TW202005213A - Automatic power control light spot transmitter including a housing, a collimator, and a Diffractive Optical Elements - Google Patents

Automatic power control light spot transmitter including a housing, a collimator, and a Diffractive Optical Elements Download PDF

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TW202005213A
TW202005213A TW107117544A TW107117544A TW202005213A TW 202005213 A TW202005213 A TW 202005213A TW 107117544 A TW107117544 A TW 107117544A TW 107117544 A TW107117544 A TW 107117544A TW 202005213 A TW202005213 A TW 202005213A
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power control
automatic power
light
circuit
coupled
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TW107117544A
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TWI691134B (en
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黃忠民
謝佳宏
林俊廷
吳明倬
方銘輝
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華信光電科技股份有限公司
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Abstract

This invention relates to an automatic power control light spot transmitter, including a housing, which sequentially has an accommodation space and a platform positioned above the accommodation space, and is covered on a substrate, so that an automatic power control IC, a laser diode and an optical reflection device are located within the housing, the accommodation space and the platform are positioned above the automatic power control IC, the laser diode and the optical reflection device; a collimator, which is fixed within the accommodation space of the housing; and a Diffractive Optical Elements (DOE), which is adhered to the platform of the housing. Accordingly, the laser diode projects a laser light on the optical reflection device, so that the optical reflection device projects the laser light vertically out of the collimator to the Diffractive Optical Elements (DOE). As a result, the Diffractive Optical Elements (DOE) generates a plurality of light spots, the laser light generates stray light within the housing by means of reflection, the stray light is detected by a photodiode of the automatic power control IC to form a readable photodetection signal. The photodetection signal performs feedback control on the output of the laser diode to adjust the ratio of a power emitted from the laser light, and the emission of each light spot of the Diffractive Optical Elements (DOE) is controlled based on the ratio of the power emitted from the laser light.

Description

自動功率控制光點發射器Automatic power control light point transmitter

本發明係有關一種自動功率控制光點發射器,其檢光訊號係回授控制雷射二極體之輸出而調整雷射光所射出之功率比例,並以雷射光所射出之功率比例而控制繞射光學元件之各光點發射。The invention relates to an automatic power control light point emitter whose light detection signal feedback controls the output of the laser diode to adjust the power ratio emitted by the laser light, and controls the winding power according to the power ratio emitted by the laser light The light spots of the optical components are emitted.

按,雷射二極體之發光強度,亦受到驅動電流量及溫度影響,當驅動電流越高光強度越高,則元件溫度越高及光衰減值越大,且在雷射二極體啟動後,而輕微電壓變化會造成電流變化量劇烈變化,亦需要自動功率控制雷射二極體之發光強度,如圖1所示,其揭示在US Patent No.7,177,333,為一種雷射二極體模組10,包含:一散熱座(heat sink)11,具有一凹槽111,且其背面設有第1接腳12a、第2接腳12b及第3接腳(圖未示);一固定座(mount)13,係凸設在該散熱座11表面,並與該接地(GND)之第2接腳12b連接;一次固定座(submount)131,係設在該固定座13內側,供一雷射二極體(laser diode)14接合;一檢光二極體(photo diode)15,係設於該散熱座1l上;一金屬外殼(cap)17,其頂面具備一玻璃窗171,並底緣接合在該散熱座11上方;一APC電路16,係將自動功率控制電路設製成電路板或IC樣態,並內建封裝在該金屬外殼17內,利用打線與該第1接腳12a、該第2接腳12b及該第3接腳與該雷射二極體14、該檢光二極體15連接,據以形成雷射二極體之電壓驅動元件,雖該雷射二極體模組10可靠度高,但體積大而難以整合至應用端,且無法使用半導體表面黏著技術(SMT)達到快速自動化生產。Press, the luminous intensity of the laser diode is also affected by the amount of drive current and temperature. When the drive current is higher, the light intensity is higher, the higher the component temperature and the greater the light attenuation value, and after the laser diode is started, and A slight voltage change will cause a dramatic change in the amount of current change, and automatic power control of the luminous intensity of the laser diode is also required. As shown in FIG. 1, which is disclosed in US Patent No. 7,177,333, it is a laser diode module 10 , Including: a heat sink (heat sink) 11, with a groove 111, and the back of the first pin 12a, the second pin 12b and the third pin (not shown); a fixed seat (mount )13, which is convexly arranged on the surface of the heat dissipation base 11 and is connected to the second pin 12b of the ground (GND); a primary mount (submount) 131 is provided inside the fixed base 13 for one laser A laser diode 14 is joined; a photodiode 15 is mounted on the heat sink 11; a metal cap 17 is provided with a glass window 171 on the top surface, and the bottom edge is joined Above the heat sink 11; an APC circuit 16, which is an automatic power control circuit designed as a circuit board or IC, and built-in package in the metal housing 17, using wire bonding with the first pin 12a, the The second pin 12b and the third pin are connected to the laser diode 14 and the photodetector 15 to form a voltage driving element of the laser diode, although the laser diode module 10 Reliability is high, but it is bulky and difficult to integrate into the application side, and it is impossible to use semiconductor surface adhesion technology (SMT) to achieve rapid automated production.

次按,目前3D感測技術主要使用結構光(structure light)技術,現有感測用元件一般採用光點發射器(dot projector),如圖2所示,其揭示在US Patent No.8,829,406,為一種光點發射器20,包含:一輻射源元件21,包括一雷射二極體211及一檢光二極體212,該雷射二極體211係輸出一雷射光(L1 )及該檢光二極體212係檢測一反射光(N1 ),該輻射源元件21係安裝在一基座22上,且該雷射二極體211係安裝在一次固定座(submount)213上,該次固定座213被固定至一殼座(packagestem)214上,該殼座214位於一管殼215內,該管殼215之上側係設有一窗216;一外殼23,係容置該輻射源元件21,並設有一出射窗231;一準直鏡(collimating lens)24,係容置在該外殼23內;一繞射光學元件(diffractive optical elements,DOEs)25,係容置在該外殼23內;一連接器26,係耦接該輻射源元件21。該光點發射器20之主要運作方式為該雷射光(L1 )經過該準直鏡24,並通過該繞射光學元件25,形成多個光點投影於欲辨識之物體上,再經由攝像機(camera) 擷取影像,辨識3D深度資訊,但體積大而組裝複雜不容易,且該輻射源元件21無法使用半導體表面黏著技術達到快速自動化生產。The second press, the current 3D sensing technology mainly uses structure light (structure light) technology, the existing sensing elements generally use a dot projector (dot projector), as shown in Figure 2, which is disclosed in US Patent No. 8,829,406, A light point emitter 20 includes: a radiation source element 21, including a laser diode 211 and a photodetector diode 212, the laser diode 211 outputs a laser light (L 1 ) and the detector The photodiode 212 detects a reflected light (N 1 ), the radiation source element 21 is mounted on a base 22, and the laser diode 211 is mounted on a primary mount 213, the secondary The fixing base 213 is fixed to a package tem 214, which is located in a tube shell 215, and a window 216 is provided on the upper side of the tube shell 215; a housing 23 is provided for accommodating the radiation source element 21 , And has an exit window 231; a collimating lens (collimating lens) 24, is housed in the housing 23; a diffractive optical elements (diffractive optical elements, DOEs) 25, is housed in the housing 23; A connector 26 is coupled to the radiation source element 21. The main operation mode of the light spot emitter 20 is that the laser light (L 1 ) passes through the collimator lens 24 and passes through the diffractive optical element 25 to form a plurality of light spots projected on the object to be identified, and then passes through the camera (Camera) Capture images and identify 3D depth information, but it is bulky and complicated to assemble, and the radiation source element 21 cannot use semiconductor surface bonding technology to achieve rapid automated production.

惟查,該雷射二極體模組10與該光點發射器20皆無法使用半導體表面黏著技術達到快速自動化生產,且該雷射二極體模組10需整合該散熱座11、該第1接腳12a、第2接腳12b及第3接腳、該固定座13、該次固定座131、該雷射二極體14、該檢光二極體15、該APC電路16及該金屬外殼17,以致體積較大,若該雷射二極體模組10取代該光點發射器20之輻射源元件21,再整合該光點發射器20之基座22、外殼23、準直鏡24、繞射光學元件25及連接器26,不僅組裝更加複雜,體積也更加龐大。是以,本發明人有鑑於上揭問題點,乃構思一種自動功率控制光點發射器,為本發明所欲解決的課題。However, the laser diode module 10 and the spot emitter 20 cannot use semiconductor surface bonding technology to achieve rapid automated production, and the laser diode module 10 needs to integrate the heat sink 11 and the first 1 pin 12a, 2nd pin 12b and 3rd pin, the fixed base 13, the secondary fixed base 131, the laser diode 14, the photodetector 15, the APC circuit 16 and the metal case 17. As a result of the larger volume, if the laser diode module 10 replaces the radiation source element 21 of the spot emitter 20, then the base 22, housing 23, collimating mirror 24 of the spot emitter 20 are integrated The diffractive optical element 25 and the connector 26 are not only more complicated to assemble, but also more bulky. Therefore, in view of the above-mentioned problems, the present inventor conceived an automatic power control light point transmitter, which is the subject to be solved by the present invention.

緣是,本發明之主要目的,係在提供一種自動功率控制光點發射器,其以基板整合具有檢光二極體之自動功率控制IC、固定座、雷射二極體、光反射元件、殼罩、準直鏡及繞射光學元件,用以解決先前技術組裝更加複雜、體積也更加龐大及無法使用半導體表面黏著技術達到快速自動化生產之問題點,進而具有組裝簡易、體積輕薄及生產成本低之功效增進。The reason is that the main purpose of the present invention is to provide an automatic power control light point emitter, which integrates an automatic power control IC with a light detecting diode, a fixed base, a laser diode, a light reflecting element, and a case on a substrate Covers, collimating mirrors and diffractive optical components are used to solve the problems of more complicated assembly, larger volume and the inability to use semiconductor surface adhesion technology to achieve rapid automated production in the prior art, and thus have simple assembly, light and thin volume and low production cost The effectiveness of the increase.

本發明之另一目的,係在提供一種自動功率控制光點發射器,其以雷射二極體、具有檢光二極體之自動功率控制IC及光反射元件,即可形成可回授控制之雷射光,進而雷射光所射出之功率比例而控制繞射光學元件之各光點發射之功效增進。Another object of the present invention is to provide an automatic power control light point emitter, which can form a feedback control by using a laser diode, an automatic power control IC with a detection diode, and a light reflecting element Laser light, and in turn the ratio of the power emitted by the laser light, enhances the efficiency of controlling the emission of each spot of the diffractive optical element.

本發明之再一目的,係在提供一種自動功率控制光點發射器,其自動功率控制IC內建光回授控制及溫度補償,以達到穩定雷射光的輸出,且自動功率控制IC內建保護電路,以增加可靠度,進而提升光點輸出穩定及可靠輸出之功效增進。Still another object of the present invention is to provide an automatic power control light point transmitter, which has built-in optical feedback control and temperature compensation in the automatic power control IC to achieve stable laser light output, and built-in protection of the automatic power control IC Circuit to increase the reliability, thereby improving the stability of the light spot output and the improvement of the efficiency of the reliable output.

為達上述目的,本發明採用之技術手段包含:一基板;一自動功率控制IC,其具有一檢光二極體,並固定於該基板上;一固定座,係固定在該基板上;一雷射二極體,係固定在該固定座上,並耦接該自動功率控制IC;一光反射元件,係固定在該雷射二極體之前方;一殼罩,其上依序具有一容置空間及一位於該容置空間上方之平台,並蓋於該基板上,使該自動功率控制IC、該雷射二極體及該光反射元件係位於該殼罩內,且該容置空間及該平台係位於該自動功率控制IC、該雷射二極體及該光反射元件之上方;一準直鏡,係固置在該殼罩之容置空間內,使該準直鏡係位於該自動功率控制IC、該雷射二極體及該光反射元件之上方;以及一繞射光學元件,係黏著於該殼罩之平台上,使該繞射光學元件係位於該準直鏡之上方;藉此,該雷射二極體係投射一雷射光在該光反射元件上,使該光反射元件將該雷射光係垂直射出於該準直鏡至該繞射光學元件,讓該繞射光學元件可產生複數個光點,且該雷射光在該殼罩內經由反射產生一雜散光,並以該自動功率控制IC之檢光二極體係偵測該雜散光,形成一可讀取之檢光訊號,該檢光訊號係回授控制該雷射二極體之輸出而調整該雷射光所射出之功率比例,並以該雷射光所射出之功率比例而控制該繞射光學元件之各該光點發射。To achieve the above purpose, the technical means used in the present invention include: a substrate; an automatic power control IC, which has a light-detecting diode, and is fixed on the substrate; a fixing seat is fixed on the substrate; a thunder The laser diode is fixed on the fixing base and is coupled to the automatic power control IC; a light reflecting element is fixed in front of the laser diode; a shell cover has a capacity in sequence A housing space and a platform above the housing space and covering the substrate so that the automatic power control IC, the laser diode and the light reflecting element are located in the housing, and the housing space And the platform is located above the automatic power control IC, the laser diode and the light reflecting element; a collimating mirror is fixed in the accommodating space of the housing so that the collimating mirror is located The automatic power control IC, the laser diode, and the light reflecting element; and a diffractive optical element, which is adhered to the platform of the housing, so that the diffractive optical element is located on the collimating mirror Above; thereby, the laser diode system projects a laser light on the light reflecting element, so that the light reflecting element perpendicularly shoots the laser light system out of the collimator lens to the diffractive optical element, allowing the diffractive The optical element can generate a plurality of light spots, and the laser light generates a stray light through reflection in the housing, and the stray light is detected by the light detection diode system of the automatic power control IC to form a readable detection Optical signal, the detection signal is to feedback control the output of the laser diode to adjust the power ratio emitted by the laser light, and to control each of the diffractive optical elements according to the power ratio emitted by the laser light Point of light emission.

依據前揭特徵,該自動功率控制IC係設有一供應電壓接點、一接地接點、一電流設定接點、一檢光二極體輸出接點及一雷射二極體輸出接點。According to the aforementioned features, the automatic power control IC is provided with a supply voltage contact, a ground contact, a current setting contact, a photodiode output contact, and a laser diode output contact.

依據前揭特徵,該自動功率控制IC之電路架構更包括該供應電壓接點係串聯耦接該檢光二極體與並聯耦接一電阻及一第一ESD電路,且該第一ESD電路係並聯耦接一接地端;一邏輯電路,係分別串聯耦接該電阻及該電流設定接點;一電流放大電路,係串聯耦接該檢光二極體;一誤差放大器,係並聯耦接該電流放大電路;一保護電路,係並聯耦接該誤差放大器,並具有一參考電壓單元、一過溫保護單元及一低電壓鎖定單元;一電晶體,係分別串聯耦接該誤差放大器、該雷射二極體輸出接點及該接地端;一電流監控電路,係並聯耦接該接地端;一第二ESD電路,係分別並聯耦接該電流設定接點及該接地端;一第三ESD電路,係分別並聯耦接該電流設定接點及該接地端;一可變電阻,係分別串聯耦接該檢光二極體輸出接點及該接地端;該雷射二極體係分別串聯耦接該供應電壓接點及該雷射二極體輸出接點。According to the aforementioned features, the circuit architecture of the automatic power control IC further includes that the supply voltage contact is coupled in series to the detection diode and is coupled in parallel to a resistor and a first ESD circuit, and the first ESD circuit is connected in parallel Coupling to a ground terminal; a logic circuit, respectively coupling the resistor and the current setting contact in series; a current amplifying circuit, coupling the detection diode in series; an error amplifier, coupling the current amplifier in parallel Circuit; a protection circuit, which is coupled in parallel to the error amplifier, and has a reference voltage unit, an over-temperature protection unit, and a low-voltage locking unit; a transistor, which is coupled in series to the error amplifier and the laser two, respectively A polar body output contact and the ground terminal; a current monitoring circuit, which is coupled in parallel to the ground terminal; a second ESD circuit, which is respectively coupled in parallel to the current setting contact and the ground terminal; and a third ESD circuit, It is respectively coupled to the current setting contact and the ground terminal in parallel; a variable resistor is respectively coupled to the output contact of the detection diode and the ground terminal in series; the laser diode system is respectively coupled to the supply in series The voltage contact and the output contact of the laser diode.

依據前揭特徵,該自動功率控制IC之電路架構更包括一緩啟動電路,用以防止啟動時之過電流。According to the aforementioned features, the circuit architecture of the automatic power control IC further includes a slow-start circuit to prevent overcurrent during startup.

依據前揭特徵,當該邏輯電路判斷該電流設定接點係設定在高電平時,則該電流監控電路之電流值係設定為100mA,或當該邏輯電路判斷該電流設定接點係設定在低電平時,則該電流監控電路之電流值係設定為300mA。According to the aforementioned feature, when the logic circuit determines that the current setting contact is set to a high level, the current value of the current monitoring circuit is set to 100 mA, or when the logic circuit determines that the current setting contact is set to a low At level, the current value of the current monitoring circuit is set to 300mA.

依據前揭特徵,當該邏輯電路判斷該電流設定接點係設定在高電平時,則該參考電壓單元之電壓值係設定為0.55V,及當該邏輯電路判斷該電流設定接點係設定在低電平時,則該參考電壓單元之電壓值係設定為1.1V;該過溫保護單元之溫度值係設定為大於165度及小於135度;該低電壓鎖定單元之電壓值係設定為小於2.3V及大於2.5V。According to the aforementioned features, when the logic circuit determines that the current setting contact is set at a high level, the voltage value of the reference voltage unit is set to 0.55V, and when the logic circuit determines that the current setting contact is set at When the level is low, the voltage value of the reference voltage unit is set to 1.1V; the temperature value of the over-temperature protection unit is set to be greater than 165 degrees and less than 135 degrees; the voltage value of the low voltage lock unit is set to less than 2.3 V and greater than 2.5V.

依據前揭特徵,該可變電阻之電阻值範圍係設定在35Kohm至1Kohm,該可變電阻之電阻值係設定為6Kohm,而對應該檢光二極體之電流值係設定為90uA。According to the aforementioned features, the resistance value range of the variable resistor is set at 35Kohm to 1Kohm, the resistance value of the variable resistor is set at 6Kohm, and the current value corresponding to the photodiode is set at 90uA.

依據前揭特徵,該第一ESD電路、該第二ESD電路及該第三ESD電路之人體模型值係設定為大於及等於2KV;該第一ESD電路、該第二ESD電路及該第三ESD電路之機械模型值係設定為大於及等於200V。According to the aforementioned features, the human body model values of the first ESD circuit, the second ESD circuit and the third ESD circuit are set to be greater than or equal to 2KV; the first ESD circuit, the second ESD circuit and the third ESD circuit The mechanical model value of the circuit is set to be greater than or equal to 200V.

依據前揭特徵,該基板具有一第一表面及相反側之一第二表面,該第一表面係設有一第一導電墊及該第二表面係設有一第二導電墊,且該基板係由電路板所構成,使該基板內形成內部導線,令該第一導電墊與第二導電墊相互耦接,該第一導電墊係分別以複數個外部導線耦接該自動功率控制IC與該雷射二極體晶片及該第二導電墊係耦接一外部電路。According to the aforementioned feature, the substrate has a first surface and a second surface on the opposite side, the first surface is provided with a first conductive pad and the second surface is provided with a second conductive pad, and the substrate is formed by The circuit board is formed so that internal wires are formed in the substrate, so that the first conductive pad and the second conductive pad are coupled to each other, and the first conductive pad is respectively coupled to the automatic power control IC and the thunder by a plurality of external wires The emitter diode chip and the second conductive pad are coupled to an external circuit.

依據前揭特徵,該準直鏡係為單一透鏡或微透鏡陣列其中任一所構成。According to the aforementioned features, the collimator lens is composed of a single lens or a microlens array.

依據前揭特徵,該殼罩之材質係包括選自銅、不鏽鋼或鋁其中任一所構成。According to the aforementioned features, the material of the cover includes any one selected from copper, stainless steel or aluminum.

依據前揭特徵,該基板之第一表面係設置一金屬外框,該金屬外框係框住該自動功率控制IC、該固定座及該光反射元件,且該金屬外框上係設置一黏著層,該黏著層係黏著固定該殼罩之底面。According to the aforementioned feature, a metal frame is provided on the first surface of the substrate, the metal frame surrounds the automatic power control IC, the fixing base and the light reflecting element, and an adhesive is provided on the metal frame Layer, the adhesive layer adheres and fixes the bottom surface of the shell.

依據前揭特徵,該金屬外框之材料係包括選自鎳金或鎳鈀金其中任一所構成。According to the aforementioned features, the material of the metal frame includes any one selected from nickel gold and nickel palladium gold.

依據前揭特徵,該黏著層之材料係包括選自膠材或金屬其中任一所構成。According to the aforementioned features, the material of the adhesive layer includes any one selected from the group consisting of adhesive materials and metals.

依據前揭特徵,該膠材係包括選自矽膠或環氧樹脂其中任一所構成。According to the aforementioned features, the adhesive material is composed of silicone rubber or epoxy resin.

依據前揭特徵,該金屬係包括選自金錫、銀銅、錫銀銅或銦其中任一所構成。According to the aforementioned features, the metal system includes any one selected from the group consisting of gold tin, silver copper, tin silver copper, and indium.

依據前揭特徵,該殼罩之容置空間內更包括一壓環結構,該壓環結構具有一環凹座及一位於該環凹座內之壓環所構成,該環凹座之外環面係鉚合固定至該殼罩之容置空間內、該環凹座係承放該準直鏡及該環凹座係設有一光反射孔,並以該準直鏡之中央凸面之位置、該光反射孔之位置及該光反射元件之位置係垂直相對應,且該壓環之內環面係套固該準直鏡之中央凸面與該壓環之底環面係壓緊該準直鏡之環平面。According to the aforementioned features, the accommodating space of the cover further includes a pressure ring structure, the pressure ring structure having a ring recess and a pressure ring located in the ring recess, the ring recess outside the ring surface It is riveted and fixed into the accommodating space of the shell, the ring recess is used to receive the collimator lens and the ring recess is provided with a light reflection hole, and the position of the central convex surface of the collimator lens, the The position of the light reflecting hole and the position of the light reflecting element correspond vertically, and the inner annular surface of the pressing ring sets the central convex surface of the collimating lens and the bottom annular surface of the pressing ring presses the collimating lens Ring plane.

依據前揭特徵,該平台係位在該殼罩內,使該平台形成一嵌槽。According to the pre-release feature, the platform is located in the casing, so that the platform forms an embedded groove.

藉助上揭技術手段,其以該基板整合具有該檢光二極體之自動功率控制IC、該固定座、該雷射二極體、該光反射元件、該殼罩、該準直鏡及該繞射光學元件,又該雷射二極體、具有該檢光二極體之自動功率控制IC及該光反射元件,即可形成可回授控制之該雷射光,再該自動功率控制IC係內建光回授控制及溫度補償,以達到穩定該雷射光的輸出,且該自動功率控制IC係內建該保護電路,進而具有組裝簡易、體積輕薄、生產成本低、該雷射光所射出之功率比例而控制該繞射光學元件之各該光點發射、該光點輸出穩定及可靠輸出之功效增進。By means of the above-mentioned technical means, it integrates the substrate with an automatic power control IC having the light-detecting diode, the fixing base, the laser diode, the light reflecting element, the cover, the collimating mirror and the winding The laser optical element, the laser diode, the automatic power control IC with the photodetector and the light reflecting element can form the laser light that can be feedback controlled, and then the automatic power control IC is built in Optical feedback control and temperature compensation to stabilize the output of the laser light, and the automatic power control IC is built in the protection circuit, and then has the advantages of simple assembly, light and thin, low production cost, and the ratio of the power emitted by the laser light The effect of controlling the emission of each light spot of the diffractive optical element, and the stable and reliable output of the light spot is improved.

首先,請參閱圖3A~3C及圖5~7所示,本發明一種自動功率控制光點發射器30A較佳實施例,其包含:一基板31,本實施例中,該基板31具有一第一表面311及相反側之一第二表面312,該第一表面311係設有一第一導電墊3111及該第二表面312係設有一第二導電墊3121,且該基板31係由電路板所構成,使該基板31內形成內部導線,令該第一導電墊3111與第二導電墊3121相互耦接,該第二導電墊3121係耦接一外部電路O,但不限定於此。First, please refer to FIGS. 3A~3C and FIGS. 5~7, a preferred embodiment of an automatic power control spot emitter 30A of the present invention includes: a substrate 31, in this embodiment, the substrate 31 has a first A surface 311 and a second surface 312 on the opposite side, the first surface 311 is provided with a first conductive pad 3111 and the second surface 312 is provided with a second conductive pad 3121, and the substrate 31 is formed by a circuit board In the structure, internal wires are formed in the substrate 31, so that the first conductive pad 3111 and the second conductive pad 3121 are coupled to each other. The second conductive pad 3121 is coupled to an external circuit O, but it is not limited thereto.

一自動功率控制IC32,其具有一檢光二極體321,以該第一導電墊3111係耦接該自動功率控制IC32,並固定於該基板31上,本實施例中,該自動功率控制IC32係設有一供應電壓接點(P1 )、一接地接點(P2 )、一電流設定接點(P3 )、一檢光二極體輸出接點(P4 )及一雷射二極體輸出接點(P5 ),但不限定於此。An automatic power control IC32, which has a light detecting diode 321, is coupled to the automatic power control IC32 by the first conductive pad 3111, and is fixed on the substrate 31. In this embodiment, the automatic power control IC32 is Equipped with a supply voltage contact (P 1 ), a ground contact (P 2 ), a current setting contact (P 3 ), a photodiode output contact (P 4 ) and a laser diode output Contact (P 5 ), but not limited to this.

一固定座33,係固定在該基板31上。A fixing base 33 is fixed on the substrate 31.

一雷射二極體34,係固定在該固定座33上,並耦接該自動功率控制IC32,本實施例中,該第一導電墊3111係分別以複數個外部導線W耦接該自動功率控制IC32與該雷射二極體晶片34,但不限定於此。A laser diode 34 is fixed on the fixing base 33 and is coupled to the automatic power control IC 32. In this embodiment, the first conductive pad 3111 is respectively coupled to the automatic power by a plurality of external wires W The control IC 32 and the laser diode chip 34 are not limited thereto.

一光反射元件35,係固定在該雷射二極體34之前方。A light reflecting element 35 is fixed in front of the laser diode 34.

一殼罩36,其上依序具有一容置空間361及一位於該容置空間361上方之平台362,並蓋於該基板31上,使該自動功率控制IC32、該雷射二極體34及該光反射元件35係位於該殼罩36內,且該容置空間361及該平台362係位於該自動功率控制IC32、該雷射二極體34及該光反射元件35之上方,本實施例中,該殼罩36之材質係包括選自銅、不鏽鋼或鋁其中任一所構成,但不限定於此。A housing 36 with an accommodating space 361 and a platform 362 above the accommodating space 361 in sequence, and covering the substrate 31 to make the automatic power control IC 32 and the laser diode 34 And the light reflecting element 35 is located in the housing 36, and the accommodating space 361 and the platform 362 are located above the automatic power control IC 32, the laser diode 34 and the light reflecting element 35, this implementation For example, the material of the cover 36 includes any one selected from copper, stainless steel, and aluminum, but it is not limited thereto.

承上,該基板31之第一表面311係設置一金屬外框3112,該金屬外框3112係框住該自動功率控制IC32、該固定座33及該光反射元件35,且該金屬外框3112上係設置一黏著層301,該黏著層301係黏著固定該殼罩36之底面363,本實施例中,該黏著層301之材料係包括選自膠材或金屬其中任一所構成,該膠材係包括選自矽膠(silicone)或環氧樹脂(epoxy)其中任一所構成與該金屬係包括選自金錫(AuSn)、銀銅(AgCu)、錫銀銅(SnAgCu,SAC)或銦(Indium)其中任一所構成,但不限定於此。Above, the first surface 311 of the substrate 31 is provided with a metal outer frame 3112, the metal outer frame 3112 encloses the automatic power control IC 32, the fixing base 33 and the light reflecting element 35, and the metal outer frame 3112 An adhesive layer 301 is provided on the top, and the adhesive layer 301 adheres and fixes the bottom surface 363 of the cover 36. In this embodiment, the material of the adhesive layer 301 includes any one selected from the group consisting of adhesive materials and metals. The material system includes any one selected from silicone or epoxy. The metal system includes gold tin (AuSn), silver copper (AgCu), tin silver copper (SnAgCu, SAC) or indium. (Indium) Any one of them, but not limited to this.

一準直鏡37,係固置在該殼罩36之容置空間361內,使該準直鏡37係位於該自動功率控制IC32、該雷射二極體34及該光反射元件35之上方,本實施例中,該準直鏡37係為單一透鏡或微透鏡陣列其中之一所構成,但不限定於此。A collimating mirror 37 is fixed in the accommodating space 361 of the housing 36 so that the collimating mirror 37 is located above the automatic power control IC 32, the laser diode 34 and the light reflecting element 35 In this embodiment, the collimating mirror 37 is composed of a single lens or a microlens array, but it is not limited to this.

一繞射光學元件38,係黏著於該殼罩36之平台362上,使該繞射光學元件38係位於該準直鏡37之上方。A diffractive optical element 38 is adhered to the platform 362 of the housing 36 so that the diffractive optical element 38 is located above the collimating mirror 37.

另一較佳實施例中,圖4A~4C及圖5~7所示,一種自動功率控制光點發射器30B,其包含:該基板31、該自動功率控制IC32、該固定座33、該雷射二極體34、該光反射元件35、該殼罩36、該準直鏡37、該繞射光學元件38及該殼罩36之容置空間361內更包括一壓環結構39,該壓環結構39具有一環凹座391及一位於該環凹座391內之壓環392所構成,該環凹座391之外環面3911係鉚合固定至該殼罩36之容置空間361內、該環凹座391係承放該準直鏡37及該環凹座391係設有一光反射孔3912,並以該準直鏡37之中央凸面371之位置、該光反射孔3912之位置及該光反射元件35之位置係垂直相對應,且該壓環392之內環面3921係套固該準直鏡37之中央凸面371與該壓環392之底環面3922係壓緊該準直鏡37之環平面372與該平台362係位在該殼罩36內,使該平台362形成一嵌槽,但不限定於此。In another preferred embodiment, as shown in FIGS. 4A-4C and FIGS. 5-7, an automatic power control spot emitter 30B includes: the substrate 31, the automatic power control IC 32, the fixing base 33, the thunder The receiving diode 34, the light reflecting element 35, the housing 36, the collimating mirror 37, the diffractive optical element 38 and the housing space 361 of the housing 36 further include a pressure ring structure 39, the pressure The ring structure 39 has a ring recess 391 and a pressing ring 392 located in the ring recess 391. The outer ring surface 3911 of the ring recess 391 is riveted and fixed into the accommodating space 361 of the shell 36. The ring recess 391 receives the collimator lens 37 and the ring recess 391 is provided with a light reflecting hole 3912, and the position of the central convex surface 371 of the collimating lens 37, the position of the light reflecting hole 3912 and the The position of the light reflecting element 35 corresponds vertically, and the inner annular surface 3921 of the pressing ring 392 sets the central convex surface 371 of the collimating lens 37 and the bottom annular surface 3922 of the pressing ring 392 presses the collimating lens The ring plane 372 of 37 and the platform 362 are located in the housing 36, so that the platform 362 forms an embedded groove, but it is not limited thereto.

基於如此之構成,上述兩個較佳實施例之態樣,其差異僅在於該平台362之高度不同與該壓環結構39之有無,並皆可達到該雷射二極體34係投射一雷射光(L2 )在該光反射元件35上,使該光反射元件35將該雷射光(L2 )係垂直射出於該準直鏡37至該繞射光學元件38,讓該繞射光學元件38可產生複數個光點(C),且該雷射光(L2 )在該殼罩36內經由反射產生一雜散光(N2 ),並以該自動功率控制IC32之檢光二極體321係偵測該雜散光(N2 ),形成一可讀取之檢光訊號(S),該檢光訊號(S)係回授控制該雷射二極體34之輸出而調整該雷射光(L2 )所射出之功率比例,並以該雷射光(L2 )所射出之功率比例而控制該繞射光學元件38之各該光點(C)發射。Based on such a configuration, the difference between the above two preferred embodiments is only that the height of the platform 362 is different from the presence of the pressure ring structure 39, and both can reach the laser diode 34 to project a mine The emitted light (L 2 ) is on the light reflecting element 35, so that the light reflecting element 35 emits the laser light (L 2 ) perpendicularly out of the collimating mirror 37 to the diffractive optical element 38, so that the diffractive optical element 38 can generate a plurality of light spots (C), and the laser light (L 2 ) generates a stray light (N 2 ) through reflection in the housing 36, and the photodetector diode 321 of the automatic power control IC 32 Detect the stray light (N 2 ) to form a readable light detection signal (S). The light detection signal (S) is to feedback control the output of the laser diode 34 to adjust the laser light (L 2 ) The ratio of the emitted power, and the emission of each light spot (C) of the diffractive optical element 38 is controlled by the ratio of the emitted power of the laser light (L 2 ).

此外,該自動功率控制IC32之電路架構更包括該供應電壓接點(P1 )係串聯耦接該檢光二極體321與並聯耦接一電阻(R)及一第一ESD電路(E1 ),且該第一ESD電路(E1 )係並聯耦接一接地端(G),本實施例中,該供應電壓接點(P1 )所供應電壓值為2.8V,但不限定於此。In addition, the circuit architecture of the automatic power control IC 32 further includes that the supply voltage contact (P 1 ) is coupled in series to the photodetector diode 321 and is coupled in parallel to a resistor (R) and a first ESD circuit (E 1 ) In addition, the first ESD circuit (E 1 ) is coupled in parallel to a ground terminal (G). In this embodiment, the voltage supplied by the supply voltage contact (P 1 ) is 2.8V, but it is not limited to this.

一邏輯電路(LE),係分別串聯耦接該電阻(R)及該電流設定接點(P3 )。A logic circuit (LE) is coupled to the resistor (R) and the current setting contact (P 3 ) in series.

一電流放大電路(CA),係串聯耦接該檢光二極體321。A current amplifying circuit (CA) is coupled in series to the light detecting diode 321.

一誤差放大器(EA),係並聯耦接該電流放大電路(CA)。An error amplifier (EA) is coupled in parallel to the current amplification circuit (CA).

一保護電路(U),係並聯耦接該誤差放大器(EA),並具有一參考電壓單元(U1 )、一過溫保護單元(U2 )及一低電壓鎖定單元(U3 ),本實施例中,當該邏輯電路(LE)判斷該電流設定接點(P3 )係設定在高電平時,則該參考電壓單元(U1 )之電壓值係設定為0.55V,及當該邏輯電路(LE)判斷該電流設定接點(P3 )係設定在低電平時,則該參考電壓單元(U1 )之電壓值係設定為1.1V;該過溫保護單元(U2 )之溫度值係設定為大於165度及小於135度;該低電壓鎖定單元(U3 )之電壓值係設定為小於2.3V及大於2.5V,但不限定於此。A protection circuit (U) is coupled in parallel to the error amplifier (EA), and has a reference voltage unit (U 1 ), an over-temperature protection unit (U 2 ) and a low voltage lock unit (U 3 ). In an embodiment, when the logic circuit (LE) determines that the current setting contact (P 3 ) is set at a high level, the voltage value of the reference voltage unit (U 1 ) is set to 0.55V, and when the logic When the circuit (LE) judges that the current setting contact (P 3 ) is set at a low level, the voltage value of the reference voltage unit (U 1 ) is set to 1.1V; the temperature of the over-temperature protection unit (U 2 ) The value is set to be greater than 165 degrees and less than 135 degrees; the voltage value of the low voltage locking unit (U 3 ) is set to be less than 2.3V and greater than 2.5V, but it is not limited to this.

一電晶體(T),係分別串聯耦接該誤差放大器(EA)、該雷射二極體輸出接點(P5 )及該接地端(G)。A transistor (T) is coupled in series to the error amplifier (EA), the laser diode output contact (P 5 ) and the ground (G).

一電流監控電路(CM),係並聯耦接該接地端(G),本實施例中,當該邏輯電路(LE)判斷該電流設定接點(P3 )係設定在高電平時,則該電流監控電路(CM)之電流值係設定為100mA,或當該邏輯電路(LE)判斷該電流設定接點(P3 )係設定在低電平時,則該電流監控電路(CM)之電流值係設定為300mA,但不限定於此。A current monitoring circuit (CM) is coupled in parallel to the ground terminal (G). In this embodiment, when the logic circuit (LE) determines that the current setting contact (P 3 ) is set at a high level, then the The current value of the current monitoring circuit (CM) is set to 100 mA, or when the logic circuit (LE) determines that the current setting contact (P 3 ) is set to a low level, the current value of the current monitoring circuit (CM) The system is set to 300mA, but it is not limited to this.

一第二ESD電路(E2 ),係分別並聯耦接該電流設定接點(P3 )及該接地端(G)。A second ESD circuit (E 2 ) is respectively coupled in parallel to the current setting contact (P 3 ) and the ground terminal (G).

一第三ESD電路(E3 ),係分別並聯耦接該電流設定接點(P3 )及該接地端(G),本實施例中,該第一ESD電路(E1 )、該第二ESD電路(E2 )及該第三ESD電路(E3 )之人體模型(human body model,HBM)值係設定為大於及等於2KV;該第一ESD電路(E1 )、該第二ESD電路(E2 )及該第三ESD電路(E3 )之機械模型(machine model,MM)值係設定為大於及等於200V,但不限定於此。A third ESD circuit (E 3 ) is respectively coupled in parallel to the current setting contact (P 3 ) and the ground terminal (G). In this embodiment, the first ESD circuit (E 1 ) and the second The human body model (HBM) values of the ESD circuit (E 2 ) and the third ESD circuit (E 3 ) are set to be greater than or equal to 2KV; the first ESD circuit (E 1 ) and the second ESD circuit (E 2 ) and the mechanical model (MM) value of the third ESD circuit (E 3 ) are set to be greater than or equal to 200V, but not limited to this.

一可變電阻(VR),係分別串聯耦接該檢光二極體輸出接點(P4 )及該接地端(G)。A variable resistor (VR) is respectively connected in series to the output contact (P 4 ) of the photodetector and the ground (G).

該雷射二極體34係分別串聯耦接該供應電壓接點(P1 )及該雷射二極體輸出接點(P5 ),本實施例中,該可變電阻(VR)之電阻值範圍係設定在35Kohm至1Kohm,該可變電阻(VR)之電阻值係設定為6Kohm,而對應該檢光二極體321之電流值係設定為90uA,但不限定於此。The laser diode 34 is respectively coupled in series to the supply voltage contact (P 1 ) and the laser diode output contact (P 5 ). In this embodiment, the resistance of the variable resistor (VR) The value range is set at 35Kohm to 1Kohm, the resistance value of the variable resistor (VR) is set at 6Kohm, and the current value corresponding to the photodetector diode 321 is set at 90uA, but it is not limited to this.

一緩啟動電路(SS),用以防止啟動時之過電流。A slow start circuit (SS) is used to prevent overcurrent during start-up.

基於如此之構成,其以該基板31整合具有該檢光二極體321之自動功率控制IC32、該固定座33、該雷射二極體34、該光反射元件35、該殼罩36、該準直鏡37及該繞射光學元件38,又該雷射二極體34、具有該檢光二極體321之自動功率控制IC32及該光反射元件35,即可形成可回授控制之該雷射光(L2 ),再該自動功率控制IC32係內建光回授控制及溫度補償,以達到穩定該雷射光(L2 )的輸出,且該自動功率控制IC32係內建該保護電路(U),亦具有過電流保護(over current protection)、過溫保護 (over temperature protection)或暫態保護(transient protection),進而具有組裝簡易、體積輕薄、生產成本低、該雷射光(L2 )所射出之功率比例而控制該繞射光學元件38之各該光點(C)發射、該光點(C)輸出穩定及可靠輸出之功效增進。Based on such a configuration, the substrate 31 integrates the automatic power control IC 32 with the light detecting diode 321, the fixing base 33, the laser diode 34, the light reflecting element 35, the housing 36, and the standard The straight mirror 37 and the diffractive optical element 38, the laser diode 34, the automatic power control IC 32 with the photodetector diode 321, and the light reflecting element 35 can form the laser light that can be feedback controlled (L 2 ), then the automatic power control IC32 is built-in optical feedback control and temperature compensation, so as to stabilize the output of the laser light (L 2 ), and the automatic power control IC32 is built in the protection circuit (U) , Also has over current protection (over current protection), over temperature protection (over temperature protection) or transient protection (transient protection), and further has simple assembly, light and thin, low production cost, the laser light (L 2 ) emitted The power ratio controls the emission of each light spot (C) of the diffractive optical element 38, and the output of the light spot (C) is stable and the efficiency of reliable output is improved.

綜上所述,本發明所揭示之技術手段,確具「新穎性」、「進步性」及「可供產業利用」等發明專利要件,祈請 鈞局惠賜專利,以勵創作,無任德感。In summary, the technical means disclosed by the present invention do have invention patent requirements such as "novelty", "progressiveness", and "availability for industrial use". Virtue.

惟,上述所揭露之圖式、說明,僅為本發明之較佳實施例,大凡熟悉此項技藝人士,依本案精神範疇所作之修飾或等效變化,仍應包括在本案申請專利範圍內。However, the diagrams and descriptions disclosed above are only preferred embodiments of the present invention. Those who are familiar with this art and who make modifications or equivalent changes in accordance with the spirit of this case should still be included in the scope of the patent application in this case.

30A、30B‧‧‧自動功率控制光點發射器301‧‧‧黏著層31‧‧‧基板311‧‧‧第一表面3111‧‧‧第一導電墊3112‧‧‧金屬外框312‧‧‧第二表面3121‧‧‧第二導電墊32‧‧‧自動功率控制IC321‧‧‧檢光二極體33‧‧‧固定座34‧‧‧雷射二極體35‧‧‧光反射元件36‧‧‧殼罩361‧‧‧容置空間362‧‧‧平台363‧‧‧底面37‧‧‧準直鏡371‧‧‧中央凸面372‧‧‧環平面38‧‧‧繞射光學元件39‧‧‧壓環結構391‧‧‧環凹座3911‧‧‧外環面3912‧‧‧光反射孔392‧‧‧壓環3921‧‧‧內環面3922‧‧‧底環面W‧‧‧外部導線O‧‧‧外部電路L2‧‧‧雷射光N2‧‧‧雜散光C‧‧‧光點S‧‧‧檢光訊號T‧‧‧電晶體R‧‧‧電阻G‧‧‧接地端U‧‧‧保護電路U1‧‧‧參考電壓單元U2‧‧‧過溫保護單元U3‧‧‧低電壓鎖定單元P1‧‧‧供應電壓接點P2‧‧‧接地接點P3‧‧‧電流設定接點P4‧‧‧檢光二極體輸出接點P5‧‧‧雷射二極體輸出接點E1‧‧‧第一ESD電路E2‧‧‧第二ESD電路E3‧‧‧第三ESD電路LE‧‧‧邏輯電路CA‧‧‧電流放大電路EA‧‧‧誤差放大器CM‧‧‧電流監控電路VR‧‧‧可變電阻SS‧‧‧緩啟動電路30A, 30B‧‧‧‧Automatic power control spot emitter 301‧‧‧ Adhesive layer 31‧‧‧Substrate 311‧‧‧ First surface 3111‧‧‧ First conductive pad 3112‧‧‧Metal frame 312‧‧‧ Second surface 3121‧‧‧Second conductive pad 32‧‧‧Automatic power control IC321‧‧‧Detector diode 33‧‧‧Fixed base 34‧‧‧Laser diode 35‧‧‧Light reflection element 36‧ ‧‧Housing 361‧‧‧Accommodation space 362‧‧‧Platform 363‧‧‧Bottom surface 37‧‧‧ Collimating mirror 371‧‧‧Central convex surface 372‧‧‧Ring plane 38‧‧‧ Diffractive optical element 39 ‧‧Press ring structure 391‧‧‧ Ring recess 3911‧‧‧Outer ring surface 3912‧‧‧Light reflection hole 392‧‧‧Press ring 3921‧‧‧Inner ring surface 3922‧‧‧Bottom ring surface W‧‧‧ External lead O‧‧‧External circuit L 2 ‧‧‧Laser light N 2 ‧‧‧Stray light C‧‧‧Spot S‧‧‧Light detection signal T‧‧‧Transistor R‧‧‧Resistance G‧‧‧ Ground terminal U‧‧‧Protection circuit U 1 ‧‧‧ Reference voltage unit U 2 ‧‧‧Over-temperature protection unit U 3 ‧‧‧Low voltage lock unit P 1 ‧‧‧ Supply voltage contact P 2 ‧‧‧Ground connection Point P 3 ‧‧‧ Current setting contact P 4 ‧‧‧ Light detection diode output contact P 5 ‧‧‧ Laser diode output contact E 1 ‧‧‧ First ESD circuit E 2 ‧‧‧ Two ESD circuit E 3 ‧‧‧ third ESD circuit LE‧‧‧ logic circuit CA‧‧‧ current amplification circuit EA‧‧‧ error amplifier CM‧‧‧ current monitoring circuit VR‧‧‧ variable resistor SS‧‧‧ Start circuit

圖1係習用雷射二極體模組之示意圖。 圖2係習用點發射器之示意圖。 圖3A係本發明之分解立體圖。 圖3B係本發明之組合立體圖。 圖3C係圖3B中3C-3C之斷面剖視圖。 圖4A係本發明另一較佳實施例之分解立體圖。 圖4B係本發明另一較佳實施例之組合立體圖。 圖4C係圖4B中4C-4C之斷面剖視圖。 圖5係本發明自動功率控制IC之俯視圖。 圖6係本發明自動功率控制IC之電路圖。 圖7係本發明自動功率控制IC之電路架構圖。FIG. 1 is a schematic diagram of a conventional laser diode module. Figure 2 is a schematic diagram of a conventional point transmitter. 3A is an exploded perspective view of the present invention. 3B is a combined perspective view of the present invention. 3C is a cross-sectional view of 3C-3C in FIG. 3B. 4A is an exploded perspective view of another preferred embodiment of the present invention. 4B is a combined perspective view of another preferred embodiment of the present invention. 4C is a cross-sectional view of 4C-4C in FIG. 4B. 5 is a top view of the automatic power control IC of the present invention. 6 is a circuit diagram of the automatic power control IC of the present invention. 7 is a circuit diagram of the automatic power control IC of the present invention.

30A‧‧‧自動功率控制光點發射器 30A‧‧‧Automatic power control light point transmitter

31‧‧‧基板 31‧‧‧ substrate

311‧‧‧第一表面 311‧‧‧First surface

3111‧‧‧第一導電墊 3111‧‧‧The first conductive pad

3112‧‧‧金屬外框 3112‧‧‧Metal frame

312‧‧‧第二表面 312‧‧‧Second surface

3121‧‧‧第二導電墊 3121‧‧‧Second conductive pad

32‧‧‧自動功率控制IC 32‧‧‧Automatic power control IC

321‧‧‧檢光二極體 321‧‧‧Optical diode

33‧‧‧固定座 33‧‧‧Fixed seat

34‧‧‧雷射二極體 34‧‧‧Laser Diode

35‧‧‧光反射元件 35‧‧‧Light reflecting element

36‧‧‧殼罩 36‧‧‧Hood

361‧‧‧容置空間 361‧‧‧accommodation space

362‧‧‧平台 362‧‧‧Platform

363‧‧‧底面 363‧‧‧Bottom

37‧‧‧準直鏡 37‧‧‧collimator lens

371‧‧‧中央凸面 371‧‧‧Central convex

372‧‧‧環平面 372‧‧‧Circle Plane

38‧‧‧繞射光學元件 38‧‧‧diffractive optical element

W‧‧‧外部導線 W‧‧‧External wire

Claims (18)

一種自動功率控制光點發射器,其包含: 一基板; 一自動功率控制IC,其具有一檢光二極體,並固定於該基板上; 一固定座,係固定在該基板上; 一雷射二極體,係固定在該固定座上,並耦接該自動功率控制IC; 一光反射元件,係固定在該雷射二極體之前方; 一殼罩,其上依序具有一容置空間及一位於該容置空間上方之平台,並蓋於該基板上,使該自動功率控制IC、該雷射二極體及該光反射元件係位於該殼罩內,且該容置空間及該平台係位於該自動功率控制IC、該雷射二極體及該光反射元件之上方; 一準直鏡,係固置在該殼罩之容置空間內,使該準直鏡係位於該自動功率控制IC、該雷射二極體及該光反射元件之上方;以及 一繞射光學元件,係黏著於該殼罩之平台上,使該繞射光學元件係位於該準直鏡之上方; 藉此,該雷射二極體係投射一雷射光在該光反射元件上,使該光反射元件將該雷射光係垂直射出於該準直鏡至該繞射光學元件,讓該繞射光學元件可產生複數個光點,且該雷射光在該殼罩內經由反射產生一雜散光,並以該自動功率控制IC之檢光二極體係偵測該雜散光,形成一可讀取之檢光訊號,該檢光訊號係回授控制該雷射二極體之輸出而調整該雷射光所射出之功率比例,並以該雷射光所射出之功率比例而控制該繞射光學元件之各該光點發射。An automatic power control light point transmitter, which comprises: a substrate; an automatic power control IC, which has a light-detecting diode and is fixed on the substrate; a fixing seat is fixed on the substrate; a laser A diode is fixed on the fixing base and is coupled to the automatic power control IC; a light reflecting element is fixed in front of the laser diode; a housing is provided with a housing in sequence The space and a platform above the accommodating space are covered on the substrate so that the automatic power control IC, the laser diode and the light reflecting element are located in the housing, and the accommodating space and The platform is located above the automatic power control IC, the laser diode and the light reflecting element; a collimating mirror is fixed in the accommodating space of the housing so that the collimating mirror is located at the An automatic power control IC, the laser diode and the light reflecting element; and a diffractive optical element, which is adhered to the platform of the housing so that the diffractive optical element is located above the collimating mirror ; By this, the laser diode system projects a laser light on the light reflecting element, so that the light reflecting element perpendicularly emits the laser light system from the collimator lens to the diffractive optical element, so that the diffractive optical The device can generate a plurality of light spots, and the laser light generates a stray light through reflection in the housing, and the stray light is detected by the light detection diode system of the automatic power control IC to form a readable light detection Signal, the light detection signal is to feedback control the output of the laser diode to adjust the power ratio of the laser light, and to control the light of the diffractive optical element according to the power ratio of the laser light Point launch. 如請求項1所述之自動功率控制光點發射器,其中,該自動功率控制IC係設有一供應電壓接點、一接地接點、一電流設定接點、一檢光二極體輸出接點及一雷射二極體輸出接點。The automatic power control light point transmitter as described in claim 1, wherein the automatic power control IC is provided with a supply voltage contact, a ground contact, a current setting contact, a photodiode output contact and A laser diode output contact. 如請求項2所述之自動功率控制光點發射器,其中,該自動功率控制IC之電路架構更包括該供應電壓接點係串聯耦接該檢光二極體與並聯耦接一電阻及一第一ESD電路,且該第一ESD電路係並聯耦接一接地端;一邏輯電路,係分別串聯耦接該電阻及該電流設定接點;一電流放大電路,係串聯耦接該檢光二極體;一誤差放大器,係並聯耦接該電流放大電路;一保護電路,係並聯耦接該誤差放大器,並具有一參考電壓單元、一過溫保護單元及一低電壓鎖定單元;一電晶體,係分別串聯耦接該誤差放大器、該雷射二極體輸出接點及該接地端;一電流監控電路,係並聯耦接該接地端;一第二ESD電路,係分別並聯耦接該電流設定接點及該接地端;一第三ESD電路,係分別並聯耦接該電流設定接點及該接地端;一可變電阻,係分別串聯耦接該檢光二極體輸出接點及該接地端;該雷射二極體係分別串聯耦接該供應電壓接點及該雷射二極體輸出接點。The automatic power control light point transmitter according to claim 2, wherein the circuit architecture of the automatic power control IC further includes the supply voltage contact is coupled in series to the photodetector diode and in parallel to a resistor and a first An ESD circuit, and the first ESD circuit is coupled in parallel to a ground terminal; a logic circuit is coupled in series to the resistor and the current setting contact; a current amplifier circuit is coupled in series to the photodiode An error amplifier is coupled in parallel to the current amplifier circuit; a protection circuit is coupled in parallel to the error amplifier and has a reference voltage unit, an over-temperature protection unit and a low voltage lock unit; a transistor Respectively coupled in series to the error amplifier, the laser diode output contact and the ground terminal; a current monitoring circuit is coupled in parallel to the ground terminal; a second ESD circuit is coupled in parallel to the current setting terminal Point and the ground terminal; a third ESD circuit, which is respectively coupled in parallel to the current setting contact and the ground terminal; a variable resistor, which is respectively coupled in series to the photodiode output contact and the ground terminal; The laser diode system is coupled in series to the supply voltage contact and the laser diode output contact, respectively. 如請求項2所述之自動功率控制光點發射器,其中,該自動功率控制IC之電路架構更包括一緩啟動電路,用以防止啟動時之過電流。The automatic power control light point transmitter as described in claim 2, wherein the circuit structure of the automatic power control IC further includes a slow start circuit to prevent overcurrent during start. 如請求項3所述之自動功率控制光點發射器,其中,當該邏輯電路判斷該電流設定接點係設定在高電平時,則該電流監控電路之電流值係設定為100mA,或當該邏輯電路判斷該電流設定接點係設定在低電平時,則該電流監控電路之電流值係設定為300mA。The automatic power control light point transmitter as described in claim 3, wherein, when the logic circuit determines that the current setting contact is set at a high level, the current value of the current monitoring circuit is set to 100 mA, or when the When the logic circuit judges that the current setting contact is set at a low level, the current value of the current monitoring circuit is set to 300 mA. 如請求項3所述之自動功率控制光點發射器,其中,當該邏輯電路判斷該電流設定接點係設定在高電平時,則該參考電壓單元之電壓值係設定為0.55V,及當該邏輯電路判斷該電流設定接點係設定在低電平時,則該參考電壓單元之電壓值係設定為1.1V;該過溫保護單元之溫度值係設定為大於165度及小於135度;該低電壓鎖定單元之電壓值係設定為小於2.3V及大於2.5V。The automatic power control light point transmitter as described in claim 3, wherein when the logic circuit determines that the current setting contact is set at a high level, the voltage value of the reference voltage unit is set to 0.55V, and when When the logic circuit determines that the current setting contact is set at a low level, the voltage value of the reference voltage unit is set to 1.1V; the temperature value of the over-temperature protection unit is set to be greater than 165 degrees and less than 135 degrees; The voltage value of the low voltage lock unit is set to be less than 2.3V and greater than 2.5V. 如請求項3所述之自動功率控制光點發射器,其中,該可變電阻之電阻值範圍係設定在35Kohm至1Kohm,該可變電阻之電阻值係設定為6Kohm,而對應該檢光二極體之電流值係設定為90uA。The automatic power control light point transmitter as described in claim 3, wherein the resistance value range of the variable resistor is set at 35Kohm to 1Kohm, the resistance value of the variable resistor is set at 6Kohm, and corresponds to the photodiode The current value of the body is set to 90uA. 如請求項3所述之自動功率控制光點發射器,其中,該第一ESD電路、該第二ESD電路及該第三ESD電路之人體模型值係設定為大於及等於2KV;該第一ESD電路、該第二ESD電路及該第三ESD電路之機械模型值係設定為大於及等於200V。The automatic power control light point transmitter according to claim 3, wherein the human body model values of the first ESD circuit, the second ESD circuit and the third ESD circuit are set to be greater than or equal to 2KV; the first ESD The mechanical model values of the circuit, the second ESD circuit and the third ESD circuit are set to be greater than or equal to 200V. 如請求項1所述之自動功率控制光點發射器,其中,該基板具有一第一表面及相反側之一第二表面,該第一表面係設有一第一導電墊及該第二表面係設有一第二導電墊,且該基板係由電路板所構成,使該基板內形成內部導線,令該第一導電墊與第二導電墊相互耦接,該第一導電墊係分別以複數個外部導線耦接該自動功率控制IC與該雷射二極體晶片及該第二導電墊係耦接一外部電路。The automatic power control light spot emitter according to claim 1, wherein the substrate has a first surface and a second surface on the opposite side, the first surface is provided with a first conductive pad and the second surface system A second conductive pad is provided, and the substrate is composed of a circuit board, so that internal wires are formed in the substrate, so that the first conductive pad and the second conductive pad are coupled to each other, and the first conductive pad is composed of a plurality of An external wire is coupled to the automatic power control IC, the laser diode chip and the second conductive pad are coupled to an external circuit. 如請求項1所述之自動功率控制光點發射器,其中,該準直鏡係為單一透鏡或微透鏡陣列其中任一所構成。The automatic power control light spot emitter according to claim 1, wherein the collimating lens is formed by any one of a single lens or a micro lens array. 如請求項1所述之自動功率控制光點發射器,其中,該殼罩之材質係包括選自銅、不鏽鋼或鋁其中任一所構成。The automatic power control light point transmitter according to claim 1, wherein the material of the cover includes any one selected from copper, stainless steel or aluminum. 如請求項1所述之自動功率控制光點發射器,其中,該基板之第一表面係設置一金屬外框,該金屬外框係框住該自動功率控制IC、該固定座及該光反射元件,且該金屬外框上係設置一黏著層,該黏著層係黏著固定該殼罩之底面。The automatic power control light point transmitter according to claim 1, wherein a metal frame is provided on the first surface of the substrate, and the metal frame surrounds the automatic power control IC, the fixing base and the light reflection Components, and an adhesive layer is provided on the metal outer frame, and the adhesive layer is used to adhere and fix the bottom surface of the casing. 如請求項12所述之自動功率控制光點發射器,其中,該金屬外框之材料係包括選自鎳金或鎳鈀金其中任一所構成。The automatic power control light spot emitter according to claim 12, wherein the material of the metal frame includes any one selected from nickel gold or nickel palladium gold. 如請求項12所述之自動功率控制光點發射器,其中,該黏著層之材料係包括選自膠材或金屬其中任一所構成。The automatic power control light spot emitter according to claim 12, wherein the material of the adhesive layer comprises any one selected from the group consisting of glue materials and metals. 如請求項14所述之自動功率控制光點發射器,其中,該膠材係包括選自矽膠或環氧樹脂其中任一所構成。The automatic power control light point transmitter as claimed in claim 14, wherein the glue material comprises any one selected from silicone glue or epoxy resin. 如請求項14所述之自動功率控制光點發射器,其中,該金屬係包括選自金錫、銀銅、錫銀銅或銦其中任一所構成。The automatic power control light point transmitter according to claim 14, wherein the metal comprises any one selected from gold tin, silver copper, tin silver copper, or indium. 如請求項1所述之自動功率控制光點發射器,其中,該殼罩之容置空間內更包括一壓環結構,該壓環結構具有一環凹座及一位於該環凹座內之壓環所構成,該環凹座之外環面係鉚合固定至該殼罩之容置空間內、該環凹座係承放該準直鏡及該環凹座係設有一光反射孔,並以該準直鏡之中央凸面之位置、該光反射孔之位置及該光反射元件之位置係垂直相對應,且該壓環之內環面係套固該準直鏡之中央凸面與該壓環之底環面係壓緊該準直鏡之環平面。The automatic power control light point transmitter according to claim 1, wherein the housing space of the housing further includes a pressure ring structure, the pressure ring structure has a ring recess and a pressure located in the ring recess It is composed of a ring, the outer ring surface of the ring recess is riveted and fixed into the accommodating space of the shell, the ring recess is to receive the collimator lens and the ring recess is provided with a light reflecting hole, and The position of the central convex surface of the collimating mirror, the position of the light reflecting hole and the position of the light reflecting element are vertically corresponding, and the inner annular surface of the pressing ring sets the central convex surface of the collimating lens and the pressing The bottom ring surface of the ring presses the ring plane of the collimating lens. 如請求項1所述之自動功率控制光點發射器,其中,該平台係位在該殼罩內,使該平台形成一嵌槽。The automatic power control light point transmitter as claimed in claim 1, wherein the platform is located in the casing, so that the platform forms an embedded groove.
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