TW201940986A - Exposure device and exposure method - Google Patents

Exposure device and exposure method Download PDF

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Publication number
TW201940986A
TW201940986A TW108102341A TW108102341A TW201940986A TW 201940986 A TW201940986 A TW 201940986A TW 108102341 A TW108102341 A TW 108102341A TW 108102341 A TW108102341 A TW 108102341A TW 201940986 A TW201940986 A TW 201940986A
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wavelength
light
illumination
ray
line
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TW108102341A
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Chinese (zh)
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TWI815848B (en
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加藤正紀
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日商尼康股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70575Wavelength control, e.g. control of bandwidth, multiple wavelength, selection of wavelength or matching of optical components to wavelength
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70191Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like

Abstract

This exposure device (EX) is provided with: a first illumination optical system having a wavelength selection part (6A, 6B, 6C) that allows entry of light from a light source (2A, 2B, 2C) for generating light including a plurality of emission line wavelengths (g line, h line, i line, and the like) in order to illuminate a mask substrate M and that extracts an illumination light flux including at least a specific one emission line wavelength (i line) of the plurality of emission line wavelengths, the illumination light flux being limited to a predetermined wavelength width, and having a numerical aperture variable part (8A, 8B, 8C) that adjusts the spread angle of the illumination light flux; and a second illumination optical system (ILn) that includes an optical integrator (fly-eye lens system FEn) for irradiating, with the illumination light flux, the mask substrate at uniform illuminance with a numerical aperture corresponding to the spread angle. The wavelength selection part is mounted with a first wavelength selection element (interference filter SWb) that excludes an emission line on the short wavelength side and excludes an emission line on the long wavelength side appearing next to the specific emission line wavelength (i line), and that extracts a spectral component of the specific emission line wavelength and extracts a low-brightness spectral component distributed in a skirt of the specific emission line wavelength.

Description

曝光裝置及曝光方法Exposure device and exposure method

本發明係關於一種將光罩之圖案轉印於基板之曝光裝置、以及曝光方法。The present invention relates to an exposure apparatus and method for transferring a pattern of a photomask to a substrate.

以往,於用以製造液晶顯示元件、半導體元件、薄膜磁頭等電子元件之光微影步驟中,使用如下之曝光裝置,其將來自光源之照明光照射至透射型或反射型之光罩基板,將來自形成於光罩基板之元件圖案(電子元件用圖案)之透射光或反射光,透過投影光學系統而投影曝光於塗佈有光阻劑等感光劑之板等被曝光基板。作為現有之曝光裝置,已知例如日本特開2012-049332號公報所揭示,設置如下之照明系統(照明裝置):將來自2個水銀燈等光源部之各照明光,以入口側聚集為圓形狀且出口側聚集為長方形(狹縫狀)之成束光纖合成後,藉由複眼透鏡光學系統等所包含之積分器,以均勻之照度分布對光罩基板上之狹縫狀之照明區域進行柯勒照明。In the past, in a photolithography step for manufacturing electronic components such as a liquid crystal display element, a semiconductor element, and a thin-film magnetic head, the following exposure device was used, which irradiates illumination light from a light source to a transmissive or reflective photomask substrate. The transmitted light or reflected light from the element pattern (pattern for electronic components) formed on the photomask substrate is projected and exposed on a substrate to be exposed such as a plate coated with a photosensitive agent such as a photoresist through a projection optical system. As a conventional exposure device, for example, it is known to disclose, for example, Japanese Patent Application Laid-Open No. 2012-049332, and an illumination system (lighting device) is provided in which each illumination light from a light source unit such as two mercury lamps is collected into a circular shape at the entrance side. In addition, after the bundled optical fibers gathered into a rectangular (slit-shaped) exit side are synthesized, the slit-shaped illumination area on the mask substrate is uniformly distributed by the integrator included in the fly-eye lens optical system and the like. Le lighting.

於使用水銀燈(超高壓水銀放電燈等)作為光源之情形時,水銀燈之放電弧光中包含複數個明線,選擇其中之特定明線波長來作為曝光用照明光(光罩基板之照明光)。光微影步驟中,考慮到光阻劑之感光波長特性、投影光學系統之光學性能(解析力、色差特性)等,主要使用水銀燈之明線波長中的紫外波長區域之g射線(中心波長為435.835 nm)、h射線(中心波長為404.656 nm)、i射線(中心波長為365.015 nm)。以可進行投影曝光之最小線寬值表示之解析力R係於將投影光學系統之像側(被曝光基板側)之數值孔徑設為NAp,照明光之波長設為λ(nm),程序常數設為k(0<k≦1)時,由R=k・(λ/NAp)來定義。因此,藉由使用3個明線波長中波長最短之i射線,可進行更微細之光罩圖案之投影曝光(高解析曝光)。然而,近年來,與正型相比,針對感度低之負型之光阻劑層(光感應層)之曝光步驟增加,因此產生設定較長曝光時間之必要性,擔憂被曝光基板之每單位時間之處理片數之下降(生產性之下降)。When a mercury lamp (ultra-high-pressure mercury discharge lamp, etc.) is used as the light source, the arcing light of the mercury lamp includes a plurality of bright lines, and a specific bright line wavelength is selected as the illumination light for the exposure (illumination light of the mask substrate). In the photolithography step, taking into account the photosensitive wavelength characteristics of the photoresist and the optical properties (resolution, chromatic aberration characteristics) of the projection optical system, the g-rays in the ultraviolet wavelength range of the bright line wavelength of the mercury lamp (the central wavelength is 435.835 nm), h-ray (center wavelength is 404.656 nm), i-ray (center wavelength is 365.015 nm). The resolution R, which is represented by the minimum line width value capable of projection exposure, is that the numerical aperture of the image side (the exposed substrate side) of the projection optical system is set to NAp, the wavelength of the illumination light is set to λ (nm), and the program constant When k (0 <k ≦ 1), it is defined by R = k · (λ / NAp). Therefore, by using the shortest i-ray among the three bright-line wavelengths, it is possible to perform projection exposure (high-resolution exposure) of a finer mask pattern. However, in recent years, compared with the positive type, the exposure steps for the negative-type negative photoresist layer (light-sensing layer) have increased. Therefore, it is necessary to set a longer exposure time, and there is concern about per unit of the substrate being exposed. Decrease in the number of pieces processed over time (decrease in productivity).

依據本發明之第1形態,提供一種曝光裝置,其係將光罩之圖案投影曝光於光感應性之基板,其具備:光源,其為了對光罩進行照明而產生包含複數個明線波長之光;第1照明光學系統,其具有:射入來自上述光源之光且將包含上述複數個明線波長中之至少1個特定明線波長而限制為既定之波長寬度之照明光束抽出的波長選擇部、及調整上述照明光束之發散角的數值孔徑可變部;以及第2照明光學系統,其包含光學積分器,其射入上述發散角經調整之上述照明光束,隨著與上述發散角對應之數值孔徑而以同樣之照度對上述光罩上照射上述照明光束;並且於上述波長選擇部安裝第1波長選擇元件,其一面將上述特定明線波長之旁邊出現之長波長側之明線及短波長側之明線去除,一面將上述特定明線波長之光譜成分及分布於上述特定明線波長之底部附近的低亮度之光譜成分抽出。According to a first aspect of the present invention, there is provided an exposure device that exposes a pattern of a photomask to a light-sensitive substrate and includes a light source that generates a light beam including a plurality of bright-line wavelengths for illuminating the photomask. Light; a first illumination optical system having a wavelength selection for irradiating light from the light source and extracting an illumination beam containing at least one specific bright-line wavelength of the plurality of bright-line wavelengths to a predetermined wavelength width And a numerical aperture variable unit that adjusts the divergence angle of the illumination beam; and a second illumination optical system including an optical integrator that enters the illumination beam whose divergence angle is adjusted, corresponding to the divergence angle. The numerical aperture is used to irradiate the illumination light beam onto the photomask with the same illuminance; and a first wavelength selection element is mounted on the wavelength selection section, and one side of the long wavelength side bright line and The bright line on the short wavelength side is removed, and the spectral components of the specific bright line wavelength and the low The spectral components of the extraction.

依據本發明之第2形態,提供一種曝光方法,其係將光罩之圖案投影曝光於光感應性之基板,其包括:以如下方式進行波長選擇,即,與由產生包含複數個明線波長之光之光源而來之光中的至少1個特定明線波長之波峰狀之光譜成分一併,亦將不包含上述特定明線波長之旁邊出現之長波長側之明線及短波長側之明線,而分布於上述特定明線波長之底部附近的低亮度之光譜成分抽出;以及將經上述波長選擇之光譜成分之照明光束以同樣之照度照射至上述光罩上,透過在上述低亮度之光譜成分之波長寬度中不產生色差之鏡面投射方式、或者於上述低亮度之光譜成分之波長寬度中色差得到修正之反射折射方式之投影光學系統,將上述光罩之圖案投影曝光於上述基板。According to a second aspect of the present invention, an exposure method is provided, which exposes a pattern of a photomask to a light-sensitive substrate, and includes the following steps: selecting a wavelength in a manner that generates a plurality of bright-line wavelengths with The peak-shaped spectral components of at least one specific bright-line wavelength in the light coming from the light source of the light will not include the bright-line on the long wavelength side and the short-wavelength side appearing beside the specific bright-line wavelength. Bright line, and extract the low-brightness spectral components distributed near the bottom of the specific bright-line wavelength; and illuminate the illumination beam of the spectral component selected by the wavelength with the same illuminance on the photomask, and pass through the low-brightness A specular projection method that does not produce chromatic aberration in the wavelength width of the spectral component, or a reflective optical system in which the chromatic aberration is corrected in the wavelength width of the low-brightness spectral component, and exposes the pattern of the mask on the substrate. .

依據本發明之第3形態,提供一種曝光方法,其係將由光源裝置產生之包含明線波長之光中的包含由波長選擇部所選擇之特定明線波長之光譜分布之光,藉由照明光學系統而照射至擔載電子元件用圖案之光罩上,且利用射入由上述光罩產生之曝光用光束之投影光學系統,將上述圖案之像投影曝光於光感應性之基板,其包括:藉由上述波長選擇部,從由上述光源裝置產生之光中抽出波長帶域不同之第1光譜分布之光及第2光譜分布之光;以及為了利用上述照明光學系統對上述光罩進行柯勒照明,而於上述照明光學系統內之光瞳面上,將因上述第1光譜分布之光而於二維範圍分布之第1光源像、與因上述第2光譜分布之光而於二維範圍分布之第2光源像重疊地形成。According to a third aspect of the present invention, there is provided an exposure method that uses light from a light source device including a light beam having a spectral distribution of a specific light beam wavelength selected by a wavelength selection unit, by using illumination optics. The system irradiates a mask carrying a pattern for electronic components, and uses a projection optical system that projects the exposure light beam generated by the mask to project and expose the image of the pattern onto a light-sensitive substrate, including: The above-mentioned wavelength selection unit extracts the light of the first spectral distribution and the light of the second spectral distribution having different wavelength bands from the light generated by the light source device; and using the illumination optical system to perform Kohler on the photomask. Illumination, and on the pupil plane in the illumination optical system, the first light source image distributed in the two-dimensional range due to the light of the first spectral distribution and the two-dimensional range due to the light in the second spectral distribution The distributed second light source images are formed to overlap.

依據本發明之第4形態,提供一種曝光方法,其係藉由利用既定之波長分布之照明光對光罩圖案進行照明,將由上述光罩圖案產生之成像光束射入而投射於基板上之投影光學系統,而將上述光罩圖案之像投影曝光於上述基板上,其包括:將上述照明光之波長分布中之特定中心波長設為λ,上述投影光學系統之上述基板之側之數值孔徑設為NAp,且程序常數設為k(0<k≦1),將與由k・(λ/NAp)所定義之解析力R決定之可解析之最小線寬尺寸接近之大小的正方形、或者矩形之孔圖案之投影像投影於上述基板時,以變形為橢圓狀之上述孔圖案之投影像之短軸長相對於長軸長之比成為80%以上、較理想為成為90%以上之方式,設定包含上述中心波長λ之上述照明光之波長分布之寬度;以及藉由所設定之上述寬度之波長分布之照明光,對形成有電子元件用圖案之光罩進行照明,於上述基板上投影曝光上述電子元件用圖案。According to a fourth aspect of the present invention, there is provided an exposure method that uses a predetermined wavelength distribution of illumination light to illuminate a mask pattern, and projects an imaging beam generated by the mask pattern into a projection on a substrate. An optical system, and projecting and exposing the image of the mask pattern on the substrate includes: setting a specific center wavelength in the wavelength distribution of the illumination light as λ; and setting a numerical aperture on the substrate side of the projection optical system. Is a square or rectangle with NAp and a program constant set to k (0 <k ≦ 1), which is close to the smallest resolvable minimum line width dimension determined by the resolution R defined by k · (λ / NAp) When the projection image of the hole pattern is projected on the substrate, the ratio of the short axis length to the long axis length of the projection image of the hole pattern deformed into an ellipse is 80% or more, and more preferably 90% or more. The width of the wavelength distribution of the above-mentioned illumination light including the above-mentioned central wavelength λ; and the mask having the pattern for the electronic component formed by the illumination light of the wavelength distribution of the above-mentioned set width Line lighting, projection exposure on the substrate with the electronic component pattern.

關於本發明之形態之曝光裝置,揭示較佳實施方式,以下一面參照隨附之圖式一面進行詳細說明。此外,本發明之形態並不限定於該等實施方式,亦包含加以多種變更或者改良。即,以下記載之構成要素中,包含本發明所屬技術領域中具有通常知識者可容易設想者、實質相同者,以下記載之構成要素可適當組合。又,可於不脫離本發明之要旨之範圍內,進行構成要素之各種省略、置換或者變更。A preferred embodiment of the exposure apparatus according to the aspect of the present invention will be described in detail below with reference to the accompanying drawings. In addition, the form of the present invention is not limited to these embodiments, and includes various changes or improvements. That is, the constituent elements described below include those that can be easily imagined by those with ordinary knowledge in the technical field to which the present invention pertains, and those that are substantially the same, and the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the constituent elements can be made without departing from the gist of the present invention.

[第1實施方式]
圖1係表示依據第1實施方式之掃描型投影曝光裝置EX之概略性整體構成之立體圖,圖2係表示併入圖1之投影曝光裝置EX中之部分投影光學系統PLn之光學構件之配置之圖。圖1、圖2中,正交座標系XYZ之Z軸所延伸之方向表示重力方向,X軸所延伸之方向表示作為被曝光基板(光感應性基板)之板P與光罩基板M為了掃描曝光而移動之掃描移動方向,Y軸所延伸之方向表示板P之步進移動之方向。本實施方式之投影曝光裝置EX係作為對於包含反射折射方式之6個部分投影光學系統PL1~PL6之投影光學系統,一面使平坦之光罩基板M與塗佈有光感應層(光阻劑等)之平板狀板P於X方向上同步移動,一面將形成於光罩基板M上之電子元件用圖案之像轉印於板P之步進掃描方式之曝光裝置而進行說明。此外,圖1、圖2所示之投影曝光裝置EX由於與例如國際公開第2009/128488號小冊子、或者日本特開2010-245224號公報中揭示之構成相同,故而對圖1、圖2所示之裝置構成之說明簡單進行。
[First Embodiment]
FIG. 1 is a perspective view showing a schematic overall configuration of the scanning projection exposure apparatus EX according to the first embodiment, and FIG. 2 is a diagram showing the arrangement of optical components of a part of the projection optical system PLn incorporated in the projection exposure apparatus EX of FIG. 1. Illustration. In FIG. 1 and FIG. 2, the direction in which the Z axis of the orthogonal coordinate system XYZ extends indicates the direction of gravity, and the direction in which the X axis extends indicates the plate P and the mask substrate M as the exposed substrate (photosensitive substrate) for scanning. The scanning movement direction in which the exposure moves and the direction in which the Y axis extends indicates the stepwise movement direction of the plate P. The projection exposure device EX of this embodiment is a projection optical system including six partial projection optical systems PL1 to PL6 including a reflection and refraction method, and a flat mask substrate M and a light-sensitive layer (photoresist, etc.) are coated on one side. The plate-shaped plate P is moved synchronously in the X direction, and an image of a pattern for electronic components formed on the photomask substrate M is transferred to the exposure device of the step-and-scan method of the plate P for explanation. The projection exposure device EX shown in FIG. 1 and FIG. 2 has the same structure as disclosed in, for example, International Publication No. 2009/128488 or Japanese Patent Application Publication No. 2010-245224. The description of the device configuration is simple.

[投影光學系統之構成]
設定於光罩基板M上之6個照明區域IA1~IA6(參照圖1)分別設定為掃描方向亦即X方向之尺寸相對於步進移動方向亦即Y方向之尺寸較短之長方形狀。對於照明區域IA1~IA6之各個,由後述照明裝置來投射經調整為均勻之照度分布(例如±5%以內之均勻性)的曝光用之照明光。6個照明區域IA1~IA6分別設定於6個部分投影光學系統PL1~PL6之各自之物面側之位置。例如,若於照明區域IA1內出現光罩基板M之圖案部分,則由該圖案部分產生之透射光於稜鏡PMa之上側之反射面上反射而射入部分投影光學系統PL1中。部分投影光學系統PL1將來自圖案部分之透射光(成像光束、曝光用之光束),如圖2所示,透過包含沿著光軸AXa而配置之透鏡系統Ga1、Ga2、Ga3、凹面鏡Ga4之第1成像系統PL1a,而於稜鏡PMa之下側之反射面上反射,藉此,於中間像面IM1上等倍地成像為照明區域IA1之中間像。
[Configuration of projection optical system]
The six illumination areas IA1 to IA6 (refer to FIG. 1) set on the reticle substrate M are respectively set to a rectangular shape having a shorter size in the scanning direction, that is, in the X direction than in the stepwise moving direction, that is, in the Y direction. For each of the illumination areas IA1 to IA6, illumination light for exposure adjusted to a uniform illumination distribution (for example, uniformity within ± 5%) is projected by an illumination device described later. The six illumination areas IA1 to IA6 are respectively set at positions on the respective object surface sides of the six partial projection optical systems PL1 to PL6. For example, if a pattern portion of the mask substrate M appears in the illumination area IA1, the transmitted light generated by the pattern portion is reflected on a reflecting surface on the upper side of the 稜鏡 PMa and enters a part of the projection optical system PL1. Part of the projection optical system PL1 transmits the transmitted light (imaging beam, exposure beam) from the pattern part, as shown in FIG. 2, through the lens system Ga1, Ga2, Ga3, and the concave mirror Ga4, which are arranged along the optical axis AXa. 1 imaging system PL1a reflects on the reflecting surface on the lower side of 稜鏡 PMa, thereby imaging on the intermediate image plane IM1 as an intermediate image of the illumination area IA1 at equal magnification.

於中間像面IM1上,如圖1所示,配置具有使Y方向之兩端邊緣部傾斜之梯形之開口部的視野光闌板FA1。從視野光闌板FA1之開口部中透射之成像光束於稜鏡PMb之上側之反射面上反射,如圖2所示,透過包含沿著光軸AXb而配置之透鏡系統Gb1、Gb2、Gb3、凹面鏡Gb4之第2成像系統PL1b,而於稜鏡PMb之下側之反射面上向板P之方向(-Z方向)反射。藉此,於設定於板P上之梯形之投影區域EA1內,形成於視野光闌板FA1之開口部中之中間像再成像而等倍地成像。部分投影光學系統PL1藉由第1成像系統PL1a及第2成像系統PL1b,將照明區域IA1內之圖案部分之像於投影區域EA1內,以等倍之正立正像之關係而遠心地成像。On the intermediate image plane IM1, as shown in FIG. 1, a field diaphragm plate FA1 having trapezoidal openings inclined at both end edges in the Y direction is arranged. The imaging beam transmitted through the opening of the field diaphragm plate FA1 is reflected on the reflecting surface on the upper side of 稜鏡 PMb. As shown in FIG. 2, it passes through a lens system Gb1, Gb2, Gb3, The second imaging system PL1b of the concave mirror Gb4 reflects on the reflecting surface on the lower side of 稜鏡 PMb in the direction of the plate P (-Z direction). Thereby, in the trapezoidal projection area EA1 set on the plate P, the intermediate image formed in the opening portion of the field diaphragm plate FA1 is re-imaged and imaged at equal magnification. Part of the projection optical system PL1 uses the first imaging system PL1a and the second imaging system PL1b to form an image of a pattern portion in the illumination area IA1 in the projection area EA1, and telecentrically image the relationship of equal orthographic images.

如圖2所示,第1成像系統PL1a係於光瞳面Epa上配置凹面鏡Ga4之反射折射方式之半視野類型之成像系統,第2成像系統PL1b亦為於光瞳面Epb上配置凹面鏡Gb4之反射折射方式之半視野類型之成像系統。光瞳面Epa、Epb光學性地相互成為共軛關係,於光瞳面Epa、Epb之各個形成光源像(2次光源像),其形成於對照明區域IA1進行照明之照明裝置內。又,於部分投影光學系統PL1之成像光路中,於光罩基板M與稜鏡PMa之間設置焦點調整光學構件FC1,其用以將投影於板P上之投影區域EA1中之像之聚焦狀態(焦點狀態)進行微調整。進而,於視野光闌板FA1與稜鏡PMb之間設置像偏移光學構件SC1,其用以將投影於板P上之投影區域EA1之位置,於X方向及Y方向上分別獨立地進行微調整;且於稜鏡PMb與板P之間設置倍率調整光學構件MC1,其用以將投影於投影區域EA1中之圖案部分之像之大小於±數十ppm左右之範圍內進行微調整。關於焦點調整光學構件FC1、像偏移光學構件SC1、倍率調整光學構件MC1,例如揭示於國際公開第2013/094286號小冊子中,因此省略關於構成或功能之詳細說明。As shown in FIG. 2, the first imaging system PL1a is a half-field type imaging system configured with a reflection and refraction method of a concave mirror Ga4 on the pupil plane Epa, and the second imaging system PL1b is also configured with a concave mirror Gb4 on the pupil plane Epb. Half-field type imaging system with reflection and refraction. The pupil surfaces Epa and Epb optically form a conjugate relationship with each other. A light source image (secondary light source image) is formed on each of the pupil surfaces Epa and Epb, and is formed in an illumination device that illuminates the illumination area IA1. In addition, in the imaging optical path of the partial projection optical system PL1, a focus adjustment optical member FC1 is provided between the mask substrate M and 稜鏡 PMa, which is used to focus the image in the projection area EA1 projected on the plate P. (Focus state) Make fine adjustments. Further, an image-shifting optical member SC1 is provided between the field diaphragm plate FA1 and 稜鏡 PMb, and is used to independently position the projection area EA1 projected on the plate P in the X direction and the Y direction, respectively. Adjustment; and a magnification adjustment optical member MC1 is provided between the 稜鏡 PMb and the plate P, which is used to finely adjust the size of the image of the pattern portion projected in the projection area EA1 within a range of about several tens of ppm. The focus adjustment optical member FC1, the image shift optical member SC1, and the magnification adjustment optical member MC1 are disclosed in, for example, International Publication No. 2013/094286, and therefore detailed descriptions of the configuration or function are omitted.

本實施方式中,如圖2所示,部分投影光學系統PL1包括:第1成像系統PL1a、第2成像系統PL1b、稜鏡PMa、PMb、視野光闌板FA1、焦點調整光學構件FC1、像偏移光學構件SC1、以及倍率調整光學構件MC1,其他之部分投影光學系統PL2~PL6亦同樣地構成。因此,其他之部分投影光學系統PL2~PL6亦分別於設定於板P上之梯形之投影區域EA2~EA6之各個,將光罩基板M之圖案部分之像等倍地成像。藉此,若將光罩基板M與板P於X方向上以相同速度來一維移動而進行掃描曝光,則於6個投影區域EA1~EA6之各個,曝光於板P之光感應層上之圖案部分於Y方向上拼接。此外,於不需要特別加以區別之情形時,以上所說明之部分投影光學系統PL1~PL6、照明區域IA1~IA6、投影區域EA1~EA6分別亦稱為部分投影光學系統PLn、照明區域IAn、投影區域EAn(n=1~6)。In this embodiment, as shown in FIG. 2, the partial projection optical system PL1 includes a first imaging system PL1a, a second imaging system PL1b, 稜鏡 PMa, PMb, a field diaphragm plate FA1, a focus adjustment optical member FC1, and image deviation. The shift optical member SC1 and the magnification adjusting optical member MC1 are configured similarly to the other projection optical systems PL2 to PL6. Therefore, the other partial projection optical systems PL2 to PL6 also form images of the pattern portion of the mask substrate M at equal magnifications in each of the trapezoidal projection areas EA2 to EA6 set on the plate P. Therefore, if the photomask substrate M and the plate P are moved one-dimensionally at the same speed in the X direction to perform scanning exposure, each of the six projection areas EA1 to EA6 is exposed on the light-sensing layer of the plate P. The pattern part is spliced in the Y direction. In addition, when no special distinction is required, the partial projection optical systems PL1 to PL6, the illumination areas IA1 to IA6, and the projection areas EA1 to EA6 described above are also referred to as partial projection optical systems PLn, illumination areas IAn, and projection, respectively. Area EAn (n = 1 to 6).

[照明裝置之構成]
圖3係表示用以對設定於光罩基板M上之6個照明區域IA1~IA6之各個投射曝光用照明光之照明裝置之概略性整體構成的立體圖,正交座標系XYZ係設定為與上述圖1、圖2相同。本實施方式之照明裝置中,如日本特開2010-245224號公報所揭示,具備同一規格之3個水銀燈(短電弧型之超高壓水銀放電燈)2A、2B、2C(光源裝置)來作為光源。光源裝置中之燈之個數係以投射於照明區域IAn之各個之照明光成為所需照度值之方式,根據部分投影光學系統PLn之數量決定,但只要為2個以上即可。超高壓水銀放電燈藉由將封入放電管中之水銀之蒸氣壓設為106 Pa(帕斯卡)以上,而產生高亮度的紫外波長區域之明線亦即g射線(波長435.835 nm)、h射線(波長404.656 nm)、i射線(波長365.015 nm)。水銀放電燈2A、2B、2C之各自之發光點(電弧放電部)分別配置於橢圓鏡4A、4B、4C之第1焦點之位置,於橢圓鏡4A、4B、4C各自之內側之反射面上反射之光束BM係朝向橢圓鏡4A、4B、4C各自之第2焦點之位置而聚光(收斂)。
[Configuration of Lighting Device]
FIG. 3 is a perspective view showing a schematic overall configuration of an illumination device for projecting exposure illumination light to each of the six illumination areas IA1 to IA6 set on the mask substrate M. The orthogonal coordinate system XYZ is set to be the same as the above. Figures 1 and 2 are the same. In the lighting device of this embodiment, as disclosed in Japanese Patent Application Laid-Open No. 2010-245224, three mercury lamps (short-arc type ultra-high-pressure mercury discharge lamps) 2A, 2B, and 2C (light source devices) of the same specification are used as light sources. . The number of lamps in the light source device is determined based on the number of partial projection optical systems PLn so that the illumination light projected on each of the illumination areas IAn becomes the required illuminance value, but it is only required to be two or more. Ultra-high-pressure mercury discharge lamps produce g-rays (wavelength 435.835 nm) and h-rays with high brightness in the ultraviolet wavelength region by setting the vapor pressure of mercury enclosed in the discharge tube to 10 6 Pa (Pascal) or higher. (Wavelength 404.656 nm), i-ray (wavelength 365.015 nm). The respective light emitting points (arc discharge parts) of the mercury discharge lamps 2A, 2B, and 2C are respectively arranged at the positions of the first focal points of the elliptical mirrors 4A, 4B, and 4C, and on the reflecting surfaces inside the respective elliptical mirrors 4A, 4B, and 4C The reflected light beam BM is condensed (converged) toward the position of the second focal point of each of the elliptical mirrors 4A, 4B, and 4C.

從橢圓鏡4A、4B、4C分別向-Z方向放射之光束BM係以如下方式來分離:藉由配置於第2焦點之近前之雙色鏡DM,曝光用之紫外波長區域之光譜成分(例如460 nm以下之短波長區域)向+X方向反射,且較其更長之波長區域之光譜成分透射。由雙色鏡DM之各個所反射之曝光用之紫外波長區域之光束係於橢圓鏡4A、4B、4C各自之第2焦點之位置,光束直徑成為最細,於該第2焦點之位置之各個配置轉動式快門5A、5B、5C。從轉動式快門5A、5B、5C之各個通過之曝光用之紫外波長區域之光束分別一面發散一面射入至波長選擇部6A、6B、6C。波長選擇部6A、6B、6C之各個具備複數個透鏡元件及波長選擇用干涉濾光器,僅使所射入之曝光用之紫外波長區域之光束中的所需之明線波長部分透射。設置於波長選擇部6A、6B、6C之各個之干涉濾光器係設置為:可根據應曝光之光罩基板M之圖案之微細度(解析度)、或應對板P之光感應層賦予之曝光量(劑量),而與若干具有不同波長選擇特性者交換(切換)。關於該干涉濾光器之波長選擇特性之差異,後文進行詳細說明,但可將投射於光罩基板M上之照明區域IAn中的曝光用照明光之波長特性(波長分布),切換為適合於以更高解析來進行圖案曝光之特性、以及適合於為了提昇生產性而提高照度來進行圖案曝光之特性。為此,干涉濾光器預先準備具有以下特性者:使g射線(波長435.835 nm)、h射線(波長404.656 nm)、i射線(波長365.015 nm)中之任一個明線波長成分透射之特性;使g射線、h射線、i射線中之連續之2個明線波長成分(g射線+h射線、或者i射線+h射線)透射之特性;或者使g射線、h射線、i射線之全部明線波長成分透射之特性等。The light beams BM emitted from the elliptical mirrors 4A, 4B, and 4C in the -Z direction are separated in the following manner: With the dichroic mirror DM disposed immediately before the second focus, the spectral component of the ultraviolet wavelength region for exposure (for example, 460) The short wavelength region below nm) reflects in the + X direction, and the spectral components of the longer wavelength region are transmitted. The light beams in the ultraviolet wavelength range for the exposure reflected by each of the dichroic mirrors DM are at the positions of the second focal points of the elliptical mirrors 4A, 4B, and 4C, and the beam diameter becomes the thinnest. Rotary shutters 5A, 5B, 5C. The light beams in the ultraviolet wavelength range for exposure through which each of the rotating shutters 5A, 5B, and 5C pass are diverged and incident on the wavelength selection sections 6A, 6B, and 6C, respectively. Each of the wavelength selection sections 6A, 6B, and 6C is provided with a plurality of lens elements and a wavelength selection interference filter, and transmits only a required bright-line wavelength portion of the light beam in the ultraviolet wavelength region for exposure. Each of the interference filters provided in the wavelength selection sections 6A, 6B, and 6C can be set according to the fineness (resolution) of the pattern of the reticle substrate M to be exposed, or can be given to the light sensing layer of the plate P. Exposure (dose), and exchange (switch) with several people with different wavelength selection characteristics. The difference in the wavelength selection characteristics of the interference filter will be described in detail later, but the wavelength characteristics (wavelength distribution) of the exposure illumination light projected in the illumination area IAn on the mask substrate M can be switched to be suitable Characteristics for pattern exposure with higher resolution and characteristics suitable for pattern exposure with increased illuminance in order to improve productivity. For this reason, the interference filter is prepared in advance to have the following characteristics: the characteristic of transmitting any bright-line wavelength component of g-rays (wavelength 435.835 nm), h-rays (wavelength 404.656 nm), and i-rays (wavelength 365.015 nm); Characteristics of transmitting two consecutive bright-line wavelength components (g-ray + h-ray, or i-ray + h-ray) among g-ray, h-ray, and i-ray; or all bright-line wavelengths of g-ray, h-ray, and i-ray Characteristics of component transmission.

從波長選擇部6A、6B、6C之各個射出之光束射入至倍率可變部8A、8B、8C中,該倍率可變部8A、8B、8C係用以將對後段之光分配部10之入射側之3個光纖束(光導纖維、光傳輸元件)12A、12B、12C之各個射入之照明光束BMa、BMb、BMc之數值孔徑(主光線之最大傾斜角)或者直徑方向之尺寸(直徑)進行調整。倍率可變部8A、8B、8C之各個具備複數個透鏡元件,其係為了可將射入至光纖束12A、12B、12C之各個之照明光束BMa、BMb、BMc之數值孔徑(NA)於一定範圍內連續調整,而可於光軸方向上移動。藉由倍率可變部8A、8B、8C之各個,結果可將分布於圖2所示之部分投影光學系統PLn之各個光瞳面Epa、Epb上之光源像(2次光源像)的從光軸AXa、AXb起之半徑尺寸連續地改變。即,倍率可變部8A、8B、8C之各個可於將部分投影光學系統PLn之最大數值孔徑設為NAp,對照明區域IAn投射之照明光束之數值孔徑設為NAi時,對由作為數值孔徑之比的NAi/NAp所決定之照明σ值(0<σ≦1)進行調整。因此,倍率可變部8A、8B、8C之各個亦稱為可將照明σ值(照明光束之數值孔徑NPi)連續調整之數值孔徑可變部。此外,圖3所示之從橢圓鏡4A至倍率可變部8A之構成、從橢圓鏡4B至倍率可變部8B之構成、以及從橢圓鏡4C至倍率可變部8C之構成之各個亦統稱為第1照明光學系統,其功能之詳情如後。The light beams emitted from each of the wavelength selection sections 6A, 6B, and 6C are incident on the variable magnification sections 8A, 8B, and 8C. The variable magnification sections 8A, 8B, and 8C are used to divide the light distribution section 10 to the subsequent stage. Numerical aperture (maximum inclination angle of the main light) or diameter (diameter of the main light rays) of the three illumination fiber beams (optical fibers, light transmission elements) 12A, 12B, and 12C on the incident side ) Make adjustments. Each of the variable magnification sections 8A, 8B, and 8C is provided with a plurality of lens elements. The numerical apertures (NA) of the illumination beams BMa, BMb, and Bmc that are incident on each of the optical fiber bundles 12A, 12B, and 12C are constant. Continuous adjustment within the range, but can move in the direction of the optical axis. With each of the variable magnification units 8A, 8B, and 8C, as a result, the light from the light source images (secondary light source images) distributed on the pupil surfaces Epa and Epb of the partial projection optical system PLn shown in FIG. 2 can be obtained. The radial dimensions from the axes AXa and AXb are continuously changed. That is, each of the variable magnification units 8A, 8B, and 8C can set the maximum numerical aperture of the partial projection optical system PLn to NAp, and set the numerical aperture of the illumination beam projected to the illumination area IAn to NAi. The lighting σ value (0 <σ ≦ 1) determined by the ratio of NAi / NAp is adjusted. Therefore, each of the variable magnification sections 8A, 8B, and 8C is also referred to as a numerical aperture variable section capable of continuously adjusting the illumination σ value (the numerical aperture NPi of the illumination beam). In addition, the structures from the elliptical mirror 4A to the variable magnification unit 8A shown in FIG. 3, the structures from the elliptical mirror 4B to the variable magnification unit 8B, and the structures from the elliptical mirror 4C to the variable magnification unit 8C are also collectively referred to. This is the first illumination optical system. Details of its functions are as follows.

光分配部10係以將從3個入射側之光纖束12A、12B、12C之各個所射入之照明光束BMa、BMb、BMc,分配於與6個照明區域IAn之各個對應而配置之第2照明光學系統IL1~IL6之各個之方式,分成6個出射側之光纖束FG1~FG6。第2照明光學系統IL1~IL6之各個係將光纖束FG1~FG6之射出端作為光源像(多數個點光源聚集而成之2次光源像),而各照明區域IAn進行柯勒照明。此外,於不需要特別加以區別之情形時,以上所說明之第2照明光學系統IL1~IL6、光纖束FG1~FG6之各個亦稱為第2照明光學系統ILn、光纖束FGn(n=1~6)。The light distribution unit 10 is the second one arranged so that the illumination light beams BMa, BMb, and Bmc, which are incident from each of the three incident side optical fiber bundles 12A, 12B, and 12C, are allocated to correspond to each of the six illumination areas IAn. Each method of the illumination optical systems IL1 to IL6 is divided into six light emitting fiber bundles FG1 to FG6. Each of the second illumination optical systems IL1 to IL6 uses the emitting ends of the optical fiber bundles FG1 to FG6 as light source images (secondary light source images formed by a plurality of point light sources), and each illumination area IAn performs Kohler illumination. In addition, when no special distinction is required, each of the second illumination optical systems IL1 to IL6 and the optical fiber bundles FG1 to FG6 described above is also referred to as the second illumination optical system ILn and the optical fiber bundle FGn (n = 1 to 6).

[第1照明光學系統]
圖4係表示配置於從圖3所示之水銀燈2A至入射側之光纖束12A為止之光路上之第1照明光學系統之詳細構成的立體圖,正交座標系XYZ係設定為與上述圖1~圖3相同。又,從水銀燈2B至入射側之光纖束12B為止之第1照明光學系統、與從水銀燈2C至入射側之光纖束12C為止之第1照明光學系統亦成為與圖4相同之構成。如圖4所示,從橢圓鏡4A之射出開口(-Z方向之端部)中沿著光軸AX1而射出後即刻之光束BM係藉由橢圓鏡4A之上側(+Z方向)之開口部及水銀燈2A之下側電極部,而成為以光軸AX1為中心之環帶狀強度分布,即,中心部之照度極低之中空狀態之分布。光束BM係朝向轉動式快門5A之旋轉葉片所配置的橢圓鏡4A之第2焦點之位置PS1而聚光,但由於水銀燈2A之電極間所產生之電弧放電部細長地分布於光軸AX1之方向上,故而於位置PS1上未聚光為點狀,而成為具有有限大小(直徑)之光束腰。
[First illumination optical system]
FIG. 4 is a perspective view showing the detailed structure of the first illumination optical system arranged on the optical path from the mercury lamp 2A to the incident side fiber bundle 12A shown in FIG. 3, and the orthogonal coordinate system XYZ system is set to be the same as those in FIGS. Figure 3 is the same. The first illumination optical system from the mercury lamp 2B to the incident fiber bundle 12B and the first illumination optical system from the mercury lamp 2C to the incident fiber bundle 12C also have the same configuration as that shown in FIG. 4. As shown in FIG. 4, the light beam BM immediately after exiting from the exit opening (end in the -Z direction) of the elliptical mirror 4A along the optical axis AX1 passes through the opening on the upper side (+ Z direction) of the elliptical mirror 4A. And the lower electrode part of the mercury lamp 2A, it has a ring-shaped intensity distribution centered on the optical axis AX1, that is, a hollow state distribution with extremely low illuminance at the center part. The light beam BM is focused toward the position PS1 of the second focal point of the elliptical mirror 4A arranged on the rotating blade of the rotary shutter 5A, but the arc discharge portion generated between the electrodes of the mercury lamp 2A is elongated in the direction of the optical axis AX1 Therefore, the unfocused light at the position PS1 is spot-shaped and becomes a beam waist with a limited size (diameter).

於波長選擇部6A上設置有:透鏡系統(準直透鏡)6A1,其將從第2焦點之位置PS1發散而行進之光束BM射入而轉換為大致平行之光束;滑動機構FX,其保持具有相互不同之波長選擇特性之2片干涉濾光器(波長選擇構件、波長選擇元件、帶通濾光器)SWa、SWb,且將該干涉濾光器SWa、SWb中之任一者以於光路中插拔之方式進行切換;以及透鏡系統6A2,其將從干涉濾光器SWa、SWb中之任一者中透射之光束BMa聚光(收斂)於焦點位置PS2(與位置PS1光學性共軛之位置)上。滑動機構FX具有干涉濾光器SWa、SWb分別容易卸除或安裝之構成。於利用具有與干涉濾光器SWa、SWb中之任一者均不同之波長選擇特性之第3干涉濾光器(波長選擇構件、波長選擇元件、帶通濾光器)時,只要於由轉動式快門5A遮蔽來自水銀燈2A之光束BM的狀態下,從滑動機構FX上卸除干涉濾光器SWa、SWb中之任一者,且代替其而安裝第3干涉濾光器即可。此外,於不設置滑動機構之情形時,安裝可將干涉濾光器SWa、SWb等簡單地拆裝之安裝機構。The wavelength selection section 6A is provided with a lens system (collimation lens) 6A1 that enters a light beam BM diverging and traveling from the position PS1 of the second focal point and converts it into a substantially parallel light beam; a sliding mechanism FX that holds Two interference filters (wavelength selection member, wavelength selection element, band-pass filter) SWa, SWb with mutually different wavelength selection characteristics, and one of the interference filters SWa, SWb is applied to the optical path Switching between the middle and pluggable methods; and the lens system 6A2, which condenses (converges) the light beam BMa transmitted from any of the interference filters SWa, SWb at the focal position PS2 (optically conjugated to the position PS1) Position). The slide mechanism FX has a configuration in which the interference filters SWa and SWb are easily removed or attached, respectively. When using a third interference filter (wavelength selection member, wavelength selection element, bandpass filter) having a wavelength selection characteristic different from that of any of the interference filters SWa, SWb, it is only necessary to rotate In a state where the shutter 5A blocks the light beam BM from the mercury lamp 2A, any one of the interference filters SWa and SWb may be removed from the slide mechanism FX, and a third interference filter may be installed instead. In addition, when a sliding mechanism is not provided, a mounting mechanism that can easily detach the interference filters SWa, SWb and the like is mounted.

從波長選擇部6A中射出之光束BMa於焦點位置PS2上成為光束腰後,以發散之狀態射入至倍率可變部8A中。於焦點位置PS2上,形成由水銀燈2A之電弧放電部(發光點)之模糊像所引起之圓形光源像。倍率可變部8A具有可將沿著光軸AX1之位置進行調整之2個透鏡系統8A1、8A2。藉由透鏡系統8A1、8A2,從焦點位置PS2發散而行進之光束BMa係以既定之光束直徑、或者既定之數值孔徑來投射,而聚光於入射側之光纖束12A之入射端FBi上。光纖束12A之入射端FBi基本上係以與焦點位置PS2光學性地成為共軛關係之方式來配置,但亦可藉由倍率可變部8A之透鏡系統8A1、8A2之位置調整,刻意地解除其共軛關係。2個透鏡系統8A1、8A2作為變倍中繼系統而發揮功能,隨著照明光束BMa之數值孔徑之變化,結果,聚光於光纖束12A之入射端FBi上之光束BMa之直徑相對於入射端FBi之有效最大直徑而變小或變大。The light beam BMa emitted from the wavelength selection section 6A becomes a beam waist at the focal position PS2, and then enters the variable magnification section 8A in a divergent state. At the focus position PS2, a circular light source image caused by a blurred image of the arc discharge portion (light emitting point) of the mercury lamp 2A is formed. The magnification variable section 8A includes two lens systems 8A1 and 8A2 that can adjust the position along the optical axis AX1. With the lens systems 8A1 and 8A2, the light beam BMa diverging and traveling from the focal position PS2 is projected with a predetermined beam diameter or a predetermined numerical aperture, and is focused on the incident end FBi of the fiber bundle 12A on the incident side. The incident end FBi of the fiber bundle 12A is basically arranged so as to be optically conjugated to the focal position PS2, but it can also be deliberately released by adjusting the position of the lens systems 8A1 and 8A2 of the variable magnification section 8A. Its conjugate relationship. The two lens systems 8A1 and 8A2 function as a variable magnification relay system. As the numerical aperture of the illumination beam BMa changes, as a result, the diameter of the beam BMa on the incident end FBi of the optical fiber bundle 12A is relative to the incident end. The effective maximum diameter of FBi becomes smaller or larger.

[藉由干涉濾光器之波長選擇]
此處,參照圖5~圖8,對藉由可安裝於波長選擇部6A之滑動機構FX上之干涉濾光器來進行的波長選擇之一例進行說明。圖5係示意性表示藉由水銀燈(超高壓水銀放電燈)之電弧放電而產生之光束BM之波長特性(光譜分布)之一例的圖表。又,圖6係示意性表示藉由i射線-窄頻帶干涉濾光器SWa,從圖5之光譜分布中選擇抽出包含i射線之窄波長寬度之光之狀態的圖表,圖7係示意性表示藉由i射線-寬頻帶干涉濾光器SWb,從圖5之光譜分布中選擇抽出包含i射線及其底部附近之低亮度部分的比較廣之波長寬度之光之狀態的圖表,而且,圖8係示意性表示藉由i射線+h射線-干涉濾光器SWc(第3干涉濾光器),從圖5之光譜分布中選擇抽出包含i射線及h射線之兩者之廣波長寬度之光之狀態的圖表。圖5~圖8中之任一圖表均為橫軸表示波長(nm),且縱軸表示相對強度(%)。此外,圖5(以及圖6~圖8)中所示之來自超高壓水銀放電燈之光束BM之波長特性(光譜分布)中,作為主要明線之g射線、h射線、i射線、j射線各自之波峰狀光譜部分係作為利用波長解析度不太高之分光器來測量之情形時之波長寬度而圖示,實際之波峰狀光譜部分之波長寬度於以半高寬(成為波峰強度之一半之強度之寬度)來規定之情形時,為數nm~十幾nm左右。
[Wavelength selection by interference filter]
Here, an example of wavelength selection by an interference filter that can be mounted on the sliding mechanism FX of the wavelength selection section 6A will be described with reference to FIGS. 5 to 8. FIG. 5 is a graph schematically showing an example of a wavelength characteristic (spectral distribution) of a light beam BM generated by arc discharge of a mercury lamp (ultra-high-pressure mercury discharge lamp). 6 is a diagram schematically showing a state in which light with a narrow wavelength width including i-rays is selected from the spectral distribution of FIG. 5 by the i-ray-narrow-band interference filter SWa. FIG. 7 is a diagram schematically showing The i-ray-broadband interference filter SWb is used to select a graph from the spectral distribution of FIG. 5 for extracting a relatively wide-wavelength light state including the i-ray and the low-luminance portion near the bottom thereof, and FIG. 8 Schematic representation of i-ray + h-ray-interference filter SWc (third interference filter) is used to extract light with a wide wavelength width including both i-ray and h-ray from the spectral distribution of FIG. 5 Status chart. In any of the graphs in FIGS. 5 to 8, the horizontal axis represents the wavelength (nm), and the vertical axis represents the relative intensity (%). In addition, in the wavelength characteristics (spectral distribution) of the light beam BM from the ultrahigh-pressure mercury discharge lamp shown in FIG. 5 (and FIGS. 6 to 8), the g-rays, h-rays, i-rays, and j-rays are the main bright lines. The respective peak-shaped spectral portions are shown as the wavelength widths when measured using a spectroscope with a wavelength resolution that is not too high. The actual wavelength-width of the peak-shaped spectral portions is at half-height width (which becomes half of the peak intensity). When the width of the intensity is specified, it is about several nm to about ten nm.

本實施方式中,如圖6~圖8所示,準備3種干涉濾光器SWa、SWb、SWc。i射線-窄頻帶干涉濾光器SWa係如圖6所示,具有如下之波長選擇特性:於波長為約354 nm~約380 nm之間,透射率成為10%以上;且於波長為約359 nm~約377 nm之間,透射率成為90%以上。因此,由i射線-窄頻帶干涉濾光器SWa所選擇之波長寬度之半高寬包含i射線之明線波長(365.015 nm)而成為約22 nm。又,i射線-寬頻帶干涉濾光器SWb係如圖7所示,具有如下之波長選擇特性:於波長為約344 nm~約398 nm之間,透射率成為10%以上;且於波長為約350 nm~約395 nm之間,透射率成為90%以上。因此,由i射線-寬頻帶干涉濾光器SWb所選擇之波長寬度之半高寬包含i射線之明線波長(365.015 nm)而成為約49 nm。i射線-窄頻帶干涉濾光器SWa與i射線-寬頻帶干涉濾光器SWb均僅選擇i射線之明線波長帶而作為曝光用照明光,但由於i射線-窄頻帶干涉濾光器SWa之波長選擇之帶寬狹窄,故而圖6中之斜線部所表示之i射線(窄)之單色性較由i射線-寬頻帶干涉濾光器SWb所選擇之圖7中之斜線部所表示之i射線(寬)而言變得良好,由部分投影光學系統PLn之色差特性所引起之影響降低,可進行更高解析之圖案曝光。In this embodiment, as shown in FIGS. 6 to 8, three types of interference filters SWa, SWb, and SWc are prepared. The i-ray-narrow-band interference filter SWa is shown in FIG. 6 and has the following wavelength selection characteristics: at a wavelength of about 354 nm to about 380 nm, the transmittance becomes more than 10%; and at a wavelength of about 359 Between nm and about 377 nm, the transmittance is more than 90%. Therefore, the full width at half maximum of the wavelength width selected by the i-ray-narrow-band interference filter SWa includes the bright-line wavelength (365.015 nm) of the i-ray and becomes approximately 22 nm. In addition, as shown in FIG. 7, the i-broadband interference filter SWb has the following wavelength selection characteristics: the transmittance becomes more than 10% at a wavelength of about 344 nm to about 398 nm; Between about 350 nm and about 395 nm, the transmittance is more than 90%. Therefore, the full width at half maximum of the wavelength width selected by the i-ray-broadband interference filter SWb includes the bright line wavelength (365.015 nm) of the i-ray and becomes approximately 49 nm. Both the i-ray-narrow-band interference filter SWa and the i-ray-broadband interference filter SWb only select the bright-line wavelength band of the i-ray as the illumination light for exposure, but the i-ray-narrow-band interference filter SWa The bandwidth of the wavelength selection is narrow, so the monochromaticity of the i-ray (narrow) indicated by the oblique line portion in FIG. 6 is more than that indicated by the oblique line portion in FIG. 7 selected by the i-ray-broadband interference filter SWb. The i-ray (wide) becomes good, the influence caused by the chromatic aberration characteristic of the partial projection optical system PLn is reduced, and pattern analysis with higher resolution can be performed.

然而,與由i射線-寬頻帶干涉濾光器SWb所獲得之i射線(寬)之光量(圖7中之斜線部之面積)相比,由i射線-窄頻帶干涉濾光器SWa所獲得之i射線(窄)之光量(圖6中之斜線部之面積)小,因此必須使掃描曝光時之光罩基板M與板P之移動速度略微下降,導致生產性之下降。與此相對,由i射線-寬頻帶干涉濾光器SWb所獲得之i射線(寬)包含從i射線之明線波長(365.015 nm)至位於長波長側之旁邊的h射線為止之間的低亮度之底部附近部分、以及至位於短波長側之旁邊的比較強之波峰波長為止之間的低亮度之底部附近部分之光譜成分,故而可一面進行高解析之圖案曝光,一面可使光量增大數%以上,可提高生產性。利用i射線-寬頻帶干涉濾光器SWb的波長選擇之帶寬(以半高寬計,約49 nm)係由基於部分投影光學系統PLn之色差特性而求出之最小線寬之圖案投影像之對比值決定。部分投影光學系統PLn之色差中存在倍率(橫)色差及軸上(縱)色差,例如於僅專用於i射線之明線波長之投影光學系統中,修正為具有如下傾向(二次函數之傾向)之色差特性:色差量於i射線之明線波長處大致成為零,於較其而言之短波長側及長波長側,像差量增大。又,於容許使用i射線及h射線之2個明線波長之投影光學系統中,修正為如下傾向之色差特性:於i射線與h射線之大致中間之波長處使色差量大致為零,且於i射線與h射線之各明線波長之間減小色差量之變化率。However, compared with the i-ray (wide) light amount (area of the oblique line in FIG. 7) obtained by the i-ray-broadband interference filter SWb, the i-ray-narrow-band interference filter SWa The light amount of the i-ray (narrow) (the area of the oblique line in FIG. 6) is small. Therefore, it is necessary to slightly reduce the moving speed of the mask substrate M and the plate P during scanning exposure, resulting in a decrease in productivity. In contrast, the i-ray (wide) obtained by the i-ray-broadband interference filter SWb includes a low value from the bright-line wavelength (365.015 nm) of the i-ray to the h-ray located beside the long-wavelength side. The spectral components near the bottom of the brightness and the low-brightness near the bottom of the relatively strong peak wavelength near the short wavelength side, so that high-resolution pattern exposure can be performed while increasing the amount of light A few percent or more can improve productivity. The bandwidth selected by the wavelength of the i-broadband interference filter SWb (in terms of FWHM, approximately 49 nm) is the minimum line width of the pattern projection image obtained based on the chromatic aberration characteristics of the partial projection optical system PLn The contrast value is determined. The chromatic aberrations of some projection optical systems PLn include magnification (horizontal) chromatic aberration and on-axis (vertical) chromatic aberration. For example, in a projection optical system dedicated to only the bright-line wavelength of i-rays, it is corrected to have the following tendency (the tendency of a quadratic function) The chromatic aberration characteristic: the amount of chromatic aberration becomes approximately zero at the bright-line wavelength of the i-ray, and the amount of aberration increases at the short-wavelength side and the long-wavelength side more than that. Furthermore, in a projection optical system that allows the use of two bright-line wavelengths of i-rays and h-rays, the chromatic aberration characteristic is corrected to have a color difference amount of approximately zero at a wavelength approximately between the i-rays and the h-rays, and Reduce the rate of change of the amount of chromatic aberration between the bright-line wavelengths of the i-ray and the h-ray.

於使用i射線及h射線之2個明線波長之情形時,將i射線+h射線-干涉濾光器SWc安裝於滑動機構FX上,且使用圖8中之斜線部所示之光譜分布之光i射線+h射線。i射線+h射線-干涉濾光器SWc係如圖8所示,具有如下之波長選擇特性:於波長為約344 nm~約420 nm之間,透射率成為10%以上;且於波長為約350 nm~約415 nm之間,透射率成為90%以上。因此,由i射線+h射線-干涉濾光器SWc所選擇之波長寬度之半高寬包含i射線之明線波長(365.015 nm)及h射線之明線波長(404.656 nm)而成為約70 nm。於使用i射線及h射線之2個明線波長之圖案曝光中,與僅使用i射線之圖案曝光相比,可解析之最小線寬變大,但由i射線+h射線-干涉濾光器SWc所獲得之i射線+h射線之光量(圖8中之斜線部之面積)若與圖6之i射線-窄頻帶干涉濾光器SWa或圖7之i射線-寬頻帶干涉濾光器SWb之情形相比,則壓倒性地增大,生產性飛躍提高。因此,於投影曝光於板P之光感應層上的光罩基板M之圖案中,不包含微細度高之臨界線寬之圖案之情形時,藉由使用i射線+h射線-干涉濾光器SWc,可進行生產性高之圖案曝光。When two bright-line wavelengths of i-ray and h-ray are used, the i-ray + h-ray-interference filter SWc is mounted on the sliding mechanism FX, and the light with the spectral distribution shown by the oblique line portion in FIG. 8 is used i-ray + h-ray. The i-ray + h-ray-interference filter SWc is shown in FIG. 8 and has the following wavelength selection characteristics: the transmittance becomes more than 10% at a wavelength of about 344 nm to about 420 nm; and the wavelength is about 350 Between nm and about 415 nm, the transmittance is more than 90%. Therefore, the full width at half maximum of the wavelength width selected by the i-ray + h-ray-interference filter SWc includes the bright-line wavelength (365.015 nm) of the i-ray and the bright-line wavelength (404.656 nm) of the h-ray and becomes approximately 70 nm. In pattern exposure using two bright-line wavelengths of i-ray and h-ray, compared with pattern exposure using only i-ray, the smallest resolvable line width becomes larger, but i-ray + h-ray-interference filter SWc If the obtained i-ray + h-ray light amount (area of the oblique line in FIG. 8) is the same as that of the i-ray-narrowband interference filter SWa of FIG. 6 or the i-ray-broadband interference filter SWb of FIG. 7 Compared with this, it is overwhelmingly increased, and productivity is greatly improved. Therefore, when the pattern of the photomask substrate M which is projected and exposed on the light-sensing layer of the plate P does not include a pattern with a critical line width of high fineness, the i-ray + h-ray-interference filter SWc is used. , Can be pattern exposure with high productivity.

[光分配部10]
圖9係示意性表示設置於圖3所示之照明裝置中之作為光分配部10之光纖束之整體構成、入射側之光纖束12A、12B、12C各自之入射端FBi之形狀、及出射側之光纖束FG1~FG6各自之射出端FBo之形狀的立體圖,正交座標系XYZ係設定為與圖3相同。入射側之光纖束12A、12B、12C各自之入射端FBi係將多數個光纖線聚集而成型為端面整體之直徑成為數十mm以上之圓形。光纖束12A、12B、12C各自之多數個光纖線係於光分配部10內之線分配部10a中,以6個光纖束FG1~FG6分別包含大致均等之線數之方式分開。光纖束FG1~FG6各自之射出端FBo之形狀係將多數個光纖線聚集而成型為與光罩基板M上之照明區域IAn之形狀相似之長方形。1個光纖束FGn係以包含大致相同數量之由入射側之光纖束12A、12B、12C分別而來之光纖線之方式來聚集。例如,於光纖束12A、12B、12C分別將12萬根之光纖線聚集而構成之情形(總計為36萬根)時,1個光纖束FGn係將6萬根之光纖線聚集而構成。光纖束FGn之6萬根之光纖線中,約每2萬根係由從入射側之光纖束12A、12B、12C分別而來之光纖線所構成。此外,1根光纖線係外形(包層)之直徑為0.2 mm左右之石英光纖。
[Light distribution section 10]
FIG. 9 schematically shows the overall configuration of the optical fiber bundle as the light distribution section 10 provided in the lighting device shown in FIG. 3, the shape of the entrance end FBi of each of the optical fiber bundles 12A, 12B, and 12C on the entrance side, and the exit side. The perspective view of the shape of each of the exit ends FBo of the optical fiber bundles FG1 to FG6 is set to the same coordinate system XYZ as in FIG. 3. The incident ends FBi of the optical fiber bundles 12A, 12B, and 12C on the incident side are formed by concentrating a plurality of optical fiber wires into a circular shape with a diameter of the entire end face of tens of mm or more. The plurality of optical fiber wires of each of the optical fiber bundles 12A, 12B, and 12C are connected to the wire distribution unit 10a in the optical distribution unit 10, and are divided so that the six optical fiber bundles FG1 to FG6 each include a substantially equal number of lines. The shape of each of the exit ends FBo of the optical fiber bundles FG1 to FG6 is formed by concentrating a plurality of optical fiber wires into a rectangular shape similar to the shape of the illumination area IAn on the mask substrate M. One optical fiber bundle FGn is gathered so as to include approximately the same number of optical fiber wires from the incident side optical fiber bundles 12A, 12B, and 12C, respectively. For example, in the case where the optical fiber bundles 12A, 12B, and 12C are formed by collecting 120,000 optical fiber wires (a total of 360,000 fibers), one optical fiber bundle FGn is formed by collecting 60,000 optical fiber wires. Approximately every 20,000 of the 60,000 optical fibers of the optical fiber bundle FGn are composed of the optical fibers from the optical fiber bundles 12A, 12B, and 12C on the incident side. In addition, one optical fiber line is a quartz fiber with an outer diameter (cladding) of about 0.2 mm.

光纖線係於將照射至入射端之光束之數值孔徑(收斂角或發散角)加以維持之狀態下,從射出端射出光束。因此,照射至光纖束12A之入射端FBi上之照明光束BMa從光纖束FGn之射出端FBo中成為照明光束BSa而射出時之數值孔徑(收斂角或發散角)係成為與照明光束BMa之數值孔徑相同,照射至光纖束12B之入射端FBi上之照明光束BMb從光纖束FGn之射出端FBo中成為照明光束BSb而射出時之數值孔徑(收斂角或發散角)係成為與照明光束BMb之數值孔徑相同,照射至光纖束12C之入射端FBi上之照明光束BMc從光纖束FGn之射出端FBo中成為照明光束BSc而射出時之數值孔徑(收斂角或發散角)係成為與照明光束BMc之數值孔徑相同。因此,於將照射至光纖束12A、12B、12C各自之入射端FBi上之照明光束BMa、BMb、BMc之各數值孔徑(收斂角)設為NAia、NAib、NAic,且以成為NAia=NAib=NAic之方式,將圖3(圖4)所示之倍率可變部8A、8B、8C分別進行調整之情形時,從各光纖束FGn之射出端FBo中射出之照明光束BSa、BSb、BSc之各數值孔徑(發散角)彼此成為相同。於以照明光束BMa、BMb、BMc之各數值孔徑(收斂角)NAia、NAib、NAic成為彼此不同之方式,對倍率可變部8A、8B、8C分別進行調整之情形時,從各光纖束FGn之射出端FBo中射出之照明光束BSa、BSb、BSc之各數值孔徑(發散角)成為彼此不同之值。An optical fiber line emits a light beam from an emitting end while maintaining a numerical aperture (convergence angle or divergence angle) of a light beam irradiated to an incident end. Therefore, the numerical aperture (convergence angle or divergence angle) when the illumination beam BMa irradiated on the incident end FBi of the fiber bundle 12A becomes the illumination beam BSa from the exit end FBo of the fiber bundle FGn is equal to the numerical value of the illumination beam BMa The aperture is the same. The numerical aperture (convergence angle or divergence angle) when the illumination beam BMb irradiated on the incident end FBi of the fiber bundle 12B becomes the illumination beam BSb from the exit end FBo of the fiber bundle FGn is the same as the illumination beam BMb. The numerical aperture is the same, and the numerical aperture (convergence angle or divergence angle) when the illumination beam Bmc irradiated onto the incident end FBi of the fiber bundle 12C becomes the illumination beam BSc from the exit end FBo of the fiber bundle FGn is the same as the illumination beam Bmc The numerical aperture is the same. Therefore, the numerical apertures (convergence angles) of the illumination light beams BMa, BMb, and Bmc irradiated on the respective incident ends FBi of the optical fiber bundles 12A, 12B, and 12C are set to NAia, NAib, and NAic, and NAia = NAib = In the NAic method, when the variable magnification units 8A, 8B, and 8C shown in Fig. 3 (Fig. 4) are adjusted separately, the illumination beams BSa, BSb, and BSc emitted from the exit end FBo of each fiber bundle FGn are adjusted. Each numerical aperture (divergence angle) becomes the same as each other. When the numerical apertures (convergence angles) NAia, NAib, and NAic of the illumination light beams BMa, BMb, and Bmc are different from each other, and the magnification variable sections 8A, 8B, and 8C are adjusted separately, from each fiber bundle FGn The numerical apertures (divergence angles) of the illumination beams BSa, BSb, and BSc emitted from the emitting end FBo become different values from each other.

[第2照明光學系統ILn]
圖10係示意性表示將由圖3(圖9)所示之6個光纖束FGn(FG1~FG6)之各自之射出端FBo而來之照明光束(BSa、BSb、BSc),照射至光罩基板M上之各照明區域IAn中之第2照明光學系統ILn(IL1~IL6)之構成的立體圖,正交座標系XYZ設定為與圖3或圖9相同。第2照明光學系統ILn具備:第1電容器透鏡系統CFn(CF1~CF6),其為了將形成於光纖束FGn之射出端FBo上之多數個點光源像作為柯勒照明之光源像,而以前側焦點之位置與射出端FBo一致之方式來配置;複眼透鏡系統FEn(FE1~FE6),其於電容器透鏡系統CFn之後側焦點之位置設定入射面poi;以及第2電容器透鏡系統CPn(CP1~CP6),其為了將形成於複眼透鏡系統FEn之射出面epi上之光源像(2次光源像)作為柯勒照明之光源像,而將前側焦點之位置設定於複眼透鏡系統FEn之射出面epi上,且於後側之焦點之位置設定照明區域IAn(IA1~IA6)。
[Second illumination optical system ILn]
FIG. 10 is a schematic view showing that the illumination light beams (BSa, BSb, BSc) from the respective emitting ends FBo of the six fiber bundles FGn (FG1 to FG6) shown in FIG. 3 (FIG. 9) are irradiated onto the mask substrate In the perspective view of the configuration of the second illumination optical system ILn (IL1 to IL6) in each illumination area IAn on M, the orthogonal coordinate system XYZ is set to be the same as FIG. 3 or FIG. 9. The second illumination optical system ILn includes a first capacitor lens system CFn (CF1 to CF6), which uses a front side in order to use a plurality of point light source images formed on the exit end FBo of the fiber bundle FGn as the light source images of the Kohler illumination. The position of the focal point is configured in a manner consistent with the output end FBo; the fly-eye lens system FEn (FE1 to FE6) sets the incident surface poi at the position of the focal point behind the capacitor lens system CFn; and the second capacitor lens system CPn (CP1 to CP6 ), In order to set the light source image (secondary light source image) formed on the exit surface epi of the fly-eye lens system FEn as the light source image of Kohler illumination, the position of the front focus is set on the exit surface epi of the fly-eye lens system FEn. The illumination area IAn (IA1 to IA6) is set at the position of the focal point on the rear side.

電容器透鏡系統CFn與電容器透鏡系統CPn係沿著與Z軸平行之光軸AX2而配置,光軸AX2係以從光纖束FGn之長方形之射出端FBo之幾何學中心點、以及複眼透鏡系統FEn之XY面內之幾何學中心點通過之方式設定。複眼透鏡系統FEn係以於XY面內看時,與長方形之照明區域IAn成為相似形狀之方式,將具有以Y方向作為長邊、以X方向作為短邊之長方形之剖面的透鏡元件Le之複數個,以於X方向及Y方向上堆砌之方式接合而構成。於透鏡元件Le之入射面poi側及射出面epi側,分別形成有具有既定之焦點距離之凸面(球面透鏡)。又,複眼透鏡系統FEn之射出面epi成為第2照明光學系統ILn之照明光瞳之位置,複眼透鏡系統FEn之XY面內之整體之外形範圍係以大致包含照明光瞳(圓形)之直徑的方式設定。The capacitor lens system CFn and the capacitor lens system CPn are arranged along an optical axis AX2 parallel to the Z axis. The optical axis AX2 is a geometric center point of the FBo from the rectangular exit end of the fiber bundle FGn, and the fly eye lens system FEn The geometric center point in the XY plane is set by the way. The fly-eye lens system FEn is a plural number of lens elements Le having a rectangular cross-section with the Y direction as the long side and the X direction as the short side when viewed in the XY plane. Each is constructed by joining together in the X direction and the Y direction. A convex surface (spherical lens) having a predetermined focal distance is formed on the incident surface poi side and the exit surface epi side of the lens element Le, respectively. In addition, the exit surface epi of the fly-eye lens system FEn becomes the position of the illumination pupil of the second illumination optical system ILn, and the overall outer shape range in the XY plane of the fly-eye lens system FEn is to include the diameter of the illumination pupil (circular). Way to set.

進而,複眼透鏡系統FEn之射出面epi係設定為與光纖束FGn之射出端FBo光學性共軛之關係(成像關係),複眼透鏡系統FEn之入射面poi係設定為與照明區域IAn(光罩基板M之圖案面)光學性共軛之關係(成像關係)。因此,形成於光纖束FGn之射出端FBo上之多數個點光源像係於複眼透鏡系統FEn之複數個透鏡元件Le之各自之射出面epi側再成像,照明區域IAn係以與透鏡元件Le之剖面之形狀即長方形相似之形狀來照明(成像)。Furthermore, the exit surface epi of the fly-eye lens system FEn is set to a relationship (imaging relationship) with the optical conjugation of the exit end FBo of the optical fiber bundle FGn, and the entrance surface poi of the fly-eye lens system FEn is set to the illumination area IAn (mask). Patterned surface of the substrate M) Optical conjugate relationship (imaging relationship). Therefore, most of the point light source images formed on the output end FBo of the optical fiber bundle FGn are imaged on the epi side of the respective output surfaces of the plurality of lens elements Le of the fly-eye lens system FEn, and the illumination area IAn is the same as that of the lens element Le. The shape of the cross-section is a shape similar to a rectangle for illumination (imaging).

圖11(A)及圖11(B)係示意性表示從圖10所示之光纖束FGn之射出端FBo至複眼透鏡系統FEn為止之光路中之照明光束之狀態的圖,正交座標系XYZ設定為與圖10相同。圖11(A)係從Y軸方向(步進移動方向)來看該光路之圖,圖11(B)係從X軸方向(掃描移動方向)來看該光路之圖。此處,將作為從圖9所示之光纖束FGn之射出端FBo中射出之照明光束BSa、BSb、BSc各自之源的光纖線之射出端之微細之圓形發光點(0.2 mm以下之直徑)作為點光(點光源像)SPa、SPb、SPc。進而,由點光SPa、SPb、SPc分別而來之照明光束BSa、BSb、BSc之數值孔徑設為相同。因此,於光纖束FGn之射出端FBo與第1電容器透鏡系統CFn之間,與光軸AX2平行之照明光束BSa、BSb、BSc之從各中心光線之發散角與X方向、Y方向均成為相同之角度θbo。FIG. 11 (A) and FIG. 11 (B) are diagrams schematically showing states of the illumination light beams in the optical path from the exit end FBo of the optical fiber bundle FGn to the fly-eye lens system FEn shown in FIG. 10. The orthogonal coordinate system is XYZ. The setting is the same as that of FIG. 10. FIG. 11 (A) is a view of the optical path viewed from the Y-axis direction (step moving direction), and FIG. 11 (B) is a view of the optical path viewed from the X-axis direction (scanning moving direction). Here, a fine circular light emitting point (diameter of 0.2 mm or less) of the emission end of the optical fiber line which is the source of each of the illumination beams BSa, BSb, and BSc emitted from the emission end FBo of the fiber bundle FGn shown in FIG. 9 ) As point light (point light source image) SPa, SPb, SPc. Furthermore, the numerical apertures of the illumination beams BSa, BSb, and BSc from the spot lights SPa, SPb, and SPc are the same. Therefore, the divergence angles of the illumination beams BSa, BSb, and BSc from the central rays between the exit end FBo of the fiber bundle FGn and the first capacitor lens system CFn are parallel to the optical axis AX2, and the X and Y directions are the same. Angle θbo.

形成於光纖束FGn之射出端FBo上之多數個點光SPa、SPb、SPc之各個而來之照明光束BSa、BSb、BSc,藉由第1電容器透鏡系統CFn,而如圖11(A)、圖11(B)般,於複眼透鏡系統FEn之入射面poi上全部重疊,以均勻之照度分布對入射面poi進行照明。因此,光纖束FGn及第1電容器透鏡系統CFn係作為對於複眼透鏡系統FEn之第1光學積分器而發揮功能。The illumination light beams BSa, BSb, and BSc from the plurality of spot lights SPa, SPb, and SPc formed on the output end FBo of the optical fiber bundle FGn are passed through the first capacitor lens system CFn, as shown in FIG. 11 (A), As shown in FIG. 11 (B), all of the incident surface poi of the fly-eye lens system FEn are overlapped, and the incident surface poi is illuminated with a uniform illuminance distribution. Therefore, the optical fiber bundle FGn and the first capacitor lens system CFn function as a first optical integrator for the fly-eye lens system FEn.

圖12係示意性表示於圖11所示之光纖束FGn之射出端FB上,對每個光纖線形成之多數個點光(點光源像)SPa、SPb、SPc之排列之一例的圖,正交座標系XYZ係設定為與圖11相同。於Y方向長之長方形之射出端FBo上,以白圓表示之點光(點光源像)SPa、以黑圓表示之點光(點光源像)SPb、以及以雙重圓表示之點光(點光源像)SPc分別以相同數量且以同樣之分布來配置於X方向及Y方向上。圖12中,將3個點光SPa、SPb、SPc表示為於XY方向上有規則(週期性)地分布,但實際上為隨機地密集分布。如先前所例示,於入射側之光纖束12A、12B、12C分別包含12萬根光纖線之情形時,於光纖束FGn之射出端FBo上,點光SPa、SPb、SPc分別隨機地各分布約2萬。作為一例,於射出端FBo之XY方向之尺寸之比率、複眼透鏡系統FEn之1個透鏡元件Le之XY方向之尺寸之比率、以及照明區域IAn之XY方向之尺寸之比率均設定為約1:3之情形時,若將光纖線之外形直徑設為0.2 mm,則於射出端FBo之X方向上排列約143根,且於Y方向上排列約420根光纖線(總數為143×420≒6萬根)。於此情形時,射出端FBo之X方向之尺寸成為約28.6 mm(0.2 mm×143),且Y方向之尺寸成為約84 mm(0.2 mm×420)。FIG. 12 is a diagram schematically showing an example of an arrangement of a plurality of point lights (point light source images) SPa, SPb, and SPc formed on the exit end FB of the optical fiber bundle FGn shown in FIG. 11 for each optical fiber line. The coordinate system XYZ is set to be the same as that shown in FIG. 11. Point light (point light source image) SPa represented by a white circle, point light (point light source image) SPb represented by a black circle, and point light (dot circle) Light source images) SPc are respectively arranged in the X direction and the Y direction with the same number and the same distribution. In FIG. 12, the three spot lights SPa, SPb, and SPc are shown as being regularly (periodically) distributed in the XY direction, but are actually densely distributed randomly. As previously exemplified, when the optical fiber bundles 12A, 12B, and 12C on the incident side each contain 120,000 optical fiber lines, the spot lights SPa, SPb, and SPc are randomly distributed on the emission end FBo of the optical fiber bundle FGn, respectively. 20000. As an example, the ratio of the size of the XY direction at the emission end FBo, the ratio of the size of the XY direction of one lens element Le of the fly-eye lens system FEn, and the ratio of the size of the XY direction of the illumination area IAn are all set to about 1: In the case of 3, if the outer diameter of the optical fiber line is set to 0.2 mm, about 143 optical fibers are arranged in the X direction of the emitting end FBo and about 420 optical fibers are arranged in the Y direction (the total is 143 × 420 ≒ 6 Wan Gen). In this case, the size in the X direction of the injection end FBo becomes approximately 28.6 mm (0.2 mm × 143), and the size in the Y direction becomes approximately 84 mm (0.2 mm × 420).

圖13係表示於構成圖11所示之複眼透鏡系統FEn的複數個透鏡元件Le之各自之射出面epi上所形成之多數個點光源像(點光SPa'、SPb'、SPc')之排列狀態的圖,正交座標系XYZ設定為與圖11(或圖12)相同。圖13中,形成於各透鏡元件Le之射出面epi上之多數個點光SPa'、SPb'、SPc'係形成於光纖束FGn之射出端FBo上之多數個點光SPa、SPb、SPc再成像者,於每個透鏡元件Le上形成約6萬個之點光SPa'、SPb'、SPc'。因此,於複眼透鏡系統FEn之整體之射出面epi上,分布亦達到透鏡元件Le之個數×約6萬個程度之無數個點光SPa'、SPb'、SPc'。FIG. 13 shows an arrangement of a plurality of point light source images (point lights SPa ', SPb', SPc ') formed on the respective exit surfaces epi of the plurality of lens elements Le constituting the fly-eye lens system FEn shown in FIG. 11. In the state diagram, the orthogonal coordinate system XYZ is set to be the same as that in FIG. 11 (or FIG. 12). In FIG. 13, the plurality of spot lights SPa ', SPb', and SPc 'formed on the exit surface epi of each lens element Le are the plurality of spot lights SPa, SPb, and SPc formed on the exit end FBo of the optical fiber bundle FGn. The imager forms approximately 60,000 spot lights SPa ′, SPb ′, and SPc ′ on each lens element Le. Therefore, on the overall exit surface epi of the fly-eye lens system FEn, the distribution also reaches the number of lens elements Le × number of point lights SPa ′, SPb ′, SPc ′ of about 60,000 degrees.

圖14(A)及圖14(B)係示意性表示從圖10所示之複眼透鏡系統FEn至光罩基板M上之照明區域IAn為止之光路中之照明光之狀態的圖,正交座標系XYZ設定為與圖10(或圖11)相同。圖14(A)係從X方向(掃描移動方向)來看自複眼透鏡系統FEn至照明區域IAn為止之光路的圖,圖14(B)係表示從Y方向(步進移動方向)來看自複眼透鏡系統FEn至照明區域IAn為止之光路的圖。形成於複眼透鏡系統FEn之射出面epi上之無數個點光SPa'、SPb'、SPc'中,如圖14(A)所示,從位於在Y方向上與光軸AX2最遠之距離ΔHy的點光SPa'、SPb'、SPc'發散而行進之照明光束BSa'、BSb'、BSc'藉由第2電容器透鏡系統CPn而成為平行光束,並且於其中心光線(主光線)從光軸AX2起傾斜角度θhy之狀態下,投射於照明區域IAn之Y方向之整體。從於複眼透鏡系統FEn之射出面epi上排列於Y方向上之其他點光SPa'、SPb'、SPc'分別發散而行進之照明光束BSa'、BSb'、BSc'亦藉由第2電容器透鏡系統CPn,而同樣地關於Y方向而成為平行光束,投射(重疊)於照明區域IAn之Y方向之整體。14 (A) and 14 (B) are diagrams schematically showing states of illumination light in an optical path from the fly-eye lens system FEn shown in FIG. 10 to the illumination area IAn on the mask substrate M, and are orthogonal coordinates. The system XYZ is set to be the same as FIG. 10 (or FIG. 11). FIG. 14 (A) is a view from the X direction (scanning movement direction) of the optical path from the fly-eye lens system FEn to the illumination area IAn, and FIG. 14 (B) is a view from the Y direction (step movement direction). Optical path of the fly-eye lens system FEn to the illumination area IAn. The countless spot lights SPa ', SPb', and SPc 'formed on the exit surface epi of the fly-eye lens system FEn, as shown in FIG. 14 (A), are located at the distance ΔHy farthest from the optical axis AX2 in the Y direction. The spot light beams SPa ', SPb', SPc 'diverge and travel, and the illumination beams BSa', BSb ', and BSc' are parallel beams by the second capacitor lens system CPn, and the central rays (principal rays) from the optical axis In a state where AX2 is tilted from the angle θhy, the whole is projected in the Y direction of the illumination area IAn. The illumination light beams BSa ', BSb', and BSc 'traveling from the other point lights SPa', SPb ', and SPc' arranged in the Y direction on the exit surface epi of the fly-eye lens system FEn are also diverged and passed through the second capacitor lens. The system CPn is also a parallel light beam about the Y direction, and is projected (superimposed) on the entire Y direction of the illumination area IAn.

形成於複眼透鏡系統FEn之射出面epi上之無數個點光SPa'、SPb'、SPc'中,如圖14(B)所示,從位於在X方向上與光軸AX2最遠之距離ΔHx的點光SPa'、SPb'、SPc'發散而行進之照明光束BSa'、BSb'、BSc'藉由第2電容器透鏡系統CPn而成為平行光束,並且於其中心光線(主光線)從光軸AX2起傾斜角度θhx之狀態下,投射於照明區域IAn之X方向之整體。從於複眼透鏡系統FEn之射出面epi上排列於X方向上之其他點光SPa'、SPb'、SPc'分別發散而行進之照明光束BSa'、BSb'、BSc'亦藉由第2電容器透鏡系統CPn,而同樣地關於X方向而成為平行光束,投射(重疊)於照明區域IAn之X方向之整體。因此,複眼透鏡系統FEn與第2電容器透鏡系統CPn係作為以均勻之照度分布之照明光來對照明區域IAn進行照射之第2光學積分器而發揮功能。The countless spot lights SPa ', SPb', and SPc 'formed on the exit surface epi of the fly-eye lens system FEn, as shown in Fig. 14 (B), are located at a distance ΔHx farthest from the optical axis AX2 in the X direction. The spot light beams SPa ', SPb', SPc 'diverge and travel, and the illumination beams BSa', BSb ', and BSc' are parallel beams by the second capacitor lens system CPn, and the central rays (principal rays) from the optical axis In a state where AX2 is tilted from the angle θhx, the whole is projected in the X direction of the illumination area IAn. Illumination light beams BSa ', BSb', and BSc 'traveling from the other point lights SPa', SPb ', and SPc' arranged in the X direction on the exit surface epi of the fly-eye lens system FEn are also diverged and passed through the second capacitor lens. The system CPn similarly becomes a parallel beam with respect to the X direction, and is projected (superimposed) on the entire X direction of the illumination area IAn. Therefore, the fly-eye lens system FEn and the second capacitor lens system CPn function as a second optical integrator that irradiates the illumination area IAn with illumination light having a uniform illuminance distribution.

對照明區域IAn照射之照明光束BSa'、BSb'、BSc'之Y方向之最大傾斜角亦即角度θhy以及X方向之最大傾斜角亦即角度θhx係設定為大致相同之值,照明光束BSa'、BSb'、BSc'在與軸AX2平行且與照明區域IAn垂直之主光線之周圍具有等向性發散角θi(=θhy=θhx)。因此,對照明區域IAn照射之照明光束BSa'、BSb'、BSc'之數值孔徑NAi成為sin(θi)。此外,如圖14(A)、圖14(B)所明示,若減小照射於複眼透鏡系統FEn之入射面poi上的照明光束BSa、BSb、BSc之圓形照射區域之自光軸AX2起之半徑,則形成於複眼透鏡系統FEn之射出面epi上之無數個點光SPa'、SPb'、SPc'中,與光軸AX2最遠之距離ΔHx、ΔHy亦縮短,因此發散角θi(=θhy=θhx)亦減小,結果,照明光束BSa'、BSb'、BSc'之數值孔徑NAi減小,照明σ值亦減小。The maximum inclination angle of the illuminating light beams BSa ', BSb', and BSc 'in the Y direction, i.e., the angle θhy, and the maximum inclination angle of the X direction, i.e., the angle θhx, are set to approximately the same value. The illuminating light beam BSa' , BSb ′ and BSc ′ have isotropic divergence angles θi (= θhy = θhx) around the principal rays parallel to the axis AX2 and perpendicular to the illumination area IAn. Therefore, the numerical aperture NAi of the illumination light beams BSa ′, BSb ′, and BSc ′ irradiated to the illumination area IAn becomes sin (θi). In addition, as shown in FIG. 14 (A) and FIG. 14 (B), if the circular irradiation areas of the illumination light beams BSa, BSb, and BSc irradiated on the incident surface poi of the fly-eye lens system FEn are reduced, the optical axis AX2 starts from Radius, the farthest distances ΔHx, ΔHy from the optical axis AX2 among the numerous spot lights SPa ', SPb', SPc 'formed on the exit surface epi of the fly-eye lens system FEn are also shortened, so the divergence angle θi (= θhy = θhx) also decreases. As a result, the numerical aperture NAi of the illumination beams BSa ′, BSb ′, and BSc ′ decreases, and the illumination σ value also decreases.

[倍率可變部8A、8B、8C之功能]
圖15(A)及圖15(B)係對藉由圖4所示之倍率可變部(數值孔徑可變部)8A(8B、8C),將照射至入射側之光纖束12A(12B、12C)之入射端FBi上之照明光束BMa(BMb、BMc)之數值孔徑(發散角)加以調整之狀態進行說明之圖。圖15(A)、圖15(B)中,焦點位置PS2如圖4所示,係通過波長選擇部6A(6B、6C)之來自水銀燈2A(2B、2C)之光束BMa(BMb、BMc)以最小之直徑收斂(聚光)之面,於焦點位置PS2上,形成由水銀燈2A(2B、2C)之電弧放電部之模糊像所引起之圓形之光源像LDa。藉由透鏡系統8A1(8B1、8C1)及透鏡系統8A2(8B2、8C2),光源像LDa於入射側之光纖束12A(12B、12C)之入射端FBi上,再成像為光源像LDb。
[Function of variable magnification section 8A, 8B, 8C]
FIG. 15 (A) and FIG. 15 (B) are the optical fiber bundles 12A (12B, 8B, 8B, 8C) which are irradiated to the incident side by the variable magnification part (numerical aperture variable part) 8A (8B, 8C) shown in FIG. 12C) A diagram illustrating the state where the numerical aperture (divergence angle) of the illumination beam BMa (BMb, BMc) on the incident end FBi is adjusted. In FIG. 15 (A) and FIG. 15 (B), as shown in FIG. 4, the focal position PS2 is a light beam BMa (BMb, BMc) from the mercury lamp 2A (2B, 2C) that passes through the wavelength selection section 6A (6B, 6C). The surface that converges (condenses) with the smallest diameter, at the focal position PS2, forms a circular light source image LDa caused by the blurred image of the arc discharge portion of the mercury lamp 2A (2B, 2C). With the lens system 8A1 (8B1, 8C1) and the lens system 8A2 (8B2, 8C2), the light source image LDa is incident on the incident end FBi of the fiber bundle 12A (12B, 12C) on the incident side, and is then imaged as the light source image LDb.

於將透鏡系統8A1(8B1、8C1)設為負光焦度(折射力),將透鏡系統8A2(8B2、8C2)設為正光焦度(折射力),且如圖15(A)般將透鏡系統8A1(8B1、8C1)與透鏡系統8A2(8B2、8C2)分離而配置之情形時,以如下方式進行再成像:形成光源像LDb之光束BMa(BMb、BMc)之數值孔徑(發散角)NAα成為最大,並且光源像LDb於光纖束12A(12B、12C)之入射端FBi上成為最小直徑。又,於如圖15(B)般,使透鏡系統8A1(8B1、8C1)與透鏡系統8A2(8B2、8C2)接近而配置之情形時,以如下方式進行再成像:形成光源像LDb之光束BMa(BMb、BMc)之數值孔徑(發散角)NAβ成為最小,並且光源像LDb於光纖束12A(12B、12C)之入射端FBi上成為最大直徑。藉由適當調整2個透鏡系統8A1(8B1、8C1)、透鏡系統8A2(8B2、8C2)各自之光軸AX1方向之位置,可將形成光源像LDb之光束BMa(BMb、BMc)之數值孔徑(發散角)於最大之NAα至最小之NAβ之間進行調整。此外,於圖15(A)之情形時,光源像LDb之直徑可以較光纖束12A(12B、12C)之入射端FBi之有效直徑而言僅略微減小之方式設定,於圖15(B)之情形時,光源像LDb之直徑可以較光纖束12A(12B、12C)之入射端FBi之有效直徑而言僅略微增大之方式設定。The lens system 8A1 (8B1, 8C1) is set to a negative power (refractive power), the lens system 8A2 (8B2, 8C2) is set to a positive power (refractive power), and the lens is set as shown in FIG. 15 (A). When the system 8A1 (8B1, 8C1) is separated from the lens system 8A2 (8B2, 8C2), re-imaging is performed as follows: the numerical aperture (divergence angle) NAα of the light beam BMa (BMb, BMc) that forms a light source image It becomes the largest, and the light source image LDb becomes the smallest diameter on the incident end FBi of the fiber bundle 12A (12B, 12C). When the lens system 8A1 (8B1, 8C1) and the lens system 8A2 (8B2, 8C2) are arranged close to each other as shown in FIG. 15 (B), re-imaging is performed as follows: a light beam BMa of a light source image LDb is formed The numerical aperture (divergence angle) NAβ of (BMb, BMc) becomes the smallest, and the light source image LDb becomes the maximum diameter on the incident end FBi of the fiber bundle 12A (12B, 12C). By appropriately adjusting the positions of the respective optical axes AX1 of the two lens systems 8A1 (8B1, 8C1) and 8A2 (8B2, 8C2), the numerical aperture of the light beam BMa (BMb, BMc) forming the light source image LDb ( Divergence angle) is adjusted between the largest NAα to the smallest NAβ. In addition, in the case of FIG. 15 (A), the diameter of the light source image LDb can be set only slightly smaller than the effective diameter of the incident end FBi of the fiber bundle 12A (12B, 12C), as shown in FIG. 15 (B). In this case, the diameter of the light source image LDb can be set only slightly larger than the effective diameter of the incident end FBi of the fiber bundle 12A (12B, 12C).

於光纖束12A(12B、12C)之入射端FBi內,於形成光源像LDb之範圍,亦即光束BMa(BMb、BMc)所照射之範圍存在之多數個光纖線之從各個入射端射入之光束BMa(BMb、BMc)係如圖9或圖11中所說明,從形成於位於射出側之光纖束FGn之射出端FBo上的光纖線之各個射出端之點光SPa、SPb、SPc,成為將入射側之數值孔徑(最大數值孔徑NAα~最小數值孔徑NAβ之範圍之值)加以保持之狀態之照明光束BSa、BSb、BSc而射出。Within the incident end FBi of the fiber bundle 12A (12B, 12C), in the range where the light source image LDb is formed, that is, the range where the light beam BMa (BMb, BMc) is irradiated, each of the plurality of optical fiber lines is incident from each incident end. The light beam BMa (BMb, BMc) is the light SPa, SPb, SPc from the respective exit ends of the optical fiber lines formed on the exit end FBo of the fiber bundle FGn on the exit side as shown in FIG. 9 or FIG. The illumination beams BSa, BSb, and BSc in a state where the numerical aperture on the incident side (a value ranging from the maximum numerical aperture NAα to the minimum numerical aperture NAβ) is maintained are emitted.

於藉由圖4所示之3個倍率可變部8A、8B、8C之各個,將投射於入射側之光纖束12A、12B、12C之各入射端FBi上的各光束BMa、BMb、BMc之數值孔徑(發散角)設為相同之情形時,從射出側之光纖束FGn之射出端FBo中射出之3個照明光束BSa、BSb、BSc各自之數值孔徑(與圖11所示之角度θbo相當)成為相同之值。然而,若藉由倍率可變部8A、8B、8C之各個,使入射側之各光束BMa、BMb、BMc之數值孔徑(發散角)不同,亦可使從射出端FBo射出之3個照明光束BSa、BSb、BSc各自之數值孔徑不同。根據圖16,對此進行說明。Based on each of the three magnification variable sections 8A, 8B, and 8C shown in FIG. 4, each of the light beams BMa, BMb, and Bmc that will be projected onto the incident end FBi of the fiber bundles 12A, 12B, and 12C on the incident side. When the numerical aperture (divergence angle) is the same, the numerical apertures of the three illumination beams BSa, BSb, and BSc emitted from the emission end FBo of the fiber bundle FGn on the emission side (equivalent to the angle θbo shown in FIG. 11) ) Become the same value. However, if the numerical apertures (divergence angles) of the light beams BMa, BMb, and Bmc on the incident side are different by each of the magnification variable sections 8A, 8B, and 8C, the three illumination beams emitted from the emission end FBo can also be made. The numerical apertures of BSa, BSb, and BSc are different. This will be described with reference to FIG. 16.

圖16係示意性表示對圖9所示之光纖束之入射側之光纖束12A、12B、12C射入之光束BMa、BMb、BMc之狀態、以及從射出側之光纖束FGn(FG1~FG6)中射出之照明光束BSa、BSb、BSc之狀態的圖。圖16中,將投射於光纖束12A之入射端FBi上的光束BMa之數值孔徑(廣角)設為NAia,將投射於光纖束12B之入射端FBi上的光束BMb之數值孔徑(廣角)設為NAib,且將投射於光纖束12C之入射端FBi上的光束BMc之數值孔徑(廣角)設為NAic,從而設定為NAia>NAib>NAic之關係。於此情形時,從形成於射出側之光纖束FG1之射出端FBo上的多數個點光SPa之各個發散而行進之照明光束BSa成為數值孔徑NAia,從多數個點光SPb之各個發散而行進之照明光束BSb成為數值孔徑NAib,從多數個點光SPc之各個發散而行進之照明光束BSc成為數值孔徑NAic。從其他光纖束FG2~FG6之各自之射出端FBo中亦同樣,數值孔徑不同之照明光束BSa、BSb、BSc同時射出。FIG. 16 schematically shows the states of the light beams BMa, BMb, and Bmc entering the fiber bundles 12A, 12B, and 12C on the incident side of the fiber bundle shown in FIG. 9 and the fiber bundles FGn (FG1 to FG6) from the exit side. A diagram showing the states of the illuminating light beams BSa, BSb, and BSc emitted in the middle. In FIG. 16, the numerical aperture (wide angle) of the light beam BMa projected on the incident end FBi of the optical fiber bundle 12A is set to NAia, and the numerical aperture (wide angle) of the light beam BMb projected on the incident end FBi of the optical fiber bundle 12B is set to NAib, and the numerical aperture (wide angle) of the light beam BMc projected on the incident end FBi of the fiber bundle 12C is set to NAic, so that the relationship is NAia> NAib> NAic. In this case, the illumination light beam BSa traveling from the divergence of the plurality of spot lights SPa on the exit end FBo of the fiber bundle FG1 formed on the exit side becomes the numerical aperture NAia, and travels from the divergence of the plurality of spot lights SPb. The illuminating light beam BSb becomes a numerical aperture NAib, and the illuminating light beam BSc traveling from each of the plurality of spot lights SPc becomes a numerical aperture NAic. It is the same from the respective emitting ends FBo of the other optical fiber bundles FG2 to FG6, and the illumination light beams BSa, BSb, and BSc with different numerical apertures are emitted simultaneously.

圖17係為了對從光纖束FGn之射出端FBo發散而行進之照明光束BSa、BSb、BSc之於複眼透鏡系統FEn之入射面poi上之照射分布之差異進行說明,而從X方向(掃描移動方向)來看從射出端FBo至複眼透鏡系統FEn之入射面poi為止之光路的示意圖,正交座標系XYZ係設定為與圖11(B)相同。圖17中,從形成於光纖束FGn之射出端FBo(與光瞳面相當)上的多數個點光SPa之各個發散而行進之照明光束BSa係藉由電容器透鏡系統CPn而轉換為大致平行之光束,於複眼透鏡系統FEn之入射面poi內之以光軸AX1為中心之圓形之區域CFa中重疊而照射。同樣,從多數個點光SPb之各個發散而行進之照明光束BSb係藉由電容器透鏡系統CPn而轉換為大致平行之光束,於複眼透鏡系統FEn之入射面poi內之以光軸AX1為中心之圓形之區域CFb中重疊而照射,從多數個點光SPc之各個發散而行進之照明光束BSc係藉由電容器透鏡系統CPn而轉換為大致平行之光束,於複眼透鏡系統FEn之入射面poi內之以光軸AX1為中心之圓形之區域CFc中重疊而照射。FIG. 17 illustrates the difference in illumination distribution on the incident surface poi of the fly-eye lens system FEn of the illumination light beams BSa, BSb, and Bsc traveling from the exit end FBo of the optical fiber bundle FGn. (Direction) Looking at the schematic diagram of the optical path from the exit end FBo to the incident surface poi of the fly-eye lens system FEn, the orthogonal coordinate system XYZ system is set to be the same as FIG. 11 (B). In FIG. 17, the illumination light beam BSa that travels from the divergence of each of the plurality of spot lights SPa formed on the exit end FBo (equivalent to the pupil plane) of the fiber bundle FGn is converted into a substantially parallel one by the capacitor lens system CPn. The light beam is irradiated by being superimposed on a circular area CFa centered on the optical axis AX1 in the incident surface poi of the fly-eye lens system FEn. Similarly, the illuminating light beam BSb traveling from each of the plurality of point lights SPb is converted into a substantially parallel light beam by the capacitor lens system CPn, and is centered on the optical axis AX1 in the incident surface poi of the fly-eye lens system FEn. The circular area CFb is overlapped and irradiated, and the illumination light beam BSc traveling from each of the plurality of spot lights SPc is converted into a substantially parallel light beam by the capacitor lens system CPn, and is incident on the incident surface poi of the fly-eye lens system FEn. The circular area CFc centered on the optical axis AX1 is irradiated.

由於為光纖束FGn之射出端FBo配置於電容器透鏡系統CPn之前側焦點之位置(光瞳面)上,且複眼透鏡系統FEn之入射面poi配置於電容器透鏡系統CPn之後側焦點之位置上的柯勒照明方式,故而不論多數個點光SPa、SPb、SPc之各個位於射出端FBo上之何處,來自點光SPa之照明光束BSa均照射至圓形區域CFa內之整體,來自點光SPb之照明光束BSb照射至圓形區域CFb內之整體,且來自點光SPc之照明光束BSc照射至圓形區域CFc內之整體。Since the exit end FBo of the optical fiber bundle FGn is disposed at the position of the front focal point (pupil plane) of the capacitor lens system CPn, and the incident surface poi of the fly-eye lens system FEn is disposed at the position of the rear focal point of the capacitor lens system CPn. Lighting method, so no matter where each of the plurality of spot lights SPa, SPb, SPc is located on the emission end FBo, the illumination beam BSa from the spot light SPa irradiates the whole within the circular area CFa, from the spot light SPb The illumination light beam BSb irradiates the whole inside the circular area CFb, and the illumination light beam BSc from the spot light SPc irradiates the whole inside the circular area CFc.

圖18係於XY面內來看分布於複眼透鏡系統FEn之入射面poi上的圖17中之圓形區域CFa、CFb、CFc之狀態的圖,正交座標系XYZ係設定為與圖17相同。由於照明光束BSa、BSb、BSc之數值孔徑(發散角)NAia、NAib、NAic成為NAia>NAib>NAic之關係,故而如圖18般,若將以光軸AX2為中心之區域CFa之半徑設為Ria,將區域CFb之半徑設為Rib,且將區域CFc之半徑設為Ric,則成為Ria>Rib>Ric之關係。進而,於半徑為Ric之區域CFc內,3個照明光束BSa、BSb、BSc全部重疊而分布,於區域CFb內之從半徑Ric至半徑Rib之間之環帶狀區域內,2個照明光束BSa、BSb重疊而分布,於區域CFa內之從半徑Rib至半徑Ria之間之環帶狀區域內,僅分布照明光束BSa。此外,圖18中以虛線表示之圓形區域CCA表示照明σ值成為1.0(NAi=NAp)之邊界範圍,照明光束BSa、BSb、BSc各自之數值孔徑NAia、NAib、NAic之最大值係設定為與區域CCA之半徑對應之數值孔徑以下。進而,與圖18所示之3個半徑Ria、Rib、Ric中之最大半徑Ria相應地,於Y方向及X方向上分別從光軸AX2離開之位置係與上述圖14(A)、圖14(B)中所說明之距離ΔHy、ΔHx對應。FIG. 18 is a diagram showing the states of the circular areas CFa, CFb, and CFc in FIG. 17 distributed on the incident surface poi of the fly-eye lens system FEn in the XY plane. The orthogonal coordinate system XYZ system is set to be the same as that in FIG. 17. . Since the numerical apertures (divergence angles) of the illumination beams BSa, BSb, and BSc are NAia, NAib, and NAic, the relationship is NAia> NAib> NAic. Therefore, as shown in FIG. 18, if the radius of the area CFa centered on the optical axis AX2 is set as Ria, where the radius of the area CFb is set to Rib, and the radius of the area CFc is set to Ric, the relationship is Ria> Rib> Ric. Further, in the area CFc with a radius Ric, the three illumination beams BSa, BSb, and BSc are all superimposed and distributed, and in the ring-shaped region from the radius Ric to the radius Rib in the area CFb, the two illumination beams BSa And BSb are superimposed and distributed, and only the illumination light beam BSa is distributed in the ring-shaped region from the radius Rib to the radius Ria in the area CFa. In addition, the circular area CCA indicated by a dotted line in FIG. 18 indicates a boundary range where the illumination σ value becomes 1.0 (NAi = NAp), and the maximum numerical apertures NAia, NAib, and NAic of the illumination beams BSa, BSb, and BSc are set to Below the numerical aperture corresponding to the radius of the area CCA. Further, corresponding to the maximum radii Ria among the three radii Ria, Rib, and Ric shown in FIG. 18, the positions separated from the optical axis AX2 in the Y direction and the X direction are respectively the same as those in FIG. 14 (A) and FIG. 14 described above. The distances ΔHy and ΔHx described in (B) correspond.

如以上所述,藉由圖4、圖15所示之倍率可變部(數值孔徑可變部)8A、8B、8C之各自之調整,可將於複眼透鏡系統FEn之入射面poi上分布為圓形之3個照明光束BSa、BSb、BSc之各自之區域CFa、CFb、CFc之半徑Ria、Rib、Ric自由調整,使形成於複眼透鏡系統FEn之射出面epi上之無數個點光SPa'、SPb'、SPc',具有與從光軸AX2起之半徑方向之距離相應之強度分布。As described above, by adjusting the magnification variable sections (numerical aperture variable sections) 8A, 8B, and 8C shown in FIGS. 4 and 15, the incident surface poi of the fly-eye lens system FEn can be distributed as The radius of each of the circular three illumination beams BSa, BSb, and BSc CFa, CFb, CFc Ria, Rib, Ric can be adjusted freely, so that the numerous spot lights SPa 'formed on the exit surface epi of the fly-eye lens system FEn , SPb ', SPc' have an intensity distribution corresponding to the distance in the radial direction from the optical axis AX2.

圖19(A)及圖19(B)係表示與圖18所示之照明光束BSa、BSb、BSc各自之區域CFa、CFb、CFc相對應,而形成於複眼透鏡系統FEn之射出面epi(照明光瞳面)上之無數個點光SPa'、SPb'、SPc'之強度分布(光源像)之一例。圖19(A)係從X方向(掃描移動方向)來看複眼透鏡系統FEn之圖,圖19(B)係從Y方向(步進移動方向)來看複眼透鏡系統FEn之圖。形成於複眼透鏡系統FEn之射出面epi上之無數個點光SPa'係於入射面poi上之與照明光束BSa所照射之圓形區域CFa(半徑為Ria)對應之部分上產生,形成於射出面epi上之無數個點光SPb'係於入射面poi上之與照明光束BSb所照射之圓形區域CFb(半徑為Rib)對應之部分上產生,形成於射出面epi上之無數個點光SPc'係於入射面poi上之與照明光束BSc所照射之圓形區域CFc(半徑為Ric)對應之部分上產生。19 (A) and 19 (B) show the areas corresponding to CFa, CFb, and CFc of the respective illumination beams BSa, BSb, and BSc shown in FIG. 18, and are formed on the exit surface epi (illumination of the fly-eye lens system FEn). An example of the intensity distribution (light source image) of countless spot lights SPa ', SPb', SPc 'on the pupil surface). FIG. 19 (A) is a view of the fly-eye lens system FEn viewed from the X direction (scanning movement direction), and FIG. 19 (B) is a view of the fly-eye lens system FEn viewed from the Y direction (step moving direction). Countless spot lights SPa 'formed on the exit surface epi of the fly-eye lens system FEn are generated on the incident surface poi on a portion corresponding to the circular area CFa (radius Ria) illuminated by the illumination beam BSa, and are formed on the exit The countless spot lights SPb 'on the surface epi are generated on the part corresponding to the circular area CFb (radius Rib) illuminated by the illumination beam BSb on the incident surface poi, and are formed on the exit surface epi. SPc 'is generated on the incident surface poi at a portion corresponding to the circular area CFc (radius Ric) illuminated by the illumination beam BSc.

於3個照明光束BSa、BSb、BSc各自之波長特性相同之情形時,例如於將安裝於圖3、圖4所示之波長選擇部6A、6B、6C之各個之干涉濾光器均設為圖6所示之i射線-窄頻帶干涉濾光器SWa之情形時,於複眼透鏡系統FEn之射出面epi(照明系統之光瞳面)之與半徑為Ric之圓形區域CFc對應之部分,具有圖6所示之i射線(窄)之光譜分布的3個點光SPa'、SPb'、SPc'全部重疊地形成。又,於射出面epi(照明系統之光瞳面)之與從半徑Ric至半徑Rib之環帶狀區域對應之部分,形成具有i射線(窄)之光譜分布之2個點光SPa'、SPb',且於射出面epi(照明系統之光瞳面)之與從半徑Rib至半徑Ria之環帶狀區域對應之部分,僅形成具有i射線(窄)之光譜分布之1個點光SPa'。此外,形成於圖19(A)、圖19(B)所示之複眼透鏡系統FEn之射出面epi(照明系統之光瞳面)上之多數個點光(點光源像)SPa'、SPb'、SPc'於圖18之圓形區域CCA內並不均等地分布,其原因在於,為了進行倍率可變部(數值孔徑可變部)8A、8B、8C之功能說明,而將射入至光纖束12A、12B、12C之各個之光束BMa、BMb、BMc之數值孔徑NAia、NAib、NAic有意地設為NAia>NAib>NAic之關係。通常之圖案曝光中,光束BMa、BMb、BMc之數值孔徑NAia、NAib、NAic設定為NAia=NAib=NAic之關係。When the wavelength characteristics of the three illumination beams BSa, BSb, and BSc are the same, for example, each of the interference filters installed in the wavelength selection sections 6A, 6B, and 6C shown in FIG. 3 and FIG. 4 is set to In the case of the i-ray-narrow-band interference filter SWa shown in FIG. 6, the part corresponding to the exit surface epi (the pupil surface of the illumination system) of the fly-eye lens system FEn corresponding to the circular area CFc with a radius Ric, All three spot lights SPa ′, SPb ′, and SPc ′ having an i-ray (narrow) spectral distribution shown in FIG. 6 are formed to overlap. In addition, two spot lights SPa ', SPb having an i-ray (narrow) spectral distribution are formed on a portion of the exit surface epi (the pupil surface of the lighting system) corresponding to the ring-shaped region from the radius Ric to the radius Rib. 'And only one spot light SPa with a spectral distribution of i-rays (narrow) is formed on the part of the exit surface epi (the pupil plane of the lighting system) corresponding to the ring-shaped region from the radius Rib to the radius Ria' . In addition, a plurality of point lights (point light source images) SPa ', SPb' formed on the exit surface epi (the pupil surface of the illumination system) of the fly-eye lens system FEn shown in Figs. 19 (A) and 19 (B). SPc 'is not evenly distributed in the circular area CCA in FIG. 18 because the reason is that for the purpose of explaining the functions of the variable magnification section (numerical aperture variable section) 8A, 8B, and 8C, they are injected into the optical fiber. The numerical apertures NAia, NAib, and NAic of each of the beams BMa, BMb, and Bmc of the beams 12A, 12B, and 12C are intentionally set to the relationship of NAia> NAib> NAic. In a typical pattern exposure, the numerical apertures NAia, NAib, and NAic of the beams BMa, BMb, and Bmc are set to the relationship of NAia = NAib = NAic.

如圖19(A)、圖19(B)所示,於使多數個點光(點光源像)SPa'、SPb'、SPc'分布於複眼透鏡系統FEn之射出面epi(照明系統之光瞳面)上,且將成為點光SPa'、SPb'、SPc'各自之源的光束BMa、BMb、BMc(照明光束BSa、BSb、BSc)之波長特性設為相同之情形時,照射於光罩基板M之照明區域IAn中之照明光係如圖20所示,具有根據數值孔徑而照度不同之特性。圖20係示意性表示對照明區域IAn上之點OP照射之照明光束Irn之配向特性(發散角之特性),由於為遠心之照明條件(柯勒照明),故而通過點OP之照明光束Irn之主光線Lpi成為與照明區域IAn之面(光罩基板M之圖案面)垂直。照明光束Irn係以與數值孔徑NAia對應之從主光線Lpi起之發散角θia成為最大數值孔徑之方式來配向。該發散角θia中之與數值孔徑NAic對應之發散角θic內,照明光束Irn之照度成為將3個照明光束BSa、BSb、BSc相加之強度,於從與數值孔徑NAib對應之發散角θib至發散角θic之間,照明光束Irn之照度成為將2個照明光束BSa、BSb相加之強度,而且於發散角θia至發散角θib之間,照明光束Irn之照度成為僅1個照明光束BSa之強度。即,照明光束Irn之整體之發散角(圖20中為θia)中,中心附近之發散角(圖20中為θic)之強度較高,可賦予隨著發散角增大而強度降低之分布。As shown in FIGS. 19 (A) and 19 (B), a plurality of point lights (point light source images) SPa ', SPb', and SPc 'are distributed on the exit surface epi of the fly-eye lens system FEn (the pupil of the lighting system) When the wavelength characteristics of the light beams BMa, BMb, and Bmc (illumination light beams BSa, BSb, BSc) which are the respective sources of the spot lights SPa ', SPb', and SPc 'are set to the same, irradiate the mask The illuminating light in the illuminating area IAn of the substrate M is shown in FIG. 20 and has a characteristic that the illuminance is different according to the numerical aperture. FIG. 20 schematically shows the alignment characteristics (characteristics of divergence angle) of the illumination beam Irn irradiated to the point OP on the illumination area IAn. Since it is a telecentric illumination condition (Koehler illumination), the illumination beam Irn passing the point OP The main light ray Lpi is perpendicular to the surface of the illumination area IAn (the pattern surface of the mask substrate M). The illumination beam Irn is aligned such that the divergence angle θia from the main ray Lpi corresponding to the numerical aperture NAia becomes the maximum numerical aperture. Within the divergence angle θic of the divergence angle θia corresponding to the numerical aperture NAic, the illuminance of the illumination beam Irn becomes the intensity of adding the three illumination beams BSa, BSb, and BSc, from the divergence angle θib corresponding to the numerical aperture NAib to Between the divergence angle θic, the illuminance of the illumination beam Irn becomes the intensity of adding the two illumination beams BSa, BSb, and between the divergence angle θia to the divergence angle θib, the illumination intensity of the illumination beam Irn becomes only one illumination beam BSa strength. That is, of the overall divergence angle (θia in FIG. 20) of the illumination light beam Irn, the intensity of the divergence angle (θic in FIG. 20) near the center is high, and it can be given a distribution that the intensity decreases as the divergence angle increases.

補充說明,光罩基板M上之照明區域IAn(IA1~IA6)之各個與板P上之投影區域EAn(EA1~EA6)之各個成為共軛關係(成像關係),因此投射於投影區域EAn中之任意1點的曝光用成像光束(繞射光)具有與圖20相同之配向特性(發散角之特性)。It is to be noted that each of the illumination areas IAn (IA1 to IA6) on the mask substrate M and each of the projection areas EAn (EA1 to EA6) on the plate P become a conjugate relationship (imaging relationship), so they are projected into the projection area EAn. The exposure imaging beam (diffracted light) at any one of the points has the same alignment characteristics (characteristics of divergence angle) as in FIG. 20.

如上所述,藉由利用倍率可變部(數值孔徑可變部)8A、8B、8C,將對入射側之光纖束12A、12B、12C各自之入射端FBi所投射的光束BMa、BMb、BMc各自之數值孔徑(發散角)進行調整,可將投射於光罩基板M上之照明區域IAn中的照明光束Irn之整體之數值孔徑(圖20中為NAia)改變而變更照明σ值,或可在與照明光束Irn之整體之數值孔徑對應之發散角度之範圍內具有照度分布。進而,利用倍率可變部(數值孔徑可變部)8A、8B、8C,可使光束BMa、BMb、BMc各自之直徑相對於光纖束12A、12B、12C之入射端FBi之直徑而言增大或減小,因此亦可調整圖9或圖16所示之3個照明光束BSa、BSb、BSc各自之照度(點光SPa、SPb、SPc之各自之亮度)。As described above, by using the variable magnification units (numerical aperture variable units) 8A, 8B, and 8C, the light beams BMa, BMb, and BMc projected onto the incident ends FBi of the fiber bundles 12A, 12B, and 12C on the incident side are used. The numerical aperture (divergence angle) can be adjusted to change the numerical aperture (NAia in FIG. 20) of the entire illumination beam Irn projected in the illumination area IAn on the mask substrate M to change the illumination σ value. It has an illuminance distribution in a range of a divergence angle corresponding to the numerical aperture of the entire illumination beam Irn. Furthermore, by using the variable magnification units (variable numerical aperture units) 8A, 8B, and 8C, the diameters of the beams BMa, BMb, and Bmc can be increased relative to the diameters of the incident ends FBi of the fiber bundles 12A, 12B, and 12C. Or decrease, so can also adjust the respective illuminances (the respective brightnesses of the spot lights SPa, SPb, SPc) of the three illumination beams BSa, BSb, and BSc shown in FIG. 9 or FIG. 16.

[波長選擇部6A、6B、6C之功能]
於上述圖3、圖4所示之波長選擇部6A、6B、6C各自之滑動機構FX中,例如,能夠以可交換之方式安裝如圖6~圖8分別所示之具有波長選擇特性之3種干涉濾光器SWa、SWb、SWc中之任一個來進行波長選擇。本實施方式中,可藉由於3個波長選擇部6A、6B、6C之各個安裝之干涉濾光器之組合方式,而根據光罩基板M上之應曝光之圖案之特質(特性),來調整對光罩基板M之照明區域IAn進行照射之照明光之波長特性。
[Function of Wavelength Selector 6A, 6B, 6C]
In the sliding mechanism FX of each of the wavelength selection sections 6A, 6B, and 6C shown in FIG. 3 and FIG. 4 described above, for example, 3 having a wavelength selection characteristic as shown in FIGS. 6 to 8 can be installed in an interchangeable manner. One of the interference filters SWa, SWb, and SWc is used for wavelength selection. In this embodiment, it can be adjusted according to the characteristics (characteristics) of the pattern to be exposed on the photomask substrate M due to the combination of the interference filters mounted on the three wavelength selection sections 6A, 6B, and 6C. The wavelength characteristic of the illumination light that irradiates the illumination area IAn of the mask substrate M.

圖21係將於3個波長選擇部6A、6B、6C之各個安裝之圖6之i射線-窄頻帶干涉濾光器SWa、圖7之i射線-寬頻帶干涉濾光器SWb、及圖8之i射線+h射線-干涉濾光器SWc之組合例加以歸納之表。圖21之表中,左端之欄為稱呼3種干涉濾光器SWa、SWb、SWc之組合的代碼,右邊3行之波長光譜i射線(窄)、i射線(寬)、i射線+h射線之欄中記載之○記號之數量表示產生該波長光譜之水銀燈之數量。此外,以下使用圖21之說明中,3個倍率可變部8A、8B、8C之各個係以對入射側之光纖束12A、12B、12C各自之入射端FBi所投射之光束BMa、BMb、BMc之各數值孔徑NAia、NAib、NAic成為相同值之方式設定。FIG. 21 shows the i-ray-narrow-band interference filter SWa of FIG. 6, the i-ray-broadband interference filter SWb of FIG. 7, and FIG. 8 to be installed at each of the three wavelength selection sections 6A, 6B, and 6C. The combination examples of the i-ray + h-ray-interference filter SWc are summarized in the table. In the table in FIG. 21, the left column is a code that refers to the combination of three types of interference filters SWa, SWb, and SWc. The right three lines of the wavelength spectrum i-ray (narrow), i-ray (wide), i-ray + h-ray The number of ○ marks in the column indicates the number of mercury lamps that generate the wavelength spectrum. In addition, in the following description using FIG. 21, each of the three magnification variable sections 8A, 8B, and 8C is a light beam BMa, BMb, and BM projected by the incident end FBi of the fiber bundles 12A, 12B, and 12C on the incident side. The numerical apertures NAia, NAib, and NAic are set so that they have the same value.

圖21中,濾光器組合之代碼A0、A1、A2、A3、A4、T係於3個波長選擇部6A、6B、6C之任一者中必定安裝i射線-窄頻帶干涉濾光器SWa之組合,濾光器組合之代碼B0、B1、B2係於3個波長選擇部6A、6B、6C之任一者中均不安裝i射線-窄頻帶干涉濾光器SWa,而安裝i射線-寬頻帶干涉濾光器SWb與i射線+h射線-干涉濾光器SWc的組合,濾光器組合之代碼C0係於3個波長選擇部6A、6B、6C之全部中安裝i射線+h射線-干涉濾光器SWc之組合。該等組合中,代碼A0由於在3個波長選擇部6A、6B、6C之全部中安裝i射線-窄頻帶干涉濾光器SWa,故而光罩基板M上之照明區域IAn之照明光束Irn之光量係作為僅將由3個水銀燈2A、2B、2C之各個而來之i射線(窄)之光譜分布(參照圖6)之光量乘以約3倍而得之值來獲得,可於比較高之照度下進行高解析之圖案曝光。又,代碼A1係於3個波長選擇部6A、6B、6C中之2個中安裝i射線-窄頻帶干涉濾光器SWa,且於其餘之1個中安裝i射線-寬頻帶干涉濾光器SWb之情形,光罩基板M上之照明區域IAn之照明光束Irn之光量係將由3個水銀燈2A、2B、2C中之2根而來之i射線(窄)之光譜分布(參照圖6)之光量之約2倍,與由3個水銀燈2A、2B、2C中之1根而來之i射線(寬)之光譜分布(參照圖7)之光量相加而得,與代碼A0之組合相比,一面維持高解析之圖案曝光之性能,一面照明光束Irn之光量僅增加數%左右。In FIG. 21, the codes A0, A1, A2, A3, A4, and T of the filter combination are installed in any one of the three wavelength selection sections 6A, 6B, and 6C. The i-wave-narrowband interference filter SWa must be installed. In combination, the codes B0, B1, and B2 of the filter combination are installed in any of the three wavelength selection sections 6A, 6B, and 6C without installing the i-ray-narrow-band interference filter SWa, and installing the i-ray- The combination of the wide-band interference filter SWb and the i-ray + h-ray-interference filter SWc. The code C0 of the filter combination is to install i-ray + h-ray-interference in all of the three wavelength selection sections 6A, 6B, and 6C. The combination of the filters SWc. In these combinations, the code A0 has the i-ray-narrow-band interference filter SWa installed in all of the three wavelength selection sections 6A, 6B, and 6C. Therefore, the light amount of the illumination beam Irn in the illumination area IAn on the mask substrate M is the same. It is obtained by multiplying the light quantity of the i-ray (narrow) spectral distribution (refer to FIG. 6) from each of the three mercury lamps 2A, 2B, and 2C by about three times, and it can be obtained at a relatively high illuminance. High-resolution pattern exposure. In addition, code A1 is to install an i-ray-narrowband interference filter SWa in two of the three wavelength selection sections 6A, 6B, and 6C, and to install an i-ray-broadband interference filter in the remaining one. In the case of SWb, the amount of light from the illumination beam Irn in the illumination area IAn on the mask substrate M is the spectral distribution of the i-rays (narrow) from two of the three mercury lamps 2A, 2B, and 2C (see FIG. 6). Approximately twice the amount of light is obtained by adding the amount of light from the i-ray (wide) spectral distribution (see Figure 7) from one of the three mercury lamps 2A, 2B, and 2C, compared with the combination of code A0 While maintaining the performance of high-resolution pattern exposure, the amount of light from the illumination beam Irn only increased by a few percent.

圖21中,組合代碼T意指於3個波長選擇部6A、6B、6C之各個安裝分別不同之干涉濾光器SWa、SWb、SWc,組合代碼B0意指於3個波長選擇部6A、6B、6C之全部中僅安裝i射線-寬頻帶干涉濾光器SWb,而且組合代碼C0意指於3個波長選擇部6A、6B、6C之全部中僅安裝i射線+h射線-干涉濾光器SWc。如由圖21之表所明示,不論為哪一種組合代碼,均於照射於照明區域IAn中之照明光束Irn中包含大致100%之由3個水銀燈2A、2B、2C之各個而來之i射線之明線成分。然而,根據干涉濾光器SWa、SWb、SWc之組合方式,例如可設為使i射線之明線成分與h射線之明線成分之強度比不同於水銀燈之本來之強度比(參照圖5)之光譜分布。In FIG. 21, the combination code T means that the interference filters SWa, SWb, and SWc are installed differently in each of the three wavelength selection sections 6A, 6B, and 6C, and the combination code B0 means the three wavelength selection sections 6A, 6B. Only i-broadband interference filter SWb is installed in all of 6C, and the combination code C0 means that only i-ray + h-ray-interference filter SWc is installed in all of the three wavelength selection sections 6A, 6B, and 6C. . As clearly shown in the table of FIG. 21, no matter which combination code is used, the illumination beam Irn irradiated in the illumination area IAn contains approximately 100% of the i-rays from each of the three mercury lamps 2A, 2B, and 2C. The bright line component. However, according to the combination of the interference filters SWa, SWb, and SWc, for example, the intensity ratio of the bright line component of the i-ray and the bright line component of the h-ray can be set to be different from the original intensity ratio of the mercury lamp (see FIG. 5). Its spectral distribution.

圖22係示意性表示根據圖21之表中之組合代碼B2而獲得之照明光束Irn之波長特性的圖表。組合代碼B2中,於3個波長選擇部6A、6B、6C中之1個中安裝i射線-寬頻帶干涉濾光器SWb,且於其餘之2個波長選擇部之各個中安裝i射線+h射線-干涉濾光器SWc。於此情形時,將圖8所示之i射線+h射線之光譜分布乘以2倍而得之光量、與圖7所示之i射線(寬)之光譜分布之光量相加而得者成為照明光束Irn之波長光譜分布。因此,於組合代碼B2之情形時,i射線之明線成分之光量成為1根水銀燈之光量之3倍,h射線之明線成分之光量成為1根水銀燈光量之2倍,可變更照明光束Irn之波長光譜分布中之i射線之明線成分與h射線之明線成分之光量平衡,即,可根據來自水銀燈之光之光譜特性之傾向(參照圖5)而變更照明光束Irn之光譜特性。FIG. 22 is a graph schematically showing a wavelength characteristic of the illumination light beam Irn obtained according to the combination code B2 in the table of FIG. 21. In combination code B2, an i-ray-broadband interference filter SWb is installed in one of the three wavelength selection sections 6A, 6B, and 6C, and an i-ray + h-ray is installed in each of the other two wavelength selection sections. -Interference filter SWc. In this case, the light quantity obtained by multiplying the spectral distribution of the i-ray + h-ray shown in FIG. 8 by 2 times and adding the light quantity of the spectral distribution of the i-ray (wide) shown in FIG. 7 becomes illumination. Wavelength spectrum distribution of the light beam Irn. Therefore, in the case of combining code B2, the light amount of the bright line component of the i-ray becomes 3 times that of a mercury lamp, and the light amount of the bright line component of the h-ray becomes 2 times that of one mercury light. The illumination beam Irn can be changed. The light amount of the bright line component of the i-ray and the bright line component of the h-ray in the wavelength spectrum distribution is balanced, that is, the spectral characteristics of the illumination beam Irn can be changed according to the tendency of the spectral characteristics of the light from the mercury lamp (see FIG. 5).

關於以上之實施方式,補充說明,可成為如下之曝光方法:將由光源裝置(水銀放電燈2A、2B、2C)產生之包含明線波長(例如i射線、h射線、g射線)之光中,由波長選擇部(6A、6B、6C)所選擇之包含特定明線波長之光譜分布之光,利用照明光學系統(圖3)來對擔載電子元件用圖案之光罩基板M上之照明區域IAn(IA1~IA6)進行照射,利用將由光罩基板M(照明區域IAn)產生之曝光用光束(成像光束)射入之投影光學系統(部分投影光學系統PL1~PL6),而將圖案之像投影曝光於光感應性之基板(板P)上時,如圖21之組合代碼A1~A4、T、B0~B2般,藉由波長選擇部,從由光源裝置產生之光中抽出波長帶域不同之第1光譜分布之光(例如由i射線-窄頻帶干涉濾光器SWa所選擇之光譜成分)及第2光譜分布之光(例如由i射線+h射線-干涉濾光器SWc所選擇之光譜成分)之至少2個,並且為了利用照明光學系統對光罩基板M進行柯勒照明,而於照明光學系統內之光瞳面(複眼透鏡系統FEn之射出面epi)上,將因第1光譜分布之光而於二維範圍分布之第1光源像(例如圖13中之多數個點光源像SPa'之集合)、以及因第2光譜分布之光而於二維範圍分布之第2光源像(例如圖13中之多數個點光源像SPb'之集合)重疊地形成,藉此,如圖20中所說明,在與照射至光罩基板M上之照明光束Irn之最大數值孔徑對應之角度範圍(圖20中之入射角度θia)內,根據該角度而使波長與強度之平衡(波長強度特性)不同。Regarding the above embodiment, it can be supplemented as an exposure method in which light including bright-line wavelengths (for example, i-rays, h-rays, and g-rays) generated by a light source device (mercury discharge lamps 2A, 2B, 2C) is used. The light including the spectral distribution of a specific bright line wavelength selected by the wavelength selection section (6A, 6B, 6C) uses an illumination optical system (Fig. 3) to illuminate the illuminated area on the mask substrate M carrying the pattern for electronic components. IAn (IA1 to IA6) is irradiated, and a projection optical system (partial projection optical systems PL1 to PL6) that emits an exposure light beam (imaging light beam) generated by the mask substrate M (illumination area IAn) is used to form a patterned image When projection exposure is performed on a light-sensitive substrate (plate P), as shown in the combination codes A1 to A4, T, and B0 to B2 of FIG. 21, the wavelength band is extracted from the light generated by the light source device through the wavelength selection section. Light with different first spectral distribution (for example, spectral component selected by i-ray-narrow-band interference filter SWa) and light with second spectral distribution (for example, selected by i-ray + h-ray-interference filter SWc) Spectral component) At least two, in order to use the illumination optical system to illuminate the mask substrate M, the pupil surface (the exit surface epi of the fly-eye lens system FEn) on the pupil surface in the illumination optical system will have light due to the first spectral distribution. The first light source image distributed in the two-dimensional range (for example, a collection of most point light source images SPa 'in FIG. 13), and the second light source image distributed in the two-dimensional range due to the light of the second spectral distribution (for example, FIG. The plurality of point light sources like SPb ′ in 13 are formed overlappingly, whereby, as illustrated in FIG. 20, the angular range corresponding to the maximum numerical aperture of the illumination beam Irn irradiated onto the mask substrate M (FIG. Within the incident angle θia in 20), the balance of wavelength and intensity (wavelength intensity characteristic) is different depending on the angle.

[波長選擇部與倍率可變部之協作]
以上之說明中,將由倍率可變部8A、8B、8C之各個所設定的投射於光纖束12A、12B、12C各自之入射端FBi上的光束BMa、BMb、BMc之各數值孔徑NAia、NAib、NAic設為相同值,但可藉由一面將光束BMa、BMb、BMc之各數值孔徑NAia、NAib、NAic設定為不同值,一面使安裝於波長選擇部6A、6B、6C中之干涉濾光器不同,如上述圖20所示,根據照明光束Irn之發散角(θia、θib、θic)來賦予照度差,並且可對波長特性賦予差異。例如,將圖20所示之數值孔徑NAia、NAib、NAic設定為NAia=NAib>NAic之關係(將圖18、圖19所示之半徑Rib設為與半徑Ria相等之關係),如圖21之組合代碼A2般,於波長選擇部6A、6B之各個安裝i射線-窄頻帶干涉濾光器SWa,且於波長選擇部6C中安裝i射線+h射線-干涉濾光器SWc。於該情形時,於圖19所示之複眼透鏡系統FEn之射出面epi上,遍及半徑為Ria(=Rib)之圓形區域CFa內之整體,具有i射線(窄)之光譜分布(圖6)之無數個點光SPa'、SPb'同樣地排列,於半徑為Ric之圓形區域CFc內,進而,具有i射線+h射線之光譜分布(圖8)之無數個點光SPc'同樣地排列。
[Cooperation between wavelength selection section and variable magnification section]
In the above description, the numerical apertures NAia, NAib, of the light beams BMa, BMb, and Bmc set by each of the variable magnification units 8A, 8B, and 8C and projected onto the respective incident ends FBi of the fiber bundles 12A, 12B, and 12C are NAia, NAib, NAic is set to the same value, but the numerical apertures NAia, NAib, and NAic of the beams BMa, BMb, and Bmc can be set to different values while the interference filters installed in the wavelength selection sections 6A, 6B, and 6C can be set. Differently, as shown in FIG. 20 described above, a difference in illuminance can be given according to a divergence angle (θia, θib, θic) of the illumination light beam Irn, and a difference in wavelength characteristics can be given. For example, the numerical apertures NAia, NAib, and NAic shown in FIG. 20 are set to the relationship of NAia = NAib> NAic (the radius Rib shown in FIG. 18 and FIG. 19 is set to a relationship equal to the radius Ria), as shown in FIG. 21 Like the combination code A2, an i-ray-narrow-band interference filter SWa is installed in each of the wavelength selection sections 6A and 6B, and an i-ray + h-ray-interference filter SWc is installed in the wavelength selection section 6C. In this case, on the exit surface epi of the fly-eye lens system FEn shown in FIG. 19, there is an i-ray (narrow) spectral distribution throughout the entire area of the circular area CFa with a radius of Ria (= Rib) (FIG. 6 ) Countless spot lights SPa 'and SPb' are also arranged in the circular area CFc with a radius of Ric, and furthermore, countless spot lights SPc 'with a spectral distribution of i-rays + h-rays (Figure 8) are also arranged in the same way .

因此,依據本實施方式,可使於成為第2照明光學系統ILn之照明光瞳面的複眼透鏡系統FEn之射出面epi上所形成之2次光源像(無數個點光SPa'、SPb'、SPc'之聚集像)之分布範圍內之波長特性,根據與光軸AX2之直徑方向之位置而變化。於此情形時,成為於圖20所示之對光罩基板M進行照明之照明光束Irn的從主光線Lpi起之發散角θic之範圍(數值孔徑NAic)內之光線中,包括包含i射線及h射線之兩者之明線波長的光譜,於發散角θic至發散角θia(=θib)之間之環帶狀範圍(數值孔徑NAic~NAia)內之光線中,僅包含i射線(寬)之光譜。如上所述,若使形成於第2照明光學系統ILn之照明光瞳面上的2次光源像之波長特性於直徑方向上變化,則形成於光罩基板M上之圖案可抑制由半色調圖案或相位偏移圖案之情形時之圖案製造誤差等之影響所造成之投影像之品質下降。Therefore, according to this embodiment, it is possible to make a secondary light source image (an infinite number of point lights SPa ', SPb', The wavelength characteristics within the distribution range of the SPc 'aggregate image) vary depending on the position in the diameter direction from the optical axis AX2. In this case, the rays within the range (numerical aperture NAic) of the divergence angle θic from the main ray Lpi of the illumination beam Irn that illuminates the mask substrate M shown in FIG. 20 include i rays and The spectrum of the two bright-line wavelengths of the h-rays includes only the i-rays (width) in the light in a ring-shaped range (numerical aperture NAic to NAia) between the divergence angle θic to the divergence angle θia (= θib). Of the spectrum. As described above, if the wavelength characteristics of the secondary light source image formed on the illumination pupil surface of the second illumination optical system ILn are changed in the diameter direction, the pattern formed on the mask substrate M can be suppressed from the halftone pattern. The quality of the projected image is reduced due to the effects of pattern manufacturing errors, etc. in the case of phase shift patterns.

通常,半色調圖案或相位偏移圖案係以於特定波長之照明光之照射下使用為前提,以該特定波長下之振幅透射率成為既定條件之方式,於光罩基板形成管理膜厚之位移層而製作。然而,於該膜厚產生誤差之情形、或者改變照明光之數值孔徑(照明σ值)之情形時,位移層之振幅透射率從所需條件產生變動(劣化),產生如無法按目標來獲得投影曝光之圖案像之對比度、無法獲得作為目標之微細度之成像性能之下降。本實施方式中,即便於使用如上所述之半色調圖案或相位偏移圖案之光罩基板之情形時,亦可使二維地形成於對光罩基板M進行照明之照明光學系統(第2照明光學系統ILn)之照明光瞳面上之光源像之波長特性(光譜)於直徑方向上不同,因此於位移層之膜厚產生誤差之情形、或改變照明光之數值孔徑(照明σ值)之情形時,亦可抑制由位移層之振幅透射率之變動(劣化)所造成之成像性能之下降。Generally, a halftone pattern or a phase shift pattern is premised on the use under illumination of a specific wavelength of illumination, and the displacement of the management film thickness is formed on the mask substrate so that the amplitude transmittance at that specific wavelength becomes a predetermined condition. Layer. However, in the case where an error occurs in the film thickness or when the numerical aperture (illumination σ value) of the illumination light is changed, the amplitude transmittance of the displacement layer changes (deteriorates) from the required condition. The contrast of the pattern image of the projection exposure and the degradation of the imaging performance in which the target fineness cannot be obtained. In the present embodiment, even in the case of using a photomask substrate having the halftone pattern or the phase shift pattern as described above, it is possible to form a two-dimensionally formed illumination optical system for illuminating the photomask substrate M (second Illumination optical system ILn) The wavelength characteristics (spectrum) of the light source image on the illumination pupil surface are different in the diameter direction, so if there is an error in the film thickness of the displacement layer, or the numerical aperture of the illumination light (illumination σ value) is changed In this case, it is also possible to suppress a decrease in imaging performance caused by a change (deterioration) in the amplitude transmittance of the displacement layer.

[變形例1]
以上,於第1實施方式中,將3個水銀燈2A、2B、2C設為相同規格之超高壓水銀放電燈,主要將i射線之明線波長及h射線之明線波長用於圖案曝光,但亦可進而將g射線之明線波長用於圖案曝光。於此情形時,使用於包含i射線、h射線、g射線之3種明線之廣波長範圍內經色差修正之投影光學系統。此外,如日本特開2012-049332號公報中所揭示,對於搭載有將大凹面鏡與小凸面鏡加以組合之鏡面投射方式之投影光學系統的投影曝光裝置,亦可應用本實施方式之照明裝置(第1照明光學系統、第2照明光學系統ILn)。鏡面投射方式之投影光學系統由於不使用折射力強之透鏡元件,故而基本上不產生由照明光之波長之差異所引起之色差,可容易使用水銀燈之i射線、h射線、g射線之3種明線波長。又,雖將3個水銀燈2A、2B、2C設為相同規格之超高壓水銀放電燈,但就來自電弧放電部之光之波長特性而言,亦可將i射線、h射線、g射線各自之波峰強度之比率與圖5所示之比率不同之高壓水銀放電燈、與超高壓水銀放電燈進行組合,視情形,亦可將短電弧型之低壓水銀放電燈與超高壓水銀放電燈加以組合。從水銀燈2至入射側之光纖束12為止之第1照明光學系統之數量若為2以上即可,例如,於部分投影光學系統PLn之數量為6以上之情形時,為了確保照明光束Irn之照度,只要設置4個水銀燈2A~2D、4個第1照明光學系統、及4個入射側之光纖束12A~12D即可。
[Modification 1]
As described above, in the first embodiment, three mercury lamps 2A, 2B, and 2C are set as ultra-high-pressure mercury discharge lamps of the same specifications. The bright-line wavelengths of i-rays and bright-line wavelengths of h-rays are mainly used for pattern exposure. The bright-line wavelength of g-rays can also be used for pattern exposure. In this case, a projection optical system that is corrected for chromatic aberration in a wide wavelength range including three bright lines of i-ray, h-ray, and g-ray is used. In addition, as disclosed in Japanese Patent Application Laid-Open No. 2012-049332, a projection exposure apparatus equipped with a projection optical system having a specular projection method in which a large concave mirror and a small convex mirror are combined can also be applied with the illumination device of this embodiment (No. 1 illumination optical system, 2nd illumination optical system ILn). Since the projection optical system of the specular projection method does not use a lens element with strong refractive power, it basically does not produce chromatic aberration caused by the difference in the wavelength of the illumination light. It can easily use three types of i-rays, h-rays, and g-rays of mercury lamps. Bright line wavelength. In addition, although the three mercury lamps 2A, 2B, and 2C are ultrahigh-pressure mercury discharge lamps of the same specifications, as for the wavelength characteristics of the light from the arc discharge section, i-rays, h-rays, and g-rays can also be A combination of a high-pressure mercury discharge lamp having a ratio of peak intensity and a ratio different from that shown in FIG. 5 and an ultra-high-pressure mercury discharge lamp may be combined with a short-arc type low-pressure mercury discharge lamp and an ultra-high-pressure mercury discharge lamp, as appropriate. The number of the first illumination optical system from the mercury lamp 2 to the incident optical fiber bundle 12 may be 2 or more. For example, when the number of partial projection optical systems PLn is 6 or more, in order to ensure the illuminance of the illumination beam Irn As long as four mercury lamps 2A to 2D, four first illumination optical systems, and four incident side optical fiber bundles 12A to 12D can be provided.

[變形例2]
安裝於上述圖3、圖4所示之波長選擇部6A、6B、6C中之干涉濾光器係設為具有圖6~圖8分別所示之波長特性之i射線-窄頻帶干涉濾光器SWa、i射線-寬頻帶干涉濾光器SWb、i射線+h射線-干涉濾光器SWc之3種,但於投影光學系統(部分投影光學系統PLn)可使用至g射線之波長之情形時,可準備g射線-窄頻帶干涉濾光器或g射線-寬頻帶干涉濾光器、超寬頻帶域用i射線+h射線+g射線-干涉濾光器,安裝於滑動機構FX上。又,為了僅包含h射線之明線波長,亦可準備h射線-窄頻帶干涉濾光器或h射線-寬頻帶干涉濾光器。於準備僅包含h射線之明線波長之干涉濾光器之情形時,例如,將i射線-窄頻帶干涉濾光器SWa或i射線-寬頻帶干涉濾光器SWb之一者安裝於波長選擇部6A、6B之各個,且將h射線-窄頻帶干涉濾光器或h射線-寬頻帶干涉濾光器之一者安裝於波長選擇部6C上。而且,對倍率可變部8A、8B、8C之各個進行調整,將射入至光纖束12A之光束BMa(i射線)之數值孔徑NAia、與射入至光纖束12B之光束BMb(i射線)之數值孔徑NAib,以照明σ值成為大值(例如0.7以上)之方式設定為相同值,射入至光纖束12C之光束BMc(h射線)之數值孔徑NAic係以成為NAia=NAib>NAic之關係之方式設定。
[Modification 2]
The interference filters installed in the wavelength selection sections 6A, 6B, and 6C shown in FIGS. 3 and 4 are i-ray-narrow-band interference filters having wavelength characteristics shown in FIGS. 6 to 8 respectively. SWa, i-ray-broadband interference filter SWb, i-ray + h-ray-interference filter SWc, but when the projection optical system (partial projection optical system PLn) can be used to the wavelength of g-ray, A g-ray-narrow-band interference filter or a g-ray-broadband interference filter, an i-ray + h-ray + g-ray-interference filter for ultra-wideband can be prepared and mounted on the sliding mechanism FX. In addition, in order to include only the bright-line wavelength of the h-ray, an h-ray-narrow-band interference filter or an h-ray-broadband interference filter may be prepared. When preparing an interference filter including only the bright-line wavelength of the h-ray, for example, one of the i-ray-narrow-band interference filter SWa or the i-ray-broadband interference filter SWb is installed in the wavelength selection Each of the sections 6A, 6B, and one of the h-ray-narrowband interference filter or the h-ray-broadband interference filter is mounted on the wavelength selection section 6C. In addition, each of the magnification variable sections 8A, 8B, and 8C is adjusted so that the numerical aperture NAia of the light beam BMa (i-ray) incident on the optical fiber bundle 12A and the light beam BMb (i-ray) incident on the optical fiber bundle 12B are adjusted. The numerical aperture NAib is set to the same value such that the illumination σ value becomes a large value (for example, 0.7 or more). The numerical aperture NAic of the light beam Bmc (h-ray) incident on the fiber bundle 12C is NAia = NAib > NAic Relationship mode setting.

於此情形時,於成為第2照明光學系統ILn之照明光瞳面的複眼透鏡系統FEn之射出面epi上形成之2次光源像(無數個點光SPa'、SPb'、SPc'之集合像)中,包含:在與數值孔徑NAia(=NAib)對應之半徑為Ria(=Rib)之區域CFa(=CFb)內之整體中散布的僅包含i射線之明線波長之無數個點光SPa'、SPb';以及僅在與數值孔徑NAic對應之半徑為Ric之區域CFc內散布的僅包含h射線之明線波長之無數個點光SPc'。因此,形成於複眼透鏡系統FEn之射出面epi上之2次光源像係設定為如下之波長分布特性:與遍及半徑為Ria之區域CFa(與最大之數值孔徑NAia對應)之整體而以大致一定之強度分布之i射線之明線波長之光譜成分,並且包含僅分布於內側之半徑為Ric(<Ria)之區域CFc內的h射線之明線波長之光譜成分。In this case, a secondary light source image (a collective image of countless point lights SPa ', SPb', SPc 'formed on the exit surface epi of the fly-eye lens system FEn, which becomes the illumination pupil surface of the second illumination optical system ILn. ), Including: Countless spot light SPa including only the bright-line wavelength of i-rays scattered in the whole in the area CFa (= CFb) with a radius Ria (= Rib) corresponding to the numerical aperture NAia (= NAib) ', SPb'; and an unlimited number of point lights SPc 'including only bright-line wavelengths of h-rays scattered only in the area CFc with a radius Ric corresponding to the numerical aperture NAic. Therefore, the secondary light source image formed on the exit surface epi of the fly-eye lens system FEn is set to have a wavelength distribution characteristic that is approximately constant over the entire CFa (corresponding to the largest numerical aperture NAia) across the area with a radius of Ria. The intensity component of the bright-line wavelength spectrum of the i-ray includes a spectral component of the bright-line wavelength of the h-ray only distributed in the area CFc with a radius Ric (<Ria) inside.

又,於準備h射線-窄頻帶干涉濾光器或h射線-寬頻帶干涉濾光器之情形時,亦可藉由倍率可變部8A、8B、8C各自之調整,將形成於第2照明光學系統ILn之照明光瞳面上之2次光源像之波長分布特性設定為與上述相反。即,亦可將形成於第2照明光學系統ILn之照明光瞳面(射出面epi)上之2次光源像之半徑為Ria之區域CFa(與最大之數值孔徑NAia對應)之整體作為h射線之明線波長之光譜成分,且僅將內側之半徑為Ric(<Ria)之區域CFc內作為i射線之明線波長之光譜成分。此外,干涉濾光器係將既定之波長寬度之光譜成分抽出之帶通濾光器,亦可將透射較截止波長更長之波長成分的低通濾光器、與透射較截止波長更短之波長成分的高通濾光器串聯地排列者,安裝於透鏡系統6A1、6A2之間。於該情形時,準備截止波長設定為350 nm~360 nm附近之低通濾光器、以及截止波長約為375 nm之第1高通濾光器及截止波長約為395 nm之第2高通濾光器,以可交換之方式設置第1高通濾光器及第2高通濾光器。藉此,低通濾光器與第1高通濾光器之組合中,抽出如圖6所示之i射線(窄)之光譜成分,於低通濾光器與第2高通濾光器之組合中,抽出如圖7所示之i射線(寬)之光譜成分。In addition, when preparing an h-ray-narrow-band interference filter or an h-ray-broadband interference filter, they can also be formed in the second illumination by adjusting each of the variable magnification units 8A, 8B, and 8C. The wavelength distribution characteristics of the secondary light source image on the illumination pupil plane of the optical system ILn are set to be opposite to the above. That is, the entirety of the area CFa (corresponding to the largest numerical aperture NAia) of the secondary light source image having a radius of Ria formed on the illumination pupil surface (emission surface epi) of the second illumination optical system ILn may be used as the h-ray. The spectral component of the bright-line wavelength of the bright line, and only the spectral component of the bright-line wavelength of the i-ray in the area CFc with a radius Ric (<Ria) on the inner side. In addition, the interference filter is a band-pass filter that extracts a spectral component of a predetermined wavelength width, and a low-pass filter that transmits a wavelength component that is longer than the cut-off wavelength and a transmission that is shorter than the cut-off wavelength. The high-pass filters with wavelength components are arranged in series, and are mounted between the lens systems 6A1 and 6A2. In this case, prepare a low-pass filter with a cut-off wavelength set around 350 nm to 360 nm, a first high-pass filter with a cut-off wavelength of about 375 nm, and a second high-pass filter with a cut-off wavelength of about 395 nm. The filter is provided with a first high-pass filter and a second high-pass filter in an interchangeable manner. Thus, in the combination of the low-pass filter and the first high-pass filter, the i-ray (narrow) spectral component shown in FIG. 6 is extracted, and the combination of the low-pass filter and the second high-pass filter is used. In FIG. 7, the spectral components of the i-ray (wide) are extracted as shown in FIG. 7.

[變形例3]
於顯示面板之基板或電子零件安裝用電路基板等元件之製造階段、或者安裝於蒸鍍裝置內而用以將被處理基板上之蒸鍍部分加以劃分之精細金屬光罩(所謂模板光罩)之製造階段等中,存在對以通常厚度(0.5~1.5 μm)之數倍~10倍左右之厚度塗佈於板P上之負型光阻劑層(光感應層)進行圖案曝光之情形。負型光阻劑與正型光阻劑相比,感光度小者較多,曝光用照明光束Irn所照射之部分具有對顯影液成為不溶解性而殘膜之特性。進而,負型光阻劑存在對曝光用照明光束Irn之波長之感度或吸收率具有大的差異之情形。圖23係表示於橫軸上表示照明光束Irn之波長(nm),且於縱軸上表示經標準化之吸收率(0~1)的負型光阻劑之光吸收特性之一例的圖表。於圖23之光阻劑之情形時,於波長320 nm附近存在吸收之波峰,具有於波長320 nm~450 nm之間,吸收率大致線形地減少之特性(吸收率之波長依存性),i射線之明線波長365 nm之吸收率成為約0.5,且h射線之明線波長405 nm之吸收率成為約0.15。該圖23之特性為一例,根據抗蝕劑之材料物質而大為不同。於具有如圖23之特性的負型光阻劑層之厚度為10 μm以上之情形時,若利用包含i射線之明線波長及h射線之明線波長之兩者的照明光束Irn來進行圖案曝光,則根據吸收率之波長依存性,i射線之明線波長之光於抗蝕劑層之表面部分被大量吸收,對抗蝕劑層之底側(板P側)未賦予充分之光量。與此相對,h射線之明線波長之光由於抗蝕劑層中之吸收少,故而對抗蝕劑層之底側(板P側)亦賦予充分之光量。
[Modification 3]
At the manufacturing stage of the substrate of the display panel or the circuit board for mounting electronic parts, or a fine metal mask (a so-called stencil mask) installed in the evaporation device to divide the evaporated portion on the substrate to be processed. In the manufacturing stage and the like, pattern exposure may be performed on a negative photoresist layer (photosensitive layer) coated on the plate P with a thickness of several times to 10 times the normal thickness (0.5 to 1.5 μm). Negative photoresist has more sensitivity than positive photoresist, and the part irradiated by the exposure illumination beam Irn has the characteristics of insolubility to the developing solution and residual film. Furthermore, the negative photoresist may have a large difference in sensitivity or absorptivity to the wavelength of the exposure illumination beam Irn. FIG. 23 is a graph showing an example of the light absorption characteristics of a negative photoresist showing the wavelength (nm) of the illumination light beam Irn on the horizontal axis and the standardized absorptivity (0 to 1) on the vertical axis. In the case of the photoresist of Fig. 23, there is an absorption peak near the wavelength of 320 nm, and the characteristic is that the absorptivity decreases linearly between the wavelengths of 320 and 450 nm (wavelength dependence of the absorptivity), i The absorptivity of the bright-line wavelength of 365 nm of the ray becomes approximately 0.5, and the absorptivity of the bright-line wavelength of 405 nm of the h-ray becomes approximately 0.15. The characteristic of FIG. 23 is an example, and it varies greatly depending on the material of the resist. When the thickness of the negative photoresist layer having the characteristics as shown in FIG. 23 is 10 μm or more, the pattern is performed by using an illumination beam Irn including both the bright-line wavelength of the i-ray and the bright-line wavelength of the h-ray. According to the wavelength dependence of the absorptance, a large amount of light of the bright-line wavelength of the i-ray is absorbed on the surface portion of the resist layer during exposure, and a sufficient amount of light is not given to the bottom side (plate P side) of the resist layer. On the other hand, since the light of the bright-line wavelength of the h-ray has less absorption in the resist layer, a sufficient amount of light is also given to the bottom side (plate P side) of the resist layer.

由於抗蝕劑層之厚度大、以及存在吸收率之波長依存性,故而若於波長選擇部6A、6B、6C之各個安裝圖8所示之i射線+h射線-干涉濾光器SWc(選擇圖21之表中之組合代碼C0),將光罩基板M之圖案投影曝光於板P上,則可將顯影後殘膜之抗蝕劑層之圖案(抗蝕劑像)之邊緣部(側壁)設為與板P之表面不垂直而傾斜之狀態。圖24係示意性表示顯影後殘膜之抗蝕劑像之邊緣部(側壁)之傾斜的剖面圖。圖24中,於板P(此處於表面形成有鎳等金屬膜)之表面上,負型抗蝕劑層Luv係以厚度RT(10 μm以上)來形成,顯影後將抗蝕劑層Luv之未曝光部(非照射部)去除而於邊緣部Ewa、Ewb之間形成開口部HL。於製作精細金屬光罩之情形時,於該開口部HL中露出之板P上,藉由電鍍而堆積金屬層(鎳或銅等)。成為抗蝕劑層Luv之邊緣部Ewa、Ewb的側壁於此處形成為朝向開口部HL側而傾斜之狀態,即所謂倒錐狀。Because the thickness of the resist layer is large and the wavelength dependence of the absorptivity is present, if each of the wavelength selection sections 6A, 6B, and 6C is mounted with the i-ray + h-ray-interference filter SWc shown in FIG. 8 (selection diagram) The combination code C0 in the table of 21), when the pattern of the photomask substrate M is projected and exposed on the plate P, the edge portion (side wall) of the pattern (resist image) of the resist layer of the residual film after development can be projected. It is in a state of being inclined not perpendicular to the surface of the plate P. FIG. 24 is a cross-sectional view schematically showing an inclination of an edge portion (side wall) of a resist image of a residual film after development. In FIG. 24, on the surface of the plate P (here, a metal film such as nickel is formed on the surface), a negative resist layer Luv is formed with a thickness RT (10 μm or more). After the development, the resist layer Luv is formed. The unexposed portion (non-irradiated portion) is removed, and an opening portion HL is formed between the edge portions Ewa and Ewb. In the case of manufacturing a fine metal mask, a metal layer (such as nickel or copper) is deposited on the plate P exposed in the opening HL by electroplating. The sidewalls of the edge portions Ewa and Ewb serving as the resist layer Luv are formed here so as to be inclined toward the opening HL side, which is a so-called inverted cone shape.

如上所述,為了將成為抗蝕劑像之邊緣部Ewa、Ewb的側壁之傾斜量控制為所需之值,可藉由安裝於波長選擇部6A、6B、6C之各個之干涉濾光器之組合,來調整照明光束Irn中所包含之i射線之明線波長之光量(與圖6或圖7中之斜線部之面積相當)與h射線之明線波長之光量之平衡;或者可藉由倍率可變部8A、8B、8C之各個,來獨立地調整照明光束Irn中所包含之i射線之明線波長之照明光束之數值孔徑、及h射線之明線波長之照明光束之數值孔徑等。此外,對成為顯影後之抗蝕劑像之邊緣部Ewa、Ewb的側壁賦予所需之傾斜量,並不限定於負型光阻劑,對於正型光阻劑亦同樣可進行。As described above, in order to control the amount of inclination of the sidewalls of the edge portions Ewa, Ewb, which become the resist image, to a desired value, the interference filter mounted on each of the wavelength selection portions 6A, 6B, and 6C can be used. Combination to adjust the light amount of the bright-line wavelength of the i-ray included in the illumination beam Irn (equivalent to the area of the oblique line in FIG. 6 or 7) and the light amount of the bright-line wavelength of the h-ray; or by Each of the magnification variable sections 8A, 8B, and 8C independently adjusts the numerical aperture of the illumination beam of the bright-line wavelength of the i-ray included in the illumination beam Irn, and the numerical aperture of the illumination beam of the bright-line wavelength of the h-ray, etc. . In addition, it is not limited to a negative type photoresist to give a desired tilt amount to the side walls of the edge portions Ewa and Ewb which become a developed resist image, and it can be performed similarly to a positive type photoresist.

於將抗蝕劑層Luv作為精細金屬光罩製造時或配線層之形成時之鍍敷步驟中的掩蔽層之情形時,亦可利用由東京應化工業股份有限公司作為鍍敷用光阻劑來銷售之商品名PMER P-CS系列、PMER P-LA系列、PMER P-HA系列、PMER P-CE系列、或者萘醌型或化學增幅型PMER P-WE系列、PMER P-CY系列之光阻劑、商品名PMER-N-HC600PY之負型光阻劑等。此外,亦可利用由山榮化學股份有限公司所銷售之商品名為SPR-558C-1、SPR-530CMT-A之鍍敷用抗蝕劑。又,亦可將於圖案曝光時之照明光束Irn之波長區域中具有適當之光吸收率,以紫外線硬化型單體・寡聚物(環氧丙烯酸酯、丙烯酸胺基甲酸酯、聚酯丙烯酸酯)、光聚合起始劑、光增感劑、添加劑等作為組成的紫外線硬化型樹脂設為光感應層來作為抗蝕劑層Luv。In the case where the resist layer Luv is used as a masking layer in the plating step during the manufacture of a fine metal photomask or the formation of a wiring layer, Tokyo Yinghua Chemical Industry Co., Ltd. may be used as a photoresist for plating. The products to be sold are PMER P-CS series, PMER P-LA series, PMER P-HA series, PMER P-CE series, or naphthoquinone or chemically amplified PMER P-WE series, PMER P-CY series. Resist, negative photoresist under the trade name PMER-N-HC600PY, etc. In addition, plating resists sold under the trade names of SPR-558C-1 and SPR-530CMT-A sold by Shanrong Chemical Co., Ltd. can also be used. In addition, it is also possible to use a UV-curable monomer / oligomer (epoxy acrylate, acrylate urethane, polyester acrylic acid) having an appropriate light absorption in the wavelength region of the illumination beam Irn at the time of pattern exposure. Ester), a photopolymerization initiator, a photosensitizer, an additive, and the like as a UV-curable resin having a composition are set as a photosensitive layer as a resist layer Luv.

[變形例4]
於僅使用i射線-窄頻帶干涉濾光器或i射線-寬頻帶干涉濾光器,且將曝光用照明光束Irn設為僅包含i射線之明線波長之光的情形時,可進行圖案曝光時之高解析化,但隨著高解析化(照明光束之短波長化),焦點深度(DOF:Depth of Focus)亦減少。因此,為了於高解析之狀態下抑制DOF之減少,亦存在如將形成於照明光學系統之照明光瞳面上之光源像(2次光源像)之形狀設為環帶狀、設為於照明光瞳面內之以光軸為中心之點對稱之位置(區域)上偏在之4極狀之情形。於該情形時,於複眼透鏡系統FEn之射出面epi之位置或者其附近之位置,設置形成有環帶狀、或者4極狀之透光部之光闌板(照明開口光闌)。
[Modification 4]
Pattern exposure can be performed when only an i-ray-narrow-band interference filter or an i-ray-broadband interference filter is used, and the exposure illumination beam Irn is set to include only light of the bright-line wavelength of the i-ray. At the time of high resolution, the depth of focus (DOF: Depth of Focus) also decreases with the high resolution (shorter wavelength of the illumination beam). Therefore, in order to suppress the reduction of DOF in a high-resolution state, there is also a case where the shape of a light source image (secondary light source image) formed on the illumination pupil surface of the illumination optical system is set to be a ring shape, and is set to be illuminated. In the pupil plane, the position (area) with a point symmetrical about the optical axis as the center is biased to a quadrupole shape. In this case, an aperture plate (illumination aperture diaphragm) having an endless belt-shaped or 4-pole light-transmitting portion is provided at or near the exit surface epi of the fly-eye lens system FEn.

圖25(A)與圖25(B)分別為示意性表示形成有環帶狀透光部之光闌板APa、及形成有4極狀透光部之光闌板APb之XY面內之形狀的圖,正交座標系XYZ係與上述圖18相符。光闌板APa係將蒸鍍於石英之平行平板之表面上之鉻等遮光層藉由蝕刻而去除為環帶狀,如圖25(A)般形成有環帶狀透光部TPa。光闌板APb亦同樣地,將石英之平行平板之表面之遮光層藉由蝕刻而去除為4極狀,如圖25(B)般,於以光軸AX2為原點之XY座標之4個象限之各個形成有扇形透光部TPb。此外,光闌板APb亦可僅設為使於X方向及Y方向上延伸之遮光帶於光軸AX2之位置上十字狀地交叉之遮光部。FIGS. 25 (A) and 25 (B) are diagrams showing the shapes in the XY plane of the diaphragm plate APa having the annular light-transmitting portion and the diaphragm plate APb having the quadrupole-shaped light transmitting portion, respectively. In the figure, the orthogonal coordinate system XYZ system is consistent with the above-mentioned FIG. 18. The aperture plate APa removes a light-shielding layer such as chromium vapor-deposited on the surface of a parallel flat plate of quartz into an endless belt shape by etching. As shown in FIG. 25 (A), an endless belt-shaped light transmitting portion TPa is formed. In the same way, the diaphragm plate APb removes the light-shielding layer on the surface of the parallel flat plate of quartz into a 4-pole shape by etching. As shown in FIG. 25 (B), four of the XY coordinates with the optical axis AX2 as the origin Each of the quadrants is formed with a fan-shaped light transmitting portion TPb. In addition, the diaphragm plate APb may be a light-shielding portion in which the light-shielding belts extending in the X and Y directions intersect in a cross shape at the position of the optical axis AX2.

[變形例5]
於上述圖4所示之第1照明光學系統中所包含之波長選擇部6A(6B、6C)上,設置有:透鏡系統(準直透鏡)6A1,其將從橢圓鏡4A(4B、4C)之第2焦點之位置PS1發散而行進之光束BM射入,來轉換為大致平行之光束;以及透鏡系統6A2,其將大致平行之光束收斂於焦點位置PS2上。於透鏡系統6A1、6A2之間之光路中安裝有干涉濾光器SWa、SWb、SWc等中之任一個,但亦可合併設置如圖25(A)般之環帶狀光闌板。圖26係表示於第1照明光學系統之波長選擇部6A上配置有環帶狀光闌板APa'之狀態的圖,對與圖4所示之構件相同者標註相同符號。
[Modification 5]
On the wavelength selection section 6A (6B, 6C) included in the first illumination optical system shown in FIG. 4 above, a lens system (collimating lens) 6A1 is provided, which will be from the elliptical mirror 4A (4B, 4C) The second focal point position PS1 diverges and travels a light beam BM that is incident to be converted into a substantially parallel light beam; and a lens system 6A2 that converges the substantially parallel light beam on the focal position PS2. In the optical path between the lens systems 6A1 and 6A2, any one of the interference filters SWa, SWb, SWc, etc. is installed, but a ring-shaped diaphragm plate as shown in FIG. 25 (A) can also be combined. FIG. 26 is a diagram showing a state in which a ring-shaped diaphragm plate APa ′ is arranged on the wavelength selection section 6A of the first illumination optical system, and the same components as those shown in FIG. 4 are denoted by the same reference numerals.

圖26中,環帶狀光闌板APa'係將以下之層形成於石英之平板上而構成:底部附近遮光層,其將與藉由透鏡系統6A1而大致成為平行光束之光束BM之最大直徑對應而規定的外輪直徑之外側遮蔽;以及圓形之中央遮光層,其將以光軸AX1為中心之內輪直徑之內側遮蔽。光闌板APa'係與干涉濾光器SWa(或者SWb、SWc等)同樣,安裝於滑動機構FX上,設置為可於光路中插拔。從環帶狀光闌板APa'之環帶狀透光部TPa中透射之照明光束BMa藉由透鏡系統6A2而收斂於焦點位置PS2上後,再次發散而朝向後段之倍率可變部8A。光闌板APa'之外輪直徑係規定照明光束BMa之最大數值孔徑NAd1,光闌板APa'之內輪直徑係規定在照明光束BMa之剖面內,於圓形中強度分布成為零之中空範圍之數值孔徑NAd2。In Fig. 26, the ring-shaped diaphragm plate APa 'is formed by forming the following layers on a flat plate of quartz: a light-shielding layer near the bottom, which has a maximum diameter equal to that of a light beam BM which becomes a substantially parallel light beam by the lens system 6A1. Correspondingly, the outer side diameter of the outer wheel diameter is shielded; and a circular central light-shielding layer that shields the inner side of the inner wheel diameter centered on the optical axis AX1. The diaphragm plate APa ′ is mounted on the sliding mechanism FX similarly to the interference filter SWa (or SWb, SWc, etc.), and is provided so as to be insertable and removable in the optical path. The illuminating light beam BMa transmitted from the ring-shaped light transmitting portion TPa of the ring-shaped diaphragm plate APa ′ converges on the focal position PS2 by the lens system 6A2, and then diverges again toward the variable magnification portion 8A at the rear stage. The outer diameter of the diaphragm APa 'specifies the maximum numerical aperture NAd1 of the illumination beam BMa. The inner diameter of the diaphragm APa' specifies the diameter of the illumination beam BMa in the cross section of the illumination beam BMa. Numerical aperture NAd2.

由光闌板APa'來設為環帶狀之強度分布的照明光束BMa係藉由後段之倍率可變部8A,而調整射入至光纖束12A之入射端FBi時之整體之數值孔徑,但對光纖束12A之入射端FBi之各個光纖線所射入之光束成為保持最大數值孔徑NAd1與中空範圍之數值孔徑NAd2之比率者。如上述圖16所說明,各個光纖線係於保存入射光之數值孔徑(發散角)之狀態下進行光傳輸,因此從射出側之光纖束FGn之各自之射出端FBo中射出之光束BSa之數值孔徑成為與從光纖束12A之入射端FBi中射入之光束BMa之數值孔徑相同。因此,於本變形例之情形時,從光纖束FGn之各自之射出端FBo中射出之光束BSa(由形成於射出端FBo上之點光SPa而來之發散光束)具有保持最大數值孔徑NAd1與中空範圍之數值孔徑NAd2之比率的環帶狀分布。從形成於光纖束FGn之各自之射出端FBo上之多數個點光SPa之各個發散而行進之照明光束BSa係如上述圖17所說明,於複眼透鏡系統FEn之入射面poi上重疊,但由於照明光束BSa自身具有環帶狀之強度分布,故而於複眼透鏡系統FEn之入射面poi上,以維持最大數值孔徑NAd1與中空範圍之數值孔徑NAd2之比率(環帶比)之狀態的環帶狀分布來重疊。同樣,於其他波長選擇部6B、6C之光路中,亦以可插拔之方式設置環帶狀光闌板APa'。The illumination beam BMa having an intensity distribution in the shape of an annular band by the diaphragm APa ′ is adjusted by the numerical magnification section 8A at the rear stage to adjust the overall numerical aperture when it is incident on the incident end FBi of the fiber bundle 12A. The light beam incident on each optical fiber line of the incident end FBi of the optical fiber bundle 12A becomes a ratio that maintains the maximum numerical aperture NAd1 and the numerical aperture NAd2 in the hollow range. As explained in FIG. 16 above, each optical fiber line transmits light while keeping the numerical aperture (divergence angle) of the incident light. Therefore, the numerical values of the light beams BSa emitted from the respective exit ends FBo of the optical fiber bundles FGn on the exit side. The aperture becomes the same as the numerical aperture of the light beam BMa incident from the incident end FBi of the optical fiber bundle 12A. Therefore, in the case of this modification, the light beam BSa (the divergent light beam from the point light SPa formed on the output end FBo) emitted from the respective output ends FBo of the optical fiber bundle FGn has a maximum numerical aperture NAd1 and An annular band distribution of the ratio of the numerical aperture NAd2 in the hollow range. The illumination light beam BSa traveling from each of the plurality of spot lights SPa formed on the respective exit ends FBo of the optical fiber bundle FGn is traveling on the incident surface poi of the fly-eye lens system FEn as explained in FIG. 17 above. The illumination beam BSa itself has a ring-shaped intensity distribution, so it is a ring-shaped band on the incident surface poi of the fly-eye lens system FEn to maintain the ratio (ring-band ratio) of the maximum numerical aperture NAd1 to the numerical aperture NAd2 of the hollow range. The distributions overlap. Similarly, in the optical paths of the other wavelength selection sections 6B and 6C, a ring-shaped diaphragm plate APa ′ is also detachably provided.

如以上所述,本變形例中,可將於複眼透鏡系統FEn之入射面poi上重疊而照射之照明光束BSa、BSb、BSc中之至少1個,設為具有以光軸AX2為中心之所需環帶比之環帶狀強度分布。因此,藉由倍率可變部8A、8B、8C之調整,形成於複眼透鏡系統FEn之射出面epi上之無數個點光SPa'、SPb'、SPc'中,例如點光SPa'及SPb'可分布於圖18或圖19所示之半徑為Ric之區域CFc之外側之環帶狀範圍內,點光SPc'可分布於圖18或圖19所示之半徑為Ric之區域CFc內。此時,藉由適當選定於波長選擇部6A、6B、6C之各個安裝之干涉濾光器之組合,例如,可使分布於半徑為Ric之區域CFc之外側之環帶狀範圍內的點光SPa'及SPb'具有i射線(窄)之光譜,且可使分布於半徑為Ric之區域CFc內之點光SPc'具有h射線(窄)之光譜。即,可將形成於第2照明光學系統ILn之照明光瞳面(複眼透鏡系統FEn之射出面epi)上之光源像之波長特性,根據從光軸AX2起之距離(與數值孔徑對應)而改變為完全不同之波長。As described above, in this modification, at least one of the illumination light beams BSa, BSb, and BSc that can be irradiated on the incident surface poi of the fly-eye lens system FEn is set to have a center around the optical axis AX2. The ring-shaped band strength distribution is required. Therefore, by adjusting the variable magnification units 8A, 8B, and 8C, countless spot lights SPa ', SPb', and SPc 'formed on the exit surface epi of the fly-eye lens system FEn, such as the spot lights SPa' and SPb ' It can be distributed in a ring-shaped range outside the area CFc having a radius Ric as shown in FIG. 18 or 19, and the spot light SPc 'can be distributed within the area CFc having a radius Ric as shown in FIG. 18 or 19. At this time, by appropriately selecting a combination of interference filters installed in each of the wavelength selection sections 6A, 6B, and 6C, for example, it is possible to distribute spot light in a ring-shaped range outside the area CFc with a radius of Ric. SPa 'and SPb' have an i-ray (narrow) spectrum, and the point light SPc 'distributed in the area CFc with a radius Ric can have an h-ray (narrow) spectrum. That is, the wavelength characteristics of the light source image formed on the illumination pupil surface (the exit surface epi of the fly-eye lens system FEn) of the second illumination optical system ILn can be determined based on the distance from the optical axis AX2 (corresponding to the numerical aperture). Change to a completely different wavelength.

此外,如圖26所示,環帶狀光闌板APa'設置於波長選擇部6A(6B、6C)內之光路中,但亦可設置於倍率可變部8A(8B、8C)內之光路中。進而,亦可安裝與如圖25(B)所示之4極狀光闌板APb同樣之光闌板APb',來代替圖26中之環帶狀光闌板APa'。於該情形時,照射於複眼透鏡系統FEn之入射面poi上之照明光束BSa(或者BSb、BSc)係如圖25(B)之透光部TPb般重疊於4處扇狀之區域。又,本變形例中,由於照射於複眼透鏡系統FEn之入射面poi上之照明光束BSa(或者BSb、BSc)與包含光軸AX2之通常之圓形、不包含光軸AX2之環帶狀、或者4極狀之區域重疊,故而若與僅利用如上述圖25(A)、圖25(B)所示之光闌板APa、APb來遮蔽2次光源像(點光SPa'、SPb'、SPc')之一部分的情形相比,亦具有將照明光量之損失抑制為小之優點。In addition, as shown in FIG. 26, the ring-shaped diaphragm plate APa 'is provided in the optical path in the wavelength selection section 6A (6B, 6C), but may be provided in the optical path in the variable magnification section 8A (8B, 8C). in. Further, a diaphragm plate APb ′ similar to the quadrupole diaphragm plate APb shown in FIG. 25 (B) may be installed instead of the annular band diaphragm plate APa ′ in FIG. 26. In this case, the illumination light beam BSa (or BSb, BSc) irradiated on the incident surface poi of the fly-eye lens system FEn overlaps the four fan-shaped areas like the light transmitting portion TPb of FIG. 25 (B). In addition, in this modification, the illumination beam BSa (or BSb, BSc) irradiated on the incident surface poi of the fly-eye lens system FEn and the ordinary circular shape including the optical axis AX2, the endless belt shape not including the optical axis AX2, Or the quadrupole region overlaps, so if the secondary light source images (point lights SPa ', SPb', SPb ', SPb', SPb ', SPb', SPb ', SPc ') also has the advantage of suppressing the loss of the amount of illumination light to a small amount compared to the case of a part.

[第2實施方式]
圖27係表示依據第2實施方式之曝光裝置之概略性整體構成的圖,正交座標系XYZ之Z軸設定為重力方向。如圖27般之曝光裝置之詳細構成例如揭示於國際公開第2013/094286號小冊子、國際公開第2014/073535號小冊子中,因此簡單進行以下裝置構成之說明。圖27之曝光裝置係為了對可撓之長條片狀基板FS掃描曝光光罩之圖案,而從與Y軸平行設定之中心線CC1起以一定之半徑來彎曲為圓筒面狀,且於在Y方向上具有既定長度(與片狀基板FS之Y方向之寬度對應之長度)之外周面上形成反射型之圖案,從而安裝繞中心線CC1旋轉之圓筒光罩DMM。進而,圖27之曝光裝置中,設有具有從與Y軸平行之中心線CC2起以一定之半徑來彎曲為圓筒面狀之外周面,且於該外周面上,在長條方向上密接支持片狀基板FS,繞中心線CC2旋轉之轉筒DR。於在Z方向上隔開之圓筒光罩DMM與轉筒DR之間設置具有與上述圖2所示之構成大致相同之構成的奇數號之等倍成像之部分投影光學系統PL1(以及未圖示之部分投影光學系統PL3、PL5……)、以及偶數號之等倍成像之部分投影光學系統PL2(以及未圖示之部分投影光學系統PL4、PL6……)。
[Second Embodiment]
FIG. 27 is a diagram showing a schematic overall configuration of an exposure apparatus according to a second embodiment, and the Z axis of the orthogonal coordinate system XYZ is set to the direction of gravity. The detailed configuration of the exposure device as shown in FIG. 27 is disclosed in, for example, International Publication No. 2013/094286 and International Publication No. 2014/073535. Therefore, the following description of the device configuration is briefly performed. The exposure device shown in FIG. 27 is designed to scan a pattern of an exposure mask on a flexible long sheet-like substrate FS, and bends a cylindrical surface with a certain radius from a center line CC1 set parallel to the Y axis, and A reflective pattern is formed on the outer peripheral surface having a predetermined length in the Y direction (a length corresponding to the width in the Y direction of the sheet substrate FS), and a cylindrical photomask DMM that rotates about the centerline CC1 is installed. Further, the exposure apparatus of FIG. 27 is provided with an outer peripheral surface having a cylindrical surface curved at a certain radius from a center line CC2 parallel to the Y axis, and is closely adhered to the outer peripheral surface in a long direction. A drum DR supporting a sheet-like substrate FS and rotating around a centerline CC2. Between the cylindrical reticle DMM and the rotating drum DR spaced in the Z direction, a partial projection optical system PL1 (and not shown) having an odd-numbered equal-magnification imaging having a structure substantially the same as the structure shown in FIG. 2 described above is provided. The part of the projection optical systems PL3, PL5, etc. shown), and the part of the projection optical system PL2 (and the part of the projection optical systems PL4, PL6, etc., not shown) with equal magnification.

而且,於圓筒光罩DMM之外周面與奇數號之部分投影光學系統PL1、PL3、PL5……之各個之間,設置落射照明用之偏光分光鏡PBSa。於各偏光分光鏡PBSa之圓筒光罩DMM側之面安裝有1/4波長板(或膜體)。於圓筒光罩DMM之外周面上設定Y方向上細長之長方形照明區域IAn之各個,由具有與上述圖10所示之第2照明光學系統ILn大致相同之構成的奇數號之第2照明光學系統IL1、IL3、IL5……與偶數號之第2照明光學系統IL2、IL4、IL6……之各個而來之曝光用照明光束,透過偏光分光鏡PBSa、PBSb而投射。偏光分光鏡PBSa、PBSb(以及1/4波長板)根據偏光狀態,將朝向圓筒光罩DMM之照明區域IAn之照明光束、與照明區域IAn內出現之來自光罩圖案之反射光束分離,但為此,必須預先使投射於偏光分光鏡PBSa、PBSb上之照明光束成為直線偏光。因此,於第2照明光學系統ILn之照明光路中之適當位置,例如從圖10所示之射出側之光纖束FGn至第2電容器透鏡系統CPn之間之位置,或者圖4所示之第1照明光學系統之波長選擇部6A、6B、6C內或倍率可變部8A、8B、8C之前後之位置上,設置偏光板。A polarizing beam splitter PBSa for epi-illumination is provided between the outer peripheral surface of the cylindrical mask DMM and each of the odd-numbered partial projection optical systems PL1, PL3, PL5, .... A 1/4 wavelength plate (or film) is mounted on the surface of the cylindrical mask DMM side of each polarizing beam splitter PBSa. On the outer peripheral surface of the cylindrical mask DMM, each of the elongated rectangular illumination areas IAn in the Y direction is set, and the second illumination optics having an odd number and having a configuration substantially the same as that of the second illumination optical system ILn shown in FIG. 10 described above. The illumination light beams for exposure from each of the systems IL1, IL3, IL5 ... and the even-numbered second illumination optical systems IL2, IL4, IL6 ... are projected through the polarizing beam splitters PBSa, PBSb. The polarizing beam splitters PBSa, PBSb (and 1/4 wavelength plate) separate the illumination beam toward the illumination area IAn of the cylindrical mask DMM from the reflected beam from the mask pattern appearing in the illumination area IAn according to the polarization state, but For this reason, it is necessary to make the illumination light beams projected on the polarization beam splitters PBSa and PBSb linearly polarized in advance. Therefore, an appropriate position in the illumination light path of the second illumination optical system ILn is, for example, a position from the fiber bundle FGn on the emission side shown in FIG. 10 to the second capacitor lens system CPn, or the first capacitor lens system CPn shown in FIG. 4. A polarizing plate is provided in the wavelength selection section 6A, 6B, 6C of the illumination optical system, or in front of or behind the variable magnification section 8A, 8B, 8C.

若將包含圓筒光罩DMM之中心線CC1及轉筒DR之中心線CC2且與YZ面平行之面設為中心面CCp,則當於XZ面內(圖27之紙面內)來看時,奇數號之部分投影光學系統PL1、PL3、PL5……與奇數號之第2照明光學系統IL1、IL3、IL5……之套組,以及偶數號之部分投影光學系統PL2、PL4、PL6……與偶數號之第2照明光學系統IL2、IL4、IL6……之套組,係相對於中心面CCp而對稱配置。又,將由圓筒光罩DMM上之照明區域IAn之各個所產生之圖案之反射光束射入的部分投影光學系統PLn之各自之圓筒光罩DMM側之主光線,係以其延長線朝向中心線CC1之方式設定;於部分投影光學系統PLn之各自之轉筒DR側,對設定於片狀基板FS上之投影區域EAn之各個投射之成像光束之主光線,係以其延長線朝向中心線CC2之方式設定。If the plane including the centerline CC1 of the cylindrical mask DMM and the centerline CC2 of the drum DR and parallel to the YZ plane is set as the central plane CCp, when viewed in the XZ plane (inside the paper plane of FIG. 27), The odd numbered projection optical systems PL1, PL3, PL5 ... and the odd numbered second illumination optical systems IL1, IL3, IL5 ..., and the even numbered projection optical systems PL2, PL4, PL6 ... and The even-numbered sets of the second illumination optical systems IL2, IL4, IL6,... Are arranged symmetrically with respect to the center plane CCp. In addition, the main light rays on the respective cylindrical mask DMM sides of the partial projection optical system PLn where the reflected light beams of the patterns generated by each of the illumination areas IAn on the cylindrical mask DMM are incident are directed toward the center with their extension lines. The line CC1 is set; on the respective DR side of the partial projection optical system PLn, the main light rays of the imaging beams projected on the projection area EAn set on the sheet substrate FS are directed toward the centerline with their extension lines. CC2 mode setting.

本實施方式中,由於部分投影光學系統PLn之投影倍率為等倍(1:1),故而將圓筒光罩DMM之外周面(圖案形成面)之從中心線CC1起之半徑、與轉筒DR之外周面之從中心線CC2起之半徑(嚴格而言為加上片狀基板FS之厚度的半徑)設為相等,使圓筒光罩DMM與轉筒DR以同一旋轉速度來旋轉,使從於圓筒光罩DMM上由高反射部及低反射部所形成之元件用圖案而來之反射光束於片狀基板FS上掃描曝光。此時,於圓筒光罩DMM之圖案形成面上,形成由單層或複數層所形成之膜體,其對於來自第2照明光學系統ILn之照明光束,高反射部具有儘可能高之反射率,且低反射部具有儘可能低之反射率(理想而言,反射率為零)。作為反射型之光罩圖案之製作方法之一例,有如下方法:將曝光用照明光束之波長光譜中成為高反射率(例如80%以上,較理想為90%以下)之第1膜體(金屬薄膜等),蒸鍍於圓筒光罩DMM之圖案形成面之整個面上後,將曝光用照明光束之波長光譜中成為低反射率(例如10%以上,較理想為5%以下)之第2膜體(金屬薄膜或介電體多層膜等)積層於第1膜體之表面,藉由利用光微影法等之圖案化,第2膜體中之成為低反射部之部分殘留,作為高反射部之部分藉由蝕刻而去除,使基底之第1膜體露出。此外,與該方法相反,亦可為如下方法:將成為低反射率之第2膜體最初蒸鍍於圓筒光罩DMM之圖案形成面之整個面上後,於該第2膜體之表面上積層成為高反射率之第1膜體,保留第1膜體中之成為高反射部之部分,藉由蝕刻而去除作為低反射部之部分,使基底之第2膜體露出。In this embodiment, since the projection magnification of the partial projection optical system PLn is equal (1: 1), the radius from the centerline CC1 of the outer peripheral surface (pattern forming surface) of the cylindrical mask DMM and the rotating drum The radius of the outer peripheral surface of DR from the center line CC2 (strictly speaking, the radius plus the thickness of the sheet substrate FS) is set to be equal, so that the cylindrical mask DMM and the drum DR are rotated at the same rotation speed, so that The reflected light beam from the pattern for the elements formed by the high reflection portion and the low reflection portion on the cylindrical mask DMM is scanned and exposed on the sheet substrate FS. At this time, a film body formed of a single layer or a plurality of layers is formed on the pattern forming surface of the cylindrical photomask DMM, and the high reflection part has as high a reflection as possible for the illumination light beam from the second illumination optical system ILn. And the low-reflection portion has as low a reflectance as possible (ideally, the reflectance is zero). As an example of a method for producing a reflective mask pattern, there is a method in which a wavelength spectrum of an exposure illumination light beam becomes a first film body (metal having a high reflectance (for example, 80% or more, preferably 90% or less)). Thin film, etc.), after vapor deposition on the entire surface of the pattern forming surface of the cylindrical mask DMM, the wavelength spectrum of the exposure illumination beam becomes a low reflectance (for example, 10% or more, preferably 5% or less). 2 The film body (metal thin film or dielectric multilayer film, etc.) is laminated on the surface of the first film body, and patterning using a photolithography method, etc., and a part of the second film body that becomes a low reflection portion remains as A part of the high reflection part is removed by etching, and the first film body of the base is exposed. In addition, contrary to this method, a method may also be adopted in which a second film having a low reflectance is first deposited on the entire surface of the pattern forming surface of the cylindrical mask DMM, and then onto the surface of the second film The upper layer becomes the first film body with high reflectivity, and the portion of the first film body that becomes the high reflection portion is retained, and the portion serving as the low reflection portion is removed by etching to expose the second film body of the base.

又,與透射型光罩基板中所採用之半色調方式或相位偏移方式同樣地,於反射型圖案之情形時,亦可設為反射型位移圖案,其於積層於圖案形成面上之反射膜之表面,形成與照明光束之波長對應之微細階差,設為於階差之上表面及下表面上所產生之反射光彼此之振幅強度相互抵消之相位差。於此情形時,於圓筒光罩DMM之圖案形成面之整個面上一樣地形成高反射率之膜體,於該膜體之表面上使反射光減少之圖案部分,形成由對反射光賦予180度之相位差(使振幅反射率為零)之微細階差所構成之繞射光柵狀或者方格棋狀之凹凸圖案。於設為對反射光賦予180度以外之相位差之階差構造之情形時,由於振幅反射率成為零以外之有限值,故而亦可獲得中間之反射率。Also, in the same manner as the halftone method or the phase shift method used in the transmissive photomask substrate, in the case of a reflective pattern, a reflective displacement pattern can also be used, and the reflection on the pattern forming surface is laminated. The surface of the film forms a fine step difference corresponding to the wavelength of the illumination beam, and is set to a phase difference in which the amplitude and intensity of the reflected light generated on the upper and lower surfaces of the step cancel each other out. In this case, a film body having a high reflectance is formed uniformly on the entire surface of the pattern forming surface of the cylindrical mask DMM, and a pattern portion on the surface of the film body that reduces the reflected light is formed to give the reflected light. Diffraction grating-shaped or checker-shaped concave-convex pattern composed of a small step difference of 180 degrees with a phase difference (so that the amplitude reflectance is zero). In the case of a step structure having a phase difference other than 180 degrees to the reflected light, since the amplitude reflectance becomes a finite value other than zero, an intermediate reflectance can also be obtained.

於使用如以上所述之反射型光罩之曝光裝置中,伴隨光罩(圓筒光罩DMM)之交換,存在反射型圖案之反射率產生不均之情況。尤其於反射型位移圖案中,由於形成於膜體之表面的微細之階差之製造誤差,而引起欲使反射光之強度實質上為零之圖案部分之反射率不充分減小之現象。又,即便於單純由高反射部及低反射部所構成之反射型圖案之情形時,若如圖27般形成於圓筒光罩DMM之外周面,圖案面向圓筒光罩DMM之圓周方向彎曲,因此根據照明區域IAn內之圓周方向之位置,照明光束之主光線之入射角度輕微變化,亦存在照明區域IAn內之反射率產生差異之可能性。In the exposure apparatus using the reflective mask as described above, there is a case where the reflectance of the reflective pattern is uneven due to the exchange of the mask (cylindrical mask DMM). Especially in the reflective displacement pattern, due to the manufacturing error of the minute steps formed on the surface of the film, the phenomenon that the reflectance of the pattern portion where the intensity of the reflected light is substantially zero is not sufficiently reduced is caused. Moreover, even in the case of a reflective pattern composed of only a high-reflection part and a low-reflection part, if the pattern is formed on the outer peripheral surface of the cylindrical mask DMM as shown in FIG. 27, the pattern is curved toward the circumferential direction of the cylindrical mask DMM. Therefore, according to the position in the circumferential direction in the illumination area IAn, the incident angle of the main ray of the illumination beam slightly changes, and there may be a difference in the reflectance in the illumination area IAn.

因此,本實施方式中,如上述第1實施方式或其變形例中所說明,將安裝於波長選擇部6A、6B、6C之各個之干涉濾光器之組合加以變更,或藉由倍率可變部8A、8B、8C各自之調整而將投射於複眼透鏡系統FEn之入射面poi上之照明光束BSa、BSb、BSc各自之直徑(數值孔徑)加以變更,或者使投射於複眼透鏡系統FEn之入射面poi上之照明光束BSa、BSb、BSc之各自之區域(形狀)變化,藉此,可減輕由反射型圖案之製造誤差所引起之反射率之不均或由於彎曲之圖案面而可能產生之反射率之不均。尤其如圖20或圖26中所說明,於投射於照明區域IAn中之照明光束Irn之最大之發散角(最大數值孔徑)之範圍內,可調整每個波長之強度分布或數值孔徑,因此即便於反射型之光罩圖案中產生反射率之變動或不均之情形時,亦具有可容易進行其修正之優點。Therefore, in this embodiment, as described in the above-mentioned first embodiment or its modification, the combination of the interference filters mounted on the wavelength selection sections 6A, 6B, and 6C is changed, or the magnification is variable. Each of the sections 8A, 8B, and 8C is adjusted to change the diameters (numerical apertures) of the illumination light beams BSa, BSb, and BSc projected on the incident surface poi of the fly-eye lens system FEn, or to make the incident on the fly-eye lens system FEn The respective areas (shapes) of the illumination beams BSa, BSb, and BSc on the surface poi can be reduced, thereby reducing unevenness in reflectance caused by manufacturing errors of the reflective pattern or possible occurrence of curved pattern surfaces. Uneven reflectance. Especially as illustrated in FIG. 20 or FIG. 26, the intensity distribution or numerical aperture of each wavelength can be adjusted within the range of the maximum divergence angle (maximum numerical aperture) of the illumination beam Irn projected in the illumination area IAn, so even if It also has the advantage that it can be easily corrected when a change or unevenness in the reflectance occurs in the reflective mask pattern.

[i射線-寬頻帶干涉濾光器]
如上述圖6所示,通常之i射線用干涉濾光器SWa係設定為以i射線之明線波長為中心,以儘量窄之帶寬(例如±10 nm寬度以下)抽出(透射)i射線光譜。與此相對,i射線-寬頻帶干涉濾光器SWb係設定為僅包含i射線之明線波長,以儘量寬之帶寬抽出(透射)i射線光譜。i射線-寬頻帶干涉濾光器SWb之帶寬係依存於上述各實施方式中所說明之反射折射方式之部分投影光學系統PLn(以下,亦僅稱為投影光學系統)之色差特性而設定。圖28表示利用較測量圖5之波長特性之分光器而言波長解析度更高之分光器,來測量上述圖5所示之由超高壓水銀放電燈之電弧放電部所產生之光之波長特性而獲得之詳細分光特性。由超高壓水銀放電燈之水銀所引起之主要明線為波長435.835 nm之g射線、波長404.656 nm之h射線、波長365.015 nm之i射線、波長312.566 nm之j射線,但藉由燈內之其他物質,於i射線之明線波長與j射線之明線波長之間亦產生明線Sxw(波長為約330 nm)。
[i-ray-broadband interference filter]
As shown in FIG. 6 above, the normal i-ray interference filter SWa is set to center on the bright-line wavelength of the i-ray, and extract (transmit) the i-ray spectrum with a narrowest bandwidth (for example, less than ± 10 nm width). . In contrast, the i-ray-broadband interference filter SWb is set to include only the bright-line wavelength of the i-rays, and the i-ray spectrum is extracted (transmitted) with the widest possible bandwidth. The bandwidth of the i-ray-broadband interference filter SWb is set depending on the chromatic aberration characteristics of a part of the projection optical system PLn (hereinafter, also referred to as a projection optical system only) of the reflection-refraction method described in the above embodiments. FIG. 28 shows the measurement of the wavelength characteristics of light generated by the arc discharge portion of the ultrahigh-pressure mercury discharge lamp shown in FIG. 5 using a spectroscope having a higher wavelength resolution than the spectroscope measuring the wavelength characteristics of FIG. 5. And obtain the detailed spectral characteristics. The main bright lines caused by the mercury of the ultra-high-pressure mercury discharge lamp are g-rays with a wavelength of 435.835 nm, h-rays with a wavelength of 404.656 nm, i-rays with a wavelength of 365.015 nm, and j-rays with a wavelength of 312.566 nm. Matter also produces a bright line Sxw (wavelength of about 330 nm) between the bright line wavelength of the i-ray and the bright line wavelength of the j-ray.

另一方面,作為反射折射方式之投影光學系統PLn,於主要對i射線之明線波長進行色差修正之投影光學系統之情形時,其色差特性例如成為如圖29所示之傾向。圖29係於橫軸上取波長,且於縱軸上取色差量(倍率色差、或者軸上色差)之色差特性之圖表。於對i射線之明線波長進行色差修正之情形時,構成投影光學系統之透鏡元件係由分散或折射率不同之2種以上之玻璃材料來製作,以於i射線之明線波長中色差量實質成為零之方式進行光學設計。然而,色差特性於相對於i射線之明線波長而言長之波長區域側及短之波長區域側,產生大的色差量。因此,就該色差特性而言,設定如下之波長寬度ΔWi:作為色差量而成為所容許之容許量ΔCAi以內,並且不包含i射線以外之其他明顯之明線波長。如圖28所示,於i射線之明線波長之短波長側之旁邊存在明線Sxw,且於長波長側之旁邊存在h射線,但於波長340 nm~400 nm之間無明顯之明線。因此,i射線-寬頻帶干涉濾光器SWb係設為於波長為約350 nm~約390 nm之間,透射率成為90%以上之特性。即,i射線-寬頻帶干涉濾光器SWb設為如下之波長選擇特性(透射特性):不包含i射線之明線波長之短波長側及長波長側之各個中出現之強烈明線之波峰狀光譜成分,將i射線之明線波長之光譜波峰及分布於其底部附近之低亮度之光譜成分抽出(透射)。此外,於使用對其他明線波長(h射線或g射線)進行色差修正之投影光學系統之情形時,或多或少具有如圖29所示之色差特性,因此可以同樣之方式來製作h射線-寬頻帶干涉濾光器或g射線-寬頻帶干涉濾光器。On the other hand, in the case of a projection optical system PLn, which is a reflection and refraction method, in the case of a projection optical system that mainly corrects the chromatic aberration of the bright-line wavelength of i-rays, its chromatic aberration characteristics tend to be as shown in FIG. FIG. 29 is a graph of the color difference characteristics obtained by taking the wavelength on the horizontal axis and the amount of color difference (magnification chromatic aberration, or color difference on the axis) on the vertical axis. When chromatic aberration correction is performed on the bright-line wavelength of i-rays, the lens elements constituting the projection optical system are made of two or more glass materials having different dispersion or refractive indices, so that the amount of chromatic aberration in the bright-line wavelengths of i-rays is made. Optical design in a way that essentially becomes zero. However, the chromatic aberration characteristic produces a large amount of chromatic aberration on the long wavelength region side and the short wavelength region side with respect to the bright line wavelength of the i-ray. Therefore, in terms of this chromatic aberration characteristic, the wavelength width ΔWi is set to be within the allowable amount ΔCAi as the amount of chromatic aberration, and does not include any obvious bright-line wavelength other than the i-ray. As shown in FIG. 28, there is a bright line Sxw beside the short wavelength side of the bright line wavelength of the i-ray, and there is an h-ray beside the long wavelength side, but there is no obvious bright line between the wavelengths of 340 nm to 400 nm . Therefore, the i-ray-broadband interference filter SWb has a characteristic of having a wavelength between about 350 nm and about 390 nm and a transmittance of 90% or more. That is, the i-ray-broadband interference filter SWb is set to a wavelength selection characteristic (transmission characteristic): peaks of strong bright lines appearing in each of the short-wavelength side and the long-wavelength side excluding the bright-line wavelength of the i-ray. The shape-like spectral component extracts (transmits) the spectral peak of the bright-line wavelength of the i-ray and the low-brightness spectral component distributed near its bottom. In addition, when using a projection optical system that corrects chromatic aberration at other bright-line wavelengths (h-rays or g-rays), it has more or less chromatic aberration characteristics as shown in FIG. 29, so the h-rays can be produced in the same manner. -Broadband interference filter or g-ray-broadband interference filter.

[其他變形例]
如圖4、圖15所示,為了對投射至入射側之光纖束12A、12B、12C各自之入射端FBi上的照明光束BMa、BMb、BMc各自之最大發散角(最大數值孔徑)進行控制,而設置具有可調整光軸AX1之方向之位置的2組透鏡系統8A1、8A2的倍率可變部8A、8B、8C,但亦可設為將透鏡系統8A1、8A2中之至少一者與其他透鏡系統交換而固定地切換倍率(數值孔徑)之方式。又,於上述之前組之透鏡系統8A1與後組之透鏡系統8A2之間,如美國專利第5,719,704號說明書所揭示,亦可設置2個圓錐狀之稜鏡狀光學構件(旋轉三稜鏡光學系統)。此時,於進行通常照明之情形時,使該2個圓錐狀之稜鏡狀光學構件於光軸AX1方向上密接,於進行環帶照明之情形時,亦可調整該2個圓錐狀之稜鏡狀光學構件之光軸AX1方向之間隔,而將於透鏡系統8A1與透鏡系統8A2之間通過之照明光束BMa之剖面形狀設為大小可變之環帶狀。於此情形時,不需要如使用上述圖26來說明之變形例5般,於照明光束之光路中配置環帶狀光闌板APa',因此可進而改善進行環帶照明之情形時之照明光之利用效率。
[Other variations]
As shown in FIGS. 4 and 15, in order to control the maximum divergence angles (maximum numerical apertures) of the illumination light beams BMa, BMb, and BMc on the respective incident ends FBi of the fiber bundles 12A, 12B, and 12C incident on the incident side, While the two groups of lens systems 8A1 and 8A2 with adjustable positions of the direction of the optical axis AX1 are provided, the magnification variable sections 8A, 8B, and 8C may be provided, but at least one of the lens systems 8A1 and 8A2 may be set to other lenses. The system switches and fixedly switches the method of the numerical aperture. In addition, between the lens system 8A1 of the previous group and the lens system 8A2 of the rear group, as disclosed in US Pat. No. 5,719,704, two conical cymbal-shaped optical members (rotary triplex optical system) may be provided. ). At this time, in the case of normal lighting, the two conical 稜鏡 -shaped optical members are closely contacted in the direction of the optical axis AX1, and in the case of annular lighting, the two conical ridges can also be adjusted. The interval between the directions of the optical axis AX1 of the mirror-shaped optical member, and the cross-sectional shape of the illumination light beam BMa passing between the lens system 8A1 and the lens system 8A2 is a ring shape with a variable size. In this case, it is not necessary to arrange a ring-shaped diaphragm plate APa ′ in the light path of the illumination beam, as in the fifth modification described with reference to FIG. 26, so the illumination light in the case of the ring-shaped illumination can be further improved. Utilization efficiency.

又,上述各實施方式或變形例中,使用複眼透鏡系統FEn作為光學積分器,但亦可代替其而使用微透鏡陣列、或者棒狀積分器等。進而,於上述各實施方式中,使用水銀燈(超高壓水銀放電燈)2A、2B、2C作為光源裝置,但亦可使用其他任意之放電類型之燈。又,作為光源裝置,亦可使用:發光二極體(LED)、固體雷射、氣體雷射、或者半導體雷射等雷射光源;或者將種光之雷射光增幅而由波長轉換元件來產生種光之諧波(紫外波長區域)的雷射光源。In each of the above embodiments or modifications, the fly-eye lens system FEn is used as the optical integrator, but a microlens array or a rod-shaped integrator may be used instead. Furthermore, in each of the above embodiments, mercury lamps (ultra-high-pressure mercury discharge lamps) 2A, 2B, and 2C are used as the light source devices, but any other discharge type lamps may be used. In addition, as the light source device, a laser light source such as a light emitting diode (LED), a solid laser, a gas laser, or a semiconductor laser can also be used; or the laser light of the seed light is amplified and generated by a wavelength conversion element A laser light source that is a harmonic of light (ultraviolet wavelength range).

進而補充說明,作為產生種光之諧波的雷射光源,例如作為如日本特開2001-085771號公報中所揭示之光纖放大器雷射光源,可利用中心波長355 nm之脈衝雷射光來作為照明光束。於該情形時,組裝入光纖放大器雷射光源等中之諧波發生用波長轉換元件係作為與干涉濾光器SWa、SWb、SWc相同之波長選擇部(波長選擇元件)而發揮功能。又,作為光源裝置,亦可將水銀放電燈(超高壓水銀放電燈)與雷射光源併用。例如,亦可將來自水銀放電燈之光中,包含由i射線-窄頻帶干涉濾光器SWa、或者i射線-寬頻帶干涉濾光器SWb所抽出之i射線(中心波長365 nm)的光譜成分之光,與從光纖放大器雷射光源射出之中心波長355 nm之脈衝雷射光併用。Furthermore, it is added that, as a laser light source that generates harmonics of various kinds of light, for example, as a fiber amplifier laser light source disclosed in Japanese Patent Application Laid-Open No. 2001-085771, a pulsed laser light having a center wavelength of 355 nm can be used as illumination. beam. In this case, the wavelength conversion element for harmonic generation incorporated in a fiber amplifier laser light source or the like functions as a wavelength selection unit (wavelength selection element) that is the same as the interference filters SWa, SWb, and SWc. As a light source device, a mercury discharge lamp (ultra-high pressure mercury discharge lamp) and a laser light source may be used in combination. For example, the light from the mercury discharge lamp may include the spectrum of the i-ray (center wavelength: 365 nm) extracted by the i-ray-narrow-band interference filter SWa or the i-ray-broadband interference filter SWb. The component light is used in combination with a pulsed laser light having a center wavelength of 355 nm emitted from a fiber amplifier laser light source.

於使用如上所述之雷射光源之情形時,為了將照明光束之發散角(數值孔徑)設定為大,作為一例,亦可於從雷射光源中作為平行光束而射出之雷射束之光路上,配置由石英等玻璃材料所形成之波帶片繞射光柵,其形成有於直徑方向而間距逐漸減小之微細同心圓狀(波帶片狀)之相位型之凹凸。波帶片繞射光柵之最小間距係根據投射於光纖束12A、12B、12C之各自之入射端FBi上的照明光束BMa、BMb、BMc之各自之所需發散角(數值孔徑)設定。In the case of using the laser light source as described above, in order to set the divergence angle (numerical aperture) of the illumination light beam to be large, as an example, the light of the laser beam emitted as a parallel light beam from the laser light source may also be used. On the road, a wave plate diffraction grating made of glass material such as quartz is arranged, and a phase concavity and convexity of a fine concentric circle shape (wave plate shape) gradually decreasing in the diameter direction is formed. The minimum distance between the wave plate diffraction gratings is set according to the respective required divergence angles (numerical apertures) of the illumination light beams BMa, BMb, and BMc projected on the respective incident ends FBi of the fiber bundles 12A, 12B, and 12C.

上述各實施方式中,曝光裝置係以具有複數個部分投影光學系統PLn之多透鏡方式之掃描型曝光裝置為例進行說明,但亦可為於使光罩基板M及板P靜止之狀態下,對光罩基板M之圖案進行曝光,使板P依序步進移動之步進重複型之曝光裝置。照明裝置之光源並不限定於3個水銀燈或3個雷射光源,亦可具備1個、2個、或者4個以上之光源。又,上述實施方式中,使用具有6個射出端FBo之6根光纖束FGn,但於由1個第2照明光學系統ILn且1個投影光學系統PLn所構成之曝光裝置之情形時,光纖束FGn亦可為1個。In each of the above embodiments, the exposure device is described by taking a multi-lens scanning exposure device having a plurality of partial projection optical systems PLn as an example, but it may also be in a state where the mask substrate M and the plate P are stationary. A step-and-repeat type exposure apparatus that exposes the pattern of the reticle substrate M to sequentially move the plate P stepwise. The light source of the lighting device is not limited to three mercury lamps or three laser light sources, and may be provided with one, two, or four or more light sources. In the above embodiment, the six fiber bundles FGn having six emission ends FBo are used. However, in the case of an exposure device composed of one second illumination optical system ILn and one projection optical system PLn, the fiber bundle FGn may be one.

進而,於將由1個光源(水銀燈2A等)及1個第1照明光學系統(包含波長選擇部6A及倍率可變部8A)來製作之照明光束BMa,透過1個第2照明光學系統IL1而投射於光罩基板M上,且將光罩基板M之圖案透過1個部分投影光學系統PL1而投影曝光於板P上之情形時,亦可不設置光纖束12A~12C、FGn,而將來自倍率可變部8A之照明光束BMa,直接透過第2照明光學系統IL1之第1電容器透鏡系統CF1而射入至複眼透鏡系統FE1中。Furthermore, an illumination light beam BMa produced by a light source (mercury lamp 2A, etc.) and a first illumination optical system (including a wavelength selection unit 6A and a magnification variable unit 8A) is transmitted through a second illumination optical system IL1. When projecting on the reticle substrate M and projecting the pattern of the reticle substrate M through a part of the projection optical system PL1 and projecting and exposing it on the plate P, the fiber bundles 12A to 12C and FGn may not be provided, but the magnification will come from the magnification. The illumination light beam BMa of the variable section 8A directly passes through the first capacitor lens system CF1 of the second illumination optical system IL1 and enters the fly-eye lens system FE1.

依據以上所說明之第1實施方式或其變形例、或者第2實施方式,以從由至少2個第1光源及第2光源(水銀燈2A~2C中之2個)之各自所發出之光束BM中,抽出既定之波長寬度之光譜分布之方式,設置:第1波長選擇部及第2波長選擇部(6A~6C中之2個),其與第1光源及第2光源之各個對應而設置;如下機構(滑動機構FX、或安裝機構),其以可交換之方式,將設置於第1波長選擇部及第2波長選擇部之各個且用以變更所抽出之波長區域或者波長寬度等光譜分布之波長選擇元件(干涉濾光器SWa、SWb、SWc等)配置於光路中;以及光合成構件(光纖束FGn),其用以將由第1波長選擇部所抽出之第1照明光束及由第2波長選擇部所抽出之第2照明光束之各個,於利用數值孔徑可變部(8A~8C中之2個)而各別設定之數值孔徑之狀態下進行光合成,於包含光學積分器之照明光學系統之照明光瞳面上形成2次光源像。因此,可根據光罩基板上之圖案之種別(二元光罩、相位偏移光罩、半色調光罩等)之差異、應曝光之圖案之微細度、對顯影後之抗蝕劑層之邊緣部賦予之錐傾斜量、或者反射型之光罩圖案之情形時之反射率之變動或不均等各種條件(曝光配方),於2次光源像之分布內賦予不同之波長分布特性(每個光譜之強度根據照明光瞳面內之位置而不同之特性),或以與對光罩基板之照明光束之最大數值孔徑對應之發散角而使波長分布不同。進而,亦可藉由改變(切換)照明光瞳面上之波長分布,來控制(抑制)投影光學系統自身之照射變動(投影倍率變動、焦點變動、像差變動等),其係由從將光罩基板之圖案進行投影曝光之投影光學系統(部分投影光學系統PLn)中通過之成像光束之能量而產生。According to the first embodiment or its modification, or the second embodiment described above, the light beam BM emitted from each of at least two of the first light source and the second light source (two of the mercury lamps 2A to 2C) is emitted. In the method of extracting the spectral distribution of a predetermined wavelength width, a first wavelength selection section and a second wavelength selection section (two of 6A to 6C) are provided, which are provided corresponding to each of the first light source and the second light source. ; The following mechanism (sliding mechanism FX, or mounting mechanism), which can be installed in each of the first wavelength selection section and the second wavelength selection section in an exchangeable manner to change the spectrum of the extracted wavelength region or wavelength width, etc. The distributed wavelength selection elements (interference filters SWa, SWb, SWc, etc.) are arranged in the optical path; and a light synthesis member (optical fiber bundle FGn) is used to convert the first illumination beam extracted by the first wavelength selection section and the first illumination beam Each of the second illumination light beams extracted by the two wavelength selection sections is synthesized using a numerical aperture variable section (two of 8A to 8C) and a numerical aperture set separately, and the illumination including an optical integrator is performed. Optical system A secondary light source image is formed on the illumination pupil surface. Therefore, according to the difference in the patterns on the reticle substrate (binary reticle, phase shift reticle, halftone reticle, etc.), the fineness of the pattern that should be exposed, and the development of the resist layer after development A variety of conditions (exposure recipes) such as the amount of taper inclination provided by the edge portion, or the reflectance change or unevenness in the case of a reflective mask pattern (different wavelength distribution characteristics within the distribution of the secondary light source image (each The intensity of the spectrum varies depending on the position within the illumination pupil plane), or the wavelength distribution is made different by the divergence angle corresponding to the maximum numerical aperture of the illumination beam to the mask substrate. Furthermore, by changing (switching) the wavelength distribution on the illumination pupil surface, it is also possible to control (suppress) the illumination variation (projection magnification variation, focus variation, aberration variation, etc.) of the projection optical system itself. The pattern of the reticle substrate is generated by the energy of the imaging beam passing through the projection optical system (part of the projection optical system PLn) for projection exposure.

以下,參照圖30,對來自水銀放電燈之光之波長特性(分光特性)進行補充。各實施方式或變形例中,主要使用短電弧型之超高壓水銀放電燈(2A、2B、2C),但作為電子元件用圖案曝光裝置之光源,亦使用放電管(發光管)內之水銀蒸氣壓達到約105 Pa~106 Pa左右之高壓水銀放電燈。通常,超高壓水銀放電燈藉由將放電管內之水銀蒸氣壓提高至約106 Pa~數107 Pa左右,而使適合於光微影之明線波長之i射線、h射線、g射線之各光譜寬度與高壓水銀放電燈相比略微擴展,或使i射線、h射線、g射線之各波峰強度之相對平衡與高壓水銀放電燈不同。於水銀放電燈之放電管內,例如,如日本特開2009-193768號公報中所揭示,除了點亮時之水銀蒸氣壓達到150氣壓~300氣壓之水銀(0.15 mg/mm3 以上)以外,還以約13 kPa之氬氣(稀有氣體)與水銀或其他金屬之化合物之形態而封入碘、溴、氯等鹵素。進而,來自超高壓水銀放電燈之光中,與高壓水銀放電燈相比,於各明線波長i射線、g射線、h射線之間之波長帶中,亦相對於明線波長之光強度之峰值而存在相對而言為數%、或者10~20%左右之低亮度之光譜分布(底部附近部)。Hereinafter, referring to FIG. 30, the wavelength characteristics (spectral characteristics) of the light from the mercury discharge lamp will be supplemented. In each embodiment or modification, a short arc type ultra-high-pressure mercury discharge lamp (2A, 2B, 2C) is mainly used, but as a light source of a pattern exposure device for electronic components, mercury vapor in a discharge tube (light-emitting tube) is also used. A high-pressure mercury discharge lamp with a pressure of about 10 5 Pa to 10 6 Pa. Generally, an ultra-high-pressure mercury discharge lamp raises the mercury vapor pressure in the discharge tube to about 10 6 Pa to about 10 7 Pa, thereby making i-rays, h-rays, and g-rays suitable for the bright-line wavelength of light lithography. Each spectral width is slightly expanded compared with a high-pressure mercury discharge lamp, or the relative balance of the peak intensities of i-rays, h-rays, and g-rays is different from that of a high-pressure mercury discharge lamp. In the discharge tube of a mercury discharge lamp, for example, as disclosed in Japanese Patent Application Laid-Open No. 2009-193768, except for mercury (0.15 mg / mm 3 or more) whose mercury vapor pressure reaches 150 to 300 at the time of lighting, Halogens such as iodine, bromine, and chlorine are enclosed in the form of a compound of about 13 kPa of argon (a rare gas) and mercury or other metals. Furthermore, compared with the high-pressure mercury discharge lamp, the light from the ultra-high-pressure mercury discharge lamp is also compared with the light intensity of the bright-line wavelength in the wavelength band between each bright-line wavelength i-ray, g-ray, and h-ray. A peak has a relatively low-brightness spectral distribution (a portion near the bottom) of several% or about 10 to 20%.

圖30係對高壓水銀放電燈與超高壓水銀放電燈之各波長特性之差異進行說明之圖表,圖30(A)表示來自高壓水銀放電燈之光之波長特性之一例,圖30(B)表示來自超高壓水銀放電燈之光之波長特性之一例。於圖30(A)、圖30(B)之各個,橫軸表示波長(nm),縱軸表示將明線波長之i射線之強度之峰值設為100%時之光譜之相對強度(%)。圖30(A)、(B)之各波長特性雖根據燈製造商之差異或燈之額定電力之差異而存在多少變化,但當著眼於包含i射線之波長(365 nm)的波長350~400 nm之光譜分布時,高壓水銀放電燈中,如圖30(A)般,基本上未出現相對強度達到數%以上、較理想為10%以上之底部附近部。與此相對,超高壓水銀放電燈中,如圖30(B)般,出現相對強度為數%以上,大致達到10%左右之底部附近部(低亮度之光譜成分)。FIG. 30 is a graph explaining the difference in wavelength characteristics between a high-pressure mercury discharge lamp and an ultra-high-pressure mercury discharge lamp. FIG. 30 (A) shows an example of the wavelength characteristics of light from a high-pressure mercury discharge lamp, and FIG. 30 (B) shows An example of the wavelength characteristics of light from an ultrahigh-pressure mercury discharge lamp. In each of FIGS. 30 (A) and 30 (B), the horizontal axis represents the wavelength (nm), and the vertical axis represents the relative intensity (%) of the spectrum when the peak value of the intensity of the i-ray at the bright line is set to 100%. . Although the wavelength characteristics of each of Figures 30 (A) and (B) vary depending on the difference between the lamp manufacturer and the rated power of the lamp, the wavelength of the wavelength including the i-ray (365 nm) is 350 to 400. At the spectral distribution of nm, in the high-pressure mercury discharge lamp, as shown in FIG. 30 (A), there is basically no near-bottom portion with a relative intensity of several% or more, preferably 10% or more. In contrast, in the ultra-high pressure mercury discharge lamp, as shown in FIG. 30 (B), a portion near the bottom (a low-brightness spectral component) having a relative intensity of several% or more and approximately 10% appears.

圖30(B)中之i射線之底部附近部之相對強度之程度可根據封入放電管內之水銀之量、其他稀有氣體或鹵素之種類或含量、水銀蒸氣壓而變化,成為數%~20%左右。又,明線波長之i射線、h射線、g射線之各光譜寬度成為圖30(B)之超高壓水銀放電燈比圖30(A)之高壓水銀放電燈略微擴展(變粗)之傾向。此外,上述圖5所示之波長特性中,成為i射線之波長(365 nm)之底部附近的波長350~400 nm之範圍內之光譜成分係相對於i射線之波峰強度而相對達到20%左右之強度。The relative intensity of the vicinity of the bottom of the i-ray in FIG. 30 (B) can vary depending on the amount of mercury enclosed in the discharge tube, the type or content of other noble gases or halogens, and the mercury vapor pressure, and becomes a few% to 20 %about. The spectral widths of i-rays, h-rays, and g-rays with bright-line wavelengths tend to slightly expand (thicken) the ultrahigh-pressure mercury discharge lamp of FIG. 30 (B) than the high-pressure mercury discharge lamp of FIG. 30 (A). In addition, in the wavelength characteristics shown in FIG. 5, the spectral component in the range of 350 to 400 nm near the bottom of the wavelength (365 nm) of the i-ray is relatively 20% relative to the peak intensity of the i-ray. The intensity.

因此,以僅包含水銀之明線波長中之i射線之方式,使用上述圖7所示之i射線-寬頻帶干涉濾光器SWb來進行波長選擇之照明光束(BSa、BSb、BSc),若與使用上述圖6所示之i射線-窄頻帶干涉濾光器SWa來進行波長選擇之照明光束相比,則光能量之量提高。即便相對於i射線之波峰強度,i射線之底部附近部(350 nm~365 nm與365 nm~400 nm之範圍)之相對強度如圖30(B)般為約10%左右,對板P之抗蝕劑層提供之每單位時間之光能量之量(劑量)僅大致增大由底部附近部之強度與波長寬度之積所決定之量,因此曝光量提高大約20%左右(1.1×1.1≒1.2倍)。因此,當利用上述圖1所示之曝光裝置EX,將光罩基板M之圖案掃描曝光於板P之抗蝕劑層上時,可使光罩基板M與板P之掃描速度加快20%左右,其結果為,可將利用i射線之高解析之圖案曝光之步驟之生產性提昇20%左右。Therefore, in a manner that only includes the i-rays in the bright-line wavelength of mercury, the i-ray-broadband interference filter SWb shown in FIG. 7 is used to perform the wavelength-selected illumination beam (BSa, BSb, BSc). Compared with the illumination beam whose wavelength is selected using the i-ray-narrow-band interference filter SWa shown in FIG. 6 described above, the amount of light energy is increased. Even with respect to the peak intensity of the i-ray, the relative intensity of the vicinity of the bottom of the i-ray (in the range of 350 nm to 365 nm and 365 nm to 400 nm) is about 10% as shown in Figure 30 (B). The amount of light energy (dosage) per unit time provided by the resist layer only increases approximately by the amount determined by the product of the intensity near the bottom and the wavelength width, so the exposure is increased by about 20% (1.1 × 1.1 ≒) 1.2 times). Therefore, when the pattern of the photomask substrate M is scanned and exposed on the resist layer of the plate P by using the exposure device EX shown in FIG. 1, the scanning speed of the photomask substrate M and the plate P can be increased by about 20%. As a result, the productivity of the step of exposing the pattern using the high resolution of the i-ray can be improved by about 20%.

因此,將圖30(A)所示之由高壓水銀放電燈所放射之i射線之光譜分布之相對強度10%下之波長寬度、或者圖6所示之i射線-窄頻帶干涉濾光器SWa中所設定之波長選擇範圍(帶寬)設為BWi(nm),將由超高壓水銀放電燈所放射之i射線之光譜分布中的以達到波峰強度之波長成為中心之方式設定之波長寬度(帶寬)BWi之外側(短波長側及長波長側),且到達旁邊之明線波長之光譜為止作為底部附近部之情形時,可使用以該底部附近部之平均相對強度成為數%~10%左右(較理想為20%以上)之方式,來調整水銀量及水銀蒸氣壓、稀有氣體之氣壓或成分量、鹵素之成分量等之超高壓水銀放電燈。此外,並不限定於i射線之光譜分布,於利用來自超高壓水銀放電燈之h射線或g射線之光譜分布之情形時,亦同樣與來自高壓水銀放電燈之h射線或g射線相比,於相對強度成為數%之底部附近部產生擴展,因此只要準備具有包含該底部附近部之波長選擇特性的h射線-寬頻帶干涉濾光器或g射線-寬頻帶干涉濾光器即可。Therefore, the wavelength width at 10% of the relative intensity of the spectral distribution of the i-rays emitted by the high-pressure mercury discharge lamp shown in FIG. 30 (A), or the i-ray-narrow-band interference filter SWa shown in FIG. 6 The wavelength selection range (bandwidth) set in is set to BWi (nm). The wavelength width (bandwidth) is set so that the wavelength reaching the peak intensity is centered in the spectral distribution of the i-rays emitted by the ultra-high pressure mercury discharge lamp. When BWi is outside the BWi (short wavelength side and long wavelength side) and reaches the spectrum of the bright line wavelength next to it as the vicinity of the bottom, the average relative intensity of the vicinity of the bottom may be several% to 10% ( It is ideally more than 20%) to adjust the mercury pressure and mercury vapor pressure, the pressure or composition of rare gases, the composition of halogen, and other ultra-high-pressure mercury discharge lamps. In addition, it is not limited to the spectral distribution of i-rays. When the spectral distribution of h-rays or g-rays from an ultra-high pressure mercury discharge lamp is used, it is also compared with the h-rays or g-rays from a high-pressure mercury discharge lamp. The expansion occurs in the vicinity of the bottom portion where the relative intensity becomes several%. Therefore, it is only necessary to prepare an h-band interference filter or a g-band interference filter having a wavelength selection characteristic including the vicinity of the bottom portion.

繼而,對光罩之變形例進行補充。以上之各實施方式或其變形例中,前提為使用固定地形成(擔載)有光罩圖案之透射型、或反射型之光罩基板(或圓筒光罩)之曝光裝置,但對於可變光罩方式之曝光裝置(由於不使用固定之光罩圖案,而亦稱為無光罩曝光裝置)亦同樣可應用各實施方式中所說明之照明系統(圖3~圖20等),上述可變光罩方式之曝光裝置係藉由使用將微米級別之多數個微小鏡子二維地排列之DMD(Digital Mirror Device)等,根據應曝光之圖案之資料(CAD資料)來高速切換各鏡子之各自之角度,從而於板P上投影圖案像。可變光罩方式之曝光裝置中,可由1個DMD形成於板P上之投影區域係與圖1所示之投影區域EA1同樣,限定為長方形之小區域,因此設置複數個DMD、以及將來自各DMD之反射光投影於板P上之複數個投影透鏡系統。於此情形時,複數個DMD之各自之反射面(多數個微小鏡子所排列之面)係於根據CAD資料而各別控制光之反射方向的多數個微小鏡子之分布的形態下,擔載有電子元件用圖案。而且,複數個DMD之各自之反射面配置在與圖1~圖3中所示之照明區域IA1~IA6相當之位置,由強度分布於例如±2%以內均勻化之照明光束(與圖14所示之BSa'、BSb'、BSc'相當)而照射。Next, a modification of the photomask is added. In each of the above embodiments or modifications thereof, the premise is that an exposure device in which a transmissive or reflective photomask substrate (or cylindrical photomask) having a photomask pattern fixedly formed (supported) is used. The mask-type exposure device (because it does not use a fixed mask pattern, it is also called a maskless exposure device) can also be applied to the lighting system described in each embodiment (Figures 3 to 20, etc.). The variable-mask-type exposure device uses a DMD (Digital Mirror Device) or the like that two-dimensionally arranges a plurality of micro-mirrors, and switches the mirrors at a high speed according to the data (CAD data) of the pattern to be exposed. Their respective angles, thereby projecting a pattern image on the plate P. In the variable-mask-type exposure device, the projection area formed by one DMD on the plate P is the same as the projection area EA1 shown in FIG. 1 and is limited to a small rectangular area. Therefore, a plurality of DMDs are provided, and The reflected light of each DMD is projected on a plurality of projection lens systems on the plate P. In this case, the respective reflection surfaces of the plurality of DMDs (the surfaces in which a plurality of minute mirrors are arranged) are in the form of a distribution of a plurality of minute mirrors that individually control the reflection direction of light based on CAD data, and are supported by Patterns for electronic components. Moreover, the respective reflection surfaces of the plurality of DMDs are arranged at positions corresponding to the illumination areas IA1 to IA6 shown in Figs. 1 to 3, and the intensity of the illumination beam is uniformized within an intensity distribution within, for example, ± 2% (as shown in Fig. 14). The BSa ', BSb', and BSc 'shown in the figure are equivalent) and irradiated.

因此,可使由DMD之多數個微小鏡子中的以照明光束射入至投影透鏡系統中之方式設定了角度之微小鏡子反射,且透過投影透鏡系統而投射於板P上之投影光束(照明光束),具有與如圖20所示之配向特性(發散角之特性)相同之特性。進而,亦可藉由圖21所示之干涉濾光器之組合,而在與從DMD之各個微小鏡子而照射於板P上之投影光束之最大數值孔徑所對應之發散角內,使波長分布不同。此外,亦可代替DMD而使用空間光調變元件(SLM:Spatial Light Modulator),其藉由使二維排列之多數個微小鏡子之各反射面(通常全部設定於同一平面上)中的經選擇之微小鏡子向與反射面垂直之方向位移,而對反射光束賦予相位差。Therefore, it is possible to reflect the minute mirrors whose angles are set in such a manner that the illumination light beams are projected into the projection lens system from the plurality of DMD micromirrors, and the projection light beams (illumination beams) projected on the plate P through the projection lens system. ) Has the same characteristics as the alignment characteristics (divergence angle characteristics) shown in FIG. 20. Furthermore, the combination of the interference filter shown in FIG. 21 can also be used to make the wavelength distribution within the divergence angle corresponding to the maximum numerical aperture of the projection beam irradiated onto the plate P from each of the tiny mirrors of the DMD. different. In addition, instead of DMD, a Spatial Light Modulator (SLM: Spatial Light Modulator) can also be used, which is based on the selection of reflective surfaces (usually all set on the same plane) of a plurality of tiny mirrors arranged in two dimensions. The tiny mirror is displaced in a direction perpendicular to the reflecting surface to give a phase difference to the reflected beam.

其次,對投影曝光裝置之其他形態進行補充。以上之實施方式或變形例中,前提為具有複數個部分投影光學系統PLn(PL1~PL6)、以及與其對應之複數個第2照明光學系統ILn(IL1~IL6)的所謂多透鏡方式之曝光裝置,但即便假設為具備單一之投影光學系統及單一之第2照明光學系統的曝光裝置,亦可僅藉由略微改變上述實施方式中之構成而容易具有同樣之功能。具體而言,於上述圖9所示之光分配部10內之線分配部10a中,將入射側之光纖束12A、12B、12C之各個所包含之多數個光纖線不分配於6個光纖束FG1~FG6之各個,而聚集為單一光纖束,以成為與將該單一光纖束之射出端FBo設定於光罩基板M上之單一照明區域之形狀相似之矩形之方式來成型即可。Second, it supplements other forms of the projection exposure apparatus. In the above-mentioned embodiment or modification, the so-called multi-lens type exposure device provided with a plurality of partial projection optical systems PLn (PL1 to PL6) and corresponding second illumination optical systems ILn (IL1 to IL6) is assumed. However, even if an exposure device having a single projection optical system and a single second illumination optical system is assumed, it is easy to have the same function only by slightly changing the configuration in the above embodiment. Specifically, in the line distribution section 10 a in the light distribution section 10 shown in FIG. 9 described above, a plurality of optical fiber wires included in each of the incident side optical fiber bundles 12A, 12B, and 12C are not distributed to six optical fiber bundles. Each of FG1 to FG6 can be aggregated into a single optical fiber bundle, and it can be formed into a rectangular shape similar to the shape of a single illumination area where the exit end FBo of the single optical fiber bundle is set on the mask substrate M.

其次,對光源裝置之變形例進行補充。上述圖3之構成中,使用複數個(2個以上)之水銀放電燈2A、2B、2C作為光源裝置,但於使用單一之超高壓水銀放電燈之情形時,亦可僅藉由略微改變上述實施方式中之構成而容易具有同樣之功能。具體而言,設置雙色鏡,其係於來自單一之超高壓水銀放電燈之光藉由圖4中之透鏡系統(準直透鏡)6A1而轉換為大致平行光束後,例如將不包含i射線之光譜成分之波長區域,而包含h射線之光譜成分及g射線之光譜成分的波長帶域之光透射,將包含i射線之光譜成分之短波長帶域之光反射。進而,針對從該雙色鏡中透射之光,設置如圖4(或圖3)所示之波長選擇部6A(例如包含將h射線之光譜成分抽出之干涉濾光器)及倍率可變部8A,針對由該雙色鏡反射之光,設置波長選擇部6B(包含i射線-窄頻帶干涉濾光器SWa、或者i射線-寬頻帶干涉濾光器SWb)及倍率可變部8B。如此一來,與圖22之說明同樣,可使於第2照明光學系統ILn內之照明光瞳面(與複眼透鏡系統FEn之射出面epi相當)上具有二維之擴展(範圍)而形成之光源像(點光源像之聚集)之波長特性,根據所選擇設定之干涉濾光器之特性而設為可變。Next, a modification of the light source device is added. In the structure of FIG. 3 described above, a plurality of (two or more) mercury discharge lamps 2A, 2B, and 2C are used as the light source device. However, in the case of using a single ultrahigh-pressure mercury discharge lamp, the above can be changed only slightly. The structure in the embodiment can easily have the same function. Specifically, a dichroic mirror is provided. The light from a single ultra-high-pressure mercury discharge lamp is converted into a substantially parallel beam by a lens system (collimating lens) 6A1 in FIG. 4, for example, an i-ray will not be included. In the wavelength region of the spectral component, light in the wavelength band including the spectral component of the h-ray and the spectral component of the g-ray is transmitted, and light in the short wavelength band including the spectral component of the i-ray is reflected. Further, for the light transmitted from the dichroic mirror, a wavelength selection section 6A (for example, an interference filter including an extraction of spectral components of h-rays) and a magnification variable section 8A are provided as shown in FIG. 4 (or FIG. 3). For the light reflected by the dichroic mirror, a wavelength selection section 6B (including an i-ray-narrow-band interference filter SWa or an i-ray-broadband interference filter SWb) and a magnification variable section 8B are provided. In this way, similar to the description of FIG. 22, the illumination pupil surface (equivalent to the exit surface epi of the fly-eye lens system FEn) in the second illumination optical system ILn can be formed with a two-dimensional extension (range). The wavelength characteristic of the light source image (convergence of the point light source image) is variable according to the characteristics of the interference filter selected and set.

其次,對利用i射線-寬頻帶干涉濾光器SWb之波長選擇特性之設定進行補充。如上述圖30(B)所示,來自超高壓水銀放電燈之i射線之光譜成分之底部附近部之寬度(例如相對於i射線之中心波長處之波峰強度而成為10%左右之強度的範圍)與圖30(A)所示之來自高壓水銀放電燈之i射線之光譜成分之底部附近部之寬度相比,具有2倍以上之擴展。如上述圖1、圖2所示之曝光裝置EX之部分投影光學系統PL1(PL2~PL6)係於光瞳面(光闌位置)Epa、Epb上配置有反射鏡Ga4、Gb4之反射折射方式之半視野類型之成像系統。此種成像系統與全折射方式(所有光學元件僅由透鏡等折射元件所構成)之成像系統相比,具有色差修正變得容易之優點,於使用包含複數個明線光譜(例如i射線光譜成分及h射線光譜成分)的照明光,將光罩M之圖案投影曝光於基板P上之情形時,亦可減少由色差引起之投影像之劣化(像畸變)。Next, the setting of the wavelength selection characteristic using the i-broadband interference filter SWb is supplemented. As shown in FIG. 30 (B), the width of the portion near the bottom of the spectral component of the i-ray from the ultra-high-pressure mercury discharge lamp (for example, a range of intensity of about 10% relative to the peak intensity at the center wavelength of the i-ray) ) Compared with the width of the portion near the bottom of the spectral component of the i-ray from the high-pressure mercury discharge lamp shown in FIG. 30 (A), it has an expansion of more than two times. Part of the projection optical system PL1 (PL2 to PL6) of the exposure device EX shown in Figs. 1 and 2 above is a reflection and refraction method in which mirrors Ga4 and Gb4 are arranged on the pupil plane (aperture position) Epa and Epb. Half-field type imaging system. This imaging system has the advantage of easier correction of chromatic aberration compared to the imaging system of the total refraction method (all optical elements are only composed of refractive elements such as lenses). It uses an optical system that includes multiple bright-line spectra (such as i-ray spectral components). And h-ray spectrum components), when the pattern of the mask M is projected and exposed on the substrate P, the degradation (image distortion) of the projected image caused by chromatic aberration can also be reduced.

然而,即便僅利用透過i射線-窄頻帶干涉濾光器SWa而窄頻帶化之單一之i射線光譜成分之照明光來進行投影曝光,若形成於光罩M上之圖案變得微細,則亦由於投影光學系統PL1(PL2~PL6)所具有之各種像差而使投影像(像強度分布)產生畸變。明顯出現之該畸變係稱為孔圖案之微細之孤立矩形(大致正方形)之圖案。However, even if the projection exposure is performed using only the illumination light of a single i-ray spectral component narrowed by the i-narrow-band interference filter SWa, if the pattern formed on the mask M becomes fine, The projection image (image intensity distribution) is distorted due to various aberrations of the projection optical system PL1 (PL2 to PL6). The apparent distortion is a fine isolated rectangular (roughly square) pattern called a hole pattern.

圖31係示意性表示形成於光罩M上之正方形之孔圖案,與使用i射線-窄頻帶干涉濾光器SWa而將孔圖案投影於基板P上時所獲得之投影像(光強度分布)之形狀、或者藉由曝光後之抗蝕劑層之顯影而出現之抗蝕劑像之形狀之關係的圖,X軸及Y軸係與上述圖1~圖3中之正交座標系XYZ對應。此處,圖31(A)示意性表示以較由投影光學系統PL1(PL2~PL6)所解析之最小線寬值而言充分大之尺寸Dx×Dy,形成於光罩M上之孔圖案CHA之情形時所獲得之投影像(抗蝕劑像)Ima之形狀;圖31(B)示意性表示以最小線寬值之2倍左右之大小而形成於光罩M上之孔圖案CHB之情形時所獲得之投影像(抗蝕劑像)Imb之形狀;圖31(C)示意性表示以與最小線寬值接近之大小而形成於光罩M上之孔圖案CHC之情形時所獲得之投影像(抗蝕劑像)Imc之形狀。圖31中,孔圖案CHA、CHB、CHC均設為於由影線表示之周圍之遮光部中作為孤立之透明部而形成,但亦可為相反之情形,即,作為孤立之遮光部而形成於周圍之透明部中。此外,作為可由投影光學系統PLn(n=1~6)來投影之最小線寬值而表示之解析力R通常藉由投影光學系統PLn之像側之數值孔徑NAp、照明光之波長λ(nm)、程序常數k(0<k≦1),而以R=k・(λ/NAp)來定義。FIG. 31 schematically shows a projection image (light intensity distribution) obtained when a square hole pattern formed on the reticle M is projected on a substrate P using an i-ray-narrow-band interference filter SWa. A graph showing the relationship between the shape of the resist or the shape of the resist image appearing by the development of the exposed resist layer. The X-axis and Y-axis systems correspond to the above-mentioned orthogonal coordinate system XYZ in FIGS. 1 to 3. . Here, FIG. 31 (A) schematically shows a hole pattern CHA formed on the mask M with a size Dx × Dy sufficiently larger than the minimum line width value analyzed by the projection optical system PL1 (PL2 to PL6). The shape of the projection image (resist image) Ima obtained in this case; FIG. 31 (B) schematically shows the case of the hole pattern CHB formed on the mask M with a size of about twice the minimum line width value. The shape of the projection image (resist image) Imb obtained at that time; FIG. 31 (C) schematically shows the case of the hole pattern CHC formed on the mask M with a size close to the minimum line width value. The shape of the projected image (resist image) Imc. In FIG. 31, the hole patterns CHA, CHB, and CHC are all formed as isolated transparent portions in the surrounding light-shielding portions indicated by hatching, but the opposite case may also be formed as isolated light-shielding portions. In the surrounding transparent part. In addition, the resolution R, which is expressed as the minimum line width value that can be projected by the projection optical system PLn (n = 1 to 6), is usually determined by the numerical aperture NAp on the image side of the projection optical system PLn and the wavelength λ (nm of the illumination light). ), A program constant k (0 <k ≦ 1), and defined by R = k · (λ / NAp).

如圖31(A)所示,於可由投影光學系統PLn進行投影之最小線寬值而言為數倍以上之尺寸Dx×Dy之大正方形之孔圖案CHA之情形時,其四角之直角之角落部分主要藉由投影光學系統PLn之像側之數值孔徑NAp之值,即MTF(Modulation Transfer Function),未充分解析而呈圓弧。此種現象於使用對於中心波長λ之光譜分布之擴展極其狹窄之照明光(例如,光譜寬度不滿1 nm之雷射光等)之情形時亦產生。尤其如圖31(C)所示,在與投影光學系統PLn之可解析之最小線寬值接近之尺寸之正方形之孔圖案CHC之情形時,其投影像(抗蝕劑像)Imc之形狀大致成為圓形。於此種投影光學系統PLn之特性下,若使用利用如上述圖7所示之i射線-寬頻帶干涉濾光器SWb,以相對於i射線之中心波長而廣泛包含光譜分布之底部附近部之方式抽出之照明光,將圖31(C)所示之孔圖案CHC進行投影曝光之情形時,由於投影光學系統PLn之色差特性,投影像(抗蝕劑像)Imc由圓形變化為橢圓形。As shown in FIG. 31 (A), when the minimum line width value that can be projected by the projection optical system PLn is a large square hole pattern CHA with a size Dx × Dy several times or more, the corner portion of the right corner of the four corners The value of the numerical aperture NAp on the image side of the projection optical system PLn, that is, the MTF (Modulation Transfer Function), is mainly circular without being fully analyzed. This phenomenon also occurs when illumination light (for example, laser light with a spectral width of less than 1 nm, etc.) having an extremely narrow extension of the spectral distribution of the center wavelength λ is used. In particular, as shown in FIG. 31 (C), in the case of a square hole pattern CHC having a size close to the minimum resolvable minimum line width value of the projection optical system PLn, the shape of the projection image (resist image) Imc is roughly Become round. Under the characteristics of such a projection optical system PLn, if an i-ray-broadband interference filter SWb as shown in FIG. 7 is used, the near-bottom portion of the spectral distribution is widely included with respect to the center wavelength of the i-ray. When the illumination light extracted by the method is projected to expose the hole pattern CHC shown in FIG. 31 (C), the projection image (resist image) Imc changes from circular to oval due to the chromatic aberration characteristics of the projection optical system PLn. .

圖32係將如上所述畸變為橢圓形之投影像Imc之狀態誇大而表示,圖32中之虛線表示成為大致正確之圓形的投影像Imc'。該投影像Imc'之圓形之直徑亦可根據投影光學系統PLn之基本性光學諸特性來理論性地推定。將由於色差之影響而畸變為橢圓形之投影像Imc之Y軸方向之短軸長設為CHy,將X軸方向之長軸長設為CHx,且將橢圓形之扁率(橢圓度)Δf設為Δf=CHy/CHx時,就元件製造上之容許範圍而言,扁率(橢圓度)Δf宜設定為80%以上、較理想為90%以上。即,由i射線-寬頻帶干涉濾光器SWb所抽出之i射線之光譜分布之底部附近部之擴展範圍係規定為:與可解析之最小線寬值接近之尺寸之正方形之孔圖案CHC之投影像Imc之從圓形起之形狀畸變限制為80%以上、較理想為90%以上之扁率(橢圓率)之橢圓。FIG. 32 is an exaggerated state of the projected image Imc deformed as described above, and the dotted line in FIG. 32 indicates the projected image Imc ′ which is a substantially correct circle. The circular diameter of the projection image Imc 'can also be theoretically estimated from the basic optical characteristics of the projection optical system PLn. The short-axis length of the Y-axis direction of the projected image Imc distorted into an ellipse due to the influence of chromatic aberration is set to CHy, the long-axis length of the X-axis direction is set to CHx, and the oblateness (ellipticity) Δf of the ellipse When it is set to Δf = CHy / CHx, the flatness (ellipticity) Δf should be set to 80% or more, and more preferably 90% or more, in terms of the allowable range in component manufacturing. That is, the extended range near the bottom of the spectral distribution of the i-rays extracted by the i-ray-broadband interference filter SWb is defined as: the square hole pattern CHC of a size close to the smallest resolvable line width value The shape distortion of the projected image Imc from a circle is limited to an ellipse with an oblateness (ellipticity) of 80% or more, and more preferably 90% or more.

又,圖32中,於投影像Imc之向橢圓之變形中,長軸方向表示為X方向,短軸方向表示為Y方向,長軸與短軸之各方向有時如圖33所示,於XY面內朝向任意之方向。圖33中,變形為橢圓形之孔圖案之投影像Imc之長軸與短軸係相對於X軸、Y軸而旋轉Δρ。因此,為了精密地判斷由i射線-寬頻帶干涉濾光器SWb所抽出之i射線之光譜分布之底部附近部之擴展範圍之適當與否,而藉由測試曝光等,將與可解析之最小線寬值接近之尺寸之正方形之孔圖案CHC之投影像Imc曝光於基板P上,利用檢查裝置等,對顯影後之與投影像Imc對應之抗蝕劑像進行觀察,且利用圖像分析軟體而進行與投影像Imc對應之抗蝕劑像之形狀特定(長軸、短軸之方向之決定),從而測量長軸方向之長軸長CHx與短軸方向之短軸長CHy。而且,只要判定根據其測量結果而求出之扁率(橢圓率)Δf是否為容許範圍(80%以上,較理想為90%以上)即可。In FIG. 32, in the elliptical deformation of the projected image Imc, the long-axis direction is shown as the X direction, and the short-axis direction is shown as the Y direction. The directions of the long-axis and short-axis are sometimes shown in FIG. 33. The XY plane faces in any direction. In FIG. 33, the long axis and the short axis of the projection image Imc deformed into an oval hole pattern are rotated by Δρ with respect to the X axis and the Y axis. Therefore, in order to accurately determine the appropriateness of the extended range near the bottom of the spectral distribution of the i-rays extracted by the i-ray-broadband interference filter SWb, the test and exposure are used to minimize the resolution. The projection image Imc of the square hole pattern CHC with a line width value close to the size is exposed on the substrate P, and an inspection device is used to observe the developed resist image corresponding to the projection image Imc, and image analysis software is used. Then, the shape of the resist image corresponding to the projected image Imc is determined (determining the directions of the major axis and the minor axis), and the major axis length CHx in the major axis direction and the minor axis length CHy in the minor axis direction are measured. Furthermore, it is only necessary to determine whether the oblateness (ellipticity) Δf obtained from the measurement results is within an allowable range (80% or more, and more preferably 90% or more).

但,如上述圖2所示,於投影光學系統PLn(n=1~6)之成像光路中之像空間(配置於中間像面IM1上之視野光闌板FA1之下方最近處)中,設置像偏移光學構件SC1。像偏移光學構件SC1係如例如國際公開第2013/094286號小冊子所揭示,由可於圖2中之XZ面內傾斜之透明之平行平板玻璃(石英板)、以及可在與其正交之方向上傾斜之透明之平行平板玻璃(石英板)構成。藉由調整該2片石英板之各自之傾斜量,可使投影於基板P上之投影區域EA1(EA2~EA6)內之圖案像於XY面內之任意方向上略微位移。此外,像偏移光學構件SC1之配置並不限定為圖2所示之視野光闌板FA1之下方最近處,可與配置於像空間中之作為其他修正光學系統之焦點調整光學構件FC1或倍率調整光學構件MC1中之任一者之配置進行更換。However, as shown in FIG. 2 described above, in the image space of the imaging optical path of the projection optical system PLn (n = 1 to 6) (the closest place below the field diaphragm plate FA1 on the intermediate image plane IM1), Image shift optical member SC1. The image-shifting optical member SC1 is, as disclosed in, for example, International Publication No. 2013/094286, a transparent parallel plate glass (quartz plate) that can be tilted in the XZ plane in FIG. 2 and a direction orthogonal to the plate glass (quartz plate). It is composed of a tilted transparent parallel plate glass (quartz plate). By adjusting the respective inclination amounts of the two quartz plates, the pattern image in the projection area EA1 (EA2 to EA6) projected on the substrate P can be slightly shifted in any direction in the XY plane. In addition, the configuration of the image-shifting optical member SC1 is not limited to the nearest position below the field diaphragm plate FA1 shown in FIG. 2, and the optical member FC1 or magnification can be adjusted with the focal point of the other correction optical system arranged in the image space. The arrangement of any one of the optical members MC1 is adjusted and replaced.

構成像偏移光學構件SC1之2片平行平板狀之石英板之各個從紫外波長區域(190 nm左右)至可見波長區域,具有高透射率,但於合成石英之情形時,作為一例,如圖34所示,存在從波長500 nm以下之短波長區域,尤其從波長400~3000 nm之附近至短波長側,折射率依存於波長而大幅度變化之傾向。圖34中,橫軸表示波長(nm),縱軸表示合成石英之折射率。因此,例如,於使用來自超高壓水銀放電燈(或者高壓水銀放電燈)之光中,包含中心波長約為365 nm之i射線光譜成分、及中心波長約為405 nm之h射線光譜成分之兩者的照明光,來投影光罩M之圖案之情形時,產生根據像偏移光學構件SC1之石英板之傾斜量,以i射線光譜成分而投影於基板P上之像、與以h射線光譜成分而投影於基板P上之像於XY面內略微位置偏移之現象。Each of the two parallel flat quartz plates constituting the image-shifting optical member SC1 has a high transmittance from the ultraviolet wavelength region (about 190 nm) to the visible wavelength region, but in the case of synthetic quartz, as an example, as shown in the figure As shown in 34, the refractive index tends to vary greatly depending on the wavelength from a short-wavelength region with a wavelength of 500 nm or less, particularly from the vicinity of the wavelength of 400 to 3000 nm to the short-wavelength side. In FIG. 34, the horizontal axis represents the wavelength (nm), and the vertical axis represents the refractive index of the synthetic quartz. Therefore, for example, when using light from an ultra-high-pressure mercury discharge lamp (or a high-pressure mercury discharge lamp), two of the i-ray spectral component with a center wavelength of about 365 nm and the h-ray spectral component with a center wavelength of about 405 nm are included. When the illumination light of a person projects the pattern of the mask M, an image projected on the substrate P with an i-ray spectral component and an h-ray spectrum are generated according to the tilt amount of the quartz plate of the image shift optical member SC1. The image of the component projected on the substrate P is slightly shifted in the XY plane.

圖35係示意性表示於構成配置於視野光闌板FA1之下的像偏移光學構件SC1之2片石英板中,使像向X方向位移之石英板SCx中之成像光束之動作的圖。石英板SCx係以透射視野光闌板FA1之開口部之成像光束所射入之入射面Stp與成像光束所射出之射出面Sbp相互平行地以間隔(厚度)Dpx而對向之方式構成,設置為可繞與Y軸平行之旋轉中心線旋轉(傾斜)。圖35中,僅圖示出成像光束中的從作為中間像而成像於視野光闌板FA1之開口部之中心點上的像點Poc發散而行進之成像光束之主光線LPr,線Lss表示主光線LPr與入射面Stp相交之點上之入射面Stp之法線,線LPr'表示射入至入射面Stp上之前之主光線LPr之延長線。相對於石英板SCx之入射面Stp與所射入之主光線LPr正交之初始姿勢之狀態(石英板SCx之傾斜度為零之狀態),若石英板SCx於XZ面內傾斜角度Δθx,則依據司乃耳定律,主光線LPr從射出面Sbp上向X方向,相對於延長線LPr',平行偏移位移量δx而射出。FIG. 35 is a diagram schematically showing an operation of an imaging beam in a quartz plate SCx that displaces an image in the X direction in two quartz plates constituting the image shift optical member SC1 disposed under the field stop plate FA1. The quartz plate SCx is configured such that the incident surface Stp into which the imaging light beam of the opening portion of the transmission field diaphragm plate FA1 enters and the emitting surface Sbp from which the imaging light beam is emitted are opposed to each other at an interval (thickness) Dpx. It can rotate (tilt) around the rotation center line parallel to the Y axis. In FIG. 35, only the main ray Lpr of the imaging beam that travels from the image point Poc that is imaged on the center point of the opening of the field diaphragm FA1 as an intermediate image and diverges from the imaging beam, and the line Lss represents the main beam. The normal to the incident surface Stp at the point where the light LPR intersects the incident surface Stp, and the line L Pr 'represents the extension of the main light LPR before incident on the incident surface Stp. With respect to the state in which the incident surface Stp of the quartz plate SCx is orthogonal to the incident main ray Lpr (state where the inclination of the quartz plate SCx is zero), if the quartz plate SCx is inclined at an angle Δθx in the XZ plane, then According to Snell's law, the main light beam L Pr is emitted from the emission surface Sbp in the X direction, and is shifted by a parallel shift amount δx relative to the extension line L Pr ′.

通常,由折射率nx之平行平板玻璃之傾斜所引起之光線之位移量δx可應用司乃耳定律,以δx≒Dpx・Δθx(1-1/nx)來算出,但於成像光束中包含i射線光譜成分(波長365 nm)及h射線光譜成分(波長405 nm)之情形時,石英板SCx之折射率相對於各自之波長而表示略微不同之值。因此,若將石英板SCx之i射線光譜成分(波長365 nm)中之折射率設為ni,h射線光譜成分(波長405 nm)中之折射率設為nh,由i射線光譜成分(波長365 nm)所引起之像之位移量設為δxi,由h射線光譜成分(波長405 nm)所引起之像之位移量設為δxh,則位移量δxi係以δxi≒Dpx・Δθx(1-1/ni)來算出,位移量δxh係以δxh≒Dpx・Δθx(1-1/nh)來算出。因此,若將由波長之差異(色偏移)所引起之位移量之差分量設為δx(i-h),則差分量δx(i-h)成為
δx(i-h)≒Dpx・Δθx[(1-1/ni)-(1-1/nh)]。
Generally, the amount of light displacement δx caused by the inclination of the parallel plate glass with refractive index nx can be calculated by applying Senna's law and δx ≒ Dpx · Δθx (1-1 / nx), but i is included in the imaging beam. In the case of the ray spectral component (wavelength 365 nm) and the h-ray spectral component (wavelength 405 nm), the refractive index of the quartz plate SCx shows slightly different values with respect to the respective wavelengths. Therefore, if the refractive index in the i-ray spectral component (wavelength 365 nm) of the quartz plate SCx is set to ni and the refractive index in the h-ray spectral component (wavelength 405 nm) is set to nh, the i-ray spectral component (wavelength 365) The displacement of the image caused by nm) is set to δxi, and the displacement of the image caused by the h-ray spectral component (wavelength 405 nm) is set to δxh, then the displacement amount δxi is δxi ≒ Dpx · Δθx (1-1 / ni), and the displacement amount δxh is calculated by δxh ≒ Dpx · Δθx (1−1 / nh). Therefore, if the difference in the amount of displacement caused by the difference in wavelength (color shift) is δx (i-h), the difference δx (i-h) becomes δx (i-h) ≒ Dpx · Δθx [ (1-1 / ni)-(1-1 / nh)].

作為一例,若將石英板SCx之厚度Dpx設為10 mm,將i射線光譜成分(波長365 nm)之折射率ni設為1.4746,且將h射線光譜成分(波長405 nm)之折射率nh設為1.4696,來求出相對於角度Δθx(0°~10°)而言之差分量δx(i-h)之變化,則成為如圖36所示之圖表般之線形特性。圖36之圖表中,橫軸表示石英板SCx之傾斜角Δθx[deg.],縱軸表示差分量δx(i-h)[μm]。石英板SCx配置於形成中間像之像空間中,投影光學系統PLn之投影倍率為等倍(×1),因此,圖36中之差分量δx(i-h)直接成為由投影於基板P上之i射線光譜成分所引起之圖案像與由h射線光譜成分所引起之圖案像的相對之位置偏移量。例如,於石英板SCx之傾斜角Δθx為5°之情形時,由色偏移所引起之差分量δx(i-h)於x方向上成為2 μm左右,經投影曝光之圖案產生畸變,或線寬產生誤差。As an example, if the thickness Dpx of the quartz plate SCx is 10 mm, the refractive index ni of the i-ray spectral component (wavelength 365 nm) is set to 1.4746, and the refractive index nh of the h-ray spectral component (wavelength 405 nm) is set It is 1.4696 to obtain the change in the difference δx (i-h) with respect to the angle Δθx (0 ° to 10 °), and it becomes a linear characteristic like the graph shown in FIG. 36. In the graph of FIG. 36, the horizontal axis represents the inclination angle Δθx [deg.] Of the quartz plate SCx, and the vertical axis represents the difference δx (i-h) [μm]. The quartz plate SCx is disposed in the image space forming the intermediate image, and the projection magnification of the projection optical system PLn is equal (× 1). Therefore, the difference δx (i-h) in FIG. 36 is directly projected onto the substrate P. The relative positional offset between the pattern image caused by the i-ray spectral component and the pattern image caused by the h-ray spectral component. For example, when the inclination angle Δθx of the quartz plate SCx is 5 °, the difference δx (i-h) caused by the color shift becomes about 2 μm in the x direction, and the pattern exposed by the projection is distorted, or Line width causes errors.

以上所說明之由石英板SCx所引起之色偏移之影響於使投影像向Y方向輕微位移之其他石英板(設為SCy)上亦同樣發生,若使石英板SCy於與X軸平行之旋轉中心線之周圍從水平之初期狀態起傾斜傾斜角Δθ,則於Y方向上產生由色偏移所引起之差分量δy(i-h)。如上所述,於藉由包含i射線光譜成分(波長365 nm)及h射線光譜成分(波長405 nm)之兩者的照明光謀求照度提高之情形時,為了利用投影光學系統PLn(n=1~6)之各個將投影於基板P上之圖案像間之連續精度維持為良好而必需之像偏移光學構件SC1所引起之像偏移範圍,存在根據色偏移所引起之差分量δx(i-h)、δy(i-h)之程度而受限制之情形。The effect of the color shift caused by the quartz plate SCx described above also occurs on other quartz plates (set to SCy) that slightly shift the projection image in the Y direction. If the quartz plate SCy is parallel to the X axis, The angle of inclination Δθ from the horizontal initial state around the rotation center line produces a difference δy (i-h) caused by the color shift in the Y direction. As described above, when the illumination light is improved by the illumination light including both the i-ray spectral component (wavelength 365 nm) and the h-ray spectral component (wavelength 405 nm), in order to use the projection optical system PLn (n = 1 Each of the image shift ranges caused by the image shift optical member SC1 that maintains the continuous accuracy between the pattern images projected on the substrate P to be good and has a difference amount δx ( i-h), δy (i-h), and are restricted.

與此相對,如上述各實施方式或變形例般,藉由使用i射線-寬頻帶干涉濾光器SWb,可將如圖7般來自超高壓水銀放電燈之i射線光譜成分之底部附近部,於不包含旁邊之長波長側之明線成分(h射線)或短波長側之明線成分之範圍內廣泛抽出,且相對於使用i射線-窄頻帶干涉濾光器SWa時之照度,可一面謀求數%~十幾%左右之照度提高,一面將由於像偏移光學構件SC1之石英板SCx、SCy之傾斜而產生之色偏移誤差[與差分量δx(i-h)、δy(i-h)相當之誤差]抑制為小。On the other hand, as in the above-mentioned embodiments or modifications, by using the i-ray-broadband interference filter SWb, the portion near the bottom of the i-ray spectral component of the ultra-high-pressure mercury discharge lamp as shown in FIG. 7 can be obtained. It is widely extracted within the range that does not include the bright line component (h-ray) on the long-wavelength side or the bright line component on the short-wavelength side, and can be compared with the illuminance when using the i-ray-narrowband interference filter SWa. In order to improve the illuminance of several% to ten%, the color shift error [and difference components δx (i-h), δy (i -H) equivalent error] suppressed to small.

又,上述圖32、圖33中所說明之孔圖案CHC之投影像Imc畸變為橢圓形時之扁率(橢圓度)Δf、或者長軸/短軸之XY面內之方向性亦隨著像偏移光學構件SC1之石英板SCx、SCy之傾斜角之程度而變化。因此,如圖2所示之投影光學系統PLn般,於設置有使用可傾斜之平行平板玻璃(石英板SCx、SCy)之像偏移光學構件SC1之情形時,由像偏移光學構件SC1所引起之與標稱之像偏移最大量對應的平行平板玻璃(石英板SCx、SCy)之最大傾斜角Δθx、Δθy中,亦可以與可解析之最小線寬值(解析力R)接近之孔圖案CHC之投影像Imc之扁率(橢圓度)Δf於理論上或者實際曝光時成為80%以上(較理想為90%以上)之方式,設定i射線-寬頻帶干涉濾光器SWb之波長選擇範圍。In addition, the flatness (ellipticity) Δf when the projection image Imc of the hole pattern CHC described in Figs. 32 and 33 described above is distorted into an ellipse, or the directivity in the XY plane of the long axis / short axis also follows the image. The degree of inclination of the quartz plates SCx and SCy of the offset optical member SC1 varies. Therefore, as in the projection optical system PLn shown in FIG. 2, when an image shift optical member SC1 using a tiltable parallel plate glass (quartz plate SCx, SCy) is provided, the image shift optical member SC1 is used. The maximum inclination angles Δθx, Δθy of the parallel flat glass (quartz plates SCx, SCy) caused by the maximum amount of nominal image shift can also be approximated by the minimum line width value (resolution R) The flatness (ellipticity) Δf of the projection image Ic of the pattern CHC is set to be 80% or more (preferably 90% or more) in theory or actual exposure. Set the wavelength selection of the i-broadband interference filter SWb. range.

根據以上,於圖31~圖36中所說明之實施方式中,藉由以既定之波長分布之照明光(例如來自超高壓水銀放電燈之光)對光罩圖案(透射型或者反射型)進行照明,且將由光罩圖案產生之成像光束射入而投射於基板上之投影光學系統,將光罩圖案之像投影曝光於基板上之投影曝光方法中,將照明光之波長分布中之特定中心波長設為λ(例如i射線之中心波長),將投影光學系統之基板側之數值孔徑設為NAp,且將程序常數設為k(0<k≦1),將與由k・(λ/NAp)所定義之解析力R決定之可解析之最小線寬尺寸接近之大小之正方形或矩形之孔圖案之投影像投影於基板時,以變形為橢圓狀之孔圖案之投影像之短軸長(CHy)相對於長軸長(CHx)之比(CHy/CHx)成為80%(0.8)以上、較理想為90%(0.9)以上之方式,設定包含中心波長λ之照明光之波長分布之寬度(例如由干涉濾光器所選擇之波長寬度),藉此可一面提高對光罩圖案照射之照明光之照度,一面可進行高解析之圖案曝光。此外,孔圖案之尺寸係設定為換算為投影於基板側之像之尺寸,大於由解析力R所決定之尺寸且小於解析力R之2倍之尺寸的尺寸。Based on the above, in the embodiment described in FIGS. 31 to 36, the mask pattern (transmission type or reflection type) is performed by using illumination light with a predetermined wavelength distribution (for example, light from an ultra-high pressure mercury discharge lamp). A projection optical system for illuminating and projecting an imaging beam generated by a mask pattern onto a substrate, projecting and exposing an image of the mask pattern on a substrate, and projecting a specific center in a wavelength distribution of the illumination light The wavelength is set to λ (for example, the central wavelength of i-rays), the numerical aperture on the substrate side of the projection optical system is set to NAp, and the program constant is set to k (0 <k ≦ 1). NAp) The projection image of the square or rectangular hole pattern with the smallest resolvable minimum line width size close to the resolution defined by NAp is projected on the substrate. The short axis length of the projection image transformed into an oval hole pattern. (CHy) The ratio (CHy / CHx) to the long axis length (CHx) is 80% (0.8) or more, preferably 90% (0.9) or more. The wavelength distribution of the illumination light including the central wavelength λ is set. Width (e.g. by The wavelength width selected by the interference filter) can increase the illuminance of the illuminating light that illuminates the mask pattern, and can perform high-resolution pattern exposure. In addition, the size of the hole pattern is set to a size converted into an image projected on the substrate side, which is larger than the size determined by the resolution force R and smaller than 2 times the resolution force R.

從其他觀點換言之,作為將由包含複數個明線而發光之光源(水銀放電燈等)而來之光,濾波為具有適合於光罩圖案之投影曝光的波長寬度之照明光的干涉濾光器,於曝光裝置之照明系統中併入以如下方式設定濾波之波長寬度的干涉濾光器:將照明光之波長分布中之特定明線之中心波長設為λ(例如i射線之中心波長),投影光學系統之基板側之數值孔徑設為NAp,程序常數設為k(0<k≦1),由k・(λ/NAp)所定義之解析力R決定的可解析之最小線寬尺寸接近之大小之正方形或矩形之孔圖案之投影像投影於基板時,變形為橢圓狀之孔圖案之投影像之短軸長CHy相對於長軸長CHx之比CHy/CHx成為80%(0.8)以上、較理想為90%(0.9)以上。In other words, as an interference filter that filters light from a light source (mercury discharge lamp, etc.) that emits light including a plurality of bright lines into illumination light having a wavelength width suitable for projection exposure of a mask pattern, An interference filter is set in the illumination system of the exposure device to set the filtering wavelength width as follows: set the center wavelength of a specific bright line in the wavelength distribution of the illumination light to λ (for example, the center wavelength of an i-ray), and project The numerical aperture on the substrate side of the optical system is set to NAp, the program constant is set to k (0 <k ≦ 1), and the minimum resolvable minimum line width dimension determined by the resolution force R defined by k · (λ / NAp) is close to When the projection image of a large square or rectangular hole pattern is projected on a substrate, the ratio of the short axis length CHy of the projection image deformed into an oval hole pattern to the long axis length CHx CHy / CHx becomes 80% (0.8) or more, More preferably, it is above 90% (0.9).

2A、2B、2C‧‧‧水銀燈2A, 2B, 2C‧‧‧ Mercury lamps

4A、4B、4C‧‧‧橢圓鏡 4A, 4B, 4C‧‧‧ ellipse

5A、5B、5C‧‧‧轉動式快門 5A, 5B, 5C‧‧‧Rotary shutter

6A、6B、6C‧‧‧波長選擇部 6A, 6B, 6C‧‧‧Wavelength selection section

6A1、6A2‧‧‧透鏡系統 6A1, 6A2 ‧‧‧ lens system

8A、8B、8C‧‧‧倍率可變部 8A, 8B, 8C‧‧‧Magnification variable section

8A1、8A2、8B1、8B2、8C1、8C2‧‧‧透鏡系統 8A1, 8A2, 8B1, 8B2, 8C1, 8C2‧‧‧ lens system

10‧‧‧光分配部 10‧‧‧Light Distribution Department

10a‧‧‧線分配部 10a‧‧‧line distribution department

12A、12B、12C‧‧‧光纖束 12A, 12B, 12C‧‧‧ Fiber Bundle

APa、APb‧‧‧光闌板 APa, APb ‧ ‧ iris plate

APa'‧‧‧環帶狀光闌板 APa'‧‧‧ annular band diaphragm plate

AX1、AX2、AXa、AXb‧‧‧光軸 AX1, AX2, AXa, AXb‧‧‧ Optical axis

BM、BMa、BMb、BMc‧‧‧光束 BM, BMa, BMb, Bmc‧‧‧ beam

BSa、BSa'、BSb、BSb'、BSc、BSc'‧‧‧照明光束 BSa, BSa ', BSb, BSb', BSc, BSc'‧‧‧ illumination beams

CC1、CC2‧‧‧中心線 CC1, CC2‧‧‧ Centerline

CCA‧‧‧圓形區域 CCA‧‧‧ circular area

CCp‧‧‧中心面 CCp‧‧‧center plane

CFn(CF1~CF6)‧‧‧電容器透鏡系統 CFn (CF1 ~ CF6) ‧‧‧Capacitor lens system

CFa、CFb、CFc‧‧‧區域 CFa, CFb, CFc ‧‧‧ area

CHA、CHB、CHC‧‧‧孔圖案 CHA, CHB, CHC‧‧‧hole pattern

CHx‧‧‧長軸長 CHx‧‧‧Long axis length

CHy‧‧‧短軸長 CHy‧‧‧ short axis length

CPn(CP1~CP6)‧‧‧電容器透鏡系統 CPn (CP1 ~ CP6) ‧‧‧Capacitor lens system

DM‧‧‧雙色鏡 DM‧‧‧Dual color mirror

DMM‧‧‧圓筒光罩 DMM‧‧‧Cylinder Mask

Dpx‧‧‧厚度 Dpx‧‧‧thickness

DR‧‧‧轉筒 DR‧‧‧Rotary

EA1‧‧‧投影區域 EA1‧‧‧ projection area

Epa、Epb‧‧‧光瞳面 Epa, Epb ‧‧‧ pupil surface

epi‧‧‧射出面 epi‧‧‧ shoot out

Ewa、Ewb‧‧‧邊緣部 Ewa, Ewb‧‧‧Edge

EX‧‧‧曝光裝置 EX‧‧‧Exposure device

FA1‧‧‧視野光闌板 FA1‧‧‧field diaphragm

FBi‧‧‧入射端 FBi‧‧‧incident side

FBo‧‧‧射出端 FBo‧‧‧ Injection

FC1‧‧‧焦點調整光學構件 FC1‧‧‧ Focus Adjustment Optical Component

FEn(FE1~FE6)‧‧‧複眼透鏡系統 FEn (FE1 ~ FE6) ‧‧‧Flying Eye Lens System

FGn(FG1~FG6)‧‧‧光纖束 FGn (FG1 ~ FG6) ‧‧‧Fiber Bundle

FS‧‧‧片狀基板 FS‧‧‧chip substrate

FX‧‧‧滑動機構 FX‧‧‧ sliding mechanism

Ga1、Ga2、Ga3、Gb1、Gb2、Gb3‧‧‧透鏡系統 Ga1, Ga2, Ga3, Gb1, Gb2, Gb3 ‧‧‧ lens system

Ga4、Gb4‧‧‧凹面鏡 Ga4, Gb4 ‧‧‧ concave mirror

HL‧‧‧開口部 HL‧‧‧Opening

IAn(IA1~IA6)‧‧‧照明區域 IAn (IA1 ~ IA6) ‧‧‧Lighting area

ILn(IL1~IL6)‧‧‧照明光學系統 ILn (IL1 ~ IL6) ‧‧‧Lighting optical system

IM1‧‧‧中間像面 IM1‧‧‧Intermediate image plane

Ima、Imb、Imc、Imc'‧‧‧投影像 Ima, Imb, Imc, Imc'‧‧‧ cast images

Irn‧‧‧照明光束 Irn‧‧‧illuminating beam

LDa、LDb‧‧‧光源像 LDa, LDb‧‧‧light source image

Le‧‧‧透鏡元件 Le‧‧‧ lens element

Lpi、LPr‧‧‧主光線 Lpi, L Pr‧‧‧ principal rays

LPr'‧‧‧延長線 LPr'‧‧‧ extension cable

Lss‧‧‧線 Lss‧‧‧line

Luv‧‧‧抗蝕劑層 Luv‧‧‧ resist layer

M‧‧‧光罩基板 M‧‧‧Photomask substrate

MC1‧‧‧倍率調整光學構件 MC1‧‧‧Magnification adjustment optical component

NAd1‧‧‧最大數值孔徑 NAd1‧‧‧Maximum numerical aperture

NAd2‧‧‧中空範圍之數值孔徑 NAd2‧‧‧ Hollow numerical aperture

NAia、Naib、NAic、NAα、NAβ‧‧‧數值孔徑 NAia, Naib, NAic, NAα, NAβ ‧‧‧ NA

OP‧‧‧點 OP‧‧‧point

P‧‧‧板 P‧‧‧board

PBSa、PBSb‧‧‧偏光分光鏡 PBSa, PBSb‧‧‧ Polarized Beamsplitters

PL1~PL6‧‧‧部分投影光學系統 PL1 ~ PL6‧‧‧‧partial projection optical system

PL1a‧‧‧第1成像系統 PL1a‧‧‧The first imaging system

PL1b‧‧‧第2成像系統 PL1b‧‧‧2nd imaging system

PMa、PMb‧‧‧稜鏡 PMa, PMb‧‧‧ 稜鏡

Poc‧‧‧像點 Poc‧‧‧like points

poi‧‧‧入射面 poi‧‧‧ incident surface

PS1、PS2‧‧‧焦點位置 PS1, PS2‧‧‧ focus position

Ria、Rib、Ric‧‧‧半徑 Ria, Rib, Ric ‧‧‧ radius

RT‧‧‧厚度 RT‧‧‧ thickness

Sbp‧‧‧射出面 Sbp‧‧‧ Projection

SC1‧‧‧相位偏移光學構件 SC1‧‧‧Phase Shifting Optical Component

SCx‧‧‧石英板 SCx‧‧‧Quartz Plate

SPa、SPa'、SPb、SPb'、SPc、SPc'‧‧‧點光 SPa, SPa ', SPb, SPb', SPc, SPc'‧‧‧point light

Stp‧‧‧入射面 Stp‧‧‧ incident surface

SWa、SWb、SWc‧‧‧i射線+h射線-干涉濾光器 SWa, SWb, SWc‧‧‧i-ray + h-ray-interference filter

Sxw‧‧‧明線 Sxw‧‧‧ Open Line

TPa‧‧‧環帶狀透光部 TPa‧‧‧Loop-shaped light transmitting part

TPb‧‧‧扇形透光部 TPb‧‧‧fan-shaped light transmitting part

ΔCAi‧‧‧容許量 ΔCAi‧‧‧Allowable

ΔHx、ΔHy‧‧‧距離 ΔHx, ΔHy‧‧‧ distance

ΔWi‧‧‧波長寬度 ΔWi‧‧‧ Wavelength Width

δx‧‧‧位移量δx‧‧‧Displacement

圖1係表示依據第1實施方式之掃描型投影曝光裝置之概略性構成之立體圖。FIG. 1 is a perspective view showing a schematic configuration of a scanning projection exposure apparatus according to a first embodiment.

圖2係表示併入圖1所示之投影曝光裝置中之投影光學系統之光學構件之配置的圖。 FIG. 2 is a diagram showing the arrangement of optical components of a projection optical system incorporated in the projection exposure apparatus shown in FIG. 1. FIG.

圖3係表示用以對裝填於圖1所示之投影曝光裝置中之光罩基板照射曝光用照明光之照明裝置之概略性整體構成的立體圖。 3 is a perspective view showing a schematic overall configuration of an illumination device for irradiating a mask substrate mounted in the projection exposure device shown in FIG. 1 with exposure illumination light.

圖4係示意性表示圖3所示之照明裝置中的從水銀燈至光導纖維(光纖束)為止之第1照明光學系統之構成的立體圖。 FIG. 4 is a perspective view schematically showing a configuration of a first illumination optical system from a mercury lamp to an optical fiber (optical fiber bundle) in the lighting device shown in FIG. 3.

圖5係示意性表示藉由超高壓水銀放電燈之電弧放電而產生之光之波長特性(光譜分布)之一例的圖表。 FIG. 5 is a graph schematically showing an example of a wavelength characteristic (spectral distribution) of light generated by arc discharge of an ultrahigh-pressure mercury discharge lamp.

圖6係示意性表示藉由i射線-窄頻帶干涉濾光器,從圖5所示之波長特性(光譜分布)中選擇性地抽出包含i射線之窄波長寬度之光之狀態的圖表。 FIG. 6 is a graph schematically showing a state in which light with a narrow wavelength width of i-rays is selectively extracted from the wavelength characteristics (spectral distribution) shown in FIG. 5 by an i-ray-narrow-band interference filter.

圖7係示意性表示藉由i射線-寬頻帶干涉濾光器,從圖5所示之波長特性(光譜分布)中選擇性地抽出包含i射線及其底部附近部之廣波長寬度之光之狀態的圖表。 FIG. 7 is a view schematically showing a light beam having a wide wavelength width including i-rays and a portion near the bottom thereof selectively extracted from the wavelength characteristics (spectral distribution) shown in FIG. 5 by an i-ray-broadband interference filter. Status chart.

圖8係示意性表示藉由i射線+h射線-干涉濾光器,從圖5所示之波長特性(光譜分布)中選擇性地抽出包含i射線及h射線之兩者之廣波長寬度之光之狀態的圖表。 FIG. 8 is a diagram schematically showing light with a wide wavelength width including both i-rays and h-rays from the wavelength characteristics (spectral distribution) shown in FIG. 5 by an i-ray + h-ray-interference filter Status chart.

圖9係示意性表示設置於圖3所示之照明裝置中之光導纖維(光纖束)之整體構成、及入射端與射出端各自之形狀的立體圖。 FIG. 9 is a perspective view schematically showing the overall configuration of an optical fiber (optical fiber bundle) installed in the lighting device shown in FIG. 3 and the shape of each of an incident end and an emission end.

圖10係示意性表示圖3所示之照明裝置中,將來自光纖束之射出端之照明光照射至光罩基板上之照明區域中之第2照明光學系統之構成的立體圖。 FIG. 10 is a perspective view schematically showing a configuration of a second illumination optical system in the illumination device shown in FIG. 3, which irradiates illumination light from an exit end of a fiber bundle to an illumination area on a mask substrate.

圖11係示意性表示從圖10所示之光纖束之射出端至複眼透鏡系統為止之光路中之照明光之狀態的圖。 FIG. 11 is a diagram schematically showing a state of illumination light in an optical path from the exit end of the optical fiber bundle shown in FIG. 10 to the fly-eye lens system.

圖12係示意性表示於圖11所示之光纖束之射出端,於每個光纖線上形成之多數個點光源像之排列之一例的圖。 FIG. 12 is a diagram schematically showing an example of an arrangement of a plurality of point light source images formed on each optical fiber line at the exit end of the optical fiber bundle shown in FIG. 11.

圖13係表示於構成圖11所示之複眼透鏡系統之複數個透鏡元件之各自之射出端所形成之多數個點光源像之排列狀態的圖。 FIG. 13 is a diagram showing an arrangement state of a plurality of point light source images formed at respective emitting ends of a plurality of lens elements constituting the fly-eye lens system shown in FIG. 11.

圖14係示意性表示從圖10所示之複眼透鏡系統至光罩基板上之照明區域為止之光路中之照明光之狀態的圖。 14 is a diagram schematically showing a state of illumination light in an optical path from the fly-eye lens system shown in FIG. 10 to an illumination area on a mask substrate.

圖15係對藉由圖4所示之倍率可變部(數值孔徑可變部),來調整對光纖束之入射端照射之照明光束之數值孔徑(發散角)之作用進行說明的圖。 FIG. 15 is a diagram explaining the effect of adjusting the numerical aperture (divergence angle) of the illumination light beam irradiated on the incident end of the optical fiber bundle by the variable magnification section (numerical aperture variable section) shown in FIG. 4.

圖16係示意性表示對圖9所示之光纖束之入射側之3個光纖束射入之光束、及從射出側之6個光纖束中射出之照明光束之狀態的圖。 FIG. 16 is a diagram schematically showing a state of a light beam incident on three fiber bundles on the incident side of the fiber bundle shown in FIG. 9 and an illumination light beam emitted from the six fiber bundles on the exit side.

圖17係從X方向(掃描移動方向)來看從光纖束之射出端至複眼透鏡系統之入射面為止之光路的示意圖。 FIG. 17 is a schematic view of the optical path from the exit end of the optical fiber bundle to the incident surface of the fly-eye lens system as viewed from the X direction (scanning movement direction).

圖18係於XY面內來看分布於複眼透鏡系統之入射面上之圖17中之圓形之區域CFa、CFb、CFc之狀態的圖。 FIG. 18 is a diagram showing the states of the circular regions CFa, CFb, and CFc in FIG. 17 distributed on the incident surface of the fly-eye lens system in the XY plane.

圖19(A)係從X方向(掃描移動方向)來看形成於複眼透鏡系統之射出面上之點光(點光源像)之分布的圖,圖19(B)係從Y方向(步進移動方向)來看形成於複眼透鏡系統之射出面上之點光(點光源像)之分布的圖。 FIG. 19 (A) is a diagram showing the distribution of point light (point light source image) formed on the exit surface of the fly-eye lens system from the X direction (scanning movement direction), and FIG. 19 (B) is from the Y direction (stepping (Moving direction) to see the distribution of point light (point light source image) formed on the exit surface of the fly-eye lens system.

圖20係示意性表示對光罩基板上之照明區域上之點OP照射之照明光束Irn之配向特性(發散角之特性)的圖。 FIG. 20 is a diagram schematically showing an alignment characteristic (a characteristic of a divergence angle) of an illumination light beam Irn irradiated to a point OP on an illumination area on a mask substrate.

圖21係將於3個波長選擇部6A、6B、6C之各個安裝之圖6之i射線-窄頻帶干涉濾光器SWa、圖7之i射線-寬頻帶干涉濾光器SWb、以及圖8之i射線+h射線-干涉濾光器SWc之組合例加以歸納之表。 FIG. 21 is the i-ray-narrow-band interference filter SWa of FIG. 6, the i-ray-broadband interference filter SWb of FIG. 7, and FIG. The combination examples of the i-ray + h-ray-interference filter SWc are summarized in the table.

圖22係示意性表示藉由根據圖21之表中之組合代碼B2所代表的干涉濾光器之組合而獲得之光罩基板之照明光束之波長特性的圖表。 FIG. 22 is a graph schematically showing the wavelength characteristics of the illumination beam of the mask substrate obtained by the combination of the interference filters represented by the combination code B2 in the table of FIG. 21.

圖23係為了變形例3之說明而示出負型光阻劑之依存於波長之光吸收特性之一例的圖表。 FIG. 23 is a graph showing an example of the light absorption characteristics of the negative-type photoresist depending on the wavelength for the explanation of the modification 3. FIG.

圖24係為了變形例3之說明而示意性表示於顯影後殘膜之抗蝕劑像之邊緣部(側壁)產生之傾斜的剖面圖。 FIG. 24 is a cross-sectional view schematically showing an inclination generated at an edge portion (side wall) of a resist image of a residual film after development for the explanation of Modification Example 3. FIG.

圖25(A)係表示變形例4之構成,且表示形成有環帶狀透光部之光闌板APa之形狀的圖,圖25(B)係表示變形例4之構成,且表示形成有4極狀透光部之光闌板APb之形狀的圖。 FIG. 25 (A) is a diagram showing a configuration of Modification Example 4 and showing the shape of a diaphragm plate APa having an endless belt-shaped light-transmitting portion, and FIG. 25 (B) is a diagram showing a configuration of Modification Example 4 and shows that Figure of the shape of the diaphragm plate APb of the quadrupole-shaped light-transmitting portion.

圖26係表示變形例5之構成,且表示於第1照明光學系統之波長選擇部6A上配置有環帶狀光闌板之狀態的圖。 FIG. 26 is a diagram showing a configuration of Modification 5 and showing a state in which a ring-shaped diaphragm plate is arranged on the wavelength selection section 6A of the first illumination optical system.

圖27係表示第2實施方式之曝光裝置之概略性整體構成的圖。 FIG. 27 is a diagram showing a schematic overall configuration of an exposure apparatus according to a second embodiment.

圖28係表示利用波長解析度高之分光器,來測量上述圖5所示之超高壓水銀放電燈之波長特性之情形時所獲得之詳細分光特性的圖表。 FIG. 28 is a graph showing the detailed spectral characteristics obtained when the wavelength characteristics of the ultrahigh-pressure mercury discharge lamp shown in FIG. 5 are measured using a spectroscope with a high wavelength resolution.

圖29係表示投影光學系統之色差特性與水銀燈之i射線之明線波長之關係的圖表。 FIG. 29 is a graph showing the relationship between the chromatic aberration characteristic of the projection optical system and the bright line wavelength of the i-ray of the mercury lamp.

圖30係對高壓水銀放電燈與超高壓水銀放電燈之各波長特性之差異進行說明之圖表。 FIG. 30 is a graph illustrating differences in wavelength characteristics between a high-pressure mercury discharge lamp and an ultra-high-pressure mercury discharge lamp.

圖31係對將形成於光罩上之尺寸不同之孔圖案投影於基板時所獲得之投影像之形狀之畸變進行說明的圖。 FIG. 31 is a diagram illustrating distortion of the shape of a projection image obtained when a hole pattern having different sizes formed on a photomask is projected on a substrate.

圖32係對孔圖案之投影像畸變為橢圓形之情形時之扁率(橢圓度)之求出方法進行說明的圖。 FIG. 32 is a diagram explaining a method for obtaining the flatness (ellipticity) when the projection image of the hole pattern is distorted into an oval shape.

圖33係對圖32所示之畸變為橢圓形之孔圖案之投影像之傾斜進行說明的圖。 FIG. 33 is a diagram explaining the tilt of the projection image of the elliptical hole pattern shown in FIG. 32.

圖34係表示隨著波長而變化之合成石英之折射率之變化特性之一例的圖表。 FIG. 34 is a graph showing an example of a change characteristic of the refractive index of synthetic quartz as a function of wavelength.

圖35係對由作為像偏移光學構件而設置之平行平板狀之石英板所引起之像偏移之狀態進行示意性說明之圖。 FIG. 35 is a diagram schematically illustrating a state of image shift caused by a parallel flat plate-shaped quartz plate provided as an image shift optical member.

圖36係表示隨著像偏移光學構件之石英板之傾斜角而變化之由i射線形成之投影像與由h射線形成之投影像之相對位置偏移而導致之差分量之一例的圖表。 FIG. 36 is a graph showing an example of a difference caused by a relative position shift between a projection image formed by an i-ray and a projection image formed by an h-ray, which changes with the tilt angle of a quartz plate of an image shift optical member.

Claims (15)

一種曝光裝置,其係將光罩之圖案投影曝光於光感應性之基板,其具備: 光源,其為了對光罩進行照明而產生包含複數個明線波長之光; 第1照明光學系統,其具有:射入來自上述光源之光且將包含上述複數個明線波長中之至少1個特定明線波長而限制為既定之波長寬度之照明光束抽出的波長選擇部、及調整上述照明光束之發散角的數值孔徑可變部;以及 第2照明光學系統,其包含光學積分器,其射入上述發散角經調整之上述照明光束,用以伴隨與上述發散角對應之數值孔徑,而以同樣之照度對上述光罩上照射上述照明光束;並且 於上述波長選擇部安裝第1波長選擇元件,其一面將上述特定明線波長之旁邊出現之長波長側之明線及短波長側之明線去除,一面將上述特定明線波長之光譜成分及分布於上述特定明線波長之底部附近的低亮度之光譜成分抽出。An exposure device is used for projecting and exposing a pattern of a photomask to a light-sensitive substrate, and the device comprises: A light source for generating light including a plurality of bright-line wavelengths for illuminating the photomask; The first illumination optical system includes a wavelength selection unit that emits light from the light source and extracts an illumination light beam that includes at least one specific bright-line wavelength of the plurality of bright-line wavelengths to a predetermined wavelength width, and And a numerical aperture variable section that adjusts the divergence angle of the illumination beam; and A second illumination optical system includes an optical integrator, which is incident on the illumination beam whose divergence angle is adjusted to irradiate the illumination on the photomask with the same illuminance along with a numerical aperture corresponding to the divergence angle. Light beam; and The first wavelength selection element is installed in the wavelength selection unit, and while removing the bright line on the long wavelength side and the bright line on the short wavelength side appearing beside the specific bright line wavelength, the spectral components and The low-brightness spectral components distributed near the bottom of the specific bright line wavelength are extracted. 如請求項1所述之曝光裝置,其中 上述低亮度之光譜成分所分布之上述底部附近係設定於相對於上述特定明線波長之光譜成分之波峰強度,上述低亮度之光譜成分之相對強度平均成為數%以上、較理想為10%以上之範圍。The exposure apparatus according to claim 1, wherein The vicinity of the bottom where the low-brightness spectral component is distributed is set at the peak intensity of the spectral component with respect to the specific bright-line wavelength, and the relative intensity of the low-brightness spectral component averages several% or more, preferably 10% or more Range. 如請求項2所述之曝光裝置,其中 於上述波長選擇部,設置以可與上述第1波長選擇元件交換之方式安裝第2波長選擇元件之機構,上述第2波長選擇元件將分布於上述特定明線波長之底部附近的上述低亮度之光譜成分以外的上述特定明線波長之波峰狀之光譜成分抽出。The exposure device according to claim 2, wherein A mechanism for mounting a second wavelength selection element in a manner interchangeable with the first wavelength selection element is provided in the wavelength selection section, and the second wavelength selection element is distributed at the low-luminance near the bottom of the specific bright line wavelength. The peak-shaped spectral components other than the spectral components described above are extracted from the peak shape. 如請求項3所述之曝光裝置,其中 於上述波長選擇部,以可交換之方式安裝第3波長選擇元件,其係以包含上述特定明線波長之旁邊出現之至少1個明線波長之波峰狀之光譜成分、及上述特定明線波長之波峰狀之光譜成分之兩者之方式抽出。The exposure device according to claim 3, wherein A third wavelength selection element is mounted on the wavelength selection section in an interchangeable manner, and includes a peak-shaped spectral component including at least one bright line wavelength appearing beside the specific bright line wavelength, and the specific bright line wavelength. The peak-like spectral components are extracted in both ways. 一種曝光方法,其係將光罩之圖案投影曝光於光感應性之基板,其包括: 以如下方式進行波長選擇,即,與由產生包含複數個明線波長之光之光源而來之光中的至少1個特定明線波長之波峰狀之光譜成分一併,亦將不包含上述特定明線波長之旁邊出現之長波長側之明線及短波長側之明線,而分布於上述特定明線波長之底部附近的低亮度之光譜成分抽出;以及 將經上述波長選擇之光譜成分之照明光束以同樣之照度照射至上述光罩上,透過在包含上述低亮度之光譜成分之波長寬度中不產生色差之鏡面投射方式、或者於上述低亮度之光譜成分之波長寬度中色差得到修正之反射折射方式之投影光學系統,將上述光罩之圖案投影曝光於上述基板。An exposure method, which involves projecting and exposing a pattern of a photomask to a light-sensitive substrate, including: The wavelength selection is performed in such a manner that, together with a peak-like spectral component of at least one specific bright-line wavelength of light from a light source that generates light including a plurality of bright-line wavelengths, the above-mentioned specifics will not be included. The bright line on the long wavelength side and the bright line on the short wavelength side appearing next to the bright line wavelength, and the low-brightness spectral components distributed near the bottom of the specific bright line wavelength are extracted; and The illumination light beam with the spectral component selected by the wavelength is irradiated onto the mask with the same illuminance, and the specular projection method that does not produce color difference in the wavelength width including the spectral component of the low brightness is transmitted, or the spectrum of the low brightness is transmitted A projection optical system of a reflection-refraction method in which chromatic aberration is corrected in a component's wavelength width, and a pattern of the photomask is projected and exposed on the substrate. 如請求項5所述之曝光方法,其中 上述低亮度之光譜成分所分布之上述底部附近係設定於相對於上述特定明線波長之光譜成分之波峰強度,上述低亮度之光譜成分之相對強度平均成為數%以上、較理想為10%以上之範圍。The exposure method as described in claim 5, wherein The vicinity of the bottom where the low-brightness spectral component is distributed is set at the peak intensity of the spectral component with respect to the specific bright-line wavelength, and the relative intensity of the low-brightness spectral component averages several% or more, preferably 10% or more Range. 如請求項6所述之曝光方法,其中 上述光源為超高壓水銀放電燈,將上述特定明線波長設為i射線、h射線、g射線中之任一者。The exposure method as described in claim 6, wherein The light source is an ultrahigh-pressure mercury discharge lamp, and the specific bright-line wavelength is set to any one of i-ray, h-ray, and g-ray. 一種曝光方法,其係將由光源裝置產生之包含明線波長之光中的包含由波長選擇部所選擇之特定明線波長的光譜分布之光,藉由照明光學系統而照射至擔載電子元件用圖案之光罩上,且利用射入由上述光罩產生之曝光用光束之投影光學系統,將上述圖案之像投影曝光於光感應性之基板;其包括 藉由上述波長選擇部,從由上述光源裝置產生之光中抽出波長帶域不同之第1光譜分布之光及第2光譜分布之光;以及 為了利用上述照明光學系統對上述光罩進行柯勒照明,而於上述照明光學系統內之光瞳面上,將因上述第1光譜分布之光而於二維範圍分布之第1光源像、與因上述第2光譜分布之光而於二維範圍分布之第2光源像重疊地形成。An exposure method for irradiating light containing a bright line wavelength generated by a light source device with a spectral distribution of a specific bright line wavelength selected by a wavelength selection unit to an electronic component carrying light by an illumination optical system The patterned mask is used to project and expose the image of the pattern onto a light-sensitive substrate by using a projection optical system that projects the exposure light beam generated by the mask. Extracting the light of the first spectral distribution and the light of the second spectral distribution with different wavelength bands from the light generated by the light source device by the wavelength selecting section; and In order to use the illumination optical system to perform Kohler illumination on the photomask, a first light source image distributed in a two-dimensional range due to the light of the first spectral distribution on the pupil plane in the illumination optical system, and The second light source images distributed in the two-dimensional range due to the light of the second spectral distribution are superimposed. 如請求項8所述之曝光方法,其中 將形成於上述光瞳面上之上述第1光源像之二維範圍設定於從上述光瞳面之中心起之第1半徑之圓形區域內,並且將形成於上述光瞳面上之上述第2光源像之二維範圍設定於從上述光瞳面之中心起之第2半徑之圓形區域內。The exposure method as described in claim 8, wherein The two-dimensional range of the first light source image formed on the pupil surface is set in a circular area of a first radius from the center of the pupil surface, and the first area of the first light source image formed on the pupil surface is set. The two-dimensional range of the two-light source image is set in a circular area of a second radius from the center of the pupil surface. 如請求項9所述之曝光方法,其中 可將形成上述第1光源像之上述圓形區域之上述第1半徑、與形成上述第2光源像之上述圓形區域之上述第2半徑調整為相同之值、或者不同值。The exposure method as described in claim 9, wherein The first radius of the circular area forming the first light source image and the second radius of the circular area forming the second light source image may be adjusted to the same value or different values. 如請求項8至10中之任一項所述之曝光方法,其中 上述光源裝置包含:第1水銀放電燈,其產生由上述波長選擇部所抽出之上述第1光譜分布之光;以及第2水銀放電燈,其產生由上述波長選擇部所抽出之上述第2光譜分布之光。The exposure method according to any one of claims 8 to 10, wherein The light source device includes a first mercury discharge lamp that generates the first spectrum distribution light extracted by the wavelength selection unit, and a second mercury discharge lamp that generates the second spectrum extracted by the wavelength selection unit. Light of distribution. 如請求項11所述之曝光方法,其中 上述第1水銀放電燈及上述第2水銀放電燈分別設為將放電管內之水銀蒸氣壓設為106 Pa(帕斯卡)以上之超高壓水銀放電燈。The exposure method according to claim 11, wherein the first mercury discharge lamp and the second mercury discharge lamp are respectively ultra-high-pressure mercury discharge lamps whose mercury vapor pressure in the discharge tube is set to 10 6 Pa (Pascal) or more. . 如請求項12所述之曝光方法,其中 於上述波長選擇部設置i射線-寬頻帶干涉濾光器,其從由上述超高壓水銀放電燈產生之光中所包含之複數個明線波長中,以包含i射線之光譜成分,並且包含對於i射線之光譜成分之波峰強度而言,相對地具有數%以上、較理想為10%以上之強度的底部附近部之光譜分布的方式抽出; 上述第1光譜分布之光與上述第2光譜分布之光中之任一者係由上述i射線-寬頻帶干涉濾光器抽出。The exposure method as described in claim 12, wherein An i-ray-broadband interference filter is provided in the above-mentioned wavelength selection section, which includes the spectral components of the i-rays from a plurality of bright-line wavelengths included in the light generated by the above-mentioned ultrahigh-pressure mercury discharge lamp, and includes In terms of the peak intensity of the spectral components of the i-rays, the spectral distribution in the vicinity of the bottom, which has an intensity of several% or more, preferably 10% or more, is extracted; Either the light of the first spectral distribution or the light of the second spectral distribution is extracted by the i-ray-broadband interference filter. 如請求項8至10之任一項所述之曝光方法,其中 上述光源裝置包含:水銀放電燈,其用以獲得由上述波長選擇部所抽出之上述第1光譜分布之光;以及諧波雷射光源,其用以獲得由上述波長選擇部所抽出之上述第2光譜分布之光。The exposure method according to any one of claims 8 to 10, wherein The light source device includes: a mercury discharge lamp for obtaining the first spectrum distribution light extracted by the wavelength selection section; and a harmonic laser light source for obtaining the first light distribution extracted by the wavelength selection section. 2 Spectral distribution of light. 一種曝光方法,其係以既定之波長分布之照明光對光罩圖案進行照明,藉由將由上述光罩圖案產生之成像光束射入且投射於基板上之投影光學系統,而將上述光罩圖案之像投影曝光於上述基板上;其包括: 將上述照明光之波長分布中之特定中心波長設為λ,上述投影光學系統之上述基板之側之數值孔徑設為NAp,且程序常數設為k(0<k≦1),將與由k・(λ/NAp)所定義之解析力R決定之可解析之最小線寬尺寸接近之大小之正方形、或者矩形之孔圖案之投影像投影於上述基板時,以變形為橢圓狀之上述孔圖案之投影像之短軸長相對於長軸長之比成為80%以上、較理想為90%以上之方式,設定包含上述中心波長λ之上述照明光之波長分布之寬度;以及 藉由所設定之上述寬度之波長分布之照明光,對形成有電子元件用圖案之光罩進行照明,於上述基板上投影曝光上述電子元件用圖案。An exposure method is to illuminate a mask pattern with illumination light having a predetermined wavelength distribution, and to project the imaging beam generated by the mask pattern into a projection optical system on a substrate to project the mask pattern. The image is projected and exposed on the substrate; it includes: The specific central wavelength in the wavelength distribution of the illumination light is set to λ, the numerical aperture on the substrate side of the projection optical system is set to NAp, and the program constant is set to k (0 <k ≦ 1).・ When the projected image of a square or rectangular hole pattern with the smallest resolvable minimum line width determined by the resolution R as defined by (λ / NAp) is projected on the substrate, the hole pattern is deformed into an oval shape. The width of the wavelength distribution of the illumination light including the central wavelength λ is set such that the ratio of the short-axis length to the long-axis length of the projected image becomes 80% or more, and preferably 90% or more; The mask having the pattern for electronic components formed is illuminated by the set illumination light having the above-mentioned wavelength distribution, and the pattern for electronic components is projected and exposed on the substrate.
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Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0669014B2 (en) * 1986-02-24 1994-08-31 株式会社ニコン Exposure equipment
JP2522231Y2 (en) * 1988-04-01 1997-01-08 旭光学工業株式会社 Photo engraving system
JPH0644549B2 (en) * 1989-03-17 1994-06-08 株式会社日立製作所 Projection exposure method and apparatus
EP0967524A3 (en) * 1990-11-15 2000-01-05 Nikon Corporation Projection exposure method and apparatus
JPH06318542A (en) * 1993-05-07 1994-11-15 Nikon Corp Projection aligner
JP3437314B2 (en) * 1995-03-16 2003-08-18 富士通株式会社 Phase shift mask, pattern forming method and semiconductor device manufacturing method
JP3341767B2 (en) * 2001-10-10 2002-11-05 株式会社ニコン Projection exposure apparatus and method, and circuit element forming method
TW200301848A (en) * 2002-01-09 2003-07-16 Nikon Corp Exposure apparatus and exposure method
JP2003295459A (en) * 2002-04-02 2003-10-15 Nikon Corp Aligner and exposing method
JP2003203853A (en) * 2002-01-09 2003-07-18 Nikon Corp Aligner and its method, and manufacturing method for microdevice
JP2003257846A (en) * 2002-03-07 2003-09-12 Nikon Corp Light source unit, lighting system, and system and method for exposure
US6813098B2 (en) * 2003-01-02 2004-11-02 Ultratech, Inc. Variable numerical aperture large-field unit-magnification projection system
JP4474121B2 (en) * 2003-06-06 2010-06-02 キヤノン株式会社 Exposure equipment
JP2007059510A (en) * 2005-08-23 2007-03-08 Nikon Corp Lighting optical device, aligner and manufacturing method of micro device
CN101578542B (en) * 2006-12-28 2011-06-08 卡尔蔡司Smt有限责任公司 Catadioptric projection objective with tilted deflecting mirrors, projection exposure apparatus, projection exposure method, and mirror
JP5311757B2 (en) * 2007-03-29 2013-10-09 キヤノン株式会社 Reflective optical element, exposure apparatus, and device manufacturing method
JP5115953B2 (en) * 2007-03-30 2013-01-09 Hoya株式会社 Photomask blank and photomask
JP2008263092A (en) * 2007-04-13 2008-10-30 Orc Mfg Co Ltd Projection exposure device
JP4936385B2 (en) * 2007-06-06 2012-05-23 キヤノン株式会社 Polarizing element and exposure apparatus
JP2009032749A (en) * 2007-07-24 2009-02-12 Nikon Corp Exposure apparatus and device manufacturing method
JP2009288005A (en) * 2008-05-28 2009-12-10 Asml Netherlands Bv Inspection method and apparatus, lithography apparatus, lithography processing cell, and device manufacturing method
JP2010087388A (en) * 2008-10-02 2010-04-15 Ushio Inc Aligner
JP2010103191A (en) * 2008-10-21 2010-05-06 Fujitsu Microelectronics Ltd Exposure apparatus and exposure method
JP2011022529A (en) * 2009-07-21 2011-02-03 Mejiro Precision:Kk Light source device and exposure device
CN103299243B (en) * 2010-11-19 2016-03-16 恩斯克科技有限公司 Proximity printing device and proximity printing method
JP2014052614A (en) * 2012-09-10 2014-03-20 Nikon Corp Mask, production method of mask, exposure method, device production method, and exposure apparatus

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KR102604340B1 (en) 2023-11-21
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WO2019146448A1 (en) 2019-08-01
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KR20200108068A (en) 2020-09-16
JP2022051810A (en) 2022-04-01

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