TW201932394A - Wafer-transport vehicle and wafer-carrier detection method - Google Patents

Abstract

A wafer-transport vehicle includes a carrying device including a receiving space and a detection area connected to the receiving space; a hoist device disposed in the receiving space configured to moving a wafer carrier into the receiving space; and a detection device disposed on the carrying device, and configured to detect the position of the door of the wafer carrier, and configured to generates a warning signal when the door of the wafer carrier is located at the detection area.

Description

Wafer transport carrier and wafer cassette detection method

The disclosure relates to a wafer transport vehicle and a wafer cassette detecting method, and more particularly to a wafer transport vehicle with a detecting device and a detecting method for detecting a wafer cassette by using the detecting device.

Semiconductor devices have been used in a variety of electronic applications, such as personal computers, cell phones, digital cameras, and other electronic devices. The semiconductor device is manufactured substantially by sequentially depositing a material of a dielectric layer or a dielectric layer, a conductive layer, and a semiconductor layer to a wafer, and patterning a plurality of material layers using lithography techniques to form circuit components and components thereon. . Many integrated circuits are typically fabricated on a single wafer, and individual dies on the wafer are cut and separated along a cutting line between the integrated circuits. For example, individual dies are substantially packaged separately in a multi-wafer module or other type of package.

In order to enable wafers to move in different semiconductor devices, a suspended handling system has been developed. Although the current suspension handling system meets its purpose for use, it has not yet met many other requirements. Therefore, there is a need to provide an improved solution for a suspended handling system.

Some embodiments of the present disclosure provide a wafer transport carrier, including: a carrying device having a receiving space and a connection with the receiving space a measuring device; a suspension device disposed in the accommodating space and configured to move a wafer cassette into the accommodating space; and a detecting device disposed on the loading device and configured to detect The position of the door panel of the wafer cassette is measured to emit a warning signal when the door panel is located in the detection area.

Some embodiments of the present disclosure provide a method for detecting a wafer cassette, comprising: lifting a wafer cassette wafer transport carrier from a semiconductor device via a suspension device and accommodating one of the carrier devices Moving in the space; and in the process of moving the wafer cassette by the suspension device, when a door panel of the wafer cassette is located in a detection area connected to the receiving space, a detecting device sends a first warning signal.

1‧‧‧ wafer transport vehicle

10‧‧‧Carriage device

11‧‧‧ opening

12‧‧‧ side opening

13‧‧‧Chute

14‧‧‧ side wall

20‧‧‧suspension device

30‧‧‧Detection device

31‧‧‧stop element

311‧‧‧ Slider

312‧‧‧stop film

313‧‧‧Contact surface

314, 315‧‧‧ conductive sheet

32‧‧‧Detection components

34‧‧‧Signal transmitter

35‧‧‧Signal Receiver

33‧‧‧ protective elements

A1‧‧‧ wafer transport system

A10‧‧‧Semiconductor equipment

A11‧‧‧Loading equipment

A20‧‧‧ wafer storage equipment

A21‧‧‧ bearing seat

A22‧‧‧Second loader

A30‧‧‧suspension handling system

A31‧‧ Track

B1‧‧‧ wafer cassette

B11‧‧‧ Shell

B12‧‧‧ door panel

B13‧‧‧ fastening components

C1‧‧‧ angle

D1‧‧‧ hanging direction

S1‧‧‧ accommodating space

S2‧‧‧Detection area

W1‧‧‧ wafer

1 is a schematic diagram of a wafer transport system in accordance with some embodiments of the present disclosure.

2 is a perspective view of a wafer transport carrier in accordance with some embodiments of the present disclosure.

Figure 3 is a perspective view of a stop element in accordance with some embodiments of the present disclosure.

4 is a schematic illustration of a wafer transport carrier in accordance with some embodiments of the present disclosure, wherein the door panel of the wafer cassette is in a closed position.

Figure 5 is a schematic illustration of a wafer transport carrier in accordance with some embodiments of the present disclosure, wherein the door panel of the wafer cassette is in a releasable position.

Figure 6 is a schematic illustration of a wafer transport carrier in accordance with some embodiments of the present disclosure.

Figure 7 is a schematic illustration of a wafer transport carrier in accordance with some embodiments of the present disclosure. Figure.

Figure 8 is a perspective view of a wafer transport carrier in accordance with some embodiments of the present disclosure.

Figure 9 is a schematic illustration of a wafer transport carrier in accordance with some embodiments of the present disclosure.

Figure 10 is a schematic illustration of a wafer transport carrier in accordance with some embodiments of the present disclosure.

11 is a flow chart of a method for detecting a wafer cassette in accordance with some embodiments of the present disclosure.

The following description provides many different embodiments, or examples, for implementing the various features of the disclosure. The components and arrangements described in the following specific examples are only used to simplify the disclosure of the disclosed embodiments, which are merely by way of example, and are not intended to limit the disclosed embodiments. For example, the description of the structure of the first feature on or above a second feature includes direct contact between the first and second features, or another feature disposed between the first and second features such that The first and second features are not in direct contact.

In addition, the same reference numerals and/or characters are used in the present description in the different examples. The foregoing is merely for purposes of simplicity and clarity and is not intended to be

The vocabulary of the first and second words of this specification are for the purpose of clarity of explanation and are not intended to be construed as limiting. In addition, the first feature and the second feature are not limited to the same or different features.

Spatially related vocabulary used here, such as above or below The use of one element or the relationship of one feature to another element or feature is simply described. In addition to the orientations described in the drawings, the devices are used or operated in different orientations. The shapes, dimensions, and thicknesses of the drawings may not be drawn to scale or simplified for the purpose of clarity of description, and are merely illustrative.

The disclosed embodiment provides a wafer transport carrier capable of detecting whether the door panel of the wafer cassette is closed during lifting of a wafer cassette. In addition, the wafer transport carrier can detect whether the door panel is open or the door panel is detached during the process of transporting the wafer cassette.

1 is a schematic diagram of a wafer transport system A1 in accordance with some embodiments of the present disclosure. The wafer transport system A1 may include a semiconductor device A10, a wafer storage device A20, and a Over Hoist Transport (OHT). The semiconductor device A10 is used to perform a semiconductor process on the wafer W1.

In some embodiments, the semiconductor device A10 can be a chemical mechanical polishing (CMP) device, a physical vapor deposition (PVD) device, and a chemical vapor deposition (CVD). A device, an ion implant device, an etching device, a photolithography device, or other suitable device.

In some embodiments, the semiconductor process may be a chemical mechanical polishing process, a physical vapor deposition process, a chemical vapor deposition process, a doping process, an etching process, a lithography process, or other suitable Process.

The semiconductor device A10 may include a plurality of load ports A11 (load Port), used to carry the wafer cassette B1. In some embodiments, semiconductor device A10 can include a load port A11.

The wafer cassette B1 can be used to accommodate one or more wafers W1. In some embodiments, the wafer cassette B1 can be a front opening unified pod (FOUP) or a wafer boat.

The wafer cassette B1 may include a casing (also referred to as a casing) B11, a door panel B12, and a fastening component B13. The outer casing B11 can be used to accommodate a plurality of wafers W1. The door panel B12 is detachably disposed on the outer casing B11. In the embodiment, the door panel B12 is detachably disposed on one side wall of the outer casing B11. The fastening element B13 is disposed on the outer casing B11. In this embodiment, the fastening component B13 is disposed on the top of the outer casing B11.

When the wafer cassette B1 is carried on the loading cassette A11, the semiconductor device A10 detaches the door panel B12 from the housing B11. The semiconductor device A10 takes out the wafer W1 from the inside of the wafer cassette B1, and then transports it to the inside of the semiconductor device A10 to perform a semiconductor process. After the semiconductor device A10 has processed the wafer W1, the wafer W1 is returned to the wafer cassette B1, and the door panel B12 is covered to the outer casing B11.

The wafer storage device A20 is used to store a plurality of wafer cassettes B1. The wafer storage device A20 includes a plurality of carriers A21 and a plurality of loading cassettes A22. The carrier A21 is disposed in the wafer storage device A20, and the loading port A22 is located on the outer side of the wafer storage device A20.

When the wafer cassette B1 is to be stored in the wafer storage device A20, the wafer cassette B1 is first placed on the loading cassette A22, and then the wafer storage device A20 transfers the wafer cassette B1 placed on the loading cassette A22 to the wafer. Store on the carrier A21 in the device A20.

When the wafer cassette B1 is taken out from the storage wafer storage device A20, the wafer storage device A20 transfers the wafer cassette B1 placed on the carrier A21 to the loading cassette A22. Thereafter, the suspended transport system A30 can transport the wafer cassette B1 from the loading cassette A22 to the loading cassette A11 of the semiconductor device A10.

The suspended handling system A30 includes a track A31 and a plurality of wafer transport carriers 1. In some embodiments, the track A31 is placed on the ceiling of the fab and can pass over the load magazine A11 and the load magazine A22. The wafer transport carrier 1 is movably disposed on the track A31. In other words, the wafer transport carrier 1 can be moved along the track A31, and the wafer transport carrier 1 is used to transport the wafer cassette B1.

In some embodiments, the wafer transport carrier 1 transports the wafer cassette B1 from the wafer storage device A20 to the semiconductor device A10, or transports the wafer cassette B1 from the semiconductor device A10 to the wafer storage device A20. In some embodiments, the wafer transport carrier 1 transports the wafer cassette B1 from the wafer storage device A20 to another wafer storage device, or transports the wafer cassette B1 from the semiconductor device A10 to another semiconductor device.

As shown in FIG. 1, the wafer transporting carrier 1 includes a loading device 10 and a suspension device 20. The carrying device 10 is movably disposed on the track A31 and is used to transport the wafer cassette B1. The carrying device 10 can include an accommodating space S1 and a lower opening 11. The lower opening 11 is connected to the accommodating space S1 and is located at the bottom of the carrying device 10 (that is, facing the opposite side of the track A31).

The suspension device 20 is disposed in the carrying device 10 and can be located in the accommodating space S1. The suspension device 20 is used to move the wafer cassette B1 in a hanging direction D1. The above hanging direction D1 may be a vertical direction. The track A31 may extend vertically or substantially perpendicular to the hanging direction D1.

As shown in FIG. 1, in some embodiments, when the wafer cassette B1 is not carried on the loading cassette A11 of the semiconductor device A10, the semiconductor device A10 can issue a request signal. The wafer storage device A20 can carry out the wafer cassette B1 on the carrier A21 and place it on the loading cassette A22 according to the above request signal.

In one embodiment, the request signal sent by the semiconductor device A10 is transmitted to a control system (not shown) of the wafer transport system A1, and the request signal is forwarded to the wafer storage device A20 by the control system or according to the request. The signal transmits a corresponding control signal to the wafer storage device A20.

At this time, the wafer storage device A20 can issue a transfer signal. The suspended transport system A30 can move a wafer transport carrier 1 above the wafer cassette B1 according to the transport signal. In one embodiment, the transport signal sent by the wafer storage device A20 is transmitted to the control system, and the control system transfers the request signal to the suspended transport system A30 or transmits a corresponding control signal to the wafer storage according to the request signal. Device A20.

Thereafter, the wafer transport carrier 1 lowers the suspension device 20 onto the wafer cassette B1, and snaps the suspension device 20 to the fastening member B13 of the wafer cassette B1. After the suspension device 20 fastens the fastening component B13 of the wafer cassette B1, the suspension device 20 lifts the wafer cassette B1 in the hanging direction D1 and enters the housing space of the carrying device 10 via the lower opening 11. Within S1.

The wafer transport carrier 1 is carried along the track A31 with the wafer cassette B1 to the top of one of the semiconductor devices A10. The wafer transport carrier 1 controls the suspension device 20 to descend to place the wafer cassette B1 on the loading cassette A11. Thereafter, the suspension device 20 is disengaged from the snap element B13 of the wafer cassette B1 and raised into the wafer transport carrier 1.

When the semiconductor device A10 processes the wafer W1 in the wafer cassette B1 Thereafter, the semiconductor device A10 sends a carry signal. In some embodiments, the suspended handling system A30 moves a wafer transport carrier 1 to the top of the wafer cassette B1 on the loading cassette A11 in accordance with the transport signal.

The wafer transport carrier 1 lowers the suspension device 20 to the wafer cassette B1 in the hanging direction D1 and is fastened to the fastening member B13. After the suspension device 20 is coupled to the fastening component B13, the suspension device 20 lifts the wafer cassette B1 and enters the accommodating space S1 of the carrying device 10 via the lower opening 11. Thereafter, the wafer transport carrier 1 is moved along the track A31 to transport the wafer cassette B1 to the wafer storage device A20 or another semiconductor device.

2 is a perspective view of a wafer transport carrier 1 in accordance with some embodiments of the present disclosure. Figure 3 is a perspective view of the stop element 31 in accordance with some embodiments of the present disclosure. FIG. 4 is a schematic illustration of a wafer transport carrier 1 in accordance with some embodiments of the present disclosure.

The ride 10 can include a side opening 12 and a chute 13. The side opening 12 and the chute 13 are formed on one of the side walls 14 of the carrying device 10. The side opening 12 is connected to the accommodating space S1 and is perpendicular or substantially perpendicular to the lower opening 11. The wafer transport carrier 1 further includes a detecting device 30 disposed on the side wall 14 of the carrying device 10 and adjacent to the side opening 12 and the receiving space S1. In this embodiment, the detecting device 30 can be located in a detecting area S2. The detection area S2 is connected to the accommodation space S1 via the side opening 12.

The detecting device 30 can include a stop element 31 and a detecting element 32 (as shown in FIG. 4). The stop element 31 can be movably disposed in the sliding slot 13 of the carrying device 10 in the hanging direction D1 and can be located in the detecting area S2. In some embodiments, the stop element 31 can be generally an L-shaped structure, but is not limited.

As shown in FIGS. 2 and 3, the stop member 31 can include a slider 311 and a stop tab 312. The slider 311 is movably disposed in the chute 13 of the carrying device 10. In other words, the chute 13 can restrict the slider 311 from moving in the hanging direction D1. In some embodiments, the slider 311 can be a T-shaped structure. The cross section of the chute 13 perpendicular to the suspension direction D1 may be T-shaped. The stop member 31 can be prevented from falling off the chute 13 by the structure of the slider 311.

The stop piece 312 is connected to the slider 311 and located in the detection area S2. In some embodiments, the stop tab 312 can extend generally in the suspending direction D1 and corresponds to the side opening 12 and the receiving space S1. In some embodiments, the stop tab 312 is secured to the slider 311. In some embodiments, the stop tab 312 is integrally formed with the slider 311.

The detecting component 32 is disposed in the carrying device 10 and may correspond to the chute 13 . In some embodiments, the detecting element 32 is disposed on one side of the chute 13 away from the lower opening 11 and is located in the chute 13 adjacent to one side of the lower opening 11 when the slider 311 is not moved. In some embodiments, the detecting component 32 can be a contact switch or a contactless switch. For example, the contact switch can be a push button switch, and the non-contact switch can be a reed switch or a distance sensor, but is not limited thereto.

The detecting component 32 is configured to generate a warning signal. In one embodiment, the warning signal from the detecting component 32 is transmitted to a control system (not shown) of the wafer transport system A1. Therefore, after the detecting component 32 generates the warning signal, the control system of the wafer transportation system A1 can stop the movement of the loading device 10 and/or the suspension device 20 according to the warning signal.

In some embodiments, the control system of the wafer transport system A1 is more The warning signal can be transmitted to the relevant engineer's mobile device via wireless transmission. In some embodiments, the warning signal sent by the detecting component 32 is further transmitted to the loading device 10, and the charging device 10 can emit warning light via a light source according to the warning signal.

In Fig. 4, the door panel B12 of the wafer cassette B1 is in a closed position, and the stopper member 31 is located at an initial position. At this time, the door panel B12 is not located in the detection area S2, and the door panel B12 is separated from the stopper piece 312 of the stopper member 31. In the disclosed embodiment, when the door panel B12 is in the closed position, the door panel B12 is well coupled with the outer casing B11. Therefore, during the process of lifting the wafer cassette B1 by the suspension device 20 or during the process of transporting the wafer cassette B1 by the loading device 10, when the door panel B12 of the wafer cassette B1 is not located in the detection area S2, or touches When the stop element 31 is encountered, the detecting device 30 does not emit a warning signal.

FIG. 5 is a schematic illustration of a wafer transport carrier 1 in accordance with some embodiments of the present disclosure. In Fig. 5, the door panel B12 of the wafer cassette B1 is in a loose position, and the stop member 31 is in a trigger position. Therefore, in the process in which the suspension device 20 lifts the wafer cassette B1, the door panel B12 moves in the detection area S2. In addition, when the wafer cassette B1 is moved into the accommodating space S1, the door panel B12 pushes the bottom of the stopping piece 312 in the hanging direction D1 to move the slider 311 of the stopping member 31 toward the detecting element 32. . When the stop element 31 approaches or contacts the detecting element 32, the detecting device 30 issues a warning signal. In some embodiments, the movement of the carrier device 10 and/or the suspension device 20 stops moving in accordance with the warning signal.

After the detecting device 30 issues a warning signal, the wafer transporting vehicle 1 stops the hanging device 20 from moving the wafer cassette B1 according to the warning signal, and stops the wafer transporting vehicle 1 from moving on the track A31. Therefore, the door panel can be prevented instantly B12 further sways during the movement of the hanging device 20 to move the wafer cassette B1, causing the door panel B12 to fall off the outer casing B11. In addition, by stopping the wafer transporting vehicle 1 itself to move on the track A31, the engineer can wait for the door panel B12 to be properly mounted on the outer casing B11 in time to prevent the door panel B12 from falling during the movement of the wafer transporting vehicle 1. drop.

Since the door panel B12 is dropped during the movement of the suspension device 20 or the wafer transporting vehicle 1 to move the wafer cassette B1, the center of gravity of the wafer cassette B1 may be changed to cause the wafer cassette B1 to shake or tilt. However, if the door panel B1 is shaken or tilted, the lack of the door panel B12 stopper may cause the wafer W1 in the wafer cassette B1 to fall out of the wafer cassette B1, resulting in serious loss. Therefore, the detecting device 30 of the present disclosure prevents the door panel B12 from coming off immediately, thereby preventing the wafer W1 from falling out of the wafer cassette B1.

In this embodiment, the sensing component 32 can be a contactless switch. Therefore, the stop element 31 can cause the detecting device 30 to issue a warning signal without contacting the detecting component 32, so as to prevent the relative position of the door panel B12 and the outer casing B11 from moving when the stopping component 31 collides with the sensing component 32, thereby causing the door panel B12. Fall off.

In some embodiments, the sensing element 32 can be a reed switch. The slider 311 includes a permanent magnet. In other words, the slider 311 can generate a magnetic force. When the slider 311 approaches the reed switch, the magnetic force of the slider 311 triggers the reed switch and generates the above warning signal.

In some embodiments, sensing element 32 can be a distance sensor. When the sensing element 32 senses that the distance between the slider 311 and the slider 311 is less than a predetermined distance, for example, 1 cm, that is, the door panel B12 is in the released position, the sensing component 32 issues a warning signal.

As shown in Figure 4, if the door panel B12 is moved or suspended in the suspension device 20 When the wafer cassette B1 is in the closed position, the stopper member 31 is not moved by the door panel B12. Subsequently, if the door panel B12 is loosened from the outer casing B11, the door panel B12 can be abutted against the stop member 31 at this time. Therefore, the stopper member 31 can stop the door panel B12 from falling out of the outer casing B11. In addition, when the door panel B12 contacts the contact surface 313 of the stopper piece 312 facing the accommodating space S1, the wafer transporting vehicle 1 can issue a warning signal. In some embodiments, the movement of the carrier device 10 and/or the suspension device 20 stops moving in accordance with the warning signal.

Figure 6 is a schematic illustration of a wafer transport carrier 1 in accordance with some embodiments of the present disclosure. One end of the stop piece 312 is pivotally connected to one end of the slider 311. The slider 311 has a conductive sheet 314. The stop piece 312 has a conductive piece 315. The conductive sheet 315 and the conductive sheet 314 can be electrically connected to the sensing unit 32. When the stopper piece 312 is not pushed by the door panel B12 via the contact surface 313, the conductive sheet 315 is separated from the conductive sheet 314.

FIG. 7 is a schematic illustration of a wafer transport carrier 1 in accordance with some embodiments of the present disclosure. When the door panel B12 is poured to the stopper piece 312 to rotate the stopper piece 312 with respect to the slider 311. At this time, the conductive sheet 315 is in contact with or electrically connected to the conductive sheet 314, and the sensing unit 32 of the detecting device 30 generates a warning signal.

As shown in Figs. 6 and 7, the angle C1 between the stop piece 312 and the slider 311 is limited to a predetermined range. In some embodiments, the predetermined range is between about 90 degrees and 95 degrees. Therefore, the stopper piece 312 can also prevent the door panel B12 from coming off.

Figure 8 is a perspective view of a wafer transport carrier 1 in accordance with some embodiments of the present disclosure. FIG. 9 is a schematic illustration of a wafer transport carrier 1 in accordance with some embodiments of the present disclosure. The detecting device 30 is disposed in the detecting area S2 and can be disposed on On the side wall 14 of the carrier device 10. The detecting device 30 includes a detecting element 32 and a plurality of shielding elements 33. The detecting component 32 can include a plurality of signal emitters 34 and a plurality of signal receptors 35.

The protective element 33 can be disposed on the side wall 14 of the ride 10. In some embodiments, the guard element 33 can be an L-shaped structure, but is not limited thereto. The guard element 33 can be adjacent to the detection area S2. In this embodiment, the detection area S2 is located between the accommodating space S1 and the two shielding elements 33.

The signal emitter 34 is disposed on the guard element 33 and can be used to emit a detection beam. The signal receiver 35 is disposed on the other guard element 33 and is operable to receive the detection beam. In some embodiments, the signal transmitter 34 and the signal receiver 35 can be integrated into one component. In some embodiments, the signal transmitter 34 and the signal receiver 35 can be disposed on the same guard element 33.

In some embodiments, a portion of the signal transmitter 34 and the signal receiver 35 are located in the same guard element 33, and a portion of the signal transmitter 34 and the signal receiver 35 are located in the other guard element 33. In some embodiments, the signal transmitters 34 and the signal receivers 35 on the same guard element 33 are arranged in a staggered manner.

As shown in FIG. 9, during the process of moving the wafer cassette B1 by the suspension device 20, when the door panel B12 of the wafer cassette B1 is located in the detection area S2 and shields the detection beam, the detecting device 30 issues a warning signal.

FIG. 10 is a schematic illustration of a wafer transport carrier 1 in accordance with some embodiments of the present disclosure. As shown in FIG. 10, when the wafer transporting vehicle 1 transports the wafer cassette B1, if the door panel B12 is loosened from the outer casing B11, the door panel B12 can be stopped by the protective member 33, so that the protective member 33 can be prevented. The door panel B12 falls off the outer casing B11. In addition, when the door panel B12 is in the loose position, the door panel B12 blocks the detection beam and the detection device 30 can issue a warning signal.

The shield member 33, the signal transmitter 34, and the signal receiver 35 in the embodiments of Figs. 8 to 9 can be applied to the embodiments shown in Figs. 1 to 7.

FIG. 11 is a flow chart of a method for detecting a wafer cassette B1 according to some embodiments of the present disclosure. In step S101, as shown in FIG. 1, the wafer cassette B1 is placed on one of the semiconductor devices A10 on the loading cassette A11. The wafer transport system A1 controls a wafer transport carrier 1 to move above the wafer cassette B1. The wafer transport carrier 1 lifts the wafer cassette B1 from the semiconductor device A10 by the suspension device 20, and moves toward the accommodation space S1 of the carrier device 10.

In step S103, during the process of moving the wafer cassette B1 by the suspension device 20, when one of the door panels B12 of the wafer cassette B1 is located in the detection area S2 of the receiving space S1, the detecting device 30 issues a warning. Signal, and step S105 is performed.

In step S105, if the suspension device 20 is moving the wafer cassette B1, the suspension device 20 is stopped. If the wafer transporting vehicle 1 is transporting the wafer cassette B1, the transporting movement of the carrying device 10 is stopped.

If the door panel B12 of the wafer cassette B1 is not located in the detection area S2, the suspension device 20 moves the wafer cassette B1 to a transport position (as shown in FIG. 4) and then performs step S107. In step S107, the wafer transport carrier 1 transports the wafer cassette B1 along the track A31.

In step S109, when the wafer transporting vehicle 1 moves, when the door panel B12 moves into the detecting area S2, the detecting device 30 issues a warning signal, and executes step S105.

If the door panel B12 of the wafer cassette B1 is not located in the detection area S2, the wafer transport carrier 1 continues to transport the wafer cassette B1 along the track A31. In step S111, when the wafer W1 transports a predetermined position, the wafer cassette B1 is loaded and unloaded on a wafer storage device A20 or another semiconductor device.

In summary, the detecting device of the present disclosure can instantly detect whether the door panel of the wafer cassette is loose during the process of moving the wafer cassette by the hanging device or during the process of transporting the wafer cassette by the wafer transporting vehicle. It is detached from the outer casing and can issue a warning signal when it detects that the door panel is loose from the outer casing, thereby preventing the door panel from falling off the outer casing and reducing the risk of wafer scrapping.

The present disclosure provides a wafer transporting vehicle comprising: a carrying device having a receiving space and a detecting area connected to the receiving space; a suspension device disposed in the receiving space and configured To move a wafer cassette into the accommodating space; and a detecting device disposed on the loading device configured to detect the position of the door panel of the wafer cassette, so that when the door panel is located in the detecting area, Send a warning signal.

In some embodiments, the detecting device includes: a stop element movably disposed on the carrying device and located in the detecting area; and a detecting component disposed in the carrying device. The detecting component is configured to issue a warning signal when the stopper element is moved by the door panel and approaches the detecting component.

In some embodiments, the detecting component can be a contact switch or a contactless switch.

In some embodiments, the stop element includes: a slider movably disposed in one of the chutes of the carrier device; and a stop tab coupled to the slider and located within the detection area.

In some embodiments, the detecting device is configured to issue a warning signal when the door panel contacts one of the contact faces of the stop sheet facing the accommodating space.

In some embodiments, the stop piece is pivotally connected to the slider, the stop piece includes a first conductive piece, and the slider includes a second conductive piece separated from the first conductive piece. The detecting device is configured to electrically connect the second conductive piece to the second conductive piece to issue a warning signal when the door plate abuts the stop piece and rotates the stop piece relative to the slider.

In some embodiments, the detecting device includes: a signal transmitter configured to emit a detection beam; and a signal receiver configured to receive the detection beam. The detecting device is configured to issue a warning signal when the door panel of the wafer cassette is located in the detection area and shields the detection beam.

In some embodiments, the detecting device further includes a protective component disposed on the carrying device adjacent to the detecting area, wherein the signal emitter is disposed on the protective component, and the door panel is located in a loose position Relying on protective components.

The present disclosure provides a method for detecting a wafer cassette, comprising: lifting a wafer cassette from a semiconductor device via a suspension device and moving it in an accommodation space of one of the carrier devices; and the suspension device During the process of moving the wafer cassette, a detecting device sends a warning signal when one of the door panels of the wafer cassette is located in a detecting area connected to the receiving space.

In some embodiments, during the process of transporting the wafer cassette by the carrying device, the detecting device issues a warning signal when the door panel pushes one of the detecting devices.

The above-disclosed features can be combined, modified, substituted or diverted with one or more of the disclosed embodiments in any suitable manner and are not limited to the specific embodiments.

The present disclosure is disclosed in the above embodiments, but is not intended to limit the scope of the disclosure. Any one skilled in the art can make some changes without departing from the spirit and scope of the disclosure. With retouching. Therefore, the above embodiments are not intended to limit the scope of the disclosure, and the scope of the disclosure is defined by the scope of the appended claims.

Claims (10)

A wafer transporting vehicle includes: a carrying device having a receiving space and a detecting area connected to the receiving space; a suspension device disposed in the receiving space and configured to be used Moving a wafer cassette into the accommodating space; and a detecting device disposed on the carrying device and configured to detect a position of a door panel of the wafer cassette, wherein the door panel is located in the Detecting A warning signal is issued when measuring the area. The wafer transport vehicle of claim 1, wherein the detecting device comprises: a stop element movably disposed on the carrying device and located in the detecting area; and a detecting The detecting component is disposed in the carrying device; wherein the detecting component is configured to issue the warning signal when the stopping component is moved by the door panel and approaches the detecting component. The wafer transport vehicle of claim 2, wherein the detecting component can be a contact switch or a non-contact switch. The wafer transport carrier of claim 2, wherein the stop element comprises: a slider movably disposed in one of the chutes of the carrier device; and a stop piece connected to the The slider is located in the detection area. The wafer transporting vehicle of claim 4, wherein the detecting is when the door panel contacts a contact surface of the stopping piece facing the accommodating space The device sends the warning signal. The wafer transporting vehicle of claim 4, wherein the stopping piece is pivotally connected to the slider, the stopping piece comprises a first conductive piece, and the sliding block comprises the first conductive piece Separating a second conductive sheet, wherein the detecting device is configured to electrically connect the second conductive sheet to the second after the door panel abuts the stop sheet and rotates the stop sheet relative to the slider This warning signal is issued when the conductive sheet is used. The wafer transport vehicle of claim 1, wherein the detecting device comprises: a signal transmitter configured to emit a detection beam; and a signal receiver configured to receive the Detecting a light beam; wherein the detecting device is configured to issue the warning signal when the door panel of the wafer cassette is located in the detecting area and shields the detecting beam. The wafer transport vehicle of claim 7, wherein the detecting device further comprises a protective component disposed on the carrier device and adjacent to the detecting region, wherein the signal transmitter is disposed on the The door panel abuts the guard element when the guard element is in a loose position. A method for detecting a wafer cassette, comprising: lifting a wafer cassette from a semiconductor device via a suspension device and moving it toward an accommodation space of a carrier device; and moving the crystal to the suspension device In the process of the round box, when one of the door panels of the wafer cassette is located in a detection area of the receiving space, a detecting device sends a warning signal. The method for detecting a wafer cassette as described in claim 9 of the patent application is further included in During the process of transporting the wafer cassette, the detecting device sends the warning signal when the door panel is located in the detecting area.