TW201929216A - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
TW201929216A
TW201929216A TW106145584A TW106145584A TW201929216A TW 201929216 A TW201929216 A TW 201929216A TW 106145584 A TW106145584 A TW 106145584A TW 106145584 A TW106145584 A TW 106145584A TW 201929216 A TW201929216 A TW 201929216A
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light
electrode
emitting element
emitting
layer
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TW106145584A
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TWI656637B (en
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謝承志
林育玄
陳鵬聿
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友達光電股份有限公司
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Priority to CN201810141006.9A priority patent/CN108269946B/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/856Arrangements for extracting light from the devices comprising reflective means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

A light emitting device including a first electrode, a second electrode, a light emitting structure, a bank structure, and a reflecting layer is provided. The second electrode is disposed on the first electrode. The light emitting structure is disposed between the first electrode and the second electrode. The bank structure is disposed on the first electrode, and the bank structure surrounds the second electrode and the light emitting structure. The reflecting layer having an opening which exposed the second electrode is disposed on the second electrode.

Description

發光元件Light emitting element

本發明是有關於一種發光元件,且特別是有關於一種反射層設置於發光結構上的發光元件。The present invention relates to a light emitting element, and more particularly to a light emitting element having a reflective layer disposed on a light emitting structure.

隨著科技的進步,平面顯示器是近年來最受矚目的顯示技術,其中有機發光二極體(organic light emitting diode, OLED)因其自發光、無視角依存、省電、製程簡易、低成本、低溫度操作範圍以及高應答速度等優點而具有極大的應用潛力,可望成為下一代的平面顯示器之主流。With the advancement of science and technology, flat panel displays are the most noticeable display technology in recent years. Among them, organic light emitting diodes (OLEDs) are self-emitting, have no viewing angle dependence, save power, have simple manufacturing processes, low cost, Low temperature operating range and high response speed have great application potential, and it is expected to become the mainstream of next-generation flat panel displays.

噴墨塗佈技術(ink jet printing, IJP)在OLED的製程上能夠提升材料利用率以降低成本,但在進行噴墨塗佈之前需形成對應畫素設置的擋牆(bank),以定義每一畫素的區域。然而,在液滴噴塗於擋牆所構成的容置空間內時,液體的表面張力與擋牆附著力的不同導致後續經乾燥製程所形成之薄膜的厚度均勻度不佳,致使畫素周圍的亮度及色度與中心有明顯差異。Ink jet printing (IJP) technology can improve material utilization to reduce costs in the OLED manufacturing process, but before inkjet coating, a bank corresponding to the pixel settings needs to be formed to define each One pixel area. However, when liquid droplets are sprayed into the accommodating space formed by the retaining wall, the difference between the surface tension of the liquid and the adhesion of the retaining wall causes the thickness uniformity of the film formed by the subsequent drying process to be poor, resulting in Brightness and chromaticity are significantly different from the center.

因此,如何在薄膜厚度均勻度不佳的情況下,改善畫素周圍的亮度及色度與中心有明顯差異的問題,實為目前研發人員亟欲解決的問題之一。Therefore, how to improve the brightness and chromaticity around the pixels when the uniformity of the film thickness is not good is obviously different from the center, which is one of the problems that the current R & D personnel want to solve.

本發明提供一種發光元件,其具有均勻的亮度及色度。The invention provides a light-emitting element having uniform brightness and chromaticity.

本發明提供一種發光元件,其包括第一電極、第二電極、發光結構、擋牆結構和反射層。第二電極設置於第一電極上。發光結構設置於第一電極和第二電極之間。擋牆結構設置於第一電極上,且擋牆結構環繞第二電極和發光結構。反射層設置於第二電極上,且反射層具有暴露第二電極的開口。The invention provides a light-emitting element, which includes a first electrode, a second electrode, a light-emitting structure, a retaining wall structure, and a reflective layer. The second electrode is disposed on the first electrode. The light emitting structure is disposed between the first electrode and the second electrode. The retaining wall structure is disposed on the first electrode, and the retaining wall structure surrounds the second electrode and the light emitting structure. The reflective layer is disposed on the second electrode, and the reflective layer has an opening exposing the second electrode.

基於上述,在本發明的發光元件中,由於反射層設置於第二電極上,且其具有暴露第二電極的開口,故可藉由全反射的方式,使發光結構所產生的光於反射層下均勻混合之後,再由同一個開口射出。如此一來,即便畫素周圍的亮度及色度與中心有明顯差異(薄膜平坦性不佳所導致),仍可藉由全反射的方式,將亮度與色度不同的光於反射層下進行均勻混合,進而讓發光元件具有均勻的亮度及色度。Based on the above, in the light-emitting element of the present invention, since the reflective layer is disposed on the second electrode and it has an opening exposing the second electrode, the light generated by the light-emitting structure can be made to the reflective layer by means of total reflection. After mixing evenly, shoot out from the same opening again. In this way, even if the brightness and chromaticity around the pixel are significantly different from the center (caused by poor film flatness), the light with different brightness and chromaticity can still be carried out under the reflective layer by means of total reflection. Mix uniformly, so that the light-emitting element has uniform brightness and chromaticity.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

以下將參照本實施例之圖式以更全面地闡述本發明。然而,本發明亦可以各種不同的形式體現,而不應限於本文中所述之實施例。圖式中的層與區域的厚度會為了清楚起見而放大。相同或相似之參考號碼表示相同或相似之元件,以下段落將不再一一贅述。另外,實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本發明。Hereinafter, the present invention will be explained more fully with reference to the drawings of this embodiment. However, the present invention may be embodied in various forms and should not be limited to the embodiments described herein. The thicknesses of layers and regions in the drawings are exaggerated for clarity. The same or similar reference numbers indicate the same or similar elements, and the following paragraphs will not repeat them one by one. In addition, the directional terms mentioned in the embodiments, such as: up, down, left, right, front, or rear, are only directions referring to the attached drawings. Therefore, the directional terms used are used to illustrate and not to limit the present invention.

圖1為依據本發明一實施例的發光元件的示意圖。應注意的是,為了清楚表示光線於反射層和第一電極之間行經的路徑,圖1中省略了光學匹配層。圖2為圖1中沿虛線A-A’的剖面示意圖。應注意的是,為了清楚表示發光元件中各膜層之間的相對位置,圖2中並未繪示出各膜層的膜面差異或是厚度差異。FIG. 1 is a schematic diagram of a light emitting device according to an embodiment of the present invention. It should be noted that, in order to clearly show the path of light passing between the reflective layer and the first electrode, the optical matching layer is omitted in FIG. 1. Fig. 2 is a schematic cross-sectional view taken along the dashed line A-A 'in Fig. 1. It should be noted that, in order to clearly indicate the relative positions of the film layers in the light-emitting element, the film surface differences or thickness differences of the film layers are not shown in FIG. 2.

請同時參照圖1和圖2,發光元件100包括第一電極102、第二電極104、發光結構106、擋牆結構108以及反射層110。在本實施例中,發光元件100可包括有機發光二極體。Please refer to FIG. 1 and FIG. 2 at the same time. The light emitting device 100 includes a first electrode 102, a second electrode 104, a light emitting structure 106, a retaining wall structure 108, and a reflective layer 110. In this embodiment, the light emitting element 100 may include an organic light emitting diode.

第一電極102設置於基板S上。基板S的材料可以是玻璃、石英、有機聚合物、不透光/反射材料(例如:導電材料、金屬、晶圓、陶瓷或其它可適用的材料)或是其它可適用的材料。若使用導電材料或金屬時,則在基板S上覆蓋一層絕緣層(未繪示),以避免短路問題。在一些實施例中,基板S還可包括主動元件陣列(未繪示),其中上述的主動元件陣列包括多個電晶體(未繪示),其分別電性連接至相對應的第一電極102。第一電極102的材料為導體材料,例如鋁(Al)、銀(Ag)、鉻(Cr)、銅(Cu)、鎳(Ni)、鈦(Ti)、鉬(Mo)、鎂(Mg)、鉑(Pt)、金(Au)或其組合。第一電極102可以是單層、雙層或多層結構。舉例來說,第一電極102可以是由Ti/Al/Ti所構成的三層結構或是由Mo/Al/Mo、ITO/Ag/ITO所構成的三層結構。在一些實施例中,第一電極102包括反射電極,其材料可以是對可見光具有良好反射率的金屬,例如鋁、鉬、金或其組合。在一些實施例中,第一電極102的形成方法可以是化學氣相沉積(CVD)、物理氣相沉積(PVD)、原子層沉積(ALD)、蒸鍍(VTE)、濺鍍(SPT)或其組合。在一些實施例中,第一電極102可為發光元件100的陽極(anode)。The first electrode 102 is disposed on the substrate S. The material of the substrate S may be glass, quartz, organic polymers, opaque / reflective materials (for example, conductive materials, metals, wafers, ceramics, or other applicable materials) or other applicable materials. If a conductive material or metal is used, an insulating layer (not shown) is covered on the substrate S to avoid short-circuit problems. In some embodiments, the substrate S may further include an active device array (not shown), wherein the above active device array includes a plurality of transistors (not shown), which are respectively electrically connected to the corresponding first electrodes 102. . The material of the first electrode 102 is a conductive material such as aluminum (Al), silver (Ag), chromium (Cr), copper (Cu), nickel (Ni), titanium (Ti), molybdenum (Mo), and magnesium (Mg). , Platinum (Pt), gold (Au), or a combination thereof. The first electrode 102 may have a single-layer, double-layer, or multilayer structure. For example, the first electrode 102 may be a three-layer structure composed of Ti / Al / Ti or a three-layer structure composed of Mo / Al / Mo and ITO / Ag / ITO. In some embodiments, the first electrode 102 includes a reflective electrode, and a material thereof may be a metal having good reflectivity to visible light, such as aluminum, molybdenum, gold, or a combination thereof. In some embodiments, the method for forming the first electrode 102 may be chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), evaporation (VTE), sputtering (SPT), or Its combination. In some embodiments, the first electrode 102 may be an anode of the light emitting element 100.

第二電極104設置於第一電極102上。第二電極104的材料可為透明的導體材料,例如銦錫氧化物、銦鋅氧化物、鋁錫氧化物、鋁鋅氧化物或銦鍺鋅氧化物等金屬氧化物。在一些實施例中,第二電極104的形成方法可以是化學氣相沉積(CVD)、物理氣相沉積(PVD)、原子層沉積(ALD)、蒸鍍(VTE)、濺鍍(SPT)或其組合。在一些實施例中,第二電極104可為發光元件100的陰極(cathode)。The second electrode 104 is disposed on the first electrode 102. The material of the second electrode 104 may be a transparent conductive material, such as a metal oxide such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, or indium germanium zinc oxide. In some embodiments, the method for forming the second electrode 104 may be chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), evaporation (VTE), sputtering (SPT), or Its combination. In some embodiments, the second electrode 104 may be a cathode of the light emitting element 100.

發光結構106設置於第一電極102和第二電極104之間。發光結構106包括電洞注入層HIL、電洞傳輸層HTL、發光層EL和電子傳輸層ETL。電洞注入層HIL的材料例如是苯二甲藍銅、星狀芳胺類、聚苯胺、聚乙烯二氧噻吩或其他適合的材料。電洞傳輸層HTL的材料例如是三芳香胺類、交叉結構二胺聯苯、二胺聯苯衍生物或其他適合的材料。發光層EL可以是紅色有機發光圖案、綠色有機發光圖案、藍色有機發光圖案或是混合各頻譜的光產生的不同顏色(例如白、橘、黃等)發光圖案。電子傳輸層ETL的材料可以是噁唑衍生物及其樹狀物、金屬螯合物(例如Alq3)、唑類化合物、二氮蒽衍生物、含矽雜環化合物或其他適合的材料。在本實施例中,第一電極102為陽極;第二電極為陰極;發光結構106從第一電極102起依序包括上述的電洞注入層HIL、電洞傳輸層HTL、發光層EL和電子傳輸層ETL。The light emitting structure 106 is disposed between the first electrode 102 and the second electrode 104. The light emitting structure 106 includes a hole injection layer HIL, a hole transport layer HTL, a light emitting layer EL, and an electron transport layer ETL. The material of the hole injection layer HIL is, for example, xylylene blue copper, star-shaped aromatic amines, polyaniline, polyethylene dioxythiophene, or other suitable materials. The material of the hole transport layer HTL is, for example, triarylamines, cross-structured diamine biphenyls, diamine biphenyl derivatives, or other suitable materials. The light-emitting layer EL may be a red organic light-emitting pattern, a green organic light-emitting pattern, a blue organic light-emitting pattern, or a light-emitting pattern of different colors (for example, white, orange, yellow, and the like) generated by mixing light of each spectrum. The material of the electron transport layer ETL may be an oxazole derivative and its dendrimer, a metal chelate (for example, Alq3), an azole compound, a diazaanthracene derivative, a silicon-containing heterocyclic compound, or other suitable materials. In this embodiment, the first electrode 102 is an anode; the second electrode is a cathode; the light emitting structure 106 includes the above-mentioned hole injection layer HIL, hole transport layer HTL, light emitting layer EL, and electrons in order from the first electrode 102. Transport layer ETL.

在本實施例中,為了提升材料的利用率以降低發光元件100的製造成本,可藉由噴墨塗佈製程來形成電洞注入層HIL、電洞傳輸層HTL和發光層EL;而電子傳輸層ETL是藉由熱蒸鍍製程形成於發光層EL上,以降低發光元件100的驅動電壓。基於液體的表面張力與擋牆側壁吸附力的不同會導致液滴乾燥過程有膜厚不均的狀況,故以上述製程所形成的發光結構106的厚度隨著遠離該發光結構106的中心漸增。在一些實施例中,電洞注入層HIL、電洞傳輸層HTL、發光層EL和電子傳輸層ETL也可藉由噴墨塗佈製程形成。In this embodiment, in order to improve the utilization rate of materials to reduce the manufacturing cost of the light emitting device 100, the hole injection layer HIL, the hole transport layer HTL, and the light emitting layer EL may be formed by an inkjet coating process; and electron transmission The layer ETL is formed on the light-emitting layer EL by a thermal evaporation process to reduce the driving voltage of the light-emitting element 100. Based on the difference between the surface tension of the liquid and the adsorption force of the side wall of the retaining wall, the thickness of the light-emitting structure 106 formed by the above process may gradually increase as the thickness of the light-emitting structure 106 increases from the center of the liquid droplet drying process. . In some embodiments, the hole injection layer HIL, the hole transport layer HTL, the light emitting layer EL, and the electron transport layer ETL can also be formed by an inkjet coating process.

擋牆結構108設置於第一電極102上,且擋牆結構108環繞第二電極104和發光結構106。在藉由噴墨塗佈製程形成發光結構106之前,需先藉由擋牆結構108來定義每一畫素的區域,之後再將上述發光結構106中的各個膜層依序噴塗於擋牆結構108所構成的容置空間108a內。在一些實施例中,擋牆結構108可為疏水性材料,例如以含氟的負型光阻為材料,並經過黃光微影等製程所形成。如此一來,噴墨塗佈於容置空間108a內的液體可良好的固定於其中。The retaining wall structure 108 is disposed on the first electrode 102, and the retaining wall structure 108 surrounds the second electrode 104 and the light emitting structure 106. Before the light-emitting structure 106 is formed by the inkjet coating process, the area of each pixel must be defined by the retaining wall structure 108, and then each film layer in the above-mentioned light-emitting structure 106 is sequentially sprayed on the retaining wall structure. The accommodating space 108a formed by 108. In some embodiments, the retaining wall structure 108 may be a hydrophobic material, for example, a negative photoresist containing fluorine is used as a material, and is formed by processes such as yellow light lithography. In this way, the liquid that is inkjet-coated in the accommodating space 108a can be well fixed therein.

反射層110設置於第二電極104上,且反射層110具有暴露該第二電極104的開口110a。如此一來,可藉由全反射的方式,使發光結構106所產生的光於反射層110下均勻混合之後,再由同一個開口110a射出而傳遞至觀看者O。如此一來,即便畫素PX周圍(鄰近擋牆結構108的部分)的亮度及色度與其中心有明顯差異,仍可藉由全反射的方式,將亮度與色度不同的光於反射層110下進行均勻混合,進而讓發光元件100具有均勻的亮度及色度。舉例來說,發光結構106在位置P1和位置P2的厚度不同,故在注入相同單位面積的電流下,其所產生的光也具有不同的亮度和色度,但是兩者可藉由全反射的方式(如圖1所示之光行經的路線L1、L2)於反射層110下進行均勻混合之後,再由開口110a射出,使得畫素PX具有均勻的亮度和色度。也就是說,發光元件100在注入相同單位面積的電流下,畫素PX可維持原有的亮度和色度,而不會受到膜面平坦性不佳的影響,使得發光元件100具有良好的壽命與效率表現。在一些實施例中,相較於發光結構106於位置P1處所產生出來的光,其於位置P2處所產生出來的光具有較短的波長。The reflective layer 110 is disposed on the second electrode 104, and the reflective layer 110 has an opening 110 a that exposes the second electrode 104. In this way, the light generated by the light emitting structure 106 can be uniformly mixed under the reflective layer 110 in a total reflection manner, and then emitted through the same opening 110a to be transmitted to the viewer O. In this way, even if the brightness and chrominance around the pixel PX (the part adjacent to the retaining wall structure 108) are significantly different from its center, the light with different brightness and chrominance can still be reflected on the reflective layer 110 by means of total reflection. The light-emitting element 100 has uniform brightness and chromaticity. For example, the thickness of the light emitting structure 106 at the position P1 and the position P2 is different. Therefore, when the same unit area of current is injected, the light produced by the light emitting structure 106 also has different brightness and chromaticity, but the two can be totally reflected by Method (paths L1 and L2 through which light travels as shown in FIG. 1) are uniformly mixed under the reflective layer 110, and then emitted through the opening 110a, so that the pixels PX have uniform brightness and chromaticity. In other words, the pixel PX can maintain the original brightness and chromaticity under the same current per unit area of the light emitting element 100 without being affected by the poor flatness of the film surface, so that the light emitting element 100 has a good life. And efficiency performance. In some embodiments, the light generated at the position P2 has a shorter wavelength than the light generated by the light emitting structure 106 at the position P1.

在一些實施例中,開口110a設置於發光結構106的中心。如此一來,由於發光結構106的中心表面較為平坦,當光線從此處射出並穿過第二電極104時,較不易受到厚度不均的影響。另外,開口110a的大小與形狀可依設計進行適當的調整,只要能使發光結構106所產生出來的光線穿過開口110a即可。In some embodiments, the opening 110 a is disposed in the center of the light emitting structure 106. In this way, since the central surface of the light emitting structure 106 is relatively flat, when light exits there and passes through the second electrode 104, it is less susceptible to the influence of uneven thickness. In addition, the size and shape of the opening 110a can be appropriately adjusted according to the design, as long as the light generated by the light emitting structure 106 can pass through the opening 110a.

在一些實施例中,可選擇性地於反射層110和第二電極104之間設置光學匹配層112(如圖2所示),以增加光取出率。舉例來說,光學匹配層112可以是折射率匹配層。In some embodiments, an optical matching layer 112 (as shown in FIG. 2) may be selectively provided between the reflective layer 110 and the second electrode 104 to increase the light extraction rate. For example, the optical matching layer 112 may be a refractive index matching layer.

圖3為依據本發明另一實施例的發光元件的示意圖,其中發光元件200大致相同於發光元件100,其不同之處在於發光元件200的第一電極202具有凹凸微結構202a,故相同或相似元件使用相同或相似標號,其餘構件之連接關係、材料、功效及其製程已於前文中進行詳盡地描述,故於下文中不再重複贅述。3 is a schematic diagram of a light-emitting element according to another embodiment of the present invention. The light-emitting element 200 is substantially the same as the light-emitting element 100. The difference is that the first electrode 202 of the light-emitting element 200 has an uneven microstructure 202a, so it is the same or similar. The components use the same or similar reference numerals. The connection relationships, materials, functions and processes of the remaining components have been described in detail in the foregoing, so they will not be repeated here.

請參照圖3,發光元件200包括第一電極202、第二電極104、發光結構106、擋牆結構108以及反射層110。Referring to FIG. 3, the light-emitting element 200 includes a first electrode 202, a second electrode 104, a light-emitting structure 106, a retaining wall structure 108, and a reflective layer 110.

在此實施例中,第一電極202在鄰近發光結構106的表面具有凹凸微結構202a,且凹凸微結構202a設置在鄰近擋牆結構108的位置處(畫素PX的邊緣處)。如此一來,畫素PX邊緣的光線除了可於反射層110和第一電極202之間,以全反射的方式集中於開口110a之外,其還可藉由凹凸微結構202a讓邊緣的光線能夠散射,藉此幫助邊緣的光線傳遞至畫素PX的中心,使得畫素PX具有更為均勻的亮度和色度。在本實施例中,凹凸微結構202a可由多個圓狀的凸起部所構成(如圖3所示),但本發明不以此為限。在其他實施例中,凹凸微結構202a也可由其他不同形狀或數量的凸起部所構成。在一些實施例中,部分的凹凸微結構202a可設置於擋牆結構108中。In this embodiment, the first electrode 202 has a concavo-convex microstructure 202a on a surface adjacent to the light emitting structure 106, and the concavo-convex microstructure 202a is disposed near the retaining wall structure 108 (at the edge of the pixel PX). In this way, in addition to the light at the edge of the pixel PX, it can be concentrated between the reflective layer 110 and the first electrode 202 in the opening 110a in a total reflection manner, and it can also allow the light at the edge to be reflected by the concave-convex microstructure 202a. Scattering, thereby helping the light at the edges to pass to the center of the pixel PX, so that the pixel PX has more uniform brightness and chromaticity. In this embodiment, the concave-convex microstructure 202 a may be composed of a plurality of circular protrusions (as shown in FIG. 3), but the present invention is not limited thereto. In other embodiments, the concave-convex microstructure 202a may also be composed of other protrusions with different shapes or numbers. In some embodiments, part of the concave-convex microstructure 202 a may be disposed in the retaining wall structure 108.

圖4為依據本發明另一實施例的發光元件的示意圖,其中發光元件300大致相同於發光元件100,其不同之處在於發光元件300的擋牆結構308具有反射結構308a,故相同或相似元件使用相同或相似標號,其餘構件之連接關係、材料、功效及其製程已於前文中進行詳盡地描述,故於下文中不再重複贅述。4 is a schematic diagram of a light-emitting element according to another embodiment of the present invention. The light-emitting element 300 is substantially the same as the light-emitting element 100. The difference is that the retaining wall structure 308 of the light-emitting element 300 has a reflective structure 308a, so the same or similar elements The same or similar reference numerals are used. The connection relationship, materials, functions and processes of the remaining components have been described in detail in the foregoing, so they will not be repeated hereafter.

請參照圖4,發光元件300包括第一電極102、第二電極104、發光結構106、擋牆結構308以及反射層110。Referring to FIG. 4, the light-emitting element 300 includes a first electrode 102, a second electrode 104, a light-emitting structure 106, a retaining wall structure 308, and a reflective layer 110.

在此實施例中,擋牆結構308具有設置於其中的反射結構308a。如此一來,畫素PX邊緣的光線除了可於反射層110和第一電極202之間,以全反射的方式集中於開口110a之外,其還能夠藉由反射結構308a讓側向的光線能夠反射回畫素PX中心,以減少光的損失,使得畫素PX具有更為均勻的亮度和色度。在一些實施例中,反射結構308a的材料可為金屬,例如Al、Ag、Cr、Cu、Ni、Ti、Mo、Mg、Pt、Au或其組合。另外,在其他實施例中,第一電極102的表面也可選擇性地具有凹凸微結構(如圖3所示之凹凸微結構202a),且凹凸微結構可設置在鄰近擋牆結構108的位置處(畫素PX的邊緣處)。凹凸微結構例如是由多個圓狀的凸起部所構成(如圖3所示),但本發明不以此為限。In this embodiment, the retaining wall structure 308 has a reflective structure 308a disposed therein. In this way, in addition to the light at the edge of the pixel PX can be concentrated between the reflective layer 110 and the first electrode 202 in the opening 110a in a total reflection manner, it can also allow the lateral light to be reflected by the reflective structure 308a. Reflected back to the center of the pixel PX to reduce the loss of light, so that the pixel PX has more uniform brightness and chromaticity. In some embodiments, the material of the reflective structure 308a may be a metal, such as Al, Ag, Cr, Cu, Ni, Ti, Mo, Mg, Pt, Au, or a combination thereof. In addition, in other embodiments, the surface of the first electrode 102 may optionally have a concave-convex microstructure (as shown in FIG. 3, the concave-convex microstructure 202 a), and the concave-convex microstructure may be disposed adjacent to the retaining wall structure 108. (At the edge of the pixel PX). The concave-convex microstructure is constituted by a plurality of circular protrusions (as shown in FIG. 3), but the present invention is not limited thereto.

綜上所述,在上述實施例的發光元件中,由於反射層設置於第二電極上,且其具有暴露第二電極的開口,故可藉由全反射的方式,使發光結構所產生的光於反射層下均勻混合之後由同一個開口射出。如此一來,即便畫素周圍的亮度及色度與中心有明顯差異(薄膜平坦性不佳所導致),仍可藉由全反射的方式,將亮度與色度不同的光於反射層下進行均勻混合,進而讓發光元件具有均勻的亮度及色度。In summary, in the light-emitting element of the above embodiment, since the reflective layer is disposed on the second electrode and has an opening exposing the second electrode, the light generated by the light-emitting structure can be made by total reflection. After uniformly mixing under the reflective layer, it is emitted from the same opening. In this way, even if the brightness and chromaticity around the pixel are significantly different from the center (caused by poor film flatness), the light with different brightness and chromaticity can still be carried out under the reflective layer by means of total reflection. Mix uniformly, so that the light-emitting element has uniform brightness and chromaticity.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

100、200、300‧‧‧發光元件100, 200, 300‧‧‧ light-emitting elements

102、202‧‧‧第一電極102、202‧‧‧First electrode

104‧‧‧第二電極104‧‧‧Second electrode

106‧‧‧發光結構106‧‧‧light emitting structure

108、308‧‧‧擋牆結構108, 308‧‧‧ Retaining wall structure

108a‧‧‧容置空間108a‧‧‧accommodation space

110‧‧‧反射層110‧‧‧Reflective layer

110a‧‧‧開口110a‧‧‧ opening

112‧‧‧光學匹配層112‧‧‧Optical matching layer

202a‧‧‧凹凸微結構202a‧‧‧ Bump Microstructure

308a‧‧‧反射結構308a‧‧‧Reflective structure

S‧‧‧基板S‧‧‧ substrate

HIL‧‧‧電洞注入層HIL‧‧‧ Hole injection layer

HTL‧‧‧電洞傳輸層HTL‧‧‧ Hole Transmission Layer

EL‧‧‧發光層EL‧‧‧Light-emitting layer

ETL‧‧‧電子傳輸層ETL‧‧‧Electronic Transmission Layer

O‧‧‧觀看者O‧‧‧ viewers

PX‧‧‧畫素PX‧‧‧Pixels

P1、P2‧‧‧位置P1, P2‧‧‧Position

L1、L2‧‧‧光行經路線L1, L2‧‧‧ Light route

圖1為依據本發明一實施例的發光元件的示意圖。 圖2為圖1中沿虛線A-A’的剖面示意圖。 圖3為依據本發明另一實施例的發光元件的示意圖。 圖4為依據本發明又一實施例的發光元件的示意圖。FIG. 1 is a schematic diagram of a light emitting device according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view taken along the dashed line A-A 'in Fig. 1. FIG. 3 is a schematic diagram of a light emitting device according to another embodiment of the present invention. FIG. 4 is a schematic diagram of a light emitting device according to another embodiment of the present invention.

Claims (10)

一種發光元件,包括: 一第一電極; 一第二電極,設置於該第一電極上; 一發光結構,設置於該第一電極和該第二電極之間; 一擋牆結構,設置於該第一電極上,且該擋牆結構環繞該第二電極和該發光結構;以及 一反射層,設置於該第二電極上,且該反射層具有暴露該第二電極的一開口。A light-emitting element includes: a first electrode; a second electrode disposed on the first electrode; a light-emitting structure disposed between the first electrode and the second electrode; a retaining wall structure disposed on the first electrode; On the first electrode, and the retaining wall structure surrounds the second electrode and the light-emitting structure; and a reflective layer is disposed on the second electrode, and the reflective layer has an opening exposing the second electrode. 如申請專利範圍第1項所述的發光元件,其中該發光結構的厚度隨著遠離該發光結構的中心漸增。The light-emitting element according to item 1 of the scope of patent application, wherein the thickness of the light-emitting structure increases as it moves away from the center of the light-emitting structure. 如申請專利範圍第2項所述的發光元件,其中該開口設置於該發光結構的中心。The light-emitting element according to item 2 of the scope of patent application, wherein the opening is provided at the center of the light-emitting structure. 如申請專利範圍第1項所述的發光元件,其中該第一電極包括一反射電極。The light-emitting element according to item 1 of the application, wherein the first electrode includes a reflective electrode. 如申請專利範圍第4項所述的發光元件,其中該第一電極在鄰近該發光結構的表面具有一凹凸微結構,該凹凸微結構設置在鄰近該擋牆結構的位置處。The light-emitting element according to item 4 of the application, wherein the first electrode has a concave-convex microstructure on a surface adjacent to the light-emitting structure, and the concave-convex microstructure is disposed at a position adjacent to the retaining wall structure. 如申請專利範圍第1項所述的發光元件,更包括: 一反射結構,設置於該擋牆結構中。The light-emitting element according to item 1 of the patent application scope further includes: a reflective structure disposed in the retaining wall structure. 如申請專利範圍第1項所述的發光元件,更包括: 一光學匹配層,設置於該反射層和該第二電極之間。The light-emitting element according to item 1 of the patent application scope further includes: an optical matching layer disposed between the reflective layer and the second electrode. 如申請專利範圍第1項所述的發光元件,其中該發光結構從該第一電極起依序包括一電洞注入層、一電洞傳輸層、一發光層和一電子傳輸層,且該電洞注入層、該電洞傳輸層和該發光層是由噴墨塗佈製程所形成。The light-emitting element according to item 1 of the scope of patent application, wherein the light-emitting structure includes a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer in order from the first electrode, and the electricity The hole injection layer, the hole transport layer, and the light emitting layer are formed by an inkjet coating process. 如申請專利範圍第1項所述的發光元件,其中該發光元件包括有機發光二極體。The light-emitting element according to item 1 of the patent application scope, wherein the light-emitting element includes an organic light-emitting diode. 如申請專利範圍第1項所述的發光元件,其中該擋牆結構包括疏水性材料。The light-emitting element according to item 1 of the patent application scope, wherein the retaining wall structure comprises a hydrophobic material.
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