JP6985964B2 - Pitot tube type flowmeter for substrate processing equipment, substrate processing equipment, and substrate processing method - Google Patents

Description

The present invention relates to a substrate processing method executed by a pitot tube type flow meter for a substrate processing apparatus, a substrate processing apparatus including a pitot tube type flow meter, and a substrate processing apparatus including a pitot tube type flow meter.
The substrate to be processed includes, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for an optical magnetic disk, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, and an organic EL (electroluminescence). ) A substrate for FPD (Flat Panel Display) such as a display device is included.

In the manufacturing process of a semiconductor device, a liquid crystal display device, or the like, a substrate processing device for processing a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device is used.
Patent Document 1 discloses a single-wafer type substrate processing apparatus that processes substrates one by one. This substrate processing apparatus includes a plurality of processing units for processing a substrate, a plurality of gas-liquid separation boxes for separating liquid from exhaust gas discharged from the plurality of processing units, and a plurality of gas-liquid separation boxes connected to each of the plurality of gas-liquid separation boxes. It is equipped with an individual exhaust duct and a collective exhaust duct connected to each individual exhaust duct.

The substrate processing apparatus described in Patent Document 1 further includes a collective damper for adjusting the flow rate of the exhaust flowing in the collective exhaust duct, and a collective flow meter for detecting the flow rate of the exhaust flowing in the collective exhaust duct. In paragraph 1981 of Patent Document 1, the collective flow meter is, for example, a differential pressure flow meter, the first collective flow meter that detects the exhaust pressure upstream of the collective damper, and the first collective flow meter that detects the exhaust pressure downstream of the collective damper. 2 Collective flow meters and are described as including. In the same paragraph, it is stated that the collective flow meter is not limited to the differential pressure flow meter, but may be another type of flow meter such as a thermal mass flow meter, a vortex flow meter, and an ultrasonic flow meter. be.

Japanese Unexamined Patent Publication No. 2015-119042

The exhaust discharged from the substrate processing equipment may contain trace amounts of chemicals. For example, when multiple types of chemicals such as acidic chemicals, alkaline chemicals, and organic chemicals are sequentially supplied to the same substrate, the exhaust containing the acidic chemicals, the exhaust containing the alkaline chemicals, and the exhaust containing the organic chemicals are used. However, they pass through the exhaust duct in sequence. In this case, crystals such as salt are generated in the exhaust duct and gradually accumulated in the exhaust duct. Even if only one type of chemical solution is supplied to the same substrate, when the water contained in the chemical solution is lost, residues and crystals remain in the exhaust duct and gradually accumulate in the exhaust duct.

Patent Document 1 describes that a differential pressure flow meter, a thermal mass flow meter, a vortex flow meter, an ultrasonic flow meter, or the like is used as a collective flow meter, but what type of flow meter is the collective flow meter? Even so, if the processing of the substrate is continued, foreign substances such as residues and crystals adhere to the collective flow meter and gradually accumulate in the collective flow meter. If the amount of foreign matter attached is small, it has almost no effect on the measurement of the flow rate, but if the amount of foreign matter increases, it may affect the measurement accuracy of the flow rate.

Therefore, one of the objects of the present invention is to provide a Pitot tube type flow meter for a substrate processing apparatus, a substrate processing apparatus, and a substrate processing method capable of measuring the flow rate of exhaust with stable accuracy over a long period of time.

The invention according to claim 1 for achieving the above object includes a tubular casing through which an exhaust containing a chemical for treating a substrate passes, and an outer peripheral surface having a measurement hole in contact with the exhaust, which is arranged in the casing. The pitot tube is provided, a pitot tube for guiding the cleaning liquid to be supplied to the pitot tube, and at least one fluid nozzle for supplying a fluid to the inside of the casing, and the pitot tube is provided with the at least one fluid. that is connected to the nozzle, a Pitot tube type flowmeter for the substrate processing apparatus.
According to this configuration, the exhaust gas containing the chemicals that process the substrate flows downstream in the casing. The pitot tube is arranged in the casing. The total pressure (sum of static pressure and dynamic pressure) and static pressure of the exhaust gas flowing downstream in the casing are detected by the Pitot tube. The flow rate of the exhaust, that is, the amount of exhaust passing through the casing in a unit time, is calculated based on the dynamic pressure of the exhaust. This makes it possible to measure the flow rate of the exhaust gas passing through the casing.

The exhaust gas flowing downstream in the casing is in contact with the outer peripheral surface of the Pitot tube provided with the measurement hole. When the Pitot tube is exposed to the exhaust for a long time, foreign matter such as salt adheres to the measurement hole of the Pitot tube. The cleaning liquid guided by the cleaning liquid pipe is supplied to the measuring hole of the Pitot tube. As a result, it is possible to prevent the measurement hole of the Pitot tube from being clogged with foreign matter such as residue or crystals, and it is possible to measure the flow rate of the exhaust gas with stable accuracy over a long period of time.

Further, since the cleaning liquid is supplied to the Pitot tube and the casing, when the foreign matter adhering to these is dissolved in the cleaning liquid, the foreign matter can be removed while being dissolved in the cleaning liquid. For example, salts generated by contact between acidic chemicals and alkaline chemicals and crystals precipitated from the chemical solution due to the disappearance of water dissolve in water, so if a cleaning solution containing water is supplied to a pitot tube or the like, the salt or crystals will be effective. Can be removed. Therefore, foreign matter can be reliably removed as compared with the case where a cleaning gas is used instead of the cleaning liquid.
According to this configuration, in addition to the above-mentioned effect (hereinafter, referred to as “the former effect”), the following effects can be achieved. Specifically, the cleaning liquid is supplied to the fluid nozzle from the cleaning liquid pipe and discharged from the fluid nozzle. As a result, the cleaning liquid is supplied to the inside of the casing. Therefore, the inner surface of the casing can be cleaned with the cleaning liquid. Not only that, the members arranged inside the casing such as the Pitot tube can also be washed with the cleaning liquid. As a result, the flow rate of the exhaust gas can be measured with stable accuracy over a long period of time.

The chemical for treating the substrate may be a vapor of the chemical solution (gas of the chemical) or mist (microdroplets of the chemical), or may be a chemical solution (liquid of the chemical). Similarly, the chemical contained in the exhaust gas may be a vapor of the chemical (gas of the chemical) or a mist of the chemical (small droplets of the chemical).
The total pressure and static pressure of the exhaust gas may be measured by two Pitot tubes or by one Pitot tube. That is, the Pitot tube type flow meter for the substrate processing apparatus may be provided with two Pitot tubes (total pressure measuring tube and static pressure measuring tube) for measuring the total pressure and the static pressure of the exhaust, respectively, or the total pressure. It may be provided with one Pitot tube in which a measuring tube and a static pressure measuring tube are integrated.

Pitot tube type flowmeter for the substrate processing apparatus may further include a connected measured pipe to the Pitot tube. The cleaning liquid pipe may be connected to the Pitot tube via the measurement pipe.
According to this configuration, the pressure (total pressure or static pressure) applied to the measurement hole of the Pitot tube is transmitted to the differential pressure gauge via the measurement pipe. The cleaning liquid guided by the cleaning liquid pipe is supplied to the internal space of the Pitot tube via the measuring pipe. The cleaning liquid in the pitot tube is discharged to the outside of the pitot tube through the measuring hole. If foreign matter adheres to the measuring hole, the foreign matter is washed away by the cleaning liquid discharged from the measuring hole. As a result, it is possible to prevent the measurement hole of the Pitot tube from being clogged with foreign matter, and it is possible to measure the flow rate of the exhaust gas with stable accuracy over a long period of time.

In addition, since the cleaning liquid is supplied to the internal space of the Pitot tube via the measuring pipe, it is not necessary to arrange the fluid nozzle for discharging the cleaning liquid in the casing. Placing the fluid nozzle inside the casing has a slight effect on the flow of the exhaust. Therefore, the Pitot tube can be cleaned without affecting the flow of exhaust gas. Further, since it is not necessary to provide a fluid nozzle, the number of parts can be reduced.

Invention according to claim 2, wherein said at least one fluid nozzle is disposed in the casing, comprising a fluid nozzle for discharging the fluid toward the outer peripheral surface of the Pitot tube, according to claim 1 It is a Pitot tube type flow meter for a substrate processing device.
According to this configuration, the cleaning liquid guided by the cleaning liquid pipe is supplied to the fluid nozzle arranged in the casing, and is discharged from the fluid nozzle toward the outer peripheral surface of the Pitot tube. As a result, the cleaning liquid is supplied to the measuring hole of the Pitot tube. If foreign matter adheres to the measurement hole, the foreign matter is washed away by the cleaning liquid discharged from the fluid nozzle. As a result, it is possible to prevent the measurement hole of the Pitot tube from being clogged with foreign matter, and it is possible to measure the flow rate of the exhaust gas with stable accuracy over a long period of time.

The invention according to claim 3 includes a tubular casing through which an exhaust containing a chemical for treating a substrate passes, an outer peripheral surface having a measurement hole in contact with the exhaust, and a Pitot tube arranged in the casing. wherein comprising a washing liquid pipe for guiding the cleaning liquid supplied to the Pitot tube, and connected to the measurement pipe in the Pitot tube, and a suction pipe for sucking the fluid in the pitot tube through said measurement pipe, substrate processing apparatus It is a Pitot tube type flow meter.
According to this configuration, in addition to the former effect, the following effects can be achieved. Specifically, after the Pitot tube is washed with the cleaning liquid, the fluid in the Pitot tube is sucked into the suction pipe via the measurement pipe connected to the Pitot tube. Even if foreign matter or cleaning liquid remains in the Pitot tube, it is sucked into the suction pipe via the measurement pipe. Further, since an air flow is formed from the outside of the Pitot tube into the Pitot tube through the measurement hole, the drying of the cleaning liquid adhering to the measurement hole is promoted. Therefore, the Pitot tube can be dried in a shorter time than when the Pitot tube is dried by the flow of exhaust gas.

The invention according to claim 4 includes a tubular casing through which an exhaust containing a chemical for treating a substrate passes, an outer peripheral surface having a measurement hole in contact with the exhaust, and a Pitot tube arranged in the casing. A cleaning liquid pipe that guides the cleaning liquid supplied to the pitot tube, a measuring pipe connected to the pitot tube, and the pitot tube connected to the pitot tube via the measuring pipe, and the pitot tube via the measuring pipe. It is a pitot tube type flow meter for a substrate processing apparatus , which is provided with a gas pipe for guiding the gas supplied to the substrate processing apparatus.
According to this configuration, in addition to the former effect, the following effects can be achieved. Specifically, after the Pitot tube is washed with the cleaning liquid, the gas guided by the gas pipe is supplied to the internal space of the Pitot tube via the measurement pipe. The gas in the pitot tube is discharged to the outside of the pitot tube through the measuring hole. As a result, an air flow is formed from the inside of the Pitot tube to the outside of the Pitot tube through the measurement hole, so that the drying of the cleaning liquid adhering to the measurement hole is promoted. Therefore, the Pitot tube can be dried in a shorter time than when the Pitot tube is dried by the flow of exhaust gas.

The invention according to claim 5 includes a tubular casing through which an exhaust containing a chemical for treating a substrate passes, an outer peripheral surface having a measurement hole in contact with the exhaust, and a Pitot tube arranged in the casing. A cleaning liquid pipe that guides the cleaning liquid supplied to the Pitot tube, a fluid nozzle that is arranged in the casing and discharges a fluid toward the outer peripheral surface of the Pitot tube, and is connected to the fluid nozzle. and a gas pipe for guiding the gas supplied to said fluid nozzle is a Pitot tube type flowmeter for the substrate processing apparatus.

According to this configuration, in addition to the former effect, the following effects can be achieved. Specifically, after the Pitot tube is washed with the cleaning liquid, the gas guided by the gas pipe is supplied to the fluid nozzle arranged in the casing and discharged from the fluid nozzle toward the outer peripheral surface of the Pitot tube. .. This promotes the drying of the cleaning liquid adhering to the measurement hole. Therefore, the Pitot tube can be dried in a shorter time than when the Pitot tube is dried by the flow of exhaust gas.

When the cleaning liquid pipe is connected to the fluid nozzle, the Pitot tube type flow meter for the substrate processing device may include a cleaning liquid nozzle to which the cleaning liquid pipe is connected and a gas nozzle to which the gas pipe is connected, or the cleaning liquid. Both the pipe and the gas pipe may be connected to one fluid nozzle.
The invention according to claim 6 is arranged in a processing unit for supplying a chemical for processing a substrate to a substrate, an exhaust passage through which an exhaust containing the chemical passes, and an exhaust passage containing the chemical. A substrate processing apparatus including a Pitot tube type flow meter for the substrate processing apparatus according to any one of claims 1 to 5 , which measures a flow rate.

According to this configuration, the chemicals for processing the substrate are supplied to the substrate. As a result, the substrate is processed. Exhaust containing chemicals is exhausted through the exhaust passage. The Pitot tube flow meter is located in the exhaust passage. This makes it possible to measure the flow rate of the exhaust gas flowing through the exhaust passage. Further, since the pitot tube of the pitot tube type flow meter is washed with the cleaning liquid, it is possible to prevent the measurement hole of the pitot tube from being clogged with foreign matter, and it is possible to measure the flow rate of the exhaust with stable accuracy for a long period of time. In addition, Pitot tube flowmeters have lower pressure loss than other types of flowmeters, such as orifice flowmeters, which can reduce energy consumption.

The invention according to claim 7 is the substrate processing apparatus according to claim 6 , wherein the pitot tube type flow meter for the substrate processing apparatus is arranged under the floor of a clean room in which the substrate processing apparatus is installed. be.
According to this configuration, the Pitot tube flow meter is placed under the floor of the clean room. It is conceivable that the operator uses a nozzle or brush held in his or her hand to clean the inside of the casing and the pitot tube. However, if the Pitot tube flow meter is located underground, the Pitot tube flow meter cannot be easily cleaned in this way. This is because it is not easy to access the members placed in the basement of the clean room. Therefore, the pitot tube type flow meter can be easily cleaned by providing the pitot tube with a cleaning liquid pipe for supplying the cleaning liquid.
The invention according to claim 8 is a gas flow rate that changes at least one of a supply air flow rate representing the flow rate of gas supplied into the substrate processing apparatus and an exhaust flow rate representing the flow rate of gas discharged from the substrate processing apparatus. The claim further comprises a changing unit and a control device for causing the gas flow rate changing unit to change at least one of the supply air flow rate and the exhaust flow rate based on the measured value of the Pitot tube type flow meter for the substrate processing device. 6 or 7 is the substrate processing apparatus.
The gas flow rate changing unit may be a blower that sends gas into the substrate processing device, or may be an exhaust damper that changes the cross-sectional area of the flow path of the exhaust passage, or both of them are provided. May be good. Even if the set value of the blower, that is, the set value of the flow rate of the gas sent by the blower into the substrate processing apparatus is the same, the flow velocity of the gas in the substrate processing apparatus is not always constant. This is because the state of the substrate processing apparatus changes. The control device changes the flow rate of the gas sent from the blower into the substrate processing device based on the measured value of the flow meter. Therefore, the flow velocity of the gas in the substrate processing apparatus can be kept constant or intentionally changed.

The invention according to claim 9 is arranged in a processing unit for supplying a chemical for processing a substrate to a substrate, an exhaust passage through which exhaust containing the chemical passes, and an exhaust including the chemical. A pitot tube type flow meter for a substrate processing device for measuring a flow rate is provided, and the pitot tube type flow meter for the substrate processing device has a tubular casing through which an exhaust containing the chemicals passes and a measurement in contact with the exhaust. A pitot tube arranged in the casing, including an outer peripheral surface having a hole, and a pitot tube for guiding the pitot tube supplied to the pitot tube are provided, and the casing has a horizontal center line of the casing. The pitot tube is arranged in the exhaust passage in a horizontal posture or an inclined posture in which the center line of the casing is inclined obliquely with respect to the horizontal plane, and the Pitot tube looks at the casing in the direction of the center line of the casing. Sometimes the centerline of the Pitot tube is tilted diagonally with respect to the horizontal plane, or when the casing is viewed in the direction of the centerline of the casing, the centerline of the Pitot tube is in a horizontal horizontal position. It is a substrate processing apparatus arranged in the casing.

According to this configuration, in addition to the former effect, the following effects can be achieved. Specifically, the center line of the casing extends horizontally or is inclined diagonally with respect to the horizontal plane. The pitot tube is usually arranged on the diameter of the inner peripheral surface of the casing, that is, a line segment that passes through the center line of the casing and has both ends arranged on the inner peripheral surface of the casing. When the casing is in the above-mentioned posture and the center line of the Pitot tube is vertical, foreign substances such as residues and crystals tend to collect at the lower end of the Pitot tube. Therefore, by tilting the Pitot tube diagonally with respect to the vertical plane or making it orthogonal to the vertical plane, it is possible to reduce the adhesion of such foreign matter.

The invention according to claim 10 is arranged in a processing unit for supplying a chemical for processing a substrate to a substrate, an exhaust passage through which exhaust containing the chemical passes, and an exhaust including the chemical. A pitot tube type flow meter for a substrate processing device that measures the flow rate, a pitot tube type flow meter for measuring the pressure applied to the exhaust passage, a measured value of the pitot tube type flow meter for the substrate processing device, and a measurement of the pressure gauge. The pitot tube type flow meter for the substrate processing apparatus includes the control device for detecting the clogging of the measurement hole of the pitot tube of the pitot tube type flow meter for the substrate processing apparatus based on the value, and the pitot tube type flow meter for the substrate processing apparatus contains the chemical. A tubular casing through which the included exhaust passes, a pitot tube arranged in the pitot tube including an outer peripheral surface having a measurement hole in contact with the exhaust, and a cleaning liquid pipe for guiding the cleaning liquid supplied to the pitot tube. It is a substrate processing apparatus provided with.
According to this configuration, in addition to the former effect, the following effects can be achieved. Specifically, the pressure applied to the exhaust passage is measured by a pressure gauge. If the flow velocity of the exhaust flowing in the exhaust passage is constant, the measured value of the Pitot tube type flow meter is also substantially constant, and the measured value of the pressure gauge is also substantially constant. In other words, if the measurement hole of the Pitot tube is not clogged and the Pitot tube type flow meter is functioning properly, the measured value of the Pitot tube type flow meter and the measured value of the pressure gauge have a certain relationship. Therefore, if the relationship between the measured value of the Pitot tube type flow meter and the measured value of the pressure gauge is broken, there is a possibility that foreign matter has adhered to the measurement hole of the Pitot tube. The control device detects this based on the measured value of the Pitot tube type flow meter and the measured value of the pressure gauge. As a result, clogging of the measuring hole can be detected in advance.

The invention according to claim 11 is a substrate processing method executed by a substrate processing apparatus including a Pitot tube type flow meter for the substrate processing apparatus according to any one of claims 1 to 5, wherein the substrate is used. The flow rate of the exhaust containing the chemical is measured by a pitot tube type flow meter for the substrate processing apparatus arranged in a substrate processing step for supplying the chemical to be processed to the substrate and an exhaust passage for guiding the exhaust containing the chemical. After the exhaust flow rate measurement step and the pitot tube type flow meter for the substrate processing apparatus, the cleaning liquid guided by the cleaning liquid pipe of the pitot tube type flow meter for the substrate processing apparatus is transferred to the pitot tube of the pitot tube type flow meter for the substrate processing apparatus. A substrate processing method comprising a Pitot tube cleaning step of cleaning the Pitot tube by supplying. According to this configuration, the same effect as the above-mentioned effect can be obtained.

According to a twelfth aspect of the present invention, in the exhaust flow rate measuring step, the chemical is applied to a Pitot tube type flow meter for the substrate processing apparatus, which is arranged under the floor of a clean room in which the substrate processing apparatus is installed. The substrate processing method according to claim 11 , further comprising a step of measuring the flow rate of the included exhaust. According to this configuration, the same effect as the above-mentioned effect can be obtained.
The invention according to claim 13 is from a supply air flow rate representing a flow rate of gas supplied into the substrate processing apparatus and from the substrate processing apparatus based on a measured value of a Pitot tube type flow meter for the substrate processing apparatus. The substrate processing method according to claim 11, further comprising a gas flow rate changing step of changing at least one of the exhaust flow rates representing the flow rate of the discharged gas. According to this configuration, the same effect as the above-mentioned effect can be obtained.
The invention according to claim 14 is a substrate processing method executed by a substrate processing apparatus including a Pitot tube type flow meter for a substrate processing apparatus, wherein the Pitot tube type flowmeter for the substrate processing apparatus has a substrate. It includes a tubular casing through which exhaust containing chemicals to be processed passes, and an outer peripheral surface having a measurement hole in contact with the exhaust, and guides the Pitot tube arranged in the casing and the cleaning liquid supplied to the Pitot tube. The substrate processing method includes a cleaning liquid pipe, a substrate processing step for supplying a chemical for processing the substrate to the substrate, and a Pitot tube type flow meter arranged in an exhaust passage for guiding an exhaust containing the chemical. After the exhaust flow rate measuring step for measuring the flow rate of the exhaust containing the chemical and the pitot tube type flow meter, the cleaning liquid guided by the cleaning liquid pipe of the pitot tube type flow meter is supplied to the pitot tube of the pitot tube type flow meter. The pitot tube cleaning step for cleaning the pitot tube is included, and the pitot tube type flow meter casing for the substrate processing apparatus has a horizontal posture in which the center line of the pitot tube is horizontal, or the pitot tube of the casing. The center line is arranged in the exhaust passage in an inclined posture inclined with respect to the horizontal plane, and the exhaust flow rate measuring step is performed on the Pitot tube when the casing is viewed in the direction of the center line of the casing. A step of causing a Pitot tube type flow meter for the substrate processing apparatus arranged in the casing to measure the flow rate of the exhaust containing the chemical in an inclined posture in which the center line is tilted diagonally with respect to the horizontal plane. When the casing is viewed in the direction of the center line of the casing, the center line of the Pitot tube is in a horizontal horizontal posture, and the Pitot tube type flow meter for the substrate processing apparatus is arranged in the casing. It is a substrate processing method including a step of measuring the flow rate of an exhaust containing chemicals. According to this configuration, the same effect as the above-mentioned effect can be obtained.

The invention according to claim 15 is a substrate processing method executed by a substrate processing apparatus including a Pitot tube type flow meter for a substrate processing apparatus, wherein the Pitot tube type flowmeter for the substrate processing apparatus has a substrate. It includes a tubular casing through which exhaust containing chemicals to be processed passes, and an outer peripheral surface having a measurement hole in contact with the exhaust, and guides the Pitot tube arranged in the casing and the cleaning liquid supplied to the Pitot tube. The substrate processing method includes a cleaning liquid pipe, a substrate processing step for supplying a chemical for processing the substrate to the substrate, and a Pitot tube type flow meter arranged in an exhaust passage for guiding an exhaust containing the chemical. After the exhaust flow rate measuring step for measuring the flow rate of the exhaust containing the chemical and the pitot tube type flow meter, the cleaning liquid guided by the cleaning liquid pipe of the pitot tube type flow meter is supplied to the pitot tube of the pitot tube type flow meter. By doing so, based on the pitot tube cleaning step for cleaning the pitot tube , the measured value of the pitot tube for measuring the pressure applied to the exhaust passage, and the measured value of the pitot tube type flow meter for the substrate processing apparatus. It is a substrate processing method including a clogging detection step for detecting the clogging of the measurement hole of the Pitot tube of the Pitot tube type flow meter for the substrate processing apparatus. According to this configuration, the same effect as the above-mentioned effect can be obtained.

The invention according to claim 16 is a substrate processing method executed by a substrate processing apparatus including a pitot tube type flow meter for a substrate processing apparatus, wherein the pitot tube type flowmeter for the substrate processing apparatus has a substrate. It includes a tubular casing through which exhaust containing chemicals to be processed passes, and an outer peripheral surface having a measurement hole in contact with the exhaust, and guides the Pitot tube arranged in the casing and the cleaning liquid supplied to the Pitot tube. The substrate processing method includes a cleaning liquid pipe, a substrate processing step for supplying a chemical for processing the substrate to the substrate, and a Pitot tube type flow meter arranged in an exhaust passage for guiding an exhaust containing the chemical. After the exhaust flow rate measuring step for measuring the flow rate of the exhaust containing the chemical and the pitot tube type flow meter, the cleaning liquid guided by the cleaning liquid pipe of the pitot tube type flow meter is supplied to the pitot tube of the pitot tube type flow meter. A pitot tube cleaning step for cleaning the pitot tube, and a pitot tube drying step for drying the pitot tube by forming an air flow by at least one of suction and supply of fluid after the pitot tube cleaning step. It is a substrate processing method including and. According to this configuration, the same effect as the above-mentioned effect can be obtained.

It is a schematic diagram which looked at the substrate processing apparatus which concerns on 1st Embodiment of this invention from the top. It is a schematic diagram which looked at the substrate processing apparatus from the side. It is a schematic diagram which looked at the inside of the processing unit provided in the substrate processing apparatus horizontally. It is a block diagram which shows the hardware of a control device. It is a process drawing for demonstrating an example of substrate processing performed by a substrate processing apparatus. It is a schematic diagram for demonstrating the exhaust system of a substrate processing apparatus. It is sectional drawing which shows the cross section of the flow meter cut in the plane including the center line of a casing. It is a figure which looked at the flow meter in the direction of the arrow VIII shown in FIG. It is sectional drawing which shows the cross section of the flow meter along the IX-IX line shown in FIG. 7. It is sectional drawing which shows the cross section of the Pitot tube along the X-X ray shown in FIG. It is sectional drawing which shows the state which the Pitot tube is cleaning. It is sectional drawing which shows the state which the Pitot tube is dried. It is sectional drawing which shows the 1st modification of 1st Embodiment of this invention, and shows the sectional view of the flow meter cut by the plane including the center line of a casing. It is sectional drawing which shows the 2nd modification of 1st Embodiment of this invention, and shows the sectional view of the flow meter cut by the plane including the center line of a casing. It is sectional drawing which shows the 3rd modification of 1st Embodiment of this invention, and shows the sectional view of the flow meter cut in the plane orthogonal to the center line of a casing. It is a time chart which concerns on 2nd Embodiment of this invention, and shows the change with time of the rotation speed of a substrate, the flow rate of clean air supplied from FFU into a chamber, and the flow rate of exhaust gas discharged from a chamber. It is a flowchart which concerns on 3rd Embodiment of this invention, and shows the flow at the time of determining whether or not the control device performs cleaning of a flow meter.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic view of the substrate processing apparatus 1 according to the first embodiment of the present invention as viewed from above. FIG. 2 is a schematic view of the substrate processing apparatus 1 as viewed from the side.
As shown in FIG. 1, the substrate processing apparatus 1 is a single-wafer processing apparatus that processes disk-shaped substrates W such as semiconductor wafers one by one. The substrate processing apparatus 1 uses a load port LP holding a carrier C accommodating one or more substrates W constituting one lot, and a substrate W conveyed from the carrier C on the load port LP as a processing liquid or a processing gas. A plurality of processing units 2 that process with a processing fluid such as, a transfer robot that conveys the substrate W between the carrier C on the load port LP and the processing unit 2, and a control device 3 that controls the substrate processing device 1. I have.

The transfer robot includes an indexer robot IR that carries in and out the board W to the carrier C on the load port LP, and a center robot CR that carries in and out the board W to the plurality of processing units 2. The indexer robot IR conveys the substrate W between the load port LP and the center robot CR, and the center robot CR conveys the substrate W between the indexer robot IR and the processing unit 2. The center robot CR includes a hand H1 that supports the substrate W, and the indexer robot IR includes a hand H2 that supports the substrate W.

The plurality of processing units 2 form a plurality of tower TWs arranged around the center robot CR in a plan view. FIG. 1 shows an example in which four tower TWs are formed. As shown in FIG. 2, each tower TW includes a plurality (for example, three) processing units 2 stacked one above the other. Each tower TW is arranged above the floor F of the clean room where the substrate processing device 1 is installed.

FIG. 3 is a schematic view of the inside of the processing unit 2 provided in the substrate processing apparatus 1 as viewed horizontally.
The processing unit 2 has a box-shaped chamber 4 having an internal space, and a spin chuck 8 that rotates around a vertical rotation axis A1 passing through the central portion of the substrate W while holding one substrate W horizontally in the chamber 4. And a cylindrical processing cup 13 surrounding the spin chuck 8 around the rotation axis A1.

The chamber 4 includes a box-shaped partition wall 5 provided with a carry-in / carry-out port 5b through which the substrate W passes, and a shutter 7 for opening / closing the carry-in / carry-out port 5b. The FFU 6 (fan filter unit) of the processing unit 2 is arranged on the air outlet 5a provided in the upper part of the partition wall 5. The FFU 6 constantly supplies clean air (air filtered by a filter) into the chamber 4 from the air outlet 5a. The gas in the chamber 4 is discharged from the chamber 4 through the exhaust duct 41 connected to the bottom of the processing cup 13. As a result, a downflow of clean air is constantly formed in the chamber 4.

The spin chuck 8 is formed from a disk-shaped spin base 10 held in a horizontal posture, a plurality of chuck pins 9 holding the substrate W in a horizontal posture above the spin base 10, and a central portion of the spin base 10. It includes a spin shaft 11 extending downward and a spin motor 12 that rotates a spin base 10 and a plurality of chuck pins 9 by rotating the spin shaft 11. The spin chuck 8 is not limited to a holding type chuck in which a plurality of chuck pins 9 are brought into contact with the outer peripheral surface of the substrate W, but the back surface (lower surface) of the substrate W, which is a non-device forming surface, is attracted to the upper surface of the spin base 10. It may be a vacuum type chuck that holds the substrate W horizontally.

The processing cup 13 includes a guard 14 for receiving the liquid discharged outward from the substrate W, a cup 15 for receiving the liquid guided downward by the guard 14, and a cylindrical outer wall member 16 surrounding the guard 14 and the cup 15. including. The processing cup 13 may include a plurality of guards 14 and a plurality of cups 15.
The guard 14 includes a cylindrical tubular portion 14b surrounding the spin chuck 8 and an annular ceiling portion 14a extending diagonally upward from the upper end portion of the tubular portion 14b toward the rotation axis A1. The cup 15 is arranged below the tubular portion 14b. The cup 15 forms an annular liquid receiving groove that opens upward. The liquid received by the guard 14 is guided to the liquid receiving groove.

The processing unit 2 includes a guard elevating unit 17 that elevates and elevates the guard 14. The guard elevating unit 17 positions the guard 14 at an arbitrary position from the upper position (position shown in FIG. 3) to the lower position. The upper position is a position where the upper end 14u of the guard 14 is arranged above the holding position where the substrate W held by the spin chuck 8 is arranged. The lower position is a position where the upper end 14u of the guard 14 is arranged below the holding position. The upper end of the annular shape of the ceiling portion 14a corresponds to the upper end 14u of the guard 14. The upper end 14u of the guard 14 surrounds the substrate W and the spin base 10 in a plan view.

When the processing liquid is supplied to the substrate W while the spin chuck 8 is rotating the substrate W, the processing liquid supplied to the substrate W is shaken off around the substrate W. When the treatment liquid is supplied to the substrate W, the upper end 14u of the guard 14 is arranged above the substrate W. Therefore, the treatment liquid such as the chemical liquid and the rinsing liquid discharged around the substrate W is received by the guard 14 and guided to the cup 15.

The processing unit 2 includes a plurality of processing liquid nozzles that discharge the processing liquid toward the substrate W held by the spin chuck 8. The plurality of processing liquid nozzles are an acidic chemical liquid nozzle 18 that discharges an acidic chemical liquid toward the substrate W, an alkaline chemical liquid nozzle 21 that discharges an alkaline chemical liquid toward the substrate W, and an organic chemical liquid discharge toward the substrate W. The organic chemical liquid nozzle 24 is included, and the rinse liquid nozzle 27 that discharges the rinse liquid toward the substrate W is included.

The acidic chemical solution nozzle 18 may be a scan nozzle that can move horizontally in the chamber 4, or may be a fixed nozzle fixed to the partition wall 5 of the chamber 4. The same applies to the alkaline chemical solution nozzle 21, the organic chemical solution nozzle 24, and the rinse solution nozzle 27. For example, when the acidic chemical solution nozzle 18 is a scan nozzle, the processing unit 2 may be provided with a nozzle moving unit for moving the acidic chemical solution nozzle 18 in the chamber 4.

The processing unit 2 includes an acidic chemical liquid pipe 19 connected to the acidic chemical liquid nozzle 18 and an acidic chemical liquid valve 20 that opens and closes the inside of the acidic chemical liquid pipe 19. Similarly, the processing unit 2 includes an alkaline chemical liquid pipe 22 connected to the alkaline chemical liquid nozzle 21, an alkaline chemical liquid valve 23 that opens and closes the inside of the alkaline chemical liquid pipe 22, and an organic chemical liquid pipe 25 connected to the organic chemical liquid nozzle 24. Includes an organic chemical liquid valve 26 that opens and closes the inside of the organic chemical liquid pipe 25, a rinse liquid pipe 28 connected to the rinse liquid nozzle 27, and a rinse liquid valve 29 that opens and closes the inside of the rinse liquid pipe 28.

Although not shown, the acidic chemical solution valve 20 includes a valve body provided with an internal flow path through which a liquid flows and an annular valve seat surrounding the internal flow path, a valve body movable with respect to the valve seat, and a valve body. Includes an actuator that moves the valve body between a closed position where the valve contacts the valve seat and an open position where the valve body is away from the valve seat. The same applies to other valves. The actuator may be a pneumatic actuator or an electric actuator, or may be an actuator other than these. The control device 3 opens and closes the acidic chemical solution valve 20 by controlling the actuator.

When the acidic chemical solution valve 20 is opened, the acidic chemical solution from the acidic chemical solution supply source is discharged from the acidic chemical solution nozzle 18 toward the upper surface of the substrate W. Similarly, when any of the alkaline chemical solution valve 23, the organic chemical solution valve 26, and the rinse solution valve 29 is opened, any of the alkaline chemical solution, the organic chemical solution, and the rinse solution becomes the alkaline chemical solution nozzle 21, the organic chemical solution nozzle 24, And is discharged from any of the rinse liquid nozzles 27 toward the upper surface of the substrate W. As a result, the processing liquid is supplied to the upper surface of the substrate W.

An example of an acidic chemical solution is hydrofluoric acid (hydrofluoric acid), and an example of an alkaline chemical solution is SC-1 (ammonia hydrogen peroxide solution). An example of an organic chemical solution is IPA (isopropyl alcohol), and an example of a rinse solution is pure water (deionized water: DIW (Deionized Water)). IPA is an example of an organic solvent having a lower surface tension than water and a higher volatility than water.

The acidic chemical solution may be an acidic chemical solution other than hydrofluoric acid such as sulfuric acid or hydrochloric acid. The alkaline chemical solution may be an alkaline chemical solution other than SC-1 such as TMAH (trimethylphenylammonium hydroxide). The organic chemical solution may be an organic chemical solution other than IPA such as HFE (hydrofluoroether). The rinsing solution may be a rinsing solution other than pure water such as carbonated water, electrolytic ionized water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 to 100 ppm).

FIG. 4 is a block diagram showing the hardware of the control device 3.
The control device 3 is a computer including a computer main body 31 and a peripheral device 34 connected to the computer main body 31. The computer main body 31 includes a CPU 32 (central processing unit) that executes various instructions and a main storage device 33 that stores information. The peripheral device 34 includes an auxiliary storage device 35 for storing information such as the program P, a reading device 36 for reading information from the removable media M, and a communication device 37 for communicating with other devices such as a host computer.

The control device 3 is connected to the input device 38, the display device 39, and the alarm device 40. The input device 38 is operated when an operator such as a user or a maintenance person inputs information to the board processing device 1. The information is displayed on the screen of the display device 39. The input device 38 may be any of a keyboard, a pointing device, and a touch panel, or may be a device other than these. A touch panel display that also serves as an input device 38 and a display device 39 may be provided in the substrate processing device 1. The alarm device 40 issues an alarm using one or more of light, sound, letters, and graphics. When the input device 38 is a touch panel display, the input device 38 may also serve as an alarm device 40.

The CPU 32 executes the program P stored in the auxiliary storage device 35. The program P in the auxiliary storage device 35 may be pre-installed in the control device 3, or may be sent from the removable media M to the auxiliary storage device 35 through the reading device 36. It may be sent from an external device such as a host computer to the auxiliary storage device 35 through the communication device 37.

The auxiliary storage device 35 and the removable media M are non-volatile memories that retain storage even when power is not supplied. The auxiliary storage device 35 is, for example, a magnetic storage device such as a hard disk drive. The removable media M is, for example, an optical disk such as a compact disk or a semiconductor memory such as a memory card. The removable media M is an example of a computer-readable recording medium on which the program P is recorded.

The auxiliary storage device 35 stores a plurality of recipes. The recipe is information that defines the processing content, processing conditions, and processing procedure of the substrate W. The plurality of recipes differ from each other in at least one of the processing contents, processing conditions, and processing procedures of the substrate W. The control device 3 controls the board processing device 1 so that the board W is processed according to the recipe specified by the host computer. Each of the following steps is executed by the control device 3 controlling the substrate processing device 1. In other words, the control device 3 is programmed to perform each of the following steps.

Next, an example of the processing of the substrate W performed by the substrate processing apparatus 1 will be described.
FIG. 5 is a process diagram for explaining an example of the processing of the substrate W performed by the substrate processing apparatus 1. In the following, reference will be made to FIGS. 1, 3 and 5.
When the substrate W is processed by the substrate processing apparatus 1, a carry-in step of carrying the substrate W into the chamber 4 is performed.

Specifically, with the guard 14 located at the lower position, the center robot CR causes the hand H1 to enter the chamber 4 while supporting the substrate W with the hand H1 (step S1 in FIG. 5). After that, the center robot CR places the substrate W on the hand H1 on the spin chuck 8. After placing the substrate W on the spin chuck 8, the center robot CR retracts the hand H1 from the inside of the chamber 4.

Next, an acidic chemical solution supply step of supplying hydrofluoric acid, which is an example of the acidic chemical solution, to the substrate W is performed.
Specifically, the guard elevating unit 17 raises the guard 14 to an upper position so that the inner surface of the guard 14 horizontally faces the outer peripheral surface of the substrate W. The spin motor 12 starts rotating in a state where the substrate W is gripped by the chuck pin 9. As a result, the rotation of the substrate W is started (step S2 in FIG. 5). In this state, the acidic chemical solution valve 20 is opened, and the acidic chemical solution nozzle 18 starts discharging hydrofluoric acid (step S3 in FIG. 5).

The hydrofluoric acid discharged from the acidic chemical solution nozzle 18 lands on the upper surface of the substrate W and then flows outward along the upper surface of the rotating substrate W. As a result, a liquid film of hydrofluoric acid covering the entire upper surface of the substrate W is formed on the substrate W. When a predetermined time elapses after the acidic chemical solution valve 20 is opened, the acidic chemical solution valve 20 is closed and the discharge of hydrofluoric acid from the acidic chemical solution nozzle 18 is stopped.
Next, a first rinse liquid supply step of supplying pure water, which is an example of the rinse liquid, to the substrate W is performed.

Specifically, the rinsing liquid valve 29 is opened, and the rinsing liquid nozzle 27 starts discharging pure water (step S4 in FIG. 5). The pure water discharged from the rinse liquid nozzle 27 has landed on the upper surface of the substrate W and then flows outward along the upper surface of the rotating substrate W. As a result, hydrofluoric acid on the substrate W is replaced with pure water, and a liquid film of pure water covering the entire upper surface of the substrate W is formed. After that, the rinse liquid valve 29 is closed, and the discharge of pure water from the rinse liquid nozzle 27 is stopped.

Next, an alkaline chemical solution supply step of supplying SC-1 which is an example of the alkaline chemical solution to the substrate W is performed.
Specifically, the alkaline chemical solution valve 23 is opened, and the alkaline chemical solution nozzle 21 starts discharging SC-1 (step S5 in FIG. 5). The SC-1 discharged from the alkaline chemical solution nozzle 21 lands on the upper surface of the substrate W and then flows outward along the upper surface of the rotating substrate W. As a result, the pure water on the substrate W is replaced with SC-1, and a liquid film of SC-1 covering the entire upper surface of the substrate W is formed. After that, the alkaline chemical solution valve 23 is closed, and the discharge of SC-1 from the alkaline chemical solution nozzle 21 is stopped.

Next, a second rinsing liquid supply step of supplying pure water, which is an example of the rinsing liquid, to the substrate W is performed.
Specifically, the rinsing liquid valve 29 is opened, and the rinsing liquid nozzle 27 starts discharging pure water (step S6 in FIG. 5). The pure water discharged from the rinse liquid nozzle 27 has landed on the upper surface of the substrate W and then flows outward along the upper surface of the rotating substrate W. As a result, SC-1 on the substrate W is replaced with pure water, and a liquid film of pure water covering the entire upper surface of the substrate W is formed. After that, the rinse liquid valve 29 is closed, and the discharge of pure water from the rinse liquid nozzle 27 is stopped.

Next, an organic chemical solution supply step of supplying IPA, which is an example of the organic chemical solution, to the substrate W is performed.
Specifically, the organic chemical liquid valve 26 is opened, and the organic chemical liquid nozzle 24 starts discharging the IPA (step S7 in FIG. 5). The IPA discharged from the organic chemical solution nozzle 24 lands on the upper surface of the substrate W and then flows outward along the upper surface of the rotating substrate W. As a result, the pure water on the substrate W is replaced with IPA, and a liquid film of IPA covering the entire upper surface of the substrate W is formed. After that, the organic chemical liquid valve 26 is closed, and the discharge of IPA from the organic chemical liquid nozzle 24 is stopped.

Next, a drying step (spin drying step) of drying the substrate W by rotating the substrate W is performed.
Specifically, the spin motor 12 accelerates the substrate W in the rotational direction, and the substrate has a drying speed (for example, several thousand rpm) higher than the rotation speed of the substrate W in the period from the first chemical solution supply step to the organic chemical solution supply step. Rotate W. As a result, the liquid is removed from the substrate W, and the substrate W dries (step S8 in FIG. 5). When a predetermined time has elapsed from the start of high-speed rotation of the substrate W, the spin motor 12 stops rotating. As a result, the rotation of the substrate W is stopped (step S9 in FIG. 5).

Next, a carry-out step of carrying out the substrate W from the chamber 4 is performed.
Specifically, the guard elevating unit 17 lowers the guard 14 to a lower position. In this state, the center robot CR causes the hand H1 to enter the chamber 4. The center robot CR supports the substrate W on the spin chuck 8 with the hand H1 after the plurality of chuck pins 9 release the grip of the substrate W. After that, the center robot CR retracts the hand H1 from the inside of the chamber 4 while supporting the substrate W with the hand H1. As a result, the processed substrate W is carried out from the chamber 4 (step S10 in FIG. 5).

Next, the exhaust system of the substrate processing device 1 will be described.
FIG. 6 is a schematic diagram for explaining the exhaust system of the substrate processing device 1. In the following description, upstream and downstream mean upstream and downstream of the exhaust flow direction Df in the exhaust passage 44.
The substrate processing apparatus 1 includes an exhaust duct 41 that guides the exhaust generated in the substrate processing apparatus 1 to the exhaust processing equipment provided in the factory where the substrate processing apparatus 1 is installed. The exhaust duct 41 forms an exhaust passage 44 extending from the plurality of processing units 2 toward the exhaust treatment equipment. The exhaust duct 41 includes a plurality of individual exhaust ducts 42 corresponding to the plurality of processing units 2, and a plurality of collective exhaust ducts 43 corresponding to the plurality of tower TWs.

Each of the plurality of individual exhaust ducts 42 is connected to the plurality of processing units 2. The collective exhaust duct 43 is connected to all the individual exhaust ducts 42 corresponding to one tower TW. In other words, all the individual exhaust ducts 42 connected to all the processing units 2 included in one tower TW are connected to one collective exhaust duct 43.
Each collective exhaust duct 43 is connected to an exhaust treatment facility that constantly sucks the exhaust gas of the substrate treatment device 1. The substrate processing device 1 includes a plurality of pressure gauges 45 for measuring the pressure (negative pressure) applied to the exhaust passage 44, a plurality of flow meters 46 for measuring the flow rate of the exhaust flowing through the exhaust passage 44, and a flow path of the exhaust passage 44. It is provided with a plurality of exhaust dampers 47 for changing the cross-sectional area (the area of the cross section orthogonal to the flow direction Df of the exhaust). The exhaust damper 47 may be a manual damper or an auto damper. When the exhaust damper 47 is an auto damper, the exhaust damper 47 includes a valve such as a butterfly valve and an actuator for changing the opening degree of the valve.

Each of the plurality of pressure gauges 45 corresponds to a plurality of individual exhaust ducts 42. Similarly, the plurality of flowmeters 46 each correspond to a plurality of individual exhaust ducts 42, and the plurality of exhaust dampers 47 each correspond to a plurality of individual exhaust ducts 42. That is, the pressure gauge 45, the flow meter 46, and the exhaust damper 47 are provided for each individual exhaust duct 42, and are connected to the corresponding individual exhaust duct 42.

FIG. 6 shows an example in which the pressure gauge 45, the flow meter 46, and the exhaust damper 47 are arranged in the order of the pressure gauge 45, the flow meter 46, and the exhaust damper 47 in the flow direction Df of the exhaust from the upstream side. The pressure gauge 45 is arranged upstream of the flow meter 46, and the flow meter 46 is arranged upstream of the exhaust damper 47. The order of the pressure gauge 45, the flow meter 46, and the exhaust damper 47 is not limited to this.

The pressure gauge 45, the flow meter 46, and the exhaust damper 47 are arranged in the underfloor space, which is the space under the floor F of the clean room. Therefore, a part of the individual exhaust duct 42 is arranged in the underfloor space of the clean room. The downstream end of the individual exhaust duct 42 is connected to the collective exhaust duct 43 in the underfloor space of the clean room. The collective exhaust duct 43 is arranged in the underfloor space of the clean room.

Next, the flow meter 46 that measures the flow rate of the exhaust gas will be described.
In the following description, when either the total pressure measuring tube 55t or the static pressure measuring tube 55s may be used, the pitot tube 55 is referred to, and when either the total pressure measuring hole 56t or the static pressure measuring hole 56s may be used, the measuring hole 56 is referred to. That is.
FIG. 7 is a cross-sectional view showing a cross section of the flow meter 46 cut in a plane including the center line L1 of the casing 51. FIG. 8 is a view of the flow meter 46 in the direction of arrow VIII shown in FIG. FIG. 9 is a cross-sectional view showing a cross section of the flow meter 46 along the IX-IX line shown in FIG. 7. FIG. 10 is a cross-sectional view showing a cross section of the Pitot tube 55 along the XX line shown in FIG.

The flow meter 46 is a Pitot tube type flow meter. As shown in FIG. 7, the flow meter 46 includes a casing 51 forming a part of the exhaust passage 44, two Pitot tubes 55 for measuring the total pressure and static pressure of the exhaust flowing downstream in the casing 51, and two. It includes two measuring pipes 57 connected to each of the two Pitot tubes 55, and a rectifying member 59 that regulates the flow of exhaust flowing downstream in the casing 51 upstream of the two Pitot tubes 55. The two Pitot tubes 55 are connected to the differential pressure gauge 58 via two measuring pipes 57.

The casing 51 includes a main tube 53 forming a part of the exhaust passage 44, an annular upstream flange 52 extending radially outward from the upstream end of the main tube 53, and a main from the downstream end of the main tube 53. Includes an annular downstream flange 54 extending radially outward of the tube 53. The inner peripheral surface of the main tube 53 corresponds to the inner peripheral surface 51i of the casing 51 forming a part of the exhaust passage 44. As shown in FIG. 9, the inner peripheral surface of the main tube 53 has a circular cross section. The cross section of the inner peripheral surface of the main tube 53 may have a shape other than a circle such as a quadrangle.

As shown in FIG. 7, in the casing 51, the center line L1 (center line of the main tube 53) of the casing 51 is arranged on the exhaust passage 44 in a horizontal horizontal posture. The casing 51 is arranged between the first duct 42a and the second duct 42b of the individual exhaust duct 42. The first duct 42a is arranged upstream of the casing 51, and the second duct 42b is arranged downstream of the casing 51. The casing 51 is connected to the first duct 42a and the second duct 42b via a seal. As shown in FIG. 8, the bolt for fixing the upstream flange 52 of the casing 51 to the first duct 42a is inserted into a plurality of through holes h1 penetrating the upstream flange 52 in the flow direction Df. Similarly, the bolt for fixing the downstream flange 54 of the casing 51 to the second duct 42b is inserted into a plurality of through holes penetrating the downstream flange 54 in the flow direction Df.

As shown in FIG. 7, the two Pitot tubes 55 have a total pressure measuring tube 55t for measuring the total pressure of the exhaust flowing downstream in the casing 51 and a static pressure measuring the static pressure of the exhaust flowing downstream in the casing 51. Includes a pressure measuring tube 55s. The total pressure measuring tube 55t and the static pressure measuring tube 55s are inserted into the main tube 53. The total pressure measuring tube 55t and the static pressure measuring tube 55s are attached to the casing 51. The total pressure measuring tube 55t is arranged upstream of the static pressure measuring tube 55s.

The total pressure measuring tube 55t and the static pressure measuring tube 55s extend in the radial direction of the main tube 53. FIG. 7 shows an example in which the center line L2 of the total pressure measuring tube 55t and the static pressure measuring tube 55s is vertical. The total pressure measuring tube 55t and the static pressure measuring tube 55s penetrate the main tube 53 in the radial direction of the main tube 53. Both ends of the total pressure measuring tube 55t and the static pressure measuring tube 55s project radially outward from the outer peripheral surface of the main tube 53. The two measuring pipes 57 are connected to the total pressure measuring tube 55t and the static pressure measuring tube 55s outside the casing 51.

As shown in FIG. 8, the total pressure measuring tube 55t and the static pressure measuring tube 55s are on the diameter of the inner peripheral surface of the main tube 53, that is, on a line segment having both ends arranged on the inner peripheral surface of the main tube 53. Have been placed. The total pressure measuring tube 55t and the static pressure measuring tube 55s are two tubes having the same shape, size, and material. Looking at the casing 51 from the upstream side of the casing 51 in the direction of the center line L1 of the casing 51 (direction parallel to the flow direction Df), the total pressure measuring tube 55t overlaps the entire static pressure measuring tube 55s, and the static pressure is measured. None of the measuring tubes 55s can be seen. The total pressure measuring tube 55t and the static pressure measuring tube 55s overlap with the center line L1 of the casing 51.

As shown in FIG. 9, the total pressure measuring tube 55t includes a plurality of total pressure measuring holes 56t arranged in the axial direction of the total pressure measuring tube 55t. FIG. 9 shows an example in which six total pressure measuring holes 56t are provided in the total pressure measuring tube 55t. The axial direction of the total pressure measuring tube 55t coincides with the radial direction of the main tube 53. The plurality of total pressure measuring holes 56t constitute a plurality of pairs. The two paired total pressure measuring holes 56t are arranged at positions 180 degrees rotationally symmetric with respect to the center line L1 of the casing 51. The pitch P1 of the plurality of total pressure measuring holes 56t, that is, the distance between the two adjacent total pressure measuring holes 56t decreases as the distance from the center line L1 of the casing 51 increases.

FIG. 10 shows an example in which the cross sections of the total pressure measuring tube 55t and the static pressure measuring tube 55s cut in a plane orthogonal to the axial direction of the total pressure measuring tube 55t and the static pressure measuring tube 55s are diamond-shaped. The shorter diagonal Ld of the cross section of the total pressure measuring tube 55t extends in the flow direction Df, and the shorter diagonal Ld of the cross section of the static pressure measuring tube 55s extends in the flow direction Df. The cross sections of the total pressure measuring tube 55t and the static pressure measuring tube 55s may have a shape other than a rhombus such as a circle, or may be different from each other.

As shown in FIG. 10, the total pressure measuring hole 56t is opened at the outer peripheral surface 55o and the inner peripheral surface 55i of the total pressure measuring tube 55t, and penetrates the total pressure measuring tube 55t. The total pressure measuring hole 56t is directed upstream. The static pressure measuring tube 55s includes a plurality of (for example, the same number as a plurality of total pressure measuring holes 56t) static pressure measuring holes 56s. The static pressure measuring hole 56s is opened at the outer peripheral surface 55o and the inner peripheral surface 55i of the static pressure measuring tube 55s, and penetrates the static pressure measuring tube 55s. The static pressure measuring hole 56s is directed downstream.

As shown in FIG. 7, the plurality of static pressure measuring holes 56s are arranged in the axial direction of the static pressure measuring tube 55s corresponding to the radial direction of the main tube 53. The plurality of static pressure measuring holes 56s constitute a plurality of pairs. The two paired static pressure measuring holes 56s are arranged at positions 180 degrees rotationally symmetric with respect to the center line L1 of the casing 51. Similar to the plurality of total pressure measuring holes 56t, the pitch of the plurality of static pressure measuring holes 56s, that is, the distance between the two adjacent static pressure measuring holes 56s decreases as the distance from the center line L1 of the casing 51 increases. ..

As shown in FIG. 7, the rectifying member 59 is arranged upstream of the total pressure measuring tube 55t and the static pressure measuring tube 55s. The rectifying member 59 is attached to the casing 51. The rectifying member 59 is surrounded by the inner peripheral surface 51i of the casing 51. As shown in FIG. 8, when the casing 51 is viewed from the upstream side of the casing 51 in the direction of the center line L1 of the casing 51, the rectifying member 59 divides the space surrounded by the inner peripheral surface 51i of the casing 51 into a plurality of regions. It is a partition.

FIG. 8 shows an example in which two straightening vanes 59a intersecting at the center line L1 of the casing 51 are provided on the straightening vane 59. Looking at the casing 51 from the upstream side of the casing 51 in the direction of the center line L1 of the casing 51, the straightening vane 59a extends in the radial direction of the main tube 53. In addition to or in place of the straightening vane 59a, the straightening vane 59 may include a straightening ring surrounding the center line L1 of the casing 51. Further, the rectifying member 59 may be a grid or a net.

As shown in FIG. 7, the exhaust gas flows into the casing 51 from the inlet 46i provided at the upstream end of the casing 51. The exhaust gas that has flowed into the casing 51 passes through the rectifying member 59. As a result, the flow of exhaust gas is adjusted. The exhaust gas that has passed through the rectifying member 59 passes through the total pressure measuring pipe 55t and the static pressure measuring pipe 55s. After that, the exhaust gas is discharged downstream from the casing 51 through the outlet 46o provided at the downstream end of the casing 51.

The total pressure of the exhaust gas flowing downstream in the casing 51 is applied to the plurality of total pressure measuring holes 56t of the total pressure measuring pipe 55t. The total pressure of the exhaust gas is transmitted to the differential pressure gauge 58 via the measuring pipe 57 connected to the total pressure measuring pipe 55t. Similarly, the static pressure of the exhaust gas flowing downstream in the casing 51 is applied to the plurality of static pressure measuring holes 56s of the static pressure measuring pipe 55s. The static pressure of the exhaust gas is transmitted to the differential pressure gauge 58 via the measuring pipe 57 connected to the static pressure measuring pipe 55s.

The differential pressure gauge 58 calculates the dynamic pressure of the exhaust based on the pressure of the exhaust transmitted from the total pressure measuring pipe 55t and the static pressure measuring pipe 55s via the two measuring pipes 57. The dynamic pressure of the exhaust gas calculated by the differential pressure gauge 58 is input to the control device 3. The control device 3 calculates the flow rate of the exhaust gas based on the dynamic pressure of the exhaust gas input from the differential pressure gauge 58 and the cross-sectional area of the flow path of the casing 51. The flow rate of the exhaust gas may be calculated by the differential pressure gauge 58.

The control device 3 constantly monitors whether the flow rate of the exhaust gas calculated by the control device 3 or the flow rate of the exhaust gas input from the differential pressure gauge 58 is maintained within an appropriate range. If the exhaust flow rate is out of the appropriate range, the control device 3 generates an alarm in the alarm device 40 (see FIG. 4) and notifies the user of the substrate processing device 1 of the abnormality in the exhaust flow rate. As a result, it is possible to immediately detect an abnormality in the flow rate of the exhaust gas.

In this way, the exhaust gas flows downstream in the casing 51 while in contact with the inner peripheral surface 51i of the casing 51, the surface of the rectifying member 59, and the surface of the Pitot tube 55. The surface of the Pitot tube 55 includes an outer peripheral surface 55o and an inner peripheral surface 55i of the Pitot tube 55, and an inner peripheral surface of the measurement hole 56. The inner peripheral surface 51i and the like of the casing 51 are made of a resin having resistance to chemicals supplied to the substrate W. That is, the inner peripheral surface 51i and the like of the casing 51 are made of a resin having a property of not being corroded or deformed even if it comes into contact with chemicals.

FIG. 7 shows an example in which the entire main tube 53, the entire Pitot tube 55, and the entire rectifying member 59 are made of a resin having chemical resistance (for example, polyvinyl chloride). The main tube 53 may be made of a transparent resin or a non-transparent resin. If the main tube 53 is transparent, the inside of the casing 51 can be seen from the outside of the casing 51. Therefore, the inside of the casing 51 can be seen without removing the casing 51 from the individual exhaust duct 42.

Next, a cleaning system for cleaning and drying the flow meter 46 will be described.
As shown in FIG. 7, the flow meter 46 has two measurements, a cleaning liquid pipe 62 for guiding the cleaning liquid supplied to the total pressure measuring pipe 55t and the static pressure measuring pipe 55s, and a cleaning liquid valve 63 for opening and closing the cleaning liquid pipe 62. Includes two constantly open valves 61 that open and close the pipe 57. The flow meter 46 further includes a suction pipe 64 for sucking the fluid in the total pressure measuring pipe 55t and the static pressure measuring pipe 55s via the two measuring pipes 57, and a suction valve 65 for opening and closing the suction pipe 64. The suction pipe 64 may be connected to a suction device 66 such as an aspirator, or may be connected to a suction facility provided in a factory where the substrate processing device 1 is installed.

The downstream end of the cleaning liquid pipe 62 is connected to each of the two measuring pipes 57. The upstream end of the suction pipe 64 is connected to each of the two measurement pipes 57. The constantly open valve 61 is interposed in the measuring pipe 57 at a position closer to the differential pressure gauge 58 than the connection position between the cleaning liquid pipe 62 and the measuring pipe 57. The constantly open valve 61 is closed only when the flow meter 46 is washed and dried. The constantly open valve 61 is, for example, an air valve that is opened and closed by a pneumatic actuator. The cleaning liquid guided by the cleaning liquid pipe 62 is, for example, pure water. The cleaning liquid may be a liquid other than pure water. For example, any of the above-mentioned specific examples of the rinsing solution may be used as the cleaning solution.

FIG. 11A is a cross-sectional view showing a state in which the Pitot tube 55 is being washed. FIG. 11B is a cross-sectional view showing a state in which the Pitot tube 55 is dried.
As shown in FIG. 11A, when cleaning the total pressure measuring tube 55t and the static pressure measuring tube 55s, the control device 3 opens the cleaning liquid valve 63. As a result, pure water, which is an example of the cleaning liquid, is supplied from the cleaning liquid pipe 62 to the total pressure measuring pipe 55t and the static pressure measuring pipe 55s via the two measuring pipes 57. The pure water in the total pressure measuring tube 55t is discharged to the outside of the total pressure measuring tube 55t from the plurality of total pressure measuring holes 56t. Similarly, the pure water in the static pressure measuring tube 55s is discharged to the outside of the static pressure measuring tube 55s from the plurality of static pressure measuring holes 56s. As a result, pure water is supplied to the total pressure measuring hole 56t and the static pressure measuring hole 56s, and the foreign matter adhering to the total pressure measuring hole 56t and the static pressure measuring hole 56s is washed away.

When a predetermined time has elapsed after the cleaning liquid valve 63 is opened, the control device 3 closes the cleaning liquid valve 63. As a result, the supply of pure water to the total pressure measuring tube 55t and the static pressure measuring tube 55s is stopped. After that, the control device 3 opens the suction valve 65. As a result, as shown in FIG. 11B, the fluid in the total pressure measuring pipe 55t and the static pressure measuring pipe 55s is sucked into the suction pipe 64 via the two measuring pipes 57. Even if foreign matter or cleaning liquid remains in the Pitot tube 55, they are sucked into the suction pipe 64 via the two measurement pipes 57. As a result, the total pressure measuring tube 55t and the static pressure measuring tube 55s are dried.

The cleaning of the flow meter 46 may be executed every time one substrate W is processed, may be executed every time a plurality of substrates W are processed, or may be executed at regular intervals. However, it may be executed at any time. When the flow meter 46 is cleaned every time a plurality of substrates W are processed, the flow meter 46 may be cleaned every time all the substrates W contained in one lot are processed, or an arbitrary number of substrates W may be cleaned. The flow meter 46 may be washed every time.

As described above, in the present embodiment, the exhaust gas containing the chemicals for treating the substrate W flows downstream in the casing 51. The Pitot tube 55 is arranged in the casing 51. The total pressure (sum of static pressure and dynamic pressure) and static pressure of the exhaust gas flowing downstream in the casing 51 are detected by the Pitot tube 55. The flow rate of the exhaust gas, that is, the amount of the exhaust gas passing through the casing 51 in a unit time is calculated based on the dynamic pressure of the exhaust gas. This makes it possible to measure the flow rate of the exhaust gas passing through the casing 51.

The exhaust gas flowing downstream in the casing 51 comes into contact with the outer peripheral surface 55o of the Pitot tube 55 provided with the measurement hole 56. When the Pitot tube 55 is exposed to the exhaust for a long time, foreign matter such as salt adheres to the measurement hole 56 of the Pitot tube 55. The cleaning liquid guided by the cleaning liquid pipe 62 is supplied to the measuring hole 56 of the Pitot tube 55. As a result, it is possible to prevent the measurement hole 56 of the Pitot tube 55 from being clogged with foreign matter such as residue or crystals, and it is possible to measure the flow rate of the exhaust gas with stable accuracy over a long period of time.

Further, since the cleaning liquid is supplied to the Pitot tube 55 and the casing 51, when the foreign matter adhering to these is dissolved in the cleaning liquid, the foreign matter can be removed while being dissolved in the cleaning liquid. For example, salts generated by contact between acidic chemicals and alkaline chemicals and crystals precipitated from the chemical solution due to the disappearance of water are soluble in water, so if a cleaning solution containing water is supplied to the Pitot tube 55 or the like, the salt or crystals will be effective. Can be removed. Therefore, foreign matter can be reliably removed as compared with the case where a cleaning gas is used instead of the cleaning liquid.

In the present embodiment, the pressure (total pressure or static pressure) applied to the measurement hole 56 of the Pitot tube 55 is transmitted to the differential pressure gauge 58 via the measurement pipe 57. The cleaning liquid guided by the cleaning liquid pipe 62 is supplied to the internal space of the Pitot tube 55 via the measuring pipe 57. The cleaning liquid in the pitot tube 55 is discharged to the outside of the pitot tube 55 through the measuring hole 56. If foreign matter adheres to the measuring hole 56, the foreign matter is washed away by the cleaning liquid discharged from the measuring hole 56. As a result, it is possible to prevent the measurement hole 56 of the Pitot tube 55 from being clogged with foreign matter, and it is possible to measure the flow rate of the exhaust gas with stable accuracy over a long period of time.

In addition, since the cleaning liquid is supplied to the internal space of the Pitot tube 55 via the measuring pipe 57, the fluid nozzle 73 (see FIG. 13) for discharging the cleaning liquid does not have to be arranged in the casing 51. Placing the fluid nozzle 73 inside the casing 51 has a slight effect on the flow of exhaust gas. Therefore, the Pitot tube 55 can be cleaned without affecting the flow of exhaust gas. Further, since the fluid nozzle 73 does not have to be provided, the number of parts can be reduced.

In the present embodiment, after the pitot tube 55 is washed with the cleaning liquid, the fluid in the pitot tube 55 is sucked into the suction pipe 64 via the measurement pipe 57 connected to the pitot tube 55. Even if foreign matter or cleaning liquid remains in the Pitot tube 55, they are sucked into the suction pipe 64 via the measurement pipe 57. Further, since an air flow is formed from the outside of the Pitot tube 55 into the Pitot tube 55 through the measurement hole 56, the drying of the cleaning liquid adhering to the measurement hole 56 is promoted. Therefore, the Pitot tube 55 can be dried in a shorter time than when the Pitot tube 55 is dried by the flow of exhaust gas.

In the present embodiment, the chemicals for processing the substrate W are supplied to the substrate W. As a result, the substrate W is processed. Exhaust gas containing chemicals is discharged through the exhaust passage 44. The flow meter 46 is arranged in the exhaust passage 44. This makes it possible to measure the flow rate of the exhaust gas flowing through the exhaust passage 44. Further, since the pitot tube 55 of the flow meter 46 is washed with the cleaning liquid, it is possible to prevent the measurement hole 56 of the pitot tube 55 from being clogged with foreign matter, and the flow rate of the exhaust gas can be measured with stable accuracy over a long period of time. In addition, since the flow meter 46 has a smaller pressure loss than other types of flow meters such as an orifice flow meter, energy consumption can be reduced.

In this embodiment, the flow meter 46 is arranged under the floor F of the clean room. It is conceivable that the inside of the casing 51 and the Pitot tube 55 are cleaned by using a nozzle or a brush held by the operator in his / her own hand. However, when the flow meter 46 is located underground, the flow meter 46 cannot be easily cleaned in this way. This is because it is not easy to access the members placed in the basement of the clean room. Therefore, the flow meter 46 can be easily cleaned by providing the cleaning liquid pipe 62 for supplying the cleaning liquid to the Pitot tube 55.

As shown in FIG. 12, the flow meter 46 guides the gas supplied to the total pressure measuring pipe 55t and the static pressure measuring pipe 55s via the two measuring pipes 57 in place of or in addition to the suction pipe 64. A gas pipe 71 for opening and closing the gas pipe 71 may be provided.
In the case of the configuration shown in FIG. 12, the control device 3 opens the gas valve 72 after the total pressure measuring tube 55t and the static pressure measuring tube 55s are washed with the cleaning liquid, and measures the total pressure of a gas such as clean air or dry air. It is supplied to the tube 55t and the static pressure measuring tube 55s. As a result, an air flow that flows out of the Pitot tube 55 from inside the Pitot tube 55 through the measurement hole 56 is formed, so that the drying of the cleaning liquid adhering to the measurement hole 56 is promoted. Therefore, the Pitot tube 55 can be dried in a shorter time than when the Pitot tube 55 is dried by the flow of exhaust gas.

Further, as shown in FIG. 13, the flow meter 46 may include at least one fluid nozzle 73. FIG. 13 shows an example in which 10 fluid nozzles 73a, 73b, 73c, 73d, and 73e are provided. The cleaning liquid pipe 62 and the gas pipe 71 are connected to the fluid nozzles 73a, 73b, 73c, 73d, 73e instead of the Pitot tube 55. The cleaning liquid pipe 62 and the gas pipe 71 may be connected to both the Pitot tube 55 and the fluid nozzle 73. The flow meter 46 may include a cleaning liquid nozzle to which the cleaning liquid pipe 62 is connected and a gas nozzle to which the gas pipe 71 is connected, instead of the fluid nozzle 73.

The two fluid nozzles 73a are arranged outside the casing 51, and the remaining eight fluid nozzles 73b, 73c, 73d, 73e are arranged inside the casing 51. The six fluid nozzles 73b, 73c, 73d are arranged upstream of the two Pitot tubes 55, and the two fluid nozzles 73e are arranged downstream of the two Pitot tubes 55. The two fluid nozzles 73d are arranged between the rectifying member 59 and the Pitot tube 55.

The two fluid nozzles 73a discharge fluids such as a cleaning liquid and a gas toward the upstream end of the rectifying member 59. The two fluid nozzles 73b discharge the fluid toward the inner peripheral surface 51i of the casing 51. The two fluid nozzles 73c discharge the fluid toward the side surface of the rectifying member 59. The two fluid nozzles 73d discharge the fluid toward the outer peripheral surface of the total pressure measuring tube 55t. The two fluid nozzles 73e discharge the fluid toward the outer peripheral surface of the static pressure measuring tube 55s.

In the case of the configuration shown in FIG. 13, the control device 3 opens the cleaning liquid valve 63 to discharge the cleaning liquid to all the fluid nozzles 73. As a result, the cleaning liquid is supplied to the inner peripheral surface 51i of the casing 51, the surface of the rectifying member 59, and the outer peripheral surface of the Pitot tube 55. After closing the cleaning liquid valve 63, the control device 3 opens the gas valve 72 to discharge gas to all the fluid nozzles 73. As a result, the inner peripheral surface 51i of the casing 51, the surface of the rectifying member 59, and the outer peripheral surface of the Pitot tube 55 are dried.

In this way, the flow meter 46 is washed. If foreign matter adheres to the measurement hole 56 of the Pitot tube 55, the foreign matter is washed away by the cleaning liquid discharged from the fluid nozzle 73. After that, the discharge of gas from all the fluid nozzles 73 promotes the drying of the cleaning liquid adhering to the measurement hole 56. Therefore, the Pitot tube 55 can be dried in a shorter time than when the Pitot tube 55 is dried by the flow of exhaust gas.

Further, as shown in FIG. 14, the Pitot tube 55 has an inclined posture in which the center line L2 of the Pitot tube 55 is tilted diagonally with respect to the horizontal plane when the casing 51 is viewed in the direction of the center line L1 of the casing 51. When the casing 51 is viewed in the direction of the center line L1 of the casing 51, the center line L2 of the Pitot tube 55 may be arranged in the casing 51 in a horizontal horizontal posture. FIG. 14 shows an example of the former.

The black circles in FIG. 14 indicate foreign substances such as residues and crystals adhering to the lower end portion of the inner peripheral surface 51i of the casing 51. When the center line L1 of the casing 51 is inclined horizontally or diagonally with respect to the horizontal plane and the center line L2 of the pitot tube 55 is vertical, foreign substances such as residues and crystals tend to collect at the lower end of the pitot tube 55. Therefore, by tilting the Pitot tube 55 diagonally with respect to the vertical plane or making it orthogonal to the vertical plane, it is possible to reduce the adhesion of such foreign matter.

Second Embodiment FIG. 15 is a time chart according to the second embodiment of the present invention, in which the rotation speed of the substrate W, the flow rate of clean air supplied from the FFU 6 into the chamber 4, and the exhaust gas discharged from the chamber 4 are shown. It shows the change of the flow rate over time. In the following, reference will be made to FIGS. 6 and 15.
The main difference between the first embodiment and the second embodiment is that the control device 3 sets the output of the FFU 6, that is, the flow rate of clean air sent by the FFU 6 into the chamber 4, based on the measured value of the flow meter 46. Is to change the setting value of.

Specifically, when the substrate W is being processed, the rotation speed of the substrate W is not constant and changes according to the content of the processing. FIG. 15 shows an example in which the rotation speed of the substrate W increases from zero to the liquid treatment speed, and then increases from the liquid treatment speed to the drying speed. The liquid treatment speed is the rotation speed of the substrate W when a treatment liquid such as a chemical solution or a rinsing liquid is supplied to the substrate W, and the drying speed is the rotation speed of the substrate W when the substrate W is being dried. be. When the drying of the substrate W is completed, the rotation speed of the substrate W decreases from the drying speed to zero.

The flow rate of the clean air flowing into the chamber 4 and the flow rate of the exhaust gas discharged from the chamber 4 change without changing the output set value of the FFU 6. This is because the state in the chamber 4 changes. For example, when the rotation speed of the substrate W increases, the flow rate of clean air flowing into the chamber 4 and the flow rate of the exhaust gas discharged from the chamber 4 increase even if the output set value of the FFU 6 is the same. As shown by the two-point chain line in FIG. 15, when the rotation speed of the substrate W is the liquid processing speed, the flow rate of the exhaust is larger than when the rotation speed of the substrate W is zero, and the rotation speed of the substrate W is the drying speed. When the rotation speed of the substrate W is higher than that at the liquid processing speed, the flow rate of the exhaust is larger.

When the flow rate of the exhaust gas changes, the measured value of the flow meter 46 also changes. As shown in FIG. 15, the control device 3 changes the output set value of the FFU 6 based on the measured value of the flow meter 46, and reduces the fluctuation range of the flow rate of the exhaust gas discharged from the chamber 4. For example, when the rotation speed of the substrate W is the liquid processing speed, the control device 3 reduces the output set value of the FFU 6 as compared with the case where the rotation speed of the substrate W is zero, and when the rotation speed of the substrate W is the drying speed. Decreases the output set value of FFU 6 as compared with the case where the rotation speed of the substrate W is the liquid processing speed.

By changing the output set value of the FFU 6 in this way, it is possible to reduce the energy consumed by the FFU 6 as compared with the case where the output set value of the FFU 6 is not changed while stabilizing the downflow speed. Further, by changing the output set value of the FFU 6 in this way, the maximum flow rate of clean air required by the substrate processing apparatus 1 can be reduced, and the amount of clean air used can be reduced.

In the second embodiment, in addition to the action and effect according to the first embodiment, the following action and effect can be exerted. Specifically, FFU6, which is an example of a blower, sends gas into the substrate processing apparatus 1. Even if the output set value of the FFU 6, that is, the set value of the flow rate of the gas sent by the FFU 6 into the substrate processing apparatus 1 is the same, the flow velocity of the gas in the substrate processing apparatus 1 is not always constant. This is because the state of the substrate processing apparatus 1 changes. The control device 3 changes the flow rate of the gas sent from the FFU 6 into the substrate processing device 1 based on the measured value of the flow meter 46. Therefore, the flow velocity of the gas in the substrate processing apparatus 1 can be kept constant or intentionally changed.

In the above description, the case where the output set value of the FFU 6 is changed based on the measured value of the flow meter 46 has been described. However, when the exhaust damper 47 (see FIG. 6) is an auto damper, the output set value of the FFU 6 is changed. The opening degree of the exhaust damper 47 may be changed in addition to or instead of the change of. When the opening degree of the exhaust damper 47 changes, the pressure loss in the exhaust damper 47 changes, so that the flow rate of the exhaust gas discharged from the chamber 4 through the individual exhaust duct 42 changes. By adjusting the flow rate of the exhaust gas, it is possible to reduce the load of the exhaust gas treatment equipment provided in the factory where the substrate treatment device 1 is installed.

Third Embodiment FIG. 16 is a flowchart according to the third embodiment of the present invention, and shows a flow when the control device 3 determines whether or not to wash the flow meter 46. In the following, reference will be made to FIGS. 6 and 16.
The main difference between the first embodiment and the third embodiment is that the control device 3 determines the necessity of cleaning the flow meter 46 based on the measured value of the flow meter 46 and the measured value of the pressure gauge 45. be.

Specifically, the pressure applied to the exhaust passage 44 is measured by the pressure gauge 45. If the flow velocity of the exhaust flowing in the exhaust passage 44 is constant, the measured value of the flow meter 46 is also substantially constant, and the measured value of the pressure gauge 45 is also substantially constant. In other words, if the measuring hole 56 of the Pitot tube 55 is not clogged and the flow meter 46 is functioning properly, the measured value of the flow meter 46 and the measured value of the pressure gauge 45 have a certain relationship. Therefore, if the relationship between the measured value of the flow meter 46 and the measured value of the pressure gauge 45 is broken, there is a possibility that foreign matter has adhered to the measuring hole 56 of the Pitot tube 55.

As shown in FIG. 16, the control device 3 acquires the measured value of the flow meter 46 and the measured value of the pressure gauge 45 (step S11). After that, the control device 3 determines whether or not the measured value of the flow meter 46 is within an appropriate range based on the relationship between the measured value of the flow meter 46 and the measured value of the pressure gauge 45 (step S12). The relationship between the measured value of the flow meter 46 and the measured value of the pressure gauge 45 is created based on the experimental value measured in advance and stored in the auxiliary storage device 35 (see FIG. 4) of the control device 3.

If the measured value of the flow meter 46 is within an appropriate range (Yes in step S12), the control device 3 acquires the measured value of the flow meter 46 and the measured value of the pressure gauge 45 again (returns to step S11). .. If the measured value of the flow meter 46 is out of the appropriate range (No in step S12), the control device 3 determines that foreign matter has adhered to the measurement hole 56 of the Pitot tube 55, and the flow meter 46 is added to the cleaning system. (Step S13). As a result, clogging of the measuring hole 56 can be detected in advance, and the flow rate of the exhaust gas can be measured with stable accuracy over a long period of time.

Other Embodiments The present invention is not limited to the contents of the above-described embodiments, and various modifications can be made.
For example, when the liquid such as the cleaning liquid adhering to the Pitot tube 55 is evaporated by the flow of the exhaust gas, the suction pipe 64 and the gas pipe 71 may be omitted.

The casing 51 may be arranged in the exhaust passage 44 in an inclined posture in which the center line L1 of the casing 51 is not a horizontal horizontal posture but the center line L1 of the casing 51 is inclined obliquely with respect to the horizontal plane. Alternatively, the casing 51 may be arranged in the exhaust passage 44 with the center line L1 of the casing 51 in a vertical vertical posture.
Only the inner peripheral surface of the main tube 53, not the entire main tube 53 of the casing 51, may be made of a resin having chemical resistance. For example, the main tube 53 may include an outer cylinder made of a material other than resin such as metal, and a resin layer coated on the entire inner peripheral surface of the outer cylinder.

Similarly, only the surface of the pitot tube 55, not the entire pitot tube 55, may be formed of a chemical resistant resin. That is, as long as any part of the flow meter 46 in contact with the exhaust is made of a resin having chemical resistance, the other parts may be made of any material.
The flow meter 46 may be provided not for each processing unit 2 but for each tower TW. That is, the flow meter 46 may be provided only in the collective exhaust duct 43.

The flow meter 46 may be arranged above the floor F of the clean room. For example, the flow meter 46 may be arranged inside the substrate processing apparatus 1.
The substrate processing device 1 is not limited to an apparatus for processing a disk-shaped substrate W, and may be an apparatus for processing a polygonal substrate W.
The substrate processing apparatus 1 is not limited to the single-wafer type apparatus, and may be a batch-type apparatus that collectively processes a plurality of substrates W.

Two or more of all the above configurations may be combined. Two or more of all the steps described above may be combined.
In addition, various design changes can be made within the scope of the matters described in the claims.

1: Board processing device 2: Processing unit 3: Control device 42: Individual exhaust duct 43: Collective exhaust duct 44: Exhaust passage 45: Pressure gauge 46: Flow meter 47: Exhaust damper 51: Casing 51i: Casing inner peripheral surface 52 : Upstream flange 53: Main tube 54: Downstream flange 55: Pitot tube 55i: Inner peripheral surface of Pitot tube 55o: Outer surface of Pitot tube 55s: Static pressure measuring tube 55t: Total pressure measuring tube 56: Measuring hole 56s: Static pressure Measuring hole 56t: Total pressure measuring hole 57: Measuring pipe 58: Differential pressure gauge 61: Always open valve 62: Cleaning liquid pipe 63: Cleaning liquid valve 64: Suction pipe 65: Suction valve 66: Suction device 71: Gas pipe 72: Gas valve 73: Fluid nozzle Df: Exhaust flow direction F: Clean room floor L1: Casing center line L2: Pitot tube center line W: Substrate

Claims (16)

A cylindrical casing through which exhaust gas containing chemicals that process the substrate passes,
A pitot tube arranged in the casing, including an outer peripheral surface having a measuring hole in contact with the exhaust,
A cleaning liquid pipe that guides the cleaning liquid supplied to the Pitot tube, and
And at least one fluid nozzle for supplying a fluid to the interior of the casing,
The washing liquid pipe, the is connected to at least one fluid nozzle, pitot tube type flow meter for the substrate processing apparatus. The Pitot tube type flow rate for a substrate processing apparatus according to claim 1 , wherein the at least one fluid nozzle is arranged in the casing and includes a fluid nozzle for discharging a fluid toward an outer peripheral surface of the Pitot tube. Total. A cylindrical casing through which exhaust gas containing chemicals that process the substrate passes,
A pitot tube arranged in the casing, including an outer peripheral surface having a measuring hole in contact with the exhaust,
A cleaning liquid pipe that guides the cleaning liquid supplied to the Pitot tube, and
The measuring pipe connected to the Pitot tube and
And a suction pipe for sucking the fluid in the pitot tube through the measuring pipe, a Pitot tube type flowmeter for the substrate processing apparatus. A cylindrical casing through which exhaust gas containing chemicals that process the substrate passes,
A pitot tube arranged in the casing, including an outer peripheral surface having a measuring hole in contact with the exhaust,
A cleaning liquid pipe that guides the cleaning liquid supplied to the Pitot tube, and
The measuring pipe connected to the Pitot tube and
Wherein through the measurement pipe is connected to the pitot tube, and a gas pipe for guiding the gas supplied to said pitot tube through the measuring pipe, a Pitot tube type flowmeter for the substrate processing apparatus. A cylindrical casing through which exhaust gas containing chemicals that process the substrate passes,
A pitot tube arranged in the casing, including an outer peripheral surface having a measuring hole in contact with the exhaust,
A cleaning liquid pipe that guides the cleaning liquid supplied to the Pitot tube, and
Is disposed in the casing, a fluid nozzle for discharging the fluid toward the outer peripheral surface of the Pitot tube,
It said being connected to the fluid nozzle, and a gas pipe for guiding the gas supplied to the fluid nozzle, pitot tube type flow meter for the substrate processing apparatus. A processing unit that supplies chemicals that process the board to the board,
An exhaust passage through which the exhaust containing the chemicals passes, and
A pitot tube type flow meter for a substrate processing apparatus according to any one of claims 1 to 5 , which is arranged in the exhaust passage and measures the flow rate of exhaust gas containing the chemicals. .. The substrate processing apparatus according to claim 6 , wherein the pitot tube type flow meter for the substrate processing apparatus is arranged under the floor of a clean room in which the substrate processing apparatus is installed. A gas flow rate changing unit that changes at least one of a supply air flow rate representing the flow rate of the gas supplied into the substrate processing apparatus and an exhaust flow rate representing the flow rate of the gas discharged from the substrate processing apparatus.
6. The substrate processing apparatus described. A processing unit that supplies chemicals that process the board to the board,
An exhaust passage through which the exhaust containing the chemicals passes, and
It is provided with a Pitot tube type flow meter for a substrate processing device, which is arranged in the exhaust passage and measures the flow rate of the exhaust containing the chemicals.
The Pitot tube type flow meter for the substrate processing device is
A cylindrical casing through which the exhaust containing the chemicals passes, and
A pitot tube arranged in the casing, including an outer peripheral surface having a measuring hole in contact with the exhaust,
A cleaning liquid pipe for guiding the cleaning liquid supplied to the Pitot tube is provided.
The casing is arranged in the exhaust passage in a horizontal posture in which the center line of the casing is horizontal or in an inclined posture in which the center line of the casing is inclined at an angle with respect to a horizontal plane.
The Pitot tube has an inclined posture in which the center line of the Pitot tube is tilted diagonally with respect to a horizontal plane when the casing is viewed in the direction of the center line of the casing, or the casing is directed toward the center line of the casing. the center line of the Pitot tube in a horizontal horizontal posture, is disposed in the casing, the substrate processing apparatus when viewed in. A processing unit that supplies chemicals that process the board to the board,
An exhaust passage through which the exhaust containing the chemicals passes, and
A pitot tube type flow meter for a substrate processing device, which is arranged in the exhaust passage and measures the flow rate of the exhaust containing the chemicals,
A pressure gauge that measures the pressure applied to the exhaust passage, and
A control device that detects clogging of the measurement hole of the Pitot tube of the Pitot tube type flow meter for the substrate processing device based on the measured value of the Pitot tube type flow meter for the substrate processing device and the measured value of the pressure gauge. And with
The Pitot tube type flow meter for the substrate processing device is
A cylindrical casing through which the exhaust containing the chemicals passes, and
A pitot tube arranged in the casing, including an outer peripheral surface having a measuring hole in contact with the exhaust,
A substrate processing apparatus comprising a cleaning liquid pipe for guiding the cleaning liquid supplied to the Pitot tube. A substrate processing method executed by a substrate processing apparatus including a Pitot tube type flow meter for the substrate processing apparatus according to any one of claims 1 to 5.
The board processing step that supplies the chemicals that process the board to the board,
An exhaust flow rate measuring step of causing a Pitot tube type flow meter for the substrate processing apparatus arranged in an exhaust passage for guiding the exhaust containing the chemical to measure the flow rate of the exhaust containing the chemical.
After the exhaust flow rate measurement step, the pitot tube of the pitot tube type flow meter for the substrate processing apparatus is supplied with the cleaning liquid guided by the pitot tube of the pitot tube type flow meter for the substrate processing apparatus. A substrate processing method comprising a Pitot tube cleaning step of cleaning a tube. The exhaust flow rate measuring step is a step of causing a Pitot tube type flow meter for the substrate processing apparatus, which is arranged under the floor of a clean room where the substrate processing apparatus is installed, to measure the flow rate of the exhaust containing the chemicals. The substrate processing method according to claim 11, which includes. Based on the measured values of the Pitot tube type flow meter for the substrate processing apparatus, the supply air flow rate representing the flow rate of the gas supplied into the substrate processing apparatus and the exhaust representing the flow rate of the gas discharged from the substrate processing apparatus. The substrate processing method according to claim 11 , further comprising a gas flow rate changing step of changing at least one of the flow rates. A substrate processing method performed by a substrate processing apparatus equipped with a Pitot tube type flow meter for the substrate processing apparatus.
The Pitot tube type flow meter for the substrate processing device is
A cylindrical casing through which exhaust gas containing chemicals that process the substrate passes,
A pitot tube arranged in the casing, including an outer peripheral surface having a measuring hole in contact with the exhaust,
A cleaning liquid pipe for guiding the cleaning liquid supplied to the Pitot tube is provided.
The substrate processing method is
The board processing step that supplies the chemicals that process the board to the board,
An exhaust flow rate measuring step of causing the Pitot tube type flow meter arranged in an exhaust passage for guiding the exhaust containing the chemical to measure the flow rate of the exhaust containing the chemical.
After the exhaust flow rate measurement step, a pitot tube cleaning step for cleaning the pitot tube by supplying the cleaning liquid guided by the cleaning liquid pipe of the pitot tube type flow meter to the pitot tube of the pitot tube type flow meter. Including
The casing of the Pitot tube type flow meter for the substrate processing device is placed in the exhaust passage in a horizontal posture in which the center line of the casing is horizontal or in an inclined posture in which the center line of the casing is tilted diagonally with respect to a horizontal plane. Have been placed and
The exhaust flow measurement step is arranged in the casing in an inclined posture in which the center line of the Pitot tube is inclined obliquely with respect to a horizontal plane when the casing is viewed in the direction of the center line of the casing. A step of causing a Pitot tube type flow meter for a substrate processing apparatus to measure the flow rate of exhaust containing the chemical, or when the casing is viewed in the direction of the center line of the casing, the center line of the Pitot tube is horizontal. horizontally, disposed within said casing, a Pitot tube type flowmeter for said substrate processing apparatus, comprising the step of measuring the flow rate of the exhaust gas containing the chemicals, substrate processing method. A substrate processing method performed by a substrate processing apparatus equipped with a Pitot tube type flow meter for the substrate processing apparatus.
The Pitot tube type flow meter for the substrate processing device is
A cylindrical casing through which exhaust gas containing chemicals that process the substrate passes,
A pitot tube arranged in the casing, including an outer peripheral surface having a measuring hole in contact with the exhaust,
A cleaning liquid pipe for guiding the cleaning liquid supplied to the Pitot tube is provided.
The substrate processing method is
The board processing step that supplies the chemicals that process the board to the board,
An exhaust flow rate measuring step of causing the Pitot tube type flow meter arranged in an exhaust passage for guiding the exhaust containing the chemical to measure the flow rate of the exhaust containing the chemical.
After the exhaust flow rate measurement step, a pitot tube cleaning step for cleaning the pitot tube by supplying the cleaning liquid guided by the cleaning liquid pipe of the pitot tube type flow meter to the pitot tube of the pitot tube type flow meter.
Measurement of the Pitot tube of the Pitot tube type flow meter for the substrate processing device based on the measured value of the pressure gauge for measuring the pressure applied to the exhaust passage and the measured value of the Pitot tube type flow meter for the substrate processing device. A substrate processing method that includes a clogging detection step that detects clogging of holes. A substrate processing method performed by a substrate processing apparatus equipped with a Pitot tube type flow meter for the substrate processing apparatus.
The Pitot tube type flow meter for the substrate processing device is
A cylindrical casing through which exhaust gas containing chemicals that process the substrate passes,
A pitot tube arranged in the casing, including an outer peripheral surface having a measuring hole in contact with the exhaust,
A cleaning liquid pipe for guiding the cleaning liquid supplied to the Pitot tube is provided.
The substrate processing method is
The board processing step that supplies the chemicals that process the board to the board,
An exhaust flow rate measuring step of causing the Pitot tube type flow meter arranged in an exhaust passage for guiding the exhaust containing the chemical to measure the flow rate of the exhaust containing the chemical.
After the exhaust flow rate measurement step, a pitot tube cleaning step for cleaning the pitot tube by supplying the cleaning liquid guided by the cleaning liquid pipe of the pitot tube type flow meter to the pitot tube of the pitot tube type flow meter.
After said pitot tube cleaning step, by forming the air flow by at least one of the suction and supply of the fluid, and a pitot tube drying step of drying the Pitot tube, the substrate processing method.

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