KR20200006093A - Apparatus and Method for Handling Devices - Google Patents

Abstract

A method of processing an apparatus comprising a substrate and a carrier includes defining a first path based on a profile of an outer boundary defined at the bonding interface between the substrate and the carrier, and a second path based on the profile of the outer edge of the carrier. Defining a; positioning a separation path on the substrate located laterally between the first and second paths; and separating the substrate along the separation path. Also provided is an apparatus comprising a carrier and a substrate comprising a separation path comprising a plurality of crossover separation paths.

Description

Apparatus and Method for Handling Devices

This application claims priority to US Provisional Application No. 62 / 504,810, filed May 11, 2017, under 35 U.S.C. §119, the contents of which are incorporated herein by reference in their entirety.

FIELD The present disclosure relates generally to methods and apparatus for treating a substrate and a carrier, and more particularly, to a method and apparatus for separating a substrate along a separation path while the substrate is bonded to the carrier.

Glass sheets are commonly used in display applications such as, for example, liquid crystal displays (LCDs), electrophoretic displays (EPDs), organic light emitting diode displays (OLEDs), plasma display panels (PDPs), touch sensors, photovoltaic cells, and the like. Glass sheets can be produced, for example, by various ribbon forming processes, such as slot draw, float, down-draw, fusion-down draw, rolling, or up-draw. The glass ribbon is not limited but subsequently separated to provide a thin, flexible glass sheet suitable for further processing into desired display applications, including substrates for mobile devices, wearables (eg, watches), televisions, computers, tablets, and other display monitors. Can be. There is an interest in providing and processing thin, flexible glass sheets in the manufacture of substrates comprising flexible electronics or other electronic devices. Fabrication of the substrate may include the transport and handling of thin, flexible glass sheets. Accordingly, there is a need for an apparatus comprising a substrate and a method of treating the substrate.

In one way of handling thin flexible glass while processing a substrate, such flexible glass sheet is bonded to a carrier. Once bonded to the carrier, the nature and size of the carrier makes it possible to handle and transport such bonded structure without unwanted bending of the glass sheet during manufacture and without causing damage to the glass sheet. For example, thin flexible glass sheets may be bonded to relatively rigid carriers, and then functional elements (eg, color filters, touch sensors, or thin film transistor (TFT) elements) may be employed in the manufacture of electronic devices for display applications. It can be attached to a thin, flexible glass sheet to produce a viable glass substrate. In addition, by bonding the glass sheet to the carrier, the nature and size of the carrier allows the combined structure to be handled and transported in the production equipment without significant changes to existing production equipment, thereby reducing costs and efficiency of processing technology. To increase.

For example, it is desirable to size a substrate by separating one or more peripheral portions from the central portion of the substrate to provide a central portion having a predetermined shape and size that can be employed in various applications. Then, once transfer, handling, sizing, and other processing steps are completed, the substrate with a predetermined size and shape is removed from the carrier so that the substrate can be employed, for example, in an electronic device for a display application. It is desired to do it. However, due to the delicate nature of the substrate, unfortunately damage may occur to the substrate and / or carrier when bonding the substrate to the carrier, during processing and sizing of the substrate and carrier, and when separating the substrate from the carrier.

Current techniques for trimming a flexible glass sheet for sizing it prior to bonding the trimmed flexible glass sheet to a carrier typically produce current or future treatment procedures by creating glass particles that may contaminate the carrier. Reduce or eliminate the usefulness of the carrier. In addition, trimming the flexible glass sheet for sizing it before bonding the trimmed flexible glass sheet to the carrier substrate can produce glass particles that contaminate the second major surface of the flexible glass sheet, May cause: to reduce the strength of the bond between the flexible glass sheet and the carrier substrate; Provide a path for entry of process liquid into the flexible glass sheet / carrier interface during processing of the device on the flexible glass sheet; And / or separate the flexible glass sheet from the carrier when the glass particles provide a bonding mechanism between the flexible glass sheet and the carrier, which may cause damage to the flexible glass sheet and / or carrier during the separation process. Moreover, there is a desire to provide a predetermined side distance between the carrier and the corresponding outer edge of the flexible glass sheet. However, current techniques for trimming the flexible glass sheet for sizing prior to bonding have precisely positioned the trimmed flexible glass sheet to the carrier to achieve side distances within a range of predetermined side distances and / or predetermined side distances. And complicated to combine.

Accordingly, there is a need for a practical solution for bonding a substrate to a carrier, processing and sizing the substrate, and separating the substrate from the carrier without damaging the carrier and the substrate. Similarly, there is also a need for a practical solution for separating peripheral portions of the substrate from the central portion of the substrate that reduces and eliminates damage to the substrate and provides a consistent and repeatable process. Thus, reducing and eliminating damage to the substrate during processing and sizing of the substrate, enabling bonding of the substrate to the carrier and detachment of the substrate from the carrier without damaging the carrier and the substrate, and providing the substrate for a variety of intended applications. What is needed is a particular apparatus for carriers and substrates, as well as methods for treating carriers and substrates that provide a consistent and repeatable process for sizing.

The present invention is to provide a method and apparatus for separating a substrate along a separation path while the substrate is bonded to a carrier.

An exemplary embodiment of an apparatus comprising a substrate and a carrier is presented. Also provided are methods of treating a substrate and a carrier.

As described throughout the present disclosure, a substrate may comprise a single glass substrate (eg, a single flexible glass substrate, or a single rigid glass substrate), a single glass-ceramic substrate, a single ceramic substrate, or a single silicon substrate. Including a wide range of substrates. The substrate can also be a non-glass substrate, for example a polymer such as polycarbonate or other polymers including transparent, translucent and opaque polymers. The term "glass" as used herein is meant to include any material made at least partially of glass, including glass and glass-ceramic. In embodiments, the glass-ceramic has a crystallinity of about 30% to about 90%. Non-limiting examples of glass ceramic systems that may be employed include Li ₂ O × Al ₂ O ₃ × nSiO ₂ (ie, LAS system), MgO × Al ₂ O ₃ × nSiO ₂ (ie, MAS system) and ZnO × Al ₂ O ₃ xnSiO ₂ (ie, ZAS system). In some embodiments, the substrate comprises a single blank substrate of material, such as a single blank glass substrate (eg, a clean surface separated from a glass ribbon produced by a down-draw fusion process or other technique). Sheet), a single blank glass-ceramic substrate, a single blank silicon substrate (eg, a single blank silicon wafer). When provided as a single blank glass substrate, the single blank glass substrate can be transparent, translucent, or opaque, and optionally from the first major surface to the second major surface of the single blank glass substrate, The same glass composition can be included over the entire thickness. In some embodiments, the single blank glass substrate may comprise a single blank glass substrate that is chemically strengthened.

Any single substrate of the present disclosure may optionally include a wide range of functionality. For example, a single glass substrate may include a form that allows the substrate to change light or be integrated into a display device, touch sensor element, or other device. In some embodiments, a single glass substrate can include a color filter, polarizer, thin film transistor (TFT) or other elements. In some embodiments, where the substrate is provided as a single silicon substrate, the silicon substrate may comprise a form that allows the silicon substrate to be integrated into an integrated circuit, photovoltaic device, or other electrical element.

In some embodiments, the substrate may comprise a stack of single substrates, including, for example, any one or more single substrates. A stack of single substrates may be constituted by two or more single substrates stacked on each other while facing the major surface of adjacent single substrates joined to each other. In some embodiments, the stack of single substrates may comprise a stack of single glass substrates. For example, the first single glass substrate may comprise a color filter and the second single glass substrate may comprise one or more thin film transistors. The first and second single glass substrates may be joined together as a stack of single substrates that may be formed as display panels for display applications. Thus, substrates of the present disclosure may include any one or more single substrates or stacks of single substrates.

Some exemplary embodiments of the present disclosure are described below with the understanding that any embodiments can be used alone or in combination with each other.

Example 1. A method of processing an apparatus comprising a substrate and a carrier is disclosed. The substrate includes a first major surface and a second major surface, the thickness of the substrate being defined between the first major surface of the substrate and the second major surface of the substrate. The carrier includes a first major surface and a second major surface, the thickness of the carrier being defined between the first major surface of the carrier and the second major surface of the carrier. The thickness of the substrate is less than the thickness of the carrier, the first portion of the second major surface of the substrate is coupled to the first major surface of the carrier, and the outer boundary of the first portion of the second major surface of the substrate is A second interface of the second major surface of the substrate and the first major surface of the carrier, the second portion of the second major surface of the substrate passing from the outer boundary past the outer edge of the carrier It extends away from the first portion of the major surface. The method includes defining a first path based on the profile of the outer boundary, defining a second path based on the profile of the outer edge of the carrier, located laterally between the first path and the second path. Positioning a separation path on the substrate, and separating the substrate along the separation path.

Example 2 The method of example 1, wherein the substrate has a thickness of about 50 microns to about 300 microns.

Example 3 The method of example 1 or 2, wherein the material of the substrate is selected from the group comprising glass, glass-ceramic, ceramic, and silicon.

Example 4 The method of any one of embodiments 1-3, wherein the separating comprises creating a defect on the first major surface of the substrate.

Example 5 The method of example 4, wherein the defect comprises a score line extending along the separation path.

Example 6 The method of embodiment 4 or 5, wherein a full-body crack is created that extends along a separation path from the first major surface of the substrate to the second major surface of the substrate, Enlarging the defect while the first portion of the second major surface of the substrate is coupled to the first major surface of the carrier.

Embodiment 7 The step of enlarging the defect includes applying a force to a peripheral portion of the substrate while the first portion of the second major surface of the substrate is coupled to the first major surface of the carrier.

Embodiment 8 The method of any of embodiments 1-7, wherein the outer edge of the carrier comprises an edge surface that intersects the first major surface of the carrier and the second major surface of the carrier, and wherein the carrier The intersection of the edge surface and the first major surface of s extends along the outer boundary and common boundary axis.

Example 9 The method of example 8, wherein the edge surface of the carrier comprises a convex profile.

Embodiment 10 The method of any one of embodiments 1 to 9, wherein defining the first path includes identifying a first plurality of points of an outer boundary.

Embodiment 11 The method of Embodiment 10, comprising fitting a first line to the first plurality of points, and then defining the first path as the first line.

Embodiment 12 The method of any one of embodiments 1 to 11, wherein defining the second path includes identifying a second plurality of points of the outer edge of the carrier.

Embodiment 13 The method of embodiment 12, further comprising: fitting a second line to the second plurality of points, and then defining the second path as the second line.

Example 14 The method of any of embodiments 1-13, wherein the separation path is linear.

Example 15 The method of example 14, wherein at least one of the first path and the second path is non-linear.

Example 16 The method of example 15, wherein the first path is non-linear and the second path is non-linear.

Embodiment 17 The method of any of embodiments 1-16, wherein the separating step is from a first distance from an outer boundary in a direction away from the outer edge of the carrier and from an outer boundary in a direction towards the outer edge of the carrier. The substrate is provided with a new outer edge defined laterally between the second distances of.

Example 18 The method of example 17, wherein the first distance is from about 0 microns to about 50 microns.

Example 19 The method of embodiment 17 or 18, wherein the second distance is from about 0 micron to about 150 micron.

Example 20 An apparatus comprises a substrate comprising a first major surface and a second major surface and a carrier comprising the first major surface and the second major surface. The thickness of the substrate is defined between the first major surface of the substrate and the second major surface of the substrate, and the thickness of the carrier is defined between the first major surface of the carrier and the second major surface of the carrier and the substrate The thickness of is smaller than the thickness of the carrier. The second major surface of the substrate is coupled to the first major surface of the carrier, the outer edge of the substrate enclosing the outer edge of the carrier laterally. The substrate includes a separation path that includes a continuous boundary that laterally surrounds a central portion of the substrate. The outer edge of the carrier laterally surrounds a continuous boundary of the separation path, the separation path including a plurality of cross separation paths including a first separation path, a second separation path, and a third separation path. The first separation path intersects the second separation path, and the third separation path intersects the first separation path and the second separation path. A first peripheral portion of the substrate is defined between an outer edge of the substrate and the first separation path, and a second peripheral portion of the substrate is defined between an outer edge of the substrate and the second separation path and an edge of the substrate A portion is defined between the third separation path, the first peripheral portion of the substrate, and the second peripheral portion of the substrate.

Example 21 The apparatus of example 20, wherein the substrate has a thickness of about 50 microns to about 300 microns.

Example 22 The apparatus of example 20 or example 21, wherein the material of the substrate is selected from the group comprising glass, glass-ceramic, ceramic, and silicon.

Embodiment 23 The method of processing the device of any one of embodiments 20 to 22, comprises placing each path of the plurality of cross separation paths on the substrate and separating the substrate along each path.

Embodiment 24 The method of embodiment 23, wherein the separating step is performed while the second major surface of the substrate is bonded to the first major surface of the carrier.

Embodiment 25 The method of embodiment 23 or embodiment 24, wherein each path of the plurality of cross separation paths is located on a substrate independently of other paths of the plurality of cross separation paths.

Embodiment 26 The method of any one of embodiments 23-25, wherein the separating step separates the first peripheral portion of the substrate from the central portion of the substrate along the first separation path and removes the first peripheral portion of the substrate along the second separation path. Separating the second peripheral portion of the substrate from the central portion, and then separating the edge portion of the substrate from the central portion of the substrate along the third separation path.

Embodiment 27 The method of any of embodiments 23-26, wherein the first portion of the second major surface of the substrate is coupled to the first major surface of the carrier and the first portion of the second major surface of the substrate An outer boundary of the substrate is defined at a mating interface between the second major surface of the substrate and the first major surface of the carrier, the second portion of the second major surface of the substrate passing from the outer boundary past the outer edge of the carrier; Extends far into the first portion of the second major surface of the substrate. The separating step is defined laterally between the first distance from the outer boundary in a direction surrounding the central portion and away from the outer edge of the carrier and the second distance from the outer boundary in the direction toward the outer edge of the carrier. The new outer edge to the substrate.

Example 28 The method of example 27, wherein the first distance is from about 0 micron to about 50 micron.

Example 29 The method of embodiment 27 or 28, wherein the second distance is from about 0 micron to about 150 micron.

According to the present invention, a method and apparatus for separating a substrate along a separation path while the substrate is bonded to a carrier can be provided.

The above and other forms and advantages of embodiments of the present disclosure are better understood upon reading the following detailed description with reference to the accompanying drawings:
1 shows a top view of an example device including a substrate and a carrier in accordance with embodiments of the present disclosure;
FIG. 2 shows a partial cross-sectional view of the example device over line 2-2 of FIG. 1 in accordance with embodiments of the present disclosure; FIG.
3 shows a top view of a partial cross-sectional view of the exemplary device over line 3-3 of FIG. 2 in accordance with embodiments of the present disclosure;
4 illustrates an example embodiment of a partial cross-sectional view of the example device of FIG. 2 in accordance with embodiments of the present disclosure;
5 shows a top view of the example device of FIG. 1 after separating a substrate along a separation path in accordance with embodiments of the present disclosure;
FIG. 6 illustrates a partial cross-sectional view of the exemplary device over lines 6-6 of FIG. 5 after separating the substrate along a separation path in accordance with embodiments of the present disclosure.

The embodiments will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments are shown. Wherever possible, the same reference numerals are used to refer to the same or similar parts throughout the drawings. However, the claims may include many different forms of various embodiments and should not be construed as limited to the embodiments set forth herein.

As briefly described above, in various embodiments, a method and apparatus for processing a substrate are provided. The substrate can be coupled to a carrier to enable handling and transfer of the substrate during processing. With respect to the substrate, the nature and size of the carrier may allow the bonded substrate to be handled and transported during processing without significantly bending the substrate, which may damage the substrate and / or damage components that may be mounted to the substrate. have. Unless stated otherwise, the substrates of any embodiments of the present disclosure may include a single substrate or a stack of two or more single substrates. Such a single substrate may have a thickness of about 50 microns (μm) to about 300 microns, although other thicknesses may be provided in some embodiments.

In some embodiments, a single flexible glass substrate or stack of single flexible glass substrates is formed naturally between a binder, eg, a polymeric binder, a silicone binder, one or more adjacent surfaces (eg, rough adjacent surfaces). Force, or other binder, can be removably coupled to the carrier. In some embodiments, the substrate can be bonded to the carrier without a binder, and the bonding force based on direct contact between the substrate and the carrier can couple the carrier to the substrate. In some embodiments, the substrate can be bonded to a carrier made of glass, resin, or other material (eg, low pressure laminate or high pressure laminate of a fiber sheet, or polycarbonate) that can withstand conditions during processing of the substrate. Thus, the carrier can introduce a desired level of rigidity by providing the carrier with an additional thickness that can engage (or work with) the thickness of the substrate that is removably bonded to the carrier. In some embodiments, the carrier may comprise a plate (eg, rigid plate) having a thickness greater than the thickness of a single substrate bonded to the carrier. Further, in some embodiments, the carrier is a treatment configured to treat a relatively thick glass substrate having a thickness within the overall thickness range of the carrier and the substrate bonded to the carrier, within the full thickness range of the carrier and the substrate bonded to the carrier. It may be selected to include a thickness that may be within a range that may be employed with the machine and equipment.

After bonding the substrate to the carrier, it may be desirable to subsequently remove the carrier from the substrate without damaging the substrate. For example, it may be desirable to remove the substrate from the carrier prior to processing the substrate (eg, by adding one or more functional components). Alternatively, in some embodiments, there may be a need to remove a single substrate from a carrier after the substrate has been treated with a single substrate having one or more functional elements and before creating the substrate as a stack of single substrates. have. In addition, in some embodiments, it may be desired to remove a carrier from a substrate comprising a stack of single substrates.

The present disclosure provides an apparatus and method for processing an apparatus. For example, FIG. 1 shows an exemplary form of an example device 100 that includes a substrate 110 and a carrier 120. For clarity, the shape of the carrier 120 is shown in dashed lines in FIG. 1 because the carrier 120 is located below the substrate 110 in the top view of FIG. 1. In some embodiments, the material of substrate 110 may be selected from the group comprising glass, glass-ceramic, ceramic, and silicon, and the material of carrier 120 may be polyurethane, glass, glass-ceramic, It may be selected from the group comprising ceramics, silicon, plastics, and metals. In some embodiments, substrate 110 and / or carrier 120 may or may not transmit light, and thus may be transparent, translucent, or opaque at least partially or entirely. In addition, as shown in FIG. 2. A partial cross-sectional view of device 100 along line 2-2 of FIG. 1 is shown, and in some embodiments, substrate 110 can include a first major surface 111 and a second major surface 112 and The carrier 120 may include a first major surface 121 and a second major surface 122. In some embodiments, the thickness “t1” of the substrate 110 defined between the first major surface 111 and the second major surface 112 may be between about 50 microns and about 300 microns. In addition, in some embodiments, such thickness “t1” may be less than the thickness “t2” of the carrier 120 defined between the first major surface 121 and the second major surface 122.

In some embodiments, the second major surface 112 of the substrate 110 may be coupled to the first major surface 121 of the carrier 120. In some embodiments, the coupling between the second major surface 112 of the substrate 110 and the first major surface 121 of the carrier 120 may be considered temporary. For example, in some embodiments, once joined, the first note may be detached from the carrier 120 and then, for example, to employ the substrate 110 in one or more display applications. Intention may be intended to separate the second major surface 112 from the surface 121 (eg, after processing the apparatus 100).

In some embodiments, the second major surface 112 may be in direct contact with the first major surface 121. In some embodiments, based on at least direct contact between the Jeju surface 112 and the first major surface 121, the second major surface 112 is directly coupled to the first major surface 121. Can be. Alternatively or in addition, in some embodiments, the device 100 is adapted to couple the second major surface 112 to the first major surface 121 and the first major surface 112. Adhesive (not shown) located between surfaces 121. In some embodiments, the second major surface 112 of the substrate 110 is a lamination, pressing, heating, or other bonding method for attaching the substrate 110 to the carrier 120. Can be coupled to the first major surface 121 of the carrier 120. For example, in some embodiments, the first portion 201 of the second major surface 112 of the substrate 110 may be coupled to the first major surface 121 of the carrier 120. . In some embodiments, the coupling between the substrate 110 and the carrier 120 may not be considered temporary, whereby once sized the substrate 110 and the carrier 120 are finished products (eg, It is employed as a building panel or as a backsplash.

In some embodiments, the outer boundary 150 of the first portion 201 of the second major surface 112 of the substrate 110 may include a second major surface 112 of the substrate 110 and a carrier ( The coupling interface between the first major surface 121 of 120 may be defined. In addition, in some embodiments, the second portion 202 of the second major surface 112 of the substrate 110 passes from the outer boundary 150 beyond the outer edge 125 of the carrier 120. It may extend away from the first portion 201 of the second major surface 112. Thus, in some embodiments, the substrate 110 may be larger in size than the carrier 120, and cantilevered portions (eg, cantilevered) relative to the joined portion (eg, the first portion 201). , A second portion 202). In some embodiments, the substrate 110 oversized relative to the carrier 120 may simplify the bonding step because accurate alignment of the substrate 110 with respect to the carrier 120 may not be desired during the bonding step. . Rather, as discussed in greater detail below, the predetermined dimensions of the substrate 110 may be provided by subsequent separation of the peripheral portion of the substrate 110 after the substrate 110 is coupled to the carrier 120.

In some embodiments, the outer edge 125 may extend across the thickness "t2" of the carrier 120 between the first major surface 121 and the second major surface 122. In some embodiments, the outer edge 125 of the carrier 120 includes an edge surface that intersects the first major surface 121 of the carrier 120 and the second major surface 122 of the carrier 120. can do. In addition, in some embodiments, the intersection of the edge surface of the outer edge 125 and the first major surface 121 of the carrier 120 may extend along the outer boundary 150 and the common boundary axis. . In some embodiments, the outer edge 125 may comprise a planar edge surface extending across at least a portion of the thickness “t2” between the first major surface 121 and the second major surface 122. have. Further, in some embodiments, the outer edge 125 is a convex profile and a concave profile extending across at least a portion of the thickness “t2” between the first major surface 121 and the second major surface 122. Non-planar edge surfaces (eg, convex edge surfaces as shown in FIG. 2) that include at least one of the following. In some embodiments, the outer edge 125 may comprise two or more planar edge surfaces, two or more non-planar edge surfaces, or one or more planar edge surfaces and first and second major surfaces 121 and 122. And a combination of one or more non-planar edge surfaces extending across at least a portion of the liver thickness “t2”. In some embodiments, the outer edge 125 may be a “molding” edge formed based on the operation of at least one molding process, cutting process, and separation process. Additionally or alternatively, in some embodiments, the outer edge 125 is ground, polished, and buffed to provide one or more profiles, shapes, and surface properties to the edge surface of the outer edge 125. may be one or more of: buffing, and machining.

In addition, in some embodiments, the outer edge 125 may include a corner between the planar edge surface and at least one of the first major surface 121 and the second major surface 122. Similarly, in some embodiments, the outer edge 125 may include a corner between a non-planar edge surface and at least one of the first major surface 121 and the second major surface 122. In some embodiments, the edges may include square edges where at least one of the first major surface 121 and the second major surface 122 is connected to the planar edge surface at a substantially 90 degree angle. Alternatively, in some embodiments, the edge may be a rounded edge, a cut edge, a chamfered edge, an inclined edge, or a planar edge surface or at least one of the first major surface 121 and the second major surface 122. Other shaped edges that connect to the non-planar edge surfaces. Thus, for the purposes of the present disclosure, regardless of shape, the outer edge 125 of the carrier 120 may have a thickness " t2 " of the carrier 120 between the first major surface 121 and the second major surface 122. And extend across and define the surface surrounding the first major surface 121 and the second major surface 122, thereby forming the outer circumference of the carrier 120.

In some embodiments, the device 100 may be processed after coupling the second major surface 112 of the substrate 110 to the first major surface 121 of the carrier 120. In some embodiments, the process includes cleaning, cleaning, sizing (eg, trimming), and attaching functional elements (eg, a color filter, touch sensor, or thin film transistor (TFT) element) to the substrate 110. It may include one or more of the. For example, in some embodiments, the substrate 110 is a bonded structure comprising a substrate 110 coupled to the carrier 120, for example, the bonded structure may be fabricated without significant modification. It can be handled by using existing manufacturing equipment that provides characteristics and sizes that can be handled and transferred to the manufacturing equipment. For example, in some embodiments, existing manufacturing equipment may be configured to process structures having a predetermined thickness. Thus, in some embodiments, the thickness “t1” of the substrate 110 in combination with the thickness “t2” of the carrier 120 is equal to a predetermined thickness at which existing manufacturing equipment may be configured for processing. It may be selected to provide a thickness “t3” of the device 100 between the first major surface 111 of the substrate 110 and the second major surface 122 of the carrier 120. In some embodiments, the thickness “t3” may be about 400 micron to about 750 micron, about 500 micron to about 1 millimeter, about 1 millimeter to about 2 millimeter; However, in some embodiments, the thickness “t3” of the device 100 may be larger or smaller than the explicit dimensions provided in the present disclosure without departing from the scope of the present disclosure.

Returning to FIG. 1, in some embodiments, the outer edge 115 of the substrate 110 may laterally surround the outer edge 125 of the carrier 120. Throughout this disclosure, a first aspect that “laterally encloses” a second aspect is, for example, on an upper or lower surface in a direction perpendicular to one or more major surfaces of the substrate 110 and / or carrier 120. For example, it is intended to mean that the outer circumference defined by the first form surrounds the outer circumference defined by the second form. Thus, for example, as shown in the plan view of FIG. 1, the outer circumference (defined by the outer edge 115) of the substrate 110 is defined by the outer circumference (the outer edge 125) of the carrier 120. Enclosed). Likewise, in some embodiments, the outer edge 125 of the carrier 120 is coupled between the second major surface 112 of the substrate 110 and the first major surface 121 of the carrier 120. The outer boundary 150 defined in the interface may laterally surround. Additionally, in some embodiments, the substrate 110 can include a separation path 175 that includes a continuous boundary that laterally surrounds the central portion 180 of the substrate 110. In some embodiments, the outer edge 125 of the carrier 120 may laterally surround a continuous boundary of the separation path 175. Thus, in some embodiments, the separation path 175 includes a separation path 175 that laterally surrounds the outer boundary 150 and an outer edge 125 that laterally surrounds the separation path 175. May be laterally located between the outer edge 125 of the carrier 120 and the outer boundary 150.

As will be discussed in more detail below, the method of processing the device 100 may, for example, provide the substrate 110 with a predetermined shape and size selected for employment in one or more applications, such as a display application. The substrate 110 may be separated along the separation path 175. After positioning the substrate 110 on the carrier 120 having an outer edge 115 laterally surrounding the outer edge 125 of the carrier 120, the separation path 175 is followed by the substrate 110. By separating the substrate 110, the initial size, shape, and placement of the substrate 110 (eg, prior to processing the apparatus 100) may, for example, prior to bonding the substrate 110 to the carrier 120. It may be faster and cheaper than sizing the substrate 110 to a predetermined shape and size. For example, where the substrate 110 is trimmed to size the substrate 110 prior to coupling the carrier 120, in some embodiments, the substrate 110 is careful against the carrier 120. Extreme precision may be required to position it smoothly. Additionally, where the substrate 110 is trimmed for sizing prior to bonding the substrate 110 to the carrier 120, in some embodiments, the preceding trim when handling and transporting the substrate 110. Extreme care may be required to avoid cutting, scratching or cracking the edges of the substrate. Accordingly, in some embodiments, separating the substrate 110 along the separation path 175 after the substrate 110 is coupled to the carrier 120 and the substrate 110 is coupled to the carrier 120. The efficiency of the process can be increased and the likelihood of damage to the substrate 110 during sizing, handling, and transporting the substrate 110 can be reduced.

Further, in some embodiments, the separation path 175 includes a plurality of cross separation paths including a first separation path 175a, a second separation path 175b, and a third separation path 175c. It may include. In some embodiments, the first separation path 175a may intersect the second separation path 175b, and the third separation path 175c may be the first separation path 175a and the second separation path 175a. May intersect the separation path 175b. In some embodiments, the first peripheral portion 181 of the substrate 110 may be defined between the outer edge 115 of the substrate and the first separation path 175a, and the first portion of the substrate 110 may be formed. Two peripheral portions 182 may be defined between the outer edge 115 of the substrate 110 and the second separation path 175b. In addition, in some embodiments, the corner portion 183 of the substrate 110 may be defined between the third separation path 175c, the first peripheral portion 181, and the second peripheral portion 182. Can be. In some embodiments, such a plurality of crossover paths may define a central portion 180 of the substrate 110. For example, in some embodiments, one or more of the plurality of crossover paths intersect the outer edge 115 of the substrate 110 at two locations, the first major surface of the substrate 110. It can extend separately across 111 and define a central portion 180 of the substrate 110 along with other one or more of the plurality of intersecting paths. In some embodiments, any number of intersections defining the central portion 180 to include any size and shape that may be selected based at least in part on the particular application in which the substrate 110 may be employed. It should be appreciated that the separation path 175 can include a separation path.

A method of separating the substrate 110 along the separation path 175 is now described with reference to FIGS. 3-6, wherein FIG. 3 is a partial cross-sectional view of the device 100 along line 3-3 of FIG. 2. Top view is shown. For example, FIG. 3 provides an exemplary diagram of what a machine vision device 225 can see. In some embodiments, the machine vision device 225 is an imaging technology (eg, camera, sensor, light, laser, etc.) to provide one or more forms of image-based automated inspection and analysis of the device 100. It may include. For example, in some embodiments, the machine vision device 225 may acquire an image that includes one or more forms of the device 100. In addition, in some embodiments, the machine vision device 225 may be coupled to a controller 250 (eg, computer, CPU, programmable logic controller) via a wired or wireless connection. In some embodiments, the controller 250 may be directed, programmed, encoded, designed, and / or made to operate a machine vision device 225, and may be coupled to the machine vision device 225. Information (e.g., digital images) obtained by the present invention. The controller 250 may further include hardware and software for providing image processing capability of the image acquired by the machine vision device 225. For example, in some embodiments, the controller 250 may include images, image comparison techniques, edge detection capabilities, image stitching and registration, pixel counting and manipulation, segmentation, pattern recognition, color analysis, optical To obtain data from analysis, measurement and metrology, and other machine vision image processing methods, images may be processed using filters, image extraction and decoding techniques. Based at least in part on image processing capability, the controller 250 may provide an output (eg, a control signal) to one or more elements to process, trim, transport and handle the device 100 based on the output. Can be.

Thus, for purposes of the disclosure, the machine vision device 225, alone or in combination with the controller 250, may be used alone or in humans, for example, to interpret visual details obtained with a human visual system. It is understood to be technically distinct from the human eye, which uses the visual system of the human central nervous system to process visual details in combination with the brain. Thus, in some embodiments, the machine vision device 225, alone or in combination with the controller 250, performs automatic image capture and image processing in the form of the device 100 without human interaction. It is possible to provide a scalable, consistent and repeatable automated method for processing the substrate 110 and the carrier 120 thereby. In addition, although a single machine vision device 225 is shown in the figures, it should be understood that in some embodiments, one or more machine vision devices may be employed in accordance with the methods of the present disclosure without departing from the scope of the present disclosure. .

The features of the method are, in some embodiments, one or more forms alone or the same to separate the substrate 100 along one or more separation paths 175 of the plurality of cross separation paths without departing from the scope of the present disclosure. Or will be described in connection with the first separation path 175a with the understanding that it may be applied in combination in a similar manner. In some embodiments, the method includes defining a first path (eg, first linear path 301, first non-linear path 303) based on the profile of the outer boundary 150. It may include. For example, in some embodiments, defining the first paths 301, 303 may include the first plurality of points 301a, 301b, 301c, 301d, 301e, 301f of the outer boundary 150. , 301g, 301h, 301i). In some embodiments, the method aligns the first lines 301, 303 with the first plurality of points 301a-301i, and then aligns the first paths 301, 303 with the first line ( 301 and 303). In some embodiments, the method further comprises a second path (eg, second linear path 302, second non-linear path 304) based on the profile of the outer edge 125 of the carrier 120. It may include the step of defining. For example, in some embodiments, defining the second paths 302, 304 may include the second plurality of points 302a, 302b, 302c, of the outer edge 125 of the carrier 120. 302d, 302e, 302f, 302g, 302h, 302i). In some embodiments, the method aligns second lines 302, 304 with the second plurality of points 302a-302i, and then aligns the second paths 302, 304 with the second line ( 302 and 304).

In some embodiments, the machine vision device 225, alone or in combination with the controller 250, may combine at least one of the first paths 301, 303 and the second paths 302, 304. It can be specified automatically. For example, in some embodiments, the mash vision device 225 may obtain an image of at least one area of the device 100, and the first plurality of points of the outer boundary 150. One or more image processing techniques may be used to identify at least one of 301a-301i and the second plurality of points 302a-302i of the outer edge 125 of the carrier 120. In some embodiments, the first plurality of points 301a-301i may correspond to, for example, the spatial location of the physical form and / or the physical form of the outer boundary 150, The plurality of points 302a-302i may correspond to, for example, the spatial location of the physical shape and / or the physical shape of the outer edge 125 of the carrier 120. In some embodiments, at least one of the outer boundary 150 and the outer edge 125 may comprise an irregular (eg, non-linear) shape. Further, in some embodiments, identifying the first plurality of points 301a-301i and the second plurality of points 302a-302i may include the outer boundary 150 and the outer edge 125. ) Can provide an estimate of the irregular shape of at least one irregular shape. In some embodiments, the number of such points may be increased, for example, to increase the spatial resolution and accuracy of the estimated profile, or, for example, to increase the computation speed. Thus, in some embodiments, the methods of the present disclosure provide a profile of the outer boundary 150 projected on the first major surface 111 of the substrate 110 and the first major surface of the substrate 110. The profile of the outer edge 125 of the carrier 120 projected on 111 can be estimated.

Further, in some embodiments, the controller 250 aligns the first line 301 (which defines the first linear path 301) with the first plurality of points 301a-301i and the first line. One or more line fitting techniques (eg, linear regression analysis) may be employed to fit two lines 302 (which define a second linear path 302) to the second plurality of points 302a-302i. Similarly, in some embodiments, the controller 250 attaches the first line 303 (which defines the first non-linear path 303) to the first plurality of points 301a-301i. One or more line n-order polynomial regression analysis techniques (e.g., 2) to fit and fit the second line 304 (which defines the second non-linear path 304) to the second plurality of points 302a-302i. Car, tertiary, etc.) may be employed. Thus, based on the methods of the present disclosure, the first paths 301, 303 may be, for example, based on the estimated shape of the outer boundary 150 or an estimate based on a single point of the substrate 110. It may provide a more accurate estimate of the actual profile of the outer boundary 150 as projected on the primary surface 111. Similarly, based on the methods of the present disclosure, the second paths 302, 304 are more than, for example, the estimated shape of the outer edge 125 of the carrier 120 or an estimate based on a single point. It may provide a more accurate estimate of the actual profile of the outer edge 125 of the carrier 120 as projected on the first major surface 111 of the substrate 110. By providing a more accurate estimate of the profile of the outer boundary 150 and outer edge 125, the features of the present disclosure are increased, for example, when positioning the separation path 175 on the substrate 110. Provides precision and accuracy, providing more accurate dimensions of the substrate 110 and consistent control of the shape and size of the substrate 110.

Thus, in some embodiments, the method may further comprise positioning the separation path 175 on the substrate 110. In some embodiments, the positioning may be accomplished digitally, for example, by one or more image processing techniques performed by the controller 250 on an image acquired by the machine vision device 225. . For example, in some embodiments, the machine vision device 225, alone or in combination with the controller 250, estimates the profile of the outer boundary 150 and the exterior of the carrier 120. Based on the estimation of the profile of the edge 125, the corresponding spatial location of the separation path 175 on the substrate 110 may be determined. Based on the corresponding spatial location of the separation path 175 on the substrate 110, the controller 250 may operate one or more elements to automatically process the device 100 in accordance with the methods of the present disclosure. Can be. Returning back to FIG. 1, in some embodiments, the positioning may comprise each path (eg, first separation path 175a, second path) of a plurality of cross separation paths 175 on the substrate 110. And a separation path 175b and a third separation path 175c). In some embodiments, each path of the plurality of cross separation paths 175 may be located on the substrate 110 independently of other paths of the plurality of cross separation paths 175. By positioning each path of the plurality of cross separation paths 175 independently of other paths of the plurality of separation paths 175, the position of each path is different from that of the plurality of cross separation paths 175. Regardless of the shape of the paths, it may be better controlled based on the shape of the substrate 110 and / or carrier 120.

5 shows a top view of the device 100 after separating the substrate 110 along each path of the plurality of cross separation paths 175. In some embodiments, the separating step may provide a substrate 110 having a new outer edge 500 laterally surrounding the central portion 180 of the substrate 110. In addition, the outer edge 125 of the carrier 120 may laterally surround the new outer edge 500 of the substrate 110. By laterally surrounding the new outer edge 500 of the substrate 110, the outer edge 125 of the carrier 120 may affect at least one of the substrate 110 and the carrier 120. The new outer edge 500 can be isolated from external force and contact with the object. For example, during handling, processing, and transport of the substrate 110 coupled to the carrier 120, at least one of the substrate 110 and the carrier 120 may be affected by external forces and contact with an object. . In some embodiments, if the substrate 110 is directly affected by external force and contact with the object, the substrate 110 is damaged (eg, cracked, chipped) by at least such external force and contact with the object. , Scratches, etc.). However, by laterally enclosing the new outer edge 500 of the substrate 110, the outer edge 125 of the carrier 120 can be in contact with the external force and the object and in direct contact with the external force and the object. By isolating the new outer edge 500 from contact, damage to the substrate 110 can be at least prevented or reduced.

In some embodiments, the separating step may include separating the substrate 110 along each path of the plurality of cross separation paths 175. For example, in some embodiments, the separating step comprises a first peripheral portion 181 of the substrate 110 from a central portion 180 of the substrate 110 along the first separation path 175a. After separating the second peripheral portion 182 of the substrate 110 from the central portion 180 of the substrate 110 along the second separation path 175b, the third separation path ( The method may include separating the edge portion 183 of the substrate 110 from the central portion 180 of the substrate 110 along 175c. Separating the substrate 110 along the first separation path 175a may provide a first new outer edge 500a to the substrate 110 and may provide the second separation path 175b. Accordingly, the separating of the substrate 110 may provide a second new outer edge 500b to the substrate 110. Similarly, providing a corner portion 183 along the third separation path 175c may provide a third new outer edge 500c on the substrate 110. In some embodiments, separating each peripheral portion from the central portion 180 in a predetermined order, for example, separating both the first peripheral portion 181 and the second peripheral portion 182. If the corner portion 183 was previously separated from the central portion 180, cracks, chipping, and cracking in the substrate 110 along the separation path 175 caused by separation that may otherwise be present. At least one of can be prevented and reduced.

As shown in FIG. 3, in some embodiments, the first separation path 175a may be located laterally between the first paths 301 and 303 and the second paths 302 and 304. In some embodiments, after placing a first separation path 175a on the substrate 110, the method includes separating the substrate 110 along the first separation path 175a. can do. In some embodiments, such separation may include creating a defect 300 on the first major surface 111 of the substrate 110. In some embodiments, the defect 300 may include a score line extending along the first separation path 175a. In some embodiments, the defect 300 is an entire first separation path from a first position of the outer edge 115 of the substrate 110 to a second position of the outer edge 115 of the substrate 110. May extend along 175a. However, as shown in FIG. 3, such defect 300 may, in some embodiments, extend at a partial distance along the first separation path 175a. In addition, in some embodiments, the first separation path 175a may be linear, and the first major surface 111 of the substrate 110 may be tools (eg, score wheels, scribes, diamond tips, Contact with an indenter). Alternatively or in addition, in some embodiments, the defect 300 may be formed by a laser and may include a plurality of defects along the first separation path 175a. In some embodiments, the cooling fluid (eg, liquid, gas, or a combination of liquid and gas) may be defective, alone or in combination with a heating device (eg, electromagnetic radiation, laser, ultraviolet laser, pulsed laser, etc.). And may be employed to apply thermal stress on the substrate 110 along the first separation path 175a to form 300 and / or to separate the substrate 110 along the first separation path 175a. .

In addition, as shown in the partial cross-sectional view of FIG. 4, in some embodiments, the separating step may include the first major surface 111 of the substrate 110 to the second major surface of the substrate 110. In order to create the whole-body crack 400 extending along the first separation path 175a to 112, the first portion 201 of the second major surface 112 of the substrate 110 is moved to the carrier 120. While coupled to the first major surface 121 of), it may include the step of enlarging the defect (300). In some embodiments, the step of enlarging the defect 300 may include the first portion 201 of the second major surface 112 of the substrate 110 being attached to the first major surface 121 of the carrier 120. It may include applying a force "F" to the peripheral portion (eg, the first peripheral portion 181) of the substrate 110 while being bonded. In some embodiments, the carrier 120 supports the center portion 180 and the first peripheral portion 181 and is centered while separating the substrate 110 along the first separation path 175a. The movement of at least one of the portion 180 and the first peripheral portion 181 may be prevented and reduced (eg, vibration dampened). Supporting the central portion 180 and the first peripheral portion 181 while separating the substrate 110 along the first separation path 175a may include the central portion 180 and the first peripheral portion 181. Is not supported by the carrier 120, at least prevents and reduces cracks, chippings, and cracks in the substrate 110 along the first separation path 175a caused by separation that may otherwise be present. You can.

6 shows a partial cross-sectional view of the device 100 along line 6-6 of FIG. 5 after separating the substrate 110 along the first separation path 175a. For example, in some embodiments, the detaching step may include a first distance “d1” from the outer boundary 150 in a direction away from the outer edge 125 of the carrier 120 and the outside of the carrier 120. The first new outer edge 500a defined laterally between the second distance “d2” from the outer boundary 150 in the direction towards the edge 125 may be provided to the substrate 110. In some embodiments, the first distance “d1” may be about 0 micron to about 50 micron, and / or the second distance “d2” may be about 0 micron to about 150 micron. For example, in some embodiments, the first distance “d1” includes all ranges between and subranges therebetween, from about 0 micron to about 10 micron, about 10 micron to about 50 micron, about 10 micron to about 20 micron, about 20 micron to about 40 micron. Likewise, in some embodiments, the second distance “d2” includes all ranges and subranges therebetween, from about 0 micron to about 10 micron, from about 10 micron to about 150 micron, from about 10 micron to about 50 micron, about 50 micron to about 100 micron, about 100 micron to about 150 micron.

In some embodiments, based on the method of locating the first separation path 175a, a first new outer edge 500a may be located within the outer edge 125 of the carrier 120. For example, the outer edge 125 of the carrier 120 may be connected to the first new outer edge from contact with an external force and an object that may affect at least one of the substrate 110 and the carrier 120. 500a) can be isolated. For example, during handling, processing, and transport of the substrate 110 coupled to the carrier 120, at least one of the substrate 110 and the carrier 120 may be affected by external forces and contact with an object. . In some embodiments, if the substrate 110 is directly affected by external force and contact with the object, the substrate 110 is damaged (eg, cracked, chipped) by at least such external force and contact with the object. , Scratches, etc.). However, with the first new outer edge 500a of the substrate 110 positioned laterally within the outer edge 125 of the carrier 120, the carrier 120 is in contact with the external force and object. By contacting and isolating the first new outer edge 500a from such external force and direct contact with the object, damage to the substrate 110 can be at least prevented and reduced.

Thus, for example, a substrate 110 including certain functional elements (eg, a color filter, a touch sensor, or a thin film transistor (TFT) element) attached to the first major surface 111 of the substrate 110; For example, after separating the central portion 180 along the separation path 175, the substrate 110 may be separated from the carrier 120 and the display application or substrate 110 may find usefulness. It can be used in electronic devices for any other application. In addition, in some embodiments, the substrate 110 and the carrier 120 may form an end product (eg, a building panel or backsplash) together, and thus the substrate 110 and the carrier 120. May be employed together in one or more applications where utility may be found.

The embodiments and functional operations described herein may be implemented in digital electronic circuitry, or computer software, firmware, or hardware, including the structures disclosed herein and their structural equivalents, or a combination of one or more thereof. Embodiments described herein may be implemented as one or more modules of computer program instructions encoded on one or more computer program products, namely program carriers, executed by or for controlling the operation of the data processing apparatus. Such type of program carrier may be a computer readable medium. The computer readable medium may be a machine-readable storage device, a machine-readable storage substrate, a memory device, or a combination of one or more thereof.

The term “processor” or “controller” may include any device, apparatus, and machine for processing data, including, by way of example, a programmable processor, a computer, or multiple processors or computers. The processor may include, in addition to hardware, code that creates an execution environment for the computer program, such as processor firmware, a protocol stack, a database management system, an operating system, or a combination thereof.

Computer programs (also known as programs, software, software applications, scripts, or code) can be written in any form of programming language, including compiled or interpreted languages, or declarative or procedural languages, and are intended for use in computing environments. It can be arranged in any form, including suitable modules, elements, subroutines, or other units or standalone programs. A computer program does not necessarily correspond to a file in a file system. A program may be a portion of a file that holds another program or data (eg, one or more scripts stored in a markup language document), a single file dedicated to that program, or multiple coordinated files (eg, one or more modules, subprograms, or code). File to store a portion of the. The computer program may be arranged to run on one computer or on multiple computers located at one site or distributed across multiple sites and interconnected by a communication network.

The processes described herein may be performed by one or more programmable processors executing one or more computer programs to perform functions by manipulating input data to produce output. Processes and logic flows may also be performed by special purpose logic circuits, such as field programmable gate arrays (FPGAs) or application specific integrated circuits (ASICs), whereby the device may also be implemented.

Processors suitable for the execution of a computer program include, by way of example, general purpose microprocessors and special purpose microprocessors, and any one or more processors of any kind of digital computer. In general, a processor will receive instructions and data from read-only memory or random-access memory or both. Essential elements of a computer are a processor for performing instructions and one or more data memory devices for storing instructions and data. In general, a computer also includes one or more mass storage devices for storing data such as, for example, magnetic, magneto-optical disks, or optical disks, or for receiving data from or transmitting data to them. Or operatively combined for both. But a computer does not need such a device. In addition, the computer may be embedded in other devices, such as, for example, cell phones, personal digital assistants (PDAs).

Computer-readable media suitable for storing computer program instructions and data include, for example, nonvolatile memory, media and memory devices, including semiconductor memory devices such as EPROM, EEPROM, and flash memory devices; Magnetic disks such as internal hard disks or removable disks; Magneto-optical disks; And all forms of data memory including CD ROM and DVD-ROM discs. Such processors and memory may be supplemented or integrated into special purpose logic circuits.

In order to provide for interaction with a user, embodiments described herein can be used to provide a display device, such as a cathode ray tube (CRT) or LCD (liquid crystal display) monitor and keyboard and pointing device, such as a mouse or trackball, for displaying information to a user. Or may be implemented on a computer with a touch screen that allows a user to provide input to the computer. Other kinds of devices may be used to provide for interaction with a user. For example, input from a user may be received in some form, including acoustic, voice, or tactile input.

Embodiments described herein include a back end component such as, for example, a data server, a middleware component such as an application server, or a front end component, such as a user. Can be implemented in a computing system that includes a graphical user interface or web browser capable of interacting with the execution of a subject described herein, or any combination of one or more such back end components, middleware components, or front end components. have. The components of such a system may be interconnected by any form or medium of digital data communication, such as a communication network. Examples of communication networks include local area networks (“LANs”) and wide area networks (“WANs”), such as the Internet.

The computing system can include a client and a server. Clients and servers are generally remote from each other and typically interact via a communication network. The relationship between client and server occurs due to computer programs running on each computer and having a client-server relationship with each other.

Directional terms used herein (eg, up, down, right, left, front, back, top, bottom) are made only with reference to the drawings, and do not mean absolute directions.

As used herein, the term “that”, “one” or “one” means “at least one” and should not be limited to “only one” unless expressly indicated otherwise. Thus, for example, reference to "an element" includes embodiments having two or more such elements unless the context clearly indicates otherwise.

As used herein, the term "about" means that the quantity, size, formulation, parameters, and other quantities and characteristics are not accurate and need not be accurate, but tolerances, conversion factors, rounding, measurement errors, and the like are known to those skilled in the art. This means that they can be approximated and / or made larger or smaller as desired. When the term "about" is used to describe a value or endpoint in a range, it is to be understood that the present disclosure includes the specific value or endpoint mentioned. Regardless of whether "about" is referred to herein for an endpoint of a numerical value or range, the numerical value or endpoint of the range is modified by two embodiments, "about" and that is not modified by "about". It is intended to be included. It should be further understood that the endpoint of each range is important in relation to and independent of the other endpoints.

As used herein, the terms "substantially", "substantially", and variations thereof are intended to be noted that the described form is equal to or approximately equal to the value or description. For example, a "substantially planar" surface is intended to represent a planar or approximately planar surface. Also, as defined above, “substantially similar” is intended to indicate that the two values are equal or approximately identical. In some embodiments, “substantially similar” may represent a value within about 10% of each other, such as within about 5% of each other, or within about 2% of each other.

The above embodiments, and forms of these embodiments, are exemplary and can be provided in any combination with any one or more of these embodiments alone or in any other embodiment provided herein without departing from the scope of the present disclosure.

It will be apparent to those skilled in the art that various changes and modifications can be made to the present disclosure without departing from the spirit and scope of the disclosure. Accordingly, it is intended that the present disclosure cover the modifications and variations of this disclosure provided they come within the scope of the appended claims and their equivalents.

Claims (29)

A method of processing an apparatus comprising a substrate and a carrier,
The substrate comprises a first major surface, a second major surface, and a prescribed thickness between the first major surface of the substrate and the second major surface of the substrate;
The carrier comprises a first major surface, a second major surface, and a prescribed thickness between the first major surface of the carrier and the second major surface of the carrier;
The thickness of the substrate is less than the thickness of the carrier, the first portion of the second major surface of the substrate is coupled to the first major surface of the carrier, and the outer boundary of the first portion of the second major surface of the substrate is A second interface of the second major surface of the substrate and the first major surface of the carrier, the second portion of the second major surface of the substrate passing from the outer boundary past the outer edge of the carrier Extend away from the first part of the major surface,
The method is:
Defining a first path based on the profile of the outer boundary;
Defining a second path based on the profile of the outer edge of the carrier;
Positioning a separation path on the substrate located laterally between the first and second paths; And
Separating the substrate along the separation path. The method according to claim 1,
And a substrate having a thickness of about 50 microns to about 300 microns. The method according to claim 1 or 2,
Wherein the material of the substrate is selected from the group comprising glass, glass-ceramic, ceramic, and silicon. The method according to any one of claims 1 to 3,
Wherein the separating step comprises creating a defect on the first major surface of the substrate. The method according to claim 4,
Wherein the defect comprises a score line extending along a separation path. The method according to claim 4 or 5,
A first portion of the second major surface of the substrate is formed by the carrier to create a full-body crack that extends along a separation path from the first major surface of the substrate to the second major surface of the substrate. Enlarging the defect while being coupled to the first major surface of the substrate. The method according to claim 6,
Magnifying the defect includes applying a force to a peripheral portion of the substrate while the first portion of the second major surface of the substrate is coupled to the first major surface of the carrier. How to handle the device. The method according to claim 6,
The method according to any one of claims 1 to 7,
The outer edge of the carrier includes an edge surface that intersects the first major surface of the carrier and the second major surface of the carrier, the intersection of the edge surface of the carrier and the first major surface along an outer boundary and a common boundary axis. A method of processing an apparatus comprising a substrate and a carrier, which is extended. The method according to claim 8,
Wherein the edge surface of the carrier comprises a conical profile. The method according to any one of claims 1 to 9,
Defining a first path includes identifying a first plurality of points of an outer boundary. The method according to claim 10,
Aligning a first line to the first plurality of points, and then defining the first path as the first line. The method according to any one of claims 1 to 11,
Defining a second path includes identifying a second plurality of points of an outer edge of the carrier. The method according to claim 12,
And aligning a second line to the second plurality of points, and then defining the second path as the second line. The method according to any one of claims 1 to 13,
And wherein the separation path is linear. The method according to any one of claims 1 to 14,
Wherein at least one of the first path and the second path is non-linear. The method according to claim 15,
Wherein the first path is non-linear and the second path is non-linear. The method according to any one of claims 1 to 16,
The separating step provides the substrate with a new outer edge defined laterally between a first distance from an outer boundary in a direction away from an outer edge of the carrier and a second distance from an outer boundary in a direction towards the outer edge of the carrier. And a device comprising a substrate and a carrier. The method according to claim 17,
Wherein the first distance is from about 0 microns to about 50 microns. The method according to claim 17 or 18,
And the second distance is from about 0 microns to about 150 microns. A substrate comprising a first major surface, a second major surface, and a thickness defined between the first major surface and the second major surface; And
A carrier comprising a first major surface, a second major surface, and a thickness defined between the first major surface and the second major surface,
The thickness of the substrate is less than the thickness of the carrier, the second major surface of the substrate is coupled to the first major surface of the carrier, the outer edge of the substrate surrounds the outer edge of the carrier,
The substrate includes a separation path including a continuous boundary that laterally surrounds a central portion of the substrate,
The outer edge of the carrier laterally surrounds a continuous boundary of the separation path, the separation path comprising a plurality of cross separation paths including a first separation path, a second separation path, and a third separation path, A first separation path intersects the second separation path, the third separation path intersects the first separation path and the second separation path, and a first peripheral portion of the substrate has an outer edge of the substrate and the first separation path. A second peripheral portion of the substrate is defined between the separation path, and a second peripheral portion of the substrate is defined between the outer edge of the substrate and the second separation path, the edge portion of the substrate is the third separation path, the first peripheral portion of the substrate, and And defined between the second peripheral portion of the substrate. The method of claim 20,
And the substrate has a thickness of about 50 microns to about 300 microns. The method according to claim 20 or 21,
The material of the substrate is selected from the group comprising glass, glass-ceramic, ceramic, and silicon. A method of treating the apparatus of claim 20, wherein the method comprises:
Positioning each path of the plurality of cross separation paths on the substrate; And
Separating the substrate along each path of the plurality of cross separation paths. The method according to claim 23,
And wherein the separating step is performed while the second major surface of the substrate is joined to the first major surface of the carrier. The method according to claim 23 or 24,
Wherein each path of the plurality of cross separation paths is located on a substrate independently of other paths of the plurality of cross separation paths. The method according to any one of claims 23 to 25,
The separating step separates the first peripheral portion of the substrate from the central portion of the substrate along the first separation path, separates the second peripheral portion of the substrate from the central portion of the substrate along the second separation path, and removes the third separation path. Accordingly separating the corner portion of the substrate from the central portion of the substrate. The method according to any one of claims 23 to 26,
The first portion of the second major surface of the substrate is coupled to the first major surface of the carrier, and the outer boundary of the first portion of the second major surface of the substrate is the second major surface of the substrate and the first principal of the carrier. Defined in an interfacial coupling interface, the second portion of the second major surface of the substrate extends away from the outer boundary past the outer edge of the carrier to the first portion of the second major surface of the substrate,
The separating step is defined laterally between the first distance from the outer boundary in the direction surrounding the central portion and away from the outer edge of the carrier and the second distance from the outer boundary in the direction towards the outer edge of the carrier. Providing a new outer edge to the substrate. The method of claim 27,
The first distance is about 0 micron to about 50 micron. The method of claim 27 or 28,
And the second distance is about 0 microns to about 150 microns.

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