TW202000450A - Circuit board and an electrical connector assembly - Google Patents

Abstract

The present invention relates to a circuit board and an electrical connector assembly. The electrical connector assembly has said circuit board and a flat data transmission cable solded on the circuit board. The circuit board has a base board and a plurality circuit designed on the base board. The base board has a soldering area and a circuit area connecting with the soldering area. The circuit includes a number of wiring pads provided on the soldering area and a plurality of electrical lines in the circuit area. The wiring pads are arranged side by side. Each wiring pad has a width along a direction of there are arranged and a length in a perpendicular direction. The length of the wiring pads being less than 1.5 mm.

Description

Circuit board and electric connection assembly with the circuit board

The invention relates to the technical field of electrical connection, in particular to a circuit board capable of improving signal transmission stability and an electrical connection assembly with the circuit board.

The circuit board is usually installed in an electronic device for soldering and electrical connection of electronic components. Under normal circumstances, a plurality of gold fingers or pads are provided on the circuit board, and there is a wiring design that is electrically connected to the gold fingers or pads inside the circuit board, and the gold fingers or pads are soldered to the electrical connectors or wires In order to achieve the transmission or processing of the input or output signals of the electrical connector or the wire end. However, the conventional circuit board does not correspond to the connection part of the wire, and the outer layer of the wire needs to be stripped and connected by bending the cable, which causes the impedance to change in this part, and the above-mentioned conventional connection scheme has more stripping of the wire, resulting in a discontinuous impedance The longer length affects the stability of signal transmission.

In view of this, it is indeed necessary to further improve the conventional circuit board to solve the above problems.

An object of the present invention is to provide a circuit board capable of improving signal transmission stability and an electrical connection assembly having the circuit board.

To achieve the above object, the present invention provides a circuit board, including a substrate, the substrate has a soldering area and a wiring area connecting the soldering area; a circuit structure is provided on the substrate, and the circuit structure has a plurality of soldering areas provided on the substrate to connect the wires Connection pads, conductive lines arranged in the soldering area and wiring area and electrically connecting the connection pads; wherein, the connection pads are arranged side by side, and have a width extending along the direction of their arrangement and along the vertical row For the length extending in the cloth direction, the length of the connection pad is less than 1.5 mm.

As a further improvement of the present invention, each of the connection pads occupies an area of the soldering area of less than 0.39 mm ² .

As a further improvement of the present invention, wherein the ratio of the length to the width of each of the connection pads is less than 5.8.

To achieve the above object, the present invention also provides a circuit board, including: a substrate, the substrate has a soldering area and a wiring area connecting the soldering area; a circuit structure is provided on the substrate, the circuit structure has a plurality of soldering areas provided on the substrate to The connection pad of the connecting wire, the conductive line provided in the welding area and the wiring area and electrically connecting the connection pad; wherein the welding area and the wiring area are adjacently arranged in the length direction of the connection pad; In the length direction of the pad, the wiring pad has a first edge close to the wiring area and a second edge far away from the wiring area, and the distance between the second edge and the edge of the substrate away from the wiring area of the soldering area is less than 1 mm.

As a further improvement of the present invention, in the length direction of the connection pad, the length from the first edge of the connection pad to the edge of the substrate away from the wiring area of the bonding area is not more than 2 mm.

To achieve the above object, the present invention also provides an electrical connection assembly, including: a circuit board, the circuit board having a substrate and a circuit structure provided on the substrate, the substrate has a soldering area and a wiring area connecting the soldering area; The circuit structure has a plurality of connection pads provided in the welding area of the substrate to connect the wires, and conductive lines provided in the welding area and the wiring area and electrically connecting the connection pads; the data transmission cable is welded to the circuit board. The data transmission cable has a plurality of conductors arranged side by side, a plastic layer integrally covering the plurality of conductors, and a metal layer formed by spirally winding a metal tape on the outside of the plastic layer; each of the conductors has a conductor , The metal layer has at least an aluminum foil layer and a bonding layer provided on the side of the aluminum foil layer facing the plastic layer, the metal layer is bonded and fixed to the outside of the plastic layer by hot melting of the bonding layer; wherein, the wire and the wiring The pads are connected in a one-to-one correspondence, and the center spacing of adjacent wires is the same as the center spacing of corresponding adjacent wiring pads.

As a further improvement of the present invention, in the longitudinal direction of the wiring pad, the wiring pad has a first edge close to the wiring area and a second edge far away from the wiring area, and the data transmission cable has an exposed conductor The length of the butt portion of the soldering portion of the conductor and the bonding pad matches the length from the first edge of the bonding pad to the edge of the bonding area away from the wiring area, and is set to no more than 2 mm.

As a further improvement of the present invention, wherein the outer diameter of the conductor adopts 31 to 34 U.S. wire gauges, the connection pads and the wires are arranged at equal intervals in the arrangement direction, and the adjacent connection pads and the adjacent wires The center spacing is set between 0.30mm and 0.42mm.

As a further improvement of the present invention, the width of each of the connection pads is less than 0.28 mm.

As a further improvement of the present invention, wherein the distance between two adjacent connection pads is not less than 0.13 mm.

The length of the conventional connection pad is usually set to be more than 2mm, which makes it difficult to effectively improve the signal transmission stability caused by the impedance discontinuity. A solution of the present invention is to set the length of the connection pad to not more than 1.5mm. Another solution reduces the distance from the edge of the wiring pad to the edge of the circuit board substrate. Another solution is to make the wiring pad correspond to the wire one by one, that is, the spacing corresponds to the same, so that there is no need to bend the wire connection, that is, through the above solutions It may shorten the length of the conductor of the exposed butt wire, thereby reducing the distance of the impedance discontinuity, and improving the stability of the signal transmission. Especially when the high-frequency signal is transmitted, the impedance discontinuity can be further shortened and the high-frequency characteristics are more stable.

The invention mainly relates to a circuit board, which can be applied to various electronic devices such as computers, exchanges, charging devices, etc., and is mainly used for the transmission of electrical signals.

As shown in the first figure, the circuit board 100 in this embodiment has a substrate 1 and a circuit structure provided on the substrate 1.

Wherein, the thickness of the substrate 1 is 0.5 to 1.7 mm. The substrate 1 has at least a bonding area 11 and a wiring area 12 connected to the bonding area 11. The bonding area 11 and the wiring area 12 are arranged adjacent to each other in the longitudinal direction of the substrate 1. In this embodiment, in the longitudinal direction of the base 1, the substrate 1 further has a connection area 13 disposed on the side of the wiring area 12 away from the solder area 11. A plurality of positioning grooves 121 are provided on both sides of the wiring area 12 to limit the circuit board 100 or other electronic components (not shown) of the present invention.

As shown in the fourth figure, the wiring structure includes at least a bonding pad 21 disposed in the bonding area 11 to connect the wires 801, and a bonding pad 21 disposed in the bonding area 11 and the wiring area 12 and electrically connecting the bonding pad 21 Conductive circuit (not shown). In this embodiment, the wiring structure further includes gold fingers 22 disposed in the connection area 13. In this embodiment, the connection area 13 provided with the gold finger 22 can be directly formed as a tongue of a connector (not shown), that is, the connection area 13 is directly mated with the mating connector to achieve Signal transmission with docking connector. Of course, the golden finger 22 can also be soldered to the conductive terminal (not shown) of a connector, so as to realize the electrical connection and signal transmission and processing of the aforementioned wire 801 and the connector.

As shown in the fourth figure, the data transmission cable 800 welded to the above-mentioned circuit board 100 of the present invention includes a plurality of conductors 801 arranged side by side, a plastic layer 802 covering the plurality of conductors 801 integrally, and spirally arranged by using a metal tape A metal layer 803 formed outside the plastic layer 802. The metal layer 803 has at least an aluminum foil layer 8031 and a bonding layer disposed on the side of the aluminum foil layer 8031 facing the plastic layer 802. The metal layer 803 is bonded and fixed to the outside of the plastic layer 802 by hot melting after the bonding layer; , Can achieve tight winding between the metal layer 803 and the plastic layer 802; on the other hand, the metal layer 803 is provided with a bonding layer on the side facing the plastic layer 802, not only can directly fix the metal layer 803 by bonding Outside the plastic layer 802, the entire cable can be made thinner and softer; and air can be discharged during bonding, and because the bonding is fixed, the discharged air cannot enter, achieving a dense effect, and thus achieving a tight package Cover, high-frequency transmission performance is good and soft and thin effect.

The wires 801 and the connection pads 21 are connected in a one-to-one correspondence, and the center spacing of the adjacent wires 801 is the same as the center spacing of the corresponding adjacent connection pads 21; Conduct bending cable connection to shorten the stripping length, thereby reducing the distance of impedance discontinuity, and improving the stability of signal transmission. Especially when high-frequency signal transmission is performed, the impedance discontinuity can be further shortened, and the high-frequency characteristics are more stable. .

Preferably, a plurality of the conductive wires 801 are arranged at equal intervals, and the outer diameter of the conductive wires 801 is equal to the center spacing of adjacent conductive wires 801. Each wire 801 has a conductor 8011 and an insulating coating 8012 covering the conductor 8011; of course, the wire 801 may not be provided with the coating layer 8012, and the plastic layer 802 is directly insulated and coated. The same purpose can be achieved. The coating layer 8012 and the plastic layer 802 are made of the same or similar materials, preferably made of high-density polyethylene to ensure the bonding strength and overall flexibility between adjacent layers of the data transmission cable 800; It is preferably made of a plastic material with a dielectric coefficient close to air, which can make the impedance of the cladding layer 8012 and the plastic layer 802 smaller, thereby providing a better signal transmission environment for the conductor 8011, reducing the signal propagation delay, and reducing the signal The crosstalk between them ensures the high-speed and effective transmission of the signal and reduces the signal attenuation. In the present invention, the outer diameter of the conductor 8011 adopts 31 to 34 U.S. wire gauges, and the ratio of the outer diameter of the conductor 8011 to the center distance between adjacent wires 801 is between 1.4 and 2.8.

Further, in the present invention, the connection pads 21 are arranged side by side, and in the arrangement direction of the connection pads 21, the connection pads 21 have at least two ground pads G for connecting the ground wires and the arrangement The signal pad S between the two ground pads G; by this, the noise around the signal pad S can be eliminated by the ground pad G, the signal transmission of the signal pad S is ensured, and the signal is improved Transmission and processing efficiency.

In addition, the golden fingers 22 are also arranged side by side parallel to the arrangement direction of the bonding pads 21. The wiring pad 21 and the gold finger 22 both have a width extending in the direction of their arrangement and a length extending in the direction of the perpendicular arrangement. The bonding area 11, the wiring area 12 and the connection area 13 are arranged in sequence along the length direction of the connection pad 21 and the gold finger 22.

As shown in the first figure, in this embodiment, the number of the signal pad S between two adjacent ground pads G is only two, and it is provided on two adjacent ground wires. The two signal pads S between the disks G constitute a signal pad group for transmitting differential signals. Further, the connection pad 21 has only the ground pad G and the signal pad group, and the number of the ground pad G is one more than the number of the signal pad group. Furthermore, in this embodiment, in the arrangement direction of the connection pads 21, the connection pads 21 located on both sides of the edge are ground pads G, and between every two adjacent ground pads G With a pair of signal pad group. With reference to the first figure, the connection pad 21 in this embodiment has 7 ground pads G and 6 signal pad sets. The signal arrangement design of the golden finger 22 end and the connection pad 21 Matching, so that the circuit board 100 described in this embodiment can be adapted to the standard specifications of Slimline SAS, and thus can be used to transmit corresponding signals.

Further, the length of the conventional connection pad is usually set to be more than 2 mm; and in the present invention, each of the connection pads 21 is set so that its length in a direction perpendicular to its arrangement direction is not more than 1.5 mm , Preferably less than 1.3mm, further preferably set to less than 1.1mm, that is to make the length of the connection pad 21 as short as possible, thereby reducing the corresponding wire 801 stripping length and the wire 801 stripping length and the welding length of the bonding pad 21 In addition, when transmitting high-frequency signals, the impedance discontinuities can be further shortened, and the high-frequency characteristics are more stable.

Preferably, in the present invention, each of the connection pads 21 occupies an area of the soldering area 11 of less than 0.39 mm2; preferably, the connection pads 21 have a width in the direction of their arrangement, and each of the connection pads The ratio of the length and width of the disk 21 is less than 5.8, that is, under the same area, the ratio of the length and width of the wiring pad 21 is minimized, so that the wiring pad 21 is arranged close to a square, thereby reducing the length and further reducing the impedance. The continuous distance and proper width can ensure the stability of welding with the wire.

In the present invention, the width of each of the connection pads 21 is less than 0.28 mm to ensure a space between adjacent connection pads 21; preferably, the width is larger than the outer diameter of the conductor 8011. In the present invention, the distance between the two adjacent connection pads 21 is not less than 0.13 mm; thereby facilitating the welding of adjacent wires and avoiding problems such as mutual adhesion or welding short circuit due to the small spacing.

In this embodiment, the wiring pads 21 are arranged at equal intervals in the direction of arrangement, and the center spacing of adjacent wiring pads 21 is between 0.30 mm and 0.42 mm; this kind of setting matches the data transmission line The distance between the cables 800 is set, so that without stretching or bending the wires 801 in the data transmission cable 800, one-to-one welding can be directly performed to facilitate the connection of the two and further reduce the need for the wires 801 The stripping length further shortens the impedance discontinuity and makes the high-frequency characteristics more stable.

In addition, in the length direction of the bonding pad 21, the bonding pad 21 has a first edge close to the wiring area 12 and a second edge far away from the wiring area 12, and the second edge is away from the bonding area 11 from the wiring The distance of the edge of the substrate 1 in the area 12 is less than 1 mm; that is, the length of the unnecessary area is reduced as much as possible, thereby shortening the stripping length required by the wire 801, so that the impedance discontinuity is shortened, and the high-frequency characteristics are more stable.

Further, in the length direction of the connection pad, it is preferable that the length from the first edge of the connection pad 21 to the edge of the substrate 11 away from the wiring area 12 of the bonding area 11 is not greater than 2 mm; The continuous distance ensures the stability of the high-frequency characteristics during the transmission of high-frequency signals.

The above is the overall layout design of the first preferred embodiment of the circuit board 100 of the present invention. With this arrangement, not only the noise around the signal pad S can be effectively eliminated, the signal transmission of the signal pad S is ensured, and the signal transmission is improved And processing efficiency.

In addition, in the above embodiment, the size setting of the wiring pad 21, the distance setting between the second edge of the wiring pad 21 and the edge of the substrate 1, and the corresponding setting of the one-to-one correspondence between the wiring pad 21 and the wire 801 can all be used as shortening The technical solution of the discontinuous impedance distance can of course also be set in coexistence of two or three to ensure the stability of the high-frequency characteristics of high-frequency signal transmission.

Please refer to the second figure for a second preferred embodiment of the circuit board 100' of the present invention. The overall arrangement of the circuit board 100' is similar to the first preferred embodiment described above, except for the following differences.

In this embodiment, the number of the connection pads 21' and the golden fingers 22' are different from the first preferred embodiment. Specifically, the number of the signal pads S is two of the number of the ground pads G Times. Further, the signal pad S includes not only signal pad groups disposed between adjacent ground pads G to transmit differential signals, but also other single ends disposed outside the ground pad G The signal pads, and in the arrangement direction of the connection pads 21', the connection pads 21' located on both sides are signal pads S.

Please refer to the third figure for a third preferred embodiment of the circuit board 300 of the present invention. The overall arrangement of the circuit board 300 is similar to the first preferred embodiment described above, except for the following differences.

In this embodiment, the number of wiring pads 41 and gold fingers 42 is different from that of the first preferred embodiment. Specifically, in this embodiment, the number of ground pads G is greater than the number of signal pads S One more quantity. Further, the signal pad S only includes a single-ended signal pad, and the signal pad S and the ground pad G are alternately arranged. Further, in the arrangement direction of the connection pads 41, the connection pads 41 located on both sides of the edges are ground pads G.

It can be seen from the above description that the present invention also relates to an electrical connection assembly including the circuit board 100, 100', 300 and a data transmission cable 800 soldered to the circuit board 100, 100', 300, the data transmission cable The signal arrangement design of the wire 801 in 800 corresponds to the corresponding connection pads 21, 21', 41 on the circuit boards 100, 100', 300, respectively, and the data transmission cable 800 has a connection pad 21, 21', 41 soldered butt joints, the butt joints remove the metal layer 803, the plastic layer 802 and the cladding layer 8012 to expose the conductor 8011 part, so that the conductor 8011 and the bonding pads 21, 21' , 41 for welding.

In combination with the arrangement of the aforementioned connection pads 21, 21', 41, in the present invention, the length of the connecting portion of the data transmission cable 800 after removing the metal layer 803, the plastic layer 802, and the cladding layer 8012 can be effectively shortened. Further, the center spacing of adjacent wires 801 is set to match the center spacing of the connection pads 21, 21', 41, that is, between 0.30 and 0.42 mm, and the wire 801 of the data transmission cable 800 is also made Direct in-situ welding can be carried out with the connection pads 21, 21', 41, which can limit the distance that affects the impedance discontinuity and ensure the stability of the high-frequency characteristics during the transmission of high-frequency signals.

In particular, it should be pointed out that for those of ordinary skill in the art, equivalent changes made to the present invention under the teaching of the present invention should still be included in the scope claimed by the patent application scope of the present invention.

100, 100’, 300 ‧‧‧ circuit board 1‧‧‧ substrate 11‧‧‧welding area 12‧‧‧Wiring area 13‧‧‧ Connection area 121‧‧‧Locating groove 21, 21’, 41‧‧‧ wiring pad 22, 22’, 42‧‧‧ gold finger G‧‧‧Ground pad S‧‧‧Signal pad 800‧‧‧Data transmission cable 801‧‧‧Wire 802‧‧‧Plastic layer 803‧‧‧Metal layer 8011‧‧‧Conductor 8012‧‧‧ coating

The first figure is a plan view of the first preferred embodiment of the circuit board of the present invention; the second figure is a plan view of the second preferred embodiment of the circuit board of the present invention; the third figure is the third preferred embodiment of the circuit board of the present invention The top view of the example; the fourth figure is a perspective view of a data transmission cable connected to the circuit board of the present invention; the fifth figure is a front view of the data transmission cable shown in the fourth figure.

100‧‧‧ circuit board

1‧‧‧ substrate

11‧‧‧welding area

12‧‧‧Wiring area

13‧‧‧ Connection area

121‧‧‧Locating groove

21‧‧‧Wiring pad

22‧‧‧Goldfinger

G‧‧‧Ground pad

S‧‧‧Signal pad

Claims (10)

A circuit board includes: a substrate, the substrate has a soldering area and a wiring area connecting the soldering area; a circuit structure is provided on the substrate, the circuit structure has a plurality of soldering areas provided on the substrate to connect the wiring pads of the wires, and is provided on Conductive lines electrically connected to the bonding pads in the soldering area and the wiring area; wherein the bonding pads are arranged side by side and have a width extending in the direction of their arrangement and a length extending in the direction perpendicular to the direction of the arrangement The length of the connection pad is less than 1.5mm. The circuit board as described in item 1 of the patent application scope, wherein the area occupied by each of the bonding pads is less than 0.39 mm ² . The circuit board as described in item 2 of the patent application scope, wherein the ratio of the length and width of each of the connection pads is less than 5.8. A circuit board includes: a substrate, the substrate has a soldering area and a wiring area connecting the soldering area; a circuit structure is provided on the substrate, the circuit structure has a plurality of soldering areas provided on the substrate to connect the wiring pads of the wires, and is provided on Conductive lines electrically connected to the bonding pads in the soldering area and the wiring area; wherein the bonding area and the wiring area are adjacently arranged in the length direction of the bonding pad; in the length direction of the bonding pad, the The connection pad has a first edge close to the wiring area and a second edge far away from the wiring area, and the distance between the second edge and the edge of the substrate away from the wiring area of the bonding area is less than 1 mm. The circuit board as described in item 1 or item 4 of the patent application scope, wherein in the length direction of the connection pad, the length from the first edge of the connection pad to the edge of the substrate away from the wiring area of the bonding area is not Greater than 2mm. An electrical connection assembly includes: a circuit board having a substrate and a circuit structure provided on the substrate, the substrate having a soldering area and a wiring area connecting the soldering area; the circuit structure has a plurality of soldering provided on the substrate The connection pads for connecting the wires, the conductive lines provided in the welding area and the wiring area and electrically connecting the connection pads; the data transmission cable is welded to the circuit board, and the data transmission cable has a plurality of side by side A wire, a plastic layer integrally covering a plurality of the wires, and a metal layer formed by spirally winding a metal material strip outside the plastic layer; each of the wires has a conductor, and the metal layer has at least an aluminum foil layer And an adhesive layer provided on the side of the aluminum foil layer facing the plastic layer, and the metal layer is bonded and fixed to the outside of the plastic layer by hot melting of the adhesive layer; wherein, the wires and the connection pads are connected in one-to-one correspondence The center distance between adjacent wires is the same as the center distance between corresponding adjacent bonding pads. The electrical connection assembly as described in item 6 of the patent application range, wherein the wiring pad has a first edge near the wiring area and a second edge away from the wiring area in the length direction of the wiring pad, so The data transmission cable has a butt portion where the conductor is exposed and the conductor is welded to the terminal pad, and the length of the butt portion matches the length from the first edge of the terminal pad to the edge of the welding area away from the wiring area, both Set to no more than 2mm. The electrical connection assembly as described in item 6 of the patent application, wherein the outer diameter of the conductor adopts 31 to 34 U.S. wire gauge, the wiring pads and the wires are arranged at equal intervals in the direction of their arrangement, and are adjacent The center distance between the connection pad and the adjacent wire is set between 0.30mm and 0.42mm. The circuit board as described in item 6 of the patent application, wherein the width of each of the connection pads is less than 0.28 mm. The circuit board as described in item 6 of the patent application scope, wherein the distance between two adjacent bonding pads is not less than 0.13mm.

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