TWI585942B - Led display panel - Google Patents

Description

LED display template

The present invention relates to a display template, and more particularly to an LED display template.

Conventional display templates are mostly packaged with LED chips, that is, an optical lens is coated on the LED chip, and then several packaged LED structures are respectively mounted on the circuit board. Finally, the shielded panels are further separated by the above-mentioned encapsulated LED structures.

However, conventional display templates require not only a large amount of man-hours for assembly, but also a specific spacing between any two packaged LED structures on the board surface of the board for the purpose of shielding the board. . In other words, under the framework of the conventional display template, in order to enable the shielding plate to be disposed between any two encapsulated LED structures, it is inevitable that it is difficult to further reduce the spacing, thereby hindering the color contrast and resolution of the display template. Upgrade.

Moreover, since the shielding plate and the circuit board are two independent members, there is bound to be a gap between the shielding plate and the circuit board, and the gap will easily cause light interference between the two adjacent packaged LED structures.

Therefore, the present inventors have felt that the above-mentioned deficiencies can be improved, and they have devoted themselves to research and cooperated with the application of the theory, and finally proposed a present invention which is reasonable in design and effective in improving the above-mentioned defects.

An embodiment of the present invention provides an LED display template that can effectively improve the lack of a conventional display template.

An embodiment of the present invention provides an LED display template, including: a circuit carrier board having a first board surface and a second board surface on opposite sides, a first conductive layer disposed on the first board surface, And a second conductive layer disposed on the second board surface, and the second conductive layer is electrically connected to the first conductive layer; a plurality of LED chips mounted on the first board surface of the circuit carrier board and electrically Is electrically connected to the first conductive layer; a plurality of transparent colloids are attached to the first board surface of the circuit carrier and are respectively coated on the LED chips, and each of the transparent colloids includes a light emitting a surface of the ring and a side of the ring, the light emitted by the LED chip wrapped in each of the transparent glue bodies is penetrated by the light emitting surface; a light shielding gel body integrally attached to the first board of the circuit carrier board And covering the side of the ring of the transparent colloid; and an electronic component module mounted on the circuit carrier and electrically connected to the LED chips to adjust each LED chip via the electronic component module The amount of current.

In summary, the LED display template provided by the embodiment of the present invention can greatly reduce the labor required for production and ensure the reduction of any two adjacent positions under the premise of ensuring no light interference between the LED chips. The spacing between the LED chips further enhances color contrast and resolution.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

100‧‧‧LED display template

1‧‧‧Circuit carrier board

11‧‧‧ first board

12‧‧‧ second board

13‧‧‧First conductive layer

14‧‧‧Second conductive layer

15‧‧‧First side

16‧‧‧Second side

2‧‧‧LED chip

21‧‧‧Lighting surface

22‧‧‧Installation surface

23‧‧‧ ring side

3‧‧‧Translucent colloid

31‧‧‧Out of the glossy

32‧‧‧ ring side

4‧‧‧ shading gel

5‧‧‧Electronic component module

51‧‧‧ Controller

52‧‧‧Electrical connector

53‧‧‧Drive components

6‧‧‧Waterproof housing

7‧‧‧Connecting components

71‧‧‧ first public seat

72‧‧‧ first mother seat

73‧‧‧Second public

74‧‧‧Second mother seat

1 is a schematic perspective view of an LED display template of the present invention.

2 is a functional block diagram of an LED display template of the present invention.

Figure 3 is a cross-sectional view taken along line X-X of Figure 1.

4 is a cross-sectional view showing another embodiment of the LED display template of the present invention.

FIG. 5 is a schematic view of FIG. 3 with a waterproof housing.

Figure 6 is a schematic view showing the LED display template of the present invention with a connection assembly.

FIG. 7 is a schematic diagram of a plurality of LED display templates connected to each other through a connection assembly according to the present invention.

Please refer to FIG. 1 to FIG. 4 , which are the first embodiment of the present invention. It should be noted that the related embodiments refer to the related quantities and appearances of the drawings, and only specifically illustrate the present invention. The embodiments are not intended to limit the scope of the invention.

As shown in FIG. 1 to FIG. 3, this embodiment is an LED display template 100, which is defined as a non-cutting aspect and is used as a whole to display a specific image or light type, in other words, any cut to form a single or several LEDs. The LED template of the structure is not the LED display template 100 referred to in this embodiment, which will be described first. The LED display template 100 includes a circuit carrier board 1, a plurality of LED chips 2, a plurality of transparent colloids 3, a light shielding colloid 4, and an electronic component module 5. The construction of each element of the LED display template 100 will be described below.

In the present embodiment, the board of the circuit carrier 1 may be of a fiberglass epoxy board (FR4) or a ceramic board, but the circuit board 1 of the embodiment is not a lead frame type. Furthermore, the circuit carrier 1 is substantially square (ie rectangular or square), and the circuit carrier 1 has a first board surface 11 and a second board surface 12 on opposite sides (such as the circuit in FIG. 3). a top surface and a bottom surface of the carrier 1 ), a first conductive layer 13 disposed on the first board surface 11 , and a second conductive layer 14 disposed on the second board surface 12 . The second conductive layer 14 is electrically connected to the first conductive layer 13 , and the electrical connection may be electrically connected through a through hole formed through the first plate surface 11 and the second surface 12 (not shown). A conductive material is disposed in the through hole, so that the first conductive layer 13 and the second conductive layer 14 are connected through the conductive material in the through hole, so that the first conductive layer 13 and the second conductive layer 14 are electrically connected.

In this embodiment, the LED chip 2 may be at least one of a white LED chip, a red LED chip, a green LED chip, a blue LED chip, an infrared LED chip, and an ultraviolet LED chip, but is not limited thereto. . Each LED crystal The sheet 2 has a light emitting surface 21, a mounting surface 22, and a ring side surface 23 surrounding the edge of the light emitting surface 21 and the mounting surface 22. The light emitting surface 21 and the mounting surface 22 are respectively the top surface of the LED chip 2 in FIG. With the bottom surface.

Furthermore, the LED chips 2 are mounted on the first board surface 11 of the circuit carrier 1 with its mounting surface 22 and electrically connected to the first conductive layer 13 , and the LED chips 2 are disposed on the circuit carrier 1 . The arrangement of the arrays is generally arranged in a matrix type in this embodiment. The connection between the LED chip 2 and the circuit carrier 1 may be through wire bonding or flip chip bonding, and is not limited herein.

The light-transmitting colloids 3 are attached to the first board surface 11 of the circuit carrier 1 at intervals and are respectively wrapped around the LED chips 2 . The light-transmitting colloid 3 is directly formed on the first board surface 11 of the circuit carrier 1 after the LED chip 2 is mounted on the first board surface 11 of the circuit carrier 1 in this embodiment. The light-transmitting colloid 3 of the embodiment is a primary optical lens of the LED wafer 2. The corresponding relationship between the light-transmitting colloid 3 and the LED chip 2 is a single pair, and the light-transmitting colloid 3 completely covers the light-emitting surface 21 and the ring-side surface 23 of the LED wafer 2.

In more detail, each of the light-transmitting colloids 3 includes a top light-emitting surface 31 and a ring-side surface 32, and the light-emitting surface 31 corresponds to the light-emitting surface 21 of the LED chip 2 coated by the light-transmitting colloid 3. Further, the LED The light-emitting surface 21 of the wafer 2 is located within the area formed by the projection of the ejector surface 31 toward the circuit carrier 1. Further, the light emitted from the LED chip 2 coated in each of the light-transmitting colloids 3 is penetrated by the light-emitting surface 31.

The light-shielding gel 4 is integrally attached to the first plate surface 11 of the circuit board 1 and covers the ring side surface 32 of the light-transmitting colloids 3 without gaps, and the light-emitting surface 31 of the light-transmitting colloids 3 is exposed to light. Outside the colloid 4. The light shielding colloid 4 is soft in the embodiment after the transparent colloid 3 is formed on the first board surface 11 of the circuit carrier 1. The viscous light-shielding gel 4 is injected into the block of the first board surface 11 of the circuit carrier 1 which is not provided with the light-transmitting colloid 3, and is formed by post-cure. Also, since the above-mentioned light-shielding gel 4 is softened during the forming process, it is possible to fill gaps of various sizes, so that the spacing between any two adjacent light-transmitting colloids 3 can be controlled by the designer's needs, that is, Any two adjacent light-transmitting colloids 3 can be designed to be extremely small.

Moreover, the outer surface portion of the light shielding colloid 4 away from the circuit carrier 1 (such as the top surface of the light shielding colloid 4 in FIG. 3) is disposed in a plane with the illuminating surface 31 of the transparent colloid 3, but not limit.

It should be noted that the light shielding gel 4 and the circuit carrier 1 of the present embodiment are two different members, and are implemented by forming the light shielding gel 4 on the circuit carrier 1 . In this embodiment, the method is as follows: a wall is integrally formed on the circuit carrier corresponding to each LED chip, and then a transparent colloid is injected into the wall to cover the LED chip (not shown).

The reason for the above exclusion is mainly: when the shroud is replaced by a wall, the above-mentioned wall is integrally formed on the circuit carrier board, which is not only cumbersome to manufacture, but also the structure of the wall is greatly limited, that is, the space surrounded by the wall is only It can be implemented in such a way that the top is not less than the bottom. For example, if the structure of the transparent colloid 3 shown in FIG. 3 of the present invention is to be formed, the cross-sectional area of the portion away from the circuit carrier 1 (such as the top of the transparent colloid 3) is smaller than that of the adjacent circuit carrier 1 (eg, The cross-sectional area of the top of the transparent colloid 3; at this time, when the scheme of replacing the shading colloid with a wall is implemented, a wall is formed on the circuit carrier board, and the space surrounded by the top of the wall is smaller than the space surrounded by the bottom. The light-transmissive colloid is then injected into the surrounding wall. In the above injection process, the light-transmitting colloid will be difficult to completely fill the space inside the wall, thereby causing the light-transmitting colloid to have an unexpected structure such as a missing corner.

In addition, the light-transmitting colloid 3 may be replaced by other configurations in addition to the configuration shown in FIG. For example, as shown in FIG. 4, the cross-sectional area of each of the light-transmitting colloids 3 parallel to the circuit carrier 1 is gradually reduced by the direction adjacent to the circuit carrier 1 toward the circuit carrier 1. That is, before the light-shielding body 4 is formed, each of the light-transmitting colloids 3 can be The structure is a substantially hemispherical structure, and then the hemispherical transparent colloid 3 is covered with the light shielding colloid 4, and the light shielding colloid 4 and the transparent colloid 3 are removed from the circuit carrier 1 toward the adjacent circuit carrier 1 . So that the ejector surface 31 of each of the light-transmitting colloids 3 is selectively formed on the LED chip 2 coated thereon and parallel to any section of the circuit carrier 1. That is to say, the designer can obtain the ejector surface 31 of different sizes in the above manner.

The electronic component module 5 is mounted on the second board surface 12 of the circuit carrier 1 and electrically connected to the second conductive layer 14 . The electronic component module 5 is electrically connected to the LED chips 2 through the second conductive layer 14 . The electrical conduction is performed, whereby the amount of current of each LED chip 2 can be adjusted via the electronic component module 5.

The electronic component module 5 includes at least one of a controller 51, an electrical connector, and a driving component 53. In this embodiment, the electronic component module 5 includes a controller 51 and a battery. The connector 52 and the driving component 53 are exemplified, but are not limited thereto in practical applications. The controller 51, the electrical connector 52, and the driving component 53 are electrically connected to the LED chips 2, whereby the controller 51 can be used to control the amount of current input to each LED chip 2; The device 52 can be connected to an electronic device (not shown), and the electronic device is electrically connected to the LED chips 2 via the electrical connector 52, and then the current amount of each LED chip 2 is controlled by the electrical connector 52; The driving element 53 can be used to drive the individual LED chips 2.

In addition to the controller 51, the electrical connector 52, and the driving component 53, the electronic component module 5 may be added with other electronic components according to the needs of the designer, and is not limited herein.

According to the above, the LED display template 100 of the present embodiment can effectively reduce the labor required for production, and can be directly connected to the LED chip 2 through the electronic component module 5 and directly used. To display a specific image or light type. In other words, the LED display template 100 of the embodiment does not need to undergo a production process as is conventional (ie, first The LED chip is packaged, and then several packaged LED structures are respectively mounted on the circuit board).

Furthermore, the LED display template 100 of the embodiment is disposed through the light shielding colloid 4 to ensure that no light interference occurs between adjacent LED chips 2, and the characteristics of the light shielding colloid 4 are utilized to facilitate the reduction of any two. The spacing between adjacent LED chips 2 further enhances color contrast and resolution.

Referring to FIG. 5, which is a second embodiment of the present invention, the present embodiment is similar to the first embodiment described above, and the same portions are not described again, and the difference between the two is mainly in the LED display template of this embodiment. The 100 further includes a waterproof housing 6. The waterproof housing 6 covers the circuit carrier board 1, the light-transmitting colloids 3, the light-shielding gel 4, and the outer side of the electronic component module 5, and the space enclosed by the waterproof housing 6 and the external space thereof are mutually Isolated. Further, the portion of the waterproof case 6 corresponding to the light-emitting surface 31 of the light-transmitting colloid 3 is light-transmissive, whereby light emitted from the LED chip 2 can be irradiated to the outside through the light-emitting surface 31 and the waterproof case 6.

Therefore, the LED display template 100 of the present embodiment is provided with the waterproof housing 6 to prevent the moisture or dirt outside the waterproof housing 6 from affecting the circuit board 1 and the electronic components thereon, thereby enabling the LED display template 100. The applicable environment is more extensive.

Referring to FIG. 6 and FIG. 7 , which is a third embodiment of the present invention, the present embodiment is similar to the first embodiment described above, and the same portions are not described again, and the differences between the two are mainly in the following embodiments. The LED display template 100 further includes a connection assembly 7. Wherein, the connecting component 7 is fixed to the second board surface 12 of the circuit carrier board 1, and any two LED display templates 100 can be mechanically connected to each other via the respective connecting components 7 being assembled to each other.

In more detail, the circuit carrier 1 has two first sides 15 on the opposite side (such as the front side and the rear side of the circuit carrier 1 in FIG. 6) and two second on the other opposite side. Side 16 (such as the left and right sides of circuit carrier 1 in Figure 6). Said company The joint assembly 7 has a first male seat 71 and a first female seat 72 that are geometrically compatible with each other, and a second male seat 73 and a second female seat 74 that are geometrically compatible with each other. The first male seat 71 and the first female seat 72 are fixed to the second board surface 12 of the circuit carrier 1 and respectively adjacent to the first side edges 15 , and the second male seats 73 and the second The female base 74 is fixed to the second board surface 12 of the circuit carrier 1 and adjacent to the two second side edges 16, respectively.

Furthermore, any two LED display templates 100 described in this embodiment can be joined to the first female seat 72 of the other LED display template 100 through the first male seat 71 of one of the LED display templates 100 to enable the LED display template. 100 produces an effect of stretching; for the same reason, any two LED display templates 100 can also be joined to the second female seat 74 of the other LED display template 100 through the second male seat 73 of one of the LED display templates 100. In other words, the user can select a suitable number of LED display templates 100 according to their actual needs, and splicing the selected plurality of LED display templates 100 to each other to form a display size desired by the user.

In addition, the connection assembly 7 described in this embodiment is exemplified by its mechanical connection, but is not limited thereto. For example, the connection component does not exclude the function of being designed to have an electrical connection function or both electrical connection and mechanical connection. Furthermore, the specific structure of the first male seat 71 and the first female seat 72 and the second male seat 73 and the second female seat 74 that cooperate with each other may be changed according to the requirements of the designer, and It is limited to the aspect presented by the diagram of this embodiment.

Therefore, the LED display template 100 of the present embodiment has a modular function by providing the connection component 7, that is, each LED display template 100 of the embodiment can be quickly spliced to form a variety of frames. The size, in turn, meets the user's need for different display sizes.

[Possible effects of the embodiments of the present invention]

In summary, the LED display template provided by the embodiments of the present invention can greatly reduce the production requirements under the premise of ensuring no light interference between the LED chips. It takes a lot of man-hours and helps to reduce the spacing between any two adjacent LED chips, thereby improving color contrast and resolution.

Furthermore, the LED display template can be provided with a waterproof housing to prevent moisture or dirt outside the waterproof housing from affecting the circuit board and the electronic components thereon, thereby making the LED display template more applicable.

In addition, the LED display template can be modularized by providing a connection component, in other words, each LED display template can be quickly spliced to form various sizes, thereby conforming to different display sizes of the user. Demand.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalent variations and modifications of the scope of the invention are intended to be within the scope of the invention.

100‧‧‧LED display template

1‧‧‧Circuit carrier board

13‧‧‧First conductive layer

14‧‧‧Second conductive layer

2‧‧‧LED chip

5‧‧‧Electronic component module

51‧‧‧ Controller

52‧‧‧Electrical connector

53‧‧‧Drive components

Claims (9)

An LED display template includes: a circuit carrier board having a first board surface and a second board surface on opposite sides, a first conductive layer disposed on the first board surface, and a second conductive layer of the second board, and the second conductive layer is electrically connected to the first conductive layer; a plurality of LED chips mounted on the first board surface of the circuit carrier and electrically connected to the first board a conductive layer; a plurality of transparent colloids are attached to the first board surface of the circuit carrier and are respectively coated on the LED chips, and each of the transparent colloids includes a top light emitting surface and a ring side surface. The light emitted by the LED chip wrapped in each of the light-transmitting gels is penetrated by the light-emitting surface; a light-shielding gel integrally attached to the first surface of the circuit carrier and covering the light a ring-shaped side of the light-transmitting colloid; an electronic component module mounted on the circuit carrier and electrically connected to the LED chips to adjust the current amount of each LED chip via the electronic component module; a connection component fixed to the circuit carrier; any two of the LED display modes Each group can be mutually connected via the connection assembly, and are mechanically or electrically connected. The LED display template of claim 1, wherein the LED chips are further defined as at least one of a white LED chip, a red LED chip, a green LED chip, a blue LED chip, an infrared LED chip, and an ultraviolet LED chip. One. The LED display template of claim 1, wherein the circuit carrier is substantially square, the circuit carrier has two first sides on opposite sides and two second sides on the opposite side, the connection The assembly has a first male seat and a first female seat geometrically cooperating, and a second male seat and a geometrically compatible one a second female seat; the first male seat and the first female seat are fixed on the circuit carrier and respectively adjacent to the two first sides, and the second male seat and the second female seat are fixed on the circuit carrier The plates are respectively adjacent to the two second sides. The LED display template of claim 3, wherein the connection component is fixed to the second board surface of the circuit carrier. The LED display template of claim 1, wherein the electronic component module has at least one of a controller, an electrical connector, and a driving component; the controller is configured to control the amount of current input to each LED chip. The electrical connector is connected to an electronic device, and the electronic device can be electrically connected to the LED chips via the electrical connector; the driving component is used to drive each LED chip. The LED display template of claim 1, wherein the outer surface portion of the light shielding gel away from the circuit carrier is disposed in a plane with the illuminating surface of the transparent colloid. The LED display template of claim 6, wherein each of the transparent colloidal cross-sectional areas parallel to the circuit carrier is gradually narrowed by a direction adjacent to the circuit carrier away from the circuit carrier, and each The ejector surface of the light transmissive colloid is above the LED chip it covers and parallel to the circuit carrier. An LED display template includes: a circuit carrier board having a first board surface and a second board surface on opposite sides, a first conductive layer disposed on the first board surface, and a second conductive layer of the second board surface, and the second conductive layer is electrically connected to the first conductive layer; a plurality of LED chips mounted on the first board surface of the circuit carrier board and electrically connected to The first conductive layer; a plurality of transparent colloids are attached to the first board surface of the circuit carrier and are respectively coated on the LED chips, and each of the transparent colloids includes a top surface and a ring The light emitted by the LED chip wrapped in each of the transparent colloids is penetrated by the ejector surface; a light shielding colloid integrally attached to the first surface of the circuit carrier and covering the side of the ring of the transparent colloid; an electronic component module mounted on the circuit carrier and electrically connected to the An LED chip for adjusting an amount of current of each LED chip via the electronic component module; and a waterproof housing covering the circuit carrier, the transparent colloid, the light shielding colloid, and the electronic component module The outer side, and the space enclosed in the waterproof casing is isolated from the outer space thereof. The LED display template of claim 8, wherein the electronic component module is mounted on the second board surface of the circuit carrier and electrically connected to the second conductive layer, and the electronic component module transmits the second conductive layer The layers are electrically connected to the LED chips.