TWI576534B - Modular led display and led lighting panel - Google Patents

Description

Modular LED display panel and LED illuminating panel

The present invention relates to a display panel, and more particularly to a modular LED display panel and an LED illuminating panel.

Conventional display panels are mostly packaged with LED chips, that is, a single optical lens is coated on the LED chip, and then several packaged LED structures are respectively mounted on the circuit carrier. Finally, the shielded panels are further separated by the above-mentioned encapsulated LED structures.

However, the conventional display templates require not only a large amount of man-hours for assembly, but also the size of the conventional display templates depends on the size of the circuit board used, and thus cannot be adjusted to suit various sizes.

Therefore, the present inventors have felt that the above-mentioned deficiencies can be improved, and they have devoted themselves to research and cooperated with the application of the theory, and finally proposed a present invention which is reasonable in design and effective in improving the above-mentioned defects.

The embodiment of the invention provides a modular LED display panel and an LED illuminating panel, which can effectively improve the lack of the conventional display panel.

The embodiment of the present invention provides a modular LED display panel, comprising a plurality of LED illuminating panels detachably spliced, and the LED illuminating panels are electrically connected to each other; wherein each LED illuminating panel comprises: a circuit carrier board, A first surface and a second surface on opposite sides; a plurality of LED lighting modules adjacent to each other and mounted on the first surface of the circuit carrier; wherein each LED lighting module comprises : a base a board having a front surface and a back surface on opposite sides, and a back surface of the substrate is mounted on the first surface of the circuit carrier; and a plurality of LED chips mounted on the front surface of the substrate, and the LEDs The chip is electrically connected to the circuit carrier via the substrate; and an electronic component module is mounted on the circuit carrier, and the electronic component module is electrically connected to the LED lighting modules through the circuit carrier Sexual conduction.

The embodiment of the invention further provides an LED illuminating panel, comprising: a circuit carrier board having a first surface and a second surface on opposite sides; and a plurality of LED lighting modules adjacent to each other and mounted on a first surface of the circuit carrier; wherein each LED lighting module comprises: a substrate having a front surface and a back surface on opposite sides, and a back surface of the substrate is mounted on the first surface of the circuit carrier And a plurality of LED chips mounted on the front surface of the substrate, and the LED chips are electrically connected to the circuit carrier via the substrate; and an electronic component module mounted on the circuit carrier, and The electronic component module is electrically connected to the LED lighting modules through the circuit carrier.

In summary, the modular LED display panel and the LED illuminating panel provided by the embodiments of the present invention can be adjusted and changed according to different size requirements, thereby effectively improving the lack of the conventional display panel. Furthermore, since the LED illuminating panel is composed of a plurality of LED illuminating modules, it is only necessary to replace the damaged LED illuminating module during maintenance.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

1000‧‧‧Modular LED display panel

100‧‧‧LED illuminating board

1‧‧‧Circuit carrier board

11‧‧‧ first surface

12‧‧‧ second surface

13‧‧‧ first side

14‧‧‧Second side

2‧‧‧LED lighting module

21‧‧‧Substrate

211‧‧‧ positive

212‧‧‧Back

22‧‧‧LED chip

23‧‧‧ colloid

23a‧‧‧Translucent colloid

231a‧‧‧Out of the glossy

232a‧‧‧ ring side

23b‧‧‧shading colloid

231‧‧‧Glossy

232‧‧‧ Groove

233‧‧‧ corner

234‧‧‧Combined groove

3‧‧‧Electronic component module

31‧‧‧ Controller

32‧‧‧Electrical connector

33‧‧‧Drive components

4‧‧‧Connecting components

41‧‧‧ first public seat

42‧‧‧ first mother seat

43‧‧‧Second public

44‧‧‧Second mother seat

200‧‧‧ outer frame

201‧‧‧ positioning ribs

1 is a perspective view of a modular LED display panel of the present invention.

2 is a schematic perspective view of an LED illuminating panel of the present invention.

3 is an exploded perspective view of an LED illuminating panel of the present invention.

Figure 4 is a cross-sectional view taken along line X-X of Figure 3.

Figure 5 is a cross-sectional view showing a variation of Figure 4.

Figure 6 is a perspective view showing the LED light-emitting panel of the present invention provided with a connection assembly.

FIG. 7 is a perspective view showing a plurality of LED illuminating panels provided with a connecting component of the present invention being assembled to each other to form a modular LED display panel.

Figure 8 is a cross-sectional view showing another embodiment of the LED lighting panel of the present invention.

Fig. 9 is a perspective view showing still another embodiment of the LED lighting panel of the present invention.

Figure 10 is a cross-sectional view taken along line Y-Y of Figure 9.

Figure 11 is a cross-sectional view showing a variation of Figure 10.

[First Embodiment]

Please refer to FIG. 1 to FIG. 7 , which are the first embodiment of the present invention. It should be noted that the related numbers and appearances mentioned in the embodiments are only used to specifically describe the implementation of the present invention. The manner in which the content is understood is not to be construed as limiting the scope of the invention.

As shown in FIG. 1 , the present embodiment is a modular LED display panel 1000 including a plurality of LED illuminating panels 100 detachably spliced, and the LED illuminating panels 100 are electrically connected to each other. Furthermore, in the embodiment, the modular LED display panel 1000 is exemplified by four LED illuminating panels 100 spliced together, but in practical applications, the LED illuminating panel included in the modular LED display panel 1000 is included. The number and shape of the 100 are not limited by the description of the embodiment and the appearance of the drawing.

It should be noted that, since the LED illuminating panels 100 are substantially the same in the embodiment, the following is only for the LED illuminating panel 100 for the convenience of the specific configuration of the LED illuminating panel 100. One of the LED illuminating panels 100 is described.

Referring to FIG. 2 to FIG. 4 , the LED lighting panel 100 includes a circuit carrier board 1 , a plurality of LED lighting modules 2 , and an electronic component module 3 . In the embodiment, the LED light-emitting panel 100 is an LED light-emitting module 2, but in practical applications. The number and shape of the LED lighting module 2 included in the LED lighting panel 100 are not limited to those of the embodiment and the drawings. The construction of each element of the LED lighting panel 100 will be described below.

In the embodiment, the board of the circuit board 1 may be of a type such as a glass fiber epoxy board (FR4), a composite epoxy glass board (CEM), or a ceramic board, but is not limited thereto. The circuit carrier 1 of the present embodiment is not a lead frame type, which is described in the following. Furthermore, the circuit carrier 1 is substantially square (ie rectangular or square), and the circuit carrier 1 has a first surface 11 and a second surface 12 on opposite sides (such as the circuit carrier in FIG. 3). 1 top and bottom).

A plurality of LED lighting modules 2 are adjacent to each other and mounted on the first surface 11 of the circuit carrier 1 to electrically connect to each other through the circuit carrier 1 . In the present embodiment, the LED lighting module 2 has substantially the same structure. Therefore, in order to facilitate the specific configuration of the LED lighting module 2, only one of the LEDs of the LED lighting module 2 is described below. The light-emitting module 2 is introduced, and then the connection relationship between the LED light-emitting modules 2 will be described.

The LED lighting module 2 includes a substrate 21, a plurality of LED chips 22, and a colloid 23; the substrate 21 has a front surface 211 and a back surface 212 on opposite sides, and the back surface 212 of the substrate 21 is mounted on the circuit. The first surface 11 of the board 1 is mounted on the front surface 211 of the substrate 21, and the LED chips 22 are electrically connected to the circuit carrier 1 via the substrate 21.

The arrangement of the LED chips 22 on the circuit carrier 1 is arranged in a matrix type in the embodiment. The connection between the LED chip 22 and the circuit carrier 1 may be through wire bonding or flip chip bonding, and is not limited herein. Furthermore, the LED chip 22 in this embodiment may be a white LED chip, a red LED chip, a green LED chip, a blue LED chip, an infrared LED chip, and an ultraviolet LED. At least one of the wafers, but not limited thereto.

The colloid 23 is located on the front surface 211 of the substrate 21 and covers the LED chip 22 on the substrate 21. The colloid 23 has a light-emitting surface 231 away from the substrate 21, and the light-emitting surface 231 is recessed to form a plurality of criss-crossing grooves 232. . Each of the grooves 232 is projected onto the projection area of the front surface 211 of the substrate 21, and is located at a portion of the front surface 211 of the substrate 21 where the LED chips 22 are not mounted. Moreover, each of the edges of the light-emitting surface 231 is concavely formed with a notch 233, and the groove 232 is located within a range surrounded by the notch 233. In any two adjacent LED lighting modules 2 of the LED lighting panel 100, the notched corners 233 on the adjacent edges are spliced together into a combined recess 234. The width and depth of any of the combined grooves 234 are substantially equal to the width and depth of any of the grooves 232 in the embodiment, and the width of any of the corners 233 of the combined groove 234 is preferably a groove. Half of the 232 width, but not limited to this. And any combination groove 234 is also substantially parallel to at least one of the grooves 232.

Therefore, the LED illuminating panel 100 or the modular LED display panel 1000 of the present embodiment is provided with a recess 232 and a combined recess 234 through the illuminating surface 231, so that the user can reduce the combination due to visual fatigue during viewing. The discontinuity that the groove 234 can create, thereby improving the overall visual contrast.

Further, the colloid 23 of the present embodiment may be a fully transparent colloid (as shown in FIG. 4) or include a plurality of transparent colloids 23a and a light-shielding colloid 23b (as shown in FIG. 5). Specifically, in the example in which the colloid 23 is composed of the light-transmitting colloid 23a and the light-shielding colloid 23b, the light-transmitting colloids 23a are attached to the front surface 211 of the substrate 21 at intervals, and are respectively coated on the LED chips 22. In this embodiment, after the LED chip 22 is mounted on the front surface 211 of the substrate 21, the light-transmitting colloid 23a is directly formed on the front surface 211 of the substrate 21. That is, the light-transmitting colloid 23a of the present embodiment is It is a primary optical lens of the LED wafer 22. The transparent colloid 23a and The correspondence of the LED chips 22 is a single pair, and the light-transmitting colloid 23a completely covers the LED wafer.

In more detail, each of the transparent colloids 23a includes a top surface 231a and a ring side 232a, and the illuminating surface 231a corresponds to the light emitting surface of the LED chip 22 covered by the transparent colloid 23a (such as the LED in FIG. 5). The top surface of the wafer 22). That is, the light emitting surface of the LED wafer 22 is located within an area formed by the projection of the ejector surface 231a toward the front surface 211 of the substrate 21. Further, the light emitted from the LED chip 22 coated in each of the light-transmitting colloids 23a is penetrated by the ejector surface 231a.

The light-shielding body 23b is integrally attached to the front surface 211 of the substrate 21 and covers the ring side surface 232a of the light-transmitting colloids 23a without gaps, and the light-emitting surface 231a of the light-transmitting colloids 23a is exposed outside the light-shielding body 23b. . In the present embodiment, after the light-transmitting colloid 23a is formed on the front surface 211 of the substrate 21, the light-shielding colloid 23b is injected into the front surface 211 of the substrate 21 and the transparent colloid 23a is not provided. The block is then cured to form. Also, since the above-mentioned light shielding colloid 23b is softened during the forming process, it is possible to fill gaps of various sizes, so that the spacing between any two adjacent transparent colloids 23a can be controlled by the designer's needs, that is, Any two adjacent light-transmitting colloids 23a may be designed to have a very small distance between them.

It should be noted that the light-shielding body 23b and the substrate 21 of the present embodiment are two different members, and the light-shielding gel 23b is formed on the substrate 21. In this embodiment, the method is as follows: a wall is integrally formed on the substrate corresponding to each LED chip, and then a transparent colloid is injected into the surrounding wall to cover the LED chip (not shown).

The reason for the above exclusion is mainly: when the sun visor is replaced by a wall, the above-mentioned wall is integrally formed on the substrate, which is not only cumbersome to manufacture, but also has a large limitation on the structure of the wall, that is, the space surrounded by the wall can only be The top is implemented not less than the bottom. For example, if the structure of the light-transmitting colloid 23a as shown in FIG. 5 of the present invention is formed, the portion away from the substrate 21 (such as the top of the transparent colloid 23a) is cut. The area is smaller than the cross-sectional area of the portion adjacent to the substrate 21 (such as the bottom of the transparent colloid 23a); at this time, when the shroud is replaced by a wall, a wall is formed on the circuit carrier board, and the top of the wall is surrounded. The space is smaller than the space surrounded by the bottom, and then the light-transmitting colloid is injected into the above-mentioned wall. In the above injection process, the light-transmitting colloid will be difficult to completely fill the space inside the wall, thereby causing the light-transmitting colloid to have an unexpected structure such as a missing corner.

In addition, the light-transmitting colloid 23a may be replaced by other configurations in addition to the configuration shown in the drawings. For example, before forming the light-shielding colloid, each of the light-transmitting colloids can be designed to have a substantially hemispherical structure (not shown), and then the semi-spherical transparent colloid is covered with a light-shielding colloid, and then moved away from the circuit carrier. The light-shielding colloid and the light-transmitting colloid are removed in a direction adjacent to the circuit carrier such that the light-emitting surface of each of the light-transmitting colloids is selectively formed on the LED chip coated thereon and parallel to any section of the circuit carrier. That is to say, the designer can obtain different sizes of the ejector surface by the above method.

As shown in FIG. 4 , the electronic component module 3 is mounted on the second surface 12 of the circuit carrier 1 , and the electronic component module 3 is electrically connected to the LED chip 22 of the LED lighting module 2 through the circuit carrier 1 . The current is turned on, whereby the amount of current of each LED chip 22 can be adjusted via the electronic component module 3.

The electronic component module 3 includes at least one of a controller 31, an electrical connector 32, and a driving component 33. In this embodiment, the electronic component module 3 includes a controller 31 at the same time. The electrical connector 32 and the driving component 33 are exemplified, but are not limited thereto in practical applications. Furthermore, the controller 31, the electrical connector 32, and the driving component 33 are electrically connected to the LED chips 22, whereby the controller 31 can be used to control the amount of current input to each LED chip 22. The electrical connector 32 can be connected to an electronic device (not shown), and the electronic device is electrically connected to the LED chips 22 via the electrical connector 32, and then the LED chips 22 are controlled through the electrical connector 32. The amount of current; the drive element 33 can be used to drive each LED chip 22.

In addition to the controller 31, the electrical connector 32, and the driving component 33, the electronic component module 3 may be added with other electronic components according to the needs of the designer, and is not limited herein.

It should be noted that, as shown in FIG. 6 and FIG. 7 , the LED illuminating panel 100 of the present embodiment may further include a connecting component 4 , that is, any two LED illuminating panels 100 may be spliced to each other through the respective connecting components 4 . However, the splicing manner of the LED illuminating panel 100 is not limited to the connecting component 4. Wherein, the connecting component 4 is fixed to the second surface 12 of the circuit carrier board 1, and any two LED lighting panels 100 can be mechanically connected to each other via the mutual connection of the respective connecting components 4.

In more detail, the circuit carrier 1 has two first sides 13 on the opposite side (such as the front side and the rear side of the circuit carrier 1 in FIG. 6) and two second on the other opposite side. Side 14 (such as the left and right sides of circuit carrier 1 in Figure 6). The connecting component 4 has a first male seat 41 and a first female seat 42 that are geometrically compatible with each other, and a second male seat 43 and a second female seat 44 that are geometrically compatible with each other. The first male seat 41 and the first female seat 42 are fixed to the second surface 12 of the circuit carrier 1 and respectively adjacent to the first side edges 13 , and the second male seat 43 and the second female side 43 . The seats 44 are fixed to the second surface 12 of the circuit carrier 1 and are respectively adjacent to the two second sides 14 .

Furthermore, any two LED illuminating panels 100 of the present embodiment can be coupled to the first female seat 42 of the other LED illuminating panel 100 through the first male seat 41 of one of the LED illuminating panels 100 to enable the LED illuminating panel 100 produces an effect of stretching; for the same reason, any two LED illuminating panels 100 can also be joined to the second female seat 44 of the other LED illuminating panel 100 through the second male seat 43 of one of the LED illuminating panels 100. In other words, the user can select the appropriate number of LED illuminating panels 100 according to their actual needs, and splicing the selected plurality of LED illuminating panels 100 to each other to form a display size desired by the user.

In addition, the connection assembly 4 described in this embodiment is exemplified by its mechanical connection. But it is not limited to this. For example, the connection component does not exclude the function of being designed to have an electrical connection function or both electrical connection and mechanical connection. Furthermore, the specific structure of the first male seat 41 and the first female seat 42 and the second male seat 43 and the second female seat 44 that cooperate with each other may be changed according to the requirements of the designer, and It is limited to the aspect presented by the diagram of this embodiment.

Therefore, the LED illuminating panel 100 of the present embodiment has a modular function by providing the connection component 4, that is, each LED illuminating panel 100 of the present embodiment can be quickly spliced to form a variety of frames. The size, in turn, meets the user's need for different display sizes.

[Second embodiment]

Referring to FIG. 8 , which is a second embodiment of the present invention, the present embodiment is similar to the first embodiment described above, and the same portions are not described again, and the difference between the two is mainly in the modularization of the embodiment. The LED display panel 1000 further includes an outer frame 200, the specific differences of which are described below.

The outer frame body 200 is disposed on the light-emitting surface 231 of the LED light-emitting panel 100, and a plurality of positioning ridges 201 are disposed adjacent to the outer frame body 200 of the LED light-emitting panels 100, and the outer frame body 200 is positioned. The ribs 201 are respectively embedded in the grooves 232 and the combined grooves 234 on the light-emitting surface 231 of the LED illuminating panel 100. Therefore, the modular LED display panel 1000 provided by the embodiment can facilitate the rapid alignment and assembly of the outer frame 200 and the LED illuminating panels 100.

It should be noted that the size of the outer frame body 200 corresponding to the light-emitting surface 23a of the light-transmitting colloid 23a is equivalent to the size of the corresponding light-emitting surface 231a in this embodiment, but is not limited thereto. For example, in another embodiment, the outer frame 200 corresponding to the light-emitting surface 23a of the transparent colloid 23a is smaller in size than the corresponding illuminating surface 231a, that is, the outer frame. The body 200 shields the ejector surface 231a of the portion.

In addition, the outer frame 200 can be further coated on the LED illuminating panels 100. The outer side (not shown), and the space enclosed by the outer frame 200 is isolated from its outer space. Further, the portion of the outer frame body 200 corresponding to the light-emitting surface 23a of the light-transmitting colloid 23a is light-transmissive, so that the light emitted from the LED chip 22 can be radiated from the outer frame 200 via the light-emitting surface 231a. . Therefore, the modular LED display panel 1000 of the present embodiment is provided with the outer frame body 200 to prevent the moisture or dirt outside the outer frame body 200 from affecting the circuit carrier board 1 and the electronic components thereon, thereby The applicable environment of the assembled LED display panel 1000 is more extensive.

[Third embodiment]

Referring to FIG. 9 to FIG. 11 , which is a third embodiment of the present invention, the first embodiment is similar to the first embodiment and the second embodiment, and the same portions are not repeated, and the difference mainly lies in each LED. The colloid 23 of the light-emitting module 2 has a light-emitting surface 231, and the specific difference is as follows.

The recess 232 and the combined recess 234 of the light-emitting surface 231 of the colloid 23 of each LED lighting module 2 of the embodiment can be adjusted according to requirements. For example, as shown in FIG. 9 and FIG. 10, each of the LED lighting modules 2 is designed to pass through the groove 232 of the light-emitting surface 231 of the colloid 23 and the combined groove 234 to be wider and narrower (ie, the groove). 232 or the width of the combined groove 234 is gradually reduced from the position away from the substrate 21 toward the substrate 21, so that the light-emitting surface 231 forms a plurality of hemispherical or ellipsoidal lenses having optical guiding characteristics, thereby conforming to different The demand, but not limited to it. Furthermore, as shown in FIG. 11, each of the LED lighting modules 2 can also make the light-emitting surface 231 of the colloid 23 appear planar.

[Possible effects of the embodiments of the present invention]

In summary, the modular LED display panel and the LED illuminating panel provided by the embodiments of the present invention can be adjusted and changed according to different size requirements, thereby effectively improving the lack of the conventional display panel. Moreover, since the LED illuminating panel is composed of a plurality of LED illuminating modules, only the damaged LED illuminating module needs to be replaced during maintenance. Just fine.

In addition, the modular LED display panel and the LED illuminating panel provided by the embodiments of the present invention are provided with a groove and a combined groove through the light-emitting surface, so that the user can reduce the combination due to visual fatigue during viewing. The discontinuity that the groove may create, thereby improving the overall visual contrast. Furthermore, positioning ribs corresponding to the grooves and the combined grooves are provided through the outer frame body, so that the outer frame body can be quickly aligned and assembled with the LED illuminating plates.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalent variations and modifications of the scope of the invention are intended to be within the scope of the invention.

100‧‧‧LED illuminating board

1‧‧‧Circuit carrier board

12‧‧‧ second surface

2‧‧‧LED lighting module

21‧‧‧Substrate

211‧‧‧ positive

212‧‧‧Back

22‧‧‧LED chip

23‧‧‧ colloid

231‧‧‧Glossy

232‧‧‧ Groove

233‧‧‧ corner

234‧‧‧Combined groove

3‧‧‧Electronic component module

31‧‧‧ Controller

32‧‧‧Electrical connector

33‧‧‧Drive components

Claims (8)

A modular LED display panel includes a plurality of LED illuminating panels detachably spliced, and the LED illuminating panels are electrically connected to each other; wherein each LED illuminating panel comprises: a circuit carrier board having opposite sides a first surface and a second surface of the side; a plurality of LED lighting modules adjacent to each other and mounted on the first surface of the circuit carrier; wherein each LED lighting module comprises: a substrate a front surface and a back surface on opposite sides, and a back surface of the substrate is mounted on the first surface of the circuit carrier; a plurality of LED chips mounted on the front surface of the substrate, and the LED chips are passed through the substrate And electrically connected to the circuit carrier; and a colloid on the front surface of the substrate and covering the LED chips, the colloid has a light exiting surface away from the substrate, and the light exit surface is recessed to form a plurality of grooves And each groove is projected on a projection area of the front surface of the substrate, where the LED chip is not mounted on the front surface of the substrate; and an electronic component module mounted on the circuit carrier, and the electronic component mold Electrical conduction is formed with the plurality of the LED module through the circuit carrier. The modular LED display panel of claim 1, wherein each of the LED light-emitting modules has a notch formed on each edge of the light-emitting surface, and the grooves are located around the corners. In the range of any two adjacent LED lighting modules of the modular LED display panel, the missing corners on the adjacent edges are spliced together into a combined groove. The modular LED display panel of claim 2, wherein in each of the LED lighting modules, the width of any of the combined grooves is substantially equal to the width of any of the grooves, and any combination groove is substantially Parallel to at least one of the grooves. The modular LED display panel of claim 2, further comprising a frame And the outer frame body is disposed on the light emitting surface of the LED light emitting plate, and the outer frame body portion adjacent to the LED light emitting plates is provided with a plurality of positioning ridges, and the positioning ridges are respectively embedded in the These grooves are in the combined grooves. The modular LED display panel of claim 1, wherein each of the LED light-emitting modules comprises a plurality of transparent colloids and a light-shielding colloid, and the transparent colloids are attached to the substrate at intervals. The light-emitting colloids include a light-emitting surface and a ring-side surface, and the light emitted by the LED chip wrapped in each of the light-transmitting gels is emitted by the light-emitting surface. And penetrating the outer layer; the light shielding colloid integrally adheres to the front surface of the substrate and covers the ring side surfaces of the light transmissive colloids. The modular LED display panel of any one of claims 1 to 4, wherein in each LED illuminating panel, the electronic component module has a controller, an electrical connector, and a driving component At least one of the controllers; the controller is configured to control the amount of current input to each of the LED chips; the electrical connector is configured to be plugged into an electronic device, so that the electronic device can be electrically connected to the LED chips via the electrical connector; The drive element is used to drive individual LED chips. An LED illuminating board includes: a circuit carrier board having a first surface and a second surface on opposite sides; and a plurality of LED lighting modules adjacent to each other and mounted on the circuit carrier a surface; wherein each LED lighting module comprises: a substrate having a front surface and a back surface on opposite sides, and a back surface of the substrate is mounted on the first surface of the circuit carrier; a plurality of LED chips, Mounted on the front surface of the substrate, and the LED chips are electrically connected to the circuit carrier via the substrate; and a glue is disposed on the front surface of the substrate and covers the LED chips, the colloid has a distance away from the a light emitting surface of the substrate, and the light emitting surface is recessed to form a plurality of grooves; and each groove is projected onto the projection area of the front surface of the substrate a portion of the substrate on which the LED chips are not mounted; and an electronic component module mounted on the circuit carrier, and the electronic component module transmits the LEDs through the circuit carrier The group forms electrical conduction. The LED illuminating panel of claim 7, wherein in each of the LED illuminating modules, each edge of the illuminating surface is concavely formed with a notch, and the grooves are located within a range surrounded by the nicks In any two adjacent LED lighting modules of the LED illuminating panel, the missing corners on the adjacent edges are spliced together into a combined groove.