CN112236671A - Foreign matter inspection device and foreign matter inspection method - Google Patents
Foreign matter inspection device and foreign matter inspection method Download PDFInfo
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- CN112236671A CN112236671A CN201880094385.9A CN201880094385A CN112236671A CN 112236671 A CN112236671 A CN 112236671A CN 201880094385 A CN201880094385 A CN 201880094385A CN 112236671 A CN112236671 A CN 112236671A
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- 238000003384 imaging method Methods 0.000 claims abstract description 60
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- 238000001514 detection method Methods 0.000 claims abstract description 19
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
Abstract
The invention provides a foreign matter inspection device, which can improve the detection precision of foreign matters by enlarging the effective inspection area when inspecting the foreign matters adhered to the inspection object. The foreign matter inspection device (1) of the present invention is used for inspecting foreign matters attached to the surface of an inspection object (4); a foreign matter inspection device (1) is provided with: light source units (3a, 3b) for irradiating the inspection object (4) with illumination light (L) having a complementary color relationship with the surface color of the inspection object (4); imaging units (2 a-2 r) that image an inspection object (4); and a detection unit that detects foreign matter on the basis of the images captured by the imaging units (2 a-2 r).
Description
Technical Field
The present invention relates to a foreign matter inspection apparatus and a foreign matter inspection method for inspecting foreign matters adhering to various substrates such as a liquid crystal color filter.
Background
Conventionally, in a semiconductor manufacturing process, a manufacturing process of a flat panel display such as a liquid crystal display device, or the like, in order to improve product accuracy or the like, foreign substances adhering to a glass substrate are detected in the manufacturing process.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2000-74849
Patent document 2: japanese patent laid-open publication No. 2016-133357
Disclosure of Invention
In a process for manufacturing a color filter to be mounted on a liquid crystal display device, it is necessary to inspect whether or not foreign matter adheres to a resist (レジスト) applied in a state where the resist is applied. When foreign matter adheres to the photoresist, a mask disposed close to the photoresist surface is damaged or the quality of the color filter itself is impaired in exposure as a subsequent process. In particular, since the mask is expensive, when the mask is damaged by foreign matter, the economic loss is considerable.
In a color filter during production as an inspection target, an electrode may be provided on the back surface of a glass substrate or a hole may be formed in the glass substrate. Further, although the color filter during production is inspected while being installed on a base or the like, the base itself may be damaged. In the inspection in the manufacturing process of the color filter, it is necessary to inspect: foreign matter adhering to the photoresist side (surface) of the glass substrate. However, foreign matter, damage, and cavities in the electrodes, holes, or susceptors provided on the glass substrate are imaged even during surface inspection, and are difficult to distinguish from foreign matter. Thus, when image processing is performed on a captured image, for a region where damage, cavities, and the like of the electrode, the hole, the base, and the like described above are known in advance, the following is performed: the above-mentioned region is not used as a region for inspecting foreign matter by masking the non-sensitive region.
However, when the non-sensing area increases, the area for inspecting the foreign matter becomes smaller. Even if foreign matter adheres to the non-sensitive region, the mask is considered to be not adhered with foreign matter, which may damage the mask or deteriorate the quality of the product as described above.
Therefore, the foreign matter inspection device according to the present invention adopts the following first configuration.
A foreign matter inspection apparatus for inspecting a foreign matter adhering to a surface of an inspection object,
the foreign matter inspection device is provided with: a light source unit that irradiates illumination light, which is complementary to a surface color of the inspection object, onto the inspection object; an imaging unit that images the inspection target; and a detection unit that detects a foreign object based on the image captured by the imaging unit.
In addition to the first configuration, the foreign matter inspection device according to the present invention (second configuration) is such that the detection unit detects the foreign matter using a mask that specifies a non-sensitive region: a region in the captured image that is excluded from the detection object of the foreign object, and the non-sensing region is: a region smaller than the size of a structure located on the back surface of the inspection object or a hole provided in the inspection object.
In the foreign matter inspection device according to the present invention (third configuration), in addition to the second configuration, the mask is formed based on an image captured by irradiating the inspection target with the illumination light having a complementary color relationship with a surface color of the inspection target.
In the foreign matter inspection device according to the present invention (fourth configuration), in addition to the second or third configuration, the detection unit changes a mask in accordance with the surface color of the inspection object.
In addition to the first to fourth configurations, the foreign matter inspection device according to the present invention (fifth configuration) is such that the illumination light emitted from the light source is incoherent light.
Further, a foreign matter inspection device (sixth configuration) according to the present invention is the foreign matter inspection device according to any one of the first to fifth configurations, wherein the inspection object is: the substrate is coated with a color photoresist film on the surface, and the illumination light and the color of the color photoresist film are in a complementary color relationship.
In the foreign matter inspection device according to the present invention (seventh configuration), in addition to any one of the first to sixth configurations, the light source unit changes the color of the illumination light in accordance with the surface color of the inspection target.
In addition to the first to seventh configurations, the foreign object inspection apparatus according to the present invention (eighth configuration) is configured such that the imaging unit is disposed at a position where the apparatus does not receive the regular reflection light reflected by the inspection target and where the apparatus can receive the scattered light of the foreign object adhering to the surface of the inspection target.
A foreign matter inspection method (ninth configuration) according to the present invention is a method for inspecting a foreign matter adhering to a surface of an inspection target, and is characterized in that illumination light having a color complementary to a color of the surface of the inspection target is irradiated to the inspection target, the inspection target is imaged, and the foreign matter is detected based on an image captured by the imaging unit.
According to the foreign matter inspection apparatus and the foreign matter inspection method of the present invention, the inspection target is irradiated with the illumination light having a complementary color relationship with the surface color of the inspection target, and the foreign matter is inspected based on the captured image, whereby it is possible to reduce or eliminate the need for: the non-inductive region is used for the electrode positioned at the back of the object to be inspected, the hole arranged on the object to be inspected, the damage of the base and the like, thereby expanding the region for inspecting foreign matters and improving the inspection precision.
Drawings
Fig. 1 is a perspective view showing the configuration of a foreign matter inspection device according to the present embodiment.
Fig. 2 is a side view showing the configuration of the foreign matter inspection device according to the present embodiment.
Fig. 3 is a diagram illustrating a process of manufacturing a color filter to be inspected according to the present embodiment.
Fig. 4 is a color wheel for explaining the relationship between the color of the illumination light used in the present embodiment and the color of the color resist (the surface color of the inspection target).
Fig. 5 is a schematic diagram for explaining Mie Scattering (Mie Scattering).
Fig. 6 is a photographed image photographed using a bead ball.
Fig. 7 is a side view for explaining an imaging configuration of the foreign matter inspection device according to the present embodiment.
Fig. 8 is a schematic diagram for explaining the inspection target region in the captured image according to the present embodiment.
Fig. 9 is a schematic diagram for explaining a mask used in the image processing of the present embodiment.
Fig. 10 is a flowchart showing a foreign matter inspection process according to the present embodiment.
Detailed Description
Fig. 1 is a perspective view showing the configuration of a foreign matter inspection device 1 according to the present embodiment. The foreign matter inspection device of the present embodiment is configured as follows, and includes: led (light Emitting diode) line light sources 3a and 3b (corresponding to the "light source unit" of the present invention) for illuminating the inspection object 4 disposed on the base 5; imaging units 2a to 2r that image the illuminated inspection object 4; and an information processing device (not shown, corresponding to the "detection unit" of the present invention) that performs image processing on the images captured by the imaging units 2a to 2r so as to detect foreign matter adhering to the surface of the inspection object 4.
The inspection object 4 of the present embodiment is, for example: a transparent substrate (e.g., a glass substrate) having a surface coated with a color resist is provided in the middle of the process of manufacturing the color filter. The process for manufacturing the color filter will be described in detail later. The foreign matter inspection apparatus 1 is not limited to a color filter in the middle of the manufacturing process, and may be used in various fields using a transparent substrate.
The imaging units 2a to 2r are arranged above the inspection object 4 in a matrix form. In fig. 1, an imaging range P of the imaging unit 2k is indicated by oblique lines. In the present embodiment, a part of the imaging range P is used as a valid inspection area, and the remaining imaging range is not used for detecting a foreign object (as a invalid inspection area). The imaging units 2a to 2r arranged in a matrix are arranged so that a part of each effective inspection region overlaps, whereby the entire surface of the inspection object 4 can be an inspection object. In this way, the entire surface of the inspection object 4 can be inspected by imaging by the imaging units 2a to 2 r. Further, by imaging a partial region of the inspection object 4 and moving the inspection object 4 or moving the imaging units 2a to 2r, it is possible to form: the entire surface of the inspection object 4 can be inspected. The number and arrangement of the imaging units 2a to 2r are not limited to those shown in fig. 1, and may be determined as appropriate according to various conditions such as the size and shape of the inspection object 4.
The LED line light sources 3a and 3b as the light source units irradiate illumination light L from the lateral direction of the inspection object 4 toward the surface of the inspection object 4. In order to detect foreign matter adhering to the surface of the inspection object 4, the imaging units 2a to 2r of the present embodiment are configured to: the angle of the light beam is directed to receive the scattered light generated by the foreign matter and the angle of the normally reflected light reflected by the inspection object 4 which does not receive the illumination light L. With this arrangement, scattered light generated by a foreign object can be received without being obstructed by the regular reflection light, and thus the accuracy of detecting a foreign object can be improved.
Preferably, the light source unit uses incoherent light such as the LED line light sources 3a and 3b of the present embodiment or a fluorescent lamp, instead of using flat light such as radar light. In the case of using the flat light, a structure such as an electrode on the back surface of the inspection object, a hole provided in the inspection object, or the like is photographed in an actual size. On the other hand, the uneven light is used as the illumination light, and the color of the illumination light is selected, whereby: as a result, the amount of light transmitted through the inspection target by the illumination light can be reduced from the actual size, and thus, a structure such as an electrode positioned on the rear surface of the inspection target, a hole provided in the inspection target, or the like can be recognized (observed), and the inspection target region can be enlarged.
Fig. 2 is a side view showing the configuration of the foreign matter inspection device 1 according to the present embodiment. Fig. 2 is a side view of the rows of imaging units 2a to 2f in fig. 1. The LED line light sources 3a, 3b irradiate illumination light L from the lateral direction toward the surface of the inspection object 4. Preferably, the illumination light L is desirably incident substantially parallel to the surface of the inspection object 4, that is, incident such that the light is irradiated only on the foreign matter located on the surface 4 of the inspection object 4. However, considering that the surface of the inspection object 4 does not become a perfect plane due to the strain of the inspection object 4 or the base 5, it needs to be slightly inclined. When the inclination angle of the illumination light L with respect to the surface of the inspection object 4 is 0 degree in a state of being parallel to the XY plane, it is preferably inclined toward the inspection object 4 in a range of 0 degree to 5 degrees. More preferably within a range of 0 to 3 degrees. In fig. 2, the inclination angle of the illumination light L is exaggerated compared to the actual inclination angle. As described above, the imaging units 2a to 2f of the present embodiment are arranged such that: the angle of the light beam is directed to receive scattered light generated by a foreign substance adhering to the surface of the inspection object 4 and not to receive the normally reflected light of the illumination light L reflected by the inspection object 4.
The imaging units 2a to 2c are arranged so as to receive scattered light generated by a foreign object irradiated with the illumination light L from the LED line light source 3a, and the scattered light is generated by the foreign object: on the XZ plane, the test object 4 is inclined by an angle E (1 degree < E <20 degrees) with respect to the vertical direction (Z-axis direction) thereof. On the other hand, the imaging units 2d to 2f are arranged so as to receive scattered light generated by the foreign matter irradiated with the illumination light L from the LED line light sources 3b, and the scattered light is generated by the foreign matter: on the XZ plane, the imaging units 2a to 2c are inclined at an angle E with respect to a direction different from the direction. With this arrangement, the imaging units 2a to 2c mainly receive: the illumination light L from the LED line light sources 3a is irradiated to the foreign matter and scattered light scattered by the foreign matter is less likely to be affected by the regular reflection light from the LED line light sources 3a and 3 b. The imaging units 2d to 2f mainly receive: the illumination light L from the LED line light source 3b is irradiated to the foreign matter and scattered light scattered by the foreign matter is less likely to be affected by the regular reflection light from the LED line light sources 3a and 3 b. Further, although not shown, the imaging units 2a to 2f are: in the YZ plane, the state is oriented in the vertical direction.
In this embodiment, a color filter used in a liquid crystal display device is an inspection target 4. In particular, the detection of foreign matter adhering to the surface of the color filter is performed during the manufacturing process. Fig. 3 is a view showing a process of manufacturing a color filter. As shown in fig. 3(a), a black matrix 42 is formed on a transparent substrate 41 such as a glass substrate. The formation of the black matrix 42 is performed by exposure and development in the same manner as the color resist 43R described later, but the description thereof is omitted here. As shown in fig. 3(B), a red color resist 43R is coated on the transparent substrate 41 on which the black matrix 42 is formed. The foreign matter inspection apparatus 1 of the present embodiment is designed to have the color resist 43R applied thereon as the inspection target 4.
As shown in fig. 3(C), after the color resist 43R is coated, the mask 44 is disposed above and exposed, but when a foreign substance adheres to the color resist 43R, the mask 44 may be damaged by the foreign substance. Since the mask 44 is extremely expensive, the economic loss due to the breakage is considerable. In addition, when the color filter is continuously manufactured without noticing the damage of the mask 44 caused by the foreign substance, the color filter itself may be defective. Defects in the color filter may cause deterioration of a display image of the liquid crystal display device, for example.
Ultraviolet rays are irradiated through the opening 44a provided in the mask 44 to deactivate the color resist 43R at the position of the opening 44 a. Then, unnecessary portions of the color resist 43R are removed by a developer, and then the remaining color resist 43R is baked and cured. Fig. 3(D) is a view showing the cured color resist 43R. The green color resist 43G is subjected to the processes shown in fig. 3(B) and 3(C), whereby a cured color resist 43G is added as shown in fig. 3 (E). Then, the blue color resist 43B is subjected to the processes shown in fig. 3(B) and 3(C), thereby adding the cured color resist 43B as shown in fig. 3 (E). Even in the state where the green color resist 43G and the blue color resist 43B are applied, the foreign matter inspection device 1 of the present embodiment performs inspection of foreign matter adhering to the surface thereof with the inspection object 4.
FIG. 4 is a diagram of: a hue circle for explaining a relationship between the color of the illumination light L used in the foreign matter inspection device 1 of the present embodiment and the color of the color resist, which is the surface color of the inspection target 4. In this embodiment, a color wheel equally divided into 24 blocks is used. Fig. 4(a) shows a case of the color resist 43G, and shows a case where the resist color is red as indicated by an arrow. In the hue ring, the colors at the opposite positions are complementary colors. Here, the complementary color means: the color mixture of a certain color light and its complementary color light is added to generate a color of white light.
In the present embodiment, by selecting the color of the illumination light L so that the color satisfies the predetermined condition according to the surface color of the inspection object 4, it is possible to recognize (observe) a structure such as an electrode positioned on the back surface of the inspection object 4, a hole provided in the inspection object 4, a damage on the surface of the base 5, or the like, which is smaller than the actual size. Conventionally, when white light or the like is used as the illumination light L, the above-described damage of the structure, the hole, and the base 5 of the inspection object 4 is observed in the captured image in a real size. Therefore, it is necessary to provide the following structures, holes, and damages: a mask having a non-sensing area corresponding to the actual size. In the non-sensing region, the surface of the inspection object 4 cannot be inspected. Therefore, if foreign matter adheres to the non-sensing region, an inspection omission may be caused. On the other hand, in the present embodiment, by using the color of the illumination light L satisfying the predetermined condition, the non-sensitive region can be reduced, and the region for inspecting the foreign matter can be enlarged.
The condition for the color of the illumination light L needs to be in a complementary color relationship with the surface color of the inspection object 4 (in the present embodiment, the resist color). Here, the complementary color relationship means: in the hue ring, a color having a center frequency within a predetermined range from a complementary color of a surface color of the inspection target 4 is included. For example, in the case of the color resist 43G shown in fig. 4(a), in the hue ring divided into 24 blocks, there are used: the illumination light L having a center frequency in a color within a predetermined range from the position of the complementary color disposed opposite to the resist color (red), that is, the following is used: the colors in the range of 4 blocks before and after the illumination light L have the center frequency. In the present embodiment, the following are used: the color of the position shown by the arrow has the illumination light L of the center frequency. In the same manner as in the case of the color resist 43G shown in fig. 4B (resist color is green) and the case of the color resist 43B shown in fig. 4C (resist color is blue), the following are used: and an illumination light L having a center frequency in a color within a predetermined range from a complementary color of the color resist.
As described with reference to fig. 2, in the present embodiment, the imaging units 2a to 2r receive scattered light generated by a foreign object, thereby enabling efficient detection of the foreign object. Here, scattering of light by foreign substances will be described. It is known that when light is incident on fine particles as foreign matter, the scattering form differs depending on the size of the fine particles. It is known that scattering by fine particles is roughly differentiated by the relationship between the size of the fine particles and the wavelength of light, and Rayleigh scattering (Rayleigh scattering) occurs when the size of the fine particles is 1/10, and mie scattering occurs when the size of the fine particles exceeds the size. In the present embodiment, the foreign matter to be detected is a foreign matter having a size that generates mie scattering such as a chip of a glass substrate.
Fig. 5 is a schematic diagram for explaining mie scattering, and is a schematic diagram showing a state of scattering when the illumination light L is incident on the fine spherical particles S. Fig. 5(a) is a plan view showing a state of scattered light, and fig. 5(B) is a side view thereof. Here, the surface of the inspection target 4 is set as an XY plane, an axis orthogonal to the surface of the inspection target is set as a Z axis, and the traveling direction of the illumination light L is set as a positive direction of the X axis. The scattered light is shown in such a manner that arcs are respectively drawn in the positive and negative directions of the X axis. Further, since the scattered light observed is larger than the size of the fine spherical particles S, foreign matter adhering to the inspection object can be effectively detected by observing the scattered light.
Fig. 6 is a captured image 23 (binarized) captured by using the foreign matter inspection device 1 according to the present embodiment. Here, the surface of the inspection object 4 is imaged by adhering transparent 2 minute spherical particles S1 and S2 (minute beads). The circles shown by the broken lines indicate the actual positions of the minute spherical particles S1, S2, which do not actually appear on the captured image 23. The captured image 23 is, similarly to fig. 5: the illumination light L is made incident on the fine spherical particles S1 and S2 in the positive direction of the X axis, and the image is captured, and the binarization of the image is completed. In the X-axis positive and negative directions of the fine spherical particles S1 and S2, scattered light indicated by black appears. Thus, the scattered light from the minute spherical particles S1, S2 is shown as: since the size is larger than the actual size of the fine spherical particles S1 and S2, foreign matter adhering to the surface of the inspection object 4 can be effectively inspected. In fig. 5 and 6, the spherical particles S are used as the foreign matter because the scattered light is most difficult to be observed in a spherical shape. The actual foreign matter is typically: the shape of the glass fragment or the like is different from a spherical shape, and scattered light is clearly generated in such a shape, and observation becomes easy.
Fig. 7 is a side view for explaining an imaging configuration of the foreign matter inspection device 1 according to the present embodiment. In the configuration described with reference to fig. 1 and 2, the imaging configuration will be described with reference to one imaging unit 2a as an example. In the present embodiment, the surface of the inspection object 4 is illuminated by the LED line light source 3a extending in the Y-axis direction, and the imaging unit 2a captures: scattered light is caused by foreign matter adhering to the inspection object 4. Here, as a sample of the foreign matter, 6 fine spherical particles S1 to S6 are arranged at equal intervals in the X axis direction. These fine spherical particles S1 to S6 are arranged so as to fall within the imaging range T of the imaging unit 2 a. In fig. 7, the illumination light L is incident substantially parallel to the surface of the inspection object 4, but may be inclined only toward the inspection object 4 as described with reference to fig. 2.
In the present embodiment, it is desirable to clearly capture scattered light generated by a foreign object in terms of the discovery of the foreign object. In order to receive as much scattered light of the fine spherical particles S1 to S6 as possible, it is preferable that the angle E of the imaging section 2a be increased in order to increase the amount of received light with respect to scattered light generated on the side opposite to the incident side of the illumination light L among the fine spherical particles S1 to S6. However, when the angle E is increased, not only the scattered light but also the regular reflection light of the illumination light L enters, and the scattered light is blocked by the regular reflection light. Therefore, in the present embodiment, the angle E of the imaging unit 2a is set to: the angle (range of 1 to 20 degrees) at which regular reflection light of the illumination light L from the LED line light source 3a is not incident.
In addition, in the case of using the normal imaging unit 2a in which the optical axis of the optical system 22 is in a perpendicular relationship with the imaging surface 21, the amount of received scattered light decreases in the positive direction along the X axis within the imaging range T of the imaging unit 2 a. Therefore, in the present embodiment, the effective inspection region R1 located on the LED line light source 3a side is used as a detection target of the foreign matter instead of using the entire imaging range T. The invalid inspection region R2 located at a position away from the LED line light source 3a is not used as a detection target of foreign matter. Therefore, as described with reference to fig. 1 and 2, when the entire surface of the inspection object 4 is inspected by using the plurality of imaging units 2a to 2R, the imaging units 2a to 2R are arranged so that part of the effective inspection region R1 overlaps.
Fig. 8 is a schematic diagram for explaining the effective inspection region R1 in the captured image 23 of the present embodiment. As described with reference to fig. 7, in the present embodiment, a region of the imaging range T on the side where the illumination light L is incident from the LED line light source 3a is set as the effective inspection region R1 used for the foreign matter inspection. The remaining region is set as an invalid inspection region R2 not used for foreign matter inspection. As can be seen from fig. 8, when the imaging unit 2a in which the optical axis of the optical system 22 is orthogonal to the imaging surface 21 is used, the position of the optical axis C2 in the captured image 23 is located at the center of the captured image 23. On the other hand, since the image center C1 of the valid inspection region R1 is the one from which the invalid inspection region R2 is cut out from the captured image 23, it is shifted toward the side on which the illumination light L is incident.
Fig. 9 is a schematic diagram for explaining a mask used in the image processing of the present embodiment. The mask is: the detection unit is used to specify a non-sensitive region in the captured image 23 that is not used for foreign matter inspection. The non-sensing area is allocated to: the position of a structure, a hole, a flaw, or the like in the inspection object 4, which is known in advance, is aimed at: these are not erroneously detected as foreign matter. In the present embodiment, incoherent light is used as the illumination light L, and the color thereof is selected, whereby a structure such as an electrode positioned on the back surface of the inspection object 4, a hole provided in the inspection object 4, a damage on the surface of the base 5, and the like can be recognized (observed) particularly smaller than the actual size. Therefore, the non-sensing area in the mask can be reduced or not provided, and the following effects can be achieved: the area outside the non-sensing area, that is, the area to be inspected for foreign matter is enlarged.
Fig. 9(a) schematically shows: an electrode 45b provided on the rear surface of the inspection object 4, a plan view of a hole 45a penetrating the inspection object 4, and a cross-sectional view of the hole 45 a. The coordinate system shown in fig. 9 is the same as that shown in fig. 1 and 2, and the illumination light L is applied to the surface of the inspection object 4 from the positive direction of the Z axis. The electrode 45b is located on the back surface opposite to the side irradiated with the illumination light L.
When photographing is performed using white light as the illumination light L, the hole 45a and the electrode 45b are observed in real size. Thus, as shown in fig. 9(B), the non-sensitive regions 61a and 61B of the mask 6a in the case of using white light are provided as follows: the size of the hole 45a and the electrode 45b in fig. 9(a) is the same or slightly larger with a margin. The regions other than the non-sensitive regions 61a, 61B in the mask 6a of fig. 9(B) are used as inspection targets of foreign matter. Therefore, when foreign matter adheres to these non-sensing areas 61a and 61b, the foreign matter is not detected.
On the other hand, in the foreign matter inspection device 1 of the present embodiment, as described with reference to fig. 4, by selecting the color of the illumination light L in accordance with the surface color of the inspection object 4, the amount of light transmission of the illumination light L to the inspection object can be reduced, and the amount of reflection (brightness) of the electrode 45b positioned on the rear surface of the inspection object 4, the hole 45a provided in the inspection object 4, and the base hole 5a provided in the base 5 can be made substantially zero or reduced. In the present embodiment, a threshold value is set for each pixel of the captured image, and binarization is performed at a luminance equal to or higher than the threshold value, but by performing binarization, the luminance of the entire region or a partial region of the electrode 45b positioned on the rear surface of the inspection object 4, the hole 45a provided in the inspection object 4, and the base hole 5a provided in the base 5 becomes equal to or lower than the threshold value, and the entire region or a partial region is excluded from the recognition (observation) object. For example, in fig. 9 a, although the illumination light L enters from the positive direction of the X axis, the incident illumination light L is reflected at the end portion (the side where the value of X is large) of the electrode 45b, and the luminance becomes stronger than that at other portions of the electrode 45 b. Therefore, the end portion of the electrode 45b on the side where the illumination light is incident remains as an identifiable (observable) image even after binarization.
The mask 6b used in the foreign matter inspection device 1 of the present embodiment is created based on the binarized captured image 23 shown in fig. 9(C), and has the form shown in fig. 9 (D). In the mask 6b, as shown in fig. 9(C), since the holes 45a have been deleted in the captured image 23, the non-sensitive region 61a for the holes 45a is not required. In addition, the electrode 45b may be formed using a non-sensing region 61b' smaller than the actual size of the electrode 45 b. As can be seen from this, comparing the white light mask 6a in fig. 9(B) with the mask 6B of the present embodiment in fig. 9(D), the non-sensing area can be suppressed to be small, and it is possible to realize: the remaining region, that is, the region to be inspected for foreign matter is enlarged. Further, as the image processing for detecting the foreign object, it is not always necessary to binarize the captured image 23, and instead of the binarization, n-value (n ≧ 3) may be performed.
The inspection target 4, on which the adhesion of foreign matter has been sufficiently confirmed, is photographed, and a mask 6b used for image processing of the foreign matter inspection apparatus 1 is created using the photographed image. Even if the inspection objects 4 have the same configuration, the size of the electrode image 23b or the like changes when the surface color such as the resist color and the color of the illumination light L are different from each other, and therefore, it is preferable to create the inspection objects 4 for each surface color.
Fig. 10 is a flowchart showing a foreign matter inspection process of the foreign matter inspection apparatus 1 according to the present embodiment. In the present embodiment, the color filter in the middle of the manufacturing process described with reference to fig. 3 is used as the inspection object 4. In the foreign matter inspection step, first, the inspection object 4 is set on the susceptor 5 (S11). Then, the judgment: the color of the surface of the inspection object 4, that is, the color of the color resist is appropriate for the color of the illumination light L set by the LED line light sources 3a and 3 b. When the color of the illumination light L is not suitable for the surface color of the inspection object 4, that is, the color of the color resist applied, such as when the color of the color resist to be inspected is changed along with a change in the production line (S12: No), the color of the illumination light L is changed so as to be suitable for the surface color of the inspection object 4 (S13). The LED line light source 3a is provided with: the R (red), G (green), and B (blue) LEDs can change (adjust) the color of the illumination light L by changing the brightness of each LED.
Then, illumination light is irradiated to the surface of the inspection object 4 (S14), and the imaging units 2a to 2r perform imaging. In the present embodiment, the effective inspection region R1, which is a partial region of the captured image 23, is used for the inspection of the foreign matter. After the captured image 23 is binarized (S16), a mask corresponding to the surface color is applied (S19). In addition, as described above, since the mask corresponds to the surface color, when the mask is not suitable for the surface color (S17: No), the mask is changed to the mask suitable for the surface color (S18).
The captured image 23 after binarization is inspected for the presence or absence of foreign matter in the region excluding the non-sensing region by the mask (S20). As described with reference to fig. 6, although the foreign object is detected by observing the scattered light generated by the foreign object, if the range of the scattered light (the black portion in fig. 6) exceeds the threshold value, it is determined that there is a foreign object. After the inspection, the inspection object 4 is moved away from the base 5 (S21), and if there is No foreign matter (S22: No), the inspection object 4 proceeds to the next step. On the other hand, when there is a foreign object (S22: Yes), the inspection object 4 performs: a reprocessing step of removing the applied color resist or the like, or a disposal step (S23). The presence or absence of foreign matter can be checked in various forms other than the above-described forms.
As described above, in the present embodiment, by irradiating the inspection target 4 with the illumination light L having a complementary color relationship with the surface color of the inspection target 4 and performing the inspection of the foreign object based on the captured image, it is possible to reduce: the electrode 45b positioned on the back surface of the inspection object 4, the hole 45a provided in the inspection object 4, and the non-sensitive region of the damage or the like of the base 5 may be unnecessary, so that: the area for inspecting foreign matter is enlarged to improve the inspection accuracy.
The present invention is not limited to these embodiments, and embodiments obtained by appropriately combining the configurations of the embodiments belong to the technical scope of the present invention.
Description of the reference numerals
1: foreign matter inspection devices 2a to 2 r: image pickup unit
3a, 3 b: LED line light source (light source unit) 4: examination object
5: bases 6a, 6 b: shade cover
21: shooting surface 22: optical system
23: captured image 23 b: electrode image
41: transparent substrate 42: black matrix
43R, 43G, 43B: color resist 44: light shield
44 a: opening 45 a: hole(s)
45 b: an electrode T: shooting range
61a, 61 b': non-sensing area
C1: image center C2: optical axis
E: angle L: illumination light
P: shooting range R1: effective examination area
S (S1-S6): minute spherical particles R2: invalid examination region
Claims (9)
1. A foreign matter inspection apparatus for inspecting a foreign matter adhering to a surface of an inspection object,
the foreign matter inspection device is provided with:
a light source unit that irradiates illumination light, which is complementary to a surface color of the inspection object, onto the inspection object;
an imaging unit that images the inspection target; and
and a detection unit that detects a foreign object based on the image captured by the imaging unit.
2. The foreign matter inspection device according to claim 1,
the detection part detects the foreign matter by using a mask which designates a non-sensing area, wherein the non-sensing area is as follows: a region in the captured image that is excluded from the detection object of the foreign object,
and, the non-sensing area is: a region smaller than the size of a structure located on the back surface of the inspection object or a hole provided in the inspection object.
3. The foreign matter inspection device according to claim 2,
the mask is formed based on an image captured by irradiating the illumination light having a complementary color relationship with a surface color of the inspection object on the inspection object.
4. The foreign matter inspection device according to claim 2,
the detection unit changes a mask according to the surface color of the inspection object.
5. The foreign matter inspection device according to claim 1,
the illumination light irradiated from the light source is incoherent light.
6. The foreign matter inspection device according to claim 1,
the inspection object is: a substrate coated with a color resist film on the surface,
the illumination light and the color of the color photoresist film are in a complementary color relationship.
7. The foreign matter inspection device according to claim 1,
the light source unit changes the color of the illumination light in accordance with the surface color of the inspection object.
8. The foreign matter inspection device according to claim 1,
the imaging unit is disposed at a position where the regular reflection light reflected by the inspection target is not received and a position where the scattered light of the foreign matter adhering to the surface of the inspection target can be received.
9. A foreign matter inspection method for inspecting a foreign matter adhering to a surface of an inspection object,
the inspection target is irradiated with illumination light having a complementary color relationship with a surface color of the inspection target, the inspection target is imaged, and the foreign object is detected based on the image imaged by the imaging unit.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2018/022470 WO2019239501A1 (en) | 2018-06-12 | 2018-06-12 | Foreign matter inspection device and foreign matter inspection method |
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| CN112236671A true CN112236671A (en) | 2021-01-15 |
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| CN201880094385.9A Pending CN112236671A (en) | 2018-06-12 | 2018-06-12 | Foreign matter inspection device and foreign matter inspection method |
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| JP (1) | JP6980241B2 (en) |
| CN (1) | CN112236671A (en) |
| TW (1) | TWI721447B (en) |
| WO (1) | WO2019239501A1 (en) |
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| GB1056652A (en) * | 1964-04-14 | 1967-01-25 | Int Standard Electric Corp | Flaw detection apparatus |
| JP2004219108A (en) * | 2003-01-09 | 2004-08-05 | Dainippon Printing Co Ltd | Method and apparatus for inspecting irregularities in film thickness of colored film |
| JP2007040862A (en) * | 2005-08-04 | 2007-02-15 | Dainippon Printing Co Ltd | Foreign matter inspection device and method |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI721447B (en) | 2021-03-11 |
| JP6980241B2 (en) | 2021-12-15 |
| WO2019239501A1 (en) | 2019-12-19 |
| JPWO2019239501A1 (en) | 2021-03-18 |
| TW202004557A (en) | 2020-01-16 |
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