TW202004557A - Foreign matter inspection device and foreign matter inspection method - Google Patents

Abstract

To increase the degree of precision to which foreign matter is detected when inspecting for foreign matter adhered to an object for inspection, by means of enlarging an effective inspection area. A foreign matter inspection device (1) according to the present invention, which inspects for foreign matter adhered to a surface of an object for inspection (4), wherein said foreign matter inspection device (1) comprises: light source parts (3a, 3b) which irradiate illumination light (L) onto the object for inspection (4), said illumination light (L) being a complementary color to a surface color of the object for inspection (4); imaging parts (2a-2r) which image the object for inspection (4); and a detection part which detects the foreign matter on the basis of images imaged by the imaging parts (2a-2r).

Description

Foreign body inspection device and foreign body inspection method

The invention relates to a foreign object inspection device and a foreign object inspection method, which inspects foreign objects attached to various substrates such as liquid crystal color filters.

It is known that in the manufacturing process of semiconductors, the manufacturing process of flat panel displays such as liquid crystal display devices, etc., for the purpose of improving the accuracy of products, etc., foreign objects attached to the glass substrate are detected in the manufacturing process.

Patent Document 1 discloses a foreign object detection device that focuses the photographic means on the surface of the object under inspection for photography, detects foreign objects on the surface of the object under inspection from the photographed image, and aligns the focus of the photographic means Take photographs on the back of the object under inspection, and detect foreign objects on the back of the object under inspection from the photographed images. Patent Document 2 discloses a foreign object inspection device capable of inspecting foreign objects attached to the front and back surfaces of a glass substrate with high accuracy. Therefore, the foreign object inspection device can switch between the detection of the foreign object attached to the surface of the glass substrate and the detection of the foreign object attached to the back surface of the glass substrate by changing the relative position of the light emitting position and the light receiving position .

[Prior Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2000-74849

Patent Document 2: Japanese Patent Laid-Open No. 2016-133357

In the manufacturing process of the color filter mounted on the liquid crystal display device, it is necessary to check whether a foreign object adheres to the coated photoresist in a state where the photoresist is applied. In the case where a foreign object is attached to the photoresist, it may cause damage to the photomask disposed near the photoresist surface or damage the quality of the color filter itself during the exposure in the subsequent steps. In particular, due to the high price of the photomask, when damage is caused by foreign objects, the economic loss is considerable.

In addition, in the color filter in the process of being manufactured as an inspection object, an electrode may be provided on the back surface of the glass substrate, or a hole may be processed on the glass substrate. In addition, the color filter in the manufacturing process is inspected in a state where it is installed on a base, etc., but the base itself may be damaged. In the inspection in the manufacturing process of the color filter, it is necessary to inspect the foreign matter attached to the photoresist side (surface) coated on the glass substrate. However, foreign objects, damages, and holes in electrodes, holes, or pedestals provided on the glass substrate may also be photographed during the inspection of the surface, thereby making it difficult to distinguish them from foreign objects. Therefore, when performing image processing on the photographed images, masking the areas that are not known in advance such as such electrodes, holes, damage to the base, caves, etc. will be performed instead of Use it as an area to inspect foreign objects.

However, if the non-sensing area increases, the area for inspecting foreign objects will shrink. In addition, even if foreign matter is attached to the non-sensing area, it will still be regarded as unattached foreign matter. As mentioned above, it may cause damage to the photomask or damage the quality of the manufactured product.

Therefore, the foreign matter inspection device of the present invention adopts the first configuration described below. A foreign object inspection device is for inspecting foreign objects adhering to the surface of an inspection object; it includes: a light source unit that illuminates the inspection object with illumination light in a complementary color relationship with the surface color of the inspection object; The inspection object is photographed; and a detection unit that detects foreign objects based on the image photographed by the imaging unit.

Furthermore, the foreign object inspection device (second configuration) of the present invention is the first configuration in which the detection unit detects a foreign object using a mask specifying a non-sensing area, which is excluded from foreign objects in the photographed image For areas other than the test object, the non-sensing area is smaller than the size of the structure on the back of the test object or the hole provided in the test object.

Furthermore, the foreign object inspection device (third configuration) of the present invention is the second configuration, and the mask is photographed by illuminating the inspection object with the illumination light in a complementary color relationship with the surface color of the inspection object The person formed by the image.

Furthermore, in the foreign object inspection device (fourth configuration) of the present invention, in the second or third configuration, the detection unit changes the mask according to the surface color of the inspection object.

Furthermore, the foreign object inspection device (fifth configuration) of the present invention is any one of the first to fourth configurations, and the illumination light irradiated from the light source is incoherent light.

Furthermore, the foreign object inspection device (sixth configuration) of the present invention is any one of the first to fifth configurations, the inspection object is a substrate coated with a color photoresist film on the surface, the illumination light and the color The color of the photoresist film becomes a complementary color relationship.

Furthermore, the foreign material inspection device (seventh configuration) of the present invention is any one of the first to sixth configurations, and the light source section changes the color of the illumination light according to the surface color of the inspection object.

In addition, the foreign object inspection device (eighth configuration) of the present invention is any one of the first to seventh configurations, and the imaging unit is disposed at a position that does not receive the regular reflection light reflected by the inspection object, and is The position to receive the scattered light of the foreign matter attached to the surface of the inspection object.

In addition, the foreign object inspection method (ninth configuration) of the present invention is to inspect a foreign object adhering to the surface of the inspection object; wherein the illumination light in a complementary color relationship with the surface color of the inspection object is irradiated to the inspection object, The inspection object is photographed, and a foreign object is detected based on the image photographed by the photographing unit.

According to the foreign object inspection device and the foreign object inspection method of the present invention, by illuminating the inspection object with the illumination light having a complementary color relationship with the surface color of the inspection object, and inspecting the foreign object based on the photographed image, it can be reduced or unnecessary The non-sensing area for the electrode located on the back of the inspection object, the hole provided in the inspection object, the damage to the base, etc., can expand the area for inspection of foreign objects, and can improve the inspection accuracy.

1‧‧‧Foreign object inspection device

2a~2r‧‧‧Photography Department

3a, 3b ‧‧‧ LED linear light source (light source part)

4‧‧‧ Inspection object

5‧‧‧Dock

5a‧‧‧Base hole

6a, 6b‧‧‧Mask

21‧‧‧Photographic

22‧‧‧Optical system

23‧‧‧Photographic image

23b‧‧‧electrode image

41‧‧‧Transparent substrate

42‧‧‧ Black Matrix

43R, 43G, 43B‧‧‧ color resist

44‧‧‧mask

44a‧‧‧Opening

45a‧‧‧hole

45b‧‧‧electrode

61a, 61b, 61b’‧‧‧non-sensitive area

C1‧‧‧Image Center

C2‧‧‧ Optical axis

E‧‧‧angle

L‧‧‧Light

P‧‧‧ photography range

R1‧‧‧ Effective inspection area

R2‧‧‧Invalid inspection area

S(S1~S6)‧‧‧ tiny spherical particles

T‧‧‧ photography range

FIG. 1 is a perspective view showing the configuration of a foreign matter inspection device of this embodiment.

FIG. 2 is a side view showing the configuration of the foreign matter inspection device of this embodiment.

3(A) to (F) are diagrams showing the manufacturing steps of the color filter which is the inspection object of this embodiment.

4(A) to (C) are color phase rings for explaining the relationship between the color of the illumination light used in this embodiment and the color of the color photoresist (surface color of the inspection object).

5(A) and (B) are schematic diagrams for explaining Mie Scattering.

Fig. 6 is a photographic image using bead balls for photography.

FIG. 7 is a side view for explaining the photographic structure of the foreign matter inspection apparatus of this embodiment.

FIG. 8 is a schematic diagram for explaining the inspection target area in the photographic image of this embodiment.

9(A) to (D) are schematic diagrams for explaining the mask used in the image processing of this embodiment.

FIG. 10 is a flowchart showing the foreign matter inspection procedure of this embodiment.

FIG. 1 is a perspective view showing the configuration of a foreign matter inspection device 1 of this embodiment. The foreign object inspection device of this embodiment is configured to include: LED (Light Emitting Diode) linear light sources 3a, 3b (equivalent to the "light source unit" of the present invention), which illuminates the inspection object provided on the base 5 4; the photographing section 2a~2r, which photographs the illuminated inspection object 4; and the information processing device (not shown, which corresponds to the "detection section" of the present invention), which compares the pictures photographed by the photographing section 2a~2r Image processing is performed to detect foreign objects attached to the surface of the inspection object 4.

The inspection object 4 of the present embodiment is, for example, a transparent substrate (glass substrate, etc.) coated with a color photoresist on the surface during the manufacturing process of the color filter. The manufacturing steps of the color filter will be described in detail later. In addition, the foreign object inspection apparatus 1 does not limit the inspection object 4 to the color filter in the middle of the manufacturing process, and can also be used in various fields using a transparent substrate.

The imaging units 2a to 2r are arranged above the inspection object 4 in a matrix. In FIG. 1, the photographing range P of the photographing unit 2k is displayed with diagonal lines. In this embodiment, a part of the imaging range P is used as an effective inspection area, and the remaining imaging range is not used for detection of foreign objects (as an invalid inspection area). The imaging sections 2a to 2r arranged in a matrix form can be arranged so that part of each effective inspection area overlaps, so that the entire inspection object 4 can be used as the inspection object. In this way, by taking pictures with the photography sections 2a to 2r, the entirety of the inspection object 4 can be checked. In addition, it is also possible to inspect the entire area of the inspection object 4 by photographing a partial area of the inspection object 4 and moving the inspection object 4 or moving the photographing units 2a to 2r. In addition, the number and arrangement of the photographing sections 2a to 2r are not limited to the form shown in FIG. 1, but can be appropriately determined according to various conditions such as the size and shape of the inspection object 4.

The LED line light sources 3a and 3b as the light source section irradiate the illumination light L toward the surface of the inspection object 4 from the lateral direction of the inspection object 4. In order to detect foreign objects adhering to the surface of the inspection object 4, the photographing units 2a to 2r of this embodiment are directed at the angle of receiving the scattered light generated by the foreign objects but not receiving the illumination light L of the regular reflection light reflected by the inspection object 4 Angle configuration. According to such an arrangement, scattered light generated from a foreign object can be received without being hindered by regular reflected light, and the accuracy of foreign object detection can be improved.

Preferably, the light source section does not use coherent light such as laser light, but uses incoherent light such as the LED line light sources 3a, 3b or fluorescent lamps of the present embodiment. In the case of using coherent light, structures such as electrodes on the back surface of the inspection object or holes provided in the inspection object are photographed at actual size. On the other hand, by using incoherent light as the illumination light, and selecting the color of the illumination light, to suppress the amount of light transmitted to the inspection object, as a result, it is possible to identify (observe) the location of the inspection object smaller than the actual size Structures such as electrodes on the back or holes provided in the inspection object can expand the inspection object area.

FIG. 2 is a side view showing the configuration of the foreign matter inspection apparatus 1 of this embodiment. FIG. 2 is a side view of the row of photographing sections 2a to 2f in FIG. The LED line light sources 3a and 3b irradiate the illumination light L toward the surface of the inspection object 4 from the lateral direction. Ideally, the illumination light L is preferably incident substantially parallel to the surface of the inspection object 4, that is, the light is incident so as to irradiate only the foreign matter located on the surface of the inspection object 4. However, considering that the surface of the inspection object 4 does not become completely flat due to the strain of the inspection object 4 or the base 5, it needs to be slightly inclined. The inclination angle of the illumination light L with respect to the surface of the inspection object 4 is set to be 0 degrees in a state parallel to the XY plane, and is preferably inclined toward the inspection object 4 within the range of 0 degrees to 5 degrees. More preferably, it is within 0 degrees to 3 degrees. Furthermore, in FIG. 2, the tilt angle of the illumination light L is exaggerated and displayed. As described above, the photographing units 2a to 2f of this embodiment are directed at an angle that receives scattered light from foreign objects attached to the surface of the inspection object 4 but does not receive the illuminating light L and is reflected by the regular reflection light of the inspection object 4 Configuration.

In order to receive the scattered light of the illumination light L of the LED line light source 3a due to foreign objects, the imaging sections 2a to 2c are inclined on the XZ plane with the vertical direction (Z-axis direction) of the inspection object 4 by an angle E (1 degree <E <20 degrees) configuration. On the other hand, in order to receive the scattered light of the illumination light L of the LED line light source 3b due to foreign objects, the imaging units 2d to 2f are arranged on the XZ plane at an angle E different from the imaging units 2a to 2c. With this arrangement, the photographing sections 2a to 2c mainly receive the scattered light of the illumination light L of the LED linear light source 3a scattered by foreign objects, and are not easily affected by the regular reflected light of the LED linear light sources 3a and 3b. In addition, the photographing sections 2d to 2f mainly receive the scattered light of the illumination light L of the LED linear light source 3b scattered by foreign objects, and are not easily affected by the regular reflected light of the LED linear light sources 3a and 3b. In addition, although not shown, the imaging units 2a to 2f are oriented in the vertical direction in the YZ plane.

In this embodiment, the color filter used in the liquid crystal display device is the inspection object 4. In particular, the color filter in the middle of the manufacturing process is inspected for foreign objects attached to the surface. FIG. 3 is a diagram showing the manufacturing steps of the color filter. As shown in FIG. 3(A), a black matrix 42 is formed on a transparent substrate 41 such as a glass substrate. The formation of the black matrix 42 is the same as the color photoresist 43R described later, and is performed by exposure and development, but the description thereof is omitted here. As shown in FIG. 3(B), a red color photoresist 43R is coated on the transparent substrate 41 on which the black matrix 42 is formed. The foreign object inspection apparatus 1 of this embodiment makes the state to which the color photoresist 43R is applied the inspection object 4.

As shown in FIG. 3(C), after applying the color photoresist 43R, although the photomask 44 is disposed above for exposure, when a foreign object adheres to the color photoresist 43R, the photomask 44 may be damaged by the foreign object. Due to the high price of the photomask 44, the economic loss due to damage is considerable. In addition, in the case where the color filter 44 continues to be manufactured without paying attention to the damage of the photomask 44 caused by foreign objects, it may cause a defect in the color filter itself. The defects of the color filter may cause deterioration of the display image of the liquid crystal display device, for example.

Ultraviolet rays are irradiated through the opening 44a provided in the photomask 44 to inactivate the color photoresist 43R at the position of the opening 44a. Then, after removing unnecessary portions of the color photoresist 43R with a developing solution, baking is performed to harden the remaining color photoresist 43R. FIG. 3(D) is a diagram showing the color photoresist 43R after being hardened. For the green color photoresist 43G, the hardened color photoresist 43G is added as shown in FIG. 3(E) by performing the steps of FIGS. 3(B) and 3(C). In addition, for the blue color photoresist 43B, by performing the steps of FIG. 3(B) and FIG. 3(C), as shown in FIG. 3(E), the hardened color photoresist 43B is added. The foreign object inspection device 1 of the present embodiment performs inspection of foreign objects adhering to the surface of the state where the green color photoresist 43G and the blue color photoresist 43B are applied as the inspection object 4.

FIG. 4 is a hue ring for explaining the relationship between the color of the illumination light L used in the foreign object inspection apparatus 1 of the present embodiment and the color resist color of the surface color of the inspection object 4. In this embodiment, a hue circle divided into 24 blocks is used. FIG. 4(A) is the case of the color photoresist 43G, and the photoresist color is red as indicated by the arrow. In the hue circle, the colors at the opposite positions become complementary colors. Among them, the complementary color refers to the color that produces a white light when a certain color light and its complementary color light are mixed and added.

In this embodiment, by selecting according to the surface color of the inspection object 4 such that the color of the illumination light L satisfies the predetermined conditions, it is possible to identify (observe) structures such as electrodes on the back of the inspection object 4 smaller than the actual size , Or holes provided in the inspection object 4, or damage to the surface of the base 5, etc. It is known that when white light or the like is used as the illumination light L, the damage to the structure, hole, and base 5 of the inspection object 4 described above is observed at the actual size on the photographic image. Therefore, it is necessary to provide a mask with a non-sensing area according to the actual size to these structures, holes, and damages. In the non-sensing area, the surface of the inspection object 4 cannot be inspected. Therefore, if foreign objects are attached to the non-sensing area, inspection may be missed. On the other hand, in this embodiment, by using the color of the illumination light L that satisfies the predetermined conditions, the non-sensing area can be reduced to expand the area for inspecting foreign objects.

As the condition of the color of the illumination light L, it is necessary to have a complementary color relationship with the surface color of the inspection object 4 (in this embodiment, the photoresist color). Among them, the complementary color relationship refers to a color having a center frequency within a predetermined range of complementary colors of the surface color of the inspection object 4 in the hue circle. For example, in the case of the color photoresist 43G shown in FIG. 4(A), in the hue circle divided into 24 blocks, use a predetermined range from the position of the complementary color arranged opposite to the photoresist color (red), That is, the illumination light L having the center frequency in the color in the range of the four blocks before and after it. In this embodiment, the illumination light L having the center frequency in the color at the position indicated by the arrow is used. In addition, the case of the color photoresist 43G shown in FIG. 4(B) (the color of the photoresist is green) and the case of the color photoresist 43B shown in FIG. 4(C) (the color of the photoresist is blue) are also the same , Used for the illumination light L with center frequency in the color within a predetermined range of the complementary color of the photoresist color.

As described in FIG. 2, in the present embodiment, in the photographing sections 2 a to 2 r, by receiving the scattered light generated by the foreign matter, the foreign matter can be effectively detected. Here, the scattering of light generated by foreign matter will be described. It is known that in the case where light is incident on minute particles that are foreign substances, the scattering morphology varies depending on the size of the minute particles. The scattering generated by the fine particles is very different according to the relationship between the size of the fine particles and the wavelength of light. When the size of the fine particles is 1/10 of the wavelength of light, Rayleigh scattering occurs. In addition, When the size of the fine particles exceeds the above size, Mie scattering occurs. In the present embodiment, the foreign object to be detected is a foreign object of a size such as fragments of the glass substrate and the size of Mie scattering.

FIG. 5 is a schematic diagram for explaining Mie scattering, and is a schematic diagram showing the scattering state when the illumination light L is incident on the minute spherical particles S. FIG. FIG. 5(A) is a top view showing the state of scattered light, and FIG. 5(B) is a side view thereof. Among them, the surface of the inspection object 4 is set to the XY plane, the axis orthogonal to the surface of the inspection object is set to the Z axis, and the traveling direction of the illumination light L is set to the positive direction of the X axis. The scattered light appears as arcs in the positive and negative directions of the X axis. In addition, since the scattered light observed is larger than the size of the fine spherical particles S, by observing the scattered light, foreign objects attached to the inspection object can be effectively detected.

FIG. 6 is a photographic image 23 (binarization has been completed) taken using the foreign object inspection apparatus 1 of this embodiment. Here, two transparent spherical particles S1 and S2 (fine beads) are attached to the surface of the inspection object 4 and photographed. The circle shown by the dotted line shows the actual positions of the minute spherical particles S1, S2, and actually does not appear on the photographic image 23. The photographed image 23 is the same as that in FIG. 5, and the illumination light L is incident on the fine spherical particles S1 and S2 in the positive direction of the X axis, and the binarized image is completed. Scattered light in black appears in the positive and negative X-axis directions of the tiny spherical particles S1 and S2. In this way, the scattered light from the fine spherical particles S1, S2 is shown to be larger than the actual size of the fine spherical particles S1, S2, and therefore it is effective for the inspection of foreign objects adhering to the surface of the inspection object 4. In addition, in FIGS. 5 and 6, the fine spherical particles S are used as foreign substances, because the observation of scattered light is most difficult in a spherical shape. The actual foreign object is usually a shape different from the spherical shape such as glass fragments. In this shape, scattered light will obviously appear, which makes observation easier.

7 is a side view for explaining the photographic structure of the foreign matter inspection apparatus 1 of the present embodiment. Among them, in the configuration described with reference to FIGS. 1 and 2, one imaging section 2 a is used as an example to describe the imaging configuration. In the present embodiment, the surface of the inspection object 4 is illuminated with the LED line light source 3a extending in the Y-axis direction, and the scattered light caused by the scattering of foreign materials attached to the inspection object 4 is captured by the imaging unit 2a. Among them, as a sample of foreign matter, six fine spherical particles S1 to S6 are arranged at equal intervals in the X-axis direction. The minute spherical particles S1 to S6 are arranged so as to enter the imaging range T of the imaging unit 2a. In FIG. 7, the illumination light L is incident substantially parallel to the surface of the inspection object 4, but as described in FIG. 2, it may be slightly inclined toward the inspection object 4 side.

In the present embodiment, it is preferable to clearly capture the scattered light generated by the foreign object in the discovery of the foreign object. In order to receive the scattered light of the fine spherical particles S1~S6 as much as possible, it is preferable that the scattered light generated on the side opposite to the incident side of the illumination light L in the fine spherical particles S1~S6 is to increase the amount of light received , The angle E of the photographing section 2a can be increased. However, when the angle E is increased, not only the scattered light is incident, but also the regular reflected light of the illumination light L is incident, thereby causing the scattered light to be hindered by the regular reflected light. Therefore, in the present embodiment, the angle E of the imaging unit 2a is set to an angle (in the range of 1 degree to 20 degrees) in which the regular reflection light of the illumination light L from the LED line light source 3a does not enter.

In addition, in the case where the ordinary imaging section 2a using the optical axis of the optical system 22 is in a perpendicular relationship to the imaging surface 21, within the imaging range T of the imaging section 2a, along the positive direction of the X axis, scattered light is received The amount becomes smaller. Therefore, in this embodiment, instead of using the imaging range T completely, the effective inspection region R1 located on the side of the LED line light source 3a is used as the object of detection of foreign objects. In addition, the invalid inspection region R2 located at a position away from the LED line light source 3a is not used as the object of detection of foreign objects. Therefore, as explained in FIGS. 1 and 2, when a plurality of imaging units 2 a-2 r are used to inspect the entirety of the inspection object 4, the imaging units 2 a-2 r are arranged in such a manner that a portion of the effective inspection region R1 overlaps.

FIG. 8 is a schematic diagram for explaining the effective inspection region R1 in the photographic image 23 of this embodiment. As described in FIG. 7, in the present embodiment, the region in the imaging range T that is located on the side where the illumination light L is incident from the LED line light source 3 a is used as the effective inspection region R1 for foreign object inspection. In addition, the remaining area is regarded as an invalid inspection area R2 that is not used for inspection of foreign objects. As can be seen from FIG. 8, in the case where the imaging unit 2 a whose optical axis of the optical system 22 is orthogonal to the imaging surface 21 is used, the position of the optical axis C2 in the imaging image 23 is located at the center of the imaging image 23. On the other hand, since the image center C1 of the effective inspection area R1 cuts the invalid inspection area R2 from the photographed image 23, it shifts toward the side where the illumination light L enters.

FIG. 9 is a schematic diagram for explaining the mask used in the image processing of this embodiment. The mask is used to specify a non-sensing area in the photographed image 23 that is not used for inspection of foreign objects. The non-sensing area is located at a position of a previously known structure, hole, damage, etc. in the inspection object 4, and its purpose is not to mistakenly detect it as a foreign object. In this embodiment, by using incoherent light as the illumination light L and selecting its color, in particular, it is possible to identify (observe) structures such as electrodes on the back of the inspection object 4 and holes provided in the inspection object 4 smaller than the actual size 3. Damage to the surface of the base 5 etc. Therefore, the non-sensing area in the mask can be reduced, or the non-sensing area can be eliminated, and the area other than the non-sensing area, that is, the area to be inspected for foreign objects can be expanded.

9(A) is a plan view schematically showing an electrode 45b provided on the back surface of the inspection object 4, a hole 45a penetrating the inspection object 4, and a cross-sectional view at the position of the hole 45a. The coordinates shown in FIG. 9 are the same as those in FIGS. 1 and 2, and the illumination light L is irradiated on the surface of the inspection object 4 from the positive direction of the Z axis. The electrode 45b is located on the back side opposite to the side where the illumination light L is irradiated.

When photographing using white light as the illumination light L, the hole 45a and the electrode 45b are observed at actual sizes. Therefore, as shown in FIG. 9(B), the non-sensitive areas 61a and 61b in the mask 6a when white light is used are set to the same size as the hole 45a and the electrode 45b of FIG. 9(A), or Set aside to be slightly larger. The area other than the non-sensing areas 61a and 61b in the mask 6a of FIG. 9(B) is used as a foreign object inspection object. Therefore, when a foreign object adheres to the non-sensing areas 61a and 61b, the foreign object will not be detected.

On the other hand, in the foreign object inspection apparatus 1 of this embodiment, as also explained in FIG. 4, by selecting the color of the illumination light L according to the surface color of the inspection object 4, the penetration of the illumination light L toward the inspection object can be reduced The amount of light, the amount of reflection (brightness) of the electrode 45b on the back of the test object 4, the hole 45a provided in the test object 4, and the base hole 5a provided in the base 5 can be set to approximately zero, or the amount of reflection can be adjusted reduce. In this embodiment, although a threshold value is set for each pixel of the photographed image, and binarization is performed with brightness above the threshold value, by binarization, the electrode 45b, which is located on the back surface of the inspection object 4, In the hole 45a provided in the inspection object 4 and the base hole 5a provided in the base 5, the brightness of the entire area or a portion of the area becomes below the threshold value, and the entire area or a portion of the area is excluded from recognition (observation) Outside the object. For example, in FIG. 9(A), although the illumination light L is incident from the positive direction of the X axis, the incident illumination light L is reflected at the end of the electrode 45b (the side where the value of X is larger), making the brightness more The other part of the electrode 45b is stronger. Therefore, the end portion of the electrode 45b on the side where the illumination light is incident will remain as a recognizable (observable) image even after binarization.

The mask 6b used in the foreign matter inspection apparatus 1 of this embodiment is produced based on the binarized photographic image 23 shown in FIG. 9(C), and becomes the form shown in FIG. 9(D). In the mask 6b, as shown in FIG. 9(C), since the hole 45a is deleted in the photographed image 23, the non-sensing area 61a for the hole 45a is unnecessary. In addition, as for the electrode 45b, it is sufficient to use the non-sensing area 61b' which is smaller than the actual size of the electrode 45b. Therefore, by comparing the white light mask 6a of FIG. 9(B) with the mask 6b of this embodiment of FIG. 9(D), it can be seen that the non-sensing area can be suppressed to be small, and the remaining area can be sought as a foreign object The area subject to inspection is expanded. In addition, as image processing when performing foreign object detection, it is not necessary to binarize the captured image 23, but n-value conversion (n≧3) may be performed instead of binarization.

The mask 6b used in the image processing of the foreign object inspection apparatus 1 is made by taking an image of the inspection object 4 that has been sufficiently confirmed that no foreign object is attached, and using the captured image. In addition, even if the inspection object 4 has the same configuration, when the surface color such as the color of the photoresist and the color of the illumination light L are different, the size of the electrode image 23b and the like also change. The surface color of the object 4 is made.

FIG. 10 is a flowchart showing the foreign matter inspection procedure of the foreign matter inspection apparatus 1 of this embodiment. In this embodiment, the color filter in the middle of the manufacturing process described in FIG. 3 is the inspection object 4. In the foreign matter inspection step, first, the inspection object 4 is installed on the base 5 (S11). Then, it is judged whether the surface color of the inspection object 4, that is, the color of the color photoresist is suitable for the color of the illumination light L set in the LED line light sources 3a, 3b. When the color of the target color photoresist is changed along with the change of the production line, etc., when the color of the illumination light L is not suitable for the surface color of the inspection object 4, that is, the color of the coated color photoresist (S12: No), The color of the illumination light L is changed in a manner suitable for the surface color of the inspection object 4 (S13). The LED line light source 3a is provided with R (red), G (green), and B (blue) LEDs. By changing the brightness of the LEDs of various colors, the color of the illumination light L can be changed (dimmed).

Then, the surface of the inspection object 4 is irradiated with illumination light (S14), and the imaging units 2a to 2r perform imaging. Furthermore, in the present embodiment, the effective inspection region R1, which is a partial region of the captured image 23, is used for inspection of foreign objects. After the binarized image 23 is binarized (S16), a mask corresponding to the surface color is applied (S19). Furthermore, as described above, since the mask corresponds to the surface color, when the mask is not suitable for the surface color (S17: No), the mask is changed to be suitable for the surface color (S18).

The presence or absence of foreign matter is checked in the binarized photographic image 23 for the area where the non-sensing area is excluded by the mask (S20). As illustrated in FIG. 6, although the detection of foreign objects is performed by observing the scattered light generated by the foreign objects, when the range of the scattered light (the part shown in black in FIG. 6) exceeds the threshold, it is judged as There are foreign objects. After performing the inspection, the inspection object 4 moves from the base 5 (S21), and when there is no foreign object (S22: No), the inspection object 4 proceeds to the next step. On the other hand, when there is a foreign object (S22: Yes), the inspection object 4 performs a reprocessing step such as removing the applied color photoresist or the like, or becomes an object of disposal processing (S23). In addition, the presence or absence of foreign matter can be inspected in various forms other than the above.

In this way, in the present embodiment, by illuminating the inspection object 4 with the illumination light L having a complementary color relationship with the surface color of the inspection object 4 and performing inspection of foreign objects based on the photographed image, it can be reduced for inspection in place The non-sensing area of the electrode 45b on the back of the object 4, the hole 45a provided in the inspection object 4, the damage of the base 5, etc., or the non-sensing area may not be needed, so that the area for foreign object inspection can be expanded, and the inspection accuracy can be improved .

In addition, the present invention is not limited to the other embodiments, and the technical scope of the present invention also includes embodiments in which the configurations of the embodiments are appropriately combined.

2a‧‧‧Photography Department

3a‧‧‧LED linear light source (light source part)

4‧‧‧ Inspection object

21‧‧‧Photographic

22‧‧‧Optical system

E‧‧‧angle

L‧‧‧Light

R1‧‧‧ Effective inspection area

R2‧‧‧Invalid inspection area

S1~S6‧‧‧ tiny spherical particles

T‧‧‧ photography range

Claims (9)

A foreign object inspection device is for inspecting foreign objects adhering to the surface of an inspection object; it includes: a light source unit that illuminates the inspection object with illumination light in a complementary color relationship with the surface color of the inspection object; The inspection object is photographed; and a detection unit that detects foreign objects based on the image photographed by the imaging unit. The foreign object inspection device according to claim 1, wherein the detection unit detects a foreign object using a mask specifying a non-sensing area, the non-sensing area is an area excluded from the foreign object detection object in the captured image, and the non-sensing area It is smaller than the structure on the back of the inspection object or the hole provided in the inspection object. The foreign object inspection device according to claim 2, wherein the mask is formed by an image captured by illuminating the inspection object with the illumination light in a complementary color relationship with the surface color of the inspection object. The foreign material inspection device according to claim 2, wherein the detection unit changes the mask according to the surface color of the inspection object. The foreign matter inspection device according to claim 1, wherein the illumination light irradiated from the light source is incoherent light. The foreign object inspection device according to claim 1, wherein the inspection object is a substrate coated with a color photoresist film on the surface, and the illumination light and the color of the color photoresist film have a complementary color relationship. The foreign object inspection device according to claim 1, wherein the light source unit changes the color of the illumination light according to the surface color of the inspection object. The foreign object inspection device according to claim 1, wherein the imaging unit is disposed at a position where the regular reflected light reflected by the inspection object is not received, and is a location to receive scattered light of a foreign object adhering to the surface of the inspection object. A foreign object inspection method is to inspect foreign objects attached to the surface of the inspection object; wherein, illuminating the inspection object with illumination light having a complementary color relationship with the surface color of the inspection object, photographing the inspection object, according to the above The image captured by the photography department detects foreign objects.

Images