TW201943611A - Powder supply device, resin-molding device, powder supply method, and method for producing resin-molding product capable of controlling the supply amount of powder with higher accuracy - Google Patents

Abstract

The present invention provides a powder supply device, which moves the powder by vibrating the powder supply path in the presence of powder, and supplies the powder to a supply target from a discharge port provided in the powder supply path. The present invention also provides a resin-molding device, a powder supply method, and a method for producing resin-molding product. The powder supply device includes a vibrating unit that vibrates the powder supply path; a measuring unit that measures the supply amount of the powder with respect to the supply target; and a control unit that controls the vibration of the vibrating unit in a manner that that makes the supply amount become a specified target amount. The control unit controls the vibrating unit in a manner that the powder can be supplied continuously in the first stage after the supply is started and controls the vibrating unit in a manner that the powder can be supplied intermittently in the second stage after the first stage.

Description

Powder supply device, resin molding device, powder supply method, and method for manufacturing resin molded product

The present invention relates to a powder and granule supply device for supplying powder and granules, a resin molding device using the powder and granule supply device, a powder and granule supply method in the powder and granule supply device, and the use of the powder. A method for producing a resin molded product using a granular supply method.

In order to protect electronic components such as integrated circuits (ICs) from light, heat, and moisture, the electronic components are usually sealed by resin. The resin portion (resin sealing portion) that seals the electronic component is also referred to as a "package portion".

As a typical method of resin sealing, there is a compression molding method using a molding die including a lower die and an upper die. More specifically, a granular resin material is supplied to the cavity of the lower mold, and a substrate on which electronic components are mounted is mounted on the upper mold, and then the lower mold and the upper mold are heated and the two are closed. Thereby, molding is performed.

As a technique for supplying a resin material for such a resin seal, for example, Japanese Patent Laid-Open No. 2013-042017 discloses a resin molding device including a resin supply unit that supplies a mold for Resin molded from a workpiece taken out from the workpiece supply unit. More specifically, the resin input unit 52 includes a trough 53 that receives granular resin supplied from a hopper 51, and an electromagnetic feeder 54 that vibrates the hopper 53 to granulate the pellets. The resin is conveyed to the workpiece W. The electromagnetic feeder 54 is configured to vibrate a pair of vibrating plates in a predetermined direction and convey the particulate resin in the hopper 53. The resin input portion 52 is formed by using a magnetic feeder 54 to vibrate the hopper 53 in a predetermined direction and convey the granular resin, and when the electronic balance 56 included in the workpiece placing portion 55 measures a predetermined weight less than the resin supply amount , Stop driving of the electromagnetic feeder 54. Here, the predetermined weight is set by estimating the amount of resin dropped from the hopper 53 to the workpiece W after the electromagnetic feeder 54 is stopped. Thereby, the supply amount of the particulate resin supplied from the resin input portion 52 to the workpiece W can be measured and stably supplied within a predetermined error range (refer to [0051], [0052], Japanese Patent Laid-Open No. 2013-042017, [0058] and FIG. 8 etc.).

In addition, although it is not directed to a technique for resin sealing electronic parts, for example, Japanese Patent Laid-Open No. 11-160138 discloses a technique for supplying powder at a constant flow rate over a long period of time. More specifically, there is disclosed a configuration in which a ratio of time driven at a resonance frequency, that is, a duty ratio is changed when adjusting a powder conveyance amount (cut amount) or adjusting a powder flow rate. The self-driving circuit 60 intermittently applies a driving voltage and a driving current to the vibrator 10 (refer to [0029], [0033], [0034], etc. of Japanese Patent Laid-Open No. 11-160138).

In order to improve the packaging efficiency of electronic components in a finished product, it is required to reduce the thickness of the packaging portion (resin sealing portion) of the electronic component. For such requirements, it is necessary to control the supply amount of the resin material to the cavity with higher accuracy.

The resin molding apparatus disclosed in the Japanese Patent Laid-Open No. 2013-042017 estimates the amount of resin falling after the electromagnetic feeder 54 is stopped, and controls the timing of stopping the electromagnetic feeder 54, which is difficult to improve. Control accuracy of supply.

In addition, Japanese Patent Laid-Open No. 11-160138 is directed to a technology for supplying powder at a fixed flow rate over a long period of time, and in batch processing, it is not envisaged to control the supply amount at all.

The high-precision supply of powder and granules is required not only to reduce the thickness of the packaging part (resin sealing part) of electronic parts, but also in many other fields.

The present invention aims to solve such a problem, and provides an apparatus and method capable of controlling the supply amount of powder and granular materials such as a granular resin material with higher accuracy.

According to an aspect of the present invention, there is provided a powder and granule supply device that moves a powder and granule by vibrating a powder and granule supply path in which the powder and granules are present, and supplies the powder to a supply target from a discharge port provided in the powder and granule supply path. Material supplies powder and granules. The powder supply device includes a vibration unit that vibrates the powder supply path, a measurement unit that measures the supply amount of the powder to the supply object, and a control unit that controls the vibration so that the supply amount becomes a specified target amount. Department of vibration. The control unit controls the vibrating unit to continuously supply the powder and granules in the first stage after the supply is started, and controls the vibrating unit to intermittently supply the powders and granules in the second stage after the first stage.

A resin molding apparatus according to another aspect of the present invention includes: the powder and granular material supplying device; and a compression molding section that performs compression molding using a granular resin material that is a powder and granular material supplied from the powder and granular material supplying device.

According to still another aspect of the present invention, there is provided a method for supplying powder and granules by moving the powder and granules by vibrating the powder and granule supply path in which the powder and granules are present, and supplying the powder from a discharge port provided in the powder and granule supply path The object supplies powder and granules at a specified target amount. The powder supply method includes a step of vibrating a vibrating portion associated with the powder supply path in a first phase after the supply is started, and continuously supplying the powder and particles; and a first step after the first phase. In the two stages, the step of vibrating the vibrating portion so as to intermittently supply the powder and granules until the supply amount of the powder and granules to the supply target reaches a target amount.

A method for producing a resin molded article according to still another aspect of the present invention includes the steps of the powder and granular material supplying method; and the step of performing compression molding using the supplied granular material, that is, a granular resin material.

The and other objects, features, aspects, and advantages of the present invention will be made clear by the following detailed description of the present invention understood in association with the accompanying drawings.

Embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the same or corresponding parts in the drawings are denoted by the same reference numerals, and descriptions thereof are not repeated.

In the present specification, the term "powder and granule" is a term including an aggregate of an object having an arbitrary particle size. The "powder and granule" includes the concept of "powder" and has characteristics like a fluid as an aggregate. That is, in this specification, the term "powder and granules" includes aggregates that move or deform when receiving any external force.

In the following description, as a typical example of powder and granular material, a granular resin material is assumed, and as a typical example of a powder and granular material supply device, a resin material supply device that supplies only a granular resin material at a predetermined weight is assumed. The powder and granules supplied by the powder and granule supply device of the present invention are not limited to granular resin materials, and can be applied to any material or substance.

<A. Example of overall configuration of resin molding apparatus 1>
First, an overall configuration example of the resin molding apparatus 1 including the resin material supply apparatus 10 according to the present embodiment will be described. Typically, the resin molding apparatus 1 according to the present embodiment is used as a device for resin sealing an electronic component by molding a resin on an exposed surface of a substrate on which an electronic component is arranged. The resin molding apparatus 1 can also be comprised as a part of manufacturing apparatus of an electronic component.

FIG. 1 is a schematic diagram showing an example of the overall configuration of a resin molding apparatus 1 according to this embodiment. Referring to FIG. 1, the resin molding apparatus 1 receives a substrate S that is a target of resin molding and a particulate resin material P that is a resin molding material from the outside, and lowers a resin molded product T that is a substrate S on which the resin is molded. One step supply.

More specifically, the resin molding apparatus 1 includes a receiving module 31, one or more molding modules 32, and a delivery module 33. The resin molding apparatus 1 further includes a main transfer device 36 arranged so as to penetrate the receiving module 31, one or more molding modules 32, and the delivery module 33. The main transfer device 36 transfers the substrate S, the resin material transfer portion 20, and the resin molded product T.

Each of the receiving module 31, the one or more forming modules 32, and the delivery module 33 is provided with a sub conveying device 37 extending in a direction perpendicular to the main conveying device 36. At the intersection of the main transfer device 36 and each of the sub transfer devices 37, the substrate S, the resin material transfer portion 20, and the resin molded product T can change the transfer direction.

The receiving module 31 receives the substrate S and the resin material P from the outside and supplies them to the forming module 32. The receiving module 31 includes a substrate receiving section 311 for receiving the substrate S, and a resin material supply device 10 for receiving the resin material P from the outside and supplying the received resin material P to the resin material transfer section 20.

The resin material supply device 10 supplies a resin material P having a predetermined weight from the ejection port 121. In the following description, a predetermined weight is also referred to as a "target amount". The target amount is specified by a management device or the like (not shown) based on the type of the substrate S that is a target of resin molding. In each supply operation, the weight of the resin material P supplied to the supply target is also referred to as a "supply amount". That is, the resin material supply device 10 adjusts the discharge amount of the resin material P from the discharge port 121 so that the supply amount becomes a target value. The "supply amount becomes the target value" does not mean only the case where the supply amount strictly matches the target value, but may also include the case where the supply amount is within a range that is substantially free from the target value.

A resin material transfer tray 15 having a recessed portion 151 corresponding to the size of the substrate S on a flat surface is arranged in the resin material transfer portion 20. The resin material transfer tray 15 is an example of a supply target object that supplies the resin material P from the resin material supply device 10. The resin material conveying unit 20 is relatively moved relative to the ejection port 121 of the resin material supply apparatus 10 so that the resin material P dropped from the ejection port 121 of the resin material supply apparatus 10 uniformly covers the recessed portion 151 of the resin material conveying tray 15 . The resin material transfer unit 20 is transferred to the molding module 32 when the resin material P has finished filling the recessed portion 151 of the resin material transfer tray 15.

Each molding module 32 includes a compression molding section 30 for molding a resin on the substrate S. The compression molding section 30 performs compression molding using a particulate resin material P that is a powder and a granule supplied from the resin material supply device 10.

More specifically, the compression molding section 30 includes a molding die including a lower die and an upper die. The resin material P is supplied from the resin material supply device 10 to the lower mold of the compression molding section 30, and the substrate S is mounted on the upper mold of the compression molding section 30 by a substrate transfer section (not shown). In addition, the compression molding section 30 heats the lower mold and the upper mold and molds the two together to mold the resin on the substrate S. That is, the resin molded product T is manufactured by clamping.

The delivery module 33 holds a resin molded product T manufactured by the molding module 32. More specifically, the delivery module 33 includes a resin molded product holding portion 331 for holding the resin molded product T. The resin molded product holding portion 331 supplies the held resin molded product T to the next step or the like in response to a request or the like from the next step.

In FIG. 1, a resin molding apparatus 1 including three molding modules 32 is exemplified. However, the number of the molding modules 32 may be arbitrarily determined according to the performance required by the resin molding apparatus 1 and the like. In particular, the resin molding apparatus 1 according to this embodiment is modularized for each function. Therefore, even after the resin molding apparatus 1 is assembled and the resin molded product T is manufactured, the molding module 32 can be arbitrarily increased or decreased.

<B. Configuration example of resin material supply device 10>
Next, an example of the overall configuration of the resin material supply device 10 constituting the resin molding device 1 according to this embodiment will be described.

FIG. 2 is a schematic diagram showing an example of the overall configuration of the resin material supply device 10 constituting the resin molding device 1 according to the present embodiment. Referring to FIG. 2, the resin material supply device 10 includes a stocker 17 that receives powdered and granular resin material P from the outside, and a trough chute 11 that is disposed below the stocker 17; The groove 12 communicates with the inclined material groove 11.

The stocker 17 stores a resin material P supplied from the outside. A supply port 171 that is a hole for supplying the resin material P to the chute 11 and a stocker feeder 172 that vibrates the stocker 17 are provided at a lower portion of the stocker 17. In accordance with an instruction from the control unit 100, the stocker feeder 172 is vibrated, and thereby the resin material P in the stocker 17 is vibrated. As a result, a part of the resin material P in the stocker 17 is passed through the supply port 171. It is supplied to the sloping chute 11.

FIG. 2 illustrates a configuration example in which the control unit 100 controls the vibration of the stocker feeder 172. However, the control of the vibration of the stocker feeder 172 may be performed using a control unit different from the control unit 100.

The hopper 12 corresponds to a powder and granule supply path for supplying a granular resin material P as a typical example of the powder and granules. One end of the chute 12 is connected to the sloping chute 11 so as to communicate with the sloping chute 11, and an ejection port 121 is provided at the other end of the chute 12. The resin material P is supplied to the resin material transfer tray 15 as an example of a supply target through the discharge port 121. In the steady state, the resin material P supplied from the stocker 17 exists inside the chute 11 and the hopper 12.

The resin material supply device 10 includes a hopper feeder 13 which is a vibrating section that vibrates the hopper 12. In addition, by the vibration of the hopper feeder 13, in addition to the hopper 12, the inclined chute 11 can also vibrate. When the resin material P is supplied, a resin material transfer tray 15 is disposed directly below the discharge port 121 by the resin material transfer unit 20.

In accordance with an instruction from the control unit 100, the hopper feeder 13 is vibrated, so that the resin material P in the hopper 12 is vibrated. As a result, the resin material P in the hopper 12 is supplied to the resin material conveyance through the ejection port 121. The recessed portion 151 of the tray 15.

As described above, in the resin material supply device 10, the hopper 12 (powder and powder supply path) in which the granular resin material P (powder and granules) is present is vibrated to move the resin material P, and the resin material P is installed in the hopper The discharge port 121 of 12 supplies the resin material P to the resin material transfer tray 15 (supply object).

A resin material discharge portion 16 is disposed further below the discharge port 121 at a position where the resin material transfer tray 15 and the resin material transfer portion 20 are arranged. The resin material discharge unit 16 is a container that receives the resin material P when the resin material P is discharged without supplying the resin material P to the resin material transfer tray 15.

Here, an operation when the resin material P is loaded into the resin material transport tray 15 will be described. The resin material transfer unit 20 positions the resin material transfer tray 15 between the ejection port 121 and the resin material discharge unit 16. The resin material transfer unit 20 can move the resin material transfer tray 15 substantially horizontally so that any position of the resin material transfer tray 15 can be arranged directly below the ejection port 121. After the resin material P is loaded, the resin material transfer unit 20 transfers the resin material transfer tray 15 to the upper portion of the lower mold of the compression molding unit 30 (see FIG. 1).

When the resin material P is not supplied to the resin material transfer tray 15 but the resin material P is discharged, the resin material transfer unit 20 moves the resin material transfer tray 15 away from directly below the ejection port 121 to discharge the resin material P to the resin material. Ejection section 16.

In addition, instead of always disposing the resin material discharge portion 16 directly below the discharge port 121, when the resin material P is discharged, the resin material discharge portion 16 can be moved directly below the discharge port 121.

The resin material supply device 10 further includes a measurement unit 14 for measuring the supply amount of the resin material P to the supply target object in association with the chute 11 and the hopper 12.

The hopper feeder 13 vibrates and the resin material P in the hopper 12 is discharged from the ejection port 121. Therefore, as long as the resin material P supplied from the hopper 17 is not supplied, the measurement value by the measurement unit 14 decreases. The supply amount of the resin material P can be measured based on the difference between the measurement value from the measurement unit 14 before the feeder feeder 13 starts to vibrate and the measurement value from the measurement unit 14 after the feeder feeder 13 has completed vibration. The amount of change in the measurement value from the measurement unit 14 per unit time corresponds to the supply rate of the resin material P.

The control unit 100 controls the hopper feeder 13 so that the supply amount of the resin material P becomes a specified target amount based on the measurement value from the measurement unit 14. More specifically, the control unit 100 adjusts a command value given to the hopper feeder 13.

In addition, in the resin material supply device 10 shown in FIG. 2, a measurement section 14 that measures the weight of the inclined chute 11 and the hopper 12 is used. In addition to or instead of the measurement section 14, a measurement resin may be disposed. A measurement unit for the weight of the material transfer tray 15. In this case, the supply amount of the resin material P may be measured based on the number difference between the measured values from the measuring section before the feeder feeder 13 starts to vibrate and after the vibration is completed. The supply rate of the resin material P may be calculated based on the amount of change per unit time.

As described above, in the resin material supply device 10, the granular resin material P (a typical example of powder and granules) supplied from the stocker 17 to the sloping chute 11 is caused by the vibration of the hopper 12 as a powder and granule supply path. It moves toward the discharge port 121 provided in one end of the hopper 12. Then, the resin material P falls from the ejection port 121 and is supplied to the supply target. The supply amount of the resin material P to the supply target can be adjusted by controlling the vibration of the hopper feeder 13 as the vibrating section based on the measurement value by the measurement section 14.

<C. Configuration example of control unit 100>
Next, a configuration example of the control unit 100 constituting the resin material supply device 10 will be described.

The control unit 100 according to the present embodiment performs at least control related to the supply of the resin material P by the resin material supply device 10. The control unit 100 may further perform control related to the transfer by the resin material transfer unit 20. Furthermore, overall control of the resin molding apparatus 1 (see FIG. 1) may be performed by the control unit 100. In this case, the control related to the supply of the resin material P by the resin material supply device 10 can be achieved as a part of the control performed by the control unit 100.

The control unit 100 may be implemented using a control device such as a programmable logic controller (PLC), or may be implemented using an industrial personal computer.

FIG. 3 is a schematic diagram showing an example of a hardware configuration of the control unit 100 constituting the resin material supply device 10 according to the present embodiment. FIG. 3 shows, as a typical example, a configuration example of the control unit 100 using an industrial personal computer based on a general-purpose architecture. In the control unit 100, a universal operating system (OS) and a real-time OS are executed, and a human-machine interface (HMI) function, a communication function, and a control function requiring real-time performance are taken into consideration.

The control unit 100 includes an input unit 102, an output unit 104, a main memory 106, an optical drive 108, a processor 110, a hard disk drive (HDD) 120, a network interface 112, a measurement unit interface 114, and a vibration unit interface. 116 as the main component. These components are connected in such a way that they can exchange data with each other via the internal bus 118.

The input unit 102 is a component that accepts an operation from a user, and typically includes a keyboard, a touch panel, a mouse, a track ball, and the like. The output unit 104 is a means for outputting the processing results and the like in the control unit 100 to the outside, and typically includes a display, a printer, various indicators, and the like. The main memory 106 includes a dynamic random access memory (DRAM) and the like, and holds encoding of a program executed by the processor 110 or various work data required to execute the program.

The processor 110 is a processing body that reads out a program stored in the HDD 120 and performs processing on the input data. The processor 110 is configured to execute a general-purpose OS and various applications operating on the general-purpose OS in parallel, and a real-time OS and various applications operating on the real-time OS. As an example, the processor 110 may include a configuration including multiple processors (so-called “multiprocessor”), and a configuration including multiple cores in a single processor (so-called “multicore”). "), And any one of the configurations having characteristics of both a multi-processor and a multi-core.

The HDD 120 is a storage unit, and typically stores a general-purpose OS 122, a real-time OS 124, an HMI program 126, and a control program 128. The HMI program 126 operates in the execution environment of the general-purpose OS 122, and mainly implements processing related to user exchange. The control program 128 operates in the execution environment of the real-time OS 124 and controls each component constituting the resin material supply device 10.

Various programs executed by the control unit 100 are stored in a recording medium 108A such as a high-density read-only optical disc (Digital Versatile Disc Read Only Memory (DVD-ROM)) and can be circulated. The content of the recording medium 108A is read by the optical drive 108 and is installed in the HDD 120. That is, one aspect of the present invention includes a program for implementing the control section 100 and some recording media storing the program. As these recording media, in addition to an optical recording medium, a magnetic recording medium, a magneto-optical recording medium, a semiconductor recording medium, or the like can be used.

FIG. 3 illustrates an example in which a plurality of programs are installed in the HDD 120. However, these programs may be integrated into one program, and may also be incorporated as part of other programs.

The network interface 112 exchanges data with an external device via a network.

The program installed in the HDD 120 can be obtained from a server via the network interface 112. That is, the program that realizes the control unit 100 according to the present embodiment can be downloaded and installed on the HDD 120 by any method.

A measurement value from the measurement unit 14 is input to the measurement unit interface 114. A command value is output from the vibration part interface 116 to the stocker feeder 172 and the tank feeder 13.

FIG. 3 illustrates a configuration example of the control unit 100 according to the present embodiment by executing a program by the processor 110, but it is not limited to this, and a powder supply device or a powder supply device according to the present invention can be suitably used in practice. The structure corresponding to the technological level of the era of powder supply method. For example, a PLC (Programmable Logic Controller) as an industrial controller can be used instead of a general-purpose computer. Alternatively, an integrated circuit such as a Large Scale Integrated Circuit (LSI) or an Application Specific Integrated Circuit (ASIC) may be used to achieve all or part of the functions provided by the control unit 100, or This is achieved using reprogrammable circuit elements such as Field-Programmable Gate Array (FPGA). Alternatively, the functions provided by the control unit 100 shown in FIG. 3 may be implemented by a plurality of processing subjects cooperating with each other. For example, a plurality of computers may be connected to realize the functions provided by the control section 100.

In addition, not all the constituent elements shown in FIG. 3 are necessary, and the optical driver 108, a mouse as an example of the input section 102, and a printer as an example of the output section 104 may not be used in actual control. Make up.

<D. Supply Control Method of Resin Material P in Resin Material Supply Device 10>
Next, a method for controlling the supply of the resin material P in the resin material supply device 10 according to this embodiment will be described.

(D1: Summary)
The resin material supply device 10 performs supply control so as to supply a specified target amount of the resin material P in each supply operation. More specifically, in the supply control method according to this embodiment, the control unit 100 controls the hopper feeder 13 to continuously supply the resin material P in the first stage 201 after the start of supply, and in the first stage In the second stage 202 after 201, the hopper feeder 13 is controlled so as to intermittently supply the resin material P. The first stage 201 may be set immediately after the supply is started.

FIG. 4 is a time chart for explaining a method of controlling the supply of the resin material P in the resin material supply device 10 according to the present embodiment.

Referring to FIG. 4, in the first stage 201, the magnitude of the command value given to the hopper feeder 13 is controlled so that the supply speed of the resin material P (that is, the supply amount per unit time) is fixed. According to the magnitude of the command value, the vibration intensity generated by the hopper feeder 13 changes. The magnitude of the command value can be calculated sequentially based on the deviation between the target value of the supply speed and the actual measured value of the supply speed. Typically, the magnitude of the command value can be calculated one by one using feedback control of the target supply speed input value and the actual measured value of the supply speed. As a typical example of feedback control, Proportional Integral Differential (PID) control can be used.

The first stage 201 (time t1 to time t2) ends when the actual value of the supply amount of the resin material P reaches the end determination value that is less than the target amount by a predetermined amount. That is, at the end point of the first stage 201, the command value is updated to zero. The end judgment value of the completion of the first stage 201 is set to the resin material P based on the resin material P (ie, the inflow after the vibration stops) ejected from the ejection port 121 of the resin material supply device 10 after the vibration of the hopper feeder 13 is stopped. The supply amount will not exceed the target amount range.

In addition, for ease of understanding, the waveform of the command value shown in FIG. 4 is drawn as a substantially straight line. However, for example, when PID control is used, the waveform of the actual command value changes as follows: if the supply speed drops, it rises, and if the supply speed rises, it falls.

As described above, in the first stage 201, since the hopper feeder 13 is continuously vibrated, the resin material P is continuously ejected from the ejection port 121 of the resin material supply device 10.

The second stage 202 (time t2 to time t3) corresponds to an adjustment period of the supply amount in which the resin material P is intermittently ejected so that the supply amount of the resin material P becomes the target amount. Typically, the hopper feeder 13 is intermittently given a command value of a predetermined size. That is, the control unit 100 gives a pulse-shaped command value to the hopper feeder 13 in the second stage.

Here, the control unit 100 may determine the value of the command value in the second stage 202 based on the magnitude of the command value given to the tank feeder 13 in the first stage 201 (that is, the vibration intensity generated by the tank feeder 13). size. Specifically, the magnitude of the command value in the second stage 202 can be made substantially the same as the magnitude of the command value immediately before the end of the first stage 201.

In addition, the magnitude of the command value in the second stage 202 may be appropriately set to a value that has no problem in actual use. For example, the value of the command value of the second stage 202 may be set to -50% to + 10% relative to the value of the command value immediately before the end of the first stage 201, and more specifically, from -50%. , -45%, -40%, -35%, -30%, -25%, -20%, -15%, -10%, -9%, -8%, -7%, -6%,- 5%, -4%, -3%, -2%, -1%, 0%, + 1%, + 2%, + 3%, + 4%, + 5%, + 6%, + 7%, Between two values selected from + 8%, + 9%, and + 10%, it can also be set to at least one value selected from these.

By maintaining the continuity of the magnitude of the command value between the first stage 201 and the second stage 202, it is possible to maintain the distribution state of the resin material P remaining in the hopper 12 serving as the powder supply path. At the next supply of the resin material P, the resin material P may be continuously ejected.

The second stage 202 may be divided into a plurality of stages. In each divided stage, the size of the command value may be different, and the length of the period during which the command value is output may be different.

Hereinafter, more detailed processing contents of the first stage 201 and the second stage 202 will be described.

(D2: Stage 1 201)
FIG. 5 is a flowchart showing an example of processing in the first stage 201 of the supply control method of the resin material P in the resin material supply device 10 according to the present embodiment. Typically, each step shown in FIG. 5 is implemented by the processor 110 of the control unit 100 executing a control program 128.

Referring to FIG. 5, the control unit 100 determines whether or not a supply start instruction of the resin material P has been received (step S1). If the supply start instruction of the resin material P is not received (NO in step S1), the process of step S1 is repeated. When receiving the supply start instruction of the resin material P (YES in step S1), the control unit 100 sets the measurement value from the measurement unit 14 at this moment as the initial measurement value (step S2). The processing in step S2 corresponds to the tare removal processing.

After the processing of step S2 is executed, the output of the command value to the hopper feeder 13 is started. That is, the control unit 100 determines a command initial value as an initial value of the command value (step S3), and outputs the command initial value determined in step S3 as a command value over a predetermined initial operation time (step S4).

The reason why such an operation of fixing the command value to the command initial value across the initial operation time is to stabilize the supply speed of the initial ejection of the resin material P. After the initial operation time has elapsed, the discharge of the resin material P is considered to be stable, so the feedback control is started.

That is, the control unit 100 calculates a command value based on the target value of the feed speed and the actual measured value of the feed speed (step S5), and updates the output command value to the command value calculated in step S5 (step S6). Here, the actual measurement value of the supply speed is calculated based on a time change of the measurement value from the measurement unit 14.

Then, the control unit 100 determines whether the supply amount of the resin material P has reached the end determination value (step S7). If the supply amount of the resin material P has not reached the end determination value (NO in step S7), the processes after step S5 are repeated.

In contrast, when the supply amount of the resin material P reaches the end determination value (YES in step S7), the control unit 100 stops outputting the command value (step S8). That is, the control unit 100 updates the command value to zero. Thereby, the processing in the first stage 201 ends.

As described above, in the first stage 201, a feedback control such as a constant supply speed (ie, a discharge speed) is performed, and the resin material P is continuously supplied. When the predetermined end determination value is reached, the feedback control is stopped.

Furthermore, depending on the shape of the hopper 12 and the ejection port 121, the particle diameter of the resin material P, etc., the processes of steps S2 to S4 may not necessarily be required. When step S1 is completed, the use of the command value of the feedback control can be started immediately Calculate (processing after step S5).

FIG. 6 is a block diagram showing a functional configuration corresponding to processing in the first stage 201 of the supply control method of the resin material P in the resin material supply device 10 according to the present embodiment. Typically, each functional block shown in FIG. 6 is implemented by the processor 110 of the control unit 100 executing a control program 128.

6, the control unit 100 includes a deviation calculation unit 210, a PID calculation unit 212, a selection unit 214, a selection unit 216, a command value holding unit 218, a timer 220, a differentiator 222, a differentiator 224, and a comparison unit 226 as the first Functional configuration of the first stage 201.

The deviation calculation unit 210 and the PID calculation unit 212 correspond to functional configurations for implementing feedback control (corresponding to steps S5 and S6 shown in FIG. 5). The deviation calculation unit 210 calculates a deviation between a target value of the supply speed and an actual measured value of the supply speed. The PID calculation unit 212 receives an input of a deviation in the supply speed from the deviation calculation unit 210, executes a PID calculation, and calculates a command value.

The differentiator 222 corresponds to a functional configuration for calculating the supply amount of the resin material P. That is, the differentiator 222 calculates the current supply amount based on the measurement initial value that is the measurement value of the measurement unit 14 when the supply start instruction of the resin material P is given, and the current measurement value of the measurement unit 14.

The differentiator 224 corresponds to a functional configuration for calculating the supply rate of the resin material P. More specifically, the differentiator 224 calculates a time differential of the supply amount from the differentiator 222, and outputs it as an actual measured value of the supply speed.

The selection unit 216, the command value holding unit 218, and the timer 220 correspond to a functional configuration for realizing processing (corresponding to steps S3 and S4 shown in FIG. 5) for outputting the initial command value over the initial operation time. More specifically, the selection unit 216 outputs one of the command value from the command value holding unit 218 and the command value from the PID calculation unit 212 (selection unit 214) as the final command value in accordance with the command from the timer 220. The command value holding unit 218 holds the current command value while a valid command value is being output. Therefore, when the output of the command value is stopped, the command value holding unit 218 holds the command value immediately before the stop. The command value held in the command value holding unit 218 in this way is used as a command initial value when the next supply of the resin material P is started. The timer 220 counts up in the initial operation time when a supply start instruction of the resin material P is given. The timer 220 gives the selection unit 216 a selection instruction for outputting the instruction value from the instruction value holding unit 218 during the period before the initial operation time has elapsed. On the other hand, when the initial operation time has elapsed, the selection unit 216 gives A selection instruction for outputting an instruction value from the PID calculation unit 212 (selection unit 214).

The selection unit 214 and the comparison unit 226 correspond to a functional configuration for realizing the processing (corresponding to steps S7 and S8 shown in FIG. 5) required to determine the end of the processing in the first stage 201. More specifically, the selection unit 214 switches whether to output a command value from the PID calculation unit 212 as a valid command value in accordance with a command from the comparison unit 226. The comparison unit 226 compares the supply amount of the resin material P from the differentiator 222 with the end determination value. The comparison unit 226 gives the selection unit 214 a selection instruction for outputting the instruction value from the PID calculation unit 212 within a period before the supply amount reaches the end determination value, and on the other hand, when the supply amount reaches the end determination value, it selects the selection The unit 214 gives a selection instruction (instruction to stop the instruction value) for stopping the output of the instruction value.

Note that FIG. 6 shows only one example of the functional configuration of the first stage 201 and is not limited to this. Other configurations may be used as the functional configuration of the first stage 201.

(D3: Phase 2 202)
FIG. 7 is a flowchart showing an example of processing in the second stage of the supply control method of the resin material P in the resin material supply device 10 according to the present embodiment. Typically, each step shown in FIG. 7 is implemented by the processor 110 of the control unit 100 executing a control program 128.

Referring to FIG. 7, the control unit 100 determines the magnitude of the command value used in the second stage 202 (step S11). Typically, the size of the command value immediately before the end of the first stage 201 may be determined in step S11 as the size of the command value used in the second stage 202.

The control unit 100 determines whether the supply amount of the resin material P has reached the target amount (step S12). If the supply amount of the resin material P has not reached the target amount (NO in step S12), the control unit 100 determines whether the output period of the command output has arrived (step S13).

Here, the output cycle of the pulse-shaped command value and the time width of the output command value are predetermined. Furthermore, instead of the output period and the time width, the output period and the duty ratio (that is, the ratio of the time width to the output period) may be specified in advance.

If the output period of the instruction output has not arrived (NO in step S13), the process of step S13 is repeated. When the output cycle of the command output comes (YES in step S13), the control unit 100 outputs a command value of a size determined in step S11 across a predetermined time width (step S14). Then, the processing from step S12 is repeated.

On the other hand, when the supply amount of the resin material P reaches the target amount (YES in step S12), the processing in the second stage 202 ends.

As described above, in the second stage 202, the resin material P is intermittently ejected until the specified target amount is output by outputting a pulsed command value.

FIG. 8 is a block diagram showing a functional configuration corresponding to processing in the second stage of the supply control method of the resin material P in the resin material supply device 10 according to the present embodiment. Typically, each functional block shown in FIG. 8 is implemented by the processor 110 of the control unit 100 executing a control program 128.

Referring to FIG. 8, the control section 100 includes a pulse generation section 230, an amplification section 232, a selection section 234, a comparison section 236, and a differentiator 222 as the functional configuration of the second stage 202.

The function of the differentiator 222 is the same as that of the differentiator 222 shown in FIG. 6, and it calculates the supply amount of the resin material P.

The pulse generating unit 230 and the amplifying unit 232 correspond to a functional configuration for realizing the output of a pulse-like command value (corresponding to steps S13 and S14 shown in FIG. 7). The pulse generator 230 outputs a pulse signal having a predetermined time width for each predetermined output period. The amplifying section 232 adjusts the amplitude of the pulse signal from the pulse generating section 230 to a predetermined command value, and generates a pulse-shaped command value.

The selection unit 234 and the comparison unit 236 correspond to a functional configuration for realizing the processing (corresponding to step S12 shown in FIG. 7) required to determine the end of the processing in the second stage 202. More specifically, the selection unit 234 switches whether to output the command value from the amplification unit 232 as a valid command value in accordance with a command from the comparison unit 236. The comparison unit 236 compares the supply amount of the resin material P from the difference device 222 with the target amount. The comparison unit 236 gives the selection unit 234 a selection instruction for outputting the command value from the amplification unit 232 within a period before the supply amount reaches the target amount, and on the other hand, when the supply amount reaches the target amount, it gives the selection unit 234 a selection instruction. Selection instruction for stopping output of instruction value (instruction to stop instruction value).

Note that FIG. 8 shows only one example of the functional configuration of the second stage 202 and is not limited to this. Other configurations may be used as the functional configuration of the second stage 202.

<E. Division of the second stage 202>
In the embodiment described above, the second stage 202 outputs pulse-like command values with the same output cycle and time width. That is, the supply amount per unit time in the second stage 202 is fixed. Instead of this processing, in the second stage 202, the supply amount per unit time may be reduced as the actual value of the supply amount of the resin material P approaches the target amount.

As an example of such a process of reducing the supply amount per unit time, the following description divides the second stage 202 into two sections (hereinafter, referred to as "the first sub-stage 241" and "the second sub-stage 242") and When the command value output in each sub-phase is different. That is, the second stage 202 includes a first sub-stage 241 and a second sub-stage 242 subsequent to the first sub-stage 241. Among them, it can also be divided into more sections (for example, three or more sub-stages).

The transition conditions from the first sub-phase 241 to the second sub-phase 242 can be arbitrarily set, and for example, the difference between the target value and the actual value of the supply amount of the resin material P can be set to the adjustment start amount or less as the transition condition.

The control unit 100 controls the material in the first sub-phase 241 and the second sub-phase 242 so that the supply amount per unit time in the second sub-phase 242 is smaller than the supply amount per unit time in the first sub-phase 241.槽 给 器 13。 The groove feeder 13.

As a specific method of reducing the supply amount per unit time, at least any one of the output cycle of the command output, the time width of the command output, and the size of the command output may be changed. In addition, the duty ratio of the instruction output is defined by the relative relationship between the output period and the time width. Therefore, when changing at least one of the output period of the instruction output and the time width of the instruction output, it means that the instruction output The duty cycle is changed.

FIGS. 9 (a) to 9 (c) are timing charts showing an example of command values output in the second stage 202 according to the modification of the embodiment. In the time charts shown in FIGS. 9 (a) to 9 (c), the supply amount per unit time in the second sub-phase 242 is set smaller than the supply amount per unit time in the first sub-phase 241.

FIG. 9 (a) shows an example of processing for extending the output cycle of the command output between the first sub-phase 241 and the second sub-phase 242. In the example, the control unit 100 makes the cycle of giving the command value to the hopper feeder 13 in the second sub-phase 242 longer than the cycle of giving the command value to the hopper feeder 13 in the first sub-phase 241. More specifically, in the first sub-phase 241, the command value of the time width Td is output for each output period T1, and in the second sub-phase 242, the output value of the time width Td is output for each output period T2 (> T1). Instruction value.

In the first sub-phase 241, the resin material P is supplied at a relatively high supply rate, thereby reducing the time required for the entire process in the second phase 202, and in the second sub-phase 242, the supply is relatively low. By supplying the resin material P at a high speed, the supply amount of the resin material P can be controlled with higher accuracy.

By adopting such a second stage 202 including a plurality of sub-stages, it is possible to suppress an increase in the overall processing time required for the supply process of the resin material P, and to control the supply amount of the resin material P with higher accuracy.

FIG. 9 (b) shows a time chart when the size of the command output is changed in addition to the process of changing the output cycle as shown in FIG. 9 (a). In the example, the control unit 100 makes the magnitude of the command value given to the hopper feeder 13 in the second sub-phase 242 smaller than the magnitude of the command value given to the hopper feeder 13 in the first sub-phase 241. . More specifically, in the first sub-phase 241, an instruction value having a time width Td of a size Y1 is output for each output cycle T1, and in the second sub-phase 242, it is output for each output cycle T2 (> T1) A command value having a time width Td of Y2 (<Y1). That is, in the second sub-phase 242, compared with the first sub-phase 241, the vibration intensity generated by the hopper feeder 13 becomes smaller.

In this way, by increasing the output period and reducing the size of the command value, the supply amount per unit time in the second sub-phase 242 is further reduced. Therefore, compared with the case of FIG. 9 (a), the supply amount control can be further improved. Precision.

Moreover, even if the magnitude of the command value is changed in the second sub-phase 242, the amount of the resin material P supplied in the second sub-phase 242 is extremely small, so the resin material remaining in the hopper 12 can be ignored. The influence of the distribution state of P may ignore the influence on the next supply process of the resin material P.

FIG. 9 (c) shows a processing example of shortening the time width of the instruction output between the first sub-phase 241 and the second sub-phase 242. In the example, the control unit 100 makes the time width of the command value given to the hopper feeder 13 in the second sub-phase 242 longer than the time of the command value given to the hopper feeder 13 in the first sub-phase 241. Short width. More specifically, in the first sub-phase 241, the command value of the time width Td1 is output for each output cycle T1, and in the second sub-phase 242, the output value of the time width Td2 (<Td1) is output for each output cycle T1. Instruction value.

In the first sub-phase 241, the resin material P is supplied at a relatively high supply rate, thereby reducing the time required for the entire process in the second phase 202, and in the second sub-phase 242, the supply is relatively low. By supplying the resin material P at a high speed, the supply amount of the resin material P can be controlled with higher accuracy.

By adopting such a second stage 202 including a plurality of sub-stages, it is possible to suppress an increase in the overall processing time required for the supply process of the resin material P, and to control the supply amount of the resin material P with higher accuracy.

9 (a) to 9 (c) show typical examples, and any method can be adopted if the supply amount per unit time can be reduced as the actual value of the supply amount of the resin material P approaches the target amount. For example, in the second sub-phase 242 of the process shown in FIG. 9 (b), the output period T1 may be set to the same output period T1 as the first sub-phase 241 instead of the output period T2, or it may be provided only with time. The magnitude Y2 of the command value of the width Td is smaller than the magnitude Y1 of the command value of the first sub-stage.

FIG. 10 is a flowchart showing an example of processing in the second stage of the method for controlling the supply of the resin material P in the resin material supply device 10 according to the modification of the embodiment. Typically, each step shown in FIG. 10 is implemented by the processor 110 of the control unit 100 executing a control program 128. In the steps shown in FIG. 10, steps that execute substantially the same processing as in FIG. 7 are denoted by the same step numbers.

10, the control unit 100 determines the magnitude of the command value used in the second stage 202 (step S11). Typically, the size of the command value immediately before the end of the first stage 201 may be determined in step S11 as the size of the command value used in the second stage 202.

The control unit 100 determines whether the supply amount of the resin material P has reached the target amount (step S12). If the supply amount of the resin material P has not reached the target amount (No in step S12), the control unit 100 determines whether the difference between the target amount and the supply amount of the resin material P is equal to or less than the adjustment start amount (step S15).

If the difference between the target amount and the supply amount of the resin material P is equal to or less than the adjustment start amount (YES in step S15), the control unit 100 controls at least one of the output cycle of the command output, the time width of the command output, and the size of the command output. One is changed to reduce the supply amount per unit time (step S16).

On the other hand, if the difference between the target amount and the supply amount of the resin material P is not less than the adjustment start amount (NO in step S15), the process of step S16 is skipped.

The control unit 100 determines whether the output cycle of the currently set command output has arrived (step S13). If the output cycle of the currently set command output has not arrived (NO in step S13), the process of step S13 is repeated.

When the output cycle of the currently set command output comes (YES in step S13), the control unit 100 outputs the command value of the currently set size across the currently set time width (step S14). Then, the processing from step S12 is repeated.

On the other hand, when the supply amount of the resin material P reaches the target amount (YES in step S12), the processing in the second stage 202 ends.

＜ F. Modifications ＞
The embodiments described above may be modified as described below. The plurality of modifications exemplified below can be arbitrarily combined.

(F1: Modification of the control of the supply speed in the first stage 201)
In the embodiment described above, an example is shown in which the feed rate of the resin material P in the first stage 201 is calculated by using feedback control, but a fixed command value may be output.

For example, until the supply amount of the resin material P reaches the end determination value, the command initial value calculated after receiving the supply start command of the resin material P may be continuously output (see step S3 in FIG. 5). For example, when the distribution state of the resin material P remaining in the hopper 12 is stable, sufficient control performance can be obtained even when a fixed value is output as a command value.

(F2: Instruction value in stage 2 202)
In the above-mentioned embodiment, as a method of intermittently supplying the resin material P, a method of outputting a command value having a pulse-like time waveform (that is, a rectangular wave) is exemplified. The command value of the time waveform of the shape wave or triangle wave.

＜ G. Notes ＞
This embodiment includes the following technical ideas.

According to an embodiment, there is provided a powder and granular material supply device that vibrates a powder and granular material supply path in which the powder and granular material are present, moves the powder and granular material, and supplies the supply target object from a discharge port provided in the powder and granular material supply path. Powder and granules. The powder supply device includes a vibration unit that vibrates the powder supply path, a measurement unit that measures the supply amount of the powder to the supply object, and a control unit that controls the vibration so that the supply amount becomes a specified target amount. Department of vibration. The control unit controls the vibrating unit to continuously supply the powder and granules in the first stage after the supply is started, and controls the vibrating unit to intermittently supply the powders and granules in the second stage after the first stage.

The control unit may give a pulse-shaped command value to the vibration unit in the second stage.

The control unit may determine the magnitude of the command value in the second stage based on the magnitude of the command value given to the vibration unit in the first stage.

The second stage may include the first sub-stage and the second sub-stage after the first sub-stage. The control unit may control the vibrating unit in the first and second sub-stages so that the supply amount per unit time in the second sub-stage is smaller than the supply amount per unit time in the first sub-stage.

The control unit may be configured such that the cycle in which the command value is given to the vibration unit in the second sub-stage is longer than the cycle in which the command value is given to the vibration unit in the first sub-stage.

The control unit may make the magnitude of the command value given to the vibrating unit in the second sub-stage smaller than the magnitude of the command value given to the vibrating unit in the first sub-stage.

A resin molding apparatus according to another embodiment includes: the powder and granular material supplying device; and a compression molding section that performs compression molding using a granular resin material that is a powder and granular material supplied from the powder and granular material supplying device.

According to still another embodiment, there is provided a method for supplying powder and granules, which moves the powder and granules by vibrating the powder and granule supply path in which the powder and granules are present, and supplies the powder to the object from a discharge port provided in the powder and granule supply path Supply the specified amount of powder and granules. The powder supply method includes a step of vibrating a vibrating portion associated with the powder supply path in a first phase after the supply is started, and continuously supplying the powder and particles; and a first step after the first phase. In the two stages, the step of vibrating the vibrating portion so as to intermittently supply the powder and granules until the supply amount of the powder and granules to the supply target reaches a target amount.

The step of vibrating the vibrating section in the second step may include a step of giving a pulse-shaped command value to the vibrating section.

The magnitude of the command value in the second stage may be determined based on the magnitude of the command value given to the vibration unit in the first stage.

The second stage may include the first sub-stage and the second sub-stage after the first sub-stage. The step of vibrating the vibrating section in the second stage may include that the supply amount per unit time in the second sub-stage is smaller than the supply amount per unit time in the first sub-stage. 2 steps to control the vibrating part.

The cycle in which the command value is given to the vibration unit in the second sub-phase may be set longer than the cycle in which the command value is given to the vibration unit in the first sub-stage.

The magnitude of the command value given to the vibrating unit in the second sub-stage may be set smaller than the magnitude of the command value given to the vibrating unit in the first sub-stage.

A method for manufacturing a resin molded article according to still another embodiment includes the steps of the powder and granular material supplying method, and the step of performing compression molding using the supplied granular resin material, that is, the granular material.

＜ H. Advantages ＞
According to the powder and granular material supply device and the powder and granular material supply method of the present embodiment, the first phase of controlling the vibrating portion to continuously supply powder and granular materials and the second phase of controlling the vibrating portion to supply powder and granular materials intermittently are adopted. stage. By adopting a plurality of stages in which the supply form of the powder and granules is different, the supply amount of the powder and granules can be controlled with higher accuracy.

In addition, when a granular resin material is used as a typical example of the powder and granules supplied by the powder and granule supply device and the powder and granule supply method according to the present embodiment, it is possible to suppress the resin material supplied by each supply operation. The weight deviation is too large or insufficient relative to the target amount, so that the thickness of the resin molded product can be made uniform.

Furthermore, when a resin molded product is used for sealing electronic components, even if it is a thin package, the package thickness can be made uniform.

In addition, by dividing the second stage into a plurality of sub-stages and varying the supply amount per unit time, the overall processing time required for the supply operation is not prolonged, and the control performance of the supply amount of the powder can be further improved.

The embodiments of the present invention have been described, but the embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

1‧‧‧resin molding device

10‧‧‧Resin material supply device

11‧‧‧ inclined material trough

12‧‧‧ trough

13‧‧‧Tank feeder

14‧‧‧Measurement Department

15‧‧‧Resin material transfer tray

16‧‧‧Resin material discharge section

17‧‧‧stocker

20‧‧‧Resin material transfer department

30‧‧‧Compression molding department

31‧‧‧Receiving module

32‧‧‧forming module

33‧‧‧ Delivery Module

36‧‧‧Main Transfer Device

37‧‧‧Deputy transfer device

100‧‧‧Control Department

102‧‧‧Input Department

104‧‧‧Output Department

106‧‧‧Main memory

108‧‧‧ Optical Drive

108A‧‧‧Recording medium

110‧‧‧ processor

112‧‧‧ web interface

114‧‧‧Measurement interface

116‧‧‧Vibration section interface

118‧‧‧ Internal Bus

120‧‧‧HDD

121‧‧‧ spout

122‧‧‧General OS

124‧‧‧Real-time OS

126‧‧‧HMI program

128‧‧‧Control Program

151‧‧‧concave

171‧‧‧ supply port

172‧‧‧stocker feeder

201‧‧‧Phase 1

202‧‧‧Phase 2

210‧‧‧ Deviation calculation section

212‧‧‧PID calculation department

214, 216, 234‧‧‧‧Selection Department

218‧‧‧Command value holding unit

220‧‧‧Timer

222‧‧‧ Differentiator

224‧‧‧ Differentiator

226, 236‧‧‧‧Comparison

230‧‧‧pulse generator

232‧‧‧Magnifying Department

241‧‧‧Phase 1

242‧‧‧Phase 2

311‧‧‧Substrate receiving section

331‧‧‧Resin molded product holding section

P‧‧‧Resin material

S‧‧‧ substrate

S1 ～ S16‧‧‧‧Steps

T‧‧‧resin molding

T1, T2‧‧‧ output cycle

t1, t2, t3‧‧‧time

Td, Td1, Td2‧‧‧time width

Y1, Y2‧‧‧ size of command value

FIG. 1 is a schematic diagram showing an example of the overall configuration of a resin molding apparatus according to this embodiment.

FIG. 2 is a schematic diagram showing an example of the overall configuration of a resin material supply device constituting the resin molding device according to the present embodiment.

FIG. 3 is a schematic diagram showing an example of a hardware configuration of a control unit constituting the resin material supply device according to the present embodiment.

FIG. 4 is a time chart for explaining a method for controlling the supply of a resin material in the resin material supply device according to the present embodiment.

FIG. 5 is a flow chart showing an example of processing in the first stage of the resin material supply control method in the resin material supply device according to the present embodiment.

FIG. 6 is a block diagram showing a functional configuration corresponding to processing in the first stage of the method for controlling the supply of a resin material in the resin material supply device according to the present embodiment.

FIG. 7 is a flowchart showing an example of processing in the second stage of the resin material supply control method in the resin material supply device according to the present embodiment.

FIG. 8 is a block diagram showing a functional configuration corresponding to processing in the second stage of the resin material supply control method in the resin material supply device according to the present embodiment.

FIGS. 9 (a) to 9 (c) are timing charts showing an example of command values output in the second stage according to the modification of the present embodiment.

FIG. 10 is a flowchart showing an example of processing in the second stage of the resin material supply control method in the resin material supply device according to the modification of the embodiment.

Claims (14)

A powder supply device is a powder supply device which vibrates a powder supply path in which powder particles are present, moves the powder and supplies powder to a supply target from a discharge port provided in the powder supply path. The powder and granular material supplying device of the powder and granular material is characterized by comprising: A vibrating part that vibrates the powder and granular material supply path; A measurement unit that measures a supply amount of the powder and granules to the supply object; and The control unit controls the vibration of the vibrating unit so that the supply amount becomes a designated target amount, and The control unit controls the vibrating unit to continuously supply the powder and granules in a first stage after the start of supply, and supplies the powder intermittently in a second stage after the first stage. A granular manner controls the vibrating portion. The powder and granular material supply device according to item 1 of the scope of application for a patent, wherein the control unit gives a pulse-shaped command value to the vibration unit in the second stage. The powder and granular material supply device according to item 1 or 2 of the scope of patent application, wherein the control unit determines the second unit based on a magnitude of a command value given to the vibrating unit in the first stage. The size of the instruction value in the stage. According to the powder and granule supply device according to item 1 of the scope of patent application, wherein the second stage includes a first sub-stage and a second sub-stage after the first sub-stage, The control unit is configured to provide the supply amount per unit time in the second sub-stage to be smaller than the supply amount per unit time in the first sub-stage in the first sub-stage and the second sub-stage. The vibration part is controlled in a stage. The powder and granular material supply device according to item 4 of the scope of patent application, wherein the control unit makes a cycle ratio of the command value given to the vibrating unit in the second sub-phase to the first sub-phase. The cycle in which the vibration unit gives the command value is long. The powder and granular material supply device according to item 4 or item 5 of the scope of patent application, wherein the control unit makes the magnitude of the command value given to the vibrating unit in the second sub-stage smaller than that in the first sub-stage. The magnitude of the command value given to the vibrating part in one sub-stage is small. A resin forming device includes: The powder and granule supply device according to any one of claims 1 to 6 of the scope of patent application; and The compression molding section performs compression molding using the granular resin material that is the powder and granular material supplied from the powder and granular material supplying device. A method for supplying powder and granules is to move the powder and granules by vibrating the powder and granule supply path in which the powders and granules are present, and to supply a supply object from a discharge port provided in the powder and granule supply path. A specified target amount of a powder and granule supply method for the powder and granule, which is characterized by comprising: A step of vibrating a vibrating portion associated with the powder and granular supply path so as to continuously supply the powder and granular material in a first stage after the supply is started; and In the second stage after the first stage, the vibrating section is vibrated so that the powder and granules are intermittently supplied until the supply amount of the powder to the supply target object reaches the target amount. So far. The method for supplying powder and granules according to item 8 of the scope of patent application, wherein the step of vibrating the vibrating portion in the second stage includes a step of giving a pulse-shaped command value to the vibrating portion. The powder and granule supply method according to claim 8 or claim 9, wherein the command in the second stage is determined based on the magnitude of the command value given to the vibrating section in the first stage. The size of the value. The method for supplying powder and granules according to item 8 of the scope of patent application, wherein the second stage includes a first sub-stage and a second sub-stage after the first sub-stage, The step of vibrating the vibrating section in the second stage includes that the supply amount per unit time in the second sub-stage is smaller than the supply amount per unit time in the first sub-stage. A step of controlling the vibrating unit in the first sub-stage and the second sub-stage. The method for supplying powder and granules according to item 11 of the scope of patent application, wherein a cycle ratio of giving a command value to the vibrating part in the second sub-phase is given to the vibrating part in the first sub-phase. The command value cycle is set long. The method for supplying powder and granules according to the 11th or 12th in the scope of patent application, wherein the magnitude of the command value given to the vibrating part in the second sub-stage is smaller than that in the first sub-stage The magnitude of the command value given by the vibration unit is set small. A method for manufacturing a resin molded article includes: The steps of the powder supply method according to any one of claims 8 to 13 of the scope of patent application; and A step of performing compression molding using the supplied granular resin material, that is, the powder or granular material.