TW201913866A - Laser irradiation device capable of improving processing accuracy for substrate - Google Patents

Abstract

The present invention provides a laser irradiation device capable of improving processing accuracy for substrate. One embodiment of the laser irradiation device (1) includes: a laser irradiation unit (3) for irradiating laser beam onto a substrate (s); a base unit (4); and a transfer stage (5) for transferring the substrate (S). The transfer stage (5) comprises: a stage (10) capable of moving on the base unit (4); a base flange (11) fixed on the stage (10); a substrate stage (12) fixed on the upper end of the base flange (11) for carrying the substrate (s); and, a pushing pin (13) for supporting the substrate (s), which is penetrated through the substrate stage (12) and capable of moving up and down.

Description

 Laser irradiation device  

The present invention relates to a laser irradiation apparatus.

Patent Document 1 discloses a laser irradiation apparatus that raises and lowers a substrate by a push pin when a substrate is transferred between a robot and a substrate stage.

 [Previous Technical Literature]    [Patent Literature]  

Patent Document 1: Japanese Laid-Open Patent Publication No. 2006-5032.

The inventors have found various problems associated with a substrate transporting table used in a laser irradiation apparatus.

Other problems and novel features will become apparent from the description and appended claims.

In the laser irradiation apparatus of the embodiment, a substrate stage on which a substrate is loaded is fixed to an upper end portion of a flange of the base for irradiating the laser light, and a substrate support for pushing up and down is penetrated through the substrate stage. pin.

In a laser irradiation apparatus according to an embodiment, a substrate stage on which a substrate is loaded is fixed to an upper end portion of a base flange that rotates the substrate stage, and a motor is connected to a lower surface of the substrate stage in order to irradiate the laser light. The motor moves the push pin for supporting the substrate and the pusher blade for supporting the substrate up and down, and the push pin passes through the substrate stage, and the push blade is disposed around the substrate stage.

According to the above embodiment, the processing accuracy of the substrate can be improved.

1‧‧‧Laser illumination device

2‧‧‧ chamber

2a‧‧‧ Sidewall

2b‧‧‧Transportation port

2c‧‧ ‧ door

2d‧‧‧ top board

2e‧‧‧ openings

2f‧‧‧ bottom

3‧‧‧Laser illumination department

4‧‧‧Base section

5, 51, 61, 100‧‧‧ delivery desk

6‧‧‧Substrate transport mechanism

6a‧‧‧ fork

6b‧‧‧Mechanical arm

7‧‧‧Laser light source

8‧‧‧Mirror

9‧‧‧Projection lens

10 stages

11‧‧‧Base flange

12, 63‧‧‧ substrate table

12a‧‧‧through hole

12b, 63a‧‧‧ slot

13‧‧‧Pushing pin

13a‧‧‧First push pin

13b‧‧‧second push pin

13c, 62a‧‧‧ resin part (resin mat)

13d‧‧‧ base

13e‧‧‧Fitting Department

13f‧‧‧Mate

14, 62‧‧‧ Pushing blades

15, 101‧‧‧ drive unit

16‧‧‧X-axis orbit

17‧‧‧Y-axis orbit

18, 102‧‧‧ motor

19‧‧‧First Drive Transmission Department

20‧‧‧Second drive transmission

20a‧‧‧Drive transmission part for the first push pin

20b‧‧‧Drive transmission part for the second push pin

20c, 20e‧‧‧ support

20d, 20f, 21b, 28‧‧‧ racks

21‧‧‧ Third Drive Transmission Department

21a‧‧‧Pushing arm

22‧‧‧Linear motion drive unit

23‧‧‧Transfer arm

24‧‧‧Rotary axis

25‧‧‧ guidance mechanism in the Y-axis direction

26‧‧‧First fixed member

27, 34, 36, 38‧‧‧ Linked components

29‧‧‧Second fixed component

30‧‧‧First pinion

31‧‧‧Second pinion

32‧‧‧ Third pinion

33, 35, 37‧‧ ‧ guidance mechanism in the Z-axis direction

103‧‧‧ linkage mechanism

B‧‧‧Bolts

L1‧‧‧Laser light

R‧‧‧Processing Room

S‧‧‧Substrate

XII, XIII, XV, XVI, XVIII, XIX, XXI, XXII‧‧‧ section line

Fig. 1 is a side view schematically showing a laser irradiation apparatus according to a first embodiment.

Fig. 2 is a plan view schematically showing a laser irradiation apparatus according to a first embodiment.

Fig. 3 is a view for explaining the connection structure of the susceptor flange of the first embodiment.

Fig. 4 is a perspective view schematically showing a first drive transmission portion of the drive unit of the first embodiment.

Fig. 5 is a view schematically showing a second drive transmission portion of the drive unit of the first embodiment.

Fig. 6 is a view schematically showing a second drive transmission portion different from the drive unit of the first embodiment.

Fig. 7 is a view schematically showing a third drive transmission portion of the drive unit of the first embodiment.

Fig. 8 is a view schematically showing a transport stage of a laser irradiation apparatus of a comparative example.

Fig. 9 is a cross-sectional view schematically showing an end portion of the push pin of the first embodiment.

Fig. 10 is a plan view schematically showing a transfer table in the second embodiment.

FIG. 11 is a plan view schematically showing a mode in which the substrate is irradiated with laser light while the substrate stage is moved in the X-axis direction in the longitudinal direction of the substrate stage according to the first embodiment.

Figure 12 is a cross-sectional view taken along the line XII-XII of Figure 11.

Figure 13 is a cross-sectional view taken along the line XIII-XIII of Figure 11.

FIG. 14 is a plan view schematically showing a mode in which the substrate is irradiated with laser light while the substrate stage is moved in the X-axis direction in the short-side direction of the substrate stage of the first embodiment.

Figure 15 is a cross-sectional view taken along the line XV-XV of Figure 14.

Figure 16 is a cross-sectional view taken along line XVI-XVI of Figure 14.

FIG. 17 is a plan view schematically showing a pattern in which the substrate is irradiated with the laser light while the substrate stage is moved in the X-axis direction in the X-axis direction in the longitudinal direction of the substrate stage of the second embodiment.

Figure 18 is a cross-sectional view taken along line XVIII-XVIII of Figure 17.

Figure 19 is a cross-sectional view taken along the line XIX-XIX of Figure 17.

FIG. 20 is a plan view schematically showing a mode in which the substrate is irradiated with laser light while the substrate stage is moved in the X-axis direction in the short-side direction of the substrate stage of the second embodiment.

Figure 21 is a cross-sectional view taken along line XXI-XXI of Figure 20.

Figure 22 is a cross-sectional view taken along line XXII-XXII of Figure 20.

Fig. 23 is a plan view schematically showing a transport table according to a third embodiment.

Fig. 24 is a side view schematically showing a state in which the pusher blade has been raised in the transport table of the third embodiment.

Hereinafter, specific embodiments will be described with reference to the drawings. However, it is not limited to the following embodiments. Further, in order to clarify the description, the following description and drawings are simplified in a simplified manner.

<Embodiment 1>

First, the overall configuration of the laser irradiation apparatus of the present embodiment will be described. Fig. 1 is a side view schematically showing a laser irradiation apparatus of the present embodiment. Fig. 2 is a plan view schematically showing a laser irradiation apparatus of the embodiment. In addition, in FIGS. 1 and 2, the laser irradiation device is simplified. Here, in the following description, in order to clarify the description, an XYZ orthogonal coordinate system will be described. At this time, the Z-axis direction is the vertical direction, and the XY plane is the horizontal plane.

The laser irradiation apparatus 1 is preferably an excimer laser annealing apparatus that irradiates laser light that has been formed on the substrate S to the amorphous semiconductor to be multi-crystallized. Alternatively, the laser irradiation apparatus 1 may be applied to a laser stripping apparatus that irradiates the peeling layer formed on the substrate S with laser light to peel off the peeling layer. Here, the substrate S is made of, for example, a glass substrate.

Specifically, as shown in FIGS. 1 and 2 , the laser irradiation apparatus 1 includes a chamber 2, a laser irradiation unit 3, a base unit 4, and a transport table 5, and the substrate transport mechanism 6 The substrate S is transferred. The inside of the chamber 2 serves as a processing chamber R that irradiates the substrate S received from the substrate transport mechanism 6 with laser light to process the substrate S. Further, the processing chamber R is an inert gas atmosphere such as nitrogen.

The side wall 2a of the X-axis + side of the chamber 2 is provided with a transport port 2b for carrying the substrate S into the processing chamber R by the substrate transport mechanism 6 for using the processed substrate S The substrate transport mechanism 6 is carried out from the processing chamber R. The transport port 2b is openable and closable by a shutter 2c.

Here, the substrate transport mechanism 6 is disposed on the X-axis + side with respect to the laser irradiation device 1, and includes a robot arm 6b provided with a fork 6a at the distal end portion. In the substrate transport mechanism 6 as described above, the substrate S placed on the surface on the Z-axis + side of the fork 6a is carried into the processing chamber R from the transport port 2b of the chamber 2 or is carried out from the processing chamber R.

The laser irradiation unit 3 is an optical system for irradiating the substrate S with the laser light L1 to process the substrate S. The laser irradiation unit 3 is disposed on the Z-axis + side of the chamber 2 as shown in Fig. 1 . The laser irradiation unit 3 as described above includes a laser light source 7, a mirror surface 8, and a projection lens 9.

The laser light L1 that has been emitted from the laser light source 7 is incident on the projection lens 9 via the mirror surface 8. Further, the laser light L1 that has been emitted from the projection lens 9 is incident on the processing chamber R via the opening 2e formed in the top plate 2d of the chamber 2. At this time, the laser beam L1 is irradiated to the irradiation region set in advance in the processing chamber R as a line beam having the Y-axis direction as the long-side direction.

The base portion 4 is fixed to a fixed disk of the bottom surface 2f of the chamber 2. The transport table 5 transports the substrate S in such a manner that the laser beam L1 is irradiated to a desired region of the substrate S in the processing chamber R. As shown in FIG. 1, the transport table 5 includes a stage 10, a base flange 11, a substrate stage 12, a push pin 13, a push blade 14, and a drive unit 15.

The stage 10 is movable on the Z-axis + side with respect to the base portion 4. The stage 10 is, for example, an XY stage, and moves slightly horizontally along the X-axis rail 16 extending in the X direction and the Y-axis rail 17 extending in the Y-axis direction as shown in Fig. 2 . The base flange 11 is fixed to the surface of the table 10 on the Z-axis + side. The base flange 11 is, for example, a rotation driving device that rotates around a rotating shaft extending in the Z-axis direction.

The substrate S is carried on the substrate stage 12 . The substrate 12 is, for example, an adsorption stage, and has a rectangular shape when viewed in the Z-axis direction. The substrate stage 12 as described above is fixed to the end portion of the susceptor flange 11 on the Z-axis + side so that the center of the substrate stage 12 is disposed substantially on the rotation axis of the susceptor flange 11.

Fig. 3 is a view for explaining the connection structure of the susceptor flange of the embodiment. As shown in FIG. 3, the substrate stage 12 may be connected to the end of the base flange 11 on the Z-axis + side by a bolt B. That is, the drive unit 15 for driving the push pin 13 or the push blade 14 is not disposed between the base flange 11 and the substrate stage 12, and the substrate stage 12 is fixed to the base flange 11.

Incidentally, when the Z-axis-side end portion of the base flange 11 is also coupled to the stage 10 by the bolt B, the table 10 and the base flange 11 and the substrate stage 12 can be easily coupled. However, the means for connecting the table 10 to the base flange 11 and the means for connecting the base flange 11 to the substrate stage 12 are not limited to the bolts, as long as they can be between the table 10 and the base flange 11 and at the base. The edge 11 and the substrate stage 12 may be connected to each other without being interposed in a state in which the height of the drive unit 15 or the like in the Z-axis direction is interposed.

When the push pin 13 and the push blade 14 receive the substrate S between the substrate transport mechanism 6 and the substrate stage 12, the substrate S is moved up and down. Specifically, as shown in FIG. 1 , the push pin 13 and the push blade 14 are used to receive the substrate between the substrate stage 12 and the substrate S when the substrate S is received between the substrate transfer mechanism 6 and the substrate stage 12 . The desired interval of the fork 6a of the transport mechanism 6 causes the substrate S to rise in the Z-axis + direction. Further, the push pin 13 and the push blade 14 are configured such that the substrate S received from the substrate transport mechanism 6 is carried on the Z-axis + side surface of the substrate stage 12, and the substrate S is lowered in the Z-axis direction.

The push pin 13 is a rod-shaped member that extends in the Z-axis direction. The push pin 13 passes through the substrate stage 12, and the drive unit 15 can be moved up and down in the Z-axis direction. Specifically, the push pin 13 is a through hole 12a that penetrates the substrate stage 12 in the Z-axis direction. Then, the Z-axis-side end of the push pin 13 is coupled to the drive unit 15.

In the present embodiment, as shown in FIG. 2, the first push pin 13a and the second push pin 13b are provided as the push pin 13. The first push pin 13a is disposed along the periphery of the substrate stage 12. For example, when the long side of the substrate stage 12 is disposed in the X-axis direction, as shown in FIG. 2, the first push pins 13a are disposed along the long sides of the substrate stage 12 that face each other in the Y-axis direction. . However, the arrangement and the number of the first push pins 13a may be any arrangement and number that can stably raise and lower the substrate S.

As shown in FIG. 2, the second push pin 13b is disposed substantially at the center of the substrate stage 12. That is, the second push pin 13b is disposed substantially on the rotation shaft of the base flange 11.

As shown in Figs. 1 and 2, the pusher blade 14 is attached to the arm member extending in the horizontal direction and disposed on the periphery of the substrate stage 12. Then, the pusher blade 14 is lifted and lowered in the Z-axis direction by the drive unit 15 in conjunction with the push pin 13.

Specifically, as shown in FIG. 2, one end of the push blade 14 is viewed from the Z-axis direction inside the plane region of the substrate stage 12, and can be accommodated in the groove portion 12b, which is a substrate. The surface of the Z-axis + side of the stage 12 and the side surface continuous with the surface of the Z-axis + side are formed so as to cut out a notch. On the other hand, the other end portion of the push blade 14 is connected to the drive unit 15 as viewed from the Z-axis direction on the outer side of the planar region disposed on the substrate stage 12.

For example, when the long side of the substrate stage 12 is arranged in the X-axis direction, as shown in FIG. 2, the pusher blades 14 are arranged three along each of the short sides facing the X-axis direction on the substrate stage 12. Then, as viewed in the Z-axis direction, the pusher blade 14 is disposed in the X-axis direction so as to be approximately orthogonal to the short side of the substrate stage 12. However, the arrangement and the number of the push blades 14 may be any arrangement and number that can stably raise and lower the substrate S.

The drive unit 15 raises and lowers the push pin 13 and the push blade 14. Here, FIG. 4 is a perspective view schematically showing a first drive transmission portion of the drive unit of the embodiment. Fig. 5 is a view schematically showing a second drive transmission portion of the drive unit of the embodiment. Fig. 6 is a view schematically showing a second drive transmission portion different from the drive unit of the embodiment. Fig. 7 is a view schematically showing a third drive transmission portion of the drive unit of the embodiment.

As shown in FIGS. 4 to 7 , the drive unit 15 includes a motor 18 , a first drive transmission unit 19 , a second drive transmission unit 20 , and a third drive transmission unit 21 . The motor 18 is disposed on the side of the base flange 11 and is fixed to the Z-axis side of the substrate stage 12. The first drive transmission unit 19 includes a linear motion drive unit 22, a transmission arm 23, and a rotary shaft 24.

The linear motion drive unit 22 converts the rotational drive of the motor 18 into a linear motion drive. For example, when the long side of the substrate stage 12 is disposed in the X-axis direction, the linear motion driving unit 22 is provided with a ball screw having a screw shaft extending in the Y-axis direction and a nut that is engaged with the screw shaft ( Nut) The rotation shaft of the motor 18 is coupled to the screw shaft. The linear motion drive unit 22 as described above is disposed on the side of the base flange 11 and is fixed to the Z-axis side of the substrate stage 12.

The transmission arm 23 is disposed substantially horizontally on the side of the base flange 11. For example, when the long side of the substrate stage 12 is disposed in the X-axis direction, the transfer arm 23 is disposed along the short side of the X-axis side of the substrate stage 12, and is guided by a guide mechanism (for example, a linear guide) in the Y-axis direction. The linear guide 25 is fixed to the Z-axis-side surface of the substrate stage 12 by the first fixing member 26.

The transmission arm 23 is coupled to the nut of the linear drive unit 22 via the coupling member 27 . Thereby, when the linear motion drive unit 22 is driven, the transfer arm 23 moves substantially horizontally, for example, in the Y-axis direction. A rack 28 extending in the longitudinal direction of the transmission arm 23 is provided at both end portions of the transmission arm 23 as described above.

The rotating shaft 24 is disposed substantially horizontally on the side of the base flange 11. For example, when the long side of the substrate stage 12 is disposed in the X-axis direction, the two rotating shafts 24 are arranged substantially in parallel along the long sides facing the Y-axis direction of the substrate stage 12, respectively. Further, the rotating shaft 24 is fixed to the Z-axis-side surface of the substrate stage 12 by the first fixing member 26 and the second fixing member 29 which are common to the transmission arm 23.

As shown in FIG. 4, a first pinion 30, a second pinion 31, and a third pinion 32 are provided on such a rotating shaft 24. The first pinion gear 30 meshes with the rack 28 of the transmission arm 23, and transmits the driving force from the transmission arm 23 to the rotating shaft 24.

At this time, as shown in FIG. 4, the first pinion 30 of one of the rotating shafts 24 is coupled to the rack 28 of one of the transmission arms 23 from the Z-axis + side, and the first of the other rotating shafts 24 is small. The gear 30 is coupled to the other side of the rack arm 23 from the Z-axis side. Thereby, each of the rotating shafts 24 rotates in the same direction with an equal number of rotations as the transmission arm 23 moves.

The second pinion gear 31 transmits the driving force from the rotating shaft 24 to the push pin 13 via the second drive transmission portion 20 . In the second embodiment, the second drive transmission unit 20 includes a drive transmission unit 20a that transmits the driving force from the rotary shaft 24 to the first push pin 13a and the drive transmission unit 20b to drive from the rotary shaft 24. The force is transmitted to the second push pin 13b.

As shown in Fig. 5, the drive transmission portion 20a of the first push pin 13a includes a support portion 20c and a rack 20d. The support portion 20c is disposed on the side of the base flange 11, and is fixed to the Z-axis-side surface of the substrate stage 12 via a guide mechanism 33 in the Z-axis direction.

For example, the support portion 20c is an arm member, and one end portion of the first push pin 13a is connected to the Z-axis side end via the connection member 34, and the other end portion is provided with the rack 20d. The tooth surface of the rack 20d is disposed outward of the laser irradiation device 1. Further, the rack 20d extends in the Z-axis direction and meshes with the second pinion 31 of the rotating shaft 24. Thereby, the first push pin 13a moves up and down in the Z-axis direction in accordance with the rotation of the rotary shaft 24.

As shown in FIG. 6, the drive transmission part 20b of the 2nd push pin 13b is equipped with the support part 20e and the rack 20f. The support portion 20e passes through a through hole formed in the base flange 11. The through hole of the base flange 11 is formed to allow the support portion 20e to move up and down in the Z-axis direction. The support portion 20e is fixed to the Z-axis-side surface of the substrate stage 12 via the guide mechanism 35 in the Z-axis direction.

For example, when the long side of the substrate stage 12 is disposed in the X-axis direction, the support portion 20e is an arm member extending in the Y-axis direction, and the Z-axis side of the second push pin 13b is coupled to the center via the connection member 36. The end portion is provided with a rack 20f at both ends. The tooth surface of the rack 20f is disposed outward of the laser irradiation device 1. Further, the rack 20f extends in the Z-axis direction and engages with the second pinion 31 of the rotating shaft 24. Thereby, the second push pin 13b moves up and down in the Z-axis direction in accordance with the rotation of the rotary shaft 24.

The third pinion gear 32 transmits the driving force from the rotating shaft 24 to the pushing blade 14 via the third driving transmission portion 21 . As shown in FIG. 7, the third transmission unit 21 includes a pusher arm 21a and a rack 21b. The push arm 21a is disposed substantially parallel to the transfer arm 23 outside the plane region of the substrate stage 12 as viewed in the Z-axis direction. Further, the push arm 21a is disposed substantially horizontally.

For example, when the long side of the substrate stage 12 is disposed in the X-axis direction, the two push arms 21a are arranged substantially in parallel along the short sides facing the X-axis direction of the substrate stage 12, respectively. Further, each of the push arms 21a is fixed to the Z-axis-side surface of the substrate stage 12 via a guide mechanism 37 in the Z-axis direction.

The other end portion of the push blade 14 is coupled to the push arm 21a via the connecting member 38. The connecting member 38 is disposed outside the plane region of the substrate stage 12 as viewed in the Z-axis direction. Further, the connecting member 38 supports the end portion of the push blade 14 on the Z-axis + side so as to have substantially the same height as the end portion of the push pin 13 on the Z-axis + side.

A rack 21b is provided at both end portions of the push arm 21a. The tooth surface of the rack 21b is disposed outward of the laser irradiation device 1. Further, the rack 21b extends in the Z-axis direction and engages with the third pinion 32 of the rotary shaft 24. Thereby, the push blade 14 moves up and down in the Z-axis direction in accordance with the rotation of the rotary shaft 24.

Next, a flow of processing the substrate S using the laser irradiation device 1 of the present embodiment will be described. First, the shutter 2c of the chamber 2 is operated to open the transport port 2b, and the substrate S carried by the fork 6a of the substrate transport mechanism 6 is carried into the processing chamber R from the transport port 2b. At this time, the push pin 13 and the push blade 14 are in a state of being raised in the Z-axis + direction.

Next, the substrate S is placed on the Z-axis + side end of the push pin 13 and the push blade 14 by the substrate transfer mechanism 6. Then, the fork 6a of the substrate transport mechanism 6 is pulled out from the interval between the substrate S and the substrate stage 12, and the substrate transport mechanism 6 is retracted from the processing chamber R. Thereafter, the shutter 2c of the chamber 2 is operated to close the transport port 2b, and the processing chamber R becomes a sealed space.

Next, the motor 18 is rotationally driven to move the transmission arm 23 substantially horizontally. Thereby, the rotation shaft 24 is rotated to one side, the push pin 13 is lowered in the Z-axis direction via the second drive transmission portion 20, and the push blade 14 is lowered in the Z-axis direction via the third drive transmission portion 21, and the substrate S is The surface is placed on the Z-axis + side of the substrate stage 12. The substrate stage 12 adsorbs the substrate S.

At this time, the push pin 13 is housed in the through hole 12 a of the substrate stage 12 such that the end portion of the push pin 13 on the Z-axis + side does not protrude from the surface on the Z-axis + side of the substrate stage 12 . Further, the push blade 14 is housed in the groove portion 12b of the substrate stage 12 so that one end of the push blade 14 does not protrude from the surface on the Z-axis + side of the substrate stage 12.

Next, the stage 10 and the susceptor flange 11 are controlled, and the laser beam L1 emitted from the laser illuminating unit 3 is irradiated to a desired region of the substrate S to process the substrate S. At this time, a line beam in which the Y-axis direction is the long-side direction is irradiated on the substrate S.

Here, the motor 18 is fixed to the Z-axis side of the substrate stage 12, and the transmission arm 23 or the rotating shaft 24 is disposed on the side of the base flange 11, so that the Z axis of the substrate stage 12 is not hindered. Rotate.

Next, when the processing of the substrate S is completed, the motor 18 is rotationally driven to move the transfer arm 23 substantially horizontally to the other side. Thereby, the rotation shaft 24 rotates to the other side, the push pin 13 rises in the Z-axis + direction via the second drive transmission portion 20, and the push blade 14 rises in the Z-axis + direction via the third drive transmission portion 21. As a result, the substrate S rises in the Z-axis + direction, and a space between the substrate S and the substrate stage 12 into which the fork 6a of the substrate transport mechanism 6 can be inserted is formed.

Next, the shutter 2c of the chamber 2 is operated to open the transport port 2b, and the substrate S is placed on the fork 6a of the substrate transport mechanism 6, and the substrate transport mechanism 6 is retracted from the processing chamber R. After that, when the substrate transport mechanism 6 accommodates, for example, the substrate S in a cassette or the like, the processing of the substrate S is completed.

Next, the transport stage 5 of the laser irradiation apparatus 1 of the present embodiment is compared with the transport stage of the laser irradiation apparatus of the comparative example. Fig. 8 is a perspective view schematically showing a transport stage of a laser irradiation apparatus of a comparative example. In addition, the same members as those of the laser irradiation device of the present embodiment are denoted by the same reference numerals.

As shown in FIG. 8, the transport stage 100 of the laser irradiation apparatus of a comparative example is equipped with the drive unit 101 for raising and lowering the push-pin 13 between the base flange 11 and the substrate stage 12. The drive unit 101 is driven by linear motion of the motor 102 by, for example, a link mechanism 103 to convert linear motion in the Z-axis direction.

In the transport table 100 of the laser irradiation apparatus of the comparative example, the drive unit 101 is disposed between the base flange 11 and the substrate stage 12, and the stage 10 or the base flange 11 is formed on the substrate stage 12. The action is low. Therefore, there is a concern that the processing accuracy of the substrate S is lowered.

On the other hand, in the transfer table 5 of the laser irradiation apparatus 1 of the present embodiment, the drive unit 15 is not disposed between the susceptor flange 11 and the substrate stage 12, and the transport of the laser irradiation apparatus of the comparative example is compared. The center of gravity of the substrate stage 12 is lowered. Thereby, the followability of the substrate stage 12 and the stage 10 or the base flange 11 is improved, and the accuracy of the posture or the moving speed in the process processing is improved, and highly precise flow processing is possible. Therefore, the laser irradiation device 1 of the present embodiment can improve the processing accuracy of the substrate S as compared with the laser irradiation device of the comparative example.

Further, since the transport stage 5 of the laser irradiation apparatus 1 of the present embodiment supports the peripheral portion of the substrate S by the pusher blade 14, the substrate is supported only by the push pin 13 like the transport table 100 of the laser irradiation apparatus of the comparative example. Compared with the state of S, it is possible to suppress the bending of the substrate S while supporting the substrate S.

Here, it is preferable that the push pin 13 or the end portion of the push blade 14 on the Z-axis + side is provided with a resin portion. That is, it is preferable that the portion of the push pin 13 or the push blade 14 that is in contact with the substrate S is a resin portion. The resin portion is preferably formed of, for example, polyetheretherketone (PEEK) resin (PEEK resin). Thereby, damage of the substrate S can be suppressed when the substrate S comes into contact with the push pin 13 or the push blade 14.

At this time, as shown in FIG. 9, the push pin 13 includes a resin portion 13c on the Z-axis + side and a base portion 13d to which the Z-axis side end portion of the resin portion 13c is coupled, and the resin portion 13c is preferably opposed to the base portion 13d. The structure that can be loaded and unloaded. For example, a fitting portion 13e is formed in the fitted portion 13e, and the fitted portion 13e is formed on the Z-axis side end portion of the resin portion 13c, and the fitting portion 13f is formed in the base portion 13d. The end of the shaft + side. Thereby, only the resin portion 13c can be simply replaced when the resin portion 13c is worn out. Further, it is preferable that the resin portion of the pusher blade 14 is also replaceable.

<Embodiment 2>

The transport stage of the laser irradiation apparatus of the present embodiment has a configuration similar to that of the transport stage 5 of the laser irradiation apparatus 1 of the first embodiment, but the arrangement of the push blades 14 is different. In addition, since the transport stage of the laser irradiation apparatus of the present embodiment is configured in substantially the same manner as the transport stage 5 of the laser irradiation apparatus 1 of the first embodiment, the overlapping description will be omitted, and the same components will be denoted by the same reference numerals. Description.

Fig. 10 is a plan view schematically showing a transport table of the embodiment. As shown in FIG. 10, in the transport table 51 of the present embodiment, the pusher blades 14 are arranged to intersect at an angle of approximately 45 degrees with respect to the short side of the substrate stage 12 as viewed in the Z-axis direction.

The effect of arranging the pusher blades 14 in this manner is compared with the arrangement of the pusher blades 14 of the first embodiment. First, a case where the substrate S is irradiated with laser light by using the transport table 5 of the first embodiment will be discussed.

FIG. 11 is a plan view schematically showing a mode in which the substrate is irradiated with laser light while the substrate stage is moved in the X-axis direction in the X-axis direction in the longitudinal direction of the substrate stage of the first embodiment. Figure 12 is a cross-sectional view taken along the line XII-XII of Figure 11. Figure 13 is a cross-sectional view taken along the line XIII-XIII of Figure 11. FIG. 14 is a plan view schematically showing a mode in which the substrate is irradiated with laser light while the substrate stage is moved in the X-axis direction in the short-side direction of the substrate stage of the first embodiment. Figure 15 is a cross-sectional view taken along the line XV-XV of Figure 14. Figure 16 is a cross-sectional view taken along line XVI-XVI of Figure 14.

As shown in FIG. 11, the substrate S is placed on the Z-axis + side surface of the substrate stage 12, and the long-side direction of the substrate stage 12 is disposed in the X-axis direction, and the long-side direction of the substrate S is disposed in the X direction. In the axial direction, while the substrate stage 12 is moved in the X-axis direction, the substrate S is irradiated with a line beam in which the Y-axis direction is the long-side direction.

At this time, as shown in FIG. 12, in the region where the groove portion 12b of the substrate stage 12 is formed, it is affected by the groove portion 12b when the substrate S is processed. Further, as shown in FIG. 13, the region of the through hole 12a in which the substrate stage 12 is formed is also affected by the through hole 12a when the substrate S is processed. In addition, the portion of the mesh line in FIGS. 12 and 13 is an area that is affected when the substrate S is processed.

On the other hand, as shown in FIG. 14, the substrate S is placed on the surface on the Z-axis + side of the substrate stage 12, and the short-side direction of the substrate stage 12 is disposed in the X-axis direction, and the short-side direction of the substrate S is The substrate S is irradiated with the line beam having the Y-axis direction as the long-side direction while the substrate stage 12 is moved in the X-axis direction.

At this time, as shown in FIG. 15, the region in which the through hole 12a or the groove portion 12b is not formed is not affected by the processing of the substrate S. However, as shown in FIG. 16, the through hole 12a is formed in the substrate stage 12. Or the area of the groove portion 12b is affected by the through hole 12a or the groove portion 12b when the substrate S is processed. In addition, the portion of the network line in Fig. 16 is an area that is affected when the substrate S is processed.

Here, when the longitudinal direction of the substrate stage 12 is arranged in the X-axis direction, the substrate stage 12 is moved in the X-axis direction, and the longitudinal direction of the substrate stage 12 is arranged in the Y-axis direction. When the substrate stage 12 is moved in the X-axis direction, the influence of the through hole 12a is the same when the substrate S is processed.

On the other hand, when the longitudinal direction of the substrate stage 12 is arranged in the X-axis direction and the substrate stage 12 is moved in the X-axis direction, the groove portion 12b has a short length in the Y-axis direction, and when the substrate S is processed, Less impact. On the other hand, when the longitudinal direction of the substrate stage 12 is arranged in the Y-axis direction and the substrate stage 12 is moved in the X-axis direction, the groove portion 12b has a long length in the Y-axis direction, and when the substrate S is processed, Great impact. Therefore, the influence of the groove portion 12b at the time of processing the substrate S varies with the arrangement of the substrate stage 12.

Next, a case where the substrate S is irradiated with the laser light using the transport table 51 of the present embodiment will be discussed.

FIG. 17 is a plan view schematically showing a pattern in which the substrate is irradiated with laser light while the substrate stage is moved in the X-axis direction in the longitudinal direction of the substrate stage of the embodiment. Figure 18 is a cross-sectional view taken along line XVIII-XVIII of Figure 17. Figure 19 is a cross-sectional view taken along the line XIX-XIX of Figure 17. FIG. 20 is a plan view schematically showing a mode in which the substrate is irradiated with laser light while the substrate stage is moved in the X-axis direction in the short-side direction of the substrate stage of the embodiment. Figure 21 is a cross-sectional view taken along line XXI-XXI of Figure 20. Figure 22 is a cross-sectional view taken along line XXII-XXII of Figure 20.

As shown in FIG. 17, the substrate S is placed on the Z-axis + side surface of the substrate stage 12, and the long-side direction of the substrate stage 12 is disposed in the X-axis direction, and the long-side direction of the substrate S is disposed in the X direction. In the axial direction, while the substrate stage 12 is moved in the X-axis direction, the substrate S is irradiated with a line beam in which the Y-axis direction is the long-side direction.

At this time, as shown in FIG. 18, in the region where the groove portion 12b of the substrate stage 12 is formed, it is affected by the groove portion 12b when the substrate S is processed. Further, as shown in FIG. 19, the region of the through hole 12a in which the substrate stage 12 is formed is also affected by the through hole 12a when the substrate S is processed. In addition, the mesh portion in FIGS. 18 and 19 is an area that is affected when the substrate S is processed.

On the other hand, as shown in FIG. 20, the substrate S is placed on the Z-axis + side surface of the substrate stage 12, and the short-side direction of the substrate stage 12 is disposed in the X-axis direction, and the short-side direction of the substrate S is The substrate S is irradiated with the line beam having the Y-axis direction as the long-side direction while the substrate stage 12 is moved in the X-axis direction.

At this time, as shown in FIG. 21, in the region where the through hole 12a or the groove portion 12b is not formed, although the substrate S is not affected, the through hole 12a is formed in the substrate stage 12 as shown in FIG. Or the area of the groove portion 12b is affected by the through hole 12a or the groove portion 12b when the substrate S is processed. In addition, the screen portion in FIG. 22 is an area that is affected when the substrate S is processed.

Here, when the longitudinal direction of the substrate stage 12 is arranged in the X-axis direction, the substrate stage 12 is moved in the X-axis direction, and the longitudinal direction of the substrate stage 12 is arranged in the Y-axis direction. When the substrate stage 12 is moved in the X-axis direction, the influence of the through hole 12a is the same when the substrate S is processed.

On the other hand, the groove portion 12b is disposed so as to intersect at an angle of approximately 45° with respect to the short side of the X-axis + side of the substrate stage 12. Therefore, when the substrate stage 12 is placed in the X-axis direction in the longitudinal direction of the substrate stage 12, the substrate stage 12 is moved in the X-axis direction, and the long side direction of the substrate stage 12 is placed in the Y-axis direction. When the substrate stage 12 is moved in the X-axis direction, the length of the groove portion 12b in the Y-axis direction (specifically, the cross-sectional shape on the YZ surface) is approximately the same.

Therefore, when the substrate S is irradiated with the laser light by using the transport table 51 of the present embodiment, the substrate S is irradiated with the laser light by the transport table 5 of the first embodiment, and the longitudinal direction of the substrate stage 12 is disposed. Which of the X-axis direction and the Y-axis direction can roughly equalize the influence of the groove portion 12b when the substrate S is processed.

Further, the groove portion 12b of the present embodiment is disposed so as to intersect at an angle of approximately 45° with respect to the short side of the substrate stage 12 as viewed in the Z-axis direction, and the long side of the substrate stage 12 is changed with respect to the first embodiment. The groove portion 12b when the direction is disposed in the Y-axis direction is short in the Y-axis direction, and the influence of the groove portion 12b when the substrate S is processed can be minimized.

However, the groove portion 12b of the present embodiment is disposed so as to intersect at an angle of approximately 45° with respect to the short side of the substrate stage 12 as viewed in the Z-axis direction, as long as the long side direction of the substrate stage 12 is disposed in the X direction. Which of the axial direction and the Y-axis direction can roughly equalize the influence of the groove portion 12b when the substrate S is processed, for example, at an angle of 40 to 50 with respect to the side of the substrate stage 12 Configuration is also possible.

<Embodiment 3>

Fig. 23 is a plan view schematically showing the transport table of the embodiment. Fig. 24 is a side view schematically showing a state in which the pusher blade has been raised in the transport table of the embodiment.

As shown in FIG. 23 and FIG. 24, in the transport table 61 of the present embodiment, the pusher blade 62 is placed on the connecting member 38 facing the substrate stage 63, and can be accommodated in the groove portion 63a formed in the substrate stage 63. . At this time, the push pin 13 and the like of the first embodiment may be omitted.

The pusher blade 62 can support the substrate S in a wide range as compared with the case where the push pin 13 and the push blade 14 of the first embodiment support the substrate S, and the substrate S can be stabilized and moved up and down.

At this time, as shown in FIGS. 23 and 24, it is preferable to attach and detach the resin portion (resin pad) 62a to the end portion of the Z-axis + of the push blade 62. Thereby, damage to the substrate S can be suppressed when the substrate S is supported by the push blade 62.

In the case where the substrate S is irradiated with laser light, the region overlapping the space on the substrate S by the space (groove portion or through hole) formed on the Z-axis side with respect to the substrate S and the like The treatment in the region and different from the heating state of the substrate S produces mura. Further, if the planar area of the groove portion or the through hole becomes large, the unevenness will appear more prominently on the substrate S.

Therefore, comparing FIG. 2 and FIG. 10 with FIG. 23, the groove portion 12b of the first and second embodiments is narrower in plane area with respect to the groove portion 63a of the third embodiment, and the laser irradiation device of the third embodiment In contrast, when the substrate S is overtreated by the laser irradiation apparatuses of the first and second embodiments, unevenness occurring in the substrate S can be suppressed.

The embodiments of the invention made by the inventors of the present invention have been specifically described above, but the present invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit and scope of the invention.

For example, in the above-described embodiment, the push pin or the pusher blade is lifted and lowered using a rack or pinion or the like, but the push pin or the push blade may be raised and lowered using a linear actuator or the like.

Claims (13)

 A laser irradiation device comprising: a laser irradiation unit for irradiating a substrate with laser light; a base portion; and a transfer table for transporting the substrate; the transport stage having a table at the base portion Moving upward; a base flange fixed to the table; a substrate stage fixed to an upper end portion of the base flange for accommodating the substrate; and a push pin for supporting the substrate, extending through the substrate table mobile.    The laser irradiation device according to claim 1, wherein an upper end portion of the base flange and the substrate stage are coupled by a bolt.    The laser irradiation apparatus according to claim 1, wherein the transporting station has a push arm that is disposed outside the substrate stage and movable up and down, and a plurality of pusher blades for supporting the substrate, and is coupled to the push arm. It is disposed on the periphery of the substrate stage.    The laser irradiation apparatus according to claim 3, wherein a groove portion corresponding to each of the plurality of pusher blades is formed on an upper surface of the substrate stage.    The laser irradiation device according to claim 3, wherein the planar shape of the substrate is a quadrangular shape; the pusher blade is disposed to intersect the first side or the second side of the substrate, and the second side and the first One side facing each other.    The laser irradiation device according to claim 5, wherein the pusher blade is disposed to be orthogonal to the first side or the second side.    The laser irradiation device according to claim 5, wherein the pusher blade is disposed at an angle of 40 to 50 with respect to the first side or the second side.    The laser irradiation device according to claim 1, wherein the push pin has a base portion, and a resin portion that is disposed on a distal end side of the push pin with respect to the base portion, and the resin portion is detachable from the base portion.    The laser irradiation apparatus according to claim 1, wherein the transport stage has a motor connected to a lower surface of the substrate stage, and the push pin is vertically movable by a driving force of the motor.    The laser irradiation device according to claim 1, wherein an amorphous semiconductor is formed on the substrate, and a polycrystalline semiconductor is formed by the laser irradiation of the substrate by the laser irradiation unit.    The laser irradiation apparatus of claim 1, wherein the stage is an XY stage.    The laser irradiation device according to claim 1, wherein the susceptor flange is a rotation driving device for rotating the substrate stage with a rotating shaft extending in the vertical direction as a center.    A laser irradiation device comprising: a laser irradiation unit for irradiating a substrate with laser light; a base portion; and a transfer table for transporting the substrate; the transport stage having a table at the base portion Moving upward; the base flange is fixed on the table; the substrate stage is fixed to the upper end of the base flange for accommodating the substrate; the push pin for supporting the substrate penetrates the substrate table; a pushing blade disposed at a periphery of the substrate stage; and a motor connected to a lower surface of the substrate stage; the pedestal flange being used for rotating the substrate stage by rotating a rotating shaft extending in a vertical direction The device: the push pin and the push blade are movable up and down by a driving force of the motor.