TW201903324A - Light source module - Google Patents

Light source module Download PDF

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Publication number
TW201903324A
TW201903324A TW106118586A TW106118586A TW201903324A TW 201903324 A TW201903324 A TW 201903324A TW 106118586 A TW106118586 A TW 106118586A TW 106118586 A TW106118586 A TW 106118586A TW 201903324 A TW201903324 A TW 201903324A
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Taiwan
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light source
interstitial layer
source module
refractive index
layer
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TW106118586A
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Chinese (zh)
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彭耀祈
邱贊立
李柏蒼
簡銘宏
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光寶科技股份有限公司
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Priority to TW106118586A priority Critical patent/TW201903324A/en
Publication of TW201903324A publication Critical patent/TW201903324A/en

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Abstract

A light source module including a substrate, a LED package, an optical cover and at least one packing layer is provided. The LED package is disposed on the substrate and has an encapsulation. The optical cover is disposed on the LED package. The at least one packing layer is disposed between the LED package and the optical cover.

Description

光源模組Light source module

本發明是有關於一種光源模組,且特別是有關於一種防水且高出光效率的光源模組。The invention relates to a light source module, and in particular to a light source module with waterproof and high light efficiency.

現有LED光源模組大都在LED封裝體外側配置光學外罩,且LED封裝體與光學外罩之間存在空氣層,藉由折射率差異與光學外罩的曲率來調整光型。此外,為了滿足防水的需求,通常在基板與光學外罩之間額外配置一層防水矽膠層。Most of the existing LED light source modules are provided with an optical cover outside the LED package, and an air layer exists between the LED package and the optical cover, and the light pattern is adjusted by the difference in refractive index and the curvature of the optical cover. In addition, in order to meet the requirements of waterproofing, an additional layer of waterproof silicone is usually disposed between the substrate and the optical cover.

然而,光學穿透率受限於材料本身穿透率及空氣與材料之間介面所造成的菲涅爾損失(Fresnel loss),故出光效率會因此受限。此外,雖然額外配置防水矽膠層並透過螺絲組裝可達到防水的效果,但這也增加了光源模組的組成構件,組裝工序上較為複雜。However, the optical transmittance is limited by the material's own transmittance and the Fresnel loss caused by the interface between the air and the material, so the light extraction efficiency is thus limited. In addition, although the waterproof silicone layer is additionally disposed and assembled by screws, the waterproof effect can be achieved, but the components of the light source module are also added, and the assembly process is complicated.

本發明提供一種光源模組,其可提供高出光效率、防水的功效且在組裝上相當簡單。The invention provides a light source module which can provide high light-emitting efficiency, waterproof effect and is relatively simple to assemble.

本發明的一種光源模組,包括一基板、一LED封裝體、一光學外罩及至少一填隙層。其中LED封裝體包含一封裝膠體並配置在基板上。光學外罩配置在LED封裝體上,而填隙層填充於LED封裝體與光學外罩之間。A light source module of the present invention includes a substrate, an LED package, an optical cover, and at least one interstitial layer. The LED package comprises an encapsulant and is disposed on the substrate. The optical housing is disposed on the LED package, and the interstitial layer is filled between the LED package and the optical housing.

在本發明的一實施例中,上述的封裝膠體的折射率大於至少一填隙層的折射率,且至少一填隙層的折射率大於等於光學外罩的折射率。In an embodiment of the invention, the refractive index of the encapsulant is greater than the refractive index of the at least one interstitial layer, and the refractive index of the at least one interstitial layer is greater than or equal to the refractive index of the optical cover.

在本發明的一實施例中,上述的LED封裝體與光學外罩之間不存有空氣間隙(air gap)。In an embodiment of the invention, there is no air gap between the LED package and the optical cover.

在本發明的一實施例中,上述的至少一填隙層包括一第一填隙層及一第二填隙層。In an embodiment of the invention, the at least one interstitial layer comprises a first interstitial layer and a second interstitial layer.

在本發明的一實施例中,上述的第一填隙層及第二填隙層的折射率差值介於0.05至0.5之間。In an embodiment of the invention, the first interstitial layer and the second interstitial layer have a refractive index difference of between 0.05 and 0.5.

在本發明的一實施例中,上述的第一填隙層的折射率大於第二填隙層的折射率。In an embodiment of the invention, the refractive index of the first interstitial layer is greater than the refractive index of the second interstitial layer.

在本發明的一實施例中,上述的第一填隙層的折射率小於第二填隙層的折射率。In an embodiment of the invention, the refractive index of the first interstitial layer is smaller than the refractive index of the second interstitial layer.

在本發明的一實施例中,上述的第二填隙層包括擴散粒子。In an embodiment of the invention, the second interstitial layer comprises diffusing particles.

在本發明的一實施例中,上述的光源模組更包括一濾光鍍膜,位於光學外罩的內表面。In an embodiment of the invention, the light source module further includes a filter coating on the inner surface of the optical cover.

在本發明的一實施例中,上述的光源模組更包括一反射鍍膜,位於至少一填隙層的內表面。In an embodiment of the invention, the light source module further includes a reflective coating on the inner surface of the at least one interstitial layer.

基於上述,本發明的光源模組藉由將填隙層填充於LED封裝體與光學外罩之間,藉由封裝膠體、填隙層與光學外罩來提供相近的折射率,以達成提昇光學效率以及控制光型之效果。由於本發明的光源模組在LED封裝體與光學外罩之間沒有空氣間隙,可避免如習知的光源模組中光穿過封裝膠體與空氣層之間的介面以及空氣層與光學外罩之間的介面所造成的損失,而可提昇出光效率與提昇照明品質。另外,填隙層包覆LED封裝體而可提供防水防塵的效果且不需額外使用螺絲固定,可節省組裝工時與工序。此外,若在填隙層添加擴散粒子,能夠將LED封裝體所發出的光線均勻化,而提供使用者舒適的視覺效果且減少眩光。Based on the above, the light source module of the present invention provides a similar refractive index by encapsulating the colloid, the interstitial layer and the optical cover by filling the interstitial layer between the LED package and the optical cover to achieve improved optical efficiency. Control the effect of the light type. Since the light source module of the present invention has no air gap between the LED package and the optical cover, the light between the package colloid and the air layer and the air layer and the optical cover can be avoided between the light source module as in the conventional light source module. The loss caused by the interface can improve the light efficiency and improve the lighting quality. In addition, the interstitial layer covers the LED package to provide a waterproof and dustproof effect without additional screw fixing, which saves assembly time and process. In addition, if diffusing particles are added to the interstitial layer, the light emitted from the LED package can be made uniform, providing a user with a comfortable visual effect and reducing glare.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.

圖1是依照本發明的一實施例的一種光源模組的示意圖。請參閱圖1,在圖1中多個光源模組100以排列成陣列的形式為例,而能夠發出陣列狀的光線,當然,在其他實施例中,光源模組100也可有其他的排列形式,並不以此為限制。下面將會以圖1中其中一個光源模組100為例,詳細地說明此光源模組100的結構。1 is a schematic diagram of a light source module in accordance with an embodiment of the invention. Referring to FIG. 1 , in FIG. 1 , a plurality of light source modules 100 are arranged in an array to take an array of light. Of course, in other embodiments, the light source module 100 may have other arrangements. Form is not limited to this. The structure of the light source module 100 will be described in detail below by taking one of the light source modules 100 of FIG. 1 as an example.

圖2是沿圖1的A-A線段的剖面示意圖。請參閱圖2,本實施例的光源模組100包括一基板110、一LED封裝體120、一光學外罩140及至少一填隙層130。在本實施例中,基板110可為任何合宜的電路板,例如是鋁基電路板110,其上設有電路(未繪示)及隔絕電路與基板的絕緣層(未繪示)。LED封裝體120配置在基板110上且電性連接於基板110上的電路。在本實施例中,LED封裝體120包含具有導線的一板體122、配置在板體122上且電性連接於板體122的LED 124以及配置在板體122上且包封於LED 124的一封裝膠體126。Fig. 2 is a schematic cross-sectional view taken along line A-A of Fig. 1. Referring to FIG. 2 , the light source module 100 of the present embodiment includes a substrate 110 , an LED package 120 , an optical cover 140 , and at least one interstitial layer 130 . In this embodiment, the substrate 110 can be any suitable circuit board, such as an aluminum-based circuit board 110, which is provided with a circuit (not shown) and an insulating layer (not shown) for isolating the circuit from the substrate. The LED package 120 is disposed on the substrate 110 and electrically connected to the circuit on the substrate 110. In this embodiment, the LED package 120 includes a board body 122 having a wire, an LED 124 disposed on the board body 122 and electrically connected to the board body 122, and being disposed on the board body 122 and enclosing the LED 124. An encapsulant 126.

光學外罩140配置在LED封裝體120上。在本實施例中,光學外罩140位於最外側並完整包覆LED封裝體120,而具有保護LED封裝體120的效果。當然,在其他實施例中,光學外罩140也可以是部分包覆LED封裝體120。The optical housing 140 is disposed on the LED package 120. In the present embodiment, the optical housing 140 is located at the outermost side and completely encloses the LED package 120, and has the effect of protecting the LED package 120. Of course, in other embodiments, the optical housing 140 may also partially encapsulate the LED package 120.

圖3是沿圖1的B-B線段的剖面示意圖。需說明的是,在圖3中為了要表示出光學外罩140與LED封裝體120的相對關係以及光學外罩140的內表面142的輪廓,而隱藏了基板110及填隙層130。請參閱圖3,若以LED封裝體120的LED 124的中心位置作為X-Y平面上的原點,而貫穿LED封裝體120的LED 124的軸L作為Z軸的旋轉軸心為例,在本實施例中,光學外罩140的內表面142為非軸對稱曲面。由圖3可看到,光學外罩140的內表面142在軸L的左右兩側是不對稱的,光學外罩140可藉由此特定的曲率與形狀而能夠提供較佳的光學效果。Fig. 3 is a schematic cross-sectional view taken along line B-B of Fig. 1. It should be noted that, in FIG. 3, in order to show the relative relationship between the optical cover 140 and the LED package 120 and the outline of the inner surface 142 of the optical cover 140, the substrate 110 and the interstitial layer 130 are hidden. Referring to FIG. 3 , the center position of the LED 124 of the LED package 120 is taken as the origin on the XY plane, and the axis L of the LED 124 penetrating the LED package 120 is taken as the rotation axis of the Z axis. In the example, the inner surface 142 of the optical housing 140 is a non-axisymmetric curved surface. As can be seen from Figure 3, the inner surface 142 of the optical housing 140 is asymmetrical on the left and right sides of the axis L, and the optical housing 140 provides a preferred optical effect by virtue of this particular curvature and shape.

要解釋的是,相對於非軸對稱曲面的是軸對稱曲面,以軸對稱曲面來說,其相對於軸的兩側的形狀是對稱的,例如是球面、拋物面、雙曲面或橢圓面等。因此,在本實施例中所提到的非軸對稱曲面可以說是非球面、非拋物面、非雙曲面及非橢圓面。更明確地說,非軸對稱曲面是指依循某個特定的數學方程式所構成的非軸對稱的光學曲面。當然,在其他實施例中,光學外罩140的內表面142也可以是其他曲面,例如是依循某個特定的數學方程式所構成的不規則光學曲面。如後所述,光學外罩140可藉由模塑工藝疊加形成。或者,為一先形成之硬質層,在此情況下,光學外罩140係包括一膠材注入孔(未繪示),用於注入形成填隙層130之材料。It is to be explained that the axisymmetric surface is opposite to the non-axisymmetric surface, and the axis is symmetric with respect to the shape of the two sides of the axis, such as a spherical surface, a paraboloid, a hyperboloid or an elliptical surface. Therefore, the non-axisymmetric curved surfaces mentioned in this embodiment can be said to be aspherical, non-parabolic, non-hyperbolic, and non-elliptical. More specifically, a non-axisymmetric surface is a non-axisymmetric optical surface that follows a particular mathematical equation. Of course, in other embodiments, the inner surface 142 of the optical housing 140 can also be other curved surfaces, such as irregular optical curved surfaces that follow a particular mathematical equation. As will be described later, the optical cover 140 can be formed by superposition of a molding process. Alternatively, it is a previously formed hard layer. In this case, the optical cover 140 includes a glue injection hole (not shown) for injecting a material forming the interstitial layer 130.

請回到圖2,在本實施例中,光源模組100包括一層填隙層130,填隙層130填充於LED封裝體120與光學外罩140之間。由圖2可清楚看到,LED封裝體120與光學外罩140之間的間隙由填隙層130填滿,因此,LED封裝體120的封裝膠體126與光學外罩140之間不存有空氣間隙(air gap)。特定言之,在本實施例中,封裝膠體126、填隙層130與光學外罩140的折射率可為漸變式變化,以達到好的穿透效率。舉例而言,封裝膠體126的折射率大於填隙層130的折射率,且填隙層130的折射率大於等於光學外罩140的折射率。在本實施例中,填隙層130的材料可以為膠材,例如是矽膠或者任何適合之材料。封裝膠體126、填隙層130及光學外罩140的折射率可為1.4~1.7之間,且封裝膠體126、填隙層130及光學外罩140的折射率具有上述的變化關係。如此一來,光源模組100可避免如習知的光源模組中光穿過封裝膠體與空氣層之間的介面以及空氣層與光學外罩之間的介面所造成的菲涅爾損失,而可提昇出光效率與提昇照明品質,由於填隙層130包覆LED封裝體120而可提供防水防塵的效果,且不需額外使用螺絲固定,可節省組裝工時與工序。Referring back to FIG. 2 , in the embodiment, the light source module 100 includes a gap filling layer 130 , and the gap filling layer 130 is filled between the LED package 120 and the optical cover 140 . As can be clearly seen from FIG. 2, the gap between the LED package 120 and the optical cover 140 is filled by the interstitial layer 130. Therefore, there is no air gap between the encapsulant 126 of the LED package 120 and the optical cover 140 ( Air gap). In particular, in the present embodiment, the refractive index of the encapsulant 126, the interstitial layer 130, and the optical cover 140 may be changed in a gradual manner to achieve good penetration efficiency. For example, the refractive index of the encapsulant 126 is greater than the refractive index of the interstitial layer 130, and the refractive index of the interstitial layer 130 is greater than or equal to the refractive index of the optical housing 140. In this embodiment, the material of the interstitial layer 130 may be a glue material such as silicone or any suitable material. The refractive index of the encapsulant 126, the interstitial layer 130, and the optical cover 140 may be between 1.4 and 1.7, and the refractive indices of the encapsulant 126, the interstitial layer 130, and the optical cover 140 have the above-described relationship. In this way, the light source module 100 can avoid Fresnel loss caused by the interface between the encapsulant and the air layer and the interface between the air layer and the optical cover in the light source module as in the conventional light source module. The light-emitting efficiency is improved and the lighting quality is improved. Since the gap-filling layer 130 covers the LED package 120, the waterproof and dust-proof effect can be provided, and no additional screw fixing is needed, thereby saving assembly man-hours and processes.

表一比較了三種光源模組,包括了編號1的光源模組,其只有LED封裝體120;編號2的光源模組,其具有LED封裝體120與光學外罩140,且在LED封裝體120與光學外罩140之間有空氣間隙;編號3的光源模組是圖2的光源模組100,其在LED封裝體120與光學外罩140之間填充有填隙層130而不具有空氣間隙。由表一可清楚看到,若比較編號1、2的光源模組可知,僅在LED封裝體120外配置了光學外罩140,即具有空氣間隙的情況下,流明值會明顯的下降,然而在同時比較編號2、3的光源模組後可知,在填充填隙層130後,流明值跟透鏡效率都較有空氣間隙存在時有所提升。 表一Table 1 compares three light source modules, including the light source module of number 1, which has only the LED package 120; the light source module of number 2, which has the LED package 120 and the optical cover 140, and is in the LED package 120 and There is an air gap between the optical enclosures 140; the light source module of the number 3 is the light source module 100 of FIG. 2, which is filled with the interstitial layer 130 between the LED package 120 and the optical enclosure 140 without an air gap. As can be clearly seen from Table 1, it can be seen that comparing the light source modules of Nos. 1 and 2, only when the optical cover 140 is disposed outside the LED package 120, that is, when there is an air gap, the lumen value will be significantly decreased, however, At the same time, comparing the light source modules of Nos. 2 and 3, it can be seen that after filling the interstitial layer 130, the lumen value and the lens efficiency are improved when there is an air gap. Table I

當然,光源模組的形式不以上述為限制,下面舉出其他的光源模組。圖4至圖8分別是依照本發明的其他實施例的多種光源模組的剖面示意圖。需說明的是,在下面的實施例中,與前一實施例相同或相似的元件以相同或相似的符號表示,不再多加贅述。Of course, the form of the light source module is not limited to the above, and other light source modules are listed below. 4 to 8 are schematic cross-sectional views of various light source modules in accordance with other embodiments of the present invention. It is to be noted that, in the following embodiments, the same or similar elements as those of the previous embodiment are denoted by the same or similar symbols and will not be described again.

請先參閱圖4,圖4的光源模組100a與圖2的光源模組100的主要差異在於,在本實施例中,填隙層130a摻雜有粒子131,以提供特殊的光學效果。舉例來說,摻雜在填隙層130內的粒子131可包括擴散粒子,用以將LED封裝體120所發出的光線均勻化,而提供使用者舒適的視覺效果、減少眩光且可控制光型。Referring to FIG. 4, the main difference between the light source module 100a of FIG. 4 and the light source module 100 of FIG. 2 is that, in the present embodiment, the interstitial layer 130a is doped with particles 131 to provide a special optical effect. For example, the particles 131 doped in the interstitial layer 130 may include diffusing particles for homogenizing the light emitted by the LED package 120 to provide a user's comfortable visual effect, reduce glare, and control the light type. .

值得一提的是,由於擴散粒子在填隙層130a中的濃度不同會影響出光的視覺效果,例如擴散粒子在填隙層130a中的濃度低會具有較高的光線穿透效率,但擴散效果不足;擴散粒子在填隙層130a中的濃度高會具有較高的擴散效果,但光線穿透效率不佳。在本實施例中,擴散粒子的重量濃度百分比介於0.1%至20%之間,以在穿透效率與擴散效果中取得較佳的平衡。此外,在本實施例中,擴散粒子可以包括有機擴散材料,例如是丙烯酸型、有機矽型或聚乙烯型等材料,擴散粒子也可以包括無機擴散材料,例如是奈米硫酸鋇,二氧化矽或碳酸鈣。當然,擴散粒子的種類與重量濃度百分比並不以上述為限制。It is worth mentioning that because the concentration of the diffusion particles in the interstitial layer 130a will affect the visual effect of the light, for example, the low concentration of the diffusion particles in the interstitial layer 130a will have a higher light penetration efficiency, but the diffusion effect. Insufficient; the high concentration of the diffusing particles in the interstitial layer 130a has a high diffusion effect, but the light penetration efficiency is not good. In the present embodiment, the concentration percentage of the diffusing particles is between 0.1% and 20% to achieve a better balance between the penetration efficiency and the diffusion effect. In addition, in the embodiment, the diffusion particles may include an organic diffusion material, such as an acrylic type, an organic germanium type or a polyethylene type, and the diffusion particles may also include an inorganic diffusion material such as nanometer barium sulfate or cerium oxide. Or calcium carbonate. Of course, the type and concentration percentage of the diffusing particles are not limited to the above.

當然,摻雜在填隙層130內的粒子131的種類並不限於擴散粒子,粒子131也可包括螢光粉,其為光致發光機制材料,以作為光線的波長轉換之用。同樣地,螢光粉的重量濃度百分比會介於0.1%至30%之間,以在穿透效率與波長轉換之間取得較佳的平衡。此外,在本實施例中,螢光粉的種類並無特殊限制,可例如為鋁酸鹽螢光粉、矽酸鹽螢光粉、氮化物螢光粉、氮氧化物螢光粉或氟化物螢光粉及前述之混合物。Of course, the kind of the particles 131 doped in the interstitial layer 130 is not limited to the diffusion particles, and the particles 131 may also include a phosphor powder, which is a photoluminescence mechanism material for wavelength conversion of light. Similarly, the weight percentage of the phosphor powder will be between 0.1% and 30% to achieve a better balance between penetration efficiency and wavelength conversion. In addition, in the present embodiment, the type of the phosphor powder is not particularly limited, and may be, for example, aluminate phosphor powder, tantalate phosphor powder, nitride phosphor powder, oxynitride phosphor powder or fluoride. Fluorescent powder and a mixture of the foregoing.

在本發明中,亦可包含具有複數層填隙層的實施態樣。在此情況下,封裝膠體126、填隙層130與光學外罩140的折射率依然為漸變式變化,然而各填隙層間的折射率關係卻可依需要而有所調整。以下舉例說明。In the present invention, an embodiment having a plurality of layers of interstitial layers may also be included. In this case, the refractive index of the encapsulant 126, the interstitial layer 130 and the optical cover 140 are still changed gradually, but the refractive index relationship between the interstitial layers can be adjusted as needed. The following examples are given.

請參閱圖5,圖5的光源模組100b與圖2的光源模組100的主要差異在於,在本實施例中,至少一填隙層130b包括一第一填隙層132及一第二填隙層134,第一填隙層132包覆LED封裝體120,第二填隙層134包覆第一填隙層132。在本實施例中,第一填隙層132的折射率可以大於第二填隙層134的折射率,且第一填隙層132及第二填隙層134的折射率差值介於0.05至0.5之間。此外,在本實施例中,封裝膠體126的折射率大於第一填隙層132的折射率與第二填隙層134的折射率,且第一填隙層132的折射率與第二填隙層134的折射率大於等於光學外罩140的折射率。Referring to FIG. 5 , the main difference between the light source module 100 b of FIG. 5 and the light source module 100 of FIG. 2 is that, in this embodiment, at least one interstitial layer 130 b includes a first interstitial layer 132 and a second fill. The gap layer 134, the first interstitial layer 132 covers the LED package 120, and the second interstitial layer 134 covers the first interstitial layer 132. In this embodiment, the refractive index of the first interstitial layer 132 may be greater than the refractive index of the second interstitial layer 134, and the refractive index difference between the first interstitial layer 132 and the second interstitial layer 134 is between 0.05 and Between 0.5. In addition, in the present embodiment, the refractive index of the encapsulant 126 is greater than the refractive index of the first interstitial layer 132 and the refractive index of the second interstitial layer 134, and the refractive index of the first interstitial layer 132 and the second interstitial The refractive index of layer 134 is greater than or equal to the refractive index of optical housing 140.

請參閱圖6,圖6的光源模組100c與圖5的光源模組100b的主要差異在於,第一填隙層132的折射率高於第二填隙層134c的折射率,且第二填隙層134c混有粒子131,粒子以擴散粒子為例,能夠將LED封裝體120所發出的光線均勻化,而提供使用者舒適的視覺效果、減少眩光且可控制光型。當然,粒子也可以是螢光粉而能夠轉換光線的波長。Referring to FIG. 6, the main difference between the light source module 100c of FIG. 6 and the light source module 100b of FIG. 5 is that the refractive index of the first interstitial layer 132 is higher than the refractive index of the second interstitial layer 134c, and the second filling The gap layer 134c is mixed with the particles 131. The particles are exemplified by the diffusing particles, and the light emitted from the LED package 120 can be made uniform, thereby providing a user with a comfortable visual effect, reducing glare, and controlling the light type. Of course, the particles can also be fluorescent powders that are capable of converting the wavelength of light.

圖9是以圖5與圖6的光源模組100b、100c為例的位置與照度的關係圖。請參閱圖9,圖9的X軸可看成是將圖5與圖6的光源模組100b、100c沿圖1的C-C線段所排列的位置,Y軸是圖5與圖6的光源模組100b、100c所發出的光線的輝度。圖5的光源模組100b以虛線表示,圖6的光源模組100c以實線表示。由於圖6的光源模組100c在第二填隙層134c摻雜了擴散粒子,因此,由圖9可清楚看到,圖6的這一排光源模組100c在輝度上差距(約為700000)明顯小於圖5的這一排光源模組100b在照度上差距(約為1500000)。由於在第二填隙層134c摻雜了擴散粒子的這排光源模組100c的輝度差距明顯地較小,而能夠提供較佳的視覺舒適度。Fig. 9 is a view showing the relationship between the position and the illuminance of the light source modules 100b and 100c of Figs. 5 and 6 as an example. Referring to FIG. 9, the X-axis of FIG. 9 can be regarded as the position where the light source modules 100b and 100c of FIG. 5 and FIG. 6 are arranged along the CC line segment of FIG. 1, and the Y-axis is the light source module of FIGS. 5 and 6. The brightness of the light emitted by 100b, 100c. The light source module 100b of FIG. 5 is indicated by a broken line, and the light source module 100c of FIG. 6 is indicated by a solid line. Since the light source module 100c of FIG. 6 is doped with diffusion particles in the second interstitial layer 134c, it can be clearly seen from FIG. 9 that the light source module 100c of FIG. 6 has a difference in luminance (about 700,000). It is significantly smaller than the illuminance difference (about 1.500000) of this row of light source modules 100b of FIG. Since the luminance difference of the row of light source modules 100c doped with the diffusion particles in the second interstitial layer 134c is significantly smaller, it can provide better visual comfort.

值得一提的是,由於圖6的光源模組100c的第二填隙層134c混有粒子131,光線在穿過第二填隙層134c時可能會向第一填隙層132的方向散射,而使得第二填隙層134c的出光效率受到影響。為了避免上述問題,在圖6的光源模組100c中,第二填隙層134c的折射率大於第一填隙層132的折射率。若在第二填隙層134c內的一部分光線被粒子131反射而朝向第一填隙層132射去,在第一填隙層132與第二填隙層134之間的介面有機率被全反射回第二填隙層134。因此,第二填隙層134c的折射率大於第一填隙層132的折射率的設計可使得第二填隙層134內的光線較多地射向光學外罩140,而提升第二填隙層134的出光效率。It is to be noted that, since the second interstitial layer 134c of the light source module 100c of FIG. 6 is mixed with the particles 131, the light may scatter in the direction of the first interstitial layer 132 when passing through the second interstitial layer 134c. The light extraction efficiency of the second interstitial layer 134c is affected. In order to avoid the above problem, in the light source module 100c of FIG. 6, the refractive index of the second interstitial layer 134c is greater than the refractive index of the first interstitial layer 132. If a portion of the light in the second interstitial layer 134c is reflected by the particles 131 and is directed toward the first interstitial layer 132, the interfacial organic ratio between the first interstitial layer 132 and the second interstitial layer 134 is totally reflected. Returning to the second interstitial layer 134. Therefore, the design of the second interstitial layer 134c having a refractive index greater than that of the first interstitial layer 132 may cause more light in the second interstitial layer 134 to be directed toward the optical housing 140, and the second interstitial layer may be lifted. 134's light output efficiency.

表二比較了四種光源模組,包括了編號1的光源模組,其在封裝膠體與光學外罩之間具有空氣間隙,也就是習知的光源模組;編號2的光源模組在封裝膠體126與光學外罩140之間填充有第一填隙層132及第二填隙層134,且第一填隙層132的折射率大於第二填隙層134的折射率,而如同圖5的光源模組100b;編號3的光源模組是將10%的擴散粒子混入圖5的光源模組100b的第二填隙層134;編號4的光源模組的第一填隙層132的折射率小於第二填隙層134c的折射率,且將10%的擴散粒子混入第二填隙層134c,而如同圖6的光源模組100c。比較編號1、2的光源模組可知,編號2的光源模組100b在封裝膠體126與光學外罩140之間填充填隙層130b之後,穿透率大幅提昇6%。比較編號3、4的光源模組可知,當在第二填隙層134添加擴散粒子時,將第二填隙層134c的折射率設計為大於第一填隙層132的折射率,則出光效率可提升2%。 表二Table 2 compares four light source modules, including the number 1 light source module, which has an air gap between the package gel and the optical cover, which is also a conventional light source module; the number 2 light source module is in the package colloid A first interstitial layer 132 and a second interstitial layer 134 are filled between the 126 and the optical cover 140, and the refractive index of the first interstitial layer 132 is greater than the refractive index of the second interstitial layer 134, and the light source of FIG. The module 100b; the light source module of No. 3 is a second interstitial layer 134 that mixes 10% of the diffusion particles into the light source module 100b of FIG. 5; the refractive index of the first interstitial layer 132 of the light source module of No. 4 is less than The refractive index of the second interstitial layer 134c is mixed with 10% of the diffusion particles into the second interstitial layer 134c, like the light source module 100c of FIG. Comparing the light source modules of Nos. 1 and 2, it can be seen that the light source module 100b of No. 2 has a gap increase of 6% after filling the interstitial layer 130b between the encapsulant 126 and the optical cover 140. Comparing the light source modules of No. 3 and 4, when the diffusion particles are added to the second interstitial layer 134, the refractive index of the second interstitial layer 134c is designed to be larger than the refractive index of the first interstitial layer 132, and the light extraction efficiency is obtained. Can be increased by 2%. Table II

請回到圖7,圖7的光源模組100d與圖6的光源模組100c的主要差異在於,在本實施例中,光源模組100d更包括一濾光鍍膜150,較佳係位於光學外罩140的內表面(即填隙層130c的外表面)以過濾藍光/UV光(例如波長小於460nm的光),而使藍光/UV光不會穿出填隙層130c,以降低光源模組100d發出藍光/UV光而影響到使用者的眼睛健康的可能性。然而在其他實施例中,濾光鍍膜150也可以位在LED封裝體120的外表面(即填隙層130c的內表面),或者,位在第一填隙層132與第二填隙層134c之間。The main difference between the light source module 100d of FIG. 7 and the light source module 100c of FIG. 6 is that, in the embodiment, the light source module 100d further includes a filter coating 150, preferably located in the optical cover. The inner surface of 140 (ie, the outer surface of the interstitial layer 130c) filters blue/UV light (eg, light having a wavelength of less than 460 nm), so that the blue/UV light does not pass through the interstitial layer 130c to lower the light source module 100d. Blue light/UV light is emitted to affect the health of the user's eyes. In other embodiments, the filter coating 150 may also be located on the outer surface of the LED package 120 (ie, the inner surface of the interstitial layer 130c), or in the first interstitial layer 132 and the second interstitial layer 134c. between.

請參閱圖8,圖8的光源模組100e與圖6的光源模組100c的主要差異在於,在本實施例中,填隙層130c的第二填隙層134c的粒子以螢光粉為例,光源模組100e更包括一反射鍍膜160,較加係包含一能反射波長大於500 nm的反射鍍膜。反射鍍膜160位於至少一填隙層130的內表面,更明確地說,反射鍍膜160位在第一填隙層132的內表面,以將黃光向外反射,以調整光源模組100e所發出的光線色溫。Referring to FIG. 8, the main difference between the light source module 100e of FIG. 8 and the light source module 100c of FIG. 6 is that, in the embodiment, the particles of the second interstitial layer 134c of the interstitial layer 130c are exemplified by phosphor powder. The light source module 100e further includes a reflective coating 160, and the additive system comprises a reflective coating having a wavelength greater than 500 nm. The reflective coating 160 is located on the inner surface of the at least one interstitial layer 130. More specifically, the reflective coating 160 is positioned on the inner surface of the first interstitial layer 132 to reflect the yellow light outward to adjust the light source module 100e. The color temperature of the light.

當然,在未繪示的其他實施例中,濾光鍍膜150或/及反射鍍膜160也可以應用在圖2、圖4、圖5的光源模組100、100a、100b或是其他的未繪示光源模組上,並不以上述為限制。Of course, in other embodiments not shown, the filter coating 150 or/and the reflective coating 160 can also be applied to the light source modules 100, 100a, 100b of FIG. 2, FIG. 4, FIG. 5 or other not shown. The light source module is not limited to the above.

下面提供光源模組100的製造方法。圖10至圖13是依照本發明的一實施例的一種光源模組100的製造方法的流程示意圖。在本實施例中,將以圖2的光源模組100為例,說明其中一種在LED封裝體120上形成填隙層130的方式。當然,在其他實施例中,填隙層130的製造方法並不以此為限制。A method of manufacturing the light source module 100 is provided below. 10 to 13 are schematic flow charts of a method of manufacturing a light source module 100 according to an embodiment of the invention. In this embodiment, a light source module 100 of FIG. 2 will be taken as an example to describe one of the ways in which the interstitial layer 130 is formed on the LED package 120. Of course, in other embodiments, the method of manufacturing the interstitial layer 130 is not limited thereto.

請先參閱圖10,首先,提供一模具10,其中模具10包括分離的一第一部分12及一第二部分14。LED封裝體120連同基板110一起固定在模具10的第一部分12。第二部分14包括一凹腔17,在本實施例中,第二部分14包括一固定件15及可相對於固定件15移動的活動件16,凹腔17形成於活動件16上。當然,本實施例僅舉出其中一種模具10的態樣,能應用此方方法的模具10的態樣並不限於此。此外,在圖10中可見,在第一部分12結合至第二部分14之前,一剝離層18(release layer)覆蓋於凹腔17內,以利後續脫膜,當然,在其他實施例中,若光源模組100容易分離於模具10,也可省略剝離層18。Referring first to Figure 10, first, a mold 10 is provided in which the mold 10 includes a first portion 12 and a second portion 14 that are separated. The LED package 120 is secured to the first portion 12 of the mold 10 along with the substrate 110. The second portion 14 includes a cavity 17 which, in the present embodiment, includes a fastener 15 and a movable member 16 movable relative to the fixture 15, the cavity 17 being formed on the movable member 16. Of course, this embodiment exemplifies only one of the molds 10, and the aspect of the mold 10 to which the method can be applied is not limited thereto. In addition, it can be seen in FIG. 10 that a release layer 18 is covered in the cavity 17 before the first portion 12 is bonded to the second portion 14 to facilitate subsequent film removal. Of course, in other embodiments, The light source module 100 is easily separated from the mold 10, and the peeling layer 18 may be omitted.

接著,如圖11所示,使第一部分12結合至第二部分14,且位在第一部分12上的LED封裝體120會伸入第二部分14的凹腔17。在本實施例中,使第一部分12結合至第二部分14的方式是如圖12所示,對凹腔17施以負壓,而使第一部分12密合於第二部分14。由於凹腔17內的壓力降低,活動件16會相對於固定件15上移直到活動件16被基板110阻擋而無法繼續上移。操作者可在活動件16到定位之前或之後,注入一膠材20至剝離層18與基板110之間的空間以覆蓋LED封裝體120。在本實施例中,膠材20的材質例如是矽膠或者任何折射率可在1.4~1.7之間之材料。當然,在其他實施例中,若第一部分12可直接緊密結合於第二部分14,也可省略對凹腔17施以負壓的步驟。此外,在其他實施例中,第二部分14的活動件16也可以是不能夠相對於固定件15移動的設計,也就是說,第二部分14也可以是不會變形的單一構件。Next, as shown in FIG. 11, the first portion 12 is bonded to the second portion 14, and the LED package 120 positioned on the first portion 12 projects into the cavity 17 of the second portion 14. In the present embodiment, the first portion 12 is joined to the second portion 14 in such a manner as to apply a negative pressure to the cavity 17 and the first portion 12 to the second portion 14 as shown in FIG. As the pressure within the cavity 17 decreases, the movable member 16 moves up relative to the fixture 15 until the movable member 16 is blocked by the substrate 110 and cannot continue to move up. The operator can inject a glue 20 to the space between the peeling layer 18 and the substrate 110 to cover the LED package 120 before or after the movable member 16 is positioned. In this embodiment, the material of the rubber material 20 is, for example, silicone or any material having a refractive index of between 1.4 and 1.7. Of course, in other embodiments, if the first portion 12 can be directly coupled to the second portion 14, the step of applying a negative pressure to the cavity 17 can be omitted. Moreover, in other embodiments, the movable member 16 of the second portion 14 may also be a design that is not movable relative to the fixed member 15, that is, the second portion 14 may also be a single member that does not deform.

接著,如圖13所示,固化膠材20,而形成包覆於LED封裝體120的一膠層(也就是填隙層130)。在本實施例中,膠材20是以受熱後會固化的材料為例,因此可透過加熱模具10的第二部分14的方式來固化膠材20,以形成填隙層130。但在其他實施例中,膠材20也可以選用光固化材料,例如是UV光後會固化的材料,當膠材20是光固化材料時,模具10的第二部分14要可使光線穿透,例如是透明,以透過對模具10的第二部分14照光的方式來固化膠材20,以形成填隙層130,而完成將填隙層130形成在基板110上並包覆LED封裝體120的步驟。再來,再將基板110移除於第一部分12,且移除剝離層18而使填隙層130分離於第二部分14,即可脫離於模具10。形成具有填隙層130之半成品。需說明的是,在有多層填隙層130之情況下,可重複進行模塑,以形成多層填隙層130之半成品。最後,具有填隙層130之半成品上模塑形成光學外罩140,最後即形成本發明之光源模組。Next, as shown in FIG. 13, the adhesive 20 is cured to form a glue layer (that is, the interstitial layer 130) that is coated on the LED package 120. In the present embodiment, the rubber material 20 is exemplified by a material which is cured after being heated, so that the rubber material 20 can be cured by heating the second portion 14 of the mold 10 to form the interstitial layer 130. However, in other embodiments, the glue 20 may also be a photocurable material, such as a material that cures after UV light. When the glue 20 is a photocurable material, the second portion 14 of the mold 10 allows light to penetrate. For example, it is transparent to cure the glue 20 by illuminating the second portion 14 of the mold 10 to form the interstitial layer 130, and completing the formation of the interstitial layer 130 on the substrate 110 and coating the LED package 120 A step of. Then, the substrate 110 is removed from the first portion 12, and the peeling layer 18 is removed to separate the interstitial layer 130 from the second portion 14 to be detached from the mold 10. A semi-finished product having a gap-filling layer 130 is formed. It should be noted that in the case of having a plurality of interstitial layers 130, molding may be repeated to form a semi-finished product of the multi-layer interstitial layer 130. Finally, the semi-finished product having the interstitial layer 130 is molded to form the optical cover 140, and finally the light source module of the present invention is formed.

除上述直接模塑光學外罩140的方法,本發明亦可使用硬質光學外罩140。即提供一具有膠材注入孔的光學外罩140,直接將具有LED封裝體120的基板110與光學外罩140對準貼合後,由膠材注入孔注入膠材20進行固化,形成具有單層填隙層130之光源模組。亦或,將如前述N層填隙層130的半成品與光學外罩140對準貼合後,由膠材注入孔注入膠材20進行固化,形成具有N+1層填隙層130之光源模組。In addition to the above method of directly molding the optical cover 140, the present invention may also use a rigid optical cover 140. That is, an optical cover 140 having a glue injection hole is provided, and the substrate 110 having the LED package 120 is directly aligned with the optical cover 140, and then the glue material 20 is injected from the glue injection hole to form a single layer. The light source module of the gap layer 130. Alternatively, after the semi-finished product of the N-layer interstitial layer 130 is aligned with the optical cover 140, the adhesive material 20 is injected from the rubber injection hole to be cured to form a light source module having the N+1 layer interstitial layer 130. .

綜上所述,本發明的光源模組藉由將填隙層填充於LED封裝體與光學外罩之間,藉由封裝膠體、填隙層與光學外罩來提供相近的折射率,以達成提昇光學效率以及控制光型之效果。由於本發明的光源模組在LED封裝體與光學外罩之間沒有空氣間隙,可避免如習知的光源模組中光穿過封裝膠體與空氣層之間的介面以及空氣層與光學外罩之間的介面所造成的菲涅爾損失,而可提昇出光效率與提昇照明品質。另外,填隙層包覆LED封裝體而可提供防水防塵的效果且不需額外使用螺絲固定,可節省組裝工時與工序。此外,若在填隙層添加擴散粒子,能夠將LED封裝體所發出的光線均勻化,而提供使用者舒適的視覺效果且減少眩光。In summary, the light source module of the present invention fills the gap between the LED package and the optical cover, and provides a similar refractive index by the encapsulant, the interstitial layer and the optical cover to achieve the lifting optics. Efficiency and the effect of controlling light patterns. Since the light source module of the present invention has no air gap between the LED package and the optical cover, the light between the package colloid and the air layer and the air layer and the optical cover can be avoided between the light source module as in the conventional light source module. The Fresnel loss caused by the interface can improve the light efficiency and improve the lighting quality. In addition, the interstitial layer covers the LED package to provide a waterproof and dustproof effect without additional screw fixing, which saves assembly time and process. In addition, if diffusing particles are added to the interstitial layer, the light emitted from the LED package can be made uniform, providing a user with a comfortable visual effect and reducing glare.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

L‧‧‧軸L‧‧‧ axis

10‧‧‧模具 10‧‧‧Mold

12‧‧‧第一部分12‧‧‧Part 1

14‧‧‧第二部分14‧‧‧Part II

15‧‧‧固定件15‧‧‧Fixed parts

16‧‧‧活動件16‧‧‧Activities

17‧‧‧凹腔17‧‧‧ cavity

18‧‧‧剝離層18‧‧‧ peeling layer

20‧‧‧膠材20‧‧‧Stained materials

100、100a、100b、100c、100d、100e‧‧‧光源模組100, 100a, 100b, 100c, 100d, 100e‧‧‧ light source module

110‧‧‧基板110‧‧‧Substrate

120‧‧‧LED封裝體120‧‧‧LED package

122‧‧‧板體122‧‧‧ board

124‧‧‧LED124‧‧‧LED

126‧‧‧封裝膠體126‧‧‧Package colloid

130、130a、130b、130c‧‧‧填隙層130, 130a, 130b, 130c‧‧‧ gap layer

131‧‧‧粒子131‧‧‧ particles

132‧‧‧第一填隙層132‧‧‧First gap layer

134、134c‧‧‧第二填隙層134, 134c‧‧‧Second interstitial layer

140‧‧‧光學外罩140‧‧‧Optical cover

142‧‧‧內表面142‧‧‧ inner surface

150‧‧‧濾光鍍膜150‧‧‧Filter coating

160‧‧‧反射鍍膜160‧‧‧reflective coating

圖1是依照本發明的一實施例的一種光源模組的示意圖。 圖2是沿圖1的A-A線段的剖面示意圖。 圖3是沿圖1的B-B線段的剖面示意圖。 圖4至圖8分別是依照本發明的其他實施例的多種光源模組的剖面示意圖。 圖9是以圖5與圖6的光源模組為例的位置與輝度的關係圖。 圖10至圖13是依照本發明的一實施例的一種光源模組的製造方法的流程示意圖。1 is a schematic diagram of a light source module in accordance with an embodiment of the invention. Fig. 2 is a schematic cross-sectional view taken along line A-A of Fig. 1. Fig. 3 is a schematic cross-sectional view taken along line B-B of Fig. 1. 4 to 8 are schematic cross-sectional views of various light source modules in accordance with other embodiments of the present invention. FIG. 9 is a diagram showing the relationship between the position and the luminance of the light source module of FIGS. 5 and 6. 10 to 13 are schematic flow charts of a method of manufacturing a light source module according to an embodiment of the invention.

Claims (10)

一種光源模組,包括: 一基板; 一LED封裝體,配置在該基板上,該LED封裝體包含一封裝膠體; 一光學外罩,配置在該LED封裝體上;以及 至少一填隙層,填充於該LED封裝體與該光學外罩之間。A light source module includes: a substrate; an LED package disposed on the substrate, the LED package includes an encapsulant; an optical cover disposed on the LED package; and at least one interstitial layer, filled Between the LED package and the optical housing. 如申請專利範圍第1項所述的光源模組,其中該封裝膠體的折射率大於該至少一填隙層的折射率,且該至少一填隙層的折射率大於等於該光學外罩的折射率。The light source module of claim 1, wherein a refractive index of the encapsulant is greater than a refractive index of the at least one interstitial layer, and a refractive index of the at least one interstitial layer is greater than or equal to a refractive index of the optical cover. . 如申請專利範圍第1項所述的光源模組,其中該LED封裝體與該光學外罩之間不存有空氣間隙(air gap)。The light source module of claim 1, wherein there is no air gap between the LED package and the optical cover. 如申請專利範圍第1項所述的光源模組,其中該至少一填隙層包括一第一填隙層及一第二填隙層。The light source module of claim 1, wherein the at least one interstitial layer comprises a first interstitial layer and a second interstitial layer. 如申請專利範圍第4項所述的光源模組,其中該第一填隙層的折射率與該第二填隙層的折射率差值介於0.05至0.5之間。The light source module of claim 4, wherein a refractive index difference between the refractive index of the first interstitial layer and the second interstitial layer is between 0.05 and 0.5. 如申請專利範圍第4項所述的光源模組,其中該第一填隙層的折射率大於該第二填隙層的折射率。The light source module of claim 4, wherein the first interstitial layer has a refractive index greater than a refractive index of the second interstitial layer. 如申請專利範圍第4項所述的光源模組,其中該第一填隙層的折射率小於該第二填隙層的折射率。The light source module of claim 4, wherein the first interstitial layer has a refractive index smaller than a refractive index of the second interstitial layer. 如申請專利範圍第7項所述的光源模組,其中該第二填隙層包括擴散粒子。The light source module of claim 7, wherein the second interstitial layer comprises diffusion particles. 如申請專利範圍第1項所述的光源模組,更包括: 一濾光鍍膜,位於該光學外罩的內表面。The light source module of claim 1, further comprising: a filter coating on an inner surface of the optical cover. 如申請專利範圍第1項所述的光源模組,更包括: 一反射鍍膜,位於該至少一填隙層的內表面。The light source module of claim 1, further comprising: a reflective coating on an inner surface of the at least one interstitial layer.
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