TW201943755A - Resin composition capable of obtaining a cured product with excellent smear removability and excellent adhesion to a conductor layer - Google Patents

Abstract

The present invention provides a resin composition capable of obtaining a cured product with excellent smear removability and excellent adhesion to a conductor layer, and also provides a resin sheet containing the resin composition, a printed wiring board having an insulating layer formed by using the resin composition, and a semiconductor device. The resin composition of the present invention includes (A) an epoxy resin; (B) a benzoxazine-based curing agent; and (C) (meth)acrylic acid ester. The mass of the component (B) is divided by the equivalent weight of benzoxazine ring to obtain a value defined as b, and the mass of the component (C) is divided by the equivalent weight of (meth)acryl group to obtain a value defined as c, which b/c is 0.08 or more and 2.5 or less.

Description

Resin composition

The present invention relates to a resin composition. The present invention also relates to a resin sheet, a printed wiring board, and a semiconductor device containing the resin composition.

A manufacturing technique of a printed wiring board, for example, a manufacturing method of a build-up method in which an insulating layer and a conductor layer are alternately laminated on an inner-layer circuit board is known. The insulating layer is generally formed by hardening a resin composition. For example, Patent Document 1 describes a resin composition containing (A) a radical polymerizable compound, (B) an epoxy resin, (C) a hardener, and (D) a roughening component.
[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Application Publication No. 2014-034580

[Problems to be Solved by the Invention]

Many proposals for a resin composition suitable for forming an insulating layer of an inner-layer circuit board include the resin composition described in Patent Document 1, but in recent years, an insulating layer that requires a low dielectric tangent has been improved.

As a result of the review by the present inventors, it is difficult to obtain a hardened product of a resin composition containing a material that reduces the dielectric tangent, and it is difficult to obtain adhesion with a conductor layer or the like, and it has been found that the slag removal property for ensuring the conductivity is low. In recent years, in the manufacture of multilayer printed wiring boards, the hardened product of the resin composition used to form the insulating layer needs to have sufficient adhesiveness and slag removal properties for the miniaturization and high density of the wiring, but it is still not sufficient Meet these performances.

The object of the present invention is to provide a resin composition having excellent slag removal properties and excellent adhesion to a conductor layer; a resin sheet containing the resin composition; and a printed wiring having an insulating layer formed using the resin composition. Board; and semiconductor devices.

[Means to solve the problem]

As a result of careful review in order to solve the aforementioned problems, the present inventors have found that (A) an epoxy resin, (B) a benzoxazine-based hardener, and (C) a (meth) acrylate are combined, and (B) A resin composition in which the amount ratio of a benzoxazine-based hardener and (C) (meth) acrylate is set within a predetermined range can solve the aforementioned problems and complete the present invention.
That is, the present invention includes the following.

[1] a resin composition comprising
(A) epoxy resin,
(B) benzoxazine-based hardener, and
(C) a resin composition of (meth) acrylate,
Where the value obtained by dividing the mass of the component (B) by the equivalent of the benzoxazine ring is b, and the value obtained by dividing the mass of the component (C) by the equivalent of the (meth) acrylfluorenyl group is c, and 0.08 or more and 2.5 or less.
[2] The resin composition according to [1], in which the component (C) is two (meth) acrylfluorenyl groups in one molecule.
[3] The resin composition according to [1] or [2], wherein the component (C) has a cyclic structure.
[4] The resin composition according to any one of [1] to [3], wherein the component (C) has a structure represented by the following formula (C-1),

(In formula (C-1), R ¹ and R ⁴ each independently represent an acrylfluorenyl group or a methacrylfluorenyl group, R ² and R ³ each independently represent a divalent linking group, and ring A represents a divalent cyclic group. ).
[5] The resin composition according to any one of [1] to [4], wherein the component (B) has a structure represented by the following formula (B-1),

(In the formula (B-1), R ¹¹ represents an n-valent group, R ¹² each independently represents a halogen atom, an alkyl group, or an aryl group, n represents an integer of 2 to 4, and m represents an integer of 0 to 4).
[6] The resin composition according to any one of [1] to [5], wherein the component (A) includes a liquid epoxy resin and a solid epoxy resin.
[7] The resin composition according to any one of [1] to [6], further comprising (D) an inorganic filler.
[8] The resin composition according to [7], wherein when the nonvolatile component in the resin composition is 100% by mass, the content of the (D) component is 70% by mass or more.
[9] The resin composition according to any one of [1] to [8], wherein when the resin component in the resin composition is 100% by mass, the content of the (C) component is 1% by mass or more and 20% by mass or less .
[10] The resin composition according to any one of [1] to [9], wherein when the resin component in the resin composition is 100% by mass, the content of the component (B) is 1% by mass or more and 15% by mass or less .
[11] The resin composition according to any one of [1] to [10], which is used for insulation purposes.
[12] The resin composition according to any one of [1] to [11], which is used for forming an insulating layer.
[13] The resin composition according to any one of [1] to [12], for forming an insulating layer for forming a conductor layer.
[14] The resin composition according to any one of [1] to [13], which is used for packaging a semiconductor wafer.
[15] A resin sheet comprising a support and a resin composition layer including the resin composition according to any one of [1] to [14] provided on the support.
[16] A printed wiring board comprising an insulating layer formed of a cured product of a resin composition according to any one of [1] to [14].
[17] A semiconductor device comprising a printed wiring board such as [16].

[Inventive effect]

According to the present invention, it is possible to provide a resin composition capable of obtaining a cured product having excellent slag removal properties and excellent adhesion to a conductor layer; a resin sheet containing the resin composition; and having an insulation formed using the resin composition. Layers of printed wiring boards; and semiconductor devices.

[Form of Implementing Invention]

Hereinafter, the present invention will be described in detail by showing embodiments and examples. However, the present invention is not limited to the following embodiments and examples, and can be arbitrarily changed and implemented without departing from the scope of the patent application of the present invention and its equivalent range.

[Resin composition]
The resin composition of the present invention is a resin composition including (A) an epoxy resin, (B) a benzoxazine-based hardener, and (C) a (meth) acrylate, and the mass of the component (B) is divided by When the value obtained by the benzoxazine ring equivalent is b, and when the value obtained by dividing the mass of the (C) component by the (meth) acrylfluorenyl equivalent is set to c, b / c is 0.08 or more and 2.5 or less.

By using such a resin composition, a hardened | cured material which is excellent in slag removal property and is excellent in adhesiveness with a conductor layer can be obtained. In addition, by using such a resin composition, the dielectric tangent of the hardened material can generally be reduced, and the arithmetic average roughness (Ra) of the surface of the hardened material obtained after the roughening treatment can be reduced.

The resin composition is combined with the components (A) to (C), and may further include an arbitrary component. Examples of the optional components include (D) an inorganic filler, (E) a curing agent, (F) a thermoplastic resin, (G) a curing accelerator, (H) a polymerization initiator, and (I) other additives. Hereinafter, each component contained in a resin composition is demonstrated in detail.

＜ (A) Epoxy resin ＞
(A) The epoxy resin includes, for example, bisxylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and bisphenol AF type epoxy resin. , Dicyclopentadiene epoxy resin, triphenol epoxy resin, naphthol novolac epoxy resin, phenol novolac epoxy resin, tert-butyl-catechol epoxy resin, naphthalene Epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac epoxy resin, biphenyl type epoxy resin, Linear aliphatic epoxy resin, epoxy resin with butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro epoxy resin, cyclohexane epoxy resin, cyclohexane Dimethyl alcohol type epoxy resin, naphthalene ether type epoxy resin, trimethylol type epoxy resin, tetraphenylethane type epoxy resin and the like. One type of epoxy resin can be used alone, or two or more types can be used in combination.

The resin composition is preferably an epoxy resin containing (A) an epoxy resin having two or more epoxy groups in one molecule. From the viewpoint of obtaining the desired effect of the present invention more significantly, the ratio of the epoxy resin having two or more epoxy groups in one molecule is preferable to 100% by mass of the non-volatile content of the epoxy resin (A). It is 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more.

Epoxy resins are liquid epoxy resins at a temperature of 20 ° C (hereinafter sometimes referred to as "liquid epoxy resins") and solid epoxy resins at a temperature of 20 ° C (hereinafter sometimes referred to as "solid epoxy resins" Resin "). The resin composition may include only the liquid epoxy resin or the solid epoxy resin as the (A) epoxy resin. However, it is preferable to include the liquid epoxy resin and the solid epoxy resin in combination. As the (A) epoxy resin, by combining a liquid epoxy resin and a solid epoxy resin, when it is used in the form of a resin sheet, sufficient flexibility can be obtained, and the fracture strength of the hardened material of the resin composition can be improved. .

The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

The liquid epoxy resin is preferably a bisphenol A epoxy resin, a bisphenol F epoxy resin, a bisphenol AF epoxy resin, a naphthalene epoxy resin, a glycidyl ester epoxy resin, or a shrinking epoxy resin. Glycerylamine type epoxy resin, phenol novolac type epoxy resin, alicyclic epoxy resin with ester skeleton, cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resin, glycidylamine type The epoxy resin and the epoxy resin having a butadiene structure are more preferably a bisphenol A type epoxy resin and a bisphenol F type epoxy resin.

Specific examples of the liquid epoxy resin include "HP4032", "HP4032D", "HP4032SS" (naphthalene-type epoxy resin) manufactured by DIC; "828US", "jER828EL", "825", "825" manufactured by Mitsubishi Chemical Company, "Epikote828EL" (bisphenol A type epoxy resin); "jER807" and "1750" (bisphenol F type epoxy resin) made by Mitsubishi Chemical; "jER152" (phenol novolac type epoxy resin) made by Mitsubishi Chemical ; "630" and "630LSD" (glycidylamine type epoxy resin) made by Mitsubishi Chemical Company; "ZX1059" (bisphenol A type epoxy resin and bisphenol F type epoxy resin) manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd. (Mixed product); "EX-721" (glycidyl ester epoxy resin) manufactured by Nagase Chemtex; "CELLOXID2021P" (alicyclic epoxy resin with ester skeleton) manufactured by DAICEL; manufactured by DAICEL "PB-3600" (epoxy resin with butadiene structure); "ZX1658" and "ZX1658GS" (liquid 1,4-glycidyl cyclohexane type epoxy resin) manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd. Wait. These can be used alone or in combination of two or more.

The solid epoxy resin is preferably a solid epoxy resin having three or more epoxy groups in one molecule, and more preferably an aromatic solid ring having three or more epoxy groups in one molecule. Oxygen resin.

As the solid epoxy resin, bisxylenol type epoxy resin, naphthalene type epoxy resin, naphthalene type 4-functional epoxy resin, cresol novolac epoxy resin, and dicyclopentadiene type epoxy resin are preferable. , Triphenol epoxy resin, naphthol epoxy resin, biphenyl epoxy resin, naphthalene ether epoxy resin, anthracene epoxy resin, bisphenol A epoxy resin, bisphenol AF epoxy resin Resin and tetraphenylethane type epoxy resin, more preferably naphthol type epoxy resin and naphthalene type epoxy resin.

Specific examples of the solid epoxy resin include "HP4032H" (naphthalene-type epoxy resin) manufactured by DIC; "HP-4700" and "HP-4710" (naphthalene-type 4-functional epoxy resin) manufactured by DIC ; "N-690" (cresol novolac epoxy resin) manufactured by DIC; "N-695" (cresol novolac epoxy resin) manufactured by DIC; "HP-7200", "HP HP-7200HH "," HP-7200H "(dicyclopentadiene epoxy resin);" EXA-7311 "," EXA-7311-G3 "," EXA-7311-G4 "," EXA " -7311-G4S "," HP6000 "(naphthalene ether epoxy resin);" EPPN-502H "(triphenol epoxy resin) manufactured by Nippon Kayaku Co .;" NC7000L "(naphthalene) manufactured by Nippon Kayaku Co., Ltd. Phenol novolac epoxy resin); "NC3000H", "NC3000", "NC3000L", "NC3100" (biphenyl epoxy resin) manufactured by Nippon Kayaku Co., Ltd .; "ESN475V" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd. (Naphthol-type epoxy resin); "ESN485" (naphthol novolac-type epoxy resin) manufactured by Nippon Steel & Sumitomo Chemical Corporation; "YX4000H", "YX4000", "YL612" manufactured by Mitsubishi Chemical 1 "(biphenyl epoxy resin);" YX4000HK "(bis xylenol epoxy resin) manufactured by Mitsubishi Chemical;" YX8800 "(anthracene epoxy resin) manufactured by Mitsubishi Chemical; manufactured by Osaka Gas Chemical Company "PG-100" and "CG-500"; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Company; "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical Company; "jER1010" manufactured by Mitsubishi Chemical Company "(Solid bisphenol A type epoxy resin);" jER1031S "(tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Company, and the like. These can be used alone or in combination of two or more.

As the (A) epoxy resin, when a liquid epoxy resin and a solid epoxy resin are used in combination, their weight ratio (liquid epoxy resin: solid epoxy resin) is expressed by mass ratio, and is preferably 1: 1 ~ 1: 20, more preferably 1: 1.5 ~ 1: 15, and particularly good 1: 1 ~ 1: 10. By setting the amount ratio of the liquid epoxy resin to the solid epoxy resin within this range, the desired effect of the present invention can be significantly obtained. In addition, when it is usually used in the form of a resin sheet, it can impart moderate adhesiveness. Moreover, when it is usually used in the form of a resin sheet, sufficient flexibility can be obtained, and workability can be improved. Moreover, a hardened | cured material which has sufficient breaking strength is normally obtained.

(A) The epoxy equivalent of the epoxy resin is preferably 50 g / eq. To 5000 g / eq., More preferably 50 g / eq. To 3000 g / eq., And even more preferably 80 g / eq. To 2000 g / eq. More preferably, it is 110 g / eq. To 1000 g / eq. Within this range, the crosslinking density of the hardened material of the resin composition layer becomes sufficient, and an insulating layer with a small surface roughness can be provided. The epoxy equivalent is the mass of a resin containing 1 equivalent of an epoxy group. This epoxy equivalent can be measured in accordance with JIS K7236.

(A) The weight average molecular weight (Mw) of the epoxy resin is preferably from 100 to 5000, more preferably from 250 to 3000, and still more preferably from 400 to 1500 from the viewpoint that the desired effect of the present invention is significantly obtained.
The weight average molecular weight of the resin can be measured as a polystyrene equivalent value by a gel permeation chromatography (GPC) method.

(A) The content of the epoxy resin is from the viewpoint of obtaining a good mechanical strength and an insulating layer showing insulation reliability. When the non-volatile content in the resin composition is 100% by mass, it is preferably 1% by mass or more. More preferably, it is 5 mass% or more, More preferably, it is 10 mass% or more. The upper limit of the content of the epoxy resin is preferably 30% by mass or less, more preferably 25% by mass or less, and particularly preferably 20% by mass or less from the viewpoint that the desired effect of the present invention is significantly obtained. In the present invention, when the content of each component in the resin composition is not particularly specified, it means the value when the nonvolatile component in the resin composition is 100% by mass.

＜ (B) Benzoxazine-based hardener ＞
The resin composition contains (B) a benzoxazine-based hardener. (B) A benzoxazine-based hardener refers to a compound having a benzoxazine ring represented by the following formula (B-2) in the molecule.

By using (B) a benzoxazine-based hardener and (C) (meth) acrylate in a specific amount ratio, a hardened product having excellent slag removal properties and excellent adhesion to a conductor layer can be obtained. (B) A benzoxazine-based hardener may be used alone or in combination of two or more.

(B) The number of benzoxazine rings in one molecule of the benzoxazine-based hardener is preferably one from the viewpoint of obtaining a hardened product having excellent adhesion to the conductor layer and low arithmetic average roughness. Above, more preferably 2 or more, more preferably 10 or less, and even more preferably 5 or less.

(B) The benzoxazine-based hardener preferably has an aromatic ring in addition to the benzoxazine ring. By having an aromatic ring in addition to the benzoxazine ring, a hardened product having better adhesion to the conductor layer and lower arithmetic average roughness can be obtained. Examples of the aromatic ring include a benzene ring, a naphthalene ring, an anthracene ring, a biphenyl ring, and the like, and a benzene ring is preferred. The number of aromatic rings is preferably one or more, more preferably two or more, more preferably ten or less, and still more preferably five or less from the viewpoint of improving the adhesion.

(B) The benzoxazine-based hardener is preferably a benzoxazine-based hardener represented by the following general formula (B-1).

(In the formula (B-1), R ¹¹ represents an n-valent group, and R ¹² each independently represents a halogen atom, an alkyl group, or an aryl group. N represents an integer of 2 to 4 and m represents an integer of 0 to 4.)

R ¹¹ represents an n-valent basis. Such a group is preferably an n-valent aromatic hydrocarbon group, an n-valent aliphatic hydrocarbon group, an oxygen atom, or a combination thereof. For example, when n is 2, R ^{11 is} preferably a diaryl group, an alkylene group, an oxygen atom, or a divalent group grouped by a combination of two or more selected from these, more preferably a diaryl group or a group selected from Divalent bases grouped by two or more combinations are more preferably selected from divalent bases grouped by two or more combinations.

The arylene is preferably an arylene having 6 to 20 carbon atoms, more preferably an arylene having 6 to 15 carbon atoms, and even more preferably an arylene having 6 to 12 carbon atoms. Specific examples of the arylene group include a phenylene group, a naphthyl group, an anthracenylene group, a biphenylene group, and the like, and a phenylene group is preferred.
The alkylene group is preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms, and even more preferably an alkylene group having 1 to 3 carbon atoms. Specific examples of the alkylene group include, for example, methylene, ethylidene, and propylidene. Methylene is preferred.

Divalent groups selected from the group consisting of two or more of these combinations include, for example, groups obtained by bonding 1 or more aryl groups with 1 or more oxygen atoms, 1 or more aryl groups, and 1 or more aryl groups. A group obtained by bonding an alkyl group, a group obtained by bonding an alkyl group of 1 or more and an oxygen atom of 1 or more, a group obtained by bonding an alkyl group of 1 or more and an alkyl group of 1 or more and an oxygen atom of 1 or more The obtained base and the like are preferably a base obtained by bonding an aryl group of 1 or more and an oxygen atom of 1 or more, and a group obtained by bonding of an aryl group of 1 or more and an alkyl group of 1 or more. Specific examples of the divalent radical selected from the group consisting of two or more of these combinations include the following radicals. In the formula, "*" indicates a bond.

The arylene group and the alkylene group may have a substituent. The substituent is not particularly limited, and examples thereof include a halogen atom, -OH, -OC _1-6 alkyl,
-N (C _1-6 alkyl) ₂ , C _1-6 alkyl, C _6-10 aryl, -NH ₂ , -CN,
-C (O) OC _1-6 alkyl, -COOH, -C (O) H, -NO ₂ and the like. Here, the term “C _pq ” (p and q are positive integers and satisfy p <q.) Indicates that the number of carbon atoms of the organic group described after this term is p to q. For example, the description of "C _1-6 alkyl" means an alkyl group having 1 to 6 carbon atoms.

The substituent may further have a substituent (hereinafter sometimes referred to as a "secondary substituent"). When a secondary substituent is not specifically mentioned, the same thing as the said substituent can also be used.

R ¹² each independently represents a halogen atom, an alkyl group, or an aryl group. The alkyl group is preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and even more preferably an alkyl group having 1 to 3 carbon atoms. The aryl group is preferably an aryl group having 6 to 20 carbon atoms, more preferably an aryl group having 6 to 15 carbon atoms, and even more preferably an aryl group having 6 to 10 carbon atoms. The halogen atom means a fluorine atom, a chlorine atom, a bromine atom or an iodine atom. The alkyl group and the aryl group may have a substituent. The substituent is the same as the substituent which the above-mentioned arylene group may have.

n represents an integer of 2 to 4, preferably an integer of 2 to 3, and more preferably 2. m represents an integer of 0 to 4, preferably an integer of 0 to 3, more preferably 0.

From the viewpoint of obtaining the desired effect of the present invention, the benzoxazine-based hardener represented by the general formula (B-1) is preferably represented by the following general formula (B-3) and general formula (B-4) At least one of benzoxazine-based hardeners.

The benzoxazine-based hardener represented by the general formula (B-3) is preferably at least any one of the benzoxazine-based hardener represented by the general formula (B-5) and the general formula (B-6). The benzoxazine-based hardener represented by the formula (B-4) is preferably a benzoxazine-based hardener represented by the general formula (B-7).

The benzoxazine-based hardener represented by the general formula (B-1) may be used singly or in combination of two or more kinds. For example, when a benzoxazine-based hardener represented by the general formula (B-5) and a benzoxazine-based hardener represented by the general formula (B-6) are used as a mixture, the mass mixing ratio (general formula (B -5): The general formula (B-6)) is preferably 1: 10 ~ 10: 1, more preferably 1: 5 ~ 5: 1, and even more preferably 1: 3 ~ 3: 1. By setting the mass mixing ratio within this range, the adhesion between the insulating layer and the conductor layer can be improved.

(B) Specific examples of the benzoxazine-based hardener include "JBZ-OD100" (benzoxazine ring equivalent 218) and "JBZ-OP100D" (benzoxazine ring equivalent 218g / eq.), "ODA-BOZ" (benzoxazine ring equivalent 218g / eq.); "Pd" (benzoxazine ring equivalent 217g / eq.), "Fa" (benzene Benzoxazine ring equivalent 217g / eq.); "HFB2006M" (benzoxazine ring equivalent 432g / eq.) Manufactured by Showa Polymer Co., Ltd., etc.

(B) The molecular weight of the benzoxazine-based hardener is preferably 200 or more, more preferably 300 or more, and more preferably 400 or more, more preferably 10,000 or less, and more preferably 5,000 from the viewpoint of improving adhesion. The following is more preferably 3,000 or less.

(B) The benzoxazine ring equivalent of the benzoxazine-based hardener is preferably 50 g / eq. Or more from the viewpoint of obtaining a hardened product having excellent adhesion to the conductor layer and low arithmetic mean roughness. It is more preferably 100 g / eq. Or more, more preferably 500 g / eq. Or less, more preferably 400 g / eq. Or less, and still more preferably 300 g / eq. Or less. The benzoxazine ring equivalent refers to the mass of the component (B) containing one equivalent of the benzoxazine ring.

The value obtained by dividing the mass of the (A) component by the epoxy equivalent of the (A) component is regarded as a. This value "a" represents the equivalent number (eq.) Of the epoxy group contained in (A) component. The value obtained by dividing the mass of the component (B) by the benzoxazine ring equivalent of the component (B) is taken as b. This value "b" represents the equivalent number (eq.) Of the benzoxazine ring contained in the component (B). At this time, b / a is preferably 0.01 or more, more preferably 0.02 or more, still more preferably 0.03 or more, more preferably 10 or less, still more preferably 5 or less, and even more preferably 1 or less. By setting the amount ratio of (A) component and (B) component to this range, the hardened | cured material excellent in adhesiveness can be obtained. Here, when the resin composition contains two or more components (A), the above-mentioned a is the total value obtained by dividing the mass of the non-volatile component of each epoxy resin present in the resin composition by each epoxy equivalent. value. When the resin composition contains two or more components (B), the above-mentioned b is the mass of the non-volatile component of each benzoxazine-based hardener present in the resin composition divided by each benzoxazine ring equivalent. All the obtained values are total values.

(B) When the content of the benzoxazine-based hardener is 100% by mass of the resin component in the resin composition, it is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass. %the above. The upper limit is preferably 15% by mass or less, more preferably 14% by mass or less, and still more preferably 13% by mass or less. By setting the content of the component (B) within this range, a hardened product having excellent adhesion to the conductor layer and low arithmetic average roughness can be obtained.

The "resin component" of the resin composition refers to a component obtained by removing the (D) inorganic filler from among the non-volatile components contained in the resin composition.

<(C) (Meth) acrylate>
The resin composition contains (C) (meth) acrylate. By containing (C) (meth) acrylate in a resin composition, the hardened | cured material which can reduce a dielectric tangent and is excellent in slag removal property can be obtained. Here, the term "(meth) acrylic acid" means acrylic acid and methacrylic acid, and combinations thereof.

(C) From the viewpoint of obtaining a hardened product having a reduced dielectric tangent and excellent slag removal properties, the (meth) acrylate preferably has two (meth) acrylfluorenyl groups in one molecule. The term "(meth) acrylfluorenyl" means acrylyl and methacrylfluorenyl and combinations thereof.

(C) (meth) acrylate preferably has a cyclic structure from the viewpoint of obtaining a hardened product having a reduced dielectric tangent and excellent slag removal properties. The cyclic structure is preferably a divalent cyclic group. The divalent cyclic group may be any of a cyclic group including an alicyclic structure and a cyclic group including an aromatic ring structure. Among these, a cyclic group containing an alicyclic structure is preferred from the viewpoint of significantly obtaining the desired effect of the present invention.

A bivalent cyclic group is preferably a 3-membered ring or more, more preferably a 4-membered ring or more, and even more preferably a 5-membered ring or more, and more preferably 20 members, from the viewpoint that the desired effect of the present invention is significantly obtained. Below the ring, more preferably below 15 members, and even more preferably below 10 members. The divalent cyclic group may have a monocyclic structure or a polycyclic structure.

The ring in the divalent cyclic group may be a skeleton in which a ring is formed by a hetero atom in addition to a carbon atom. Examples of the hetero atom include an oxygen atom, a sulfur atom, and a nitrogen atom, and an oxygen atom is preferred. The heteroatom may have one, or may have two or more.

Specific examples of the divalent cyclic group include the following divalent groups (i) to (xi). Among them, the divalent cyclic group is preferably (x) or (xi).

The divalent cyclic group may have a substituent. Examples of such a substituent include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an arylalkyl group, a silyl group, a fluorenyl group, a fluorenyl group, a carboxyl group, a sulfonic group, a cyano group, a nitro group, a hydroxyl group, A mercapto group, a pendant oxygen group, and the like are preferably an alkyl group.

The (meth) acrylfluorenyl group may be directly bonded to a divalent cyclic group, or may be bonded via a divalent linking group. Examples of the divalent linking group include alkylene, alkenyl, arylene, heteroarylene, -C (= O) O-, -O-, -NHC (= O)-, -NC ( = O) N-, -NHC (= O) O-, -C (= O)-,
-S-, -SO-, -NH-, etc., or a base formed by combining these plural numbers. The alkylene group is preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms, and even more preferably an alkylene group having 1 to 5 carbon atoms, or a carbon atom number. 1 to 4 alkyl groups. The alkylene group may be any of linear, branched, and cyclic. Examples of such an alkylene group include a methylene group, an ethylene group, a propyl group, a butyl group, a pentyl group, a hexamethylene group, and a 1,1-dimethyl butyl group. Preferred is a methylene group. , Ethylene, 1,1-dimethyl ethylene. The alkylene group is preferably an alkylene group having 2 to 10 carbon atoms, more preferably an alkylene group having 2 to 6 carbon atoms, and even more preferably an alkylene group having 2 to 5 carbon atoms. The arylene or heteroarylene is preferably an arylene or heteroarylene having 6 to 20 carbon atoms, and more preferably an arylene or heteroarylene having 6 to 10 carbon atoms. The divalent linking group is preferably an alkylene group, and among these, a methylene group and 1,1-dimethylethylene group are preferred.

(C) The (meth) acrylate is preferably represented by the following formula (C-1).

(In formula (C-1), R ¹ and R ⁴ each independently represent an acrylfluorenyl group or a methacrylfluorenyl group, and R ² and R ³ each independently represent a divalent linking group. Ring A represents a divalent cyclic group .)

R ¹ and R ⁴ each independently represent an acrylfluorenyl group or a methacrylfluorenyl group, and is preferably an acrylfluorenyl group.

R ² and R ³ each independently represent a divalent linking group. The divalent linking group is the same as the aforementioned divalent linking group.

Ring A represents a divalent cyclic group. Ring A is the same as the divalent cyclic group described above.

Ring A may have a substituent. The substituent is the same as the substituent which the above-mentioned divalent cyclic group may have.

Specific examples of the component (C) are shown below, but the present invention is not limited thereto.

(C) A commercially available product can be used, for example, "A-DOG" ((meth) acryl fluorenyl equivalent 163g / eq.) By Shin Nakamura Chemical Industry Co., Ltd., and "DCP- A "((meth) acrylfluorenyl equivalent 152g / eq.)," NPDGA "((meth) acrylfluorenyl equivalent 106g / eq.) Manufactured by Nippon Kayaku Co., Ltd., and" FM-400 "((methyl) 156 g / eq. Of acryl fluorenyl equivalent, `` R-687 '' (187 g / eq. Of (meth) acryl fluorenyl equivalent), `` THE-330 '' (143 g / eq. Of (meth) acryl fluorenyl equivalent), "PET-30" ((meth) acrylfluorenyl equivalent 88g / eq.), "DPHA" ((meth) acrylfluorenyl equivalent 96g / eq.), Etc. (C) A component may be used individually by 1 type, and may be used in combination of 2 or more type.

(C) The (meth) acrylic acid fluorene equivalent of the (meth) acrylic acid ester is preferably 30 g / eq. Or more from the viewpoint of reducing the dielectric tangent and hardening material having excellent slag removal properties. It is 50 g / eq. Or more, and more preferably 75 g / eq. Or more, more preferably 400 g / eq. Or less, more preferably 300 g / eq. Or less, and still more preferably 200 g / eq. Or less. The (meth) acrylfluorenyl equivalent is the mass of the (C) component which contains 1 equivalent of (meth) acrylfluorenyl.

The content of the component (C) is from the viewpoint of remarkably obtaining the effect of the present invention. When the resin component in the resin composition is 100% by mass, it is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5 mass% or more. The upper limit is preferably 20% by mass or less, more preferably 18% by mass or less, and still more preferably 15% by mass or less.

The resin composition is obtained by combining (B) a benzoxazine-based hardener and (C) (meth) acrylate in a specific amount ratio, thereby obtaining a cured product having excellent adhesion and low arithmetic average roughness. . The value obtained by dividing the mass of the component (B) by the benzoxazine ring equivalent of the component (B) is defined as b. The value obtained by dividing the mass of the (C) component by the (meth) acrylfluorenyl equivalent of the (C) component is c. This value "c" represents the equivalent number (eq.) Of the (meth) acrylfluorenyl equivalent contained in the (C) component. At this time, b / c is 0.08 or more, preferably 0.1 or more, and more preferably 0.13 or more. The upper limit value is 2.5 or less, preferably 2 or less, and more preferably 0.19 or less. By setting b / c within this range and adjusting the amount ratio of the component (B) and the component (C), a hardened material having excellent adhesion and low arithmetic average roughness can be obtained. Moreover, the dielectric tangent of this hardened | cured material is usually reduced. When the resin composition contains two or more components (C), the value obtained by dividing the mass of each (meth) acrylic acid ester in the above-mentioned c-series present in the resin composition by each (meth) acryl fluorene equivalent Value.

＜ (D) Inorganic fillers ＞
The resin composition may further contain (D) an inorganic filler as an arbitrary component in addition to the above-mentioned components.

As the material of the inorganic filler, an inorganic compound is used. Examples of the material of the inorganic filler include silicon dioxide, aluminum oxide, glass, sapphire, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, gibbsite, Aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate , Titanium oxide, zirconia, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium phosphotungstate. Of these, particularly preferred is silicon dioxide. Examples of the silicon dioxide include amorphous silicon dioxide, fused silicon dioxide, crystalline silicon dioxide, synthetic silicon dioxide, and hollow silicon dioxide. The silicon dioxide is preferably spherical silicon dioxide. (D) The inorganic filler may be used alone or in combination of two or more kinds.

(D) Commercial products of inorganic fillers include, for example, "UFP-30" manufactured by Denka Chemical Industries; "SP60-05" and "SP507-05" manufactured by NIPPON STEEL & SUMIKIN MATERIALS; and manufactured by admatechs "YC100C", "YA050C", "YA050C-MJE", "YA010C"; "UFP-30" manufactured by Denka; "SilFile NSS-3N", "SilFile NSS-4N", "SilFile NSS" manufactured by Tokuyama Corporation -5N ";" SC2500SQ "," SO-C4 "," SO-C2 "," SO-C1 "manufactured by admatechs; etc.

(D) From the viewpoint that the average particle diameter of the inorganic filler can significantly obtain the desired effect of the present invention, it is preferably 0.01 μm or more, more preferably 0.05 μm or more, particularly preferably 0.1 μm or more, and preferably 5 μm. Hereinafter, it is more preferably 2 μm or less, and still more preferably 1 μm or less.

(D) The average particle diameter of the inorganic filler can be measured by a laser diffraction chirping scattering method based on the Mie scattering theory. Specifically, a particle size distribution of particles is produced on a volume basis by a laser diffraction scattering particle size distribution measurement device, and the particle size distribution is used to measure the median particle size as the average particle size. For the measurement sample, 100 mg of inorganic filling material and 10 g of methyl ethyl ketone were weighed out in a small glass bottle, and dispersed by ultrasonic waves for 10 minutes. A laser diffraction particle size distribution measuring device was used for the measurement sample, and the light source wavelength was blue and red, and the volume basis particle size distribution of the (D) inorganic filler was measured by a flow cell method. In the particle size distribution, the average particle size is calculated from the median particle size. The laser diffraction type particle size distribution measuring device includes, for example, "LA-960" manufactured by Horiba, Ltd., and the like.

(D) The specific surface area of the inorganic filler, from the viewpoint that the desired effect of the present invention can be significantly obtained, is preferably 1 m ² / g or more, more preferably 2 m ² / g or more, and particularly preferably 3 m ² / g or more. . The upper limit is not particularly limited, but is preferably 60 m ² / g or less, 50 m ² / g or less, or 40 m ² / g or less. The specific surface area can be obtained by using a specific surface area measuring device (Macsorb HM-1210, manufactured by MOUNTECH) to adsorb nitrogen on the surface of the sample in accordance with the BET method, and calculate the specific surface area using the BET multi-point method.

(D) Inorganic fillers are preferably treated with a surface treatment agent from the viewpoint of improving moisture resistance and dispersibility. Examples of the surface treatment agent include a fluorine-containing silane coupling agent, an aminosilane-based coupling agent, an epoxysilane-based coupling agent, a mercaptosilane coupling agent, a silane-based coupling agent, an alkoxysilane, and an organic silazane compound. , Titanate-based coupling agents, etc. The surface treatment agents may be used singly or in combination of two or more kinds.

Commercially available products of the surface treatment agent include, for example, "KBM403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd., and "KBM803" (3-mercaptopropyltrimethyl) manufactured by Shin-Etsu Chemical Industry Co., Ltd. Oxysilane), "KBE903" (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd., "KBM573" (N-phenyl-3-aminopropyltrimethoxy) manufactured by Shin-Etsu Chemical Industry Co., Ltd. Silane), Shin-Etsu Chemical Industry Co., Ltd. "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Industry Co., Ltd. "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Industry Co., Ltd. "KBM-4803" (Long-chain epoxy-based silane coupling agent), "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., and the like.

From the viewpoint of improving the dispersibility of the inorganic filler depending on the degree of the surface treatment of the surface treatment agent, it is preferred to fall within a specific range. Specifically, 100 parts by mass of the inorganic filler, preferably 0.2 to 5 parts by mass of the surface treatment agent, and more preferably 0.2 to 3 parts by mass of the surface treatment agent, and more preferably It is a surface treated by 0.3 to 2 parts by mass.

The degree of surface treatment by the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler. The carbon content per unit surface area of the inorganic filler is preferably 0.02 mg / m ² or more, more preferably 0.1 mg / m ² or more, and still more preferably 0.2 mg / m from the viewpoint of improving the dispersibility of the inorganic filler. ² or more. From the viewpoint of suppressing an increase in the melt viscosity of the resin varnish and the melt viscosity of the sheet form, it is preferably 1 mg / m ² or less, more preferably 0.8 mg / m ² or less, and still more preferably 0.5 mg / m ² or less.

The carbon content per unit surface area of the inorganic filler is measured after the surface-treated inorganic filler is washed with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent was added to an inorganic filler surface-treated with a surface treatment agent, and ultrasonic cleaning was performed at 25 ° C for 5 minutes. After removing the upper liquid and drying the solid content, the carbon content per unit surface area of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, "EMIA-320V" manufactured by Horiba, Ltd. can be used.

(D) The content of the inorganic filler is from the viewpoint of reducing the dielectric tangent and improving the slag removal property. When the nonvolatile component in the resin composition is 100% by mass, it is preferably 50% by mass or more, more preferably 60 More than 70% by mass, and more preferably more than 70% by mass. From the viewpoint of maintaining adhesion, it is preferably 90% by mass or less, more preferably 85% by mass or less, and still more preferably 80% by mass or less. In general, when the content of the inorganic filler is relatively large, the adhesiveness tends to decrease, and in the present invention, sufficient adhesiveness can be maintained.

＜ (E) Hardener ＞
The resin composition may further contain (E) a curing agent as an optional component in addition to the above-mentioned components. However, the (B) benzoxazine-based hardener is not included in the (E) hardener. The (E) curing agent usually has a function of reacting with the component (A) to harden the resin composition. (E) A hardener may be used individually by 1 type, and may be used combining two or more types by arbitrary ratios.

(E) As the hardener, a compound that reacts with an epoxy resin to harden the resin composition may be used. Examples of the hardener include a phenol-based hardener, an active ester-based hardener, a cyanate-based hardener, a carbodiimide-based hardener, Amine-based hardeners, acid anhydride-based hardeners, and the like. Among these, from the viewpoint that the desired effect of the present invention can be significantly obtained, a phenol-based hardener and an active ester-based hardener are preferred, and an active ester-based hardener is more preferred.

Examples of the phenol-based hardener include hardeners having one or more, preferably two or more, hydroxyl groups bonded to an aromatic ring (benzene ring, naphthalene ring, etc.) in one molecule. Among these, a compound having a hydroxyl group bonded to a benzene ring is preferred. From the viewpoint of heat resistance and water resistance, a phenol-based hardener having a novolac structure is preferred. From the viewpoint of adhesion, a nitrogen-containing phenol-based hardener is preferred, and a triazine skeleton-containing phenol-based hardener is more preferred. In particular, a phenol novolak hardener containing a triazine skeleton is preferred from the viewpoint of achieving sufficient heat resistance, water resistance, and adhesion.

Specific examples of the phenol-based hardener and naphthol-based hardener include "MEH-7700", "MEH-7810", "MEH-7851", and "MEH-8000H" manufactured by Kawa Kasei Corporation; "NHN", "CBN", "GPH"; "SN-170", "SN-180", "SN-190", "SN-475", "SN-485" made by Nippon Steel & Sumitomo Chemical Corporation , "SN-495", "SN-495V", "SN-375", "SN-395"; "TD-2090", "TD-2090-60M", "LA-7052", " LA-7054 "," LA-1356 "," LA-3018 "," LA-3018-50P "," EXB-9500 "," HPC-9500 "," KA-1160 "," KA-1163 "," "KA-1165"; "GDP-6115L", "GDP-6115H", "ELPC75", etc., manufactured by Qunrong Chemical Company.

Examples of the active ester-based hardener include hardeners having one or more active ester groups in one molecule. Among them, the active ester-based hardener is preferably a phenol ester, a thiophenol ester, an N-hydroxyamine ester, a heterocyclic hydroxy compound ester, and the like having two or more highly reactive esters in one molecule. Compounds based on radicals are preferred. The active ester-based hardener is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. Particularly from the viewpoint of improving heat resistance, an active ester-based hardener obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester-based hardener obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable. .

Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

Examples of the phenol compound or naphthol compound include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, and methylated bisphenol. Phenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-Dihydroxynaphthalene, Dihydroxybenzophenone, Trihydroxybenzophenone, Tetrahydroxybenzophenone, Resorcinol, Pyrogallol, Dicyclopentadiene Type Diphenol Compound, Phenol Novolac Varnish, etc. Here, the "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing one molecule of dicyclopentadiene and two molecules of phenol.

Preferred specific examples of the active ester-based hardener include active ester compounds containing a dicyclopentadiene-type diphenol structure, active ester compounds containing a naphthalene structure, active ester compounds containing an acetic acid compound of phenol novolac, An active ester compound containing a benzamidine compound of phenol novolac. Among these, an active ester compound containing a naphthalene structure and an active ester compound containing a dicyclopentadiene-type diphenol structure are more preferable. The "dicyclopentadiene-type diphenol structure" means a divalent structure formed from phenylene-dicyclopentyl-phenylene.

Commercial products of active ester-based hardeners, which contain dicyclopentadiene-type diphenol-based active ester compounds. Examples include "EXB9451", "EXB9460", "EXB9460S", "HPC-8000", and "HPC-8000H" "," HPC-8000-65T "," HPC-8000H-65TM "," EXB-8000L "," EXB-8000L-65TM "," EXB-8150-65T "(manufactured by DIC Corporation); activity containing a naphthalene structure Examples of the ester compounds include "EXB9416-70BK" (manufactured by DIC); active ester-based hardeners of the acetic acid compounds of phenol novolac; "DC808" (manufactured by Mitsubishi Chemical Company); benzoic compounds of phenol novolac Examples of the active ester-based hardener include "YLH1026" (manufactured by Mitsubishi Chemical Company), "YLH1030" (manufactured by Mitsubishi Chemical Company), and "YLH1048" (manufactured by Mitsubishi Chemical Company); and the like.

Examples of the cyanate-based curing agent include bisphenol A dicyanate, polyphenol cyanate, oligo (3-methylene-1,5-phenylene cyanate), and 4,4'-subline. Methylbis (2,6-dimethylphenylcyanate), 4,4'-ethylenediphenyldicyanate, hexafluorobisphenol A dicyanate, 2,2-bis ( 4-cyanate) phenylpropane, 1,1-bis (4-cyanatephenylmethane), bis (4-cyanate-3,5-dimethylphenyl) methane, 1,3- Bis (4-cyanatephenyl-1- (methylethylene)) benzene, bis (4-cyanatephenyl) sulfide, and bis (4-cyanatephenyl) ether, etc. 2-functional cyanate resins; polyfunctional cyanate resins derived from phenol novolac and cresol novolac; prepolymers of which these cyanate resins are partially triazinated; etc. Specific examples of the cyanate-based curing agent include "PT30" and "PT60" (both phenol novolac-type polyfunctional cyanate resins) and "ULL-950S" (polyfunctional cyanate esters) manufactured by Lonza Japan. Resin); "BA230", "BA230S75" (prepolymer of a trimer of a bisphenol A dicyanate partially or completely triazinated); etc.

Specific examples of the carbodiimide-based hardener include "V-03" and "V-07" manufactured by Nishinbo Chemical.

Examples of the amine hardener include hardeners having one or more amine groups in one molecule, and examples thereof include aliphatic amines, polyetheramines, alicyclic amines, and aromatic amines. From the viewpoint of the desired effect of the present invention, aromatic amines are preferred. The amine-based hardener is preferably a primary amine or a secondary amine, and more preferably a primary amine. Specific examples of the amine-based hardener include 4,4'-methylenebis (2,6-dimethylaniline), diphenyldiaminofluorene, and 4,4'-diaminodiphenylmethane. , 4,4'-diaminodiphenylphosphonium, 3,3'-diaminodiphenylphosphonium, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4 '-Diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3 , 3'-dihydroxybenzidine, 2,2-bis (3-amino-4-hydroxyphenyl) propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenyl Methanediamine, 2,2-bis (4-aminophenyl) propane, 2,2-bis (4- (4-aminophenoxy) phenyl) propane, 1,3-bis (3- Aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 4,4'-bis (4-amine Phenylphenoxy) biphenyl, bis (4- (4-aminophenoxy) phenyl) fluorene, bis (4- (3-aminophenoxy) phenyl) fluorene and the like. Commercial products can be used for the amine hardener, and examples thereof include "KAYABOND C-200S", "KAYABOND C-100", "Kayahard AA", "Kayahard AB", "Kayahard A-S", Mitsubishi manufactured by Nippon Kayaku Co., Ltd. "Epicure W" made by chemical company, etc.

Examples of the acid anhydride-based curing agent include a curing agent having one or more acid anhydride groups in one molecule. Specific examples of the acid anhydride-based hardener include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and methylhexahydrophthalic acid. Acid anhydride, methyl nadic acid anhydride, hydrogenated methyl nadic acid anhydride, trialkyltetrahydrophthalic anhydride, dodecenylsuccinic anhydride, 5- (2,5-dioxotetrahydro-3-furan ) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, anhydrous pyromellitic acid, benzophenone tetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride , Naphthalene tetracarboxylic dianhydride, oxybisphthalic dianhydride, 3,3'-4,4'-diphenylphosphonium tetracarboxylic dianhydride, 1,3,3a, 4,5,9b-hexa Hydrogenated 5- (tetrahydro-2,5-dioxo-3-furyl) -naphtho [1,2-C] furan-1,3-dione, ethylene glycol bis (anhydro trimellitate) Polymeric anhydrides such as styrene and maleic resin copolymerized with styrene and maleic acid.

A value obtained by dividing the mass of the (A) component by the epoxy equivalent of the (A) component is referred to as a, and a value obtained by dividing the mass of the (E) component by the reactive group equivalent of the (E) component is referred to as e. This value "e" represents the number of equivalents (eq.) Of the reactive groups contained in the (E) component. At this time, e / a is preferably 0.1 or more, more preferably 0.3 or more, and still more preferably 0.5 or more. The upper limit value is preferably 3 or less, more preferably 2 or less, and even more preferably 1 or less. Here, the reactive group of the curing agent is an active hydroxyl group or the like, which varies depending on the type of the curing agent. When two or more (A) components are contained in the resin composition, and when two or more (E) components are contained in the resin composition, the above-mentioned e is the mass of each (E) component present in the resin composition divided by All the values obtained by the equivalents of each reactive group are totaled. By setting the amount ratio of the epoxy resin to the hardener within this range, the heat resistance of the hardened product of the resin composition is further improved.

In addition, (b + e) / c is 1.31 or more, preferably 1.35 or more, and more preferably 1.4 or more. The upper limit value is 7 or less, preferably 6 or less, and more preferably 5 or less. By adjusting the amount ratio of the (B) component and the (C) component so that (b + e) / c falls within this range, a cured product having excellent adhesion and low arithmetic average roughness can be obtained.

(E) The content of the hardener is from the viewpoint that the desired effect of the present invention can be significantly obtained. When the nonvolatile content in the resin composition is 100% by mass, it is preferably 1% by mass or more, and more preferably 3% by mass or more. It is more preferably 5 mass% or more, preferably 15 mass% or less, more preferably 13 mass% or less, and still more preferably 10 mass% or less.

＜ (F) Thermoplastic resin ＞
The resin composition may further include (F) a thermoplastic resin as an optional component in addition to the above-mentioned components.

Examples of the thermoplastic resin as the (F) component include phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyimide resin, and polyimide resin. Etherimide resin, polyfluorene resin, polyether resin, polyphenylene ether resin, polycarbonate resin, polyetheretherketone resin, polyester resin, etc. Among these, a phenoxy resin is preferred from the viewpoint of significantly obtaining the desired effect of the present invention and the viewpoint of obtaining an insulating layer having a small surface roughness and particularly excellent adhesion to a conductor layer. Moreover, a thermoplastic resin may be used individually by 1 type, or may be used in combination of 2 or more type.

Examples of the phenoxy resin include those selected from the group consisting of a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a bisphenol acetophenone skeleton, a novolac skeleton, a biphenyl skeleton, a fluorene skeleton, and a dicyclopentadiene skeleton. 1 or more types of phenoxy resins in a group consisting of norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group.

Specific examples of the phenoxy resin include "1256" and "4250" made by Mitsubishi Chemical (both phenoxy resins containing a bisphenol A skeleton); "YX8100" (made by bisphenol S skeletons) made by Mitsubishi Chemical (Phenoxy resin); "YX6954" (phenoxy resin containing bisphenol acetophenone skeleton) manufactured by Mitsubishi Chemical; "FX280" and "FX293" manufactured by Nippon Steel & Sumitomo Chemical; "YL7500BH30" manufactured by Mitsubishi Chemical "," YX6954BH30 "," YX7553 "," YX7553BH30 "," YL7769BH30 "," YL6794 "," YL7213 "," YL7290 ", and" YL7482 "; etc.

Examples of the polyvinyl acetal resin include a polyvinyl formal resin and a polyvinyl butyral resin, and a polyvinyl butyral resin is preferred. Specific examples of the polyvinyl acetal resin include "Denka Butyral4000-2", "Denka Butyral5000-A", "Denka Butyral6000-C", and "Denka Butyral6000-EP"; manufactured by Electrochemical Industries, Ltd .; Sekisui Chemical Industry The company's S-Lec BH series, BX series (such as BX-5Z), KS series (such as KS-1), BL series, BM series; etc.

Specific examples of the polyimide resin include "Rikacoat SN20" and "Rikacoat PN20" manufactured by Shin Nippon Chemical Co., Ltd. Specific examples of the polyimide resin include linear polyimide obtained by reacting a bifunctional hydroxyl-terminated polybutadiene, a diisocyanate compound, and a quaternary acid anhydride (Polyimide described in Japanese Patent Application Laid-Open No. 2006-37083 Polyimide), modified polyimide containing a polysiloxane skeleton (polyimide described in Japanese Patent Application Laid-Open No. 2002-12667 and Japanese Patent Application Laid-Open No. 2000-319386), and the like .

Specific examples of the polyamidoimide resin include "Vylomax HR11NN" and "Vylomax HR16NN" manufactured by Toyobo Corporation. Specific examples of the polyamidamine / imide resin include modified polyamidamine / imine produced by Hitachi Chemical Co., Ltd., "KS9100", "KS9300" (polyamidamine / imide containing a polysiloxane skeleton), and the like. .

Specific examples of the polyether fluorene resin include "PES5003P" manufactured by Sumitomo Chemical Corporation.

Specific examples of the polyphenylene ether resin include oligomeric polyphenylene ether styrene resin "OPE-2St 1200" manufactured by Mitsubishi Gas Chemical Co., Ltd. and the like.

Specific examples of the polymer resin include polymer "P1700" and "P3500" made by Solvay Advanced Polymers.

(F) From the viewpoint that the weight average molecular weight (Mw) of the thermoplastic resin can significantly obtain the desired effect of the present invention, it is preferably 8,000 or more, more preferably 10,000 or more, particularly preferably 20,000 or more, and preferably 70,000 or less. , More preferably 60,000 or less, particularly good 50,000 or less.

(F) The content of the thermoplastic resin is from the viewpoint that the desired effect of the present invention can be remarkably obtained. When the nonvolatile content in the resin composition is 100% by mass, it is preferably 0.01% by mass or more, and more preferably 0.05% by mass. % Or more, more preferably 0.1% by mass or more, more preferably 5% by mass or less, more preferably 3% by mass or less, and still more preferably 1% by mass or less.

＜ (G) Hardening accelerator ＞
The resin composition may further contain (G) a hardening accelerator as an optional component in addition to the above-mentioned components.

Examples of the hardening accelerator include phosphorus-based hardening accelerators, amine-based hardening accelerators, imidazole-based hardening accelerators, guanidine-based hardening accelerators, and metal-based hardening accelerators. Among them, preferred are phosphorus-based hardening accelerators, amine-based hardening accelerators, imidazole-based hardening accelerators, and metal-based hardening accelerators, and more preferred are amine-based hardening accelerators, imidazole-based hardening accelerators, and metal-based hardening accelerators. One type of hardening accelerator can be used alone, or two or more types can be used in combination.

Examples of the phosphorus-based hardening accelerator include triphenylphosphine, osmium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4- (Methylphenyl) triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, etc., preferably triphenylphosphine, tetrabutylphosphonium Decanoate.

Examples of the amine-based hardening accelerator include trialkylamines such as triethylamine, tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, and 2,4,6, -tris ( Dimethylaminomethyl) phenol, 1,8-diazabicyclo (5,4,0) -undecene, etc., preferably 4-dimethylaminopyridine, 1,8-diazabicyclo (5,4,0) -undecene.

Examples of the imidazole-based hardening accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, and 2-ethyl-4-methylimidazole. , 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1 -Benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl- 4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-benzene Imidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino- 6- [2'-undecylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazole -(1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine isotriazine Polycyanic acid adduct, 2-phenylimidazole isotricyanic acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethyl Imidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] Imidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, and the like, and the addition of imidazole compounds and epoxy resins The compound is preferably 2-ethyl-4-methylimidazole or 1-benzyl-2-phenylimidazole.

A commercially available product can be used as the imidazole-based hardening accelerator, and examples thereof include "P200-H50" manufactured by Mitsubishi Chemical Corporation.

Examples of guanidine-based hardening accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1- (o-tolyl) guanidine, and dimethyl. Guanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo [4.4.0] dec-5-ene, 7-methyl-1,5 , 7-triazabicyclo [4.4.0] dec-5-ene, 1-methyl biguanide, 1-ethyl biguanide, 1-n-butyl biguanide, 1-n-octadecyl biguanide, 1,1 -Dimethyl biguanide, 1,1-diethyl biguanide, 1-cyclohexyl biguanide, 1-allyl biguanide, 1-phenyl biguanide, 1- (o-tolyl) biguanide, etc., preferably dicyanide Amine, 1,5,7-triazabicyclo [4.4.0] dec-5-ene.

Examples of the metal-based hardening accelerator include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of the organometallic complex include organic cobalt complexes such as cobalt (II) acetoacetone, cobalt (III) acetoacetone, and copper complexes of copper (II) acetonate, etc. Organic zinc complexes such as osmium zinc acetone (II), organic iron complexes such as ethyl acetone iron (III), organic nickel complexes such as ethyl acetonide nickel (II), and manganese (II) ) And the like. Examples of the organic metal salt include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

(G) The content of the hardening accelerator can significantly obtain the desired effect of the present invention. When the nonvolatile content in the resin composition is 100% by mass, it is preferably 0.01% by mass or more, and more preferably 0.03. At least mass%, more preferably at least 0.05 mass%, more preferably at most 0.3 mass%, more preferably at most 0.2 mass%, still more preferably at most 0.1 mass%.

＜ (H) Polymerization initiator ＞
The resin composition may further contain (H) a polymerization initiator as an optional component in addition to the above-mentioned components. The (H) polymerization initiator usually has a function of promoting the crosslinking of the (meth) acrylfluorenyl group in the component (C). (H) The polymerization initiator may be used alone or in combination of two or more kinds.

(H) Polymerization initiator, for example, t-butylcumyl peroxide, t-butylperoxyacetate, α, α'-bis (t-butylperoxy) diisopropylbenzene , T-butylperoxylaurate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyneodecanoate, t-butylperoxybenzoate, and other peroxides.

(H) Commercially available products of the polymerization initiator include, for example, "Percumyl P", "Percumyl D", "Perbutyl C", "Perbutyl A", "Perbutyl P", "Perbutyl L", " "Perbutyl O", "Perbutyl ND", "Perbutyl Z", etc.

(H) The content of the polymerization initiator is from the viewpoint that the desired effect of the present invention can be significantly obtained. When the non-volatile content in the resin composition is 100% by mass, it is preferably 0.01% by mass or more, more preferably 0.03 mass% or more, and more preferably 0.05 mass% or more, more preferably 0.5 mass% or less, more preferably 0.3 mass% or less, and still more preferably 0.1 mass% or less.

＜ (I) Other additives ＞
The resin composition may further contain other additives as optional components in addition to the aforementioned components. Examples of such additives include organic fillers; resin additives such as tackifiers, defoamers, leveling agents, and adhesion-imparting agents; and the like. These additives may be used singly or in combination of two or more kinds.

The present inventors have found that when (C) (meth) acrylate is contained in the resin composition, the dielectric tangent can be reduced and the slag removing property can be improved. As a result of further careful review by the present inventors, it was found that by reducing the ratio of the amount of (B) benzoxazine-based hardener to (C) (meth) acrylate in the resin composition, the resin composition was reduced. In addition to the dielectric tangent and improving the slag removal, the arithmetic average roughness (Ra) of the surface of the hardened product obtained after the roughening treatment can be reduced, and the adhesion (peel strength) to the plated conductor layer can also be improved. This is because (B) the benzoxazine-based hardener increases the crosslink density in the hardened material, and the increase in the arithmetic average roughness is suppressed, and the peel strength is improved.

<Physical properties and uses of resin composition>
The resin composition was thermally cured at 130 ° C for 30 minutes, and then cured at 170 ° C for 30 minutes. The cured product exhibited excellent slag removal properties. Therefore, when a via hole is formed by the foregoing hardened material, an insulating layer with a maximum slag length at the bottom of the via hole is less than 5 μm. The scum-removability can be measured by the method described in Examples described later.

The roughened surface after the roughening treatment of the hardened material surface after the resin composition is thermally cured at 130 ° C for 30 minutes and then at 170 ° C for 30 minutes generally exhibits low arithmetic mean roughness (Ra). Therefore, the hardened | cured material brings about the insulating layer with low arithmetic average roughness. The arithmetic average roughness is preferably 130 nm or less, more preferably 120 nm or less, and still more preferably 100 nm or less. In addition, the lower limit of the arithmetic mean roughness may be 1 nm or more. The above-mentioned evaluation of the arithmetic average roughness (Ra) can be measured according to the method described in the examples described later.

The cured product which was thermally cured at 130 ° C. for 30 minutes and then cured at 170 ° C. for 30 minutes exhibited characteristics excellent in adhesion (peel strength) to the plated conductor layer. Therefore, the hardened | cured material brings the insulating layer which is excellent in adhesiveness with a plating conductor layer. The adhesion strength with the plated conductor layer is preferably 0.2 kgf / cm or more, more preferably 0.3 kgf / cm or more, and still more preferably 0.4 kgf / cm or more. The upper limit of the adhesive strength is not particularly limited, but may be 5 kgf / cm or less. The above-mentioned evaluation of the adhesion strength with the plated conductor layer can be measured according to the method described in the examples described later.

A cured product obtained by thermally curing a resin composition at 190 ° C for 90 minutes generally exhibits a low dielectric tangent. Therefore, the hardened | cured material brings the insulating layer with a low dielectric tangent. The dielectric tangent is preferably 0.005 or less, more preferably 0.004 or less and 0.003 or less. The lower limit of the dielectric tangent is not particularly limited, but may be 0.0001 or more. The evaluation of the dielectric tangent can be measured according to the method described in the examples described later.

The resin composition of the present invention can provide an insulating layer excellent in slag removal and adhesion. Therefore, the resin composition of the present invention can be suitably used as a resin composition for insulation applications. Specifically, it can be suitably used as a resin composition for forming an insulating layer for forming a conductor layer (including a rewiring layer) formed on the insulating layer (resin composition for forming an insulating layer for forming a conductor layer).

The multilayer printed wiring board described later can be suitably used as a resin composition for forming an insulating layer of a multilayer printed wiring board (resin composition for forming an insulating layer of a multilayer printed wiring board) and as an interlayer insulating layer for a printed wiring board. A resin composition (resin composition for forming an interlayer insulation layer of a printed wiring board) is used.

In addition, for example, when a semiconductor wafer package is manufactured through the following steps (1) to (6), the resin composition of the present invention can also be suitably used as a resin composition for a redistribution layer for an insulating layer for redistribution layer formation ( A resin composition for forming a rewiring formation layer) and a resin composition for packaging a semiconductor wafer (resin composition for packaging a semiconductor wafer) are used. When manufacturing a semiconductor chip package, a redistribution layer may be further formed on the packaging layer.
(1) a step of temporarily fixing a film by laminating on a substrate,
(2) a step of temporarily fixing a semiconductor wafer to a film,
(3) a step of forming an encapsulation layer on a semiconductor wafer,
(4) a step of peeling the substrate and the temporary fixing film from the semiconductor wafer,
(5) a step of forming a rewiring forming layer as an insulating layer on the substrate of the semiconductor wafer and the surface on which the temporary fixing film is peeled off, and
(6) Step of forming a redistribution layer as a conductor layer on the redistribution forming layer

In addition, the resin composition of the present invention depends on an insulating layer having a good embedding property of the part, and is therefore also a case where the printed wiring board is a circuit board built into the part.

[Resin sheet]
The resin sheet of the present invention includes a support and a resin composition layer formed of the resin composition of the present invention provided on the support.

The thickness of the resin composition layer is preferably 50 μm or less, and more preferably 40 μm or less from the viewpoint that the thickness of the printed wiring board can be reduced and the hardened material of the resin composition can provide a hardened material having excellent insulation properties even if it is a thin film. It is more preferably 30 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited, and it may be generally 5 μm or more, 10 μm or more.

Examples of the support include a film made of a plastic material, a metal foil, and a release paper, and preferably a film made of a plastic material and a metal foil.

When a film made of a plastic material is used as a support, examples of the plastic material include polyethylene terephthalate (hereinafter sometimes referred to as "PET"), polyethylene naphthalate (sometimes below) Polyester (referred to as "PEN"), etc .; polycarbonate (hereinafter sometimes referred to as "PC"); acrylic acid such as polymethylmethacrylate (hereinafter sometimes referred to as "PMMA"), cyclic polyolefin, Triethyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, and the like. Among them, polyethylene terephthalate and polyethylene naphthalate are preferred, and cheap polyethylene terephthalate is particularly preferred.

When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil. Among these, copper foil is preferred. The copper foil may be a foil made of a single metal of copper, or a foil made of an alloy of copper and other metals (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.).

The support may be subjected to a matting treatment, a corona treatment, or an antistatic treatment on the surface bonded to the resin composition layer.

Moreover, as a support body, the support body with a mold release layer which has a mold release layer on the surface joined to a resin composition layer can also be used. The release agent used for the release layer of the support body with a release layer may be, for example, one or more members selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. Release agent. A commercially available product may be used as the support with a release layer, and examples thereof include a PET film having a release layer containing an alkyd resin-based release agent as a main component, and "SK-1" and "AL-5" manufactured by Lintec Corporation. "," AL-7 "," lumirror T60 "made by Toray," Purex "made by Teijin," unipeel "made by unitika, etc.

The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When a support with a release layer is used, the thickness of the entire support with a release layer is preferably within the above range.

In one embodiment, the resin sheet may include other layers as necessary. Examples of the other layers include a protective film conforming to the support provided on the surface of the resin composition layer that is not joined to the support (that is, the surface opposite to the support). The thickness of the protective film is not particularly limited, and is, for example, 1 μm to 40 μm. By laminating the protective film, it is possible to suppress adhesion or scratches on dirt and the like on the surface of the resin composition layer.

The resin sheet can be produced, for example, by preparing a resin varnish in which a resin composition is dissolved in an organic solvent, applying the resin varnish to a support using a die coater, or the like, and drying the resin varnish to form a resin composition layer.

Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol Ethyl acetates such as alcohol acetate; carbitols such as lysone and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; dimethylformamide and dimethylacetamide (DMAc) and amidamine-based solvents such as N-methylpyrrolidone and the like. The organic solvents may be used singly or in combination of two or more kinds.

Drying can be performed by a conventional method such as heating and blowing hot air. The drying conditions are not particularly limited, but the content of the organic solvent dried to the resin composition layer is 10% by mass or less, and preferably 5% by mass or less. It also varies depending on the boiling point of the organic solvent in the resin varnish. For example, when using a resin varnish containing 30% to 60% by mass of an organic solvent, it can be formed by drying at 50 ° C to 150 ° C for 3 minutes to 10 minutes. Resin composition layer.

The resin sheet can be rolled into a roll and stored. When the resin sheet has a protective film, the peelable protective film can be used later.

[Printed wiring board]
The printed wiring board of the present invention includes an insulating layer formed of a cured product of the resin composition of the present invention.

The printed wiring board is manufactured by the method including the following steps (I) and (II) using the above-mentioned resin sheet, for example.
(I) A step of bonding a resin composition layer of a resin sheet and an inner layer substrate to be laminated on the inner layer substrate
(II) A step of thermally curing the resin composition layer to form an insulating layer

The "inner substrate" used in step (I) is a member that becomes a substrate for a printed wiring board, and examples thereof include glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polymer substrates. Phenyl ether substrate and so on. In addition, one or both sides of the substrate may have a conductor layer, and the conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate is sometimes referred to as an "inner layer circuit substrate." Moreover, when manufacturing a printed wiring board, the intermediate manufacture which further forms an insulation layer and / or a conductor layer is also included in the "inner layer substrate" of this invention. When the printed wiring board is a part-embedded circuit board, an inner substrate having parts embedded therein can be used.

The lamination of the inner layer substrate and the resin sheet can be performed, for example, by heat-pressing the resin sheet to the inner layer substrate from the side of the support. A member (hereinafter, also referred to as a "heat-compression-bonding member") that heat-pressure-bonds a resin sheet to an inner layer substrate includes, for example, a heated metal plate (SUS mirror plate, etc.) or a metal roller (SUS roller). In addition, instead of pressing the thermocompression bonding member directly on the resin sheet, the resin sheet sufficiently follows the unevenness of the surface of the inner substrate and is preferably pressed through an elastic material such as a heat-resistant rubber.

The lamination of the inner substrate and the resin sheet can be performed by a vacuum lamination method. In the vacuum lamination method, the heating and crimping temperature is preferably in the range of 60 ° C to 160 ° C, and more preferably in the range of 80 ° C to 140 ° C. The heating and crimping pressure is preferably 0.098MPa to 1.77MPa, and more preferably 0.29MPa to In the range of 1.47 MPa, the heating and crimping time is preferably in the range of 20 seconds to 400 seconds, and more preferably in the range of 30 seconds to 300 seconds. The lamination is preferably performed under reduced pressure under a pressure of 26.7 hPa.

Lamination can be performed by a commercially available vacuum laminator. Commercially available vacuum laminators include, for example, a vacuum pressure type laminator made by Meiki Seisakusho, a vacuum coater made by nikko-materials, and a batch type vacuum pressure laminator.

After lamination, under normal pressure (atmospheric pressure), for example, by pressing the heat-pressing member from the support side, the laminated resin sheet may be smoothed. The pressing conditions for the smoothing treatment may be the same conditions as those of the heat-pressing conditions for the above-mentioned laminated layer. The smoothing process can be performed by a commercially available laminator. The lamination and smoothing treatment can also be performed continuously using the above-mentioned commercially available vacuum laminator.

The support may be removed between step (I) and step (II), or may be removed after step (II).

In step (II), the resin composition layer is thermally hardened to form an insulating layer. The conditions for thermal curing of the resin composition layer are not particularly limited, and when forming an insulating layer of a printed wiring board, conditions that are generally used can be used.

For example, the thermal curing conditions of the resin composition layer vary depending on the type of the resin composition, and the curing temperature is preferably 120 ° C to 240 ° C, more preferably 150 ° C to 220 ° C, and still more preferably 170 ° C to 210 ° C. . The hardening time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

Before the resin composition layer is thermally hardened, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, before thermosetting the resin composition layer, the resin composition layer is usually at a temperature of 50 ° C or higher and less than 120 ° C (preferably 60 ° C or higher and 115 ° C or lower, more preferably 70 ° C or higher and 110 ° C or lower) Pre-heating for more than 5 minutes (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes).

When manufacturing a printed wiring board, (III) a step of making holes in the insulating layer, (IV) a step of roughening the insulating layer, and (V) a step of forming a conductor layer may be further performed. These steps (III) to (V) can be carried out in accordance with various methods known to those skilled in the art for manufacturing printed wiring boards. In addition, when the support is removed after step (II), the support may be removed between step (II) and step (III), between step (III) and step (IV), or step (IV). And step (V). In addition, if necessary, the formation of the insulating layer and the conductor layer in steps (II) to (V) is repeatedly performed, and a multilayer wiring board may be formed.

Step (III) is a step of opening a hole in the insulating layer. Through this step, holes such as a via hole, a through hole, and the like can be formed in the insulating layer. Step (III) can be performed according to the composition of the resin composition used for forming the insulating layer, for example, using a drill, a laser, a plasma, or the like. The size or shape of the hole can be appropriately determined according to the design of the printed wiring board.

Step (IV) is a step of roughening the insulating layer. Usually, in this step (IV), scum is also removed. The order and conditions of the roughening treatment are not particularly limited, and when forming an insulating layer of a printed wiring board, a generally known order and conditions may be used. For example, a swelling treatment with a swelling solution, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing solution may be performed in accordance with this order, and the insulating layer may be subjected to a roughening treatment. The swelling liquid used for the roughening treatment is not particularly limited, and examples thereof include an alkali solution and a surfactant solution, and an alkali solution is preferred, and the alkali solution is more preferably a sodium hydroxide solution or a potassium hydroxide solution. Examples of commercially available swelling liquids include "Swelling Dip Securiganth P" and "Swelling Dip Securiganth SBU" manufactured by Atotech Japan. The swelling treatment by the swelling solution is not particularly limited. For example, the swelling treatment can be performed by immersing the insulating layer in a swelling solution at 30 ° C to 90 ° C for 1 minute to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to a moderate level, it is preferred that the insulating layer is immersed in a swelling liquid at 40 ° C to 80 ° C for 5 to 15 minutes. The oxidizing agent used for the roughening treatment is not particularly limited, and examples thereof include an alkaline permanganic acid solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment of an oxidant such as an alkaline permanganic acid solution is preferably performed by immersing the insulating layer in an oxidant solution heated to 60 ° C to 100 ° C for 10 minutes to 30 minutes. The concentration of the permanganate in the alkaline permanganic acid solution is preferably 5 to 10% by mass. Examples of commercially available oxidants include alkaline permanganic acid solutions such as "Concentrate Compact CP" and "Dosing Solution Securiganth P" manufactured by Atotech Japan. The neutralizing liquid used for the roughening treatment is preferably an acidic aqueous solution. Examples of commercially available products include "Reduction solution Securiganth P" manufactured by Atotech Japan. The treatment with the neutralizing solution can be performed by immersing the treated surface roughened with an oxidizing agent in a neutralizing solution at 30 ° C to 80 ° C for 1 minute to 30 minutes. From the viewpoint of workability and the like, a method of immersing an object subjected to roughening treatment with an oxidizing agent in a neutralization solution at 40 ° C to 70 ° C for 5 to 20 minutes is preferred.

In one embodiment, the arithmetic average roughness (Ra) of the surface of the insulating layer after the roughening treatment is preferably 120 nm or less, more preferably 110 nm or less, and still more preferably 100 nm or less. The lower limit is not particularly limited, but is preferably 30 nm or more, more preferably 40 nm or more, and still more preferably 50 nm or more. The arithmetic average roughness (Ra) of the surface of the insulating layer can be measured using a non-contact surface roughness meter.

Step (V) is a step of forming a conductor layer, and a conductor layer is formed on the insulating layer. The conductive material used for the conductive layer is not particularly limited. In a preferred embodiment, the conductor layer includes one or more members selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. metal. The conductor layer may be a single metal layer or an alloy layer. Examples of the alloy layer include an alloy of two or more metals selected from the above group (for example, nickel-chromium alloy, copper-nickel alloy, and copper-titanium alloy). Of layers. Among these, from the viewpoints of versatility, cost, and ease of patterning of the conductor layer, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper is preferred; or nickel The alloy layer of chromium alloy, copper-nickel alloy, and copper-titanium alloy is more preferably a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or an alloy layer of nickel-chromium alloy. More preferably, it is a single metal layer of copper.

The conductor layer may have a single-layer structure, or a single-metal layer or alloy made of different kinds of metals or alloys, and a multilayer structure in which two or more layers are laminated. When the conductor layer has a multilayer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc, or titanium, or an alloy layer of a nickel-chromium alloy.

The thickness of the conductor layer varies depending on the desired design of the printed wiring board, and is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

In one embodiment, the conductive layer can be formed by plating. For example, a conventionally known technique such as a semi-additive method and a full-additive method can be used to plate the surface of an insulating layer to form a conductor layer having a desired wiring pattern. It is preferably formed by a semi-additive method. An example of forming a conductive layer by a semi-additive method is shown below.

First, a shield layer is formed on the surface of the insulating layer by electroless plating. Next, on the formed plating protection layer, a mask pattern corresponding to a desired wiring pattern and exposing a part of the plating protection layer is formed. On the exposed plating protection layer, after forming a metal layer by electroplating, the mask pattern is removed. Then, an unnecessary plating protection layer is removed by etching or the like to form a conductor layer having a desired wiring pattern.

[Semiconductor device]
The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured using the printed wiring board of the present invention.

Examples of the semiconductor device include various semiconductor devices such as power supply gas products (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trams, ships, and airplanes).

The semiconductor device of the present invention can be manufactured by, for example, mounting a component (semiconductor wafer) at a conductive portion of a circuit board. "Continuity" means "a place where electrical signals are transmitted to the printed wiring board", which may be either a surface or an embedded place. When the semiconductor wafer is an electric circuit element using a semiconductor as a material, it is not particularly limited.

The method for mounting a semiconductor wafer during the manufacture of a semiconductor device is not particularly limited as long as the semiconductor wafer can effectively function. Specific examples include a wire bonding mounting method, a flip-chip mounting method, and a bumpless buildup ( (BBUL) installation method, anisotropic conductive film (ACF) installation method, non-conductive film (NCF) installation method, etc. Here, the "mounting method by bumpless layer (BBUL)" refers to the "mounting method of directly embedding a semiconductor wafer in a recessed portion of a printed wiring board and connecting the semiconductor wafer to the wiring on the printed wiring board".

[Example]

Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited to the following examples. In addition, in the following description, "part" and "%" which indicate an amount, respectively, show "mass part" and "mass%" unless otherwise stated. In addition, the operation described below indicates that the operation is performed in an environment of normal temperature and pressure unless otherwise specified.

[Example 1]
10 parts of a bisphenol type epoxy resin ("ZX1059" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., a 1: 1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent 169 g / eq.) 50 parts of an epoxy resin ("ESN475V" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., epoxy equivalent weight is about 330 g / eq.) Was dissolved in 40 parts of solvent petroleum spirit while being stirred to dissolve the heat. This was cooled to room temperature to prepare a dissolved composition of the epoxy resin.

5 parts of a phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1: 1 solution of 30% by mass of MEK and cyclohexanone) in the dissolved composition of the epoxy resin, a triazine skeleton, and 5 parts of novolac phenolic hardener ("LA-3018-50P" manufactured by DIC Corporation, reactive group equivalent of about 151 g / eq., 50% non-volatile 2-methoxypropanol solution), active ester Hardener ("HPC-8000-65T" manufactured by DIC, approximately 223 g / eq. Of reactive group equivalent, toluene solution with 65% by mass of non-volatile content), acrylate ("A-DOG" manufactured by Shin Nakamura Chemical Co. (Meth) acrylfluorene equivalent 156g / eq.) 20 parts, benzoxazine-based hardener ("JBZ-OD100" manufactured by JFE Chemical Co., Ltd. with MEK, benzoxazine ring equivalent of about 218g / eq.) 10 parts of 50% by mass non-volatile solution), 5 parts of hardening accelerator (1-benzyl-2-phenylimidazole (1B2PZ), 10% by mass of non-volatile MEK solution), polymerization initiator (Percumyl D 2, MEK solution made by Nippon Oil Co., Ltd., 20% non-volatile content) 2 parts, spherical silica (average particle) Of 0.5 m, a specific surface area 5.9m ² / g admatechs Corporation "SO-C2") 310 parts, 10 parts of cyclohexanone, MEK10 parts, and then uniformly dispersed using a high speed rotary mixer to prepare a resin varnish.

As a support, a polyethylene terephthalate (PET) film ("AL5" manufactured by Lintec, thickness: 38 µm) with a release layer was prepared. The aforementioned resin varnish was uniformly applied on the release layer of this support, so that the thickness of the resin composition layer after drying was 25 μm. Then, the resin varnish was dried at 80 ° C to 100 ° C (average 90 ° C) for 4 minutes to obtain a resin sheet including a support and a resin composition layer.

A-DOG has the structure shown below.

JBZ-OD100 is a mixture of p-body and m-body shown below (p-body: m-body = 6: 4).

[Example 2]
In Example 1, 20 parts of acrylic acid ester ("A-DOG" manufactured by Shin Nakamura Chemical Co., Ltd., 156 g / eq. Of (meth) acrylfluorenyl equivalent) was changed to acrylic acid ester ("DCP-A manufactured by Kyoeisha Chemical Co., Ltd. ", 20 parts of (meth) acrylfluorenyl equivalent 152 g / eq.). Except for the above matters, a resin varnish and a resin sheet were produced in the same manner as in Example 1.

DCP-A has the structure shown below.

[Example 3]
10 parts of the benzoxazine-based hardener of Example 1 ("JBZ-OD100" manufactured by JFE Chemical Co., Ltd., with a benzoxazine ring equivalent of about 218 g / eq. Dissolved as a 50% by mass non-volatile solution) MEK It was changed to 20 parts of a benzoxazine-based hardener ("Pd" manufactured by JFE Chemical Co., Ltd., a benzoxazine ring equivalent of about 217 g / eq., And a solution of 25% by mass of nonvolatile matter) were prepared with MEK. Except for the above matters, a resin varnish and a resin sheet were produced in the same manner as in Example 1.

Pd has the structure shown below.

[Example 4]
In Example 1,
1) Benzoxazine-based hardener ("JBZ-OD100" manufactured by JFE Chemical Co., Ltd. with MEK, benzoxazine ring equivalent of about 218 g / eq. Dissolved into a 50% by mass non-volatile solution), the amount is from 10 parts Becomes 6 servings,
2) The amount of acrylate ("A-DOG" manufactured by Shin Nakamura Chemical Co., Ltd., (meth) acrylic acid group equivalent 156 g / eq.) Was changed from 20 parts to 15 parts,
3) The amount of spherical silicon dioxide (average particle size 0.5 μm, "SO-C2" manufactured by admatechs) with an amine-based alkoxysilane compound ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 310 parts to 300 Serving.
Except for the above matters, a resin varnish and a resin sheet were produced in the same manner as in Example 1.

[Example 5]
In Example 1,
1) Benzoxazine-based hardener ("JBZ-OD100" manufactured by JFE Chemical Co., Ltd. with MEK, benzoxazine ring equivalent of about 218 g / eq. Dissolved into a 50% by mass non-volatile solution), the amount is from 10 parts Becomes 20 servings,
2) The amount of acrylate ("A-DOG" manufactured by Shin Nakamura Chemical Co., Ltd., (meth) acrylfluorenyl equivalent 156 g / eq.) Was changed from 20 parts to 10 parts,
3) The amount of spherical silica (average particle size 0.5 μm, "SO-C2" manufactured by admatechs), which was surface-treated with an amine-based alkoxysilane compound ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 310 parts to 300 Serving.
Except for the above matters, a resin varnish and a resin sheet were produced in the same manner as in Example 1.

[Comparative Example 1]
In Example 1,
1) 10 parts without using a benzoxazine-based hardener ("JBZ-OD100" manufactured by JFE Chemical Co., Ltd. with a benzoxazine ring equivalent of about 218 g / eq. Dissolved into a 50% by mass non-volatile solution),
2) The amount of spherical silica (average particle size 0.5 μm, "SO-C2" manufactured by admatechs), which was surface-treated with an amine-based alkoxysilane compound ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 310 parts to 290 Servings,
3) 2 parts of polymerization initiator (Percumyl D, MEK solution manufactured by Nippon Oil Co., Ltd., non-volatile content 20%) are not used.
Except for the above matters, a resin varnish and a resin sheet were produced in the same manner as in Example 1.

[Comparative Example 2]
In Example 2,
1) 10 parts without using a benzoxazine-based hardener ("JBZ-OD100" manufactured by JFE Chemical Co., Ltd. with a benzoxazine ring equivalent of about 218 g / eq. Dissolved into a 50% by mass non-volatile solution),
2) The amount of spherical silica (average particle size 0.5 μm, "SO-C2" manufactured by admatechs) treated with an amine-based alkoxysilane compound ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 310 parts to 290 Servings,
3) 2 parts of polymerization initiator (Percumyl D, MEK solution manufactured by Nippon Oil Co., Ltd., non-volatile content 20%) are not used.
Except for the above matters, a resin varnish and a resin sheet were produced in the same manner as in Example 2.

[Comparative Example 3]
In Example 1,
1) 20 parts of acrylate ("A-DOG" manufactured by Shin Nakamura Chemical Co., Ltd., (meth) acrylfluorenyl equivalent 156 g / eq.) Are not used,
2) The amount of spherical silica (average particle size 0.5 μm, "SO-C2" manufactured by admatechs), which was surface-treated with an amine-based alkoxysilane compound ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 310 parts to 240 Servings,
3) 10 parts without using a benzoxazine-based hardener ("JBZ-OD100" manufactured by JFE Chemical Co., Ltd., with a benzoxazine ring equivalent of about 218 g / eq. Dissolved as a 50% by mass non-volatile solution),
4) 2 parts of polymerization initiator (Percumyl D, MEK solution manufactured by Nippon Oil Co., Ltd., 20% non-volatile content) is not used.
Except for the above matters, a resin varnish and a resin sheet were produced in the same manner as in Example 1.

[Comparative Example 4]
In Example 1,
1) The amount of benzoxazine-based hardener ("JBZ-OD100" (benzoxazine ring equivalent approximately 218g / eq.) Made by JFE Chemical Co., Ltd. with MEK is dissolved into a 50% by mass non-volatile solution) amount is 10 Serving becomes 2 servings,
2) The amount of spherical silicon dioxide (average particle size 0.5 μm, "SO-C2" manufactured by admatechs), which was surface-treated with an amine-based alkoxysilane compound ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 310 parts to 300 Servings,
3) 2 parts of polymerization initiator (Percumyl D, MEK solution manufactured by Nippon Oil Co., Ltd., non-volatile content 20%) are not used.
Except for the above matters, a resin varnish and a resin sheet were produced in the same manner as in Example 1.

[Comparative Example 5]
In Example 1,
1) The amount of benzoxazine-based hardener ("JBZ-OD100" (benzoxazine ring equivalent approximately 218g / eq.) Made by JFE Chemical Co., Ltd. with MEK is dissolved into a 50% by mass non-volatile solution) amount is 10 Serving becomes 40 servings,
2) The amount of acrylate ("A-DOG" manufactured by Shin Nakamura Chemical Co., Ltd., (meth) acryl fluorene equivalent 156 g / eq.) Was changed from 20 parts to 5 parts,
3) The amount of spherical silica (average particle size 0.5 μm, "SO-C2" manufactured by admatechs), which was surface-treated with an amine-based alkoxysilane compound ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 310 parts to 300 Servings,
4) 2 parts of polymerization initiator (Percumyl D, MEK solution manufactured by Nippon Oil Co., Ltd., 20% non-volatile content) is not used.
Except for the above matters, a resin varnish and a resin sheet were produced in the same manner as in Example 1.

[Evaluation of slag removal and arithmetic average roughness (Ra)]
＜ Production of Evaluation Board A ＞
(1) Preparation of the base substrate for the built-in substrate. The glass cloth substrate with copper foil on the surface as the inner substrate is prepared as an epoxy resin-laminated copper laminate on both sides (the thickness of the copper foil is 18 μm, the thickness of the substrate is 0.8 mm, and manufactured by Panasonic Corporation. R1515A "). The copper foil on the surface of this inner layer substrate was etched with a copper etching amount of 1 μm using a micro etchant ("CZ8101" manufactured by MEC Corporation) to perform a roughening treatment. Then, it dried at 190 degreeC for 30 minutes.

(2) Lamination and hardening of resin sheets The resin sheets obtained in the above examples and comparative examples were subjected to a batch-type vacuum pressure laminator (two-stage build-up laminator "CVP700" manufactured by nikko-materials) to make the resin composition The layer is bonded to the aforementioned inner-layer substrate and laminated on both sides of the inner-layer substrate. This laminate was decompressed for 30 seconds, and the pressure was set to 13 hPa or less, and then the pressure bonding was performed at a temperature of 100 ° C and a pressure of 0.74 MPa for 30 seconds.

Next, the laminated resin sheet was smoothed by hot pressing at 100 ° C. and a pressure of 0.5 MPa for 60 seconds at atmospheric pressure. The resin sheet was put into an oven at 130 ° C and heated for 30 minutes, and then transferred to an oven at 170 ° C and heated for 30 minutes.

(3) The formation of vias was performed using a CO ₂ laser processing machine (LK-2K212 / 2C) manufactured by Viamechanics, under the conditions of a frequency of 2000 Hz, a pulse width of 3 μs, an output of 0.95 W, and an impact number of 3. Processing to form via holes having a top diameter (diameter) of 50 μm on the surface of the insulating layer and a diameter of 40 μm on the bottom surface of the insulating layer. Then, the PET film was peeled.

(4) Roughening process The inner layer substrate was immersed in a swelling liquid of Swelling Dip Securiganth P manufactured by Atotech Japan Co. at 60 ° C for 10 minutes. Next, the roughened solution was immersed in Concentrate Compact P (KMnO ₄ : 60 g / L, NaOH: 40 g / L aqueous solution) manufactured by Atotech Japan Co., Ltd. at 80 ° C. for 20 minutes. Finally, the solution was immersed in Reduction solution Securiganth P manufactured by Atotech Japan Co., Ltd. for 5 minutes at 40 ° C. The obtained substrate was used as an evaluation substrate A.

＜ Evaluation of Smear Removability ＞
The periphery of the bottom of the via hole of the substrate A was observed and evaluated with a scanning electron microscope (SEM), and the maximum slag length from the wall surface at the bottom of the via hole was measured from the obtained image, and evaluated using the following criteria.
：: The maximum slag length is less than 5 μm.
×: The maximum slag length is 5 μm or more.

<Measurement of Arithmetic Mean Roughness (Ra)>
A non-contact surface roughness meter (WYKO NT3300, manufactured by Veeco Instruments) was used for the evaluation substrate A, and a value obtained in a measurement range of 121 μm × 92 μm was used in the VSI mode with a 50 × lens, and the Ra value was determined. Measured by averaging 10 points chosen arbitrarily.

[Measurement of Plating Peel Strength]
＜ Production of Evaluation Board B ＞
The evaluation substrate A was immersed in a solution for electroless plating containing PdCl ₂ at 40 ° C. for 5 minutes, and then in an electroless copper plating solution at 25 ° C. for 20 minutes. After heating at 150 ° C for 30 minutes, an annealing treatment was performed to form an etching resist. After patterning was performed by etching, copper sulfate plating was performed to form a conductor layer having a thickness of 30 μm. Next, the substrate obtained by annealing at 200 ° C. for 60 minutes was used as the evaluation substrate B.

<Measurement of the tensile peel strength (peel strength) of the plated conductor layer>
In the conductor layer of the evaluation substrate B, a portion without a via hole was cut with a width of 10 mm and a length of 150 mm, and one end was peeled off to obtain a tool (auto-com type testing machine AC-50C-SL, manufactured by TSE). Clamp, and measure the load (kgf / cm) at room temperature (25 ° C) at a speed of 50 mm / min and peeling 100 mm in the vertical direction.

[Measurement of dielectric tangent]
The resin sheets obtained in each example and each comparative example were thermally cured at 190 ° C for 90 minutes, and the PET film was peeled to obtain a sheet-like cured product. This hardened product was cut into a test piece having a width of 2 mm and a length of 80 mm. The dielectric constant measuring device CP521 of the cavity resonator perturbation method manufactured by Kanto Applied Electronics Development Co., Ltd. and the network analyzer E8362B manufactured by Agilent Technologies were used. The dielectric tangent (tan δ) was measured at a measurement frequency of 5.8 GHz. Measurement was performed on two test pieces to calculate an average value.

In the table, "content of (B) component" indicates the content of (B) component when the resin component in the resin composition is 100% by mass, and "content of (C) component" indicates the resin component design in the resin composition. The content of the (C) component when the content is 100% by mass, and the "content of the (D) component" means the content of the (D) component when the nonvolatile component in the resin composition is 100% by mass. "B" represents the value obtained by dividing the mass of the component (B) by the benzoxazine ring equivalent, and "c" represents the value obtained by dividing the mass of the (C) component by the (meth) acrylfluorene equivalent.

In Examples 1 to 5, it was confirmed that even when the components (D) to (H) were not contained, there were differences to some extent, but the same results as in the above examples were obtained.

Claims (17)

A resin composition comprising (A) epoxy resin, (B) benzoxazine-based hardener, and (C) a resin composition of (meth) acrylate, Where the value obtained by dividing the mass of the component (B) by the equivalent of the benzoxazine ring is b, and the value obtained by dividing the mass of the component (C) by the equivalent of the (meth) acrylfluorenyl group is set to c, b / c is 0.08 or more and 2.5 or less. For example, the resin composition according to claim 1, wherein the (C) component has two (meth) acrylfluorenyl groups in one molecule. The resin composition according to claim 1, wherein the component (C) has a cyclic structure. For example, the resin composition of claim 1, wherein the component (C) has a structure represented by the following formula (C-1), (In formula (C-1), R ¹ and R ⁴ each independently represent an acrylfluorenyl group or a methacrylfluorenyl group, R ² and R ³ each independently represent a divalent linking group, and ring A represents a divalent cyclic group. ). For example, the resin composition of claim 1, wherein the component (B) has a structure represented by the following formula (B-1), (In the formula (B-1), R ¹¹ represents an n-valent group, R ¹² each independently represents a halogen atom, an alkyl group, or an aryl group, n represents an integer of 2 to 4, and m represents an integer of 0 to 4). The resin composition according to claim 1, wherein the component (A) includes a liquid epoxy resin and a solid epoxy resin. The resin composition according to claim 1, further comprising (D) an inorganic filler. For example, when the resin composition of claim 7 is a non-volatile component in the resin composition of 100% by mass, the content of the (D) component is 70% by mass or more. For example, when the resin composition in claim 1 is a resin composition in which the content of the (C) component is 100% by mass or more, the content of the component (C) is 1% by mass or more and 20% by mass or less. For example, when the resin composition in claim 1 is a resin composition in which the content of the component (B) is 100% by mass, the content of the component (B) is 1% by mass or more and 15% by mass or less. The resin composition of claim 1, which is used for insulation purposes. The resin composition according to claim 1 is used for forming an insulating layer. The resin composition according to claim 1 is for forming an insulating layer for forming a conductor layer. The resin composition according to claim 1 is used for packaging a semiconductor wafer. A resin sheet comprising a support and a resin composition layer including the resin composition according to any one of claims 1 to 14 provided on the support. A printed wiring board comprising an insulating layer formed of a cured product of a resin composition according to any one of claims 1 to 14. A semiconductor device includes a printed wiring board as claimed in claim 16.