TW202007611A - Wafer cassette holder including a wafer cassette receiving portion and a mobile absorption support portion - Google Patents
Wafer cassette holder including a wafer cassette receiving portion and a mobile absorption support portion Download PDFInfo
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- TW202007611A TW202007611A TW108126100A TW108126100A TW202007611A TW 202007611 A TW202007611 A TW 202007611A TW 108126100 A TW108126100 A TW 108126100A TW 108126100 A TW108126100 A TW 108126100A TW 202007611 A TW202007611 A TW 202007611A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
Description
本發明係關於配置於搭載用以收容複數晶圓之晶匣的搬送台車,支持該晶匣的晶匣固持具。The present invention relates to a crystal box holder configured to be mounted on a transfer trolley equipped with a crystal box for accommodating a plurality of wafers and supporting the crystal box.
在手機及電腦等的電子機器所使用之裝置晶片的製造工程中,首先,於由半導體等的材料所成之晶圓的表面形成複數IC(Integrated Circuit)、LSI(Large Scale Integrated circuit)等的裝置。之後,將該晶圓分割成各個裝置的話,則形成各個裝置晶片。作為裝置晶片的製造工程所使用的加工裝置,公知用以分割晶圓的切削裝置及雷射加工裝置。In the manufacturing process of device wafers used in electronic devices such as mobile phones and computers, first, a plurality of ICs (Integrated Circuits), LSIs (Large Scale Integrated circuits), etc. are formed on the surface of wafers made of materials such as semiconductors Device. After that, if the wafer is divided into individual devices, individual device chips are formed. As a processing device used in the manufacturing process of device wafers, a cutting device and a laser processing device for dividing a wafer are known.
為了容易處理該晶圓及裝置晶片,該晶圓係在具有開口的框架與黏著膠帶一體化之框架單元的狀態下搬送,被搬入該加工裝置以進行加工。形成框架單元時,準備具有比該晶圓的直徑大之直徑的開口的框架,以封堵該開口之方式將黏著膠帶貼上該框架,在該開口的內側將該晶圓貼附於該黏著膠帶。In order to easily process the wafer and the device wafer, the wafer is transported in a state in which the frame having the opening and the frame unit integrated with the adhesive tape are carried into the processing device for processing. When forming the frame unit, prepare a frame with an opening larger than the diameter of the wafer, attach the adhesive tape to the frame in such a way as to close the opening, and attach the wafer to the adhesive inside the opening tape.
晶圓係在框架單元的狀態下,或原封不動的狀態下被收容於稱為晶匣的容器來進行搬送。該晶匣可收容複數晶圓。晶匣係例如具有收容複數晶圓的空間,與挾持該空間相互面對之一對側壁。然後,於一對側壁相互對向之面,分別設置有複數直線狀的導引軌道。導引軌道形成於一對側壁個別對應的位置。The wafer is stored in a container called a wafer cassette in a state of a frame unit or in an intact state, and is transferred. The wafer cassette can accommodate multiple wafers. The wafer box has, for example, a space for accommodating a plurality of wafers, and a pair of side walls facing each other holding the space. Then, a plurality of linear guide rails are respectively provided on a pair of side walls facing each other. The guide rail is formed at a position corresponding to each pair of side walls.
將晶圓收容於晶匣時,在形成於一側壁的一導引軌道,與鄰接於該導引軌道之另一導引軌道之間插入晶圓或框架的一端,並且在面對該側壁之其他側壁所對應的位置插入該晶圓或框架的另一端。亦即,該導引軌道係具有規定晶匣之收容晶圓的位置的功能,於導引軌道所規定之複數收容位置個別收容晶圓。When storing the wafer in the wafer cassette, insert one end of the wafer or frame between a guide rail formed on one side wall and another guide rail adjacent to the guide rail, and facing the side wall The positions corresponding to the other side walls are inserted into the other end of the wafer or frame. That is, the guide rail has a function of specifying the position of the wafer cassette to accommodate the wafer, and the wafer is individually accommodated at the plurality of storage positions specified by the guide rail.
操作加工裝置的操作員藉由搬運晶匣來搬送複數晶圓。但是,近年來為了提升裝置晶片的製造效率而晶圓大型化,伴隨該狀況,晶匣也大型化。因此,收容複數晶圓的晶匣的重量明顯地增加,搬送晶匣的操作員的負擔也變大。因此,操作員不以手搬送,利用可搬送晶匣的搬送台車(參照專利文獻1)。 [先前技術文獻] [專利文獻]An operator who operates the processing apparatus transports a plurality of wafers by transporting a wafer cassette. However, in recent years, wafers have been enlarged in order to improve the manufacturing efficiency of device wafers. In response to this situation, the wafer cassette has also been enlarged. As a result, the weight of the cassette containing the plurality of wafers is significantly increased, and the burden on the operator who transports the cassette is also increased. Therefore, the operator does not use a hand to transport, but uses a transport trolley that can transport the magazine (refer to Patent Document 1). [Prior Technical Literature] [Patent Literature]
[專利文獻1]日本特開平7-66095號公報[Patent Document 1] Japanese Patent Laid-Open No. 7-66095
[發明所欲解決之課題][Problems to be solved by the invention]
搬送台車在裝置晶片的製造工場等使用。於該製造工場,配置有多數的加工裝置及配管等,又,於該製造工場的地面,設置有具有各種功能的溝槽及軌道等。因此,在移動搭載晶匣的搬送台車之期間,有該搬送台車與製造工場內部的構造物等衝突的狀況。又,也有該搬送台車的車輪陷入地面的溝槽之狀況,及車輪卡到軌道之狀況。The transfer trolley is used in a manufacturing plant of device wafers and the like. In this manufacturing plant, many processing devices, piping, etc. are arranged, and on the ground of this manufacturing plant, grooves, rails, and the like having various functions are provided. Therefore, during the movement of the transfer trolley on which the cassette is mounted, there may be a conflict between the transfer trolley and the structure inside the manufacturing plant. In addition, there are also cases where the wheels of the transport trolley fall into the grooves on the ground, and the wheels are caught on the rails.
該等狀況中,會有因為衝擊而搭載於搬送台車的晶匣翻倒或掉落,收容於該晶匣的複數晶圓一度破損的狀況。尤其,形成裝置的晶圓破損的時候,對於該晶圓至今已實施用以形成裝置的多數工程,已投入龐大的成本,故其損害的規模極大。Under these conditions, the wafer box mounted on the transfer trolley may fall or fall due to impact, and a plurality of wafers contained in the wafer box may be damaged once. In particular, when the wafer that forms the device is damaged, most of the projects used to form the device have been implemented for this wafer, and a huge cost has been invested, so the scale of damage is extremely large.
本發明係有鑑於相關問題點所發明者,其目的係提供配置於搭載用以收容複數晶圓之晶匣的搬送台車,緩和傳達至搭載於該搬送台車的晶匣之衝擊的晶匣固持具。 [用以解決課題之手段]The present invention is invented in view of the related problems, and its object is to provide a cassette holder configured to be mounted on a transfer trolley equipped with a cassette for accommodating a plurality of wafers and to relieve the impact of the cassette mounted on the transfer trolley . [Means to solve the problem]
依據本發明的一樣態,提供一種晶匣固持具,係支持收容晶圓之晶匣的晶匣固持具,其特徵為具備:晶匣收容部,係具備載置該晶匣之長方形狀的底面部、從長方形狀的該底面部之一端部及與該一端部對向之另一端部分別直立設置,且分別面對於該晶匣之一對側面的一對抵頂側壁、及從連接該底面部的該一端部及該另一端部的後端部直立設置的後壁;及移動吸收支持部,係一邊允許該晶匣收容部向沿著該晶匣收容部的該底面部的方向移動所定量或傾斜所定量,一邊支持該晶匣收容部。According to the same aspect of the present invention, there is provided a cassette holder, which supports a cassette holding a wafer, and is characterized by comprising: a cassette receiving part, which has a rectangular bottom surface on which the cassette is mounted A portion, an end from one end of the rectangular bottom surface and the other end opposite to the one end are respectively upright, and respectively face a pair of abutting side walls facing a pair of side surfaces of the crystal box, and connect the bottom surface A rear wall of the one end portion and the rear end portion of the other end portion that are upright; and a movement absorption support portion that allows the cartridge housing portion to move in a direction along the bottom surface portion of the cartridge housing portion Fixed or tilted, while supporting the crystal box accommodating part.
理想是該移動吸收支持部,係具有:長方形狀的支持板,係大於該晶匣收容部的該底面部,可滑動地支持該晶匣收容部;一對側壁,係從該支持板的一端部及對向於該一端部的另一端部分別直立設置,且分別面對於該晶匣收容部的該一對抵頂側壁;壁部,係從連接該支持板的該一端部及該另一端部的後端部直立設置,面對於該晶匣收容部的該後壁;及彈性構件,係連接該一對側壁的一方、該一對側壁的另一方、及該壁部的任一方,與被該支持板支持的該晶匣收容部。It is desirable that the mobile absorption support portion has a rectangular support plate that is larger than the bottom surface portion of the crystal box receiving portion and slidably supports the crystal box receiving portion; a pair of side walls from one end of the support plate And the other end opposite to the one end are upright respectively, and face the pair of abutting side walls of the cassette receiving part respectively; the wall part is connected from the one end and the other end of the support plate The rear end of the portion is provided upright, facing the rear wall of the cassette receiving portion; and the elastic member is connected to one of the pair of side walls, the other of the pair of side walls, and any of the wall portions, and The crystal box accommodating portion supported by the support plate.
更理想是更具備加速度感測器,與記錄以該加速度感測器檢測出的振動資料的振動資料記錄部。It is more desirable to further include an acceleration sensor and a vibration data recording unit that records vibration data detected by the acceleration sensor.
又,理想是更具備對移動該晶匣固持具的操作員進行攝影的相機,與記錄以該相機攝影之畫像資料的畫像資料記錄部。In addition, it is desirable to further include a camera that photographs an operator who moves the holder, and a portrait data recording unit that records portrait data photographed by the camera.
更理想是更具備發送以該振動資料記錄部記錄的該振動資料的資訊發送部。It is more desirable to further include an information transmission unit that transmits the vibration data recorded by the vibration data recording unit.
又,理想是更具備發送以該畫像資料記錄部記錄的畫像資料的資訊發送部。In addition, it is desirable to further include an information transmission unit that transmits the portrait data recorded by the portrait data recording unit.
更理想是固定於搬送該晶匣的搬送台車。 [發明的效果]More ideally, it is fixed to the transfer trolley that transfers the magazine. [Effect of invention]
本發明的一樣態之晶匣固持具,係例如固定於搬送用以收容晶圓之晶匣的搬送台車來使用。該晶匣固持具具備晶匣收容部。於該晶匣收容部所具備之底面部載置該晶匣。於底面部的一端部,與對向於該一端部的另一端部,分別直立設置分別面對於晶匣的一對側面之一對抵頂側壁,於底面部的後端部直立設置後壁。The crystal box holder of the same state of the present invention is used, for example, by being fixed to a transport trolley that transports a crystal box for storing wafers. The crystal box holder has a crystal box accommodating part. The crystal box is placed on the bottom portion of the crystal box accommodating portion. One end portion of the bottom surface portion is opposite to the other end portion opposite to the one end portion, and one of a pair of side surfaces facing the crystal box is respectively arranged up against the top side wall, and a rear wall is erected at the rear end portion of the bottom portion.
該晶匣固持具係進而具備支持晶匣收容部的移動吸收支持部。該移動吸收支持部,係一邊允許晶匣收容部向沿著底面部的方向移動或傾斜,一邊支持該晶匣收容部。在此,沿著底面部的方向係例如水平方向。The crystal box holder further includes a moving absorption support portion that supports the crystal box accommodating portion. The movement absorption support portion supports the crystal cassette storage portion while allowing the crystal cassette storage portion to move or tilt in the direction along the bottom surface portion. Here, the direction along the bottom portion is, for example, the horizontal direction.
移動搭載用以收容晶圓之晶匣的搬送台車之期間,未預期的衝擊施加於該搬送台車時,該衝擊可藉由該移動吸收支持部緩和。因此,傳達到被晶匣收容部收容的晶匣之衝擊相對地小。進而,即使像使晶匣移動或傾斜的衝擊施加於晶匣固持具的狀況中,晶匣也適切地被持續支持。因此,可防止晶匣的翻倒及掉落。During the movement of the transfer trolley carrying the wafer cassette for containing wafers, when an unexpected impact is applied to the transfer trolley, the impact can be alleviated by the movement absorption support portion. Therefore, the impact transmitted to the crystal cassette accommodated in the crystal cassette accommodating portion is relatively small. Furthermore, even when an impact such as moving or tilting the crystal cassette is applied to the crystal cassette holder, the crystal cassette is properly supported continuously. Therefore, the tipping and falling of the crystal box can be prevented.
所以,依據本發明的一樣態,可提供配置於搭載用以收容複數晶圓之晶匣的搬送台車,緩和傳達至搭載於該搬送台車的晶匣之衝擊的晶匣固持具。Therefore, according to the same aspect of the present invention, it is possible to provide a cassette holder configured to be mounted on a transfer trolley mounted with a cassette for accommodating a plurality of wafers, and mitigating the impact transmitted to the cassette mounted on the transfer trolley.
參照添附圖式,針對本發明的一樣態相關的實施形態進行說明。首先,針對本實施形態的晶匣固持具所收容的晶匣,與被晶匣收容的晶圓進行說明。圖1係模式揭示將包含晶圓1的框架單元1a收容於晶匣9之樣子的立體圖。An embodiment related to the same state of the present invention will be described with reference to the attached drawings. First, the wafer cassette accommodated in the cassette holder of this embodiment and the wafer accommodated in the cassette will be described. FIG. 1 is a schematic perspective view showing how the frame unit 1 a including the
如圖1所示,晶圓1係被貼附於貼在具有比晶圓1的直徑大之直徑的開口之環狀的框架5的黏著膠帶3,在框架單元1a的狀態下被收容於晶匣9。或者,晶圓1係在原封不動的狀態下被收容於晶匣9。該晶圓1係例如由矽、SiC(碳化矽)、或者其他半導體等的材料所成之晶圓、又或者藍寶石、玻璃、石英等的材料所成之圓板狀的基板。As shown in FIG. 1, the
於晶圓1的表面,行程有IC(Integrated circuit)或LED(Light emitting diode)等的裝置7,晶圓1被分割成各個裝置7的話,則形成具備裝置7的各個裝置晶片。所形成的裝置晶片藉由黏著膠帶3支持。之後,將黏著膠帶3往外周方向擴張的話,則裝置晶片間的間隔變寬,容易進行裝置晶片的拾取。A
晶匣9可收容複數晶圓1或框架單元1a。晶匣9係例如圖1所示般,具備相互對向之一對側壁9a、9b。進而,具備連接側壁9a之一端及側壁9b之一端的前壁9c,與連接側壁9a之另一端及側壁9b之另一端的後壁9d。又,於晶匣9的底部,設置底板(未圖示)。晶匣9的一對側壁9a、9b之間的間隔,係設為與被收容物即晶圓1或框架單元1a的大小對應的大小。The
於晶匣9之一對側壁9a、9b相互對向之面,分別設置有複數直線狀的導引軌道13a、13b。導引軌道13a、13b形成於一對側壁9a、9b個別對應的位置。如圖1所示,導引軌道13a、13b係例如沿著上下方向形成。藉由一對側壁9a、9b、前壁9c、及後壁9d的各上端部構成搬出入口11,晶圓1係透過該搬出入口11從晶匣9搬出入。A plurality of
將晶圓1收容於晶匣9時,將晶圓1或框架5的一端,插入形成於側壁9a之一導引軌道13a,與鄰接於該導引軌道13a的另一導引軌道13a之間。同時,將晶圓1或框架5的另一端,插入側壁9b的對應之位置。亦即,導引軌道13a、13b係具有規定收容晶圓1的位置的功能,於導引軌道13a、13b所規定之複數收容位置個別收容晶圓1。When storing the
再者,於圖1所例示的晶匣9從上方搬入晶圓1,被收容於晶匣9的晶圓1係從上方搬出,但是,收容晶圓1的晶匣9並不限定於此。例如,晶匣9並不具備前壁9c,前側成為晶圓1的搬出入口亦可。此時,於一對側壁9a、9b的內面形成沿著水平方向的複數導引軌道13a、13b,於晶匣9,從水平方向前側搬入晶圓1。In addition, the
以下,以將複數晶圓1收容於上部具備搬出入口11的晶匣9,並搬送該晶匣9的狀況為例進行說明。於裝置晶片的製造工場配置有複數加工裝置,在各加工裝置之間搬送晶圓1時,晶圓1被收容於晶匣9。於該製造工場中使用加工裝置的操作員,利用搬送晶匣9來搬送晶圓1。Hereinafter, a case where a plurality of
近年來,晶圓1有明顯大型化的傾向,收容複數晶圓1的晶匣9的重量也大幅增加。因此,為了減輕操作員的負擔,使用搬送晶匣9的搬送台車28(參照圖5)。然而,有搭載晶匣9的搬送台車28與該製造工場的構造物等發生衝突等,未預期的衝擊加於晶匣9,晶匣9翻倒等導致所收容的晶圓1發生破損的狀況。In recent years, the
因此,為了緩和該衝擊,防止晶圓1的破損,使用本實施形態的晶匣固持具2(參照圖2等)。該晶匣固持具2固定於該搬送台車28。晶匣9係利用收容於晶匣固持具2,被搭載於搬送台車28來進行搬送。以下,針對本實施形態的晶匣固持具2進行說明。Therefore, in order to alleviate the impact and prevent damage to the
圖2係模式揭示晶匣9被收容於晶匣固持具2之樣子的立體圖。於晶匣9收容有複數晶圓1。晶匣固持具2係具備收容晶匣9的晶匣收容部4。晶匣收容部4係具備大於晶匣9的底部之長方形狀的底面部6。於底面部6上載置晶匣9。FIG. 2 is a perspective view schematically showing how the
從長方形狀的底面部6的一端部6a及對向於該一端部6a的另一端部6b,分別直立設置一對抵頂側壁8a、8b。晶匣9被收容於晶匣收容部4時,一對抵頂側壁8a、8b係分別面對於晶匣9的一對側壁9a、9b。進而,從連接一端部6a及另一端部6b的底面部6之後側的後端部,直立設置後壁4a。晶匣9係收容於被底面部6、一對抵頂側壁8a、8b、及後壁4a等包圍的收容空間內。A pair of abutting
本實施形態的晶匣固持具2係更具備一邊允許晶匣收容部4移動所定量或傾斜所定量,一邊支持該晶匣收容部4的移動吸收支持部10。移動吸收支持部10係具備支持晶匣收容部4之長方形狀的支持板12。載置於支持板12上的晶匣收容部4可對於支持板12滑動。The
移動吸收支持部10係具備從支持板12的一端部12a及對向於該一端部12a的另一端部12b,分別直立設置一對側壁14a、14b。該一對側壁14a、14b係分別與晶匣收容部49的一對抵頂側壁8a、8b面對。進而,從連接一端部12a及另一端部12b的底面部12之後側的後端部,直立設置壁部10a。The movement
圖3係模式揭示收容晶匣9的晶匣固持具2的剖面圖。圖3所示的剖面圖,係揭示以平行於支持板12之面切斷晶匣固持具2的剖面。如圖3所示,晶匣收容部4係連接於複數彈性構件16a、16b、16c。FIG. 3 is a model diagram showing a cross-sectional view of the
移動吸收支持部10係具備連接支持晶匣收容部4之後壁4a與該壁部10a的彈性構件16a。又,具備連接晶匣收容部4之抵頂側壁8a與該側壁14a的彈性構件16b,更具備連接晶匣收容部4之抵頂側壁8b與該側壁14b的彈性構件16c。The movement
圖5係模式揭示以固定晶匣固持具2的搬送台車28搬送晶匣9之樣子的立體圖。搬送台車28係例如具備沿著垂直方向延伸的4條支柱28a、設置於該4條支柱28a之最下端的車輪28b、固定於該4條支柱28a之長方形狀的網架28c。該網架28c的各角係於4條支柱28a的任一,分別固定於與該支柱28a的相同高度。FIG. 5 is a perspective view schematically showing how the
於網架28c上,固定複數晶匣固持具2,搬送收容晶圓1的晶匣9時,使該晶匣固持具2收容晶匣9。在晶匣固持具2收容晶匣9的狀態下,操作員15移動搬送台車28的話則可搬送晶匣9。此時,有操作員15失誤地讓搬送台車28與設置於裝置晶片的製造工場內的構造物等衝突的狀況。On the
晶匣收容部4係可滑動地支持於支持板12上,又,藉由彈性構件16a、16b、16c沿著水平方向連接於移動吸收支持部10。因此,衝擊等施加於固定晶匣固持具2的搬送台車28時,藉由彈性構件16a、16b、16c緩和的衝擊傳達至晶匣9。The
進而,因為來自外部的衝擊等,晶匣收容部4正要往沿著底面部6的橫方向移動時,或正要傾斜時,主要彈性構件16b、16c會緩和該衝擊。然後,一邊允許晶匣收容部4往該橫方向之所定量的移動或所定量的傾斜,一邊移動吸收支持部10支持該晶匣收容部4。Furthermore, the main
又,因為來自外部的衝擊等,晶匣收容部4正要往沿著該底面部6的前後方向,亦即垂直於該橫方向的方向移動時,或正要傾斜時,主要彈性構件16a會緩和該衝擊。然後,一邊允許晶匣收容部4往該前後方向之所定量的移動或所定量的傾斜,一邊移動吸收支持部10支持該晶匣收容部4。Also, due to external impact, etc., the
所以,對於被晶匣固持具2收容的晶匣9,緩和該衝擊等才傳達,又,防止晶匣9的翻倒,及從搬送台車28掉落,故可防止收容於晶匣9之晶圓1的破損。Therefore, for the
進一步,針對本實施形態的晶匣固持具2的構造進行說明。圖4係模式揭示收容晶匣9的晶匣固持具2的側視圖。如圖4所示,例如於晶匣固持具2的晶匣收容部4之抵頂側壁8a的外側,設置有記錄單元18。該記錄單元18係例如具備捕捉晶匣固持具2之前方的相機20、加速度感測器22、輸出資訊的資訊發送部24、記錄各種資訊的記憶部26。Furthermore, the structure of the
相機20係在晶匣9被收容於晶匣收容部4時、搬送台車28移動時、又,搬出被收容於晶匣收容部4的晶匣9時動作,對從事作業的操作員15進行攝影。藉由攝影所得之畫像係例如作為畫像資料而積存於記憶部26。亦即,記憶部26係具有畫像資料記錄部的功能。晶匣9,或被收容的晶圓1等發生問題等時,可藉由該畫像資料特定此時實施作業的操作員15。The
加速度感測器22係具有在藉由搬送台車28搬送晶匣9時,監視施加於收容晶匣9的晶匣收容部4之振動及衝擊的大小的功能。例如,搬送晶匣9時,藉由加速度感測器22持續檢測晶匣收容部4的振動的樣子,檢測出超過所允許之範圍的強度之強度的振動或衝擊時,則該記錄單元18對操作員發出警告亦可。The
又,所得之振動資料係積存於記憶部26亦可。亦即,記憶部26係具有振動資料記錄部的功能。藉由分析積存於記憶部26的振動資料,之後可參照施加於晶匣9之振動的履歷。進而,振動資料係與實施搬送作業之操作員15的資訊一起記憶於記憶部26亦可。藉由分析積存於記憶部26的振動資料,例如可比較各操作員15的作業水準等。Furthermore, the obtained vibration data may be stored in the
資訊發送部24係具備將該畫像資料及該振動資料從記錄單元18發送至外部的功能。資訊發送部24係例如具備可藉由無線方式所致之通訊,連接於外部機器之天線或通訊模組等的單元,例如紅外線通訊單元、無線LAN單元、或手機線路用的通訊單元等的單元。或者,資訊發送部24係在與外部機器之間藉由通訊纜線連接的單元,具備連接於該通訊纜線的端子。The
具備相機20、加速度感測器22、資訊發送部24、及記憶部26的記錄單元18係例如藉由市售的智慧型手機實現亦可。例如,將專用的應用程式安裝於智慧型手機,使其具有記錄單元18的功能,利用將其安裝於晶匣收容部4的抵頂側壁8a,以將記錄單元18設置於晶匣固持具2亦可。The
晶匣固持具2係進而具備該晶匣固持具2對搬送台車28的固定所使用之固定部10b亦可。固定部10b係例如圖4所示般,設置於移動吸收支持部10的底面。固定部10b係例如具備一端連接於移動吸收支持部10,另一端連接於固定構件的彈性構件。如圖5所示,將晶匣固持具2固定於搬送台車28時,例如藉由將該固定構件嵌入網架28c的開口,讓晶匣固持具2被固定於網架28c。The
如以上所說明般,透過晶匣固持具2將晶匣9搭載於搬送台車28的話,即使藉由搬送台車28搬送晶匣9時發生衝擊等的狀況中,也可緩和傳達到晶匣9的衝擊。又,一邊允許晶匣9移動或傾斜,一邊適切地支持,故晶匣9難翻倒或掉落。所以,晶圓1難發生損傷等,可更安全地搬送形成裝置7之昂貴的晶圓1。As described above, if the
再者,本發明並不限定於前述實施形態的記載,可進行各種變更來實施。例如,在前述實施形態中,已針對固定於搬送台車28所使用之晶匣固持具2進行說明,但是,本發明的一樣態並不限定於此。例如,晶匣固持具2係固定於搬送台車28以外之物亦可。Furthermore, the present invention is not limited to the description of the foregoing embodiments, and can be implemented with various changes. For example, in the foregoing embodiment, the
例如,本發明的一樣態的晶匣固持具2係如圖6所示般,固定於不移動的收容架30來使用亦可。圖6係模式揭示晶匣9被保管於固定晶匣固持具2的收容架30之樣子的立體圖。該收容架30係具備一對側壁30a,與兩端分別固定於該側壁30a的架板30b。For example, as shown in FIG. 6, the
例如,地震頻傳的地區存在裝置晶片的製造工場的狀況中,在將晶匣9收容於收容架30以保管晶圓1之期間,有在該地區發生大規模的地震的情況。即使於此種狀況中,只要將晶匣固持具2固定於收容架30,將晶匣9收容於該晶匣固持具2的話,地震所致之振動及衝擊也可藉由彈性構件16a、16b、16c等緩和,防止晶匣9的掉落及翻倒。然後,因為緩和傳達到晶圓1的衝擊,故晶圓1難發生損傷。For example, when there is a manufacturing plant for device wafers in an area where earthquakes are frequent, a large-scale earthquake may occur in the area while the
此外,前述實施形態的構造、方法等只要不脫離本發明的目的的範圍,可適當變更來實施。In addition, the structure, method, and the like of the foregoing embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.
1‧‧‧晶圓
1a‧‧‧框架單元
2‧‧‧晶匣固持具
3‧‧‧膠帶
4‧‧‧晶匣收容部
4a‧‧‧後壁
5‧‧‧框架
6‧‧‧底面部
6a,6b‧‧‧端部
7‧‧‧裝置
8a,8b‧‧‧抵頂側壁
9‧‧‧晶匣
9a,9b‧‧‧側壁
9c,9d‧‧‧壁部
10‧‧‧移動吸收支持部
10a‧‧‧壁部
10b‧‧‧固定部
11‧‧‧搬出入口
12‧‧‧支持板
12a,12b‧‧‧端部
13a,13b‧‧‧導引軌道
14a,14b‧‧‧側壁
15‧‧‧操作員
16a,16b,16c‧‧‧彈性構件
18‧‧‧記錄單元
20‧‧‧相機
22‧‧‧加速度感測器
24‧‧‧資訊發送部
26‧‧‧記憶部
28‧‧‧搬送台車
28a‧‧‧支柱
28b‧‧‧車輪
28c‧‧‧網架
30‧‧‧收容架
30a‧‧‧側壁
30b‧‧‧架板1‧‧‧ Wafer
1a‧‧‧
[圖1]模式揭示將包含晶圓的框架單元收容於晶匣之樣子的立體圖。 [圖2]模式揭示晶匣被收容於晶匣固持具之樣子的立體圖。 [圖3]模式揭示收容晶匣的晶匣固持具的剖面圖。 [圖4]模式揭示收容晶匣的晶匣固持具的側視圖。 [圖5]模式揭示以固定晶匣固持具的搬送台車搬送晶匣之樣子的立體圖。 [圖6]模式揭示晶匣被保管於固定晶匣固持具的收容架之樣子的立體圖。[Fig. 1] A perspective view schematically showing how a frame unit including a wafer is housed in a wafer magazine. [Fig. 2] A perspective view showing the mode in which the crystal box is accommodated in the crystal box holder. [Fig. 3] A schematic view showing a cross-sectional view of a cassette holder holding a cassette. [FIG. 4] The model reveals the side view of the crystal holder holding the crystal holder. [Fig. 5] A perspective view schematically showing how a cassette is transported by a transfer trolley with a fixed cassette holder. [Fig. 6] A perspective view schematically showing how the crystal cassette is stored in the storage rack holding the crystal cassette holder.
1‧‧‧晶圓 1‧‧‧ Wafer
2‧‧‧晶匣固持具 2‧‧‧Cage holder
4‧‧‧晶匣收容部 4‧‧‧ Crystal box containment department
4a‧‧‧後壁 4a‧‧‧Back wall
6‧‧‧底面部 6‧‧‧Bottom face
6a,6b‧‧‧端部 6a, 6b ‧‧‧ end
8a,8b‧‧‧抵頂側壁 8a, 8b‧‧‧ against the side wall
9‧‧‧晶匣 9‧‧‧crystal box
9a,9b‧‧‧側壁 9a, 9b‧‧‧side wall
9c,9d‧‧‧壁部 9c, 9d
10‧‧‧移動吸收支持部 10‧‧‧Mobile Absorption Support Department
10a‧‧‧壁部 10a‧‧‧Wall
10b‧‧‧固定部 10b‧‧‧Fixed Department
11‧‧‧搬出入口 11‧‧‧ Move out
12‧‧‧支持板 12‧‧‧Support board
12a,12b‧‧‧端部 12a, 12b ‧‧‧ end
13a,13b‧‧‧導引軌道 13a, 13b‧‧‧Guide track
14a,14b‧‧‧側壁 14a, 14b‧‧‧side wall
16a‧‧‧彈性構件 16a‧‧‧Elastic member
18‧‧‧記錄單元 18‧‧‧Record unit
Claims (7)
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JP2018139484A JP7162977B2 (en) | 2018-07-25 | 2018-07-25 | cassette holder |
JP2018-139484 | 2018-07-25 |
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TW202007611A true TW202007611A (en) | 2020-02-16 |
TWI811405B TWI811405B (en) | 2023-08-11 |
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TW (1) | TWI811405B (en) |
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CN213355191U (en) * | 2021-03-19 | 2021-06-04 | 台湾积体电路制造股份有限公司 | Storage device of wafer carrier |
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JPH06329206A (en) * | 1993-05-18 | 1994-11-29 | Toshiba Corp | Wafer cassette, band for carrying wafer cassette and shape detecting device theerefor |
JP4286210B2 (en) | 2004-11-12 | 2009-06-24 | シャープ株式会社 | Glass substrate transfer method and transfer system |
JP2007153355A (en) | 2005-12-01 | 2007-06-21 | Nitto Denko Corp | Truck for transferring plate-like article |
JP2013001521A (en) * | 2011-06-17 | 2013-01-07 | Hitachi Ltd | Article conveyance management device, article conveyance management method, and program |
JP5687575B2 (en) * | 2011-07-11 | 2015-03-18 | 株式会社東芝 | Wafer transfer container protection case |
JP2014078656A (en) | 2012-10-12 | 2014-05-01 | Disco Abrasive Syst Ltd | Housing cassette |
JP6007880B2 (en) | 2013-10-10 | 2016-10-12 | 株式会社ダイフク | Ceiling transport vehicle |
JP6689672B2 (en) | 2016-05-25 | 2020-04-28 | 信越ポリマー株式会社 | Substrate storage container, management system thereof, and substrate storage container management method |
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2019
- 2019-07-23 CN CN201910665011.4A patent/CN110783241B/en active Active
- 2019-07-24 TW TW108126100A patent/TWI811405B/en active
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JP7162977B2 (en) | 2022-10-31 |
JP2020017625A (en) | 2020-01-30 |
CN110783241A (en) | 2020-02-11 |
TWI811405B (en) | 2023-08-11 |
CN110783241B (en) | 2024-02-23 |
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