TW201920592A - Thermally conductive composite material, and manufacturing method therefor - Google Patents

Thermally conductive composite material, and manufacturing method therefor Download PDF

Info

Publication number
TW201920592A
TW201920592A TW107140837A TW107140837A TW201920592A TW 201920592 A TW201920592 A TW 201920592A TW 107140837 A TW107140837 A TW 107140837A TW 107140837 A TW107140837 A TW 107140837A TW 201920592 A TW201920592 A TW 201920592A
Authority
TW
Taiwan
Prior art keywords
fiber
composite material
conductive composite
thermally conductive
thickness
Prior art date
Application number
TW107140837A
Other languages
Chinese (zh)
Other versions
TWI689580B (en
Inventor
延澤優樹
倉田功
Original Assignee
日商新日鐵住金高新材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商新日鐵住金高新材料股份有限公司 filed Critical 日商新日鐵住金高新材料股份有限公司
Publication of TW201920592A publication Critical patent/TW201920592A/en
Application granted granted Critical
Publication of TWI689580B publication Critical patent/TWI689580B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/022Mechanical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/027Thermal properties
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1626Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472Sheet interfaces
    • H05K7/20481Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/302Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54Yield strength; Tensile strength
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00Containers; Receptacles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The purpose of the present invention is to provide a thermally conductive composite material that is low cost and achieves both high hardness and heat dissipating properties. A thermally conductive composite material (1) includes a fiber reinforced resin material (2) which is sheet shaped and contains a continuous reinforcing fiber (f), and metal foil layers (3(3a, 3b)) which are integrally joined to both surfaces of the fiber reinforced resin material (2), and the thickness (T1) of the thermally conductive composite material is 0.07-1mm. The thickness (t2) of the fiber reinforced resin material (2) is at least 0.05mm to less than 1mm, the thickness (t3a, t3b) of the metal foil layers (3(3a, 3b)) is 0.009-0.1mm, and the tensile elasticity of the thermally conductive composite material (1) is at least 80GPa.

Description

導熱性複合材料及其製造方法    Thermally conductive composite material and manufacturing method thereof   

本發明係關於一種作為由智慧型手機、輸入板、可攜式電腦等所代表之資訊終端機器之殼體、殼體箱或移動型數位醫療用片匣或作為其他需要熱對策之電機器殼體等的補強板而使用之高剛性(高彈性)且具有高散熱特性,即導熱性之導熱性複合材料及其製造方法。 The present invention relates to a case, a case box, or a mobile digital medical cassette as an information terminal device represented by a smart phone, an input board, a portable computer, or the like, or other electrical machine cases that require thermal measures. A thermally conductive composite material with high rigidity (high elasticity) and high heat dissipation characteristics, such as thermal conductivity, which is used for a reinforcing plate such as a body, and a manufacturing method thereof.

現在,例如於智慧型手機、輸入板、可攜式電腦等資訊終端機器中,搭載電池、電路基板等之殼體、殼體箱、一體安裝於該殼體等之殼體表面材料、頂板等為了輕量化而使塑膠系材料成形從而製作之方法成為主流。例如,於圖1示出概略構成之智慧型手機100一般由搭載有電池、電路基板等之薄型箱狀的殼體(或者殼體箱)101,及安裝於殼體(或者殼體箱)101之具備顯示器、觸控面板之蓋體102構成。 At present, for example, in information terminal devices such as smart phones, input boards, and portable computers, a case, a case, a battery, a circuit board, and the like, a case surface material, a top plate, etc. integrally mounted on the case, etc. In order to reduce weight, a method of forming and manufacturing a plastic-based material has become mainstream. For example, as shown in FIG. 1, a smart phone 100 having a schematic configuration generally includes a thin box-shaped case (or case box) 101 on which a battery, a circuit board, and the like are mounted, and the case (or case box) 101 is mounted on the case. It has a cover body 102 including a display and a touch panel.

近年來,於上述般之資訊終端機器中,隨著CPU等之處理性能提高,因半導體裝置等之消耗電力增加而引起之電池的大型化與放熱量之增大迫不得已,因此,進一步強烈要求殼體(或者殼體箱)之剛性化及散熱性(導熱性)。 In recent years, in the above-mentioned information terminal devices, as the processing performance of the CPU and the like has increased, the increase in the battery size and the increase in heat generation caused by the increase in power consumption of semiconductor devices and the like have been unavoidable. The rigidity of the body (or case box) and heat dissipation (thermal conductivity).

以往,通常用作散熱構件之石墨片材等具有驚人之導熱率, 但價格極高,另外於剛性之方面存在問題。 Conventionally, graphite sheets and the like generally used as heat-radiating members have amazing thermal conductivity, but they are extremely expensive and have problems in terms of rigidity.

因此,專利文獻1提出有為了將積體電路所使用之半導體等加熱元件冷卻而使用碳纖維複合材料的混成之散熱板。該散熱板之碳纖維複合材料的導熱率存在異向性,因此於搭載半導體等加熱元件之碳纖維複合體的周圍接合高導熱性金屬而構成,碳纖維複合體之碳纖維係相對於搭載加熱元件之面垂直地單軸配向。 Therefore, Patent Document 1 proposes a heat sink composed of a carbon fiber composite material for cooling a heating element such as a semiconductor used in an integrated circuit. The thermal conductivity of the carbon fiber composite material of the heat sink is anisotropic, so it is formed by joining a highly thermally conductive metal around the carbon fiber composite body equipped with heating elements such as semiconductors. The carbon fiber of the carbon fiber composite body is perpendicular to the surface on which the heating element is mounted. Ground uniaxial alignment.

又,專利文獻2提出有利用接著劑將鋁平板接著於碳纖維強化塑膠成形品之底面部的導熱性複合成型品作為內置有高性能CPU之電腦的殼體,該碳纖維強化塑膠成形品具有箱形之長纖維顆粒。 In addition, Patent Document 2 proposes a thermally conductive composite molded product in which an aluminum flat plate is adhered to a bottom surface portion of a carbon fiber reinforced plastic molded product using an adhesive as a housing of a computer having a high-performance CPU. The carbon fiber reinforced plastic molded product has a box shape. Long fiber particles.

專利文獻1:日本特開2002-57259號公報 Patent Document 1: Japanese Patent Application Laid-Open No. 2002-57259

專利文獻2:日本特開平11-147286號公報 Patent Document 2: Japanese Patent Application Laid-Open No. 11-147286

亦根據上述專利文獻之記載所理解般,碳纖維強化複合材料所使用之強化纖維即碳纖維,於纖維軸方向上良好地傳遞熱量,但於與纖維軸成直角之方向上幾乎不傳遞熱量。因此,靠近碳纖維強化複合材料之熱源的表面之碳纖維在某種程度上有助於熱擴散,但相對於碳纖維強化複合材料之厚度方向上導熱率差,故遠離表面之內側的碳纖維幾乎不對熱擴散有助益。即,例如瀝青系碳纖維其本身之導熱率為100~600W/mK而顯示極高之數值,但存在如下問題:僅於纖維軸方向上發揮其能力而存在異向性,又,於製成使樹脂含浸於碳纖維中而製作之碳纖維強化複合材料之情形時,樹脂的導熱率之不良產生影響而無法獲得所需之導熱特性等。 It is also understood from the description of the above-mentioned patent documents that carbon fibers, which are reinforcing fibers used in carbon fiber reinforced composite materials, transmit heat well in the direction of the fiber axis, but hardly transmit heat in a direction perpendicular to the fiber axis. Therefore, the carbon fibers near the surface of the carbon fiber-reinforced composite material contribute to heat diffusion to some extent, but the thermal conductivity is poor relative to the thickness direction of the carbon fiber-reinforced composite material, so the carbon fibers far away from the surface hardly diffuse the heat. Helpful. That is, for example, the pitch-based carbon fiber has a very high thermal conductivity of 100 to 600 W / mK, but it has the following problems: it exhibits anisotropy only by exerting its ability in the direction of the fiber axis, and it is difficult to make it. In the case of a carbon fiber-reinforced composite material prepared by impregnating a carbon fiber with a resin, the poor thermal conductivity of the resin affects the desired thermal conductivity characteristics and the like.

又,上述專利文獻1所記載之使用碳纖維複合材料的混成之散熱板例如設成如下構成:於30mm見方、厚度2mm之銅片的中央部嵌入厚度2mm之碳纖維複合體,並於該碳纖維複合體上搭載加熱元件。又,專利文獻2所記載之碳纖維強化塑膠成形品例如將碳纖維強化塑膠成形品之厚度設為1.4mm,長纖維顆粒之重量平均纖維長設為0.38mm,鋁平板之厚度設為0.6mm。 In addition, the hybrid heat sink using a carbon fiber composite material described in the above-mentioned Patent Document 1 is configured, for example, as follows: a carbon fiber composite body having a thickness of 2 mm is embedded in a central portion of a copper sheet having a thickness of 30 mm square and 2 mm thick, and the carbon fiber composite body Equipped with heating elements. The carbon fiber-reinforced plastic molded product described in Patent Document 2 has, for example, a thickness of the carbon fiber-reinforced plastic molded product of 1.4 mm, a weight average fiber length of long fiber particles of 0.38 mm, and a thickness of an aluminum flat plate of 0.6 mm.

專利文獻1、2所記載之混成之散熱板或者碳纖維強化塑膠成形品無法將其自身用作智慧型手機等之殼體蓋或者用以補強殼體之補強板。 The mixed heat sink or the carbon fiber reinforced plastic molded product described in Patent Documents 1 and 2 cannot be used as a case cover of a smartphone or the like or a reinforcing plate for reinforcing the case.

因此,本發明人等為了改善使用上述習知之碳纖維複合材料的混成之散熱板或者碳纖維強化塑膠成形品之上述問題點,進行了大量研究實驗,結果發現,藉由將成為與放熱體之接觸部的表面設為金屬,並於內側配置高剛性之碳纖維強化複合材料般的纖維強化複合材料,或者於內側配置金屬,於其兩側配置碳纖維強化複合材料般之纖維強化複合材料,並將金屬之厚度及纖維強化複合材料之厚度設計為最佳,藉此可利用作為等向性材料之金屬的導熱性向纖維強化複合材料之纖維軸方向以外的面內方向促進熱擴散而於面內方向及厚度方向均保持良好之散熱特性(導熱率),並且可確保高剛性。 Therefore, the present inventors carried out a large number of research experiments in order to improve the above-mentioned problems of the heat sink or the carbon fiber reinforced plastic molded product using the conventional carbon fiber composite material, and found that the contact portion with the heat radiation body will be The surface is made of metal, and a fiber-reinforced composite material, such as a carbon fiber reinforced composite material, is arranged on the inside. The thickness and the thickness of the fiber-reinforced composite material are optimally designed so that the thermal conductivity of the metal, which is an isotropic material, can be used to promote heat diffusion in an in-plane direction other than the fiber axis direction of the fiber-reinforced composite material in the in-plane direction and thickness. Good heat dissipation (thermal conductivity) is maintained in all directions, and high rigidity is ensured.

即,本發明之目的在於提供一種低成本且可同時實現高剛性與散熱性之導熱性複合材料。 That is, an object of the present invention is to provide a thermally conductive composite material that can achieve both high rigidity and heat dissipation at a low cost.

上述目的係利用本發明之導熱性複合材料而達成。簡而言之,根據本發明之第一態樣,提供一種導熱性複合材料,其具有含連續之 強化纖維的片狀纖維強化樹脂材料及一體接合於上述纖維強化樹脂材料之兩面的金屬箔層,厚度被設為0.07~1mm,其特徵在於:上述纖維強化樹脂材料之厚度被設為0.05mm以上,未達1mm,上述金屬箔層之厚度被設為0.009~0.1mm,上述導熱性複合材料之拉伸彈性模數為80GPa以上。根據本發明之第二態樣,提供一種導熱性複合材料,其具有金屬箔層及一體接合於上述金屬箔層的兩面之含連續之強化纖維的片狀纖維強化樹脂材料,厚度被設為0.12~1mm者,其特徵在於:上述纖維強化樹脂材料之厚度被設為0.05mm以上,未達1mm,上述金屬箔層之厚度被設為0.009~0.1mm,上述導熱性複合材料之拉伸彈性模數為80GPa以上。 The above object is achieved by using the thermally conductive composite material of the present invention. In short, according to a first aspect of the present invention, there is provided a thermally conductive composite material having a sheet-like fiber-reinforced resin material containing continuous reinforcing fibers and metal foil layers integrally bonded to both sides of the fiber-reinforced resin material The thickness is set to 0.07 to 1 mm, which is characterized in that the thickness of the fiber-reinforced resin material is set to 0.05 mm or more and less than 1 mm, the thickness of the metal foil layer is set to 0.009 to 0.1 mm, and the thermally conductive composite material is The tensile elastic modulus is 80 GPa or more. According to a second aspect of the present invention, there is provided a thermally conductive composite material having a metal foil layer and a sheet-shaped fiber-reinforced resin material containing continuous reinforcing fibers integrally bonded to both sides of the metal foil layer, and the thickness is set to 0.12 Those with a thickness of ~ 1 mm are characterized in that the thickness of the fiber-reinforced resin material is set to 0.05 mm or more and less than 1 mm, the thickness of the metal foil layer is set to 0.009 to 0.1 mm, and the elastic modulus of the thermally conductive composite material is stretched. The number is 80 GPa or more.

根據上述本發明之第一實施態樣,上述纖維強化樹脂材料以纖維體積含有率計,含有20%以上之瀝青系碳纖維,該瀝青系碳纖維具有100W/mK以上的強化纖維之導熱率及400GPa以上之拉伸彈性模數。 According to the first aspect of the present invention, the fiber-reinforced resin material contains at least 20% of pitch-based carbon fibers in terms of fiber volume content, and the pitch-based carbon fibers have a thermal conductivity of reinforcing fibers of 100 W / mK or more and 400 GPa or more. The tensile elastic modulus.

根據上述本發明之另一實施態樣,上述纖維強化樹脂材料之強化纖維係瀝青系碳纖維、PAN(polyacrylonitrile,聚丙烯腈)系碳纖維或玻璃纖維或者將上述纖維混合2種以上而成者。 According to another aspect of the present invention, the fiber-reinforced resin-based reinforced fiber-based pitch-based carbon fiber, PAN (polyacrylonitrile) -based carbon fiber, or glass fiber, or a mixture of two or more of the above-mentioned fibers.

根據上述第1及第2本發明之另一實施態樣,上述纖維強化樹脂材料係將連續之上述強化纖維沿一方向拉齊並含浸樹脂而形成,及/或於至少沿2軸方向所織成之織物含浸樹脂而形成。 According to another aspect of the first and second aspects of the present invention, the fiber-reinforced resin material is formed by drawing continuous impregnated fibers in one direction and impregnating the resin, and / or is woven in at least two directions. The resulting fabric is impregnated with resin.

根據上述第1及第2本發明之另一實施態樣,上述纖維強化樹脂材料係將連續之上述強化纖維沿一方向拉齊並含浸樹脂而形成之片 材,至少於2軸方向上積層進行製作。 According to another aspect of the first and second aspects of the present invention, the fiber-reinforced resin material is a sheet formed by continuously aligning the reinforcing fibers in one direction and impregnated with the resin, and is laminated in at least two axes. Production.

根據上述第1及第2本發明之另一實施態樣,上述金屬箔層由具有50W/mK以上之導熱率之金屬製作。 According to another aspect of the first and second aspects of the present invention, the metal foil layer is made of a metal having a thermal conductivity of 50 W / mK or more.

根據上述本發明之另一實施態樣,上述導熱性複合材料之厚度為0.12~0.5mm。 According to another aspect of the present invention, the thickness of the thermally conductive composite material is 0.12 to 0.5 mm.

根據本發明之第三態樣,提供一種於纖維強化樹脂材料之兩面一體化有金屬箔層的導熱性複合材料之製造方法,該導熱性複合材料具有含連續之強化纖維的片狀纖維強化樹脂材料及一體接合於上述纖維強化樹脂材料之兩面的金屬箔層,該導熱性複合材料之厚度被設為0.07~1mm、拉伸彈性模數為80GPa以上,其特徵在於:(a)準備將連續之強化纖維至少沿一方向拉齊排列並含浸樹脂進行半硬化之纖維單位面積重量被設為25~600g/m2、纖維體積含有率被設為20~70%之至少1片預浸體片,及厚度被設為0.009~0.1mm之金屬箔,(b)將上述金屬箔按壓至上述預浸體片之兩面而一體地積層,(c)其後,將上述預浸體片硬化而製成纖維強化樹脂材料。 According to a third aspect of the present invention, a method for manufacturing a thermally conductive composite material with a metal foil layer integrated on both sides of a fiber-reinforced resin material is provided. The thermally conductive composite material has a sheet-shaped fiber-reinforced resin containing continuous reinforcing fibers. Material and metal foil layers integrally bonded to both sides of the fiber-reinforced resin material, the thickness of the thermally conductive composite material is set to 0.07 to 1 mm, and the tensile modulus of elasticity is 80 GPa or more, which is characterized by: (a) ready to be continuous At least one prepreg sheet with the unit weight of the reinforcing fibers aligned in at least one direction and impregnated with resin for semi-hardening is set to 25 to 600 g / m 2 and the fiber volume content rate is set to 20 to 70%. , And a metal foil having a thickness of 0.009 to 0.1 mm, (b) pressing the metal foil onto both sides of the prepreg sheet and laminating it integrally, (c) thereafter, hardening the prepreg sheet Fiber-reinforced resin material.

根據本發明之第四態樣,提供一種於金屬箔層之兩面一體化有纖維強化樹脂材料的導熱性複合材料之製造方法,該導熱性複合材料具有金屬箔層及一體接合於上述金屬箔層的兩面之含連續之強化纖維的片狀纖維強化樹脂材料,該導熱性複合材料之厚度被設為0.12~1mm,拉伸彈性模數為80GPa以上,其特徵在於:(a)準備將連續之強化纖維至少沿一方向拉齊排列並含浸樹脂進行半硬化之纖維單位面積重量被設為25~600g/m2、纖維體積含有率被設為20 ~70%之至少1片預浸體片、及厚度被設為0.009~0.1mm之金屬箔,(b)將上述預浸體片按壓至上述金屬箔之兩面而一體地積層,(c)其後,將上述預浸體片硬化而製成纖維強化樹脂材料。 According to a fourth aspect of the present invention, a method for manufacturing a thermally conductive composite material in which a fiber-reinforced resin material is integrated on both sides of a metal foil layer is provided. The thermally conductive composite material has a metal foil layer and is integrally bonded to the metal foil layer. A sheet-shaped fiber-reinforced resin material containing continuous reinforcing fibers on both sides of the sheet. The thickness of the thermally conductive composite material is set to 0.12 to 1 mm and the tensile modulus of elasticity is 80 GPa or more. It is characterized by: (a) preparing continuous The weight per unit area of the fibers where the reinforcing fibers are aligned in at least one direction and impregnated with resin for semi-hardening is set to 25 to 600 g / m 2 , and the fiber volume content rate is set to at least one prepreg sheet of 20 to 70%, And a metal foil having a thickness of 0.009 to 0.1 mm, (b) the prepreg sheet is pressed against both sides of the metal foil to be laminated integrally, and (c) the prepreg sheet is then hardened to form Fiber-reinforced resin material.

根據本發明,具備高剛性與散熱性,僅藉由貼附於被補強體便可防止因被補強體之外力所導致之變形而防止裝置內部損壞,且不形成熱斑便可進行擴散。 According to the present invention, it has high rigidity and heat dissipation, and can be prevented from being damaged due to deformation caused by external force of the reinforced body only by being attached to the reinforced body, and can be spread without forming hot spots.

1‧‧‧導熱性複合材料 1‧‧‧ thermally conductive composite material

2‧‧‧纖維強化樹脂材料 2‧‧‧ fiber reinforced resin material

3‧‧‧金屬箔層 3‧‧‧ metal foil layer

10‧‧‧纖維強化片材 10‧‧‧ fiber reinforced sheet

10PG‧‧‧預浸體片 10PG‧‧‧Prepreg

101‧‧‧被補強體 101‧‧‧ Reinforced

圖1係表示智慧型手機之概略構成的立體圖,表示利用本發明之導熱性複合材料補強智慧型手機之殼體或者殼體箱之態樣。 FIG. 1 is a perspective view showing a schematic configuration of a smart phone, and shows a state in which a case or a case of a smart phone is reinforced by using the thermally conductive composite material of the present invention.

圖2(a)係製成為由本發明之導熱性複合材料所補強之被補強體的智慧型手機之殼體或者殼體箱的概略構成剖面圖,圖2(b)係本發明之導熱性複合材料之一實施例的概略構成放大剖面圖。又,圖2(c)係本發明之導熱性複合材料之另一實施例的概略構成放大剖面圖。 FIG. 2 (a) is a schematic cross-sectional view of a casing or a case of a smart phone made of a reinforced body reinforced with a thermally conductive composite material of the present invention, and FIG. 2 (b) is a thermally conductive composite of the present invention An enlarged cross-sectional view of a schematic configuration of an example of a material. FIG. 2 (c) is an enlarged sectional view showing a schematic configuration of another embodiment of the thermally conductive composite material of the present invention.

圖3(a)係表示接合金屬箔層之前的預浸體片(纖維強化樹脂材料)、強化纖維片材之一實施例的立體圖,圖3(b)係說明預浸體片之積層態樣之一例的圖。 FIG. 3 (a) is a perspective view showing an example of a prepreg sheet (fiber-reinforced resin material) and a reinforced fiber sheet before the metal foil layer is bonded, and FIG. 3 (b) is a view showing a laminated state of the prepreg sheet Figure of an example.

圖4(a)、(b)係說明本發明之導熱性複合材料之製造方法的概略構成圖。 4 (a) and 4 (b) are schematic configuration diagrams illustrating a method for producing a thermally conductive composite material according to the present invention.

圖5(a)及圖5(b)分別係用以說明導熱性複合材料之試驗樣本之尺寸形狀的俯視圖及剖面圖,圖5(c)係用以測試試驗樣本之散熱性之溫度測量方法的圖。 Fig. 5 (a) and Fig. 5 (b) are a top view and a sectional view, respectively, for explaining the size and shape of a test sample of a thermally conductive composite material, and Fig. 5 (c) is a temperature measurement method for testing the heat dissipation of the test sample. Illustration.

以下,根據圖式對本發明之導熱性複合材料進而詳細地進行說明。 Hereinafter, the thermally conductive composite material of the present invention will be described in detail with reference to the drawings.

實施例1 Example 1

如上述般,圖1表示智慧型手機100之概略構成,表示藉由以本發明之導熱性複合材料1所形成之補強板來補強智慧型手機100之殼體或者殼體箱(即被補強體)101的底板部分101a之態樣。 As described above, FIG. 1 shows a schematic configuration of the smart phone 100, and shows that the housing or the case box of the smart phone 100 (that is, the body to be reinforced) is reinforced by the reinforcing plate formed by the thermally conductive composite material 1 of the present invention. ) 101 The state of the bottom plate portion 101a.

圖2(a)係表示製成由本發明之導熱性複合材料1所補強之被補強體的智慧型手機之殼體或者殼體箱101之概略構成的剖面圖,圖2(b)係本發明之導熱性複合材料1之一實施例的概略構成放大剖面圖。再者,與圖1不同,於圖2(a)中被補強體101之底板部分101a位於上方而被圖示。圖2(c)係其後作為實施例2進行說明的本發明之導熱性複合材料1之另一實施例的概略構成放大剖面圖。 FIG. 2 (a) is a cross-sectional view showing a schematic configuration of a casing or a casing 101 of a smart phone made of a reinforced body reinforced with the thermally conductive composite material 1 of the present invention, and FIG. 2 (b) is the present invention. An enlarged sectional view showing a schematic configuration of an embodiment of the thermally conductive composite material 1. In addition, unlike FIG. 1, the bottom plate portion 101 a of the reinforced body 101 in FIG. 2 (a) is located above and illustrated. Fig. 2 (c) is an enlarged cross-sectional view showing a schematic configuration of another embodiment of the thermally conductive composite material 1 of the present invention, which will be described later as Example 2.

首先,若參照圖2(b),則於本實施例中,本發明之導熱性複合材料1具有含連續之強化纖維的片狀纖維強化樹脂材料2及一體接合於該纖維強化樹脂材料2之兩面的金屬箔層3(3a、3b)。根據本發明,若亦參照圖3,則藉由導熱性複合材料1之熱擴散,基本而言,係藉由纖維強化樹脂材料2及金屬箔層3而實現纖維強化樹脂材料2之強化纖維f的纖維軸方向(圖3中為X-X方向)之熱擴散,與強化纖維f之纖維軸方向交叉(正交)的方向(圖3中為Y-Y方向)之熱擴散由金屬箔層3進行。 First, referring to FIG. 2 (b), in this embodiment, the thermally conductive composite material 1 of the present invention includes a sheet-shaped fiber-reinforced resin material 2 containing continuous reinforcing fibers and a fiber-reinforced resin material 2 integrally bonded to the fiber-reinforced resin material 2. Metal foil layers 3 (3a, 3b) on both sides. According to the present invention, if also referring to FIG. 3, the thermal diffusion of the thermally conductive composite material 1 basically realizes the reinforcing fiber f of the fiber-reinforced resin material 2 by the fiber-reinforced resin material 2 and the metal foil layer 3. The thermal diffusion in the direction of the fiber axis (direction XX in FIG. 3), and the direction crossing (orthogonal) to the direction of the fiber axis of the reinforcing fiber f (direction YY in FIG. 3) are performed by the metal foil layer 3.

又,導熱性複合材料1所需之散熱性藉由導熱性複合材料1 及各構成構件2、3之厚度設計而達成。即,於本發明中,導熱性複合材料1之厚度方向(圖3中為Z-Z方向)的導熱藉由如下之構成而達成:相對於纖維強化樹脂材料2的強化纖維f正交之方向(圖3中為Y-Y方向)的導熱率之不良難以產生影響之最佳纖維強化樹脂材料2與金屬箔層3之構成。 The heat dissipation required for the thermally conductive composite material 1 is achieved by designing the thickness of the thermally conductive composite material 1 and each of the constituent members 2 and 3. That is, in the present invention, the thermal conductivity in the thickness direction of the thermally conductive composite material 1 (ZZ direction in FIG. 3) is achieved by a structure orthogonal to the direction of the reinforcing fibers f of the fiber-reinforced resin material 2 (FIG. (3 in the YY direction). The optimum fiber-reinforced resin material 2 and the metal foil layer 3 have a poor thermal conductivity.

即,若參照表示本發明之一實施例之圖2(b),則將導熱性複合材料1之厚度(T1)設為1mm以下,通常設為0.07~1mm(0.07mm≦T1≦1mm)。若厚度(T1)超過1mm,則如本實施例般,於將導熱性複合材料1用作作為被補強體之例如智慧型手機的殼體(或者殼體箱)101之補強板之情形時,會過度佔有被補強體101之內空間,為了收容智慧型手機之主要構件,作為被補強體101之智慧型手機之殼體等必然會增大,總重量亦增大,而有損小型化、輕量化。又,若將厚度(T1)設為未達0.07mm,則難以達成本發明目標之作為補強板的高剛性,又,纖維強化樹脂材料2、金屬箔層3會變得極薄而無法利用現有之原材料製作,導致成本增高。較佳將導熱性複合材料1之厚度(T1)設為0.12~0.5mm。 That is, referring to FIG. 2 (b) showing an embodiment of the present invention, the thickness (T1) of the thermally conductive composite material 1 is set to 1 mm or less, and usually 0.07 to 1 mm (0.07 mm ≦ T1 ≦ 1 mm). If the thickness (T1) exceeds 1 mm, as in this embodiment, when the thermally conductive composite material 1 is used as a reinforcing plate such as a casing (or casing) 101 of a smart phone, The space inside the reinforced body 101 will be excessively occupied. In order to accommodate the main components of the smart phone, the housing of the smart phone as the reinforced body 101 will inevitably increase, and the total weight will also increase, which will damage the miniaturization, Lightweight. In addition, if the thickness (T1) is less than 0.07 mm, it will be difficult to achieve the high rigidity of the reinforcing plate as the object of the invention, and the fiber-reinforced resin material 2 and the metal foil layer 3 will become extremely thin and cannot be used. The production of raw materials leads to higher costs. The thickness (T1) of the thermally conductive composite material 1 is preferably set to 0.12 to 0.5 mm.

又,根據本發明者等人之實驗研究的結果,可知關於導熱性複合材料1,為了獲得所需之拉伸剛性(拉伸彈性模數×截面面積)而需要將拉伸彈性模數設定為至少大於鋁之拉伸彈性模數(70GPa)的80GPa以上。若拉伸彈性模數未達80GPa,則無法獲得用以補強之充分剛性。 From the results of experimental research by the inventors, it can be seen that the thermally conductive composite material 1 needs to have a tensile modulus of elasticity in order to obtain the required tensile rigidity (tensile modulus of elasticity × cross-sectional area). At least 80 GPa greater than the tensile elastic modulus (70 GPa) of aluminum. If the tensile elastic modulus is less than 80 GPa, sufficient rigidity for reinforcement cannot be obtained.

以下,對本發明之導熱性複合材料1之各構成構件進而詳細地進行說明。 Hereinafter, each constituent member of the thermally conductive composite material 1 of the present invention will be described in more detail.

(纖維強化樹脂材料) (Fiber-reinforced resin material)

片狀纖維強化樹脂材料2之厚度(t2)被設為0.05mm以上 未達1mm(0.05mm≦t2<1mm),若厚度(t2)為1mm以上,則存在導致散熱性惡化之問題,若厚度(t2)未達0.05mm,則難以達成作為補強板之高剛性,又,纖維強化樹脂材料2變得極薄而無法利用現有之原材料製作,導致成本增高等問題。較佳將纖維強化樹脂材料2之厚度(t2)設為0.1~0.46mm。 The thickness (t2) of the sheet-shaped fiber-reinforced resin material 2 is set to be 0.05 mm or more and less than 1 mm (0.05 mm ≦ t2 <1 mm). If the thickness (t2) is 1 mm or more, there is a problem that the heat dissipation property is deteriorated. (t2) If it is less than 0.05 mm, it is difficult to achieve high rigidity as a reinforcing plate, and the fiber-reinforced resin material 2 becomes extremely thin and cannot be manufactured using existing raw materials, leading to problems such as increased costs. The thickness (t2) of the fiber-reinforced resin material 2 is preferably set to 0.1 to 0.46 mm.

將纖維強化樹脂材料2製成以纖維體積含有率(Vf)計含有20%以上之瀝青系碳纖維的纖維強化複合材料,該瀝青系碳纖維之導熱率設為100W/mK以上、拉伸彈性模數設為400GPa以上。詳細內容於下文中進行敍述,於本發明中,將纖維體積含有率(Vf)設為20~70%,較佳設為40~65%。即根據本實施例,於使用瀝青系碳纖維之情形時,纖維體積含有率20%之纖維強化樹脂材料2的拉伸彈性模數設為400GPa×纖維體積含有率(Vf)20%=80GPa。即,現狀為於纖維強化樹脂材料2使用瀝青系碳纖維作為強化纖維之情形時獲得最大之導熱率(散熱性)及剛性。藉由使用此構成之纖維強化樹脂材料2,可獲得根據本發明之拉伸彈性模數設為80GPa以上的導熱性複合材料1。 The fiber-reinforced resin material 2 is made of a fiber-reinforced composite material containing 20% or more of pitch-based carbon fibers in terms of fiber volume fraction (Vf). The pitch-based carbon fibers have a thermal conductivity of 100 W / mK or more and a tensile elastic modulus. It is set to 400 GPa or more. The details are described below. In the present invention, the fiber volume fraction (Vf) is set to 20 to 70%, preferably 40 to 65%. That is, according to this embodiment, when pitch-based carbon fibers are used, the tensile elastic modulus of the fiber-reinforced resin material 2 having a fiber volume content rate of 20% is set to 400 GPa × fiber volume content rate (Vf) 20% = 80 GPa. That is, the present situation is that when the pitch-based carbon fiber is used as the reinforcing fiber in the fiber-reinforced resin material 2, the maximum thermal conductivity (heat dissipation) and rigidity are obtained. By using the fiber-reinforced resin material 2 having this structure, a thermally conductive composite material 1 having a tensile elastic modulus of 80 GPa or more according to the present invention can be obtained.

纖維強化樹脂材料2係將樹脂R含浸於連續之強化纖維f中進行製作,作為強化纖維f,可最佳地使用碳纖維,尤其如上述般,較佳為瀝青系碳纖維。根據所要求之補強板、即導熱性複合材料1之規格,亦可使用於拉伸彈性模數及導熱率之方面劣於瀝青系碳纖維之PAN系碳纖維。又,根據情形,除使用碳纖維以外,亦可使用於拉伸彈性模數及導熱率之方面更劣於碳纖維之玻璃纖維。當然,亦可將該等纖維混合而使用。 The fiber-reinforced resin material 2 is produced by impregnating a resin R with continuous reinforcing fibers f. As the reinforcing fibers f, carbon fibers can be used optimally. As described above, pitch-based carbon fibers are preferred. According to the specifications of the required reinforcing plate, that is, the thermally conductive composite material 1, PAN-based carbon fibers that are inferior to pitch-based carbon fibers in terms of tensile elastic modulus and thermal conductivity can also be used. In addition, depending on the case, in addition to carbon fibers, glass fibers that are inferior to carbon fibers in terms of tensile elastic modulus and thermal conductivity can also be used. Of course, these fibers may be mixed and used.

此處,若表示可於本發明中使用之強化纖維之拉伸彈性模數 及導熱率,則如表1所示。 Table 1 shows the tensile elastic modulus and thermal conductivity of the reinforcing fibers that can be used in the present invention.

又,可於本發明中使用之纖維強化樹脂材料2如圖3(a)所示,係使用如下方法製成之預浸體片10PG而製作:將樹脂R含浸於將沿纖維軸方向連續之上述般的強化纖維f沿一方向拉齊而構成為片狀之強化纖維片材10S中,並使之半硬化(B階段化)而成。 Moreover, as shown in FIG. 3 (a), the fiber-reinforced resin material 2 that can be used in the present invention is prepared by using a prepreg sheet 10PG prepared by impregnating a resin R with a resin continuous in a fiber axis direction. The above-mentioned reinforcing fibers f are aligned in one direction to form a sheet-like reinforcing fiber sheet 10S, and are semi-hardened (B-staged).

較佳使用預浸體片10PG之纖維單位面積重量為25~600g/m2者,碳纖維之纖維體積含有率(Vf)如上述般設為20%以上。可視需要將預浸體片10PG積層複數片而使用。該預浸體片10PG於硬化後,如上述般形成厚度(t2)為0.05mm以上且未達1mm、較佳為0.1~0.46mm之纖維強化樹脂材料2。 It is preferable to use a prepreg sheet having a fiber basis weight of 25 to 600 g / m 2 , and the fiber volume fraction (Vf) of the carbon fiber is set to 20% or more as described above. If necessary, a plurality of prepreg sheets 10PG are laminated and used. After the prepreg sheet 10PG is cured, the fiber-reinforced resin material 2 having a thickness (t2) of 0.05 mm or more and less than 1 mm, and preferably 0.1 to 0.46 mm is formed as described above.

於上述說明中,作為將強化纖維f沿一方向拉齊而製作之UD形狀者進行了說明,亦可視需要以強化纖維f相互交叉之方式積層複數片預浸體片10PG而使用。即,可以沿強化纖維f之方向至少2軸方向、根據情形沿3軸、4軸方向配向之方式,積層將強化纖維f沿一方向拉齊所製作之UD形狀之預浸體片10PG而製作。例如,如圖3(b)所示,可將3片強化纖維f於0°方向上配向之預浸體片10PG(0°)、強化纖維f於90°方向上配向之預浸體片10PG(90°)及強化纖維f於0°方向上配向之預浸體片10PG (0°)積層而製作。進而,雖未圖示,但亦可設為使用強化纖維f於+45°方向上配向之預浸體片10PG(+45°)與強化纖維f於-45°方向上配向之預浸體片10PG(-45°)代替上述強化纖維f於90°方向上配向之預浸體片10PG(90°)之3軸構成,或者亦可設為使用上述強化纖維f於90°方向上配向之預浸體片10PG(90°)以外,進而使用強化纖維f於+45°方向上配向之預浸體片10PG(+45°)與強化纖維f於-45°方向上配向之預浸體片10PG(-45°)之4軸構成。 In the above description, the UD shape produced by pulling the reinforcing fibers f in one direction has been described, and a plurality of prepreg sheets 10PG may be laminated and used so that the reinforcing fibers f cross each other as necessary. That is, the prepreg sheet 10PG of the UD shape can be produced by laminating the reinforcing fiber f in one direction along at least 2 axes in the direction of the reinforcing fiber f and 3 axes and 4 axes depending on the situation. . For example, as shown in FIG. 3 (b), three prepreg sheets 10PG (0 °) in which the reinforcing fiber f is oriented in the direction of 0 °, and 10 prepreg sheets 10PG in which the reinforcing fiber f is oriented in the direction of 90 ° (90 °) and reinforcing fiber f were laminated with 10PG (0 °) of prepreg sheets aligned in the direction of 0 °. Furthermore, although not shown, a prepreg sheet 10PG (+ 45 °) oriented in the direction of + 45 ° using reinforcing fiber f and a prepreg sheet oriented in the direction of -45 ° using reinforcing fiber f may be used. 10PG (-45 °) replaces the 3-axis structure of 10PG (90 °) of the prepreg sheet oriented in the 90 ° direction instead of the above-mentioned reinforcing fiber f, or it may be set as a pre-aligned orientation using the above-mentioned reinforcing fiber f in the 90 ° direction. In addition to the immersion sheet 10PG (90 °), the prepreg sheet 10PG (+ 45 °) oriented in the + 45 ° direction with the reinforcing fiber f and the prepreg sheet 10PG oriented in the -45 ° direction with the reinforcing fiber f (-45 °) 4-axis configuration.

進而,強化纖維片材10S亦可視需要製成為將1種或者多種強化纖維f織成而形成之例如平紋織物、斜紋織物、緞紋織物等織物(布)。進而,亦可將上述UD形狀者與布併用。 Further, the reinforcing fiber sheet 10S may be made into a fabric (cloth) such as a plain weave, a twill weave, or a satin weave formed by weaving one or more kinds of reinforcing fibers f as necessary. Furthermore, you may use the said UD shape together with cloth.

作為含浸樹脂(矩陣樹脂)R,較佳使用環氧樹脂、乙烯酯樹脂、MMA樹脂、不飽和聚酯樹脂或酚樹脂中之任一者。 As the impregnating resin (matrix resin) R, any of epoxy resin, vinyl ester resin, MMA resin, unsaturated polyester resin, or phenol resin is preferably used.

纖維強化樹脂材料2中之強化纖維f如上述般,例如於使用瀝青系碳纖維之情形時,重要的是以纖維體積含有率(Vf)計含有20%以上。通常設為20~70%。若強化纖維f之纖維體積含有率(Vf)未達20%,則存在纖維量少而無法獲得所需之剛性及散熱性之問題,若超過70%,則會產生樹脂不足而無法獲得原本之機械物性等問題。較佳將纖維體積含有率(Vf)設為40~65%之範圍。 The reinforcing fibers f in the fiber-reinforced resin material 2 are as described above. For example, when pitch-based carbon fibers are used, it is important to include 20% or more in terms of the fiber volume fraction (Vf). Usually set to 20 ~ 70%. If the fiber volume fraction (Vf) of the reinforcing fiber f is less than 20%, there is a problem that the amount of fiber is small and the required rigidity and heat dissipation property cannot be obtained. If it exceeds 70%, the resin is insufficient and the original Mechanical properties and other issues. The fiber volume fraction (Vf) is preferably set in a range of 40 to 65%.

(金屬箔層) (Metal foil layer)

金屬箔層3(3a、3b)係由鋁或者銅般具有200W/mK以上之導熱率的金屬製作。根據所要求之散熱性之程度,亦可使用劣於該等金屬材料之具有50~200W/mK的導熱率之例如鐵或鎳或黃銅等。進而,亦可由具有50~200W/mK之例如鋁合金等上述各金屬之合金製作。金屬箔 層3a、3b亦可根據導熱性複合材料1之形狀而設為相同之金屬,亦可設為不同之金屬。 The metal foil layer 3 (3a, 3b) is made of a metal such as aluminum or copper having a thermal conductivity of 200 W / mK or more. Depending on the required degree of heat dissipation, it is also possible to use, for example, iron or nickel or brass with a thermal conductivity of 50 to 200 W / mK inferior to these metal materials. Furthermore, it can also be made from an alloy of the above-mentioned metals such as aluminum alloys having 50 to 200 W / mK. The metal foil layers 3a and 3b may be the same metal or different metals depending on the shape of the thermally conductive composite material 1.

又,金屬箔層3(3a、3b)之厚度(t3a、t3b)分別設為0.009~0.1mm(0.009mm≦t3a、t3b≦0.1mm),若厚度(t3a、t3b)超過0.1mm,則金屬箔層3(3a、3b)之厚度(t3a、t3b)過厚,不會產生纖維強化樹脂材料2之拉伸彈性模數,從而於剛性之方面不利。又,由於通常金屬箔層3之密度高於纖維強化樹脂材料2,故隨著厚度(t3a、t3b)之增加,導熱性複合材料1之重量會增加。若厚度(t3a、t3b)未達0.009mm,則會產生無法利用現有之原材料製作而導致成本增高之問題。進而,由於材料過薄而會折彎或破損等,操作變得非常困難。較佳金屬箔層3(3a、3b)之厚度(t3a、t3b)分別為0.01~0.05mm。再者,根據導熱性複合材料1之形狀,金屬箔層3a、3b之厚度(t3a、t3b)可相同,又,亦可不同。 In addition, the thicknesses (t3a, t3b) of the metal foil layers 3 (3a, 3b) are set to 0.009 to 0.1mm (0.009mm ≦ t3a, t3b ≦ 0.1mm), respectively. If the thickness (t3a, t3b) exceeds 0.1mm, the metal The thickness (t3a, t3b) of the foil layer 3 (3a, 3b) is too thick, and the tensile elastic modulus of the fiber-reinforced resin material 2 is not generated, which is disadvantageous in terms of rigidity. In addition, since the density of the metal foil layer 3 is generally higher than that of the fiber-reinforced resin material 2, as the thickness (t3a, t3b) increases, the weight of the thermally conductive composite material 1 increases. If the thickness (t3a, t3b) is less than 0.009 mm, a problem arises that the existing raw materials cannot be used and the cost increases. Furthermore, since the material is too thin, it may be bent or broken, which makes handling extremely difficult. Preferably, the thicknesses (t3a, t3b) of the metal foil layers 3 (3a, 3b) are 0.01 to 0.05 mm. Furthermore, depending on the shape of the thermally conductive composite material 1, the thicknesses (t3a, t3b) of the metal foil layers 3a, 3b may be the same or different.

(製造方法) (Production method)

根據本發明,金屬箔層3(3a、3b)必需相對於纖維強化樹脂材料2一體成型。即,例如圖4(a)所示,將金屬箔層3(3a、3b)按壓至對強化纖維片材10S含浸樹脂R,尚未完全硬化之所謂預浸體片10PG的兩面並一體積層,視需要進行加熱而將樹脂R硬化。 According to the present invention, the metal foil layer 3 (3a, 3b) must be integrally formed with the fiber-reinforced resin material 2. That is, as shown in FIG. 4 (a), for example, the metal foil layer 3 (3a, 3b) is pressed onto both sides of a so-called prepreg sheet 10PG impregnated with the resin R impregnated with the reinforcing fiber sheet 10S, and a volume layer is formed. Heating is required to harden the resin R.

若於後接著,即使用接著劑將金屬箔層3(3a、3b)接著於預浸體片材10PG之含浸樹脂R完全硬化、即纖維強化樹脂材料2而製成一體之情形時,則擔心根據接著劑之厚度而接著層散熱性或剛性降低。又,難以進行金屬箔層3之接著前基底處理或確保接著劑塗佈量之均勻性,或者接著前基底處理自身繁雜。進而另外產生貼附之步驟而隨之成本增高。 If the metal foil layer 3 (3a, 3b) is adhered to the prepreg sheet 10PG using the adhesive, the resin R is completely hardened, that is, the fiber-reinforced resin material 2 is integrated into one body. Depending on the thickness of the adhesive, the heat dissipation property or rigidity of the adhesive layer is reduced. In addition, it is difficult to perform pre-substrate treatment before the metal foil layer 3 or to ensure uniformity of the amount of adhesive applied, or the pre-substrate treatment itself is complicated. In addition, a step of attaching is generated, and the cost increases accordingly.

(補強方法) (Reinforcement method)

如上述般製作之導熱性複合材料1例如係一體接合於智慧型手機殼體或者殼體箱(被補強體)101等(參照圖1)。 The thermally conductive composite material 1 produced as described above is, for example, integrally bonded to a smartphone case or a case box (reinforced body) 101 (see FIG. 1).

為了簡便地進行作業而準備治具等,例如,藉由接著劑、視情形藉由雙面膠帶等而一體接合於成為預先成型之殼體箱或外殼的頂面部之頂板等。於該情形時,藉由適當設定接著劑之厚度、材質而不會產生散熱性或剛性之降低。又,亦可藉由於智慧型手機殼體或者殼體箱101之成形時設置於成型模具,同時進行壓製成型而一體接合於被補強體101。 A jig or the like is prepared for easy operation. For example, it is integrally bonded to a top plate that becomes a top surface of a pre-molded case box or casing with an adhesive or a double-sided tape as appropriate. In this case, by appropriately setting the thickness and material of the adhesive, there is no reduction in heat dissipation or rigidity. In addition, it can also be integrally joined to the reinforced body 101 because it is set in a molding die during the molding of the smartphone case or the case box 101 and press-molded at the same time.

作為如上述般獲得之纖維強化塑膠製品之被補強體101,如上述般由其厚度(T1)設為0.07~1mm、拉伸彈性模數設為80GPa以上之具備高剛性與散熱性的補強體(即導熱性複合材料1)所補強,藉此,可有效地防止因外力導致之變形而防止裝置內部損壞,且不形成因收容於裝置內部的放熱源所引起之熱斑而可進行擴散。 As the reinforced body 101 of the fiber-reinforced plastic product obtained as described above, the reinforced body having high rigidity and heat dissipation is set as described above with a thickness (T1) of 0.07 to 1 mm and a tensile elastic modulus of 80 GPa or more. (That is, the thermally conductive composite material 1), thereby effectively preventing deformation due to external forces and preventing damage to the inside of the device, and it can spread without forming a hot spot caused by a heat radiation source housed inside the device.

(實驗例之說明) (Explanation of experimental examples)

繼而,為了證實本發明之導熱性複合材料1之作用效果,而製作各種試驗樣本,並對機械強度、散熱性進行性能試驗。於表2、表4中表示於本實驗例中使用之試驗樣本的材料、構成、各尺寸等,於表3、表5中表示試驗結果。 Then, in order to confirm the effect of the thermally conductive composite material 1 of the present invention, various test samples were made, and performance tests were performed on mechanical strength and heat dissipation. Tables 2 and 4 show the materials, structures, dimensions, etc. of the test samples used in this experimental example, and Tables 3 and 5 show the test results.

(1)實驗例1~4 (1) Experimental examples 1 to 4

(試驗樣本) (Test sample)

於實驗例1中,使用薄板狀之鋁(A5052)單質(金屬單質)。於實驗例2中,使用於瀝青系碳纖維之布(織物)中含浸有樹脂之碳纖維 強化樹脂(CFRP布)。於實驗例3中,使用於玻璃纖維之布(織物)中含浸有樹脂之玻璃纖維強化樹脂(GFRP布)及於將瀝青系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂的碳纖維強化樹脂(CFRP單向)疊合之玻璃-碳纖維接合複合材料(GFRP布-CFRP單向)。於實驗例4中,根據本發明之構成,使用以如下方法製作而成之纖維強化複合材料(金屬箔表層-CFRP單向芯):將銅箔一體成型於將瀝青系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂之碳纖維強化樹脂(CFRP單向)的兩面。 In Experimental Example 1, a thin plate-shaped aluminum (A5052) simple substance (metal simple substance) was used. In Experimental Example 2, a carbon fiber-reinforced resin (CFRP cloth) impregnated with a resin was used in a cloth (fabric) of pitch-based carbon fiber. In Experimental Example 3, a glass fiber reinforced resin (GFRP cloth) impregnated with a resin in a glass fiber cloth (fabric) and a resin impregnated in a unidirectional carbon fiber sheet in which pitch-based carbon fibers are aligned in one direction are used. Carbon fiber reinforced resin (CFRP unidirectional) laminated glass-carbon fiber bonded composite material (GFRP cloth-CFRP unidirectional). In Experimental Example 4, according to the structure of the present invention, a fiber-reinforced composite material (metal foil surface layer-CFRP unidirectional core) produced by the following method was used: copper foil was integrally molded to align the pitch-based carbon fibers in one direction The unidirectional carbon fiber sheet is impregnated with both sides of a carbon fiber reinforced resin (CFRP unidirectional) resin.

又,於實驗例2、3、4中使用之瀝青系碳纖維係使用單絲平均直徑9μm、收束條數3000條、6000條或12000條之纖維束,即瀝青系碳纖維股(日本Graphite Fiber股份有限公司製造(商品名:GRANOC XN-80),並使環氧樹脂含浸於纖維中而獲得預浸體。 In addition, the pitch-based carbon fibers used in Experimental Examples 2, 3, and 4 used fiber bundles having an average diameter of a single filament of 9 μm, a number of bundles of 3000, 6000, or 12,000, that is, pitch-based carbon fiber stocks (Japan Graphite Fiber Co., Ltd. Co., Ltd. (trade name: GRANAC XN-80), and impregnated epoxy resin with fibers to obtain a prepreg.

於實驗例3中使用之玻璃纖維布預浸體係使用三菱麗陽股份有限公司製造(商品名:GHO250-381IM)。纖維單位面積重量如表2所示。 The glass fiber cloth prepreg system used in Experimental Example 3 was manufactured by Mitsubishi Rayon Corporation (trade name: GHO250-381IM). The fiber basis weight is shown in Table 2.

於實驗例3中,於將玻璃纖維布預浸體與單向碳纖維片材預浸體疊合而製成一體後,進行加熱使樹脂硬化而製作試驗樣本。又,於實驗例4中,將銅箔按壓至單向碳纖維片材預浸體之兩面而積層為一體,並進行加熱使樹脂硬化,製作導熱性複合材料1。 In Experimental Example 3, a glass fiber cloth prepreg and a unidirectional carbon fiber sheet prepreg were laminated to form a single body, and then heated to harden the resin to prepare a test sample. Further, in Experimental Example 4, copper foil was pressed onto both surfaces of the unidirectional carbon fiber sheet prepreg to be laminated, and the resin was cured by heating to produce a thermally conductive composite material 1.

所使用之鋁、銅、玻璃纖維、瀝青系碳纖維之機械特性及導熱率如下所述。 The mechanical properties and thermal conductivity of the aluminum, copper, glass fiber, and pitch-based carbon fibers used are as follows.

鋁(A5052):拉伸彈性模數:70GPa導熱率:138W/mK Aluminum (A5052): Tensile elastic modulus: 70GPa Thermal conductivity: 138W / mK

銅:拉伸彈性模數:110~130GPa 導熱率:398W/mK Copper: Tensile elastic modulus: 110 ~ 130GPa Thermal conductivity: 398W / mK

玻璃纖維:拉伸彈性模數:70GPa導熱率:0.5W/mK Glass fiber: tensile elastic modulus: 70GPa thermal conductivity: 0.5W / mK

瀝青系碳纖維:拉伸彈性模數:780GPa導熱率:320W/mK Asphalt-based carbon fiber: Tensile elastic modulus: 780GPa Thermal conductivity: 320W / mK

於實驗例1~4中使用之試驗樣本S如圖5(a)、(b)所示般將長度×寬度設為100mm×50mm,各樣本S之厚度尺寸(總厚度T1,金屬箔層厚t3,纖維強化樹脂材料厚度t2)如表2所示。 As shown in Figures 5 (a) and (b), the test sample S used in Experimental Examples 1 to 4 was set to a length × width of 100 mm × 50 mm. The thickness of each sample S (total thickness T1, metal foil layer thickness) t3, the thickness t2 of the fiber-reinforced resin material is shown in Table 2.

(散熱性) (Heat dissipation)

各試驗樣本S之散熱性係如下述般進行測量。 The heat radiation properties of each test sample S were measured as follows.

如圖5(c)所示,於試驗樣本、即試驗片S之長邊方向一端(圖5(c)中為左側端)之寬度方向中央部設置加熱器(H),並利用溫度感測器(TS)對試驗片之至少加熱器設置位置及與設置有加熱器(H)之側為相反側(圖5(c)中為右側端)的溫度測量點進行測量。測量溫度試驗開始時與達到平衡狀態時之溫度。根據溫度測量之結果的散熱性之判斷如下所述。即,若加熱器正下方之點的溫度高,則判斷為溫度未分散至周圍,因此散熱性差。又,於遠離加熱器之試驗片的另一端(圖5(c)中為右側端)之測量點的溫度上升之情形時,判斷為熱量分散至較遠處,因此散熱性良好。 As shown in FIG. 5 (c), a heater (H) is provided at the center in the width direction of the test sample, that is, the one end in the long-side direction of the test piece S (the left end in FIG. 5 (c)), and the temperature is sensed. The device (TS) measures the temperature of at least the heater installation position of the test piece and the temperature measurement point opposite to the side on which the heater (H) is provided (the right end in FIG. 5 (c)). Measure the temperature at the beginning of the temperature test and when it reaches equilibrium. Judgment of heat dissipation based on the results of temperature measurement is as follows. That is, if the temperature at the point immediately below the heater is high, it is determined that the temperature is not dispersed to the surroundings, and therefore, the heat dissipation is poor. In addition, when the temperature at the measurement point on the other end (the right end in Fig. 5 (c)) of the test piece far from the heater rises, it is determined that the heat is dispersed far away, so the heat dissipation is good.

散熱性之測量結果如表3所示,實驗例1之樣本的加熱器正下方之溫度於實驗例1~4之中最低,可見熱量擴散至整體之跡象(◎:散熱性非常好)。實驗例2之樣本於實驗例1~4之中為第三,雖與實驗例1 之樣本同樣地熱量擴散至整體,但劣於實驗例1之樣本(△)。實驗例3之樣本之加熱器正下方的溫度於實驗例1~4之中最高,蓄熱而熱量僅沿一方向擴散(×:散熱性不良)。實驗例4之樣本之加熱器正下方的溫度於實驗例1~4之中第二低,可見熱量擴散至整體、熱量擴散至試驗樣本之端部的跡象(◎~○:散熱性良好)。 The measurement results of heat dissipation are shown in Table 3. The temperature directly under the heater of the sample of Experimental Example 1 was the lowest among Experimental Examples 1 to 4, and it was seen that heat spread to the whole ((: Very good heat dissipation). The sample of Experimental Example 2 is the third among Experimental Examples 1 to 4. Although the heat spreads to the entire body like the sample of Experimental Example 1, it is inferior to the sample of Experimental Example 1 (△). The temperature directly under the heater of the sample of Experimental Example 3 was the highest among Experimental Examples 1 to 4, and the heat was stored and the heat was diffused only in one direction (×: Poor heat dissipation). The temperature directly below the heater of the sample of Experimental Example 4 was the second lowest among Experimental Examples 1 to 4, and it was seen that heat spread to the whole and heat spread to the end of the test sample (◎ ~~: good heat dissipation).

(拉伸彈性模數、拉伸剛性) (Tensile elastic modulus, tensile rigidity)

拉伸彈性模數(E)、拉伸剛性及重量係藉由計算而求出。拉伸剛性係樣本之拉伸彈性模數(E)與樣本之橫截面積(A)(於本實施例中,A=50mm×T1)之乘積。 The tensile elastic modulus (E), tensile rigidity, and weight were obtained by calculation. The tensile rigidity is the product of the tensile elastic modulus (E) of the sample and the cross-sectional area (A) of the sample (in this embodiment, A = 50mm × T1).

拉伸彈性模數、拉伸剛性及重量之結果如表3所示。根據表3,藉由本發明而構成之實驗例4的試驗樣本於散熱性及剛性之方面優異,又,亦於重量之方面較實驗例1之鋁單質輕量。 Table 3 shows the results of the tensile elastic modulus, tensile rigidity, and weight. According to Table 3, the test sample of Experimental Example 4 constituted by the present invention is excellent in terms of heat dissipation and rigidity, and is also lighter in weight than the aluminum element of Experimental Example 1.

(2)實驗例5~9 (2) Experimental examples 5 to 9

為了進一步證實本發明之導熱性複合材料1之作用效果,除先前敍述之實驗例1~4之外,變更導熱性複合材料1之厚度(T1),且儘可能使厚度一致而進行性能試驗。如上述般,於表4中表示於本實驗例中使用之試驗樣本的材料、構成、各尺寸等,於表5中表示試驗結果。 In order to further confirm the function and effect of the thermally conductive composite material 1 of the present invention, in addition to the experimental examples 1 to 4 described previously, the thickness (T1) of the thermally conductive composite material 1 was changed, and the thickness test was performed as uniformly as possible. As described above, Table 4 shows the materials, composition, dimensions, etc. of the test samples used in this experimental example, and Table 5 shows the test results.

(試驗樣本) (Test sample)

於實驗例5中,使用薄板狀之鋁A5052單質(金屬單質)。厚度設為0.48mm。於實驗例6中,使用將於將瀝青系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂之預浸體於X方向與Y方向上積層而獲得之碳纖維強化樹脂(CFRP單向0°/90°板)。於實驗例7中,根據本發明之構成,使用將銅箔一體成型於碳纖維強化樹脂之兩面進行製作而成的纖維強化複合材料(金屬箔表層-瀝青系CFRP單向0°/90°),該碳纖維強化樹脂係將於將瀝青系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂之預 浸體於X方向與Y方向上積層而獲得。於實驗例8中,使用碳纖維強化樹脂(PAN系CFRP單向0°/90°板),該碳纖維強化樹脂係將在使PAN系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂之預浸體於X方向與Y方向上積層而獲得。於實驗例9中,根據本發明之構成,使用將銅箔一體成型於碳纖維強化樹脂之兩面進行製作而成之纖維強化複合材料(金屬箔表層-PAN系CFRP單向0°/90°板),該碳纖維強化樹脂係將在使PAN系碳纖維沿一方向拉齊之單向碳纖維片材中含浸樹脂之預浸體於X方向與Y方向上積層而獲得。 In Experimental Example 5, a thin plate-shaped aluminum A5052 simple substance (metal simple substance) was used. The thickness is set to 0.48 mm. In Experimental Example 6, a carbon fiber-reinforced resin (CFRP unidirectional) obtained by laminating a prepreg impregnated with resin in a unidirectional carbon fiber sheet in which pitch-based carbon fibers are aligned in one direction was used. 0 ° / 90 ° plate). In Experimental Example 7, according to the structure of the present invention, a fiber-reinforced composite material (metal foil surface layer—asphalt-based CFRP unidirectional 0 ° / 90 °) produced by integrally molding copper foil on both sides of a carbon fiber reinforced resin was used. The carbon fiber-reinforced resin is obtained by laminating pitch-based carbon fibers in one direction with a unidirectional carbon fiber sheet impregnated with resin in the X direction and the Y direction. In Experimental Example 8, a carbon fiber reinforced resin (PAN-based CFRP unidirectional 0 ° / 90 ° plate) was used. The carbon fiber-reinforced resin was impregnated with resin in a unidirectional carbon fiber sheet in which PAN-based carbon fibers were aligned in one direction. The prepreg is obtained by laminating in the X direction and the Y direction. In Experimental Example 9, according to the constitution of the present invention, a fiber-reinforced composite material (metal foil surface layer-PAN-based CFRP unidirectional 0 ° / 90 ° plate) produced by integrally molding copper foil on both sides of a carbon fiber reinforced resin was used. The carbon fiber-reinforced resin is obtained by laminating prepregs impregnated with resin in a unidirectional carbon fiber sheet in which PAN-based carbon fibers are aligned in one direction in the X and Y directions.

又,關於實驗例5~9中使用之瀝青系碳纖維、鋁、銅,使用各物性與實驗例1~4相同者。於實驗例8、9中使用之PAN系碳纖維係使用三菱麗陽股份有限公司製造(TR380G125等)。所使用之總纖維單位面積重量設為如表4所示。 Regarding the pitch-based carbon fibers, aluminum, and copper used in Experimental Examples 5 to 9, the same physical properties as those of Experimental Examples 1 to 4 were used. The PAN-based carbon fibers used in Experimental Examples 8 and 9 were manufactured by Mitsubishi Rayon Corporation (TR380G125, etc.). The total fiber basis weight used is set as shown in Table 4.

於實驗例5~9中使用之試驗樣本與實施例1~4同樣地將長度×寬度設為100mm×50mm,各樣本之厚度尺寸(總厚度T1,金屬箔層厚t3,纖維強化樹脂材料厚度t2)如表4所示。 The test samples used in Experimental Examples 5 to 9 were the same as in Examples 1 to 4. The length × width was set to 100 mm × 50 mm. The thickness of each sample (total thickness T1, metal foil layer thickness t3, and fiber-reinforced resin material thickness). t2) As shown in Table 4.

(散熱性) (Heat dissipation)

各試驗樣本之散熱性係利用與實驗例1~4相同之方法進行測量。 The heat dissipation of each test sample was measured by the same method as in Experimental Examples 1 to 4.

散熱性之測量結果如表5所示,實驗例5之樣本的加熱器正下方之溫度為38.8℃而於實驗例5~9之中最低,可見熱量進而擴散至整體之跡象(◎:散熱性非常好)。實驗例6之樣本的加熱器正下方之溫度為40℃而與實驗例5之鋁為相同程度,熱量擴散之跡象雖為擴散至整體,但劣 於實驗例5之鋁(○:散熱性略好)。實驗例7之樣本的加熱器正下方之溫度為39.8℃,藉由銅箔之效果而熱量擴散之跡象與實驗例5之鋁為相同程度(◎:散熱性非常好)。實驗例8之樣本的加熱器正下方之溫度為93.4℃而顯著蓄熱,熱量幾乎未擴散(×:散熱性不良)。實驗例9之樣本的加熱器正下方之溫度為50℃左右而可見蓄熱,但若與實驗例8之樣本相比,則藉由銅箔之效果而蓄熱得以抑制,可見熱量稍微擴散之跡象(△:散熱性略差)。 The measurement results of heat dissipation are shown in Table 5. The temperature directly under the heater of the sample of Experimental Example 5 was 38.8 ° C, which was the lowest among Experimental Examples 5-9. It can be seen that the heat has spread to the whole (◎: Heat dissipation very good). The temperature of the sample directly under the heater of Experimental Example 6 is 40 ° C and is the same as that of Aluminum of Experimental Example 5. Although the signs of heat diffusion are diffused to the whole, it is inferior to that of Aluminum of Experimental Example 5 (○: heat dissipation is slightly it is good). The temperature directly under the heater of the sample of Experimental Example 7 was 39.8 ° C, and the signs of heat diffusion due to the effect of the copper foil were the same as that of Aluminum of Experimental Example 5 (:: Very good heat dissipation). The temperature directly below the heater of the sample of Experimental Example 8 was 93.4 ° C, and significant heat was accumulated, and the heat was hardly diffused (×: poor heat dissipation). In the sample of Experimental Example 9, the heat storage temperature is about 50 ° C under the heater, but compared with the sample of Experimental Example 8, the heat storage is suppressed by the effect of the copper foil, and the heat is slightly diffused. △: The heat dissipation is slightly inferior).

(拉伸彈性模數、拉伸剛性) (Tensile elastic modulus, tensile rigidity)

拉伸彈性模數(E)、拉伸剛性及重量與實驗例1~4同樣,藉由計算而求出。拉伸彈性模數、拉伸剛性及重量之結果如表5所示。根據表5,根據本發明而構成之實驗例7的試驗樣本於散熱性及剛性之方面優異,又,亦於重量之方面較大致相同厚度的實驗例5之鋁單質輕量。 The tensile elastic modulus (E), tensile rigidity, and weight were determined by calculation in the same manner as in Experimental Examples 1 to 4. Table 5 shows the results of the tensile elastic modulus, tensile rigidity, and weight. According to Table 5, the test sample of Experimental Example 7 constituted according to the present invention is excellent in terms of heat dissipation and rigidity, and is also light in weight in terms of the aluminum element of Experimental Example 5 which is larger in weight and has the same thickness.

實施例2 Example 2

於圖2(c)中表示本發明之導熱性複合材料1之第二實施例。根據本實施例,導熱性複合材料1具有金屬箔層3及一體接合於該金屬箔層3之兩面的片狀纖維強化樹脂材料2(2a、2b)。 FIG. 2 (c) shows a second embodiment of the thermally conductive composite material 1 of the present invention. According to this embodiment, the thermally conductive composite material 1 includes a metal foil layer 3 and a sheet-shaped fiber-reinforced resin material 2 (2 a, 2 b) integrally bonded to both surfaces of the metal foil layer 3.

本實施例之導熱性複合材料1若與實施例1之導熱性複合材料1進行比較,則係藉由設為將具有高拉伸彈性模數之纖維強化樹脂材料2(2a、2b)配置於金屬箔層3之兩面的構成而相較於散熱性,更重視剛性之類型者。 If the thermally conductive composite material 1 of this embodiment is compared with the thermally conductive composite material 1 of Example 1, the fiber-reinforced resin material 2 (2a, 2b) having a high tensile elastic modulus is arranged in The structure of both surfaces of the metal foil layer 3 is more rigid than the heat dissipation.

本實施例之導熱性複合材料1於將片狀纖維強化樹脂材料2(2a、2b)一體接合於金屬箔層3的兩面之方面與實施例1之情形不同,作為構成構件之金屬箔層3及片狀纖維強化樹脂材料2(2a、2b),設為與實 施例1相同之材料構成。因此,針對金屬箔層3及片狀纖維強化樹脂材料2(2a、2b)之說明,援用實施例1之說明而省略詳細說明。 The thermally conductive composite material 1 of this embodiment is different from the case of Example 1 in that the sheet-shaped fiber-reinforced resin material 2 (2a, 2b) is integrally bonded to both sides of the metal foil layer 3, and the metal foil layer 3 as a constituent member is different. The sheet-like fiber-reinforced resin material 2 (2a, 2b) has the same material configuration as that of Example 1. Therefore, the description of the metal foil layer 3 and the sheet-shaped fiber-reinforced resin material 2 (2a, 2b) is referred to the description of Example 1 and detailed description is omitted.

於本實施例中,導熱性複合材料1之厚度(T2)與上述實施例1之情形同樣地設為1mm以下,通常,於本實施例中設為0.12~1mm(0.12mm≦T2≦1mm)。較佳將導熱性複合材料之厚度(T2)設為0.12~0.5mm。 In this embodiment, the thickness (T2) of the thermally conductive composite material 1 is set to 1 mm or less as in the case of the above-mentioned embodiment 1. Generally, it is set to 0.12 to 1 mm (0.12 mm ≦ T2 ≦ 1 mm) in this embodiment. . The thickness (T2) of the thermally conductive composite material is preferably set to 0.12 to 0.5 mm.

(製造方法) (Production method)

於本實施例中,金屬箔層3亦必需相對於纖維強化樹脂材料2(2a、2b)一體成型。即,例如圖4(b)所示,將對強化纖維片材10Sa、10Sb含浸樹脂R,尚未完全硬化之所謂預浸體狀態的強化纖維片材(預浸體片)10PG(10PGa、10PGb)按壓至金屬箔層3之兩面而一體地積層,並視需要進行加熱而將樹脂R硬化。 In this embodiment, the metal foil layer 3 must also be formed integrally with the fiber-reinforced resin material 2 (2a, 2b). That is, for example, as shown in FIG. 4 (b), the reinforcing fiber sheet 10Sa, 10Sb is impregnated with the resin R, and the reinforcing fiber sheet (prepreg sheet) 10PG (10PGa, 10PGb) in a so-called prepreg state that has not yet been completely hardened. The resin R is laminated by pressing on both surfaces of the metal foil layer 3 and integrally laminating it, and heating it as necessary.

亦如實施例1所說明般,若於後接著,即對於金屬箔層3之兩面接著預浸體片10PG(10PGa、10PGb)之含浸樹脂完全硬化,即纖維強化樹脂材料2(2a、2b)而製成一體之情形時,擔心根據接著劑之厚度而於接著層散熱性或剛性降低。 As described in Example 1, if the resin impregnated with the prepreg sheet 10PG (10PGa, 10PGb) on both sides of the metal foil layer 3 is subsequently cured, that is, the fiber-reinforced resin material 2 (2a, 2b) On the other hand, when integrated, there is a concern that the heat dissipation property or rigidity of the adhesive layer may be reduced depending on the thickness of the adhesive.

(補強方法) (Reinforcement method)

如上述般製作之導熱性複合材料1與實施例1之情形同樣地被一體接合於被補強體101。 The thermally conductive composite material 1 produced as described above is integrally bonded to the reinforced body 101 in the same manner as in the case of Example 1.

作為如此獲得之纖維強化塑膠製品的被補強體101,如上述般,由其厚度(T2)設為0.12~1mm、拉伸彈性模數設為80GPa以上之具備高剛性與散熱性之補強體(即導熱性複合材料1)所補強,藉此,可有效地防止因外力所導致之變形而防止裝置內部損壞,且不形成因收納於裝置 內部的放熱源所引起之熱斑便可進行擴散。 As the reinforced body 101 of the fiber-reinforced plastic product obtained in this way, as described above, the reinforced body having high rigidity and heat dissipation properties (T2) having a thickness (T2) of 0.12 to 1 mm and a tensile elastic modulus of 80 GPa or more ( That is, it is reinforced by the thermally conductive composite material 1), which can effectively prevent deformation due to external forces and prevent internal damage to the device, and can spread without forming a hot spot caused by a heat source stored in the device.

(實驗例之說明) (Explanation of experimental examples)

繼而,為了證實本發明之導熱性複合材料1之作用效果而製作試驗樣本,並對機械強度、散熱性進行性能試驗。於上述表4、表5中將本實驗例表示為實驗例10。於表4中表示於實驗例10中使用之試驗樣本的材料、構成、各尺寸等,於表5中表示試驗結果。 Next, in order to confirm the effect of the thermally conductive composite material 1 of the present invention, a test sample was made, and performance tests were performed on mechanical strength and heat dissipation. This experimental example is shown as Experimental Example 10 in Tables 4 and 5 above. Table 4 shows the materials, composition, dimensions, etc. of the test samples used in Experimental Example 10, and Table 5 shows the test results.

實驗例10 Experimental Example 10

(試驗樣本) (Test sample)

於實驗例10中,根據本發明之構成,使用以如下方法製作之纖維強化複合材料(金屬箔芯-瀝青系CFRP單向0°/90°板):將使瀝青系碳纖維沿一方向拉齊之單向碳纖維片材中含浸有樹脂之預浸體於X方向與Y方向上積層於銅箔3的兩面並一體化。 In Experimental Example 10, according to the constitution of the present invention, a fiber-reinforced composite material (metal foil core-asphalt CFRP unidirectional 0 ° / 90 ° plate) produced by the following method was used: the pitch-based carbon fibers were aligned in one direction The unidirectional carbon fiber sheet impregnated with resin is laminated on both sides of the copper foil 3 in the X direction and the Y direction and integrated.

又,於實驗例10中使用之瀝青系碳纖維、銅使用各物性與實驗例1~9相同者。所使用之總纖維單位面積重量設為如表4所示。 The pitch-based carbon fibers and copper used in Experimental Example 10 have the same physical properties as those of Experimental Examples 1 to 9. The total fiber basis weight used is set as shown in Table 4.

於實驗例10中使用之試驗樣本與實驗例1~9同樣地將長度×寬度設為100mm×50mm,各樣本之厚度尺寸(總厚度T2,金屬箔層厚t3,纖維強化樹脂材料厚度t2)如表4所示。 The test samples used in Experimental Example 10 were the same as Experimental Examples 1-9. The length × width was set to 100mm × 50mm, and the thickness of each sample (total thickness T2, metal foil layer thickness t3, and fiber-reinforced resin material thickness t2). As shown in Table 4.

(散熱性) (Heat dissipation)

試驗樣本之散熱性係利用與實驗例1~9相同之方法而測量。 The heat dissipation properties of the test samples were measured by the same method as in Experimental Examples 1-9.

散熱性之測量結果如表5所示,實驗例10之樣本的加熱器正下方之溫度為39.4℃,熱量擴散之跡象與上述實驗例7之樣本相比略差 (◎~○:散熱性良好)。 The measurement results of heat dissipation are shown in Table 5. The temperature directly under the heater of the sample of Experimental Example 10 was 39.4 ° C, and the signs of heat diffusion were slightly worse than the samples of Experimental Example 7 above (◎ ~ ○: Good heat dissipation. ).

(拉伸彈性模數、拉伸剛性) (Tensile elastic modulus, tensile rigidity)

拉伸彈性模數(E)、拉伸剛性及重量與實驗例1~9同樣,藉由計算而求出。拉伸彈性模數、拉伸剛性及重量之結果如表5所示。根據表5,根據本實施例而構成之實驗例10的試驗樣本於散熱性及剛性之方面優異,又,亦於重量之方面較大致相同厚度的上述實驗例5之鋁單質輕量。 The tensile elastic modulus (E), tensile rigidity, and weight were determined by calculation in the same manner as in Experimental Examples 1 to 9. Table 5 shows the results of the tensile elastic modulus, tensile rigidity, and weight. According to Table 5, the test sample of Experimental Example 10 constituted according to this example is excellent in terms of heat dissipation and rigidity, and is also relatively light in weight in terms of aluminum in the above-mentioned Experimental Example 5 having a large thickness and the same thickness.

Claims (8)

一種導熱性複合材料,其具有含連續之強化纖維的片狀纖維強化樹脂材料及一體接合於該纖維強化樹脂材料之兩面的金屬箔層,厚度被設為0.07~1mm,其特徵在於:該纖維強化樹脂材料之厚度被設為0.05mm以上,未達1mm,該金屬箔層之厚度被設為0.009~0.1mm,該導熱性複合材料之拉伸彈性模數為80GPa以上。     A thermally conductive composite material having a sheet-shaped fiber-reinforced resin material containing continuous reinforcing fibers and metal foil layers integrally bonded to both sides of the fiber-reinforced resin material. The thickness is set to 0.07 to 1 mm, and the characteristics are: The thickness of the reinforced resin material is set to 0.05 mm or more and less than 1 mm, the thickness of the metal foil layer is set to 0.009 to 0.1 mm, and the tensile elastic modulus of the thermally conductive composite material is 80 GPa or more.     一種導熱性複合材料,其具有金屬箔層及一體接合於該金屬箔層的兩面之含連續之強化纖維的片狀纖維強化樹脂材料,厚度被設為0.12~1mm,其特徵在於:該纖維強化樹脂材料之厚度被設為0.05mm以上,未達1mm,該金屬箔層之厚度被設為0.009~0.1mm,該導熱性複合材料之拉伸彈性模數為80GPa以上。     A thermally conductive composite material having a metal foil layer and a sheet-shaped fiber-reinforced resin material containing continuous reinforcing fibers integrally bonded to both sides of the metal foil layer. The thickness is set to 0.12 to 1 mm, and the characteristics are: The thickness of the resin material is set to 0.05 mm or more and less than 1 mm, the thickness of the metal foil layer is set to 0.009 to 0.1 mm, and the tensile elastic modulus of the thermally conductive composite material is 80 GPa or more.     如申請專利範圍第1或2項之導熱性複合材料,其中,該纖維強化樹脂材料以纖維體積含有率計,含有20%以上之瀝青系碳纖維,該瀝青系碳纖維具有100W/mK以上的強化纖維之導熱率及400GPa以上之拉伸彈性模數。     For example, the thermally conductive composite material of the scope of application for patent No. 1 or 2, wherein the fiber-reinforced resin material contains more than 20% of pitch-based carbon fibers based on the fiber volume content rate, and the pitch-based carbon fibers have a reinforcing fiber of 100 W / mK or more Thermal conductivity and tensile elastic modulus above 400GPa.     如申請專利範圍第1或2項之導熱性複合材料,其中,該纖維強化樹脂材料之強化纖維係瀝青系碳纖維、PAN(polyacrylonitrile,聚丙烯腈)系碳纖維或玻璃纖維或者將該纖維混合2種以上而成者。     For example, the thermally conductive composite material of the scope of application for patent No. 1 or 2, wherein the reinforcing fiber of the fiber-reinforced resin material is pitch-based carbon fiber, PAN (polyacrylonitrile, polyacrylonitrile) -based carbon fiber or glass fiber, or a mixture of these two kinds of fibers All of the above.     如申請專利範圍第1至4項中任一項之導熱性複合材料,其中,該纖維強化樹脂材料係將連續之該強化纖維沿一方向拉齊並含浸樹脂而形 成,及/或於至少沿2軸方向而織成之織物含浸樹脂而形成。     For example, the thermally conductive composite material according to any one of claims 1 to 4, wherein the fiber-reinforced resin material is formed by drawing continuous impregnated fibers in one direction and impregnating the resin, and / or at least along The biaxially woven fabric is impregnated with resin.     如申請專利範圍第1至4項中任一項之導熱性複合材料,其中,該纖維強化樹脂材料係將連續之該強化纖維沿一方向拉齊並含浸樹脂而形成之片材,至少於2軸方向上積層進行製作。     For example, the thermally conductive composite material according to any one of claims 1 to 4, wherein the fiber-reinforced resin material is a sheet formed by drawing continuous impregnation of the reinforcing fibers in one direction and impregnating the resin, with a minimum of 2 Lamination is performed in the axial direction.     如申請專利範圍第1至6項中任一項之導熱性複合材料,其中,該金屬箔層由具有50W/mK以上之導熱率之金屬製作。     For example, the thermally conductive composite material according to any one of claims 1 to 6, wherein the metal foil layer is made of a metal having a thermal conductivity of 50 W / mK or more.     如申請專利範圍第1至7項中任一項之導熱性複合材料,其中,該導熱性複合材料之厚度為0.12~0.5mm。     For example, the thermal conductive composite material according to any one of claims 1 to 7, wherein the thickness of the thermal conductive composite material is 0.12 to 0.5 mm.    
TW107140837A 2014-02-10 2015-02-06 Thermally conductive composite material and its manufacturing method TWI689580B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP2014-023666 2014-02-10
JP2014023666 2014-02-10
JP2014178596 2014-09-02
JPJP2014-178596 2014-09-02

Publications (2)

Publication Number Publication Date
TW201920592A true TW201920592A (en) 2019-06-01
TWI689580B TWI689580B (en) 2020-04-01

Family

ID=53777870

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104104030A TWI659095B (en) 2014-02-10 2015-02-06 Thermally conductive composite material and manufacturing method thereof
TW107140837A TWI689580B (en) 2014-02-10 2015-02-06 Thermally conductive composite material and its manufacturing method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW104104030A TWI659095B (en) 2014-02-10 2015-02-06 Thermally conductive composite material and manufacturing method thereof

Country Status (3)

Country Link
JP (1) JP6571000B2 (en)
TW (2) TWI659095B (en)
WO (1) WO2015119064A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3337657B1 (en) 2015-08-18 2020-05-06 Hewlett-Packard Development Company, L.P. Composite material
KR20180056653A (en) * 2015-09-18 2018-05-29 도레이 카부시키가이샤 housing
JP6463667B2 (en) * 2015-12-11 2019-02-06 本田技研工業株式会社 Cylinder block
IT201700011367A1 (en) * 2017-02-02 2018-08-02 Niteko S R L Planar heat sink in composite material with high thermal conductivity and high mechanical resistance
EP3782810B1 (en) 2018-04-18 2023-01-11 Nippon Steel Corporation Composite of metal and carbon-fiber-reinforced resin material, and method for manufacturing composite of metal and carbon-fiber-reinforced resin material
WO2021106561A1 (en) * 2019-11-29 2021-06-03 東レ株式会社 Sandwich structure and method for manufacturing same
JPWO2021106563A1 (en) * 2019-11-29 2021-06-03
KR102314378B1 (en) * 2019-12-20 2021-10-20 한국과학기술연구원 A fiber reinforced composite structure comprising a metal coating layer and the method for producing the same
CN112684850A (en) * 2020-12-16 2021-04-20 太仓鸿恩电子科技有限公司 Forming process of ultra-light notebook carbon fiber plate shell capable of quickly dissipating heat
CN114734707B (en) * 2022-04-25 2022-11-11 叶金蕊 Heat-conducting ultrahigh voltage-resistant insulating composite material and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
JP4597279B2 (en) * 1998-07-31 2010-12-15 弘治 大石橋 Thermally conductive composite material
JP2001118974A (en) * 1999-10-15 2001-04-27 Mitsubishi Chemicals Corp Heat radiating plate
JP5703542B2 (en) * 2009-03-26 2015-04-22 三菱樹脂株式会社 Carbon fiber reinforced resin sheet and roll wound body thereof
KR20120050835A (en) * 2010-11-11 2012-05-21 삼성전기주식회사 Metal clad laminate and method for manufacturing the same, heat-radiating substrate
JP6003010B2 (en) * 2010-11-18 2016-10-05 三菱レイヨン株式会社 Electromagnetic wave shielding composite material, electronic equipment casing and battery case

Also Published As

Publication number Publication date
JPWO2015119064A1 (en) 2017-03-23
TW201536907A (en) 2015-10-01
JP6571000B2 (en) 2019-09-04
WO2015119064A1 (en) 2015-08-13
TWI689580B (en) 2020-04-01
TWI659095B (en) 2019-05-11

Similar Documents

Publication Publication Date Title
TWI659095B (en) Thermally conductive composite material and manufacturing method thereof
CN108029212B (en) Shell body
CN108029222B (en) Electronic equipment shell
US20180124957A1 (en) Heat Radiation Sheet And Method For Manufacturing Of The Same
TWI663905B (en) Laminates and integrally formed products
KR20170095316A (en) Graphite laminates, processes for producing graphite laminates, structural object for heat transport, and rod-shaped heat-transporting object
CN111699090B (en) Heat conductive sheet
CN108029215B (en) Shell body
CN108029213B (en) Shell body
US10509443B2 (en) Housing
JP2016022685A (en) Heat conductive laminate
JP2009220478A (en) Fiber-reinforced sandwich structure composite and composite molding
JP2005213459A (en) High thermal conductive material
KR102537709B1 (en) Thermal conductive sheet using graphite combined with dopamin and method of manufacturing the same
JP2010070412A (en) Graphite composite sheet
CN112805825A (en) Insulating radiating fin with stripping piece
JP2017059793A (en) Housing
US20130273275A1 (en) Shell structure
CN210781887U (en) Heat conduction structure and electronic device
KR102068493B1 (en) Thermal diffusion sheet and the manufacturing method thereof
KR102068492B1 (en) Thermal diffusion sheet and the manufacturing method thereof
CN111452442A (en) Thermoplastic light composite material plate, manufacturing method and corresponding product thereof
JP2017177388A (en) Fiber reinforced resin composite structure and manufacturing method therefor
JPH11354608A (en) Hand for transfer apparatus
CN203513563U (en) Enhanced heat-conductive insulating film