 having electrical conductivity are provided in thedielectric layer 17 a at the positions on which thegrounding terminals 13 b are provided. The via 19 is formed by making a hole from the upper surface to the lower surface of thedielectric layer 17 a and inserting an electrically-conductive material such as a metal in this hole. - The
semiconductor device 1 is grounded by electrical connection between the groundingterminals 13 b and thegrounding layer 17 b through thevias 19. Thedielectric layer 17 a has a predetermined dielectric constant. Thedielectric layer 17 a, thetransmission line 14, and thegrounding layer 17 b form a micro-strip line. Thedielectric layer 17 c has a function to support thedielectric layer 17 a and thegrounding layer 17 b. - The
transmission line 14 is connected to thesignal transmission terminal 13 a, and thetransmission line 14 transmits a millimeter-wave electrical signal in a predetermined direction (inFIGS. 2 and 3 , in the right direction). Theresonant pattern 15 having a symmetric shape with respect to the direction of the transmission line is formed in thetransmission line 14. The shape of theresonant pattern 15 is e.g. a circular shape symmetric with respect to the predetermined direction. By thisresonant pattern 15, impedance matching of thetransmission line 14 is achieved, which makes it possible to reduce reflection of the millimeter-wave electrical signal. - An
antenna part 16 is connected to the other end of thetransmission line 14, and theantenna part 16 converts the millimeter-wave electrical signal to an electromagnetic wave signal. Theantenna part 16 outputs the electromagnetic wave signal arising from the conversion by theantenna part 16 to the external via a sealingresin 18. Thesemiconductor device 1 is sealed by the sealingresin 18 in such a way that an upper part of thesubstrate 17 is covered. The sealingresin 18 is composed of an electrically-insulating material having a predetermined dielectric constant. - A simulation result relating to the millimeter-wave signal transmission by the
semiconductor device 1 will be described below. As shown inFIG. 4 , this simulation result is represented by plotting the frequency (GHz) of the millimeter-wave electrical signal on the abscissa and plotting the S-parameter magnitude (dB) on the ordinate, and is obtained by calculation with use of thesemiconductor device 1 shown inFIGS. 1 to 3 based on parameters shown in Table 2. The full lines inFIG. 4 indicate transfer characteristics S12A and S21A, and the dashed lines indicate reflection characteristics S11A and S22A. -
TABLE 2 Thickness A1 of transmission line 1418 μm Width A2 of transmission line 14130 μm Length A3 of transmission line 142 mm Thickness A5 of dielectric layer 17a70 μm Relative dielectric constant of dielectric layer 17a4.7 Dissipation factor of dielectric layer 17a0.02 Relative dielectric constant of sealing resin 184.2 Dissipation factor of sealing resin 180.02 Length of wire 12a635 μm Length of wire 12b711 μm Distance B4 between one end of transmission 860 μm line 14and center of resonant pattern 15Radius B6 of resonant pattern 15350 μm - As shown in Table 2, in this simulation, the width A2 of the
transmission line 14 and the length A3 from one end of thetransmission line 14 to the other end of thetransmission line 14, shown inFIG. 2 , are set to 130 μm and 2 mm, respectively. Referring toFIG. 3 , the thickness A1 of thetransmission line 14 is set to 18 μm, and the thickness A5 of thedielectric layer 17 a in thesubstrate 17 is set to 70 μm. Furthermore, referring toFIG. 2 , the distance B4 between one end of thetransmission line 14 and the center of theresonant pattern 15 is set to 860 μm, and the radius B6 of theresonant pattern 15 is set to 350 μm. In addition, the relative dielectric constant and the dissipation factor of thedielectric layer 17 a are set to 4.7 and 0.02, respectively. The relative dielectric constant and the dissipation factor of the sealingresin 18 are set to 4.2 and 0.02, respectively. The lengths of thewire 12 a and thewire 12 b are set to 635 μm and 711 μm, respectively. - As shown in
FIG. 4 , the transfer characteristics S12A and S21A have S-parameter magnitudes of about −3 dB when the frequency of the millimeter-wave electrical signal is around 60 GHz. The reflection characteristics S11A and S22A have S-parameter magnitudes of about −12 dB and −18 dB, respectively, when the frequency of the millimeter-wave electrical signal is around 60 GHz. - As above, compared with the simulation result of the
semiconductor device 100 of the related art, shown inFIG. 26 , the S-parameter magnitudes of the transfer characteristics S12A and S21A are increased and the S-parameter magnitudes of the reflection characteristics S11A and S22A are decreased when the frequency of the millimeter-wave electrical signal is around 60 GHz. This indicates that the transmission characteristic of the millimeter-wave electrical signal can be enhanced. Based on this feature, thesemiconductor device 1 can carry out high-speed data transmission involving little signal deterioration. -
FIG. 5 shows a simulation result indicating the reflection characteristics of thesemiconductor device 1, obtained by calculation with variation in the distance between one end of thetransmission line 14 and the center of theresonant pattern 15 in the semiconductor device 1 (hereinafter, this distance will be referred to as the distance B4) in the range from 800 μm to 1000 μm in increments of 20 μm. As shown inFIG. 5 , this simulation result is represented by plotting the frequency (GHz) of the millimeter-wave electrical signal on the abscissa and plotting the S-parameter magnitude (dB) on the ordinate, and is obtained by calculation with use of the parameters other than the distance B4, among the above-described parameters in Table 2. - In
FIG. 5 , a reflection characteristic L80 indicates the reflection characteristic of thesemiconductor device 1 when the distance B4 is set to 800 μm. A reflection characteristic L82 indicates the reflection characteristic of thesemiconductor device 1 when the distance B4 is set to 820 μm. A reflection characteristic L84 indicates the reflection characteristic of thesemiconductor device 1 when the distance B4 is set to 840 μm. A reflection characteristic L86 indicates the reflection characteristic of thesemiconductor device 1 when the distance B4 is set to 860 μm. A reflection characteristic L88 indicates the reflection characteristic of thesemiconductor device 1 when the distance B4 is set to 880 μm. A reflection characteristic L90 indicates the reflection characteristic of thesemiconductor device 1 when the distance B4 is set to 900 μm. A reflection characteristic L92 indicates the reflection characteristic of thesemiconductor device 1 when the distance B4 is set to 920 μm. A reflection characteristic L94 indicates the reflection characteristic of thesemiconductor device 1 when the distance B4 is set to 940 μm. A reflection characteristic L96 indicates the reflection characteristic of thesemiconductor device 1 when the distance B4 is set to 960 μm. A reflection characteristic L98 indicates the reflection characteristic of thesemiconductor device 1 when the distance B4 is set to 980 μm. A reflection characteristic L100 indicates the reflection characteristic of thesemiconductor device 1 when the distance B4 is set to 1000 μm. - As shown in
FIG. 5 , the resonant frequency of theresonant pattern 15 is shifted depending on the distance B4. The resonant frequency of theresonant pattern 15 is about 68 GHz when the distance B4 is set to 800 μm. The resonant frequency of theresonant pattern 15 is about 66 GHz when the distance B4 is set to 820 μm. The resonant frequency of theresonant pattern 15 is about 65 GHz when the distance B4 is set to 840 μm. The resonant frequency of theresonant pattern 15 is about 63 GHz when the distance B4 is set to 860 μm. The resonant frequency of theresonant pattern 15 is about 62 GHz when the distance B4 is set to 880 μm. The resonant frequency of theresonant pattern 15 is about 61 GHz when the distance B4 is set to 900 μm. The resonant frequency of theresonant pattern 15 is about 60 GHz when the distance B4 is set to 920 μm. The resonant frequency of theresonant pattern 15 is about 58 GHz when the distance B4 is set to 940 μm. The resonant frequency of theresonant pattern 15 is about 57 GHz when the distance B4 is set to 960 μm. The resonant frequency of theresonant pattern 15 is about 56 GHz when the distance B4 is set to 980 μm. The resonant frequency of theresonant pattern 15 is about 55 GHz when the distance B4 is set to 1000 μm. - In this manner, the resonant frequency of the
resonant pattern 15 is shifted toward the lower frequency side when the distance B4 is set longer. This feature makes it possible to transmit the millimeter-wave electrical signal at the desired frequency through change in the distance B4. -
FIG. 6 shows a simulation result indicating the reflection characteristics, obtained by calculation with variation in the relative dielectric constant of the sealingresin 18 in thesemiconductor device 1 in the range from 3.0 to 5.0 in increments of 0.2. As shown inFIG. 6 , this simulation result is represented by plotting the frequency (GHz) of the millimeter-wave electrical signal on the abscissa and plotting the S-parameter magnitude (dB) on the ordinate, and is obtained by calculation with use of the parameters other than the relative dielectric constant of the sealingresin 18, among the above-described parameters in Table 2. - In
FIG. 6 , a reflection characteristic E30 indicates the reflection characteristic of thesemiconductor device 1 when the relative dielectric constant of the sealingresin 18 is set to 3.0. A reflection characteristic E32 indicates the reflection characteristic of thesemiconductor device 1 when the relative dielectric constant of the sealingresin 18 is set to 3.2. A reflection characteristic E34 indicates the reflection characteristic of thesemiconductor device 1 when the relative dielectric constant of the sealingresin 18 is set to 3.4. A reflection characteristic E36 indicates the reflection characteristic of thesemiconductor device 1 when the relative dielectric constant of the sealingresin 18 is set to 3.6. A reflection characteristic E38 indicates the reflection characteristic of thesemiconductor device 1 when the relative dielectric constant of the sealingresin 18 is set to 3.8. A reflection characteristic E40 indicates the reflection characteristic of thesemiconductor device 1 when the relative dielectric constant of the sealingresin 18 is set to 4.0. A reflection characteristic E42 indicates the reflection characteristic of thesemiconductor device 1 when the relative dielectric constant of the sealingresin 18 is set to 4.2. A reflection characteristic E44 indicates the reflection characteristic of thesemiconductor device 1 when the relative dielectric constant of the sealingresin 18 is set to 4.4. A reflection characteristic E46 indicates the reflection characteristic of thesemiconductor device 1 when the relative dielectric constant of the sealingresin 18 is set to 4.6. A reflection characteristic E48 indicates the reflection characteristic of thesemiconductor device 1 when the relative dielectric constant of the sealingresin 18 is set to 4.8. A reflection characteristic E50 indicates the reflection characteristic of thesemiconductor device 1 when the relative dielectric constant of the sealingresin 18 is set to 5.0. - As shown in
FIG. 6 , the resonant frequency of theresonant pattern 15 is shifted depending on the relative dielectric constant of the sealingresin 18. The resonant frequency of theresonant pattern 15 is about 64 GHz when the relative dielectric constant of the sealingresin 18 is set to 3.0. The resonant frequency of theresonant pattern 15 is about 63.5 GHz when the relative dielectric constant of the sealingresin 18 is set to 3.2. The resonant frequency of theresonant pattern 15 is about 63 GHz when the relative dielectric constant of the sealingresin 18 is set to 3.4. The resonant frequency of theresonant pattern 15 is about 62.5 GHz when the relative dielectric constant of the sealingresin 18 is set to 3.6. The resonant frequency of theresonant pattern 15 is about 62 GHz when the relative dielectric constant of the sealingresin 18 is set to 3.8. The resonant frequency of theresonant pattern 15 is about 61.5 GHz when the relative dielectric constant of the sealingresin 18 is set to 4.0. The resonant frequency of theresonant pattern 15 is about 61 GHz when the relative dielectric constant of the sealingresin 18 is set to 4.2. The resonant frequency of theresonant pattern 15 is about 60.5 GHz when the relative dielectric constant of the sealingresin 18 is set to 4.4. The resonant frequency of theresonant pattern 15 is about 60 GHz when the relative dielectric constant of the sealingresin 18 is set to 4.6. The resonant frequency of theresonant pattern 15 is about 59.5 GHz when the relative dielectric constant of the sealingresin 18 is set to 4.8. The resonant frequency of theresonant pattern 15 is about 59 GHz when the relative dielectric constant of the sealingresin 18 is set to 5.0. - In this manner, the resonant frequency of the
resonant pattern 15 is shifted toward the lower frequency side when the relative dielectric constant of the sealingresin 18 is set higher. This feature makes it possible to transmit the millimeter-wave electrical signal at the desired frequency through change in the relative dielectric constant of the sealingresin 18. - A method for manufacturing the
semiconductor device 1 will be described below. As shown inFIG. 7 , for thesemiconductor device 1, theterminal unit 13, thetransmission line 14, theresonant pattern 15, and theantenna part 16 are formed on a predetermined surface (inFIG. 7 , the upper surface) of thesubstrate 17 composed of thedielectric layers grounding layer 17 b. Theterminal unit 13, thetransmission line 14, theresonant pattern 15, and theantenna part 16 are formed by e.g. etching. - The dielectric layers 17 a and 17 c are composed of an electrically-insulating material and formed by using e.g. resin or ceramics. The
grounding layer 17 b, theterminal unit 13, thetransmission line 14, theresonant pattern 15, and theantenna part 16 are composed of the same electrically-conductive material and formed by using e.g. copper or aluminum. - A patch antenna is employed as an example of the
antenna part 16 in this manufacturing example. The patch antenna can be fabricated as a thin component similarly to theterminal unit 13, thetransmission line 14, and theresonant pattern 15. Thus, the adhesion between theantenna part 16 and the sealingresin 18 can be increased, so that efficient electromagnetic coupling is achieved. Furthermore, the patch antenna can be fabricated at low cost because it has a simple two-dimensional physical shape. -
Paste 50 is applied at a predetermined position (inFIG. 7 , in the dashed line rectangle) on thesubstrate 17 on which theterminal unit 13, thetransmission line 14, theresonant pattern 15, and theantenna part 16 are formed. Thepaste 50 is composed of e.g. a metal material such as silver or aluminum and an organic solvent. Thecircuit board 10 on which theterminal unit 11 is formed is placed on thesubstrate 17 on which thepaste 50 is applied. Thesubstrate 17 on which thecircuit board 10 is placed is loaded in a constant-temperature chamber or a conveyer drying oven at about 200° C., and thepaste 50 is dried. This surely fixes thesubstrate 17 and thecircuit board 10 to each other. - After the
paste 50 is dried, as shown inFIG. 8 , theterminal unit 11 on thecircuit board 10 is connected to theterminal unit 13 on thesubstrate 17 by thewire unit 12. For this connection between theterminal units wire unit 12, e.g. apparatus for wire bonding, called a wire bonder, is used. - As shown in
FIG. 9 , the upper surface of thesubstrate 17 on which thewire unit 12 is mounted is sealed by injection molding of the sealingresin 18. The sealingresin 18 has the electrically-insulating characteristic and a predetermined dielectric constant, and transmits a signal output from theantenna part 16. Furthermore, the sealingresin 18 has a function for protection from dusts and water from the external. For the sealingresin 18, e.g. a resin material such as an epoxy resin or a urethane resin is used. - By such a manufacturing method, the
semiconductor device 1, which is allowed to have an enhanced transmission characteristic of the millimeter-wave electrical signal through impedance matching of thetransmission line 14 by theresonant pattern 15, can be fabricated at low cost. - As above, in the
semiconductor device 1 according to the first embodiment, thecircuit board 10 processes an electrical signal having a millimeter-wave frequency. Thetransmission line 14 is connected to thecircuit board 10 via thewire unit 12 and transmits the electrical signal. On the premise of this configuration, theresonant pattern 15 having a symmetric shape with respect to the direction of thetransmission line 14 is provided in thetransmission line 14. Thus, impedance matching of thetransmission line 14 is achieved by theresonant pattern 15, which makes it possible to reduce reflection of the electrical signal that is transmitted through thistransmission line 14 and has the millimeter-wave frequency. As a result, the transmission characteristic of the millimeter-wave electrical signal can be enhanced, and thesemiconductor device 1 capable of high-speed data transmission involving little signal deterioration can be provided. - The present embodiment relates to a semiconductor device in which a resonant pattern is provided in a transmission line on a circuit board. In this second embodiment, the component having the same name and symbol as those of the component in the above-described first embodiment has the same function, and therefore description thereof is omitted.
- As shown in
FIGS. 10 and 11 , asemiconductor device 2 according to the present embodiment includes acircuit board 20 serving as a semiconductor circuit element that processes a millimeter-wave electrical signal, and a second transmission line (hereinafter, referred to as the transmission line 21) that is provided on thecircuit board 20 and transmits the electrical signal. In thetransmission line 21, aresonant pattern 22 serving as an impedance matching pattern having a symmetric shape with respect to thetransmission line 21 is provided. Furthermore, thesemiconductor device 2 includes asubstrate 17 and a sealingresin 18. - The
circuit board 20 is composed of a first dielectric layer (hereinafter, referred to as thedielectric layer 20 a), agrounding layer 20 b, and a second dielectric layer (hereinafter, referred to as thedielectric layer 20 c). Thegrounding layer 20 b is formed of copper or aluminum and has a function for grounding. Thedielectric layer 20 a has a predetermined dielectric constant. Thedielectric layer 20 a, thetransmission line 21, and thegrounding layer 20 b form a micro-strip line. Thedielectric layer 20 c has a function to support thedielectric layer 20 a and thegrounding layer 20 b. - On the surface of the
circuit board 20, aterminal unit 11 composed of asignal transmission terminal 11 a andgrounding terminals 11 b, thetransmission line 21, and theresonant pattern 22 are formed. Theterminal unit 11, thetransmission line 21, and theresonant pattern 22 are formed by covering the surface of thecircuit board 20 with a mask or the like having a predetermined pattern and depositing a metal material such as copper or aluminum. - The
resonant pattern 22 has a symmetric shape with respect to the direction in which thetransmission line 21 transmits the millimeter-wave electrical signal. The shape of theresonant pattern 22 is e.g. a circular shape symmetric with respect to a predetermined direction. By thisresonant pattern 22, impedance matching of thetransmission line 21 is achieved, which makes it possible to reduce reflection of the millimeter-wave electrical signal. This feature can enhance the transmission characteristic of the millimeter-wave electrical signal. - The
substrate 17 has aterminal unit 13 composed of asignal transmission terminal 13 a andgrounding terminals 13 b. Thegrounding terminals 11 b are connected to thegrounding terminals 13 b viawires 12 b included in awire unit 12. - The
substrate 17 has adielectric layer 17 a, agrounding layer 17 b, and adielectric layer 17 c.Vias 19 having electrical conductivity are provided in thedielectric layer 17 a at the positions on which thegrounding terminals 13 b are provided. The via 19 is formed by making a hole from the upper surface to the lower surface of thedielectric layer 17 a and inserting an electrically-conductive material such as a metal in this hole. - The
semiconductor device 2 is grounded by electrical connection between the groundingterminals 13 b and thegrounding layer 17 b through thevias 19. Thedielectric layer 17 a has a predetermined dielectric constant. Thedielectric layer 17 a, thetransmission line 14, and thegrounding layer 17 b form a micro-strip line. Thedielectric layer 17 c has a function to support thedielectric layer 17 a and thegrounding layer 17 b. - The
signal transmission terminal 11 a is connected to thesignal transmission terminal 13 a on thesubstrate 17 via awire 12 a included in thewire unit 12. Thetransmission line 14 is connected to thesignal transmission terminal 13 a, and thetransmission line 14 transmits the millimeter-wave electrical signal in a predetermined direction (inFIGS. 10 and 11 , in the right direction). - An
antenna part 16 is connected to the other end of thetransmission line 14, and theantenna part 16 converts the millimeter-wave electrical signal to an electromagnetic wave signal. Theantenna part 16 outputs the electromagnetic wave signal arising from the conversion by theantenna part 16 to the external via the sealingresin 18. Thesemiconductor device 2 is sealed by the sealingresin 18 in such a way that an upper part of thesubstrate 17 is covered. The sealingresin 18 is composed of an electrically-insulating material having a predetermined dielectric constant. - The operation of the
semiconductor device 2 having the above-described configuration will be described below. The millimeter-wave electrical signal processed by thecircuit board 20 is transmitted through thetransmission line 21 provided with theresonant pattern 22. This millimeter-wave electrical signal can be transmitted through thetransmission line 21 without suffering from the influence of reflection because impedance matching of thetransmission line 21 is achieved by theresonant pattern 22. The millimeter-wave electrical signal transmitted through thetransmission line 21 is subsequently transmitted through thetransmission line 14 via thesignal transmission terminal 11 a provided on thecircuit board 20, thewire 12 a, and thesignal transmission terminal 13 a. The millimeter-wave electrical signal transmitted through thetransmission line 14 is converted to the electromagnetic wave signal by theantenna part 16, and the electromagnetic wave signal is output to the outside of thesemiconductor device 2. - A simulation result relating to the millimeter-wave signal transmission by the
semiconductor device 2 will be described below. As shown inFIG. 12 , this simulation result is represented by plotting the frequency (GHz) of the millimeter-wave electrical signal on the abscissa and plotting the S-parameter magnitude (dB) on the ordinate, and is obtained by calculation with use of thesemiconductor device 2 shown inFIGS. 10 and 11 based on parameters shown in Table 3. The full lines inFIG. 12 indicate transfer characteristics S12B and S21B, and the dashed lines indicate reflection characteristics S11B and S22B. -
TABLE 3 Thickness C1 of transmission line 211 μm Width C2 of transmission line 2110 μm Length C3 of transmission line 212 mm Thickness C5 of dielectric layer 20a5 μm Relative dielectric constant of dielectric layer 20a3.5 Dissipation factor of dielectric layer 20a0.01 Relative dielectric constant of sealing resin 184.2 Dissipation factor of sealing resin 180.02 Length of wire 12a635 μm Length of wire 12b711 μm Distance C4 between one end of transmission 530 μm line 21 and center of resonant pattern 22Radius C6 of resonant pattern 2260 μm - As shown in Table 3, in this simulation, the width C2 of the
transmission line 21 and the length C3 from one end of thetransmission line 21 to the other end of thetransmission line 21, shown inFIG. 10 , are set to 10 μm and 2 mm, respectively. Referring toFIG. 11 , the thickness C1 of thetransmission line 21 is set to 1 μm, and the thickness C5 of thedielectric layer 20 a is set to 5 μm. Furthermore, referring toFIG. 10 , the distance C4 between one end of thetransmission line 21 and the center of theresonant pattern 22 is set to 530 μm, and the radius C6 of theresonant pattern 22 is set to 60 μm. In addition, the relative dielectric constant and the dissipation factor of thedielectric layer 20 a are set to 3.5 and 0.01, respectively. The relative dielectric constant and the dissipation factor of the sealingresin 18 are set to 4.2 and 0.02, respectively. The lengths of thewire 12 a and thewire 12 b are set to 635 μm and 711 μm, respectively. - As shown in
FIG. 12 , the transfer characteristics S12B and S21B have S-parameter magnitudes of about −3 dB when the frequency of the millimeter-wave electrical signal is around 60 GHz. The reflection characteristics S11B and S22B have S-parameter magnitudes of about −26 dB and −10 dB, respectively, when the frequency of the millimeter-wave electrical signal is around 60 GHz. - As above, compared with the simulation result of the
semiconductor device 100 of the related art, shown inFIG. 26 , the S-parameter magnitudes of the transfer characteristics S12B and S21B are increased and the S-parameter magnitudes of the reflection characteristics S11B and S22B are decreased when the frequency of the millimeter-wave electrical signal is around 60 GHz. This indicates that the transmission characteristic of the millimeter-wave electrical signal can be enhanced. Based on this feature, thesemiconductor device 2 can carry out high-speed data transmission involving little signal deterioration. - As above, in the
semiconductor device 2 according to the second embodiment, thecircuit board 20 has thetransmission line 21 for transmitting the millimeter-wave electrical signal in a predetermined direction, and theresonant pattern 22 having a symmetric shape with respect to the direction of thetransmission line 21, e.g. a circular shape, is provided in thistransmission line 21. Thus, impedance matching of thetransmission line 21 is achieved by theresonant pattern 22, which makes it possible to reduce reflection of the millimeter-wave electrical signal transmitted through thistransmission line 21. As a result, the transmission characteristic of the millimeter-wave electrical signal can be enhanced, and thesemiconductor device 2 capable of high-speed data transmission involving little signal deterioration can be provided. - The present embodiment relates to a semiconductor device obtained by omitting the sealing
resin 18 of thesemiconductor device 1. In this third embodiment, the component having the same name and symbol as those of the component in the above-described first embodiment has the same function, and therefore description thereof is omitted. - As shown in
FIGS. 13 and 14 , asemiconductor device 3 according to the present embodiment includes acircuit board 10 that processes a millimeter-wave electrical signal and atransmission line 14 that is connected to thecircuit board 10 via awire unit 12 and transmits the electrical signal. In thetransmission line 14, aresonant pattern 15 having a symmetric shape with respect to the direction of this transmission line is provided. Thesemiconductor device 3 further includes asubstrate 17 on which thetransmission line 14 and theresonant pattern 15 are formed. Thecircuit board 10 and the surface of thesubstrate 17 are not sealed by a sealing resin. - A simulation result relating to the millimeter-wave signal transmission by the
semiconductor device 3 will be described below. As shown inFIG. 15 , this simulation result is represented by plotting the frequency (GHz) of the millimeter-wave electrical signal on the abscissa and plotting the S-parameter magnitude (dB) on the ordinate, and is obtained by calculation with use of thesemiconductor device 3 shown inFIGS. 13 and 14 based on parameters shown in Table 4. The full lines inFIG. 15 indicate transfer characteristics S12C and S21C, and the dashed lines indicate reflection characteristics S11C and S22C. -
TABLE 4 Thickness A1 of transmission line 1418 μm Width A2 of transmission line 14130 μm Length A3 of transmission line 142 mm Thickness A5 of dielectric layer 17a70 μm Relative dielectric constant of dielectric layer 17a4.7 Dissipation factor of dielectric layer 17a0.02 Length of wire 12a635 μm Length of wire 12b711 μm Distance F4 between one end of transmission 980 μm line 14 and center of resonant pattern 15Radius F6 of resonant pattern 15350 μm - As shown in Table 4, in this simulation, the width A2 of the
transmission line 14 and the length A3 from one end of thetransmission line 14 to the other end of thetransmission line 14, shown inFIG. 13 , are set to 130 μm and 2 mm, respectively. Referring toFIG. 14 , the thickness A1 of thetransmission line 14 is set to 18 μm, and the thickness A5 of thedielectric layer 17 a is set to 70 μm. Furthermore, referring toFIG. 13 , the distance F4 between one end of thetransmission line 14 and the center of theresonant pattern 15 is set to 980 μm, and the radius F6 of theresonant pattern 15 is set to 350 μm. In addition, the relative dielectric constant and the dissipation factor of thedielectric layer 17 a are set to 4.7 and 0.02, respectively. The lengths of thewire 12 a and thewire 12 b are set to 635 μm and 711 μm, respectively. - As shown in
FIG. 15 , the transfer characteristics S12C and S21C have S-parameter magnitudes of about −3 dB when the frequency of the millimeter-wave electrical signal is around 60 GHz. The reflection characteristics S11C and S22C have S-parameter magnitudes of about −11 dB and −42 dB, respectively, when the frequency of the millimeter-wave electrical signal is around 60 GHz. - As above, compared with the simulation result of the
semiconductor device 100 of the related art, shown inFIG. 26 , the S-parameter magnitudes of the transfer characteristics S12C and S21C are increased and the S-parameter magnitudes of the reflection characteristics S11C and S22C are decreased when the frequency of the millimeter-wave electrical signal is around 60 GHz. This indicates that the transmission characteristic of the millimeter-wave electrical signal can be enhanced. Based on this feature, thesemiconductor device 3 can carry out high-speed data transmission involving little signal deterioration. - As above, in the
semiconductor device 3 according to the third embodiment, impedance matching of thetransmission line 14 is achieved by theresonant pattern 15 although a sealing resin is not provided. This makes it possible to reduce reflection of the millimeter-wave electrical signal transmitted through thistransmission line 14. - The present embodiment relates to a
semiconductor device 4 having a printedboard 35 provided with anantenna part 29. In this fourth embodiment, the component having the same name and symbol as those of the component in the above-described first embodiment has the same function, and therefore description thereof is omitted. - As shown in
FIG. 16 , thesemiconductor device 4 according to the present embodiment includes acircuit board 10 that processes a millimeter-wave electrical signal and atransmission line 14 that is connected to thecircuit board 10 via awire unit 12 and transmits the electrical signal. In thetransmission line 14, aresonant pattern 15 having a symmetric shape with respect to thetransmission line 14 is provided. Thesemiconductor device 4 further includes an interposer substrate (hereinafter, referred to as the substrate 25) on which thetransmission line 14 is formed and the printedboard 35 having a third transmission line (hereinafter, referred to as the transmission line 28) and theantenna part 29. - The
substrate 25 is equivalent to a component obtained by omitting theantenna part 16 on thesubstrate 17 in the first embodiment and providing a second via (hereinafter, referred to as the via 27). On the surface of the printedboard 35, thetransmission line 28 and theantenna part 29 are formed. Thetransmission line 28 and theantenna part 29 are formed by using an electrically-conductive metal such as copper or aluminum. - In the
semiconductor device 4, thesubstrate 25 is placed on a predetermined surface of the printedboard 35. The printedboard 35 and thesubstrate 25 are electrically connected to each other by the via 27 in thesubstrate 25. The via 27 is formed by making a hole from the upper surface to the lower surface of thesubstrate 25 and inserting an electrically-conductive material such as a metal in this hole. - A millimeter-wave electrical signal is processed by the
circuit board 10, and the processed millimeter-wave electrical signal is output to aterminal unit 13 on thesubstrate 25 via aterminal unit 11 and thewire unit 12. The millimeter-wave electrical signal output to theterminal unit 13 is transmitted through thetransmission line 14 in a predetermined direction. In thetransmission line 14, theresonant pattern 15 symmetric with respect to the direction of thetransmission line 14 is provided. Impedance matching of thetransmission line 14 is achieved by thisresonant pattern 15, and thus the transmission characteristic of the millimeter-wave electrical signal can be enhanced. The millimeter-wave electrical signal, whose transmission characteristic is enhanced, is output to thetransmission line 28 on the printedboard 35 through the via 27. The millimeter-wave electrical signal is transmitted through thetransmission line 28 and output to theantenna part 29 at one end of thetransmission line 28. Theantenna part 29 converts the output millimeter-wave electrical signal to an electromagnetic wave signal and outputs the signal to the external. - As above, in the
semiconductor device 4 according to the fourth embodiment, the millimeter-wave electrical signal is transmitted by thetransmission line 28 formed on the printedboard 35, and therefore the flexibility of the configuration of theantenna part 29 is high. - The present embodiment relates to a
transmission system 5 that employs twosemiconductor devices 1 in the first embodiment and allows transmission of a millimeter-wave between the semiconductor devices. In this embodiment, the component having the same name and numeral/symbol as those of the component in the above-described first embodiment has the same function, and therefore description thereof is omitted. - As shown in
FIGS. 17 and 18 , thetransmission system 5 includes a first semiconductor device (hereinafter, referred to as thesemiconductor device 1A) and a second semiconductor device (hereinafter, referred to as thesemiconductor device 1B).Support substrates 32 are provided under thesemiconductor device 1A and on thesemiconductor device 1B.Support pillars 33 are provided at four corners of thesupport substrates 32. Thesemiconductor devices support substrates 32 and thesupport pillars 33. - The
semiconductor device 1A includes a first circuit board (hereinafter, referred to as thecircuit board 10A) and a first interposer substrate (hereinafter, referred to as thesubstrate 17A). Thecircuit board 10A processes a millimeter-wave electrical signal and outputs the processed millimeter-wave electrical signal from aterminal unit 11A to thesubstrate 17A. Thesubstrate 17A has a first terminal unit (hereinafter, referred to as theterminal unit 13A), a first transmission line (hereinafter, referred to as thetransmission line 14A), a first resonant pattern (hereinafter, referred to as theresonant pattern 15A), and a first antenna part (hereinafter, referred to as theantenna part 16A). - The
transmission line 14A transmits the millimeter-wave electrical signal processed by thecircuit board 10A in a predetermined direction (inFIG. 17 , in the right direction). Theterminal unit 13A at one end of thistransmission line 14A is connected to theterminal unit 11A on thecircuit board 10A via awire unit 12A. In thetransmission line 14A, theresonant pattern 15A having a symmetric shape with respect to the direction of thetransmission line 14A, e.g. a circular shape, is provided. By thisresonant pattern 15A, impedance matching of thetransmission line 14A is achieved, which makes it possible to reduce reflection of the millimeter-wave electrical signal. Thesubstrate 17A converts the millimeter-wave electrical signal to an electromagnetic wave signal D1 by theantenna part 16A provided at the other end of thetransmission line 14A, and outputs the electromagnetic wave signal D1 to thesemiconductor device 1B. - The
semiconductor device 1B includes a second circuit board (hereinafter, referred to as thecircuit board 10B) and a second interposer substrate (hereinafter, referred to as thesubstrate 17B). Thesubstrate 17B has a second terminal unit (hereinafter, referred to as theterminal unit 13B), a second transmission line (hereinafter, referred to as thetransmission line 14B), a second resonant pattern (hereinafter, referred to as theresonant pattern 15B), and a second antenna part (hereinafter, referred to as theantenna part 16B). - The
substrate 17B receives the electromagnetic wave signal D1 output from theantenna part 16A by theantenna part 16B, and converts the received signal to a millimeter-wave electrical signal. One end of thetransmission line 14B is connected to theantenna part 16B. Thetransmission line 14B transmits the millimeter-wave electrical signal arising from the conversion by theantenna part 16B in a predetermined direction (inFIG. 17 , in the left direction). - In the
transmission line 14B, theresonant pattern 15B having a symmetric shape with respect to thetransmission line 14B, e.g. a circular shape, is provided. By thisresonant pattern 15B, impedance matching of thetransmission line 14B is achieved, which makes it possible to reduce reflection of the millimeter-wave electrical signal. Theterminal unit 13B is provided at the other end of thetransmission line 14B. Awire unit 12B is connected to theterminal unit 13B and to aterminal unit 11B on thecircuit board 10B. The millimeter-wave electrical signal transmitted through thetransmission line 14B is output from theterminal unit 13B on thesubstrate 17B to theterminal unit 11B via thewire unit 12B. Thecircuit board 10B executes signal processing for the millimeter-wave electrical signal output to theterminal unit 11B. - As above, the
transmission system 5 according to the fifth embodiment includes thesemiconductor devices resonant patterns transmission lines transmission lines resonant patterns transmission lines transmission system 5 capable of high-speed data transmission involving little signal deterioration can be provided. - Although the present embodiment relates to the transmission system that transmits the millimeter-wave electrical signal from the
semiconductor device 1A to thesemiconductor device 1B, the transmission system may be so configured that the millimeter-wave electrical signal is transmitted from thesemiconductor device 1B to thesemiconductor device 1A. - The present embodiment relates to a
transmission system 6 obtained by providing adielectric transmission path 40 in the above-describedtransmission system 5 for transmitting a millimeter-wave between semiconductor devices. In this embodiment, the component having the same name and symbol as those of the component in the above-described fifth embodiment has the same function, and therefore description thereof is omitted. - As shown in
FIG. 19 , thetransmission system 6 includessemiconductor devices dielectric transmission path 40. Achassis 31 is provided between thesemiconductor device 1A and thesemiconductor device 1B. Thechassis 31 has a function to fix thesemiconductor devices chassis 31 is formed by using e.g. an electrically-insulating material such as a resin. Thedielectric transmission path 40 is provided inside thechassis 31, and thedielectric transmission path 40 is located above anantenna part 16A of thesemiconductor device 1A and below anantenna part 16B of thesemiconductor device 1B. Thedielectric transmission path 40 has a predetermined dielectric constant and is provided by using e.g. any of an acrylic resin-based, urethane resin-based, epoxy resin-based, silicone-based, and polyimide-based dielectric materials. -
Viscoelastic members 30 are provided between thesemiconductor devices chassis 31. Theviscoelastic member 30 has a predetermined dielectric constant and is provided by using e.g. any of an acrylic resin-based, urethane resin-based, epoxy resin-based, silicone-based, and polyimide-based dielectric materials. It is preferable that theviscoelastic member 30 be composed of the same material as that of thedielectric transmission path 40. - As described above for the fifth embodiment, an electromagnetic wave signal D1 is output from the
antenna part 16A on asubstrate 17A. In the present embodiment, theviscoelastic member 30 and thedielectric transmission path 40 are provided above theantenna part 16A with the intermediary of a sealingresin 18. The electromagnetic wave signal D1 output from theantenna part 16A passes through theviscoelastic member 30 and thedielectric transmission path 40 and is received by theantenna part 16B on asubstrate 17B. - A method for manufacturing the
transmission system 6 will be described below. The method is based on the premise that thesemiconductor devices semiconductor device 1, described withFIGS. 7 to 9 . - As shown in
FIG. 20 , for the manufacturing of thetransmission system 6, an adhesive (not shown) is applied on the lower part of thesubstrate 17A of thesemiconductor device 1A and asupport substrate 32 is set, to thereby fix thesemiconductor device 1A and thesupport substrate 32. Furthermore, an adhesive is applied on the bottom surfaces ofsupport pillars 33 and thesupport pillars 33 are provided upright and fixed at four corners of the upper surface of thesupport substrate 32. Theviscoelastic member 30 is placed on the sealingresin 18 for sealing thesubstrate 17A. An adhesive may be provided between theviscoelastic member 30 and the sealingresin 18. However, it is preferable to use, as this adhesive, an adhesive composed of the same material as that of theviscoelastic member 30. - As shown in
FIG. 21 , an adhesive (not shown) is applied on the upper part of thesubstrate 17B of thesemiconductor device 1B and thesupport substrate 32 is set, to thereby fix thesemiconductor device 1B and thesupport substrate 32. Furthermore, an adhesive is applied on the upper surfaces of thesupport pillars 33 and thesupport pillars 33 are provided upright and fixed at four corners of the lower surface of thesupport substrate 32. Theviscoelastic member 30 is placed under the sealingresin 18 of thesemiconductor device 1B. An adhesive may be provided between theviscoelastic member 30 and the sealingresin 18 similarly to the above-describedsemiconductor device 1A. - As shown in
FIG. 22 , ahole 41 is made at a predetermined place of the chassis 31 (place opposed to theantenna parts semiconductor devices dielectric transmission path 40 is inserted therein. Thechassis 31 is provided between thesemiconductor device 1A described withFIG. 20 and thesemiconductor device 1B described withFIG. 21 . An adhesive is applied between thesupport pillars 33 provided for thesemiconductor devices chassis 31, and thesemiconductor devices chassis 31 are fixed. An adhesive may be applied between theviscoelastic members 30 provided for thesemiconductor devices chassis 31. In this case, it is preferable to use, as this adhesive, an adhesive composed of the same material as that of theviscoelastic members 30. In this manner, thetransmission system 6 shown inFIG. 19 is fabricated. - As above, the
transmission system 6 according to the sixth embodiment includes thedielectric transmission path 40 and theviscoelastic members 30 between thesemiconductor devices - The present application contains subject matter related to that disclosed in Japanese Priority Patent Application JP 2009-063564 filed in the Japan Patent Office on Mar. 16, 2009, the entire content of which is hereby incorporated by reference.
- It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and alterations may occur depending on design requirements and other factors insofar as they are within the scope of the appended claims or the equivalents thereof.
Claims (18)
1. A semiconductor device comprising:
a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and
a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal, wherein
an impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.
2. The semiconductor device according to claim 1 , wherein
the transmission line is provided on the semiconductor circuit element.
3. The semiconductor device according to claim 1 , wherein
the impedance matching pattern has a circular shape symmetric with respect to the direction of the transmission line.
4. The semiconductor device according to claim 1 , wherein
a resonant frequency of the impedance matching pattern is shifted depending on distance between one end of the transmission line and the impedance matching pattern, and the electrical signal having a desired frequency is transmitted.
5. The semiconductor device according to claim 1 , wherein
the semiconductor circuit element is covered by an insulating protective member having a predetermined dielectric constant, and
a resonant frequency of the impedance matching pattern is shifted depending on the dielectric constant of the protective member, and the electrical signal having a desired frequency is transmitted.
6. The semiconductor device according to claim 1 , wherein
the predetermined frequency is in a millimeter-wave band.
7. The semiconductor device according to claim 1 , wherein
a plurality of grounding electrodes are provided for the transmission line, and
the plurality of grounding electrodes are provided symmetrically with respect to the direction of the transmission line.
8. A transmission system comprising:
a first semiconductor device configured to include a first semiconductor circuit element that processes an electrical signal having a predetermined frequency, a first transmission line that is connected to the first semiconductor circuit element via a wire and transmits the electrical signal, and a first antenna part that converts the electrical signal transmitted from the first transmission line to an electromagnetic wave signal and sends the electromagnetic wave signal; and
a second semiconductor device configured to include a second antenna part that receives the electromagnetic wave signal sent from the first antenna part and converts the electromagnetic wave signal to an electrical signal having the predetermined frequency, a second transmission line that transmits the electrical signal arising from conversion by the second antenna part, and a second semiconductor circuit element that is connected to the second transmission line via a wire and processes the electrical signal transmitted by the second transmission line, wherein
impedance matching patterns having symmetric shapes with respect to directions of the first and second transmission lines are provided in the first and second transmission lines.
9. The transmission system according to claim 8 , further comprising
a dielectric transmission path configured to be provided between the first semiconductor device and the second semiconductor device and have a predetermined dielectric constant, the dielectric transmission path transmitting the electrical signal from the first semiconductor device to the second semiconductor device.
10. The transmission system according to claim 9 , wherein
a viscoelastic member having a predetermined dielectric constant is provided between the first and second semiconductor devices and the dielectric transmission path.
11. The transmission system according to claim 9 , wherein
at least one dielectric material among an acrylic resin-based material, a urethane resin-based material, an epoxy resin-based material, a silicone-based material, and a polyimide-based material is used.
12. The transmission system according to claim 8 , wherein
the predetermined frequency is in a millimeter-wave band.
13. The transmission system according to claim 8 , wherein
a plurality of grounding electrodes are provided for the transmission line, and
the plurality of grounding electrodes are provided symmetrically with respect to the direction of the transmission line.
14. A method for manufacturing a semiconductor device, the method comprising the steps of:
forming a semiconductor circuit element that processes an electrical signal having a predetermined frequency;
forming, on a substrate, a transmission line that transmits the electrical signal and an impedance matching pattern having a symmetric shape with respect to a direction of the transmission line;
setting the semiconductor circuit element on the substrate; and
connecting the transmission line to the semiconductor circuit element via a wire.
15. The method for manufacturing a semiconductor device according to claim 14 , further comprising the step of
forming an insulating protective member having a predetermined dielectric constant on the substrate.
16. A method for manufacturing a transmission system, the method comprising the steps of:
fabricating a first semiconductor device;
fabricating a second semiconductor device; and
connecting the first semiconductor device to the second semiconductor device, wherein
the step of fabricating a first semiconductor device includes the sub-steps of
forming a first semiconductor circuit element that processes an electrical signal having a predetermined frequency,
forming, on a first substrate, a first transmission line that transmits the electrical signal and an impedance matching pattern having a symmetric shape with respect to a direction of the first transmission line,
setting the first semiconductor circuit element on the first substrate, and
connecting the first transmission line to the first semiconductor circuit element via a wire, and
the step of fabricating a second semiconductor device includes the sub-steps of
forming a second semiconductor circuit element that processes an electrical signal having a predetermined frequency,
forming, on a second substrate, a second transmission line that transmits the electrical signal and an impedance matching pattern having a symmetric shape with respect to a direction of the second transmission line,
setting the second semiconductor circuit element on the second substrate, and
connecting the second transmission line to the second semiconductor circuit element via a wire.
17. The method for manufacturing a transmission system according to claim 16 , further comprising the step of
forming, between the first semiconductor device and the second semiconductor device, a dielectric transmission path that has a predetermined dielectric constant and transmits the electrical signal from the first semiconductor device to the second semiconductor device.
18. The method for manufacturing a transmission system according to claim 17 , further comprising the step of
forming a viscoelastic member having a predetermined dielectric constant between the first and second semiconductor devices and the dielectric transmission path.
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US14/487,711 US9748664B2 (en) | 2009-03-16 | 2014-09-16 | Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system |
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JP2009063564A JP5287390B2 (en) | 2009-03-16 | 2009-03-16 | Semiconductor device, transmission system, semiconductor device manufacturing method, and transmission system manufacturing method |
JP2009-063564 | 2009-03-16 |
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Also Published As
Publication number | Publication date |
---|---|
CN101840911A (en) | 2010-09-22 |
US9748664B2 (en) | 2017-08-29 |
JP2010219816A (en) | 2010-09-30 |
EP2230712A3 (en) | 2010-10-27 |
EP2230712A2 (en) | 2010-09-22 |
US20150002360A1 (en) | 2015-01-01 |
CN101840911B (en) | 2014-01-08 |
JP5287390B2 (en) | 2013-09-11 |
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