TW201914973A - Apparatus and methods for processing an apparatus - Google Patents

Abstract

A method of processing an apparatus including a substrate and a carrier includes defining a first path based on a profile of an outer boundary defined at a bond interface between the substrate and the carrier, defining a second path based on a profile of an outer edge of the carrier, locating a separation path on the substrate that is laterally positioned between the first path and the second path, and separating the substrate along the separation path. An apparatus including a carrier and a substrate including a separation path including a plurality of interesting separation paths is also provided.

Description

Apparatus and method for processing equipment

Cross-reference to related applications: This application claims priority to US Provisional Application No. 62 / 504,810, filed on May 11, 2017 under the Patent Act, and relies on and incorporates this US provisional application Its contents are for reference.

This disclosure relates generally to methods and apparatuses for processing substrates and carriers, and more particularly, to methods and apparatuses for separating substrates along a separation path when the substrates are bonded to the carrier.

In display applications, glass sheets are often used, such as liquid crystal displays (LCD), electrophoretic displays (EPD), organic light emitting diode displays (OLED), plasma displays (PDP), touch sensors, photovoltaic devices, and so on. Glass sheets can be manufactured, for example, with various tape forming procedures, such as slot draw, float, down-draw, fusion down-draw, rolling, or up -draw). The glass ribbon can then be split to provide a flexible thin glass sheet suitable for further processing of a desired display application including, but not limited to, a substrate for a mobile device, a wearable device (such as a watch), a television , Computers, tablets, and other display monitors. In manufacturing substrates containing flexible electronic devices or other electronic devices, it is of interest to provide and process flexible thin glass sheets. Fabricating a substrate may include transporting and processing a thin flexible glass sheet. Therefore, a device including a substrate, and a method for processing a substrate are needed.

In one way of processing flexible thin glass during processing of a substrate, a flexible glass sheet is bonded to a carrier. Once bonded to the carrier, the characteristics and dimensions of the carrier allow the joined structure to be disposed of and transported during the manufacturing process without undesired bending of the glass sheet and without causing damage to the glass sheet. For example, a flexible thin glass sheet can be bonded to a fairly rigid carrier, and then a functional component such as a color filter, a touch sensor, or a thin film transistor (TFT) component can be attached to the flexible Thin glass sheets to produce glass substrates that can be used in the production of electronic devices for display applications. In addition, by bonding the glass sheet to the carrier, the characteristics and dimensions of the carrier allow the joined structure to be disposed and transported in the production facility without extensive modification of existing production facilities, thereby reducing costs and improving handling Efficiency of technology.

It is necessary to adjust the size of the substrate by, for example, separating one or more peripheral portions from the central portion of the substrate to provide a central portion having a predetermined shape and size for use in various applications. Then, once transportation, processing, resizing, and other processing steps are completed, the substrate having a predetermined size and shape needs to be removed from the carrier so that the substrate can be used, for example, in an electronic device for display applications. However, due to the delicate nature of the substrate, the substrate and / or the carrier may be damaged during bonding of the substrate to the carrier, during processing and resizing of the substrate and the carrier, and when peeling the substrate from the carrier. .

Current techniques for trimming a flexible glass sheet to a desired size prior to joining the trimmed flexible glass sheet to a carrier typically produce glass particles that can contaminate the carrier, thereby reducing or damaging the carrier for current or future use. The ability to process programs. In addition, trimming the flexible glass sheet to a desired size before bonding the trimmed flexible glass sheet to a carrier substrate can generate glass particles that can contaminate the second major surface of the flexible glass sheet, which can cause some problems: reduce The strength of the bond between the flexible glass sheet and the carrier substrate; providing a path for processing liquid to enter the flexible glass sheet / carrier interface during the time the device is being placed on the flexible glass sheet; and / or on the glass When the particles provide a bonding mechanism between the flexible glass sheet and the carrier, the flexible glass sheet is peeled from the carrier. This bonding mechanism may cause damage to the flexible glass sheet and / or the carrier during the peeling process. In addition, a predetermined lateral distance needs to be provided between the outer edge of the corresponding flexible glass sheet and the carrier. However, current techniques for trimming flexible glass sheets to a desired size prior to joining allow precise positioning and joining of the trimmed flexible glass sheets to a carrier to obtain a predetermined lateral distance and / or within a predetermined lateral distance range The lateral distance is complicated.

Therefore, practical solutions are needed for bonding the substrate to the carrier, processing and adjusting the substrate size, and peeling the substrate from the carrier without harming the carrier and the substrate. Similarly, it is also necessary to separate the peripheral portion of the substrate from the center portion of the substrate, reduce and / or eliminate damage to the substrate, and provide a practical solution for consistent and repeatable processing. Therefore, specific equipment for carriers and substrates, as well as methods for processing carriers and substrates, are required to reduce and / or eliminate damage to substrates during processing and resizing of substrates, permitting substrates to be bonded to carriers And peel the substrate from the carrier without harming the carrier and the substrate, and provide a consistent, repeatable process for adjusting the size of the substrate for various applications.

Exemplary embodiments of a device including a substrate and a carrier are disclosed. Methods for processing substrates and carriers are also provided.

The substrate described in the entire disclosure includes a wide range of substrates, including a single glass substrate (such as a single flexible glass substrate or a single rigid glass substrate), a single glass ceramic substrate, a single ceramic substrate, or a single silicon substrate. Furthermore, the substrate may be a non-glass substrate, such as a polymer (such as polycarbonate or other polymers), including transparent, translucent, and opaque polymers. The term "glass" as used herein is meant to include any material made at least partially of glass, including glass and glass ceramics. "Glass ceramic" includes materials produced by controlled crystallisation of glass. In a specific embodiment, the glass ceramic has a crystallinity of about 30% to about 90%. Non-limiting examples of glass-ceramic systems that can be used include Li ₂ O × Al ₂ O ₃ × nSiO ₂ (i.e., LAS system), MgO × Al ₂ O ₃ × nSiO ₂ (i.e., MAS system), and ZnO × Al ₂ O ₃ × nSiO ₂ (aka ZAS system). In some embodiments, the substrate includes a single blank material substrate, such as a single blank glass substrate (eg, a glass plate containing an original surface separated from a glass ribbon produced by a pull-down melting process or other technology), a single blank glass ceramic substrate, a single Blank silicon substrate (for example, a single blank silicon wafer). If provided as a single blank glass substrate, the single blank glass substrate may be transparent, translucent, or opaque, and optionally over the entire thickness of the single blank glass substrate from the first major surface to the second major surface The same glass composition is included above. In some embodiments, the single blank glass substrate may include a single blank glass substrate that has been chemically strengthened.

Any one of the disclosed single substrates may optionally include a wide range of functionality. For example, a single glass substrate may include features that allow the substrate to adjust light or be incorporated into a display device, touch sensor component, or other device. In some embodiments, a single glass substrate may include a color filter, a polarizer, a thin film transistor (TFT), or other components. In some embodiments, if the substrate is provided as a single silicon substrate, the silicon substrate may include features that allow the silicon substrate to be incorporated into body circuits, photovoltaic devices, or other electronic components.

In some embodiments, the substrate may include a single substrate stack, such as any one or more single substrates. A single substrate stack may be constructed by two or more single substrates stacked relative to each other and opposing major surfaces adjacent to the single substrate bonded to each other. In some embodiments, a single substrate stack may include a single glass substrate stack. For example, the first single glass substrate may include a color filter, and the second single glass substrate may include one or more thin film transistors. The first and second single glass substrates can be joined together into a single substrate stack, and the single substrate stack can be formed into a display panel for display applications. In addition, the substrate of the present disclosure may include any one or more single substrates or a single substrate stack.

Exemplary specific embodiments of the disclosure are described below, and it should be understood that any of these specific embodiments may be used alone or in combination with each other.

Specific Example 1. A method for processing equipment including a substrate and a carrier. The substrate includes a first main surface and a second main surface, and the thickness of the substrate is defined between the first main surface of the substrate and the second main surface of the substrate. The carrier includes a first main surface and a second main surface, and the thickness of the carrier is defined between the first main surface of the carrier and the second main surface of the carrier. The thickness of the substrate is smaller than the thickness of the carrier. The first portion of the second major surface of the substrate is bonded to the first major surface of the carrier. The outer boundary of the first portion of the second major surface of the substrate is defined on the second major surface of the substrate and At the joint interface between the first major surfaces of the carrier, and the second portion of the second major surface of the substrate extends from the outer boundary away from the first portion of the second major surface of the substrate beyond the outer edge of the carrier. The method includes defining a first path based on an outer boundary contour, defining a second path based on a contour of an outer edge of a vehicle, positioning a separated path laterally placed between the first path and the second path on a substrate, and along the separated path. Detach the substrate.

Specific embodiment 2. According to the method described in Embodiment 1, the thickness of the substrate is from about 50 microns to about 300 microns.

Specific Embodiment 3. According to the method described in the first embodiment or the second embodiment, the material of the substrate is selected from the group consisting of glass, glass ceramic, ceramic, and silicon.

Specific Example 4. According to the method of any one of the specific embodiments 1-3, separating comprises generating a defect on the first main surface of the substrate.

Specific Example 5. In the method as described in the specific embodiment 4, the defect includes a score line extending along the separation path.

Specific embodiment 6. The method according to specific embodiment 4 or specific embodiment 5, comprising: expanding a defect when a first portion of the second main surface of the substrate is bonded to the first main surface of the carrier to generate a first portion of the substrate along the separation path from the substrate. One major surface extends to the entire crack of the second major surface of the substrate.

Specific embodiment 7. The method according to the specific embodiment 6, wherein expanding the defect comprises: when the first portion of the second main surface of the substrate is bonded to the first main surface of the carrier, applying a force to the peripheral portion of the substrate.

Specific embodiment 8. According to the method of any one of specific embodiments 1 to 7, the outer edge of the vehicle includes an edge surface, the edge surface intersects with the first main surface of the vehicle and the second main surface of the vehicle, and the edge surface and the vehicle The intersection of the first major surface extends along a common boundary axis with the outer boundary.

Specific embodiment 9. According to the method described in specific embodiment 8, the edge surface of the vehicle includes a convex contour.

Specific embodiment 10. According to the method described in any one of the specific embodiments 1 to 9, defining the first path includes: identifying a first plurality of points of an outer boundary.

Specific Example 11. The method according to the specific embodiment 10 includes fitting a first line to a first plurality of points, and then defining the first path as the first line.

Specific Embodiment 12. According to the method of any one of the specific embodiments 1 to 11, defining the second path includes: identifying a second plurality of points on an outer edge of the vehicle.

Specific Example 13. The method according to the specific embodiment 12 includes fitting a second line to a second plurality of points, and then defining the second path as the second line.

Specific Example 14. According to the method of any one of the specific embodiments 1-13, the separation path is linear.

Specific Example 15. In the method according to the specific embodiment 14, at least one of the first path and the second path is non-linear.

Specific embodiment 16. According to the method described in Embodiment 15, the first path is non-linear and the second path is non-linear.

Specific embodiment 17. According to the method of any one of the specific embodiments 1 to 16, the separation step provides a new outer edge to the substrate, the new outer edge is laterally defined in a first distance from the outer boundary to a direction away from the outer edge of the carrier, and in From the outer boundary between a second distance in a direction towards the outer edge of the vehicle.

Specific Example 18. According to the method of embodiment 17, the first distance is from about 0 micrometers to about 50 micrometers.

Specific Embodiment 19. According to the method of embodiment 17 or embodiment 18, the second distance is from about 0 micrometers to about 150 micrometers.

Specific Embodiment 20. The device includes a substrate and a carrier. The substrate includes a first main surface, a second main surface, and a first main surface and a second main surface of the carrier. The thickness of the substrate is defined between the first major surface of the substrate and the second major surface of the substrate. The thickness of the carrier is defined between the first major surface of the carrier and the second major surface of the carrier. The thickness is smaller than the thickness of the vehicle. The second major surface of the substrate is bonded to the first major surface of the carrier, and the outer edge of the substrate laterally surrounds the outer edge of the carrier. The substrate includes a separation path including a continuous boundary laterally surrounding a central portion of the substrate. The outer edge of the vehicle laterally surrounds the continuous boundary of the separation path, and the separation path includes a plurality of intersecting separation paths, including a first separation path, a second separation path, and a third separation path. The first separation path meets the second separation path, and the third separation path meets the first separation path and the second separation path. A first peripheral portion of the substrate is defined between the outer edge of the substrate and the first separation path, and a second peripheral portion of the substrate is defined between the outer edge of the substrate and the second separation path, and a corner portion of the substrate is defined Between the third separation path, the first peripheral portion of the substrate, and the second peripheral portion of the substrate.

Specific embodiment 21. According to the apparatus of embodiment 20, the thickness of the substrate is from about 50 microns to about 300 microns.

Specific Embodiment 22. According to the device of embodiment 20 or embodiment 21, the material of the substrate is selected from the group consisting of glass, glass ceramic, ceramic, and silicon.

Specific Embodiment 23. A method for processing the device according to any one of the specific embodiments 20 to 22, comprising: positioning each of a plurality of intersection separation paths on a substrate, and separating the substrate along each path.

Specific Embodiment 24. In the method described in the specific embodiment 23, the separating step is performed when the second main surface of the substrate is bonded to the first main surface of the carrier.

Specific Example 25. According to the method described in the specific embodiment 23 or the specific embodiment 24, each of the plurality of intersection separation paths is positioned on the substrate independently of other paths in the plurality of intersection separation paths.

Specific Example 26. The method according to any one of the specific embodiments 23 to 25, separating comprises: separating the first peripheral portion of the substrate and the center portion of the substrate along a first separation path, and separating the second peripheral portion of the substrate and the center of the substrate The portion is separated along the second separation path, and then the corner portion of the substrate and the center portion of the substrate are separated along the third separation path.

Specific Example 27. According to the method of any one of specific embodiments 23 to 26, the first portion of the second main surface of the substrate is bonded to the first main surface of the carrier, and the outer boundary of the first portion of the second main surface of the substrate is defined at At the joint interface between the second major surface of the substrate and the first major surface of the carrier, and the second portion of the second major surface of the substrate extends from the outer boundary away from the first portion of the second major surface of the substrate beyond the Outer edge. The separation step provides the substrate with a new outer edge laterally surrounding the central portion, the new outer edge laterally defining a first distance in a direction away from the outer boundary and away from the outer edge of the vehicle and at a distance from the outer boundary toward the outer edge of the vehicle. Between the second distances in the direction.

Specific Example 28. According to the method of embodiment 27, the first distance is from about 0 micrometers to about 50 micrometers.

Specific Example 29. According to the method of embodiment 27 or embodiment 28, the second distance is from about 0 micrometers to about 150 micrometers.

Specific embodiments will now be described more fully with reference to the accompanying drawings, which illustrate exemplary embodiments. Wherever possible, the same reference numbers will be used in the drawings to refer to the same or like parts. However, the patentable scope may encompass many different aspects of the various specific embodiments and should not be construed as being limited to the specific embodiments set forth herein.

As noted briefly above, methods and apparatuses for processing substrates are provided in various specific embodiments. To enable the substrate to be processed and transported during processing, the substrate may be bonded to a carrier. The characteristics and dimensions of the carrier relative to the substrate allow the bonded substrates to be handled and transported during the processing period, so as not to bend the substrate a lot, which can damage the substrate and / or damage the components that can be mounted to the substrate. Unless otherwise indicated, the substrate of any of the disclosed specific embodiments may include a single substrate, or a stack of two or more single substrates. The thickness of a single substrate may be from about 50 microns (microns, μm) to about 300 microns, although other thicknesses may be provided in some embodiments.

In some embodiments, a single flexible glass substrate or a stack of single flexible glass substrates may be removably bonded to a carrier using an adhesive, such as a polymer adhesive, a siloxane adhesive, Naturally occurring forces between multiple abutting surfaces (for example, rough abutting surfaces), or other adhesives. In some embodiments, the substrate may be bonded to the carrier without an adhesive, and the carrier may be bonded to the substrate based on a bonding force of a direct contact between the substrate and the carrier. In some embodiments, the substrate may be bonded to a carrier made of glass, resin, or other material capable of withstanding the environment during substrate processing (for example, polycarbonate, fiberboard high pressure laminate or low pressure laminate) . Thus, the carrier can optionally introduce the required level of rigidity, and by providing a carrier with additional thickness, this carrier can be combined (or acted on together) with the thickness of the substrate that is removably bonded to the carrier. In some embodiments, the carrier may include a plate (eg, a rigid plate), and the thickness of the plate may be greater than the thickness of a single substrate bonded to the carrier. Furthermore, in some specific embodiments, the thickness of the carrier may be selected so that the total thickness of the carrier and the substrate bonded to the carrier may be within a range that may be configured to process a relatively thick glass substrate ( The processing equipment and equipment used are those whose thickness is within the total thickness of the carrier and the substrate bonded to the carrier.

After the substrate is bonded to the carrier, it may then be desirable to remove the carrier from the substrate without damaging the substrate. For example, it may be desirable to remove a substrate from a carrier before processing the substrate (eg, by adding one or more functional components). Alternatively, in some embodiments, it may be desirable to remove a single substrate from a carrier after the substrate has been processed into a single substrate having one or more functional components, and before the substrates are produced as a single substrate stack. . Further, in some embodiments, it may be desirable to remove a carrier from a substrate that includes a single substrate stack.

The present disclosure provides a device and a method for processing a device. For example, FIG . 1 illustrates exemplary features of an example device 100 including a substrate 110 and a carrier 120 . For clarity, as in the plan view of FIG. 1 in the carrier 120 is located below the substrate 110, FIG. 1 in the first carrier 120 is illustrated in dashed lines characteristic. In some specific embodiments, the material of the substrate 110 may be selected from the group consisting of glass, glass ceramic, ceramic, and silicon, and the material of the carrier 120 may be selected from the group consisting of polyurethane, glass , Glass ceramics, ceramics, silicon, plastics and metals. In some embodiments, the substrate 110 and / or the carrier 120 may or may not transmit light, and thus may be at least partially (or entirely) transparent, translucent, or opaque. In addition, as shown a partial sectional view of apparatus 100 illustrated in FIG. 2 along the line 2-2 of FIG. 1, in some embodiments, the substrate 110 may comprise a first major surface 111 and the second main The surface 112 and the carrier 120 may include a first main surface 121 and a second main surface 122 . In some embodiments, the thickness “ t1 ” of the substrate 110 defined between the first main surface 111 and the second main surface 112 may be from about 50 μm to about 300 μm. Furthermore, in some specific embodiments, the thickness “ t1 ” may be smaller than the thickness “ t2 ” of the carrier 120 defined between the first main surface 121 and the second main surface 122 .

In some embodiments, the second main surface 112 of the substrate 110 may be bonded to the first main surface 121 of the carrier 120 . In some embodiments, the bonding between the second main surface 112 of the substrate 110 and the first main surface 121 of the carrier 120 can be regarded as temporary. For example, in some embodiments, once bonded, the second major surface 112 may be intended to be peeled from the first major surface 121 (eg, at a later time, after the processing device 100 ), thereby separating the substrate 110 from the carrier 120 And then, for example, utilize the substrate 110 in one or more display applications.

In some embodiments, the second main surface 112 may directly contact the first main surface 121 . In some embodiments, the at least partially direct contact between the second major surface 112 and 121 based on the first major surface, a second major surface 112 may be directly bonded to the first major surface 121. Alternatively or additionally, in some embodiments, the device 110 may include an adhesive (not shown) located between the second main surface 112 and the first main surface 121 to bond the second main surface 112 to the first Main surface 121 . In some embodiments, it can be by lamination, pressing, heating, or other substrate 110 is attached to the carrier joining method 120 to engage the second major surface 112 of the substrate 110 to the carrier 120 of the first main Surface 121 . For example, in some embodiments, the first portion 201 of the second main surface 112 of the substrate 110 may be bonded to the first main surface 121 of the carrier 120 . In some specific embodiments, the bonding between the substrate 110 and the carrier 120 may not be regarded as temporary, and once the substrate 110 and the carrier 120 are resized, they may be used as final products (such as building panels or Tailgate).

In some embodiments, the outer boundary of the second main surface of the substrate 110 of the first portion 201 112 150, can be defined in the engagement between the first major surface of the second main surface 121,120 of the substrate 110 and the carrier 112 interface. Furthermore, in some embodiments, the second portion 202 of the second main surface 112 of the substrate 110 may extend from the outer boundary 150 away from the first portion 201 of the second main surface 112 beyond the outer edge 125 of the carrier 120 . Therefore, in some specific embodiments, the size of the substrate 110 may be larger than that of the carrier 120 , and may include a cantilever portion (eg, the second portion 202 ) that is suspended relative to the bonding portion (eg, the first portion 201 ). In some embodiments, the step of bonding may be simplified with respect to the oversized substrate 110 relative to the carrier 120 , because the substrate 110 may not need to be precisely aligned with respect to the carrier 120 during the bonding step. In contrast, as discussed more fully below, the peripheral portion of the substrate 110 may then be separated after the substrate 110 is bonded to the carrier 120 to provide the substrate 110 with a predetermined size.

In some embodiments, the outer edge 125 may extend across the thickness " t2 " of the carrier 120 between the first main surface 121 and the second main surface 122 . In some embodiments, the outer edge 120 of the carrier 125 may comprise an edge surface, a first edge surface intersection carrier main surface 120 of the carrier 121 and the second major surface 120 122. In addition, in some embodiments, the intersection of the edge surface of the outer edge 125 and the first major surface 121 of the carrier 120 may extend along a common boundary axis with the outer boundary 150 . In some embodiments, the outer edge 125 may include a planar edge surface that extends across at least a portion of the thickness “ t2 ” between the first major surface 121 and the second major surface 122 . Furthermore, in some specific embodiments, the outer edge 125 may include a non-planar edge surface, and the non-planar edge surface includes at least one of a convex contour and a concave contour (such as the convex edge surface illustrated in FIG . 2 ). The edge surface extends across at least a portion of the thickness “ t2 ” between the first main surface 121 and the second main surface 122 . In some embodiments, the outer edge 125 may include two or more planar edge surfaces, two or more non-planar edge surfaces, or one or more planar edge surfaces and one or more non-planar edge surfaces. The combination extends across at least a portion of the thickness " t2 " between the first main surface 121 and the second main surface 122 . In some embodiments, the outer edge 125 may be an "as-formed" edge formed based at least in part on operations of at least one of a forming process, a cutting process, and a separating process. Additionally or alternatively, in some embodiments, the outer edge 125 may be one or more of the following: ground, polished, polished, and machined to provide one or more contours, shapes The edge surface of the outer edge 125 with surface characteristics.

Furthermore, in some embodiments, the outer edge 125 may include an angle between a planar edge surface and at least one of the first major surface 121 and the second major surface 122 . Similarly, in some embodiments, the outer edge 125 may include an angle between the non-planar edge surface and at least one of the first major surface 121 and the second major surface 122 . In some embodiments, the corner may include a square corner, where at least one of the first major surface 121 and the second major surface 122 is connected to the planar edge surface by a substantially 90 degree angle. Alternatively, in some specific embodiments, the angle may include a fillet, a chamfer, a chamfer, or a bevel that connects at least one of the first major surface 121 and the second major surface 122 to a planar edge surface or a non-planar edge surface , Or other shaped corners. Therefore, in order to illustrate the disclosure, regardless of the shape, the outer edge 125 of the carrier 120 may be defined as a surface that extends across the thickness " t2 " of the carrier 120 between the first major surface 121 and the second major surface 122 . The surface surrounds the first main surface 121 and the second main surface 122 to form an outer periphery of the carrier 120 .

In some specific embodiments, after the second main surface 112 of the substrate 110 and the first main surface 121 of the carrier 120 are bonded, the device 100 may be processed. In some embodiments, processing may include one or more of the following: cleaning, washing, resizing (such as trimming), and functional components (such as color filters, touch sensors, or thin film transistors) (TFT) component) is attached to the substrate 110 . For example, in some embodiments, the substrate 110 may be processed by using existing production equipment, which includes a bonded structure of the substrate 110 bonded to the carrier 120 , such as providing a structure that allows the bonded structure to be handled and transported to Production equipment without extensive modification of the characteristics and dimensions of the production equipment. For example, in some embodiments, existing production equipment may be configured to process structures having a predetermined thickness. Thus, in some embodiments, the thickness of the substrate 110 "t1" and the carrier 120 of the combined thickness "t2" can be selected to provide the thickness of the device 100 and the first major surface of the carrier 111 "t3" in the substrate 110 Between the second main surfaces 122 of the tool 120 , it is equal to a predetermined thickness that allows existing production equipment to be configured to process. In some embodiments, the thickness “ t3 ” may be from about 400 microns to about 750 microns, from about 500 microns to about 1 mm, and from about 1 mm to about 2 mm; however, in some embodiments, the thickness of the device 100 The thickness " t3 " may be larger or smaller than the explicit dimensions provided in the disclosure without departing from the scope of the disclosure.

Looking back at FIG . 1 , in some embodiments, the outer edge 115 of the substrate 110 may laterally surround the outer edge 125 of the carrier 120 . In the full text of the disclosure, the first feature of the "transverse surround" second feature means a top view or a bottom view in a direction orthogonal to one or more of the main surfaces of the substrate 110 and / or the carrier 120 In the figure, the outer periphery defined by the first feature surrounds, for example, the outer periphery defined by the second feature. Therefore, for example, as shown in the plan view of FIG . 1 , the outer periphery of the substrate 110 (defined by the outer edge 115 ) surrounds the outer periphery of the carrier 120 (defined by the outer edge 125 ). Similarly, in some embodiments, the outer edge 125 of the carrier 120 may laterally surround the outer boundary 150. The outer boundary 150 is defined between the second major surface 112 of the substrate 110 and the first major surface 121 of the carrier 120 . Interface. Furthermore, in some specific embodiments, the substrate 110 may include a separation path 175 , and the separation path 175 includes a continuous boundary laterally surrounding the central portion 180 of the substrate 110 . In some embodiments, the outer edge 125 of the carrier 120 may laterally surround a continuous boundary of the separation path 175 . Therefore, in some embodiments, the separation path 175 may be laterally located between the outer boundary 150 and the outer edge 125 of the carrier 120 , and the outer edge 125 surrounds the separation path 175 laterally, and the separation path 175 laterally surrounds the outer boundary 150 .

As discussed more fully below, the method for processing the device 100 may include separating the substrate 110 along a separation path 175 to , for example, provide a substrate 110 having a predetermined shape and size that is selected for adoption in a In more applications (such as display applications). By positioning the substrate 110 on the carrier 120 with the outer edge 115 laterally surrounding the outer edge 125 of the carrier 120 , and then separating the substrate 110 along the separation path 175 , the initial size, shape, and placement of the substrate 110 (for example, on the device) 100 before processing) can be performed faster and less expensively, compared to, for example, adjusting the substrate 110 to a predetermined shape and size before bonding the substrate 110 to the carrier 120 . For example, if the substrate 110 is trimmed to a desired size before the substrate 110 is bonded to the carrier 120 , in some embodiments, extreme accuracy may be required to carefully position the substrate 110 relative to the carrier 120 . In addition, if the substrate 110 is trimmed to a desired size before the substrate 110 is bonded to the carrier 120 , in some embodiments, extreme care may be required when handling and transporting the substrate 110 to avoid pre-trimmed substrates. The edges are cracked, scratched, or broken. Thus, in some embodiments, the substrate 110 is bonded to the carrier 120 and the substrate 110 is then bonded to the carrier substrate 110 is separated along the separation path 120 175, can improve the efficiency of processing and reduce the size of the substrate 110 in the adjustment, The possibility of damaging the substrate 110 when handling and transporting the substrate 110 .

Furthermore, in some specific embodiments, the separation path 175 may include a plurality of intersection paths, including a first separation path 175a , a second separation path 175b , and a third separation path 175c . In some specific embodiments, the first separation path 175a may meet the second separation path 175b , and the third separation path 175c may meet the first separation path 175a and the second separation path 175b . In some embodiments, the first peripheral portion 110 of the substrate 181 may be defined between the first separating path 115 and the outer edge 175a of the substrate 110 and the substrate 110 surrounding the second portion 182 may be defined in the substrate 110 Between the outer edge 115 and the second separation path 175b . Furthermore, in some embodiments, the corner portion 183 of the substrate 110 may be defined between the third separation path 175 c , the first peripheral portion 181 , and the second peripheral portion 182 . In some embodiments, the plurality of intersection paths may define a central portion 180 of the substrate 110 . For example, in some embodiments, a plurality of intersection of a path or more paths, two positions individually extend across the outer edge 115 at the intersection of the first major surface of the substrate 110 and the substrate 110 at 110, and may be Together with one or more other paths of the plurality of intersection paths, a central portion 180 of the substrate 110 is defined. It should be understood that the separation path 175 may include any number of intersection separation paths, and these separation paths define the central portion 180 to include any size and shape. In some embodiments, these sizes and shapes may be based at least in part on the substrate 110 to be used. Selected for a particular application.

Referring now to FIG. 3 to FIG. 6 illustrates a method 175 of substrate 110 separated along the separation path, wherein FIG. 3 along line 2 illustrates a partial plan view of a section of FIG. 3-3 of FIG device 100. For example, FIG . 3 provides an exemplary field of view visible by the machine vision device 225 . In some embodiments, the machine vision device 225 may include imaging technology (such as a camera, sensor, light, laser, etc.) to provide automatic image-based inspection and analysis of one or more features of the device 100 . For example, in some embodiments, the machine vision device 225 may acquire an image containing one or more features of the device 100 . Furthermore, in some embodiments, the machine vision device 225 may be connected to the controller 250 (eg, a computer, a CPU, a programmable logic controller) via a wired connection or a wireless connection. In some embodiments, the controller 250 may be directed, programmed, coded, designed, and / or made to operate the machine vision device 225 , and may process the data obtained by the machine vision device 225 Information (such as digital images). The controller 250 may further include hardware and software to provide image processing capabilities for images acquired by the machine vision device 225 . For example, in some embodiments, the controller 250 may use filters, image extraction and decoding techniques, obtain data from images, image comparison techniques, edge detection capabilities, image stitching and registration, pixel counting and manipulation, segmentation, modes Identification, color analysis, optical analysis, measurement and metrology, and other machine vision image processing methods to process images. Based at least in part on image processing capabilities, the controller 250 may provide output (eg, control signals) to one or more components to process, trim, transport, and dispose of the device 100 based on the output.

Therefore, in order to illustrate the disclosure, the machine vision device 225 (either alone or in combination with the controller 250 ) should be understood as a person who is technically distinct from, for example, a person who uses the visual system of the human central nervous system to process visual details Eye (alone or in combination with the human brain to interpret visual details obtained with the human visual system). Therefore, in some specific embodiments, the machine vision device 225 (either alone or in combination with the controller 250 ) can provide automatic image capture and image processing for the features of the device 100 without human interaction, thereby providing a scalable, consistent And repeatable automated method for processing the substrate 110 and the carrier 120 . Furthermore, although a single machine vision device 225 is illustrated in the drawings, it should be understood that one or more machine vision devices may be used in some specific embodiments according to the method of disclosure without departing from the scope of the disclosure. .

The features of the method will be explained with respect to the first separation path 175a , which is done in understanding the following: In some specific embodiments, one or more features may be applied individually or in combination by the same or similar methods, The substrate 110 is separated along one or more separation paths 175 of the plurality of intersection separation paths without departing from the scope of the disclosure. In some embodiments, the method may include defining a first path (eg, a first linear path 301 , a first non-linear path 303 ) based on the contour of the outer boundary 150 . For example, in some specific embodiments, defining the first path 301 , 303 may include: identifying the first plurality of points 301a , 301b , 301c , 301d , 301e , 301f , 301g , 301h , 301i of the outer boundary 150 . In some embodiments, the method may include fitting the first lines 301 , 303 to the first plurality of points 301a - 301i , and then defining the first paths 301 , 303 as the first lines 301 , 303 . In some embodiments, the method may include defining a second path (eg, a second linear path 302 , a second non-linear path 304 ) based on the contour of the outer edge 125 of the carrier 120 . For example, in some specific embodiments, defining the second path 302 , 304 may include: identifying a second plurality of points 302a , 302b , 302c , 302d , 302e , 302f , 302g , 302h , 302i of the outer edge 125 of the carrier 120 . In some specific embodiments, the method may include fitting a second line 302 , 304 to the second plurality of points 302a - 302i , and then defining the second path 302 , 304 as the second line 302 , 304 .

In some embodiments, the machine vision device 225 (alone or in combination with the controller 250 ) may automatically define at least one of the first paths 301 , 303 and the second paths 302 , 304 . For example, in some specific embodiments, the machine vision device 225 may obtain an image of at least a region of the device 100 , and may use one or more image processing techniques to process the image to identify the first plurality of points 301a of the outer boundary 150 -At least one of 301i and the second plurality of points 302a - 302i of the outer edge 125 of the vehicle 120 . In some specific embodiments, the first plurality of points 301a - 301i may, for example, correspond to the physical features of the outer boundary 150 or the spatial position of the solid features, and the second plurality of points 302a - 302i may, for example, correspond to the outer of the vehicle 120 The solid feature of the edge 125 or the spatial position of the solid feature. In some embodiments, at least one of the outer boundary 150 and the outer edge 125 may include irregular (eg, non-linear) features. Furthermore, in some specific embodiments, identifying the first plurality of points 301a - 301i and the second plurality of points 302a - 302i may provide an estimation of the irregular shape of the irregular features of at least one of the outer boundary 150 and the outer edge 125 . . In some embodiments, the number of points may be increased to, for example, increase the estimated spatial resolution and accuracy, or the number of points may be decreased to, for example, increase the calculation speed. Thus, in some embodiments, the method of the present disclosure may be estimated as projected onto the contour of the outer boundary 110 of the first main surface 111 of the substrate 150, and 110 as projected onto the first major surface of the substrate 120 on the carrier 111 Outline of the outer edge 125 .

Furthermore, in some specific embodiments, the controller 250 may use one or more line fitting techniques (such as linear regression analysis) to fit the first plurality of points 301a - 301i to the first line 301 (define the first Linear path 301 ), and fit a second line 302 (defining a second linear path 302 ) to the second plurality of points 302a - 302i . Similarly, in some embodiments, the controller 250 may use one or more n-th order polynomial regression analysis techniques (eg, second-order, third-order, etc.) to fit the first line to the first plurality of points 301a - 301i. 303 (define the first non-linear path 303 ), and fit a second line 304 (define the second non-linear path 304 ) to the second plurality of points 302a - 302i . Therefore, based on the disclosed content method, the first paths 301 , 303 may provide a more accurate estimate of the actual contour of the outer boundary 150 as projected on the first major surface 111 of the substrate 110 , compared to, for example, based on the outer boundary 150 A single point or hypothesis made of a hypothetical feature. Similarly, based on the disclosed method, the second paths 302 , 304 may provide a more accurate estimate of the actual contour of the outer edge 125 of the carrier 120 , such as projected on the first major surface 111 of the substrate 110 , compared to (e.g., ) Assumptions made based on a single point or assumed feature of the outer edge 125 of the vehicle 120 . By providing a more accurate estimation of the contours of the outer boundary 150 and the outer edge 125 , the features of the present disclosure can similarly improve accuracy and accuracy when, for example, positioning the separation path 175 on the substrate 110 , resulting in a more accurate Size of the substrate 110 and uniformly control the shape and size of the substrate 110 .

Therefore, in some embodiments, the method may further include positioning the separation path 175 on the substrate 110 . In some embodiments, the positioning can be done digitally, for example, by using one or more image processing technologies implemented by the controller 250 on the images acquired by the machine vision device 225 . For example, in some embodiments, the machine vision device 225 (alone or in combination with the controller 250 ) may determine a corresponding separation path on the substrate 110 based on the estimation of the contour of the outer boundary and the contour of the outer edge 125 of the carrier 120 . 175 space locations. Based on the spatial position of the corresponding separation path 175 on the substrate 110 , the controller 250 may operate one or more components to automatically process the device 100 according to the disclosed method. Back see FIG. 1, in some embodiments, may be positioned on the substrate 110 is positioned comprising a plurality of intersection of each path separation path (e.g. path 175a 175 separating the first and second separating path 175b, a third separation Path 175c ). In some specific embodiments, each path of the plurality of intersection separation paths 175 may be positioned on the substrate 110 independently of other paths of the plurality of intersection separation paths 175 . By a plurality of independent separation path intersection 175 of the other paths are positioned a plurality of paths each path separated intersection 175, and may be based on (or) wherein the substrate carrier 110 more preferably 120 to control the position of each path, Regardless of the characteristics of the other paths of the plurality of intersection separation paths 175 .

FIG . 5 illustrates a plan view of the apparatus 100 after the substrate 110 is separated along each of a plurality of intersection separation paths 175 . In some embodiments, the substrate 110 may be separated to provide a new outer edge 500, the new outer edge 500 of the substrate 110 laterally surrounds the center portion 180. In addition, the outer edge 125 of the carrier 120 may laterally surround the new outer edge 500 of the substrate 110 . By laterally surrounding the new outer edge 500 of the substrate 110 , the outer edge 125 of the carrier 120 can isolate the new outer edge 500 , so that the new outer edge 500 is not subject to objects and at least one of the substrate 110 and the carrier 120 can be subjected to. Contact with external forces. For example, in the disposal of the contact carrier 120 of the substrate 110, the process, and during the transportation, at least one of the substrate 110 and carrier 120 may be subjected to an external force and joined to the article. In some embodiments, if the substrate 110 is to be in direct contact with an object and an external force, the substrate 110 may be damaged based on contact with the object and an external force (eg, broken, cracked, or scratched, etc.). However, by laterally surrounding the new outer edge 500 of the substrate 110 , the outer edge 125 of the carrier 120 can contact objects and external forces, and isolate the new outer edge 500 so that the new outer edge 500 does not directly contact the objects and external forces, thereby preventing and (Or) reduce damage to the substrate 110 .

In some embodiments, separating may include separating the substrate 110 along each of the plurality of intersection separation paths 175 . For example, in some embodiments, the separator may comprise a first central portion 181 of the peripheral portion of the substrate 110 and the substrate 180 175a 110 separated along a first separating path, the center of the second peripheral portion 182 of the substrate 110 and the substrate 110 180 175b partially separated along the second separating path, and then the corner portions of the central portion 110 of the substrate 183 and the substrate 110 is separated along the third separation 180 175c path. Separating the substrate 110 along the first separation path 175a may provide the substrate 110 with a first new outer edge 500a , and separating the substrate 110 along the second separation path 175b may provide the substrate 110 with a second new outer edge 500b . Similarly, separating the corner portion 183 along the third separation path 175c may provide the substrate 110 with a third new outer edge 500c . In some embodiments, separating the respective peripheral portions from the central portion 180 in a predetermined order can prevent and / or reduce breaks, splits, and cracks in the substrate 110 along the separation path 175 caused by the separation. If, for example, the corner portion 183 is separated from the center portion 180 before the first peripheral portion 180 is separated from the second peripheral portion 182 , such fracture, splitting, and cracking may occur.

As shown in FIG . 3 , in some embodiments, the first separation path 175a may be positioned laterally between the first paths 301 , 303 and the second paths 302 , 304 . In some embodiments, after positioning the first separation path 175a on the substrate 110 , the method may then include separating the substrate 110 along the first separation path 715a . In some embodiments, separating may include generating a defect 300 on the first major surface 111 of the substrate 110 . In some embodiments, the defect 300 may include a score line extending along the first separation path 175a . In some embodiments, the defect 300 may be a first 175a extend along the entire separation path 110 from the first position of the outer edge 115 of the substrate 110 to the second position the outer edge 115 of the substrate; however, in some embodiments, as in the first FIG. 3 illustrates that the defect 300 may extend a portion of the distance along the first separation path 175a . Furthermore, in some embodiments, the first separation path 175a may be linear, and may be brought into contact with the first main surface 111 of the substrate 110 by a tool (such as a scribe wheel, a scribe, a diamond tip, an indenter, etc.). form. Alternatively or additionally, in some embodiments, the defect 300 may be formed by a laser and may include a plurality of defects along the first separation path 175a . In some embodiments, a cooling liquid (such as a liquid, a gas, or a combination of a liquid and a gas) alone or in combination with a heating device (such as electromagnetic radiation, laser, ultraviolet laser, pulse laser, etc.) may be used. Thermal stress is applied on the substrate 110 along the first separation path 175a to form a defect 300 and / or the substrate 110 is separated along the first separation path 175a .

Further, as part of the sectional view illustrated in FIG 4, in some embodiments, the separator may be included in the first major surface bonded to the carrier 121 201 120 second major surface of the substrate 110 of the first portion 112 of the enlarged defect 300, to produce a first split path 175a extends along the first main surface 111 of the substrate 110 to crack the entire second main surface of the substrate 110 of 112 400. In some specific embodiments, the enlarged defect 300 may include applying a force “ F ” to the peripheral portion of the substrate 110 when the first portion 201 of the second main surface 112 of the substrate 110 is bonded to the first main surface 121 of the carrier 120 ( For example, the first peripheral portion 181 ). In some embodiments, the carrier 120 may hold the central portion 180 and the first peripheral portion 181 and prevent and / or reduce the first peripheral portion 181 and the central portion 180 when separating the substrate 110 along the first separation path 175a. Movement of at least one of them (eg, suppression of vibration). Supporting the first peripheral portion 181 and the central portion 180 when separating the substrate 110 along the first separation path 175a can prevent and / or reduce breaks and cracks along the first separation path 175a in the substrate 110 caused by separation. And cracking. If the first peripheral portion 181 and the central portion 180 are not supported by the carrier 120 , such cracking, cracking, and cracking may occur.

FIG 6 illustrates 175a after separating the substrate 110 along a first split path, along a line of FIG. 5 a partial sectional view of the apparatus 100 6-6. For example, in some embodiments, the separation may provide the substrate 110 with a first new outer edge 500a , and the first new outer edge 500a is laterally defined at a first distance from the outer boundary 150 in a direction away from the outer edge 125 of the carrier 120 . d1 ”and a second distance“ d2 ”from the outer boundary 150 in the direction toward the outer edge 125 of the carrier 120 . In some embodiments, the first distance “ d1 ” may be from about 0 micrometers to about 50 micrometers, and / or the second distance “ d2 ” may be from about 0 micrometers to about 150 micrometers. For example, in some embodiments, the first distance " d1 " may be from about 0 microns to about 10 microns, from about 10 microns to about 50 microns, from about 10 microns to about 20 microns, from about 20 microns to about 40 microns , And include all ranges and subranges in between. Similarly, in some embodiments, the second distance " d2 " may be from about 0 microns to about 10 microns, from about 10 microns to about 150 microns, from about 10 microns to about 50 microns, from about 50 microns to about 100 micrometers, from about 100 micrometers to about 150 micrometers, and includes all ranges and subranges therebetween.

In some embodiments, based on the method of positioning the first separation path 175a , the first new outer edge 500a may be positioned inside the outer edge 125 of the carrier 120 . For example, the outer edge 125 of the carrier 120 may isolate the first new outer edge 500a , so that the first new outer edge 500a is not contacted by an object with which at least one of the substrate 110 and the carrier 120 may be exposed to external force. For example, in a contact carrier 120 of the substrate 110 disposal, treatment, and during the transportation, at least one of the substrate 110 and carrier 120 may be subjected to an external force and joined to the article. In some specific embodiments, if the substrate 110 is to be directly contacted by an external force and an object, the substrate 110 may be damaged (eg, broken, cracked, scratched, etc.) based on at least the contact with the object and the external force. However, by positioning the first new outer edge 500a of the substrate 110 laterally inside the outer edge 125 of the carrier 120 , in some specific embodiments, the carrier 120 can contact objects and external forces, and isolate the first new outer The edge 500 a prevents the first new outer edge 500 a from directly contacting objects and external forces, thereby preventing and / or reducing damage to the substrate 110 .

In addition, after the substrate 110 is separated along the separation path 175 , any functional component (such as a color filter, a touch sensor, or a thin film transistor (TFT) attached to, for example, the first main surface 111 of the substrate 110 is included. ) Parts) of the substrate 110 (eg, the central portion 180 ), the substrate 110 may be peeled from the carrier 120 and used in an electronic device for display applications, or any other application in which the substrate 110 can play a role. Furthermore, in some specific embodiments, the substrate 110 and the carrier 120 may be formed together as a final product (such as a building panel or a tailgate), and thus may be used together in one or both of which the substrate 110 and the carrier 120 can function. More applications.

The specific embodiments and functional operations described in this specification can be implemented in digital electronic circuit systems, or in computer software, firmware, or hardware, including the structures disclosed in this specification and their structural equivalents, or A combination of one or more of them. The specific embodiments described in this specification may be implemented as one or more computer program products, that is, one or more computer program instruction modules, which are encoded on a tangible program carrier for execution by a data processing device. Or control the operation of data processing equipment. The tangible program carrier may be a computer-readable medium. The computer-readable medium may be a machine-readable storage device, a machine-readable storage substrate, a memory device, or a combination of one or more of the above.

The term "processor" or "controller" can encompass all equipment, devices, and machines used to process data, including, for example, programmable processors, computers, or multiple processors or computers. In addition to hardware, the processor may contain code that creates an execution environment for the computer program in question, such as constituting processor firmware, protocol stacks, database management systems, operating systems, or a combination of one or more of the above Code.

Computer programs (also known as programs, software, software applications, scripts, or code) can be written in any form of programming language, including compiled or interpreted languages, statements, or procedural languages, and can be deployed in any form, including as a stand-alone program or as a model A group, part, subroutine, or other unit suitable for use in a computing environment. Computer programs do not need to correspond to files in the file system. Programs can be stored in sections that hold other files or data (such as one or more scripts stored in a markup language document), in a single file specific to the program in question, or in multiple collaborative files (Such as a file that stores one or more modules, routines, or code sections). Computer programs can be deployed to be executed on one computer or on multiple computers that are located at one site or distributed across multiple sites and are interconnected by a communication network.

The procedures described in this specification can be executed by one or more programmable processors that execute one or more computer programs to execute functions, operate on input data and generate output . Programs and logic flows can also be performed by special-purpose logic circuits (and devices can also be implemented as special-purpose logic circuits), such as FPGAs (field programmable gate arrays) or ASICs (application-specific integrated circuits).

Processors suitable for running computer programs include, for example, general-purpose and special-purpose microprocessors, and any one or more processors of any type of digital computer. Generally speaking, the processor will receive instructions and data from read-only memory or random access memory (or both). The essential components of a computer are a processor for executing instructions and one or more data memory devices for storing instructions and data. Generally, a computer will also include one or more mass storage devices (such as magnetic disks, magneto-optical disks, or optical disks) for storing data, or be operatively coupled to receive from one or more mass storage devices Data and / or transfer data to one or more mass storage devices. However, a computer need not have such a device. Furthermore, the computer can be embedded in another device, such as a mobile phone, a personal digital assistant (PDA), to name a few.

Computer-readable media suitable for storing computer program instructions and data, including all forms of data memory (including non-volatile memory, media, and memory devices), including semiconductor memory devices such as EPROM, EEPROM, and Flash memory devices; magnetic disks, such as internal hard disks or removable disks; magneto-optical disks; and CDROM and DVD-ROM disks. The processor and the memory can be supplemented (or incorporated into the special purpose logic system) by the special purpose logic system.

In order to interact with users, the specific embodiments described herein can be implemented on a computer with a display device to display information to the user, such as a CRT (cathode ray tube) or LCD (liquid crystal display) monitor, etc., and can A keyboard and pointing device that lets users provide input to a computer, such as a mouse or trackball, or a touch screen. Other types of devices can also be used to interact with the user; for example, any form of user input can be received, including voice, spoken, or tactile input.

The specific embodiments described herein may be implemented in a computing system containing back-end components (such as a data server), or include middleware components (such as an application server), or include front-end components (such as with a graphical user interface or A client computer of a web browser, a user can interact with embodiments of the technical subject matter described herein through a graphical user interface or a web browser), or any one or more of such backends, middleware, or front-end components combination. The components of the system can be interconnected by digital data communications (such as communication networks) in any form or medium. Examples of communication networks include local area networks ("LAN") and wide area area networks ("WAN"), such as the Internet.

Computing systems can include clients and servers. The client and server are generally remote from each other, and usually interact through a communication network. The relationship between the client and the server is generated by computer programs running on the respective computers and having a client-server relationship with each other.

The directional words used in this text, such as up, down, right, left, front, back, top, and bottom, are only for reference to the drawings drawn, and are not meant to imply absolute orientation.

The terms "the", "an", or "an" as used herein mean "at least one" and should not be limited to "only one" unless expressly stated otherwise. Thus, for example, reference to "a component" includes a specific embodiment having two or more such components, unless the context clearly indicates otherwise.

As used herein, the term "about" means that quantities, sizes, recipes, parameters, and other quantities and characteristics are not and need not be precise, but may be approximated and / or larger or smaller as needed. , Reflecting tolerances, conversion factors, rounding, measurement errors, etc., and other factors known to those skilled in the art. When the word "about" is used to describe a range value or endpoint, it should be understood that this disclosure includes the particular value or endpoint mentioned. Regardless of whether the value or endpoint of the range in the description records "about", the value or endpoint of the range is intended to include two specific embodiments: one modified by "about" and one not modified by "about." It will be further understood that the endpoint of each range is important to the other endpoint and is independent of the other endpoint.

As used herein, the terms "substantially", "substantially" and variations thereof mean that the stated feature is equal to or approximately equal to a value or description. For example, a "substantially flat" surface means a surface labeled as flat or approximately flat. Furthermore, as defined above, "substantially similar" means that the two values are equal or approximately equal. In some embodiments, "substantially similar" may be labeled with values within 10% of each other (such as within 5% of each other, or within 2% of each other).

The above specific embodiments (and the features of these specific embodiments) are merely exemplary and may be provided separately or in any combination with any one or more specific embodiments provided herein without departing from the disclosure range.

It will be apparent to those having ordinary knowledge in the technical field of the present invention that various modifications and variations can be made to the present disclosure without departing from the spirit and scope of the present disclosure. Therefore, this disclosure is intended to cover modifications and variations of this disclosure, provided that such modifications and variations are within the scope of the appended patent applications and their equivalents.

100‧‧‧ Equipment

110‧‧‧ substrate

111‧‧‧first major surface

112‧‧‧Second major surface

115‧‧‧ outer edge

120‧‧‧ Vehicle

121‧‧‧ first major surface

122‧‧‧Second major surface

125‧‧‧ outer edge

150‧‧‧ outer border

175‧‧‧ separation path

175a‧‧‧First separation path

175b‧‧‧Second separation path

175c‧‧‧ Third separation path

180‧‧‧ Central Section

181‧‧‧The first peripheral part

182‧‧‧Second Peripheral

183‧‧‧ Corner

201‧‧‧ Part I

202‧‧‧ Part Two

225‧‧‧ Machine Vision Device

250‧‧‧ Controller

301‧‧‧first linear path

301a-301i‧‧‧The first plural points

303‧‧‧first non-linear path

302‧‧‧second linear path

302a-302i ‧‧‧ second plural points

304‧‧‧Second Nonlinear Path

400‧‧‧ All cracks

500‧‧‧ new outer edge

500a‧‧‧First new outer edge

500b‧‧‧ second new outer edge

500c‧‧‧ Third new outer edge

When reading the following embodiments with reference to additional drawings, the foregoing and other features and advantages of the specific embodiments of the present disclosure can be better understood, of which:

FIG . 1 illustrates a plan view of an exemplary device including a substrate and a carrier according to a specific embodiment of the present disclosure;

FIG . 2 illustrates a partial cross-sectional view of an exemplary device along line 2-2 of FIG . 1 according to a specific embodiment of the present disclosure;

FIG . 3 is a top view illustrating a partial cross-sectional view of an exemplary device along line 3-3 of FIG . 2 according to a specific embodiment of the present disclosure;

Fig . 4 illustrates an exemplary embodiment of a partial cross-sectional view of the exemplary device of Fig . 2 according to a specific embodiment of the present disclosure;

FIG 5 illustrates a plan view of an exemplary apparatus of FIG. 1 after separating the substrate along the separation path in accordance with a particular embodiment of the present disclosure; and

FIG 6 illustrates the substrate after separation along the separation path, along a line of FIG. 5 a partial sectional view of an exemplary apparatus according to the embodiment 6-6 of the present disclosure.

Domestic hosting information (please note in order of hosting institution, date, and number) None

Information on foreign deposits (please note in order of deposit country, institution, date, and number) None

Claims (15)

A method for processing a device including a substrate and a carrier; the substrate includes a first major surface, a second major surface, and a thickness, the thickness being defined between the first major surface of the substrate and the The carrier includes a first main surface, a second main surface, and a thickness defined between the first main surface of the carrier and the first main surface of the carrier. Between two major surfaces; the thickness of the substrate is less than the thickness of the carrier, a first portion of the second major surface of the substrate is bonded to the first major surface of the carrier, and the second major surface of the substrate An outer boundary of the first portion of the surface is defined at a joint interface between the second major surface of the substrate and the first major surface of the carrier, and a first boundary of the second major surface of the substrate The two parts extend from the outer boundary and the first part of the second major surface of the substrate exceeds an outer edge of the carrier. The method includes the following steps: a step of defining a first path, based on a contour of the outer boundary, defining A first path; defining a second path A step of defining a second path based on a contour of the outer edge of the carrier; a positioning step of positioning a separation path on the substrate, the separation path being laterally located between the first path and the second path; and In a separation step, the substrate is separated along the separation path. According to the method of claim 1, the separating step includes the step of generating a defect on the first major surface of the substrate. The method as recited in claim 2, wherein the defect includes a one-dot line extending along the separation path. The method according to claim 2, further comprising the step of expanding the defect when the first portion of the second main surface of the substrate is bonded to the first main surface of the carrier to generate The separation path extends from the first major surface of the substrate to an entire crack on the second major surface of the substrate. The method according to claim 4, wherein expanding the defect comprises the step of: when the first portion of the second main surface of the substrate is joined to the first main surface of the carrier, a force is applied to the substrate. A peripheral part. According to the method of any one of claims 1 to 5, the outer edge of the vehicle includes an edge surface, the edge surface, the first main surface of the vehicle, and the second main surface of the vehicle. At the intersection, the intersection of the edge surface and the first main surface of the vehicle extends along a common boundary axis with the outer boundary, and the edge surface of the vehicle includes a convex profile. According to the method of any one of claims 1 to 5, defining the first path includes the following steps: identifying a first plurality of points of the outer boundary, and further including the following steps: Unify the first line, and then define the first path as the first line. According to the method of any one of claims 1 to 5, defining the second path includes the following steps: identifying a second plurality of points on the outer edge of the vehicle, and further including the following steps: The plurality of points fit a second line, and then the second path is defined as the second line. The method according to any one of claims 1 to 5, wherein the separating step provides a new outer edge to the substrate, the new outer edge being laterally defined in a direction from the outer boundary away from the outer edge of the carrier. Between a first distance from the outer boundary and a second distance in a direction from the outer boundary toward the outer edge of the vehicle, and at least one of the following: the first distance is from about 0 microns to About 50 microns; and the first distance is from about 0 microns to about 150 microns. An apparatus includes: a substrate including a first major surface, a second major surface, and a thickness, the thickness being defined between the first major surface of the substrate and the second major surface of the substrate A vehicle comprising a first major surface, a second major surface, and a thickness defined between the first major surface of the vehicle and the second major surface of the vehicle; The thickness of the substrate is smaller than the thickness of the carrier, the second major surface of the substrate is bonded to the first major surface of the carrier, and an outer edge of the substrate laterally surrounds an outer edge of the carrier; And the substrate includes a separation path, the separation path includes a continuous boundary, the continuous boundary laterally surrounds a central portion of the substrate, the outer edge of the carrier laterally surrounds the continuous boundary of the separation path, and the separation path includes A plurality of intersection separation paths, the plurality of intersection separation paths including a first separation path, a second separation path, and a third separation path; the first separation path meets the second separation path; the first The separation path intersects the first separation path and the second separation path. A first peripheral portion of the substrate is defined between the outer edge of the substrate and the first separation path. A second peripheral portion of the substrate Is defined between the outer edge of the substrate and the second separation path, and a corner portion of the substrate is defined between the third separation path, the first peripheral portion of the substrate, and the second periphery of the substrate Between sections. The apparatus according to claim 10, wherein the thickness of the substrate is from about 50 microns to about 300 microns. In the apparatus according to claim 10, the material of the substrate is selected from the group consisting of glass, glass ceramic, ceramic, and silicon. A method for processing a device according to claim 10, comprising the steps of: locating each of the plurality of intersection separation paths on the substrate; and along each of the plurality of intersection separation paths. The substrate is separated, and the separating step is performed when the second main surface of the substrate is bonded to the first main surface of the carrier. According to the method described in claim 13, each of the plurality of intersection separation paths is positioned on the substrate independently of other paths in the plurality of intersection separation paths. According to the method of claim 13 or 14, a first portion of the second main surface of the substrate is bonded to the first main surface of the carrier, and an outer portion of the first portion of the second main surface of the substrate is bonded. A boundary is defined at a joint interface between the second major surface of the substrate and the first major surface of the carrier, and a second portion of the second major surface of the substrate extends from the outer boundary away from the outer boundary. The first portion of the second major surface of the substrate exceeds an outer edge of the carrier, and the separating step provides the substrate with a new outer edge laterally surrounding the central portion, the new outer edge being laterally defined from the outer boundary Between a first distance in a direction away from the outer edge of the vehicle and a second distance from the outer boundary in a direction toward the outer edge of the vehicle, and at least one of the following Or: the first distance is from about 0 microns to about 50 microns; and the second distance is from about 0 microns to about 150 microns.