TW202005782A - Imprinting system, glue supplying device and imprinting method - Google Patents

Abstract

An imprinting system including a imprinting mold and a glue supplying device is provided. The imprinting mold has an imprinting surface. The glue supplying device includes a glue supplying main body and a glue injection portion. The glue supplying main body is adapted to drive the glue injection portion to move toward the imprinting surface, and to supply a first glue layer onto the imprinting surface through the glue injection portion. The imprinting mold is adapted to imprint the first glue layer onto a wafer. In addition, an imprinting method is also provided.

Description

Imprint system, glue supply device and imprint method

The invention relates to an imprinting system, a glue supplying device and an imprinting method, and particularly relates to an imprinting system, a glue supplying device and an imprinting method used in a wafer imprinting process.

Nanoimprint is to use the imprinted microstructure of the mold (such as a plurality of concave holes) to imprint the adhesive layer on the wafer to form the desired microstructure on the wafer, such as the optical microstructure of the lens of the optical device . However, in the case where the depth of the concave hole of the mold is large, during the imprinting process, the air in the concave hole cannot be completely discharged with the entry of the glue, thereby generating air bubbles and affecting the product yield. Moreover, if the pressure applied to the adhesive layer by the mold during the imprinting process is changed (increased) to solve the bubble problem, the imprinting quality will be affected due to the change.

The invention provides an imprinting system, a glue supply device and an imprinting method, which can avoid the generation of air bubbles in the glue layer after imprinting.

The imprint system of the present invention includes an imprint mold and a glue supply device. The stamping mold has a stamping surface. The glue supply device includes a glue supply main body and a glue outlet part. The glue supply body is suitable for driving the glue outlet to move toward the imprint surface, and provides a first glue layer to the imprint surface by the glue outlet. The imprinting mold is suitable for laminating the first glue onto a wafer.

The glue supply device of the present invention includes a glue supply body, an extension arm and a glue outlet. The extension arm extends from the glue supply body. The glue outlet is arranged at the end of the extension arm. The glue supply main body is suitable for driving the extending arm to extend into an imprinting mold so that the glue-out portion is located on an imprinting surface of the imprinting mold, and a first glue layer is provided to the imprinting surface through the glue-out portion. The imprinting mold is suitable for laminating the first glue onto a wafer.

In an embodiment of the invention, the bottom of the glue supply body has a plurality of rollers, and the glue supply body is adapted to be moved by the rollers.

In an embodiment of the present invention, the above glue supply device includes an extension arm, the extension arm extends from the main body of the glue supply, and the glue outlet is disposed at the end of the extension arm. The extension arm is suitable for extending into the imprinting mold so that The glue outlet is located on the embossed surface.

In an embodiment of the invention, the above-mentioned glue supply main body is suitable for driving the extension arm up and down.

In an embodiment of the present invention, the glue supply main body supplies glue to the glue outlet through the extension arm.

In an embodiment of the present invention, the above-mentioned imprinting mold includes an upper mold and a carrier table. The carrier table is located below the upper mold and is suitable for carrying wafers.

In an embodiment of the present invention, the above-mentioned glue supply main body is suitable for driving the glue outlet to move between the upper mold and the carrying platform.

In an embodiment of the invention, the above-mentioned glue-out part has a glue-out surface, and a glue-out hole is in the center of the glue-out surface.

In an embodiment of the present invention, the above-mentioned glue outlet is suitable for being positioned at the center of the imprinted surface by the driving of the glue supply body.

In an embodiment of the present invention, the above-mentioned glue dispensing portion is adapted to have a distance from the embossed surface by the driving of the glue supply body.

In an embodiment of the present invention, the above-mentioned embossed surface has a plurality of embossed concave holes, and the glue-out portion is adapted to allow part of the first glue layer to enter at least part of these embossed concave holes.

In an embodiment of the present invention, the above-mentioned glue dispensing portion is adapted to apply a glue dispensing pressure to the imprinting surface to at least partially expel air bubbles in the imprinting concave holes.

In an embodiment of the invention, the wafer has a second adhesive layer, and the imprinting mold is suitable for laminating the first adhesive to the second adhesive layer.

The imprint method of the present invention includes the following steps. An embossing mold is provided with an embossing surface. A glue supply device is provided, including a glue supply main body and a glue outlet. The glue-out body drives the glue-out part to move toward the imprinted surface, and the glue-out part provides a first glue layer to the imprinted surface. The imprint mold laminates the first glue onto a wafer.

In an embodiment of the invention, the bottom of the above-mentioned glue supply body has a plurality of rollers, and the method includes the following steps. The glue supply body is moved by these rollers.

In an embodiment of the invention, the above-mentioned glue supply device includes an extension arm, the extension arm extends from the glue supply main body, and the glue outlet is disposed at the end of the extension arm. The method includes the following steps. The extension arm extends into the imprinting mold so that the glue outlet is positioned on the imprinting surface.

In an embodiment of the invention, the above imprinting method includes the following steps. The glue supply body drives the extension arm to move up and down.

In an embodiment of the invention, the above imprinting method includes the following steps. The glue supply body supplies glue to the glue outlet through the extension arm.

In an embodiment of the present invention, the above-mentioned embossing mold includes an upper mold and a carrier table, and the carrier table is located below the upper mold. The method includes the following steps. The wafer is carried by the carrying table.

In an embodiment of the invention, the above imprinting method includes the following steps. The glue supply main body drives the glue outlet to move between the upper mold and the bearing table.

In an embodiment of the present invention, the above-mentioned glue-out part has a glue-out surface, and a glue-out hole in the center of the glue-out surface. The method includes the following steps. The glue hole is located at the center of the imprinted surface by the driving of the glue main body.

In an embodiment of the invention, the above imprinting method includes the following steps. The glue-out part is driven by the glue main body to have a distance from the imprinted surface.

In an embodiment of the present invention, the above-mentioned embossed surface has a plurality of embossed concave holes, and the method includes the following steps. The glue-out portion allows part of the first glue layer to enter at least part of these embossed recesses.

In an embodiment of the invention, the above imprinting method includes the following steps. The glue-out part applies a glue-out pressure to the imprinted surface to at least partially expel the air bubbles in the imprinted concave holes.

In an embodiment of the invention, the above imprinting method includes the following steps. Provide a second adhesive layer on the wafer. The imprinting mold laminates the first adhesive layer to the second adhesive layer.

Based on the above, the present invention uses the glue supply device to provide the first glue layer on the imprint surface of the imprint mold before using the imprint mold to imprint the wafer. The glue supply device can use sufficient The glue supply pressure causes the bubbles of the first glue layer on the imprinted surface to be discharged, and then the imprinting mold laminates the first glue on the imprinted surface that has discharged the bubbles to the wafer. According to this, the pre-pressure is applied to discharge the air bubbles to prevent the adhesive layer from leaving air bubbles after imprinting, thereby improving the yield of the imprinted products.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

FIG. 1 is a schematic diagram of an imprint system according to an embodiment of the invention. 2 is a perspective view of the glue supply device of FIG. 1. FIG. 3 illustrates that the glue outlet of the glue supply device of FIG. 2 is moved into the imprinting mold. Please refer to FIGS. 1 to 3. The imprint system 100 of this embodiment includes an imprint mold 110 and a glue supply device 120. The imprinting mold 110 includes an upper mold 112 and a carrying platform 114. The carrying platform 114 is located below the upper mold 112 and is suitable for carrying the wafer W. Before the imprinting mold 110 imprints the wafer W, the glue supply device 120 is used to provide an adhesive layer to the imprinting surface of the imprinting mold 110, as described in detail below.

FIG. 4 illustrates that the glue outlet of FIG. 3 rises and dispenses glue. FIG. 5 illustrates a partially enlarged view of the glue outlet of FIG. 4 providing a glue layer to the stamping surface of the mold. As shown in FIG. 5, the upper mold 112 of the imprinting mold 110 has an imprinting surface 110a, and the imprinting surface 110a has a plurality of imprinting concave holes 110b. In order to make the drawing clearer, FIG. 5 depicts the embossed recess 110b as larger. In fact, the embossed recess 110b may be a nano-level microstructure, which is not limited by the present invention. As shown in FIG. 2, the glue supply device 120 includes a glue supply main body 122 and a glue outlet 124. The glue supply body 122 is adapted to drive the glue outlet 124 to move between the upper mold 112 and the carrier 114 as shown in FIG. 3 and to rise as shown in FIG. 4 to move toward the embossed surface 110a (marked in FIG. 5) of the upper mold 112. . As shown in FIG. 5, the glue supply main body 122 provides a first glue layer 50 to the embossed surface 110 a through the glue portion 124, so that part of the first glue layer 50 enters at least part of the embossed recesses 110 a.

The glue supplying device 120 can discharge the bubbles of the first glue layer 50 in the imprinting recesses 110a of the imprinting surface 110a by a sufficient glue supplying pressure during the above glue supplying process. FIG. 6 illustrates that the glue outlet of FIG. 4 moves away from the imprinting mold. After the glue supply device 120 provides the first glue layer 50 to the imprint surface 110a of the imprint mold 110, the glue supply body 122 drives the glue portion 124 to move away from the imprint mold 110 to become the state shown in FIG. 6, and then imprint the mold 110 may imprint the first adhesive layer 50 on the imprinted surface 110a with air bubbles discharged onto the second adhesive layer 60 on the wafer W. According to this, the pre-pressure is applied to discharge the air bubbles to prevent the adhesive layer from leaving air bubbles after imprinting, thereby improving the yield of the imprinted products.

Further, since the problem that the bubbles of the adhesive layer are difficult to be discharged mostly occurs in the center of the imprint surface, the first adhesive layer 50 provided by the glue main body 122 can be concentrated in the center of the imprint surface 110a. Specifically, as shown in FIGS. 3 to 5, the glue-out portion 124 of this embodiment has a glue-out surface 124 a, and a glue-out hole H is provided in the center of the glue-out surface 124 a. The glue hole H is suitable for driving the glue main body 122 (drawing suitable for FIG. 2) to be located at the center of the stamping surface 110 a (marked in FIG. 5 ), so that the glue portion 124 is pressed through the glue hole H The first adhesive layer 50 is provided at the center of the printing surface 110a. Under this imprinting method, the surrounding area of the imprinting surface 110a is directly imprinted, for example, by the second adhesive layer 60 spreading around, instead of imprinting the first adhesive layer 50 to the second as in the center胶层60。 60 glue layer.

In this embodiment, the glue dispensing portion 124 is adapted to be driven by the glue main body 122 to have an appropriate distance from the imprinting surface 110a of the imprinting mold 110 as shown in FIG. 5 and provide an appropriate amount of glue to produce Sufficient pressure to expel air bubbles. The distance is, for example, 0.1 mm, and the amount of glue is, for example, 2 ml, which is not limited by the present invention.

Please refer to FIG. 2. The bottom of the glue supply body 122 of this embodiment may have a plurality of rollers 122a, and is suitable for moving to the imprinting mold 110 (shown in FIGS. 3 and 4) or by these rollers 122a. From the imprinting mold 110. In addition, the glue supply device 120 further includes an extension arm 126, the extension arm 126 extends from the glue supply body 122, the glue outlet 124 is disposed at the end of the extension arm 126, the extension arm 126 is suitable for extending into the imprinting mold 110 to make The glue-out portion 124 is located on the imprint surface 110 a of the imprint mold 110. Furthermore, the glue supply main body 122 can be driven by a servo motor or other suitable driving device to move the extension arm 126 between the states shown in FIGS. 3 and 4.

Further, the glue supply body 122 may have a braking device at its roller 122a, and set it to allow the roller 122a to actuate only when the extension arm 126 and the glue outlet 124 are in the lower position shown in FIG. 3, In order to prevent the extension arm 126 and the glue outlet 124 from being in a higher position as shown in FIG. In addition, the glue supply main body 122 of this embodiment, for example, drives glue in the glue bucket 122c through the glue tube 122d and the extension arm 126 to supply glue to the glue outlet 124 through the driving of the glue dispenser 122b. Moreover, the glue supply main body 122 may be provided with a man-machine interface for the user to operate, so as to control the raising and lowering of the extension arm 126 and the amount of glue dispensed from the glue-out portion 124 as required.

In summary, in the present invention, before the wafer is imprinted by the imprinting mold, the glue supply device is used to provide the first glue layer on the imprint surface of the imprinting mold. The glue supply device can Sufficient glue supply pressure causes the bubbles of the first glue layer on the imprinted surface to be discharged, and then the imprinting mold laminates the first glue on the imprinted surface of the discharged bubbles to the wafer. According to this, the pre-pressure is applied to discharge the air bubbles to prevent the adhesive layer from leaving air bubbles after imprinting, thereby improving the yield of the imprinted products.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

50‧‧‧First adhesive layer 60‧‧‧Second adhesive layer 100‧‧‧imprinting system 110‧‧‧imprinting mold 110a‧‧‧imprinting surface 110b‧‧‧imprinting concave hole 112‧‧‧up Mould 114‧‧‧Carrier 120 120‧‧‧Glue supply device 122‧‧‧Glue supply main body 122a‧‧‧Roller 122b‧‧‧Dispenser 122c‧‧‧Glue barrel 122d‧‧‧Hose 124 124‧‧‧ Section 124a‧‧‧Exit surface 126‧‧‧Extension arm H‧‧‧Exit hole W‧‧‧ Wafer

FIG. 1 is a schematic diagram of an imprint system according to an embodiment of the invention. 2 is a perspective view of the glue supply device of FIG. 1. FIG. 3 illustrates that the glue outlet of the glue supply device of FIG. 2 is moved into the imprinting mold. FIG. 4 illustrates that the glue outlet of FIG. 3 rises and dispenses glue. FIG. 5 illustrates a partially enlarged view of the glue outlet of FIG. 4 providing a glue layer to the stamping surface of the mold. FIG. 6 illustrates that the glue outlet of FIG. 4 moves away from the imprinting mold.

50‧‧‧First adhesive layer

110‧‧‧imprint mold

112‧‧‧Upper Mould

114‧‧‧Carrying platform

124‧‧‧Dispensing Department

124a‧‧‧Outlet surface

H‧‧‧ glue hole

W‧‧‧ Wafer

Claims (30)

An embossing system includes: an embossing mold with an embossed surface; and a glue supply device, including a glue supply body and a glue outlet, wherein the glue supply body is suitable for driving the glue outlet to the pressure The printing surface moves, and a first adhesive layer is provided to the embossed surface through the glue-out portion. The embossing mold is suitable for laminating the first glue to a wafer. The imprint system as described in item 1 of the patent application scope, wherein the bottom of the glue supply body has a plurality of rollers, and the glue supply body is adapted to be moved by the rollers. The imprint system as described in item 1 of the patent application scope, wherein the glue supply device includes an extension arm extending from the glue supply body, the glue outlet is disposed at the end of the extension arm, and the extension arm It is suitable to extend into the embossing mold so that the glue-out portion is opposite to the embossing surface. The imprinting system as described in item 3 of the patent application scope, wherein the glue supply body is adapted to drive the extension arm up and down. The imprinting system as described in item 3 of the patent application scope, wherein the glue supply main body supplies glue to the glue outlet through the extension arm. The imprinting system as described in item 1 of the patent application scope, wherein the imprinting mold includes an upper mold and a carrier table, the carrier table is located below the upper mold and is suitable for carrying the wafer. The imprint system as described in item 6 of the patent application scope, wherein the glue supply main body is adapted to drive the glue outlet to move between the upper mold and the carrier. The imprinting system as described in item 1 of the patent application scope, wherein the glue-out part has a glue-out surface, and a glue-out hole is in the center of the glue-out surface. The imprinting system as described in item 8 of the patent application range, wherein the glue outlet is adapted to be centered on the imprinting surface by the driving of the glue supply body. The imprinting system as described in item 1 of the patent application range, wherein the glue-out portion is adapted to have a distance from the imprinting surface by the driving of the glue supply body. The embossing system as described in item 1 of the patent application range, wherein the embossed surface has a plurality of embossed recesses, and the glue-out portion is adapted to allow part of the first glue layer to enter at least part of the embossed recesses. The imprinting system as described in item 11 of the patent application range, wherein the glue dispensing part is adapted to apply a glue dispensing pressure to the imprinting surface to at least partially expel air bubbles in the imprinting concave holes. The imprinting system as described in item 1 of the patent application scope, wherein the wafer has a second adhesive layer, and the imprinting mold is suitable for laminating the first adhesive to the second adhesive layer. A glue supply device includes: a glue supply main body; an extension arm extending from the glue supply main body; and a glue outlet part disposed at the end of the extension arm, wherein the glue supply main body is adapted to drive the extension arm to extend Into an imprinting mold so that the glue-out portion is located on an imprinting surface of the imprinting mold, and a first glue layer is provided to the imprinting surface by the glue-out portion, the imprinting mold is suitable for The first glue is laminated to a wafer. The glue supply device according to item 14 of the patent application scope, wherein the bottom of the glue supply body has a plurality of rollers, and the glue supply body is adapted to be moved by the rollers. The glue supply device as described in item 14 of the patent application scope, wherein the glue supply body is adapted to drive the extension arm to move up and down. The glue supply device as described in item 14 of the patent application range, wherein the glue supply body supplies glue to the glue outlet through the extension arm. The glue supply device as described in item 14 of the patent application range, wherein the glue outlet has a glue outlet surface, and a glue outlet is provided in the center of the glue outlet surface. An embossing method includes: providing an embossing mold with an embossed surface; providing a glue supply device, including a glue supply main body and a glue output portion; driving the glue output portion toward the pressure by the glue supply main body The printing surface moves, and a first adhesive layer is provided to the embossed surface by the glue-out portion; and the first mold is laminated and printed onto a wafer by the embossing mold. The imprint method as described in item 19 of the patent application scope, wherein the bottom of the glue supply body has a plurality of rollers, the method includes: the glue supply body is moved by the rollers. The imprint method as described in item 19 of the patent application scope, wherein the glue supply device includes an extension arm extending from the glue supply main body, the glue outlet is disposed at the end of the extension arm, the method includes : The extending arm extends into the imprinting mold so that the glue-out portion is located on the imprinting surface. The imprint method as described in Item 21 of the patent application scope includes: the glue supply body drives the extension arm to move up and down. The imprint method as described in item 21 of the patent application scope includes: the glue supply main body supplies glue to the glue outlet through the extension arm. The imprinting method as described in item 19 of the patent application scope, wherein the imprinting mold includes an upper mold and a carrier table, the carrier table is located below the upper mold, the method includes: carrying the crystal by the carrier table round. The imprinting method as described in item 24 of the patent application scope includes: the glue supply main body drives the glue output part to move between the upper mold and the carrying platform. The imprint method as described in item 19 of the patent application scope, wherein the glue-out part has a glue-out surface, and a glue-out hole in the center of the glue-out surface, the method includes: the glue-out hole through the glue supply The driving of the main body is located at the center of the embossed surface. The imprinting method as described in item 19 of the patent application scope includes: the glue outlet is driven by the glue supply body to have a distance from the imprinting surface. The embossing method according to item 19 of the patent application scope, wherein the embossed surface has a plurality of embossed concave holes, the method includes: the glue-out portion allows part of the first glue layer to enter at least part of the embossed concave holes . The embossing method as described in item 28 of the patent application scope includes: the gluing part applies an gluing pressure to the embossed surface to at least partially discharge air bubbles in the embossed concave holes. The imprint method as described in item 19 of the patent application scope includes: providing a second adhesive layer on the wafer; and the imprinting mold laminating the first adhesive to the second adhesive layer.

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