TW201925074A - Release film peeling method and release film peeling device prevents the cover film from warping - Google Patents

Abstract

The purpose of the present invention is to provide a release film peeling method and a release film peeling device, which can peel and remove a release film from a single-layered laminated thin film without causing the warpage or damage of the cover film. The release film peeling method and the release film peeling device (10) includes: adsorbing the side of release film (4) of the laminated thin-film (1) to a laminated thin-film adsorption table (14), moving the laminated thin-film (1) toward the x (-) direction and using a pre-peeling roller (13) to make the end part of the cover film (2) floated from the release film (4) to form a pre-peeled edge reserving part L at the same time, adsorbing the side of the cover film (2) of the laminated thin-film (1) to an adsorption head (16), and rotating the peeling roller (30) by moving the laminated thin-film adsorption table (14) and the peeling roller (30) in the x (+) direction to wind and peel the release film (4) from the laminated thin-film (1) at the same time, and removing and transferring the release film (4) by a conveyor belt (33).

Description

Release film peeling method and release film peeling device

The present invention relates to a release film peeling method and a release film peeling device.

Conventionally, a circuit board that has been generally recognized is used by adhering a cover film having a thermosetting adhesive layer to a conductor pattern forming surface of a substrate on which a conductor pattern such as a copper foil is formed. In the cover film, a release film as a protective film is laminated on the surface of the thermosetting adhesive layer (this is referred to as a laminated film), and after the release film is peeled off from the laminated film, the cover film is heated. Crimped on the circuit substrate. When the release film laminated on the adhesive layer is peeled off, peeling is required to prevent warpage and damage of the cover film.

As a method of peeling off the release film from the single-layer laminated film, there is a method of blowing air to the corner portion of the laminated film to lift the release film on the upper layer side of the corner portion, and borrowing the lifted release film The method of holding the holding device and moving the holding device along the diagonal of the corner portion while blowing air to peel off the release film (for example, refer to Patent Document 1).

Further, in the peeling method of peeling the protective film from the laminated board material on which the substrate material (circuit substrate) and the protective material (release film) are laminated, there is a method of cutting the protective material by half cut And a protective material peeling method in which the protective material is peeled off after the substrate material is grasped by the holding device together with the half-cut piece (for example, refer to Patent Document 2).

Prior technical literature

Patent Document 1: JP-A-2008-37572

Patent Document 2: JP-A-2015-83504

However, the peeling method described in Patent Document 1 is a method in which air is blown onto a laminated film and the release film is peeled off from the laminated film, and the film is peeled off at the start of peeling. In the peeling process, the entire release film may float and adhere to other places due to static electricity or the like, and may be hindered in the peeling operation and the removal operation.

Further, in the peeling method described in Patent Document 2, since the protective material is half-cut, there is a problem that the substrate material and the protective material are not completely cut. Also, at the time of half-cutting, it is conceivable that a cutting residue is generated and adhered to the substrate material, and the half-cut piece must be peeled off from the substrate material.

Accordingly, the present invention has been made to solve the above problems, and an object thereof is to provide a release film peeling method and a release film peeling apparatus which can remove a release film from a single sheet without causing warpage or damage of the cover film. The laminated film of the sheet was peeled off and removed.

The release film peeling method of the present invention is a release film from a single-layer laminated film composed of a cover film having a thermosetting adhesive layer and a release film laminated on the adhesive layer. A release film peeling method for peeling and removing a film, comprising: vacuum-adsorbing the release film side of the laminated film to a laminated film adsorption stage; and the laminated film is oriented to one side While the direction is moving, the pre-peeling roller is rotated while pressing the laminate film from the side of the cover film film, and the end portion of the cover film is floated from the release film. An operation of forming a pre-stripping edge portion; releasing the adsorption of the laminated film to the laminated film adsorption stage, and vacuum-adsorbing the entire surface of the cover film of the laminated film to the adsorption head; and After the laminated film is adsorbed, the peeling roller having adhesiveness is brought into contact with the release film, and the laminated film suction stage and the peeling roll are moved in the other direction. Rotating the peeling , Whereby the peeling and removal operations while the film is wound off from the laminate film at.

According to the release film peeling method of the present invention, the pre-peeling roll is formed by pressing the pre-peeling roll while being pressed from the cover film side of the laminated film, and the entire cover film is covered by the adsorption head. After the surface is adsorbed, the release film peeling roll portion is rotated to peel the release film from the laminated film. As a result, in the single-layer laminated film, the release film can be peeled off and removed without causing warpage or damage of the cover film.

In the release film peeling method of the present invention, it is desirable that in the operation of forming the pre-peeled edge portion, the cover film is pressed while the pre-peel roll is rotated to cause the cover layer The ends of the film float from the release film and contact air with the adhesive layer.

The thermosetting adhesive layer can form a pre-stripping edge portion by utilizing the property that the surface is in contact with the air, and if it is not heated, it is impossible to re-adhere the release film, and once peeled off from the pre-peeled edge portion, it can be easily The release film was peeled off from the laminated film.

In the release film peeling method of the present invention, it is preferable that in the operation in which the adsorption head is vacuum-adsorbing the laminated film, the pre-stripping edge portion is contained by the adsorption head. The entire surface of the laminated film is adsorbed.

Since the adsorption head adsorbs the entire surface of the cover film including the pre-stripped edge portion, warpage of the cover film can be prevented when the release film is peeled off. Further, since the peeling roller is not in direct contact with the cover film, it is possible to prevent damage to the cover film.

In the release film peeling method of the present invention, it is desirable that in the operation of peeling and removing the release film, the peeling film is peeled off while the peeling film is peeled off using the peeling roller The release film is conveyed by a transfer belt, and is removed by separating the release film from the peeling roll and the transfer belt by a separation plate.

When the release film is peeled off using only the peeling roller, the release film may be caught in the peeling roller to cause difficulty in removing the release film from the peeling roller. Therefore, if the release film after peeling is conveyed by the conveyor belt and separated from the peeling roller and the conveyor by the separating plate, the release film can be released without being wound around the peeling roller. The film was peeled off from the cover film and removed.

The release film peeling device of the present invention is a release film which is obtained from a laminated film composed of a cover film having a thermosetting adhesive layer and a release film laminated on the adhesive layer. A release film peeling apparatus for peeling and removing a film, comprising: a laminated film adsorption stage capable of reciprocating in one direction while vacuum-adsorbing the release film side of the laminated film; The laminated film is pressed from the side of the cover film, and is rotated on one side of the laminated film adsorption stage to be rotated on the end side of the laminated film on the traveling direction side. Forming a pre-stripping edge portion; adsorbing a head, vacuum-adsorbing the cover film side of the laminated film; and releasing the film peeling roll portion, being movable integrally with the laminated film adsorption stage, and moving The adsorption head is in a state in which the laminated film is adsorbed, and a peeling roller abuts on the release film in the pre-peeled edge portion, and is further attached to the laminated film adsorption stage One direction of movement in the stripping The roller is rotated while said laminated film from the release film at the peeling.

According to the release film peeling apparatus of the present invention, the pre-peeling roll is pressed from the side of the cover film of the laminated film while being rotated, and the end portion of the cover film is floated from the release film to form a pre-peeling. In the edge portion, after the entire surface of the cover film is adsorbed by the adsorption head, the peeling roller is rotated and the release film is peeled off from the laminated film. As a result, in the single-layer laminated film, the cover film can be peeled off from the laminated film without warping or damage.

In the release film peeling apparatus of the present invention, it is desirable that the pre-peeling roll is longer than a width dimension perpendicular to a moving direction of the laminated film, and the surface has adhesiveness, and the laminate is laminated The structure in which the film is pressed while being rotated by the movement of the laminated film adsorption stage.

The pre-peeling roll thus formed can be rotated by relatively moving the laminated film while being pressed against the laminated film adsorption stage without being offset, so that the cover film can be moved from the laminated film adsorption stage. The release film after vacuum adsorption floats and forms a pre-stripping edge portion.

In the release film peeling apparatus of the present invention, it is preferable that the release film peeling roll portion includes: the peeling roll, which is longer than a width dimension of the laminated film, and has a surface adhesiveness; a moving roller disposed on a lower side of the peeling roller and at a position farther from the laminated film adsorption stage than the peeling roller; and a conveyor belt that joins the peeling roller and the driven roller and conveys the peeling The release film, wherein the peeling roller and the driven roller are formed with a plurality of grooves, the conveyor belts are respectively mounted on the plurality of grooves, and the conveyor belt is stored in the peeling The inside of the outer peripheral surface of the roller is mounted.

The release film peeling roll portion configured as described above is peeled off continuously and almost uniformly by the entire width of the release film by the release roller having adhesiveness, and the release film after peeling is carried by the conveyor belt Transfer to the bottom. Therefore, the release film after peeling can be conveyed from the peeling roll by the conveyor belt without being wound around the peeling roll.

In the release film peeling apparatus of the present invention, it is preferable that the release film peeling roll portion has a separation plate configured to be between the peeling roller and the driven roller and the conveyor belt Crossing, and the driven roller side protrudes from the intersection toward the outside of the conveyor belt.

The release film which is peeled off by the peeling roller is conveyed to the lower side (direction away from the peeling roller) by the conveyor belt, and can be removed from the conveyor belt by the separation plate.

In the release film peeling apparatus of the present invention, it is preferable that the adsorption head has a state in which the coating layer is moved to adhere to the cover layer in a state in which the cover film is peeled off after the release film is peeled off. a position at which the circuit board of the film is disposed, and a function of heating and crimping the cover film on a predetermined position of the circuit board.

According to this configuration, the release film peeling device can realize the peeling function of peeling off and removing the release film from the laminated film, and also has the function of attaching the cover layer film to the circuit board by heating and pressure bonding.

Hereinafter, the release film peeling method and the release film peeling apparatus 10 in the embodiment of the present invention will be described with reference to Figs. 1 to 7 .

Structure of laminated film 1

Fig. 1 is a cross-sectional view showing the structure of the laminated film 1. The laminated film 1 is a single piece (sometimes referred to as a single piece or a strip) having a quadrangular shape in plan view, and is covered by the cover film 2 having the thermosetting adhesive layer 3 and the release layer laminated on the adhesive layer 3. The film 4 is constructed. The cover film 2 is a film for protecting the surface of a flexible wiring substrate or the like after forming a conductive pattern, such as a polyimide resin or a PET (polyethylene terephthalate) resin. The release film 4 is composed of a PET resin or the like and is a film for protecting the surface of the adhesive layer 3. The adhesive layer 3 and the release film 4 are in a laminated state in which the air between the layers is closely adhered, and since the adhesive layer 3 is thermosetting, the adhesive layer 3 becomes a contact with air at a normal temperature. In a separated state, it is possible to form a structure in which the release film 4 is peeled off from the adhesive layer 3, that is, from the cover film 2.

Structure of release film peeling device 10

Fig. 2 is a perspective view showing the structure of the release film peeling device 10 in the embodiment. In the drawings to be described later, the left and right directions in the second diagram are indicated by X, the right direction is X (+), the left direction is X (-), and the depth direction of the figure is Y. It is shown that the deep side is set to Y (-), the near side is set to Y (+), and the direction perpendicular to the XY plane is represented by Z, and the upper side is referred to as Z (+) or above, and the lower side is referred to as Z (-). ) or below to explain. The release film peeling apparatus 10 has a laminated film adsorption stage unit 11 for vacuum-adsorbing the laminated film 1 on the side of the release film 4 (see FIG. 1); the adsorption head unit 12, and the laminated film 1 on the cover film. 2 (refer to Fig. 1) side vacuum adsorption; and the pre-peeling roll 13 presses the laminated film 1 from the cover film side to the laminated film adsorption stage 14. The laminated film adsorption stage unit 11, the adsorption head unit 12, and the laminated film 1 shown in Fig. 2 are layout views showing a state in operation. The material of the pre-peeling roll 13 is a material having adhesiveness such as a polyolefin type rubber, and an adhesive layer may be formed on the outer peripheral surface.

The laminated film adsorption stage unit 11 has a laminated film adsorption stage 14 and a release film peeling roll unit 15 attached to the X (-) direction end of the laminated film adsorption stage 14. The laminated film adsorption stage unit 11 can reciprocate in the X direction, and pre-peeling of the release film 4 by the X (-) direction below the pre-peeling roll 13 is performed in the downward direction of the adsorption head unit 12 When moving in the X (+) direction, the release film peeling roller portion 15 operates to peel and remove the release film 4 from the cover film 2 . The detailed structure of the laminated film adsorption stage unit 11 will be described with reference to Figs. 3 and 4, and the peeling method of the release film 4 will be described later with reference to Figs. 5, 6 and 7.

The adsorption head unit 12 has an adsorption head 16 which is disposed above the laminated film adsorption stage unit 11 (Z (+) side) and faces the laminated film adsorption stage 14; the Z-axis driving portion 17 causes the adsorption head 16 to The Z-direction reciprocates; and the Y-axis driving unit 18 reciprocates the adsorption head 16 in the Y direction. The Z-axis drive unit 17 and the Y-axis drive unit 18 are driven with high precision by a servo motor (Servo motor) and a ball screw mechanism (not shown). The adsorption head unit 12 has a θ-axis drive unit 19 that rotates the adsorption head 16 in the horizontal direction, and the θ-axis drive unit 19 corrects the posture (angle with respect to the X-axis or the Y-axis) of the cover film 2 after adsorption. On the adsorption head 16, a plurality of adsorption holes (not shown) for vacuum-adsorbing the laminated film 1 are provided.

In the X (+) direction of the release film peeling apparatus 10, the substrate adsorption stage 20 is disposed, and a circuit board (for example, a flexible wiring board) which is a target of adhesion of the cover film 2 is vacuumed. The adsorption unit and the feeding unit 21 feed the circuit substrate to the substrate adsorption stage 20, and feed the laminated film 1 to the laminated film adsorption stage 14. Among them, the feeding unit 21 can reciprocate in the Y-axis direction and the Z-axis direction. The substrate adsorption stage 20 is moved to the lower side of the adsorption head 16 in the X (-) direction along the guide rail 22, and the cover film 2 is heated and pressure-bonded to the conductor pattern forming surface of the circuit board. The circuit substrate adhered to the cover film 2 is moved in the X (+) direction along the guide rail 22, is crimped by the pressure roller 23, and returned to the substrate supply position to be removed.

Structure of laminated film adsorption stage unit 11

Fig. 3 is a view showing the structure of the laminated film adsorption stage unit 11, and Fig. 3(a) is a perspective view showing the overall structure of the laminated film adsorption stage unit 11, and Fig. 3(b) is the first A part of the adsorption hole forming region 24 surrounded by the broken line B shown in (a) of Fig. 3 is enlarged and shown later. The laminated film adsorption stage unit 11 includes a laminated film adsorption stage 14 having an adsorption hole formation region 24 in which a plurality of adsorption holes 25 are arranged, a base portion 26 on which the laminated film adsorption stage 14 is placed and held, and a release type The film peeling roll unit 15 is provided at the end portion of the laminated film adsorption stage 14 in the X (-) direction.

The release film peeling roll unit 15 is composed of a peeling roller 30 that is longer than the width (the dimension in the Y direction) of the laminated film 1 and has adhesiveness on the surface, and a driven roller 31 that is disposed at a position on the lower side away from the peeling roller 30. . The driven roller 31 has the same length as the peeling roller 30. Both ends of the peeling roller 30 and the driven roller 31 are rotatably supported by the support plate 32. The support plate 32 is fixed to both ends of the base portion 26 in the Y direction. The material of the peeling roller 30 may be a material such as a polyolefin rubber, and an adhesive layer may be formed on the outer peripheral surface. The peeling roller 30 and the driven roller 31 are coupled by a conveyor belt 33 having a circular cross section. The conveyor belt 33 is attached to the grooves 34, 35 which are formed on the peeling roller 30 and the driven roller 31, respectively. A separation plate 36 is provided between the peeling roller 30 and the driven roller 31. The connection relationship between the peeling roller 30, the driven roller 31, and the conveyor belt 33 will be described in detail with reference to FIG.

Fig. 4 is a view of the laminated film adsorption stage unit 11 and the release film peeling roll unit 15 viewed from the Y (+) direction. (a) of FIG. 4 is a cross-sectional view showing a cut surface after cutting along the cutting line AA shown in FIG. 3, and (b) of FIG. 4 is a peeling roll portion 15 of the release film (in FIG. 4) A part of (a) surrounded by a broken line C) is enlarged and displayed. In the laminated film adsorption stage 14, a plurality of adsorption holes 25 as shown in FIG. 3(b) are provided, and the adsorption holes 25 communicate with the negative pressure chamber 27. The negative pressure chamber 27 is connected to a vacuum pump (not shown) by a joint 28, and vacuum is sucked from the adsorption hole 25 by driving the vacuum pump to vacuum-adsorb the laminated film 1 on the side of the release film 4. As shown in (a) of Fig. 4, the outer peripheral surface of the peeling roller 30 is disposed at a position higher than the laminated film adsorption stage 14 (Z (+) direction), and the driven roller 31 is disposed at a ratio The peeling roller 30 is further on the lower side and away from the X (-) direction. A straight line connecting the peeling roller 30 and the axial center of the driven roller 31 (indicated by a chain double-dashed line in the drawing) is inclined at an angle θ with respect to the surface of the laminated film adsorption stage 14.

As shown in FIG. 4(b), grooves 34 and 35 are formed in each of the peeling roller 30 and the driven roller 31. A conveyor belt 33 is mounted on these grooves 34, 35. A plurality of grooves 34 and 35 are formed in the Y direction (see (a) of Fig. 3). In the example shown in FIG. 3( a ), the belt 10 is provided, but the release film 4 after peeling is not limited to 10 pieces as long as it is disposed so as not to hang between the conveyor belts 33 . . The groove 34 formed in the peeling roller 30 has a depth at which the conveyor belt 33 does not protrude from the outer peripheral surface of the peeling roller 30. The groove 35 formed in the driven roller 31 is a depth slightly protruding from the outer circumferential surface of the driven roller 31 of the conveyor belt 33, but may be a depth that does not protrude. As the laminated film adsorption stage 14 moves in the X (+) direction with respect to the adsorption head 16 to which the laminated film 1 is vacuum-adsorbed, the peeling roll 30 is rotated by friction with the laminated film 1. The conveyor belt 33 rotates between the driven rollers 31 by the rotation (rotation) of the peeling roller 30, and conveys the release film 4 after peeling to the lower side.

Although the detailed peeling method of the release film 4 will be described later, the release film 4 peeled off by the peeling roller 30 is conveyed downward by the conveyor belt 33. In the release film peeling roll portion 15, a separation plate 36 for separating and removing the release film 4 after peeling is provided. As shown in FIGS. 3 and 4, the separating plate 36 is composed of a plate-shaped separating portion 37 extending in the Y direction and a fixing portion 38 provided at both end portions of the separating portion 37.

The separating plate 36 is fixed to the support plate 32 by the fixing portion 38 (see also (a) of Fig. 3). As shown in FIG. 4( b ), the separation portion 37 intersects the outer belt 33 (described as the conveyor belt 33A) at the upper end portion in the direction away from the laminated film adsorption stage 14 , and the lower side is inclined to the specific belt 33A. It protrudes further to the outside (in a direction away from the laminated film adsorption stage 14). The peeling roller 30 is rotated in the direction indicated by the solid arrow in (b) of Fig. 4, and the conveyer belt 33 is conveyed in the same direction. At this time, the conveyor belt 33 enters from the upper side of the groove 39 provided in the separating portion 37 as shown in (a) of FIG. 3 and (b) of FIG. 4, and is separated from the inner side of the lower separating portion 37. The driven roller 31 is then reached. As a result, the release film 4 peeled off by the peeling roller 30 is conveyed to the lower side by the conveyance belt 33, and is separated by the separation plate 36 from the peeling roller 30 and the conveyance belt 33, and is removed. Next, the peeling method of the release film will be described in detail with reference to FIGS. 5, 6, and 7.

Release film peeling method

Fig. 5 is a flow chart showing the operation of the release film peeling method in the embodiment, and Fig. 6 is an operation explanatory view showing the main operation of the release film peeling method in the embodiment, which is shown later, and Fig. 7 is a view showing An enlarged view of the peeling and removing operation of the film 4. The operation flow chart of Fig. 5 will be described with reference to Figs. 6 and 7. First, as shown in (a) of Fig. 6, the laminated film 1 is supplied to the laminated film adsorption stage 14, and the release film 4 side is vacuum-adsorbed (step S1). The supply of the laminated film 1 to the laminated film adsorption stage 14 is performed by the supply unit 21 (refer to Fig. 2). At this stage, the pre-peeling roller 13 and the adsorption head 16 stand by at a predetermined position above the laminated film 1 and the release film peeling roll portion 15.

After the laminated film 1 is vacuum-adsorbed on the laminated film adsorption stage 14, as shown in FIG. 6(b), the laminated film adsorption stage 14 is moved in the X (-) direction (step S2), and stacked. Before the X (-) side end portion of the layer film 1 reaches the lower side of the pre-peeling roll 13, the pre-peeling roll 13 is lowered to a position where it can abut against the laminated film 1 (step S3). Further, as shown in (c) of Fig. 6, when the laminated film adsorption stage 14 is moved in the X (-) direction, the laminated film 1 is pressed by the pre-peeling roll 13, so that only the adhesive is contained. The front end portion of the cover film 2 of the layer 3 floats from the cover film 2. The front end portion of the floating cover film 2 is preliminarily peeled off.

The appearance of the pre-stripping is enlarged as shown in (d) of Fig. 6. The cover film 2 and the adhesive layer 3 have an adhesive force which is not easily peeled off, and since the release film 4 and the adhesive layer are in close contact but do not adhere, once pressed by the pre-peeling roller 13, due to the release film 4 The vacuum is adsorbed on the laminated film adsorption stage 14 so that the cover film 2 side is instantaneously floated from the release film 4, so that the adhesive layer 3 comes into contact with the air. Since the adhesive layer 3 is thermosetting, it is possible to easily peel off even if it is in contact with air once and the release film 4 is pressed again without adhering. The floating range at this time is referred to as a pre-peeling edge portion L, and the operation of floating the release film 4 by the pre-peeling roller 13 is referred to as a pre-peeling edge portion forming operation (step S4). The pressing force of the pre-peeling roller 13 may be such a degree that it is substantially uniformly contacted with the laminated film 1 during the movement, without actively causing the cover film 2 to warp upward. On the X (+) side of the pre-stripping edge portion L, the release film 4 is not floated. The pre-peeling roller 13 is rotated by the frictional force with the cover film 2 by the movement of the laminated film 1 in the X (-) direction in a state in which it is in contact with the laminated film 1.

After the laminated film 1 is positioned below the pre-peeling roll 13, as shown in FIG. 6(e), the pre-peeling roll 13 is raised to the standby position (the position away from the laminated film 1) (step S5). The laminated film adsorption stage 14 is stopped (step S6), and the adsorption head 16 is lowered to abut against the laminated film 1 (step S7), and the cover film 2 side of the laminated film 1 is vacuum-adsorbed (step S8). After the laminated film 1 is vacuum-adsorbed, the adsorption of the laminated film 1 on the laminated film adsorption stage 14 is released (step S9). Next, as shown in (f) of FIG. 6, the adsorption head 16 after the adsorption of the laminated film 1 is raised to a height position (a position at which the release film 4 can be peeled off) capable of abutting on the upper surface of the separation roller 30 ( Step S10).

Thereafter, as shown in (g) of Fig. 6, the laminated film adsorption stage 14 is moved in the X (+) direction (step S11), and the laminated film adsorption stage is used when the peeling roll 30 comes into contact with the release film 4 The movement of the cover film (the cover film 2) starts the rotation of the peeling roller 30, and the peeling of the release film 4 is started by the adhesiveness of the peeling roller 30 (step S12). Then, by moving the laminated film adsorption stage 14 (covering film 2) in the X (+) direction, the release film 4 is separated from the cover film 2 and then removed (step S13). The removal of the release film 4 will be described in detail with reference to FIG.

As shown in Fig. 7, the peeling roller 30 is rotated by the movement in the X (+) direction of the laminated film adsorption stage 14, and the release film 4 is peeled off by the adhesiveness of the surface. At this time, the peeling roller 30 entrains the release film 4 only under the structure of the peeling roller 30, but by the conveyor belt 33, the peeling roller 30 can be peeled off without the release film 4 being wound up. The film 4 is conveyed to the lower side (the direction of movement is indicated by a broken line). Since the separation plate 36 is provided during the conveyance of the release film 4, the release film 37 can be separated from the separation roller 30 and the conveyor belt 33 by the separation portion 37 and then removed. Since the peeling roller 30 is rotated by friction with the release film 4, it is difficult to generate static electricity. After the peeling and removing operation of the release film 4 (step S13) is completed, the laminated film adsorption stage 14 returns to the initial position of the next laminated film 1 to be fed.

The operation of the adsorption head 16 after the completion of the peeling and removing operation of the release film 4 (step S13) will be described with reference to Fig. 2 . The adsorption head unit 12 moves to the circuit board (not shown) which is the target of adhesion of the cover film 2 in the Y (-) direction in a state in which the coating film 16 after the peeling of the release film 4 is adsorbed by the adsorption head 16 . The position is pasted, and the cover film 2 is heated and crimped onto the circuit substrate. The circuit board moves to the lower side of the adsorption head 16 along the guide rail 22 in a state of being vacuum-adsorbed by the substrate adsorption stage 20, and stops at the pasting position. Therefore, the release film peeling device 10 is a device having a function of separating the release film 4 from the laminated film 1 and removing it, and bonding the cover film 2 to the substrate. The circuit substrate after the cover film 2 is adhered is further crimped by the pressure roller 23 when returning to the removal position.

The release film peeling method described above is to be released at a single laminated film 1 composed of a cover film 2 having a thermosetting adhesive layer 3 and a release film 4 laminated on the adhesive layer 3. The peeling method of peeling and removing the film 4 has an operation of vacuum-adsorbing the release film 4 side of the laminated film 1 to the laminated film adsorption stage 14; and the laminated film 1 is oriented in one direction (X (-) direction) While moving, the pre-peeling roll 13 is rotated while the laminated film 1 is pressed from the side of the cover film 2, and the end portion of the cover film 2 is floated from the release film 4 to form a pre-form. The operation of peeling off the edge portion L; releasing the adsorption of the laminated film 1 to the laminated film adsorption stage 14, and vacuum-adsorbing the entire surface of the cover film 2 of the laminated film 1 to the adsorption head 16; 16 is a state in which the laminated film 1 is adsorbed, and after the release roller 30 having adhesiveness is brought into contact with the release film 4, the laminated film adsorption stage 14 and the peeling roll 30 are oriented in the other direction (X (+ ))) moving to rotate the peeling roller 30, thereby removing the release film 4 from the laminated film 1 Peeling and removal of the winding operation simultaneously.

According to this release film peeling method, the pre-peeling edge portion L is formed by pressing the pre-peeling roll 13 while being pressed from the cover film 2 of the laminated film 1, and is covered by the adsorption head 16. After the entire surface of the layer film 2 is adsorbed, the peeling roller 30 is rotated to peel the release film 2 from the laminated film 1. As a result, in the single-layer laminated film 1, the release film 4 can be peeled off from the laminated film 1 and removed without causing warpage or damage.

In the operation of forming the pre-peeled edge portion L (step S4), the cover film 2 is pressed while the pre-peeling roller 13 is rotated to float the end portion of the cover film 2 from the release film 4, and the air is made Contact with the adhesive layer 3.

The thermosetting adhesive layer 3 can form a pre-stripping edge portion L by utilizing the property that the surface of the thermosetting adhesive layer cannot be adhered again if it is not heated, and once peeled off from the pre-stripping edge portion L, The release film 4 can be easily peeled off from the laminated film 1.

In the operation in which the adsorption head 16 vacuum-adsorbs the laminated film 1, the entire surface of the laminated film 1 containing the pre-peeled edge portion L is adsorbed by the adsorption head 16. As a result, warpage of the cover film 2 can be prevented when the release film 4 is peeled off. Further, since the peeling roller 30 does not come into contact with the cover film 2, it is possible to prevent the cover film 2 from being damaged.

In the operation of peeling and removing the release film 4, the release film 4 after peeling is peeled off by the peeling roller 30, and the release film 4 after peeling is conveyed by the conveyance belt 33, and is removed from the peeling roller 30 by the separation plate 36. And the release film 4 is peeled off and removed at the conveyor belt 33.

When the release film 4 is peeled off using only the peeling roller 30, the release film 4 is caught in the peeling roller 30 to cause difficulty in removal. Therefore, if the release film 4 which has been peeled off by the peeling roller 30 is transported using the conveyor belt 33 and is separated from the peeling roller 30 and the conveyor belt 33 by the separating plate 36, it can be prevented in the release film 4 In the case of being wound around the peeling roller 30, the release film 4 is peeled off from the cover film 2 and removed.

The release film peeling apparatus 10 includes a laminated film adsorption stage 14 that can reciprocate in one direction (X direction) while vacuum-adsorbing the release film 4 side of the laminated film 1, and a pre-peeling roll 13 from the cover layer The film 4 is pressed against the laminated film 1 and is formed on the end portion of the laminated film 1 on the traveling direction side while being rotated in one direction (X (-) direction) of the laminated film adsorption stage 14 while being rotated. The pre-peeling edge portion L is formed; the adsorption head 16 vacuum-adsorbs the cover film 2 side of the laminated film 1, and the release film peeling roll portion 15 is integrated with the laminated film adsorption stage 14 and moved, and is adsorbed. In the state where the laminated film 1 is adsorbed, the peeling roller 30 and the release film 4 are in contact with each other in the pre-peeled edge portion L, and the other direction (X( +) Direction) Movement The release film 4 is peeled off from the laminated film 1 while the peeling roller 30 is rotated.

According to the release film peeling apparatus 10 described above, the pre-peeling roll 13 is rotated from the side of the cover film 2 of the laminated film 1 while the end portion of the cover film 2 is removed from the release film 4 The floating portion is formed to form the pre-stripping edge portion L. After the entire surface of the cover film 2 is adsorbed by the adsorption head 16, the peeling roller 16 is rotated and the release film 4 is wound from the laminated film. Stripped. As a result, in the single-layer laminated film 1, the cover film 2 is not warped. Alternatively, since the release film peeling roll portion is not in contact with the cover film 2, the release film 4 can be peeled off from the laminated film 1 without damage.

The pre-peeling roller 13 is longer than the width dimension (Y-direction dimension) perpendicular to the moving direction of the laminated film 1, and has adhesiveness on the surface, and the laminate film 1 is pressed while being moved by the laminated film adsorption stage 14. The structure to rotate. The pre-separation roller 13 thus constituted is rotated by relatively moving while pressing the laminated film 1 without offset, so that the cover film 2 can be vacuumed from the laminated film adsorption stage 14. The release film 4 after the adsorption floats and forms a pre-stripping edge portion L.

The release film peeling roll portion 15 is composed of a peeling roll 30 which is longer than the width dimension of the laminated film 1 and has adhesiveness on the surface; the driven roller 31 is disposed on the lower side of the peeling roll 30, and is in the ratio of the peeling roll 30 is further away from the position of the laminated film adsorption stage 14; and the conveyor belt 33 is configured by joining the peeling roller 30 and the driven roller 31 and conveying the peeled release film 4, wherein the peeling roller 30 and the driven roller 31 are disposed. A plurality of grooves 34 and 35 are formed, and a conveyor belt 33 is attached to each of the plurality of grooves, and the conveyor belt 33 is attached to the inside of the outer circumferential surface of the separation roller 30.

The release film peeling roll portion 15 configured as described above is peeled off continuously and almost uniformly by the entire width of the release film 4 by the peeling roller 30 having adhesiveness, and the release film is peeled off after being peeled off. The belt is conveyed to the lower by the belt 33. Therefore, the release film 4 after being peeled off can be separated from the peeling roller 30 by the conveyance belt 33 without being wound around the peeling roller 30, and then conveyed.

Further, the release film peeling roller portion 15 has a separation plate 36 that is disposed to intersect the conveyance belt 33 between the separation roller 30 and the driven roller 31, and the driven roller 31 side is outward from the intersection portion toward the outside of the conveyor belt 33. protruding. The release film 4 when peeled off by the peeling roller 30 is conveyed to the lower side (the direction away from the peeling roller 30) by the conveyance belt 33, and can be removed from the conveyance belt 33 by the separation plate 36 and removed.

The adsorption head 16 is preferably placed in a state where the cover film 2 after the release film 4 is peeled off is moved to the position of the circuit substrate (not shown) to which the cover film 2 is adhered, and the cover layer is applied. The film 2 is heated and pressed to a predetermined position on the circuit board. According to this configuration, the release film peeling device 10 can realize the peeling function of peeling off and removing the release film from the laminated film 1, and also has the function of attaching the cover film 2 to the circuit board by heating and pressure bonding.

However, the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within a scope that can achieve the object of the present invention are also included in the present invention.

In the above-described embodiment, an example in which the release film 4 is peeled off and removed from the single laminated film 1 is described, but the number of the laminated film to be peeled off is not limited to one. It is able to further increase its number. For example, in the laminated film adsorption stage 14, a plurality of sheets may be arranged in the Y direction, or in the X direction, or in the Y direction, and in the X direction, and the release film may be peeled off from each of them. In this case, the circuit board corresponding to the arrangement of the laminated film is arranged on the substrate adsorption stage 20, and the laminated film after peeling off the release film can be adhered.

Further, in the above-described embodiment, although the laminated film 1 is peeled off from the release film 4 after being formed into a single piece, for example, the long laminated film wound on the roll may be supplied in the feed. Before laminating the film adsorption stage 14, it is cut and fed to a single laminated film.

Further, in the above-described embodiment, the release film peeling roll unit 15 and the laminated film adsorption stage can be integrally moved in the X direction. However, after the adsorption head 16 adsorbs the laminated film 1, it may be separated. The film peeling roll portion 15 is configured to be independent and movable with respect to the laminated film adsorption stage. In this case, after the adsorption head 16 adsorbs the laminated film 1, the laminated film adsorption stage is moved to the initial position, and thereafter, if the release film peeling roll portion 15 is moved, the embodiment can be used. The release film 4 was peeled off and removed by the same method.

1‧‧‧Laminated film

2‧‧‧ Cover film

3‧‧‧Binder layer

4‧‧‧ release film

10‧‧‧ Release film peeling device

11‧‧‧Laminated film adsorption station unit

12‧‧‧Adsorption head unit

13‧‧‧Pre-disbonding roller

14‧‧‧Laminated film adsorption station

15‧‧‧ Release film peeling roller

16‧‧‧Adsorption head

17‧‧‧Z-axis drive unit

18‧‧‧Y-axis drive unit

19‧‧‧θ axis drive unit

20‧‧‧Substrate adsorption station

21‧‧‧Feeding unit

22‧‧‧ rails

23‧‧‧Crimp rolls

24‧‧‧Adsorption hole formation area

25‧‧‧Adsorption holes

26‧‧‧ Base of the base

27‧‧‧ Negative pressure chamber

28‧‧‧Connectors

30‧‧‧ peeling roller

31‧‧‧ driven roller

32‧‧‧Support board

33, 33A‧‧‧ conveyor belt

34, 35, 39‧‧ ‧ ditch

36‧‧‧Separation board

37‧‧‧Separation Department

38‧‧‧ fixed department

L‧‧‧Pre-stripping edge

S1~S13‧‧‧Steps

Fig. 1 is a cross-sectional view showing the structure of the laminated film 1.

Fig. 2 is a perspective view showing the structure of the release film peeling device 10 in the embodiment.

Fig. 3 is a view showing the structure of the laminated film adsorption stage unit 11.

Fig. 4 is a view of the laminated film adsorption stage unit 11 and the release film peeling roll unit 15 viewed from the Y (+) direction.

Fig. 5 is a flow chart showing the operation of the release film peeling method in the embodiment.

Fig. 6 is an operation explanatory view showing a simplified operation of the main operation of the release film peeling method in the embodiment.

Fig. 7 is a view showing the peeling removal operation of the release film 4 enlarged and shown later.

Claims (9)

A release film peeling method for peeling and removing a release film from a single-layer laminated film composed of a cover film having a thermosetting adhesive layer and a release film laminated on the adhesive layer, The method includes: vacuum-adsorbing the release film side of the laminated film to a laminated film adsorption stage; and moving the laminated film from the cover film by using a pre-peeling roll while moving the laminated film in one direction The pre-peeling roller is rotated while the side is pressed, and the end portion of the cover film is floated from the release film to form a pre-peeled edge portion; the laminated film is released from the laminated film adsorption stage Adsorbing, and vacuum-adsorbing the entire surface of the cover film of the laminated film to the adsorption head; and contacting the release roller having adhesiveness to the release state in a state where the adsorption head adsorbs the laminated film After the film, the peeling roll is rotated by moving the laminated film adsorption stage and the peeling roll in the other direction, thereby performing the operation of peeling and removing the release film while being wound from the laminated film. The release film peeling method according to claim 1, wherein in the operation of forming the pre-peeled edge portion, the cover film is pressed while the pre-peel roll is rotated to make the cover film The end floats from the release film and exposes the air to the adhesive layer. The release film peeling method according to the first or the second aspect of the invention, wherein, in the operation in which the adsorption head is vacuum-adsorbing the laminated film, the pre-stripping edge is contained by the adsorption head The entire surface of the laminated film is adsorbed. The release film peeling method according to any one of the items 1 to 3, wherein, in the operation of peeling and removing the release film, the release film is peeled off using the peeling roller. At the same time, the release film after peeling is conveyed by a conveyance belt, and the release film is separated from the peeling roll and the transfer belt by a separation plate. A release film peeling device which peels and removes a release film from a single-layer laminated film composed of a cover film having a thermosetting adhesive layer and a release film laminated on the adhesive layer, The method includes: a laminated film adsorption stage capable of reciprocating in one direction while vacuum-adsorbing the release film side of the laminated film; and a pre-peeling roll, pressing the laminated film from the side of the cover film, and The laminated film adsorption stage moves in one direction to rotate, and a pre-peeled edge portion is formed on the end portion of the laminated film on the traveling direction side; and an adsorption head that coats the cover film side of the laminated film The vacuum adsorption and the release film peeling roll portion are movable integrally with the laminated film adsorption stage, and are peeled off in the pre-peeled edge portion in a state where the adsorption head is adsorbed by the laminated film. The roller abuts against the release film, and the release film is peeled off from the laminated film while the peeling roller is rotated by moving in the other direction of the laminated film adsorption stage. The release film peeling device according to claim 5, wherein the pre-peeling roll is longer than a width dimension perpendicular to a moving direction of the laminated film, and the surface has adhesiveness, and the laminated film is used. The structure is rotated by the movement of the laminated film adsorption stage while being pressed. The release film peeling device according to claim 5, wherein the release film peeling roll portion comprises: the peeling roll, which has a longer width dimension than the laminated film, and has a surface adhered a driven roller disposed on a lower side of the peeling roller and at a position farther from the laminated film adsorption stage than the peeling roller; and a conveyor belt that joins the peeling roller and the driven roller and conveys the peeled off In the release film, the separation roller and the driven roller are formed with a plurality of grooves, and the conveyor belt is attached to each of the plurality of grooves, and the conveyor belt is attached to the inside of the outer circumferential surface of the separation roller. The release film peeling device according to any one of the preceding claims, wherein the release film peeling roll portion has a separation plate disposed at the peeling roller and the driven plate The rollers intersect the conveyor belt, and the driven roller side protrudes from the intersection toward the outside of the conveyor belt. The release film peeling device according to claim 5, wherein the adsorption head has a state in which the cover film is adhered to the cover film in a state in which the cover film is peeled off after the release film is peeled off. The position of the circuit board is disposed, and the cover film is heated and pressed to a predetermined position of the circuit board.