TW202007954A - Detecting apparatus for identifying defect of hole wall - Google Patents
Detecting apparatus for identifying defect of hole wall Download PDFInfo
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- TW202007954A TW202007954A TW108103884A TW108103884A TW202007954A TW 202007954 A TW202007954 A TW 202007954A TW 108103884 A TW108103884 A TW 108103884A TW 108103884 A TW108103884 A TW 108103884A TW 202007954 A TW202007954 A TW 202007954A
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Abstract
Description
本發明係有關於一種檢測設備,尤指一種辨識孔壁瑕疵的檢測設備。 The invention relates to a detection device, in particular to a detection device for identifying hole wall defects.
在各種物件上常會見到許多孔、槽等具有深度的結構設計,這些結構設計除了作為造型、流通口之外,通常具有用以定位、鎖固、或裝設其他零組件等使用目的,並且依據使用目的的不同,對於這些結構設計也有不同的精度要求。 Many kinds of holes, grooves and other deep structural designs are often seen on various objects. In addition to being used as a shape and a circulation port, these structural designs usually have the purpose of positioning, locking, or installing other components, etc., and Depending on the purpose of use, there are also different accuracy requirements for these structural designs.
孔,一般可以經由沖床沖壓製成、經由雷射切割而成、或經由手工具鑽孔形成等方式,依照製程方式的不同,孔的精度也大有不同,因此需要針對物件上的孔進行檢測,藉以確保孔符合所需的精度要求。 Holes can generally be made by punching by punching, laser cutting, or drilling by hand tools. According to different manufacturing methods, the accuracy of the holes is also very different, so it is necessary to detect the hole on the object , To ensure that the holes meet the required accuracy requirements.
本發明的主要目的,在於提供一種簡化孔壁檢測流程以及提高整體檢測效率的檢測設備。 The main purpose of the present invention is to provide a detection device that simplifies the detection process of the hole wall and improves the overall detection efficiency.
為達到上述目的,本發明係提供一種辨識孔壁瑕疵的檢測設備,包含有一檢測平台、一廣角攝像裝置、以及一處理器。該檢測平台供一待測物設置,該廣角攝像裝置設置於該檢測 平台一側,對該待測物上的至少一孔結構進行取像,該處理器包含有一取像指示模組、以及一影像處理模組,該取像指示模組與該廣角攝像裝置電連接,以傳送一取像指令至該廣角攝像裝置以取得該孔結構的一影像,以及該影像處理模組接收該影像並依據所取得的該影像獲得一影像辨識結果。 To achieve the above object, the present invention provides a detection device for identifying hole wall defects, which includes a detection platform, a wide-angle camera device, and a processor. The detection platform is provided with an object to be measured, the wide-angle camera device is provided on the side of the detection platform, and the at least one hole structure of the object to be measured is imaged. The processor includes an image acquisition instruction module, and a An image processing module, the image capturing instruction module is electrically connected to the wide-angle camera device to transmit an image capturing command to the wide-angle camera device to obtain an image of the hole structure, and the image processing module receives the image and based on The obtained image obtains an image recognition result.
為達到上述目的,本發明另提供一種辨識孔壁瑕疵的檢測設備,包含有一檢測平台、一攝像裝置、以及一處理器。該檢測平台供一待測物設置,該攝像裝置設置於該檢測平台一側且與該檢測平台表面間夾一傾斜角,對該待測物上的至少一孔結構進行取像,該處理器包含有一取像指示模組、以及一影像處理模組,該取像指示模組與該攝像裝置電連接,以傳送一取像指令至該攝像裝置以取得該孔結構的一影像,以及該影像處理模組接收該影像並依據所取得的該影像獲得一影像辨識結果。 To achieve the above object, the present invention also provides a detection device for identifying hole wall defects, which includes a detection platform, a camera device, and a processor. The detection platform is provided for an object to be measured, the camera device is disposed on one side of the detection platform and forms an inclination angle with the surface of the detection platform to take an image of at least one hole structure on the object to be measured, and the processor It includes an imaging instruction module and an image processing module. The imaging instruction module is electrically connected to the camera device to transmit an imaging command to the camera device to obtain an image of the hole structure and the image The processing module receives the image and obtains an image recognition result based on the obtained image.
本發明可以於單次取像中取得孔結構內側壁面的所有影像,藉以辨識其瑕疵的位置及其種類,簡化以往繁複的檢測流程,縮減檢測時間,提升檢測生產線的工作效率,並且適用於檢測電路板的各類型孔壁或側壁。 The invention can obtain all the images of the inner wall surface of the hole structure in a single imaging, so as to identify the position and type of the defect, simplify the previous complicated inspection process, reduce the inspection time, improve the efficiency of the inspection production line, and is suitable for inspection Various types of hole walls or side walls of the circuit board.
100‧‧‧檢測設備 100‧‧‧ Testing equipment
P‧‧‧待測物 P‧‧‧ test object
P1‧‧‧孔結構 P1‧‧‧hole structure
P11‧‧‧內側壁面 P11‧‧‧Inner wall surface
10‧‧‧檢測平台 10‧‧‧ Testing platform
20‧‧‧廣角攝像裝置 20‧‧‧Wide angle camera
21‧‧‧攝像機主體 21‧‧‧Camera main body
22‧‧‧廣角鏡頭 22‧‧‧wide-angle lens
30‧‧‧處理器 30‧‧‧ processor
31‧‧‧取像指示模組 31‧‧‧ Acquisition instruction module
32‧‧‧影像處理模組 32‧‧‧Image processing module
33‧‧‧定位指示模組 33‧‧‧Position indication module
40‧‧‧照明裝置 40‧‧‧Lighting
41‧‧‧側向光源 41‧‧‧Side light source
411‧‧‧光源 411‧‧‧Light source
412‧‧‧透鏡 412‧‧‧Lens
413‧‧‧漫射器 413‧‧‧ Diffuser
42‧‧‧背面光源 42‧‧‧Back light
50‧‧‧移載裝置 50‧‧‧Transfer device
θ‧‧‧視角 θ‧‧‧angle of view
H‧‧‧取像焦距 H‧‧‧Acquisition focal length
I‧‧‧拉伸影像 I‧‧‧Stretch the image
200‧‧‧檢測設備 200‧‧‧ Testing equipment
A‧‧‧傾斜角 A‧‧‧Tilt angle
T‧‧‧影像取像區域 T‧‧‧Image acquisition area
M‧‧‧反射鏡 M‧‧‧Reflecting mirror
L‧‧‧光線 L‧‧‧Light
R‧‧‧路徑 R‧‧‧ Path
D‧‧‧瑕疵 D‧‧‧Blemish
圖1,為本發明檢測設備的側面示意圖。 FIG. 1 is a schematic side view of the detection device of the present invention.
圖2,為本發明檢測設備的方塊示意圖。 FIG. 2 is a block diagram of the detection device of the present invention.
圖3,為本發明檢測設備的成像示意圖。 Figure 3 is a schematic diagram of the imaging of the detection device of the present invention.
圖4,為本發明檢測設備取得孔結構的影像示意圖。 FIG. 4 is a schematic diagram of an image of a hole structure obtained by a detection device of the present invention.
圖5,為本發明檢測設備另一實施例的側面示意圖。 FIG. 5 is a schematic side view of another embodiment of the detection device of the present invention.
圖6,為本發明檢測設備另一實施例影像取像區域的移動示意圖。 6 is a schematic diagram of movement of an image capturing area of another embodiment of the detection device of the present invention.
有關本發明之詳細說明及技術內容,現就配合圖式說明如下。再者,本發明中之圖式,為說明方便,其比例未必照實際比例繪製,該等圖式及其比例並非用以限制本發明之範圍,在此先行敘明。 The detailed description and technical content of the present invention will now be described in conjunction with the drawings. Furthermore, the drawings in the present invention are not necessarily drawn according to actual proportions for the convenience of explanation. The drawings and their proportions are not intended to limit the scope of the present invention, and will be described here first.
請參閱「圖1」以及「圖2」,為本發明檢測設備的側面示意圖以及方塊示意圖,如圖所示:本發明係提供一種辨識孔壁瑕疵的檢測設備100,該檢測設備100主要應用於檢測孔、槽等結構的內側壁面,透過光學檢測鏡頭於單次拍攝取得內側壁面的所有影像,藉以辨識其壁面上是否具有異物、油墨或表面不平整等瑕疵狀況,該檢測設備100包含有一檢測平台10、一廣角攝像裝置20、以及一處理器30。 Please refer to "FIG. 1" and "FIG. 2", which are side schematic diagrams and block schematic diagrams of the inspection device of the present invention. As shown in the figure: the present invention provides a
所述的檢測平台10供一待測物P設置,該待測物P可以為一電路板、一面板、或一產品殼體等物件,本發明對此不予以限制。於一實施態樣中,所述的檢測平台10可以設置有用以定位該待測物P的定位支架(圖未示),該定位支架包含有二可分別於X方向以及Y方向上調整的定位桿,經由該二定位桿將該待測物P固定設置於該檢測平台10的平面上。於另一實施態樣 中,所述的檢測平台10可以設置有一真空吸附裝置(圖未示),經由該真空吸附裝置吸附該待測物P,以將該待測物P固定設置於該檢測平台10的平面上。所述的檢測平台10還可以設置有一用以承載該待測物P的傳輸帶(圖未示),於該待測物P經過該廣角攝像裝置20時對該待測物P進行取像。惟,上述例示僅為本發明檢測平台10的幾種較佳實施態樣說明,本發明的具體實施態樣並不侷限於上述實施態樣,在此先行敘明。 The
所述的廣角攝像裝置20設置於該檢測平台10一側,對該待測物P的至少一孔結構P1進行取像,該孔結構P1可以為一通孔、一槽孔、或其他任何在物件上形成具有一深度的結構。於本實施態樣中,如「圖1」所示,該廣角攝像裝置20設置於該檢測平台10的上方,用以拍攝該待測物P,藉以取得該孔結構P1內側壁面P11的影像。所述的廣角攝像裝置20包含有一攝像機主體21、以及一設置於該攝像機主體21一側的廣角鏡頭22,其中,該廣角鏡頭22可以與該攝像機主體21共構為一體或獨立設置,本發明對此不予以限制。所述的攝像機主體21可以為CMOS線掃描相機(CMOS line scan camera)、CMOS面掃描相機(CMOS area scan camera)或CCD(Charge Coupled Device)線掃描相機,可以對該待測物P的孔結構P1進行取像,藉以得到該孔結構P1內側壁面P11的影像。所述的廣角鏡頭22對物件進行取像時,所取得的影像會有球面或膨脹的感覺,產生桶狀畸變(Barrel Distortion),又稱為負型扭曲(Negative Distortion),例如該廣 角鏡頭22拍攝一個方形物體時,所取得的影像的四角會向內緊縮,而影像的邊線中段則會向外拉伸凸出,形狀類似一個木桶,因此又被稱為桶狀變形。 The wide-
於本實施態樣中,如「圖2」所示,所述的處理器30包含有一取像指示模組31、一影像處理模組32、以及一定位指示模組33。於一實施態樣中,所述的處理器配合儲存單元工作,用以存取儲存單元的資料後,執行儲存單元內預存的程式,預存的程式可以為取像指示模組31、影像處理模組32、以及定位指示模組33。在此必須先說明的是,本發明中所述的處理器及儲存單元並不限制單個,於必要時亦可以經由複數個處理器及複數個儲存單元協同執行程式並完成工作。於一實施態樣中,所述的處理器例如是中央處理器(Central Processing Unit,CPU),或是其他可程式化之一般用途或特殊用途的微處理器(Microprocessor)、數位訊號處理器(Digital Signal Processor,DSP)、可程式化控制器、特殊應用積體電路(Application Specific Integrated Circuits,ASIC)、可程式化邏輯裝置(Programmable Logic Device,PLD)或其他類似裝置或這些裝置的組合。 In this embodiment, as shown in FIG. 2, the
所述的取像指示模組31與該廣角攝像裝置20電連接,該取像指示模組31傳送一取像指令至該廣角攝像裝置20,以令該廣角攝像裝置20取得該孔結構P1的一影像。所述的影像處理模組32接收該廣角攝像裝置20取得該孔結構P1的影像,並依據所取得的該影像獲得一影像辨識結果,透過該影像辨識結果判 斷該孔結構P1內側壁面P11是否具有瑕疵D及其種類與位置(如圖4所示)。於一實施態樣中,所述的影像處理模組32依據所取得的該孔結構P1的影像,將影像經過例如二值化處理、銳化處理、加強對比度處理、去背處理、影像分割處理或其他類似的影像處理程序,透過上述影像處理後的影像辨識該孔結構P1內側壁面P11是否具有瑕疵D,以及辨識瑕疵D為例如該內側壁面P11具有氣泡、孔隙、凹陷、凸塊、裂痕、異物、毛邊、油墨或其他任何造成該內側壁面P11不平整的瑕疵種類。於另一實施態樣中,所述的影像處理模組32依據所取得的該孔結構P1的影像經由影像處理程序後與一預設影像進行比對,藉以辨識該孔結構P1內側壁面P11的瑕疵D的種類及其位置。於另一實施態樣中,亦可以透過機器學習、或深度學習等類神經網路進行影像的瑕疵辨識。惟,上述例示僅為本發明影像處理辨識的三種較佳實施態樣說明,本發明的具體實施態樣並不侷限於上述實施態樣,在此先行敘明。 The
為使該廣角攝像裝置20取得該孔結構P1影像,於一實施態樣中,定位指示模組33分別取得該孔結構P1及該廣角攝像裝置20的初始座標,依據上述二初始座標輸出座標訊號,取得該廣角攝像裝置20與該孔結構P1間的相對位置關係以利進行調整。於一實施態樣中,定位指示模組33依據該孔結構P1及該廣角攝像裝置20的初始座標,經由計算並得出二初始座標於X、Y、Z等軸向上的向量差值,依據該向量差值以調整該廣角攝像裝 置20與該孔結構P1間的相對位置關係。 In order to enable the wide-
所述的檢測設備100更進一步包含有一照明裝置40,該照明裝置40設置該檢測平台10一側,以提供照明光源。所述的照明裝置40包含有一或複數個側向光源41,該側向光源41設置於該檢測平台10上方的一側或周側,於本實施態樣中,如「圖1」所示,該側向光源41設置於該檢測平台10的上方二側,由該待測物P正面的二側對該孔結構P1提供照明光源。於一實施態樣中,所述的側向光源41可以為一環狀燈,由該待測物P四周對該孔結構P1提供均勻的照明光源,減少暗帶產生。該側向光源41除了可以為環狀燈之外,還可以為隧道燈、側向燈等照明光源。所述的照明裝置40包含有一或複數個背面光源42,該背面光源42設置於該檢測平台10相對該廣角攝像裝置20的另一側,於本實施態樣中,如「圖1」所示,該背面光源42設置於該檢測平台10的下方,該檢測平台10可以為一具有透光性的均光板,該背面光源42的光源垂直照射於該均光板,使光源均勻照射至該待測物P背面。 The
所述的檢測設備100進一步包含有一承載該廣角攝像裝置20的移載裝置50。該移載裝置50依據該定位指示模組33輸出的座標訊號將該廣角攝像裝置20移動至該孔結構P1附近,以對該孔結構P1進行取像。所述的移載裝置50可以為一多軸機械臂(圖未示),包含有一設置於該檢測平台10一側的承載基座、以及一設置於該承載基座上用以承載該廣角攝像裝置20的移載手 臂,其中,該承載基座可以與該檢測平台10一體設置,透過該移載手臂移動該廣角攝像裝置20至該孔結構P1上,並調整該廣角攝像裝置20與該待測物P間的距離。於另一較佳實施態樣中,所述的移載裝置50可以為一設置於該檢測平台10上的多維線性載台(圖未示),包含有一具有一Z軸滑軌的X軸滑軌、以及一與該X軸滑軌相連接的Y軸滑軌,該Z軸滑軌上承載該廣角攝像裝置20以移動其於Z方向上移動,並透過該X軸滑軌及該Y軸滑軌分別於XY方向方向上移動,藉以調整該廣角攝像裝置20相對該孔結構P1的位置。惟,上述例示僅為本發明移載裝置50的二種較佳實施態樣說明,本發明的具體實施態樣並不侷限於上述實施態樣,在此先行敘明。 The
請一併參閱「圖3」,為本發明檢測設備的成像示意圖,如圖所示:於本實施態樣中,所述的側向光源41係包含有一光源411、一設於該光源411一側的透鏡412、以及一設於該光源411與該透鏡412間的漫射器413。該光源411經由該透鏡412及該漫射器413輸出成複數個具指向性的光線L。所述的光線L朝該廣角攝像裝置20軸心方向照射,該光線L經由反射鏡M反射至該孔結構P1上。所述的廣角攝像裝置20於Z方向上移動以調整對該孔結構P1的取像位置,該廣角攝像裝置20利用其廣角特性,由成像路徑R接收照射於該內側壁面P11的光線L,以取得該孔結構P1的內側壁面P11影像。 Please also refer to "Figure 3", which is an imaging schematic diagram of the detection device of the present invention. As shown in the figure: in this embodiment, the lateral
請一併參閱「圖4」,為本發明檢測設備所取得孔結構的影像示意圖,並請一併參閱「圖1」,如圖所示:如「圖1」所示,所述的廣角攝像裝置20的視角θ介於70度至90度之間,即該廣角鏡頭22可以對該待測物P進行取像的範圍。所述的廣角攝像裝置20與該待測物P間的取像焦距H介於5mm至60mm之間,有助於該孔結構P1進入該廣角攝像裝置20的視角θ中,藉以取得該孔結構P1的清晰影像。 Please also refer to "Figure 4", which is an image schematic diagram of the hole structure obtained by the inspection device of the present invention, and refer to "Figure 1", as shown in the figure: as shown in "Figure 1", the wide-angle camera The angle of view θ of the
為使該廣角攝像裝置20所取得的影像能夠呈現該孔結構P1的所有內側壁面P11,於進行檢測時,透過移載裝置50將該廣角攝像裝置20移動至該孔結構P1上並使二者同軸設置,以令該廣角攝像裝置20將該孔結構P1的內側壁面P11成像於拉伸影像I中,利用該廣角攝像裝置20的廣角端會使影像產生桶狀變形的特性,於該拉伸影像I中呈現拉伸的內側壁面P11,如「圖4」所示,本發明透過廣角攝像裝置20的特性,於單次拍攝即可取得孔結構P1的所有內側壁面P11以利於辨識其瑕疵D的位置及其種類,有效簡化檢測流程以及縮短檢測時間。 In order to enable the image acquired by the wide-
請一併參閱「圖5」以及「圖6」,為本發明檢測設備另一實施例的側面示意圖以及影像取像區域的移動示意圖,並請一併參閱「圖2」,如圖所示:於本實施態樣中,所述的檢測設備200進行檢測時,透過移載裝置50將廣角攝像裝置20移動至孔結構P1周緣內側上方(或下方),其中,該廣角攝像裝置20與該檢測平台10 表面間夾一傾斜角A,該傾斜角A介於0度至90度之間,該移載裝置50使傾斜的該廣角攝像裝置20沿該孔結構P1周緣繞行,即該廣角攝像裝置20的影像取像區域T繞該孔結構P1一圈,取得呈現拉伸的內側壁面P11影像,本發明透過沿孔緣繞一圈同時進行取像的方式,有助於檢測小孔徑的壁面瑕疵D的位置及其種類(如圖6所示)。由於本實施態樣與前一實施態樣的差異主要在於廣角攝像裝置20與孔結構P1間的位置關係,因此本段落針對相同結構的部分不再進行贅述,在此先行敘明。 Please refer to "Figure 5" and "Figure 6" together, which is a schematic side view of another embodiment of the detection device of the present invention and a schematic diagram of the movement of the image capturing area, and also refer to "Figure 2", as shown in the figure: In the present embodiment, when the
於另一實施態樣中,本發明中亦可使用不具廣角成像效果的攝像裝置對孔結構P1進行取像,由於本實施態樣與前一實施態樣的差異主要在於攝像裝置的成像效果,因此本段落針對相同結構的部分不再進行贅述,在此先行敘明。所述的檢測設備100進行檢測時,透過移載裝置50將攝像裝置移動至孔結構P1周緣內側上方(或下方),調整該攝像裝置與該檢測平台10表面間夾一介於0度至90度之間的傾斜角A,針對該孔結構P1的內側壁面進行影像擷取,藉以檢測孔徑的壁面瑕疵。另外,該移載裝置50亦可使該攝像裝置沿該孔結構P1周緣繞行,即攝像裝置的影像取像區繞該孔結構P1一圈,取得孔結構P1內側壁面P11影像,藉以檢測孔徑的內壁面瑕疵位置及其種類。 In another embodiment, the present invention can also use a camera device without a wide-angle imaging effect to capture the hole structure P1. Since the difference between this embodiment and the previous embodiment is mainly the imaging effect of the camera device, Therefore, this paragraph will not repeat the parts of the same structure, which will be described first. When the
綜上所述,本發明可以於單次取像中取得孔結構內側壁面的所有影像,藉以辨識其瑕疵的位置及其種類,簡化以往繁複的檢測流程,縮減檢測時間,提升檢測生產線的工作效率。 In summary, the present invention can obtain all the images of the inner wall surface of the hole structure in a single acquisition, so as to identify the position and type of the defect, simplify the previous complicated inspection process, reduce the inspection time, and improve the efficiency of the inspection production line .
以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能以此限定本發明實施之範圍,即凡依本發明申請專利範圍所作之均等變化與修飾,皆應仍屬本發明之專利涵蓋範圍內。 The present invention has been described in detail above, but the above is only one of the preferred embodiments of the present invention, and it should not be used to limit the scope of implementation of the present invention, that is, any equivalent made in accordance with the scope of the patent application of the present invention Changes and modifications should still fall within the scope of the patent of the present invention.
100‧‧‧檢測設備 100‧‧‧ Testing equipment
P‧‧‧待測物 P‧‧‧ test object
P1‧‧‧孔結構 P1‧‧‧hole structure
P11‧‧‧內側壁面 P11‧‧‧Inner wall surface
10‧‧‧檢測平台 10‧‧‧ Testing platform
20‧‧‧廣角攝像裝置 20‧‧‧Wide angle camera
21‧‧‧攝像機主體 21‧‧‧Camera main body
22‧‧‧廣角鏡頭 22‧‧‧wide-angle lens
40‧‧‧照明裝置 40‧‧‧Lighting
41‧‧‧側向光源 41‧‧‧Side light source
42‧‧‧背面光源 42‧‧‧Back light
θ‧‧‧視角 θ‧‧‧angle of view
H‧‧‧取像焦距 H‧‧‧Acquisition focal length
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