TW202004501A - Memory inspecting system, memory inspecting method, and error mapping table building method for memory inspecting - Google Patents

Memory inspecting system, memory inspecting method, and error mapping table building method for memory inspecting Download PDF

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TW202004501A
TW202004501A TW107119395A TW107119395A TW202004501A TW 202004501 A TW202004501 A TW 202004501A TW 107119395 A TW107119395 A TW 107119395A TW 107119395 A TW107119395 A TW 107119395A TW 202004501 A TW202004501 A TW 202004501A
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memory
address
test
bit
control unit
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TWI668566B (en
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陳曉德
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和碩聯合科技股份有限公司
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    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor

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Abstract

The present invention provides a memory inspecting system, the method thereof, and an error mapping table building method. The memory inspecting method is used for inspecting a memory of a device under test. The memory inspecting method includes: retrieving an error mapping table corresponding to the device under test, the error mapping table including a set of mapping address data and a set of data line data, in which the set of mapping address includes a plurality of mapping addresses of the memory, and the set of data line data includes a plurality of data line designators of the data lines of the memory, each data line designator is mapped to a bit of each mapping address; writing a test pattern to each mapping address using the control unit; retrieving the address value of each mapping address using the control unit; determining bit by bit whether the address value is the same as the test pattern.

Description

記憶體檢測系統、記憶體檢測方法以及用於記憶體檢測的錯誤映射表建立方法Memory detection system, memory detection method, and method for establishing error mapping table for memory detection

本發明涉及一種檢測系統及方法,尤其是涉及一種記憶體檢測系統、記憶體檢測方法以及用於記憶體檢測的錯誤映射表建立方法。The invention relates to a detection system and method, in particular to a memory detection system, a memory detection method, and a method for establishing an error mapping table for memory detection.

一般而言,嵌入式系統的記憶體設計為直接焊在主機板上,因此,不若一般模組型態記憶體在出廠時就已完成測試,嵌入式系統的記憶體測試是與主板的搭配測試一起完成。Generally speaking, the memory of the embedded system is designed to be directly soldered to the motherboard. Therefore, if the general module type memory has been tested at the factory, the memory test of the embedded system is matched with the motherboard The test is completed together.

一般用以測試組裝電路主板的方式主要分成電性測試(In-Circuit Test, ICT)、功能測試(Function Verification Test, FVT)、自動光學檢測(Automatic Optical Inspection, AOI)等。電性測試的實施方式為設計一探針治具,其上的每一探針分別對應到待測主板上預先設置的零件測試點。實際測試時,將探針與單獨零件或多個零件通過測試點連接,而以各區域電路的等效電阻、電容、電感及電壓等量測值作為依據來判斷待測主板是否存在焊接不良、缺件、電性相反等製程錯誤情形。電性測試(In-Circuit Test, ICT)不需將主板開機即能測試,且不需要經由專業電路設計人員來執行測試,因此可提高測試速度並降低成本。然而,探針治具成本高昂,且需要定期維護與更換。此外,以電性測試的方式需要在CPU與記憶體之間額外增加測試點,對信號品質造成影響,同時也降低了主板佈線利用率。並且,在主板配備多顆記憶體的情況下,此種測試方式終將拉長整體測試時間。Generally, the methods used to test assembled circuit boards are mainly divided into electrical test (In-Circuit Test, ICT), function test (FVT), automatic optical inspection (AOI), etc. The embodiment of the electrical test is to design a probe jig, and each probe on the probe corresponds to a pre-set component test point on the main board to be tested. In the actual test, the probe is connected to a single part or multiple parts through the test point, and the equivalent resistance, capacitance, inductance and voltage of the circuit in each region are used as the basis to determine whether the main board to be tested has bad soldering, Process errors such as missing parts and reverse electrical properties. In-Circuit Test (ICT) can be tested without turning on the motherboard, and does not need to be tested by professional circuit designers, so it can increase test speed and reduce costs. However, probe fixtures are costly and require regular maintenance and replacement. In addition, the electrical test method requires additional test points between the CPU and the memory, which affects the signal quality and also reduces the motherboard wiring utilization rate. In addition, when the motherboard is equipped with multiple memories, this test method will eventually lengthen the overall test time.

功能測試的實現方式為:將待測主板開機,並判讀開機程式(Bootloader,或Boot code)的開機輸出訊息。然而,開機程式的輸出資訊需要專業人員來判讀,因此成本將提高。且當主板有加密機制的需求時,主板上的中央處理器(CPU)需要支援加密機制外,相關開機資訊也會被預設為關閉,提高了判讀難度。The function test is implemented by booting the motherboard to be tested and interpreting the boot output message of the boot program (Bootloader, or Boot code). However, the output information of the boot program needs to be interpreted by professionals, so the cost will increase. In addition, when the motherboard requires an encryption mechanism, the central processing unit (CPU) on the motherboard needs to support the encryption mechanism, and related boot information will also be turned off by default, which increases the difficulty of interpretation.

承上述,本發明所要解決的技術問題在於,針對現有技術的不足提供一種記憶體檢測系統、記憶體檢測方法以及用於記憶體檢測的錯誤映射表建立方法,用以檢驗記憶體特定位址被寫入檢查位元組後的位址值是否與該檢查位元組相同,並在不相同時對於錯誤映射表進行查表,藉此判斷記憶體的故障情形。Based on the above, the technical problem to be solved by the present invention is to provide a memory detection system, a memory detection method, and an error mapping table creation method for memory detection to check the specific address of the memory Whether the address value after writing into the check byte is the same as the check byte, and when not the same, check the error mapping table to determine the fault condition of the memory.

為了達到上述目的,本發明所採用的其中一技術方案是提供一種記憶體檢測方法,以檢測一待測裝置的記憶體,其中,記憶體檢測方法包含:讀取對應該待測裝置的一錯誤映射表,其中,該錯誤映射表包括:一組映射位址資料以及一組資料線資料,該組映射位址資料包括該記憶體的複數個映射位址,且該組資料線資料包括該記憶體的複數個資料線的複數個資料線名稱,其中,每一該資料線名稱在該錯誤映射表中分別映射於每一該映射位址的每一位元;對所讀取之每一該映射位址寫入一檢查位元組;讀取每一該映射位址因應該檢查位元組的一位址值;判斷每一該位址值的每一位元的位元值與該檢查位元組中相對應的位元的位元值是否相同;以及 若判斷至少一映射位址因應該檢查位元組的該位址值的至少一位元的位元值與該檢查位元組中相對應的位元的位元值不同,判斷該記憶體為故障。In order to achieve the above object, one of the technical solutions adopted by the present invention is to provide a memory detection method to detect the memory of a device under test, wherein the memory detection method includes: reading an error corresponding to the device under test A mapping table, wherein the error mapping table includes: a set of mapped address data and a set of data line data, the set of mapped address data includes a plurality of mapped addresses of the memory, and the set of data line data includes the memory The plurality of data line names of the plurality of data lines of the body, where each data line name is mapped to each bit of each mapping address in the error mapping table; Write a check byte to the mapped address; read the bit value of the checked byte for each mapped address; determine the bit value of each bit of the address and the check Whether the bit value of the corresponding bit in the byte is the same; and if it is judged that at least one mapped address should check the bit value of at least one bit of the address value of the bit and the check byte The bit value of the corresponding bit in is different, and the memory is judged to be faulty.

為了達到上述目的,本發明所採用的另一技術方案是提供一種錯誤映射表建立方法,用以檢測一待測裝置的一記憶體,該錯誤映射表建立方法包含:提供一無故障待測裝置,該無故障待測裝置包括一無故障記憶體;提供一測試治具,該測試治具包括:一測試探針模組;一開關模組;以及一微控制單元,其中,該開關模組連接於該測試探針模組與該微控制單元之間;將該測試探針模組連接於該無故障待測裝置的該無故障記憶體的其中之一資料線;通過該微控制單元控制該開關模組,以使該無故障記憶體的該其中之一資料線、該測試探針模組與該開關模組之間形成短路;通過該微控制單元以對該無故障記憶體的一測試位址區間內的所有位址的寫入一全1位元組;通過該微控制單元以判斷該測試位址區間內的所有位址因應該全1位元組的位址值是否為全1位元組;以及若該測試位址區間內的其中之一位址的位址值不為全1位元組,該微控制單元建立對應於該待測裝置的一錯誤映射表,將該其中之一位址、該其中之一位址的位址值以及該經短路處理的其中之一資料線的資料線名稱儲存於該錯誤映射表,且在該錯誤映射表中建立該其中之一位址、該其中之一位址的位址值以及該經短路處理的其中之一資料線的資料線名稱之間的映射關係。In order to achieve the above object, another technical solution adopted by the present invention is to provide an error mapping table creation method for detecting a memory of a device under test. The error mapping table creation method includes: providing a fault-free device under test , The fault-free device under test includes a fault-free memory; a test fixture is provided, the test fixture includes: a test probe module; a switch module; and a micro-control unit, wherein the switch module Connected between the test probe module and the micro control unit; connecting the test probe module to one of the data lines of the fault-free memory of the fault-free device under test; controlled by the micro-control unit The switch module, so that one of the data lines of the fault-free memory, the test probe module and the switch module forms a short circuit; the micro-control unit All the addresses in the test address interval are written into a full 1-byte; the micro-control unit is used to determine whether all the addresses in the test address interval should be the full 1-byte address value. 1 byte; and if the address value of one of the addresses in the test address interval is not all 1 byte, the micro control unit creates an error mapping table corresponding to the device under test, One of the addresses, the address value of the one of the addresses, and the data line name of the one of the short-circuited data lines are stored in the error mapping table, and the one of them is created in the error mapping table The mapping relationship between the address, the address value of one of the addresses, and the data line name of the one of the short-circuited data lines.

為了達到上述目的,本發明所採用的另一技術方案是提供一種記憶體檢測系統,包含一待測裝置以及一電子裝置。該待測裝置包括一記憶體。該電子裝置包括一控制單元,該待測裝置連接於該電子裝置,其中,該電子裝置儲存有對應該待測裝置的一錯誤映射表,該錯誤映射表包括一組映射位址資料以及一組資料線資料,該組映射位址資料包括該記憶體的複數個映射位址一組資料線資料,該組資料線資料包括該記憶體的複數個資料線的名稱,每一該資料線名稱在該錯誤映射表中分別映射於每一該映射位址的每一位元。該控制單元用以讀取該錯誤映射表,並根據該錯誤映射表的該組映射位址資料而對該記憶體的該複數個映射位址寫入一檢查位元組,並判斷每一該映射位址因應該檢查位元組的一位址值的每一位元的位元值與該檢查位元組中相對應的位元的位元值是否相同,其中,若該位址值中至少一位元的位元值與該檢查位元組中相對應的位元的位元值不同,該控制單元根據該錯誤映射表判斷映射於該至少一位元的至少一該資料線為故障。In order to achieve the above object, another technical solution adopted by the present invention is to provide a memory detection system including a device to be tested and an electronic device. The device under test includes a memory. The electronic device includes a control unit, the device under test is connected to the electronic device, wherein the electronic device stores an error mapping table corresponding to the device under test, the error mapping table includes a set of mapping address data and a set of Data line data, the set of mapped address data includes a plurality of mapped addresses of the memory, a set of data line data, the set of data line data includes the names of the plurality of data lines of the memory, each of the data line names is in The error mapping table is mapped to each bit of each mapping address separately. The control unit is used to read the error mapping table and write a check byte to the plurality of mapping addresses of the memory according to the set of mapping address data of the error mapping table, and determine each The mapping address should check whether the bit value of each bit of the bit address value of the byte is the same as the bit value of the corresponding bit in the check byte, where, if the address value is The bit value of at least one bit is different from the bit value of the corresponding bit in the check bit group, the control unit determines that at least one of the data lines mapped to the at least one bit is faulty according to the error mapping table .

為使能更進一步瞭解本發明的映射及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。In order to further understand the mapping and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and explanation only, and are not intended to limit the present invention.

以下通過特定的具體實施例並配合圖1至圖6以說明本發明所公開記憶體檢測系統、記憶體檢測方法以及錯誤映射表建立方法的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。然而,以下所公開的內容並非用以限制本發明的保護範圍,在不悖離本發明構思精神的原則下,本領域技術人員可基於不同觀點與應用以其他不同實施例實現本發明。另外,需事先聲明的是,本發明的附圖僅為示意說明,並非依實際尺寸的描繪。此外,雖本文中可能使用第一、第二、第三等用語來描述各種元件,但該些元件不應受該些用語的限制。這些用語主要是用以區分元件。The following describes the implementation of the memory detection system, memory detection method, and error mapping table creation method disclosed by the present invention through specific specific examples and FIG. 1 to FIG. 6. Those skilled in the art can understand the content disclosed in this specification Understand the advantages and effects of the present invention. However, the content disclosed below is not intended to limit the protection scope of the present invention. Without departing from the spirit of the inventive concept, those skilled in the art can implement the present invention in other different embodiments based on different viewpoints and applications. In addition, it should be stated in advance that the drawings of the present invention are only schematic illustrations, and are not drawn according to actual sizes. In addition, although terms such as first, second, and third may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish components.

第一實施例First embodiment

請參閱圖1及圖2,本發明第一實施例提供一種如圖1所示的記憶體檢測系統U,以及如圖2所示的使用記憶體檢測系統U的記憶體檢測方法。首先,將依據圖1介紹本實施例記憶體檢測系統U的組成元件。本實施例的記憶體檢測方法將配合圖2說明一併揭露。1 and 2, the first embodiment of the present invention provides a memory detection system U as shown in FIG. 1 and a memory detection method using the memory detection system U as shown in FIG. 2. First, the components of the memory detection system U of this embodiment will be described based on FIG. 1. The memory detection method of this embodiment will be disclosed together with the description of FIG. 2.

如圖1所示,本實施例的記憶體檢測系統U包括待測裝置1以及電子裝置2。待測裝置1具有中央處理器10以及記憶體11。電子裝置2具有輸入單元20、控制單元21以及輸出單元22。明確而言,本實施例中,待測裝置1可為待檢測的電腦主機板,電子裝置2可為桌上型電腦或筆記型電腦,其具有控制單元21以實施上述記憶體檢測方法,並利用輸出單元22(例如:螢幕)供檢測人員監督檢測情況。然而,本發明不限於上述。此外,在本實施例中,記憶體11數量為二,然而,本發明不限制記憶體11數量。在其他實施例中,待測裝置1可以僅安裝有一個記憶體11或裝有兩個以上的記憶體11。As shown in FIG. 1, the memory detection system U of this embodiment includes a device under test 1 and an electronic device 2. The device under test 1 has a central processing unit 10 and a memory 11. The electronic device 2 has an input unit 20, a control unit 21, and an output unit 22. Specifically, in this embodiment, the device under test 1 may be a computer motherboard to be tested, and the electronic device 2 may be a desktop computer or a notebook computer, which has a control unit 21 to implement the above-mentioned memory detection method, and The output unit 22 (for example, a screen) is used for the inspection personnel to supervise the inspection situation. However, the present invention is not limited to the above. In addition, in this embodiment, the number of the memory 11 is two, however, the present invention does not limit the number of the memory 11. In other embodiments, the device under test 1 may be installed with only one memory 11 or with more than two memories 11.

本實施例是以內嵌式的記憶體11(embedded memory)作為示例來描述本發明,然而,本發明不對此加以限制。在其他實施例中,本發明可使用外接式記憶體或內接式記憶體的待測裝置。此外,本發明亦不限制待測裝置1與電子裝置2之間的連接方式,待測裝置1與電子裝置2之間可視待測裝置1的介面種類而決定適用的轉接器連接。例如,若待測裝置1為使用SPI介面的主機板,則可使用SPI-USB轉接器來連接待測裝置1與電子裝置2;本發明不限於上述舉例,在其他實施例中,待測裝置1也可使用USB、I2C等介面。The present embodiment takes the embedded memory 11 (embedded memory) as an example to describe the present invention, however, the present invention does not limit this. In other embodiments, the present invention may use an external memory or an internal memory device under test. In addition, the present invention also does not limit the connection method between the device under test 1 and the electronic device 2. The suitable adapter connection can be determined between the device under test 1 and the electronic device 2 according to the interface type of the device under test 1. For example, if the device under test 1 is a motherboard using an SPI interface, an SPI-USB adapter can be used to connect the device under test 1 and the electronic device 2; the present invention is not limited to the above example, in other embodiments, the device under test The device 1 can also use interfaces such as USB and I2C.

請參閱圖2,本實施例的記憶體檢測方法包括步驟S100:控制單元21接收待測裝置資訊,以使控制單元21根據待測裝置資訊讀取對應於待測裝置1的錯誤映射表;步驟S102:通過控制單元21讀取對應待測裝置1的一錯誤映射表,其中,錯誤映射表包括一組映射位址資料以及一組資料線資料,映射位址資料包括記憶體11的複數個映射位址,資料線資料包括記憶體11的複數個資料線(Data line)的複數個資料線名稱。錯誤映射表中,每一資料線名稱分別映射於每一映射位址的每一位元。Referring to FIG. 2, the memory detection method in this embodiment includes step S100: the control unit 21 receives the information of the device under test, so that the control unit 21 reads the error mapping table corresponding to the device under test 1 according to the information of the device under test; steps S102: Read an error mapping table corresponding to the device under test 1 through the control unit 21, wherein the error mapping table includes a set of mapping address data and a set of data line data, and the mapping address data includes a plurality of mappings of the memory 11 Address, data line data includes a plurality of data line names of a plurality of data lines of the memory 11 (Data line). In the error mapping table, each data line name is mapped to each bit of each mapping address.

本實施例中,待測裝置資訊可例如為待測裝置1的型號,例如,可通過使用電子裝置2的維修人員操作輸入單元20(例如:鍵盤)而輸入待測裝置資訊,接著,控制單元21根據該待測裝置資訊提取對應該型號的錯誤映射表。然而,本發明不限於此。在其他實施例中,例如當電子裝置2預設為用以檢測特定型號的待測裝置1,則可省略步驟S100。In this embodiment, the information of the device under test can be, for example, the model of the device under test 1, for example, the information of the device under test can be input by the maintenance personnel using the electronic device 2 to operate the input unit 20 (eg, a keyboard), and then, the control unit 21 Extract the error mapping table corresponding to the model according to the information of the device under test. However, the present invention is not limited to this. In other embodiments, for example, when the electronic device 2 is preset as the device under test 1 for detecting a specific model, step S100 may be omitted.

錯誤映射表內至少包括每一記憶體11的映射位址及資料線名稱。在本實施例中,映射位址為記憶體11中任一條資料線損壞時,內容值的存取將會受到影響的位址。錯誤映射表內還儲存有每一記憶體11的每一條資料線名稱,明確來說,資料線名稱為記憶體資料線的指定符。此外,本實施例中,錯誤映射表還具有待測裝置1的每一記憶體11在電路中的零件名稱(Component Reference Designator),然而,本發明不限於此。The error mapping table includes at least the mapping address and data line name of each memory 11. In this embodiment, the mapping address is the address where the access to the content value will be affected when any data line in the memory 11 is damaged. The name of each data line of each memory 11 is also stored in the error mapping table. Specifically, the name of the data line is the designator of the memory data line. In addition, in this embodiment, the error mapping table also has a component name (Component Reference Designator) in the circuit of each memory 11 of the device under test 1, however, the present invention is not limited to this.

錯誤映射表內的每一該資料線名稱在該錯誤映射表中分別映射於每一該映射位址的每一位元。詳細來說,由於每一資料線對應一位元的資料,錯誤映射表紀錄了每一記憶體11的每一資料線對應於每一映射位址中的何位元。以下將以表一來說明本發明的錯誤映射表的其中一實施樣態。Each data line name in the error mapping table is mapped to each bit of each mapping address in the error mapping table. In detail, since each data line corresponds to one bit of data, the error mapping table records which bit in each mapped address corresponds to each data line of each memory 11. The following will describe one embodiment of the error mapping table of the present invention with Table 1.

表一

Figure 107119395-A0304-0001
Table I
Figure 107119395-A0304-0001

如表一所示,本實施例的錯誤映射表儲存有待測裝置1每一記憶體11的零件名稱(U2001、U2002),每一記憶體11對應的映射位址(0x80000001至0x80000015、0x80000002至0x8000002A)、每一記憶體11的每一資料線名稱(1D0至1D7、2D0至2D7)以及每一記憶體11中資料線名稱與位元編號的對應關係。舉例而言,由表一中可看出,零件名稱為U2001的記憶體11其資料線1D7對應到映射位址0x80000001至0x80000015的第0位元。又例如,零件名稱為U2002的記憶體其資料線2D5對應到映射位址0x80000002至0x8000002A的第3位元。As shown in Table 1, the error mapping table of this embodiment stores the part names (U2001, U2002) of each memory 11 of the device under test 1, and the corresponding mapping address (0x80000001 to 0x80000015, 0x80000002 to 0x8000002A), each data line name (1D0 to 1D7, 2D0 to 2D7) of each memory 11 and the correspondence relationship between the data line name and the bit number in each memory 11. For example, as can be seen from Table 1, the data line 1D7 of the memory 11 with the part name U2001 corresponds to the 0th bit of the mapping address 0x80000001 to 0x80000015. For another example, in the memory with the part name U2002, the data line 2D5 corresponds to the third bit of the mapping address 0x80000002 to 0x8000002A.

明確來說,U2001、U2002、1D0至1D7以及2D0至2D7為通過控制單元21給予各記憶體11及其各條資料線的零件名稱。在本實施例中,1D0代表記憶體U2001的第0個資料線,2D3代表記憶體U2002的第3個資料線。然而,本發明不以此為限,例如,記憶體或資料線的零件名稱可依實際上待測裝置1的電路圖中所給予零件的名稱而設定相同或相對應的名稱,且由於不同實施例中,待測裝置1電路圖中的零件名稱設定方式可能不同,故不以本實施例為限;記憶體及其資料線在錯誤映射表中的零件名稱設定方式較佳以維修人員可依照電路圖判別錯誤為主。此外,在其他實施樣態中,錯誤映射表可經由表格的排列方式以及資料線指定符的設定方式來分隔不同記憶體11的映射位址以及資料線名稱,如此,錯誤映射表內可不須包括記憶體指定符。Specifically, U2001, U2002, 1D0 to 1D7 and 2D0 to 2D7 are part names given to each memory 11 and each data line by the control unit 21. In this embodiment, 1D0 represents the 0th data line of the memory U2001, and 2D3 represents the 3rd data line of the memory U2002. However, the present invention is not limited to this. For example, the names of the parts of the memory or the data line can be set to the same or corresponding names according to the names of the parts actually given to the circuit diagram of the device under test 1, and due to different embodiments In the circuit diagram of the device under test 1, the part name setting method may be different, so it is not limited to this embodiment; the part name setting method of the memory and its data line in the error mapping table is better, so that the maintenance personnel can judge according to the circuit diagram Mistakes dominate. In addition, in other implementations, the error mapping table can separate the mapping addresses and data line names of different memories 11 through the arrangement of the table and the setting method of the data line specifier, so that the error mapping table need not include Memory specifier.

接著,請參閱圖2,本實施例的記憶體檢測方法執行步驟S104:以控制單元21讀取映射位址資料;步驟S106:以控制單元21對所讀取之每一映射位址寫入一檢查位元組;步驟S108:以控制單元21讀取每一映射位址因應檢查位元組的一位址值;步驟S110:以控制單元21判斷每一位址值的每一位元的位元值與檢查位元組中相對應的位元的位元值是否相同;以及步驟S112:控制單元21根據錯誤映射表判斷映射於至少一位元的至少一資料線為故障。Next, referring to FIG. 2, the memory detection method of this embodiment performs step S104: the control unit 21 reads the mapped address data; step S106: the control unit 21 writes one to each mapped address read Check the byte; Step S108: Use the control unit 21 to read each mapped address corresponding to the bit value of the checked byte; Step S110: Use the control unit 21 to determine the bit of each bit of each address value The bit value is the same as the bit value of the corresponding bit in the check bit group; and Step S112: The control unit 21 determines that at least one data line mapped to at least one bit is faulty according to the error mapping table.

以表一的錯誤映射表為例,步驟S106中,控制單元21讀取表一中所有映射位址後,分別對所有映射位址寫入一檢查位元組。本實施例中,檢查位元組為全1位元組或全0位元組,即11111111或00000000。記憶體的資料線故障情形可概分為兩種,即開路與短路。當一資料線形成開路,對其所影響的位址而言,寫入0或1的動作都將失效,並且位址值恆為1。換言之,當一資料線開路,即使對其所影響的位址寫入0,當回讀位址值,得到的返回值仍將為1。因此,當使用全0的檢查位元組而寫入映射位址,可判斷資料線是否有開路的情形。相反地,當一資料線形成短路,對於其所影響的位址來說,寫入0或1的動作都將失效,並且位址值恆為0。亦即當一資料線短路,即使對其所影響的位址寫入1,當回讀位址值,得到的返回值仍將為0。因此使用全1的檢查位元組可以判別資料線是否存在短路。Taking the error mapping table in Table 1 as an example, in step S106, after reading all the mapping addresses in Table 1, the control unit 21 writes a check byte to all the mapping addresses, respectively. In this embodiment, the check byte is all 1 byte or all 0 bytes, that is, 11111111 or 00000000. There are two types of memory data line failures, namely open circuit and short circuit. When a data line forms an open circuit, the writing of 0 or 1 will fail for the address it affects, and the address value is always 1. In other words, when a data line is open, even if 0 is written to the address affected by it, when the address value is read back, the return value will still be 1. Therefore, when using the check byte of all 0s and writing the mapping address, it can be judged whether the data line is open. Conversely, when a data line forms a short circuit, for the address it affects, the action of writing 0 or 1 will be invalid, and the address value is always 0. That is, when a data line is short-circuited, even if a 1 is written to the address affected by it, when the address value is read back, the returned value will still be 0. Therefore, the use of all 1 check bytes can determine whether there is a short circuit in the data line.

因此,執行步驟S108及步驟S110之後,若得到待測裝置1回傳的位址值與寫入的檢查位元組不符,控制單元21會判斷不符合期望值的位元對應的資料線為短路或開路(步驟112)。以下以表二進一步舉例說明。Therefore, after performing steps S108 and S110, if the address value returned by the device under test 1 does not match the written check byte, the control unit 21 determines that the data line corresponding to the bit that does not meet the expected value is short-circuited or Open circuit (step 112). The following is further illustrated in Table 2.

表二

Figure 107119395-A0304-0002
Table II
Figure 107119395-A0304-0002

請參閱表二,當控制單元21對指定符為U2001的記憶體11的映射位址0x80000009寫入全0位元組,控制單元21對該映射位址的期望值會是全0位元組,換言之,當控制單元21讀取映射位址對應檢查位元組的位址值,會預期讀回的位址值為全0。期望值設為與檢查位元組相同的原因在於,若記憶體U2001的資料線沒有故障,映射位址0x80000009在寫入全0位元組之後的位址值應為全0。此時,若控制單元21讀取映射位址0x80000009被寫入全0位元組之後的位址值,而得到的回傳值為00100000,則可判斷記憶體U2001的第5位元對應的資料線為開路。接著,控制單元21會對錯誤映射表進行查表。而由表一可知,記憶體U2001的第5位元對應到記憶體U2001的第6個資料線,則控制單元21會判斷記憶體U2001的第6個資料線為開路。Please refer to Table 2. When the control unit 21 writes all 0 bytes to the mapped address 0x80000009 of the memory 11 designated by U2001, the expected value of the control unit 21 for the mapped address will be all 0 bytes, in other words When the control unit 21 reads the address value of the check byte corresponding to the mapped address, it expects that the read back address value is all 0s. The reason why the expected value is set to be the same as the check byte is that if the data line of the memory U2001 is not faulty, the address value of the mapped address 0x80000009 after writing all 0 bytes should be all 0s. At this time, if the control unit 21 reads the address value after the mapped address 0x80000009 is written to all 0 bytes, and the returned value is 00100000, the data corresponding to the fifth bit of the memory U2001 can be determined The line is open. Next, the control unit 21 looks up the error mapping table. It can be seen from Table 1 that the fifth bit of the memory U2001 corresponds to the sixth data line of the memory U2001, and the control unit 21 determines that the sixth data line of the memory U2001 is an open circuit.

復請參閱表二。同樣地,當控制單元21對指定符為U2002的記憶體11的映射位址0x8000000A寫入全1位元組,控制單元21對該映射位址的位址值期望值會是全1。而當控制單元21對該映射位址讀取到的回傳值是11110111,則可判斷記憶體U2002的第3位元對應的資料線為短路。此時控制單元21對錯誤映射表進行查表,而由表一可知,記憶體U2002的第3位元對應的資料線為記憶體U2002的第5個資料線,則控制單元21會判斷記憶體U2002的第5個資料線為短路。Please refer to Table 2 for details. Similarly, when the control unit 21 writes all 1-bytes to the mapping address 0x8000000A of the memory 11 designated by U2002, the control unit 21 expects the address value of the mapping address to be all ones. When the return value read by the control unit 21 from the mapped address is 11110111, it can be determined that the data line corresponding to the third bit of the memory U2002 is short-circuited. At this time, the control unit 21 looks up the error mapping table, and from Table 1, it can be seen that the data line corresponding to the third bit of the memory U2002 is the fifth data line of the memory U2002, then the control unit 21 will determine the memory The fifth data line of U2002 is short circuit.

本實施例中,控制單元21可對錯誤映射表內的所有映射位址先寫入全1位元組,判斷待測裝置1的記憶體11有無短路情形之後,再對所有映射位址寫入全0位元組,判斷待測裝置1的記憶體11有無開路情形。然而,本發明不限於此。例如,在只需判斷短路的情況下,可僅對映射位址寫入全1位元組。In this embodiment, the control unit 21 can first write all the mapping addresses in the error mapping table to all 1 bytes, determine whether the memory 11 of the device under test 1 is short-circuited, and then write to all the mapping addresses All 0 bytes to determine whether the memory 11 of the device under test 1 has an open circuit. However, the present invention is not limited to this. For example, in the case where it is only necessary to judge the short circuit, only one byte can be written to the mapped address.

進一步來說,如圖2所示,本實施例在步驟S112之後還可進一步包括步驟S114:控制單元21通過輸出單元22顯示至少一位元所對應的至少一資料線的一故障狀態。步驟S114之後,記憶體測試結束。舉例而言,輸出單元22可為螢幕,而控制單元21利用該螢幕顯示記憶體檢測結果,其中檢測結果包括:記憶體U2001的第6個資料線為開路,記憶體U2002的第5個資料線為短路。本發明不限於上述。在其他實施例中,也可經由他種方式提供維修人員測試結果。Further, as shown in FIG. 2, after step S112, this embodiment may further include step S114: the control unit 21 displays an error status of at least one data line corresponding to at least one bit through the output unit 22. After step S114, the memory test ends. For example, the output unit 22 may be a screen, and the control unit 21 uses the screen to display the memory detection result, where the detection result includes: the sixth data line of the memory U2001 is an open circuit, and the fifth data line of the memory U2002 Is a short circuit. The present invention is not limited to the above. In other embodiments, maintenance personnel test results can also be provided in other ways.

如圖2所示,本實施例中,若控制單元21判斷每一位址值的每一位元的位元值與檢查位元組中相對應的位元的位元值相同,例如,對映射位址的預期值與回傳值相同,則控制單元21判斷記憶體11無故障並執行步驟S116:控制單元21通過輸出單元22顯示記憶體11無故障,記憶體測試結束。As shown in FIG. 2, in this embodiment, if the control unit 21 determines that the bit value of each bit of each address value is the same as the bit value of the corresponding bit in the check bit group, for example, If the expected value of the mapped address is the same as the return value, the control unit 21 determines that the memory 11 is fault-free and executes step S116: the control unit 21 indicates that the memory 11 is fault-free through the output unit 22, and the memory test is completed.

值得一提的是,在本發明其他實施例中,本實施例的記憶體檢測方法可與待測裝置1的開機檔案整合,在此實施例中,待測裝置1可設置於電子裝置2內,且步驟S100可省略。當待測裝置1開機時遇到錯誤情形,電子裝置2的控制單元21直接從步驟S102開始進行記憶體11的檢測。It is worth mentioning that, in other embodiments of the present invention, the memory detection method of this embodiment can be integrated with the boot file of the device under test 1, in this embodiment, the device under test 1 can be disposed in the electronic device 2 And step S100 can be omitted. When the device under test 1 encounters an error condition when it is turned on, the control unit 21 of the electronic device 2 directly starts the detection of the memory 11 from step S102.

此外,本實施例以電子裝置2的控制單元21執行錯誤映射表的讀取、檢查位元組的寫入動作以及位址值的判斷,然而,本發明亦不限於此。在其他實施例中,也可例如但不限於由待測裝置1內建的微控制單元執行上述步驟,或由待測裝置1內建的微控制單元及電子裝置2的控制單元共同完成。In addition, in this embodiment, the control unit 21 of the electronic device 2 performs the reading of the error map, the writing operation of the check byte, and the judgment of the address value. However, the present invention is not limited thereto. In other embodiments, the above steps may be performed by, for example, but not limited to, the micro control unit built in the device under test 1 or the micro control unit built in the device under test 1 and the control unit of the electronic device 2 may be implemented together.

另外,需要說明的是,表二中以一條資料線故障為例來說明控制單元21依據位址值判斷資料線故障情形的方式,然而,本發明不限於此。例如,在表一的實施例中,當記憶體U2001的映射位址0x80000001在寫入全1位元組之後的回傳值是10111110,則對表一查表後可判斷記憶體U2001的第四條資料線及第七條資料線同時短路。In addition, it should be noted that a data line failure is taken as an example in Table 2 to describe the manner in which the control unit 21 determines the data line failure situation according to the address value. However, the present invention is not limited to this. For example, in the embodiment of Table 1, when the mapped address of the memory U2001 is 0x80000001 and the return value after writing all 1 byte is 10111110, the table 4 can be judged to determine the fourth position of the memory U2001 The data line and the seventh data line are short-circuited at the same time.

此外,應理解的是,表一及表二僅為本發明的記憶體檢測方法及系統U的實施示例,記憶體11實際的映射位址、映射位址數量以及資料線與位元的對應關係不以表中為限。此外,本實施例以具有八條資料線的記憶體為例,然而,本發明亦不以此為限。在其他實施例中,本發明的記憶體測試方法及記憶體測試系統也可適用於具有例如16條資料線的記憶體。換言之,本發明的記憶體測試方法及記憶體測試系統不限制待測裝置1的記憶體11的資料寬度。In addition, it should be understood that Tables 1 and 2 are only examples of the implementation of the memory detection method and system U of the present invention. The actual mapped addresses of the memory 11, the number of mapped addresses, and the correspondence between the data lines and the bits Not limited to the table. In addition, in this embodiment, a memory with eight data lines is used as an example, however, the invention is not limited thereto. In other embodiments, the memory testing method and memory testing system of the present invention can also be applied to a memory having, for example, 16 data lines. In other words, the memory testing method and memory testing system of the present invention do not limit the data width of the memory 11 of the device under test 1.

藉由上述技術方案,本實施例的記憶體測試方法及記憶體檢測系統U與習知技術的記憶體電性測試相比,不須使用成本高昂的探針治具,也不須在主板上另增測試點,僅需使用計算裝置連接主機板,並執行上述記憶體測試方法,因此可降低了記憶體測試的成本並提高了測試效率。此外,本發明的記憶體測試方法可直接將出現故障的資料線以及故障情形(例如:開路或短路)經由輸出單元22呈現給維修人員,因此,相較於習知技術的記憶體功能測試方法,本發明的記憶體測試方法不需研發端人員來對測試結果進行判讀,進一步降低了人事成本。With the above technical solution, the memory test method and the memory detection system U of this embodiment do not need to use costly probe fixtures and do not need to be on the motherboard as compared with the conventional electrical memory test In addition to the additional test points, it is only necessary to use a computing device to connect to the motherboard and perform the above-mentioned memory test method, thus reducing the cost of memory test and improving the test efficiency. In addition, the memory test method of the present invention can directly present the faulty data line and the fault condition (for example: open circuit or short circuit) to the maintenance personnel through the output unit 22, therefore, compared to the conventional technology memory function test method The memory testing method of the present invention does not require R&D personnel to interpret the test results, which further reduces personnel costs.

第二實施例Second embodiment

以下將配合圖3至圖6說明本發明第二實施例。圖3及圖4顯示本發明第二實施例提供的記憶體測試系統U’,圖5顯示本實施例提供的錯誤映射表建立方法。首先將配合圖3及圖4說明本實施例的組成元件,而使用該些組成元件執行的錯誤映射表建立方法將配合圖5揭示。The second embodiment of the present invention will be described below with reference to FIGS. 3 to 6. 3 and 4 show the memory test system U'provided by the second embodiment of the present invention, and FIG. 5 shows the method for creating an error mapping table provided by this embodiment. First, the constituent elements of this embodiment will be described with reference to FIGS. 3 and 4, and the method of creating an error map using these constituent elements will be disclosed with reference to FIG. 5.

圖3顯示本實施例的記憶體測試系統U’的功能方塊圖。如圖所示,本實施例的記憶體測試系統U’包括無故障待測裝置1’、測試治具3以及電子裝置2。無故障待測裝置1’包括中央處理器10’以及無故障記憶體11’。電子裝置2的實施樣態與第一實施例相同,於此不再贅述。無故障待測裝置1’的中央處理器10’與待測裝置1的中央處理器10相同,亦即,無故障待測裝置1’具有與待測裝置1相同的處理電路。此外,無故障記憶體11’與記憶體11具有相同的資料寬度,且本實施例中,無故障記憶體11’的數量與第一實施例中的記憶體11數量相同。明確而言,待測裝置1與無故障待測裝置1’為同一製造商所生產的同一型號的產品,惟無故障待測裝置1’是經過測試的已知良品。Fig. 3 shows a functional block diagram of the memory test system U'of this embodiment. As shown in the figure, the memory test system U'of this embodiment includes a fault-free device under test 1', a test fixture 3, and an electronic device 2. The trouble-free device 1'includes a central processing unit 10' and a trouble-free memory 11'. The implementation of the electronic device 2 is the same as that of the first embodiment, and will not be repeated here. The central processing unit 10' of the non-faulty device under test 1'is the same as the central processor 10 of the device 1 under test, that is, the non-faulty device 1'has the same processing circuit as the device 1 under test. In addition, the fault-free memory 11' and the memory 11 have the same data width, and in this embodiment, the number of the fault-free memory 11' is the same as the number of the memory 11 in the first embodiment. Specifically, the device under test 1 and the device under test 1'are products of the same model manufactured by the same manufacturer, but the device under test 1'is a known good product that has been tested.

圖4中所示的記憶體檢測系統U’’為圖3的記憶體檢測系統U’的變化實施例。如圖4所示,無故障記憶體11’的各資料線以走線110連接於測試點P。測試治具3具有測試探針模組30、開關模組31以及微控制單元32。測試探針模組30具有至少一頂針301,且測試探針模組30通過頂針301連接於無故障記憶體11’的其中一資料線。本實施例中,測試探針模組30具有兩個頂針301,各對應於每一無故障記憶體11’。然而,本發明不限於此。在其他實施例中,測試探針模組30的頂針301數量可等於無故障記憶體11’的資料線數量總和,且每一頂針301分別通過一測試點P及一走線110而連接於每一資料線。The memory detection system U'' shown in Fig. 4 is a modified embodiment of the memory detection system U'of Fig. 3. As shown in FIG. 4, each data line of the fault-free memory 11' is connected to the test point P with a trace 110. The test fixture 3 has a test probe module 30, a switch module 31, and a micro control unit 32. The test probe module 30 has at least one thimble 301, and the test probe module 30 is connected to one of the data lines of the fault-free memory 11' through the thimble 301. In this embodiment, the test probe module 30 has two thimble pins 301, each corresponding to each trouble-free memory 11'. However, the present invention is not limited to this. In other embodiments, the number of thimble pins 301 of the test probe module 30 may be equal to the total number of data lines of the fault-free memory 11 ′, and each thimble pin 301 is connected to each pin through a test point P and a trace 110 respectively. A data line.

本實施例中,開關模組31為數位或類比開關,連接於測試探針模組30與微控制單元32之間。然而,本發明不限於此;在其他實施例中,開關模組31也可例如以單刀多擲開關實現。本實施例中,微控制單元32是微控制器(microcontroller)。由於微控制器可獨立運作,並可完成本實施例的錯誤映射表建立方法,因此在本變化實施例中,記憶體測試系統U’僅具有無故障待測裝置1’以及測試治具3,不包括電子裝置2。電子裝置2在第二實施例中主要用以顯示測試結果給操作人員,並提供操作人員進行其他測試相關操作。In this embodiment, the switch module 31 is a digital or analog switch, and is connected between the test probe module 30 and the micro control unit 32. However, the present invention is not limited to this; in other embodiments, the switch module 31 may also be implemented with a single-pole multi-throw switch, for example. In this embodiment, the micro control unit 32 is a microcontroller (microcontroller). Since the microcontroller can operate independently and can complete the error mapping table creation method of this embodiment, in this modified embodiment, the memory test system U'only has a fault-free device under test 1'and a test fixture 3, Does not include the electronic device 2. In the second embodiment, the electronic device 2 is mainly used to display the test result to the operator and provide the operator with other test-related operations.

請參閱圖5,本實施例的錯誤映射表建立方法包括步驟S200:提供無故障待測裝置1’,無故障待測裝置1’包括無故障記憶體11’,在步驟S200中,無故障待測裝置1’與待測裝置1具有相同的中央處理器10,無故障記憶體11’與記憶體11具有相同的資料寬度,且無故障記憶體11’數量與記憶體11數量相同;步驟S202:提供測試治具,其包括:測試探針模組30、開關模組31以及微控制單元32,其中,開關模組31連接於測試探針模組30與微控制單元32之間;步驟S204:將測試探針模組30連接於無故障待測裝置1’的無故障記憶體11’的其中之一資料線;步驟S206:通過微控制單元32控制開關模組31,以使無故障記憶體11’的其中之一資料線、測試探針模組30與開關模組31之間形成短路;步驟S208:通過微控制單元32以對無故障記憶體11’的一測試位址區間內的所有位址的寫入一全1位元;以及步驟S210:通過微控制單元32以判斷測試位址區間內的所有位址因應全1位元的位址值是否為全1位元。Referring to FIG. 5, the method for creating an error mapping table in this embodiment includes step S200: providing a device 1′ to be tested without failure, which includes a memory 11′ to be tested, and in step S200, to be tested without failure The device under test 1'has the same CPU 10 as the device under test 1, the fault-free memory 11' has the same data width as the memory 11, and the number of fault-free memories 11' is the same as the number of memories 11; step S202 : Provide a test fixture, which includes: a test probe module 30, a switch module 31, and a micro control unit 32, wherein the switch module 31 is connected between the test probe module 30 and the micro control unit 32; step S204 : Connect the test probe module 30 to one of the data lines of the fault-free memory 11' of the fault-to-be-tested device 1'; Step S206: Control the switch module 31 through the micro-control unit 32 to make the fault-free memory One of the data lines of the body 11', the test probe module 30 and the switch module 31 form a short circuit; Step S208: the micro control unit 32 is used to test the fault-free memory 11' within a test address interval All of the addresses are written in one full bit; and step S210: the micro control unit 32 is used to determine whether all the addresses in the test address interval correspond to the full one bit or not.

步驟S206作用在於模擬其中之一資料線形成短路時的情形。當資料線形成短路,步驟S208中寫入全1位元的動作將無法對經短路處理的資料線所影響的位址中的位元寫入1值,且只要經短路處理的資料線還處於短路狀態,該位元的位元值將恆為0。因此,當微控制單元32執行步驟S210,微控制單元32會判斷該測試位址區間內,被經短路處理的資料線所影響的位址之位址值不為全1。換言之,步驟S210的作用在於找出第一實施例所述的映射位址,即資料線故障時受影響的位址。Step S206 is used to simulate the situation when one of the data lines forms a short circuit. When the data line is short-circuited, the operation of writing all 1 bits in step S208 will not be able to write a value of 1 in the address affected by the short-circuited data line, and as long as the short-circuited data line is still in In the short-circuit state, the bit value of this bit will always be 0. Therefore, when the micro control unit 32 executes step S210, the micro control unit 32 determines that the address value of the address affected by the short-circuited data line in the test address interval is not all ones. In other words, the function of step S210 is to find the mapping address described in the first embodiment, that is, the address affected when the data line is faulty.

接著,如圖5所示,本實施例的錯誤映射表建立方法還包括步驟S212:若測試位址區間內的其中之一位址的位址值不為全1位元,微控制單元32建立對應待測裝置1的錯誤映射表,並將其中之一位址以及經短路處理的其中之一資料線的資料線名稱儲存於錯誤映射表,且在錯誤映射表中建立該其中之一位址、該其中之一位址的位址值中不為1的位元以及經短路處理的其中之一資料線的資料線名稱之間的映射關係。Next, as shown in FIG. 5, the method for creating an error map in this embodiment further includes step S212: if the address value of one of the addresses in the test address interval is not all 1 bit, the micro control unit 32 creates Corresponding to the error mapping table of the device under test 1, and storing one of the address and the data line name of one of the data lines after short-circuit processing in the error mapping table, and creating the one of the address in the error mapping table , The mapping relationship between the bit value of the address value of one of the addresses that is not 1 and the name of the data line of one of the data lines that has been short-circuited.

詳細而言,步驟S212中,微控制單元32藉由比對位址值而辨識出映射位址,並建立一錯誤映射表,此錯誤映射表可儲存在微控制單元32內或圖3的電子裝置2中,供後續待測裝置1出現開機錯誤等故障情形時作檢測之用(圖2中步驟S100至S116)。接著,微控制單元32將步驟S210中所有被判斷不為全1的位址(即映射位址)以及經短路處理的資料線名稱儲存於錯誤映射表,並建立兩者之間的映射關係。更進一步來說,本步驟中,微控制單元32會同時將經短路處理的資料線映射於不為全1的位址中位址值不為1的位元。以下將配合表三及表四更進一步描述步驟S204至步驟S212。In detail, in step S212, the micro control unit 32 recognizes the mapping address by comparing the address values and creates an error mapping table, which can be stored in the micro control unit 32 or the electronic device of FIG. 3 In 2, it is used for detection when the device under test 1 has a power-on error or other fault conditions (steps S100 to S116 in FIG. 2). Next, the micro control unit 32 stores all the addresses determined in step S210 that are not all ones (ie, mapped addresses) and the names of the data lines that have been short-circuited in the error mapping table, and establishes a mapping relationship between the two. Furthermore, in this step, the micro-control unit 32 simultaneously maps the short-circuited data lines to the bits whose address value is not 1 among the addresses that are not all ones. The steps S204 to S212 will be further described below in conjunction with Tables 3 and 4.

表三

Figure 107119395-A0304-0003
Table 3
Figure 107119395-A0304-0003

請配合參閱表三。表三顯示無故障記憶體11’的一測試位址區間。為方便說明,本實施例使用與第一實施例相對應的指定符來說明本實施例的無故障記憶體11’及其資料線。舉例而言,在步驟S204中,測試探針模組30以頂針301連接於無故障記憶體U2001第四個資料線1D4,步驟S206中,通過微控制單元32而控制開關模組31,而將第四個資料線1D4形成短路。接著,步驟S208中,通過微控制單元32對表三中的所有位址寫入全1位元組,以十六進位表示即為FF。步驟S210中,微控制單元32讀取測試位址區間的所有位址值,而得到如表三所示的結果,其中,有部分位址的位址值不為全1(表三中,以粗體斜線表示不為全1的位址值),如0x000000211的位址值為7F。表三中所有位址值不為全1的位址即為對應於資料線1D4的映射位址。表三中映射位址的位址值皆為7F,以二進位表示則為01111111,表示無故障記憶體U2001的資料線1D4對應表三中所有映射位址的第7位元。Please refer to Table 3. Table 3 shows a test address interval of the fault-free memory 11'. For convenience of description, this embodiment uses the specifier corresponding to the first embodiment to describe the trouble-free memory 11' and its data line of this embodiment. For example, in step S204, the test probe module 30 is connected to the fourth data line 1D4 of the fault-free memory U2001 with a thimble 301. In step S206, the switch module 31 is controlled by the micro control unit 32, and the The fourth data line 1D4 forms a short circuit. Next, in step S208, the micro-control unit 32 writes all 1-byte bytes to all the addresses in Table 3, which is expressed as FF in hexadecimal. In step S210, the micro control unit 32 reads all the address values in the test address interval, and obtains the results shown in Table 3. Among them, the address values of some addresses are not all 1 (in Table 3, the Bold slashes indicate address values that are not all ones). For example, the address value of 0x000000211 is 7F. In Table 3, all addresses whose address values are not all 1s are the mapped addresses corresponding to the data line 1D4. The address values of the mapped addresses in Table 3 are all 7F. In binary, it is 01111111, which means that the data line 1D4 of the fault-free memory U2001 corresponds to the 7th bit of all mapped addresses in Table 3.

表四

Figure 107119395-A0304-0004
Table 4
Figure 107119395-A0304-0004

接著,請見表四,在步驟S212中,微控制單元32建立如表四的錯誤映射表,並將所有測試位址區間位址值不為全1的位址(即表三中的位址值為7F的位址)以及資料線1D4存入表四,其中,資料線1D4儲存到第7位元對應的欄位,至此,步驟S212完成。Next, please refer to Table 4. In step S212, the micro control unit 32 establishes an error mapping table as shown in Table 4, and sets all the test address interval address values that are not all ones (that is, the addresses in Table 3 The address with a value of 7F) and the data line 1D4 are stored in Table 4, where the data line 1D4 is stored in the field corresponding to the 7th bit, and thus, step S212 is completed.

請見圖5,本實施例的錯誤映射表建立方法在步驟S212後還進一步包括步驟S214:判斷無故障記憶體11’的所有資料線是否皆已完成測試。此處的「測試」意指對資料線執行步驟S204至步驟S210。若否,則回到步驟204,對尚未完成測試的資料線執行步驟S204至S210,直至零件名稱U2001的無故障記憶體11’的其餘每一資料線(1D0、1D2、1D3、1D5、1D6、1D7)以及零件名稱為U2002的無故障記憶體11’的每一資料線(2D0至2D7)皆完成測試為止,而完成形式如表五的待測裝置1的錯誤映射表。為方便說明,表五中僅列舉部分映射位址作為示意。應當理解的是,實際映射位址、實際映射位址的數目以及資料線與位元編號的對應關係視實際應用時所使用的待測裝置、待測裝置的記憶體而定,不以表中所示為限。Please refer to FIG. 5. After the step S212, the method for creating an error mapping table further includes step S214: determining whether all the data lines of the fault-free memory 11' have been tested. The "test" here means that steps S204 to S210 are performed on the data line. If not, return to step 204, and perform steps S204 to S210 on the data lines that have not yet completed the test, until each remaining data line (1D0, 1D2, 1D3, 1D5, 1D6, 1D0, 1D2, 1D3, 1D6, 1D7) and each data line (2D0 to 2D7) of the fault-free memory 11' with the part name U2002 is completed until the test, and the error mapping table of the device under test 1 in the form shown in Table 5 is completed. For convenience of description, only a part of the mapped addresses are listed in Table 5 as an illustration. It should be understood that the actual mapped addresses, the number of actual mapped addresses, and the correspondence between the data lines and the bit numbers depend on the device under test and the memory of the device under test in actual application, not in the table As shown.

表五

Figure 107119395-A0304-0005
Table 5
Figure 107119395-A0304-0005

值得一提的是,在本發明另一實施例當中,測試探針模組30具有的頂針301數量可與資料線數目相同,每一頂針301分別通過測試點P連接於每一資料線,而開關模組31使用數位或類比開關實現。在此實施例中,步驟S200至S214可通過微控制單元32以全自動方式單獨完成,進一步提升測試效率。It is worth mentioning that in another embodiment of the present invention, the number of thimble pins 301 of the test probe module 30 may be the same as the number of data lines, and each thimble pin 301 is connected to each data line through the test point P, and The switch module 31 is implemented using digital or analog switches. In this embodiment, steps S200 to S214 can be completed individually by the micro control unit 32 in a fully automatic manner, further improving the test efficiency.

此外,本發明在其他實施例當中,可在步驟S210之後以其他方式記錄經短路處理資料線、受短路資料線影響而位址值不為全1的位址及其位元值不為1的位元之間的映射關係,而不以建立錯誤映射表為限。舉例而言,可以設立標籤(tag)的方式建立資料線與位元的映射關係。In addition, in other embodiments of the present invention, after step S210, the short-circuited data line, the address affected by the short-circuit data line and whose address value is not all 1 and its bit value other than 1 can be recorded in other ways. The mapping relationship between bits is not limited to the establishment of an error mapping table. For example, the mapping relationship between the data line and the bit can be established by establishing a tag.

請參見圖6,進一步來說,本發明另一變化實施例的記憶體檢測方法還可包括上述的測試位址區間的選取方法。測試位址區間選取方法包括步驟S300:以微控制單元32啟動無故障待測裝置1’:步驟S302:以微控制單元32讀取無故障記憶體的一位址內容值表;以及步驟S304:以微控制單元32根據位址內容值表而選取無故障記憶體的一位址區間以作為測試位址區間,其中,該位址區間內所有位址的內容值為0。Please refer to FIG. 6. Further, the memory detection method according to another modified embodiment of the present invention may further include the method for selecting the test address interval described above. The method for selecting the test address interval includes step S300: the micro-control unit 32 starts the fault-free device under test 1': step S302: the micro-control unit 32 reads the one-bit content value table of the fault-free memory; and step S304: The micro control unit 32 selects a one-bit address section of the non-faulty memory as the test address section according to the address content value table, wherein the content value of all addresses in the address section is 0.

詳細來說,本變化實施例中是在確認無故障待測裝置1’開機完成之後,選取無故障記憶體11’內容值為0的一位址區間作為測試位址區間。如此,可避免執行圖2中的記憶體測試方法時,清除掉記憶體11中的開機資料,影響記憶體11運作。In detail, in this modified embodiment, after confirming that the trouble-free device 1'is turned on, the one-bit address interval with the content value of the zero-fault memory 11' as 0 is selected as the test address interval. In this way, it is possible to avoid erasing the boot data in the memory 11 and affecting the operation of the memory 11 when executing the memory test method in FIG. 2.

綜合上述,藉由上述技術手段,本發明所提供的記憶體檢測方法、錯誤映射表建立方法以及記憶體檢測系統藉由「通過控制單元讀取對應該待測裝置的錯誤映射表」、「以控制單元對所讀取之每一映射位址寫入一檢查位元組」、以及「以控制單元判斷每一位址值的每一位元的位元值與檢查位元組中相對應的位元的位元值是否相同」的技術方案,以達到「若位址值中至少一位元的位元值與該檢查位元組中相對應的位元的位元值不同,控制單元根據該錯誤映射表判斷映射於該至少一位元的資料線為故障」。In summary, by the above technical means, the memory detection method, the error mapping table creation method and the memory detection system provided by the present invention are achieved by "reading the error mapping table corresponding to the device under test through the control unit", " The control unit writes a check byte to each mapped address read", and "uses the control unit to determine the bit value of each bit of each address value corresponding to the check byte Whether the bit value of the bit is the same” to achieve “if the bit value of at least one bit in the address value is different from the bit value of the corresponding bit in the check bit group, the control unit The error mapping table determines that the data line mapped to the at least one bit is defective."

藉此,本發明的記憶體檢測方法、錯誤映射表建立方法以及記憶體檢測系統與現有技術的記憶體電性測試法相比,可省去成本高的探針治具,也不須在主板上另增測試點。僅需使用計算裝置連接主機板,並透過計算裝置的控制單元執行本發明的記憶體測試方法,因此降低了記憶體測試的成本並提高了測試效率。此外,本發明的記憶體測試方法可直接將出現故障的資料線以及故障情形經由輸出單元22呈現給維修人員,因此,相較於習知技術的記憶體功能測試方法,本發明的記憶體測試方法不需專業人員來對開機程式進行判讀,進一步降低了人事成本。In this way, the memory detection method, the error mapping table creation method and the memory detection system of the present invention can save the costly probe fixture compared to the prior art memory electrical test method, and do not need to be on the motherboard Another test point. It only needs to use the computing device to connect to the motherboard and execute the memory testing method of the present invention through the control unit of the computing device, thereby reducing the cost of memory testing and improving the testing efficiency. In addition, the memory test method of the present invention can directly present the faulty data line and the fault situation to the maintenance personnel through the output unit 22. Therefore, compared with the memory function test method of the conventional technology, the memory test of the present invention The method does not require professionals to interpret the boot program, which further reduces personnel costs.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均落入本發明的申請專利範圍內。The content disclosed above is only a preferred and feasible embodiment of the present invention, and therefore does not limit the scope of the patent application of the present invention, so any technical changes made by using the description and drawings of the present invention fall into the application of the present invention. Within the scope of the patent.

U、U’、U’’‧‧‧記憶體測試系統 1‧‧‧待測裝置 10、10’‧‧‧中央處理器 11‧‧‧記憶體 2‧‧‧電子裝置 20‧‧‧輸入單元 21‧‧‧控制單元 22‧‧‧輸出單元 1’‧‧‧無故障待測裝置 11’‧‧‧無故障記憶體 111‧‧‧走線 P‧‧‧測試點 3‧‧‧測試治具 30‧‧‧測試探針模組 301‧‧‧頂針 31‧‧‧開關模組 32‧‧‧微控制單元 U, U’, U’’‧‧‧ memory test system 1‧‧‧ device under test 10, 10’‧‧‧ CPU 11‧‧‧Memory 2‧‧‧Electronic device 20‧‧‧Input unit 21‧‧‧Control unit 22‧‧‧Output unit 1’‧‧‧Fault-free device under test 11’‧‧‧Fault free memory 111‧‧‧Trace P‧‧‧Test point 3‧‧‧Test fixture 30‧‧‧Test probe module 301‧‧‧Thimble 31‧‧‧Switch module 32‧‧‧Micro Control Unit

圖1為本發明第一實施例的記憶體檢測方法的功能方塊圖。 圖2為本發明第一實施例的記憶體檢測系統的流程圖。 圖3為本發明第二實施例的記憶體檢測系統的功能方塊圖圖。 圖4為本發明第二實施例的記憶體檢測系統的示意圖。 圖5為本發明第二實施例的記憶體檢測方法的流程圖。 圖6為本發明第二實施例的記憶體檢測方法的一變化實施例流程圖。FIG. 1 is a functional block diagram of a memory detection method according to a first embodiment of the invention. 2 is a flowchart of a memory detection system according to a first embodiment of the invention. 3 is a functional block diagram of a memory detection system according to a second embodiment of the invention. 4 is a schematic diagram of a memory detection system according to a second embodiment of the invention. 5 is a flowchart of a memory detection method according to a second embodiment of the invention. 6 is a flowchart of a modified embodiment of the memory detection method according to the second embodiment of the present invention.

本發明指定代表圖為流程圖,故無符號簡單說明。 The designated representative diagram of the present invention is a flowchart, so there is no symbol for a simple description.

Claims (15)

一種記憶體檢測方法,用以檢測一待測裝置的一記憶體,其中,該記憶體檢測方法包含: 讀取對應該待測裝置的一錯誤映射表,其中,該錯誤映射表包括一組映射位址資料及一組資料線資料,該組映射位址資料包括該記憶體的複數個映射位址,該組資料線資料包括該記憶體的複數個資料線的複數個資料線名稱,每一該資料線名稱在該錯誤映射表中分別映射於每一該映射位址的每一位元; 對每一該映射位址寫入一檢查位元組; 讀取每一該映射位址因應該檢查位元組的一位址值; 判斷每一該位址值的每一位元的位元值與該檢查位元組中相對應的位元的位元值是否相同;以及 若判斷至少一映射位址因應該檢查位元組的該位址值的至少一位元的位元值與該檢查位元組中相對應的位元的位元值不同,判斷該記憶體為故障。A memory detection method for detecting a memory of a device under test, wherein the memory detection method includes: reading an error mapping table corresponding to the device under test, wherein the error mapping table includes a set of mappings Address data and a set of data line data, the set of mapped address data includes a plurality of mapped addresses of the memory, the set of data line data includes a plurality of data line names of the plurality of data lines of the memory, each The name of the data line is mapped to each bit of each mapping address in the error mapping table; a check byte is written to each mapping address; reading each mapping address corresponds to Check the bit value of the byte; determine whether the bit value of each bit of each address value is the same as the bit value of the corresponding bit in the check byte; and if judge at least one The mapped address determines that the memory is defective because the bit value of at least one bit of the address value of the check byte group is different from the bit value of the corresponding bit in the check byte group. 如請求項1所述的記憶體檢測方法,其中,該檢查位元組為全1位元組,且若判斷至少一映射位址因應該檢查位元組的該位址值的至少一位元的位元值與該檢查位元組中相對應的位元的位元值不同,判斷該記憶體為故障的步驟之中,還進一步包括: 該控制單元根據該錯誤映射表判斷映射於該至少一位元的至少一該資料線為短路。The memory detection method according to claim 1, wherein the check byte is all 1 byte, and if it is judged that at least one mapped address should check at least one bit of the address value of the byte The bit value of is different from the bit value of the corresponding bit in the check bit group, and the step of determining that the memory is a failure further includes: the control unit determines to map to the at least one according to the error mapping table At least one of the data lines of one bit is short-circuited. 如請求項1所述的記憶體檢測方法,其中,該檢查位元組為全0位元組,且若判斷至少一映射位址因應該檢查位元組的該位址值的至少一位元的位元值與該檢查位元組中相對應的位元的位元值不同,判斷該記憶體為故障的步驟之中,還進一步包括: 該控制單元根據該錯誤映射表判斷映射於該至少一位元的至少一該資料線為開路。The memory detection method according to claim 1, wherein the check byte is all 0 bytes, and if it is determined that at least one mapped address should check at least one bit of the address value of the byte The bit value of is different from the bit value of the corresponding bit in the check bit group, and the step of determining that the memory is a failure further includes: the control unit determines to map to the at least one according to the error mapping table At least one of the data lines of one bit is open. 如請求項1所述的記憶體檢測方法,其中,讀取對應該待測裝置的該錯誤映射表的步驟之中,還進一步包括: 通過一輸入單元接收一待測裝置資訊,以使該控制單元根據該待測裝置資訊讀取對應於該待測裝置的該錯誤映射表。The memory detection method according to claim 1, wherein the step of reading the error mapping table corresponding to the device under test further comprises: receiving information about a device under test through an input unit to enable the control The unit reads the error mapping table corresponding to the device under test according to the information of the device under test. 如請求項1所述的記憶體檢測方法,其中,讀取對應該待測裝置的該錯誤映射表的步驟之前,還進一步包括: 提供一測試治具,該測試治具包括一測試探針模組、一開關模組以及一微控制單元,其中,該開關模組連接於該測試探針模組與該微控制單元之間; 將該測試探針模組連接於一無故障待測裝置的一無故障記憶體的其中之一資料線; 通過該微控制單元控制該開關模組,以使該無故障記憶體的該其中之一資料線、該測試探針模組與該開關模組之間形成短路; 通過該微控制單元以對該無故障記憶體的一測試位址區間內的所有位址的寫入一全1位元組;以及 通過該微控制單元以判斷該測試位址區間內的所有位址因應該全1位元組的位址值是否為全1位元組。The memory detection method according to claim 1, wherein before the step of reading the error mapping table corresponding to the device under test, the method further comprises: providing a test fixture, the test fixture including a test probe module Group, a switch module and a micro-control unit, wherein the switch module is connected between the test probe module and the micro-control unit; the test probe module is connected to a fault-free device under test One of the data lines of a fault-free memory; the switch module is controlled by the micro-control unit so that one of the data lines of the fault-free memory, the test probe module and the switch module A short circuit is formed between them; the micro-control unit writes a full 1-byte address to all addresses in a test address section of the fault-free memory; and the micro-control unit determines the test address section All the addresses within should be based on whether the address value of all 1-byte is all 1-byte. 如請求項5所述的記憶體檢測方法,其中,通過該微控制單元以判斷該測試位址區間內的所有位址因應該全1位元組的位址值是否為全1位元組的步驟之中,還進一步包括: 若該測試位址區間內的其中之一位址的位址值不為全1位元組,該微控制單元建立對應該待測裝置的該錯誤映射表,並將該其中之一位址、以及該經短路處理的其中之一資料線的資料線名稱儲存於該錯誤映射表,且在該錯誤映射表中建立該其中之一位址、該其中之一位址的位址值中不為1的位元以及該經短路處理的其中之一資料線的資料線名稱之間的映射關係。The memory detection method according to claim 5, wherein the micro-control unit is used to determine whether all the addresses in the test address interval should correspond to all 1-byte address values The step further includes: if the address value of one of the addresses in the test address interval is not all 1 byte, the micro control unit establishes the error mapping table corresponding to the device under test, and Store one of the addresses and the data line name of the one of the short-circuited data lines in the error mapping table, and create the one of the address and the one of the bits in the error mapping table The mapping relationship between the bit value of the address that is not 1 and the name of the data line of one of the data lines that have been short-circuited. 如請求項5所述的記憶體檢測方法,其中,通過該微控制單元以對該無故障記憶體的該測試位址區間內的所有位址的寫入該全1位元組的步驟中,還進一步包括: 以該微控制單元啟動該無故障待測裝置; 以該微控制單元讀取該無故障記憶體的一位址內容值表;以及 以該微控制單元根據該位址內容值表而選取該記憶體的一位址區間以作為該測試位址區間,其中,該位址區間內所有位址的內容值為0。The memory detection method according to claim 5, wherein in the step of writing all the 1-bytes in the test address section of the non-faulty memory through the micro control unit, The method further includes: starting the fault-free device under test with the micro-control unit; reading the one-bit content value table of the non-faulty memory with the micro-control unit; and using the micro control unit according to the address content value table The one-bit address interval of the memory is selected as the test address interval, wherein the content value of all addresses in the address interval is 0. 如請求項5所述的記憶體檢測方法,其中,該無故障待測裝置與該待測裝置各具有一處理電路,且該無故障待測裝置的該處理電路與該待測裝置的該處理電路具有相同的電路結構,該無故障記憶體與該記憶體具有相同的資料寬度。The memory detection method according to claim 5, wherein the non-faulty device under test and the device under test each have a processing circuit, and the processing circuit of the non-faulty device under test and the processing of the device under test The circuits have the same circuit structure, and the fault-free memory and the memory have the same data width. 一種錯誤映射表建立方法,用以檢測一待測裝置的一記憶體,該錯誤映射表建立方法包含: 提供一測試治具,該測試治具包括一測試探針模組、一開關模組以及一微控制單元,其中,該開關模組連接於該測試探針模組與該微控制單元之間; 將該測試探針模組連接於一無故障待測裝置的一無故障記憶體的其中之一資料線; 通過該微控制單元控制該開關模組,以使該無故障記憶體的該其中之一資料線、該測試探針模組與該開關模組之間形成短路; 通過該微控制單元以對該無故障記憶體的一測試位址區間內的所有位址的寫入一全1位元組; 通過該微控制單元以判斷該測試位址區間內的所有位址因應該全1位元組的位址值是否為全1位元組;以及 若該測試位址區間內的其中之一位址的位址值不為全1位元組,該微控制單元建立對應於該待測裝置的一錯誤映射表,將該其中之一位址、該其中之一位址的位址值以及該經短路處理的其中之一資料線的資料線名稱儲存於該錯誤映射表,且在該錯誤映射表中建立該其中之一位址、該其中之一位址的位址值以及該經短路處理的其中之一資料線的資料線名稱之間的映射關係。A method for creating an error mapping table is used to detect a memory of a device under test. The method for establishing an error mapping table includes: providing a test fixture, the test fixture including a test probe module, a switch module and A micro-control unit, wherein the switch module is connected between the test probe module and the micro-control unit; the test probe module is connected to a fault-free memory of a fault-free device under test One of the data lines; the switch module is controlled by the micro control unit so that one of the data lines of the fault-free memory, the test probe module and the switch module forms a short circuit; by the micro The control unit writes an entire 1-byte address to all addresses in a test address section of the fault-free memory; the micro-control unit determines whether all addresses in the test address section should be Whether the address value of 1 byte is all 1 byte; and if the address value of one of the addresses in the test address interval is not all 1 byte, the micro control unit establishes the corresponding value An error mapping table of the device under test, storing the one of the addresses, the address value of the one of the addresses, and the data line name of the one of the short-circuited data lines in the error mapping table, and A mapping relationship between the one of the addresses, the address value of the one of the addresses, and the data line name of the one of the short-circuited data lines is established in the error mapping table. 一種記憶體檢測系統,包含: 一待測裝置,該待測單元包括一記憶體;以及 一電子裝置,該電子裝置包括一控制單元,該待測裝置連接於該電子裝置,其中,該電子裝置儲存有對應該待測裝置的一錯誤映射表,該錯誤映射表包括: 一組映射位址資料,該組映射位址資料包括該記憶體的複數個映射位址;以及 一組資料線資料,該組資料線資料包括該記憶體的複數個資料線的名稱,其中,每一該資料線名稱在該錯誤映射表中分別映射於每一該映射位址的每一位元, 且該控制單元用以讀取該錯誤映射表,並根據該錯誤映射表的該組映射位址資料而對該記憶體的該複數個映射位址寫入一檢查位元組,並判斷每一該映射位址因應該檢查位元組的一位址值的每一位元的位元值與該檢查位元組中相對應的位元的位元值是否相同,其中,若該位址值中至少一位元的位元值與該檢查位元組中相對應的位元的位元值不同,該控制單元根據該錯誤映射表判斷映射於該至少一位元的至少一該資料線為故障。A memory detection system includes: a device to be tested, the unit to be tested includes a memory; and an electronic device, the electronic device includes a control unit, the device to be tested is connected to the electronic device, wherein the electronic device An error mapping table corresponding to the device under test is stored. The error mapping table includes: a set of mapped address data, the set of mapped address data includes a plurality of mapped addresses of the memory; and a set of data line data, The set of data line data includes the names of a plurality of data lines of the memory, wherein each data line name is mapped to each bit of each mapping address in the error mapping table, and the control unit Used to read the error mapping table and write a check byte to the plurality of mapping addresses of the memory according to the set of mapping address data of the error mapping table, and determine each of the mapping addresses It should be checked whether the bit value of each bit of the bit address value of the byte is the same as the bit value of the corresponding bit in the check byte, where, if at least one bit in the address value The bit value of the bit is different from the bit value of the corresponding bit in the check bit group, and the control unit determines that at least one of the data lines mapped to the at least one bit is faulty according to the error mapping table. 如請求項10所述的記憶體檢測系統,其中,該電子裝置還進一步包括一輸出單元,該控制單元通過該輸出單元顯示對應於該至少一位元的至少一該資料線的一故障狀態。The memory detection system according to claim 10, wherein the electronic device further includes an output unit through which the control unit displays a fault state of at least one of the data lines corresponding to the at least one bit. 如請求項10所述的記憶體檢測系統,其中,該電子裝置還進一步包括一接收單元,用以接收一待測裝置資訊,以使該控制單元根據該待測裝置資訊讀取對應於該待測裝置的該錯誤映射表。The memory detection system according to claim 10, wherein the electronic device further comprises a receiving unit for receiving information of a device under test, so that the control unit reads information corresponding to the device according to the information of the device under test The error mapping table of the test device. 如請求項10所述的記憶體檢測系統,還進一步包括: 一無故障待測裝置,該無故障待測裝置包括一無故障記憶體;以及 一測試治具,該測試治具包括: 一測試探針模組; 一開關模組;以及 一微控制單元, 其中,該開關模組連接於該測試探針模組與該微控制單元之間,且該測試探針模組連接於該無故障記憶體的其中之一資料線, 其中,該微控制單元用以控制該開關單元,以使該無故障記憶體的其中之一資料線、該測試探針模組與該開關模組之間形成短路,其中,該微控制單元對該無故障記憶體的一測試位址區間內的所有位址的寫入一全1位元組,並判斷該測試位址區間內的所有位址因應該全1位元組的位址值是否為全1位元組。The memory detection system according to claim 10, further comprising: a fault-free device under test, the fault-free device under test includes a fault-free memory; and a test fixture, the test fixture includes: a test Probe module; a switch module; and a micro control unit, wherein the switch module is connected between the test probe module and the micro control unit, and the test probe module is connected to the fault-free One of the data lines of the memory, wherein the micro-control unit is used to control the switch unit so that one of the data lines of the fault-free memory, the test probe module and the switch module are formed Short circuit, in which the micro control unit writes all 1-bytes to all addresses in a test address interval of the fault-free memory, and judges that all addresses in the test address interval should be Whether the address value of 1 byte is all 1 byte. 如請求項13所述的記憶體檢測系統,其中,該微控制單元進一步在該測試位址區間內的其中之一位址的位址值不為全1位元組的情況下,用以建立對應於該待測裝置的該錯誤映射表,將該其中之一位址以及該經短路處理的其中之一資料線的資料線名稱儲存於該錯誤映射表,且在該錯誤映射表中建立該其中之一位址、該其中之一位址的位址值中不為1的位元以及該經短路處理的其中之一資料線的資料線名稱之間的映射關係。The memory detection system according to claim 13, wherein the micro-control unit is further used to establish if the address value of one of the addresses in the test address interval is not all 1 byte Corresponding to the error mapping table of the device under test, storing one of the address and the data line name of the one of the short-circuited data lines in the error mapping table, and creating the error mapping table The mapping relationship between one of the addresses, the bits of which the address value of the one of the addresses is not 1, and the name of the data line of the one of the short-circuited data lines. 如請求項13所述的記憶體檢測系統,其中,該無故障待測裝置與該待測裝置各具有一處理電路,且該無故障待測裝置的該處理電路與該待測裝置的該處理電路具有相同的電路結構,該無故障記憶體與該記憶體具有相同的資料寬度。The memory detection system according to claim 13, wherein the non-faulty device under test and the device under test each have a processing circuit, and the processing circuit of the non-faulty device under test and the processing of the device under test The circuits have the same circuit structure, and the fault-free memory and the memory have the same data width.
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