CN112747670A - BGA packaging solder ball detection system and method - Google Patents
BGA packaging solder ball detection system and method Download PDFInfo
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- CN112747670A CN112747670A CN202010182171.6A CN202010182171A CN112747670A CN 112747670 A CN112747670 A CN 112747670A CN 202010182171 A CN202010182171 A CN 202010182171A CN 112747670 A CN112747670 A CN 112747670A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 116
- 238000001514 detection method Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 230000007547 defect Effects 0.000 claims abstract description 30
- 238000005259 measurement Methods 0.000 claims abstract description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 22
- 239000011159 matrix material Substances 0.000 claims description 11
- 238000007689 inspection Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000009877 rendering Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- 238000004364 calculation method Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000013178 mathematical model Methods 0.000 claims description 3
- 238000012935 Averaging Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000006185 dispersion Substances 0.000 claims 1
- 238000005457 optimization Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- Length Measuring Devices By Optical Means (AREA)
Abstract
A BGA packaging solder ball detection system comprises a light field camera, a lens, a detection module and a control module, wherein the lens is opposite to a BGA packaging solder ball to be detected and is used for acquiring an image of the solder ball; and the light source is used for helping the light field camera to obtain an image of the solder ball. The detection process of the solder balls comprises the steps of adjusting the focal length and/or the aperture of the light field camera to obtain a plurality of defocused soft light pure color calibration plates of the BGA packaging solder balls and obtain light field white images of the solder balls; calibrating the light field white image, and calibrating the center of the light field camera microlens; performing scale calibration on the light field camera; setting up and adjusting the light source; shooting a BGA solder ball area array to be detected by the light field camera to obtain a multi-view image and a depth image; carrying out position identification and positioning on the solder balls according to the light field multi-view image and the depth image; and finally obtaining the three-dimensional size measurement information and the defect detection information of the tested solder ball.
Description
Technical Field
The invention belongs to the technical field of integrated circuit packaging measurement, and particularly relates to a BGA packaging solder ball detection system and a method.
Background
In recent years, with the rapid increase of science and technology and industrial level, the requirement of daily life for electronic products is higher and higher, and the demand is also larger and larger. The BGA technology of the ball grid array packaging solder balls of the integrated circuit chip improves the manufacturing speed of the circuit board to a certain extent. However, with the development of precision packaging, the requirement for solder balls is relatively strict, so the speed of solder ball detection becomes a key factor for limiting the technology. The three-dimensional dimension measurement and defect detection of BGA (Ball Grid Array, BGA solder Ball for short) Ball Grid Array packaging solder balls can adopt photoelectric detection technology. The dimension measurement of the solder balls comprises but is not limited to the position coordinates of the ball center, the ball diameter and the ball volume of each solder ball, the ball center distance and the arrangement error of each solder ball; the detection of the tin ball defects includes but is not limited to the surface state of the tin ball, the oversize and undersize of the tin ball, and the judgment of defects such as tin lack, tin connection, foreign matters and the like.
The three-dimensional measurement and defect detection technology is a core technology in the field of machine vision and measurement. Three-dimensional measurement and defect detection refers to identifying three-dimensional information and defects of an object. The measurement of three-dimensional dimension of BGA solder balls and defect detection are always one of the most difficult issues for industrial appearance detection. At present, the industrial world mostly adopts manual re-judgment after the detection of the three-dimensional dimension and the defect of the BGA solder ball by a two-dimensional camera, has advantages in the aspect of solder ball positioning, but has the defects of only judging whether the solder is at the corresponding position or not at a certain angle due to the lack of height information, and more bad phenomena under various complex conditions such as solder volume, surface roundness, foreign matters and the like are detected or depend on manual re-judgment and spot check, thereby causing serious restriction on automatic networking in electronic production.
The appearance of the light field camera provides a new solution direction for the three-dimensional size measurement and defect detection of the BGA solder balls. The light field camera is additionally provided with a micro lens array between a sensor and a main lens of a conventional camera, so that the propagation direction of light rays is recorded, a unique light field image coded by the lens array is formed, the light field image is processed and rendered, and then three-dimensional information can be obtained.
Disclosure of Invention
The invention provides a BGA packaging tin ball detection system and a method, which utilize a light field camera to realize three-dimensional size measurement and defect detection of an integrated circuit BGA packaging tin ball.
In one embodiment of the present invention, a BGA package solder ball inspection system includes,
the lens of the light field camera is over against the BGA packaging solder ball to be detected and is used for acquiring an image of the solder ball;
and at least one light source, wherein the light of the light source is emitted to the BGA packaging solder ball and is used for helping the light field camera to obtain an image of the solder ball.
The detection process of the detection system for the solder ball comprises the following steps,
adjusting the focal length and/or aperture of the light field camera to obtain a plurality of defocused soft light pure color calibration plates of the BGA packaging solder balls to obtain light field white images of the solder balls;
calibrating the light field white image, and calibrating the center of the light field camera microlens;
performing scale calibration on the light field camera;
setting up and adjusting the light source;
shooting a BGA solder ball area array to be detected by the light field camera to obtain a multi-view image and a depth image;
carrying out position identification and positioning on the solder balls according to the light field multi-view image and the depth image;
and finally obtaining the three-dimensional size measurement information and the defect detection information of the tested solder ball.
The invention relates to a method for measuring the three-dimensional size of a BGA solder ball and detecting defects based on an optical field camera, which adopts the optical field camera to shoot a defocusing soft light pure color calibration plate after matching with a lens with a proper aperture and a proper focal length, and carries out optical field white image calibration and microlens center calibration; shooting a plurality of scale calibration plates with different spatial positions by using the camera to calibrate the scale of the light field camera; the solder ball area to be detected is irradiated by matching with a proper light source, so that the solder ball and the substrate can be well imaged by a camera; shooting a tested tin ball area by a light field camera, and performing light field multi-view rendering and depth calculation; and then, identifying and positioning the position of each solder ball to finally obtain the three-dimensional size measurement and defect detection of the solder ball in the tested solder ball area. The invention has the following beneficial effects:
1. the image information of a plurality of visual angles of the BGA solder balls can be obtained through one-time shooting, and the information which is difficult to detect at a single visual angle, such as foreign matters, collision injuries and the like on the surface has more accurate and stable detection capability.
2. The three-dimensional coordinate information of BGA tin balls can be obtained through one-time shooting, the three-dimensional size of the tin balls can be measured, the volume of the tin balls can be calculated, and then the tin amount can be judged in an auxiliary mode, so that unstable finished products of welding caused by insufficient tin amount or overlarge tin amount can be avoided from the source more stably.
3. The BGA solder ball detection information obtained by the light field camera is point cloud information, the numerical value can be directly imported into a judgment program, and the judgment program can be efficiently accessed and integrated with the existing production mode.
The invention can accurately and efficiently acquire the three-dimensional size measurement and defect detection information of the BGA solder ball, and effectively solve the problems of the existing equipment inspection and manual inspection.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present invention will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:
FIG. 1 is a flowchart of a method for measuring three-dimensional dimensions of BGA solder balls and detecting defects based on a light field camera according to an embodiment of the present invention.
FIG. 2 is a schematic view of a system for testing BGA solder balls by a light field camera under the irradiation of a light source according to one embodiment of the present invention. FIG. 3 is a schematic view of a system for testing BGA solder balls by a light field camera under the irradiation of a light source according to one embodiment of the present invention. 10-light field camera, 21-first light source, 22-second light source, 23-third light source, 30-BGA tin ball.
Detailed Description
According to one or more embodiments, as shown in fig. 3, a BGA package solder ball detection system includes a light field camera having a lens facing a BGA package solder ball to be detected for obtaining an image of the solder ball; and light rays of the two light sources are emitted to the BGA packaging solder balls and are used for helping the light field camera to obtain images of the solder balls.
In accordance with one or more embodiments, as shown in fig. 1, a BGA package solder ball inspection system includes,
adjusting the focal length and/or aperture of the light field camera to obtain a plurality of defocused soft light pure color calibration plates of the BGA packaging solder balls to obtain light field white images of the solder balls;
calibrating the light field white image, and calibrating the center of the light field camera microlens;
performing scale calibration on the light field camera;
setting up and adjusting the light source;
shooting a BGA solder ball area array to be detected by the light field camera to obtain a multi-view image and a depth image;
carrying out position identification and positioning on the solder balls according to the light field multi-view image and the depth image;
and finally obtaining the three-dimensional size measurement information and the defect detection information of the tested solder ball.
Further, the method for calibrating the light field white image is to calculate a vignetting removal matrix according to the light field white image. The method for calibrating the center of the light field camera microlens is to calculate and obtain a light field camera microlens subpixel level center coordinate matrix according to a light field white image. The method for carrying out scale calibration on the light field camera comprises the steps that the light field camera shoots a plurality of circular point calibration plates with known space three-dimensional positions, a light field mathematical model from three-dimensional coordinates to parallax is built, and light field camera scale calibration is completed.
According to one or more embodiments, a BGA solder ball three-dimensional size measuring and defect detecting method based on a light field camera includes the following steps:
a1, selecting an optical lens with proper focal length and magnification according to the size of the solder ball measuring area and the measuring depth range. Adjusting the lens aperture to the light field camera aperture match, i.e. the microlens aperture matches the main lens aperture, as embodied by the light field camera taking a defocused soft solid color calibration plate image in which the microlens array is locatedExactly or close to the tangent state. After the adjustment is finished, a plurality of pure-color background plates with uniform light intensity at the defocusing position of the light field camera are shot, namely the defocusing soft light pure-color calibration plate. Averaging and normalizing a plurality of light field white images to obtain a vignetting removing matrix
All the light field original images shot subsequently need to be point-divided by the vignetting removing matrix, and therefore light field white image calibration is completed.
After the light field packet image calibration step is completed, processing the light field white image by using a filter, removing noise of the light field white image, and performing non-maximum value suppression on the filtered light field image; then, according to the processed image, taking a local maximum value, wherein the maximum value is just the integer-level center of the light field camera micro-lens; and (3) taking the center of the integer level microlens as an initial iteration value, iteratively optimizing the arrangement grid of the microlenses, finally obtaining the arrangement angle and the arrangement distance of the microlenses, and obtaining the center of the subpixel level microlens.
A2, the light field camera scale calibration step needs to assemble a displacement table and a scale calibration plate: firstly, fixing a scale calibration plate in the focal plane area of the light field camera, continuously moving the calibration plate to a fixed spatial distance from the focal plane, and shooting, wherein the spatial position of a point on the calibration plate is known, so that the spatial position of the point on the calibration plate in the whole moving process can be obtained. And the dot calibration points form a diffusion circle on the light field image, the diameter of the diffusion circle is obtained through processing, the parallax value of the diffusion circle and the pixel coordinate of the diffusion circle are further obtained through calculation, and the relation between the three-dimensional coordinate in the space and the pixel coordinate and the parallax value of the light field camera is obtained through fitting according to the light field camera scale calibration model.
A3, irradiating the solder ball by using a proper light source according to the measurement requirement of the BGA solder ball to be measured, and irradiating the solder ball by using 3-degree light sources as shown in figure 2, so that the solder ball can be imaged by a light field camera, and multiple imaging can be performed if necessary; the light source in this process is not limited, and the first light source, the second light source, and the third light source may use, for example, a ring light source, a backlight, a stripe light source, a sphere integral light source, a dome light source, a coaxial light source, or the like.
A4, performing conventional light field rendering and depth estimation based on the light field camera original light field image of the BGA solder ball. Firstly, performing light field multi-view rendering to obtain a light field multi-view image with defect information; and then further calculating to obtain a light field parallax image, and converting the light field parallax image into a light field depth image according to a light field camera scale calibration result, wherein the depth image also comprises depth information of all pixel points of the test area.
A5, the light field multi-view image is not different from the conventional two-dimensional camera image in nature, and can be regarded as the same object shot by a plurality of two-dimensional cameras with different angles, so the solder ball positioning can be carried out by using the central view image.
A6, performing solder ball size measurement by using the depth image information corresponding to the positioned solder balls, wherein the solder ball size measurement includes but is not limited to the position coordinates of the center of each solder ball, the diameter of each solder ball, the volume of each solder ball, the distance between the centers of each solder ball and the arrangement error; the solder ball size measurement information and the multi-view image information are used for detecting the solder ball defects, wherein the solder ball defect detection includes but is not limited to the surface state of the solder ball, the volume of the solder ball is too large or too small, and the defects of tin deficiency, tin connection, foreign matters and the like are judged.
It should be understood that, in the embodiment of the present invention, the term "and/or" is only one kind of association relation describing an associated object, and means that three kinds of relations may exist. For example, a and/or B, may represent: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be noted that while the foregoing has described the spirit and principles of the invention with reference to several specific embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, nor is the division of aspects, which is for convenience only as the features in these aspects cannot be combined. The invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (12)
1. A BGA package solder ball inspection system is characterized in that the inspection system comprises,
the lens of the light field camera is over against the BGA packaging solder ball to be detected and is used for acquiring an image of the solder ball;
and at least one light source, wherein the light of the light source is emitted to the BGA packaging solder ball and is used for helping the light field camera to obtain an image of the solder ball.
2. The BGA package solder ball detection system of claim 1, wherein the detection process of the solder ball by the detection system comprises,
adjusting the focal length and/or aperture of the light field camera to obtain a plurality of defocused soft light pure color calibration plates of the BGA packaging solder balls to obtain light field white images of the solder balls;
calibrating the light field white image, and calibrating the center of the light field camera microlens;
performing scale calibration on the light field camera;
setting up and adjusting the light source;
shooting a BGA solder ball area array to be detected by the light field camera to obtain a multi-view image and a depth image;
carrying out position identification and positioning on the solder balls according to the light field multi-view image and the depth image;
and finally obtaining the three-dimensional size measurement information and the defect detection information of the tested solder ball.
3. The BGA package solder ball detection system of claim 2, wherein the method for calibrating the light field white image is,
calculating according to the light field white image to obtain a de-vignetting matrix,
the method for calibrating the center of the light field camera microlens is
And calculating to obtain a light field camera microlens subpixel level central coordinate matrix according to the light field white image.
4. The BGA package solder ball detection system of claim 2, wherein the light field camera is scaled by the method of calibrating the light field camera,
the light field camera shoots a plurality of circular point calibration plates with known space three-dimensional positions, a light field mathematical model from three-dimensional coordinates to parallax is established, and the calibration of the light field camera scale is completed.
5. A BGA package solder ball detection method, which uses the BGA package solder ball detection system as claimed in claim 1, wherein the detection method comprises the following steps:
a1, adjusting the focal length and/or aperture of the lens of the light field camera, shooting a plurality of defocusing soft light pure color calibration plates by using the light field camera matched with the lens aperture, and acquiring a light field white image; calculating according to the white image of the light field camera to obtain a vignetting removing matrix and a light field camera micro-lens sub-pixel level central coordinate matrix;
a2, shooting a plurality of dot calibration plates with known spatial three-dimensional positions through a light field camera, establishing a light field mathematical model from three-dimensional coordinates to parallax, and completing light field camera scale calibration;
a3, the BGA solder ball array to be tested is irradiated by matching the light source, so that the light field camera obtains high-quality imaging;
a4, shooting a BGA solder ball array to be tested by the light field camera, and performing light field multi-view rendering and depth calculation to obtain a multi-view image and a depth image;
a5, identifying and positioning the position of each tested solder ball according to the light field multi-view image and the depth image;
and A6, obtaining the three-dimensional size measurement information and the defect detection information of the solder ball in the detected area.
6. The method of claim 5, wherein step A1 further comprises,
adjusting the aperture of the main lens of the light field camera to ensure that the micro-lens array of the original light field white image is just or approximately tangent;
shooting a plurality of defocusing soft light pure color calibration plate images through a light field camera, wherein the calibration plate is positioned on a pure color background plate with uniform light intensity at the defocusing position of the light field camera; wherein,
the vignetting removing matrix is a matrix obtained by averaging and normalizing a plurality of original light field white images W (u, v)
The light field camera microlens subpixel level center coordinate matrix is obtained by performing iteration optimization processing on a light field white image after each microlens local maximum processing is performed on the light field white image.
7. The method of claim 5, wherein the three-dimensional coordinates of the dots on the calibration plate are known in step A2, and the light field camera is used to capture the calibration plate to obtain the dispersion degree and the corresponding parallax of the dots on the calibration plate;
and then fitting and calibrating to obtain the relation between the parallax value and the three-dimensional coordinate.
8. The method of claim 5, wherein the proper angle light source in step A3 can illuminate the BGA solder ball array clearly, so that the light field camera can image the defect well.
9. The BGA package solder ball inspection method of claim 5, wherein the light field camera in step A4 shoots the defect image and then performs light field multi-view rendering to obtain a light field multi-view image and a light field parallax image,
and converting the parallax image into a depth image through the conversion relation between the parallax and the three-dimensional coordinates obtained through calibration in the step A2.
10. The method of claim 5, wherein the step A5 is performed by using an identification algorithm to automatically identify the position of each solder ball in the image and locate the solder ball in the depth image according to the characteristic of the solder ball imaging as circle and arrangement rule in the specific optical field multi-view image.
11. The method of claim 5, wherein the step A6 utilizes the depth image information corresponding to the solder ball to perform solder ball dimension measurement, and utilizes the solder ball dimension measurement information and the multi-view image information to perform solder ball defect detection.
12. The BGA package solder ball testing method of claim 11, wherein the solder ball dimension measurement includes the coordinates of the center of the solder ball, the diameter of the solder ball, the volume of the solder ball, the pitch between the centers of the solder balls, and the arrangement error;
the detection of the tin ball defect comprises the surface state of the tin ball, the oversize and undersize of the tin ball, and the judgment of the defects of tin lack, tin connection and foreign matter.
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| CN113686253A (en) * | 2021-09-18 | 2021-11-23 | 广州海普电子材料科技有限公司 | BGA solder ball detection method and system |
| CN114812407A (en) * | 2022-03-25 | 2022-07-29 | 合肥图迅电子科技有限公司 | Chip tin ball three-dimensional height detection method and system based on luminosity three-dimensional (3D) reconstruction |
| CN115791804A (en) * | 2022-12-20 | 2023-03-14 | 中国航发贵州黎阳航空动力有限公司 | Stripe defect detection method for compressor blade |
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