TW201943757A - 熱硬化性組成物、預浸體、疊層板、覆金屬箔疊層板、印刷配線板、以及多層印刷配線板 - Google Patents

熱硬化性組成物、預浸體、疊層板、覆金屬箔疊層板、印刷配線板、以及多層印刷配線板

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Publication number
TW201943757A
TW201943757A TW108113709A TW108113709A TW201943757A TW 201943757 A TW201943757 A TW 201943757A TW 108113709 A TW108113709 A TW 108113709A TW 108113709 A TW108113709 A TW 108113709A TW 201943757 A TW201943757 A TW 201943757A
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TW
Taiwan
Prior art keywords
mass
parts
compound
thermosetting composition
content
Prior art date
Application number
TW108113709A
Other languages
English (en)
Chinese (zh)
Inventor
山口翔平
田所弘晃
富澤克哉
志田典浩
河合英利
Original Assignee
日商三菱瓦斯化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商三菱瓦斯化學股份有限公司 filed Critical 日商三菱瓦斯化學股份有限公司
Publication of TW201943757A publication Critical patent/TW201943757A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
TW108113709A 2018-04-20 2019-04-19 熱硬化性組成物、預浸體、疊層板、覆金屬箔疊層板、印刷配線板、以及多層印刷配線板 TW201943757A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018081073 2018-04-20
JP2018-081073 2018-04-20

Publications (1)

Publication Number Publication Date
TW201943757A true TW201943757A (zh) 2019-11-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW108113709A TW201943757A (zh) 2018-04-20 2019-04-19 熱硬化性組成物、預浸體、疊層板、覆金屬箔疊層板、印刷配線板、以及多層印刷配線板

Country Status (3)

Country Link
JP (1) JP7307896B2 (fr)
TW (1) TW201943757A (fr)
WO (1) WO2019203292A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021230002A1 (fr) * 2020-05-15 2021-11-18 富士フイルム株式会社 Composition durcissable, matériau thermoconducteur, feuille thermoconductrice, dispositif à couche thermoconductrice, et composé
KR20230121723A (ko) 2020-12-17 2023-08-21 가부시키가이샤 아데카 화합물 및 조성물

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01313519A (ja) * 1988-06-10 1989-12-19 Mitsui Petrochem Ind Ltd エポキシ樹脂組成物およびエポキシ樹脂成型材料およびエポキシ樹脂成型体
JPH09104731A (ja) * 1995-10-11 1997-04-22 Nippon Kayaku Co Ltd ポリフェノール類、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
DE69837394T2 (de) * 1998-06-24 2007-07-05 Nippon Kayaku K.K. Mehrwertige phenole, epoxyharze, epoxyharz-zuammensetzungen und ihre vernetzten produkte
JP2000044776A (ja) * 1998-07-29 2000-02-15 Mitsui Chemicals Inc 熱硬化性樹脂組成物
JP5309886B2 (ja) * 2007-10-22 2013-10-09 日立化成株式会社 半導体封止用フィルム状接着剤、半導体装置の製造方法及び半導体装置
JP5439863B2 (ja) * 2008-03-26 2014-03-12 日立化成株式会社 半導体封止用接着剤、半導体封止用フィルム状接着剤、半導体装置及びその製造方法
JP5691833B2 (ja) * 2011-05-19 2015-04-01 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ及び積層体
JP2014129464A (ja) * 2012-12-28 2014-07-10 Hitachi Chemical Co Ltd エポキシ樹脂硬化剤、及びそれを用いたエポキシ樹脂組成物、硬化物、光半導体装置
JP6718588B2 (ja) * 2016-02-15 2020-07-08 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板

Also Published As

Publication number Publication date
WO2019203292A1 (fr) 2019-10-24
JPWO2019203292A1 (ja) 2021-05-20
JP7307896B2 (ja) 2023-07-13

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