TW201924929A - Ceramic device and manufacturing method thereof - Google Patents

Abstract

A ceramic device including a ceramic material, a patterned metal structure and a surface activation material. A surface of the ceramic material at least includes a first surface and a second surface which are non-coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.

Description

Ceramic element and manufacturing method thereof

The disclosure relates to a component and a method for manufacturing the same, and more particularly, to a ceramic component and a method for manufacturing the same.

At present, in the process of manufacturing a ceramic element with a metal circuit, the metal circuit has a large position accuracy error.

For example, in the current manufacturing method of ceramic filter, the silver paste is first dipped on the ceramic material, and the silver paste is coated on the ceramic material and the surface of the through-hole in the ceramic material by rapid rotation, and then Silver is solidified on the ceramic material and on the surface of the through-holes by high temperature sintering. Next, the ultra-precision machining process is used to grind and remove the silver metal on the surface to be patterned, and then perform silver paste screen printing and silver paste sintering to complete the electrode and metal structure surface of the filter.

The above method uses the silver paste screen printing technology and the metal paste sintering technology to produce a metal circuit of a ceramic filter. However, due to the high temperature sintering of metal lines, circuit size and position deviations (about 5% to 14% position accuracy error) will cause large antenna frequency offsets, and subsequent manual antenna trimming will depend on a lot of manual work.

The present disclosure provides a ceramic element and a manufacturing method thereof, which can make a metal circuit have good position accuracy.

The present disclosure proposes a ceramic component including a ceramic material, a patterned metal structure, and a surface activation material. The surface of the ceramic material includes at least a non-coplanar first surface and a second surface, and has a plurality of depressions on the surface of the ceramic material. The patterned metal structure is disposed on the first surface and the second surface. The surface activating material is disposed on the recessed surface and is located at the interface between the ceramic material and the patterned metal structure.

The present disclosure proposes a method for manufacturing a ceramic element, including the following steps. Provide ceramic materials. A plurality of depressions are formed on the surface of the ceramic material. After the depression is formed, the surface of the ceramic material is subjected to a surface activation treatment. A first metal layer is formed on the surface of the surface-treated ceramic material by an electroless plating process. A patterning process is performed on the first metal layer to form a first patterned metal layer.

In order to make the above-mentioned features and advantages of the present disclosure more comprehensible, embodiments are described below in detail with reference to the accompanying drawings.

1A to 1D are schematic diagrams of a manufacturing process of a ceramic element according to an embodiment of the disclosure. Fig. 2 is a cross-sectional view taken along a line I-I 'in Fig. 1D.

Referring to FIG. 1A, a ceramic material 100 is provided. 100 is a ceramic material, calcium titanate (CaTiO _3), magnesium titanate (MgTiO _3), zinc titanate (ZnTiO _3), or combinations thereof. There may be at least one through hole 102 in the ceramic material 100. In this embodiment, four through holes 102 in the ceramic material 100 are taken as an example for description, but the disclosure is not limited thereto. The aspect ratio of the through hole 102 is, for example, 12 or less. In one embodiment, the aspect ratio of the through hole 102 is, for example, 10 or less.

The surface of the ceramic material 100 may include at least a non-coplanar first surface S1 and a second surface S2. The first surface S1 and the second surface S2 may be adjacent to each other or not. In this embodiment, the first surface S1 and the second surface S2 are described by taking the example of being adjacent to each other as an example. In addition, although the shape of the ceramic material 100 is described by taking a hexahedron as an example, the disclosure is not limited thereto. Those skilled in the art can adjust the shape of the ceramic material 100 according to product design requirements.

Next, a small number of depressions 104 (indicated by "dot" in the figure) are formed on the surface of the ceramic material 100. In addition, a recess 104 may be formed on the surface of the through hole 102. The surface roughness formed by the depressions 104 on the ceramic material 100 is, for example, less than 5 microns. A method of forming the depression 104 is, for example, a wet etching process of the ceramic material 100. For example, the ceramic material 100 can be immersed in an etchant to form a plurality of depressions 104 on the surface of the ceramic material 100. The etchant used in the wet etching process is, for example, hydrofluoric acid, a mixture of sulfuric acid and hydrogen peroxide, or a buffer oxide layer etchant (BOE), and the concentration of the etchant is, for example, 1% to 20%. The time for which the ceramic material 100 is immersed in the etchant is, for example, 1 minute to 10 minutes.

Then, referring to FIG. 1B, after the recess 104 is formed, a surface activation treatment is performed on the surface of the ceramic material 100. Thereby, a surface-active material 106 can be formed on the surface of the depression 104. In addition, the surface activating material 106 can cover the surface of the ceramic material 100 more comprehensively. The surface-active material is, for example, palladium, gold, platinum, silver, or a compound thereof. The surface activation treatment includes reacting a reactant and a reducing agent on the surface of the ceramic material 100. The reactants are, for example, palladium chloride (PdCl ₂ ), palladium acetate, polyvinylpyrrolidone-palladium (PVP-Pd), polyvinyl alcohol-palladium (PVA-Pd), gold chloride, polyvinylpyrrolidone-platinum (PVP-Pt ), Polyvinyl alcohol-platinum (PVA-Pt), polyvinylpyrrolidone-silver (PVP-Ag), polyvinyl alcohol-silver (PVA-Ag), or a combination thereof, and the reducing agent is, for example, stannous chloride, formaldehyde or Sodium phosphite.

Next, referring to FIG. 1C, a first metal layer 108 is formed on the surface of the ceramic material 100 subjected to the surface activation treatment by an electroless plating process. The first metal layer 108 may be further formed on a surface of the through hole 102. The surface-active material 106 can assist the first metal layer 108 to adhere to the surface of the ceramic material 100. The material of the first metal layer 108 is, for example, copper, nickel, silver, or gold.

In addition, the method for forming the first metal layer 108 may further include performing an electroplating process after the electroless plating process to increase the thickness of the first metal layer 108 to a target thickness. In another embodiment, the first metal layer 108 having a target thickness can also be formed directly by an electroless plating process.

After that, referring to FIG. 1D, a patterning process is performed on the first metal layer 108 to form a first patterned metal layer 108 a. The patterning process is, for example, a laser patterning process. In this embodiment, a portion of the surface of the ceramic material 100 can be exposed by removing a portion of the first metal layer 108 and a portion of the surface activating material 106 by a patterning process. It should be noted that, in this embodiment, a part of the surface of the ceramic material 100 is exposed through the patterning process, and there are still a plurality of depressions 104. However, in another embodiment, a portion of the first metal layer 108 may be removed by a patterning process, and a portion of the surface-active material 106 is exposed. In another embodiment, part of the first metal layer 108, part of the surface activating material 106, and the recess 104 may be removed by a patterning process to expose a part of the surface of the ceramic material 100, wherein the exposed part of the surface is not With depression 104. The changes in the above embodiments are caused by the depth of removal controlled by the patterning process, and can be adjusted according to actual needs, and are not limited to those listed.

By the above method, the ceramic element 10 can be manufactured. In the ceramic element 10, a material combination of the surface activation material 106 and the first patterned metal layer 108a may be selected according to a process design requirement. For example, the surface-active material 106 may be palladium, and the material of the first patterned metal layer 108a may be silver.

Based on the above embodiments, it can be known that in the manufacturing method of the ceramic element 10 described above, since the first patterned metal layer 108a is formed on the surface of the surface-treated ceramic material 100 by an electroless plating process and a patterning process, it is not borrowed. It is formed by a high-temperature sintering process, so the metal lines in the first patterned metal layer 108a have good position accuracy.

Hereinafter, the ceramic element 10 according to the embodiment will be described with reference to FIGS. 1D and 2.

1D and FIG. 2, the ceramic element 10 includes a ceramic material 100, a patterned metal structure, and a surface activation material 106. The ceramic element 10 may be a filter (eg, a high-frequency filter) or an antenna for a global positioning system. In this embodiment, the ceramic element 10 is described by taking a filter as an example. The surface of the ceramic material 100 includes at least a non-coplanar first surface S1 and a second surface S2, and the surface of the ceramic material 100 has a small number of depressions 104. The ceramic material 100 may have a through hole 102. When the ceramic element 10 is a filter, one of the first surface S1 and the second surface S2 may be an electrode surface, and the other of the first surface S1 and the second surface S2 may be a signal structure surface.

The patterned metal structure may be a single-layer structure or a multi-layer structure. In this embodiment, the patterned metal structure is described using the single-layered structure of the first patterned metal layer 108a as an example. The first patterned metal layer 108 a (patterned metal structure) is disposed on the first surface S1 and the second surface S2, and may be disposed on other surfaces of the ceramic material 100. In addition, a portion of the first patterned metal layer 108 a (patterned metal structure) may be disposed on a surface of the through hole 102. The material of the first patterned metal layer 108a is, for example, copper, nickel, silver, or gold.

The surface activation material 106 is disposed on the surface of the recess 104 and is located at the interface between the ceramic material 100 and the first patterned metal layer 108 a (patterned metal structure). The surface-active material 106 is, for example, palladium, gold, platinum, silver, or a compound thereof. At the interface between the ceramic material 100 and the first patterned metal layer 108a (patterned metal structure), based on the total amount of the ceramic material 100 and the surface activating material 106, the content of the surface activating material 106 is, for example, 5 weight percent (wt%). ) Or less, for example, from 0.1 wt% to 5 wt%.

In addition, the materials, specifications, forming methods, or effects of the components in the ceramic element 10 have been described in detail in the above embodiments, so they will not be repeated here.

Based on the above embodiments, it can be known that, in the ceramic element 100, since the surface activating material 106 is disposed on the surface of the recess 104 of the ceramic material 100, the electroless plating process and the patterning process can be used in the ceramic material 100 having the surface activating material 106. The first patterned metal layer 108a (patterned metal structure) is formed on the surface, and a high temperature sintering process is not required. Therefore, the metal circuit in the first patterned metal layer 108a (patterned metal structure) can have good position accuracy.

FIG. 3A to FIG. 3D are schematic diagrams of a manufacturing process of the ceramic component subsequent to FIG. 1C according to another embodiment of the present disclosure. Fig. 4 is a cross-sectional view taken along a line II-II 'in Fig. 3D. The same components in FIG. 3A and FIG. 1C have been described in the above embodiment, so the description will not be repeated here.

Referring to FIG. 3A, after the first metal layer 108 of FIG. 1C is formed and before the patterning process is performed, a second metal layer 110 is formed on the first metal layer 108. The second metal layer 110 can protect the first metal layer 108 to prevent the first metal layer 108 from being oxidized. The thickness of the first metal layer 108 may be greater than the thickness of the second metal layer 110. A method for forming the second metal layer 110 is, for example, a plating method or an electroless plating method. The material of the second metal layer 110 is, for example, a plated metal or an electroless plated metal. The electroplated metal is, for example, copper, nickel, silver, gold, platinum, tin, or an alloy thereof, and the electroless metal is, for example, copper, nickel, silver, gold, platinum, or palladium.

Referring to FIG. 3B, a laser patterning process is performed on the second metal layer 110 to form a second patterned metal layer 110a. In this embodiment, a part of the surface of the first metal layer 108 may be exposed by removing a portion of the second metal layer 110 by a laser patterning process.

Referring to FIG. 3C, an etching process is performed on the first metal layer 108 by using the second patterned metal layer 110a as a mask. In this embodiment, part of the first metal layer 108 and part of the surface activating material 106 can be removed by an etching process, and a part of the surface of the ceramic material 100 can be exposed. The etching process is, for example, a wet etching process, and the etchant used is, for example, phosphoric acid, sulfuric acid, or a mixture of the above materials and hydrogen peroxide. Thereby, the first metal layer 108 can be patterned, and a first patterned metal layer 108 a (see FIG. 4) is formed between the second patterned metal layer 110 a and the ceramic material 100.

In this embodiment, although the patterning process performed on the first metal layer 108 is described by taking the above method as an example, the disclosure is not limited thereto. For example, a laser patterning process may be directly performed on the second metal layer 110 and the first metal layer 108 located below it in FIG. 3A to form the second patterned metal layer 110a and located below it in FIG. 3C. The first patterned metal layer 108a (see FIG. 4).

Referring to FIG. 3D, a third patterned metal layer 112 can be selectively formed on the second patterned metal layer 110a by an electroless plating process. The third patterned metal layer 112 may be used to increase solderability. In this embodiment, the third patterned metal layer 112 is only formed on the second patterned metal layer 110a, and is not formed on the surface of the ceramic material 100 exposed by the second patterned metal layer 110a. The material of the third patterned metal layer 112 is, for example, an electroplated metal or an electroless metal, such as gold, nickel, silver, tin, platinum, or an alloy thereof.

By the above method, the ceramic element 20 can be manufactured. In the ceramic element 20, a material combination of the surface activation material 106, the first patterned metal layer 108a, the second patterned metal layer 110a, and the third patterned metal layer 112 may be selected according to process design requirements. For example, the surface activation material 106 may be palladium, the material of the first patterned metal layer 108 may be copper, the material of the second patterned metal layer 110a may be nickel, and the material of the third patterned metal layer 112 may be gold.

Based on the above embodiments, it can be known that, in the manufacturing method of the ceramic element 20, the patterned metal structure 114 is formed on the surface of the surface-treated ceramic material 100 by an electroplating or electroless plating process and a patterning process. Formed by a high-temperature sintering process, the metal lines in the patterned metal structure 114 have good position accuracy.

Hereinafter, the ceramic element 20 of the above embodiment will be described with reference to FIGS. 3D and 4.

Please refer to FIG. 1D, FIG. 2, FIG. 3D and FIG. 4 at the same time. The ceramic element 20 is similar to the ceramic element 10, but it should be noted that the patterned metal structure 114 of the ceramic element 20 is a multilayer structure. The patterned metal structure 114 includes a first patterned metal layer 108 a and a second patterned metal layer 110 a, and may further include a third patterned metal layer 112. The patterned metal structure 114 is disposed on the first surface S1 and the second surface S2, and may be disposed on other surfaces of the ceramic material 100. In addition, a portion of the patterned metal structure 114 may be disposed on a surface of the through-hole 102. The surface activation material 106 is located at an interface between the ceramic material 100 and the patterned metal structure 114.

The first patterned metal layer 108 a is disposed on the first surface S1 and the second surface S2, and may be disposed on other surfaces of the ceramic material 100. In addition, a portion of the first patterned metal layer 108 a may be disposed on a surface of the through-hole 102. The material of the first patterned metal layer 108a is, for example, copper, nickel, silver, or gold.

The second patterned metal layer 110a is disposed on the first patterned metal layer 108a. The thickness of the first patterned metal layer 108a may be greater than the thickness of the second patterned metal layer 110a. The material of the second patterned metal layer 110a is, for example, a plated metal or an electroless plated metal. The electroplated metal is, for example, copper, nickel, silver, gold, platinum, tin, or an alloy thereof, and the electroless metal is, for example, copper, nickel, silver, gold, platinum, or palladium.

The third patterned metal layer 112 is disposed on the second patterned metal layer 110a. The material of the third patterned metal layer 112 is, for example, an electroplated metal or an electroless metal, such as gold, nickel, silver, tin, platinum, or an alloy thereof.

In addition, similar components in the ceramic element 20 and the ceramic element 10 are denoted by the same symbols, and descriptions thereof are omitted.

Based on the above embodiment, it can be known that, in the ceramic element 20, since the surface-active material 106 is disposed on the surface of the recess 104 of the ceramic material 100, the electroless plating process and the patterning process can be used in the ceramic material 100 having the surface-active material 106. The patterned metal structure 114 is formed on the surface, and a high-temperature sintering process is not required. Therefore, the metal lines in the patterned metal structure 114 can have good position accuracy.

＜ Experimental example ＞

<Example 1: Production of ceramic filter>

First, a wet etching process is performed, and the calcium magnesium titanate ceramic material is immersed in a 2% hydrofluoric acid (HF) solution for 10 minutes to form micro-etched depressions on the surface of the ceramic material, and the surface roughness Ra can be made From 0.2 microns to 0.5 microns. Next, a surface activation treatment is performed, a ceramic material having a plurality of depressions formed therein is immersed in a solution containing stannous chloride (reducing agent) and palladium chloride (reactant) to perform surface activation treatment, so that palladium atoms (surface activation material) ) Attached to a plurality of depressions in the micro-etching. Then, an electroless plating process is performed, and the surface-activated ceramic material is put into an electroless copper solution for 30 minutes, so that copper metal is deposited on the surface of the ceramic material and the through-hole having an aspect ratio of 8, and the electroplated copper is used. During the process, copper metal was deposited again, so that the thickness of the copper metal reached the target value. Next, electroplated nickel or electroless nickel is deposited on the copper metal, and then a laser patterning process is performed on the nickel layer. Then, the patterned nickel layer is used as a mask layer, and a mixture of phosphoric acid and hydrogen peroxide is used as an etchant to perform an etching process on the copper metal layer. Finally, an electroless gold plating process is performed on the nickel layer to obtain a ceramic filter.

<Example 2: Detection of surface activated materials>

FIG. 5A is a graph showing the results of detecting a surface-activated material on a ceramic material before surface activation treatment in a ceramic filter using a SEM / EDS. FIG. 5B is a graph showing the results of surface activation material detection on a ceramic material after surface activation treatment in a ceramic filter using SEM / EDS.

Scanning Electron Microscope / Energy Dispersive Spectrometer (SEM / EDS) was used to detect the surface activation material of the ceramic material before and after the surface activation treatment in the ceramic filter of Example 1. The results are shown in Figure 5A, Figure 5B, Tables 1 and 2 show.

Table 1 Composition of ceramic materials before surface activation treatment

Table 2 Composition of ceramic materials after surface activation treatment

As can be seen from FIG. 5A, FIG. 5B, Tables 1 and 2, before the ceramic material is subjected to the acid etching process, the composition of the ceramic material does not contain palladium atoms. After the ceramic material is subjected to the acid etching process and the surface activation treatment, the composition of the ceramic material contains 0.6% by weight of palladium atoms.

In summary, in the ceramic component and the manufacturing method thereof disclosed in the present disclosure, since the surface-activating material is disposed on the recessed surface of the ceramic material, the electroless plating process and the patterning process can be used to apply the ceramic on the surface-active material. A patterned metal structure is formed on the surface of the material, and a high temperature sintering process is not required. Therefore, the metal circuit in the patterned metal structure can have good position accuracy.

Although the present disclosure has been disclosed as above by way of example, it is not intended to limit the present disclosure. Any person with ordinary knowledge in the technical field should make some changes and modifications without departing from the spirit and scope of the present disclosure. The scope of protection of this disclosure shall be determined by the scope of the attached patent application.

100‧‧‧Ceramic materials

102‧‧‧through hole

104‧‧‧ Sag

106‧‧‧ surface activated materials

108‧‧‧ first metal layer

108a‧‧‧first patterned metal layer

110‧‧‧Second metal layer

110a‧‧‧second patterned metal layer

112‧‧‧ the third patterned metal layer

114‧‧‧patterned metal structure

S1‧‧‧First surface

S2‧‧‧Second surface

1A to 1D are schematic diagrams of a manufacturing process of a ceramic element according to an embodiment of the disclosure. Fig. 2 is a cross-sectional view taken along a line I-I 'in Fig. 1D. FIG. 3A to FIG. 3D are schematic diagrams of a manufacturing process of the ceramic component subsequent to FIG. 1C according to another embodiment of the present disclosure. Fig. 4 is a cross-sectional view taken along a line II-II 'in Fig. 3D. FIG. 5A is a diagram showing the results of detecting a surface-activated material on a ceramic material before surface activation treatment in a ceramic filter using a scanning electron microscope additional energy dispersive spectrometer (SEM / EDS). FIG. 5B is a graph showing the results of surface activation material detection on a ceramic material after surface activation treatment in a ceramic filter using SEM / EDS.

Claims (31)

A ceramic element includes: a ceramic material, wherein the surface of the ceramic material includes at least a non-coplanar first surface and a second surface, and has a plurality of depressions on the surface of the ceramic material; a patterned metal structure Is disposed on the first surface and the second surface; and a surface activating material is disposed on the recessed surfaces and is located at an interface between the ceramic material and the patterned metal structure. The scope of the patent application of the ceramic element Item 1, wherein the ceramic material comprises calcium titanate (CaTiO _3), magnesium titanate (MgTiO _3), zinc titanate (ZnTiO _3), or combinations thereof. The ceramic element according to item 1 of the patent application scope, wherein the first surface and the second surface are adjacent or non-adjacent to each other. The ceramic element according to item 1 of the scope of patent application, wherein the surface roughness formed by the recesses on the ceramic material is less than 5 microns. The ceramic element according to item 1 of the patent application scope, wherein the ceramic material has at least one through hole, and a portion of the patterned metal structure is disposed on a surface of the at least one through hole. The ceramic element according to item 5 of the scope of patent application, wherein the aspect ratio of the at least one through hole is 12 or less. The ceramic element according to item 1 of the application, wherein the patterned metal structure includes a first patterned metal layer. The ceramic element according to item 7 of the application, wherein a material of the first patterned metal layer includes copper, nickel, silver, or gold. The ceramic element according to item 7 of the patent application scope, wherein the patterned metal structure further includes a second patterned metal layer, wherein the second patterned metal layer is disposed on the first patterned metal layer. The ceramic element according to item 9 of the application, wherein the thickness of the first patterned metal layer is greater than the thickness of the second patterned metal layer. The ceramic element according to item 9 of the application, wherein a material of the second patterned metal layer includes an electroplated metal or an electroless metal. The ceramic element according to item 11 of the application, wherein the electroplated metal includes copper, nickel, silver, gold, platinum, tin, or an alloy thereof, and the electroless metal includes copper, nickel, silver, gold, platinum, or palladium . The ceramic element according to item 9 of the application, wherein the patterned metal structure further includes a third patterned metal layer, and the third patterned metal layer is disposed on the second patterned metal layer. The ceramic element according to item 13 of the application, wherein the material of the third patterned metal layer includes an electroplated metal or an electroless metal. The ceramic element according to item 14 of the application, wherein the plated or electroless metal includes gold, nickel, silver, tin, platinum, or an alloy thereof. The ceramic element according to item 1 of the patent application scope, wherein the surface-active material includes palladium, gold, platinum, silver, or a compound thereof. The ceramic element according to item 1 of the scope of patent application, wherein at the interface between the ceramic material and the patterned metal structure, the content of the surface activated material is 5wt based on the total amount of the ceramic material and the surface activated material %the following. The ceramic element according to item 1 of the patent application scope, wherein the ceramic element includes a filter or an antenna for a global positioning system. A method for manufacturing a ceramic element includes: providing a ceramic material; forming a plurality of depressions on the surface of the ceramic material; after forming the depressions, performing a surface activation treatment on the surface of the ceramic material; The manufacturing process forms a first metal layer on the surface of the ceramic material subjected to the surface activation treatment; and performs a patterning process on the first metal layer to form a first patterned metal layer. The method for manufacturing a ceramic element according to item 19 of the application, wherein the ceramic material has at least one through hole, and the first metal layer is further formed on a surface of the at least one through hole. The method for manufacturing a ceramic element according to item 19 of the scope of patent application, wherein the surface of the ceramic material includes at least a non-coplanar first surface and a second surface, and the first patterned metal layer is disposed on the first A surface and the second surface. The method for manufacturing a ceramic element according to item 21 of the application, wherein the first surface and the second surface are adjacent or non-adjacent to each other. The method for manufacturing a ceramic element according to item 19 of the scope of the patent application, wherein the method for forming the depressions includes performing a wet etching process on the ceramic material. The method for manufacturing a ceramic element according to item 19 of the application, wherein the surface activation treatment includes reacting a reactant and a reducing agent on the surface of the ceramic material, wherein the reactant includes palladium chloride and palladium acetate. , Polyvinylpyrrolidone-palladium, polyvinyl alcohol-palladium, gold chloride, polyvinylpyrrolidone-platinum, polyvinyl alcohol-platinum, polyvinylpyrrolidone-silver, polyvinyl alcohol-silver, or a combination thereof, and the reducing agent includes chlorine Stannous, formaldehyde or sodium phosphite. The method for manufacturing a ceramic element according to item 19 of the scope of the patent application, wherein the method for forming the first metal layer further includes performing an electroplating process after performing the electroless plating process. The method for manufacturing a ceramic element according to item 19 of the application, wherein the patterning process includes a laser patterning process. The method for manufacturing a ceramic element according to item 19 of the scope of patent application, further includes forming a second metal layer on the first metal layer before performing the patterning process. The method for manufacturing a ceramic element according to item 27 of the application, wherein the method for forming the second metal layer includes an electroplating method or an electroless plating method. The method for manufacturing a ceramic element according to item 27 of the application, wherein the patterning process includes performing a laser patterning process on the second metal layer and the first metal layer. The method for manufacturing a ceramic element as described in claim 27, wherein the patterning process includes: performing a laser patterning process on the second metal layer to form a second patterned metal layer; and The second patterned metal layer is used as a mask, and an etching process is performed on the first metal layer. The method for manufacturing a ceramic element according to item 30 of the scope of patent application, further includes forming a third patterned metal layer on the second patterned metal layer by the electroless plating process after the patterning process is performed.