CN106908453A - The detection method and detection means of a kind of printed substrate - Google Patents
The detection method and detection means of a kind of printed substrate Download PDFInfo
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- CN106908453A CN106908453A CN201710184347.XA CN201710184347A CN106908453A CN 106908453 A CN106908453 A CN 106908453A CN 201710184347 A CN201710184347 A CN 201710184347A CN 106908453 A CN106908453 A CN 106908453A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95661—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature
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Abstract
The invention discloses the detection method and detection means of a kind of printed substrate, including：The three-dimensional appearance parameter of printed substrate is obtained based on three-dimensional digital image correlation method；Defects detection is carried out to the printed substrate according to the three-dimensional appearance parameter.Relatively existing AOI detection methods, the technical scheme that the present invention is provided can accurately measure the three-dimensional appearance of printed substrate, can obtain intuitively three-dimensional cloud atlas and accurate three-dimensional appearance data, and then solve the problems, such as short transverse defects detection；And, relatively existing AXI detection methods, the technical scheme that the present invention is provided improves detection speed, can meet the on-line real-time measuremen of printed substrate.
Description
Technical field
The present invention relates to printed substrate detection technique field, more specifically, it is related to a kind of inspection of printed substrate
Survey method and detection means.
Background technology
Printed substrate (Print Circuit Board, PCB) is the circuit substrate with printed wiring, and it is used to pacify
Dress and connection circuit components.In order to ensure the quality of production of PCB, need to detect it before dispatching from the factory, traditional detection
Method has artificial range estimation, needle-bar test, flying probe etc..Due to defects such as " contacts limited ", above-mentioned detection method is not
The growth requirement of manufacturing technology can be completely adapted to, thus, automatic optics inspection (the Automatic Optical based on image
Inspection, AOI) technology gradually grows up.
AOI technologies are using sensor to obtain the two-dimensional illumination image of detectable substance and digitize, and using gray level image and are led to
Cross (given according to some with reference to comparison method (being made comparisons with the digitized template image for prestoring) or design rule method of inspection
Rule detection figure) carry out defects detection.But, the three-dimensional appearance on detectable substance surface cannot be directly obtained due to AOI technologies, because
This cannot detect the defect in terms of height；Some other detection method, such as automatic X-ray detection (Automatic X-ray
Inspection, AXI), due to high cost, detection speed are slow, it is also difficult to used in production line.
The content of the invention
In view of this, the invention provides the detection method and detection means of a kind of printed substrate, based on 3-dimensional digital
DIC Method obtains the three-dimensional appearance parameter of printed substrate, and then printed substrate is lacked according to three-dimensional appearance parameter
Detection is fallen into, the problem of short transverse defects detection is not only solved, and improve detection speed.
To achieve the above object, the technical scheme that the present invention is provided is as follows：
A kind of detection method of printed substrate, including：
The three-dimensional appearance parameter of printed substrate is obtained based on three-dimensional digital image correlation method；
Defects detection is carried out to the printed substrate according to the three-dimensional appearance parameter.
Optionally, the three-dimensional appearance parameter of printed substrate is obtained based on three-dimensional digital image correlation method, including：
First speckle image and the second speckle image are gathered by collecting device, wherein, the collecting device is included along the
One light source, frosted glass, convex lens and the board under test rest area for axially setting gradually, and including being arranged at first axial direction two
Side and along the second axially arranged the first image acquiring device and the second image acquiring device, described first image acquisition device
The region for obtaining image on the board under test rest area with the second image acquiring device is identical, and the printed substrate is arranged at
The board under test rest area；Wherein, after light source unlatching, described first image acquisition device is on the printed substrate
The speckle image of collection is the first speckle image, and, second image acquiring device is gathered on the printed substrate
Speckle image be the second speckle image；
The corresponding corresponding points in position in first speckle image and the second speckle image are obtained, and demarcates first figure
As acquisition device and the second image acquiring device distinguish corresponding imaging model parameter；
According to corresponding points image coordinate respectively in first speckle image and the second speckle image and described
Imaging model parameter, calculates the three dimensional space coordinate of the corresponding points, and according to the three dimensional space coordinate of the different corresponding points
Obtain the three-dimensional appearance parameter of the printed substrate.
Optionally, demarcate described first image acquisition device and the second image acquiring device distinguishes corresponding imaging model ginseng
Number, including：
The scaling board of predetermined number is arranged at the board under test rest area successively, to obtain the of the predetermined number pair
One demarcates speckle image and second demarcates speckle image, wherein, the position of the scaling board of the predetermined number is different；And described
After light source is opened, the speckle image that described first image acquisition device is gathered on the scaling board is the first demarcation speckle pattern
Picture, and, the speckle image that second image acquiring device is gathered on the scaling board is the second demarcation speckle image；
The first demarcation speckle image and second according to the predetermined number pair demarcates speckle image, demarcates first figure
As acquisition device and the second image acquiring device distinguish corresponding imaging model parameter.
Optionally, the scaling board is round dot scaling board.
Optionally, the three-dimensional appearance parameter includes：Welding spot size and feature sizes.
Optionally, the acquisition of the welding spot size includes：
First speckle image and the second speckle image are gathered by collecting device；
The corresponding corresponding points in position in first speckle image and the second speckle image are obtained, and demarcates first figure
As acquisition device and the second image acquiring device distinguish corresponding imaging model parameter；
The image coordinate of the corresponding points according to digital picture and the imaging model parameter, calculate the corresponding points
Three dimensional space coordinate；
Three dimensions according to the different corresponding points builds three-dimensional appearance cloud atlas；
A plurality of phase line is drawn on the three-dimensional appearance cloud atlas and obtains a plurality of empty overture line, wherein, every stage
Line is by multiple solder joints；
The welding spot size according to a plurality of empty sequence curve acquisition.
Optionally, the acquisition of the feature sizes includes：
First speckle image and the second speckle image are gathered by collecting device；
The corresponding corresponding points in position in first speckle image and the second speckle image are obtained, and demarcates first figure
As acquisition device and the second image acquiring device distinguish corresponding imaging model parameter；
The image coordinate of the corresponding points according to digital picture and the imaging model parameter, calculate the corresponding points
Three dimensional space coordinate；
Three dimensions according to the different corresponding points builds three-dimensional appearance cloud atlas；
A plurality of phase line is drawn on the three-dimensional appearance cloud atlas and obtains a plurality of empty overture line, wherein, every stage
Line is by multiple line widths；
The feature sizes according to a plurality of empty sequence curve acquisition.
Optionally, the light source is semiconductor laser.
Optionally, described first image acquisition device and the second image acquiring device are camera.
Accordingly, present invention also offers a kind of detection means of printed substrate, the detection means includes：
Acquisition module, the acquisition module is used to be obtained based on three-dimensional digital image correlation method the three-dimensional shaped of printed substrate
Looks parameter；
And, detection module, the detection module is used to enter the printed substrate according to the three-dimensional appearance parameter
Row defects detection.
Compared to prior art, the technical scheme that the present invention is provided at least has advantages below：
The invention provides the detection method and detection means of a kind of printed substrate, including：Based on three-dimensional digital image
Correlation method obtains the three-dimensional appearance parameter of printed substrate；The printed substrate is lacked according to the three-dimensional appearance parameter
Fall into detection.Relatively existing AOI detection methods, the technical scheme that the present invention is provided can accurately measure printed substrate
Three-dimensional appearance, can obtain intuitively three-dimensional cloud atlas and accurate three-dimensional appearance data, and then solve the inspection of short transverse defect
The problem of survey；And, relatively existing AXI detection methods, the technical scheme that the present invention is provided improves detection speed, can meet
The on-line real-time measuremen of printed substrate.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Inventive embodiment, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
A kind of flow chart of the detection method of printed substrate that Fig. 1 is provided for the embodiment of the present application；
A kind of flow chart of the acquisition methods of the three-dimensional appearance of printed substrate that Fig. 2 is provided for the embodiment of the present application；
A kind of structural representation of collecting device that Fig. 3 a are provided for the embodiment of the present application；
A kind of first speckle image and the second speckle image correspondence schematic diagram that Fig. 3 b are provided for the embodiment of the present application；
A kind of acquisition methods flow chart of welding spot size that Fig. 4 is provided for the embodiment of the present application；
A kind of speckle image design sketch that Fig. 5 is provided for the embodiment of the present application；
A kind of three-dimensional appearance accompanying drawings that Fig. 6 is provided for the embodiment of the present application；
A kind of acquisition methods flow chart of feature sizes that Fig. 7 is provided for the embodiment of the present application；
Another speckle image design sketch that Fig. 8 is provided for the embodiment of the present application；
Another three-dimensional appearance accompanying drawings that Fig. 9 is provided for the embodiment of the present application；
A kind of structural representation of the detection means of printed substrate that Figure 10 is provided for the embodiment of the present application.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
As described in background, the automatic optics inspection (Automatic Optical Inspection, AOI) of image
Technology gradually grows up.Wherein, AOI technologies be using sensor obtain detectable substance two-dimensional illumination image and digitize, profit
With gray level image and by reference to comparison method (being made comparisons with the digitized template image for prestoring) or design rule method of inspection
(according to some given rule detection figures) carries out defects detection.But, because AOI technologies cannot directly obtain detectable substance table
The three-dimensional appearance in face, therefore the defect in terms of height cannot be detected；Some other detection method, such as automatic X-ray detection
(Automatic X-ray Inspection, AXI), due to high cost, detection speed are slow, it is also difficult in production line
Use.
Based on this, the embodiment of the present application provides the detection method and detection means of a kind of printed substrate, based on three-dimensional
Loading by means of digital image correlation method obtains the three-dimensional appearance parameter of printed substrate, and then printed substrate is entered according to three-dimensional appearance parameter
Row defects detection, not only solves the problem of short transverse defects detection, and improves detection speed.To realize above-mentioned mesh
, the technical scheme that the embodiment of the present application is provided is as follows, specific to combine shown in Fig. 1 to Figure 10, and the embodiment of the present application is provided
Technical scheme is described in detail.
With reference to shown in Fig. 1, a kind of flow chart of the detection method of the printed substrate provided for the embodiment of the present application, its
In, detection method includes：
S1, the three-dimensional appearance parameter that printed substrate is obtained based on three-dimensional digital image correlation method；
S2, defects detection is carried out to the printed substrate according to the three-dimensional appearance parameter.
Three-dimensional digital image correlation method combines DIC (Digital Image Correlation, digital picture is related) side
The principle of method and binocular stereo vision, object under test surface is obtained using two image acquiring devices of mutual angled fixation
Speckle image, the image coordinate of the tested point chosen in image is then calculated by image matching algorithm, in conjunction with pre-
The parameter of the image acquiring device first demarcated and its relative position relation, the three dimensions for being calculated object under test surface are sat
Mark, the three-dimensional appearance on object under test surface is obtained with this.And then defects detection is carried out to printed substrate according to three-dimensional appearance,
Such as, judge printed substrate with the presence or absence of defects such as open circuit, copper ashes, feature omissions.
As shown in the above, the technical scheme that the embodiment of the present application is provided, is obtained based on three-dimensional digital image correlation method
The three-dimensional appearance parameter of printed substrate, then carries out defects detection according to three-dimensional appearance parameter to the printed substrate.Phase
To existing AOI detection methods, the technical scheme that the embodiment of the present application is provided can accurately measure the three of printed substrate
Dimension pattern, can obtain intuitively three-dimensional cloud atlas and accurate three-dimensional appearance data, and then solve short transverse defects detection
Problem；And, relatively existing AXI detection methods, the technical scheme that the embodiment of the present application is provided improves detection speed, can
Meet the on-line real-time measuremen of printed substrate.
With reference to shown in Fig. 2, a kind of acquisition methods of the three-dimensional appearance of the printed substrate provided for the embodiment of the present application
Flow chart, wherein, the three-dimensional appearance parameter of printed substrate is obtained based on three-dimensional digital image correlation method, including：
S11, by collecting device gather the first speckle image and the second speckle image.
With specific reference to shown in Fig. 3 a, being a kind of structural representation of collecting device that the embodiment of the present application is provided, wherein, institute
Stating collecting device includes the light source 100, frosted glass 200, convex lens 300 and the board under test rest area that are set gradually along the first axial direction X,
And including be arranged at the first axial direction X both sides and along the second axial direction Y set the first image acquiring device 401 and second
Image acquiring device 402, the image acquiring device 402 of described first image acquisition device 401 and second is placed in the board under test
The region that image is obtained in area is identical, and the printed substrate 500 is arranged at the board under test rest area；Wherein, in the light
After source 100 is opened, the speckle image that described first image acquisition device 401 is gathered on the printed substrate 500 is first
Speckle image, and, the speckle image that second image acquiring device 402 is gathered on the printed substrate 500 is the
Two speckle images；Optionally, the light source is semiconductor laser.
S12, the corresponding corresponding points in position in first speckle image and the second speckle image are obtained, and demarcate described the
One image acquiring device and the second image acquiring device distinguish corresponding imaging model parameter；
S13, according to corresponding points image coordinate respectively in first speckle image and the second speckle image and
The imaging model parameter, calculates the three dimensional space coordinate of the corresponding points, and according to the three dimensions of the different corresponding points
Coordinate obtains the three-dimensional appearance parameter of the printed substrate.
Wherein, demarcate described first image acquisition device and the second image acquiring device distinguishes corresponding imaging model ginseng
Number, including：
The scaling board of predetermined number is arranged at the board under test rest area successively, to obtain the of the predetermined number pair
One demarcates speckle image and second demarcates speckle image, wherein, the position of the scaling board of the predetermined number is different；And described
After light source is opened, the speckle image that described first image acquisition device is gathered on the scaling board is the first demarcation speckle pattern
Picture, and, the speckle image that second image acquiring device is gathered on the scaling board is the second demarcation speckle image；Can
Choosing, the scaling board is round dot scaling board；
The first demarcation speckle image and second according to the predetermined number pair demarcates speckle image, demarcates first figure
As acquisition device and the second image acquiring device distinguish corresponding imaging model parameter.
In the embodiment of the application one, described first image acquisition device and the second image acquiring device are camera.Its
In, with reference to shown in Fig. 3 b, a kind of first speckle image provided for the embodiment of the present application and the second speckle image correspond to schematic diagram,
Due to the influence of parallax, by the coordinate of corresponding points in the first speckle image of left camera (the first image acquiring device), the right side is obtained
The coordinate method of corresponding corresponding points is in camera (the second image acquiring device)：
Taken in the first speckle image with unknown point P (x0, y0) centered on (2M+1) * (2M+1) pixel size pros
Parameter examines image subsection, and phase is carried out by pre-defined correlation function by certain searching method in the second speckle image
Close and calculate, find with the correlation function of reference picture sub-district take extreme value with P ' (x '0, y '0) centered on target image sub-district.
Reference picture sub-district point coordinates (x, y) corresponding with target image sub-district and (x ', y ') by single order shape function and
Undetermined parameter vectorRepresent：
Wherein, Δ x=x-x0, Δ y=y-y0, ξ0, η0It is reference picture sub-district center P (x0,y0) point parallax；ξx, ξy,
ηx, ηyIt is the first derivative of parallax in image subsection.
Definition normalization minimum squared distance function evaluates the similarity degree of left camera and right camera correspondence image sub-district, its
Expression formula Wie：
Wherein, f (x, y) is that coordinate is (x in reference picture sub-district,Y) gray scale of point, during g (x ', y ') is target image sub-district
The gray scale of corresponding points (x ', y '),
The respectively average gray of reference picture sub-district and target image sub-district,It is parameter vector to be asked.
Wherein, camera parameter is demarcated as：In world coordinate system a little camera target surface projection can with preferable pin hole into
(bibliography is described as model：ZHANG Zheng-you.A flexible new technique for camera
calibration[J].IEEE Transactions on Pattern Analysis and Machine Itelligence,
2000,22(11):1330-1334), it is expressed as under homogeneous coordinates：
Wherein, s is proportionality coefficient, and (u, v) is coordinate of the spatial point in camera ideal image plane, (xw,yw,zw)TFor
Corresponding points coordinate in world coordinate system, R, t are respectively the spin matrix and translation vector that world coordinates is tied to camera coordinates system,
Referred to as external parameter.
A is camera internal parameter, be can be expressed as：
Wherein, (u0,v0) it is main point coordinates；, α and β is respectively focal length parameter of the image in u axles and V axles；γ is image
Crooked parameter.
Measuring system (i.e. collecting device) based on three-dimensional digital image correlation method needs to enter rower to it before the use
It is fixed, calibration and usage by the round dot scaling board (such as 12*9 round dots scaling board) that calculates, under system photographs several different visual angles
Scaling board (is such as placed after behind side plate rest area, scaling board is changed by modes such as rotation, translation, off-plane movements by uncalibrated image
Position, to obtain the scaling board image under different visual angles), sat in left camera and right magazine correspondence by identification feature point
Mark, obtains the inside and outside parameter A of left camera and right camera when shooting every timel、Rli、TliAnd Ar、Rri、Tri, then by it is non-linear most
A young waiter in a wineshop or an inn multiplies optimization method and does global optimization.
Object function is：
Wherein,J-th characteristic point is calculated with nonlinear model in left camera the i-th width calibration maps
Image coordinate；For j-th characteristic point is calculated with nonlinear model in right camera the i-th width calibration maps
The image coordinate come；ml,ij, mr,ijIt is the true picture coordinate of the character pair point of algorithm identification；Through Levenberg-
All calibrating parameters of the measuring system of three-dimensional digital image correlation method can be obtained after Marquart algorithm optimizations.
Finally, three-dimensional reconstruction is：After completing to demarcate to camera, two corresponding inside and outside parameters of camera are obtained, while
Also a spatial world coordinate system based on calibrating template is established；Left phase has also been obtained by the matching of speckle image corresponding points
The two dimensional image coordinate of corresponding points on machine and right camera speckle image.With this, reconstructed by the two dimensional image coordinate of corresponding points
Three dimensional space coordinate.After above-mentioned calibration process obtains calibrating parameters, then projection matrix M1 and M2 determines (bibliography：Horse
Song moral, Zhang Zhengyou computer visions-computational theory and algorithm basis [M] Beijing：Science Press, 1998), can obtain：
Wherein, (ui,vi) it is homogeneous coordinates of the spatial point in left camera and right camera ideal image plane, (xw,yw,zw,
1)TIt is homogeneous coordinates of the correspondence spatial point under world coordinate system.Above-mentioned equation group amounts to six equations, five unknown number (zc1、
zc2、xw、yw、zw), above-mentioned equation group is solved using least square method, obtain spatial point three-dimensional coordinate (xw,yw,zw), realize printing
The three-dimensional appearance on the surface of wiring board is rebuild.
It should be noted that the method for generation speckle is not limited to above by the method for laser on a printed-wiring board
Generation；In the application other embodiment, can also be generated by sciagraphy, will well in advance speckle picture projection to print
Brush PCB surface forms the speckle field of stabilization；Or, generated by spraying fine and closely woven object method, i.e., blow on a printed-wiring board deposited
Some fine and closely woven object particles (such as starch or carbon particle), then remove after measurement is finished；Or other method, to this
The application is not particularly limited.
In the embodiment of the application one, the final three-dimensional appearance parameter for obtaining can include：Welding spot size and line width
Size.
It is a kind of acquisition methods flow chart of welding spot size that the embodiment of the present application is provided with reference to shown in Fig. 4, wherein, institute
The acquisition for stating welding spot size includes：
S211, by collecting device gather the first speckle image and the second speckle image；
S212, acquisition first speckle image and the corresponding corresponding points in position in the second speckle image, and demarcate described
First image acquiring device and the second image acquiring device distinguish corresponding imaging model parameter；
S213, the image coordinate of the corresponding points according to digital picture and the imaging model parameter, it is described right to calculate
The three dimensional space coordinate that should be put；
S214, according to the three dimensions of the different corresponding points build three-dimensional appearance cloud atlas；
S215, draw a plurality of phase line on the three-dimensional appearance cloud atlas and obtain a plurality of empty overture line, wherein, described in every
Phase line is by multiple solder joints；
S216, the welding spot size according to a plurality of empty sequence curve acquisition.
Specifically combine shown in Fig. 5 and Fig. 6, a kind of speckle image design sketch that Fig. 5 is provided for the embodiment of the present application, Fig. 6 is
A kind of three-dimensional appearance accompanying drawings that the embodiment of the present application is provided.Wherein, the operating distance of collecting device, regulation are adjusted first
Angle and spacing between left camera and right camera, and focused so that left camera and right camera looks into fee printed substrate are (such as
Printed substrate center favored area shown in a marks in Fig. 5, and, after the amplification of frame favored area as shown in b marks, wherein, black color dots
Battle array is solder joint) the same area, and blur-free imaging.Wherein, semiconductor laser (wavelength X can be 532nm) sends continuous sharp
Light beam, is dissipated by frosted glass diffusion sheet, by after lens convergence, the speckle field of stabilization being formed in print circuit board surface.It is left
Camera and right camera gather a pair of speckle images (as shown in c marks in Fig. 5 the first speckle image, and, second shown in d marks
Speckle image, wherein, fine powder shape thing is the speckle of generation)；Then use scaling board instead and replace printed substrate, by changing
The modes such as the position of scaling board, left camera and right camera gather predetermined number to (such as 10 pairs) scaling board image, using what is obtained
Scaling board image is demarcated, and obtains the imaging model parameter of two cameras.Speckle image with left camera as reference picture, on the right side
Corresponding relation is found in the speckle image of camera, using the image of corresponding points in camera imaging model parameter and combination digital picture
Coordinate, calculate reconstruct obtain whole audience three dimensional space coordinate, and surveyed and drawn with this obtain three-dimensional appearance cloud atlas (in such as Fig. 6 a mark correspondence
Image, using substrate as XOY plane, vertical substrate plane is upwards the rectangular coordinate system of Z axis positive direction to coordinate system).
On three-dimensional appearance cloud atlas draw 3 phase lines (phase line 0,1 and 2 as shown in Figure 6), each phase line according to
It is secondary by three solder joints (in such as Fig. 6 b mark correspondence image), obtain three empty overture lines (c marks correspondence image, edge in such as Fig. 6
Three pattern results of phase line distribution, transverse axis is represented to the length of starting point, and the longitudinal axis represents height).Can by three empty overture lines
To obtain, the welding spot size parameter of width and solder joint relative to the height of substrate of solder joint.
And, it is a kind of acquisition methods flow chart of feature sizes that the embodiment of the present application is provided with reference to shown in Fig. 7, its
In, the acquisition of the feature sizes includes：
S221, by collecting device gather the first speckle image and the second speckle image；
S222, acquisition first speckle image and the corresponding corresponding points in position in the second speckle image, and demarcate described
First image acquiring device and the second image acquiring device distinguish corresponding imaging model parameter；
S223, the image coordinate of the corresponding points according to digital picture and the imaging model parameter, it is described right to calculate
The three dimensional space coordinate that should be put；
S224, according to the three dimensions of the different corresponding points build three-dimensional appearance cloud atlas；
S225, draw a plurality of phase line on the three-dimensional appearance cloud atlas and obtain a plurality of empty overture line, wherein, described in every
Phase line is by multiple line widths；
S226, the feature sizes according to a plurality of empty sequence curve acquisition.
It is specific to combine shown in Fig. 8 and Fig. 9, another speckle image design sketch that Fig. 8 is provided for the embodiment of the present application, Fig. 9
For another three-dimensional appearance accompanying drawings that the embodiment of the present application is provided.
Wherein, the operating distance of collecting device is adjusted first, adjusts angle and spacing between left camera and right camera, and
Focused so that left camera and right camera looks into fee printed substrate (as shown in a marks in Fig. 8 printed substrate center constituency
Domain, and, frame favored area amplify after as shown in b is identified) the same area, and blur-free imaging.Wherein, semiconductor laser (ripple
λ long can be 532nm) continuous laser beam is sent, dissipated by frosted glass diffusion sheet, by after lens convergence, in printed wire
Plate surface forms the speckle field of stabilization.Left camera and right camera gather a pair of speckle images, and (first dissipates as shown in c marks in Fig. 8
Spot image, and, the second speckle image is similar and not shown to the first speckle image, wherein, fine powder shape thing is generation
Speckle)；Then use scaling board instead and replace printed substrate, by mode, left camera and the right camera such as position that change scaling board
Collection predetermined number to (such as 10 pairs) scaling board image, demarcated using the scaling board image for obtaining, obtain two cameras into
As model parameter.Speckle image with left camera finds corresponding relation as reference picture in the speckle image of right camera, utilizes
The image coordinate of corresponding points in camera imaging model parameter and combination digital picture, calculates reconstruct and obtains whole audience three dimensions seat
Mark, and surveyed and drawn with this obtain three-dimensional appearance cloud atlas (in such as Fig. 9 a mark correspondence image, coordinate system using substrate as XOY plane, hang down
Straight base plan is upwards the rectangular coordinate system of Z axis positive direction).
On three-dimensional appearance cloud atlas draw 3 phase lines (phase line 0,1 and 2 as shown in Figure 9), each phase line according to
Secondary to pass through multiple line widths (b marks correspondence image in such as Fig. 9), (c identifies correspondence image, edge in such as Fig. 9 to obtain three empty overture lines
Three pattern results of phase line distribution, transverse axis is represented to the length of starting point, and the longitudinal axis represents height).Can by three empty overture lines
To obtain, the width of lines, and feature sizes parameter of the lines with " triangle platform " relative to the height of substrate.
It should be noted that the detection method that the embodiment of the present application is provided, by experimental verification, its certainty of measurement is superior to
3um, improves measurement effect.
Accordingly, the embodiment of the present application additionally provides a kind of detection means of printed substrate, is this with reference to shown in Figure 10
A kind of structural representation of the detection means of printed substrate that application embodiment is provided, wherein, the detection means includes：
Acquisition module 1000, the acquisition module 1000 is used to obtain printed substrate based on three-dimensional digital image correlation method
Three-dimensional appearance parameter；
And, detection module 2000, the detection module 2000 is used for according to the three-dimensional appearance parameter to the printing
Wiring board carries out defects detection.
The embodiment of the present application provides the detection method and detection means of a kind of printed substrate, including：Based on three dimensions
Word DIC Method obtains the three-dimensional appearance parameter of printed substrate；According to the three-dimensional appearance parameter to the printed substrate
Carry out defects detection.Relatively existing AOI detection methods, the technical scheme that the embodiment of the present application is provided can be measured accurately
The three-dimensional appearance of printed substrate, can obtain intuitively three-dimensional cloud atlas and accurate three-dimensional appearance data, and then solve height
Spend the problem of direction defects detection；And, relatively existing AXI detection methods, the technical scheme that the embodiment of the present application is provided is carried
Detection speed high, can meet the on-line real-time measuremen of printed substrate.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or uses the present invention.
Various modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, the present invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The scope most wide for causing.
Claims (10)
1. a kind of detection method of printed substrate, it is characterised in that including：
The three-dimensional appearance parameter of printed substrate is obtained based on three-dimensional digital image correlation method；
Defects detection is carried out to the printed substrate according to the three-dimensional appearance parameter.
2. the detection method of printed substrate according to claim 1, it is characterised in that related based on three-dimensional digital image
Method obtains the three-dimensional appearance parameter of printed substrate, including：
First speckle image and the second speckle image are gathered by collecting device, wherein, the collecting device is included along first axle
To the light source, frosted glass, convex lens that set gradually and board under test rest area, and including be arranged at the described first axial both sides,
And along the second axially arranged the first image acquiring device and the second image acquiring device, described first image acquisition device and
The region that two image acquiring devices obtain image on the board under test rest area is identical, and the printed substrate is arranged at described
Board under test rest area；Wherein, after light source unlatching, described first image acquisition device is gathered on the printed substrate
Speckle image be the first speckle image, and, it is scattered that second image acquiring device gather on the printed substrate
Spot image is the second speckle image；
The corresponding corresponding points in position in first speckle image and the second speckle image are obtained, and demarcates described first image and obtained
Take device and the second image acquiring device distinguishes corresponding imaging model parameter；
According to corresponding points image coordinate respectively in first speckle image and the second speckle image and the imaging
Model parameter, calculates the three dimensional space coordinate of the corresponding points, and obtain according to the three dimensional space coordinate of the different corresponding points
The three-dimensional appearance parameter of the printed substrate.
3. the detection method of printed substrate according to claim 2, it is characterised in that demarcate described first image and obtain
Device and the second image acquiring device distinguish corresponding imaging model parameter, including：
The scaling board of predetermined number is arranged at the board under test rest area successively, to obtain the first mark of the predetermined number pair
Determine speckle image and second and demarcate speckle image, wherein, the position of the scaling board of the predetermined number is different；And in the light source
After unlatching, the speckle image that described first image acquisition device is gathered on the scaling board is the first demarcation speckle image, with
And, the speckle image that second image acquiring device is gathered on the scaling board is the second demarcation speckle image；
The first demarcation speckle image and second according to the predetermined number pair demarcates speckle image, demarcates described first image and obtains
Take device and the second image acquiring device distinguishes corresponding imaging model parameter.
4. the detection method of printed substrate according to claim 3, it is characterised in that the scaling board is that round dot is demarcated
Plate.
5. the detection method of printed substrate according to claim 2, it is characterised in that the three-dimensional appearance parameter bag
Include：Welding spot size and feature sizes.
6. the detection method of printed substrate according to claim 5, it is characterised in that the acquisition bag of the welding spot size
Include：
First speckle image and the second speckle image are gathered by collecting device；
The corresponding corresponding points in position in first speckle image and the second speckle image are obtained, and demarcates described first image and obtained
Take device and the second image acquiring device distinguishes corresponding imaging model parameter；
The image coordinate of the corresponding points according to digital picture and the imaging model parameter, calculate the three-dimensional of the corresponding points
Space coordinates；
Three dimensions according to the different corresponding points builds three-dimensional appearance cloud atlas；
A plurality of phase line is drawn on the three-dimensional appearance cloud atlas and obtains a plurality of empty overture line, wherein, every phase line warp
Cross multiple solder joints；
The welding spot size according to a plurality of empty sequence curve acquisition.
7. the detection method of printed substrate according to claim 5, it is characterised in that the acquisition bag of the feature sizes
Include：
First speckle image and the second speckle image are gathered by collecting device；
The corresponding corresponding points in position in first speckle image and the second speckle image are obtained, and demarcates described first image and obtained
Take device and the second image acquiring device distinguishes corresponding imaging model parameter；
The image coordinate of the corresponding points according to digital picture and the imaging model parameter, calculate the three-dimensional of the corresponding points
Space coordinates；
Three dimensions according to the different corresponding points builds three-dimensional appearance cloud atlas；
A plurality of phase line is drawn on the three-dimensional appearance cloud atlas and obtains a plurality of empty overture line, wherein, every phase line warp
Cross multiple line widths；
The feature sizes according to a plurality of empty sequence curve acquisition.
8. the detection method of printed substrate according to claim 2, it is characterised in that the light source is semiconductor laser
Device.
9. the detection method of printed substrate according to claim 2, it is characterised in that described first image acquisition device
Camera is with the second image acquiring device.
10. a kind of detection means of printed substrate, it is characterised in that the detection means includes：
Acquisition module, the acquisition module is used to be obtained based on three-dimensional digital image correlation method the three-dimensional appearance ginseng of printed substrate
Number；
And, detection module, the detection module is used to lack the printed substrate according to the three-dimensional appearance parameter
Fall into detection.
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