TW201941896A - Resin molding apparatus and method of manufacturing resin molded product - Google Patents

Abstract

The invention provides a resin molding apparatus 1 which reduces the viscosity of a liquid resin without deteriorating the workability of nozzle replacement. The resin molding apparatus 1 supplies a liquid resin 30 to a discharge object 14 to perform resin molding, and the resin molding apparatus 1 includes a nozzle 29 for discharging the liquid resin 30 to the discharge object 14, a heating part 31 for heating the nozzle 29 in contact with the nozzle 29, and a switching mechanism 34 for switching between a contact state in which the nozzle 29 and the heating part 31 are in contact with each other and a separation state in which the nozzle 29 and the heating part 31 are separated from each other.

Description

Resin molding device and method for manufacturing resin molded product

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

Conventionally, a semiconductor wafer mounted on a substrate is resin-sealed using, for example, a liquid resin including a thermosetting resin such as a silicone resin or an epoxy resin. As a technique for resin sealing, resin molding techniques such as compression molding and transfer molding are used. In resin molding using a liquid resin, resin molding is performed by mixing a liquid resin as an adjuvant such as a hardener with the liquid resin as a main agent and heating the mixed liquid resin.

In the resin sealing using the liquid resin, a nozzle that ejects the liquid resin is inserted between the upper mold and the lower mold, and the liquid resin is supplied to a cavity formed in the lower mold. Here, since the viscosity of the liquid resin decreases as its temperature increases, the liquid resin is heated in order to make the liquid resin easier to be ejected from the nozzle.

As a person who heats a liquid resin, as shown in Patent Document 1, a nozzle in which an infusion tube is integrally formed, and a spiral pipe is provided on the outer periphery of the infusion tube to constitute a temperature regulator. In addition, the thermosetting resin is made into a liquid resin having a fluidity level by the temperature regulator.

However, in a configuration in which the temperature regulator is provided for an infusion tube integrally formed in a nozzle, the structure of the nozzle becomes complicated, and the workability of nozzle replacement is also deteriorated as a result.
[Prior Art Literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-232437

[Problems to be Solved by the Invention]
Therefore, this invention is made in order to solve the said problem, The main objective is not to reduce the workability | operativity of nozzle replacement, and to reduce the viscosity of a liquid resin.
[Technical means to solve the problem]

That is, the resin molding apparatus of the present invention is a resin molding apparatus that supplies a liquid resin to an ejection object to perform resin molding, and includes a nozzle that ejects the liquid resin to the ejection object; a heating section, Contacting the nozzle to heat the nozzle; and a switching mechanism that switches a contact state where the nozzle and the heating section are in contact with each other and a separated state where the nozzle and the heating section are separated from each other.
The method for producing a resin molded article of the present invention is a method for producing a resin molded article by ejecting a liquid resin from a nozzle to an ejection object and performing resin molding using the ejected liquid resin to produce a resin molded article. The nozzle is brought into contact with a heating portion provided in a contactable and separable manner with respect to the nozzle for heating, and then a liquid resin is ejected to the ejection target.
[Effect of the invention]

According to the present invention thus constituted, the viscosity of the liquid resin can be reduced without deteriorating the workability of nozzle replacement.

Next, the present invention will be described in more detail with examples. However, the present invention is not limited by the following description.

As described above, the resin molding apparatus of the present invention is a resin molding apparatus that supplies a liquid resin to an ejection object to perform resin molding, and includes a nozzle that ejects the liquid resin to the ejection object; A heating unit that contacts the nozzle to heat the nozzle; and a switching mechanism that switches a contact state where the nozzle and the heating unit are in contact with each other and a separated state where the nozzle and the heating unit are separated from each other .
According to the resin molding device, since the contact state where the nozzle and the heating section are in contact with each other and the separation state where the nozzle and the heating section are separated from each other can be switched, there is no need to provide a heating section in the nozzle. As a result, the liquid resin can be heated in the nozzle without complicating the structure of the nozzle. Since the structure of the nozzle is not complicated, the workability of nozzle replacement is not deteriorated. In addition, the liquid resin is heated to reduce the viscosity of the liquid resin, and it is easy to eject from the nozzle. The accuracy of the ejection amount can be improved, and the wire drawing state after ejection can be released as soon as possible.

In order to be able to actively cool the nozzle without complicating the structure of the nozzle, it is desirable to include a cooling section that contacts the nozzle and cools the nozzle, and the switching mechanism controls the nozzle and the nozzle. A contact state in which the cooling portions are in contact with each other is switched with a separated state in which the nozzles and the cooling portions are separated from each other.
With this configuration, adverse effects on the liquid resin (for example, unnecessary thermal curing) can be reduced. In addition, by cooling the nozzle, the viscosity of the liquid resin can be increased, and the liquid resin can be prevented from dripping from the nozzle in a standby state in which the liquid resin is not discharged.

In order to be able to manage the temperature of the nozzle, it is desirable to include a temperature sensor that detects the temperature of the nozzle, and a control unit that controls the switching mechanism based on the detected temperature of the temperature sensor.

In order to make it difficult for the temperature of the heated nozzle to be lowered, it is desirable to include a heat insulation member which is provided on the outer surface of the nozzle and has a larger heat capacity than the nozzle.

Preferably, at least a part of the surface of the nozzle is subjected to a blackening treatment.
With such a configuration, it is easy to absorb heat radiation from the outside of the nozzle, such as a molding die, and it is possible to use the heat radiation to heat the nozzle or prevent a decrease in temperature.

The resin molding apparatus includes a dispenser having the nozzle and ejecting the liquid resin from the nozzle; and a supply module that supplies the liquid resin to the dispenser while the dispenser is on standby. In the configuration, the heating unit is desirably provided in the supply module.
Since the heating unit is provided in the supply module in this manner, the nozzle in the standby state can be heated. As a result, the nozzle can be sufficiently heated before the liquid resin is ejected.

The ejection object of the resin molding apparatus is a molding mold, and the resin molding apparatus includes a molding module, and the molding module includes the molding mold and a mold clamping mechanism for clamping the molding mold. In the configuration, the heating unit is desirably provided in the forming module.
Since the heating unit is provided in the molding module in this manner, the nozzle can be heated immediately before the liquid resin is ejected. As a result, the liquid resin can be ejected before the temperature of the heated nozzle is lowered.

The heating unit is preferably provided in a dispenser that ejects the liquid resin from the nozzle via the switching mechanism.
With such a configuration, the nozzle can be heated while the liquid resin is ejected from the nozzle.

In addition, the method for producing a resin molded article of the present invention is a method for producing a resin molded article by ejecting a liquid resin from a nozzle to an ejection object and performing resin molding using the ejected liquid resin to produce a resin molded article. After the nozzle is brought into contact with a heating portion provided separately from the nozzle so as to be in contact with the heating element, the liquid resin is ejected from the ejection object after heating.
According to the method for manufacturing the resin molded product, since the nozzle is heated by using a heating portion which is provided so as to be able to contact and separate from the nozzle, it is not necessary to provide a heating portion in the nozzle. As a result, the liquid resin can be heated in the nozzle without complicating the structure of the nozzle. Since the structure of the nozzle is not complicated, the workability of nozzle replacement is not deteriorated. In addition, the liquid resin is heated to reduce the viscosity of the liquid resin, and it is easy to eject from the nozzle. The accuracy of the ejection amount can be improved, and the wire drawing state after ejection can be released as soon as possible.

After the liquid resin is ejected from the ejection target object, the nozzle is preferably brought into contact with a cooling portion provided separately from the nozzle so as to be in contact with the cooling unit for cooling.
With this configuration, adverse effects on the liquid resin (for example, unnecessary thermal curing) can be reduced. In addition, by cooling the nozzle, the viscosity of the liquid resin can be increased, and the liquid resin can be prevented from dripping from the nozzle after being ejected.

<Embodiment of the present invention>
Hereinafter, embodiments of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, for any of the figures shown below, for ease of understanding, they are schematically omitted or exaggerated as appropriate. For the same constituent elements, the same symbols are assigned, and descriptions thereof are appropriately omitted. In addition, in this application, the term "liquid" refers to a liquid that is liquid at normal temperature and has fluidity, and in other words the degree of viscosity regardless of the level of fluidity. In addition, in this application, the "resin-molded product" refers to a product including at least a resin-molded resin portion, and includes a resin-molded and resin-sealed wafer formed on a substrate by a molding die as described later and resin-sealed The expression of the concept of the shape of the sealed substrate.

The structure of the resin molding apparatus 1 of this embodiment is demonstrated with reference to FIG. The resin molding apparatus 1 shown in FIG. 1 is a resin molding apparatus using a compression molding method. This embodiment shows a case where, for example, a substrate on which a semiconductor wafer is mounted is a target for resin molding, and a liquid resin that is a fluid resin is used as a resin material. Examples of the "substrate" include general substrates such as glass epoxy substrates, ceramic substrates, resin substrates, and metal substrates, and lead frames.

Specifically, as shown in FIG. 1, the resin molding apparatus 1 includes a substrate supply / storage module 2, four molding modules 3A, 3B, 3C, 3D, and a supply module 4 as constituent elements. The substrate supply / storage module 2, the forming modules 3A to 3D, and the supply module 4 as constituent elements can be detached from each other with respect to other constituent elements, and can be replaced.

The substrate supply / storage module 2 is provided with a pre-sealed substrate supply section 6 which supplies a pre-sealed substrate 5 and a post-sealed substrate storage section 8 which houses a post-sealed substrate 7. For example, a light-emitting diode (LED) wafer, which is an optical element, is mounted on the sealed front substrate 5. A loader 9 and an unloader 10 are provided in the substrate supply / storage module 2, and a rail 11 supporting the loader 9 and the unloader 10 is provided along the X direction. The loader 9 and the unloader 10 move along the rail 11 in the X direction.

The loader 9 and the unloader 10 supported by the rail 11 move in the X direction between the substrate supply / storage module 2, each of the forming modules 3A, 3B, 3C, and 3D and the supply module 4. The loader 9 is provided with a moving mechanism 12 for supplying the sealing front substrate 5 to the upper mold in each of the forming modules 3A, 3B, 3C, and 3D. In each forming module, the moving mechanism 12 moves in the Y direction. The unloader 10 is provided with a moving mechanism 13 for receiving the sealed substrate 7 from the upper mold in each of the forming modules 3A, 3B, 3C, and 3D. In each of the forming modules 3A, 3B, 3C, and 3D, the moving mechanism 13 moves in the Y direction.

Each of the forming modules 3A, 3B, 3C, and 3D is provided with a pair of forming dies facing each other. The pair of forming dies of the present embodiment are a lower die 14 that can be raised and lowered, and an upper die that is disposed opposite to the lower die 14 (not shown, see FIG. 2 (1)). Each of the forming modules 3A, 3B, 3C, and 3D includes a mold clamping mechanism 15 for clamping and opening the upper mold and the lower mold 14. A cavity 16, which is a space in which the liquid resin is cured, is formed in the lower mold 14. In other words, the chamber 16 is a storage portion that stores a liquid resin. The mold surface of the cavity 16 is covered with a release film 17.

The supply module 4 is provided with a resin supply mechanism 18 that supplies a liquid resin to the cavity 16 of the lower mold 14 as an object to be ejected. The resin supply mechanism 18 is supported by the rail 11 and moves in the X direction along the rail 11 by the moving mechanism 20. The resin supply mechanism 18 is provided with a dispenser 19 as a liquid resin ejection mechanism. In each of the forming modules 3A, 3B, 3C, and 3D, the dispenser 19 is moved in the Y direction by the moving mechanism 20 and the liquid resin is ejected to the chamber 16. The dispenser 19 shown in FIG. 1 is a one-liquid type dispenser using a liquid resin obtained by mixing a main agent and a hardener in advance. As the main agent, a silicone resin or epoxy resin having thermosetting property and light transmitting property is used.

A vacuum mechanism 21 is provided in the supply module 4. In each of the forming modules 3A, 3B, 3C, and 3D, the evacuation mechanism 21 forcibly sucks air from the cavity 16 immediately before closing the upper mold and the lower mold 14 and discharges them. The supply module 4 is provided with a control unit 22 that controls the overall operation of the resin molding apparatus 1. FIG. 1 shows a case where the evacuation mechanism 21 and the control unit 22 are provided in the supply module 4. It is not limited to this, and the evacuation mechanism 21 and the control unit 22 may be provided in other modules. The control unit 22 includes, for example, a dedicated or general-purpose computer including a central processing unit (CPU), an internal memory, an analog digital (AD) converter, and an input / output inverter.

1 and FIGS. 2 (1) and 2 (2), the resin supply mechanism 18 supplies the liquid resin 30 to the cavity 16 provided in the lower mold 14 (see FIGS. 2 (1) and 2 (2)). ). As shown in FIG. 2 (1), an upper mold 23, a lower mold 14, and a film pressing member 24 are provided in each of the forming modules 3A, 3B, 3C, and 3D (see FIG. 1).

The release film 17 covers the mold surface of the cavity 16 and the surrounding mold surfaces. The film pressing member 24 is a member for pressing and fixing the release film 17 to the mold surface of the lower mold 14 around the cavity 16. The film pressing member 24 has an opening in a central portion, and a molding die is located inside the opening. The hermetically sealed front substrate 5 on which the LED chip 25 and the like are fixed is arranged and arranged in the upper mold 23 by, for example, suction, clamp, or the like. An independent chamber 26 corresponding to each LED chip 25 is provided inside the chamber 16.

The release film 17 is supplied so as to cover the entire surface of the chamber 16. The release film 17 is heated by a heater (not shown) provided in the lower mold 14. The heated release film 17 is softened and stretched. Around the chamber 16, the softened release film 17 is pressed and fixed to the mold surface of the lower mold 14 by the film pressing member 24. The softened release film 17 is adsorbed so as to follow the mold surface of each of the independent chambers 26. In addition, FIG. 2 (1) shows a case where the film pressing member 24 is used. It is not limited to this, and the release film 17 and the film pressing member 24 may not be used.

As shown in FIG. 2 (1) and FIG. 2 (2), the dispenser 19 includes a delivery mechanism 27 for sending a predetermined amount of liquid resin 30, a syringe 28 for storing the liquid resin 30, and a syringe for discharging the liquid resin 30. Nozzle 29. In the dispenser 19, the delivery mechanism 27, the syringe 28, and the nozzle 29 are connected and integrated. Therefore, each component (the sending-out mechanism 27, the syringe 28, and the nozzle 29) can be detached from each other, and each component element unit can be replaced with the same type but a different component unit. For example, the liquid resin 30 having different materials, different viscosities, and the like may be stored in advance in a plurality of syringes 28, and the required syringes 28 may be attached to the dispenser 19 and used according to the product. Alternatively, syringes 28 having different capacities can be selected for use.

By exchanging the nozzles 29, the discharge direction of the liquid resin 30 can be set to any direction such as directly below, directly to the side, and obliquely below. The diameter of the discharge port of the nozzle 29 can be changed according to the viscosity of the liquid resin 30. Furthermore, a static mixer may be provided between the syringe 28 and the nozzle 29. For example, even when a fluorescent substance or the like is added to the liquid resin 30 as an additive, the liquid resin 30 can be ejected in a uniform state where the fluorescent substance is not precipitated by stirring the liquid resin 30 with a static mixer. 30.

The dispenser 19 may be moved in the vertical direction (Z direction). The dispenser 19 shown in FIG. 2 (1) can be centered on a certain point in the vertical plane (including the Y-axis and Z-axis planes) or the horizontal plane (including the X-axis and Y-axis planes). Partially rotating way back and forth. In this case, the back-and-forth motion is performed so that the front-end | tip part of the dispenser 19 may draw a part of circular arc.

A case where a molding module 3C is used as the operation of the resin molding apparatus 1 will be described with reference to FIGS. 1 and 2 (1) and 2 (2). First, for example, the sealed front substrate 5 on which the LED wafer 25 is mounted is transferred from the sealed front substrate supply unit 6 to the loader 9 so that the LED wafer 25 is mounted facing downward. Next, the loader 9 is moved from the substrate supply / storage module 2 along the rail 11 in the + X direction to the forming module 3C.

Next, in the forming module 3C, using the moving mechanism 12, the loader 9 is moved in the −Y direction to a predetermined position between the lower mold 14 and the upper mold 23 (see FIG. 2 (1)). The downwardly sealed front substrate 5 on which the LED chip 25 is mounted is fixed to the lower surface of the upper mold 23 by suction or clamping. After the sealing front substrate 5 is placed on the lower surface of the upper mold, the loader 9 is moved to the original position in the substrate supply / storage module 2.

Next, using the resin supply mechanism 18, the dispenser 19 is moved from the standby position in the supply module 4 along the rail 11 in the -X direction to the molding module 3C. Thereby, the resin supply mechanism 18 is moved to a predetermined position near the lower mold 14 in the module 3C. The moving mechanism 20 is used to move the dispenser 19 to a predetermined position above the lower mold 14.

Next, as shown in FIG. 2 (1), the liquid resin 30 is ejected from the nozzle 29 of the dispenser 19. Specifically, the liquid resin 30 is ejected from the nozzle 29 of the dispenser 19 toward the cavity 16 provided in the lower mold 14. Thereby, the liquid resin 30 is supplied to the chamber 16.

Next, after the liquid resin 30 is supplied to the chamber 16, the dispenser 19 is retracted to the resin supply mechanism 18 using the moving mechanism 20. The resin supply mechanism 18 is moved to the original standby position in the supply module 4.

Next, in the molding module 3C, the lower mold 14 is raised using the mold clamping mechanism 15, and thereby the upper mold 23 and the lower mold 14 are clamped. By performing the mold clamping, the LED wafer 25 mounted on the sealed front substrate 5 is immersed in the liquid resin 30 supplied to the chamber 16. At this time, a predetermined resin pressure may be applied to the liquid resin 30 in the cavity 16 using a cavity bottom member (not shown) provided in the lower mold 14.

In addition, during the mold clamping process, the inside of the chamber 16 may be sucked by using the evacuation mechanism 21. As a result, air remaining in the cavity 16 or air bubbles contained in the liquid resin 30 are discharged to the outside of the molding die. The inside of the chamber 16 is set to a predetermined degree of vacuum.

Next, a heater (not shown) provided in the lower mold 14 is used to heat the liquid resin 30 for the time required to harden the liquid resin 30. Thereby, the liquid resin 30 is hardened and a hardened resin is formed. Thereby, the LED wafer 25 mounted on the sealing front substrate 5 is resin-sealed by the hardened resin formed in accordance with the shape of the cavity 16. After the liquid resin 30 is hardened, the upper mold 23 and the lower mold 14 are opened using a mold clamping mechanism 15.

Next, the loader 9 is retracted to an appropriate position that does not prevent the unloader 10 from moving to the forming module 3C. For example, the loader 9 is retracted from the substrate supply / storage module 2 to an appropriate position in the forming module 3D or the supply module 4. After that, the unloader 10 is moved from the substrate supply / storage module 2 to the forming module 3C in the + X direction along the rail 11.

Next, in the molding module 3C, the moving mechanism 13 is moved to a predetermined position between the lower mold 14 and the upper mold 23 in the −Y direction, and then the moving mechanism 13 receives the sealed substrate 7 from the upper mold 23. After receiving the sealed back substrate 7, the moving mechanism 13 is returned to the unloader 10. After the unloader 10 is returned to the substrate supply / storage module 2, the sealed substrate 7 is stored in the sealed substrate storage portion 8. At this time, the resin sealing of the first sealed front substrate 5 is completed, thereby completing the first sealed rear substrate 7.

Next, the loader 9 retracted to an appropriate position in the forming module 3D or the supply module 4 is moved to the substrate supply / storage module 2. The self-sealed front substrate supply unit 6 transfers the next sealed front substrate 5 to the loader 9. Resin sealing is repeated as described above.

In addition, in this embodiment, the supply of the front substrate 5 is sealed, the movement of the resin supply mechanism 18 and the dispenser 19, the ejection of the liquid resin 30, the clamping and opening of the upper mold 23 and the lower mold 14, and the sealed substrate Operations such as storage 7 are controlled by the control unit 22.

<Temperature adjustment mechanism of nozzle 29>
In addition, the resin molding apparatus 1 of this embodiment includes a temperature adjustment mechanism that is provided separately from the nozzle 29 and adjusts the temperature of the nozzle 29.

Specifically, as shown in FIG. 1, FIG. 3 (1), FIG. 3 (2), and FIG. 4 (1), FIG. Heating section 31, cooling section 32 that contacts nozzle 29 to cool nozzle 29, temperature sensor 33 that detects the temperature of nozzle 29, and contact / non-contact between nozzle 29 and heating section 31 or cooling section 32 The switching mechanism 34 for switching is contacted.

The heating section 31, the cooling section 32, and the temperature sensor 33 of this embodiment are provided in the supply module 4.

As shown in FIGS. 3 (1) and 3 (2), the heating unit 31 is, for example, a metal block 311 (hereinafter also referred to as a heating block 311) with a heater (not shown) built therein. The heating section 31 is fixed in the supply module 4 and has a contact heating surface 311 a that is in contact with the outer surface of the nozzle 29 for heating. The contact heating surface 311 a of the present embodiment is a surface that is in contact with the front end surface 29 a of the nozzle 29. Since the front end surface 29a of the nozzle 29 is a flat surface, the contact heating surface 311a is also formed as a flat surface. The heater is, for example, an exothermic resistor.

As shown in FIGS. 4 (1) and 4 (2), the cooling unit 32 is, for example, a metal block 321 (hereinafter also referred to as a cooling block 321). The cooling section 32 is fixed in the supply module 4 and has a contact cooling surface 321 a that is in contact with the outer surface of the nozzle 29 for cooling. The contact cooling surface 321 a of the present embodiment is a surface that is in contact with the front end surface 29 a of the nozzle 29 in the same manner as the contact heating surface 311 a. Since the front end surface 29a of the nozzle 29 is a flat surface, the contact cooling surface 321a is also formed as a flat surface. The cooling unit 32 may include a cooler inside the cooling block 321. As a cooler, a cooling pipe using a Peltier element and a cooling medium through which a gas or a liquid flows is considered.

The heating section 31 and the cooling section 32 are provided in parallel in the X direction (the extending direction of the rail 11), for example. The contact heating surface 311 a of the heating section 31 and the contact cooling surface 321 a of the cooling section 32 are provided in the Y direction so as to be in contact with the front end surface 29 a of the nozzle 29 that is moved in the Y direction by the moving mechanism 20.

The switching mechanism 34 switches a contact state where the nozzle 29 and the heating section 31 are in contact with each other and a separated state where the nozzle 29 and the heating section 31 are separated from each other, and a contact state where the nozzle 29 and the cooling section 32 are in contact with each other and the nozzle 29 and the cooling section 32 The separated states separated from each other are switched.

The switching mechanism 34 in the present embodiment includes a moving mechanism 20. By moving the dispenser 19 in the X and Y directions by the moving mechanism 20, the contact / non-contact of the nozzle 29 and the heating section 31 and the contact / non-contact of the nozzle 29 and the cooling section 32 are switched. The contact / non-contact switching by the moving mechanism 20 is controlled by the control unit 22.

The temperature sensor 33 is, for example, a non-contact sensor such as an infrared sensor. The temperature sensor 33 is provided in the supply module 4 at a position that can detect the temperature of the nozzle 29 that is in contact with the heating section 31 and the cooling section 32 (see FIG. 3 (1), FIG. 3 (2), and FIG. 4 (1), Figure 4 (2)). In the present embodiment, the temperature of the nozzle 29 in contact is detected from the side, but the temperature may be detected from above or below. In addition, although FIG. 1 etc. are comprised so that both a heating temperature and a cooling temperature may be detected with one temperature sensor 33, each temperature sensor 33 may be provided in the heating part 31 and the cooling part 32, respectively. The detection signal of the temperature sensor 33 is transmitted to the control unit 22, and the switching mechanism is controlled by the moving mechanism 20.

Next, the operation of the dispenser 19 before and after the ejection of the liquid resin is briefly described.

The dispenser 19 before the liquid resin 30 is ejected to the lower mold 14 as the ejection target portion stands by at the supply module 4. At this time, the control unit 22 controls the moving mechanism 20 so that the front end surface 29a of the nozzle 29 contacts the contact heating surface 311a of the heating block 311 (see FIGS. 3 (1) and 3 (2)). When the nozzle heating is performed, the temperature sensor 33 is used to detect the nozzle temperature, and heating is performed until the nozzle temperature reaches a predetermined set heating temperature (for example, 25 ° C to 40 ° C). When the set heating temperature is exceeded, the control unit 22 controls the moving mechanism 20 to bring the nozzle 29 into contact with the cooling block 321 for cooling, so that the set heating temperature may be set. It is also possible to set the heating temperature only by separating the nozzle 29 from the heating block 311.

After the nozzle 29 is heated in this manner, the control unit 22 controls the moving mechanism 20 to move the dispenser 19 to the molding module 3A to the molding module 3D, ejects the liquid resin 30 from the nozzle 29, and supplies the liquid resin 30 to the lower mold 14. Liquid resin 30.

After the liquid resin is supplied, the control unit 22 controls the moving mechanism 20 to return the dispenser 19 to the supply module 4. At this time, the control unit 22 controls the moving mechanism 20 so that the front end surface 29a of the nozzle 29 contacts the cooling surface 321a of the cooling block 321 (see FIGS. 4 (1) and 4 (2)). When the nozzle cooling is performed, the temperature sensor 33 is used to detect the nozzle temperature, and the cooling is performed until the nozzle temperature reaches a predetermined set cooling temperature (for example, less than 20 ° C). When the temperature is equal to or lower than the set cooling temperature, the control unit 22 controls the moving mechanism 20 to separate the nozzle 29 from the cooling block 321. Further, the state in which the nozzle 29 is brought into contact with the cooling block 321 can be maintained until the heating operation accompanying the next supply of the liquid resin 30.

<Effects of the present embodiment>
According to the resin molding apparatus 1 of this embodiment, since the contact state where the nozzle 29 and the heating section 31 are in contact with each other and the separation state where the nozzle 29 and the heating section 31 are separated from each other are switched, there is no need to provide the heating section 31 in the nozzle 29. As a result, the liquid resin 30 can be heated in the nozzle 29 without complicating the structure of the nozzle 29. Since the structure of the nozzle 29 is not complicated, the workability of nozzle replacement is not deteriorated. In addition, the liquid resin 30 is heated to reduce the viscosity of the liquid resin 30, and it is easy to eject from the nozzle 29. The accuracy of the ejection amount can be improved, and the wire drawing state after ejection can be released as soon as possible.

Further, in this embodiment, the contact state where the nozzle 29 and the cooling section 32 are in contact with each other and the separation state where the nozzle 29 and the cooling section 32 are separated from each other are switched, so that it is not necessary to provide the cooling section 32 in the nozzle 29. As a result, it is possible to actively cool the nozzle 29 without complicating the structure of the nozzle 29, and it is possible to reduce an adverse effect on the liquid resin 30 (for example, unnecessary thermal curing). By cooling the nozzle 29, the viscosity of the liquid resin 30 can be increased, and the liquid resin 30 can be prevented from dripping from the nozzle 29 in the standby state in the supply module 4.

Furthermore, in the present embodiment, since the heating section 31 is provided in the supply module 4, the nozzle 29 can be heated in a standby state before ejection. As a result, the nozzle 29 can be sufficiently heated before the liquid resin 30 is ejected. In addition, since the cooling section 32 is provided in the supply module 4, the nozzle 29 can be cooled in a standby state after ejection. As a result, the nozzle 29 can be sufficiently cooled after the liquid resin 30 is ejected, so that the viscosity of the liquid resin 30 can be increased, and the liquid resin 30 cannot be easily dropped from the nozzle 29.

＜ Other embodiments ＞
In the above-mentioned embodiment, the heating section 31 is provided in the supply module 4, but may be provided in the forming modules 3A to 3D as shown in FIG. 5. In FIG. 5, the configuration includes four forming modules 3A to 3D, and an example in which the heating section 31 is provided in each of the forming modules 3A to 3D is shown. In the case of a configuration having a plurality of forming modules 3A to 3D, a heating unit 31 may be provided in at least one of the forming modules 3A to 3D. In these cases, for example, at least one of the heating unit 31 and the dispenser 19 is moved in the forming module 3A to the forming module 3D to switch the contact / non-contact.

In the above embodiment, the contact heating surface 311a of the heating block 311 and the contact cooling surface 321a of the cooling block 321 are in contact with the front end surface 29a of the nozzle 29, but may be other external surfaces such as the upper surface or side surface of the nozzle 29. surface.

In the above-mentioned embodiment, the configuration is a configuration in which the heating unit 31 and the cooling unit 32 are brought into contact by the movement of the dispenser 19, but a switch may be provided to move the heating unit 31 and the cooling unit 32 to switch contact / non-contact. Agency 34. In this case, for example, the heating unit 31 and the cooling unit 32 are moved and brought into contact with the dispenser 19 which is in a standby state in the supply module 4.

In the above-mentioned embodiment, the contact / non-contact is switched using the detected temperature of the temperature sensor 33, but the contact / non-contact may be switched (performed) using the contact time without using the detected temperature of the temperature sensor 33. Timing control).

The heating unit 31 may be provided in the dispenser 19. That is, the heating section 31 also moves integrally with the dispenser 19. In this case, the heating unit 31 is provided in the dispenser 19 via the switching mechanism 34. As shown in FIGS. 6 (1) and 6 (2), the switching mechanism 34 includes a support member 35 for supporting the heating section 31, and is provided at a contact position P and The heating section 31 rotates between a separation position Q where the nozzle 29 is separated; and an actuator (not shown) rotates the support member 35. In FIGS. 6 (1) and 6 (2), the heating portions 31 are provided on the left and right sides of the nozzle 29 to contact the left and right sides of the nozzle 29, but may be configured to contact the upper surface of the nozzle 29. In addition, for example, the support member 35 may be configured to be rotated in contact with an external member in conjunction with the movement of the dispenser 19 without providing an actuator. The cooling unit 32 may be configured to be provided in the dispenser 19 in the same manner as the heating unit 31.

Furthermore, as shown in FIG. 7 (1) and FIG. 7 (2), a heat insulating member 36 may be provided on the outer surface of the nozzle 29. The heat insulating member 36 has a heat capacity larger than that of the nozzle 29. 7 (1) and 7 (2) show an example in which the heat-insulating member 36 is provided so as to cover the left and right side surfaces and the upper surface of the nozzle 29, but it is not limited to this, as long as the outer surface of the nozzle 29 is covered At least part of it. The thermal insulation member 36 is configured to be detachable from the nozzle 29. 7 (1) and 7 (2) show the embedded heat-insulating member 36. By providing the heat-retaining member 36 in this manner, it is possible to suppress a decrease in the temperature of the heated nozzle 29. Further, it is possible to suppress a decrease in the temperature of the nozzle 29 caused by the liquid resin 30 passing through the nozzle 29. Furthermore, by constructing the heat-retaining member 36 in a detachable manner, the workability of nozzle replacement is not deteriorated.

In the embodiment, one plane of the heating block 311 and the cooling block 321 is in contact with one plane of the nozzle. However, as shown in FIG. 8 (1) and FIG. 8 (2), for example, the heating block 311 and the cooling block A recessed portion M is formed in 321, and the nozzle 29 is in contact with the contact heating surface 311a and the contact cooling surface 321a on the inner surface of the recessed portion M. In addition, a recessed portion M may be formed in the nozzle 29. That is, the heating block 311 and the cooling block 321 may be configured to contact the nozzle 29 on a plurality of surfaces. In this way, the heat exchange area can be increased, and the temperature of the nozzle 29 can be adjusted efficiently.

In addition, at least a part of the surface of the nozzle 29 may be blackened. Here, the blackening treatment is a treatment for blackening the surface of the nozzle 29 in order to make it easy to absorb infrared rays. For example, black chrome plating, black zinc plating, low temperature black chromic acid treatment, and black electroless nickel plating can be used. Coating, blackening, black alumite treatment, black chromate treatment after zinc plating, ion plating, etc. The blackening treatment is appropriately selected according to the material of the nozzle 29 (for example, iron, stainless steel, copper, aluminum, etc.).

In the resin molding apparatus 1 according to the embodiment, after the release film is fixed to the forming mold, the liquid resin 30 is supplied to the forming mold to eject the object as the forming mold 14. However, when the release film 17 is When the liquid resin 30 is supplied to the release film 17 before being fixed to the molding die 14, the ejection target becomes the release film 17.

In addition, the present invention is not limited to the embodiment described above, and various modifications can be made without departing from the scope of the invention.

1‧‧‧resin molding device

2‧‧‧ Substrate supply and storage module

3A, 3B, 3C, 3D‧‧‧forming module

4‧‧‧Supply Module

5‧‧‧Sealed front substrate

6‧‧‧Sealed front substrate supply unit

7‧‧‧Sealed substrate (resin molded product)

8‧‧‧Sealed substrate storage section

9‧‧‧Loader

10‧‧‧Unloader

11‧‧‧ track

12, 13, 20‧‧‧ mobile agencies

14‧‧‧ Lower mold (forming mold)

15‧‧‧clamping mechanism

16‧‧‧ chamber

17‧‧‧ release film

18‧‧‧Resin supply mechanism

19‧‧‧Distributor

21‧‧‧Evacuation mechanism

22‧‧‧Control Department

23‧‧‧Upper mold (forming mold)

24‧‧‧ membrane pressing member

25‧‧‧LED Chip

26‧‧‧ independent chamber

27‧‧‧ send-out agency

28‧‧‧ syringe

29‧‧‧ Nozzle (Ejection Section)

29a‧‧‧front

30‧‧‧Liquid resin

31‧‧‧Heating section

311‧‧‧Heating block / block

311a‧‧‧ contact heating surface

32‧‧‧ Cooling Department

321‧‧‧cooling block / block

321a‧‧‧ contact cooling surface

33‧‧‧Temperature sensor

34‧‧‧ Switch mechanism

35‧‧‧ support member

36‧‧‧Insulation component

M‧‧‧ Recess

P‧‧‧Contact position

Q‧‧‧ separation position

X, Y, Z‧‧‧ directions

FIG. 1 is a view schematically showing a configuration of a resin molding apparatus according to this embodiment.

2 (1) and 2 (2) are schematic views showing a resin supply mechanism of the present embodiment, and FIG. 2 (1) is a schematic view showing a state in which the resin supply mechanism supplies a liquid resin to a cavity of a lower mold FIG. 2 (2) is a schematic plan view showing a resin supply mechanism.

3 (1) and 3 (2) are schematic views showing a state (contact state) when the nozzle is heated, FIG. 3 (1) is a plan view of a main part, and FIG. 3 (2) is a side view of the main part.

4 (1) and 4 (2) are schematic views showing a state (contact state) when the nozzle is cooled, FIG. 4 (1) is a plan view of a main part, and FIG. 4 (2) is a side view of the main part.

FIG. 5 is a diagram schematically showing a configuration of a resin molding apparatus according to a modified embodiment.

FIGS. 6 (1) and 6 (2) are schematic diagrams showing modifications of the heating section and the switching mechanism. FIG. 6 (1) is a plan view of the main part, and FIG. 6 (2) is a side view of the main part.

FIGS. 7 (1) and 7 (2) are schematic diagrams showing the main parts of the modified embodiment, FIG. 7 (1) is a front view of the main parts, and FIG. 7 (2) is a side view of the main parts.

FIGS. 8 (1) and 8 (2) are schematic views showing a heating section according to a modified embodiment, FIG. 8 (1) is a side view of a main part showing a non-contact state, and FIG. 8 (2) is a main part showing a contact state Partial side view.

Claims (10)

A resin molding apparatus for supplying a liquid resin to an ejection object to perform resin molding, including: A nozzle for ejecting the liquid resin to the ejection object; A heating unit that contacts the nozzle to heat the nozzle; and The switching mechanism switches a contact state where the nozzle and the heating section are in contact with each other and a separated state where the nozzle and the heating section are separated from each other. The resin molding apparatus according to item 1 of the scope of patent application, comprising: a cooling section that cools the nozzle in contact with the nozzle, and The switching mechanism switches a contact state where the nozzle and the cooling section are in contact with each other and a separated state where the nozzle and the cooling section are separated from each other. The resin molding apparatus according to item 1 of the scope of patent application, comprising: a temperature sensor that detects the temperature of the nozzle; and The control unit controls the switching mechanism based on the temperature detected by the temperature sensor. The resin molding device according to item 1 of the scope of patent application, includes: a heat-retaining member provided on an outer surface of the nozzle, and having a heat capacity greater than that of the nozzle. The resin molding apparatus according to item 1 of the patent application scope, wherein at least a part of a surface of the nozzle is subjected to a blackening treatment. The resin molding apparatus according to any one of claims 1 to 5 of the patent application scope, comprising: a dispenser having the nozzle, and ejecting the liquid resin from the nozzle; and A supply module for supplying the liquid resin to the dispenser while the dispenser is on standby, and The heating section is disposed in the supply module. The resin molding device according to any one of claims 1 to 5, in which the ejection object is a molding die, The resin forming apparatus includes a forming module, the forming module having the forming mold and a clamping mechanism for clamping the forming mold, The heating portion is disposed in the forming module. The resin molding device according to any one of claims 1 to 5, wherein the heating unit is provided in the dispenser that ejects the liquid resin from the nozzle via the switching mechanism. . A method for manufacturing a resin molded article, which ejects a liquid resin from a nozzle to an ejection object, and performs resin molding using the ejected liquid resin to produce a resin molded article, wherein: After the nozzle is brought into contact with a heating portion provided in a contactable and separable manner with respect to the nozzle for heating, the liquid resin is ejected toward the ejection target. The method for manufacturing a resin molded article according to item 9 of the scope of application, wherein after the liquid resin is ejected from the ejection object, the nozzle can be brought into contact with and separated from the nozzle. The provided cooling section contacts to perform cooling.