TW201915462A - Holding member, manufacturing method of holding member, inspection device, and cutting device capable of accurately inspecting the edges of an object to be held with a simple configuration - Google Patents
Holding member, manufacturing method of holding member, inspection device, and cutting device capable of accurately inspecting the edges of an object to be held with a simple configuration Download PDFInfo
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- TW201915462A TW201915462A TW107130607A TW107130607A TW201915462A TW 201915462 A TW201915462 A TW 201915462A TW 107130607 A TW107130607 A TW 107130607A TW 107130607 A TW107130607 A TW 107130607A TW 201915462 A TW201915462 A TW 201915462A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Abstract
Description
本發明是有關於一種對保持對象物進行保持並用於光學檢查的保持構件、保持構件的製造方法、檢查裝置及切斷裝置。The present invention relates to a holding member for holding an object to be held and used for optical inspection, a method for manufacturing the holding member, an inspection device, and a cutting device.
作為現有技術，例如在專利文獻1中公開了一種電子零件的外觀檢查裝置。所述電子零件的外觀檢查裝置是一種對電子零件中的被檢查部位的邊緣進行檢測，並基於此邊緣位置進行被檢查部位的尺寸測量及被檢查部位的良否判定的電子零件的外觀檢查裝置，其特徵在於具備：圖像輸入部件，從規定方向對檢查零件進行拍攝；照明部件，能夠對檢查零件從與拍攝方向構成銳角的至少兩個方向分別照射光；拍攝控制部件，在每次利用照明部件進行不同方向的光照射時使圖像輸入部件作動來進行拍攝；以及邊緣位置檢測部件，基於每次進行光照射時所獲得的圖像信號來對電極部的邊緣位置進行檢測。 [現有技術文獻]As a related art, for example, Patent Document 1 discloses an appearance inspection device for electronic components. The appearance inspection device for an electronic part is an appearance inspection device for an electronic part that detects an edge of an inspected part in an electronic part, and performs a size measurement of the inspected part and a good or bad judgment of the inspected part based on the edge position. It is characterized by comprising: an image input means for shooting inspection parts from a predetermined direction; an illuminating means for irradiating the inspection parts with light from at least two directions which form an acute angle with the shooting direction; a shooting control means for using illumination each time When the component performs light irradiation in different directions, the image input device is actuated to perform shooting; and the edge position detection component detects the edge position of the electrode portion based on an image signal obtained each time the light irradiation is performed. [Prior Art Literature]
[專利文獻] [專利文獻1] 日本專利特開平8-184410號公報[Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 8-184410
[發明所要解決的問題] 在專利文獻1所公開的電子零件的外觀檢查裝置中，隔著照相機1的拍攝中心1a左右對稱地配置各照明器2，且從左側的照明器2將A方向上的光照射至檢測零件P，從右側的照明器2將B方向上的光照射至檢查零件P。將利用A方向照明與B方向照明所獲得的各圖像資料的亮度值進行比較，並利用陰影及顯色部的有無來查找顯現出明暗差別的部分，從而對檢查零件P的邊緣位置進行檢測。因而，存在檢測邊緣位置的檢測機構的構成變得複雜，且邊緣位置的檢測所需要的時間變長的問題。[Problems to be Solved by the Invention] In the visual inspection device for an electronic component disclosed in Patent Document 1, each of the illuminators 2 is symmetrically arranged across the shooting center 1a of the camera 1, and the left illuminator 2 is positioned in the A direction. The light is irradiated to the detection part P, and the light in the B direction is irradiated to the inspection part P from the illuminator 2 on the right side. The brightness values of each image data obtained by using the A-direction illumination and the B-direction illumination are compared, and the presence or absence of the difference between light and dark is found by using the presence of the shadow and the color-developed portion, thereby detecting the edge position of the inspection part P . Therefore, there is a problem that the configuration of the detection mechanism for detecting the edge position becomes complicated, and the time required for detecting the edge position becomes long.
本發明用以解決上述課題，其目的在於提供一種能夠以簡單的構成來精度良好地進行保持對象物的邊緣檢測的保持構件、保持構件的製造方法、檢查裝置及切斷裝置。 [解決問題的技術手段]The present invention has been made to solve the above problems, and an object thereof is to provide a holding member capable of accurately performing edge detection of an object to be held with a simple configuration, a method for manufacturing the holding member, an inspection device, and a cutting device. [Technical means to solve the problem]
為了解決上述課題，本發明的保持構件是一種對多個保持對象物進行保持並用於光學檢查的保持構件，其包括：彈性樹脂，設置有對保持對象物進行吸附以加以保持的多個吸附孔、及配置於多個吸附孔之間的格子狀的槽；以及反射層，配置於槽上。In order to solve the above-mentioned problem, the holding member of the present invention is a holding member that holds a plurality of holding objects and is used for optical inspection, and includes an elastic resin provided with a plurality of suction holes for holding and holding the holding objects And a grid-shaped groove arranged between the plurality of adsorption holes; and a reflective layer arranged on the groove.
為了解決上述課題，本發明的保持構件的製造方法是一種對多個保持對象物進行保持並用於光學檢查的保持構件的製造方法，其對形成有多個吸附孔以及格子狀的槽的彈性樹脂在槽上形成反射層，所述多個吸附孔對保持對象物進行吸附以加以保持，所述格子狀的槽配置於所述吸附孔之間。 [發明的效果]In order to solve the above-mentioned problems, a method for manufacturing a holding member of the present invention is a method for manufacturing a holding member that holds a plurality of holding objects and is used for optical inspection, and is a method for forming an elastic resin having a plurality of suction holes and lattice-shaped grooves. A reflective layer is formed on the grooves, the plurality of adsorption holes adsorb and hold the holding object, and the lattice-shaped grooves are arranged between the adsorption holes. [Effect of the invention]
根據本發明能夠精度良好地進行保持對象物的邊緣檢測。According to the present invention, edge detection of a holding object can be performed with high accuracy.
以下，參照圖式對本發明的實施方式進行說明。關於本申請文件中的所有的圖，為了容易理解而適宜省略或誇大來進行示意性描繪。對相同的構成元件標注相同的符號並適宜省略說明。Hereinafter, embodiments of the present invention will be described with reference to the drawings. All the drawings in this application document are schematically omitted because they are suitably omitted or exaggerated for ease of understanding. The same symbols are assigned to the same constituent elements, and descriptions thereof are appropriately omitted.
[實施方式1] （切斷裝置的構成） 參照圖1對本發明的切斷裝置的構成進行說明。在本實施方式中例如對以下情況進行說明：作為切斷對象物，將對裝配有半導體晶片的基板進行樹脂密封而成的封裝基板切斷。[Embodiment 1] (Configuration of cutting device) The configuration of a cutting device according to the present invention will be described with reference to FIG. 1. In this embodiment, for example, a case will be described in which a package substrate obtained by resin-sealing a substrate on which a semiconductor wafer is mounted is cut as a cutting target.
作為封裝基板，例如使用球格陣列（Ball Grid Array，BGA）封裝基板、焊盤柵陣列（Land Grid Array，LGA）封裝基板、晶片尺寸封裝（Chip Size Package，CSP）封裝基板、發光二極體（Light emitting diode，LED）封裝基板等。另外，作為切斷對象物，不僅使用封裝基板，有時也使用對裝配有半導體晶片的引線框架（lead frame）進行樹脂密封而成的已密封引線框架。As the package substrate, for example, a Ball Grid Array (BGA) package substrate, a Land Grid Array (LGA) package substrate, a Chip Size Package (CSP) package substrate, and a light emitting diode are used. (Light emitting diode, LED) package substrate. In addition, as the cutting target, not only a package substrate but also a sealed lead frame obtained by resin-sealing a lead frame on which a semiconductor wafer is mounted may be used.
如圖1所示，切斷裝置1例如具備供給封裝基板2的基板供給模塊A、切斷封裝基板2的切斷模塊B、以及對經切斷而單片化的半導體封裝進行檢查的檢查模塊C作為各個構成元件。各構成元件分別可相對於其他構成元件進行拆裝且可更換。As shown in FIG. 1, the cutting device 1 includes, for example, a substrate supply module A that supplies a package substrate 2, a cutting module B that cuts the package substrate 2, and an inspection module that inspects a semiconductor package that has been cut into individual pieces. C is used as each constituent element. Each constituent element can be disassembled and replaced with respect to other constituent elements, respectively.
在基板供給模塊A中設置有供給封裝基板2的基板供給部3。封裝基板2例如具有基板、裝配於基板所具有的多個區域中的多個半導體晶片、以及以成批地覆蓋多個區域的方式形成的密封樹脂。封裝基板2利用搬送機構（未圖示）從基板供給模塊A被搬送至切斷模塊B。The substrate supply module A is provided with a substrate supply unit 3 that supplies a package substrate 2. The package substrate 2 includes, for example, a substrate, a plurality of semiconductor wafers mounted in a plurality of regions included in the substrate, and a sealing resin formed so as to cover the plurality of regions in a batch. The package substrate 2 is transferred from the substrate supply module A to the cutting module B by a transfer mechanism (not shown).
在切斷模塊B中設置有用以吸附並切斷封裝基板2的切斷平臺4。在切斷平臺4上安裝有對封裝基板2進行吸附保持的保持構件5。切斷平臺4可利用移動機構6沿圖的Y方向移動。並且，切斷平臺4可利用旋轉機構7沿θ方向旋轉。The cutting module B is provided with a cutting platform 4 for sucking and cutting the package substrate 2. A holding member 5 that suction-holds the package substrate 2 is mounted on the cutting platform 4. The cutting platform 4 can be moved by the moving mechanism 6 in the Y direction of the figure. The cutting platform 4 can be rotated in the θ direction by the rotation mechanism 7.
在切斷模塊B中設置有主軸（spindle）8來作為將封裝基板2切斷而單片化成多個半導體封裝的切斷機構。切斷裝置1例如是設置有一個主軸8的單主軸（single spindle）構成的切斷裝置。主軸8可獨立地沿X方向及Z方向移動。在主軸8中裝配有用以切斷封裝基板2的旋轉刀9。The cutting module B is provided with a spindle 8 as a cutting mechanism that cuts the package substrate 2 and singulates it into a plurality of semiconductor packages. The cutting device 1 is, for example, a cutting device composed of a single spindle provided with one spindle 8. The main shaft 8 can move independently in the X direction and the Z direction. A rotary blade 9 for cutting the package substrate 2 is mounted in the main shaft 8.
在主軸8中設置有朝向高速旋轉的旋轉刀9噴射切削水的切削水用噴嘴、噴射冷卻水的冷卻水用噴嘴、噴射用來清洗切斷屑等的清洗水的清洗水用噴嘴（均未圖示）等。通過使切斷平臺4與主軸8進行相對移動來切斷封裝基板2。The spindle 8 is provided with a cutting water nozzle that sprays cutting water toward the rotating blade 9 that rotates at a high speed, a cooling water nozzle that sprays cooling water, and a cleaning water nozzle that sprays cleaning water such as cutting chips. Icon) and so on. The cutting board 4 and the main shaft 8 are relatively moved to cut the package substrate 2.
也可設為在切斷模塊B中設置有2個主軸的雙主軸構成的切斷裝置。進而，也可設為設置兩個切斷平臺，在各個切斷平臺切斷封裝基板2的雙切割平臺構成。通過設為雙主軸構成、雙切割平臺構成，可提高切斷裝置的生產性。It is also possible to use a double-spindle cutting device having two spindles provided in the cutting module B. Furthermore, a double-cutting table structure may be provided in which two cutting tables are provided, and the package substrate 2 is cut at each cutting table. By having a dual-spindle configuration and a double-cutting table configuration, the productivity of the cutting device can be improved.
在檢查模塊C中設置有搬送機構11，所述搬送機構11對將封裝基板2切斷而經單片化的多個半導體封裝10進行吸附並予以搬送。搬送機構11可沿X方向及Z方向移動。搬送機構11對經單片化的多個半導體封裝10成批地進行吸附並予以搬送。The inspection module C is provided with a conveying mechanism 11 that sucks and conveys a plurality of semiconductor packages 10 that have been cut into packages and cut into individual pieces. The transport mechanism 11 is movable in the X direction and the Z direction. The transporting mechanism 11 sucks and transports a plurality of singulated semiconductor packages 10 in a batch.
在檢查模塊C中設置有檢查平臺12，所述檢查平臺12用以吸附並檢查經單片化的多個半導體封裝10。在檢查平臺12上安裝有對多個半導體封裝10進行吸附保持的保持構件13。利用搬送機構11，多個半導體封裝10被成批地載置於檢查平臺12上。An inspection platform 12 is provided in the inspection module C, and the inspection platform 12 is used to suck and inspect a plurality of singulated semiconductor packages 10. A holding member 13 that holds and holds a plurality of semiconductor packages 10 is mounted on the inspection platform 12. The plurality of semiconductor packages 10 are placed in a batch on the inspection platform 12 by the transfer mechanism 11.
多個半導體封裝10利用作為檢查機構的檢查用的照相機14而接受外觀檢查。保持構件13是吸附經單片化的多個半導體封裝10作為保持對象物並用於光學檢查的保持構件。如後述，安裝於檢查平臺12上的保持構件13是以精度良好地進行半導體封裝10的邊緣檢測的方式製造的保持構件。The plurality of semiconductor packages 10 are subjected to an appearance inspection using an inspection camera 14 as an inspection mechanism. The holding member 13 is a holding member that adsorbs a plurality of singulated semiconductor packages 10 as objects to be held and is used for optical inspection. As will be described later, the holding member 13 mounted on the inspection platform 12 is a holding member manufactured to accurately perform edge detection of the semiconductor package 10.
切斷裝置1中，作為經單片化並接受外觀檢查的半導體封裝，例如可列舉：BGA、LGA、CSP、LED、四面無引腳扁平封裝（Quad Flat Non-leaded Package，QFN）等半導體封裝。In the cutting device 1, as a semiconductor package that has been singulated and subjected to visual inspection, for example, semiconductor packages such as BGA, LGA, CSP, LED, and Quad Flat Non-leaded Package (QFN) can be cited. .
由檢查平臺12所檢查的多個半導體封裝10被區分為良品與不良品。利用移送機構（未圖示）將良品移送至並收容於良品用托盤15中，將不良品移送至並收容於不良品用托盤（未圖示）中。The plurality of semiconductor packages 10 inspected by the inspection platform 12 are classified into good products and defective products. Goods are transferred to and stored in the non-defective product tray 15 by a transfer mechanism (not shown), and non-defective products are transferred and stored in the non-defective product tray (not shown).
在基板供給模塊A中設置有控制部CTL。控制部CTL對切斷裝置1的動作、封裝基板2的搬送、封裝基板2的切斷、經單片化的半導體封裝10的搬送、半導體封裝10的檢查、半導體封裝10的收容等進行控制。在本實施方式中，將控制部CTL設置於基板供給模塊A中。並不限定於此，也可將控制部CTL設置於其他的模塊中。另外，控制部CTL也可分割為多個而設置於基板供給模塊A、切斷模塊B、以及檢查模塊C中的至少兩個模塊中。A control unit CTL is provided in the substrate supply module A. The control unit CTL controls operations of the cutting device 1, conveyance of the package substrate 2, cutting of the package substrate 2, conveyance of the singulated semiconductor package 10, inspection of the semiconductor package 10, storage of the semiconductor package 10, and the like. In the present embodiment, the control unit CTL is provided in the substrate supply module A. The control unit CTL is not limited to this, and may be provided in another module. The control unit CTL may be divided into a plurality and provided in at least two of the substrate supply module A, the cutting module B, and the inspection module C.
（保持構件的構成） 參照圖2（a）及圖2（b），對實施方式1中使用的保持構件13的構成進行說明。安裝於檢查平臺12的保持構件13例如通過對板狀的彈性樹脂進行加工來製造。(Configuration of Holding Member) The configuration of the holding member 13 used in the first embodiment will be described with reference to FIGS. 2 (a) and 2 (b). The holding member 13 attached to the inspection platform 12 is manufactured, for example, by processing a plate-shaped elastic resin.
如圖2（a）及圖2（b）所示，使用板狀的彈性樹脂16作為保持構件13的基座。作為彈性樹脂16例如使用矽酮系樹脂或氟系樹脂等。在彈性樹脂16中，以與吸附並保持作為保持對象物的半導體封裝10的多個區域17相對應的方式形成多個吸附孔18。多個吸附孔18以貫通彈性樹脂16的方式形成。在多個吸附孔18之間及多個吸附孔18的外側形成格子狀的槽19。由格子狀的槽19所包圍的多個突起狀的區域17成為分別對經單片化的半導體封裝10進行吸附保持的區域。As shown in FIGS. 2 (a) and 2 (b), a plate-shaped elastic resin 16 is used as a base of the holding member 13. As the elastic resin 16, for example, a silicone resin or a fluorine resin is used. In the elastic resin 16, a plurality of suction holes 18 are formed so as to correspond to a plurality of regions 17 of the semiconductor package 10 that is a holding target. The plurality of suction holes 18 are formed so as to penetrate the elastic resin 16. A grid-like groove 19 is formed between the plurality of adsorption holes 18 and outside the plurality of adsorption holes 18. The plurality of projecting regions 17 surrounded by the lattice-shaped grooves 19 are regions for holding and holding the singulated semiconductor package 10, respectively.
半導體封裝10與彈性樹脂16例如都具有相同的發黑的顏色，半導體封裝10的反射特性與彈性樹脂16的反射特性相似。因而，半導體封裝10的邊緣界限部的對比不明確，利用現有的光學檢查方法（照明機構）難以檢測出半導體封裝10的邊緣。並且邊緣檢測花費時間。Both the semiconductor package 10 and the elastic resin 16 have, for example, the same blackened color, and the reflection characteristics of the semiconductor package 10 are similar to those of the elastic resin 16. Therefore, the contrast of the edge boundary portions of the semiconductor package 10 is not clear, and it is difficult to detect the edges of the semiconductor package 10 by the conventional optical inspection method (illumination mechanism). And edge detection takes time.
此處，將「反射光」定義為在從光照射側將照射光照射至反射面時，從反射面發出的光。在本實施方式中，在從半導體封裝的吸附側將照射光照射至半導體封裝及槽底面的反射面時，從反射面朝半導體封裝吸附側發出的光成為反射光。因而，所謂「反射特性」是指所述反射光的特性。作為反射特性，包含反射率、反射光的光譜等波長特性。另外，雖將後述，但在將熒光材料用於反射層時，熒光（包含磷光）也包含於反射光中。Here, "reflected light" is defined as the light emitted from the reflective surface when the irradiated light is irradiated to the reflective surface from the light-irradiating side. In this embodiment, when the irradiation light is irradiated to the reflective surface of the semiconductor package and the bottom surface of the groove from the adsorption side of the semiconductor package, light emitted from the reflective surface toward the adsorption side of the semiconductor package becomes reflected light. Therefore, the "reflective characteristic" means the characteristic of the reflected light. The reflection characteristics include wavelength characteristics such as reflectance and spectrum of reflected light. In addition, although described later, when a fluorescent material is used for the reflective layer, fluorescence (including phosphorescence) is also included in the reflected light.
在本實施方式中，為了使吸附於保持構件13的半導體封裝10的邊緣檢測變得容易而在格子狀的槽19上配置反射特性與半導體封裝10不同的反射層20。作為反射層20，例如將反射率比半導體封裝10大（反射的光強度大）的金屬層等配置於格子狀的槽19。通過在格子狀的槽19上配置反射率與半導體封裝10不同的反射層20而能夠使半導體封裝10的邊緣界限部的對比更明確。因而，能夠容易且精度良好地進行半導體封裝10的邊緣檢測。並且能夠縮短對邊緣進行檢測的時間。In this embodiment, in order to facilitate detection of the edge of the semiconductor package 10 adsorbed on the holding member 13, a reflective layer 20 having a reflection characteristic different from that of the semiconductor package 10 is disposed on the lattice-shaped grooves 19. As the reflection layer 20, for example, a metal layer or the like having a higher reflectance than the semiconductor package 10 (higher reflected light intensity) is arranged in the grid-shaped grooves 19. By arranging the reflective layer 20 having a reflectance different from that of the semiconductor package 10 on the lattice-shaped grooves 19, the comparison of the edge boundary portions of the semiconductor package 10 can be made clearer. Therefore, edge detection of the semiconductor package 10 can be performed easily and accurately. And can shorten the time to detect the edge.
作為反射層20，只要為反射特性與保持對象物不同的構件則無特別要求。較佳為反射層與保持對象物的反射率的差（反射的光強度的差）較大。保持對象物若為半導體封裝10，則只要配置反射率比半導體封裝10大的構件即可。作為反射率比半導體封裝10大的構件，可列舉：鋁（Al）、銅（Cu）、鎳（Ni）等的金屬層。在金屬層上包含利用鍍敷而形成的鍍敷層。除金屬層以外，也可將包含導電性粒子的樹脂層、具有金屬光澤的塗料層、熒光塗料層等反射率比半導體封裝10大的材料配置於格子狀的槽19。只要是反射特性與半導體封裝10不同的材料則無特別要求。如上述，在使用熒光塗料層的情況下，成為包含從熒光塗料層發出的熒光（包含磷光）的反射光的特性。The reflection layer 20 is not particularly required as long as it is a member having a reflection characteristic different from that of the object to be held. It is preferable that the difference in reflectance (difference in reflected light intensity) between the reflective layer and the object to be held is large. If the object to be held is the semiconductor package 10, a member having a reflectance larger than that of the semiconductor package 10 may be disposed. Examples of members having a higher reflectance than the semiconductor package 10 include metal layers such as aluminum (Al), copper (Cu), and nickel (Ni). The metal layer includes a plating layer formed by plating. In addition to the metal layer, a material having a higher reflectance than the semiconductor package 10 such as a resin layer containing conductive particles, a paint layer having metallic luster, and a fluorescent paint layer may be disposed in the grid-shaped grooves 19. There is no particular requirement as long as it is a material having a reflection characteristic different from that of the semiconductor package 10. As described above, when the fluorescent paint layer is used, it has characteristics of reflected light including fluorescence (including phosphorescence) emitted from the fluorescent paint layer.
（保持構件的製造方法） 參照圖3（a）～圖3（e）對製造圖2（a）及圖2（b）所示的保持構件13的步驟與將所製造的保持構件13安裝於檢查平臺12的步驟進行說明。(Manufacturing Method of Holding Member) Referring to FIGS. 3 (a) to 3 (e), the steps of manufacturing the holding member 13 shown in FIGS. 2 (a) and 2 (b) and attaching the manufactured holding member 13 to The procedure for inspecting the platform 12 is explained.
如圖3（a）所示，首先，準備用以製造保持構件13的作為基座的板狀的彈性樹脂16。接著，在對半導體封裝10進行吸附保持的多個區域17中分別形成多個吸附孔18。多個吸附孔18以貫通彈性樹脂16的方式形成。多個吸附孔18例如利用鑽機或雷射等來形成。As shown in FIG. 3 (a), first, a plate-like elastic resin 16 as a base for manufacturing the holding member 13 is prepared. Next, a plurality of suction holes 18 are formed in each of the plurality of regions 17 that hold and hold the semiconductor package 10. The plurality of suction holes 18 are formed so as to penetrate the elastic resin 16. The plurality of suction holes 18 are formed using, for example, a drill or a laser.
接著，如圖3（b）所示，在多個吸附孔18之間及多個吸附孔18的外側形成格子狀的槽19。格子狀的槽19例如利用旋轉刀（切斷刀片）或雷射等來形成。通過形成格子狀的槽19，由格子狀的槽19包圍的多個突起狀的區域17成為分別對半導體封裝10進行吸附保持的吸附面。若使用雷射來形成吸附孔18及槽19，則能夠利用共同的步驟來形成，因此較有效率。Next, as shown in FIG. 3 (b), grid-shaped grooves 19 are formed between the plurality of adsorption holes 18 and outside the plurality of adsorption holes 18. The grid-shaped grooves 19 are formed by, for example, a rotary blade (cutting blade), a laser, or the like. By forming the grid-shaped grooves 19, the plurality of projecting regions 17 surrounded by the grid-shaped grooves 19 become suction surfaces for holding and holding the semiconductor package 10, respectively. If the adsorption holes 18 and the grooves 19 are formed using a laser, they can be formed by a common step, and thus it is more efficient.
接著，如圖3（c）所示，例如，預先準備形成為與格子狀的槽19對應的圖案的板狀構件21。在板狀構件21上，在與彈性樹脂16的吸附面對應的區域17上形成有孔部。較佳為板狀構件21例如由反射率比半導體封裝10大的鋁（Al）、銅（Cu）、鎳（Ni）等金屬板形成。板狀構件21只要是反射特性與半導體封裝10不同的材料即可。當俯視時，格子狀的槽19的圖案與板狀構件21的圖案以對應且重疊的方式形成。板狀構件的形狀較佳為以在彈性樹脂的槽與板狀構件的孔部之間設置間隙從而板狀構件的安裝或拆卸變得容易的方式設計。Next, as shown in FIG. 3 (c), for example, a plate-shaped member 21 formed in a pattern corresponding to the grid-shaped grooves 19 is prepared in advance. In the plate-like member 21, a hole portion is formed in a region 17 corresponding to the adsorption surface of the elastic resin 16. The plate-shaped member 21 is preferably formed of a metal plate such as aluminum (Al), copper (Cu), or nickel (Ni) having a reflectance greater than that of the semiconductor package 10. The plate-like member 21 may be a material having a reflection characteristic different from that of the semiconductor package 10. In a plan view, the pattern of the lattice-shaped grooves 19 and the pattern of the plate-like member 21 are formed so as to correspond to and overlap each other. The shape of the plate-like member is preferably designed in such a manner that a gap is provided between the groove of the elastic resin and the hole portion of the plate-like member so that the installation or removal of the plate-like member becomes easy.
接著，如圖3（d）所示，將板狀構件21插入至格子狀的槽19來進行配置。換句話來說，將板狀構件21嵌入並固定於格子狀的槽19。因而，可將板狀構件21從保持構件13中拆卸來進行更換。能夠與半導體封裝10對應地將反射特性不同的板狀構件21配置於格子狀的槽19。因而，能夠根據半導體封裝10的反射特性來使用適當的板狀構件21。利用至此為止的步驟來製造對半導體封裝10進行吸附保持的保持構件13。Next, as shown in FIG. 3 (d), the plate-shaped member 21 is inserted into the grid-shaped groove 19 and arranged. In other words, the plate-shaped member 21 is fitted and fixed to the grid-shaped groove 19. Therefore, the plate-like member 21 can be detached from the holding member 13 and replaced. The plate-shaped members 21 having different reflection characteristics can be arranged in the grid-shaped grooves 19 in accordance with the semiconductor package 10. Therefore, an appropriate plate-shaped member 21 can be used in accordance with the reflection characteristics of the semiconductor package 10. By the steps so far, the holding member 13 that holds and holds the semiconductor package 10 is manufactured.
接著，如圖3（e）所示，將保持構件13安裝於檢查平臺12上。在檢查平臺12中形成有空間22，保持構件13的多個吸附孔18分別與檢查平臺12的空間22連通。檢查平臺12的空間22經由開口部23而連接於吸附機構24。作為吸附機構24，例如使用真空泵等。多個半導體封裝10經由吸附孔18、空間22、開口部23而被吸附且保持於保持構件13。Next, as shown in FIG. 3 (e), the holding member 13 is mounted on the inspection platform 12. A space 22 is formed in the inspection platform 12, and a plurality of suction holes 18 of the holding member 13 communicate with the space 22 of the inspection platform 12, respectively. The space 22 of the inspection platform 12 is connected to the suction mechanism 24 via the opening 23. As the adsorption mechanism 24, for example, a vacuum pump or the like is used. The plurality of semiconductor packages 10 are sucked and held on the holding member 13 through the suction holes 18, the space 22, and the opening 23.
在本實施方式中，在格子狀的槽19上配置有反射特性與半導體封裝10不同的板狀構件21。並不限於此，也可在格子狀的槽19上塗布反射特性與半導體封裝10不同的構件。只要在格子狀的槽19上形成反射特性與半導體封裝10不同的構件即可。In the present embodiment, a plate-like member 21 having a reflection characteristic different from that of the semiconductor package 10 is arranged on the lattice-shaped grooves 19. It is not limited to this, and a member having a reflection characteristic different from that of the semiconductor package 10 may be applied to the lattice-shaped grooves 19. It is only necessary to form a member having a reflection characteristic different from that of the semiconductor package 10 in the lattice-shaped grooves 19.
（作用效果） 本實施方式的保持構件13是一種對多個作為保持對象物的半導體封裝10進行保持並用於光學檢查的保持構件，其構成為包括：彈性樹脂16，設置有對半導體封裝10進行吸附以加以保持的多個吸附孔18、及配置於多個吸附孔18之間的格子狀的槽19；以及反射層20，配置於槽19。(Effects and Effects) The holding member 13 according to the present embodiment is a holding member that holds a plurality of semiconductor packages 10 that are objects to be held and is used for optical inspection. The holding member 13 includes an elastic resin 16 and is provided to hold the semiconductor package 10. The plurality of adsorption holes 18 sucked and held and the lattice-shaped grooves 19 arranged between the plurality of adsorption holes 18; and the reflective layer 20 is arranged in the grooves 19.
本實施方式的保持構件13的製造方法是一種對多個作為保持對象物的半導體封裝10進行保持並用於光學檢查的保持構件的製造方法，其對形成有多個吸附孔18以及格子狀的槽19的彈性樹脂16在槽19上形成反射層20，所述多個吸附孔18對半導體封裝10進行吸附以加以保持，所述格子狀的槽19配置於吸附孔18之間。The manufacturing method of the holding member 13 according to the present embodiment is a method of manufacturing a holding member that holds a plurality of semiconductor packages 10 that are objects to be held and is used for optical inspection. The holding member 13 includes a plurality of suction holes 18 and a grid-shaped groove. The elastic resin 16 of 19 forms a reflective layer 20 on the grooves 19. The plurality of suction holes 18 suck and hold the semiconductor package 10. The grid-shaped grooves 19 are arranged between the suction holes 18.
根據此種構成，保持構件13將多個半導體封裝10吸附且保持於多個吸附孔18。保持構件13包含彈性樹脂16，且在彈性樹脂16上形成格子狀的槽19。在格子狀的槽19上配置反射特性與半導體封裝10不同的反射層20。藉此，能夠使半導體封裝10的邊緣界限部的對比更明確。因而，能夠精度良好地進行半導體封裝10的邊緣檢測。並且，能夠使邊緣檢測變得容易。With this configuration, the holding member 13 sucks and holds the plurality of semiconductor packages 10 in the plurality of suction holes 18. The holding member 13 includes an elastic resin 16, and a grid-like groove 19 is formed in the elastic resin 16. A reflective layer 20 having a reflection characteristic different from that of the semiconductor package 10 is disposed on the lattice-shaped grooves 19. This makes it possible to make the comparison of the edge boundary portions of the semiconductor package 10 clearer. Therefore, edge detection of the semiconductor package 10 can be performed with high accuracy. In addition, edge detection can be facilitated.
更詳細來說，根據本實施方式，在切斷裝置1中，在檢查平臺12上安裝包含彈性樹脂16的保持構件13。在保持構件13上吸附且保持將封裝基板2切斷而經單片化的多個半導體封裝10。在形成於彈性樹脂16的格子狀的槽19上配置反射特性與半導體封裝10不同的反射層20。藉此，能夠使半導體封裝10的反射光與反射層20的反射光的光強度的差變大。因而，能夠使半導體封裝10的邊緣界限部的對比明確。因此，能夠精度良好地進行半導體封裝10的邊緣檢測。More specifically, according to the present embodiment, in the cutting device 1, the holding member 13 including the elastic resin 16 is attached to the inspection platform 12. The plurality of semiconductor packages 10 which cut the package substrate 2 and are singulated are sucked and held on the holding member 13. A grid-shaped groove 19 formed in the elastic resin 16 is provided with a reflection layer 20 having a reflection characteristic different from that of the semiconductor package 10. This makes it possible to increase the difference in light intensity between the reflected light of the semiconductor package 10 and the reflected light of the reflective layer 20. Therefore, the comparison of the edge boundary portions of the semiconductor package 10 can be made clear. Therefore, edge detection of the semiconductor package 10 can be performed with high accuracy.
根據本實施方式，在形成於彈性樹脂16的格子狀的槽19上配置反射特性與半導體封裝10不同的反射層20。通過對保持構件13實施簡單的加工，能夠使半導體封裝10的邊緣界限部的對比明確。即便使用具備現有的照明的光學檢查方法也能夠使半導體封裝10的邊緣檢測變得容易。因而，能夠縮短邊緣檢測所需要的時間，並使外觀檢查的作業性提高。並且，能夠使切斷裝置1中的檢查效率提高。According to the present embodiment, a reflective layer 20 having a reflection characteristic different from that of the semiconductor package 10 is disposed on the lattice-shaped grooves 19 formed in the elastic resin 16. By simply processing the holding member 13, the contrast of the edge boundary portions of the semiconductor package 10 can be made clear. Even when an optical inspection method including a conventional illumination is used, edge detection of the semiconductor package 10 can be facilitated. Therefore, the time required for edge detection can be shortened, and the workability of appearance inspection can be improved. In addition, inspection efficiency in the cutting device 1 can be improved.
根據本實施方式，作為反射特性與半導體封裝10不同的反射層而使用了板狀構件21，所述板狀構件21包含形成為與格子狀的槽19對應的圖案的金屬板。板狀構件21能夠從保持構件13中拆卸來進行更換。因而，能夠與半導體封裝10對應地將反射率不同的板狀構件21配置於格子狀的槽19。能夠與半導體封裝10的反射特性對應地來使用適當的板狀構件21。According to this embodiment, a plate-like member 21 is used as a reflection layer having a reflection characteristic different from that of the semiconductor package 10, and the plate-like member 21 includes a metal plate formed in a pattern corresponding to the grid-shaped grooves 19. The plate-like member 21 can be detached from the holding member 13 and replaced. Therefore, it is possible to arrange the plate-shaped members 21 having different reflectances in the lattice-shaped grooves 19 in accordance with the semiconductor package 10. An appropriate plate-shaped member 21 can be used in accordance with the reflection characteristics of the semiconductor package 10.
[實施方式2] （保持構件的構成） 參照圖4（a）及圖4（b）對實施方式2中使用的保持構件的構成進行說明。與實施方式1的不同在於：將彈性樹脂安裝於支撐構件來構成保持構件。除此以外的構成與實施方式1基本相同，因此省略說明。[Embodiment 2] (Configuration of Holding Member) The configuration of a holding member used in Embodiment 2 will be described with reference to Figs. 4 (a) and 4 (b). The difference from Embodiment 1 is that an elastic resin is attached to a support member to constitute a holding member. The other configurations are basically the same as those of the first embodiment, and therefore descriptions thereof are omitted.
如圖4（a）及圖4（b）所示，保持構件25例如是在支撐構件26上安裝彈性樹脂16來構成。作為支撐構件26，使用金屬板、亞克力板、硬質樹脂板等。與實施方式1同樣地，在彈性樹脂16上形成格子狀的槽19。由格子狀的槽19包圍的多個突起狀的區域17成為配置並吸附半導體封裝10的區域。在多個突起狀的區域17中分別形成用以對半導體封裝10進行吸附保持的吸附孔27。吸附孔27以貫通彈性樹脂16及保持構件26的方式形成。As shown in FIGS. 4 (a) and 4 (b), the holding member 25 is configured by, for example, mounting an elastic resin 16 on a support member 26. As the support member 26, a metal plate, an acrylic plate, a hard resin plate, or the like is used. As in the first embodiment, grid-shaped grooves 19 are formed in the elastic resin 16. The plurality of protruding regions 17 surrounded by the lattice-shaped grooves 19 are regions where the semiconductor package 10 is arranged and adsorbed. Attachment holes 27 for holding and holding the semiconductor package 10 are formed in the plurality of protruding regions 17. The suction hole 27 is formed so as to penetrate the elastic resin 16 and the holding member 26.
與實施方式1同樣地，為了使半導體封裝10的邊緣檢測變得容易，在格子狀的槽19上配置反射特性與半導體封裝10不同的反射層20。作為反射層20，配置反射率比半導體封裝10大（反射的光強度大）的金屬層等。通過在格子狀的槽19上配置反射率比半導體封裝10大的反射層20，能夠使半導體封裝10的邊緣界限部的對比更明確。因而，能夠容易且精度良好地進行半導體封裝10的邊緣檢測。與實施方式1同樣地，作為反射層20，除金屬層以外，也使用鍍敷層、包含導電性粒子的樹脂層、具有金屬光澤的塗料層、熒光塗料層等作為反射特性與半導體封裝10不同的構件。As in the first embodiment, in order to facilitate edge detection of the semiconductor package 10, a reflective layer 20 having a reflection characteristic different from that of the semiconductor package 10 is arranged on the grid-shaped grooves 19. As the reflective layer 20, a metal layer or the like having a higher reflectance (higher reflected light intensity) than the semiconductor package 10 is disposed. By arranging the reflective layer 20 having a higher reflectance than the semiconductor package 10 in the lattice-shaped grooves 19, the contrast of the edge boundary portions of the semiconductor package 10 can be made clearer. Therefore, edge detection of the semiconductor package 10 can be performed easily and accurately. As in the first embodiment, as the reflective layer 20, in addition to the metal layer, a plating layer, a resin layer containing conductive particles, a coating layer having metallic gloss, a fluorescent coating layer, and the like are used as the reflection characteristics different from the semiconductor package 10. Building blocks.
在本實施方式中，將彈性樹脂16安裝於支撐構件26上。因彈性樹脂16被固定於支撐構件26上，故能夠抑制彈性樹脂16撓曲。因而，支撐構件26作為保持構件25的加強材而發揮功能。在保持構件25（彈性樹脂16）的面積大的情況下，此種效果變得更顯著。In this embodiment, the elastic resin 16 is attached to the support member 26. Since the elastic resin 16 is fixed to the support member 26, the elastic resin 16 can be suppressed from being deflected. Therefore, the support member 26 functions as a reinforcing material of the holding member 25. When the area of the holding member 25 (the elastic resin 16) is large, this effect becomes more significant.
（保持構件的製造方法） 參照圖5（a）～圖5（f）對製造圖4（a）及圖4（b）所示的保持構件25的步驟與將所製造的保持構件25安裝於檢查平臺12的步驟進行說明。(Manufacturing Method of Holding Member) Referring to FIGS. 5 (a) to 5 (f), the steps of manufacturing the holding member 25 shown in FIGS. 4 (a) and 4 (b) and attaching the manufactured holding member 25 to The procedure for inspecting the platform 12 is explained.
如圖5（a）所示，首先在作為基座的板狀的彈性樹脂16上形成罩幕28。作為罩幕28，例如能夠使用溶解於不會溶解反射層20與彈性樹脂16的液體中的材料。作為罩幕28的材料，較佳的是與彈性樹脂16的密接性良好，且能夠從彈性樹脂16經化學去除的材料。As shown in FIG. 5 (a), first, a cover 28 is formed on a plate-shaped elastic resin 16 as a base. As the cover 28, for example, a material dissolved in a liquid that does not dissolve the reflective layer 20 and the elastic resin 16 can be used. As the material of the cover 28, a material having good adhesion to the elastic resin 16 and capable of being chemically removed from the elastic resin 16 is preferred.
接著，如圖5（b）所示，通過對罩幕28及彈性樹脂16進行機械加工來形成格子狀的槽19。格子狀的槽19例如利用旋轉刀（切斷刀片）或雷射等來形成。在此種狀態下，在由格子狀的槽19包圍的多個區域17中為殘存有罩幕28的狀態。Next, as shown in FIG. 5 (b), the grids 19 are formed by machining the cover 28 and the elastic resin 16. The grid-shaped grooves 19 are formed by, for example, a rotary blade (cutting blade), a laser, or the like. In this state, the mask 28 is left in the plurality of regions 17 surrounded by the grid-shaped grooves 19.
接著，如圖5（c）所示，在將罩幕28殘存於彈性樹脂16上的狀態下，在彈性樹脂16的露出至吸附面側的部分及罩幕的露出側形成反射層20。藉此，在罩幕28的表面形成反射層20a，在格子狀的槽19的底面形成反射層20b。雖在罩幕28的表面及格子狀的槽19的底面形成反射層20（20a、20b），但在罩幕28及彈性樹脂16的側面不形成反射層。Next, as shown in FIG. 5 (c), in a state where the cover 28 is left on the elastic resin 16, the reflective layer 20 is formed on the portion of the elastic resin 16 exposed to the suction surface side and the exposed side of the cover. Thereby, a reflective layer 20 a is formed on the surface of the cover 28, and a reflective layer 20 b is formed on the bottom surface of the lattice-shaped groove 19. Although the reflective layer 20 (20a, 20b) is formed on the surface of the cover 28 and the bottom surface of the grid-shaped grooves 19, the reflective layer is not formed on the side of the cover 28 and the elastic resin 16.
與實施方式1同樣地，作為反射層20（20a、20b）而形成反射特性與半導體封裝10不同的構件。較佳為形成反射率比半導體封裝10大的構件。作為反射率比半導體封裝10大的構件，列舉金屬層、包含導電性粒子的樹脂層、具有金屬光澤的塗料層等。使反射層20形成於罩幕28的表面及格子狀的槽19的底面，但在罩幕28及格子狀的槽19的側面不形成反射層20。As in the first embodiment, members having different reflection characteristics from those of the semiconductor package 10 are formed as the reflection layers 20 (20 a and 20 b). It is preferable to form a member having a reflectance larger than that of the semiconductor package 10. Examples of members having a higher reflectance than the semiconductor package 10 include a metal layer, a resin layer containing conductive particles, and a coating layer having a metallic luster. The reflective layer 20 is formed on the surface of the cover 28 and the bottom surface of the grid-shaped grooves 19, but the reflective layer 20 is not formed on the sides of the cover 28 and the grid-shaped grooves 19.
接著，如圖5（d）所示，將彈性樹脂16上的罩幕28去除。藉此，形成於罩幕28上的反射層20（20a）也與罩幕28一同被去除。利用所謂的剝離製程（lift-off process）將罩幕28上的反射層20（20a）與罩幕28一同去除。結果，能夠使反射特性與半導體封裝10不同的反射層20僅殘存於格子狀的槽19的底面。Next, as shown in FIG. 5 (d), the mask 28 on the elastic resin 16 is removed. Thereby, the reflective layer 20 (20 a) formed on the cover 28 is also removed together with the cover 28. The so-called lift-off process is used to remove the reflective layer 20 (20 a) on the mask 28 together with the mask 28. As a result, the reflection layer 20 having a reflection characteristic different from that of the semiconductor package 10 can be left only on the bottom surface of the lattice-shaped grooves 19.
罩幕的去除能夠採用浸漬於溶液中來使罩幕溶解的方法。此種情況下，作為溶液，只要使用溶解罩幕但不溶解彈性樹脂與反射層的溶液即可。另外，較佳為在槽側面的至少一部分不形成金屬層，以便在浸漬於溶液中時罩幕與溶液接觸。再者，在形成於槽側面的金屬層比形成於槽底面的金屬層薄的情況下，也可浸漬於超聲波槽中並利用超聲波振動將槽側面的金屬層剝離，從而使罩幕與溶液接觸。The mask can be removed by immersion in a solution to dissolve the mask. In this case, the solution may be a solution that dissolves the mask but does not dissolve the elastic resin and the reflective layer. In addition, it is preferable that a metal layer is not formed on at least a part of the side of the groove so that the mask comes into contact with the solution when immersed in the solution. Furthermore, when the metal layer formed on the side surface of the tank is thinner than the metal layer formed on the bottom surface of the tank, the metal layer on the side of the tank may be immersed in an ultrasonic tank and peeled off by ultrasonic vibration, thereby bringing the cover into contact with the solution .
作為在罩幕28的表面及格子狀的槽19的底面形成反射層20的方法，有如下的方法。作為第1方法，能夠利用濺鍍法或真空蒸鍍法將金屬層形成於罩幕28的表面及格子狀的槽19的底面。作為第2方法，能夠利用無電鍍敷法將金屬層形成於罩幕28的表面及格子狀的槽19的底面。作為第3方法，能夠通過塗布包含導電性粒子的樹脂層來將樹脂層形成於罩幕28的表面及格子狀的槽19的底面。作為第4方法，能夠通過利用噴霧法吹附具有金屬光澤的塗料層或熒光塗料層等，來將塗料層形成於罩幕28的表面及格子狀的槽19的底面。As a method of forming the reflective layer 20 on the surface of the cover 28 and the bottom surface of the grid-shaped grooves 19, there are the following methods. As a first method, a metal layer can be formed on the surface of the cover 28 and the bottom surface of the grid-shaped grooves 19 by a sputtering method or a vacuum evaporation method. As a second method, a metal layer can be formed on the surface of the cover 28 and the bottom surface of the grid-shaped grooves 19 by an electroless plating method. As a third method, a resin layer containing conductive particles can be applied to form a resin layer on the surface of the cover 28 and the bottom surface of the grid-shaped grooves 19. As a fourth method, a coating layer having a metallic luster, a fluorescent coating layer, or the like can be applied by a spray method to form a coating layer on the surface of the cover 28 and the bottom surface of the grid-shaped grooves 19.
接著，如圖5（e）所示，將在格子狀的槽19上形成有反射層20的彈性樹脂16安裝於支撐構件26。接著，在由格子狀的槽19包圍的多個突起狀的區域17中分別形成吸附孔27。以貫通彈性樹脂16及支撐構件26的方式形成吸附孔27。利用鑽機或雷射等來形成吸附孔27。利用至此為止的步驟來製造對半導體封裝10進行吸附保持的保持構件25。Next, as shown in FIG. 5 (e), the elastic resin 16 having the reflective layer 20 formed in the grid-shaped grooves 19 is attached to the support member 26. Next, suction holes 27 are formed in the plurality of protruding regions 17 surrounded by the lattice-shaped grooves 19. The suction hole 27 is formed so as to penetrate the elastic resin 16 and the support member 26. The suction hole 27 is formed using a drill, a laser, or the like. By the steps so far, the holding member 25 that adsorbs and holds the semiconductor package 10 is manufactured.
此種情況下，將在格子狀的槽19上形成有反射層20的彈性樹脂16安裝於支撐構件26後，以貫通彈性樹脂16及支撐構件26的方式形成吸附孔27。並不限於此，也可在彈性樹脂16及支撐構件26中分別形成貫通孔後，將彈性樹脂16安裝於支撐構件26並將各自的貫通孔連接來形成吸附孔27。形成吸附孔27的步驟可在將彈性樹脂16安裝於支撐構件26之前，也可在將彈性樹脂16安裝於支撐構件26之後。In this case, after the elastic resin 16 having the reflective layer 20 formed in the lattice-shaped grooves 19 is attached to the support member 26, the suction holes 27 are formed so as to penetrate the elastic resin 16 and the support member 26. It is not limited to this, and after the through holes are formed in the elastic resin 16 and the support member 26, the elastic resin 16 may be mounted on the support member 26 and the respective through holes may be connected to form the suction holes 27. The step of forming the suction hole 27 may be before the elastic resin 16 is mounted on the support member 26, or after the elastic resin 16 is mounted on the support member 26.
在形成吸附孔的步驟在對彈性樹脂安裝前的情況下，例如，在吸附孔形成後使罩幕用的黏著片材黏著於吸附孔的吸附面而進行槽形成。其後，在彈性樹脂的露出至吸附面的部分及黏著片材的露出側形成反射層。作為黏著片材，能夠使用溶解於不會溶解反射層20與彈性樹脂16的液體中的材料，且使用在樹脂片材的至少單面配置有黏著劑的構成。作為黏著劑，例如能夠使用膠黏劑（壓敏黏著劑：pressure sensitive adhesive）。In the case of forming the adsorption hole before mounting the elastic resin, for example, after the adsorption hole is formed, an adhesive sheet for a cover is adhered to the adsorption surface of the adsorption hole to form a groove. Thereafter, a reflective layer is formed on a portion of the elastic resin exposed to the adsorption surface and an exposed side of the adhesive sheet. As the adhesive sheet, a material dissolved in a liquid that does not dissolve the reflective layer 20 and the elastic resin 16 can be used, and a configuration in which an adhesive is arranged on at least one side of the resin sheet can be used. As the adhesive, for example, an adhesive (pressure sensitive adhesive) can be used.
接著，如圖5（f）所示，將保持構件25安裝於檢查平臺12上。多個半導體封裝10經由保持構件25的吸附孔27、檢查平臺12的空間22及開口部23而被吸附且保持於保持構件25。Next, as shown in FIG. 5 (f), the holding member 25 is attached to the inspection platform 12. The plurality of semiconductor packages 10 are sucked and held on the holding member 25 via the suction holes 27 of the holding member 25, the space 22 and the opening 23 of the inspection platform 12.
（作用效果） 根據本實施方式，在支撐構件26上安裝彈性樹脂16來製造保持構件25。因彈性樹脂16被固定於支撐構件26上，故能夠抑制彈性樹脂16撓曲。因而，支撐構件16作為保持構件25的加強材發揮功能。特別是在保持構件25（彈性樹脂16）的面積大的情況下，本實施方式的效果變得更加顯著。(Effects) According to the present embodiment, the elastic member 16 is attached to the support member 26 to manufacture the holding member 25. Since the elastic resin 16 is fixed to the support member 26, the elastic resin 16 can be suppressed from being deflected. Therefore, the support member 16 functions as a reinforcing material of the holding member 25. In particular, when the area of the holding member 25 (the elastic resin 16) is large, the effect of the present embodiment becomes more significant.
根據本實施方式，在彈性樹脂16上殘存有罩幕28的狀態下形成格子狀的槽19。反射層20形成於罩幕28的表面及格子狀的槽19的底面，但在罩幕28及格子狀的槽19的側面不形成反射層20。通過去除罩幕28能夠使反射層20僅殘存於格子狀的槽19的底面。因而，能夠使半導體封裝10的邊緣界限部的對比明確。能夠精度良好且容易地進行半導體封裝10的邊緣檢測。並且，在本實施方式中，當然也起到與實施方式1同樣的效果。According to this embodiment, the grid-shaped grooves 19 are formed in a state where the cover 28 is left on the elastic resin 16. The reflective layer 20 is formed on the surface of the cover 28 and the bottom surface of the grid-shaped grooves 19, but the reflective layer 20 is not formed on the side surfaces of the cover 28 and the grid-shaped grooves 19. By removing the mask 28, the reflective layer 20 can be left only on the bottom surface of the grid-shaped grooves 19. Therefore, the comparison of the edge boundary portions of the semiconductor package 10 can be made clear. The edge detection of the semiconductor package 10 can be performed accurately and easily. In addition, in this embodiment, it is needless to say that the same effects as those of the first embodiment can be achieved.
在各實施方式中，對以下情況進行了說明：作為切斷對象物，使用了對裝配有半導體晶片的基板進行樹脂密封而成的封裝基板。作為封裝基板，使用BGA封裝基板、LGA封裝基板、CSP封裝基板等。進而，也可將本發明應用於晶片級封裝。另外，作為切斷對象物，也可將本發明應用於對裝配有半導體晶片的引線框架進行樹脂密封而成的已密封引線框架。In each embodiment, a case has been described in which a package substrate obtained by resin-sealing a substrate on which a semiconductor wafer is mounted is used as a cutting target. As the package substrate, a BGA package substrate, an LGA package substrate, a CSP package substrate, or the like is used. Furthermore, the present invention can also be applied to a wafer-level package. In addition, as a cutting object, the present invention can also be applied to a sealed lead frame obtained by resin-sealing a lead frame on which a semiconductor wafer is mounted.
在各實施方式中，對以下情況進行了說明：作為保持對象物，使用將封裝基板切斷而經單片化的半導體封裝。作為半導體封裝，能夠將本發明應用於BGA、LGA、CSP、QFN、LED等半導體封裝。進而，也能夠將本發明應用於這些半導體封裝以外的經單片化的半導體封裝全體。In each embodiment, a case has been described in which, as a holding object, a semiconductor package in which a package substrate is cut and singulated is used. As a semiconductor package, the present invention can be applied to semiconductor packages such as BGA, LGA, CSP, QFN, and LED. Furthermore, the present invention can also be applied to the entire singulated semiconductor package other than these semiconductor packages.
如上所述，上述實施方式的保持構件是對多個保持對象物進行保持並用於光學檢查的保持構件，其構成為包括：彈性樹脂，設置有對保持對象物進行吸附以加以保持的多個吸附孔、及配置於多個吸附孔之間的格子狀的槽；以及反射層，配置於槽上。As described above, the holding member of the above-mentioned embodiment is a holding member that holds a plurality of holding objects and is used for optical inspection, and is configured to include an elastic resin provided with a plurality of adsorptions that hold and hold the holding objects. A hole and a grid-shaped groove arranged between the plurality of adsorption holes; and a reflective layer arranged on the groove.
根據所述構成，在格子狀的槽上配置反射特性與保持對象物不同的反射層。藉此，能夠使保持對象物的邊緣界限部的對比明確。因而，能夠精度良好地進行保持對象物的邊緣檢測。According to the configuration, a reflective layer having a reflection characteristic different from that of the object to be held is arranged on the lattice-shaped groove. Thereby, the contrast of the edge boundary part of a holding object can be made clear. Therefore, the edge detection of the holding object can be performed with high accuracy.
進而，在上述實施方式的保持構件中，設為在配置有吸附孔的區域的外側也配置反射層的構成。Furthermore, in the holding member of the above-mentioned embodiment, a configuration in which a reflective layer is also arranged outside the region where the adsorption holes are arranged is adopted.
根據所述構成，在最外周的保持對象物的外側也配置反射層。因而，在最外周的保持對象物中也能夠精度良好地進行邊緣檢測。With this configuration, the reflective layer is also arranged on the outer side of the outermost holding object. Therefore, edge detection can be performed with high accuracy even in the outermost holding object.
進而，在上述實施方式的保持構件中，設為反射層包含金屬層、樹脂層、塗料層中的任一者的構成。Furthermore, in the holding member of the above-mentioned embodiment, it is assumed that the reflective layer includes any one of a metal layer, a resin layer, and a paint layer.
根據所述構成，在格子狀的槽上配置反射特性與保持對象物不同的反射層。因而，能夠使保持對象物的邊緣界限部的對比明確。According to the configuration, a reflective layer having a reflection characteristic different from that of the object to be held is arranged on the lattice-shaped groove. Therefore, the contrast of the edge boundary portion of the holding object can be made clear.
進而，在上述實施方式的保持構件中，設為還包括對彈性樹脂進行支撐的支撐構件的構成。Furthermore, the holding member of the above-mentioned embodiment is configured to further include a supporting member that supports an elastic resin.
根據所述構成，彈性樹脂被安裝於支撐構件上而得以固定。因而，能夠抑制彈性樹脂撓曲。According to this configuration, the elastic resin is fixed to the support member by being mounted. Therefore, it is possible to suppress the flexure of the elastic resin.
進而，在上述實施方式的檢查裝置中，設為設有對保持於保持構件的保持對象物進行檢查的檢查機構的構成。Furthermore, in the inspection apparatus of the said embodiment, it is set as the structure provided with the inspection mechanism which inspects the holding object hold | maintained by the holding member.
根據所述構成，利用檢查機構對保持於保持構件的保持對象物進行檢查。因在保持構件上配置有反射層，故能夠精度良好地進行保持對象物的邊緣檢測。According to the configuration, the holding object held by the holding member is inspected by the inspection mechanism. Since the reflecting layer is arranged on the holding member, the edge detection of the holding object can be performed with high accuracy.
進而，在上述實施方式的切斷裝置中，設為在檢查平臺上包括保持構件的構成。Furthermore, in the cutting device of the said embodiment, it is set as the structure which includes a holding member in an inspection platform.
根據所述構成，在檢查平臺上安裝配置有反射層的保持構件。因而，能夠使保持對象物的邊緣檢測變得容易。With this configuration, the holding member on which the reflective layer is arranged is attached to the inspection platform. Therefore, the edge detection of the holding object can be facilitated.
上述實施方式的保持構件的製造方法是對多個保持對象物進行保持並用於光學檢查的保持構件的製造方法，其對形成有多個吸附孔以及格子狀的槽的彈性樹脂在槽上形成反射層，所述多個吸附孔對保持對象物進行吸附以加以保持，所述格子狀的槽配置於吸附孔之間。The manufacturing method of the holding member according to the above embodiment is a method of manufacturing a holding member that holds a plurality of holding objects and is used for optical inspection, and reflects the elastic resin formed with a plurality of suction holes and a grid-shaped groove on the groove. Layer, the plurality of adsorption holes adsorb and hold the object to be held, and the lattice-shaped grooves are arranged between the adsorption holes.
根據所述方法，對形成有格子狀的槽的彈性樹脂在槽上形成反射層來製造保持構件。藉此，能夠使保持對象物的邊緣界限部的對比明確。因而，能夠精度良好地進行保持對象物的邊緣檢測。According to the method, a reflective layer is formed on the grooves of the elastic resin having the grid-like grooves formed thereon to manufacture the holding member. Thereby, the contrast of the edge boundary part of a holding object can be made clear. Therefore, the edge detection of the holding object can be performed with high accuracy.
進而，上述實施方式的保持構件的製造方法為了形成反射層而將對應於槽的格子狀的板狀構件配置於槽上。Furthermore, in the manufacturing method of the holding member of the said embodiment, in order to form a reflective layer, the grid-like plate-shaped member corresponding to a groove is arrange | positioned on a groove.
根據所述方法，在格子狀的槽上配置反射特性與保持對象物不同的板狀構件。因而，能夠使保持對象物的邊緣界限部的對比明確。並且，能夠對板狀構件進行更換來使用。According to the method, a plate-shaped member having a reflection characteristic different from that of the object to be held is arranged on the lattice-shaped groove. Therefore, the contrast of the edge boundary portion of the holding object can be made clear. In addition, the plate-shaped member can be replaced and used.
進而，上述實施方式的保持構件的製造方法為了形成反射層而在吸附孔周圍的吸附面上形成罩幕，且對在槽上未形成罩幕的狀態的彈性樹脂在槽上形成膜來作為反射層。Furthermore, in the method for manufacturing a holding member according to the above embodiment, a mask is formed on the adsorption surface around the adsorption hole in order to form a reflective layer, and a film is formed on the groove as a reflection of the elastic resin in a state where no mask is formed on the groove as a reflection. Floor.
根據所述方法，通過在吸附面上形成罩幕而能夠在未形成罩幕的格子狀的槽上容易地形成反射層。因而，能夠使保持對象物的邊緣界限部的對比明確。According to the method, a reflective layer can be easily formed on the grid-shaped grooves on which the mask is not formed by forming the mask on the suction surface. Therefore, the contrast of the edge boundary portion of the holding object can be made clear.
進而，上述實施方式的保持構件的製造方法至少在形成槽之前的彈性樹脂的吸附側形成罩幕，在彈性樹脂的罩幕形成面形成槽，在槽上形成膜來形成反射層，並去除所述罩幕。Furthermore, in the method for manufacturing a holding member according to the above embodiment, a mask is formed at least on the adsorption side of the elastic resin before the groove is formed, a groove is formed on the mask forming surface of the elastic resin, a film is formed on the groove to form a reflective layer, and Said the curtain.
根據此種方法，在彈性樹脂的吸附側形成罩幕，在罩幕形成面形成格子狀的槽。在格子狀的槽上形成反射層後將罩幕去除。藉此，能夠僅在格子狀的槽上殘存反射層。因而，能夠使保持對象物的邊緣界限部的對比明確。According to this method, a cover is formed on the adsorption side of the elastic resin, and a grid-shaped groove is formed on the cover forming surface. After forming a reflective layer on the grid-shaped grooves, the mask is removed. Thereby, the reflective layer can be left only on the lattice-shaped grooves. Therefore, the contrast of the edge boundary portion of the holding object can be made clear.
進而，上述實施方式的保持構件的製造方法為了形成反射層而在配置有吸附孔的區域的外側也形成反射層。Furthermore, in the method for manufacturing a holding member according to the above embodiment, a reflective layer is also formed on the outside of a region where an adsorption hole is arranged in order to form a reflective layer.
根據所述方法，在最外周的保持對象物的外側也配置反射層。因而，在最外周的保持對象物中也能夠使邊緣界限部的對比明確。According to this method, the reflective layer is also arranged on the outer side of the outermost holding object. Therefore, the contrast of the edge boundary portions can be made clear also in the object to be held at the outermost periphery.
本發明並不限定於上述各實施方式，在不脫離本發明的主旨的範圍內，視需要可任意且適當地進行組合、變更，或選擇性地加以採用。The present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately combined, changed, or selectively adopted within a range that does not depart from the gist of the present invention.
1‧‧‧切斷裝置1‧‧‧ cutting device
2‧‧‧封裝基板2‧‧‧ package substrate
3‧‧‧基板供給部3‧‧‧ Substrate Supply Department
4‧‧‧切斷平臺4‧‧‧ cut off platform
5、13、25‧‧‧保持構件5, 13, 25‧‧‧ holding members
6‧‧‧移動機構6‧‧‧ mobile agency
7‧‧‧旋轉機構7‧‧‧ rotating mechanism
8‧‧‧主軸8‧‧‧ Spindle
9‧‧‧旋轉刀9‧‧‧ rotating knife
10‧‧‧半導體封裝（保持對象物）10‧‧‧Semiconductor package (object to be held)
11‧‧‧搬送機構11‧‧‧ transfer agency
12‧‧‧檢查平臺12‧‧‧ Inspection platform
14‧‧‧檢查用的照相機（檢查機構）14‧‧‧ Inspection Camera (Inspection Agency)
15‧‧‧良品用托盤15‧‧‧Good product tray
16‧‧‧彈性樹脂16‧‧‧Elastic resin
17‧‧‧區域（吸附面）17‧‧‧ area (adsorption surface)
18、27‧‧‧吸附孔18, 27‧‧‧ adsorption holes
19‧‧‧格子狀的槽/槽19‧‧‧ trellis / groove
20、20a、20b‧‧‧反射層20, 20a, 20b‧‧‧Reflective layer
21‧‧‧板狀構件21‧‧‧ plate member
22‧‧‧空間22‧‧‧ space
23‧‧‧開口部23‧‧‧ opening
24‧‧‧吸附機構24‧‧‧ Adsorption mechanism
26‧‧‧支撐構件26‧‧‧ support member
28‧‧‧罩幕28‧‧‧ veil
A‧‧‧基板供給模塊A‧‧‧ substrate supply module
B‧‧‧切斷模塊B‧‧‧ Cut-off module
C‧‧‧檢查模塊C‧‧‧ Inspection Module
CTL‧‧‧控制部CTL‧‧‧Control Department
X、Y、Z、θ‧‧‧方向X, Y, Z, θ‧‧‧ directions
圖1是表示本發明的切斷裝置的概要的概略平面圖。 圖2（a）及圖2（b）是表示實施方式1中的保持構件的概要圖，圖2（a）是概略平面圖，圖2（b）是概略剖面圖。 圖3（a）～圖3（e）是表示實施方式1中的保持構件的製造方法的概略步驟剖面圖。 圖4（a）及圖4（b）是表示實施方式2中的保持構件的概要圖，圖4（a）是概略平面圖，圖4（b）是概略剖面圖。 圖5（a）～圖5（f）是表示實施方式2中的保持構件的製造方法的概略步驟剖面圖。FIG. 1 is a schematic plan view showing an outline of a cutting device of the present invention. 2 (a) and 2 (b) are schematic views showing a holding member in the first embodiment, FIG. 2 (a) is a schematic plan view, and FIG. 2 (b) is a schematic cross-sectional view. 3 (a) to 3 (e) are cross-sectional views schematically showing steps in a method for manufacturing a holding member in the first embodiment. 4 (a) and 4 (b) are schematic views showing a holding member according to the second embodiment, FIG. 4 (a) is a schematic plan view, and FIG. 4 (b) is a schematic cross-sectional view. 5 (a) to 5 (f) are schematic cross-sectional views showing steps in a method for manufacturing a holding member in a second embodiment.
Claims (11)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-188231 | 2017-09-28 | ||
| JP2017188231A JP6886379B2 (en) | 2017-09-28 | 2017-09-28 | Holding member, manufacturing method of holding member, inspection device and cutting device |
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| Publication Number | Publication Date |
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| TW201915462A true TW201915462A (en) | 2019-04-16 |
| TWI683096B TWI683096B (en) | 2020-01-21 |
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| TW107130607A TWI683096B (en) | 2017-09-28 | 2018-08-31 | Holding member, manufacturing method of holding member, inspection device and cutting device |
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|---|---|
| JP (1) | JP6886379B2 (en) |
| KR (1) | KR20190037104A (en) |
| CN (1) | CN109585352A (en) |
| TW (1) | TWI683096B (en) |
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| TWI737266B (en) * | 2019-05-24 | 2021-08-21 | 日商Ｔｏｗａ股份有限公司 | Holding member, inspection mechanism, cutting device, manufacturing method of holding object and manufacturing method of holding member |
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| JP6968949B2 (en) * | 2019-05-24 | 2021-11-24 | Ｔｏｗａ株式会社 | Manufacturing method of holding member |
| JP6823111B2 (en) * | 2019-06-07 | 2021-01-27 | 大成ラミック株式会社 | Fault observation kit |
| JP2021019082A (en) * | 2019-07-19 | 2021-02-15 | 株式会社ジャパンディスプレイ | Substrate for transcribing |
| JP2021021592A (en) * | 2019-07-25 | 2021-02-18 | Ｔｏｗａ株式会社 | Inspection system, inspection method, cutting device, and resin molding device |
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| JP3033350B2 (en) * | 1992-07-23 | 2000-04-17 | 松下電器産業株式会社 | Chip observation device |
| JPH06237094A (en) * | 1993-02-08 | 1994-08-23 | Tdk Corp | Method and device for illumination of suction part |
| JP3321503B2 (en) | 1994-12-28 | 2002-09-03 | 太陽誘電株式会社 | Appearance inspection equipment for electronic components |
| KR100331165B1 (en) * | 1999-08-05 | 2002-04-01 | 김도열 | Jig for batch production of device and thereby batch production method of device |
| JP4137471B2 (en) * | 2002-03-04 | 2008-08-20 | 東京エレクトロン株式会社 | Dicing method, integrated circuit chip inspection method, and substrate holding apparatus |
| KR20090041236A (en) * | 2007-10-23 | 2009-04-28 | 한미반도체 주식회사 | Suction pad for semiconductor transfer device |
| KR20140065376A (en) * | 2011-02-25 | 2014-05-29 | 가부시키가이샤 니콘 | Observation device, inspection device, method for manufacturing semiconductor device, and substrate support member |
| JP5627618B2 (en) * | 2012-02-23 | 2014-11-19 | Ｔｏｗａ株式会社 | Fixing jig manufacturing method and fixing jig |
| JP5918003B2 (en) * | 2012-04-27 | 2016-05-18 | Ｔｏｗａ株式会社 | Vacuum suction sheet for singulation device and method for manufacturing fixing jig using the same |
| US10317460B2 (en) * | 2013-06-07 | 2019-06-11 | Maxim Integrated Products, Inc. | Precision alignment unit for semiconductor trays |
| JP6000902B2 (en) * | 2013-06-24 | 2016-10-05 | Ｔｏｗａ株式会社 | Housing jig for electronic parts, manufacturing method thereof, and singulation apparatus |
| JP6235391B2 (en) * | 2014-03-27 | 2017-11-22 | Ｔｏｗａ株式会社 | Inspection jig, cutting device, and cutting method |
| JP6430170B2 (en) * | 2014-08-12 | 2018-11-28 | Ｔｏｗａ株式会社 | Cutting apparatus, cutting method, adsorption mechanism and apparatus using the same |
| JP6382039B2 (en) * | 2014-09-04 | 2018-08-29 | Ｔｏｗａ株式会社 | Cutting apparatus, adsorption mechanism and apparatus using the same |
| JP6685126B2 (en) * | 2015-12-24 | 2020-04-22 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
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| TWI737266B (en) * | 2019-05-24 | 2021-08-21 | 日商Ｔｏｗａ股份有限公司 | Holding member, inspection mechanism, cutting device, manufacturing method of holding object and manufacturing method of holding member |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI683096B (en) | 2020-01-21 |
| KR20190037104A (en) | 2019-04-05 |
| JP6886379B2 (en) | 2021-06-16 |
| CN109585352A (en) | 2019-04-05 |
| JP2019066188A (en) | 2019-04-25 |
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