TW201940885A - Pitot-tube type flowmeter for substrate-treating apparatus, substrate-treating apparatus, and substrate treating method - Google Patents

Abstract

This substrate-treating apparatus is provided with: a treating unit which supplies, to a substrate, a chemical agent for treating the substrate; an exhaust passage through which exhaust gas containing the chemical agent passes; and a Pitot-tube type flowmeter which is disposed in the exhaust passage and which measures the flow rate of the exhaust gas containing the chemical agent. The Pitot-tube type flowmeter comprises: a cylindrical casing through which the exhaust gas containing the chemical agent passes; a Pitot tube which includes an outer circumferential surface having a measurement hole to come into contact with the exhaust gas and which is disposed in the casing; and a cleaning liquid pipe which guides a cleaning liquid to be supplied to the Pitot tube.

Description

Pitot tube type flowmeter for substrate processing device, substrate processing device and substrate processing method

The present invention relates to a pitot tube type flowmeter for a substrate processing device, a substrate processing device having a pitot tube type flowmeter, and a substrate processing method performed by a substrate processing device having a pitot tube type flowmeter.

The substrates to be processed include, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, substrates for solar cells, organic EL (electroluminescence, A substrate such as an FPD (Flat Panel Display) substrate for an electroluminescence (display) device.

In the manufacturing steps of a semiconductor device or a liquid crystal display device, a substrate processing device that processes a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device is used.

Patent Document 1 discloses a single-chip substrate processing apparatus that processes substrates one by one. This substrate processing apparatus includes: a plurality of processing units for processing a substrate; a plurality of gas-liquid separation tanks for separating liquids by exhaust gas discharged from the plurality of processing units; and a plurality of individual units connected to the plurality of gas-liquid separation tanks, respectively Exhaust pipe; and a collective exhaust pipe connected to each individual exhaust pipe.

The substrate processing apparatus described in Patent Document 1 further includes a collective damper that adjusts a flow rate of exhaust gas flowing through the collective exhaust pipe, and a collective flow meter that detects a flow rate of exhaust gas flowing through the collective exhaust pipe. Patent Document 1 paragraph 0081 It is described that the collective flow meter is, for example, a differential pressure flow meter, and includes a first collective flow meter that detects exhaust pressure upstream of the collective damper, and a second collective flow meter that detects exhaust pressure downstream of the collective damper. It is stated in the same paragraph: the collective flow meter is not limited to the differential pressure flow meter, but can also be other types of flow meters such as thermal mass flow meters, vortex flow meters, and ultrasonic flow meters.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-119042

The exhaust gas discharged from the substrate processing apparatus may contain trace amounts of chemicals. For example, when multiple chemical liquids such as an acidic chemical liquid, an alkaline chemical liquid, and an organic chemical liquid are sequentially supplied to the same substrate, an exhaust gas containing an acidic chemical liquid, an exhaust gas containing an alkaline chemical liquid, and an organic drug The exhaust of the liquid will sequentially pass through the exhaust pipe. At this time, crystals such as salts occur in the exhaust pipe and gradually accumulate in the exhaust pipe. Even if only one type of chemical liquid is supplied to the same substrate, if the water content of the chemical liquid is lost, residues or crystals remain in the exhaust pipe and gradually accumulate in the exhaust pipe.

Patent Document 1 describes the use of a differential pressure flow meter, a thermal mass flow meter, a vortex flow meter, or an ultrasonic flow meter as a collective flow meter. Regardless of the type of the collective flow meter, if the substrate is continuously processed, the residue will remain. Foreign matter such as crystals will adhere to the collective flow meter and gradually accumulate in the collective flow meter. If the amount of attached foreign matter is only a small amount, it has little effect on the flow rate measurement, but if the amount of foreign matter increases, it may affect the accuracy of the flow rate measurement.

Therefore, one of the objects of the present invention is to provide a long-term stable accuracy. Pitot tube flowmeter, substrate processing device, and substrate processing method for a substrate processing device for measuring exhaust gas flow.

An embodiment of the present invention provides a pitot tube type flowmeter for a substrate processing device, which includes a cylindrical casing for passing exhaust gas of a medicine containing a processed substrate, and a pitot tube including a connection with the exhaust gas. An outer peripheral surface provided with a measurement hole is arranged in the housing; and a washing liquid pipe guides the washing liquid supplied to the pitot tube.

With this configuration, the exhaust gas of the medicine containing the processing substrate flows downstream in the case. The pitot tube is arranged in the casing. The total pressure (sum of static pressure and dynamic pressure) and static pressure of the exhaust gas flowing downstream in the casing are detected by a pitot tube. The exhaust gas flow, that is, the amount of exhaust gas passing through the casing per unit time, is calculated based on the dynamic pressure of the exhaust gas. Thereby, the flow rate of exhaust gas passing through the casing can be measured.

The exhaust gas flowing downstream in the casing is connected to the outer peripheral surface of the pitot tube provided with a measurement hole. If the pitot tube is exposed to the exhaust gas for a long time, foreign matter such as salt adheres to the measurement hole of the pitot tube. The washing liquid guided by the washing liquid pipe is supplied to the measurement hole of the pitot tube. This can prevent the measurement hole of the pitot tube from being clogged by foreign matter such as residue or crystals, and can measure the exhaust flow rate with stable accuracy for a long time.

In addition, since the cleaning solution is supplied to the pitot tube or the casing, when foreign matter adhering to these can be dissolved in the cleaning solution, the foreign matter can be removed by dissolving the foreign matter in the cleaning solution. For example, salts produced by contact between acidic medicines and alkaline medicines, or crystals precipitated from the medicinal solution due to the disappearance of water are dissolved in water, so if the aqueous washing solution is supplied to a pitot tube, it can be effectively removed Salt or crystal. Therefore, foreign matter can be removed more reliably than when a cleaning gas is used instead of the cleaning liquid.

The medicine for processing the substrate may be a vapor (a gas of a medicine) or a mist (a minute droplet of a medicine) of the medicine liquid, or a medicine liquid (a liquid of the medicine). Similarly, the medicine contained in the exhaust gas can be the medicine's vapor (gas of medicine), or the medicine's mist (small droplets of medicine).

The total pressure and static pressure of the exhaust gas can be measured by two pitot tubes or by one pitot tube. That is, the pitot tube type flowmeter for a substrate processing apparatus may be equipped with two pitot tubes (full pressure measurement tube and static pressure measurement tube) for measuring the total pressure and static pressure of exhaust gas, respectively, and may be provided with a full pressure measurement tube. 1 pitot tube integrated with static pressure measuring tube.

In this embodiment, the pitot tube type flowmeter for the substrate processing apparatus described above may also include at least one of the following features.

The pitot tube type flowmeter for the substrate processing apparatus further includes a measurement pipe connected to the pitot tube, and the cleaning liquid piping is connected to the pitot tube via the measurement pipe.

With this configuration, the pressure (full pressure or static pressure) applied to the measurement hole of the pitot tube is transmitted to the differential pressure gauge through the measurement pipe. The washing liquid guided by the washing liquid pipe is supplied to the inner space of the pitot tube through the measuring pipe. The cleaning solution in the pitot tube is discharged from the measurement hole to the outside of the pitot tube. If a foreign substance adheres to the measurement hole, the foreign substance is washed away by the washing liquid discharged from the measurement hole. Thereby, the measurement hole of the pitot tube can be prevented from being blocked by a foreign body, and the exhaust flow rate can be measured with stable accuracy for a long period of time.

In addition, since the cleaning liquid is supplied to the inner space of the pitot tube through the measurement pipe, the fluid nozzle that discharges the cleaning liquid may not be disposed in the housing. If the fluid nozzle is arranged in the casing, it will affect the exhaust gas flow, although it is only slightly. Therefore, the pitot tube can be cleaned without affecting the exhaust gas flow. Furthermore, since Since the fluid nozzle is provided, the number of parts can be reduced.

The pitot tube type flowmeter for the substrate processing apparatus further includes at least one fluid nozzle for supplying a fluid to the inside of the casing; and the cleaning liquid pipe is connected to the at least one fluid nozzle.

According to this configuration, the cleaning liquid is supplied to the fluid nozzle from the cleaning liquid pipe, and is discharged from the fluid nozzle. Thereby, a washing liquid is supplied to the inside of the casing. Therefore, the inner surface of the casing can be cleaned by the cleaning liquid. In addition, the components arranged inside the casing of a pitot tube or the like can be cleaned with a washing liquid. In this way, the exhaust gas flow rate can be measured with stable accuracy over a long period of time.

The at least one fluid nozzle includes a fluid nozzle which is arranged in the casing and discharges fluid toward the outer peripheral surface of the pitot tube.

According to this configuration, the cleaning liquid guided by the cleaning liquid pipe is supplied to the fluid nozzle disposed in the casing, and the fluid nozzle is discharged toward the outer peripheral surface of the pitot tube. Thereby, the washing | cleaning liquid is supplied to the measurement hole of a pitot tube. If a foreign substance adheres to the measurement hole, the foreign substance is washed away by the washing liquid discharged from the fluid nozzle. Thereby, the measurement hole of the pitot tube can be prevented from being blocked by a foreign body, and the exhaust flow rate can be measured with stable accuracy for a long period of time.

The pitot tube type flowmeter for the substrate processing apparatus further includes: a measurement pipe connected to the pitot tube; and a suction pipe that sucks a fluid in the pitot tube through the measurement pipe.

According to this configuration, after the pitot tube is washed with the washing liquid, the flow system in the pitot tube is attracted to the suction tube via the measurement tube connected to the pitot tube. Even if a foreign substance or a washing solution remains in the pitot tube, these are attracted to the suction pipe via the measurement pipe. Furthermore, since the airflow flowing into the pitot tube from the outside of the pitot tube through the measurement hole is formed, the drying of the cleaning solution adhering to the measurement hole is promoted. Therefore, compared with the case where the pitot tube is dried by the exhaust gas flow, the pitot tube can be dried in a shorter time.

The pitot tube type flowmeter for the substrate processing apparatus further includes: a measurement pipe connected to the pitot tube; and a gas piping connected to the pitot tube through the measurement piping, and guided to be supplied to the pitot tube through the measurement piping Managed gas.

According to this configuration, after the pitot tube is washed with the washing liquid, the gas guided by the gas piping is supplied to the inner space of the pitot tube through the measurement piping. The gas system in the pitot tube is discharged from the measurement hole to the outside of the pitot tube. As a result, an airflow flowing from the pitot tube to the outside of the pitot tube through the measurement hole is formed, so that the drying of the cleaning solution adhering to the measurement hole is promoted. Therefore, compared with the case where the pitot tube is dried by the exhaust gas flow, the pitot tube can be dried in a shorter time.

The pitot tube type flowmeter for the substrate processing apparatus further includes: a fluid nozzle disposed in the housing to discharge fluid toward the outer peripheral surface of the pitot tube; and a gas pipe connected to the fluid nozzle to guide and supply to the fluid nozzle. Gas from fluid nozzle.

According to this configuration, after the pitot tube is washed with the washing liquid, the gas system guided by the gas pipe is supplied to the fluid nozzle arranged in the casing, and the fluid nozzle is discharged toward the outer peripheral surface of the pitot tube. This promotes the drying of the cleaning solution adhered to the measurement well. Therefore, compared with the case where the pitot tube is dried by the exhaust gas flow, the pitot tube can be dried in a shorter time.

When the cleaning liquid pipe is connected to a fluid nozzle, a pitot tube type flowmeter for a substrate processing device may include a cleaning liquid nozzle connected to a cleaning liquid pipe and a gas nozzle connected to a gas pipe. Both the liquid pipe and the gas pipe are connected to one fluid nozzle.

Another embodiment of the present invention provides a substrate processing apparatus, The processing unit includes a processing unit for supplying chemicals to the substrate, an exhaust passage for passing exhaust gas containing the medicine, and a pitot tube type flowmeter for the substrate processing device, which is disposed in the exhaust passage, The flow rate of the exhaust gas containing the above-mentioned drugs was measured.

According to this configuration, a medicine for processing a substrate is supplied to the substrate. Thereby, the substrate is processed. The exhaust gas containing medicines is exhausted through the exhaust passage. Pitot tube type flowmeter is arranged in the exhaust passage. Thereby, the flow rate of the exhaust gas flowing through the exhaust passage can be measured. Furthermore, since the pitot tube of the pitot tube type flowmeter is cleaned by the washing liquid, foreign matter can be prevented from clogging the measurement hole of the pitot tube, and the exhaust flow rate can be measured with stable accuracy for a long time. In addition, compared to other types of flowmeters such as orifice flowmeters, the pitot tube type flowmeter has a smaller pressure loss, so it can reduce energy consumption.

In this embodiment, the substrate processing apparatus described above may also include at least one of the following features.

The pitot tube type flowmeter for the substrate processing apparatus is disposed under a floor of a clean room provided with the substrate processing apparatus.

According to this configuration, the pitot tube type flow meter is arranged under the floor of the clean room. It is generally considered that the operator uses the nozzle or brush held by himself to clean the inside of the casing or the pitot tube. However, when a pitot tube type flowmeter is disposed underground, it cannot be cleaned so easily. This is due to the difficulty in removing the components arranged underground in the clean room. Therefore, the pitot tube type flowmeter can be easily cleaned by providing a cleaning liquid pipe for supplying a cleaning liquid to the pitot tube.

The casing is arranged in the horizontal posture according to the centerline of the casing, or the inclined posture in which the centerline of the casing is inclined with respect to the horizontal plane, and is arranged in the exhaust passage; the pitot tube is positioned in the center of the casing The center line of the pitot tube is inclined with respect to the horizontal plane when the shell is viewed in the direction of the line Or, when the casing is viewed in the direction of the centerline of the casing, the centerline of the pitot tube is in a horizontal horizontal posture and is disposed in the casing.

According to this configuration, the center line of the casing extends horizontally or is inclined with respect to the horizontal plane. The pitot tube usually passes through the diameter of the inner peripheral surface of the casing, that is, through the center line of the casing, so that both ends are arranged on a line segment located on the inner peripheral surface of the casing. When the casing is in the above posture and the center line of the pitot tube is vertical, foreign matter such as residues or crystals is likely to accumulate at the lower end of the pitot tube. Therefore, by causing the pitot tube to tilt obliquely to the vertical plane or orthogonal to the vertical plane, such foreign matter adhesion can be reduced.

The substrate processing apparatus further includes a gas flow rate changing unit that changes at least one of a gas supply flow rate and an exhaust flow rate, the gas supply flow rate representing a flow rate of a gas supplied into the substrate processing apparatus, and the exhaust flow rate expressing a A flow rate of the gas discharged from the substrate processing apparatus; and a control device that causes the gas flow rate changing unit to change at least one of the supply air flow rate and the exhaust flow rate based on the measurement value of the pitot tube type flow meter used for the substrate processing apparatus By.

The gas flow rate changing unit may be a blower that blows gas into the substrate processing apparatus, or may be an exhaust damper that changes a cross-sectional area of a flow path of the exhaust passage, or may include both. Even if the set value of the blower, that is, the set value of the flow rate of the blower to the gas blown in the substrate processing device is the same, the flow rate of the gas in the substrate processing device may not be constant. This is due to a change in the state of the substrate processing apparatus. The control device changes the flow rate of the gas blown from the blower into the substrate processing device according to the measured value of the flow meter. Therefore, the flow velocity of the gas in the substrate processing apparatus can be maintained constant or changed intentionally.

The substrate processing apparatus further includes: a pressure gauge that measures a pressure applied to the exhaust passage; and a control device that measures the pressure in accordance with the substrate processing apparatus. The measured value of the pitot tube type flowmeter used and the measurement value of the above-mentioned pressure gauge are used to detect the blockage of the measurement hole of the pitot tube of the pitot tube type flowmeter used for the substrate processing device.

With this configuration, the pressure applied to the exhaust passage is measured with a pressure gauge. If the flow rate of the exhaust gas flowing through the exhaust passage is fixed, the measurement value of the pitot tube type flowmeter is also almost fixed, and the measurement value of the pressure gauge is also almost fixed. In other words, if the measurement hole of the pitot tube is not blocked, and the pitot tube type flowmeter functions properly, the measurement value of the pitot tube type flowmeter and the measurement value of the pressure gauge have a certain relationship. Therefore, if the relationship between the measured value of the pitot tube type flowmeter and the measured value of the pressure gauge is out of balance, there is a possibility that foreign matter adheres to the measurement hole of the pitot tube. The control device detects this situation based on the measured value of the Pitot tube flowmeter and the measured value of the pressure gauge. This can detect the blockage of the measuring hole beforehand.

Another embodiment of the present invention provides a substrate processing method, which is performed by a substrate processing apparatus provided with the above-mentioned pitot tube type flowmeter, and includes: a substrate processing step that supplies medicines for processing the substrate to the substrate; A gas flow measurement step for measuring a flow rate of the exhaust gas containing the above-mentioned medicine by a pitot tube type flow meter for the substrate processing device disposed on an exhaust passage for guiding the exhaust gas containing the above-mentioned medicine; Step of supplying the cleaning liquid guided by the cleaning liquid pipe of the pitot tube type flowmeter for the substrate processing device to the pitot tube type flowmeter for the substrate processing device after the exhaust gas flow measurement step. Pitot tube, to wash the pitot tube. With this configuration, the same effects as those described above can be exhibited.

In this embodiment, the above substrate processing method may also include at least one of the following features.

The exhaust gas flow measurement step includes a pitot tube for the substrate processing device disposed under a floor of a clean room in which the substrate processing device is installed. A flow meter is a step of measuring the flow rate of exhaust gas containing the aforementioned medicine. With this configuration, the same effects as those described above can be exhibited.

The casing of the pitot tube type flowmeter for the substrate processing device is arranged in a horizontal posture in which the centerline of the casing is horizontal or the centerline of the casing is inclined with respect to the horizontal plane, and is disposed in the exhaust gas. Passage, the exhaust gas flow measurement step is the substrate processing disposed in the casing by the inclined position of the centerline of the pitot tube with respect to the horizontal plane when the casing is viewed in the direction of the centerline of the casing. Pitot tube type flowmeter for the device, the step of measuring the flow rate of the exhaust gas containing the drug; or the center line of the pitot tube is horizontal when the case is viewed in the direction of the center line of the case A pitot tube type flowmeter for the substrate processing apparatus arranged in the casing, and a step of measuring a flow rate of exhaust gas containing the drug. With this configuration, the same effects as those described above can be exhibited.

The substrate processing method further includes a gas flow rate changing step that changes at least one of a gas supply flow rate and an exhaust gas flow rate based on the measurement value of the pitot tube type flow meter used for the substrate processing apparatus, and the gas supply flow rate indicates that the gas is supplied to the above. The flow rate of the gas in the substrate processing apparatus, and the exhaust flow rate indicates the flow rate of the gas discharged from the substrate processing apparatus. With this configuration, the same effects as those described above can be exhibited.

The substrate processing method further includes a clogging detection step that detects the substrate processing device based on a measurement value of a pressure gauge that measures a pressure applied to the exhaust passage and a measurement value of a pitot tube type flow meter for the substrate processing device. The pitot tube of the pitot tube type flowmeter used is blocked. With this configuration, the same effects as those described above can be exhibited.

The above substrate processing method further includes a pitot tube drying step, which After the pitot tube washing step, air flow is formed by using at least one of suction and supply of fluid, thereby drying the pitot tube. With this configuration, the same effects as those described above can be exhibited.

The above content or other objects, features, and effects of the present invention will be clarified by the following description of embodiments with reference to the accompanying drawings.

1‧‧‧ substrate processing device

2‧‧‧ processing unit

3‧‧‧control device

4‧‧‧ chamber

5‧‧‧ next door

5a‧‧‧Air outlet

5b‧‧‧ moved in and out

6‧‧‧FFU

7‧‧‧ Gate

8‧‧‧Rotating fixture

9‧‧‧ pin

10‧‧‧ rotating base

11‧‧‧Rotary shaft

12‧‧‧ rotating motor

13‧‧‧handling cup

14‧‧‧Guard

14a‧‧‧Top plate

14b‧‧‧ tube

14u‧‧‧upper

15‧‧‧ cup

16‧‧‧ Outer wall members

17‧‧‧ Guard Lifting Unit

18‧‧‧ Acidic Liquid Nozzle

19‧‧‧ Acidic Liquid Piping

20‧‧‧ Acidic Liquid Valve

21‧‧‧ Alkaline chemical liquid nozzle

22‧‧‧ Alkaline liquid pipe

23‧‧‧ Alkali Chemical Valve

24‧‧‧Organic chemical liquid nozzle

25‧‧‧ Organic medicinal liquid piping

26‧‧‧Organic liquid medicine valve

27‧‧‧Flushing nozzle

28‧‧‧Flushing liquid pipe

29‧‧‧Flushing liquid valve

31‧‧‧Computer Body

32‧‧‧CPU

33‧‧‧Master memory device

34‧‧‧ Peripherals

35‧‧‧ auxiliary memory device

36‧‧‧Reading device

37‧‧‧Communication device

38‧‧‧ input device

39‧‧‧display device

40‧‧‧Alarm device

41‧‧‧Exhaust pipe

42‧‧‧ Individual exhaust pipe

42a‧‧‧The first tube

42b‧‧‧Tube 2

43‧‧‧collection exhaust pipe

44‧‧‧Exhaust passage

45‧‧‧ pressure gauge

46‧‧‧Flowmeter

46i‧‧‧ entrance

46o‧‧‧Exit

47‧‧‧Exhaust damper

51‧‧‧shell

51i‧‧‧Inner peripheral surface

52‧‧‧upstream flange

53‧‧‧Supervisor

54‧‧‧ downstream flange

55‧‧‧ Pitot tube

55i‧‧‧Inner peripheral surface

55o‧‧‧outer surface

55s‧‧‧ static pressure measuring tube

55t‧‧‧full pressure measuring tube

56‧‧‧Assay hole

56s‧‧‧Hydrostatic measuring hole

56t‧‧‧full pressure measuring hole

57‧‧‧Measurement piping

58‧‧‧ Differential pressure gauge

59‧‧‧Rectifying component

59a‧‧‧rectifier

61‧‧‧Normally Open Valve

62‧‧‧washing liquid pipe

63‧‧‧washing liquid valve

64‧‧‧ suction pipe

65‧‧‧ Suction valve

66‧‧‧ Attraction device

71‧‧‧Gas piping

72‧‧‧Gas valve

73‧‧‧fluid nozzle

73a, 73b, 73c, 73d, 73e‧‧‧fluid nozzles

A1‧‧‧axis of rotation

C‧‧‧ carrier

CR‧‧‧ Central Robot

D1‧‧‧ interval

D2‧‧‧distance

D3‧‧‧ length

Df‧‧‧ Flow direction

F‧‧‧Floor

h1‧‧‧hole

H1, H2‧‧‧Hand

IR‧‧‧ Index Robot

L1, L2‧‧‧ Centerline

LP‧‧‧ Loading port

Ld‧‧‧ diagonal

M‧‧‧ Removable Media

P‧‧‧Program

P1‧‧‧pitch

TW‧‧‧ Tower

W‧‧‧ substrate

FIG. 1 is a schematic view of a substrate processing apparatus according to a first embodiment of the present invention as viewed from above.

FIG. 2 is a schematic view of a substrate processing apparatus viewed from a side.

FIG. 3 is a schematic view of the inside of a processing unit provided in the substrate processing apparatus.

Fig. 4 is a block diagram showing the hardware of the control device.

FIG. 5 is a flowchart for explaining an example of substrate processing performed by a substrate processing apparatus.

FIG. 6 is a schematic diagram for explaining an exhaust system of a substrate processing apparatus.

Fig. 7 is a cross-sectional view showing a cross section of a flow meter taken along a plane including a center line of a casing.

FIG. 8 is a view of the flow meter viewed from a direction of an arrow VIII shown in FIG. 7.

Fig. 9 is a sectional view showing a cross section of a flow meter taken along the line IX-IX shown in Fig. 7.

Fig. 10 is a sectional view showing a pitot tube section taken along the line X-X shown in Fig. 9.

Fig. 11A is a cross-sectional view showing a state in which the pitot tube is washed.

Fig. 11B is a cross-sectional view showing a state where the pitot tube is dried.

FIG. 12 is a cross-sectional view showing a first modified example of the first embodiment of the present invention. Shows the cross section of the flowmeter cut on the plane containing the centerline of the casing.

13 is a cross-sectional view showing a second modified example of the first embodiment of the present invention, and shows a cross section of a flow meter cut on a plane including a center line of a casing.

14 is a cross-sectional view showing a third modification of the first embodiment of the present invention, and shows a cross section of a flow meter cut on a plane orthogonal to the center line of the casing.

FIG. 15 is a timing chart of the second embodiment of the present invention, showing the change with time of the rotation speed of the substrate and the flow rate of the clean gas supplied from the FFU into the chamber and the flow rate of the exhaust gas discharged from the chamber.

FIG. 16 is a flowchart of a third embodiment of the present invention, and shows a flow when the control device determines whether to perform cleaning of the flowmeter.

FIG. 1 is a schematic view of a substrate processing apparatus 1 according to a first embodiment of the present invention as viewed from above. FIG. 2 is a schematic view of the substrate processing apparatus 1 as viewed from the side.

As shown in FIG. 1, the substrate processing apparatus 1 is a single-chip apparatus that processes a wafer-like substrate W such as a semiconductor wafer one by one. The substrate processing apparatus 1 includes a loading port LP that holds a carrier C that holds one or more substrates W constituting a batch, and a plurality of processing units 2 that are processed and loaded by a processing fluid such as a processing liquid or a processing gas. The substrate W transferred from the carrier C on the port LP; a transfer robot that transfers the substrate W between the carrier C on the loading port LP and the processing unit 2; and a control device 3 that controls the substrate processing device 1.

The transfer robot includes: an indexing robot IR that carries substrates W in and out of the carrier C on the loading port LP; and a central robot CR that carries substrates W in and out of the plurality of processing units 2. The indexing robot IR transfers the substrate W between the loading port LP and the central robot CR. The central robot CR is connected to the cable. The substrate W is transferred between the lead robot IR and the processing unit 2. The central robot CR includes a hand H1 supporting the substrate W, and the indexing robot IR includes a hand H2 supporting the substrate W.

The plurality of processing units 2 are formed in a plurality of towers TW arranged around the central robot CR in a plan view. FIG. 1 shows an example in which four towers TW are formed. As shown in FIG. 2, each tower TW system includes a plurality of (eg, three) processing units 2 stacked on top and bottom. Each tower TW is arranged above the floor F of the clean room provided in the substrate processing apparatus 1.

FIG. 3 is a schematic view of the inside of the processing unit 2 included in the substrate processing apparatus 1.

The processing unit 2 includes a box-shaped chamber 4 having an internal space, and a rotary fixture 8 horizontally holding a substrate W in the chamber 4 and rotating the substrate W around a vertical rotation axis A1 passing through a central portion of the substrate W; The cylindrical processing cup 13 of the rotary jig 8 is surrounded around the rotation axis A1.

The chamber 4 includes a box-shaped partition wall 5 provided with a carry-in / out port 5b through which the substrate W passes, and a shutter 7 which opens and closes the carry-in / out port 5b. The FFU6 (Fan Filter Unit, fan filter unit) of the processing unit 2 is arranged on the air outlet 5a provided on the upper part of the partition wall 5. FFU6 always supplies clean gas (air filtered by the filter) into the chamber 4 through the air outlet 5a. The gas system in the chamber 4 is discharged from the chamber 4 through an exhaust pipe 41 connected to the bottom of the processing cup 13. As a result, a downdraft of clean gas is constantly formed in the chamber 4.

The rotating jig 8 includes: a circular plate-shaped rotating base 10 held in a horizontal posture; a plurality of clamp pins 9 holding the substrate W in a horizontal posture above the rotating base 10; and a rotation extending downward from a central portion of the rotating base 10 Axis 11; and by using A rotary motor 12 that rotates the rotary shaft 11 to rotate the rotary base 10 and the plurality of clamp pins 9. The rotating jig 8 is not limited to a holding type in which a plurality of clamping pins 9 contact the outer peripheral surface of the substrate W, and may be held horizontally by adsorbing the back surface (lower surface) of the substrate W belonging to the non-device forming surface on the rotating substrate 10 Vacuum type clamp for the substrate W.

The processing cup 13 includes: a protective member 14 that receives the liquid discharged from the substrate W outward; a cup 15 that receives the liquid guided downward by the protective member 14; and a cylindrical outer wall member surrounding the protective member 14 and the cup 15. 16. The processing cup 13 may also include a plurality of guards 14 and a plurality of cups 15.

The protector 14 includes a cylindrical cylindrical portion 14 b surrounding the rotating jig 8 and a circular top plate portion 14 a extending obliquely upward from the upper end of the cylindrical portion 14 b toward the rotation axis A1. The cup 15 is arranged below the cylindrical portion 14b. The cup 15 forms a ring-shaped liquid receiving groove which is opened upward. The liquid received by the guard 14 is guided to the receiving groove.

The processing unit 2 includes a guard lifting unit 17 that lifts the guard 14. The guard lifting unit 17 positions the guard 14 at any position from the upper position (the position shown in FIG. 3) to the lower position. The upper position means that the upper end 14u of the guard 14 is disposed at a position higher than the holding position where the substrate W held by the rotary jig 8 is disposed. The lower position means that the upper end 14u of the guard 14 is disposed at a position lower than the holding position. The ring-shaped upper end of the top plate portion 14 a corresponds to the upper end 14 u of the guard 14. The upper end 14u of the guard 14 surrounds the substrate W and the rotating base 10 in a plan view.

When the processing liquid is supplied to the substrate W in a state where the substrate W is rotated by the rotary jig 8, the processing liquid supplied to the substrate W is removed to the periphery of the substrate W. When the processing liquid is supplied to the substrate W, the upper end 14u of the guard 14 is disposed above the substrate W. Accordingly, the processing liquid such as the chemical liquid or the rinsing liquid discharged to the periphery of the substrate W is received by the guard 14 and guided to the cup 15.

The processing unit 2 includes a plurality of processing liquid nozzles for discharging a processing liquid toward the substrate W held by the rotary jig 8. The plurality of processing liquid nozzles include: an acidic chemical liquid nozzle 18 that ejects an acidic chemical liquid toward the substrate W; an alkaline chemical liquid nozzle 21 that ejects an alkaline chemical liquid toward the substrate W; and an organic chemical liquid nozzle that ejects an organic chemical liquid toward the substrate W 24; and a rinse liquid nozzle 27 that ejects the rinse liquid toward the substrate W.

The acidic chemical liquid nozzle 18 may be a scanning nozzle capable of horizontally moving in the chamber 4, or may be a fixed nozzle fixed to the partition wall 5 of the chamber 4. The same applies to the alkaline chemical liquid nozzle 21, the organic chemical liquid nozzle 24, and the rinse liquid nozzle 27. For example, when the acidic chemical liquid nozzle 18 is a scanning nozzle, a nozzle moving unit that moves the acidic chemical liquid nozzle 18 in the chamber 4 may be provided in the processing unit 2.

The processing unit 2 includes an acidic chemical liquid pipe 19 connected to the acidic chemical liquid nozzle 18 and an acidic chemical liquid valve 20 that opens and closes the inside of the acidic chemical liquid pipe 19. Similarly, the processing unit 2 includes: an alkaline chemical liquid pipe 22 connected to the alkaline chemical liquid nozzle 21; an alkaline chemical liquid valve 23 that opens and closes the inside of the alkaline chemical liquid pipe 22; An organic chemical liquid pipe 25; an organic chemical liquid valve 26 that opens and closes the organic chemical liquid pipe 25; a flushing liquid pipe 28 connected to the flushing liquid nozzle 27;

Although not shown, the acidic chemical valve 20 includes: a valve body provided with an internal flow path through which the liquid flows and a ring-shaped valve seat surrounding the internal flow path; a valve body that can be moved relative to the valve seat; and An actuator that moves the valve body between a closed position where the valve body contacts the valve seat and an open position where the valve body leaves the valve seat. The same applies to other valves. The actuator may be an air pressure actuator or an electric actuator, or an actuator other than this. The control device 3 controls the actuator to open and close the acid chemical liquid valve 20.

If the acidic chemical liquid valve 20 is opened, the acidity from the acidic chemical liquid supply source The chemical solution is discharged from the acidic chemical solution nozzle 18 toward the upper surface of the substrate W. Similarly, if any one of the alkaline chemical liquid valve 23, the organic chemical liquid valve 26, and the flushing liquid valve 29 is opened, any one of the alkaline chemical liquid, the organic chemical liquid, and the flushing liquid is the alkaline chemical liquid Any one of the nozzle 21, the organic chemical liquid nozzle 24, and the rinse liquid nozzle 27 is ejected toward the upper surface of the substrate W. Thereby, the processing liquid is supplied to the upper surface of the substrate W.

An example of an acidic chemical solution is hydrofluoric acid (hydrofluoric acid), and an example of an alkaline chemical solution is SC-1 (ammonia-hydrogen peroxide water). An example of the organic chemical solution is IPA (isopropyl alcohol); an example of the rinse solution is pure water (deionized water: DIW (Deionized Water)). IPA is an example of an organic solvent with lower surface tension and higher volatility than water.

The acidic chemical solution may be an acidic chemical solution other than hydrofluoric acid such as sulfuric acid or hydrochloric acid. The alkaline chemical solution may be an alkaline chemical solution other than SC-1 such as TMAH (tetramethylammonium hydroxide). The organic chemical liquid may be an organic chemical liquid other than IPA such as HFE (hydrofluoroether). The rinsing liquid may be rinsing liquid other than pure water such as carbonated water, electrolytic ion water, hydrogen water, ozone water, and hydrochloric acid water with a diluted concentration (for example, about 10 to 100 ppm).

FIG. 4 is a block diagram showing the hardware of the control device 3.

The control device 3 is a computer including a computer body 31 and a peripheral device 34 connected to the computer body 31. The computer body 31 includes a CPU 32 (central processing unit) that executes various commands, and a main memory device 33 that stores information. The peripheral device 34 is an auxiliary memory device 35 including information such as a memory program P, a reading device 36 that reads information from a removable medium M, and a communication device 37 that communicates with other devices such as a host computer.

The control device 3 is connected to the input device 38, the display device 39, and the alarm device 40. The input device 38 is operated when an operator, such as a user or a maintenance person, inputs information into the substrate processing apparatus 1. The information is displayed on the screen of the display device 39. The input device 38 may be any of a keyboard, a pointing device, and a touchpad, and may also be a device other than these. A touch panel display that is also an input device 38 and a display device 39 may be provided in the substrate processing apparatus 1. The alarm device 40 issues an alarm using one or more of light, sound, text, and patterns. When the input device 38 is a touch panel display, the input device 38 may also serve as the alarm device 40.

The CPU 32 executes a program P stored in the auxiliary memory device 35. The program P in the auxiliary memory device 35 may be one installed in the control device 3 in advance, or may be transmitted from the removable medium M to the auxiliary memory device 35 through the reading device 36, or may be communicated by an external device such as a host computer through communication The device 37 transmits to the auxiliary memory device 35.

The auxiliary memory device 35 and the removable medium M are non-volatile memories that retain memory even when power is not supplied. The auxiliary memory device 35 is a magnetic memory device such as a hard disk. The removable medium M is, for example, an optical disc such as a compact disk or a semiconductor memory such as a memory card. The removable medium M is an example of a computer-readable recording medium on which the program P is recorded.

The auxiliary memory device 35 stores a plurality of recipes. The recipe is information specifying the processing content, processing conditions, and processing order of the substrate W. The plurality of recipes are different from each other in at least one of processing content, processing conditions, and processing order of the substrate W. The control device 3 controls the substrate processing device 1 to process the substrate W in accordance with a recipe designated by the host computer. Each step described later is performed by controlling the substrate processing apparatus 1 with the control apparatus 3. In other words, the control device 3 is programmed to perform the following steps.

Next, an example of the substrate W processing performed by the substrate processing apparatus 1 will be described.

FIG. 5 is a flowchart for explaining an example of the processing of the substrate W by the substrate processing apparatus 1. Hereinafter, FIG. 1, FIG. 3, and FIG. 5 are referred to.

When the substrate W is processed by the substrate processing apparatus 1, a carrying-in step of carrying the substrate W into the chamber 4 is performed.

Specifically, the central robot CR supports the substrate W by the hand H1 in a state where the protector 14 is located at the lower position, and causes the hand H1 to enter the chamber 4 (step S1 in FIG. 5). Thereafter, the central robot CR places the substrate W on the hand H1 on the rotating jig 8. After the central robot CR places the substrate W on the rotating jig 8, the hand H1 is retracted from the inside of the chamber 4.

Next, an acidic chemical solution supplying step of supplying hydrofluoric acid, which is an example of an acidic chemical solution, to the substrate W is performed.

Specifically, the guard raising / lowering unit 17 raises the guard 14 to an upper position, and makes the inner surface of the guard 14 horizontally face the outer peripheral surface of the substrate W. The rotation motor 12 starts to rotate in a state where the substrate W is held by the pin 9. Thereby, rotation of the substrate W is started (step S2 in FIG. 5). In this state, the acidic chemical liquid valve 20 is opened, and the acidic chemical liquid nozzle 18 starts to discharge hydrofluoric acid (step S3 in FIG. 5).

The hydrofluoric acid discharged from the acidic chemical liquid nozzle 18 flows onto the substrate W, and then flows outward along the upper surface of the rotating substrate W. As a result, a liquid film of hydrofluoric acid covering the entire surface of the substrate W is formed on the substrate W. After the predetermined time has elapsed after the acidic chemical liquid valve 20 is opened, the acidic chemical liquid valve 20 is closed to stop the hydrofluoric acid from being discharged from the acidic chemical liquid nozzle 18.

Next, a first rinse liquid supply step of supplying pure water, which is an example of the rinse liquid, to the substrate W is performed.

Specifically, the flushing liquid valve 29 is opened, and the flushing liquid nozzle 27 starts to spit. Pure water is produced (step S4 in FIG. 5). The pure water discharged from the rinse liquid nozzle 27 flows onto the substrate W and then flows outward along the upper surface of the rotating substrate W. Thereby, the hydrofluoric acid on the substrate W is replaced with pure water to form a liquid film covering the entire area of the upper surface of the substrate W. Thereafter, the flushing liquid valve 29 is closed, and the discharge of pure water from the flushing liquid nozzle 27 is stopped.

Next, an alkaline chemical solution supply step of supplying SC-1, which is an example of an alkaline chemical solution, to the substrate W is performed.

Specifically, the alkaline chemical liquid valve 23 is opened, and the alkaline chemical liquid nozzle 21 starts to discharge SC-1 (step S5 in FIG. 5). The SC-1 discharged from the alkaline chemical liquid nozzle 21 flows onto the substrate W and then flows outward along the upper surface of the rotating substrate W. Thereby, the pure water on the substrate W is replaced with SC-1, and a SC-1 liquid film covering the entire area on the substrate W is formed. Thereafter, the alkaline chemical liquid valve 23 is closed, and the discharge of SC-1 from the alkaline chemical liquid nozzle 21 is stopped.

Next, a second rinse liquid supply step of supplying pure water, which is an example of the rinse liquid, to the substrate W is performed.

Specifically, the flushing liquid valve 29 is opened, and the flushing liquid nozzle 27 starts to discharge pure water (step S6 in FIG. 5). The pure water discharged from the rinse liquid nozzle 27 flows onto the substrate W and then flows outward along the upper surface of the rotating substrate W. As a result, SC-1 on the substrate W is replaced with pure water, and a liquid film of pure water covering the entire surface of the substrate W is formed. Thereafter, the flushing liquid valve 29 is closed, and the discharge of pure water from the flushing liquid nozzle 27 is stopped.

Next, an organic chemical solution supplying step of supplying IPA, which is an example of an organic chemical solution, to the substrate W is performed.

Specifically, the organic chemical liquid valve 26 is opened, and the organic chemical liquid nozzle 24 is opened. The spitting of IPA is started (step S7 in FIG. 5). The IPA discharged from the organic chemical liquid nozzle 24 flows onto the substrate W and then flows outward along the upper surface of the rotating substrate W. Thereby, the pure water on the substrate W is replaced with IPA, and a liquid film of IPA covering the entire area on the substrate W is formed. Thereafter, the organic chemical liquid valve 26 is closed, and the discharge of IPA from the organic chemical liquid nozzle 24 is stopped.

Next, a drying step (rotary drying step) for drying the substrate W by rotating the substrate W is performed.

Specifically, the rotation motor 12 accelerates the substrate W in the direction of rotation, and the substrate W is dried at a higher drying speed (for example, thousands of rpm) than the rotation speed of the substrate W during the first chemical liquid supply step to the organic chemical liquid supply step. ) To rotate. Thereby, the liquid is removed from the substrate W, and the substrate W is dried (step S8 in FIG. 5). After a predetermined time has elapsed from the high-speed rotation of the substrate W, the rotation is stopped by the rotation motor 12. Thereby, the rotation of the substrate W is stopped (step S9 in FIG. 5).

Next, a carrying-out step of carrying out the substrate W from the chamber 4 is performed.

Specifically, the guard lifting unit 17 lowers the guard 14 to a lower position. In this state, the central robot CR causes the hand H1 to enter the chamber 4. After the plurality of clamp pins 9 release the grip on the substrate W, the central robot CR supports the substrate W on the rotary jig 8 by the hand H1. Thereafter, the central robot CR supports the substrate W by the hand H1 and retracts the hand H1 from the inside of the chamber 4. Thereby, the processed substrate W is carried out from the chamber 4 (step S10 in FIG. 5).

Next, the exhaust system of the substrate processing apparatus 1 will be described.

FIG. 6 is a schematic diagram for explaining an exhaust system of the substrate processing apparatus 1. The upstream and downstream in the following description means upstream and downstream of the flow direction Df of the exhaust gas in the exhaust passage 44.

The substrate processing apparatus 1 includes an exhaust pipe 41 that guides the exhaust gas generated in the substrate processing apparatus 1 to an exhaust processing equipment installed in a factory where the substrate processing apparatus 1 is installed. The exhaust pipe 41 forms an exhaust passage 44 extending from the plurality of processing units 2 toward an exhaust treatment facility. The exhaust pipe 41 includes a plurality of individual exhaust pipes 42 respectively corresponding to the plurality of processing units 2, and a plurality of collective exhaust pipes 43 respectively corresponding to the plurality of towers TW.

The plurality of individual exhaust pipes 42 are connected to the plurality of processing units 2 respectively. The collective exhaust pipe 43 is connected to all individual exhaust pipes 42 corresponding to one tower TW. In other words, all the individual exhaust pipes 42 connected to all the processing units 2 included in one tower TW are connected to one collective exhaust pipe 43.

Each of the collective exhaust pipes 43 is connected to an exhaust processing equipment that constantly sucks exhaust from the substrate processing apparatus 1. The substrate processing apparatus 1 includes: a plurality of pressure gauges 45 for measuring a pressure (negative pressure) applied to the exhaust passage 44; a plurality of flow meters 46 for measuring a flow rate of exhaust gas flowing through the exhaust passage 44; A plurality of exhaust dampers 47 are provided in the flow path cross-sectional area of the exhaust passage 44 (the area of a cross section orthogonal to the exhaust flow direction Df). The exhaust damper 47 may be a manual damper or an automatic damper. When the exhaust damper 47 is an automatic damper, the exhaust damper 47 includes a valve such as a butterfly valve, and a brake that changes the opening degree of the valve.

The plurality of pressure gauges 45 respectively correspond to the plurality of individual exhaust pipes 42. Similarly, each of the plurality of flow meters 46 corresponds to each of the individual exhaust pipes 42, and each of the plurality of exhaust dampers 47 corresponds to each of the individual exhaust pipes 42. That is, the pressure gauge 45, the flow meter 46, and the exhaust damper 47 are provided for each individual exhaust pipe 42, and are connected to the corresponding individual exhaust pipe 42.

FIG. 6 shows the operation of the pressure gauge 45, the flow meter 46, and the exhaust damper 47. On the upstream side, an example in which the pressure gauge 45, the flow meter 46, and the exhaust damper 47 are arranged in the exhaust gas flow direction Df in this order. The pressure gauge 45 is arranged upstream of the flow meter 46, and the flow meter 46 is arranged upstream of the exhaust damper 47. The order of the pressure gauge 45, the flow meter 46, and the exhaust damper 47 is not limited to this.

The pressure gauge 45, the flow meter 46 and the exhaust damper 47 are arranged in the space under the floor which belongs to the space under the floor F of the clean room. Therefore, a part of the individual exhaust pipe 42 is arranged in the underfloor space of the clean room. The downstream end of the individual exhaust pipe 42 is tied to the underfloor space of the clean room and is connected to the collecting exhaust pipe 43. The collecting exhaust pipe 43 is arranged in the underfloor space of the clean room.

Next, a flow meter 46 for measuring the flow rate of exhaust gas will be described.

In the following description, any of the full-pressure measuring tube 55t and the static-pressure measuring tube 55s may be referred to as a pitot tube 55, and any of the full-pressure measurement hole 56t and the static-pressure measurement hole 56s may be referred to as Assay hole 56.

FIG. 7 is a cross-sectional view showing a cross section of the flow meter 46 taken along a plane including the center line L1 of the casing 51. FIG. 8 is a view of the flow meter 46 viewed from a direction of an arrow VIII shown in FIG. 7. FIG. 9 is a cross-sectional view showing a cross section of the flow meter 46 taken along the line IX-IX shown in FIG. 7. Fig. 10 is a sectional view showing a section of the pitot tube 55 along the line X-X shown in Fig. 9.

The flow meter 46 is a pitot tube type flow meter. As shown in FIG. 7, the flow meter 46 includes: a casing 51 forming a part of the exhaust passage 44; two pitot tubes 55 that measure the total pressure and static pressure of the exhaust gas flowing downstream in the casing 51; Two measuring pipes 57 connected to two pitot tubes 55; and a rectifying member 59 for rectifying the exhaust gas flowing downstream in the casing 51 upstream of the two pitot tubes 55. Two pitot tubes 55 series It is connected to the differential pressure gauge 58 via two measurement pipes 57.

The housing 51 includes: a main pipe 53 forming a part of the exhaust passage 44; a ring-shaped upstream flange 52 extending from the upstream end of the main pipe 53 toward the radially outer side of the main pipe 53; and the downstream end of the main pipe 53 toward the main pipe 53 The annular downstream flange 54 extends radially outward. The inner peripheral surface of the main pipe 53 corresponds to the inner peripheral surface 51 i of the casing 51 forming a part of the exhaust passage 44. As shown in FIG. 9, the inner peripheral surface of the main pipe 53 has a circular cross section. The cross section of the inner peripheral surface of the main pipe 53 may be a shape other than a circle such as a quadrangle.

As shown in FIG. 7, the casing 51 is disposed on the exhaust passage 44 in a horizontal posture in accordance with the center line L1 of the casing 51 (the center line of the main pipe 53). The casing 51 is arranged between the first pipe 42 a and the second pipe 42 b of the individual exhaust pipe 42. The first pipe 42a is disposed upstream of the casing 51, and the second pipe 42b is disposed downstream of the casing 51. The case 51 is connected to the first pipe 42a and the second pipe 42b via a seal. As shown in FIG. 8, the bolts that fix the upstream flange 52 of the casing 51 to the first pipe 42 a are inserted into a plurality of through holes h1 penetrating the upstream flange 52 in the flow direction Df. Similarly, the bolts fixing the downstream flange 54 of the case 51 to the second pipe 42b are inserted into a plurality of through holes penetrating the downstream flange 54 in the flow direction Df.

As shown in FIG. 7, the two pitot tubes 55 include: a full-pressure measuring tube 55t that measures the total pressure of the exhaust gas flowing downstream in the casing 51; Static pressure measurement tube for 55s. The full pressure measuring tube 55t and the static pressure measuring tube 55s are inserted into the main pipe 53. The full-pressure measuring tube 55t and the static-pressure measuring tube 55s are attached to the case 51. The full pressure measuring tube 55t is arranged upstream of the static pressure measuring tube 55s.

The full pressure measuring tube 55t and the static pressure measuring tube 55s extend in the radial direction of the main pipe 53. FIG. 7 shows an example in which the center lines L2 of the full-pressure measuring tube 55t and the static-pressure measuring tube 55s are vertical. The full-pressure measuring tube 55t and the static-pressure measuring tube 55s pass through the main pipe 53 in the radial direction of the main pipe 53. Both ends of the full pressure measuring tube 55t and the static pressure measuring tube 55s are provided by the main The outer peripheral surface of the pipe 53 projects radially outward of the main pipe 53. The two measurement pipes 57 are connected to the outside of the casing 51 and connected to a full-pressure measurement pipe 55t and a static-pressure measurement pipe 55s.

As shown in FIG. 8, the full-pressure measuring tube 55t and the static-pressure measuring tube 55s are arranged on the diameter of the inner peripheral surface of the main pipe 53, that is, on both ends of the line segment on the inner peripheral surface of the main pipe 53. The full pressure measuring tube 55t and the static pressure measuring tube 55s are two tubes having the same shape, size and material. When the casing 51 is viewed from the upstream side of the casing 51 toward the center line L1 of the casing 51 (a direction parallel to the flow direction Df), the full-pressure measurement tube 55t overlaps the entire static-pressure measurement tube 55s and cannot be seen at all. To any part of the static pressure measuring tube 55s. The full pressure measuring tube 55t and the static pressure measuring tube 55s are superimposed on the center line L1 of the casing 51.

As shown in FIG. 9, the full-pressure measurement tube 55t includes a plurality of full-pressure measurement holes 56t arranged in the axial direction of the full-pressure measurement tube 55t. FIG. 9 shows an example in which six full-pressure measurement holes 56t are provided in the full-pressure measurement tube 55t. The axial direction of the full-pressure measuring tube 55t corresponds to the radial direction of the main pipe 53. The plurality of full-pressure measurement holes 56t constitute a plurality of pairs. The two full-pressure measurement holes 56t in pairs are arranged at positions that are 180 degrees rotationally symmetric with respect to the center line L1 of the housing 51. The distance between the plurality of full-pressure measurement holes 56t from P1, that is, the interval between two adjacent full-pressure measurement holes 56t, decreases as it moves away from the center line L1 of the casing 51.

FIG. 10 shows an example in which the cross-sections of the full-pressure measuring tube 55t and the static-pressure measuring tube 55s are rhombic, which are cut in a plane orthogonal to the axial direction of the full-pressure measuring tube 55t and the static-pressure measuring tube 55s. The shorter diagonal line Ld in the cross section of the full pressure measuring tube 55t extends toward the flow direction Df, and the shorter diagonal line Ld in the cross section of the static pressure measuring tube 55s extends toward the flow direction Df. The cross-sections of the full-pressure measuring tube 55t and the static-pressure measuring tube 55s may be shapes other than a diamond shape such as a circle, or may be different from each other.

As shown in FIG. 10, the full-pressure measuring hole 56t is connected to the full-pressure measuring tube 55t. The outer peripheral surface 55o and the inner peripheral surface 55i are open and penetrate the full-pressure measurement tube 55t. The full-pressure measurement hole 56t faces upstream. The static pressure measurement tube 55s includes a plurality of (for example, the same number as the plurality of full pressure measurement holes 56t) static pressure measurement holes 56s. The static pressure measurement hole 56s is opened at the outer peripheral surface 55o and the inner peripheral surface 55i of the static pressure measurement tube 55s, and penetrates the static pressure measurement tube 55s. The static pressure measurement hole 56s faces downstream.

As shown in FIG. 7, a plurality of static pressure measurement holes 56 s are arranged in the axial direction of the static pressure measurement tube 55 s that is radially aligned with the main pipe 53. A plurality of pairs of static pressure measuring holes 56s are formed. The two pairs of static pressure measuring holes 56s are arranged at a position that is 180 degrees rotationally symmetric with the center line L1 of the casing 51. Similar to the plurality of full-pressure measurement holes 56t, the distance between the plurality of static pressure measurement holes 56s, that is, the interval between two adjacent static-pressure measurement holes 56s, decreases as the distance from the center line L1 of the housing 51 decreases.

As shown in FIG. 7, the rectifying member 59 is disposed upstream of the full-pressure measurement tube 55t and the static-pressure measurement tube 55s. The rectifying member 59 is attached to the case 51. The rectifying member 59 is surrounded by the inner peripheral surface 51 i of the case 51. As shown in FIG. 8, when the casing 51 is viewed from the upstream side of the casing 51 toward the center line L1 of the casing 51, the rectifying member 59 divides the space surrounded by the inner peripheral surface 51 i of the casing 51 into a plurality of region.

FIG. 8 shows an example in which two rectifying plates 59 a intersecting the center line L1 of the housing 51 are provided on the rectifying member 59. When the casing 51 is viewed from the upstream side of the casing 51 toward the center line L1 of the casing 51, the rectifying plate 59 a extends in the radial direction of the main pipe 53. In addition to or in place of the rectifying plate 59 a, the rectifying member 59 may be provided with a rectifying ring that surrounds the center line L1 of the housing 51. The rectifying member 59 may be a grid or a net.

As shown in FIG. 7, the exhaust gas flows into the casing 51 through an inlet 46 i provided at the upstream end of the casing 51. The exhaust gas that has flowed into the casing 51 passes through the rectifying member 59. With this, The exhaust air flow is rectified. The exhaust gas that has passed through the rectifying member 59 passes through the full-pressure measurement tube 55t and the static-pressure measurement tube 55s. Thereafter, the exhaust gas is discharged from the casing 51 downstream through an outlet 46o provided at the downstream end of the casing 51.

The total pressure of the exhaust gas flowing downstream in the casing 51 is a plurality of full-pressure measurement holes 56t applied to the full-pressure measurement tube 55t. The total pressure of the exhaust gas is transmitted to the differential pressure gauge 58 via a measurement pipe 57 connected to the full-pressure measurement pipe 55t. Similarly, the static pressure of the exhaust gas flowing downstream in the casing 51 is a plurality of static pressure measurement holes 56s applied to the static pressure measurement tube 55s. The static pressure of the exhaust gas is transmitted to the differential pressure gauge 58 via a measurement pipe 57 connected to the static pressure measurement pipe 55s.

The differential pressure gauge 58 calculates the dynamic pressure of the exhaust gas based on the pressure of the exhaust gas transmitted from the full pressure measurement tube 55t and the static pressure measurement tube 55s via the two measurement pipes 57. The dynamic pressure of the exhaust gas calculated by the differential pressure gauge 58 is input to the control device 3. The control device 3 calculates the flow rate of the exhaust gas based on the dynamic pressure of the exhaust gas input from the differential pressure gauge 58 and the cross-sectional area of the flow path of the casing 51. The exhaust gas flow can also be calculated by the differential pressure gauge 58.

The control device 3 constantly monitors whether the exhaust flow rate calculated by the control device 3 or the exhaust flow rate input by the differential pressure gauge 58 is maintained within an appropriate range. When the exhaust flow rate is outside the appropriate range, the control device 3 alerts the alarm device 40 (see FIG. 4), and transmits an abnormality in the exhaust flow rate to the user of the substrate processing apparatus 1. Thereby, an abnormality in the exhaust flow rate can be detected immediately.

In this way, the exhaust gas flows downstream in the casing 51 while contacting the inner peripheral surface 51i of the casing 51, the surface of the rectifying member 59, and the surface of the pitot tube 55. The surface of the pitot tube 55 includes an outer peripheral surface 55o and an inner peripheral surface 55i of the pitot tube 55, and an inner peripheral surface of the measurement hole 56. The inner peripheral surface 51i and the like of the case 51 are formed of a resin having resistance to a medicine supplied to the substrate W. That is, the inner peripheral surface 51i of the casing 51 The grade is formed of a resin that does not corrode or deform even when exposed to a drug.

FIG. 7 shows an example in which the entire main pipe 53, the entire pitot tube 55, and the entire rectifying member 59 are formed of a resin having a chemical resistance (for example, polyvinyl chloride). The main pipe 53 may be formed of a transparent resin or may be formed of a non-transparent resin. If the main pipe 53 is transparent, the casing 51 can be viewed from outside the casing 51. Therefore, the housing 51 can be viewed without removing the housing 51 from the individual exhaust pipe 42.

Next, a cleaning system for washing and drying the flow meter 46 will be described.

As shown in FIG. 7, the flow meter 46 includes a cleaning liquid pipe 62 that guides the cleaning liquid supplied to the full pressure measuring pipe 55t and the static pressure measuring pipe 55s, and a cleaning liquid valve that opens and closes the cleaning liquid pipe 62. 63; and two normally open valves 61 that open and close two measurement pipes 57. The flow meter 46 further includes a suction pipe 64 that sucks the fluid in the full-pressure measurement pipe 55t and the static pressure measurement pipe 55s through the two measurement pipes 57; and a suction valve 65 that opens and closes the suction pipe 64. The suction pipe 64 may be connected to a suction device 66 such as an air extractor, or may be connected to a suction facility provided in a factory where the substrate processing apparatus 1 is installed.

The downstream end of the washing liquid pipe 62 is connected to each of the two measuring pipes 57. The upstream end of the suction pipe 64 is connected to each of the two measurement pipes 57. The normally open valve 61 is interposed on the measurement pipe 57 at a position closer to the differential pressure gauge 58 side than the connection position between the cleaning liquid pipe 62 and the measurement pipe 57. The normally open valve 61 is closed only when the flow meter 46 is cleaned and dried. The normally open valve 61 is an air valve that is opened and closed by, for example, an air brake. The cleaning liquid guided by the cleaning liquid pipe 62 is, for example, pure water. The cleaning liquid may be a liquid other than pure water. For example, any of the specific examples of the above-mentioned washing liquid may be used as the washing liquid.

FIG. 11A is a cross-sectional view showing a state in which the pitot tube 55 is cleaned. FIG. 11B is a sectional view showing a state where the pitot tube 55 is dried.

As shown in FIG. 11A, when the full-pressure measuring tube 55t and the static pressure measuring tube 55s are cleaned, the control device 3 opens the cleaning liquid valve 63. Thereby, pure water as an example of the washing liquid is supplied from the washing liquid pipe 62 to the full pressure measuring pipe 55t and the static pressure measuring pipe 55s via the two measuring pipes 57. The pure water in the full-pressure measurement tube 55t is discharged out of the full-pressure measurement tube 55t from the plurality of full-pressure measurement holes 56t. Similarly, pure water in the static pressure measuring tube 55s is discharged out of the static pressure measuring tube 55s through a plurality of static pressure measuring holes 56s. Thereby, pure water is supplied to the full-pressure measurement hole 56t and the static-pressure measurement hole 56s, and foreign matter adhering to the full-pressure measurement hole 56t and the static-pressure measurement hole 56s is washed away.

After a predetermined time has elapsed after the cleaning liquid valve 63 is opened, the control device 3 closes the cleaning liquid valve 63. Thereby, the supply of pure water to the full-pressure measuring tube 55t and the static-pressure measuring tube 55s is stopped. After that, the control device 3 opens the suction valve 65. Thereby, as shown in FIG. 11B, the flow system in the full-pressure measurement tube 55 t and the static pressure measurement tube 55 s is sucked to the suction pipe 64 through the two measurement pipes 57. Even if a foreign substance or a washing solution remains in the pitot tube 55, these are still sucked to the suction pipe 64 via the two measurement pipes 57. Thereby, the full pressure measuring tube 55t and the static pressure measuring tube 55s are dried.

The cleaning of the flow meter 46 may be performed every time one substrate W is processed, or each time a plurality of substrates W are processed, it may also be performed every fixed time, or at any time. When multiple substrates W are processed and the flowmeter 46 is cleaned, the flowmeter 46 may be cleaned for each substrate W included in a batch, or each substrate W may be cleaned with a flow rate. Total 46.

As described above, in the present embodiment, the exhaust of the medicine containing the processing substrate W flows downstream in the casing 51. The pitot tube 55 is disposed in the casing 51. to The total pressure (the sum of the static pressure and the dynamic pressure) and the static pressure of the exhaust gas flowing downstream in the casing 51 are detected by the pitot tube 55. The flow rate of the exhaust gas, that is, the amount of exhaust gas passing through the casing 51 per unit time, is calculated based on the dynamic pressure of the exhaust gas. Thereby, the flow rate of exhaust gas passing through the casing 51 can be measured.

The exhaust gas flowing downstream in the casing 51 is in contact with the outer peripheral surface 55o of the pitot tube 55 provided with the measurement hole 56. When the pitot tube 55 is exposed to the exhaust gas for a long time, foreign matter such as salt adheres to the measurement hole 56 of the pitot tube 55. The cleaning liquid guided by the cleaning liquid pipe 62 is supplied to the measurement hole 56 of the pitot tube 55. Thereby, the measurement hole 56 of the pitot tube 55 can be prevented from being clogged by foreign matter such as residue or crystals, and the exhaust gas flow rate can be measured with stable accuracy for a long period of time.

Furthermore, since the cleaning liquid is supplied to the pitot tube 55 or the case 51, when foreign matter adhering to these can be dissolved in the cleaning liquid, the foreign matter can be removed by dissolving the foreign matter in the cleaning liquid. For example, salts produced by contact between acidic medicines and basic medicines, or crystals precipitated from the medicinal solution due to the disappearance of water are soluble in water. Therefore, if the aqueous washing solution is supplied to the pitot tube 55, etc., Effectively removes salts or crystals. Therefore, foreign matter can be removed more reliably than when a cleaning gas is used instead of the cleaning liquid.

In this embodiment, the pressure (full pressure or static pressure) applied to the measurement hole 56 of the pitot tube 55 is transmitted to the differential pressure gauge 58 through the measurement pipe 57. The washing liquid guided by the washing liquid pipe 62 is supplied to the internal space of the pitot tube 55 through the measuring pipe 57. The cleaning solution in the pitot tube 55 is discharged out of the pitot tube 55 through the measurement hole 56. If a foreign substance adheres to the measurement hole 56, the foreign substance is washed away by the washing liquid discharged from the measurement hole 56. Thereby, the measurement hole 56 of the pitot tube 55 can be prevented from being clogged by foreign matter, and the exhaust gas flow rate can be measured with stable accuracy for a long period of time.

In addition, since the internal space of the pitot tube 55 is measured via the measuring pipe 57 Since the cleaning liquid is supplied, the fluid nozzle 73 (see FIG. 13) that discharges the cleaning liquid may not be disposed in the housing 51. If the fluid nozzle 73 is arranged in the casing 51, the fluid nozzle 73 will affect the exhaust gas flow, although it is only slightly. Accordingly, the pitot tube 55 can be cleaned without affecting the exhaust gas flow. Moreover, since the fluid nozzle 73 may not be provided, the number of parts can be reduced.

In this embodiment, after the pitot tube 55 is washed with a washing liquid, the flow system in the pitot tube 55 is sucked to the suction pipe 64 through the measurement pipe 57 connected to the pitot tube 55. Even if a foreign substance or a washing liquid remains in the pitot tube 55, these are attracted to the suction pipe 64 via the measurement pipe 57. In addition, since the air current flowing into the pitot tube 55 from the outside of the pitot tube 55 through the measurement hole 56 is formed, the drying of the cleaning liquid adhering to the measurement hole 56 is promoted. Therefore, compared with the case where the pitot tube 55 is dried by the exhaust gas flow, the pitot tube 55 can be dried in a shorter time.

In the present embodiment, a medicine for processing the substrate W is supplied to the substrate W. Thereby, the substrate W is processed. The exhaust gas containing the medicine is discharged through the exhaust passage 44. The flow meter 46 is disposed in the exhaust passage 44. Thereby, the flow rate of the exhaust gas flowing through the exhaust passage 44 can be measured. Furthermore, since the pitot tube 55 of the flow meter 46 is washed by the washing liquid, foreign matter can be prevented from clogging the measurement hole 56 of the pitot tube 55, and the exhaust flow rate can be measured with stable accuracy for a long period of time. In addition, compared with other types of flow meters such as orifice flow meters, the pressure loss of the flow meter 46 is smaller, so energy consumption can be reduced.

In this embodiment, the flow meter 46 is arranged under the floor F of the clean room. It is generally considered that the operator cleans the inside of the casing 51 or the pitot tube 55 by using a nozzle or a brush held by the operator. However, when the flow meter 46 is disposed underground, the flow meter 46 cannot be cleaned so easily. This is due to the fact that the components arranged underground in the clean room are not easy to access. Therefore, a washing liquid pipe for supplying a washing liquid to the pitot tube 55 is provided. 62, the flowmeter 46 can be simply cleaned.

Also, as shown in FIG. 12, the flow meter 46 may also replace the suction pipe 64 or additionally include: a gas pipe 71 that guides a gas supplied to the full-pressure measurement pipe 55t and the static pressure measurement pipe 55s via two measurement pipes 57; And a gas valve 72 that opens and closes the gas pipe 71.

In the case of the configuration shown in FIG. 12, after the control device 3 cleans the full-pressure measuring tube 55t and the static pressure measuring tube 55s with a washing liquid, the gas valve 72 is opened, and a gas such as a clean gas or a dry gas is supplied to the full pressure. The measuring tube 55t and the static pressure measuring tube 55s. As a result, the airflow flowing from the pitot tube 55 to the outside of the pitot tube 55 through the measurement hole 56 is formed, and the drying of the cleaning liquid adhering to the measurement hole 56 is promoted. Therefore, compared with the case where the pitot tube 55 is dried by the exhaust gas flow, the pitot tube 55 can be dried in a shorter time.

As shown in FIG. 13, the flow meter 46 may include at least one fluid nozzle 73. FIG. 13 shows an example in which ten fluid nozzles 73a, 73b, 73c, 73d, and 73e are provided. The cleaning liquid pipe 62 and the gas pipe 71 are not connected to the pitot tube 55 but are connected to the respective fluid nozzles 73a, 73b, 73c, 73d, and 73e. The cleaning liquid pipe 62 and the gas pipe 71 may be connected to both the pitot tube 55 and the fluid nozzle 73. The flowmeter 46 may include a cleaning liquid nozzle connected to the cleaning liquid pipe 62 and a gas nozzle connected to the gas pipe 71 instead of the fluid nozzle 73.

The two fluid nozzles 73a are arranged outside the casing 51, and the remaining eight fluid nozzles 73b, 73c, 73d, and 73e are arranged in the casing 51. The six fluid nozzles 73b, 73c, and 73d are arranged upstream of the two pitot tubes 55, and the two fluid nozzles 73e are arranged downstream of the two pitot tubes 55. The two fluid nozzles 73d are arranged between the rectifying member 59 and the pitot tube 55.

The two fluid nozzles 73a are discharged and cleaned toward the upstream end of the rectifying member 59. Fluids such as liquids and gases. The two fluid nozzles 73 b discharge fluid toward the inner peripheral surface 51 i of the casing 51. The two fluid nozzles 73 c discharge fluid toward the side of the rectifying member 59. The two fluid nozzles 73d discharge fluid toward the outer peripheral surface of the full-pressure measuring tube 55t. The two fluid nozzles 73e discharge fluid toward the outer peripheral surface of the static pressure measuring tube 55s.

In the case of the configuration shown in FIG. 13, the control device 3 opens the cleaning liquid valve 63 and causes all the fluid nozzles 73 to discharge the cleaning liquid. Thereby, the cleaning liquid is supplied to the inner peripheral surface 51i of the case 51, the surface of the flow regulating member 59, and the outer peripheral surface of the pitot tube 55. The control device 3 closes the cleaning liquid valve 63 and then opens the gas valve 72 so that all the fluid nozzles 73 emit gas. Thereby, the inner peripheral surface 51i of the case 51, the surface of the rectifying member 59, and the outer peripheral surface of the pitot tube 55 are dried.

In this way, the flow meter 46 is cleaned. If a foreign substance is attached to the measurement hole 56 of the pitot tube 55, the foreign substance is washed away by the washing liquid discharged from the fluid nozzle 73. Thereafter, the gas is expelled from all the fluid nozzles 73 to promote the drying of the cleaning solution attached to the measurement hole 56. Therefore, compared with the case where the pitot tube 55 is dried by the exhaust flow, the pitot tube 55 can be dried in a shorter time.

Also, as shown in FIG. 14, the pitot tube 55 can also be viewed in the direction of the center line L1 of the casing 51 when the center line L2 of the pitot tube 55 is inclined with respect to the horizontal plane or leans against the casing When the casing 51 is viewed from the center line L1 of the body 51, the center line L2 of the pitot tube 55 assumes a horizontal posture and is disposed in the casing 51. FIG. 14 shows an example of the former.

The black dots in FIG. 14 indicate foreign matters such as residues and crystals attached to the lower end of the inner peripheral surface 51i of the casing 51. When the center line L1 of the casing 51 is horizontal or inclined with respect to the horizontal plane, and the center line L2 of the pitot tube 55 is vertical, foreign matter such as residues or crystals is easily accumulated at the lower end of the pitot tube 55. Thus, by making The pitot tube 55 is inclined with respect to the vertical plane or orthogonal to the vertical plane, which can reduce such foreign matter adhesion.

[Second Embodiment]

FIG. 15 is a timing chart of the second embodiment of the present invention, showing the chronological characteristics of the rotation speed of the substrate W, the flow rate of the clean gas supplied from the FFU 6 into the chamber 4, and the flow rate of the exhaust gas discharged from the chamber 4. Variety. 6 and 15 are referred to below.

Compared with the first embodiment, the main difference of the second embodiment is that according to the measured value of the flow meter 46, the control device 3 changes the output setting value of the FFU6, that is, changes the clean gas blown from the FFU6 to the chamber 4. Flow setting value.

Specifically, when the substrate W is processed, the rotation speed of the substrate W is not fixed, but changes according to the processing content. FIG. 15 shows an example in which the rotation speed of the substrate W is increased from zero to the liquid processing speed, and then increased from the liquid processing speed to the drying speed. The liquid processing speed is the rotation speed of the substrate W when a processing liquid such as a chemical solution or a rinse solution is supplied to the substrate W, and the drying speed is the rotation speed of the substrate W when the substrate W is dried. When the drying of the substrate W is completed, the rotation speed of the substrate W is reduced from the drying speed to zero.

The flow rate of the clean gas flowing into the chamber 4 and the flow rate of the exhaust gas discharged from the chamber 4 are changed even if the FFU6 output setting value is not changed. This is due to a change in the state in the chamber 4. For example, if the rotation speed of the substrate W increases, the flow rate of the clean gas flowing into the chamber 4 and the flow rate of the exhaust gas discharged from the chamber 4 increase even if the output setting value of the FFU 6 is the same. As shown by the two-dot chain line in FIG. 15, when the rotation speed of the substrate W is the liquid processing speed, the flow rate of the exhaust gas is larger than that when the rotation speed of the substrate W is zero; row The flow rate of gas is larger than when the rotation speed of the substrate W is the liquid processing speed.

If the flow rate of the exhaust gas changes, the measured value of the flow meter 46 also changes. As shown in FIG. 15, the control device 3 changes the output setting value of the FFU 6 based on the measured value of the flow meter 46 to reduce the fluctuation range of the exhaust gas flow rate discharged from the chamber 4. For example, when the rotation speed of the substrate W is the liquid processing speed, the control device 3 reduces the output setting value of the FFU6 compared to when the rotation speed of the substrate W is zero; when the rotation speed of the substrate W is the drying speed, makes the output setting value of FFU6 When the rotation speed of the substrate W is a liquid processing speed, it is reduced.

If the output setting value of FFU6 is changed in this way, the speed of the downdraft can be stabilized, and the energy consumed by FFU6 can be reduced compared with the case where the output setting value of FFU6 is not changed. Furthermore, if the output setting value of FFU6 is changed in this way, the maximum flow rate of the clean gas required for the substrate processing apparatus 1 can be reduced, and the amount of clean gas used can be reduced.

In the second embodiment, in addition to the effects of the first embodiment, the following effects can be exhibited. Specifically, the FFU 6 which is an example of a blower blows gas into the substrate processing apparatus 1. Even if the output setting value of FFU6, that is, the setting value of FFU6 to the flow rate of the gas blown in the substrate processing apparatus 1 is the same, the flow velocity of the airflow in the substrate processing apparatus 1 may not be constant. This is due to a change in the state of the substrate processing apparatus 1. The control device 3 changes the flow rate of the gas blown from the FFU 6 into the substrate processing device 1 based on the measurement value of the flow meter 46. Therefore, the flow velocity of the gas in the substrate processing apparatus 1 can be maintained constant or changed intentionally.

Moreover, in the above description, the case where the output setting value of FFU6 is changed based on the measured value of the flow meter 46 is described. When the exhaust damper 47 (refer to FIG. 6) is an automatic damper, the output setting value of FFU6 may also be changed. Change or replace this action The opening degree of the exhaust damper 47 is changed. If the opening degree of the exhaust damper 47 is changed, the pressure loss caused by the exhaust damper 47 is changed, so the flow rate of the exhaust gas discharged from the chamber 4 through the individual exhaust pipe 42 is changed. By adjusting the exhaust gas flow rate, it is possible to reduce the load of the exhaust gas processing equipment installed in the factory where the substrate processing apparatus 1 is installed.

[Third Embodiment]

FIG. 16 is a flowchart of the third embodiment of the present invention, and shows a flow when the control device 3 determines whether to perform cleaning of the flow meter 46. 6 and FIG. 16.

Compared with the first embodiment, the main difference between the third embodiment is that the control device 3 determines the necessity of cleaning the flowmeter 46 based on the measured value of the flowmeter 46 and the measured value of the pressure gauge 45.

Specifically, the pressure applied to the exhaust passage 44 is measured with a pressure gauge 45. If the flow rate of the exhaust gas flowing in the exhaust passage 44 is fixed, the measurement value of the flow meter 46 is also almost fixed, and the measurement value of the pressure gauge 45 is also almost fixed. In other words, if the measurement hole 56 of the pitot tube 55 is not blocked and the flow meter 46 functions properly, the measurement value of the flow meter 46 and the measurement value of the pressure gauge 45 have a certain relationship. Therefore, if the relationship between the measured value of the flow meter 46 and the measured value of the pressure gauge 45 is out of balance, there is a possibility that foreign matter may adhere to the measuring hole 56 of the pitot tube 55.

As shown in FIG. 16, the control device 3 acquires the measurement value of the flow meter 46 and the measurement value of the pressure gauge 45 (step S11). Thereafter, the control device 3 determines whether the measured value of the flow meter 46 is within an appropriate range based on the relationship between the measured value of the flow meter 46 and the measured value of the pressure gauge 45 (step S12). The relationship between the measured value of the flow meter 46 and the measured value of the pressure gauge 45 is made based on the experimental value measured in advance, and is stored in the auxiliary memory device 35 (see FIG. 4) of the control device 3.

If the measured value of the flow meter 46 is within a proper range (Yes in step S12), the control device 3 will again obtain the measured value of the flow meter 46 and the measured value of the pressure gauge 45 (return to step S11). If the measurement value of the flow meter 46 is outside the appropriate range (No in step S12), the control device 3 determines that a foreign substance is attached to the measurement hole 56 of the pitot tube 55, and the cleaning system cleans the flow meter 46 (step S13). This makes it possible to detect the blockage of the measurement hole 56 in advance, and to measure the exhaust flow rate with stable accuracy for a long period of time.

[Other embodiments]

The present invention is not limited to the contents of the embodiment described above, and various changes can be made.

For example, when a liquid such as a cleaning liquid adhering to the pitot tube 55 is evaporated by the exhaust gas flow, the suction pipe 64 and the gas pipe 71 may be omitted.

The casing 51 may also be disposed in the exhaust passage 44 in an inclined posture in which the center line L1 of the casing 51 is not horizontal, but in an inclined posture in which the center line L1 of the casing 51 is inclined with respect to the horizontal plane. Alternatively, the casing 51 may be disposed in the exhaust passage 44 in a vertical posture in which the center line L1 of the casing 51 is vertical.

Instead of the entire main pipe 53 of the housing 51, only the inner peripheral surface of the main pipe 53 may be formed of a resin having chemical resistance. For example, the main pipe 53 may include an outer cylinder formed of a material other than a resin such as metal, and a resin layer applied to the entire inner peripheral surface of the outer cylinder.

Similarly, instead of the entire pitot tube 55, only the surface of the pitot tube 55 may be formed of a resin having chemical resistance. That is, if any part of the flow meter 46 that is in contact with the exhaust gas is formed of a resin having chemical resistance, the other parts may be formed of any material.

The flow meter 46 may not be provided for each processing unit 2 but may be provided for each Tower TW settings. That is, the flow meter 46 may be provided only in the collection exhaust pipe 43.

The flow meter 46 may also be arranged above the floor F of the clean room. For example, the flow meter 46 may be arranged inside the substrate processing apparatus 1.

The substrate processing apparatus 1 is not limited to an apparatus for processing a disc-shaped substrate W, and may be an apparatus for processing a polygonal substrate W.

The substrate processing apparatus 1 is not limited to a single-chip apparatus, and may be a batch-type apparatus that processes a plurality of substrates W in a batch.

It is also possible to combine two or more of the above-mentioned configurations. It is also possible to combine two or more of the above steps.

This application corresponds to Japanese Patent Application No. 2018-057253 filed with the Japan Patent Office on March 23, 2018, and all disclosures of this application are incorporated herein by reference.

Although the embodiments of the present invention have been described in detail, these are only specific examples used to clarify the technical content of the present invention, and the present invention should not be limited to these specific examples. The spirit and scope of the present invention are only Limited by the scope of the accompanying patent application.

Claims (18)

A pitot tube type flowmeter for a substrate processing device includes: a cylindrical casing for passing exhaust gas of a medicine containing a processing substrate; and a pitot tube including an outer periphery provided with a measurement hole connected to the exhaust gas. And is arranged in the casing; and a washing liquid pipe which guides the washing liquid supplied to the pitot tube. For example, the pitot tube type flowmeter for the substrate processing device of claim 1, wherein the pitot tube type flowmeter for the substrate processing device further includes a measurement pipe connected to the pitot tube; the cleaning liquid piping is passed through the measurement piping. Connected to the above pitot tube. For example, the pitot tube type flowmeter for the substrate processing device of claim 1, wherein the pitot tube type flowmeter for the substrate processing device further includes at least one fluid nozzle for supplying a fluid to the inside of the casing; the cleaning liquid piping system Connected to at least one fluid nozzle. The pitot tube type flowmeter for the substrate processing device of claim 3, wherein the at least one fluid nozzle includes a fluid nozzle which is arranged in the casing and discharges fluid toward the outer peripheral surface of the pitot tube. The pitot tube type flowmeter for a substrate processing device according to any one of claims 1 to 4, wherein the pitot tube type flowmeter for a substrate processing device further includes: a measuring pipe connected to the pitot tube; and a suction A pipe that sucks fluid in the pitot tube through the measurement pipe. The pitot tube type flowmeter for a substrate processing device according to any one of claims 1 to 4, wherein the pitot tube type flowmeter for a substrate processing device further includes: a measurement pipe connected to the pitot tube; and a gas Piping, which is piped through the above measurement The tube is connected to the pitot tube and guides a gas supplied to the pitot tube through the measurement pipe. The pitot tube type flowmeter for a substrate processing device according to any one of claims 1 to 4, wherein the pitot tube type flowmeter for a substrate processing device further includes a fluid nozzle disposed in the housing and facing the above. A fluid is discharged from the outer peripheral surface of the pitot tube; and a gas pipe connected to the fluid nozzle to guide the gas supplied to the fluid nozzle. A substrate processing apparatus comprising: a processing unit that supplies chemicals for processing a substrate to a substrate; an exhaust passage for passing exhaust gas containing the above-mentioned chemicals; and a substrate processing apparatus for any one of claims 1 to 7. A Pitot tube type flowmeter is disposed in the exhaust passage and measures the flow rate of exhaust containing the medicine. The substrate processing apparatus according to claim 8, wherein the pitot tube type flowmeter for the substrate processing apparatus is disposed under a floor of a clean room provided with the substrate processing apparatus. The substrate processing apparatus of claim 8, wherein the casing is disposed in the exhaust path in a horizontal posture in which the centerline of the casing is horizontal or in an inclined posture in which the centerline of the casing is inclined with respect to a horizontal plane; The pitot tube is viewed from the centerline of the casing when the centerline of the pitot tube is inclined with respect to the horizontal plane, or the casing is viewed from the centerline of the casing. At this time, the center line of the pitot tube is in a horizontal posture and is arranged in the casing. The substrate processing apparatus according to claim 8, further comprising: a gas flow rate changing unit that changes at least one of a gas supply flow rate and an exhaust flow rate, wherein The air supply flow rate indicates a flow rate of a gas supplied into the substrate processing apparatus, and the exhaust flow rate indicates a flow rate of a gas discharged from the substrate processing apparatus; and a control device based on a pitot tube type flow meter for the substrate processing apparatus. The measured value causes the gas flow rate changing unit to change at least one of the air supply flow rate and the exhaust flow rate. The substrate processing apparatus according to claim 8, further comprising: a pressure gauge that measures a pressure applied to the exhaust path; and a control device that is based on the measured value of the pitot tube type flow meter used for the substrate processing apparatus and The measurement value of the pressure gauge detects the blockage of the measurement hole of the pitot tube of the pitot tube type flowmeter used for the substrate processing device. A substrate processing method performed by a substrate processing apparatus provided with a pitot tube type flowmeter according to any one of claims 1 to 7, including: a substrate processing step that supplies chemicals for processing a substrate to the substrate; An exhaust flow rate measurement step for measuring a flow rate of exhaust gas containing the above-mentioned medicine by a pitot tube type flowmeter for the substrate processing device disposed on an exhaust passage for guiding the exhaust gas containing the above-mentioned medicine; The cleaning step is to supply the cleaning liquid guided by the cleaning liquid pipe of the pitot tube type flowmeter for the substrate processing device to the pitot tube type flowmeter for the substrate processing device after the exhaust gas flow measurement step. Pitot tube to wash the pitot tube. The substrate processing method according to claim 13, wherein the exhaust gas flow measurement step includes measuring by a pitot tube type flowmeter for the substrate processing device disposed under a floor of a clean room provided with the substrate processing device. A step containing the flow rate of the exhaust gas of the above medicine. The substrate processing method of claim 13, wherein the casing of the pitot tube type flowmeter used for the substrate processing device is in a horizontal posture in which the centerline of the casing is horizontal, or the centerline of the casing is relative to a horizontal plane The inclined position is arranged in the exhaust path, and the exhaust flow measurement step includes: the center line of the pitot tube is inclined relative to the horizontal plane when the casing is viewed in the direction of the center line of the casing A step of measuring the flow rate of the exhaust gas containing the medicine with the pitot tube type flowmeter for the substrate processing device disposed in the casing in an inclined posture; or by viewing the casing in the direction of the centerline of the casing The step of measuring the flow rate of the exhaust gas containing the medicine by a pitot tube type flow meter for the substrate processing device arranged in the casing in a horizontal posture with the center line of the pitot tube in a horizontal posture at the time of body. For example, the substrate processing method of claim 13 further includes a gas flow rate changing step that changes at least one of a gas supply flow rate and an exhaust flow rate based on the measured value of the pitot tube type flowmeter for the substrate processing device. The air flow rate indicates a flow rate of a gas supplied into the substrate processing apparatus, and the exhaust flow rate indicates a flow rate of a gas discharged from the substrate processing apparatus. The substrate processing method according to claim 13, further comprising a clogging detection step based on a measurement value of a pressure gauge for measuring a pressure applied to the exhaust path and a measurement value of a pitot tube type flow meter for the substrate processing device. To detect the blockage of the measurement hole of the pitot tube of the pitot tube type flowmeter used for the substrate processing device. The substrate processing method according to claim 13, further comprising a pitot tube drying step, which uses the suction and supply of fluid to form an airflow after the pitot tube washing step, thereby drying the pitot tube.